Pixel defining layer

Abstract

The invention relates to a pixel defining layer, and aims to realize a coloring pattern with low outgassing amount on an electrode substrate by adopting a fluorine-free leveling agent which is not an existing fluorine-based additive, so that the color becomes bright, the reliability of a display is improved, and the service life of the display is prolonged. That is, when the outgassing amount of the panel after the post-baking treatment is 40 ppm or more, the outgassing amount is an incentive for brightness reduction and life shortening caused by pixel shrinkage, and when the contact angle with water is 100 degrees or more, the surface energy is reduced, resulting in deposit peeling.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefits of Korean Patent Applications Nos. 10 - 2023 - 0197757 and 10 - 2024 - 0198718, the entire contents of which are incorporated herein by reference. Technical field

[0003] The present invention relates to a pixel defining layer of a light - emitting display device using a photosensitive composition. Background art

[0004] Flat - panel display devices are widely used in liquid crystal display devices (LCDs) and organic light - emitting display devices (OLEDs), etc. Among them, organic light - emitting display devices have advantages such as low power consumption, fast response speed, high color reproducibility, high brightness, and wide viewing angle.

[0005] The purpose of using a polarizing film in the organic light - emitting display device is to block the light reflected from the panel after shielding the incident external light. Its drawback is that due to the lack of bending characteristics, it is not suitable for applying the polarizing film to flexible devices.

[0006] To solve the above problems, methods such as using color filters, black matrices, and forming a light - shielding inorganic film on the upper substrate have been proposed in the past. However, this method has limitations in obtaining the desired level of anti - reflection effect and does not specifically provide a method to replace the polarizing film.

[0007] In addition, coloring patterns, such as red, green, and blue color filters, are used not only in liquid crystal displays but also in organic light - emitting displays.

[0008] When manufacturing the coloring pattern, not only various organic pigments but also carbon black and inorganic pigments are used as colorants. The pigment dispersion liquid in which they are dispersed is mixed with other compositions to form a pattern. At this time, before depositing the organic light - emitting layer, in order to support the metal mask for deposition, after adding a photolithography process, a deposition process is carried out.

[0009] When manufacturing an organic light-emitting display using pixels formed in this way, clearer colors can be achieved. The pattern uses the coloring composition, and in order to achieve good large-area coating, a leveling agent is used in a small amount, and its main component is fluorine series, so the performance will be the best. However, according to the regulations related to fluorine compound control (PFAS), its use is currently being regulated. Therefore, it is inevitable to use non-fluorine-based alternative additives. Compared with the fluorine series, the performance of the alternative additives will decline. As a result, the pressure difference of the color filter in the process or the contact angle in the pattern will be large, the film coating flatness will be high, and the outgassing amount will be large. When the outgassing amount is large, problems such as pixel shrinkage, dark spots, and electrode oxidation will be caused, shortening the life of the organic light-emitting display and reducing the brightness. Summary of the Invention

[0010] Problems to be Solved

[0011] In order to solve the above drawbacks of the traditional technology, an implementation example of the present invention uses a non-fluorine-containing leveling agent to achieve a pixel defining layer with a coloring pattern on the electrode substrate that exhibits a contact angle, film coating flatness, and outgassing amount equivalent to those of the traditional fluorine series. Not only are the colors clear, but the reliability of the display can also be improved and the life can be extended.

[0012] That is, the purpose of the present invention is to develop a photosensitive resin composition having the following technical characteristics. After post-baking treatment, the contact angle on the panel satisfies 60° to 100°, the pattern thickness is controlled to be 3.5 μm or less in the substrate, and the outgassing amount is 40 ppm or less. When the outgassing amount is 40 ppm or more, it will become an inducement to cause pixel shrinkage, resulting in a decrease in brightness and a shortening of the life. In view of this, the purpose of the present invention is to generate sufficient fumes in the post-baking treatment step to minimize the occurrence of out-gassing in the panel state, so that the outgassing amount becomes the least after the post-baking treatment process is completed.

[0013] Another implementation example provides an organic light-emitting display device including a pixel defining layer prepared by the above method.

[0014] Another implementation example provides an electronic device including the organic light-emitting display device.

[0015] Solutions to the Problems

[0016] The pixel defining layer according to the present invention includes a photosensitive composition, and the photosensitive composition includes a non-fluorine-containing leveling agent. Preferably, the pixel defining layer includes a half-tone layer.

[0017] Preferably, the leveling agent includes a silicon-based compound.

[0018] Preferably, the molecular weight of the silicon-based compound is from 5,000 g / mol to 15,000 g / mol.

[0019] More preferably, the molecular weight of the silicon-based compound is from 5,000 g / mol to 10,000 g / mol.

[0020] Preferably, the viscosity of the silicon-based compound is 100,000 mm 2 / s to 500,000 mm 2 / s.

[0021] Further preferably, when detecting a mixture of 50 wt% of the silicon-based compound and 50 wt% of propylene glycol methyl ether acetate at 20 °C, the viscosity of the silicon-based compound is 10 mm 2 / s to 40 mm 2 / s.

[0022] Preferably, the viscosity of the mixture containing the silicon-based compound is more preferably 10 mm 2 / s to 30 mm 2 / s.

[0023] Preferably, the silicon-based compound contains substituents selected from the group consisting of: alkyl groups having C1 to C 40 ; alkenyl groups having C1 to C 40 ; alkynyl groups having C1 to C 40 ; alkoxy groups having C1 to C 40 ; aryloxy groups having C6 to C 40 ; alkoxy carbonyl groups having C1 to C 40 ; carbonyl groups; ether groups; ester groups; carboxyl groups or combinations thereof.

