Pixel defining layer

Abstract

The invention relates to a pixel defining layer, and aims to adopt a fluorine-free leveling agent. According to the present invention, a pixel defining layer having a low outgassing amount is formed on an electrode substrate, such that the color becomes bright, the reliability of a display is improved, and the service life of the display is prolonged. That is, when the outgassing amount of the panel after the post-baking treatment is 15 ppm or more, the outgassing amount is an incentive for brightness reduction and life shortening due to pixel shrinkage, and when the contact angle with water is 100 degrees or more, the surface energy is reduced, resulting in deposit peeling.

Description

[0001] Cross-reference to related applications

[0002] This application claims the priority and benefits of Korean Patent Application Nos. 10-2023-0197751 and 10-2024-0198690, the entire contents of which are incorporated herein by reference. Technical field

[0003] The present invention relates to a pixel defining layer of a light-emitting display device using a photosensitive composition. Background art

[0004] Flat panel display devices are widely used in liquid crystal display devices (LCDs) and organic light emitting display devices (OLEDs), etc. Among them, organic light emitting display devices have advantages such as low power consumption, fast response speed, high color reproducibility, high brightness, and wide viewing angles.

[0005] The purpose of using a polarizing film in the organic light emitting display device is to block the light reflected from the panel after blocking the incident external light. Its drawback is that due to the lack of bending characteristics, it is not suitable for applying the polarizing film to flexible devices.

[0006] To solve the above problems, methods such as using color filters, black matrices, and forming a light-shielding inorganic film on the upper substrate have been proposed in the past. However, this method has limitations in obtaining the desired level of anti-reflection effect and does not specifically provide a method to replace the polarizing film.

[0007] In addition, coloring patterns, such as red, green, and blue color filters, are used not only in liquid crystal displays but also in organic light emitting displays.

[0008] When manufacturing the coloring pattern, not only various organic pigments but also carbon black and inorganic pigments are used as colorants, and the pigment dispersion liquid in which they are dispersed is mixed with other compositions to form a pattern.

[0009] When preparing an organic light-emitting display using the pixels formed in this way, clearer colors can be achieved. The pattern uses the coloring composition, and in order to achieve good large-area coating, a small amount of leveling agent is used, and its main component is fluorine series, so the performance will be the best. However, according to the regulations related to fluorine compound control (PFAS), its use is currently being regulated. Therefore, it is inevitable to use non-fluorine-based alternative additives. Compared with the fluorine series, the performance of the alternative additives will decline. As a result, the pressure difference of the color filter in the process or the contact angle in the pattern will be large, the film coating flatness will be high, and the outgassing amount will be large. When the outgassing is large, problems such as pixel shrinkage, dark spots, and electrode oxidation will be caused, shortening the life of the organic light-emitting display and reducing the brightness. Summary of the Invention

[0010] Problems to be Solved

[0011] In order to solve the above disadvantages of the traditional technology, an implementation example of the present invention uses a non-fluorine-containing leveling agent to form a pixel defining layer containing resin on the electrode substrate. The resin exhibits a contact angle, film coating flatness, and low outgassing amount equivalent to those of the traditional fluorine series, not only with clear colors, but also can improve the reliability of the display and extend the life.

[0012] That is, the purpose of the present invention is to develop a photosensitive resin composition having the following technical characteristics. After post-baking treatment, the contact angle on the panel satisfies 60° to 100°, the pattern thickness is controlled to be 2.0 μm or less in the substrate, and the outgassing amount is 15 ppm or less. When the outgassing amount is 15 ppm or more, it will become an inducement for pixel shrinkage, resulting in a decrease in brightness and a shortening of the life. In view of this, the purpose of the present invention is to generate sufficient fumes in the post-baking treatment step to minimize the occurrence of out-gassing in the panel state, so as to minimize the outgassing amount after the post-baking treatment process is completed.

[0013] Another implementation example provides an organic light-emitting display device including a pixel defining layer prepared by the above method.

[0014] Another implementation example provides an electronic device including the organic light-emitting display device.

[0015] Solutions to the Problems

[0016] Preferably, the pixel defining layer according to the present invention contains a photosensitive composition, and the photosensitive composition contains resin; and a non-fluorine-containing leveling agent.

[0017] Preferably, the leveling agent contains a silicon-based compound.

[0018] Preferably, the molecular weight of the silicon-based compound is from 5,000 g / mol to 15,000 g / mol.

[0019] More preferably, the molecular weight of the silicon-based compound is from 5,000 g / mol to 10,000 g / mol.

[0020] Preferably, the viscosity of the silicon-based compound is from 100,000 mm 2 / s to 500,000 mm 2 / s.

[0021] Further preferably, when a mixture of 50 wt% of the silicon-based compound and 50 wt% of propylene glycol methyl ether acetate is detected under the condition of 20 °C, the viscosity of the silicon-based compound is from 10 mm 2 / s to 40 mm 2 / s.

[0022] Preferably, the viscosity of the mixture containing the silicon-based compound is more preferably from 10 mm2 / s to 30 mm2 / s.

[0023] Preferably, the silicon-based compound contains substituents selected from the group consisting of: alkyl groups having C1 to C 40 ; alkenyl groups having C1 to C 40 ; alkynyl groups having C1 to C 40 ; alkoxy groups having C1 to C 40 ; aryloxy groups having C6 to C 40 ; alkoxy carbonyl groups having C1 to C 40 ; carbonyl group; ether group; ester group; carboxyl group or a combination thereof.

[0024] Preferably, the pixel defining layer consists of a single layer.

[0025] Preferably, the photosensitive composition contains: a non-fluorinated leveling agent in an amount of 0.01 to 0.5% by weight based on its total amount.

[0026] Preferably, the resin contains an acrylic binder resin; a cardo binder resin or a combination thereof.

[0027] Preferably, the acrylic binder resin has a weight average molecular weight of 3,000 g / mol to 150,000 g / mol.

[0028] Preferably, the cardo binder resin includes a repeating structure represented by the following Chemical Formula 1:

[0029] <Chemical Formula 1>

[0030]

[0031] In Chemical Formula 1,

[0032] 1) R1 and R2 are each independently: hydrogen; deuterium; halogen; an aryl group having 6 to 30 carbon atoms; a heterocyclyl group having 2 to 30 carbon atoms and containing at least one hetero atom selected from O, N, S, Si, and P; a cyclo group of a fused ring of an aliphatic ring and an aromatic ring having 6 to 30 carbon atoms; an alkyl group having 1 to 20 carbon atoms; an alkenyl group having 2 to 20 carbon atoms; an alkynyl group having 2 to 20 carbon atoms; an alkoxy group having 1 to 20 carbon atoms; an aryloxy group having 6 to 30 carbon atoms; a fluorenyl group; a carbonyl group; an ether group; or an alkoxy carbonyl group having 1 to 20 carbon atoms,

[0033] 2) R1 and R2 may form a ring between adjacent groups,

[0034] 3) m or n is each independently an integer from 0 to 4,

[0035] 4) A1 and A2 are each independently represented by the following Chemical Formula 2 or Chemical Formula 3,

[0036] <Chemical Formula 2>

[0037]

[0038] <Chemical Formula 3>

[0039]

[0040] In Chemical Formula 2 and Chemical Formula 3,

[0041] (4-1)* represents the connected position,

[0042] (4-2)R3 to R6 are each independently: hydrogen; deuterium; halogen; C6-C 30 aryl group; C2-C containing at least one hetero atom selected from O, N, S, Si and P 30 heterocyclyl group; C6-C 30 fused cyclo group of an aliphatic ring and an aromatic ring; C1-C 20 alkyl group;

[0043] C2-C 20 alkenyl group; C2-C 20 alkinyl group; C1-C 20 alkoxy group; C6-C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C 20 alkoxy carbonyl group,

[0044] (4-3)R3 to R6 may form a ring between adjacent groups,

[0045] (4-4)Y1 and Y2 are each independently the following Chemical Formula 6 or Chemical Formula 7,

[0046] <Chemical Formula 6>

[0047]

[0048] <Chemical Formula 7>

[0049]

[0050] In Chemical Formula 6 and Chemical Formula 7,

[0051] (4-4-1)* represents the bonding position,

[0052] (4-4-2)R 9 is hydrogen or methyl ester;

[0053] (4-4-3)R10 to R 13 are each independently: hydrogen; deuterium; halogen; aryl group having 6 to C 30 ; heterocyclyl group having 2 to C containing at least one hetero atom selected from O, N, S, Si, and P 30 ; cyclo group of a fused ring of an aliphatic ring and an aromatic ring having 6 to C 30 ; alkyl group having 1 to C 20 ; alkenyl group having 2 to C 20 ; alkynyl group having 2 to C 20 ; alkoxy group having 1 to C 20 ; aryloxy group having 6 to C 30 ; fluorenyl group; carbonyl group; ether group; or alkoxycarbonyl group having 1 to C 20 ),

[0054] 4-4-4) L1 to L3 are each independently: a single bond; fluorenylene group; alkylene having 2 to C 30 ; arylene having 6 to C 30 ; heterocycle having 2 to C 30 ; alkoxylene having 1 to C 30 ; alkyleneoxy having 2 to C 30 ; aryloxy group having 6 to C 30 ; polyethyleneoxy group having 2 to C 30 ),

[0055] 4-4-5) q and r are each independently an integer from 0 to 3; provided that q + r = 3,

[0056] 5) The resin includes a repeating unit represented by Chemical Formula 1, and in the polymer chain, the ratio of A1 and A2 is from 9:1 to 1:9,

