Display panel and display device including same

Abstract

The invention relates to a display panel and a display device including the same. The display device includes a display panel including a display area, a light transmissive area, and a non-display area surrounding the light transmissive area. The display panel includes a substrate disposed in a display area and a non-display area, a circuit portion disposed on the substrate, a light emitting element portion disposed on the circuit portion, a package portion disposed on the light emitting element portion, and a touch portion disposed on the package portion. An organic insulating layer extending from the touch portion is disposed on an opening formed in the substrate.

Description

Technical Field

[0001] The present disclosure relates to a display panel and a display device including the display panel, and more particularly, for example but not limited to, a display panel structurally improved to prevent moisture penetration and a display device including the display panel. Background Art

[0002] According to the material of the light-emitting layer, electroluminescent display devices are classified into inorganic light-emitting display devices and organic light-emitting display devices. An active matrix organic light-emitting display device includes an organic light-emitting diode (OLED) that emits light itself and has advantages such as fast response time, high luminous efficiency, high brightness, and wide viewing angle. The organic light-emitting display device has an OLED formed in each pixel. The organic light-emitting display device can represent black grayscale as completely black, and has fast response time, high luminous efficiency, high brightness, and wide viewing angle, and thus has excellent contrast and color gamut.

[0003] The descriptions provided in the discussion of this related art section should not be assumed to be prior art merely because they are mentioned in or associated with the description of the related art section. The discussion of the related art section may include information describing one or more aspects of the subject technology, and the descriptions in this section do not limit the present disclosure. Summary of the Invention

[0004] Recently, organic light-emitting display devices have been implemented on plastic substrates made of flexible materials, but can also be implemented on glass substrates due to various problems.

[0005] However, when using a laser to form a notch on a glass substrate or form a hole inside a display panel, the display panel may be damaged by the laser, or some moisture, oxygen, etc. may penetrate into the inside of the display panel due to such damage.

[0006] Example embodiments of the present disclosure provide a display panel and a display device including the display panel that improve quality and reliability by preventing film lifting when forming a light-transmitting region.

[0007] Example embodiments of the present disclosure provide a display panel and a display device including the display panel that are structurally improved to prevent moisture penetration.

[0008] Example embodiments of the present disclosure provide a display panel and a display device including the display panel that form holes of various shapes in a glass substrate while maintaining rigidity.

[0009] The objects to be solved by the embodiments of the present disclosure are not limited to the above objects, and those skilled in the art will clearly understand the objects not described above from the following description.

[0010] A display device according to an exemplary embodiment of the present disclosure includes: a display panel including a display area, a light-transmitting area, and a non-display area surrounding the light-transmitting area, wherein the display panel includes: a substrate disposed in the display area and the non-display area; a circuit portion disposed on the substrate; a light-emitting element portion disposed on the circuit portion; a packaging portion disposed on the light-emitting element portion; and a touch portion disposed on the packaging portion, wherein the substrate and the packaging portion surround an opening corresponding to the light-transmitting area, and an organic insulating layer is disposed on the opening.

[0011] A display device according to an exemplary embodiment of the present disclosure includes: a display panel including a display area, a light-transmitting area, and a non-display area surrounding the light-transmitting area, wherein the display panel includes: a substrate disposed in the display area and the non-display area; a circuit portion disposed on the substrate; a light-emitting element portion disposed on the circuit portion; a packaging portion disposed on the light-emitting element portion; and a touch portion disposed on the packaging portion, wherein the substrate includes an opening corresponding to the light-transmitting area, and one of a first touch planarization layer and a second touch planarization layer extending toward the light-transmitting area of the touch portion is joined to a coating disposed in the opening.

[0012] A display device according to an exemplary embodiment of the present disclosure includes: a display panel including a display area, a light-transmitting area, and a non-display area surrounding the light-transmitting area, wherein the display panel includes a substrate disposed in the display area and the non-display area, a circuit portion disposed on the substrate, a light-emitting element portion disposed on the circuit portion, a packaging portion disposed on the light-emitting element portion, and a touch portion disposed on the packaging portion, wherein the substrate includes an opening corresponding to the light-transmitting area, the non-display area includes a wiring area provided with wirings bypassing the light-transmitting area, a dummy area surrounding the light-transmitting area, and a moisture-proof permeation area disposed between the wiring area and the dummy area, the moisture-proof permeation area includes a first moisture-proof permeation structure and a second moisture-proof permeation structure spaced apart from each other, and one of a first touch planarization layer and a second touch planarization layer extending from the touch portion toward the light-transmitting area of the touch portion is disposed between the first moisture-proof permeation structure and the second moisture-proof permeation structure.

[0013] According to one or more aspects of the present disclosure, delamination around the light-transmitting region can be prevented by bonding a coating made of an organic material disposed in an opening of a display panel and an organic insulating layer disposed on the opening. In addition, the bonding of the coating and the organic insulating layer can prevent moisture, oxygen, etc. from penetrating into the interior of the display panel through the light-transmitting region. Specifically, a planarization layer extending from a touch portion of a display region to the light-transmitting region is used as the organic insulating layer bonded to the coating, thereby preventing delamination that may occur between a plurality of layers disposed between a substrate and the planarization layer of the touch portion, and preventing moisture, oxygen, etc. from penetrating into the interior of the display panel through the light-transmitting region. As a result, the quality and reliability of the display panel can be improved.

[0014] According to one or more aspects of the present disclosure, by providing a moisture permeation prevention structure in a non-display region provided between a display region and a light-transmitting region, moisture, oxygen, etc. can be prevented from penetrating into the interior of the display panel.

[0015] According to one or more aspects of the present disclosure, process optimization can be achieved by etching a part of a glass substrate using an etching process that simultaneously forms holes of various shapes.

[0016] According to one or more aspects of the present disclosure, when etching a substrate made of glass, a planarization layer made of an organic material and extending from a touch portion of a display region to a light-transmitting region is used as an anti-etching layer, thereby preventing an etching solution from penetrating into the interior of the display panel.

[0017] Various useful advantages and effects of the present disclosure are not limited to the above, and those skilled in the art will clearly understand the effects not described above based on the following description.

[0018] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the claimed present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and other objects, features, and advantages of the present disclosure will become more apparent to those of ordinary skill in the art by referring to the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings, wherein:

[0020] Figure 1 is a diagram showing a display device according to an exemplary embodiment of the present disclosure;

[0021] Figure 2 is taken along Figure 1 sectional view taken along line I-I' in

[0022] Figure 3 is Figure 2 an enlarged view of part A in

[0023] Figure 4 is a sectional view taken along line II-II’ in Figure 1 ;

[0024] Figure 5 is a view showing a light-transmitting region and a first protrusion in an edge region surrounding the light-transmitting region;

[0025] Figure 6 is a view showing Figure 5 an enlarged view of region B in

[0026] Figure 7 is a view showing Figure 6 an enlarged view of region Ba in

[0027] Figure 8 is a view showing an example of a display panel provided in a display device according to an exemplary embodiment of the present disclosure;

[0028] Figure 9 is a view showing Figure 8 an enlarged view of region D in

[0029] Figure 10 is a view showing Figure 8 an enlarged view of region E in

[0030] Figure 11 is a view showing Figure 8 an enlarged view of region F in

[0031] Figures 12A to 12H is a view showing a process of forming a light-transmitting region in the display panel shown in Figure 8 according to an example of the present disclosure;

[0032] Figure 13 is a view showing another example of a display panel provided in a display device according to an exemplary embodiment of the present disclosure;

[0033] Figure 14 is a view showing Figure 13 an enlarged view of region G in

[0034] Figures 15A to 15H is a view showing a process of forming a light-transmitting region in the display panel shown in Figure 13 according to an example of the present disclosure;

[0035] Figure 16 is a view showing yet another example of a display panel provided in a display device according to an exemplary embodiment of the present disclosure;

[0036] Figure 17 is a view showing Figure 16 an enlarged view of region H in ; and

[0037] Figures 18A to 18His a diagram showing the process of forming a light-transmissive region in the display panel shown in Figure 16 as shown in the figure.

[0038] Throughout the drawings and the detailed description, unless otherwise described, the same reference numerals should be understood to refer to the same elements, features, and structures. The relative sizes and depictions of these elements may be exaggerated for clarity, illustration, and convenience. Detailed Embodiments

[0039] Now, embodiments of the present disclosure will be described in detail, and examples thereof can be shown in the drawings. The progress of the described processing steps and / or operations is an example; however, the order of the steps and / or operations is not limited to the order set forth herein and may be changed as is known in the art, except for steps and / or operations that must occur in a specific order. The names of the corresponding elements used in the following description may be chosen only for the convenience of writing the specification and may thus be different from the names used in actual products.

[0040] According to the embodiments described below with reference to the drawings, the advantages and features of the present disclosure and the methods for achieving the advantages and features of the present disclosure will be more clearly understood. However, the present disclosure is not limited to the following exemplary embodiments but may be implemented in various different forms. On the contrary, the present embodiments will make the disclosure of the present disclosure complete and allow those skilled in the art to fully understand the scope of the present disclosure. The present disclosure is limited only within the scope of the appended claims.

[0041] The shapes, sizes, ratios, angles, quantities, etc. disclosed in the drawings for describing the embodiments of the present disclosure are exemplary, and the present disclosure is not limited to the items shown. The same reference numerals always refer to the same elements. In addition, when describing the present disclosure, if it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present disclosure, the detailed description thereof will be omitted.

[0042] Terms such as "comprising," "including," "having," and "consisting of," "made of," "formed of," etc. used herein are generally intended to allow the addition of other components, unless these terms are used together with the term "only." References to the singular shall be construed to include the plural unless otherwise explicitly stated.

[0043] When explaining a component, it is interpreted to include the error range even if not separately described. Any implementation described herein as an "example" is not necessarily to be construed as superior to or having an advantage over other implementations.

[0044] When describing a positional or interconnect relationship between two components such as "on top of", "above", "below", "next to", "connected or coupled", "crossed", "intersected", etc., one or more other components may be interposed between the two components, unless "immediately" or "directly" is used, that is, one or more other components may be interposed between the two components. For example, when one element or layer is "disposed" on another element or layer, a third layer or element may be interposed therebetween.

[0045] When describing a temporal context relationship such as "after", "subsequently", "then", or "before", it may not be continuous on the time scale unless "immediately" or "directly" is used.

[0046] To distinguish components, ordinal numbers such as first, second, "A", "B", "(A)", or "(B)" etc. may be used before the name of the component, but the function or structure is not limited by these ordinal numbers or the component name. For ease of description, different embodiments may have different ordinal numbers before the name of the same component.

[0047] The following embodiments may be combined or associated with each other in whole or in part, and various types of interlocks and drives are technically possible. Example embodiments may be implemented independently of each other or in a related relationship together.

[0048] The term "at least one" should be understood to include any and all combinations of one or more of the associated listed items. For example, the meaning of "at least one of the first item, the second item, and the third item" encompasses the combination of all three listed items, the combination of any two of the three elements, and each individual element (the first element, the second element, and the third element).

[0049] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by a person of ordinary skill in the art to which the example embodiments belong. It will also be understood that terms (such as those defined in a common dictionary) should be interpreted as having a meaning consistent with, for example, their meaning in the context of the relevant field, and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein. For example, the term "component" or "unit" may be applied, for example, to a separate circuit or structure, an integrated circuit, a computational block of a circuit device, or any structure configured to perform the described function, as would be understood by a person of ordinary skill in the art.

[0050] The features of the various embodiments of the present disclosure may be combined with each other in part or in whole, and may be technically related or interoperable with each other. Embodiments may be implemented independently of each other or together in an associated relationship.

[0051] Hereinafter, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. For ease of explanation, the proportions of the components shown in the drawings are different from the actual proportions and are not limited to the proportions shown in the drawings. All components of each device / apparatus according to all embodiments of the present disclosure are operably coupled and configured.

[0052] Throughout the present disclosure, the same reference numerals denote the same components.

[0053] As used herein, a "display device" may include a display device in a narrow sense, such as a liquid crystal module (LCM), an organic light emitting diode (OLED) module, or a quantum dot (QD) module, which includes a display panel and a driver for driving the display panel. It may also include an electronic device set or a device set or an equipment set such as a laptop computer, a television, a computer monitor, an in-vehicle display device, or other forms of equipment display devices in a vehicle, and mobile electronic devices such as a smart phone or an electronic tablet as a complete product or a finished product including an LCM, an OLED module, and a QD module.

[0054] The display device in the present disclosure may include the display device itself in a narrow sense, an application product including the display device in a narrow sense, or even a device set as a terminal consumer device.

[0055] Figure 1 is a conceptual diagram of a display device according to an exemplary embodiment of the present disclosure, Figure 2 is a cross-sectional view taken along line I-I' in Figure 1 and Figure 3 is an enlarged view of part A in Figure 2 . In Figure 2 , the reference numeral C indicating a virtual line may indicate the center of the light transmissive area TA.

[0056] Referring to Figure 1 and Figure 2 , a display device according to an exemplary embodiment of the present disclosure may include a display panel 100 that visually reproduces an input image and a sensor 200 disposed corresponding to a light transmissive area TA of the display panel 100. The embodiment is not limited thereto. As an example, at least one of the above components may be omitted, and / or one or more additional components may be further included.

[0057] The display panel 100 may include a display area DA for displaying an image, a light-transmitting area TA for light incident, and a non-display area NDA formed between the light-transmitting area TA and the display area DA, but is not limited thereto. The light-transmitting area TA may be a hole structure for allowing light to enter the sensor 200 disposed below the display panel 100, but is not necessarily limited thereto. Different from the display area DA, the non-display area NDA may be an area where an image is not displayed.

[0058] The display panel 100 may be a panel having a rectangular structure with a width in the X-axis direction, a length in the Y-axis direction, and a thickness in the Z-axis direction. The width and length of the display panel 100 may be set to various design values according to the application field of the display device. The X-axis direction may refer to the width direction, the row direction, or the horizontal direction, the Y-axis direction may refer to the longitudinal direction, the column direction, or the vertical direction, and the Z-axis direction may refer to the up-down direction or the thickness direction, but is not limited thereto. The X-axis direction, the Y-axis direction, and the Z-axis direction may be perpendicular to each other, but may also refer to different directions that are not perpendicular to each other. Therefore, each of the X-axis direction, the Y-axis direction, and the Z-axis direction may be described as one of the first direction, the second direction, and the third direction. The surface extending in the X-axis direction and the Y-axis direction may refer to a horizontal surface. The surface extending in the Z-axis direction may refer to a vertical surface.