[0024] Preferably, the photosensitive composition contains a non-fluorine leveling agent in an amount of 0.01 to 0.5% by weight based on its total amount.

[0025] Preferably, the photosensitive composition contains a resin, and the resin contains an acrylic binder resin; a cardo binder resin or a combination thereof.

[0026] Preferably, the acrylic binder resin has a weight average molecular weight of 3,000 g / mol to 150,000 g / mol.

[0027] Preferably, the cardo binder resin includes a repeating structure represented by the following Chemical Formula 1:

[0028] <Chemical Formula 1>

[0029]

[0030] In Chemical Formula 1,

[0031] 1) R1 and R2 are each independently: hydrogen; deuterium; halogen; an aryl group having 6 to 30 carbon atoms; a heterocyclyl group having 2 to 30 carbon atoms and containing at least one hetero atom selected from O, N, S, Si, and P; a cyclo group of a fused aliphatic ring and aromatic ring having 6 to 30 carbon atoms; an alkyl group having 1 to 20 carbon atoms; an alkenyl group having 2 to 20 carbon atoms; an alkynyl group having 2 to 20 carbon atoms; an alkoxy group having 1 to 20 carbon atoms; an aryloxy group having 6 to 30 carbon atoms; a fluorenyl group; a carbonyl group; an ether group; or an alkoxy carbonyl group having 1 to 20 carbon atoms,

[0032] 2) R1 and R2 may form a ring between adjacent groups,

[0033] 3) m or n is each independently an integer of 0 to 4,

[0034] 4) A1 and A2 are each independently the following Chemical Formula 2 or Chemical Formula 3,

[0035] <Chemical Formula 2>

[0036]

[0037] <Chemical Formula 3>

[0038]

[0039] In Chemical Formula 2 and Chemical Formula 3,

[0040] (4-1)* represents the connecting part,

[0041] (4-2) R3 to R6 are each independently: hydrogen; deuterium; halogen; an aryl group having 6 to 30 carbon atoms; a heterocyclyl group having 2 to 30 carbon atoms and containing at least one hetero atom selected from O, N, S, Si and P; a cyclo group which is a fused ring group of an aliphatic ring and an aromatic ring having 6 to 30 carbon atoms; an alkyl group having 1 to 20 carbon atoms; an alkenyl group having 2 to 20 carbon atoms; an alkynyl group having 2 to 20 carbon atoms; an alkoxy group having 1 to 20 carbon atoms; an aryloxy group having 6 to 30 carbon atoms; a fluorenyl group; a carbonyl group; an ether group; or an alkoxy carbonyl group having 1 to 20 carbon atoms,

[0042] (4-3) R3 to R6 may form a ring between adjacent groups,

[0043] (4-4) Y1 and Y2 are each independently the following Chemical Formula 6 or Chemical Formula 7,

[0044] <Chemical Formula 6>

[0045]

[0046] <Chemical Formula 7>

[0047]

[0048] In Chemical Formula 6 and Chemical Formula 7,

[0049] (4-4-1)* represents the bonding position,

[0050] (4-4-2) R9 is hydrogen or methyl ester;

[0051] (4-4-3) R 10 to R 13Independently of each other: hydrogen; deuterium; halogen; aryl group having 6 to 30 carbon atoms; heterocyclyl group having 2 to 30 carbon atoms and containing at least one hetero atom selected from O, N, S, Si and P; cyclo group of a fused ring of an aliphatic ring and an aromatic ring having 6 to 30 carbon atoms; alkyl group having 1 to 20 carbon atoms; alkenyl group having 2 to 20 carbon atoms; alkinyl group having 2 to 20 carbon atoms; alkoxy group having 1 to 20 carbon atoms; aryloxy group having 6 to 30 carbon atoms; fluorenyl group; carbonyl group; ether group; or alkoxycarbonyl group having 1 to 20 carbon atoms,

[0052] 4-4-4) L1 to L3 are independently of each other: a single bond; fluorenylene group; alkylene having 2 to 30 carbon atoms; arylene having 6 to 30 carbon atoms; heterocycle having 2 to 30 carbon atoms; alkoxylene having 1 to 30 carbon atoms; alkyleneoxy having 2 to 30 carbon atoms; aryloxy group having 6 to 30 carbon atoms; polyethyleneoxy group having 2 to 30 carbon atoms,

[0053] 4-4-5) q and r are independently integers from 0 to 3; provided that q + r = 3,

[0054] 5) The resin includes a repeating unit represented by Chemical Formula 1, and in the polymer chain, the ratio of A1 and A2 is from 9:1 to 1:9,

[0055] 6) X1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following Chemical Formula 4; or Chemical Formula 5,

[0056] 6-1) R' and R" are independently of each other: hydrogen; deuterium; halogen; aryl group of C6-C 30 ; heterocyclyl group of C2-C containing at least one hetero atom selected from O, N, S, Si and P 30 ; cyclo group of a fused ring of an aliphatic ring and an aromatic ring of C6-C 30 ; alkyl group of C1-C 20 ; alkenyl group of C2-C 20 ; alkinyl group of C2-C 20 ; alkoxy group of C1-C 20 ; aryloxy group of C6-C 30 ; fluorenyl group; carbonyl group; ether group; or alkoxycarbonyl group of C1-C 20 ,

[0057] 6-2) R' and R" may form a ring between adjacent groups,

[0058] <Chemical Formula 4>

[0059]

[0060] <Chemical Formula 5>

[0061]

