Display panel, manufacturing method thereof and display device

Abstract

A display panel comprises a first packaging layer, the first packaging layer comprises at least two first sub-packaging layers, due to the fact that less waste gas is generated when one first sub-packaging layer is formed, enough film forming gas is introduced before the first sub-packaging layer is formed every time, waste gas in a cavity between a first structure part and a light-emitting layer can be replaced out, and the light-emitting effect is improved. A new film forming environment is formed, the film forming rate in the cavity is improved, the film forming time of one first sub-packaging layer is short and is not affected by waste gas generated by forming the first sub-packaging layer, therefore, each first sub-packaging layer completely wraps the first structure part, and finally the cavity is filled with the multiple first sub-packaging layers. The formation of a water-oxygen channel can be avoided, and the risk of failure of the light-emitting layer is eliminated. The invention further provides a manufacturing method of the display panel and a display device comprising the display panel.

Description

Technical Field

[0001] The present invention relates to the field of display technologies, and more particularly, to a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) has the advantages of self-luminescence, low power consumption, and flexible display, etc., and is one of the current mainstream display technologies.

[0003] In order to protect the light-emitting layer from being eroded by water and oxygen, a packaging layer is formed on the side of the light-emitting layer away from the substrate. However, during the packaging process, a water and oxygen channel is formed between the first structural part and foreign matters and the light-emitting layer, which easily causes the failure of the light-emitting layer.

[0004] It should be noted that the information disclosed in the above background art is only used to enhance the understanding of the background of the present invention, and thus may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Invention

[0005] An object of the present invention is to overcome the problem that a water and oxygen channel is formed between the first structural part and foreign matters and the light-emitting layer, which easily causes the failure of the light-emitting layer, and to provide a display panel, a manufacturing method thereof, and a display device.

[0006] According to one aspect of the present invention, there is provided a display panel, which may include a driving backplane, a light-emitting layer, a first structural part, and a first packaging layer. The light-emitting layer is disposed on one side of the driving backplane; the first structural part is disposed on the side of the light-emitting layer away from the driving backplane, and a cavity is formed between the surface of the first structural part close to the driving backplane and the surface of the light-emitting layer away from the driving backplane; the first packaging layer is disposed on the side of the light-emitting layer away from the driving backplane, and the first packaging layer includes at least two sub-first packaging layers, and the at least two sub-first packaging layers are stacked in sequence along the direction away from the driving backplane, and each sub-first packaging layer completely wraps the first structural part, and the multiple sub-first packaging layers fill the cavity.

[0007] In an embodiment of the present invention, a boundary layer is provided between two adjacent sub-first packaging layers, and the film density in the boundary layer is less than the film density in the sub-first packaging layer.

[0008] In an embodiment of the present invention, the content of silicon element in the boundary layer is less than the content of silicon element in the sub-first packaging layer.

[0009] In an embodiment of the present invention, the display panel has an opening, and the first structural part is a partition unit arranged around the opening. The partition unit includes at least two partition layers. The distance between the orthographic projection of the partition layer far from the driving backplane on the driving backplane and the edge of the opening is a first distance, and the distance between the orthographic projection of the partition layer close to the driving backplane on the driving backplane and the edge of the opening is a second distance. The first distance is greater than the second distance.

[0010] In an embodiment of the present invention, the partition unit is a double-layer partition unit or a single-layer partition unit. The double-layer partition unit includes two partition structures arranged in a stacked manner, and the single-layer partition unit includes one partition structure.

[0011] In an embodiment of the present invention, the partition structure includes a first partition layer, a second partition layer, and a third partition layer arranged in sequence in a direction away from the driving backplane. The width of the second partition layer is smaller than the widths of the adjacent first partition layer and third partition layer on both sides.

[0012] In an embodiment of the present invention, when the partition unit is a double-layer partition unit, the two partition structures are a first partition structure and a second partition structure arranged in sequence in a direction away from the driving backplane. The third partition layer of the first partition structure is reused as the first partition layer of the second partition structure, or the third partition layer of the first partition structure and the first partition layer of the second partition structure are arranged in a stacked manner.

[0013] In an embodiment of the present invention, the shape of the cross-section of the second partition layer of the partition structure along the width direction of the partition unit is a regular trapezoid.

[0014] In an embodiment of the present invention, the width of the third partition layer of the partition structure is smaller than the width of the first partition layer.

[0015] In an embodiment of the present invention, the width of the first blocking part corresponding to the double-layer partition unit is greater than the width of the first blocking part corresponding to the single-layer partition unit.

[0016] In an embodiment of the present invention, the display panel further includes a driving circuit layer provided on one side of the driving backplane. The driving circuit layer includes a first source-drain metal layer and a second source-drain metal layer. When the partition unit is a single-layer partition unit, the partition structure is arranged on the same layer and made of the same material as the first source-drain metal layer or the second source-drain metal layer. When the partition unit is a double-layer partition unit, the partition structure is arranged on the same layer and made of the same material as the first source-drain metal layer and the second source-drain metal layer.

[0017] In an embodiment of the present invention, the number of partition units is at least two, and at least two partition units are arranged at intervals in a direction away from the opening.

[0018] In one embodiment of the present invention, the light-emitting layer includes a light-emitting material layer and a common electrode. The light-emitting material layer is disposed on one side of the driving backplane, and the common electrode is disposed on the side of the light-emitting material layer away from the driving backplane. The common electrode is partitioned by a partitioning unit to form a plurality of common electrode portions. The common electrode portions include a first common electrode portion and a second common electrode portion. The first common electrode portion is disposed on the side of the partitioning unit away from the driving backplane, and the second common electrode portion is disposed between two adjacent partitioning units.