[0059] In the display area DA of the display panel 100, data lines, gate lines intersecting the data lines, and a plurality of pixels Px arranged in a matrix form defined by the data lines and the gate lines may be provided, but are not limited thereto. Alternatively, more or fewer elements may be provided.

[0060] Each of the plurality of pixels Px includes sub-pixels of different colors for color reproduction. For example, the sub-pixels may include red sub-pixels, green sub-pixels, and blue sub-pixels, but are not limited thereto. Alternatively, the sub-pixels may include cyan sub-pixels, magenta sub-pixels, or yellow sub-pixels, etc. Although not shown, each of the plurality of pixels Px may also include sub-pixels of the same color. For example, the sub-pixels may include white sub-pixels, but are not limited thereto. Hereinafter, unless otherwise defined, a pixel may be interpreted as a sub-pixel. Each of the sub-pixels may include a pixel circuit.

[0061] As an example, the pixel circuit may include a light-emitting element, a driving element for supplying current to the light-emitting element, one or more switching elements for switching the current path of the driving element and the light-emitting element, a capacitor for maintaining the voltage Vgs between the gate and the source of the driving element, etc.

[0062] The light-emitting element can be implemented in an element structure such as an organic light-emitting diode (OLED) display, a quantum dot display, and a micro light-emitting diode (LED) display, but is not limited thereto. Hereinafter, an OLED structure including an organic compound layer will be described as an example.

[0063] The OLED includes an anode, a cathode, and an organic compound layer formed between the anode and the cathode. The organic compound layer may include one or more of a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL), but is not limited thereto. When a voltage is applied to the anode and the cathode of the OLED, holes passing through the hole transport layer (HTL) and electrons passing through the electron transport layer (ETL) move to the light-emitting layer (EML) to form excitons, so that visible light is emitted from the light-emitting layer (EML).

[0064] The display panel driver writes the pixel data of the input image into the pixel Px. The display panel driver may include a data driver that provides a data voltage for the pixel data to the data line, a gate driver that sequentially provides a gate pulse to the gate line, and the like. The data driver is integrated into the driving IC. The driving IC may be attached to the display panel 100.

[0065] The driving IC is connected to the data line through a data output channel and provides a voltage of a data signal to the data line. The driving IC includes a timing controller. The timing controller transfers the pixel data of the input image received from the host system to the data driver and controls the operation timing of the data driver and the gate driver.

[0066] The data driver of the driving IC converts the pixel data into a gamma compensation voltage through a digital-to-analog converter (DAC) and outputs a data voltage.

[0067] The gate driver may include a shift register formed in the circuit layer of the display panel 100 together with the pixel array. The shift register of the gate driver sequentially provides a gate signal to the gate line under the control of the timing controller. The gate signal may include a scan pulse and a light emission control pulse (hereinafter referred to as an "EM pulse"). The shift register may include a scan driver that outputs a scan pulse and an EM driver that outputs an EM pulse, and the like.

[0068] The host system may be implemented as an application processor (AP). The host system transfers the pixel data of the input image to the driving IC. The host system may be connected to the driving IC through a flexible printed circuit (for example, a flexible printed circuit (FPC)).

[0069] Various wirings and driving circuits may be provided in the non-display area NDA, and a pad portion connected to an integrated circuit, a printed circuit, etc. may be provided.

[0070] The flexible printed circuit can be formed on the flexible printed circuit board and can be connected to the driving IC through the pad portion. The driving IC can be disposed on the display panel 100, but is not necessarily limited thereto. For example, the driving IC can also be disposed on the flexible printed circuit board.

[0071] The display panel 100 can be manufactured based on a glass substrate, but is not necessarily limited thereto. Alternatively, the display panel 100 can be manufactured based on a plastic or flexible polymer film. For example, the flexible polymer film can be made of any one of the following: polyethylene terephthalate (PET), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone (PES), cycloolefin copolymer (COC), triacetyl cellulose (TAC) film, polyvinyl alcohol (PVA) film, polyimide (PI) film, and polystyrene (PS), which are only examples and are not necessarily limited thereto.

[0072] Referring to Figure 2 , the display panel 100 can include a substrate 10 disposed in the display area and the non-display area, a circuit portion 13 disposed on the substrate 10, and a light-emitting element portion 15 disposed on the circuit portion 13, but is not limited thereto. The display panel 100 can further include a packaging portion 17 disposed on the light-emitting element portion 15, a polarizer 19 disposed on the packaging portion 17, and a cover glass 20 disposed on the polarizer 19. The display panel can further include a touch portion 18 disposed between the light-emitting element portion 15 and the polarizer 19. Specifically, the touch portion 18 can be disposed between the packaging portion 17 and the polarizer 19.

[0073] The substrate 10 can be made of an insulating material or a flexible material, but is not limited thereto. For example, the substrate 10 can be made of glass, metal, or plastic, but is not limited thereto. However, as the substrate 10, a glass substrate having a certain strength can be used for the etching process for process simplification.

[0074] The circuit portion 13 can include a pixel circuit connected to wirings such as data lines, gate lines, and power lines, a gate driver connected to the gate lines, and the like. In addition, the wirings of the circuit portion 13 can include a plurality of insulating layers, two or more metal layers separated by the insulating layers therebetween, and an active layer including a semiconductor material, and the like. The circuit elements of the circuit portion 13 can include transistors and capacitors implemented as thin film transistors (TFTs), and the like.

[0075] The light-emitting element unit 15 may include a light-emitting element driven by a pixel circuit, but is not limited thereto. Alternatively, the light-emitting element unit 15 may further include a color filter array disposed on the light-emitting element. The light-emitting element may include a plurality of light-emitting elements, such as a red light-emitting element, a green light-emitting element, and a blue light-emitting element. In another embodiment, the light-emitting element unit 15 may include a white light-emitting element and a color filter. The light-emitting element of the light-emitting element unit 15 may be covered with a protective layer including an organic film and a protective film.

[0076] The light-emitting element unit 15 may further include a color filter array disposed on the pixel that selectively transmits red, green, and blue wavelengths, but is not limited thereto.

[0077] The encapsulation unit 17 covers the light-emitting element unit 15 to seal the circuit unit 13 and the light-emitting element unit 15. The encapsulation unit 17 may have a multi-insulating film structure in which an organic film and an inorganic film are alternately laminated. The inorganic film may block the penetration of moisture or oxygen. The organic film may flatten the surface of the inorganic film. When the organic film and the inorganic film are laminated in multiple layers, the movement path of moisture or oxygen becomes longer than that of a single layer, thereby effectively blocking the penetration of moisture / oxygen that affects the light-emitting element unit 15.

[0078] The touch unit 18 may include a capacitive touch sensor that senses a touch input based on a change in capacitance before and after the touch input. The touch unit 18 may include a metal wiring pattern and an insulating film that form the capacitance of the touch sensor. The insulating film may insulate the crossing portions of the metal wiring pattern and flatten the surface of the touch unit.

[0079] The polarizer 19 may be disposed on the light-emitting element unit 15. Specifically, the polarizer 19 may be disposed on the touch unit 18. The polarizer 19 may improve the outdoor visibility of the display device. For example, the polarizer 19 may improve visibility and contrast by converting the polarization of external light reflected by the metal pattern of the circuit unit 13. The polarizer 19 may be implemented as a polarizer or a circular polarizer in which a linear polarizer and a phase retardation film are joined. The cover glass 20 may be attached to the polarizer 19.

[0080] A light-transmitting region TA may be formed in the display region DA. A non-display region NDA may be provided to surround the light-transmitting region TA. The non-display region NDA may have a plurality of dam structures to protect the light-emitting elements in the display region DA from moisture, oxygen, etc. that may enter from the light-transmitting region TA.

[0081] The light-transmitting region TA may have a through-hole structure for injecting light into a sensor 200 such as a camera, but is not necessarily limited thereto. For example, pixels having a low density may be provided in the light-transmitting region TA.

[0082] The substrate 10 may include an opening 11 provided in the light-transmitting region TA. For example, the substrate 10 and the encapsulation part 17 may surround the opening 11 provided corresponding to the light-transmitting region TA. The opening 11 may have a tapered shape with its width narrowing towards the cover glass 20, but is not necessarily limited thereto. For example, the opening 11 may be formed in a tapered shape with its width widening towards the cover glass 20, or may be formed in a cylindrical shape with a constant width. For example, the shape of the opening 11 may vary differently according to the type of etching solution and the etching method.

[0083] An organic insulating layer may be provided on the opening 11 of the substrate 10. The opening 11 in the display panel 100 may be provided as a groove formed on the back surface of the display panel 100, and the organic insulating layer may be referred to as an organic insulating member or an organic insulating film.

[0084] The organic insulating layer provided on the opening 11 may prevent the etching solution from penetrating into the interior of the display panel 100 during the etching process. Therefore, the organic insulating layer provided on the opening 11 may be referred to as an anti-etching layer.

[0085] The organic insulating layer may include an organic material resistant to the etching solution. For example, the organic insulating layer may include one selected from the group consisting of polyester-based polymers, silicone-based polymers, acrylic-based polymers, polyolefin-based polymers, and copolymers thereof. However, it is not necessarily limited thereto, and the organic insulating layer provided on the opening 11 may include various materials, such as inorganic materials or metal materials resistant to the etching solution.

[0086] Considering process efficiency and possible delamination between multiple layers extending from multiple layers provided between the substrate and the touch part towards the light-transmitting region TA, the organic insulating layer may be formed by extending at least one of the layers constituting the touch part 18. As Figure 2 shown, the organic insulating layer may be formed as one of the layers extending from the touch part 18 of the display region DA towards the light-transmitting region TA, but is not limited thereto. For example, the organic insulating layer may be one of the first touch planarization layer and the second touch planarization layer extending from the touch part 18 towards the light-transmitting region TA.

[0087] For example, the organic insulating layer provided on the opening 11 may be a dummy layer of the touch part 18. According to such a configuration, the organic insulating layer can be formed without adding a separate process. The organic insulating layer is formed, for example, by extending at least one of the layers constituting the touch part 18, and may be formed together during the process of forming at least one of the layers constituting the touch part 18, but is not necessarily limited thereto. For example, the organic insulating layer provided on the opening 11 may be formed by extending from at least one of the layers constituting the encapsulation part 17, and may be formed together during the process of forming at least one of the layers constituting the encapsulation part 17.

[0088] According to an exemplary embodiment, the organic insulating layer may include a protrusion P1 protruding toward the light-transmitting region TA. The protrusion P1 may be a portion protruding from the upper surface of the opening 11 toward the center C of the light-transmitting region TA, and may be referred to as a first protrusion. Such a protrusion P1 may be formed during laser cutting for forming the light-transmitting region TA.

[0089] The coating 30 may be disposed on the back surface of the substrate 10 and the opening 11, and may be joined to the organic insulating layer disposed on the opening 11. The coating 30 may be made of an organic material including a polyester-based polymer or an acrylic-based polymer, but is not limited thereto.

[0090] The coating 30 may include a side coating 31 formed on the inner surface of the opening 11 and a back coating 32 disposed under the substrate 10, but is not limited thereto. In addition, the back coating 32 may be disposed under the side coating 31 and the substrate 10.

[0091] The lower surface 31a of the side coating 31 may be formed to be recessed toward the anti-etching layer, but is not necessarily limited thereto. For example, the side coating 31 shrinks by a certain height, and a curvature may be formed on the lower surface 31a of the side coating 31. In addition, the lower surface of the back coating 32 may be formed to be recessed toward the anti-etching layer, but is not necessarily limited thereto. For example, depending on the material, the side coating 31 may not shrink. Therefore, even after the curing is completed, the lower surface 31a of the side coating 31 may be substantially flat.

[0092] The inclined surface 11a of the opening 11 and the side surface S11 of the protrusion P1 of the organic insulating layer may have different slopes. Refer to Figure 3 , since the opening 11 is etched by an etching solution to have a tapered shape but the organic insulating layer disposed on the opening 11 is laser-cut to form a relatively vertical cross-section, the inclination angle of the side surface S11 of the protrusion P1 may be greater than the inclination angle of the inclined surface 11a, but is not limited thereto.

[0093] The side surface S21 of the coating 30 disposed under the protrusion P1 may have the same inclination angle as the side surface S11 of the protrusion P1, but is not necessarily limited thereto. For example, the inclination angle of the side surface S21 of the coating 30 disposed under the protrusion P1 may be greater than the inclination angle of the inclined surface 11a, but is not limited thereto. For example, the side surface S21 of the coating 30 may be formed at the same inclination angle as the inclined surface 11a.

[0094] Figure 4 is a cross-sectional view taken along the line II-II' in Figure 1 in.

[0095] Refer to Figure 4, the first transistor 120 and the second transistor 130 may be disposed on the substrate 10 in the display area DA, and the light-emitting element 150 may be disposed on the second planarization layer 111. The second planarization layer 111 may be disposed over the first transistor 120 and the second transistor 130.

[0096] The storage lower electrode 141 and the metal layer 144 may be disposed on the substrate 10. The storage lower electrode 141 and the metal layer 144 may be disposed on a portion of the substrate 10.

[0097] The storage lower electrode 141 may include molybdenum and / or aluminum, but is not limited thereto. The storage lower electrode 141 may block light from entering the first semiconductor layer 123 or the second semiconductor layer 133. The storage lower electrode 141 may overlap with the first semiconductor layer 123 or the second semiconductor layer 133 in the Z direction and may more effectively block light from entering the first semiconductor layer 123 or the second semiconductor layer 133.

[0098] The metal layer 144 may be spaced apart from the storage lower electrode 141 and may be formed together with the storage lower electrode 141 during the formation of the storage lower electrode 141, but is not limited thereto.

[0099] The multi-buffer layer 102 may be disposed on the storage lower electrode 141, the metal layer 144, and the substrate 10. The multi-buffer layer 102 may retard the diffusion of moisture or oxygen penetrating into the substrate 10 and may be formed by alternately stacking silicon nitride (SiN x ) and silicon oxide (SiO x ) at least once.

[0100] The storage upper electrode 142 may be disposed on the multi-buffer layer 102. The storage upper electrode 142 may include molybdenum and / or aluminum. The storage upper electrode 142 may block light from entering the first semiconductor layer 123 or the second semiconductor layer 133. The storage upper electrode 142 may overlap with the storage lower electrode 141 in the Z direction and may more effectively block light from entering the first semiconductor layer 123 or the second semiconductor layer 133. For example, the storage upper electrode 142 may overlap with the first semiconductor layer 123 or the second semiconductor layer 133 in the Z direction.

[0101] The active buffer layer 103 may perform a function of protecting the first semiconductor layer 123 and blocking various types of defects entering from the substrate 10. The active buffer layer 103 may be made of amorphous silicon (a-Si), silicon nitride (SiN x ) silicon oxide (SiO x ), etc., but is not limited thereto.