[0057] 6) X1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following Chemical Formula 4; or Chemical Formula 5,

[0058] 6-1) R' and R" are independently of each other: hydrogen; deuterium; halogen; C6-C 30 aryl group; C2-C containing at least one hetero atom selected from O, N, S, Si and P 30 heterocyclyl group; C6-C 30 cyclo group of fused aliphatic and aromatic rings; C1-C 20 alkyl group; C2-C 20 alkenyl group; C2-C 20 alkinyl group; C1-C 20 alkoxy group; C6-C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C 20 alkoxycarbonyl group,

[0059] 6-2) R' and R" can form a ring between adjacent groups,

[0060] <Chemical Formula 4>

[0061]

[0062] <Chemical Formula 5>

[0063]

[0064] In the said Chemical Formula 4 and Chemical Formula 5,

[0065] 6-3) * indicates the bonding position,

[0066] 6-4) R7 and R8 are independently of each other: hydrogen; deuterium; halogen; C6-C 30 aryl group; C2-C containing at least one hetero atom selected from O, N, S, Si and P 30 heterocyclyl group; C6-C 30 cyclo group of fused aliphatic and aromatic rings; C1-C 20 alkyl group; C2-C20 an alkenyl group; C2-C 20 an alkynyl group; C1-C 20 an alkoxy group; C6-C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or C1-C 20 an alkoxy carbonyl group,

[0067] 6-5) o and p are each independently an integer from 0 to 4,

[0068] 7) X2 is C6-C 30 an aryl group; a C2-C containing at least one heteroatom selected from O, N, S, Si and P 30 a heterocyclyl group; C6-C 30 a fused cyclo group of an aliphatic ring and an aromatic ring; C1-C 20 an alkyl group; C2-C 20 an alkenyl group; C2-C 20 an alkynyl group; C1-C 20 an alkoxy group; C6-C 30 an aryloxygroup; a fluorenylene group; a carbonyl group; an ether group; or C1-C 20 an alkoxy carbonyl group,

[0069] 8) said R', R", X2, L1 to L3, R1 to R8 and R 10 to R 13 may each be further substituted with one or more substituents selected from the group consisting of: deuterium; halogen; substituted or unsubstituted C1-C 30 an alkyl group or C6-C 30a silyl group of an aryl group; a siloxane group; a boron group; a germanium group; a cyano group; an amino group; a nitro group; C1-C 30 an alkylthio group of C1-C 30 an alkoxy group of C1-C 30 an aryl alkoxy group of C6-C 30 an alkyl group of C1-C 30 an alkenyl group of C2-C 30 an alkinyl group of C2-C 30 an aryl group of C6-C; substituted with deuterium 30 an aryl group of C6-C; a fluorenyl group; C2-C 30 a heterocyclyl group of C2-C, which contains at least one hetero atom selected from the group consisting of O, N, S, Si, and P 30 an aliphatic cyclic group of C3-C 30 an aryl alkyl group of C7-C 30 an aryl alkenyl group of C8-C; and combinations thereof, and a ring may be formed between adjacent substituents.

[0070] Preferably, the weight average molecular weight of the cardo resin is 1,000 to 100,000 g / mol.

[0071] Preferably, in the total amount of the photosensitive composition, the content of the cardo resin is 1 to 30% by weight.

[0072] Preferably, the photosensitive composition contains a colorant.

[0073] Preferably, the colorant contains one or more of an inorganic dye, an organic dye, an inorganic pigment, and an organic pigment.

[0074] Preferably, in the total amount of the photosensitive composition, the content of the colorant is 1 to 40% by weight.

[0075] Preferably, the colorant is pretreated with a dispersant; or a water-soluble inorganic salt and a wetting agent.

[0076] Preferably, the average particle size of the colorant is from 20 nm to 110 nm.

[0077] Preferably, the photosensitive composition contains a reactive unsaturated compound.

[0078] Preferably, the photosensitive composition contains: a reactive unsaturated compound in an amount of 1 to 40% by weight based on its total amount.

[0079] Preferably, the photosensitive composition contains a photoinitiator.

[0080] Preferably, the photosensitive composition contains: a photoinitiator in an amount of 0.01 to 10% by weight based on its total amount.

[0081] Preferably, at a temperature of 25 ± 3°C, when the surface of the pixel defining layer contacts 2 to 10 microliters (μl) of water, the contact angle with the interface is from 60° to 100°.

[0082] More preferably, the contact angle with the interface is from 65° to 95°.

[0083] Preferably, the pixel defining layer is free of residues.

[0084] Preferably, the step of preparing the pixel defining layer in the present invention includes the following steps: the planarizing agent does not contain fluorine, the photosensitive composition contains a planarizing agent, and post-baking treatment is performed on the photosensitive composition.

[0085] Preferably, the post-baking treatment step is performed at a temperature of 210°C to 300°C for 30 minutes to 120 minutes.

[0086] Preferably, the outgassing amount after performing the post-baking treatment step is 15 ppm or less.

[0087] Preferably, the preparation of the pixel defining layer further includes the steps of: coating and forming a layer of the photosensitive composition; pre-baking; exposure; and development.

[0088] Preferably, the temperature of the pre-baking step is from 80°C to 150°C or less.

[0089] Preferably, the implementation time of the pre-baking step is from 50 seconds to 200 seconds.

[0090] Preferably, the exposure step irradiates 20 mJ / cm 2 to 350 mJ / cm 2 actinic rays.

[0091] More preferably, the exposure step irradiates 20 mJ / cm 2 to 150 mJ / cm2 Actinic rays.

[0092] Preferably, the post-baking treatment step is carried out at a temperature of 210°C to 300°C.

[0093] More preferably, the temperature of the post-baking treatment step is 250°C to 270°C.

[0094] Preferably, the implementation time of the post-baking treatment step is 30 minutes to 120 minutes.

[0095] More preferably, the implementation time of the post-baking treatment step is 60 minutes to 120 minutes.

[0096] Preferably, the outgassing amount after the post-baking treatment step is 15 ppm or less.

[0097] Preferably, after the post-baking treatment step, the thickness of the pixel defining layer is 1.40 μm to 1.60 μm.

[0098] More preferably, the thickness of the pixel defining layer is 1.45 μm to 1.55 μm.

[0099] As yet another specific example, preferably, the present invention provides an organic light-emitting display device including the pixel defining layer.

[0100] As yet another specific example, preferably, the present invention provides an electronic device including the display device and a control unit for driving the display device.

[0101] Advantages of the Invention

[0102] The object of the present invention is to apply a non-fluorine leveling agent to achieve a pixel defining layer with a low outgassing amount on an electrode substrate, satisfying the contact angle and flatness equivalent to those of existing fluorine-based additives, thereby making the color vivid while improving the reliability and extending the life of the display. That is, when the contact angle after post-baking treatment is 100° or more, the surface energy is reduced, and the adhesion force between the substrate and the interface is reduced, which will become an inducement for film peeling in the pattern and organic light-emitting material deposition processes. When the outgassing amount on the panel is 15 ppm or more, this will become an inducement for pixel shrinkage, resulting in reduced brightness and shortened life. In view of this, by including the appropriate additives described in the present invention, the contact angle and outgassing amount after the post-baking treatment process are minimized. Brief Description of the Drawings

[0103] Figure 1 It is a schematic diagram of the organic light-emitting element and the pixel defining layer described in the present invention.

[0104] Figure 2It is a schematic diagram of the contact angle with water in the comparative example and the embodiment.

[0105] Figure 3 It is a schematic diagram of photographing the surface of the pixel defining layer described in the comparative example and the embodiment. Detailed Description of the Invention

[0106] Hereinafter, some embodiments of the present invention will be described in detail with reference to the schematic diagrams. When indicating the components of each drawing with reference symbols, the same components are given the same symbols as much as possible even if they are shown in other drawings.

[0107] In the process of describing the present invention, when it is considered that a detailed description of a related well-known configuration or function will obscure the gist of the present invention, the detailed description thereof may be omitted. When the present invention uses "comprising", "having", "consisting of", etc., other parts may be added unless "only ~" is used. When a component is expressed in the singular, it includes the case of being expressed in the plural unless specifically stated otherwise.

[0108] Moreover, in the process of describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only used to distinguish the components from other components, and the nature, order, sequence, or number of the components are not limited by these terms.

[0109] In the process of describing the positional relationship of components, when it is mentioned that two or more components are "connected", "combined", or "connected to", it should be understood that two or more components can be directly "connected", "combined", or "connected to", but it is also possible to further "include" two or more components and other components to achieve "connection", "combination", or "connection to". Among them, the other components may include one or more of the two or more components that are "connected", "combined", or "connected to" each other.

[0110] Moreover, when a component such as a layer, film, region, plate, etc. is "on" or "above" another component, it should be understood that this includes not only the case of being "directly above" another component, but also the case where there is another component in between. Conversely, when a certain component is "directly above" another part, it should be understood that there is no other part in between.

[0111] In the process of describing the time flow relationship related to components, working methods, manufacturing methods, etc., for example, when describing time sequence relationships such as "after ~", "then ~", "next ~", "before ~", etc. or process sequence relationships, since "immediately" or "directly" is not used, it may further include discontinuous cases.

[0112] In addition, when referring to the numerical values of the constituent elements or the information corresponding thereto, even if not separately and explicitly described, it should be construed that the numerical values or the information corresponding thereto include: the error ranges caused by various factors (e.g., engineering factors, internal or external shocks, noises, etc.).