[0019] In one embodiment of the present invention, the material of the first structural portion is different from the material of the sub-first encapsulation layer.

[0020] In one embodiment of the present invention, the first structural portion has a first surface away from the driving backplane, a second surface close to the driving backplane, and a third surface connecting the first surface and the second surface. The sub-first encapsulation layer covers the first surface, the second surface, and the third surface.

[0021] According to another aspect of the present application, there is provided a method for manufacturing a display panel provided in any one of the aspects of the present invention. The method includes:

[0022] Form a light-emitting layer on one side of the driving backplane. The side of the light-emitting layer away from the driving backplane has a first structural portion;

[0023] Introduce a film-forming gas to displace the waste gas in the cavity formed between the first structural portion and the light-emitting layer;

[0024] Introduce the film-forming gas again to control the formation of a sub-first encapsulation layer covering the first structural portion;

[0025] Repeat to form multiple layers of sub-first encapsulation layers covering the first structural portion until the cavity is filled with multiple layers of sub-first encapsulation layers.

[0026] In one embodiment of the present invention, the film-forming gas includes SiH4, N2O, NH3, H2, and N2.

[0027] According to still another aspect of the present application, there is provided a display device including the display panel provided in any one of the aspects of the present invention.

[0028] The display panel of the present invention includes a first encapsulation layer, which includes at least two sub-first encapsulation layers. Since the exhaust gas generated during the formation of one sub-first encapsulation layer is less, sufficient film-forming gas is introduced before forming each sub-first encapsulation layer, so that the exhaust gas in the cavity between the first structural part and the light-emitting layer can be displaced, forming a new film-forming environment, improving the film-forming rate in the cavity, and making the film-forming time of one sub-first encapsulation layer relatively short, without being affected by the exhaust gas generated during the formation of this sub-first encapsulation layer itself. Therefore, each sub-first encapsulation layer completely wraps the first structural part, and finally multiple sub-first encapsulation layers fill the cavity, which can avoid the formation of water and oxygen channels and eliminate the risk of light-emitting layer failure.

[0029] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The drawings herein are incorporated into the specification and form a part of this specification, showing embodiments consistent with the present invention, and are used together with the specification to explain the principles of the present invention. Obviously, the drawings in the following description are only some embodiments of the present invention, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.

[0031] Figure 1 When the partition unit is a single-layer partition unit, it is a cross-sectional schematic diagram of the display panel according to an embodiment of the present invention.

[0032] Figure 2 It is a plan schematic diagram of the display panel according to an embodiment of the present invention.

[0033] Figure 3 It is a plan schematic diagram of the opening and transition area of the display panel according to an embodiment of the present invention.

[0034] Figure 4 It is a structural schematic diagram when the partition unit according to an embodiment of the present invention is disposed on the light-emitting layer.

[0035] Figure 5 It is a structural schematic diagram when a foreign object according to an embodiment of the present invention is disposed on the light-emitting layer.

[0036] Figure 6 It is a schematic diagram of the formation of a water and oxygen channel between the partition unit and the light-emitting layer according to an embodiment of the present invention.

[0037] Figure 7 It is a schematic diagram of the formation of a water and oxygen channel between a foreign object and the light-emitting layer according to an embodiment of the present invention.

[0038] Figure 8When the partial partition unit is a single-layer partition unit, it is a schematic cross-sectional view of the display panel involved in the embodiment of the present invention.

[0039] Figure 9 It is a schematic structural diagram when the multi-layer sub-first encapsulation layer fills the cavity formed between the partition unit and the light-emitting layer.

[0040] Figure 10 When the partition unit is a single-layer partition unit, it is a schematic structural diagram when the multi-layer sub-first encapsulation layer fills the cavity formed between the partition unit and the light-emitting layer.

[0041] Figure 11 When the partition unit is a double-layer partition unit, it is a schematic structural diagram when the multi-layer sub-first encapsulation layer fills the cavity formed between the partition unit and the light-emitting layer.

[0042] Figure 12 It is a schematic structural diagram when the multi-layer sub-first encapsulation layer fills the cavity formed between the foreign matter and the light-emitting layer.

[0043] Figure 13 It is a schematic structural diagram when the film-forming gas displaces the waste gas in the cavity formed between the first structural part and the light-emitting layer.

[0044] Figure 14 It is a schematic structural diagram when controlling the generation of the first-layer sub-first encapsulation layer covering the first structural part.

[0045] Figure 15 It is a schematic structural diagram when the film-forming gas displaces the waste gas in the cavity formed between the first-layer sub-first encapsulation layer and the light-emitting layer.

[0046] Figure 16 It is a schematic structural diagram when controlling the generation of the second-layer sub-first encapsulation layer covering the first-layer sub-first encapsulation layer.

[0047] Figure 17 It is a schematic structural diagram when the film-forming gas displaces the waste gas in the cavity formed between the second-layer sub-first encapsulation layer and the light-emitting layer.

[0048] Figure 18 It is a schematic structural diagram when controlling the generation of the third-layer sub-first encapsulation layer covering the second-layer sub-first encapsulation layer.