[0102] The first semiconductor layer 123 of the first transistor 120 may be made of a polycrystalline semiconductor layer and may include a channel region, a source region, and a drain region. The first semiconductor layer 123 may be disposed on the active buffer layer 103.

[0103] The polycrystalline semiconductor layer has a higher mobility than amorphous semiconductor layers and oxide semiconductor layers, resulting in low power consumption and excellent reliability. Due to these advantages, the polycrystalline semiconductor layer can be used in driving transistors.

[0104] The first gate 122 of the first transistor 120 may be disposed on the lower gate insulating layer 104 and may overlap with the first semiconductor layer 123.

[0105] The second transistor 130 may be disposed on the lower interlayer dielectric layer 105. The lower interlayer dielectric layer 105 may be disposed on the lower gate insulating layer 104. The upper gate insulating layer 106 may be disposed on the second semiconductor layer 133 to insulate the second gate 132 from the second semiconductor layer 133. For example, the upper gate insulating layer 106 may be disposed between the second gate 132 and the second semiconductor layer 133 to insulate the second gate 132 from the second semiconductor layer 133. In addition, the second gate 132 may overlap with the second semiconductor layer 133 in the Z-axis direction.

[0106] The upper interlayer dielectric layer 108 may be disposed on the second gate 132 of the second transistor 130. The first gate 122 and the second gate 132 may each be a single layer or a multi-layer including any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof, but is not limited thereto.

[0107] The lower interlayer dielectric layer 105 may be made of an inorganic insulating layer having a higher hydrogen particle content than the upper interlayer dielectric layer 108, but is not limited thereto. For example, the lower interlayer dielectric layer 105 may be made of silicon nitride (SiNx) formed by a deposition process using NH3 gas, and the upper interlayer dielectric layer 108 may be made of silicon oxide (SiOx), but is not limited thereto. The hydrogen particles included in the lower interlayer dielectric layer 105 may diffuse into the polycrystalline semiconductor layer during the hydrogenation process and may fill the voids in the polycrystalline semiconductor layer with hydrogen. Therefore, the polycrystalline semiconductor layer can be stabilized, thereby preventing deterioration of the characteristics of the first transistor 120.

[0108] After the activation and hydrogenation processes of the first semiconductor layer 123 of the first transistor 120, the second semiconductor layer 133 of the second transistor 130 may be formed. In this case, the second semiconductor layer 133 may be made of an oxide semiconductor. Since the second semiconductor layer 133 is not exposed to the high-temperature atmosphere of the activation and hydrogenation processes of the first semiconductor layer 123, damage to the second semiconductor layer 133 can be prevented and reliability can be improved.

[0109] After the upper interlayer dielectric layer 108 is provided, a first source contact hole 125S and a first drain contact hole 125D may be formed to correspond to the source region and the drain region of the first transistor 120, respectively, and a second source contact hole 135S and a second drain contact hole 135D may be formed to correspond to the source region and the drain region of the second transistor 130, respectively.

[0110] In the first transistor 120, the first source contact hole 125S and the first drain contact hole 125D may be holes continuously formed from the upper interlayer dielectric layer 108 to the lower gate insulating layer 104 to correspond to the source region and the drain region of the first transistor 120, respectively. Similarly, in the second transistor 130, the second source contact hole 135S and the second drain contact hole 135D may be holes continuously formed from the upper interlayer dielectric layer 108 to the upper gate insulating layer 106 to correspond to the source region and the drain region of the second transistor 130, respectively.

[0111] The first source 121 and the first drain 124 corresponding to the first transistor 120 and the second source 131 and the second drain 134 corresponding to the second transistor 130 may be formed simultaneously, but are not limited thereto. Thereby, the number of processes for forming the source and the drain in each of the first transistor 120 and the second transistor 130 can be reduced.

[0112] The first source 121 and the first drain 124 of the first transistor 120 and the second source 131 and the second drain 134 of the second transistor 130 may each be a single layer or a multi-layer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof, but are not limited thereto.

[0113] The first source 121 and the first drain 124 and the second source 131 and the second drain 134 may each have a three-layer structure, but are not limited thereto. For example, the first source 121 may include a first electrode layer 121a made of Ti, a second electrode layer 121b made of Al, and a third electrode layer 121c made of Ti, and the other sources and drains may have the same structure.

[0114] The storage capacitor 140 may be disposed between the first transistor 120 and the second transistor 130. According to an exemplary embodiment, the storage capacitor 140 may be formed using a storage lower electrode 141 and a storage upper electrode 142. For example, the storage upper electrode 142 may be electrically connected to the pixel circuit through a storage power line 143. However, the structure of the storage capacitor 140 is not necessarily limited thereto, and various modifications may be made using two different metal layers.

[0115] The storage power line 143 may be disposed on the interlayer dielectric layer 108. The storage power line 143 may be made of the same material as the first source 121, the first drain 124, the second source 131, and the second drain 134 on the same plane, but is not limited thereto. Therefore, the storage power line 143 may be formed simultaneously with the first source 121, the first drain 124, the second source 131, and the second drain 134 using the same mask process.

[0116] The protective film 109 may be formed on the entire surface of the substrate 10 on which the first source 121, the first drain 124, the second source 131, the second drain 134, and the storage power line 143 are formed. For example, an inorganic insulating material such as SiN x or SiO x is deposited on the entire surface of the substrate 10 on which the first source 121, the first drain 124, the second source 131, the second drain 134, and the storage power line 143 are formed, so that the protective film 109 can be formed, but is not limited thereto.

[0117] The first planarization layer 110 may be formed on the protective film 109. Specifically, the first planarization layer 110 may be provided by coating an organic insulating material such as an acrylic resin on the entire surface of the protective film 109, but is not limited thereto.

[0118] After the protective film 109 and the first planarization layer 110 are provided, a contact hole exposing the first source 121 or the first drain 124 of the first transistor 120 may be formed by a photolithography process. A connection electrode 145 may be provided in the contact hole exposing the first drain 124 using a material made of Mo, Ti, Cu, AlNd, Al, and Cr or an alloy material thereof, but is not limited thereto. Alternatively, a connection electrode may be provided in the contact hole exposing the first source 121 using a material made of Mo, Ti, Cu, AlNd, Al, and Cr or an alloy thereof.

[0119] A second planarization layer 111 may be provided on the connection electrode 145, and a contact hole exposing the connection electrode 145 may be formed in the second planarization layer 111, so that a light-emitting element 150 connected to the first transistor 120 may be provided. The connection electrode 145 may be formed of multiple layers, similar to the first source electrode 121 and the first drain electrode 124. For example, the connection electrode 145 may have a three-layer structure, but is not limited thereto.

[0120] The light-emitting element 150 may include an anode 151 connected to the first drain electrode 124 of the first transistor 120, at least one light-emitting stack 152 formed on the anode 151, and a cathode 153 formed on the light-emitting stack 152.

[0121] The light-emitting stack 152 may include one or more of a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer, but is not limited thereto. In a tandem structure in which multiple light-emitting layers overlap each other, a charge generation layer may be additionally provided between the light-emitting layers. The light-emitting layer may emit light of different colors for each sub-pixel.

[0122] The anode 151 may be connected to the connection electrode 145 exposed through the contact hole passing through the second planarization layer 111. The anode 151 may be formed as a multi-layer structure including an opaque conductive film and a transparent conductive film having a high reflection efficiency. The transparent conductive film may be made of a material having a relatively high work function value such as indium tin oxide (ITO) or indium zinc oxide (IZO), and the opaque conductive film may have a single-layer or multi-layer structure including Al, Ag, Cu, Pb, Mo, Ti, or an alloy thereof, but is not limited thereto.

[0123] For example, the anode 151 may be formed as a structure in which a transparent conductive film, an opaque conductive film, and a transparent conductive film are sequentially stacked, or a structure in which a transparent conductive film and an opaque conductive film are sequentially stacked.

[0124] The anode 151 is provided on the second planarization layer 111 so as to overlap not only the light-emitting region provided by the bank 154 but also the pixel circuit region in which the first transistor 120, the second transistor 130, and the storage capacitor 140 are provided, thereby increasing the light-emitting area. The bank 154 is used to define sub-pixels. Therefore, the bank 154 may be made of an insulating material containing a black material. The bank 154 may be made of, for example, a transparent carbon-based mixture. Specifically, the bank 154 may contain carbon black, but is not limited thereto. The bank 154 may also be made of a transparent insulating material.

[0125] The light-emitting stack 152 can be formed by laminating a hole transport layer, an organic light-emitting layer, and an electron transport layer in this order or in the reverse order on the anode 151. In addition, the light-emitting stack 152 may further include a charge generation layer, and include a first light-emitting stack and a second light-emitting stack facing each other, where the charge generation layer is located between the first light-emitting stack and the second light-emitting stack. The light-emitting stack 152 can be disposed on the anode 151 and the bank 154.

[0126] The bank 154 can be formed to expose the anode 151. Such a bank 154 can be made of an organic material (e.g., photoacrylic), and can be a translucent material, but is not limited thereto, and can be made of an opaque material to prevent light interference between sub-pixels.

[0127] The cathode 153 can be formed on the upper surface of the light-emitting stack 152 to face the anode 151, where the light-emitting stack 152 is interposed between the cathode 153 and the anode 151. When the cathode 153 is applied to a top-emitting organic light-emitting display device, the cathode 153 can be formed of a transparent conductive film, in which indium tin oxide (ITO), indium zinc oxide (IZO), or magnesium silver (Mg-Ag) is thinly formed, but is not limited thereto.

[0128] The encapsulation part 17 can be formed on the cathode 153 of the light-emitting element 150 to protect the light-emitting element 150. Due to the organic nature of the light-emitting stack 152, the light-emitting element 150 may react with external moisture or oxygen to cause dark spots or pixel shrinkage, so the encapsulation part 17 can be disposed on the cathode 153 to prevent this problem.

[0129] The encapsulation part 17 can include a first encapsulation layer 171, a foreign matter compensation layer 172, and a second encapsulation layer 173. The first encapsulation layer 171 and the second encapsulation layer 173 can each be made of an inorganic insulating material, and the foreign matter compensation layer 172 can be made of an organic insulating material, but is not necessarily limited thereto. The first encapsulation layer 171 can be disposed on the cathode 153 of the light-emitting element 150, the foreign matter compensation layer 172 can be disposed on the first encapsulation layer 171, and the second encapsulation layer 173 can be disposed on the foreign matter compensation layer 172.

[0130] The touch part 18 can be disposed on the encapsulation part 17. The touch part 18 can include a first touch planarization layer 181, a touch buffer layer 182, a touch insulating layer 183, a touch electrode 184, and a second touch planarization layer 185, but is not limited thereto. Alternatively, the touch part 18 can include a first touch planarization layer 181, a touch insulating layer 183, a touch electrode 184, and a second touch planarization layer 185.

[0131] The first touch planarization layer 181 and the second touch planarization layer 185 can be provided to eliminate the steps at the points where the touch electrodes 184 are provided and to ensure good electrical insulation. The first touch planarization layer 181 and the second touch planarization layer 185 can each be made of an organic insulating material such as an acrylic-based resin. For example, the first touch planarization layer 181 and the second touch planarization layer 185 can each be made of an organic material such as photoacrylic (PAC) or polyimide (PI).

[0132] The first touch planarization layer 181 can be provided on the encapsulation part 17.

[0133] The touch buffer layer 182 is provided on the first touch planarization layer 181. The touch buffer layer 182 can be made of an inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. For example, when the touch electrodes 184 are protected by other insulating layers besides the touch buffer layer 182, the touch buffer layer 182 may not be formed.

[0134] The touch insulating layer 183 can be provided on the touch buffer layer 182. In addition, the touch insulating layer 183 can be provided on the first touch planarization layer 181, and the touch buffer layer 182 may not be formed. The touch insulating layer 183 can be a single layer or multiple layers made of silicon nitride (SiNx) or silicon oxide (SiOx), but is not limited thereto.

[0135] The touch electrodes 184 can be provided on the touch insulating layer 183. Specifically, the touch electrodes 184 can be provided on a part of the touch insulating layer 183 so that steps are formed at the points where the touch electrodes 184 are provided.

[0136] The second touch planarization layer 185 can be provided on the touch electrodes 184. Specifically, the second touch planarization layer 185 can be provided on the touch electrodes 184 and the parts of the touch insulating layer 183 exposed by the touch electrodes 184.

[0137] According to an embodiment, the first transistor 120 made of low-temperature polycrystalline silicon and the second transistor 130 made of an oxide semiconductor can be provided in different layers, so that thin-film transistors (TFTs) with different driving characteristics can be provided in the display device. However, it is not necessarily limited thereto, and only thin-film transistors with the same driving characteristics can be used or thin-film transistors with various circuit structures can be used. For example, the first transistor 120 and the second transistor 130 can be provided in the same layer.

[0138] Figure 5 It is a diagram showing the light-transmitting region and the first protrusion in the edge region surrounding the light-transmitting region, Figure 6 It is a diagram showing Figure 5 an enlarged view of region B inFigure 7 is a magnified view showing Figure 6 the area Ba in

[0139] Referring to Figure 5 , the first protrusion P1 of the organic insulating layer can be arranged to completely surround the periphery, such as the edge of the light-transmitting area TA.

[0140] When the opening 11 is formed by an etching process, the first protrusion P1 of the organic insulating layer can serve as an anti-etching layer to prevent the etching solution from penetrating into the interior of the display panel 100 during the etching process. Specifically, the first protrusion P1 overlaps the opening 11 in the Z-axis direction and is arranged to cover the upper part of the opening 11, thereby preventing the etching solution from penetrating into the interior of the display panel 100 during the etching process.

[0141] Since the display device according to the exemplary embodiment of the present disclosure can form openings 11 of various shapes in the substrate 10 made of glass by using etching, various openings can be formed while maintaining the rigidity of the substrate 10 as compared with the scribing, breaking, and grinding techniques in the prior art.

[0142] In addition, the display device according to the exemplary embodiment of the present disclosure has the advantage of realizing process optimization because the opening 11 can be formed together with side processing for forming a notch or rounding on the side surface of the substrate 10. In this case, of course, the organic insulating layer can also be formed on the side surface of the substrate 10.

[0143] Referring to Figure 6 and Figure 7 , the light-transmitting area TA provided with various sensors can be formed in a circular shape, and the non-display area NDA can be arranged around the light-transmitting area TA, but the present disclosure is not necessarily limited thereto. For example, the light-transmitting area TA can have various shapes such as a polygon or an ellipse, and the shape of the non-display area NDA can also vary according to the shape of the light-transmitting area TA.

