Pixel defining layer preparation method

Abstract

The invention relates to a preparation method of a pixel defining layer, and aims to provide a preparation method of a pixel defining layer through primary coating. Pre-baking is conducted; performing exposure; more than one layer is formed by a developing process, and a coloring pattern with less outgassing amount is realized on an electrode substrate, so that the color becomes bright, the reliability of a display is improved, and the service life is prolonged. That is, when the outgassing amount of the panel after the post-baking process is 40 ppm or more, the outgassing amount will become an inducement that the brightness is reduced and the life is shortened due to pixel shrinkage. In view of this, by containing the colorant of the present invention, sufficient fume is generated in the post-baking treatment step, and outgassing in the panel state is minimized, so that the outgassing amount is minimized after the post-baking treatment process is completed.

Description

[0001] Cross-reference to related applications

[0002] This application claims the priority and benefits of Korean Patent Application No. 10-2023-0197737, the entire content of which is incorporated herein by reference. Technical field

[0003] The present invention relates to a method for preparing a pixel defining layer of a light-emitting display device using a photosensitive composition. Background art

[0004] Flat panel display devices are widely used in liquid crystal display devices (LCDs) and organic light emitting display devices (OLEDs), etc. Among them, organic light emitting display devices have advantages such as low power consumption, fast response speed, high color reproducibility, high brightness, and wide viewing angles.

[0005] The purpose of using a polarizing film in the organic light emitting display device is to block the light reflected from the panel after shielding the incident external light. Its drawback is that due to the lack of bending characteristics, it is not suitable for applying the polarizing film to flexible devices.

[0006] To solve the above problems, methods such as using color filters, black matrices, and forming a light-shielding inorganic film on the upper substrate have been proposed in the past. However, this method has limitations in obtaining the desired level of anti-reflection effect and does not specifically provide a method to replace the polarizing film.

[0007] In addition, coloring patterns, such as red, green, and blue color filters, are used not only in liquid crystal displays but also in organic light emitting displays.

[0008] When manufacturing the coloring pattern, not only various organic pigments but also carbon black and inorganic pigments are used as colorants. The pigment dispersion liquid in which they are dispersed is mixed with other compositions to form a pattern. Before depositing the organic light emitting layer, in order to support the metal mask for deposition, after adding a lithography process, a deposition process is carried out.

[0009] When an organic light emitting display is prepared using the pixels formed in this way, clearer colors can be achieved. However, there is a large amount of outgassing on the coloring pattern, and when there is a large amount of outgassing, problems such as pixel shrinkage, dark spots, and electrode oxidation will occur, shortening the lifespan of the organic light emitting display and reducing the brightness. Summary of the invention

[0010] Problems to be solved

[0011] To address the above drawbacks of the conventional technology, an implementation example of the present invention integrates the process of preparing two layers into a single process to reduce damage to the panel, thereby achieving a coloring pattern with a short process time on the electrode substrate, which not only has clear colors but also can improve the reliability of the display and extend its lifespan.

[0012] Moreover, when the outgassing amount of the panel after post-baking treatment is 40 ppm or more, it will become an inducement for pixel shrinkage, resulting in a reduction in brightness and a shortening of lifespan. In view of this, the object of the present invention is to generate sufficient fumes during the post-baking treatment step to minimize the occurrence of out-gassing in the panel state, so that the outgassing amount becomes less after the post-baking treatment process is completed.

[0013] Another implementation example provides an organic light-emitting display device including a pixel defining layer prepared by the above method.

[0014] Another implementation example provides an electronic device including the organic light-emitting display device.

[0015] Problem-solving solution

[0016] The method for preparing a pixel defining layer according to the present invention includes the steps of: coating and applying a photosensitive composition; pre-baking; exposure; development; post-exposure; and post-baking treatment. Preferably, the transmittance of the photomask is divided into three sections, namely, 0% (non-exposed part), 20 to 50% (Half-tone), and 100% (Full-tone). One or more layers are formed through a single exposure and development process. The post-baking treatment step is carried out at an oven temperature of 210°C to 300°C for 30 minutes to 120 minutes, so that the post-baking treatment step generates a fume amount of 98 ppm or more and the outgassing amount after the post-baking treatment step is 40 ppm or less.

[0017] Preferably, the temperature of the pre-baking step is 80°C to 150°C.

[0018] Preferably, the implementation time of the pre-baking step is 60 seconds to 180 seconds.

[0019] Preferably, the exposure step irradiates actinic rays of 2 20 mJ / cm 2 to 350 mJ / cm.

[0020] Preferably, after the development step, the Half-tone thickness is 1.30 to 1.95 μm.

[0021] Preferably, after the development step, the Full-tone thickness is 3.20 to 3.40 μm.

[0022] Preferably, the post-exposure step irradiates with 50 to 1,000 mJ / cm 2 actinic rays.

[0023] More preferably, the temperature of the post-baking step is 230 to 270 °C.

[0024] Preferably, the post-baking step is carried out for 60 to 120 minutes.

[0025] Preferably, after the post-baking step, the half-tone thickness is 1.00 to 1.90 μm.

[0026] Preferably, after the post-baking step, the full-tone thickness is 2.80 to 3.20 μm.

[0027] Preferably, the photosensitive composition contains a colorant.

[0028] Preferably, the colorant includes one or more of inorganic dyes, organic dyes, inorganic pigments, and organic pigments.

[0029] Preferably, in the total amount of the photosensitive composition, the content of the colorant is 1 to 40% by weight.

[0030] Preferably, the colorant is pretreated with a dispersant; or a water-soluble inorganic salt and a wetting agent;

[0031] The average particle diameter of the colorant is 20 nm to 110 nm.

[0032] Preferably, the photosensitive composition contains a pattern-forming resin, and the pattern-forming resin includes an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0033] Preferably, the weight-average molecular weight of the acrylic binder resin is 3,000 g / mol to 150,000 g / mol.

[0034] Preferably, the cardo binder resin includes a repeating structure represented by the following Chemical Formula 1:

[0035] <Chemical Formula 1>

[0036]

[0037] In the Chemical Formula 1,

[0038] 1) R 1 and R 2 are each independently: hydrogen; deuterium; halogen; C6-C 30aryl group; C2 - C containing at least one hetero atom selected from O, N, S, Si, and P 30 heterocyclyl group; C6 - C 30 fused cyclo group of aliphatic ring and aromatic ring; C1 - C 20 Alkylgroup; C2 - C 20 alkenyl group; C2 - C 20 alkinyl group; C1 - C 20 alkoxy group; C6 - C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1 - C 20 alkoxy carbonyl group,

[0039] 2) R 1 and R 2 can form a ring between adjacent groups,

[0040] 3) m or n are independently integers from 0 to 4,

[0041] 4) A1 and A2 are independently the following Chemical Formula 2 or Chemical Formula 3,

[0042] <Chemical Formula 2>

[0043]

[0044] <Chemical Formula 3>

[0045]

[0046] In the said Chemical Formula 2 and Chemical Formula 3,

[0047] 4 - 1) * represents the connecting part,

[0048] 4 - 2) R 3 ~R 6 are independently: hydrogen; deuterium; halogen; C6 - C 30 aryl group; C2 - C containing at least one hetero atom selected from O, N, S, Si, and P 30 heterocyclylgroup; C6 - C30 A fused ring group (cyclo group) of an aliphatic ring and an aromatic ring; C1-C 20 An alkyl group;

[0049] C2-C 20 An alkenyl group; C2-C 20 An alkynyl group; C1-C 20 An alkoxy group; C6-C 30 An aryloxy group; A fluorenyl group; A carbonyl group; An ether group; Or C1-C 20 An alkoxy carbonyl group,

[0050] 4-3)R 3 -R 6 May form a ring between adjacent groups,

[0051] 4-4)Y 1 And Y 2 Are independently of each other the following Chemical Formula 6 or Chemical Formula 7,

[0052] <Chemical Formula 6>

[0053]

[0054] <Chemical Formula 7>

[0055]

[0056] In the said Chemical Formula 6 and Chemical Formula 7,

[0057] 4-4-1)* Indicates the bonding position,

[0058] 4-4-2)R 9 Is hydrogen or a methyl ester;

[0059] 4-4-3)R 10 -R 13 Are independently of each other: Hydrogen; Deuterium; A halogen; C6-C 30 An aryl group; A C2-C containing at least one hetero atom selected from O, N, S, Si and P 30 A heterocyclyl group; C6-C 30Fused ring group (cyclo group) of aliphatic ring and aromatic ring; C1-C 20 Alkyl group of C2-C 20 Alkenyl group of C2-C 20 Alkinyl group of C1-C 20 Alkoxy group of C6-C 30 Aryloxy group; Fluorenyl group; Carbonyl group; Ether group; or C1-C 20 Alkoxycarbonyl group of C1-C