[0113] Unless otherwise described, the terms used in this specification and the appended claims are as follows within the scope not departing from the spirit of the present invention.

[0114] Unless otherwise described, the term "halo" or "halogen" used in this application includes fluorine (F), chlorine (Cl), bromine (Br), and iodine (I).

[0115] Unless otherwise described, the term "alkyl" or "alkyl group" used in this application contains 1 to 60 carbons connected by a single bond, and represents a radical of a saturated aliphatic functional group typified by a straight-chain alkyl group, a branched-chain alkyl group, a cycloalkyl (alicyclic) group, an alkyl-substituted cycloalkyl group, or a cycloalkyl-substituted alkyl group.

[0116] Unless otherwise described, the term "haloalkyl group" or "halogenalkyl group" used in this application represents an alkyl group substituted by a halogen.

[0117] Unless otherwise described, the term "alkenyl" or "alkynyl" used in this application has a double bond or a triple bond respectively, contains a straight-chain or side-chain radical, and has 2 to 60 carbons, but is not limited thereto.

[0118] Unless otherwise described, the term "cycloalkyl" used in this application represents a cyclic alkane having 3 to 60 carbons, but is not limited thereto.

[0119] The term "Alkoxy group" or "alkyloxy group" used in this application represents an alkyl group bonded to an oxygen radical, and has 1 to 60 carbons unless otherwise described, but is not limited thereto.

[0120] As used herein, the terms "alkenoxyl group", "alkenoxy group", "alkenyloxyl group", or "alkenyloxy group" denote an alkenyl group bonded to an oxygen radical and having 2 to 60 carbons, unless otherwise described, but are not limited thereto.

[0121] Unless otherwise described, the terms "aryl group" and "arylene group" as used herein have 6 to 60 carbons, respectively, but are not limited thereto. In the present application, the aryl group or arylene group includes monocyclic, ring assemblies, fused polycyclic compounds, etc. For example, the aryl group may include a phenyl group, a monovalent functional group of biphenyl,

[0122] a monovalent functional group of naphthalene, a fluorenyl group, and a substituted fluorenyl group. The arylene group may include a fluorenylene group and a substituted fluorenylene group.

[0123] The term "ring assemblies" as used herein is composed of two or more ring systems (monocyclic or fused ring systems) directly connected by single bonds or double bonds, indicating that the number of direct connections between the rings is 1 less than the total number of ring systems included in the compound. Ring assemblies may be directly connected by single bonds or double bonds with the same or different ring systems.

[0124] In the present application, the aryl group includes ring assemblies. Therefore, the aryl group includes biphenyl and terphenyl in which benzene rings as monocyclic aromatics are connected by single bonds. In addition, the aryl group also includes compounds in which aromatic ring systems fused to aromatic monocycles are connected by single bonds. Therefore, for example, it also includes compounds in which an aromatic ring system fused to a benzene ring as an aromatic monocycle, i.e., fluorene, is connected by a single bond.

[0125] The term "fused polycyclic system" used in this application refers to a cyclic structure formed by fusing at least two atoms, including: a form in which two or more hydrocarbon ring systems are fused, and a form in which at least one heterocyclic system containing at least one hetero atom is fused, etc. The fused polycyclic system may be an aromatic ring, an aromatic heterocycle, an aliphatic ring, or a combination of such rings. For example, an aryl group may be a naphthalenyl group, a phenanthrenyl group, a fluorenyl group, etc., but is not limited thereto.

[0126] The term "spiro compound" used in this application has a "spiro union", and spiro union means a connection formed by two rings sharing only one atom. At this time, the atom shared by the two rings is called a "spiro atom", and according to the number of spiro atoms contained in a compound, it is respectively called a "monospiro-", "dispiro-", "trispiro-" compound.

[0127] Unless otherwise described, the terms "fluorenyl group", "fluorenylene group", and "fluorene-triyl group" used in this application respectively represent a monovalent, divalent, or trivalent functional group in the following structures where R, R', R", and R'" are all hydrogen, and a "substituted fluorenyl group", "substituted fluorenylene group", or "substituted fluorene-triyl group" means that at least one of the substituents R, R', R", R'" is a substituent other than hydrogen, including: a case where R and R' are bonded to each other and together with the carbon to which they are bonded form a spiro compound. In this specification, regardless of the valence numbers such as monovalent, divalent, and trivalent, the fluorenyl group, fluorenylene group, and fluorene-triyl group may all be named as fluorene group.

[0128]

[0129] Also, R, R', R", and R'" can be independently: an alkyl group having 1 to 20 carbons, an alkenyl group having 1 to 20 carbons, an aryl group having 6 to 30 carbons, or a heterocyclyl group having 2 to 30 carbons. For example, the aryl group can be phenyl, biphenyl, naphthalene, anthracene, or phenanthrene, and the heterocyclyl group can be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidone, pyridazine, pyrazine, triazine, indole, benzo furan, quinazoline, or quinoxaline. For example, the substituted fluorenyl group and fluorenylene group can be the monovalent or divalent functional groups of 9,9-dimethyl fluorene, 9,9-diphenyl fluorene, and 9,9'-spirobi[9H-fluorene], respectively.

[0130] The term "heterocyclyl group" used in this application includes not only aromatic rings such as "heteroaryl group" or "heteroarylene group", but also non-aromatic rings, and unless otherwise described, it means a ring containing one or more hetero atoms and having 2 to 60 carbon atoms, but is not limited thereto. Unless otherwise described, the term "hetero atom" used in this application means N, O, S, P, or Si, and the heterocyclyl group means a monocyclic type, cyclic polymer, fused polycyclic system, spiro compound, etc. containing hetero atoms.

[0131] For example, a "heterocyclyl group" can also replace a cyclic carbon and includes, for example, compounds such as those containing hetero atom end groups such as SO2, P=O, etc.

[0132]

[0133] The term "ring" as used in this application includes monocyclic and polycyclic rings. Of course, hydrocarbon rings include heterocycles, which contain at least one hetero atom and include aromatic and non-aromatic rings.

[0134] The term "polycyclic" as used in this application includes ring assemblies such as biphenyl, terphenyl, etc., and fused polycyclic systems and spiro compounds, including both aromatic and non-aromatic. Of course, hydrocarbon rings include heterocycles, which contain at least one hetero atom.

[0135] The term "cyclo group" as used in this application refers to cyclic hydrocarbons other than aromatic hydrocarbons, including monocyclic types, ring assemblies, fused polycyclic systems, spiro compounds, etc. Unless otherwise described, it refers to a ring having 3 to 60 carbon atoms, but is not limited thereto. For example, when a fused aromatic ring benzene and a non-aromatic cyclohexane are combined, it also corresponds to an aliphatic ring.

[0136] Moreover, when naming with a prefix continuously, it means that the substituents are arranged in the order of description. For example, an aryl alkoxy group means an alkoxy group substituted with an aryl group, an alkoxy carbonyl group means a carbonyl group substituted with an alkoxy group, and an aryl carbonyl alkenyl group means an alkenyl group substituted with an aryl carbonyl group, where the aryl carbonyl group is a carbonyl group substituted with an aryl group.

[0137] Also, unless otherwise explicitly described, in the term "substituted or unsubstituted" used in this application, "substituted" means substituted with one or more substituents selected from the group consisting of deuterium, halogen, amino group, nitrile group, nitro group, C1-C 30 alkyl group, C1-C 30 alkoxy group, C1-C 30 alkyl amine group, C1-C 30 alkyl thiophene group, C6-C 30 arylthiophene group, C2-C 30 alkenyl group, C2-C 30 alkinyl group, C3-C 30 cycloalkyl group, C6-C 30 aryl group, C6-C substituted with deuterium 30 aryl group, C8-C 30 aryl alkenyl group, silane group, boride group, germanide group, and C2-C 30 heterocyclic group, the C2-C 20 heterocyclic group includes at least one heteroatom selected from the group consisting of O, N, S, Si, and P. And it is not limited by these substituents.

[0138] In this application, for the 'functional group names' corresponding to the aryl group, arylene group, heterocyclyl group, etc. described in each label and their substituent examples, 'functional group names reflecting valences' can be recorded, or they can also be recorded as 'names of parent compounds'. For example, 'phenanthrene' as an aryl group can be classified and the name of the 'group' with valence recorded. For example, the monovalent 'group' is recorded as 'phenanthryl (group)', and the divalent 'group' is recorded as 'phenanthrylene (group)', etc. However, it can also be recorded as the name of the parent compound 'phenanthrene' without considering the valence.

[0139] Similarly, pyrimidone can be recorded as 'pyrimidone' regardless of valence, or as pyrimidinyl (group) when monovalent, and when divalent, it can be recorded as the 'group name' with the corresponding valence, such as pyrimidinylene (group), etc. Therefore, in this application, when recording the type of substituent as the name of the parent compound, it can represent an n-valent 'group' formed by the desorption of hydrogen atoms bonded to the carbon atoms and / or hetero atoms of the parent compound.

[0140] Moreover, in this specification, when recording the compound name or substituent name, the numbers or alphabets indicating the position can be omitted. For example, pyrido[4,3-d]pyrimidone

[0141] (pyrimidone) can be recorded as pyrido pyrimidone, benzofuran[2,3-d]pyrimidone (pyrimidone) can be recorded as benzofuranpyrimidone, 9,9-dimethyl-9H-fluorene can be recorded as dimethyl fluorene, etc. Therefore, both benzo[g]quinoxaline and benzo[f]quinoxaline can be recorded as benzo quinoxaline.