[0144] The non-display area NDA can include: a wiring area NDA1 where the wiring TL bypasses the light-transmitting area TA; a moisture-proof permeation area NDA2, which is arranged between the wiring area NDA1 and the light-transmitting area TA; and a dummy area NDA3, which is provided with the first protrusion P1 and is adjacent to the light-transmitting area TA, but is not limited thereto. The dummy area NDA3 can be arranged to surround the light-transmitting area TA. In this case, the dummy area NDA3 can also play a role in preventing moisture permeation. The moisture-proof permeation area NDA2 can be arranged to surround the dummy area NDA3, and the wiring area NDA1 can be arranged to surround the moisture-proof permeation area NDA2.

[0145] Figure 8is a diagram showing an example of a display panel provided in a display device according to an exemplary embodiment of the present disclosure, Figure 9 shows Figure 8 an enlarged view of region D in Figure 10 shows Figure 8 an enlarged view of region E in Figure 11 shows Figure 8 an enlarged view of region F in Figure 8 The display panel shown can represent a display panel according to a first embodiment of the present disclosure.

[0146] Referring to Figure 2 , Figure 3 , Figure 7 and Figure 8 , a display panel 100 according to an exemplary embodiment of an embodiment of the present disclosure may include a display area DA, a light transmissive area TA, and a non-display area NDA surrounding the light transmissive area TA. The non-display area NDA may include a wiring area NDA1, a moisture barrier area NDA2, and a dummy area NDA3. The display panel 100 may include a substrate 10 provided in the display area DA and the non-display area NDA, a circuit unit 13 provided on the substrate 10, a light emitting element unit 15 provided on the circuit unit 13, a packaging unit 17 provided on the light emitting element unit 15, and a touch unit 18 provided on the packaging unit 17. In this case, in the non-display area NDA, the substrate 10 and the packaging unit 17 include openings 11 corresponding to the light transmissive area TA, and an organic insulating layer is provided on the openings 11. The organic insulating layer may be formed by extending a first touch planarization layer 181 among a plurality of layers constituting the touch unit 18 toward the light transmissive area TA, but is not limited thereto. In addition, the organic insulating layer may be formed by extending a second touch planarization layer 185 among a plurality of layers constituting the touch unit 18 toward the light transmissive area TA.

[0147] The wiring area NDA1 may be provided between the display area DA and the moisture barrier area NDA2, and may be provided with wirings TL bypassing the light transmissive area TA.

[0148] The moisture barrier area NDA2 may be provided between the wiring area NDA1 and the dummy area NDA3. The moisture barrier area NDA2 may have a predetermined length to prevent oxygen, moisture, etc. from entering the inside of the display panel 100 through the light transmissive area TA. For example, a display device according to an exemplary embodiment of the present disclosure may prevent moisture or oxygen from entering the inside of the display panel 100 by ensuring a predetermined distance of a moving path of moisture or oxygen through the moisture barrier area NDA2.

[0149] The moisture barrier area NDA2 may also have various structures for preventing moisture penetration.

[0150] Referring to Figure 8, the moisture-proof permeation region NDA2 may include a moisture-proof permeation structure WPS for preventing the movement of oxygen, moisture, etc.

[0151] Referring to Figure 8 and Figure 9 , since the moisture-proof permeation structure WPS is formed on the substrate 10 to have a predetermined height, a step structure can be formed at the boundary between the moisture-proof permeation region NDA2 and the dummy region NDA3. Such a step structure can prevent the permeation of moisture, oxygen, etc. that may enter through the light-transmitting region TA. Since the inorganic insulating layer extending from the encapsulation portion 17 of the display region DA toward the light-transmitting region TA covers the side surface of the moisture-proof permeation structure WPS forming the above step structure, the permeation of moisture, oxygen, etc. through the light-transmitting region TA can be more effectively prevented. The inorganic insulating layer provided to cover the moisture-proof permeation structure WPS may be at least one of the first encapsulation layer 171 and the second encapsulation layer 173 of the encapsulation portion 17 extending from the encapsulation portion 17 of the display region DA toward the light-transmitting region TA. In other words, the inorganic insulating layer provided to cover the moisture-proof permeation structure WPS may be a layer extending from at least one of the first encapsulation layer 171 and the second encapsulation layer 173 of the encapsulation portion 17. The inorganic insulating layer may be referred to as an inorganic insulating member or an inorganic insulating film.

[0152] The moisture-proof permeation structure WPS may include a support layer SL and a plurality of protrusion patterns ST provided on the support layer SL and spaced apart from each other. The moisture-proof permeation structure WPS may further include a dam DAM provided on the support layer SL. In addition, the moisture-proof permeation structure WPS may include a light-emitting stack 152 formed discontinuously by a plurality of protrusion patterns ST spaced apart from each other. In addition, the moisture-proof permeation structure WPS may further include an inorganic insulating layer provided on the plurality of protrusion patterns ST provided with the light-emitting stack 152.

[0153] In order to implement a stepped structure at the boundary between the moisture-proof permeation region NDA2 and the dummy region NDA3, the moisture-proof permeation structure WPS may include at least one of a support layer SL, a protrusion pattern ST, a dam DAM, a light-emitting stack 152 configured to be disconnected by the protrusion pattern ST, and an inorganic insulating layer provided on the protrusion pattern ST. Such a stepped structure can prevent the permeation of moisture, oxygen, etc. that may enter through the light-transmitting region TA. In this case, since the light-emitting stack 152 is disconnected by a plurality of protrusion patterns ST arranged to be spaced apart from each other and each having an undercut shape, when the protrusion pattern ST is a component of the moisture-proof permeation structure WPS, the light-emitting stack 152 may be additionally provided on the protrusion pattern ST. In the display panel according to the first embodiment, the inorganic insulating layer provided on the plurality of protrusion patterns ST extends into the dummy region NDA3 to cover the side surface of the moisture-proof permeation structure WPS, and it may be provided together with other components constituting the moisture-proof permeation structure WPS. For example, considering the fact that the inorganic insulating layer is provided between the plurality of protrusion patterns ST to prevent peeling of the inorganic insulating layer, the inorganic insulating layer may be provided together with the protrusion pattern ST.

[0154] The dam DAM and the plurality of protrusion patterns ST may be formed using a plurality of layers provided in the display region DA or a plurality of layers extending from the display region DA, but are not limited thereto. In this case, the number of dams DAM and the number of protrusion patterns ST are not particularly limited.

[0155] The support layer SL may be provided on the substrate 10 to have a predetermined height H and may extend from the display region DA to the boundary between the moisture-proof permeation region NDA2 and the dummy region NDA3 so as to implement a stepped structure at the boundary between the moisture-proof permeation region NDA2 and the dummy region NDA3. Accordingly, the display device according to an exemplary embodiment of the present disclosure may implement a stepped structure by using the support layer SL.

[0156] The support layer SL may be formed by extending some of the plurality of layers constituting the circuit portion 13. For example, the support layer SL may be formed using at least one of the buffer layer and the insulating layer of the circuit portion 13, but is not limited thereto. As Figure 8 and Figure 9 shown, the support layer SL may be formed by extending the multi-buffer layer 102, the active buffer layer 103, the lower gate insulating layer 104, and the upper interlayer dielectric layer 108.

[0157] The dam DAM and the protrusion pattern ST provided on the support layer SL may be provided in a closed-loop shape surrounding the light-transmitting region TA, thereby preventing moisture, etc. from permeating into the display region DA through the light-transmitting region TA.

[0158] A plurality of protrusion patterns ST may be provided on the support layer SL while being spaced apart from each other. In this case, the protrusion patterns ST may include at least one first protrusion pattern ST1 provided on the display area DA side with respect to the dam DAM and at least one second protrusion pattern ST2 provided on the light transmissive area TA side with respect to the dam DAM, but is not limited thereto. Accordingly, a plurality of first protrusion patterns ST1 may be provided between the display area DA and the dam DAM, and a plurality of second protrusion patterns ST2 may be provided between the dam DAM and the dummy area NDA3.

[0159] The plurality of protrusion patterns ST may include a first pattern layer L1, a second pattern layer L2, and a third pattern layer L3 that are sequentially stacked. The second pattern layer L2 may be provided between the first pattern layer L1 and the third pattern layer L3. The first pattern layer L1 and the third pattern layer L3 may each include the same material. For example, the first pattern layer L1 and the third pattern layer L3 may each include a titanium (Ti) material, and the second pattern layer L2 may include an aluminum (Al) material, but is not limited thereto. As an example, the width of the second pattern layer L2 may be less than the width of the third pattern layer L3 and the width of the first pattern layer L1, but is not limited thereto.

[0160] The protrusion pattern ST according to the exemplary embodiment may be made of the same material as the source 121 / drain 124 or the connection electrode 145 in the display area DA. For example, a plurality of protrusion patterns ST may be formed simultaneously when the connection electrode 145 is formed, and then etched to be separated into a plurality of protrusion patterns. In this case, due to the difference in the etching reaction rate, the second pattern layer L2 made of aluminum may be etched relatively more. Accordingly, since the width of the second pattern layer L2 may be less than the width of the third pattern layer L3, the protrusion pattern ST may have an undercut shape. Due to this undercut shape, the light emitting stack 152 formed on the plurality of protrusion patterns ST may be formed discontinuously and may be disconnected between the plurality of protrusion patterns ST. Accordingly, the protrusion pattern ST may increase the length of the moisture penetration path and at the same time cause the disconnection of the light emitting stack 152 to prevent moisture penetration.

[0161] Multiple protrusion patterns ST can prevent the peeling of an inorganic insulating layer additionally provided thereon. The inorganic insulating layer can be relatively easily peeled during laser cutting or external shock. However, according to an exemplary embodiment, since the inorganic insulating layer is filled between multiple protrusion patterns ST each having an undercut shape, the peeling of the inorganic insulating layer can be prevented. Therefore, the inorganic insulating layer filled between multiple protrusion patterns ST can more effectively prevent the penetration of moisture. The inorganic insulating layer provided between multiple protrusion patterns ST can be formed by extending a first encapsulation layer 171 of an encapsulation part 17 provided in a display area DA, but is not limited thereto. In this case, different from the second protrusion pattern ST2, a foreign matter compensation layer 172 can be provided to contact the first encapsulation layer 171 covering the first protrusion pattern ST1. A second encapsulation layer 173 can be provided to contact the first encapsulation layer 171 covering the second protrusion pattern ST2. The inorganic insulating layer can be provided to cover multiple protrusion patterns ST.

[0162] The shapes of multiple first protrusion patterns ST1 and second protrusion patterns ST2 can be the same, but are not necessarily limited thereto. Multiple first protrusion patterns ST1 and second protrusion patterns ST2 can be differently modified to have a structure capable of disconnecting a light-emitting stack 152. Therefore, the protrusion pattern ST including multiple first protrusion patterns ST1 and second protrusion patterns ST2 can increase the length of a moisture penetration path while causing the disconnection of the light-emitting stack 152 to block moisture penetration.

[0163] A dam DAM can be provided between multiple first protrusion patterns ST1 and multiple second protrusion patterns ST2, and can be formed to have a height higher than that of the protrusion pattern ST with respect to a support layer SL. Therefore, by increasing the length of paths through which oxygen, moisture, etc. penetrate, the dam DAM can effectively block oxygen, moisture, etc. entering through a light-transmitting area TA.

[0164] The dam DAM can include the same material as that used for forming a first planarization layer 110, a second planarization layer 111, and a bank part 154, and can be formed in the same process as the process for forming the first planarization layer 110, the second planarization layer 111, and the bank part 154, but is not necessarily limited thereto. For example, the dam DAM can include a metal layer.

[0165] The dummy region NDA3 can be a region for the margin formed when the substrate 10 undergoes etching and / or laser cutting. For example, when there is no dummy region NDA3, the moisture-proof permeation region NDA2 may be damaged during laser cutting, making it prone to moisture permeation, and a minimum layer can be provided on the substrate 10 in the dummy region NDA3 to facilitate laser cutting. Specifically, by providing the minimum layer extending from the touch portion 18 and the opening 11 on the emission line of the emitted laser to form the light-transmitting region TA, laser cutting can be easily performed. In this case, the organic insulating layer provided on the opening 11 can prevent the etching solution from penetrating into the interior of the display panel 100 when etching the substrate 10. The first touch planarization layer 181 extending from the touch portion 18 can be provided as the organic insulating layer provided on the opening 11, but is not limited thereto. Subsequently, the touch buffer layer 182, the touch insulating layer 183, and the second touch planarization layer 185 can be sequentially provided on the first touch planarization layer 181.

[0166] The opening 11 can be formed in the substrate 10 provided in the dummy region NAD3 to correspond to the light-transmitting region TA. The opening 11 can have a diameter larger than that of the light-transmitting region TA.

[0167] The side coating 31 can be formed on the side surface of the opening 11. The side coating 31 can also cover the side surface of the opening 11. The side coating 31 can be provided in the opening 11 to compensate for the step formed by the opening 11 in the lower part of the display panel 100.

[0168] In addition, the organic insulating layer extending from the touch portion 18 can be provided on the side coating 31 and joined to the side coating 31. For example, the first touch planarization layer 181 extending from the touch portion 18 can be provided as the organic insulating layer provided on the opening 11, but is not limited thereto. Therefore, even when laser is emitted to form the light-transmitting region TA, delamination around the light-transmitting region TA can be prevented. Since the joining of the side coating 31 and the organic insulating layer can provide the effect of forming a cover made of an organic material around the light-transmitting region TA, moisture, oxygen, etc. can be prevented from penetrating into the interior of the display panel 100 through the light-transmitting region TA.

[0169] For example, a display device according to an exemplary embodiment of the present disclosure uses a planarization layer extending from the touch portion 18 of the display area DA to the light-transmissive area TA as an organic insulating layer bonded to the side coating 31, thereby preventing layer peeling that may occur between multiple layers provided between the substrate 10 and the planarization layer of the touch portion 18, and preventing the penetration of moisture, oxygen, etc. through the light-transmissive area TA. Accordingly, the quality and reliability of the display panel 100 can be improved. In addition, since the display device according to the exemplary embodiment of the present disclosure includes a moisture-proof penetration structure WPS formed in a stepped structure in addition to the planarization layer extending to the light-transmissive area TA and bonded to the side coating 31, a wider display area DA can be ensured by reducing the horizontal size of the dummy area NDA3.

[0170] The side coating 31 may be made of an organic material that absorbs light. For example, the side coating 31 may include an organic material having a light density (OD) of 1.0 or greater, but is not limited thereto.

[0171] The back coating 32 may be provided under the substrate 10 and under the side coating 31. The back coating 32 may further extend from the back surface of the substrate 10 and be formed all the way to the side coating 31. Accordingly, the back coating 32 can be prevented from peeling off the substrate 10.