[0060] 4-4-4)L 1 ~L 3 Independently of each other are: single bond; Fluorenylene group; C2-C 30 Alkylene of C2-C 30 Arylene of C6-C 30 Heterocycle of C1-C 30 Alkoxylene of C2-C 30 Alkyleneoxy of C2-C 30 Aryloxy group of C6-C 30 Polyethyleneoxy group,

[0061] 4-4-5)q and r are independently integers from 0 to 3; provided that q + r = 3,

[0062] 5) The resin includes a repeating unit represented by Chemical Formula 1, and in the polymer chain, the ratio of A1 and A2 is 9:1 to 1:9,

[0063] 6)X 1 Is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following Chemical Formula 4; or Chemical Formula 5,

[0064] 6-1) R' and R" are independently: hydrogen; deuterium; halogen; aryl group of C6-C 30 Containing at least one hetero atom of O, N, S, Si and P in C2-C 30heterocyclyl group; C6-C 30 fused cyclo group of aliphatic ring and aromatic ring; C1-C 20 Alkyl group; C2-C 20 alkenyl group; C2-C 20 alkinyl group; C1-C 20 alkoxy group; C6-C 30 aryloxy group; fluorenylgroup; carbonyl group; ether group; or C1-C 20 alkoxycarbonyl group,

[0065] 6-2) R' and R" can form a ring between adjacent groups,

[0066] <Chemical Formula 4>

[0067]

[0068] <Chemical Formula 5>

[0069]

[0070] In the said Chemical Formula 4 and Chemical Formula 5,

[0071] 6-3) * indicates the bonding position,

[0072] 6-4) R 7 ~R 8 are independently of each other: hydrogen; deuterium; halogen; aryl group of C6-C 30 heterocyclyl group of C2-C containing at least one hetero atom among O, N, S, Si and P; C6-C 30 heterocyclylgroup; C6-C 30 fused cyclo group of aliphatic ring and aromatic ring; C1-C 20 Alkylgroup;

[0073] C2-C 20 alkenyl group; C2-C 20 alkinyl group; C1-C 20an alkoxy group; C6-C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or C1-C 20 an alkoxy carbonyl group,

[0074] 6-5) o and p are each independently an integer from 0 to 4,

[0075] 7) X 2 is a C6-C 30 aryl group; a C2-C containing at least one heteroatom selected from O, N, S, Si, and P 30 heterocyclyl group; a C6-C 30 fused cyclo group of an aliphatic ring and an aromatic ring; C1-C 20 alkyl group; C2-C 20 alkenyl group; C2-C 20 alkinyl group; C1-C 20 alkoxy group; C6-C 30 aryloxy group; a fluorenylene group; a carbonyl group; an ether group; or C1-C 20 alkoxy carbonyl group,

[0076] 8) The R', R", X 2 , L 1 -L 3 , R 1 -R 8 and R 10 -R 13 may each be further substituted with one or more substituents selected from the group consisting of: deuterium; halogen; a substituted or unsubstituted C1-C 30 alkyl group or C6-C 30a silyl group of an aryl group; a siloxane group; a boron group; a germanium group; a cyano group; an amino group; a nitro group; C1-C 30 an alkylthio group of C1-C 30 an alkoxy group of C1-C 30 an arylalkoxy group of C6-C 30 an alkyl group of C1-C 30 an alkenyl group of C2-C 30 an alkynyl group of C2-C 30 an aryl group of C6-C; C6-C substituted with deuterium 30 an aryl group of C6-C; a fluorenyl group; C2-C 30 a heterocyclyl group of C2-C that contains at least one hetero atom selected from the group consisting of O, N, S, Si, and P 30 an aliphatic cyclic group of C3-C 30 an arylalkyl group of C7-C 30 an arylalkenyl group of C8-C; and combinations thereof, and rings may be formed between adjacent substituents.

[0077] Preferably, the weight average molecular weight of the cardo resin is 1,000 to 100,000 g / mol.

[0078] Preferably, in the total amount of the photosensitive composition, the content of the cardo resin is 1 to 30% by weight.

[0079] Preferably, the photosensitive composition contains a reactive unsaturated compound in an amount of 1 to 40% by weight in its total amount.

[0080] Preferably, the photosensitive composition contains a photoinitiator in an amount of 0.01 to 10% by weight in its total amount.

[0081] In yet another specific example, preferably, the present invention provides a pixel defining layer prepared by the preparation method.

[0082] In still another specific example, preferably, the present invention provides an organic light-emitting display device including the pixel defining layer.

[0083] In still another specific example, preferably, the present invention provides an electronic device including the display device and a control unit for driving the display device.

[0084] Advantages of the Invention

[0085] An object of the present invention is to achieve a coloring pattern with less outgassing amount on an electrode substrate, thereby making the color vivid while improving the reliability of the display and extending its lifespan. That is, when the outgassing amount of the panel after post-baking treatment is 40 ppm or more, it will become a cause for pixel shrinkage, resulting in reduced brightness and shortened lifespan. In view of this, by including the colorant described in the present invention, sufficient fumes are generated during the post-baking treatment step to minimize the occurrence of out-gassing in the panel state, so that the outgassing amount becomes minimal after the post-baking process is completed. BRIEF DESCRIPTION OF THE DRAWINGS

[0086] Figure 1 and Figure 2 are schematic views of the pixel defining layers described in Comparative Examples 1 to 6.

[0087] Figures 3 to 7 are schematic views of the pixel defining layers described in Examples 1 to 15. DETAILED DESCRIPTION OF THE INVENTION

[0088] Hereinafter, some embodiments of the present invention will be described in detail with reference to the schematic diagrams. When indicating the components of each drawing with reference symbols, the same components are given the same symbols as much as possible even if they are shown in other drawings.

[0089] In the process of describing the present invention, when it is considered that a detailed description of related well-known configurations or functions will obscure the gist of the present invention, the detailed description thereof may be omitted. When the present invention uses "comprising", "having", "consisting of", etc., other parts may be added unless "~ only" is used. When a component is expressed in the singular, it includes the case of being expressed in the plural unless specifically stated otherwise.

[0090] Also, in the process of describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only used to distinguish the components from other components, and the nature, order, sequence, or number of the components are not limited by these terms.

[0091] In the process of describing the positional relationship of constituent elements, when two or more constituent elements are mentioned as achieving "connection", "combination", or "access", it should be understood that two or more constituent elements can be directly "connected", "combined", or "accessed", but it is also possible to further "carry" two or more constituent elements and other constituent elements to achieve "connection", "combination", or "access". Among them, the other constituent elements can include one or more of the two or more constituent elements that are mutually "connected", "combined", or "accessed".

[0092] Moreover, when constituent elements such as layers, films, regions, plates, etc. are located "on" or "above" other constituent elements, it should be understood that this includes not only the case of being directly "above" the other constituent elements, but also the case where there are other constituent elements in between. Conversely, when a certain constituent element is located "directly above" another part, it should be understood that there are no other parts in between.

[0093] When describing the time flow relationship related to constituent elements, working methods, manufacturing methods, etc., for example, when describing time sequence relationships such as "after ~", "then ~", "next ~", "before ~", etc., or process sequence relationships, since "immediately" or "directly" is not used, it can further include discontinuous cases.

[0094] In addition, when referring to the numerical value of a constituent element or the corresponding information, even if not separately and clearly recorded, it should be interpreted that the numerical value or the corresponding information includes: the error range caused by various factors (such as engineering factors, internal or external shocks, noise, etc.).

[0095] Unless otherwise described, the terms used in this specification and the appended claims are as follows within the scope not departing from the idea of the present invention.

[0096] Unless otherwise described, the term "halo" or "halogen" used in this application includes fluorine (F), chlorine (Cl), bromine (Br), and iodine (I).

[0097] Unless otherwise described, the term "alkyl" or "alkyl group" used in this application contains 1 to 60 carbons connected by a single bond, representing a radical of a saturated aliphatic functional group typified by a straight-chain alkyl group, a branched-chain alkyl group, a cycloalkyl (alicyclic) group, an alkyl-substituted cycloalkyl group, or a cycloalkyl-substituted alkyl group.

[0098] Unless otherwise described, the term "haloalkyl group" or "halogenalkyl group" as used in this application means an alkyl group substituted with halogen.

[0099] Unless otherwise described, the terms "alkenyl" or "alkynyl" as used in this application have a double bond or a triple bond respectively, contain a straight-chain or branched-chain radical, and have 2 to 60 carbons, but are not limited thereto.

[0100] Unless otherwise described, the term "cycloalkyl" as used in this application means a cyclic alkane having 3 to 60 carbons, but is not limited thereto.

[0101] The term "Alkoxy group" or "alkyloxy group" as used in this application means an alkyl group bonded to an oxygen radical and has 1 to 60 carbons unless otherwise described, but is not limited thereto.

[0102] The terms "alkenoxyl group", "alkenoxygroup", "alkenyloxyl group" or "alkenyloxy group" as used in this application mean an alkenyl group bonded to an oxygen radical and have 2 to 60 carbons unless otherwise described, but are not limited thereto.