[0142] Furthermore, unless otherwise explicitly stated, the chemical formulas adopted in this application are equally applicable to the definitions of substituents based on the following exponential definitions of chemical formulas.

[0143]

[0144] Among them, when a is an integer of 0, it indicates that the substituent R 1 does not exist, that is, when a is 0, all the carbons forming the benzene ring are bonded to hydrogen, and at this time, the label of the hydrogen bonded to carbon can be omitted, and the chemical formula or compound can be recorded. And when a is an integer of 1, one substituent R 1 is bonded to any one of the carbons forming the benzene ring. When a is an integer of 2 or 3, the bonding can be as follows. When a is an integer from 4 to 6, a similar method can also be used to bond with the carbons of the benzene ring. When a is an integer of 2 or more, R 1 can be the same or different.

[0145]

[0146] In the present application, unless otherwise described, forming a ring means that adjacent groups are bonded to each other to form a single ring or a fused polycyclic ring. The single ring and the formed fused polycyclic ring include not only hydrocarbon rings but also heterocyclic rings, which contain at least one hetero atom and may include aromatic and non-aromatic rings.

[0147] Moreover, in the present specification, unless otherwise described, when representing a condensed ring, in 'number-condensed ring', the number represents the number of condensed rings. For example, a form in which three rings are condensed with each other can be represented as 3-condensed ring, such as anthracene, phenanthrene, benzo quinozoline, etc.

[0148] In addition, unless otherwise described, the term "bridged bicyclic compound" used in the present application refers to a compound in which two rings share more than three atoms to form a ring. The shared atoms may include carbon or hetero atoms at this time.

[0149] In the present application, an organic electronic element means (several) components between an anode and a cathode, or means an organic light-emitting diode, which includes an anode, a cathode, and (several) components therebetween.

[0150] Moreover, depending on the situation, the display device of the present application means an organic electronic element, an organic light-emitting diode, and a panel including the same, or an electronic device including a panel and a circuit. Among them, for example, the electronic device includes all lighting devices, solar cells, portable or mobile terminals (such as smart phones, tablet computers, PDAs, electronic dictionaries, PMPs, etc.), navigation terminals, game consoles, various TVs, various computer monitors, etc., but is not limited thereto, and any form of device can be used as long as it includes the (several) components.

[0151] In another implementation example, the pixel defining layer made of the photosensitive composition can be patterned at the pixel separation part of the organic light-emitting display device.

[0152] Hereinafter, referring to Figure 1Describe an organic light-emitting display device. The organic light-emitting display device according to an embodiment of the present invention may include a substrate 1, a TFT layer 2 on the substrate, a planarization layer 3 on the TFT layer, a pixel electrode 4 on the planarization layer, an organic light-emitting layer 5 on the pixel electrode, a counter electrode 7 disposed on the organic light-emitting layer, a encapsulation layer 8 disposed on the counter electrode, a touch panel 9 disposed on the encapsulation layer, a color filter 10 disposed on the touch panel, an OCA layer 11 disposed on the color filter, and a cover glass layer 12 disposed on the OCA layer.

[0153] Preferably, the pixel defining layer 6 according to the present invention is formed on the pixel electrode 4.

[0154] The pixel defining layer 6 may apply a non-fluorine leveling agent to achieve a colored pattern with the same contact angle, film flatness, and low outgassing amount as that of the conventional fluorine series on the electrode substrate, thereby making the color vivid while improving the reliability and extending the lifespan of the organic light-emitting display device.

[0155] Hereinafter, embodiments of the present invention will be described in detail. However, this is for illustrative purposes only, and the present invention is not limited thereto. The present invention is only defined by the scope of the following claims.

[0156] According to an embodiment of the present invention, the photosensitive composition can be used to prepare a pixel defining layer, a red pattern, a green pattern, a blue pattern, or a black matrix, etc.

[0157] According to an embodiment of the present invention, the black pixel defining layer (PDL) may further contain an additional colorant in addition to the colorant contained in the colorant, that is, an organic black pigment or a black dye. For example, the organic pigment can be used alone or a combination of an organic pigment and a coloring pigment can be used. The advantage here is that even if the amount of the colorant is relatively increased due to the addition of a coloring pigment with insufficient light-shielding property, the strength of the film (layer) or the adhesion to the substrate will not decrease. According to an embodiment of the present invention, the negative pixel defining layer (Negative PDL (Pixel define layer)) may contain an additional colorant, that is, a black pigment or a black dye, in place of the colorant contained in the colorant.

[0158] Hereinafter, each component will be described in detail.

[0159] Ⅰ. Composition of the photosensitive composition for forming the pixel defining layer

[0160] (1) Levelling agent

[0161] In order to prevent streaks or black spots during coating, improve the flatness and fluidity of the coating film, improve the flatness performance to prevent color spots or defects, and prevent residues from occurring due to undeveloped areas, the photosensitive composition according to the present invention contains a leveling agent.

[0162] Preferably, the leveling agent of the present invention does not contain fluorine.

[0163] Preferably, the leveling agent is a silicon-based leveling agent.

[0164] Preferably, the molecular weight of the silicon-based compound is from 5,000 g / mol to 15,000 g / mol.

[0165] More preferably, the molecular weight of the silicon-based compound is from 5,000 g / mol to 10,000 g / mol.

[0166] Preferably, the viscosity of the silicon-based compound is 100,000 mm 2 / s to 500,000 mm 2 / s.

[0167] Preferably, when detecting a mixture of 50 wt% of the silicon-based compound and 50 wt% of propylene glycol monomethyl ether acetate at 20 °C, the viscosity of the silicon-based compound is 10 mm 2 / s to 40 mm 2 / s.

[0168] Preferably, the viscosity of the mixture containing the silicon-based compound is more preferably 10 mm 2 / s to 30 mm 2 / s.

[0169] Preferably, the silicon-based leveling agent contains substituents selected from the group consisting of: C1-C 40 alkyl group; C1-C 40 alkenyl group; C1-C 40 alkinyl group; C1-C 40 alkoxy group; C6-C 40 aryloxy group; C1-C 40 alkoxy carbonyl group; carbonyl group; ether group; ester group; carboxyl group or a combination thereof.

[0170] In specific examples of the silicone leveling agent, commercially available silicone leveling agent products such as EFS-101, EFS-104, EFS-106, EFS-109, EFS-120, EFS-121, EFS-134, EFS-135, EFS-201, EFS-203, EFS-204, EFS-210, EFS-220, EFS-301, EFS-302, EFS-303, EFS-314, EFS-317, EFS-318, EFS-326, EFS-329, EFS-333, EFS-349, EFS-355, EFS-358, EFS-359, EFS-362, EFS-601, EFS-701, EFS-801, RS-55 and RS-56 of DIC Corporation; BYK-333, BYK-378, BYK-3550, BYK-3751, BYK-3754, etc. of BYK Corporation can be adopted.

[0171] Preferably, in 100 parts by weight of the photosensitive resin composition, the content of the leveling agent is 0.01 part by weight to 0.5 part by weight.

[0172] When the leveling agent is included within the above range, the coating uniformity of the photosensitive composition can be ensured, scarring will not occur, and the wettability of the glass substrate is excellent.

[0173] Moreover, the pixel defining layer formed from the photosensitive composition containing the silicone leveling agent of the present invention can achieve excellent contact angle and film surface flatness, and has a low outgassing amount. Therefore, when it is applied to a display, the color can be made vivid while the reliability can be improved and the lifespan can be extended.

[0174] (2) Resin for pattern formation

[0175] According to an embodiment of the present invention, the resin for pattern formation may include an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0176] The acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin including one or more acrylic repeating units.

[0177] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing one or more carboxyl groups, and specific examples thereof include: acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof. In the total amount of the acrylic binder resin, the content of the first ethylenically unsaturated monomer may be 5% by weight to 50% by weight, for example, 10% by weight to 40% by weight.

[0178] The second ethylenically unsaturated monomer may be an aromatic vinyl compound such as styrene, α-methylstyrene, vinyltoluene, vinylbenzyl methyl ether; an unsaturated carboxylic acid ester compound such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate; an unsaturated carboxylic acid aminoalkyl ester compound such as 2-aminoethyl (meth)acrylate, 2-dimethylaminoethyl (meth)acrylate; a carboxylic acid vinyl ester compound such as vinyl acetate; an unsaturated carboxylic acid glycidyl ester compound such as glycidyl (meth)acrylate; a vinyl cyanide compound such as (meth)acrylonitrile; an unsaturated amide compound such as (meth)acrylamide; etc., and these may be used alone or in combination of two or more.

[0179] Specific examples of the acrylic binder resin include: (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, etc., but are not limited thereto. These may also be used alone or in combination of two or more. The weight average molecular weight of the acrylic binder resin may be from 3,000 g / mol to 150,000 g / mol, for example, from 5,000 g / mol to 50,000 g / mol, for example, from 20,000 g / mol to 30,000 g / mol.

[0180] The cardo resin includes a repeating structure represented by the following Chemical Formula 1.