[0172] The display device according to the exemplary embodiment of the present disclosure can improve the adhesion of the back coating 32 by forming the back coating 32 to cover the side coating 31. In a case where the back coating 32 may be formed only on the back surface of the substrate 10 to protect the substrate 10, the back coating 32 may peel off the substrate 10 due to the external environment or impact. However, since the back coating 32 made of an organic material has a relatively low adhesion to the substrate 10, it may peel off the substrate 10 due to the external environment or impact. Accordingly, the adhesion of the back coating 32 can be improved by bonding the back coating 32 to the side coating 31 made of an organic material at the opening 11 of the substrate 10. As a result, the back coating 32 can be prevented from peeling off the substrate 10.

[0173] According to the exemplary embodiment, the side surface of the light-transmissive area TA may be formed vertically, but is not limited thereto. For example, the side surfaces of the back coating 32, the side coating 31, the protective layer PL, and the polarizer 19 that form the side surface of the light-transmissive area TA may be laser-cut to have the same vertical plane.

[0174] In addition, an inorganic insulating layer may be provided in contact with the upper surface of the substrate 10 provided in the dummy area NDA3. The inorganic insulating layer may cover the side surface of the moisture-proof penetration structure WPS and then extend to the upper surface of the substrate 10. Accordingly, the inorganic insulating layer covers the gaps between the layers constituting the moisture-proof penetration structure WPS, thereby preventing oxygen, moisture, etc. from entering the interior of the display panel 100 through the gaps.

[0175] The inorganic insulating layer may be formed by extending at least one of the first encapsulation layer 171 and the second encapsulation layer 173 of the encapsulation part 17. As Figure 8 and Figure 9 shown, the inorganic insulating layer may be formed of two layers formed by extending the first encapsulation layer 171 and the second encapsulation layer 173 of the encapsulation part 17, but is not limited thereto. Alternatively, the inorganic insulating layer may be formed of only one of the first encapsulation layer 171 and the second encapsulation layer 173 of the encapsulation part 17.

[0176] Since the inorganic insulating layer provided in the dummy region NDA3 may be etched together with the substrate 10 when the opening 11 is formed by an etching process, the end of the inorganic insulating layer may be exposed through the opening 11. Accordingly, the end of the inorganic insulating layer may be configured to form the opening 11 together with the inclined surface 11a formed on the substrate 10, and may be in contact with the side coating 31. The end of the inorganic insulating layer may be spaced apart from the laser emission line by an etching process. The laser may be used in a laser cutting process for forming the light-transmitting region TA. Accordingly, since the inorganic insulating layer is relatively far from the organic insulating layer provided on the laser emission line, damage caused by the laser may be reduced.

[0177] Figures 12A to 12H is a diagram showing a process of forming a light-transmitting region in a display panel according to a first embodiment of the present disclosure.

[0178] Figure 12A is a diagram showing steps of forming a support layer and a protrusion pattern and a dam provided on the support layer.

[0179] Referring to Figure 12A , a support layer SL may be formed on the substrate 10, and a dam DAM and a plurality of protrusion patterns ST may be formed on the support layer SL. The dam DAM may be provided between the plurality of first protrusion patterns ST1 and the plurality of second protrusion patterns ST2. The support layer SL may be formed by extending a multi-buffer layer 102, an active buffer layer 103, a lower gate insulating layer 104, an upper interlayer dielectric layer 108, etc. provided in the display region DA, but is not limited thereto.

[0180] The protrusion pattern ST may be formed when forming the source 121 and the drain 124 or the connection electrode 145 of the display region DA. In this case, the protrusion pattern ST may be formed in an undercut shape such as an 'I' shape by an etching process.

[0181] When forming at least one of the first planarization layer 110, the second planarization layer 111, and the bank 154 disposed in the display area DA, the dam DAM can be formed. In this case, the dam DAM can be formed to have a height higher than that of the protrusion pattern ST with respect to the support layer SL. Therefore, by increasing the length of the paths through which oxygen, moisture, etc. penetrate, the dam DAM can effectively block the entry of oxygen, moisture, etc. into the light-transmitting area TA.

[0182] Figure 12B FIG. is a view showing the step of forming a groove corresponding to the dummy area after laminating the light-emitting stack.

[0183] Reference Figure 12B , the light-emitting stack 152 can be laminated on the protrusion pattern ST having an undercut shape. Therefore, the light-emitting stack 152 formed on the plurality of protrusion patterns ST can be formed discontinuously and can be disconnected between the plurality of protrusion patterns ST. Therefore, the protrusion pattern ST can increase the length of the moisture penetration path and at the same time cause the disconnection of the light-emitting stack 152 to prevent moisture penetration.

[0184] Subsequently, a groove G1 corresponding to the dummy area NDA3 can be formed using a laser or the like. The groove G1 can be referred to as the first groove.

[0185] The groove G1 can be formed in a closed-loop shape, and when the groove G1 is formed, a step structure can be formed at the boundary between the moisture-proof penetration area NDA2 and the dummy area NDA3.

[0186] Figure 12C FIG. is a view showing the step of forming an inorganic insulating layer.

[0187] Reference Figure 12C , an inorganic insulating layer extending from the encapsulation part 17 of the display area DA toward the light-transmitting area TA can be disposed on the light-emitting stack 152. In this case, the inorganic insulating layer can be disposed between the plurality of protrusion patterns ST and in the groove G1. The inorganic insulating layer can be a layer made of an inorganic insulating material formed by extending the first encapsulation layer 171 and the second encapsulation layer 173 of the encapsulation part 17. The foreign matter compensation layer 172 can be disposed in contact with the first encapsulation layer 171 covering the first protrusion pattern ST1, and the second encapsulation layer 173 can be disposed in contact with the first encapsulation layer 171 covering the second protrusion pattern ST2, but is not limited thereto. In this case, the inorganic insulating layer can be formed of only one of the first encapsulation layer 171 and the second encapsulation layer 173.

[0188] Figure 12D FIG. is a view showing the step of forming an organic insulating layer and disposing a mask pattern on the back surface of the substrate.

[0189] Reference Figure 12D , the organic insulating layer can be disposed onFigure 12C on the inorganic insulating layer shown. The organic insulating layer may be formed by extending at least one of the plurality of layers constituting the touch portion 18. As Figure 12D shown, the first touch planarization layer 181 may be disposed on the inorganic insulating layer and may be used as the organic insulating layer, but is not limited thereto. Subsequently, a touch buffer layer 182, a touch insulating layer 183, and a second touch planarization layer 185 may be sequentially disposed on the first touch planarization layer 181.

[0190] In addition, the mask pattern MP may be formed under the substrate 10. According to an exemplary embodiment, the mask pattern MP may be formed according to the number and shape of openings to be formed in the substrate 10 and exposed to an etching solution to simultaneously form a plurality of openings. In this case, the formation of the openings using an etching process and the separation of the mother substrate into panels may be performed simultaneously.

[0191] The exemplary embodiment describes an example of performing an etching process using the mask pattern MP, but is not necessarily limited thereto. For example, without placing the mask pattern MP on the back surface of the substrate 10, an etching process may be performed after emitting a laser at a position where the opening 11 is desired to be formed. Accordingly, one region of the substrate 10 irradiated with the laser may react more with the etching solution than another region to form the opening 11.

[0192] Figure 12E is a diagram showing steps of forming an opening on the back surface of a substrate through an etching process.

[0193] Referring to Figure 12E , when the etching solution contacts the exposed area of the substrate 10, a partial area of the back surface of the substrate 10 exposed between the mask patterns MP may be etched to form the opening 11. In this case, a part of the inorganic insulating layer formed on the etched substrate 10 may be etched together with the substrate 10 to form the opening 11. Accordingly, the end of the inorganic insulating layer disposed in the dummy area NDA3 may be exposed through the opening 11. The substrate 10 and the encapsulation portion 17 may surround the opening 11 corresponding to the light transmissive area TA.

[0194] Subsequently, the first touch planarization layer 181 disposed on the inorganic insulating layer and used as the organic insulating layer may prevent the etching solution from penetrating into the interior of the display panel 100. The organic insulating layer disposed on the opening 11 may be formed together when the first touch planarization layer 181 of the display area DA is formed, thereby optimizing the process.

[0195] Figure 12F is a diagram showing steps of disposing a side coating in the opening.

[0196] Referring to Figure 12F, the opening 11 of the substrate 10 may be filled with the side coating 31. Subsequently, when the side coating 31 is cured, the side coating 31 shrinks by a certain height h1, and a curvature may be formed on the lower surface 31a of the side coating 31. However, depending on the material, the side coating 31 may not shrink. For example, even after the curing is completed, the lower surface 31a of the side coating 31 may be substantially flat.

[0197] In addition, the side coating 31 may be cured and bonded to the first touch planarization layer 181 serving as an organic insulating layer. In addition, the side coating 31 may be bonded to the end portion of the inorganic insulating layer exposed to the opening 11. Therefore, the bonding can prevent layer peeling from occurring around the light transmissive region TA, and prevent moisture, oxygen, etc. from penetrating into the interior of the display panel 100 through the light transmissive region TA.

[0198] Figure 12G is a diagram showing the step of setting the back coating.

[0199] Reference Figure 12G , the back coating 32 may be completely formed on the back surface, i.e., the lower surface, of the substrate 10 and on the back surface of the side coating 31. However, the present disclosure is not necessarily limited thereto, and the back coating 32 may be formed only on the lower surface of the substrate 10. Specifically, the lower surface of the back coating 32 may be formed to be recessed toward the anti-etching layer, but is not necessarily limited thereto.

[0200] Figure 12H is a diagram showing the laser cutting step.

[0201] Refer to Figure 12H , the light transmissive region TA may be formed by irradiating the opening 11 side of the substrate 10 with a laser. In this case, the organic insulating layer, the side coating 31, etc. may be laser cut. Since the display device according to the exemplary embodiment of the present disclosure includes the bonding of the side coating 31, the organic insulating layer, and the inorganic insulating layer, the end portion of which is provided farther from the light transmissive region TA than the organic insulating layer by an etching process, even when the laser for the light transmissive region TA is emitted, the inorganic insulating layer can be prevented from peeling due to the laser emission.

[0202] Figure 13 is a diagram showing another example of the display panel provided in the display device according to the exemplary embodiment of the present disclosure, and Figure 14 is a diagram showing Figure 13 an enlarged view of the region G in Figure 13 The shown display panel may represent the display panel according to the second embodiment of the present disclosure.

[0203] When referring to Figure 8 and Figure 13When comparing the display panel according to the first embodiment with the display panel according to the second embodiment, the difference between the display panel according to the second embodiment and the display panel according to the first embodiment is that a part of the organic insulating layer in the moisture-proof penetration area NDA2 is arranged to be in contact with the upper surface of the substrate 10 to separate the moisture-proof penetration structure WPS, and no inorganic insulating layer is provided in the dummy area NDA3. Therefore, compared with the display panel according to the first embodiment, the display panel according to the second embodiment can further reduce the horizontal length of the dummy area NDA3.

[0204] When describing the display panel according to the second embodiment, components identical to those of the display panel according to the first embodiment may be denoted by the same reference numerals, and thus their detailed descriptions will be omitted or briefly given.

[0205] Referring to Figure 2 、 Figure 3 、 Figure 7 and Figure 13 According to FIGS. 14, 15, 16, 17, and 18, a display panel 100 according to an exemplary embodiment of the present disclosure may include a display area DA, a light-transmitting area TA, and a non-display area NDA surrounding the light-transmitting area TA. The non-display area NDA may include a wiring area NDA1, a moisture-proof penetration area NDA2, and a dummy area NDA3. The display panel 100 may include a substrate 10 provided in the display area DA and the non-display area NDA, a circuit portion 13 provided on the substrate 10, a light-emitting element portion 15 provided on the circuit portion 13, a packaging portion 17 provided on the light-emitting element portion 15, and a touch portion 18 provided on the packaging portion 17. In this case, in the non-display area NDA, the substrate 10 and the packaging portion 17 include openings 11 corresponding to the light-transmitting area TA, and an organic insulating layer is provided between two moisture-proof penetration structures WPS separated from the upper part of the opening 11. The organic insulating layer may be formed by extending the first touch planarization layer 181 among the plurality of layers constituting the touch portion 18 toward the light-transmitting area TA, but is not limited thereto. Subsequently, a touch buffer layer 182, a touch insulating layer 183, and a second touch planarization layer 185 may be sequentially provided on the first touch planarization layer 181.

[0206] Referring to Figure 13 FIG. 19, the moisture-proof penetration area NDA2 may have various structures for preventing moisture penetration, and the display panel according to the second embodiment can more effectively cope with moisture penetration by using two moisture-proof penetration structures WPS spaced apart from each other and an organic insulating layer provided between the two moisture-proof penetration structures WPS.

[0207] Referring to Figure 13 and Figure 14, the moisture-proof penetration structure WPS provided on the display panel according to the second embodiment is formed on the substrate 10 to have a predetermined height and includes a first moisture-proof penetration structure WPS1 and a second moisture-proof penetration structure WPS2 spaced apart from each other. However, the present disclosure is not limited thereto, and the moisture-proof penetration structure WPS may be formed of two or more structures spaced apart from each other. In addition, the first moisture-proof penetration structure WPS1 and the second moisture-proof penetration structure WPS2 divided into two may be formed to have the same height and the same buffer layer, insulating layer, metal layer, etc., but are not necessarily limited thereto.

[0208] The first moisture-proof penetration structure WPS1 and the second moisture-proof penetration structure WPS2 may each include a support layer SL and a plurality of protrusion patterns ST provided to be spaced apart from each other on the support layer SL. In addition, the first moisture-proof penetration structure WPS1 and the second moisture-proof penetration structure WPS2 may each include a light-emitting stack 152 formed discontinuously by the plurality of protrusion patterns ST provided to be spaced apart from each other. In addition, the first moisture-proof penetration structure WPS1 and the second moisture-proof penetration structure WPS2 may each include an inorganic insulating layer provided on the plurality of protrusion patterns ST on which the light-emitting stack 152 is provided.

[0209] The first moisture-proof penetration structure WPS1 may further include a dam DAM provided on the support layer SL. The plurality of protrusion patterns ST may be provided on the support layer SL while being spaced apart from each other. In this case, the protrusion patterns ST provided on the first moisture-proof penetration structure WPS1 may include a plurality of first protrusion patterns ST1 provided on the display area DA side with respect to the dam DAM and a plurality of second protrusion patterns ST2 provided on the light-transmitting area TA side with respect to the dam DAM. Accordingly, the plurality of first protrusion patterns ST1 may be provided between the display area DA and the dam DAM, and the plurality of second protrusion patterns ST2 may be provided between the dam DAM and the dummy area NDA3. For example, the dam DAM may be provided between the plurality of first protrusion patterns ST1 and the plurality of second protrusion patterns ST2.