[0103] Unless otherwise described, the terms "aryl group" and "arylene group" as used in this application have 6 to 60 carbons respectively, but are not limited thereto. In this application, the aryl group or arylene group includes monocyclic, cyclic polymers, fused polycyclic compounds, etc. For example, the aryl group may include a phenyl group, a monovalent functional group of biphenyl,

[0104] a monovalent functional group of naphthalene, a fluorenyl group, and a substituted fluorenyl group. The arylene group may include a fluorenylene group and a substituted fluorenylene group.

[0105] The term "ring assemblies" used in this application refers to two or more ring systems (monocyclic or fused ring systems) directly connected by single or double bonds, indicating that the number of direct connections between the rings is one less than the total number of ring systems included in the compound. Ring assemblies can be formed by the direct connection of the same or different ring systems through single or double bonds.

[0106] In this application, the aryl group includes ring assemblies. Therefore, the aryl group includes biphenyl and terphenyl, which are formed by benzene rings (as monocyclic aromatic rings) directly connected by single bonds. Additionally, the aryl group also includes compounds in which an aromatic ring system fused with an aromatic monocyclic ring is directly connected by a single bond. Thus, for example, it also includes compounds in which an aromatic ring system fused with a benzene ring (as an aromatic monocyclic ring), i.e., fluorene, is directly connected by a single bond.

[0107] The term "fused polycyclic system" used in this application refers to a ring that is fused by sharing at least two atoms, including forms in which two or more hydrocarbon ring systems are fused and forms in which at least one heterocyclic system containing at least one hetero atom is fused, etc. The fused polycyclic system can be an aromatic ring, an aromatic heterocycle, an aliphatic ring, or a combination of such rings. For example, the aryl group can be a naphthalenyl group, a phenanthrenyl group, a fluorenyl group, etc., but is not limited thereto.

[0108] The term "spiro compound" used in this application has a "spiro union", and spiro union refers to a connection formed by two rings sharing only one atom. At this time, the atom shared by the two rings is called the "spiro atom", and according to the number of spiro atoms included in a compound, it is respectively called a "monospiro-", "dispiro-", "trispiro-" compound.

[0109] Unless otherwise described, the terms "fluorenyl group", "fluorenylene group", and "fluorene-triyl group" as used in this application respectively represent a monovalent, divalent, or trivalent functional group in which R, R', R", and R'" are all hydrogen in the following structures. "Substituted fluorenyl group", "substituted fluorenylene group", or "substituted fluorene-triyl group" means that at least one of the substituents R, R', R", and R'" is a substituent other than hydrogen, including the case where R and R' are bonded to each other and together with the carbon to which they are bonded form a spiro compound. In this specification, the fluorenyl group, fluorenylene group, and fluorene-triyl group may all be named as the fluorene group regardless of the valence such as monovalent, divalent, or trivalent.

[0110]

[0111] Moreover, R, R', R", and R'" can each independently be: an alkyl group having 1 to 20 carbons, an alkenyl group having 1 to 20 carbons, an aryl group having 6 to 30 carbons, or a heterocyclyl group having 2 to 30 carbons. For example, the aryl group can be phenyl, biphenyl, naphthalene, anthracene, or phenanthrene, and the heterocyclyl group can be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidone, pyridazine, pyrazine, triazine, indole, benzofuran, quinazoline, or quinoxaline. For example, the substituted fluorenyl group and fluorenylene group can be the monovalent or divalent functional groups of 9,9-dimethyl fluorene, 9,9-diphenyl fluorene, and 9,9'-spirobi[9H-fluorene], respectively.

[0112] The term "heterocyclyl group" used in this application includes not only aromatic rings such as "heteroaryl group" or "heteroarylene group", but also non-aromatic rings. Unless otherwise described, it respectively represents a ring containing one or more hetero atoms and having 2 to 60 carbon atoms, but is not limited thereto. Unless otherwise described, the term "hetero atom" used in this application represents N, O, S, P, or Si, and the heterocyclyl group represents a monocyclic type, cyclic polymer, fused polycyclic system, spiro compound, etc. containing hetero atoms.

[0113] For example, "heterocyclyl group" can also replace the cyclic carbon, including compounds such as those containing hetero atom end groups such as SO2, P=O, etc.

[0114]

[0115] The term "ring" used in this application includes monocyclic and polycyclic rings. Of course, hydrocarbon rings include heterocyclic rings, which contain at least one hetero atom and include aromatic and non-aromatic rings.

[0116] The term "polycyclic" used in this application includes ring assemblies such as biphenyl and terphenyl, fused polycyclic systems, and spiro compounds, including both aromatic and non-aromatic. Of course, hydrocarbon rings include heterocyclic rings, which contain at least one hetero atom.

[0117] The term "cyclo group" used in this application refers to cyclic hydrocarbons other than aromatic hydrocarbons, including monocyclic types, ring assemblies, fused polycyclic systems, spiro compounds, etc. Unless otherwise described, it refers to a ring with 3 to 60 carbon atoms, but is not limited thereto. For example, when a fused aromatic ring benzene and a non-aromatic cyclohexane are combined, it also corresponds to an aliphatic ring.

[0118] Moreover, when using prefixes consecutively, it means that the substituents are arranged in the order of description. For example, aryl alkoxy group means an alkoxy group substituted with an aryl group, alkoxy carbonyl group means a carbonyl group substituted with an alkoxy group, and aryl carbonyl alkenyl group means an alkenyl group substituted with an aryl carbonyl group, where aryl carbonyl group is a carbonyl group substituted with an aryl group.

[0119] Also, in the term "substituted or unsubstituted" used in the present application, unless explicitly described, "substituted" means substituted with one or more substituents selected from the group consisting of deuterium, halogen, amino group, nitrile group, nitro group, C1-C 30 alkyl group, C1-C 30 alkoxy group, C1-C 30 alkyl amine group, C1-C 30 alkyl thiophene group, C6-C 30 arylthiophene group, C2-C 30 alkenyl group, C2-C 30 alkinyl group, C3-C 30 cycloalkyl group, C6-C 30 aryl group, C6-C substituted with deuterium 30 aryl

[0120] group, C8-C 30 aryl alkenyl group, silane

[0121] group, boride group, germanide group, and C2-C 30 heterocyclic group, the C2-C 20 heterocyclic group includes at least one heteroatom selected from the group consisting of O, N, S, Si, and P. And, it is not limited by these substituents.

[0122] In this application, for the 'functional group names' corresponding to the aryl group, arylene group, heterocyclyl group, etc. described in each marker and its substituent examples, either the 'functional group name reflecting the valence' can be recorded, or it can be recorded as the 'name of the parent compound'. For example, 'phenanthrene', as an aryl group, can be classified by valence and the name of the 'group' can be recorded. For example, the monovalent 'group' is recorded as 'phenanthryl (group)', and the divalent 'group' is recorded as 'phenanthrylene (group)', etc. However, it can also be recorded as the name of the parent compound 'phenanthrene' without considering the valence.

[0123] Similarly, pyrimidone can be recorded as 'pyrimidone' without considering the valence, or when it is monovalent, it is recorded as pyrimidinyl (group), and when it is divalent, the 'name of the group' corresponding to the valence can be recorded, such as pyrimidinylene (group), etc. Therefore, in this application, when the type of substituent is recorded as the name of the parent compound, it can represent: an n-valent 'group' formed by the desorption of the hydrogen atom bonded to the carbon atom and / or hetero atom of the parent compound.

[0124] Moreover, in this specification, when recording the compound name or substituent name, the numbers or alphabets indicating the position can be omitted. For example, pyrido[4,3-d]pyrimidone

[0125] (pyrimidone) can be recorded as pyrido pyrimidone, benzofuran[2,3-d]pyrimidone (pyrimidone) can be recorded as benzofuranpyrimidone, 9,9-dimethyl-9H-fluorene can be recorded as dimethylfluorene, etc. Therefore, both benzo[g]quinoxaline and benzo[f]quinoxaline can be recorded as benzo quinoxaline.

[0126] Furthermore, unless otherwise clearly stated, the chemical formulas adopted in this application also apply to the definitions of substituents based on the following exponential definitions of chemical formulas.

[0127]

[0128] When a is an integer of 0, it represents the substituent R 1 does not exist. That is, when a is 0, the carbons forming the benzene ring are all bonded to hydrogen. At this time, the label of the hydrogen bonded to carbon can be omitted, and the chemical formula or compound can be described. And when a is an integer of 1, one substituent R 1 is bonded to any one of the carbons forming the benzene ring. When a is an integer of 2 or 3, its bonding can be as follows. When a is an integer from 4 to 6, a similar method can also be used to bond with the carbons of the benzene ring. When a is an integer of 2 or more, R 1 can be the same or different.