[0049] In the figure: 100 - display area; 200 - transition area, 2001 - first sub-transition area, 300 - opening;

[0050] 11 - substrate, 12 - buffer layer;

[0051] 13 - Driving circuit layer, 131 - Active layer, 1321 - First gate insulating layer, 1322 - Second gate insulating layer, 1331 - First gate electrode, 1332 - Second gate electrode, 134 - Interlayer dielectric layer, 135 - First source electrode, 136 - Drain electrode, 137 - Protective layer, 138 - Second source electrode;

[0052] 14 - Planarization layer group, 141 - First planarization layer, 142 - Second planarization layer;

[0053] 15 - Pixel defining layer, 151 - Pixel opening;

[0054] 16 - Light emitting layer, 161 - Pixel electrode, 162 - Light emitting material layer, 163 - Common electrode;

[0055] 17 - Encapsulation layer, 171 - First encapsulation layer, 1711 - Sub - first encapsulation layer, 1712 - Demarcation layer, 172 - Second encapsulation layer, 173 - Third encapsulation layer;

[0056] 18 - Dam;

[0057] 181 - First insulating layer, 182 - Second insulating layer, 183 - Third insulating layer;

[0058] 19 - Partition unit, 190 - Partition layer, 191 - First partition structure, 192 - Second partition structure, 193 - First partition layer, 194 - Second partition layer, 195 - Third partition layer;

[0059] 20 - Common electrode part, 201 - First common electrode part, 202 - Second common electrode part, 203 - Third common electrode part;

[0060] 21 - Gate line, 211 - First gate line, 212 - Second gate line;

[0061] 22 - Cavity;

[0062] 23 - Water and oxygen channel;

[0063] 24 - Foreign object;

[0064] 25 - First surface, 26 - Second surface, 27 - Third surface. Detailed implementation manners

[0065] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. Like reference numerals in the figures denote like or similar structures, and thus their detailed description will be omitted. In addition, the drawings are only schematic illustrations of the present invention and are not necessarily drawn to scale.

[0066] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification only for convenience, for example, according to the directions in the examples in the drawings. It can be understood that if the device of the icon is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" another structure, it may mean that a structure is integrally formed on another structure, or that a structure is "directly" disposed on another structure, or that a structure is "indirectly" disposed on another structure through another structure.

[0067] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "comprising" and "having" are used to mean an open inclusion and mean that there may be additional elements / components / etc. in addition to the listed elements / components / etc.; the terms "first", "second", "third", etc. are used only as labels and are not a limitation on the quantity of their objects.

[0068] As Figures 1 to 3 shown, the display panel generally may include a substrate 11, a driving circuit layer 13, a planarization layer group 14, and a light-emitting layer 16. The driving circuit layer 13 is disposed on one side of the substrate 11, the planarization layer group 14 is disposed on the side of the driving circuit layer 13 away from the substrate 11, and the light-emitting layer 16 is disposed on the side of the planarization layer group 14 away from the substrate 11. In addition, the display panel may further include a buffer layer 12, and the buffer layer 12 is disposed between the substrate 11 and the driving circuit layer 13.

[0069] The substrate 11 may be a substrate 11 of an inorganic material or a substrate 11 of an organic material. For example, in one embodiment of the present disclosure, the material of the substrate 11 may be a glass material such as soda-lime glass, quartz glass, sapphire glass, etc., or may be a metal material such as stainless steel, aluminum, nickel, etc.

[0070] In another embodiment of the present disclosure, the substrate 11 can also be a flexible substrate 11. For example, the material of the substrate 11 can be polyimide (PI). The substrate 11 can also be a composite of multiple layers of materials. For example, in one embodiment of the present disclosure, the substrate 11 can include a bottom film layer (BottomFilm), a pressure-sensitive adhesive layer, a first polyimide layer, and a second polyimide layer that are stacked in sequence.

[0071] In the display area 100, a driving circuit layer 13 is provided with a driving circuit for driving the light-emitting units. The driving circuit is located in the display area 100. Any one driving circuit can include a transistor, and the transistor can be a thin-film transistor. The thin-film transistor can be selected from a top-gate thin-film transistor, a bottom-gate thin-film transistor, or a double-gate thin-film transistor. Taking the top-gate thin-film transistor as an example, the thin-film transistor can include an active layer 131, a first gate 1331, a second gate 1332, a first gate insulating layer 1321, a second gate insulating layer 1322, and source / drain electrodes 136, where:

[0072] The active layer 131 is disposed on one side of the substrate 11. The material of the active layer 131 can be amorphous silicon semiconductor material, low-temperature polycrystalline silicon semiconductor material, metal oxide semiconductor material, organic semiconductor material, or other types of semiconductor materials. Therefore, the thin-film transistor can be an N-type thin-film transistor or a P-type thin-film transistor. The active layer 131 can include a channel region and two doped regions of different doping types located on both sides of the channel region.

[0073] The first gate insulating layer 1321 is disposed on the side of the active layer 131 away from the substrate 11. The first gate insulating layer 1321 can cover the active layer 131 and the substrate 11. The first gate 1331 is disposed on the side of the first gate insulating layer 1321 away from the substrate 11 and is opposite to the active layer 131, that is, the projection of the first gate 1331 on the substrate 11 is located within the projection range of the active layer 131 on the substrate 11. For example, the projection of the first gate 1331 on the substrate 11 coincides with the projection of the channel region of the active layer 131 on the substrate 11. The second gate insulating layer 1322 is disposed on the side of the first gate 1331 away from the substrate 11. The second gate insulating layer 1322 can cover the first gate 1331 and the first gate insulating layer 1321. The second gate 1332 is disposed on the side of the second gate insulating layer 1322 away from the substrate 11 and is opposite to the active layer 131. The materials of the first gate insulating layer 1321 and the second gate insulating layer 1322 are both insulating materials such as silicon oxide.