[0210] The second moisture-proof penetration structure WPS2 may be provided between the first moisture-proof penetration structure WPS1 and the dummy area NDA3 and may be provided in the moisture-proof penetration area NDA2 to be spaced apart from the first moisture-proof penetration structure WPS1.

[0211] The second moisture-proof penetration structure WPS2 having a predetermined height on the substrate 10 may form a step structure at the boundary between the moisture-proof penetration area NDA2 and the dummy area NDA3. Such a step structure may prevent the penetration of moisture, oxygen, etc. that may enter through the light-transmitting area TA.

[0212] In addition, the second moisture-proof penetration structure WPS2 may include a plurality of protrusion patterns ST, and the protrusion patterns ST provided on the second moisture-proof penetration structure WPS2 may be referred to as third protrusion patterns ST3. Accordingly, the plurality of protrusion patterns ST may include first protrusion patterns ST1 and second protrusion patterns ST2 with dams DAM interposed therebetween provided on the first moisture-proof penetration structure WPS1 and third protrusion patterns ST3 separated from the first protrusion patterns ST1 and the second protrusion patterns ST2 by an organic insulating layer provided between the two moisture-proof penetration structures WPS1 and WPS2. The third protrusion patterns ST3 may have the same shape as the plurality of first protrusion patterns ST1 and the plurality of second protrusion patterns ST2, but are not necessarily limited thereto. For example, the first protrusion patterns ST1 and the second protrusion patterns ST2 may have the same shape, but since the third protrusion patterns ST3 are provided adjacent to the light-transmitting region TA, the third protrusion patterns ST3 may be formed to have a different shape from the first protrusion patterns ST1. The plurality of first protrusion patterns ST1, the plurality of second protrusion patterns ST2, and the plurality of third protrusion patterns ST3 may be variously modified to have a structure capable of disconnecting the light-emitting stack 152. The third protrusion patterns ST3 may be provided between the plurality of second protrusion patterns ST2 and the dummy region NDA3.

[0213] The display panel according to the second embodiment may include an organic insulating layer provided between the first moisture-proof penetration structure WPS1 and the second moisture-proof penetration structure WPS2, and the organic insulating layer may be formed by extending the first touch planarization layer 181 of the touch portion 18 extending toward the light-transmitting region TA downward. Specifically, the first touch planarization layer 181 of the touch portion 18 may extend downward between the first moisture-proof penetration structure WPS1 and the second moisture-proof penetration structure WPS2. Accordingly, the organic insulating layer provided between the first moisture-proof penetration structure WPS1 and the second moisture-proof penetration structure WPS2 may be referred to as a protrusion and may be referred to as a second protrusion P2 to be distinguished from the first protrusion P1.

[0214] The display panel according to the second embodiment may improve the moisture-proof penetration effect by disposing the second protrusions P2 of the organic insulating layer between the first moisture-proof penetration structure WPS1 and the second moisture-proof penetration structure WPS2 spaced apart from each other.

[0215] For example, the display panel according to the second embodiment can form a more moisture-permeation-resistant structure by disposing an organic insulating layer between two moisture-permeation-preventing structures WPS1 and WPS2. Accordingly, since the inorganic insulating layer provided on the substrate 10 in the dummy region and covering the side surface of the moisture-permeation-preventing structure WPS in the display panel according to the first embodiment can be removed from the display panel according to the second embodiment, the horizontal length of the dummy region NDA3 in the display panel according to the second embodiment can be reduced as compared with the display panel according to the first embodiment.

[0216] The dummy region NDA3 may be a region formed for an edge when the substrate 10 undergoes etching and / or laser cutting. However, when there is no dummy region NDA3, the moisture-permeation-preventing region NDA2 may be damaged during the laser cutting process, making it vulnerable to moisture permeation. For example, by disposing the minimum layer extending from the touch portion 18 and the opening 11 on the emission line of the emitted laser to form a light-transmitting region TA, the laser cutting can be easily performed. In this case, the organic insulating layer provided on the opening 11 can prevent the etching solution from penetrating into the interior of the display panel 100 when etching the substrate 10. Here, the first touch planarization layer 181 extending from the touch portion 18 may be provided as the organic insulating layer provided on the opening 11.

[0217] The opening 11 may be formed in the substrate 10 provided in the dummy region NAD3 to correspond to the light-transmitting region TA, and the side coating 31 may be formed in the opening 11. Subsequently, the organic insulating layer extending from the touch portion 18 may be provided on the side coating 31 and joined to the side coating 31. Subsequently, the back coating 32 may be provided below the substrate 10 and below the side coating 31, but is not limited thereto. However, the present disclosure is not necessarily limited thereto, and the back coating 32 may be formed only on the lower surface of the substrate 10. Specifically, the lower surfaces of the side coating 31 and the back coating 32 may be formed to be recessed toward the anti-etching layer, but are not necessarily limited thereto.

[0218] Figures 15A to 15H is a diagram showing a process of forming a light-transmitting region in a display panel according to a second embodiment of the present disclosure.

[0219] Figure 15A is a diagram showing steps of forming a support layer, a protrusion pattern and a dam provided on the support layer, a light-emitting stack provided on the protrusion pattern and the dam, and an inorganic insulating layer provided on the light-emitting stack.

[0220] Refer to Figure 15A, a support layer SL may be formed on the substrate 10, and a dam DAM and a plurality of protrusion patterns ST may be formed on the support layer SL. Subsequently, a light-emitting stack 152 may be formed on the protrusion pattern ST having an undercut shape. Accordingly, the light-emitting stack 152 may be formed discontinuously and may be disconnected between the plurality of protrusion patterns ST. Subsequently, an inorganic insulating layer may be formed on the dam DAM and the plurality of protrusion patterns ST on which the light-emitting stack 152 is disposed. The inorganic insulating layer may be a layer made of an inorganic insulating material formed by extending a first encapsulation layer 171 and a second encapsulation layer 173 of the encapsulation part 17. In this case, the inorganic insulating layer may be formed of only one of the first encapsulation layer 171 and the second encapsulation layer 173.

[0221] Figure 15B FIG. is a view showing steps of forming a groove corresponding to a dummy region and a groove for partitioning a moisture-proof permeation structure.

[0222] Referring to Figure 15B , a groove G1 corresponding to the dummy region NDA3 and a groove G2 for dividing the moisture-proof permeation structure WPS into a first moisture-proof permeation structure WPS1 and a second moisture-proof permeation structure WPS2 may be formed using a laser or the like. The groove G1 corresponding to the dummy region NDA3 may be referred to as a first groove, and the groove G2 for dividing the moisture-proof permeation structure WPS into the first moisture-proof permeation structure WPS1 and the second moisture-proof permeation structure WPS2 may be referred to as a second groove.

[0223] The first groove G1 and the second groove G2 may each be formed in a closed-loop shape, and when the first groove G1 is formed, a step structure may be formed at the boundary between the moisture-proof permeation region NDA2 and the dummy region NDA3. Such a step structure may prevent the penetration of moisture, oxygen, etc. that may enter through the light-transmitting region TA. When the second groove G2 is formed, the moisture-proof permeation structure WPS may be divided into two. In this case, the second moisture-proof permeation structure WPS2 may include a support layer SL, a third protrusion pattern ST3 disposed on the support layer SL, a light-emitting stack 152 disposed to be disconnected by the third protrusion pattern ST3, and an inorganic insulating layer disposed on the third protrusion pattern ST3 on which the light-emitting stack 152 is disposed.

[0224] Figure 15C FIG. is a view showing steps of forming an organic insulating layer in the first groove and the second groove.

[0225] Reference Figure 15C, an organic insulating layer may be disposed in the first groove G1 and the second groove G2. In this case, the organic insulating layer may be on the inorganic insulating layer. The organic insulating layer may be formed by extending at least one of the plurality of layers constituting the touch portion 18. For example, when the first touch planarization layer 181 extending from the display area DA is disposed on the inorganic insulating layer, a part of the first touch planarization layer 181 extending from the display area DA may also be disposed in the first groove G1 and the second groove G2. The portion of the first touch planarization layer 181 disposed in the second groove G2 may be referred to as the second protrusion P2. The organic insulating layer may be formed by extending the first touch planarization layer 181 among the plurality of layers constituting the touch portion 18 toward the light-transmitting area TA, but is not limited thereto.

[0226] Subsequently, a touch buffer layer 182, a touch insulating layer 183, and a second touch planarization layer 185 may be sequentially disposed on the first touch planarization layer 181.

[0227] Figure 15D FIG. is a diagram showing a step of disposing a mask pattern on the back surface of a substrate.

[0228] Reference Figure 15D , a mask pattern MP may be formed under the substrate 10. According to an exemplary embodiment, the mask pattern MP may be formed according to the number and shape of openings to be formed in the substrate 10 and exposed to an etching solution to simultaneously form a plurality of openings. The exemplary embodiment describes an example of performing an etching process using the mask pattern MP, but is not necessarily limited thereto. For example, without placing the mask pattern MP on the back surface of the substrate 10, an etching process may be performed after emitting a laser at a position where the opening 11 is desired to be formed. Therefore, one area of the substrate 10 irradiated with the laser may react more to the etching solution than another area to form the opening 11.

[0229] Figure 15E FIG. is a diagram showing a step of forming an opening on the back surface of a substrate by an etching process.

[0230] Refer to Figure 15E , when the etching solution contacts the exposed area of the substrate 10, a partial area of the back surface of the substrate 10 exposed between the mask patterns MP may be etched to form the opening 11. The substrate 10 may surround the opening 11.

[0231] Subsequently, the first touch planarization layer 181 disposed on the opening 11 and serving as an organic insulating layer may prevent the etching solution from penetrating into the interior of the display panel 100. When the first touch planarization layer 181 forming the display area DA is formed, the organic insulating layer disposed on the opening 11 may be formed together, thereby optimizing the process.

[0232] Figure 15FIt is a diagram showing the steps of disposing a side coating in an opening.

[0233] Reference Figure 15F , the opening 11 of the substrate 10 may be filled with the side coating 31. Subsequently, when the side coating 31 is cured, the side coating 31 may shrink by a certain height h1, and a curvature may be formed on the lower surface 31a of the side coating 31. However, depending on the material, the side coating 31 may not shrink. For example, even after the curing is completed, the lower surface 31a of the side coating 31 may be substantially flat.

[0234] In addition, the side coating 31 may be cured and bonded to the first touch planarization layer 181 serving as an organic insulating layer. Thus, the bonding can prevent delamination from occurring around the light-transmitting region TA, and prevent moisture, oxygen, etc. from penetrating into the interior of the display panel 100 through the light-transmitting region TA.

[0235] Figure 15G It is a diagram showing the steps of disposing a back coating.

[0236] Reference Figure 15G , the back coating 32 may be entirely formed on the back surface of the substrate 10, that is, the lower surface and the back surface of the side coating 31. Specifically, the lower surface of the back coating 32 may be formed to be recessed toward the anti-etching layer, but is not necessarily limited thereto. However, the present disclosure is not necessarily limited thereto, and the back coating 32 may be formed only on the lower surface of the substrate 10.

[0237] Figure 15H It is a diagram showing the laser cutting steps.

[0238] Referring to Figure 15H , the light-transmitting region TA may be formed by irradiating the side of the opening 11 of the substrate 10 with a laser. In this case, the organic insulating layer, the side coating 31, etc. may be laser-cut. Since the display device according to the exemplary embodiment of the present disclosure includes the bonding of the side coating 31 and the organic insulating layer and the inorganic insulating layer not provided in the dummy region NDA3, even when the laser for the light-transmitting region TA is emitted, the inorganic insulating layer can be prevented from peeling due to the laser irradiation.

[0239] Figure 16 It is a diagram showing another example of the display panel provided in the display device according to the exemplary embodiment of the present disclosure, and Figure 17 is a diagram showing Figure 16 an enlarged view of the region H in Figure 16 The shown display panel may represent the display panel according to the third embodiment of the present disclosure.

[0240] When referring to Figure 13 and Figure 16When comparing the display panel according to the second embodiment with the display panel according to the third embodiment, the difference between the display panel according to the third embodiment and the display panel according to the second embodiment is that a part of the second touch planarization layer 185 provided as an organic insulating layer in the moisture-proof permeation area NDA2 extends toward the substrate 10 to be set in contact with the upper surface of the substrate 10. Specifically, a part of the second touch planarization layer 185 provided as an organic insulating layer in the moisture-proof permeation area NDA2 extends between the two moisture-proof permeation structures WPS1 and WPS2 toward the substrate 10 to be set in contact with the upper surface of the substrate 10. Therefore, since the organic insulating layer formed of only one layer is provided on the opening 11, layer peeling caused by the laser emitted to form the light-transmitting area TA can be more effectively prevented.

[0241] In addition, the difference between the display panel according to the third embodiment and the display panel according to the second embodiment is that the touch insulating layer 183 in the display area DA extends to the non-display area NDA to increase the height of the moisture-proof permeation structure WPS. Therefore, the display panel according to the third embodiment increases the length of the path through which oxygen, moisture, etc. penetrate by increasing the height of the moisture-proof permeation structure WPS, thereby more effectively blocking oxygen, moisture, etc. entering through the light-transmitting area TA. In this case, different from the display panel according to the second embodiment, since the first touch planarization layer 181 and the touch buffer layer 182 are not provided in the non-display area NDA in the display panel according to the third embodiment, the touch insulating layer 183 can be provided in contact with the second encapsulation layer 173 on the second encapsulation layer 173. The second touch planarization layer 185 can be provided on the touch insulating layer 183.

[0242] When describing the display panel according to the third embodiment, components that are the same as those of the display panel according to the first embodiment and the display panel according to the second embodiment may be denoted by the same reference numerals, and thus their detailed descriptions will be omitted or briefly given.

[0243] Refer to Figure 2 、 Figure 3 、 Figure 7 and Figure 16, the display panel 100 according to an exemplary embodiment of the present disclosure may include a display area DA, a light-transmitting area TA, and a non-display area NDA surrounding the light-transmitting area TA. The non-display area NDA may include a wiring area NDA1, a moisture-proof penetration area NDA2, and a dummy area NDA3. The display panel 100 may include a substrate 10 disposed in the display area DA and the non-display area NDA, a circuit unit 13 disposed on the substrate 10, a light-emitting element unit 15 disposed on the circuit unit 13, a packaging unit 17 disposed on the light-emitting element unit 15, and a touch unit 18 disposed on the packaging unit 17. In this case, in the non-display area NDA, the substrate 10 and the packaging unit 17 include openings 11 corresponding to the light-transmitting area TA, and an organic insulating layer is disposed between two moisture-proof penetration structures WPS separated from the upper part of the opening 11. The organic insulating layer may be formed by extending the second touch planarization layer 185 among the multiple layers constituting the touch unit 18 toward the light-transmitting area TA, but is not limited thereto.