[0129]

[0130] In this application, unless otherwise described, forming a ring means that adjacent groups are bonded to each other to form a single ring or a fused polycyclic ring. The single ring and the formed fused polycyclic ring include not only carbocyclic rings but also heterocyclic rings. The heterocyclic ring contains at least one hetero atom and can include aromatic and non-aromatic rings.

[0131] And in this specification, unless otherwise described, when representing a condensed ring, in 'number-condensed ring', the number represents the number of condensed rings. For example, the form in which three rings are condensed with each other can be represented as 3-condensed ring, such as anthracene, phenanthrene, benzo quinozoline, etc.

[0132] In addition, unless otherwise described, the term "bridged bicyclic compound" used in this application refers to a compound in which two rings share more than three atoms to form a ring. The atoms shared at this time can include carbon or hetero atoms.

[0133] In this application, an organic electrical element means the (several) components between the anode and the cathode, or means an organic light-emitting diode, which includes the anode, the cathode, and the (several) components therebetween.

[0134] Also, depending on the circumstances, the display device of the present application means an organic electro-element, an organic light-emitting diode, and a panel including the same, or an electronic device including a panel and a circuit. Among them, for example, the electronic device includes all lighting devices, solar cells, portable or mobile terminals (such as smartphones, tablets, PDAs, electronic dictionaries, PMPs, etc.), navigation terminals, game consoles, various TVs, various computer monitors, etc., but is not limited thereto, and any form of device can be used as long as it includes the above-mentioned (several) components.

[0135] Hereinafter, implementation examples of the present invention will be described in detail. However, this is for illustrative purposes only, and the present invention is not limited thereto. The present invention is only defined by the scope of the following claims.

[0136] According to an implementation example of the present invention, a composition containing a colorant can be used to prepare a red pattern, a green pattern, a blue pattern, or a black matrix, a pixel defining layer (PDL).

[0137] According to an implementation example of the present invention, the black pixel defining layer (PDL) may further contain an additional colorant in addition to the colorant contained in the colorant, that is, an organic black pigment or a black dye. For example, the organic pigment can be used alone or a combination of an organic pigment and a coloring pigment can be used. The advantage here is that since a coloring pigment with insufficient light-shielding property is mixed, even if the amount of the colorant increases relatively, the strength of the film (layer) or the adhesion to the substrate will not decrease. According to an implementation example of the present invention, the negative pixel defining layer (Negative PDL (Pixel define layer)) may contain an additional colorant, that is, a black pigment or a black dye, instead of the colorant contained in the colorant.

[0138] Hereinafter, each component will be described in detail.

[0139] 1. The preparation process of the negative pixel defining layer is as follows.

[0140] (1) Coating and coating step

[0141] The photosensitive composition is a low-viscosity liquid reagent. After coating on the substrate, a coating layer with a certain thickness is formed using a spin coater or a slot coater. The advantage of the spin coater is that the higher the rotation speed, the thinner the thickness, but the flatness deviation in the area is reduced. In order to form a coating layer on a large-area substrate, compared with the spin coater, preferably, a slot coater is used. However, its disadvantage is that after the coating layer is formed, due to the remaining solvent, the surface shows fluidity, resulting in a decrease in flatness. In order to overcome this disadvantage, VCD (vacuum chamber dry) is used to locally remove the solvent to reduce the surface fluidity.

[0142] (2) Pre-baking step

[0143] In this process, at a certain temperature and for a certain period of time, the substrate with the coating is heated using a hot plate or an oven to locally remove the solvent contained in the coating film. If the surface or the depth of the coating film is not dry, it will cause photomask contamination when exposure is carried out in the next process. When ultraviolet light is irradiated, the exposed part will not be cured properly. If it is not cured, it will lead to the failure to form and remove the pattern in the developing process.

[0144] (3) Exposure step

[0145] At the end of the pre-baking process, this process uses a patterned photomask to irradiate actinic rays (ultraviolet rays) to cure the formed film. The types of lamps that generate actinic rays include LED lamps or metal (mercury) lamps. The wavelengths are g-line (436 nm), h-line (405 nm), i-line (365 nm), Deep UV (<260 nm), and they can be used separately or in combination.

[0146] (4) Developing step

[0147] When actinic rays are irradiated in the exposure step, the photomask divides it into an exposed part and a non-exposed part. In the case of the positive type, the exposed part is dissolved by the developer, while the non-exposed part resists the developer and leaves a pattern. In the case of the negative type, the exposed part is cured and is resistant to the developer, while the non-exposed part is developed. The black pixel defining layer (Black PDL) prepared using the composition containing the colorant of the present invention is of the negative type and can be divided into an exposed part (cured) and a non-exposed part (developed) to form a pattern.

[0148] (5) Post-exposure step

[0149] This process does not use a photomask and uses actinic rays (ultraviolet rays) to irradiate the developed substrate to further cure the developed film to enhance the strength of the film. The types of lamps that generate actinic rays include LED lamps or metal (mercury) lamps. The wavelengths are g-line (436 nm), h-line (405 nm), i-line (365 nm), Deep UV (<260 nm), and they can be used separately or in combination.

[0150] (6) Post-baking treatment step

[0151] In this process, the developed substrate is heated at a high temperature of 210 °C or above to remove the remaining solvent and fume. If the solvent and fume are not completely removed, after the post-baking treatment, the degassing generated in the process will affect the components, thereby causing black spots or affecting pixel shrinkage.

[0152] 2. The composition for forming a negative pixel defining layer containing a colorant is as follows.

[0153] (1) Resin for pattern formation

[0154] According to an embodiment of the present invention, the resin for pattern formation may include an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0155] The acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin including one or more acrylic repeating units.

[0156] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing one or more carboxyl groups, and specific examples thereof include: acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof. In the total amount of the acrylic binder resin, the content of the first ethylenically unsaturated monomer may be 5% by weight to 50% by weight, for example, 10% by weight to 40% by weight.

[0157] The second ethylenically unsaturated monomer may be an aromatic vinyl compound such as styrene, α-methylstyrene, vinyltoluene, vinylbenzyl methyl ether, etc.; an unsaturated carboxylic acid ester compound such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, etc.; an unsaturated carboxylic acid aminoalkyl ester compound such as 2-aminoethyl (meth)acrylate, 2-dimethylaminoethyl (meth)acrylate, etc.; a carboxylic acid vinyl ester compound such as vinyl acetate, etc.; an unsaturated carboxylic acid glycidyl ester compound such as glycidyl (meth)acrylate, etc.; a vinyl cyanide compound such as (meth)acrylonitrile, etc.; an unsaturated amide compound such as (meth)acrylamide, etc., and these may be used alone or in combination of two or more.

[0158] Specific examples of the acrylic binder resin include: (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, etc., but are not limited thereto. These may also be used alone or in combination of two or more. The weight average molecular weight of the acrylic binder resin may be 3,000 g / mol to 150,000 g / mol, for example, it may be 5,000 g / mol to 50,000 g / mol, for example, it may be 20,000 g / mol to 30,000 g / mol.

[0159] The cardo resin includes a repeating structure represented by the following Chemical Formula 1.

[0160] <Chemical Formula 1>

[0161]

[0162] In the Chemical Formula 1,

[0163] 1) R 1 and R 2 are each independently: hydrogen; deuterium; halogen; an aryl group having 6 to 30 carbon atoms; a heterocyclyl group having 2 to 30 carbon atoms and containing at least one hetero atom selected from O, N, S, Si, and P; a cyclo group which is a fused ring group of an aliphatic ring and an aromatic ring having 6 to 30 carbon atoms; an alkyl group having 1 to 20 carbon atoms; an alkenyl group having 2 to 20 carbon atoms; an alkynyl group having 2 to 20 carbon atoms; an alkoxy group having 1 to 20 carbon atoms; an aryloxy group having 6 to 30 carbon atoms; a fluorenyl group; a carbonyl group; an ether group; or an alkoxy carbonyl group having 1 to 20 carbon atoms,

[0164] 2) R 1 and R 2 may form a ring between adjacent groups,

[0165] 3) m or n is each independently an integer from 0 to 4,

[0166] 4) A1 and A2 are each independently the following Chemical Formula 2 or Chemical Formula 3,

[0167] <Chemical Formula 2>

[0168]

[0169] <Chemical Formula 3>

[0170]

[0171] In Chemical Formula 2 and Chemical Formula 3,

[0172] (4-1)* represents the connecting position,

[0173] (4-2) R 3 ~R 6 are independently: hydrogen; deuterium; halogen; aryl group of C6~C 30 heterocyclyl group of C2~C containing at least one hetero atom selected from O, N, S, Si and P; cyclo group of fused aliphatic ring and aromatic ring of C6~C 30 alkyl group of C1~C 30 alkenyl group of C2~C 20 alkinyl group of C2~C 20 alkoxy group of C1~C 20 aryloxy group of C6~C 20 fluorenyl group; carbonyl group; ether group; or alkoxy carbonyl group of C1~C 30 20 20 20