[0074] The thin film transistor may further include an interlayer dielectric layer 134 disposed on a side of the second gate 1332 away from the substrate 11. The interlayer dielectric layer 134 may cover the second gate 1332 and the second gate insulating layer 1322, and the interlayer dielectric layer 134 is made of an insulating material. The source-drain electrode 136 is disposed on a surface of the interlayer dielectric layer 134 away from the substrate 11, and the source-drain electrode 136 includes a first source electrode 135 and a drain electrode 136. The first source electrode 135 and the drain electrode 136 are connected to the active layer 131. For example, the first source electrode 135 and the drain electrode 136 are respectively connected to two doped regions of the corresponding active layer 131 through vias.

[0075] A first planarization layer 141 is disposed on a side of the source-drain electrode 136 away from the substrate 11, and a surface of the first planarization layer 141 away from the substrate 11 is a plane. The source-drain electrode 136 may further include a second source electrode 138 connected to the first source electrode 135. A second planarization layer 142 is disposed on a side of the second source electrode 138 away from the substrate 11, and the second planarization layer 142 covers the second source electrode 138 and the first planarization layer 141. A protective layer 137 may be disposed on a side of the first source electrode 135 away from the substrate 11, and the protective layer 137 covers the first source electrode 135 and the drain electrode 136. The first planarization layer 141 covers the protective layer 137. It should be noted that the first source electrode 135 and the drain electrode 136 are located in the first source-drain metal layer of the driving circuit layer 13, and the second source electrode 138 is located in the second source-drain metal layer of the driving circuit layer 13.

[0076] The pixel defining layer 15 is disposed on a side of the first planarization layer 141 or the second planarization layer 142 away from the array substrate. The pixel defining layer 15 has a plurality of pixel openings 151. The light emitting layer 16 may include a plurality of light emitting units respectively disposed in different pixel openings 151. Each light emitting unit may include a pixel electrode 161, a light emitting material layer 162, and a common electrode 163. The pixel electrode 161 is located on a surface of the first planarization layer 141 or the second planarization layer 142 away from the substrate 11. The light emitting material layer 162 is disposed on a surface of the pixel electrode 161 away from the substrate 11. The common electrode 163 is disposed on a surface of the light emitting material layer 162 away from the substrate 11. The light emitting material layer 162 can be driven to emit light through the pixel electrode 161 and the common electrode 163 to display an image.

[0077] The pixel electrode 161 is connected to the first source electrode 135 or the second source electrode 138. A pixel defining layer 15 is provided on the side of the pixel electrode 161 away from the substrate 11. When the thin film transistor only includes the first source electrode 135, the pixel electrode 161 is connected to the first source electrode 135, and the pixel defining layer 15 covers the pixel electrode 161 and the first planarization layer 141. When the thin film transistor further includes the second source electrode 138, the pixel electrode 161 is connected to the second source electrode 138, and the pixel defining layer 15 covers the pixel electrode 161 and the second planarization layer 142.

[0078] The common electrode 163 can be used as the cathode, and the pixel electrode 161 can be used as the anode. By applying a signal to the pixel electrode 161, the light-emitting material layer 162 can be driven to emit light. The specific light-emitting principle will not be elaborated here. The light-emitting material layer 162 can contain electro-luminescent organic materials and can be formed by processes such as evaporation coating. For example, the light-emitting material layer 162 can include a hole injection layer, a hole transport layer, a light generation layer, an electron transport layer, and an electron injection layer that are sequentially stacked on the pixel electrode 161 layer. It should be noted that according to different emission colors, the light-emitting material layer 162 can include a red light-emitting material layer 162, a green light-emitting material layer 162, and a blue light-emitting material layer 162.

[0079] The display panel has an opening 300, a transition region 200, and a display region 100. The transition region 200 is located between the edge of the opening 300 and the edge of the display region 100. Due to the flow of the liquid organic encapsulation material, it is easy for the liquid organic encapsulation material to overflow. To prevent the organic encapsulation material from overflowing, a dam 18 is provided in the transition region 200. The dam 18 is provided on the side of the protective layer 137 away from the substrate 11. The dam 18 is arranged around the opening 300 to play a blocking role. The cross-sectional shape of the dam 18 can be rectangular or trapezoidal. At least the side of the dam 18 close to the display region 100 is an inclined surface, which is not limited here.

[0080] The stacked pattern of the dam 18 includes an insulating layer group, and the insulating layer group is provided with the same layer material as one or more of the first planarization layer 141, the second planarization layer 142, and the pixel defining layer 15. As Figure 2 shown, the stacked pattern of the dam 18 all includes a first insulating layer 181, and the first insulating layer 181 is provided with the same layer material as the first planarization layer 141. A second insulating layer 182 can also be provided on the first insulating layer 181, and the second insulating layer 182 is provided with the same layer material as the second planarization layer 142. A third insulating layer 183 can also be provided on the second insulating layer 182, and the third insulating layer 183 is provided with the same layer material as the pixel defining layer 15.

[0081] The transition region 200 includes a first sub-transition region 2001. The first sub-transition region 2001 is located between the edge of the barrier dam 18 and the edge of the opening 300. The first gate insulating layer 1321 and the second gate insulating layer 1322 extend from the display region 100 to the first sub-transition region 2001. The display panel further includes gate lines 21, and the gate lines 21 include first gate lines 211 and second gate lines 212. The first gate line 211 is disposed on the side of the first gate insulating layer 1321 in the first sub-transition region 2001 away from the substrate 11, and the second gate line 212 is disposed on the side of the second gate insulating layer 1322 away from the substrate 11. That is, the first gate line 211 and the first gate electrode 1331 are provided with the same layer and the same material, and the second gate line 212 and the second gate electrode 1332 are provided with the same layer and the same material.