[0062] In the said Chemical Formula 4 and Chemical Formula 5,

[0063] 6-3) * indicates the bonding position,

[0064] 6-4) R7 to R8 are independently of each other: hydrogen; deuterium; halogen; aryl group of C6-C 30 ; heterocyclyl group of C2-C containing at least one hetero atom selected from O, N, S, Si and P 30 ; cyclo group of a fused ring of an aliphatic ring and an aromatic ring of C6-C 30 ; alkyl group of C1-C 20 ; alkyl group of C2-C 20an alkenyl group; C2-C 20 an alkynyl group; C1-C 20 an alkoxy group; C6-C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or C1-C 20 an alkoxy carbonyl group,

[0065] 6-5) o and p are each independently an integer from 0 to 4,

[0066] 7) X2 is a C6-C 30 aryl group; a C2-C containing at least one heteroatom selected from O, N, S, Si, and P 30 heterocyclyl group; a C6-C 30 fused cyclo group of an aliphatic ring and an aromatic ring; C1-C 20 alkyl group; C2-C 20 alkenyl group; C2-C 20 alkynyl group; C1-C 20 alkoxy group; C6-C 30 aryloxygroup; a fluorenylene group; a carbonyl group; an ether group; or C1-C 20 alkoxy carbonyl group,

[0067] 8) The R', R", X2, L1 to L3, R1 to R8, and R 10 to R 13 can each be further substituted with one or more substituents selected from the group consisting of: deuterium; halogen; substituted or unsubstituted C1-C 30 alkyl group or C6-C 30a silyl group of an aryl group; a siloxane group; a boron group; a germanium group; a cyano group; an amino group; a nitro group; C1-C 30 an alkylthio group of C1-C 30 an alkoxy group of C1-C 30 an aryl alkoxy group of C6-C 30 an alkyl group of C1-C 30 an alkenyl group of C2-C 30 an alkinyl group of C2-C 30 an aryl group of C6-C; C6-C substituted with deuterium 30 an aryl group of C6-C; a fluorenyl group; C2-C 30 a heterocyclyl group of C2-C that contains at least one hetero atom selected from the group consisting of O, N, S, Si, and P; C3-C 30 an aliphatic cyclic group of C3-C 30 an aryl alkyl group of C7-C 30 an aryl alkenyl group of C8-C; and combinations thereof, and rings can be formed between adjacent substituents.

[0068] Preferably, the weight average molecular weight of the cardo resin is from 1,000 to

[0069] 100,000 g / mol.

[0070] Preferably, in the total amount of the photosensitive composition, the content of the cardo resin is 1 to 30% by weight.

[0071] Preferably, the photosensitive composition contains a colorant.

[0072] Preferably, the colorant contains one or more of an inorganic dye, an organic dye, an inorganic pigment, and an organic pigment.

[0073] Preferably, in the total amount of the photosensitive composition, the content of the colorant is 1 to 40% by weight.

[0074] Preferably, the colorant is pretreated with a dispersant; or a water-soluble inorganic salt and a wetting agent.

[0075] Preferably, the average particle size of the colorant is 20 nm to 110 nm.

[0076] Preferably, the photosensitive composition contains a reactive unsaturated compound.

[0077] Preferably, the photosensitive composition contains: a reactive unsaturated compound in an amount of 1 to 40% by weight based on its total amount.

[0078] Preferably, the photosensitive composition contains a photoinitiator.

[0079] Preferably, the photosensitive composition contains: a photoinitiator in an amount of 0.01 to 10% by weight based on its total amount.

[0080] Preferably, at a temperature of 25 ± 3 °C, when the surface of the pixel defining layer contacts 2 to 10 microliters (μl) of water, the contact angle with the interface is 60° to 100°.

[0081] More preferably, the contact angle with the interface is 65° to 95°.

[0082] Preferably, the pixel defining layer is free of residues.

[0083] Preferably, the steps for preparing the pixel defining layer of the present invention include the following steps: the planarizing agent does not contain fluorine, the photosensitive composition contains the planarizing agent, and post-baking treatment is performed on the photosensitive composition.

[0084] Preferably, the post-baking treatment step is performed at a temperature of 210 °C to 300 °C.

[0085] More preferably, the temperature of the post-baking treatment step is 250 °C to 270 °C.

[0086] Preferably, the post-baking treatment step is performed for 30 minutes to 120 minutes.

[0087] More preferably, the post-baking treatment step is performed for 60 minutes to 120 minutes.

[0088] Preferably, the amount of degassing after the post-baking treatment step is 40 ppm or less.

[0089] Preferably, the preparation of the pixel defining layer further includes the steps of: coating and coating the photosensitive composition; pre-baking; exposure; development; post-exposure.

[0090] Preferably, the pixel defining layer divides the photomask transmittance into three sections, namely, 0% (non-exposed portion), 20-50% (Half-tone), and 100% (Full-tone), and forms a half-tone layer and a full-tone layer through a single exposure and development process.

[0091] Preferably, the temperature of the pre-baking step is 80°C to below 150°C.

[0092] Preferably, the implementation time of the pre-baking step is 50 seconds to 200 seconds.

[0093] Preferably, the exposure step irradiates actinic rays of 20 mJ / cm 2 to 350 mJ / cm 2 of actinic rays.

[0094] More preferably, the exposure step irradiates actinic rays of 20 mJ / cm 2 to 150 mJ / cm 2 of actinic rays.

[0095] Preferably, after the development step, the half-tone thickness is 1.30 to 1.95 μm.

[0096] Preferably, after the development step, the Full-tone thickness is 3.20 to 3.40 μm.

[0097] Preferably, the post-exposure step irradiates actinic rays of 50 to 1,000 mJ / cm 2 of actinic rays.

[0098] Preferably, after the post-baking treatment step, the half-tone thickness is 1.00 to 1.90 μm.