[0174] (4-3) R 3 ~R 6 may form a ring between adjacent groups,

[0175] (4-4) Y 1 and Y 2 are independently the following Chemical Formula 6 or Chemical Formula 7,

[0176] <Chemical Formula 6>

[0177]

[0178] <Chemical Formula 7>

[0179]

[0180] In Chemical Formula 6 and Chemical Formula 7,

[0181] (4-4-1)* represents the bonding position,

[0182] (4-4-2) R 9 is hydrogen or methyl ester;

[0183] 4-4-3)R 10 ~R 13 Each independently is: hydrogen; deuterium; halogen; an aryl group having 6 to 30 carbon atoms; a heterocyclyl group having 2 to 30 carbon atoms and containing at least one hetero atom selected from O, N, S, Si and P; a fused cyclo group of an aliphatic ring and an aromatic ring having 6 to 30 carbon atoms; an alkyl group having 1 to 20 carbon atoms; an alkenyl group having 2 to 20 carbon atoms; an alkynyl group having 2 to 20 carbon atoms; an alkoxy group having 1 to 20 carbon atoms; an aryloxy group having 6 to 30 carbon atoms; a fluorenyl group; a carbonyl group; an ether group; or an alkoxycarbonyl group having 1 to 20 carbon atoms,

[0184] 4-4-4)L 1 ~L 3 Each independently is: a single bond; a fluorenylene group; an alkylene having 2 to 30 carbon atoms; an arylene having 6 to 30 carbon atoms; a heterocycle having 2 to 30 carbon atoms; an alkoxylene having 1 to 30 carbon atoms; an alkyleneoxy having 2 to 30 carbon atoms; an aryloxy group having 6 to 30 carbon atoms; a polyethyleneoxy group having 2 to 30 carbon atoms,

[0185] 4-4-5)q and r are each independently an integer from 0 to 3; provided that q + r = 3,

[0186] 5) The resin includes a repeating unit represented by Chemical Formula 1, and in the polymer chain, the ratio of A1 and A2 is from 9:1 to 1:9,

[0187] 6)X1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following Chemical Formula 4; or Chemical Formula 5,

[0188] 6-1) R' and R" are each independently: hydrogen; deuterium; halogen; C6-C 30 aryl group; C2-C containing at least one hetero atom selected from O, N, S, Si and P 30 heterocyclyl group; C6-C 30 fused cyclo group of an aliphatic ring and an aromatic ring; C1-C 20 alkyl group;

[0189] C2-C 20 alkenyl group; C2-C 20 alkinyl group; C1-C 20 alkoxy group; C6-C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C 20 alkoxy carbonyl group,

[0190] 6-2) R' and R" may form a ring between adjacent groups,

[0191] <Chemical Formula 4>

[0192]

[0193] <Chemical Formula 5>

[0194]

[0195] In the said Chemical Formula 4 and Chemical Formula 5,

[0196] 6-3) * represents the bonding position,

[0197] 6-4) R 7 ~R 8 are each independently: hydrogen; deuterium; halogen; C6-C 30 aryl group; C2-C containing at least one hetero atom selected from O, N, S, Si and P30 heterocyclyl group; C6-C 30 fused cyclo group of aliphatic ring and aromatic ring; C1-C 20 Alkylgroup;

[0198] C2-C 20 alkenyl group; C2-C 20 alkinyl group; C1-C 20 alkoxy group; C6-C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C 20 alkoxy carbonyl group,

[0199] 6-5) o and p are each independently an integer from 0 to 4,

[0200] 7) X 2 is C6-C 30 aryl group; C2-C containing at least one heteroatom selected from O, N, S, Si and P 30 heterocyclyl group; C6-C 30 fused cyclo group of aliphatic ring and aromatic ring; C1-C 20 Alkyl group; C2-C 20 alkenyl group; C2-C 20 alkinyl group; C1-C 20 alkoxy group; C6-C 30 aryloxygroup; fluorenylene group; carbonyl group; ether group; or C1-C 20 alkoxy carbonyl group,

[0201] 8) said R', R", X 2 、L 1 ~L 3 、R1 ~R 8 and R 10 ~R 13 may each be further substituted with one or more substituents selected from the group consisting of: deuterium; halogen; a silyl group of a C1-C 30 alkyl group or a C6-C 30 aryl group; a siloxane group; a boron group; a germanium group; a cyano group; an amino group; a nitro group; a C1-C 30 alkylthio group; a C1-C 30 alkoxy group; a C6-C 30 arylalkoxy group; a C1-C 30 alkyl group; a C2-C 30 alkenyl group; a C2-C 30 alkynyl group; a C6-C 30 aryl group; a C6-C 30 aryl group substituted with deuterium; a fluorenyl group; a C2-C 30 heterocyclyl group containing at least one hetero atom selected from the group consisting of O, N, S, Si, and P; a C3-C 30 aliphatic ring group; a C7-C 30 arylalkyl group; a C8-C 30 arylalkenyl group; and combinations thereof, and rings may be formed between adjacent substituents.

[0202] When the R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 are an aryl group, preferably, it may be a C6-C 30The aryl group, more preferably, can be C6-C 18 The aryl group, for example, can be phenyl, biphenyl, naphthyl, terphenyl, etc.

[0203] When the R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 is a heterocyclyl group, preferably, can be C2-C 30 The heterocyclyl group, more preferably, can be C2-C 18 The heterocyclyl group, for example, can be dibenzo furan, dibenzothiophen, naphtho benzo thiophen, naphtho benzofuran, etc.

[0204] The R', R", R 1 ~R 8 and R 10 ~R 13 is a fluorenyl group, preferably, can be 9,9-dimethyl-9H-fluorene, 9,9-diphenyl-9H-fluorenyl group, 9,9'-spirobi fluorene, etc.

[0205] The L 1 ~L 3 is an arylene group, preferably, can be C6-C 30 The arylene group, more preferably, can be C6-C 18 The arylene group, for example, can be phenyl, biphenyl, naphthyl, terphenyl, etc.

[0206] The R', R", X 2 , R 1 ~R8 and R 10 ~R 13 When it is an alkyl group, preferably, it can be a C1-C 10 alkyl group, for example, it can be methyl, t-butyl, etc.

[0207] Said R', R", X 2 , R 1 ~R 8 and R 10 ~R 13 When it is an alkoxy group, preferably, it can be a C1-C 20 alkoxy group, more preferably, it can be a C1-C 10 alkoxy group, for example, it can be methoxy, t-butoxy, etc.

[0208] Said R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 The ring formed by bonding between adjacent groups of 60 can be a C6-C 60 aromatic ring group; fluorenyl group; a C2-C 60 heterocyclyl group containing at least one hetero atom selected from O, N, S, Si and P; or a C3-C 20 aliphatic ring group, for example, when an aromatic ring is formed by bonding between adjacent groups, preferably, it can form a C6-C 14 aromatic ring, more preferably, it can form a C6-C

[0209] For example, the cardo resin can be prepared by mixing two or more of the following components: fluorene-containing compounds such as 9,9-bis(4-vinyloxymethoxyphenyl)fluorene; anhydride compounds such as pyromellitic dianhydride, naphthalene tetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, benzophenone tetracarboxylic dianhydride, pyromellitic dianhydride, cyclobutane tetracarboxylic dianhydride, perylene tetracarboxylic dianhydride, tetrahydrofuran tetracarboxylic dianhydride, and tetrahydrophthalic anhydride; glycol compounds such as ethylene glycol, propylene glycol, and polyethylene glycol; ethanol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; solvent compounds such as propylene glycol monomethyl ether acetate and N-methylpyrrolidone; phosphorus compounds such as triphenylphosphine; and ammonium or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylammonium, triethylammonium, tributylammonium, and benzyltriethylammonium chloride.

[0210] The weight average molecular weight of the cardo resin is 1,000 to 100,000 g / mol. Preferably, it can be 1,000 to 50,000 g / mol. More preferably, it can be 1,000 to 30,000 g / mol. When the weight average molecular weight of the resin is within the above range, no residue is generated during the preparation of the light-shielding layer, the pattern formation effect is good, and there is no film thickness loss during development, and good patterns can be obtained. In the total amount of the photosensitive resin composition, the content of the resin is 1 to 30% by weight. More preferably, the content can be 3 to 20% by weight. When the content of the resin is within the above range, excellent sensitivity, developability, and adhesiveness (tight adhesion) can be obtained.

[0211] (2) Reactive unsaturated compound

[0212] The reactive unsaturated compound is an essential component for negative patterns and has ethylenic unsaturated double bonds. Therefore, during the exposure in the pattern formation process, sufficient polymerization can be initiated to form patterns with excellent heat resistance, light resistance, and chemical resistance.

[0213] Specific examples of the reactive unsaturated compound include: ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, trimethylolpropane triacrylate, tripentaerythritol octaacrylate, etc.

[0214] Commercially available products of the reactive unsaturated compound are as follows.