[0082] The protective layer 137 extends from the display region 100 to the first sub-transition region 2001. The light-emitting material layer 162 extends to the first sub-transition region 2001, and the light-emitting material layer 162 is located on the side of the protective layer 137 away from the substrate 11. To ensure the display effect, the common electrode 163 needs to be blocked. Therefore, a first structural portion is provided on the side of the protective layer 137 in the first sub-transition region 2001 away from the substrate 11. The first structural portion is a blocking unit 19. In order to further improve the blocking effect, at least two blocking units 19 are provided in the first sub-transition region 2001.

[0083] The width of at least a part of the blocking unit 19 is smaller than the width of the side away from the substrate 11. Specifically, the blocking unit 19 can be set to a structure with wide ends and a narrow middle, or can be set to an inverted trapezoidal structure with the width gradually decreasing from the end away from the substrate 11 to the end close to the substrate 11, or the blocking unit 19 can be set to other structures with an undercut in its height direction. For example, the blocking unit 19 can be set to a Ti-Al-Ti structure.

[0084] The common electrode 163 located on the side of the light-emitting material layer 162 away from the substrate 11 is blocked by the blocking unit 19 to form a plurality of common electrode portions 20. The common electrode portions 20 are divided into a first common electrode portion 201, a second common electrode portion 202, and a third common electrode portion 203. The first common electrode portion 201 is disposed on the surface of the blocking unit 19 away from the substrate 11, the second common electrode portion 202 is disposed between two adjacent blocking units 19, and the third common electrode portion 203 is disposed on the side of the barrier dam 18 and the light-emitting material layer 162 away from the substrate 11.

[0085] In addition, the display panel of the present disclosure may further include a packaging layer 17 disposed on the side of the light-emitting layer 16 away from the substrate 11, thereby wrapping the light-emitting layer 16 to prevent water and oxygen from eroding. In this embodiment, the packaging layer 17 may include a first packaging layer 171, a second packaging layer 172, and a third packaging layer 173. The first packaging layer 171 is disposed on the side of the light-emitting layer 16 away from the substrate 11, the second packaging layer 172 is disposed on the side of the first packaging layer 171 away from the substrate 11, and the third packaging layer 173 is disposed on the side of the second packaging layer 172 away from the substrate 11. The first packaging layer 171 and the third packaging layer 173 may be inorganic packaging layers 17, and the second packaging layer 172 may be an organic packaging layer 17.

[0086] As Figure 4 shown, the partition unit 19 includes at least two partition layers 190. The distance between the orthographic projection of the partition layer 190 far from the driving backplane on the driving backplane and the edge of the opening 300 is a first distance, and the distance between the orthographic projection of the partition layer 190 close to the driving backplane on the driving backplane and the edge of the opening 300 is a second distance, and the first distance is greater than the second distance. Therefore, a cavity is formed between the side of the partition layer 190 far from the driving backplane close to the driving backplane and the side of the light-emitting layer 16 far from the driving backplane.

[0087] In addition, during the manufacturing process of the display panel, inevitably, some foreign matters such as dust and fibers 24 randomly fall on the side of the light-emitting layer 16 away from the substrate 11. In this case, the first structural part is the foreign matter 24, and a cavity is also formed between the side of the foreign matter 24 close to the driving backplane and the side of the light-emitting layer 16 far from the driving backplane, as Figure 5 shown.

[0088] As Figure 6 and Figure 7 shown, if a single-layer first packaging layer 171 is used to package the above two situations, since the cavity cannot discharge the waste gas generated during the formation of the first packaging layer 171 in time, and the cavity cannot flow into the new film-forming gas to participate in the reaction, the film-forming speed in this area is much lower than that of the other positions, and finally a water and oxygen channel 23 is generated. When water and oxygen enter from the water and oxygen channel 23, it will cause the light-emitting layer 16 to fail and produce black spots. As the water and oxygen continue to enter, the failed area of the light-emitting layer 16 will continue to grow, manifested as the black spots becoming larger and affecting the display.

[0089] Based on this, an embodiment of the present invention provides a display panel. As Figures 1 to 5 and Figures 8 to 12As shown, the display panel may include a driving backplane, a light-emitting layer 16, a first structural portion, and a first encapsulation layer 171. The light-emitting layer 16 is disposed on one side of the driving backplane; the first structural portion is disposed on the side of the light-emitting layer 16 away from the driving backplane, and a cavity is formed between the surface of the first structural portion close to the driving backplane and the surface of the light-emitting layer 16 away from the driving backplane; the first encapsulation layer 171 is disposed on the side of the light-emitting layer 16 away from the driving backplane. The first encapsulation layer 171 includes at least two sub-first encapsulation layers 1711, and the at least two sub-first encapsulation layers 1711 are stacked in sequence in a direction away from the driving backplane. Each sub-first encapsulation layer 1711 completely wraps the first structural portion, and the multiple sub-first encapsulation layers 1711 fill the cavity.

[0090] The first encapsulation layer 171 includes at least two sub-first encapsulation layers 1711, and the at least two sub-first encapsulation layers 1711 are stacked in sequence in a direction away from the driving backplane. Since less waste gas is generated when forming one sub-first encapsulation layer 1711, sufficient film-forming gas is introduced before forming each sub-first encapsulation layer 1711, so that the waste gas in the cavity between the first structural portion and the light-emitting layer 16 can be displaced, forming a new film-forming environment, improving the film-forming rate in the cavity, and making the film-forming time of one sub-first encapsulation layer 1711 relatively short, without being affected by the waste gas generated by forming this sub-first encapsulation layer 1711 itself. Therefore, a complete film layer can be formed each time the sub-first encapsulation layer 1711 is formed. Each sub-first encapsulation layer 1711 completely wraps the first structural portion, and finally the multiple sub-first encapsulation layers 1711 fill the cavity, which can avoid the formation of the water and oxygen channel 23 and eliminate the risk of failure of the light-emitting layer 16.