[0244] Referring to Figure 16 , the moisture-proof penetration area NDA2 may have various structures for preventing moisture penetration, and the display panel according to the third embodiment may more effectively cope with moisture penetration by using two moisture-proof penetration structures WPS spaced apart from each other and an organic insulating layer disposed between the two moisture-proof penetration structures WPS.

[0245] Referring to Figure 16 and Figure 17 , the moisture-proof penetration structure WPS disposed on the display panel according to the third embodiment is formed on the substrate 10 to have a predetermined height, and includes a first moisture-proof penetration structure WPS1 and a second moisture-proof penetration structure WPS2 spaced apart from each other. However, the present disclosure is not limited thereto, and the moisture-proof penetration structure WPS may include two or more structures spaced apart from each other. In addition, the first moisture-proof penetration structure WPS1 and the second moisture-proof penetration structure WPS2 divided into two may be formed to have the same height and the same buffer layer, insulating layer, metal layer, etc., but are not necessarily limited thereto.

[0246] The first moisture-proof penetration structure WPS1 and the second moisture-proof penetration structure WPS2 may each include a support layer SL, a plurality of protrusion patterns ST spaced apart from each other on the support layer SL, a light-emitting laminate 152 discontinuously formed by the plurality of protrusion patterns ST spaced apart from each other, and an inorganic insulating layer disposed on the plurality of protrusion patterns ST provided with the light-emitting laminate 152. In addition, the first moisture-proof penetration structure WPS1 and the second moisture-proof penetration structure WPS2 may each include a portion or a dummy layer disposed on the inorganic insulating layer and extending from the touch insulating layer 183 of the touch unit 18.

[0247] The first moisture-proof penetration structure WPS1 may further include a dam DAM disposed on the support layer SL. A plurality of protrusion patterns ST may be disposed on the support layer SL while being spaced apart from each other. In this case, the protrusion patterns ST disposed on the first moisture-proof penetration structure WPS1 may include a plurality of first protrusion patterns ST1 disposed on the display area DA side with respect to the dam DAM and a plurality of second protrusion patterns ST2 disposed on the light-transmissive area TA side with respect to the dam DAM. For example, the dam DAM may be disposed between the plurality of first protrusion patterns ST1 and the plurality of second protrusion patterns ST2.

[0248] The second moisture-proof penetration structure WPS2 may be disposed between the first moisture-proof penetration structure WPS1 and the dummy area NDA3, and may be disposed in the moisture-proof penetration area NDA2 to be spaced apart from the first moisture-proof penetration structure WPS1.

[0249] The second moisture-proof penetration structure WPS2 having a predetermined height on the substrate 10 may form a step structure at the boundary between the moisture-proof penetration area NDA2 and the dummy area NDA3. Such a step structure may prevent the penetration of moisture, oxygen, etc. that may enter through the light-transmissive area TA. In this case, since the second moisture-proof penetration structure WPS2 disposed on the display panel according to the third embodiment further includes a touch insulation layer 183 as compared with the second moisture-proof penetration structure WPS2 disposed on the display panel according to the second embodiment, the height difference in the step structure is increased by the second moisture-proof penetration structure WPS2, thereby more effectively coping with moisture penetration.

[0250] In addition, the second moisture-proof penetration structure WPS2 may include a plurality of protrusion patterns ST, and the protrusion patterns ST provided on the second moisture-proof penetration structure WPS2 may be referred to as third protrusion patterns ST3. Accordingly, the plurality of protrusion patterns ST may include a first protrusion pattern ST1 and a second protrusion pattern ST2 with dams DAM interposed therebetween provided on the first moisture-proof penetration structure WPS1, and a third protrusion pattern ST3 separated from the first protrusion pattern ST1 and the second protrusion pattern ST2 by an organic insulating layer provided between the two moisture-proof penetration structures WPS1 and WPS2. The third protrusion pattern ST3 may have the same shape as the plurality of first protrusion patterns ST1 and the plurality of second protrusion patterns ST2, but is not necessarily limited thereto. For example, the first protrusion pattern ST1 and the second protrusion pattern ST2 may have the same shape, but since the third protrusion pattern ST3 is provided adjacent to the light-transmitting region TA, the third protrusion pattern ST3 may be formed to have a shape different from that of the first protrusion pattern ST1. The plurality of first protrusion patterns ST1, the plurality of second protrusion patterns ST2, and the plurality of third protrusion patterns ST3 may be variously modified to have a structure capable of disconnecting the light-emitting stack 152. The third protrusion pattern ST3 may be provided between the plurality of second protrusion patterns ST2 and the dummy region NDA3.

[0251] The display panel according to the third embodiment may include an organic insulating layer provided between the first moisture-proof penetration structure WPS1 and the second moisture-proof penetration structure WPS2, and the organic insulating layer may be formed by extending the second touch planarization layer 185 of the touch portion 18 extending toward the light-transmitting region TA downward. Specifically, the second touch planarization layer 185 of the touch portion 18 may extend downward between the first moisture-proof penetration structure WPS1 and the second moisture-proof penetration structure WPS2. Accordingly, the organic insulating layer provided between the first moisture-proof penetration structure WPS1 and the second moisture-proof penetration structure WPS2 may be referred to as a protrusion, and may be referred to as a second protrusion P2 to be distinguished from the first protrusion P1.

[0252] The display panel according to the third embodiment may improve the moisture-proof penetration effect by providing the second protrusion P2 of the organic insulating layer between the first moisture-proof penetration structure WPS1 and the second moisture-proof penetration structure WPS2 spaced apart from each other.

[0253] The dummy region NDA3 may be a region formed for an edge when the substrate 10 undergoes etching and / or laser cutting. However, when there is no dummy region NDA3, the moisture-proof penetration region NDA2 may be damaged during the laser cutting process, making it vulnerable to moisture penetration. For example, by providing the second touch planarization layer 185 and the opening 11 extending from the touch portion 18 on the emission line of the emitted laser to form the light-transmitting region TA, damage such as layer peeling caused by laser cutting may be minimized.

[0254] An opening 11 may be formed in the substrate 10 disposed in the dummy area NAD3 to correspond to the light-transmitting area TA, and a side coating 31 may be formed in the opening 11. Subsequently, a second touch planarization layer 185, which is a layer extending from the touch portion 18, may be disposed on the side coating 31 and bonded to the side coating 31 to form a robust structure resistant to damages such as delamination. Subsequently, a back coating 32 may be disposed under the substrate 10 and under the side coating 31, but is not limited thereto. However, the present disclosure is not necessarily limited thereto, and the back coating 32 may be formed only on the lower surface of the substrate 10. Specifically, the lower surfaces of the side coating 31 and the back coating 32 may be formed to be recessed toward the anti-etching layer, but are not necessarily limited thereto.

[0255] Figures 18A to 18H FIG. is a diagram illustrating a process of forming a light-transmitting area in a display panel according to a third embodiment of the present disclosure.

[0256] Figure 18A FIG. is a diagram illustrating steps of forming a support layer, a protrusion pattern and a dam disposed on the support layer, a light-emitting stack disposed on the protrusion pattern and the dam, and an inorganic insulating layer disposed on the light-emitting stack.

[0257] Referring to Figure 18A , a support layer SL may be formed on the substrate 10, and a dam DAM and a plurality of protrusion patterns ST may be formed on the support layer SL. Subsequently, a light-emitting stack 152 may be formed on the protrusion pattern ST having an undercut shape. Thus, the light-emitting stack 152 may be formed discontinuously and may be disconnected between the plurality of protrusion patterns ST. Subsequently, an inorganic insulating layer may be formed on the dam DAM and the plurality of protrusion patterns ST on which the light-emitting stack 152 is disposed. The inorganic insulating layer may be a layer made of an inorganic insulating material formed by extending a first encapsulation layer 171 and a second encapsulation layer 173 of the encapsulation portion 17. In this case, the inorganic insulating layer may be formed of only one of the first encapsulation layer 171 and the second encapsulation layer 173.

[0258] Figure 18B FIG. is a diagram illustrating steps of forming a groove corresponding to a dummy area and a groove partitioning a moisture-proof permeation structure.

[0259] Referring to Figure 18B , grooves G1 corresponding to the dummy area NDA3 and grooves G2 partitioning the moisture-proof permeation structure WPS into a first moisture-proof permeation structure WPS1 and a second moisture-proof permeation structure WPS2 may be formed using a laser or the like. The grooves G1 corresponding to the dummy area NDA3 may be referred to as first grooves, and the grooves G2 partitioning the moisture-proof permeation structure WPS into the first moisture-proof permeation structure WPS1 and the second moisture-proof permeation structure WPS2 may be referred to as second grooves.

[0260] The first groove G1 and the second groove G2 may each be formed in a closed-loop shape, and when the first groove G1 is formed, a step structure may be formed at the boundary between the moisture-proof permeation region NDA2 and the dummy region NDA3. Such a step structure can prevent the permeation of moisture, oxygen, etc. that may enter through the light-transmitting region TA. When the second groove G2 is formed, the moisture-proof permeation structure WPS may be divided into two. In this case, the second moisture-proof permeation structure WPS2 may include a support layer SL, a third protrusion pattern ST3 provided on the support layer SL, a light-emitting stack 152 provided to be disconnected by the third protrusion pattern ST3, an inorganic insulating layer provided on the third protrusion pattern ST3 where the light-emitting stack 152 is provided, and a touch insulating layer 183 provided on the inorganic insulating layer.

[0261] Figure 18C FIG. is a diagram showing steps of forming an organic insulating layer in the first groove and the second groove.

[0262] Referring to Figure 18C , the organic insulating layer may be provided in the first groove G1 and the second groove G2. In this case, the organic insulating layer may be on the inorganic insulating layer. The organic insulating layer may be formed by extending the second touch planarization layer 185 among the multiple layers constituting the touch part 18. For example, when the second touch planarization layer 185 extending from the display region DA is provided on the touch insulating layer 183, a part of the second touch planarization layer 185 extending from the display region DA may also be provided in the first groove G1 and the second groove G2. A part of the second touch planarization layer 185 provided in the second groove G2 may be referred to as the second protrusion P2. The organic insulating layer may be formed by extending the second touch planarization layer 185 among the multiple layers constituting the touch part 18 toward the light-transmitting region TA, but is not limited thereto.

[0263] Figure 18D FIG. is a diagram showing steps of providing a mask pattern on the back surface of the substrate.

[0264] Referring to Figure 18D , the mask pattern MP may be formed under the substrate 10. According to an exemplary embodiment, the mask pattern may be formed according to the number and shape of the openings to be formed in the substrate 10 and exposed to the etching solution to simultaneously form a plurality of openings. The exemplary embodiment describes an example of performing an etching process using the mask pattern MP, but is not necessarily limited thereto. For example, without placing the mask pattern MP on the back surface of the substrate 10, an etching process may be performed after emitting a laser at a position where the opening 11 is desired to be formed. Therefore, one region of the substrate 10 irradiated with the laser may react more to the etching solution than another region to form the opening 11.

[0265] Figure 18EIt is a diagram showing the step of forming an opening on the back surface of a substrate through an etching process.

[0266] Referring to Figure 18E , when the etching solution contacts the exposed area of the substrate 10, a partial area of the back surface of the substrate 10 exposed between the mask patterns MP can be etched to form an opening 11. The substrate 10 can surround the opening 11.

[0267] Subsequently, the second touch planarization layer 185 disposed on the opening 11 and serving as an organic insulating layer can prevent the etching solution from penetrating into the interior of the display panel 100. When forming the second touch planarization layer 185 in the display area DA, the organic insulating layer disposed on the opening 11 can be formed together, thereby optimizing the process.

[0268] Figure 18F It is a diagram showing the step of disposing a side coating in the opening.

[0269] Referring to Figure 18F , the opening 11 of the substrate 10 can be filled with a side coating 31. Subsequently, when the side coating 31 cures, the side coating 31 can shrink by a certain height h1, and a curvature can be formed on the lower surface 31a of the side coating 31. However, depending on the material, the side coating 31 may not shrink. For example, even after the curing is completed, the lower surface 31a of the side coating 31 can be substantially flat.

[0270] In addition, the side coating 31 can cure and bond to the second touch planarization layer 185 serving as an organic insulating layer. Therefore, the bonding can prevent layer peeling from occurring around the light-transmitting area TA, and prevent moisture, oxygen, etc. from penetrating into the interior of the display panel 100 through the light-transmitting area TA.

[0271] Figure 18G It is a diagram showing the step of disposing a back coating.

[0272] Referring to Figure 18G , the back coating 32 can be completely formed on the back surface of the substrate 10, that is, the lower surface and the back surface of the side coating 31. Specifically, the lower surface of the back coating 32 can be formed to be recessed toward the anti-etching layer, but it is not necessarily limited to this. However, the present disclosure is not necessarily limited to this, and the back coating 32 can be formed only on the lower surface of the substrate 10.

[0273] Figure 18H It is a diagram showing the laser cutting step.

[0274] Referring to Figure 18H, the light-transmitting region TA can be formed by irradiating the opening 11 side of the substrate 10 with a laser. In this case, the organic insulating layer, the side coating 31, etc. can be cut by the laser. Since the display device according to the exemplary embodiment of the present disclosure includes the joining of the side coating 31, the second touch planarization layer 185, and the inorganic insulating layer not provided in the dummy region NDA3, the inorganic insulating layer can be prevented from peeling due to laser irradiation. In addition, in the display device according to the exemplary embodiment of the present disclosure, by the joining of the organic insulating layer formed by only one layer on the opening 11 and the side coating 31 provided in the opening 11, the layer peeling caused by the laser emitted to form the light-transmitting region TA can be more effectively prevented.

[0275] The display device according to one or more embodiments of the present disclosure can be described as follows.

[0276] The display device according to one or more embodiments of the present disclosure can include: a display panel including a display region, a light-transmitting region, and a non-display region surrounding the light-transmitting region, wherein the display panel can include: a substrate provided in the display region and the non-display region; a circuit portion provided on the substrate; a light-emitting element portion provided on the circuit portion; a packaging portion provided on the light-emitting element portion; and a touch portion provided on the packaging portion, wherein the substrate and the packaging portion surround an opening corresponding to the light-transmitting region, and an organic insulating layer is provided on the opening.