[0215] For example, the difunctional esters of (meth)acrylic acid include: aronyx M-210, M-240, M-6200, etc. of Toagosei Co., Ltd.; KAYARAD HDDA, HX-220, R-604, etc. of Nippon Kayaku Co., Ltd.; V-260, V-312, V-335HP, etc. of Osaka Organic Chemical Industry Co., Ltd.

[0216] For example, the trifunctional esters of (meth)acrylic acid include: aronyx M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060, etc. of Toagosei Co., Ltd.; KAYARAD TMPTA, DPCA-20, DPCA-60, DPCA-120, etc. of Nippon Kayaku Co., Ltd.; V-295, V-300, V-360, etc. of Osaka Organic Chemical Industry Co., Ltd.

[0217] The above products can be used alone or in combination of two or more.

[0218] In order to have more excellent developability, the reactive unsaturated compound can be used after being treated with an acid anhydride. In the total amount of the photosensitive resin composition, the content of the reactive unsaturated compound can be 1 to 40% by weight, for example, it can be 1 to 20% by weight. When the content of the reactive unsaturated compound is included within the above range, sufficient curing is initiated during exposure in the pattern formation process, and thus, the reliability is excellent, and the pattern has excellent heat resistance, light resistance and chemical resistance, as well as excellent clarity and tightness.

[0219] (3) Photoinitiator

[0220] In order to present a negative pattern by a lithography machine, a photo radical initiator needs to be used. The photoinitiator has a molar absorption coefficient of 10,000 (L / mol·cm) or more in the region of 330 to 380 nm, and the temperature at which the photoinitiator undergoes a 5% weight loss is 270 °C or less. Among them, the molar absorption coefficient can be calculated by the beer-Lambert Law. And, using TGA, the temperature was raised to 300 °C at a rate of 5 °C per minute in a nitrogen atmosphere, and the weight loss was detected.

[0221] The photopolymerization initiator is usually used in the photosensitive resin composition. For example, acetophenone-based compounds, benzophenone-based compounds, thioxanthone-based compounds, benzoin-based compounds, triazine-based compounds, etc. can be used.

[0222] For example, the acetophenone compounds include: 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyltrichloroacetophenone, p-t-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one, etc.

[0223] For example, the benzophenone compounds include: benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

[0224] For example, the thioxanthone compounds include: thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, etc.

[0225] For example, the benzoin compounds include: benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, etc.

[0226] For example, the triazine compounds include: 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-4-trichloromethyl(piperonyl)-6-triazine, 2-4-trichloromethyl(4'-methoxystyryl)-6-triazine, etc.

[0227] In addition to the compounds, the photoinitiator can also be a carbazole compound, a diketone compound, a borate sulfonium compound, a diazo compound, an imidazole compound, a non-imidazole compound, etc.

[0228] The photoinitiator, as a free radical polymerization initiator, can be a peroxide compound, an azo compound, etc.

[0229] For example, the peroxide compounds include: peroxide ketones such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methyl cyclohexanone peroxide, acetylacetone peroxide; peroxide diacyls such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, bis(3,5,5-trimethylhexanoyl) peroxide; hydroperoxides such as 2,4,4-trimethylpentan-2-yl hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide, t-butyl hydroperoxide; dialkyl peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, 1,3-bis(t-butoxyisopropyl)benzene, n-butyl t-butylperoxyvalerate; alkyl succinate esters such as 2,4,4-trimethylpentyl phenoxyacetate peroxide, α-cumyl neodecanoate peroxide, t-butylperoxybenzoic acid, di-t-butylperoxytrimethyladipic acid; percarbonates such as bis(3-methoxybutyl) peroxydicarbonate, bis(2-ethylhexyl) peroxydicarbonate, bis(4-t-cyclohexyl) peroxydicarbonate butyl, diisopropyl peroxydicarbonate, acetyl cyclohexylsulfonyl peroxide, t-aryl carbonate butyl peroxide, etc.

[0230] For example, the azo compounds include: 1,1'-azobis(cyclohexane-1-carbonitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(isobutyronitrile methyl ester), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), α,α'-azobis(isobutyronitrile), 4,4'-azobis(4-cyanovaleric acid), etc.

[0231] After the photoinitiator absorbs light and undergoes a transition to the excited state, it transfers its energy and is thus used together with a photosensitizer that undergoes a chemical reaction. For example, the photosensitizers include: tris(2-carboxyethyl)phosphine, pentaerythritol tetrakis(3-mercaptopropionate), dipentaerythritol tetrakis(3-mercaptopropionate), etc.

[0232] In the total amount of the photosensitive composition, the content of the photoinitiator can be 0.01 to 10% by weight, for example, it can be 0.1 to 5% by weight. When the content of the photoinitiator is within this range, sufficient curing is initiated during exposure in the pattern formation process. Therefore, the reliability is excellent, and the heat resistance, light resistance, and chemical resistance of the pattern are excellent, and the clarity and adhesion are also excellent. In addition, a decrease in transmittance caused by unreacted initiators can be prevented.

[0233] (4) Colorant

[0234] Both organic pigments, inorganic pigments and dyes can be used as the colorant.

[0235] The colorant can be a red pigment, a green pigment, a blue pigment, a yellow pigment, a black pigment, etc.

[0236] For example, the red pigments include: C.I. Pigment Red 254, C.I. Pigment Red 255, C.I. Pigment Red 264, C.I. Pigment Red 270, C.I. Pigment Red 272, C.I. Pigment Red 177, C.I. Pigment Red 89, etc.

[0237] For example, the green pigments include: copper phthalocyanine pigments substituted with halogen, such as, C.I. Pigment Green 36, C.I. Pigment Green 7, etc.

[0238] For example, the blue pigments include: copper phthalocyanine pigments such as C.I. Pigment Blue 15:6, C.I. Pigment Blue 15, C.I. Pigment Blue 15:1, C.I. Pigment Blue 15:2, C.I. Pigment Blue 15:3, C.I. Pigment Blue 15:4, C.I. Pigment Blue 15:5, C.I. Pigment Blue 16, etc.

[0239] For example, the yellow pigments include: isoindoline-based pigments such as C.I. Pigment Yellow 139, quinophthalone-based pigments such as C.I. Pigment Yellow 138, nickel complex pigments such as C.I. Pigment Yellow 150, etc.

[0240] For example, the black pigments include: lactam black, aniline black, perylene black, titanium black, carbon black, etc.

[0241] Moreover, according to the examples, the colorant in the photosensitive resin composition can include pigments, dyes or a combination thereof. For example, the dyes can include phthalocyanine-based compounds.

[0242] The above components can be used alone or in combination of two or more as the pigments and dyes, and there is no limitation here.

[0243] The black pigment in the above components can be used to effectively implement light shielding for the light shielding layer. When using the black pigment, it can also be used together with color adjustment and repair agents such as anthraquinone-based pigments, perylene-based pigments, phthalocyanine-based pigments, azo-based pigments, etc.

[0244] To disperse the pigment in the photosensitive resin composition, a dispersant can be used together. Specifically, the pigment can be used after surface pretreatment with a dispersant, or a dispersant can be added together with the pigment when preparing the photosensitive resin composition and then used.

[0245] The dispersant can be a nonionic dispersant, an anionic dispersant, a cationic dispersant, etc. Specific examples of the dispersant include: polyalkylene glycol and its esters, polyoxyalkylene, polyoxyalkylene polyol ester adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonates, carboxylic acid esters, carboxylates, polyoxyalkylene alkylamide adducts, alkyl amines, etc., and these can be used alone or in combination of two or more.

[0246] Commercially available products of the dispersant, for example, DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc. of BYK company; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc. of EFKA Chemical company; Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse17000, Solsperse20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, etc. of Zeneka company; or PB711, PB821, etc. of Ajinomoto company.

[0247] In the total amount of the photosensitive resin composition, the content of the dispersant can be 0.1 wt% to 15 wt%. When the content of the dispersant is within the above range, the dispersibility of the composition is excellent, and accordingly, when preparing the light-shielding layer, the stability, developability and patternability are excellent.

[0248] The pigment can also be pre-treated with a water-soluble inorganic salt and a wetting agent before use. When the pigment is used after the pre-treatment, the average particle size of the pigment can be refined.

[0249] The pretreatment is achieved by kneading the pigment together with a water-soluble inorganic salt and a wetting agent; and then filtering and washing the pigment obtained in the kneading step.

[0250] The kneading may be performed at a temperature of 40° C. to 100° C., and the filtering and washing may be performed by washing the inorganic salt with water or the like and filtering.

[0251] For example, the water-soluble inorganic salts include sodium chloride, potassium chloride, etc., but are not limited thereto.

[0252] The wetting agent uniformly mixes the pigment and the water-soluble inorganic salt, thereby playing the role of a medium that makes the pigment easy to crush. For example, the wetting agent includes: alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, and diethylene glycol monomethyl ether; alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, and glycerin polyethylene glycol, and the like. These can be used alone or in combination of two or more.