[0181] <Chemical Formula 1>

[0182]

[0183] In the Chemical Formula 1,

[0184] 1) R1 and R2 are each independently: hydrogen; deuterium; halogen; an aryl group having 6 to C 30 ; a heterocyclyl group having 2 to C containing at least one hetero atom selected from O, N, S, Si, and P 30 ; a fused ring group of an aliphatic ring and an aromatic ring having 6 to C 30 ; an alkyl group having 1 to C 20 ; an alkyl group having 2 to C20 an alkenyl group; C2 - C 20 an alkynyl group; C1 - C 20 an alkoxy group; C6 - C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or C1 - C 20 an alkoxy carbonyl group,

[0185] 2) R1 and R2 may form a ring between adjacent groups,

[0186] 3) m or n is independently an integer from 0 to 4,

[0187] 4) A1 and A2 are independently one of the following Chemical Formula 2 or Chemical Formula 3,

[0188] <Chemical Formula 2>

[0189]

[0190] <Chemical Formula 3>

[0191]

[0192] In the said Chemical Formula 2 and Chemical Formula 3,

[0193] 4 - 1) * represents the connecting part,

[0194] 4 - 2) R3 to R6 are independently: hydrogen; deuterium; halogen; C6 - C 30 an aryl group; a C2 - C containing at least one hetero atom selected from O, N, S, Si and P 30 a heterocyclyl group; C6 - C 30 a fused ring group of an aliphatic ring and an aromatic ring; C1 - C 20 an alkyl group; C2 - C 20 an alkenyl group; C2 - C 20 an alkynyl group; C2 - C 20 an alkoxy group; C6 - C 30aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C 20 alkoxy carbonyl group of C

[0195] 4-3) R3 to R6 may form a ring between adjacent groups,

[0196] 4-4) Y1 and Y2 are independently of each other the following Chemical Formula 6 or Chemical Formula 7,

[0197] <Chemical Formula 6>

[0198]

[0199] <Chemical Formula 7>

[0200]

[0201] In the said Chemical Formula 6 and Chemical Formula 7,

[0202] 4-4-1) * indicates the bonding position,

[0203] 4-4-2) R9 is hydrogen or methyl ester;

[0204] 4-4-3) R 10 ~R 13 are independently of each other: hydrogen; deuterium; halogen; aryl group of C6-C 30 heterocyclyl group of C2-C containing at least one hetero atom among O, N, S, Si and P; cyclo group of a fused ring of an aliphatic ring and an aromatic ring of C6-C 30 heterocyclyl group of C6-C 30 cyclo group of a fused ring of an aliphatic ring and an aromatic ring; alkyl group of C1-C 20 alkenyl group of C2-C 20 alkinyl group of C2-C 20 alkoxy group of C1-C 20 aryloxy group of C6-C 30 fluorenyl group; carbonyl group; ether group; or C1-C 20an alkoxycarbonyl group,

[0205] 4-4-4) L1 to L3 are each independently: a single bond; a fluorenylene group; a C2-C 30 alkylene; a C6-C 30 arylene; a C2-C 30 heterocycle; a C1-C 30 alkoxylene; a C2-C 30 alkyleneoxy; a C6-C 30 aryloxy group; a C2-C 30 a polyethyleneoxy group,

[0206] 4-4-5) q and r are each independently an integer from 0 to 3; provided that q + r = 3,

[0207] 5) The resin includes a repeating unit represented by Chemical Formula 1, and within the polymer chain, the ratio of A1 to A2 is from 9:1 to 1:9,

[0208] 6) X1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following Chemical Formula 4; or Chemical Formula 5,

[0209] 6-1) R' and R" are each independently: hydrogen; deuterium; halogen; a C6-C 30 aryl group; a C2-C containing at least one hetero atom selected from O, N, S, Si, and P 30 heterocyclyl group; a C6-C 30 cyclo group of a fused ring of an aliphatic ring and an aromatic ring; a C1-C 20 alkyl group; a C2-C 20 alkenyl group; a C2-C 20 alkinyl group; a C1-C 20 alkoxy group; a C6-C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or a C1-C 20an alkoxycarbonyl group

[0210] 6-2) R' and R" may form a ring between adjacent groups

[0211] <Chemical Formula 4>

[0212]

[0213] <Chemical Formula 5>

[0214]

[0215] In the above Chemical Formula 4 and Chemical Formula 5

[0216] 6-3) * indicates the bonding position

[0217] 6-4) R7 to R8 are each independently: hydrogen; deuterium; halogen; an aryl group having 6 to 30 carbon atoms; a heterocyclyl group having 2 to 30 carbon atoms and containing at least one hetero atom selected from O, N, S, Si and P; a cyclo group which is a fused ring group of an aliphatic ring and an aromatic ring having 6 to 30 carbon atoms; an alkyl group having 1 to 20 carbon atoms; an alkenyl group having 2 to 20 carbon atoms; an alkynyl group having 2 to 20 carbon atoms; an alkoxy group having 1 to 20 carbon atoms; an aryloxy group having 6 to 30 carbon atoms; a fluorenyl group; a carbonyl group; an ether group; or an alkoxycarbonyl group having 1 to 20 carbon atoms

[0218] 6-5) o and p are each independently an integer from 0 to 4

[0219] 7) X2 is an aryl group having 6 to 30 carbon atoms; a heterocyclyl group having 2 to 30 carbon atoms and containing at least one hetero atom; an aryl group having 6 to 30A fused ring group (cyclo group) of an aliphatic ring and an aromatic ring; C1-C 20 An alkyl group (Alkyl group); C2-C 20 An alkenyl group (alkenyl group); C2-C 20 An alkynyl group (alkinyl group); C1-C 20 An alkoxy group (alkoxy group); C6-C 30 An aryloxy group (aryloxygroup); A fluorenylene group; A carbonyl group; An ether group; Or C1-C 20 An alkoxy carbonyl group,

[0220] 8) The R', R", X2, L1-L3, R1-R8 and R 10 -R 13 May be further substituted with one or more substituents selected from the group consisting of: Deuterium; A halogen; A substituted or unsubstituted C1-C 30 An alkyl group (Alkylgroup) or C6-C 30 A silane group of an aryl group; A siloxane group (Siloxanegroup); A boron group; A germanium group; A cyano group (cyano group); An amino group; A nitro group; C1-C 30 An alkylthio group; C1-C 30 An alkoxy group (alkoxy group); C6-C 30 An aryl alkoxy group; C1-C 30 An alkyl group (Alkyl group); C2-C 30 An alkenyl group (alkenyl group); C2-C 30 An alkynyl group (alkinyl group); C6-C 30 An aryl group; A C6-C substituted with deuterium 30 An aryl group; A fluorenyl group; C2-C 30a heterocyclyl group containing at least one hetero atom selected from the group consisting of O, N, S, Si, and P; an aliphatic cyclic group having C3 to C 30 ; an arylalkyl group having C7 to C 30 ; an arylalkenyl group having C8 to C 30 ; and combinations thereof, and a ring may be formed between adjacent substituents.

[0221] When the R', R", X2, L1 to L3, R1 to R8, and R 10 to R 13 are an aryl group, preferably, it may be an aryl group having C6 to C 30 ; more preferably, it may be an aryl group having C6 to C 18 ; for example, it may be phenyl, biphenyl, naphthyl, terphenyl, etc.

[0222] When the R', R", X2, L1 to L3, R1 to R8, and R 10 to R 13 are a heterocyclyl group, preferably, it may be a heterocyclyl group having C2 to C 30 ; more preferably, it may be a heterocyclyl group having C2 to C 18 ; for example, it may be dibenzofuran, dibenzothiophene, naphtho benzothiophen, naphtho benzofuran, etc.

[0223] When the R', R", R1 to R8, and R 10 to R 13 are a fluorenyl group, preferably, it may be 9,9-dimethyl-9H-fluorene, 9,9-diphenyl-9H-fluorenyl group, 9,9'-spirobi fluorene, etc.

[0224] When L1 to L3 are arylene groups, preferably, they can be C6-C 30 arylene groups, and more preferably, they can be C6-C 18 arylene groups. For example, they can be phenyl, biphenyl, naphthyl, terphenyl, etc.

[0225] When R', R", X2, R1 to R8 and R 10 ~R 13 are alkyl groups, preferably, they can be C1-C 10 alkyl groups. For example, they can be methyl, t-butyl, etc.

[0226] When R', R", X2, R1 to R8 and R 10 ~R 13 are alkoxy groups, preferably, they can be C1-C 20 alkoxy groups, and more preferably, they can be C1-C 10 alkoxy groups. For example, they can be methoxy, t-butoxy, etc.

[0227] The ring formed by bonding adjacent groups of R', R", X2, L1 to L3, R1 to R8 and R 10 ~R 13 can be a C6-C 60 aromatic ring group; a fluorenyl group; a C2-C 60 heterocyclyl group containing at least one hetero atom such as O, N, S, Si and P; or a C3-C 60 aliphatic ring group. For example, when adjacent groups bond to each other to form an aromatic ring, preferably, they can form a C6-C 20 aromatic ring, and more preferably, they can form a C6-C 14 aromatic ring. For example, they can form benzene, naphthalene, phenanthrene, etc.

[0228] For example, the cardo resin can be prepared by mixing two or more of the following components: fluorene-containing compounds such as 9,9-bis(4-epoxyethoxyphenyl)fluorene; anhydride compounds such as pyromellitic dianhydride, naphthalene tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride, benzophenone tetracarboxylic dianhydride, pyromellitic dianhydride, cyclobutane tetracarboxylic dianhydride, perylene tetracarboxylic dianhydride, tetrahydrofuran tetracarboxylic dianhydride, and tetrahydrophthalic anhydride; glycol compounds such as ethylene glycol, propylene glycol, and polyethylene glycol; ethanol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; solvent compounds such as propylene glycol monomethyl ether acetate (PGMEA) and N-methylpyrrolidone; phosphorus compounds such as triphenylphosphine; and ammonium or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylammonium, triethylammonium, tributylammonium, and benzyltriethylammonium chloride.