[0091] The display panel involved in the embodiment of the present invention will be described in detail below in conjunction with specific embodiments.

[0092] As Figures 1 to 5 shown, a first structural portion is disposed on the side of the light-emitting layer 16 away from the substrate 11. The first structural portion is disposed on the side of the light-emitting layer 16 away from the driving backplane. The first structural portion is a partition unit 19 surrounding the opening 300, and the partition unit 19 is disposed in the first sub-transition region 2001. A cavity is formed between the surface of the partition unit 19 close to the driving backplane and the surface of the light-emitting layer 16 away from the driving backplane.

[0093] As Figures 8 to 11 shown, the first encapsulation layer 171 is disposed on the side of the light-emitting layer 16 away from the driving backplane. The first encapsulation layer 171 includes at least two sub-first encapsulation layers 1711, and the at least two sub-first encapsulation layers 1711 are stacked in sequence in a direction away from the driving backplane. The required thickness of the first encapsulation layer 171 is achieved after stacking multiple sub-first encapsulation layers 1711. The material of the sub-first encapsulation layer 1711 is different from the material of the partition unit 19.

[0094] Since less waste gas is generated when forming a sub-first encapsulation layer 1711, sufficient film-forming gas is introduced before forming each sub-first encapsulation layer 1711, so that the waste gas in the cavity between the first structural part and the light-emitting layer 16 can be displaced, forming a new film-forming environment, improving the film-forming rate in the cavity, making the film-forming time of a sub-first encapsulation layer 1711 relatively short, and not being affected by the waste gas generated by forming this sub-first encapsulation layer 1711 itself. Therefore, a complete film layer can be formed every time the sub-first encapsulation layer 1711 is formed, and each sub-first encapsulation layer 1711 completely wraps the first structural part.

[0095] The first encapsulation layer 171 is decomposed into multiple sub-first encapsulation layers 1711. Each sub-first encapsulation layer 1711 will perform a complete encapsulation on the first structural part. Eventually, the cavity is filled by multiple sub-first encapsulation layers 1711, eliminating the water-oxygen passage formed due to residual waste gas and slow reaction in the cavity between the first structural part and the light-emitting layer 16.

[0096] At the same time, due to the on-off of the radio frequency power supply and the start and stop of the input of the film-forming gas between multiple film-forming processes, the film-forming gas gradually increases in the cavity at the start of input and gradually decreases in the cavity at the end of input. Therefore, at the start and end of input, the concentration of the film-forming gas in the cavity is relatively low. As a result, a boundary layer 1712 is formed between two sub-first encapsulation layers 1711. Each boundary layer 1712 is a transition layer between adjacent sub-first encapsulation layers 1711. The density of the film layer in the boundary layer 1712 is less than that of the film layer in the sub-first encapsulation layer 1711, and the content of silicon element in the boundary layer 1712 is less than that of the silicon element in the sub-first encapsulation layer 1711.

[0097] The partition unit 19 is a single-layer partition unit 19 or a double-layer partition unit 19. The display panel may only include a single-layer partition unit 19, or may include both a double-layer partition unit 19 and a single-layer partition unit 19 at the same time. The double-layer partition unit 19 includes a first partition structure 191 and a second partition structure 192. The single-layer partition unit 19 includes one of the first partition structure 191 and the second partition structure 192. The first partition structure 191 is arranged on the same layer and made of the same material as the first source-drain metal layer, and the second partition structure 192 is arranged on the same layer and made of the same material as the second source-drain metal layer.

[0098] The double-layer partition unit 19 includes both the first partition structure 191 and the second partition structure 192. On the one hand, the thickness of the double-layer partition unit 19 is greater than that of the single-layer partition unit 19, which can achieve a better partition effect. On the other hand, both the first partition structure 191 and the second partition structure 192 have an anchoring structure, making the strength of the display panel in the thickness direction higher and making it easier to resist the film layer peeling caused by the film layer stress problem during cutting.

[0099] As shown Figure 10 in the figure, the partition unit 19 is a single-layer partition unit 19. The single-layer partition unit 19 includes a first partition structure 191. The first partition structure 191 includes a first partition layer 193, a second partition layer 194, and a third partition layer 195 arranged in sequence along the direction away from the substrate 11. The width of the second partition layer 194 is smaller than the widths of the adjacent first partition layer 193 and the third partition layer 195 on both sides. The shape of the cross-section of the second partition layer 194 of the first partition structure 191 along the width direction of the partition unit 19 is a regular trapezoid. The width of the third partition layer 195 of the first partition structure 191 is smaller than the width of the first partition layer 193. When the shape of the cross-section of the second partition layer 194 is a regular trapezoid, the sub-first encapsulation layer 1711 is more likely to adhere to the second partition layer 194, so that the sub-first encapsulation layer 1711 better wraps the partition unit 19.

[0100] As shown Figure 11 in the figure, when the partition unit 19 is a double-layer partition unit 19, the double-layer partition unit 19 includes a first partition structure 191 and a second partition structure 192 arranged in sequence along the direction away from the substrate 11. The third partition layer 195 of the first partition structure 191 is reused as the first partition layer 193 of the second partition structure 192. Of course, the third partition layer 195 of the first partition structure 191 can also be stacked with the first partition layer 193 of the second partition structure 192.