[0277] The organic insulating layer can be one of a first touch planarization layer and a second touch planarization layer extending from the touch portion toward the light-transmitting region.

[0278] The end of the inorganic insulating layer extending from the packaging portion toward the light-transmitting region can be exposed to the opening.

[0279] The inorganic insulating layer can be one of a first encapsulation layer and a second encapsulation layer extending from the packaging portion toward the light-transmitting region.

[0280] The non-display region can include a wiring region provided with wirings bypassing the light-transmitting region, a dummy region surrounding the light-transmitting region, and a moisture-proof penetration region provided between the wiring region and the dummy region. A moisture-proof penetration structure having a predetermined height can be provided on the substrate in the moisture-proof penetration region, and the side surface of the moisture-proof penetration structure can be covered by the inorganic insulating layer.

[0281] The moisture-proof penetration structure can include a support layer and a plurality of protrusion patterns provided on the support layer and spaced apart from each other, and the protrusion patterns can have an undercut shape.

[0282] The inorganic insulating layer may be disposed between the plurality of protruding patterns. In this case, the inorganic insulating layer may cover the protruding patterns.

[0283] The plurality of protruding patterns may be formed to have the same layer structure as the source electrode of the circuit portion and may be located on the same layer as the source electrode of the circuit portion.

[0284] The moisture-proof penetration structure may further include a dam, and the plurality of protruding patterns may include a plurality of first protruding patterns disposed between the display area and the dam and a plurality of second protruding patterns disposed between the dam and the dummy area.

[0285] The non-display area may include a wiring area provided with wirings bypassing the light-transmitting area, a dummy area surrounding the light-transmitting area, and a moisture-proof penetration area provided between the wiring area and the dummy area. In the dummy area, the inorganic insulating layer may be in contact with the upper surface of the substrate.

[0286] The non-display area may include a wiring area provided with wirings bypassing the light-transmitting area, a dummy area surrounding the light-transmitting area, and a moisture-proof penetration area provided between the wiring area and the dummy area. In the moisture-proof penetration area, two moisture-proof penetration structures may be provided on the substrate to have a predetermined height and spaced apart from each other, and the organic insulating layer may be disposed between the two moisture-proof penetration structures to be in contact with the upper surface of the substrate.

[0287] The moisture-proof penetration structure may further include a dam. The plurality of protruding patterns may include a first protruding pattern, a second protruding pattern, and a third protruding pattern. The first protruding pattern and the second protruding pattern are provided with the dam interposed therebetween, the third protruding pattern is separated from the first protruding pattern and the second protruding pattern, and the third protruding pattern is separated from the first protruding pattern and the second protruding pattern by the organic insulating layer disposed between the two moisture-proof penetration structures.

[0288] The non-display area may include a wiring area provided with wirings bypassing the light-transmitting area, a dummy area surrounding the light-transmitting area, and a moisture-proof penetration area provided between the wiring area and the dummy area. In the dummy area, the first touch planarization layer or the second touch planarization layer may be in contact with the upper surface of the substrate.

[0289] The display device may further include a coating disposed in the opening, wherein an upper portion of the coating is in contact with the organic insulating layer. Accordingly, the organic insulating layer and the coating may be provided to surround the light-transmitting area.

[0290] A display device according to one or more embodiments of the present disclosure may include: a display panel including a display area, a light-transmissive area, and a non-display area surrounding the light-transmissive area, wherein the display panel may include: a substrate disposed in the display area and the non-display area; a circuit unit disposed on the substrate; a light-emitting element unit disposed on the circuit unit; a packaging unit disposed on the light-emitting element unit; and a touch unit disposed on the packaging unit, wherein the substrate may include an opening corresponding to the light-transmissive area, and wherein one of a first touch planarization layer and a second touch planarization layer extending toward the light-transmissive area of the touch unit may be joined to a coating disposed in the opening.

[0291] The non-display area may include a wiring area provided with wirings bypassing the light-transmissive area, a dummy area surrounding the light-transmissive area, and a moisture-proof penetration area disposed between the wiring area and the dummy area, and in the moisture-proof penetration area, a moisture-proof penetration structure configured to have a predetermined height may be disposed on the substrate.

[0292] The moisture-proof penetration structure may include a support layer and a plurality of protrusion patterns disposed on the support layer while being spaced apart from each other, and the protrusion patterns have an undercut shape.

[0293] The moisture-proof penetration structure may include a first moisture-proof penetration structure and a second moisture-proof penetration structure spaced apart from each other, and one of the first touch planarization layer and the second touch planarization layer may include protrusions extending between the first moisture-proof penetration structure and the second moisture-proof penetration structure.

[0294] The protrusions may be in contact with the upper surface of the substrate.

[0295] A display device according to one or more embodiments of the present disclosure may include: a display panel including a display area, a light transmissive area, and a non-display area surrounding the light transmissive area, wherein the display panel may include: a substrate disposed in the display area and the non-display area; a circuit portion disposed on the substrate; a light emitting element portion disposed on the circuit portion; a packaging portion disposed on the light emitting element portion; and a touch portion disposed on the packaging portion, wherein the substrate may include an opening corresponding to the light transmissive area, the non-display area includes a wiring area provided with wirings bypassing the light transmissive area, a dummy area surrounding the light transmissive area, and a moisture barrier penetration prevention area disposed between the wiring area and the dummy area, wherein the moisture barrier penetration prevention area may include a first moisture barrier penetration prevention structure and a second moisture barrier penetration prevention structure spaced apart from each other, and wherein one of a first touch planarization layer and a second touch planarization layer extending from the touch portion toward the light transmissive area of the touch portion may be disposed between the first moisture barrier penetration prevention structure and the second moisture barrier penetration prevention structure.

[0296] A display device according to one or more embodiments of the present disclosure may include: a display panel including a display area, a light transmissive area, and a non-display area surrounding the light transmissive area, wherein the display panel includes: a substrate disposed in the display area and the non-display area; a circuit portion disposed on the substrate; a light emitting element portion disposed on the circuit portion; a packaging portion disposed on the light emitting element portion; and a touch portion disposed on the packaging portion, wherein the non-display area includes a wiring area provided with wirings bypassing the light transmissive area, a dummy area surrounding the light transmissive area, and a moisture barrier penetration prevention area disposed between the wiring area and the dummy area, and in the moisture barrier penetration prevention area, a moisture barrier penetration prevention structure is disposed on the substrate to have a predetermined height.

[0297] A display panel according to one or more embodiments of the present disclosure may include: a display area, a light transmissive area, and a non-display area surrounding the light transmissive area; a substrate disposed in the display area and the non-display area; a circuit portion disposed on the substrate; a light emitting element portion disposed on the circuit portion; a packaging portion disposed on the light emitting element portion; and a touch portion disposed on the packaging portion, wherein the substrate and the packaging portion surround an opening corresponding to the light transmissive area, and wherein an organic insulating layer is disposed on the opening.

[0298] The objects to be achieved by the present disclosure described above, the means for achieving the objects, and the effects of the present disclosure do not specify the basic features of the claims. Therefore, the scope of the claims is not limited to the disclosure of the present disclosure.

[0299] Although example embodiments of the present disclosure have been described in more detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be embodied in many different forms without departing from the technical concept of the present disclosure. Therefore, the example embodiments disclosed in the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above embodiments are illustrative in all respects and do not limit the present disclosure.

[0300] [Description of Reference Numerals]

[0301] 10: Substrate 11: Opening

[0302] 13: Circuit portion 15: Light-emitting element portion

[0303] 17: Encapsulation portion 18: Touch portion

[0304] 30: Coating 100: Display panel

[0305] 171: First encapsulation layer 172: Second encapsulation layer

[0306] 181: First touch planarization layer

[0307] 185: Second touch planarization layer

[0308] 110: First planarization layer

[0309] DA: Display area NDA: Non-display area

[0310] P1: First protrusion P2: Second protrusion

[0311] ST: Protrusion pattern TA: Translucent area

[0312] WPS: Moisture-proof penetration structure

[0313] Cross-reference to Related Applications

[0314] This application claims the priority and benefit of Korean Patent Application No. 10-2023-0197833, filed on December 29, 2023, the entire disclosure of which is incorporated herein by reference as if fully set forth herein.

Claims

1. A display device, comprising: A display panel, the display panel comprising a display area, a light-transmitting area and a non-display area adjacent to the light-transmitting area, Wherein, the display panel comprises: a substrate, the substrate being disposed in the display area and the non-display area; A circuit portion, wherein the circuit portion is disposed on the substrate; a light emitting element portion, the light emitting element portion being disposed on the circuit portion; a packaging portion provided on the light emitting element portion; and a touch portion, the touch portion being disposed on the packaging portion, The substrate and the packaging part surround an opening corresponding to the light-transmitting area, and Wherein, an organic insulating layer is arranged on the opening.

2. The display device according to claim 1, wherein: The organic insulating layer is one of a first touch planarization layer and a second touch planarization layer extending from the touch portion toward the light-transmitting area.

3. The display device according to claim 2, wherein: An end portion of the inorganic insulating layer extending from the encapsulation portion toward the light-transmitting region is exposed to the opening.

4. The display device according to claim 3, wherein: The inorganic insulating layer is one of a first encapsulation layer and a second encapsulation layer extending from the encapsulation portion toward the light-transmitting region.

5. The display device according to claim 3, wherein: The non-display area includes a wiring area provided with wirings bypassing the light-transmitting area, a dummy area surrounding the light-transmitting area, and a moisture penetration prevention area provided between the wiring area and the dummy area, The moisture penetration prevention area is provided with a moisture penetration prevention structure provided on the substrate to have a predetermined height, and The inorganic insulating layer covers a side surface of the moisture permeation prevention structure.

6. The display device according to claim 5, wherein: The moisture permeation prevention structure includes a support layer and a plurality of protrusion patterns disposed on the support layer while being spaced apart from each other, and Each of at least one protrusion pattern among the plurality of protrusion patterns has an undercut shape.

7. The display device according to claim 6, wherein: The inorganic insulating layer is disposed between the at least one protrusion pattern having the undercut shape.

8. The display device according to claim 6, wherein: The plurality of protrusion patterns are located on the same layer as the source electrode of the circuit portion.

9. The display device according to claim 6, wherein: The moisture permeation prevention structure further includes a dam, and Wherein, the plurality of protrusion patterns include: a plurality of first protrusion patterns, the plurality of first protrusion patterns being disposed between the display area and the dam; and A plurality of second protrusion patterns are disposed between the dam and the dummy region.

10. The display device according to claim 3, wherein: The non-display area includes a wiring area provided with wirings bypassing the light-transmitting area, a dummy area surrounding the light-transmitting area, and a moisture penetration prevention area provided between the wiring area and the dummy area, and In the dummy region, the inorganic insulating layer contacts an upper surface of the substrate.

11. The display device according to claim 1, wherein: The non-display area includes a wiring area provided with wirings bypassing the light-transmitting area, a dummy area surrounding the light-transmitting area, and a moisture penetration prevention area provided between the wiring area and the dummy area, The moisture penetration preventing area is provided with two moisture penetration preventing structures which are provided on the substrate to have a predetermined height and are spaced apart from each other, and The organic insulating layer is disposed between the two moisture permeation prevention structures to contact an upper surface of the substrate.

12. The display device according to claim 11, wherein: The moisture permeation prevention structure further includes a dam, The plurality of protrusion patterns include a first protrusion pattern, a second protrusion pattern, and a third protrusion pattern, the first protrusion pattern and the second protrusion pattern being provided while the dam is interposed between the first protrusion pattern and the second protrusion pattern, the third protrusion pattern being separated from the first protrusion pattern and the second protrusion pattern, and The third protrusion pattern is separated from the first protrusion pattern and the second protrusion pattern by the organic insulating layer disposed between the two moisture permeation prevention structures.

13. The display device according to claim 2, wherein: The non-display area includes a wiring area provided with wirings bypassing the light-transmitting area, a dummy area surrounding the light-transmitting area, and a moisture penetration prevention area provided between the wiring area and the dummy area, and In the dummy area, the first touch planarizing layer or the second touch planarizing layer contacts an upper surface of the substrate.

14. The display device according to claim 1 or claim 11, further comprising: a coating disposed in the opening, Wherein, an upper portion of the coating layer contacts the organic insulating layer.

15. A display device, comprising: A display panel, the display panel comprising a display area, a light-transmitting area and a non-display area adjacent to the light-transmitting area, Wherein, the display panel comprises: a substrate, the substrate being disposed in the display area and the non-display area; A circuit portion, wherein the circuit portion is disposed on the substrate; a light emitting element portion, the light emitting element portion being disposed on the circuit portion; a packaging portion provided on the light emitting element portion; and a touch portion, the touch portion being disposed on the packaging portion, Wherein, the substrate includes an opening corresponding to the light-transmitting area, and Wherein, one of the first touch planarization layer and the second touch planarization layer of the touch part extending toward the light-transmitting area is bonded to an upper portion of the coating layer disposed in the opening.

16. The display device according to claim 15, wherein: The non-display area includes a wiring area provided with wirings bypassing the light-transmitting area, a dummy area surrounding the light-transmitting area, and a moisture penetration prevention area provided between the wiring area and the dummy area, and In the moisture permeation prevention area, a moisture permeation prevention structure provided to have a predetermined height is provided on the substrate.

17. The display device according to claim 16, wherein: The moisture permeation prevention structure includes a support layer and a plurality of protrusion patterns disposed on the support layer while being spaced apart from each other, and Each of at least one of the plurality of protrusion patterns has an undercut shape.

18. The display device according to claim 16, wherein: The moisture permeation prevention structure includes a first moisture permeation prevention structure and a second moisture permeation prevention structure spaced apart from each other, and One of the first touch planarizing layer and the second touch planarizing layer includes a protrusion extending between the first moisture permeation prevention structure and the second moisture permeation prevention structure.

19. The display device according to claim 18, wherein: The protrusion contacts an upper surface of the substrate.

20. A display device, comprising: A display panel, the display panel comprising a display area, a light-transmitting area and a non-display area adjacent to the light-transmitting area, Wherein, the display panel comprises: a substrate, the substrate being disposed in the display area and the non-display area; A circuit portion, wherein the circuit portion is disposed on the substrate; a light emitting element portion, the light emitting element portion being disposed on the circuit portion; a packaging portion provided on the light emitting element portion; and a touch portion, the touch portion being disposed on the packaging portion, wherein the non-display area includes a wiring area provided with wirings bypassing the light-transmitting area, a dummy area surrounding the light-transmitting area, and a moisture-proof penetration area provided between the wiring area and the dummy area, and In the moisture permeation prevention area, a moisture permeation prevention structure provided to have a predetermined height is provided on the substrate.

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