[0229] The weight-average molecular weight of the cardo resin is 1,000 to 100,000 g / mol. Preferably, it can be 1,000 to 50,000 g / mol. More preferably, it can be 1,000 to 30,000 g / mol. When the weight-average molecular weight of the resin is within the above range, no residue is generated during the preparation of the light-shielding layer, the pattern formation effect is good, and there is no film thickness loss during development, and good patterns can be obtained. In the total amount of the photosensitive resin composition, the content of the resin is 1 to 30% by weight. More preferably, the content can be 3 to 20% by weight. When the content of the resin is within the above range, excellent sensitivity, developability, and adhesion (tightness) can be obtained.

[0230] (3) Reactive unsaturated compound

[0231] The reactive unsaturated compound is an essential component for negative patterns and has ethylenic unsaturated double bonds. Therefore, during the exposure in the pattern formation process, sufficient polymerization can be initiated to form patterns with excellent heat resistance, light resistance, and chemical resistance.

[0232] Specific examples of the reactive unsaturated compound include: ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, trimethylolpropane triacrylate, tripentaerythritol octaacrylate, etc.

[0233] Examples of commercially available products of the reactive unsaturated compound are as follows.

[0234] For example, the difunctional esters of (meth)acrylic acid include: aronyx M-210, M-240, M-6200, etc. from Toagosei Co., Ltd.; KAYARAD HDDA, HX-220, R-604, etc. from Nippon Kayaku Co., Ltd.; V-260, V-312, V-335HP, etc. from Osaka Organic Chemical Industry Co., Ltd.

[0235] For example, the trifunctional esters of (meth)acrylic acid include: aronyx M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060, etc. from Toagosei Co., Ltd.; KAYARAD TMPTA, DPCA-20, DPCA-60, DPCA-120, etc. from Nippon Kayaku Co., Ltd.; V-295, V-300, V-360, etc. from Osaka Organic Chemical Industry Co., Ltd.

[0236] The above products can be used alone or in combination of two or more.

[0237] In order to have more excellent developability, the reactive unsaturated compound can be used after being treated with an acid anhydride. In the total amount of the photosensitive resin composition, the content of the reactive unsaturated compound can be 1 to 40% by weight, for example, it can be 1 to 20% by weight. When the content of the reactive unsaturated compound is included within the above range, sufficient curing is initiated during exposure in the pattern formation process. Therefore, the reliability is excellent, and the pattern has excellent heat resistance, light resistance and chemical resistance, as well as excellent clarity and adhesion.

[0238] (4) Photoinitiator

[0239] In order to present a negative pattern through a lithography machine, a photo radical initiator needs to be used. The photoinitiator has a molar absorption coefficient of 10,000 (L / mol·cm) or more in the wavelength range of 330 to 380 nm, and the temperature at which the photoinitiator undergoes a 5% weight loss is 270 °C or lower. Among them, the molar absorption coefficient can be calculated by the beer-Lambert Law. And using TGA, in a nitrogen atmosphere, the temperature was raised to 300 °C at a rate of 5 °C per minute, and the weight loss was detected.

[0240] The photopolymerization initiator is usually used in the photosensitive resin composition. For example, acetophenone-based compounds, benzophenone-based compounds, thioxanthone-based compounds, benzoin-based compounds, triazine-based compounds, oxime-based compounds or mixtures thereof, etc. can be adopted.

[0241] For example, the acetophenone compounds include: 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyltrichloroacetophenone, p-t-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc.

[0242] For example, the benzophenone compounds include: benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

[0243] For example, the thioxanthone compounds include: thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, etc.

[0244] For example, the benzoin compounds include: benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, etc.

[0245] For example, the triazine compounds include: 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-4-trichloromethyl(piperonyl)-6-triazine, 2-4-trichloromethyl(4'-methoxystyryl)-6-triazine, etc.

[0246] For example, the oxime compounds include: 2-(o-benzoyl oxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(o-acetyl oxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanol, (E)-1(((3-cyclopentyl-1-(9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl)propane)amino)oxy)ethan-1-one (PBG-304, Trony Corporation), etc.

[0247] In addition to the compounds, the photoinitiator can also be a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a non-imidazole compound, etc.

[0248] As a free radical polymerization initiator, the photoinitiator can be a peroxide compound, an azo-bis compound, etc.

[0249] For example, the peroxide compounds include: peroxyketones such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methyl cyclohexanone peroxide, acetylacetone peroxide; diperoxyacyls such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, bis-3,5,5-trimethylhexanoyl peroxide; hydroperoxides such as 2,4,4-trimethylpentan-2-yl hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide, t-butyl hydroperoxide; dialkyl peroxides such as diisopropylbenzene peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, 1,3-bis(t-butoxyisopropyl)benzene, t-butyl peroxy-n-butyl pivalate; alkyl succinate esters such as 2,4,4-trimethylpentyl peroxy phenoxyacetate, α-cumyl peroxyneodecanoate, t-butyl peroxybenzoate, di-t-butyl peroxytrimethyladipate; percarbonates such as di-3-methoxybutyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, bis-4-t-cyclohexylbutyl peroxydicarbonate, diisopropyl peroxydicarbonate, acetyl cyclohexylsulfonyl peroxide, t-aryl peroxycarbonate butyl, etc.

[0250] For example, the azo-bis compounds include: 1,1'-azobis(cyclohexane-1-carbonitrile), 2,2'-azobis(2,4-dimethylpentanenitrile), 2,2'-azobis(isobutyronitrile methyl ester), 2,2'-azobis(4-methoxy-2,4-dimethylpentanenitrile), α,α'-azobis(isobutyronitrile), 4,4'-azobis(4-cyanopentanoic acid), etc.

[0251] After the photoinitiator absorbs light and undergoes a transition to the excited state, it transfers its energy and is thus used together with the photosensitizer that undergoes a chemical reaction. For example, the photosensitizers include: triethylene glycol bis-3-mercaptopropionate, pentaerythritol tetra-3-mercaptopropionate, dipentaerythritol tetra-3-mercaptopropionate, etc.

[0252] In the total amount of the photosensitive composition, the content of the photoinitiator can be 0.01 to 10% by weight, for example, it can be 0.1 to 5% by weight. When the content of the photoinitiator is within this range, sufficient curing is initiated during exposure in the pattern formation process. Therefore, the reliability is excellent, and the heat resistance, light resistance, and chemical resistance of the pattern are excellent, and the clarity and adhesion are also excellent. In addition, a decrease in transmittance caused by unreacted initiator can be prevented.

[0253] (5) Colorant

[0254] Organic pigments, inorganic pigments, and dyes can all be used as the colorant.

[0255] The colorant can be a red pigment, a green pigment, a blue pigment, a yellow pigment, a black pigment, etc.

[0256] For example, the red pigments include: C.I. Pigment Red 254, C.I. Pigment Red 255, C.I. Pigment Red 264, C.I. Pigment Red 270, C.I. Pigment Red 272, C.I. Pigment Red 177, C.I. Pigment Red 89, etc.

[0257] For example, the green pigments include: copper phthalocyanine pigments substituted with halogen, such as C.I. Pigment Green 36, C.I. Pigment Green 7, etc.

[0258] For example, the blue pigments include: copper phthalocyanine pigments such as C.I. Pigment Blue 15:6, C.I. Pigment Blue 15, C.I. Pigment Blue 15:1, C.I. Pigment Blue 15:2, C.I. Pigment Blue 15:3, C.I. Pigment Blue 15:4, C.I. Pigment Blue 15:5, C.I. Pigment Blue 16, etc.

[0259] For example, the yellow pigments include: isoindoline-based pigments such as C.I. Pigment Yellow 139, quinophthalone-based pigments such as C.I. Pigment Yellow 138, nickel complex pigments such as C.I. Pigment Yellow 150, etc.

[0260] For example, the black pigments include: lactam black, aniline black, perylene black, titanium black, carbon black, etc.

[0261] Also, according to the implementation example, the colorant in the photosensitive resin composition may include a pigment, a dye, or a combination thereof. For example, the dye may include a phthalocyanine compound.

[0262] The above components can be used alone or in combination of two or more as the pigment and the dye, and are not limited thereto.

[0263] The black pigment in the above components can be used to effectively implement light shielding for the light shielding layer. When using the black pigment, it can also be used together with a color correction agent such as an anthraquinone-based pigment, a perylene-based pigment, a phthalocyanine-based pigment, an azo-based pigment, etc.

[0264] In order to disperse the pigment in the photosensitive resin composition, a dispersant can be used together. Specifically, the pigment can be used after surface pretreatment with a dispersant, or a dispersant can be added together with the pigment when preparing the photosensitive resin composition.

[0265] The dispersant can be a nonionic dispersant, an anionic dispersant, a cationic dispersant, etc. Specific examples of the dispersant include: polyalkylene glycol and its ester, polyoxyalkylene, polyol alkylene oxide adduct, alcohol alkylene oxide adduct, sulfonate ester, sulfonate, carboxylate ester, carboxylate, alkylene oxide alkylamide adduct, alkyl amine, etc., and these can be used alone or in combination of two or more.

[0266] The commercially available products of the dispersant include, for example, DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc. of BYK; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc. of EFKA Chemicals; Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse17000, Solsperse20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, etc. of Zeneka; or PB711, PB821, etc. of Ajinomoto.

[0267] In the total amount of the photosensitive resin composition, the content of the dispersant can be 0.1% by weight to 15% by weight. When the content of the dispersant is included within this range, the dispersibility of the composition is excellent. Subsequently, when preparing the light-shielding layer, the stability, developability, and patternability are excellent.