[0099] Preferably, after the post-baking treatment step, the Full-tone thickness is 2.80 to 3.20 μm.

[0100] As yet another specific example, preferably, the present invention provides an organic light-emitting display device including the pixel defining layer.

[0101] As yet another specific example, preferably, the present invention provides an electronic device, which includes the display device and a control unit for driving the display device.

[0102] Advantages of the Invention

[0103] The object of the present invention is to apply a leveling agent without fluorine to achieve a coloring pattern with low outgassing volume on an electrode substrate, meet the contact angle and flatness equivalent to the existing fluorine-based additives, thereby making the color more vivid while improving the reliability and extending the lifespan of the display. That is, when the contact angle after post-baking treatment is 100° or more, the surface energy will be reduced, and the adhesion force of the substrate and the interface will be reduced, which will become the cause of film peeling in the pattern and organic light-emitting material deposition processes. When the outgassing volume on the panel is 40 ppm or more, this will become the cause of pixel shrinkage, resulting in reduced brightness and shortened lifespan. In view of this, the appropriate additives described in the present invention are included to minimize the contact angle and outgassing volume after the post-baking treatment process. BRIEF DESCRIPTION OF THE DRAWINGS

[0104] Figure 1 It is a schematic diagram of the organic light-emitting element and the pixel defining layer described in the present invention.

[0105] Figure 2 It is a schematic diagram of photographing the contact angle with water in the comparative example and the example.

[0106] Figure 3 It is a schematic diagram of photographing the surface of the pixel defining layer described in the comparative example and the example. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0107] Hereinafter, some embodiments of the present invention will be described in detail with reference to the schematic diagrams. When indicating the components of each drawing with reference symbols, as much as possible, the same components are given the same symbols even if they are shown in other drawings.

[0108] In the process of describing the present invention, when it is considered that the detailed description of related well-known configurations or functions will obscure the gist of the present invention, the detailed description thereof may be omitted. When the present invention uses "comprising", "having", "consisting of", etc., other parts may be added unless "~ only" is used. When expressing a component in the singular, unless specifically stated, it includes the case of expressing it in the plural.

[0109] Furthermore, in the process of describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only used to distinguish the components from other components, and the nature, order, sequence, or number of the components are not limited by these terms.

[0110] In the process of describing the positional relationship of constituent elements, when two or more constituent elements are mentioned to achieve "connection", "combination" or "access", it should be understood that two or more constituent elements can be directly "connected", "combined" or "accessed", but two or more constituent elements can also further "carry" other constituent elements to achieve "connection", "combination" or "access". Among them, the other constituent elements can include one or more of the two or more constituent elements that are mutually "connected", "combined" or "accessed".

[0111] Moreover, when constituent elements such as layers, films, regions, plates, etc. are located "on" or "above" other constituent elements, it should be understood that this not only includes the case of being directly "above" the other constituent elements, but also includes the case where there are other constituent elements in between. Conversely, when a certain constituent element is located "directly above" another part, it should be understood that there are no other parts in between.

[0112] When describing the time flow relationship related to constituent elements, working methods, manufacturing methods, etc., for example, when describing time sequence relationships such as "after ~", "then ~", "next ~", "before ~" or process sequence relationships, since "immediately" or "directly" is not used, discontinuous cases can be further included.

[0113] In addition, when referring to the numerical value of a constituent element or the information corresponding thereto, even if not specifically and explicitly recorded separately, it should be interpreted that the numerical value or the information corresponding thereto includes: the error range caused by various factors (such as engineering factors, internal or external impacts, noise, etc.).

[0114] Unless otherwise described, the terms used in this specification and the appended claims are as follows within the scope not departing from the idea of the present invention.

[0115] Unless otherwise described, the term "halo" or "halogen" used in this application includes fluorine (F), chlorine (Cl), bromine (Br) and iodine (I).

[0116] Unless otherwise described, the term "alkyl" or "alkyl group" used in this application contains 1 to 60 carbons connected by single bonds, representing free radicals of saturated aliphatic functional groups typified by straight-chain alkyl groups, branched-chain alkyl groups, cycloalkyl (alicyclic) groups, alkyl-substituted cycloalkyl groups, and cycloalkyl-substituted alkyl groups.

[0117] Unless otherwise described, the term "haloalkyl group" or "halogenalkyl group" as used in this application means an alkyl group substituted with halogen.

[0118] Unless otherwise described, the terms "alkenyl" or "alkynyl" as used in this application respectively have a double bond or a triple bond, contain a straight-chain or branched-chain group, and have 2 to 60 carbons, but are not limited thereto.

[0119] Unless otherwise described, the term "cycloalkyl" as used in this application means a cyclic alkane having 3 to 60 carbons, but is not limited thereto.

[0120] The term "Alkoxy group" or "alkyloxy group" as used in this application means an alkyl group bonded to an oxygen radical and has 1 to 60 carbons unless otherwise described, but is not limited thereto.

[0121] The terms "alkenoxyl group", "alkenoxygroup", "alkenyloxyl group" or "alkenyloxy group" as used in this application mean an alkenyl group bonded to an oxygen radical and have 2 to 60 carbons unless otherwise described, but are not limited thereto.

[0122] Unless otherwise described, the terms "aryl group" and "arylene group" as used in this application respectively have 6 to 60 carbons, but are not limited thereto. In this application, the aryl group or arylene group includes monocyclic, cyclic polymers, fused polycyclic compounds, etc. For example, the aryl group may include a phenyl group, a monovalent functional group of biphenyl, a monovalent functional group of naphthalene, a fluorenyl group, and a substituted fluorenyl group. The arylene group may include a fluorenylene group and a substituted fluorenylene group.