[0253] The pigment subjected to the kneading step may have an average particle size of 20 nm to 110 nm. When the average particle size of the pigment is within the above range, not only heat resistance and light resistance are excellent, but also a fine pattern can be effectively formed.

[0254] The content of the pigment in the total amount of the photosensitive resin composition may be 1% to 40% by weight, more specifically, 2% to 30% by weight. When the pigment is included within the above range, the color reproduction rate is excellent, and the curability and adhesion of the pattern are also excellent.

[0255] (5) Solvent

[0256] The solvent is compatible with the cardo resin, the reactive unsaturated compound, the pigment, the cardo compound, and the initiator, and substances that do not react can be used.

[0257] For example, the solvents include: alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisopentyl ether, anisole, and tetrahydrofuran; ethylene glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; ethylene glycol ethyl ether acetates such as methoxyethyl acetate, ethoxyethyl acetate, and diethoxyethyl acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-dipentyl ketone, and 2-heptanone; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; lactate esters such as methyl lactate and ethyl lactate; oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, methyl oxyacetate, and butyl oxyacetate; alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, and ethyl ethoxyacetate; 3-oxopropionic acid alkyl esters such as methyl 3-oxopropionate and ethyl 3-oxopropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-oxopropionic acid alkyl esters such as methyl 2-oxopropionate, ethyl 2-oxopropionate, and propyl 2-oxopropionate; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate; 2-oxy-2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate; 2-alkoxy-2-methylpropionic acid alkyl esters such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl glycolate, and methyl 2-hydroxy-3-methylbutanoate; keto acid esters such as ethyl pyruvate, etc.

[0258] Furthermore, high-boiling solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, hexanoic acid, octanoic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, ethylene glycol phenyl ether acetate can be used.

[0259] Considering the compatibility and reactivity of the solvents, ethylene glycol ethers such as ethylene glycol monoethyl ether can be used; ethylene glycol alkoxyacetates such as ethoxyethyl acetate; ethers such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate.

[0260] In the total amount of the photosensitive resin composition, the solvent can be included as the balance. Specifically, the content can be 40 to 90% by weight. When the content of the solvent is within the above range, the photosensitive resin composition can have an appropriate viscosity, thereby achieving excellent processability when preparing a pattern layer.

[0261] (6) Other additives

[0262] In order to prevent streaks or spots from appearing, improve the leveling performance, and prevent residues from being generated without development when coating the photosensitive composition, additives such as malonic acid; 3-amino-1,2-propanediol; a silane coupling agent containing a vinyl group or (meth)acryloxy group; a leveling agent; a fluorine-based surfactant; a radical polymerization initiator can be further included.

[0263] For example, in order to improve the adhesion to a substrate, etc., the photosensitive resin composition can further include a silane coupling agent having reactive substituents such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group, and an epoxy group.

[0264] For example, the silane coupling agents include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, etc., and these can be used alone or in combination of two or more.

[0265] In 100 parts by weight of the photosensitive resin composition, the parts by weight of the silane coupling agent may be from 0.01 part by weight to 10 parts by weight. When the parts by weight of the silane coupling agent are within the said range, the adhesion and storage stability are excellent, etc.

[0266] Furthermore, the photosensitive resin composition may further contain a surfactant as needed, for example, a fluorine-based surfactant, and this surfactant has the effect of improving coatability and preventing defects.

[0267] As the fluorine-based surfactant, the following commercially available fluorine-based surfactants may be used: BM- of BM Chemie GmbH BM- etc.; Armor Guard F of Dainippon Ink and Chemicals, Inc. same F same F same F etc.; Fluorad FC- of Sumitomo 3M Limited same FC- same FC- same FC- etc.; Saffron S- of Asahi Glass Co., Ltd. same S- same S- same S- same etc.; SH- of Toray Silicone Co., Ltd. same- same- SZ- SF- etc.

[0268] In 100 parts by weight of the photosensitive resin composition, the parts by weight of the surfactant may be from 0.001 part by weight to 5 parts by weight. When the parts by weight of the surfactant are within the said range, the coating uniformity can be ensured, no scars will occur, and the wettability of the glass substrate is excellent. Furthermore, the photosensitive resin composition may add a certain amount of other additives such as antioxidants and stabilizers within the range that does not damage the physical properties.

[0269] Another implementation example may utilize the photosensitive resin composition to form a pattern in the pixel isolation part of the organic light-emitting element electrode.

[0270] Hereinafter, the synthesis examples and the examples of the present invention will be specifically described, however, the synthesis examples and the examples of the present invention are not limited thereto.

[0271] (Preparation of black photosensitive composition)

[0272] Synthesis Example 1: Preparation of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene (represented by Chemical Formula 8)

[0273] 20 g of 9,9'-biphenol fluorene (Sigma aldrich), 8.67 g of epichlorohydrin (Sigma aldrich), 30 g of anhydrous potassium carbonate, and 100 ml of dimethylformamide were poured into a 300 ml three-necked round-bottom flask equipped with a distillation tube. The temperature was raised to 80 °C and the reaction was carried out for 4 hours. Then, the temperature was lowered to 25 °C, and the reaction solution was filtered. Then, the filtrate was stirred and dropped into 1000 ml of water, and the precipitated powder was filtered. Then, it was washed with water and dried under reduced pressure at 40 °C to obtain 25 g of 9,9-bis(4-(glycidyloxy)phenyl)fluorene (9,9-Bis[4-

[0274] (glycidyloxy)phenyl]fluorene) represented by the following Compound 8. The purity of the obtained powder was analyzed by HPLC, and as a result, the purity was 98%.

[0275] <Chemical Formula 8>

[0276]

[0277] Synthesis Example 2: Preparation of a cardo-based binder resin

[0278] 25 g (54 mmol) of the compound obtained in Synthesis Example 1, 8 g of acrylic acid (Daiichi Kigenso Kagaku Kogyo Co., Ltd.), 0.2 g of benzyl triethylammonium chloride (Daiichi Kigenso Kagaku Kogyo Co., Ltd.), 0.2 g of hydroquinone (Daiichi Kigenso Kagaku Kogyo Co., Ltd.), and 52 g of propylene glycol monomethyl ether acetate (Sigma aldrich) were poured into a 300 ml three-necked round-bottom flask equipped with a distillation tube and stirred at 110 °C for 6 hours. After the reaction was completed, 8 g of biphenyltetracarboxylic dianhydride (Mitsubishi Gas) and 1.8 g of tetrahydrophthalic acid (Sigma aldrich) were further poured in, and then stirred at 110 °C for 6 hours. After the reaction was completed, the reaction solution was recovered and analyzed. As a result, a cardo-based binder resin with a molecular weight of 4,580 and a solid powder content of 45% was obtained.

[0279] Preparation Example 1: Preparation of a black pigment dispersion

[0280] Using a paint shaker (Asada Co.), 15 g of Irgaphor Black S100CF (black pigment / BASF Co.), 8.5 g of Disperbyk 163 (BYK Co.), 6.5 g of SR-3613 (SMS Co.), 70 g of propylene glycol methyl ether acetate, and 100 g of zirconia beads with a diameter of 0.5 mm (Toray Co.) were dispersed for 10 hours to obtain a dispersion.

[0281] A photosensitive composition was prepared using the components in Table 1 below.

[0282] Specifically, an initiator was dissolved in a solvent, and then stirred at room temperature. A binder resin and a polymerizable compound were added thereto and stirred at room temperature. Then, a colorant and other additives were added to the obtained reaction product and stirred at room temperature. Next, the product was filtered three times to remove impurities, and a photosensitive resin composition was prepared.

[0283]

Table 1

[0284] Component ratio (%) Black pigment dispersion (Preparation Example 1) <![CDATA 23 > Cardo binder (Synthesis Example 2) <![CDATA 15 > Miramer M600 (Miwon Chemical Co., Ltd.) <![CDATA 12.5 > PBG-304 (Tronly) <![CDATA 0.5 > Propylene glycol methyl ether acetate <![CDATA 49 >

[0285] The method for preparing a negative pixel definition layer (negative PDL) using the photosensitive composition is as follows.

[0286] (1) Coating and coating step

[0287] On a 10 cm * 10 cm substrate that was cleaned and metal-evaporated, the photosensitive composition was coated with a constant thickness using a spin coater, and then part of the solvent was removed using a vacuum drying chamber (VCD, vacuum chamber dry) to form a coating film. The thickness of the film formed after the coating of the photosensitive composition passed through the VCD was 3.5 to 3.3 microns.

[0288] (2) Pre-baking step

[0289] On a hot plate, it was heated at 80 °C to 150 °C, preferably at 90 °C to 120 °C, for 60 seconds to 180 seconds, preferably for 100 seconds to 150 seconds, in order to remove the solvent contained in the obtained coating film. This process removes a certain amount of solvent so as to reduce mask contamination of the pixel pattern when performing the next process (exposure) step and prepare a clean pattern.