[0268] The pigment can also be pretreated with a water-soluble inorganic salt and a wetting agent before use. When the pigment is used after the pretreatment, the refinement of the average particle size of the pigment can be achieved.

[0269] The pretreatment is achieved through the following steps: kneading the pigment together with the water-soluble inorganic salt and the wetting agent; then, filtering and rinsing the pigment obtained in the kneading step.

[0270] The kneading can be carried out at a temperature of 40°C to 100°C, and for the filtering and rinsing, water or the like can be used to rinse the inorganic salt and filter.

[0271] For example, the water-soluble inorganic salts include sodium chloride, potassium chloride, etc., but are not limited thereto.

[0272] The wetting agent uniformly mixes the pigment and the water-soluble inorganic salt, thereby acting as a medium to make the pigment easy to pulverize. For example, there are alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, and diethylene glycol monomethyl ether; alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, and glycerin polyethylene glycol. These can be used alone or in combination of two or more.

[0273] The pigment that has undergone the kneading step may have an average particle size of 20 nm to 110 nm. When the average particle size of the pigment is within the above range, not only the heat resistance and light resistance are excellent, but also a fine pattern can be effectively formed.

[0274] In the total amount of the photosensitive resin composition, the content of the pigment may be 1% to 40% by weight, and more specifically, the content may be 2% to 30% by weight. When the pigment is included within the above range, the color reproducibility is excellent, and the curability and adhesiveness of the pattern are also excellent.

[0275] (6) Solvent

[0276] The solvent is compatible with the cardo resin, the reactive unsaturated compound, the pigment, the cardo compound, and the initiator, and substances that do not react can be used.

[0277] For example, the solvents include: alcohols such as methanol, ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisopentyl ether, anisole, tetrahydrofuran; ethylene glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether; ethylene glycol ethyl ether acetates such as methoxyethyl acetate, ethoxyethyl acetate, diethoxyethyl acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate (PGMEA), propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene, xylene; ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-dipentyl ketone, 2-heptanone; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, isobutyl acetate; lactate esters such as methyl lactate, ethyl lactate; alkyl glycollate esters such as methyl glycollate, ethyl glycollate, methyl glycollate, butyl glycollate; alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate; 3-oxopropionic acid alkyl esters such as methyl 3-oxopropionate, ethyl 3-oxopropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate; 2-oxopropionic acid alkyl esters such as methyl 2-oxopropionate, ethyl 2-oxopropionate, propyl 2-oxopropionate; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, methyl 2-ethoxypropionate; 2-oxy-2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate; 2-alkoxy-2-methylpropionic acid alkyl esters such as methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl glycolate, methyl 2-hydroxy-3-methylbutanoate; keto acid esters such as ethyl pyruvate, etc.

[0278] Moreover, high-boiling solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, ethylene glycol phenyl ether acetate can be used.

[0279] In consideration of the compatibility and reactivity of the solvent, ethylene glycol ethers such as ethylene glycol monoethyl ether can be used; ethylene glycol alkoxyacetates such as ethoxyethyl acetate; ethers such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate.

[0280] In the total amount of the photosensitive resin composition, the solvent can be included as the balance. Specifically, the content can be 40 to 90% by weight. When the content of the solvent is within the above range, the photosensitive resin composition can have an appropriate viscosity, thereby achieving excellent processability when preparing the pattern layer.

[0281] II. Preparation process of the pixel defining layer

[0282] (1) Coating and coating step

[0283] The photosensitive composition is a low-viscosity liquid reagent. After coating on the substrate, in order to form a coating layer with a certain thickness, a spin coater or a slot coater is used. The advantage of the spin coater is that the higher the rotation speed, the thinner the thickness, but the flatness deviation in the area is reduced. In order to form a coating layer on a large-area substrate, preferably, a slot coater is used compared with the spin coater. However, its disadvantage is that after forming the coating layer, due to the residual solvent, the surface shows fluidity, resulting in a decrease in flatness. In order to overcome this disadvantage, VCD (vacuum chamber dry) is used to locally remove the solvent to reduce the surface fluidity.

[0284] (2) Pre-baking step

[0285] In this process, at a certain temperature and time, the substrate with the coating layer is heated by a hot plate or an oven to locally remove the solvent contained in the coating film. If the surface or the depth of the coating film is not dry, it will cause photomask contamination during the exposure in the next process. When irradiating ultraviolet light, the exposed part is not well cured. When it is not cured, it will cause the development process not to form and remove the pattern.

[0286] (3) Exposure step

[0287] In this process, when the pre-baking process is completed, actinic rays (ultraviolet rays) are irradiated using a photomask with a pattern to cure the formed film. The types of lamps that generate actinic rays include LED lamps or metal (mercury) lamps, and the wavelengths include g-line (436 nm), h-line (405 nm), i-line (365 nm), Deep UV (<260 nm), which can be used separately or in combination.

[0288] (4) Development step

[0289] When the exposure step irradiates actinic rays, it is divided into an exposed part and a non-exposed part by a photomask. In the case of the positive type, the exposed part is dissolved by the developer, while the non-exposed part resists the developer and leaves a pattern. In the case of the negative type, the exposed part is cured and resistant to the developer, while the non-exposed part is developed. The black pixel defining layer (Black PDL) prepared using the composition containing the colorant described in the present invention is of the negative type and can be divided into an exposed part (cured) and a non-exposed part (developed) to form a pattern.

[0290] (5) Post-baking treatment step

[0291] This process heats the developed substrate at a high temperature of 210°C to 300°C to remove residual solvents and fumes. When the solvents and fumes are not completely removed, after the post-baking treatment, degassing in the process will affect the components, and thus will affect black spots or pixel shrinkage.

[0292] Another implementation example can use the photosensitive resin composition to pattern the pixel separation part of the organic light-emitting element electrode.

[0293] Hereinafter, the synthesis examples and examples of the present invention will be specifically described, but the synthesis examples and examples of the present invention are not limited thereto.

[0294] (Preparation of black photosensitive composition)

[0295] Synthesis Example 1: (Preparation of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene represented by Chemical Formula 8)

[0296] 20 g of 9,9'-bisphenol fluorene (Sigma aldrich), 8.67 g of epichlorohydrin (Sigma aldrich), 30 g of anhydrous potassium carbonate, and 100 ml of dimethylformamide were poured into a 300 ml three-necked round-bottom flask equipped with a distillation tube, heated to 80°C, and reacted for 4 hours. Then, the temperature was lowered to 25°C, the reaction solution was filtered, and then the filtrate was stirred and dropped into 1000 ml of water. The precipitated powder was filtered, then washed with water, and dried under reduced pressure at 40°C to obtain 25 g of 9,9-bis(4-glycidyloxyphenyl)fluorene (9,9-Bis[4-(glycidyloxy)phenyl]fluorene) represented by the following Compound 8. The purity of the powder was analyzed by HPLC, and as a result, the purity was 98%.

[0297] <Chemical Formula 8>

[0298]

[0299] Synthesis Example 2: Preparation of Cardo Binder Resin

[0300] 25 g (54 mmol) of Compound 1 obtained in Synthesis Example 1, 8 g of acrylic acid (Dai-Ichi Kogyo Seiyaku Co., Ltd.), 0.2 g of benzyl triethylammonium chloride (Dai-Ichi Kogyo Seiyaku Co., Ltd.), 0.2 g of hydroquinone (Dai-Ichi Kogyo Seiyaku Co., Ltd.), and 52 g of propylene glycol monomethyl ether acetate (Sigma aldrich) were poured into a 300 ml three-necked round-bottom flask equipped with a distillation tube and stirred at 110°C for 6 hours. After the reaction was completed, 8 g of biphenyltetracarboxylic dianhydride (Mitsubishi Gas Inc.) and 1.8 g of tetrahydrophthalic acid (Sigma aldrich) were further poured in, and then stirred at 110°C for 6 hours. After the reaction was completed, the reaction solution was recovered and analyzed. As a result, a Cardo binder resin with a molecular weight of 4,580 and a solid powder content of 45% was obtained.

[0301] Preparation Example 1: Preparation of Black Pigment Dispersion

[0302] Using a paint shaker (Asada Co., Ltd.), 15 g of Irgaphor Black S100CF (black pigment / BASF), 8.5 g of Disperbyk 163 (BYK), 6.5 g of SR-3613 (SMS), 70 g of propylene glycol monomethyl ether acetate, and 100 g of zirconia beads with a diameter of 0.5 mm (Toray) were dispersed for 10 hours to obtain a dispersion.

[0303] A photosensitive composition was prepared using the components in Table 1 below.

[0304] Specifically, an initiator was dissolved in a solvent, and then stirred at room temperature. A binder resin and a polymerizable compound were added thereto and stirred at room temperature. Then, a colorant and other additives were added to the obtained reaction product and stirred at room temperature. Then, the product was filtered three times to remove impurities, and a photosensitive resin composition was prepared.

[0305] [Table 1]

[0306]

[0307] The acrylic resin used is SR-3100 (SMS Corporation, resin with an average molecular weight of 6,000 to 8,000 and including double bonds), the reactive unsaturated compound used is Miraemer M600 (Miwon Chemical Co., Ltd.), the photoinitiator used is PBG-304 (Trony Corporation), and the solvent used is propylene glycol monomethyl ether acetate.

[0308] The molecular weight of the silicone leveling agent used in the compositions 1-1 to 1-5 is 5,000 g / mol to 15,000 g / mol.