[0123] The term "ring assemblies" used in this application refers to two or more ring systems (monocyclic or fused ring systems) directly connected by single or double bonds, indicating that the number of direct connections between the rings is 1 less than the total number of ring systems contained in the compound. Ring assemblies can be formed by the direct connection of the same or different ring systems through single or double bonds.

[0124] In this application, the aryl group contains ring assemblies. Therefore, the aryl group includes biphenyl and terphenyl, which are formed by benzene rings (as monocyclic aromatic rings) directly connected by single bonds. Additionally, the aryl group also includes compounds in which an aromatic ring system fused to an aromatic monocyclic ring is directly connected by a single bond. Thus, for example, it also includes compounds in which an aromatic ring system fused to a benzene ring (as an aromatic monocyclic ring), namely fluorene, is directly connected by a single bond.

[0125] The term "fused polycyclic system" used in this application refers to a ring formed by sharing at least two atoms and fused, including forms such as fusing two or more hydrocarbon ring systems and forms such as fusing at least one heterocyclic system that contains at least one hetero atom. The fused polycyclic system can be an aromatic ring, an aromatic heterocycle, an aliphatic ring, or a combination of such rings. For example, the aryl group can be a naphthalenyl group, a phenanthrenyl group, a fluorenyl group, etc., but is not limited thereto.

[0126] The term "spiro compound" used in this application has a "spiro union", and spiro union means a connection formed by two rings sharing only one atom. At this time, the atom shared by the two rings is called the "spiro atom", and according to the number of spiro atoms contained in a compound, it is respectively called a "monospiro-", "dispiro-", "trispiro-" compound.

[0127] Unless otherwise described, the terms "fluorenyl group", "fluorenylene group", and "fluorene-triyl group" used in this application respectively represent a monovalent, divalent, or trivalent functional group in which R, R', R", and R'" are all hydrogen in the following structures. "Substituted fluorenyl group", "substituted fluorenylene group", or "substituted fluorene-triyl group" means that at least one of the substituents R, R', R", and R'"

[0128] is a substituent other than hydrogen, including the case where R and R' are bonded to each other and together with the carbon to which they are bonded form a spiro compound. In this specification, the fluorenyl group, fluorenylene group, and fluorene-triyl group can all be named as fluorene group regardless of the valence numbers such as monovalent, divalent, and trivalent.

[0129]

[0130] Moreover, R, R', R", and R'" can each independently be: an alkyl group having 1 to 20 carbons, an alkenyl group having 1 to 20 carbons, an aryl group having 6 to 30 carbons, or a heterocyclyl group having 2 to 30 carbons. For example, the aryl group can be phenyl, biphenyl, naphthalene

[0131] (naphthalene), anthracene or phenanthrene, and the heterocyclyl group may be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidone, pyridazine, pyrazine, triazine, indole, benzofuran, quinazoline or quinoxaline. For example, the substituted fluorenyl group and fluorenylene group may be monovalent or divalent functional groups of 9,9-dimethyl fluorene, 9,9-diphenyl fluorene and 9,9'-spirobi[9H-fluorene], respectively.

[0132] The term "heterocyclyl group" used in this application includes not only aromatic rings such as "heteroaryl group" or "heteroarylene group", but also non-aromatic rings, and unless otherwise described, it respectively represents a ring containing one or more hetero atoms and having 2 to 60 carbon atoms, but it is not limited thereto. Unless otherwise described, the term "hetero atom" used in this application represents N, O, S, P or Si, and the heterocyclyl group represents a monocyclic type, a ring polymer, a fused polycyclic system, a spiro compound, etc. containing hetero atoms.

[0133] For example, the "heterocyclyl group" may also include, instead of the cyclic carbon, compounds containing hetero atom end groups such as SO2 and P=O, such as the following compounds.

[0134]

[0135] The term "ring" used in this application includes monocyclic and polycyclic rings. Of course, hydrocarbon rings include heterocyclic rings, which contain at least one hetero atom and include aromatic and non-aromatic rings.

[0136] As used herein, the term "polycyclic" includes ring assemblies such as biphenyl and terphenyl, fused polycyclic systems, and spiro compounds, and includes not only aromatic but also non-aromatic compounds. Of course, hydrocarbon rings include heterocyclic rings containing at least one hetero atom.

[0137] As used herein, the term "cyclo group" means a cyclic hydrocarbon other than aromatic hydrocarbons, including monocyclic, ring assemblies, fused polycyclic systems, spiro compounds, etc., and means a ring having 3 to 60 carbon atoms unless otherwise described, but is not limited thereto. For example, when a fused aromatic ring benzene and a non-aromatic cyclohexane are combined, it also corresponds to an aliphatic ring.

[0138] Also, when prefixes are continuously used for naming, it means that substituents are arranged in the order of description. For example, an aryl alkoxy group means an alkoxy group substituted with an aryl group, an alkoxy carbonyl group means a carbonyl group substituted with an alkoxy group, and an aryl carbonyl alkenyl group means an alkenyl group substituted with an aryl carbonyl group, where the aryl carbonyl group is a carbonyl group substituted with an aryl group.