[0101] The shapes of the cross-sections of the second partition layers 194 of the first partition structure 191 and the second partition structure 192 along the width direction of the partition unit 19 are both regular trapezoids. Along the direction away from the substrate 11, the widths of the first partition layer 193 of the first partition structure 191, the third partition layer 195 (the first partition layer 193 of the second partition structure 192), and the third partition layer 195 of the second partition structure 192 gradually decrease. When the shapes of the cross-sections of the second partition layers 194 of the first partition structure 191 and the second partition structure 192 are both regular trapezoids, the sub-first encapsulation layer 1711 is more likely to adhere to the second partition layers 194 of the first partition structure 191 and the second partition structure 192, so that the sub-first encapsulation layer 1711 better wraps the partition unit 19.

[0102] When the partition unit 19 is a single-layer partition unit 19, the single-layer partition unit 19 has a small height difference. When the first encapsulation layer 171 is divided into multiple sub-first encapsulation layers 1711, each sub-first encapsulation layer 1711 can better wrap the partition unit 19. When the partition unit 19 is a double-layer partition unit 19, even if the double-layer partition unit 19 has a large height difference, each sub-first encapsulation layer 1711 can completely wrap the partition unit 19, effectively avoiding the formation of the water and oxygen channel 23 while ensuring a better partition effect.

[0103] As Figure 12 shown, during the manufacturing process of the display panel, foreign matters such as dust and fibers 24 randomly fall on the side of the light-emitting layer 16 away from the substrate 11. In this case, the first structural part is the foreign matter 24, and a cavity will also be formed between the side of the foreign matter 24 close to the driving backplane and the side of the light-emitting layer 16 away from the driving backplane. For the cavity formed between the foreign matter 24 and the light-emitting layer 16, each layer of the first sub-encapsulation layer 1711 can also completely wrap the first structural part, and finally the multiple layers of the first sub-encapsulation layer 1711 fill the cavity, which can avoid the formation of the water and oxygen channel 23.

[0104] As Figure 9 and Figure 12 shown, whether the first structural part is the partition unit 19 or the foreign matter 24, the first structural part has a first surface 1901 away from the substrate 11, a second surface 1902 close to the substrate 11, and a third surface 1903 connecting the first surface 1901 and the second surface 1902, and the first sub-encapsulation layer 1711 covers the first surface 1901, the second surface 1902 and the third surface 1903.

[0105] An embodiment of the present invention also provides a manufacturing method of any of the above display panels. As Figures 13 to 18 shown, the method includes:

[0106] Step S10, forming a light-emitting layer 16 on one side of the driving backplane, and the side of the light-emitting layer 16 away from the driving backplane has a first structural part;

[0107] Step S20, introducing a film-forming gas to displace the waste gas in the cavity 22 formed between the first structural part and the light-emitting layer 16;

[0108] Step S30, introducing the film-forming gas again, and controlling to generate the first sub-encapsulation layer 1711 covering the first structural part;

[0109] Step S40, repeating to form multiple layers of the first sub-encapsulation layer 1711 covering the first structural part until the multiple layers of the first sub-encapsulation layer 1711 fill the cavity.

[0110] It should be noted that the process of generating the first sub-encapsulation layer 1711 requires the participation of a radio frequency power supply. In step S20, when the waste gas in the cavity 22 is displaced by the film-forming gas, the radio frequency power supply is not applied, and the first sub-encapsulation layer 1711 will not be formed. In step S30, after the waste gas in the cavity 22 is displaced and a new film-forming environment is formed, the radio frequency power supply is applied again to start forming the first sub-encapsulation layer 1711.

[0111] The film-forming gas generally includes 1500 - 5000 sccm of SiH4, 1000 - 1000 sccm of N2O, 1000 - 5000 sccm of NH3, 5000 - 50000 sccm of H2, and 5000 - 30000 sccm of N2. The material of the sub-first encapsulation layer 1711 formed through the above film-forming process may include silicon nitride, silicon oxynitride, and silicon oxide.

[0112] The following specifically describes steps S20 and S30 with reference to specific embodiments.

[0113] As Figure 13 shown, introduce the film-forming gas to displace the waste gas in the cavity 22 formed between the first structural part and the light-emitting layer 16. As Figure 14 shown, turn on the radio frequency power supply, introduce the film-forming gas again, control the formation of the first layer of the sub-first encapsulation layer 1711 covering the first structural part, then stop the input of the film-forming gas, and turn off the radio frequency power supply. As Figure 15 shown, introduce the film-forming gas to displace the waste gas in the cavity 22 formed between the first layer of the sub-first encapsulation layer 1711 and the light-emitting layer 16. As Figure 16 shown, turn on the radio frequency power supply, introduce the film-forming gas again, control the formation of the second layer of the sub-first encapsulation layer 1711 covering the first layer of the sub-first encapsulation layer 1711, then stop the input of the film-forming gas, and turn off the radio frequency power supply. As Figure 17 shown, introduce the film-forming gas to displace the waste gas in the cavity 22 formed between the second layer of the sub-first encapsulation layer 1711 and the light-emitting layer 16. As Figure 18 shown, turn on the radio frequency power supply, introduce the film-forming gas again, control the formation of the third layer of the sub-first encapsulation layer 1711 covering the second layer of the sub-first encapsulation layer 1711, then stop the input of the film-forming gas, and turn off the radio frequency power supply.

[0114] The embodiment of the present invention also provides a display device, which may include the display module of any one of the above embodiments of the present invention. The specific structure and beneficial effects of the display module have been described in detail above, so they will not be elaborated here.