[0309] Using GPC (1260 Infinity) of Agilent Corporation, 100 mg of the sample to be detected was dissolved in 10 g of tetrahydrofuran (THF), and then the molecular weight was detected. The GPC Column was analyzed by a combination of Shodex Corporation (GPC-802, 803, 804), and detection was carried out at a speed of 1 ml / min using an RI detector for 1 hour.

[0310] The intrinsic viscosity of the silicone leveling agent is 100,000 mm 2 / s to 500,000 mm 2 / s. At 20 °C, the viscosity of a mixture of 50 wt% of the silicone leveling agent and 50 wt% of propylene glycol monomethyl ether acetate was detected to be 10 mm 2 / s to 40 mm 2 / s.

[0311] 1 ml of the sample was loaded into a sample cup, and the viscosity was detected at a temperature of 20 ± 3 °C using a viscometer (LVDVNX-CP) of Brookfield Corporation for 1 minute. During the detection, the spindle (Z-40) was used, and the applicable rpm range for analysis during the detection was 10 to 15.

[0312] The method for preparing a negative pixel definition layer (negative PDL) using the photosensitive composition is as follows.

[0313] (1) Coating and coating step

[0314] On a 10 cm * 10 cm substrate that was cleaned and had metal deposited, the photosensitive composition was coated with a constant thickness using a spin coater, and then part of the solvent was removed using a vacuum drying chamber (VCD, vacuum chamber dry) to form a coating film. The thickness of the film formed after the coating of the photosensitive composition passed through the VCD was 2.0 microns to 1.7 microns.

[0315] (2) Pre-baking step

[0316] On a hot plate, heat at 90 °C to 120 °C for 100 seconds to 150 seconds to facilitate the removal of the solvent contained in the obtained coating film. This process removes a certain amount of solvent to reduce mask contamination of the pixel pattern and prepare a clean pattern when the next process (exposure) step is carried out.

[0317] (3) Exposure step

[0318] On the above-obtained coating film, sandwich a mask in the pixel pattern to form the desired pattern and a certain thickness. Then, irradiate actinic rays of 190 nm to 600 nm through an exposure machine. Preferably, a metal or LED light source with ghi-line can be irradiated to form a pattern. The exposure dose for forming the pattern is 80 mJ / cm 2 to 110 mJ / cm 2 of actinic rays and a negative-type photosensitive resist material.

[0319] (4) Development step

[0320] After carrying out the above exposure step, then, by the dipping method, use a 2.38 wt% TMAH (tetramethylammonium hydroxide) developer to develop for a certain time (minutes) at 23 ± 2 °C, and then rinse with deionized water (DI water) to dissolve and remove the unexposed part, leaving only the exposed part to form an image pattern, and the thickness of the coating film is 1.70 to 1.90 μm.

[0321] (5) Post-baking step

[0322] To obtain the image pattern obtained by the above development, carry out post-baking at 210 °C to 300 °C, and the post-baking time is 60 minutes to 120 minutes to completely remove the solvent, cure the pattern to form a film, and then degassing is detected.

[0323] (6) Element reliability evaluation

[0324] As Figure 2 and Figure 3 shown, for the element reliability evaluation such as pixel shrinkage and dark spot, according to the various conditions of the composition, on the glass surface, an electrode is formed with a thickness of ITO (80~ )-Ag (900~ )-ITO (80~ ). On the electrode, according to the above steps (1) to (6), a pixel defining layer is formed using the photosensitive composition of the present invention to prepare a substrate for evaluation, and the reliability test factors are confirmed.

[0325] (7) Degassing detection

[0326] Using a photosensitive composition, a pattern was formed on a substrate through the above steps (1), (2), (3), (4), and (5). Then, the degassing of an area of 10 cm x 10 cm was detected. The coating thickness was 1.45 to 1.55 μm after post-baking, and the weight of the photosensitive composition coated on a 10 cm x 10 cm substrate after post-baking was 11 to 12 g. Using JTD-505Ⅲ of JAI Company, the degassing of the substrate was trapped at 250 °C respectively, and the degassing trapping time was 30 minutes. Using QP2020GC / MS of Shimadzu Company, toluene black samples (5, 10, 50 ppm) were detected, and then a calibration curve was prepared, and the degassing generation amount of the trapped samples was amplified and detected. Products made by changing process conditions such as the development time and temperature of the development step, and the heating temperature and heat treatment time of the post-baking step were used as samples, and the degassing detection amounts detected respectively were compared.

[0327] (8) Detection method of contact angle

[0328] After performing the coating, coating, exposure, development, and post-baking described above, a film of 1.45 μm to 1.55 μm was formed, and deionized water (DI water) was dropped thereon, and the contact angle with the surface was detected. The contact angle detection equipment used was the DSA 25 equipment of KRUSS Company. A micro syringe was filled with deionized water and 2 μL was dropped, and the contact angle with the interface was detected. When detecting the contact angle, the average of the left and right values of the water droplet was detected.

[0329]

Table 2

[0330]

[0331]

[0332] Referring to the results of Comparative Example 1 and Examples 4 to 6 in Table 2 above, it can be seen that at the same post-baking temperature, among the results of the examples, the degassing amount after post-baking was lower, less than 15 ppm. Therefore, it is considered that the resin contained in the photosensitive composition and the mixed silicon-based planarizing agent have better thermal stability at high temperatures compared to the fluorine-based planarizing agent.

[0333] And, referring to Table 2 above and Figure 2It was confirmed that in the examples where the post-baking temperature was adjusted to the range of 210°C to 300°C, compared with the results of Comparative Example 2 with a lower post-baking temperature, the outgassing amount decreased, and the contact angle was included in the range of 60° to 100°. After comparing with the results of Comparative Example 3 with a higher post-baking temperature, it was confirmed that the degree of outgassing amount was similar, but the contact angle was included within the range defined in the present invention.

[0334] And, referring to Table 2 above and Figure 3 It was confirmed that in the examples where the post-baking temperature in the applicable range of 210°C to 300°C was applied to prepare the pixel defining layer, it was possible to confirm that there were no residues and pixel shrinkage phenomena in the pixel defining layer, and the component structure ensured excellent reliability.

[0335] On the contrary, from the results of Comparative Example 2, it was confirmed that when the post-baking temperature was lower than 210°C, after the post-baking treatment, the outgassing amount increased and black spots occurred in the components. From Comparative Example 3, it was confirmed that when the post-baking temperature was above 300°C, the pixel defining layer was not heat-resistant, and due to further outgassing when driving the components, a pixel shrinkage phenomenon would occur.

[0336] The above description merely exemplifies the present invention. As long as those of ordinary skill in the technical field to which the present invention pertains can make various modifications without departing from the essential characteristics of the present invention.

[0337] Therefore, the embodiments disclosed in this specification are used to describe the present invention, rather than to limit the present invention. The idea and scope of the present invention are not limited by such embodiments. The scope of the claims of the present invention should be interpreted according to the appended claims, and should be interpreted to include all technologies within the equivalent scope falling within the scope of the claims of the present invention.

Claims

1. A pixel defining layer comprising a photosensitive composition, wherein the photosensitive composition comprises a resin; and a leveler containing no fluorine.

2. The pixel definition layer according to claim 1, characterized in that: The leveler includes a silicon-based compound.

3. The pixel definition layer according to claim 2, characterized in that: The molecular weight of the silicon-based compound is 5,000 g / mol to 15,000 g / mol.

4. The pixel definition layer according to claim 2, characterized in that: The viscosity of the silicon compound is 100,000 mm 2 / s to 500,000mm 2 / s.

5. The pixel definition layer according to claim 2, characterized in that: The silicon-based compound comprises a substituent selected from the group consisting of: C1 to C 40 Alkyl group; C1~C 40 Alkenyl group; C1~C 40 Alkinyl group; C1~C 30 Alkoxy group; C6~C 40 aryloxy group; C1~C 40 an alkoxy carbonyl group; a carbonyl group; an ether group; an ester group; a carboxyl group or a combination thereof.

6. The pixel definition layer according to claim 1, characterized in that: The photosensitive composition comprises: a leveler containing no fluorine in an amount of 0.01 to 0.5 wt % based on the total amount of the leveler.

7. The pixel defining layer according to claim 1, characterized in that: The resin includes an acrylic binder resin, a cardo binder resin or a combination thereof.

8. The pixel definition layer according to claim 1, characterized in that: The preparation thereof comprises the step of post-baking the photosensitive composition.

9. The pixel defining layer according to claim 8, characterized in that: The post-baking step is performed at a temperature of 210° C. to 300° C. for 30 minutes to 120 minutes.

10. The pixel definition layer according to claim 8, characterized in that: The preparation of the pixel defining layer further includes the steps of: coating and coating the photosensitive composition; pre-baking; exposing; and developing.

11. The pixel definition layer according to claim 1, characterized in that: The photosensitive composition includes a colorant.

12. The pixel definition layer according to claim 1, characterized in that: The photosensitive composition includes a reactive unsaturated compound.

13. The pixel definition layer according to claim 1, characterized in that: The photosensitive composition includes a photoinitiator.

14. The pixel definition layer according to claim 1, characterized in that: Under the temperature condition of 25±3° C., when the surface of the pixel defining layer contacts 2 to 10 μl of water, a contact angle between the surface of the pixel defining layer and the interface is 60° to 100°.

15. The pixel definition layer according to claim 1, characterized in that: After the post-baking step is performed, the thickness of the pixel definition layer is 1.40 μm to 1.60 μm.

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