[0139] Also, unless otherwise expressly described, in the term "substituted or unsubstituted" as used herein, "substituted" means substituted with one or more substituents selected from the group consisting of deuterium, halogen, amino group, nitrile group, nitro group, C1-C 30 alkyl group, C1-C 30 alkoxy group, C1-C 30 alkyl amine group, C1-C 30alkyl thiophene group, C6 - C 30 arylthiophene group, C2 - C 30 alkenyl group, C2 - C 30 alkinyl group, C3 - C 30 cycloalkyl group, C6 - C 30 aryl group, C6 - C substituted with deuterium 30 aryl group, C8 - C 30 aryl alkenyl group, silane group, boron group, germanium group, and C2 - C 30 heterocyclyl group, the C2 - C 20 heterocyclyl group includes at least one heteroatom selected from the group consisting of O, N, S, Si, and P. And, it is not limited by such substituents.

[0140] In the present application, for the 'functional group names' corresponding to each label and its substituent examples such as aryl group, arylene group, heterocyclyl group, etc., it is possible to record the 'functional group name reflecting the valence' or record it as the 'name of the parent compound'. For example, 'phenanthrene' as an aryl group can be classified by valence and record the name of the 'group', such as recording the monovalent 'group' as 'phenanthryl (group)', and the divalent 'group' as 'phenanthrylene (group)', etc. However, it is also possible to record the name of the parent compound 'phenanthrene' without considering the valence.

[0141] Similarly, pyrimidone can be recorded as 'pyrimidone' without considering the valence, or when monovalent, recorded as pyrimidinyl (group), and when divalent, it can be recorded as the 'name of the group' with the corresponding valence, such as pyrimidinylene (group), etc. Therefore, in the present application, when recording the type of substituent as the name of the parent compound, it can represent an n-valent 'group' formed by the desorption of the hydrogen atom bonded to the carbon atom and / or heteroatom of the parent compound.

[0142] Also, in this specification, when recording a compound name or a substituent name, the numbers or alphabets indicating positions can be omitted. For example, pyrido[4,3-d]pyrimidone can be recorded as pyrido pyrimidone, benzofuran[2,3-d]pyrimidone can be recorded as benzo furanpyrimidone, 9,9-dimethyl-9H-fluorene can be recorded as dimethyl fluorene, etc. Therefore, both benzo[g]quinoxaline and benzo[f]quinoxaline can be recorded as benzo quinoxaline.

[0143] (pyrimidone) is recorded as pyrido pyrimidone, benzofuran[2,3-d]pyrimidone is recorded as benzo furanpyrimidone, 9,9-dimethyl-9H-fluorene is recorded as dimethyl fluorene, etc. Thus, both benzo[g]quinoxaline and benzo[f]quinoxaline can be recorded as benzo quinoxaline.

[0144] Also, unless otherwise specified, the chemical formulas used in this application are equally applicable to the definitions of substituents based on the following exponential definitions of chemical formulas.

[0145]

[0146] Wherein, when a is an integer of 0, it means that the substituent R 1 does not exist, that is, when a is 0, the carbons forming the benzene ring are all bonded to hydrogen. At this time, the labels of the hydrogens bonded to the carbons can be omitted, and the chemical formula or compound can be recorded. And when a is an integer of 1, one substituent R 1 is bonded to any one of the carbons forming the benzene ring. When a is an integer of 2 or 3, the bonding can be as follows. When a is an integer from 4 to 6, a similar method can also be used to bond with the carbons of the benzene ring. When a is an integer of 2 or more, R 1 can be the same or different.

[0147]

[0148] In this application, unless otherwise described, forming a ring means that adjacent groups are bonded to each other to form a single ring or a fused polycyclic ring. The single ring and the formed fused polycyclic rings include not only hydrocarbon rings but also heterocyclic rings, which contain at least one hetero atom and can include aromatic and non-aromatic rings.

[0149] Also, in this specification, unless otherwise described, when representing a condensed ring, in 'number-condensed ring', the number represents the number of condensed rings. For example, a form in which three rings are condensed with each other can be represented as 3-condensed ring, such as anthracene, phenanthrene, benzo quinozoline, etc.

[0150] In addition, unless otherwise described, the term "bridged bicyclic compound" used in this application refers to a compound in which two rings share three or more atoms to form a ring. The atoms shared at this time may include carbon or hetero atoms.

[0151] In this application, an organic electronic element means a (number of) component(s) between an anode and a cathode, or means an organic light-emitting diode, which includes an anode, a cathode, and a (number of) component(s) therebetween.

[0152] And, depending on the situation, the display device of this application means an organic electronic element, an organic light-emitting diode, and a panel and a display device including the same, or an electronic device including the panel, the display device, and a circuit. Among them, for example, the electronic device includes all lighting devices, solar cells, portable or mobile terminals (such as smartphones, tablet computers, PDAs, electronic dictionaries, PMPs, etc.), navigation terminals, game consoles, various TVs, various computer monitors, etc., but is not limited thereto, and any form of device can be used as long as it includes the (number of) component(s).

[0153] In another implementation example, the pixel defining layer made of the photosensitive composition can be patterned at the pixel separation part of the organic light-emitting display device.

[0154] Hereinafter, refer to Figure 1 Describe the organic light-emitting display device. The organic light-emitting display device described in the implementation example of the present invention may include a substrate 1, a TFT layer 2 on the substrate, a planarization layer 3 on the TFT layer, a pixel electrode 4 on the planarization layer, an organic light-emitting layer 5 on the pixel electrode, a counter electrode 7 disposed on the organic light-emitting layer, a packaging layer 8 disposed on the counter electrode, a touch panel 9 disposed on the packaging layer, a color filter 10 disposed on the touch panel, an OCA layer 11 disposed on the color filter, and a cover glass layer 12 disposed on the OCA layer.

[0155] Preferably, the pixel defining layer 6 described in the present invention is formed on the pixel electrode 4.

[0156] Preferably, the pixel defining layer 6 includes a Half-tone layer 6b, and the Half-tone layer 6b is provided on the Full-tone layer 6a and on the Full-tone layer 6a.