[0115] It should be noted that in addition to the display module, the display device also includes other necessary components and compositions, such as a housing, a circuit board, a power cord, etc. Those skilled in the art can supplement them accordingly according to the specific usage requirements of the display device, which will not be elaborated here.

[0116] The display device may also be emerging wearable devices, such as virtual reality devices and augmented reality devices, or traditional electronic devices, such as mobile phones, computers, televisions, and video cameras. They will not be listed one by one here.

[0117] Other embodiments of the present invention will be readily apparent to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the present invention and include known common general knowledge or conventional technical means in the technical field of the present invention that are not disclosed in the present invention. The specification and examples are only to be considered as exemplary, and the true scope and spirit of the present invention are pointed out by the appended claims.

Claims

1. A display panel, characterized in that: include: Driver backplane; A light-emitting layer, disposed on one side of the driving backplane; A first structural part is provided on a side of the light-emitting layer away from the driving backplane, wherein a side of the first structural part close to the driving backplane and a side of the light-emitting layer away from the driving backplane form a cavity; The first encapsulation layer is arranged on the side of the light-emitting layer away from the driving backplane, and the first encapsulation layer includes at least two sub-first encapsulation layers, and the at least two sub-first encapsulation layers are stacked in sequence along the direction away from the driving backplane, each sub-first encapsulation layer completely wraps the first structural part, and multiple sub-first encapsulation layers fill the cavity.

2. The display panel according to claim 1, characterized in that: A boundary layer is provided between two adjacent sub-first packaging layers, and the film layer density in the boundary layer is less than the film layer density in the sub-first packaging layer.

3. The display panel according to claim 2, characterized in that: The content of silicon in the boundary layer is less than the content of silicon in the sub-first encapsulation layer.

4. The display panel according to claim 1, characterized in that: The display panel has an opening, the first structural part is a partition unit arranged around the opening, the partition unit includes at least two partition layers, the distance between the orthographic projection of the partition layer far from the driving backplane on the driving backplane and the edge of the opening is a first distance, the distance between the orthographic projection of the partition layer close to the driving backplane on the driving backplane and the edge of the opening is a second distance, and the first distance is greater than the second distance.

5. The display panel according to claim 4, characterized in that: The partition unit is a double-layer partition unit or a single-layer partition unit. The double-layer partition unit includes two stacked partition structures, and the single-layer partition unit includes one partition structure.

6. The display panel according to claim 5, characterized in that: The partition structure includes a first partition layer, a second partition layer and a third partition layer arranged in sequence in a direction away from the driving back plate, and the width of the second partition layer is smaller than the width of the first partition layer and the third partition layer on two adjacent sides.

7. The display panel according to claim 6, characterized in that: When the partition unit is a double-layer partition unit, the two partition structures are respectively a first partition structure and a second partition structure arranged in sequence along a direction away from the driving back plate, and the third partition layer of the first partition structure is reused as the first partition layer of the second partition structure, or the third partition layer of the first partition structure is stacked with the first partition layer of the second partition structure.

8. The display panel according to claim 6, characterized in that: A cross-section of the second partition layer of the partition structure along a width direction of the partition unit is in a regular trapezoidal shape.

9. The display panel according to claim 8, characterized in that: The width of the third partition layer of the partition structure is smaller than the width of the first partition layer.

10. The display panel according to claim 5, characterized in that: The display panel also includes a driving circuit layer, which is arranged on one side of the driving backplane, and the driving circuit layer includes a first source-drain metal layer and a second source-drain metal layer. When the partition unit is a single-layer partition unit, the partition structure is arranged in the same layer and material as the first source-drain metal layer or the second source-drain metal layer. When the partition unit is a double-layer partition unit, the partition structure is arranged in the same layer and material as the first source-drain metal layer and the second source-drain metal layer.

11. The display panel according to claim 4, characterized in that: The number of the partition units is at least two, and at least two of the partition units are sequentially spaced apart in a direction away from the opening.

12. The display panel according to claim 11, characterized in that: The light-emitting layer includes a light-emitting material layer and a common electrode, the light-emitting material layer is arranged on one side of the driving backplane, the common electrode is arranged on the side of the light-emitting material layer away from the driving backplane, the common electrode is separated by the partition unit to form a plurality of common electrode parts, the common electrode parts include a first common electrode part and a second common electrode part, the first common electrode part is arranged on a side of the partition unit away from the driving backplane, and the second common electrode part is arranged between two adjacent partition units.

13. The display panel according to claim 1, characterized in that: The material of the first structure portion is different from the material of the sub-first encapsulation layer.

14. The display panel according to claim 1, characterized in that: The first structural part has a first surface away from the driving backplane, a second surface close to the driving backplane, and a third surface connected between the first surface and the second surface, and the sub-first packaging layer covers the first surface, the second surface and the third surface.

15. A method for manufacturing a display panel according to any one of claims 1 to 14, characterized in that: The method comprises: A light-emitting layer is formed on one side of the driving backplane, and a side of the light-emitting layer away from the driving backplane has a first structure portion; Passing film-forming gas to displace the waste gas in the cavity formed between the first structure part and the light-emitting layer; introducing the film-forming gas again to control the generation of a sub-first encapsulation layer covering the first structural part; Repeatedly forming multiple layers of sub-first encapsulation layers covering the first structure portion until the multiple layers of the sub-first encapsulation layers fill the cavity.

16. The method for manufacturing a display panel according to claim 15, characterized in that: The film forming gas includes SiH4, N2O, NH3, H2 and N2.

17. A display device, characterized in that: A display panel comprising any one of claims 1 to 14.

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