[0290] (3) Exposure step

[0291] On the obtained coating film, a mask with a given pattern is interposed to form a desired pattern and a certain thickness. Then, actinic rays of 190 nm to 600 nm are irradiated by an exposure machine. Preferably, a metal or LED light source with ghi-line can be irradiated to form a pattern. The exposure dose for forming the pattern is 20 to 350 mJ / cm 2 , preferably, 70 mJ / cm 2 to 140 mJ / cm 2 , more preferably, 80 mJ / cm 2 to 110 mJ / cm 2 , a negative-type photosensitive resist material. The transmittance of the photomask used during exposure has a three-segment transmittance, that is, 0% (non-exposed part), 20 to 50% (Half-tone), and 100% (Full-tone), and a pattern is formed.

[0292] (4) Development step

[0293] After performing the exposure step, then, by the dipping method, using a 2.38 wt% TMAH (tetramethylammonium hydroxide) developer, develop for a certain time (minutes) at 23 ± 2 °C, and then rinse with deionized water (DI water) to dissolve and remove the unexposed part, leaving only the exposed part to form an image pattern. The thickness of the coating film is 1.30 to 1.95 μm when based on Half-tone, and 3.20 to 3.40 μm when based on Full-tone.

[0294] (5) Post-exposure step

[0295] Following the development step, in order to prevent pattern disintegration after post-baking treatment, instead of using a photomask, an exposure machine is used to irradiate the entire area with actinic rays of 190 nm to 600 nm, preferably, a metal or LED light source with ghi-line, to improve the strength of the coating film. The exposure dose for improving the strength is 50 to 1,000 mJ / cm 2 .

[0296] (6) Post-baking treatment step

[0297] In order to obtain the image pattern obtained through the development, perform post-baking treatment in an oven at 210 to 300 °C, preferably, at 230 to 270 °C. The post-baking treatment time is 30 minutes to 120 minutes, preferably, perform 60 minutes to 120 minutes to completely remove the solvent, cure the pattern to form a film, and then, the outgassing amount is detected.

[0298] After performing the post-baking treatment step, the thickness of the half-tone is 1.00 to 1.90 μm. Preferably, the thickness of the Full-tone is 2.80 to 3.20 μm.

[0299] (7) Degassing detection

[0300] Using a photosensitive composition, a pattern was formed on a substrate through the above steps (1), (2), (3), (4), (5) and (6). Then, the degassing of an area of 10 cm x 10 cm was detected. The coating thickness was 2.80 to 3.20 μm after film formation by post-baking, and the weight of the photosensitive composition coated on a 10 cm x 10 cm substrate and post-baked was 11 to 12 g. Using JTD-5052 of JAI Corporation, the degassing of the substrate was trapped at 250 °C, and the degassing trapping time was 30 minutes. Using QP2020 GC / MS of Shimadzu Corporation, toluene black samples (5, 10, 50 ppm) were detected, and then a calibration curve was prepared, and the degassing generation amount of the trapped samples was amplified and detected. Products made by changing process conditions such as the development time and temperature of the development step, the heating temperature and heat treatment time of the post-baking treatment step, etc. were used as samples, and the degassing detection amounts detected separately were compared.

[0301] (7) Element reliability evaluation

[0302] When comparing the degassing detection amounts, the minimum and maximum degassing detection amounts of each process condition were confirmed, and a pattern substrate of a pixel define layer (PDL) was formed according to each condition. Then, in order to perform the evaluation of element reliability, an organic material was evaporated, and reliability inspection elements such as high-temperature driving, pixel shrinkage, and dark spots were confirmed.

[0303] (8) Method for detecting smoke generation amount

[0304] In the method for preparing a negative pixel define layer (negative PDL) using the photosensitive composition, a film formation of 3.20 to 3.40 μm was achieved by performing the development step, and the degassing detection amount of this step was confirmed. Then, after performing the post-baking treatment, the degassing detection amount detected for the film formation of 2.80 to 3.20 μm was subtracted, and the smoke generation amount of the post-baking treatment process was confirmed.

[0305] (Preparation of element substrate)

[0306] As Figures 1 to 7 shown, for the OLED element substrate, on the glass surface, with ITO -Ag -ITO A substrate for evaluation is obtained by forming an electrode with the thickness of . The substrate for evaluation includes: a negative pixel defining layer formed by coating, exposing, developing, and post-baking on the electrode with a composition containing a colorant. The physical properties of the substrate for evaluation are as follows: when detected with a UV-Vis Spectrometer, the reflectivity at 550 nm reaches more than 95%, and when the surface roughness of is detected with an Atomic Force Microscope (AFM), it reaches below 2 nm.

[0307]

Table 2

[0308]

[0309] The amount of fume and out-gas generated before and after the post-baking treatment step of the substrate was detected and compared. Referring to Comparative Examples 1 to 3 in Table 2, even if the post-baking treatment temperature is low and the post-baking treatment time increases, the amount of fume generated is below 98 ppm. Thus, it can be confirmed that the amount of out-gas after the post-baking treatment is above 40 ppm. It was confirmed that when the amount of out-gas after the post-baking treatment increases, as Figure 1 shown, out-gas occurs during element driving, causing black spots. Referring to Comparative Examples 4 to 6, when the post-baking treatment temperature exceeds 300 °C, although the content of fume and out-gas decreases, it can be seen from the reliable element images below that the pixel defining layer (PDL) cannot withstand high temperatures (320 °C), and due to further out-gas occurring during element driving, pixel shrinkage occurs. It was confirmed that the longer the placement at high temperatures (60 minutes, 120 minutes), the more serious this pixel shrinkage phenomenon becomes.

[0310] The above description merely exemplifies the present invention. Those of ordinary skill in the art in the technical field to which the present invention pertains can make various modifications without departing from the essential characteristics of the present invention.

[0311] Therefore, the embodiments disclosed in this specification are used to describe the present invention, not to limit the present invention. The idea and scope of the present invention are not limited by such embodiments. The scope of the claims of the present invention should be interpreted according to the appended claims, and should be interpreted to include all technologies within the equivalent scope falling within the scope of the claims of the present invention.

Claims

1. A method for preparing a pixel defining layer, characterized in that: The invention comprises the steps of: coating and coating a photosensitive composition; pre-baking; exposure; development; post-exposure; and post-baking, wherein the transmittance of the photomask is divided into three sections, namely, 0% (non-exposed part), 20 to 50% (half-tone) and 100% (full-tone), more than one layer is formed through one exposure and development process, and the post-baking treatment step is carried out at an oven temperature of 210° C. to 300° C. for 30 minutes to 120 minutes, so that the post-baking treatment step generates a smoke amount of more than 98 ppm and the degassing amount after the post-baking treatment step is less than 40 ppm.

2. The method for preparing a pixel defining layer according to claim 1, wherein: The temperature of the pre-baking step is 80°C to 150°C.

3. The method for preparing a pixel defining layer according to claim 1, wherein: The pre-baking step is performed for 60 seconds to 180 seconds.

4. The method for preparing a pixel defining layer according to claim 1, wherein: The exposure step irradiates 20 mJ / cm 2 Up to 350mJ / cm 2 Actinic rays.

5. The method for preparing a pixel defining layer according to claim 1, characterized in that: After the development step, the half-tone thickness is 1.30 to 1.95 μm.

6. The method for preparing a pixel defining layer according to claim 1, characterized in that: After the development step, the full-tone thickness was 3.20 to 3.40 μm.

7. The method for preparing a pixel defining layer according to claim 1, characterized in that: The post-exposure step irradiates 50 to 1,000 mJ / cm 2 Actinic rays.

8. The method for preparing a pixel defining layer according to claim 1, characterized in that: The temperature of the post-baking step is 230 to 270°C.

9. The method for preparing a pixel defining layer according to claim 1, wherein: The post-baking step is performed for 60 minutes to 120 minutes.

10. The method for preparing a pixel defining layer according to claim 1, characterized in that: After the post-baking step, the half-tone thickness is 1.00 to 1.90 μm.

11. The method for preparing a pixel defining layer according to claim 1, characterized in that: The photosensitive composition includes a colorant.

12. The method for preparing a pixel defining layer according to claim 1, characterized in that: The photosensitive composition includes a pattern forming resin, and the pattern forming resin includes an acrylic binder resin, a cardo binder resin, or a combination thereof.

13. The method for preparing a pixel defining layer according to claim 1, characterized in that: The photosensitive composition includes: a reactive unsaturated compound in an amount of 1 to 40 wt % based on the total amount thereof.

14. The method for preparing a pixel defining layer according to claim 1, wherein: The photosensitive composition comprises: a photoinitiator in an amount of 0.01 to 10 wt % based on the total amount of the photosensitive composition.

15. A pixel defining layer prepared according to claim 1.

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