[0157] Preferably, on the patterned photomask, the pixel defining layer 6 divides the transmittance of the photomask into three sections, namely, 0% (non-exposed part), 20 - 50% (Half-tone), and 100% (Full-tone), and the Full-tone layer 6a and the Half-tone layer 6b are formed through a single exposure and development process.

[0158] The pixel defining layer 6 can apply a leveling agent without fluorine to achieve a contact angle, film coating flatness, and outgassing amount equivalent to those of traditional fluorine series on the electrode substrate for a colored pattern with low outgassing amount, so as to make the color more vivid, and at the same time improve the reliability and extend the lifespan of the organic light-emitting display device.

[0159] Hereinafter, embodiments of the present invention will be described in detail. However, this is for illustrative purposes only, and the present invention is not limited thereto. The present invention is only defined by the scope of the following claims.

[0160] According to an embodiment of the present invention, the photosensitive composition can be used to prepare a pixel defining layer, a red pattern, a green pattern, a blue pattern, or a black matrix, etc.

[0161] According to an embodiment of the present invention, the pixel defining layer may further include an additional colorant in addition to the colorant included in the colorant, that is, an organic black pigment or a black dye. For example, the organic pigment can be used alone or a combination of an organic pigment and a coloring pigment can be used. The advantage here is that since a coloring pigment with insufficient light-shielding property is mixed, even if the amount of the colorant increases relatively, the strength of the film (layer) or the adhesion to the substrate will not decrease. According to an embodiment of the present invention, the negative pixel defining layer (Negative PDL (Pixel define layer)) may include an additional colorant, that is, a black pigment or a black dye, to replace the colorant included in the colorant.

[0162] Hereinafter, each component will be described in detail.

[0163] Ⅰ. Composition of the pixel defining layer composition

[0164] (1) Levelling agent

[0165] In order to prevent streaks or black spots during coating, improve the flatness and fluidity of the coating film, improve the flatness performance to prevent color spots or defects, and to prevent residues from occurring due to undeveloped areas, the photosensitive composition of the present invention includes a leveling agent.

[0166] Preferably, the leveling agent of the present invention does not contain fluorine.

[0167] Preferably, the leveling agent is a silicon-based leveling agent.

[0168] Preferably, the molecular weight of the silicon-based compound is from 5,000 g / mol to 15,000 g / mol.

[0169] More preferably, the molecular weight of the silicon-based compound is from 5,000 g / mol to 10,000 g / mol.

[0170] Preferably, the viscosity of the silicon-based compound is 100,000 mm 2 / s to 500,000 mm 2 / s.

[0171] Preferably, when detecting a mixture of 50 wt% of the silicon-based compound and 50 wt% of propylene glycol methyl ether acetate at 20 °C, the viscosity of the silicon-based compound is 10 mm 2 / s to 40 mm 2 / s.

[0172] Preferably, the silicon-based leveling agent contains substituents selected from the group consisting of: alkyl groups having C1 to C 40 ; alkenyl groups having C1 to C 40 ; alkynyl groups having C1 to C 40 ; alkoxy groups having C1 to C 40 ; aryloxy groups having C6 to C 40 ; alkoxy carbonyl groups having C1 to C 40 ; carbonyl group; ether group; ester group; carboxyl group or combinations thereof.

[0173] Among the specific examples of the silicon-based leveling agent, commercially available silicon-based leveling agent products such as EFS-101, EFS-104, EFS-106, EFS-109, EFS-120, EFS-121, EFS-134, EFS-135, EFS-201, EFS-203, EFS-204, EFS-210, EFS-220, EFS-301, EFS-302, EFS-303, EFS-314, EFS-317, EFS-318, EFS-326, EFS-329, EFS-333, EFS-349, EFS-355, EFS-358, EFS-359, EFS-362, EFS-601, EFS-701, EFS-801, RS-55, and RS-56 of DIC Corporation; BYK-333, BYK-378, BYK-3550, BYK-3751, BYK-3754, etc. of BYK Corporation can be used.

[0174] Preferably, in 100 parts by weight of the photosensitive resin composition, the content of the leveling agent is 0.01 part by weight to 0.5 part by weight.

[0175] When the leveling agent is included within the above range, the coating uniformity of the photosensitive composition can be ensured, scarring does not occur, and the wettability of the glass substrate is excellent.

[0176] Moreover, the pixel defining layer formed from the photosensitive composition containing the silicon-based leveling agent of the present invention can achieve excellent contact angle and film surface flatness, and has a low outgassing amount. Therefore, when it is applied to a display, the color can be made vivid while also improving reliability and extending the lifespan.

[0177] (2) Resin for pattern formation

[0178] According to an embodiment of the present invention, the resin for pattern formation may include an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0179] The acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin including one or more acrylic repeating units.

[0180] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing one or more carboxyl groups, and specific examples thereof include: acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof. In the total amount of the acrylic binder resin, the content of the first ethylenically unsaturated monomer may be 5% by weight to 50% by weight, for example, 10% by weight to 40% by weight.

[0181] The second ethylenically unsaturated monomer may be an aromatic ethylene compound such as styrene, α-methylstyrene, vinyltoluene, vinylbenzyl methyl ether; an unsaturated carboxylic acid ester compound such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate; an unsaturated carboxylic acid aminoalkyl ester compound such as 2-aminoethyl (meth)acrylate, 2-dimethylaminoethyl (meth)acrylate; a carboxylic acid vinyl ester compound such as vinyl acetate; an unsaturated carboxylic acid glycidyl ester compound such as glycidyl (meth)acrylate; a cyanated ethylene compound such as (meth)acrylonitrile; an unsaturated amide compound such as (meth)acrylamide; etc. These may be used alone or in combination of two or more.

[0182] Specific examples of the acrylic binder resin include: (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, etc., but are not limited thereto. These may also be used alone or in combination of two or more. The weight average molecular weight of the acrylic binder resin may be from 3,000 g / mol to 150,000 g / mol, for example, from 5,000 g / mol to 50,000 g / mol, for example, from 20,000 g / mol to 30,000 g / mol.

[0183] The cardo resin includes a repeating structure represented by the following Chemical Formula 1.

[0184] <Chemical Formula 1>

[0185]

[0186] In the above Chemical Formula 1,

[0187] 1) R1 and R2 are each independently: hydrogen; deuterium; halogen; an aryl group having 6 to C 30 ; a heterocyclyl group having 2 to C containing at least one hetero atom selected from O, N, S, Si, and P 30 ; a cyclo group which is a fused ring group of an aliphatic ring and an aromatic ring having 6 to C 30 ; an alkyl group having 1 to C 20 ; an alkyl group having 2 to C20 an alkenyl group; C2-C 20 an alkynyl group; C1-C 20 an alkoxy group; C6-C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or C1-C 20 an alkoxy carbonyl group,

[0188] 2) R1 and R2 may form a ring between adjacent groups,

[0189] 3) m or n is independently an integer from 0 to 4,

[0190] 4) A1 and A2 are independently the following Chemical Formula 2 or Chemical Formula 3,

[0191] <Chemical Formula 2>

[0192]

[0193] <Chemical Formula 3>

[0194]

[0195] In the said Chemical Formula 2 and Chemical Formula 3,

[0196] 4-1) * represents the connecting part,

[0197] 4-2) R3 to R6 are independently: hydrogen; deuterium; halogen; C6-C 30 an aryl group; a C2-C containing at least one hetero atom selected from O, N, S, Si and P 30 a heterocyclyl group; C6-C 30 a fused ring group of an aliphatic ring and an aromatic ring; C1-C 20 an alkyl group; C2-C 20 an alkenyl group; C2-C 20 an alkynyl group; C2-C 20 an alkoxy group; C6-C 30aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C 20 alkoxy carbonyl group of

[0198] 4-3) R3 to R6 may form a ring between adjacent groups,

[0199] 4-4) Y1 and Y2 are independently one of the following Chemical Formula 6 or Chemical Formula 7,

[0200] <Chemical Formula 6>

[0201]

[0202] <Chemical Formula 7>

[0203]

[0204] In the said Chemical Formula 6 and Chemical Formula 7,

[0205] 4-4-1) * indicates the bonding position,

[0206] 4-4-2) R9 is hydrogen or methyl ester;

[0207] 4-4-3) R 10 ~R 13 are independently: hydrogen; deuterium; halogen; C6-C 30 aryl group of; C2-C containing at least one hetero atom selected from O, N, S, Si and P 30 heterocyclyl group of; C6-C 30 cyclo group of fused aliphatic and aromatic rings; C1-C 20 Alkyl group of; C2-C 20 alkenyl group of; C2-C 20 alkinyl group of; C1-C 20 alkoxy group of; C6-C 30 aryloxy group; fluorenylgroup; carbonyl group; ether group; or C1-C 20an alkoxycarbonyl group,

[0208] 4-4-4) L1 to L3 are each independently: a single bond; a fluorenylene group; a C2-C 30 alkylene; a C6-C 30 arylene; a C2-C 30 heterocycle; a C1-C 30 alkoxylene; a C2-C 30 alkyleneoxy; a C6-C 30 aryloxy group; a C2-C 30 polyethyleneoxy group,

[0209] 4-4-5) q and r are each independently an integer from 0 to 3; provided that q + r = 3,

[0210] 5) The resin includes a repeating unit represented by Chemical Formula 1, and within the polymer chain, the ratio of A1 to A2 is from 9:1 to 1:9,

[0211] 6) X1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following Chemical Formula 4; or Chemical Formula 5,

[0212] 6-1) R' and R" are each independently: hydrogen; deuterium; halogen; a C6-C 30 aryl group; a C2-C containing at least one hetero atom selected from O, N, S, Si, and P 30 heterocyclyl group; a C6-C 30 cyclo group of a fused ring of an aliphatic ring and an aromatic ring; a C1-C 20 alkyl group; a C2-C 20 alkenyl group; a C2-C 20 alkinyl group; a C1-C 20 alkoxy group; a C6-C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or a C1-C 20an alkoxycarbonyl group

[0213] 6-2) R' and R" may form a ring between adjacent groups

[0214] <Chemical Formula 4>

[0215]

[0216] <Chemical Formula 5>

[0217]

[0218] In the said Chemical Formula 4 and Chemical Formula 5

[0219] 6-3) * indicates the bonding position

[0220] 6-4) R7 to R8 are each independently: hydrogen; deuterium; halogen; a C6-C 30 aryl group; a C2-C containing at least one hetero atom selected from O, N, S, Si and P 30 heterocyclyl group; a C6-C 30 fused cyclo group of an aliphatic ring and an aromatic ring; a C1-C 20 alkyl group; a C2-C 20 alkenyl group; a C2-C 20 alkynyl group; a C1-C 20 alkoxy group; a C6-C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or a C1-C 20 alkoxy carbonyl group

[0221] 6-5) o and p are each independently an integer from 0 to 4

[0222] 7) X2 is a C6-C 30 aryl group; a C2-C containing at least one hetero atom selected from O, N, S, Si and P 30 heterocyclyl group; a C6-C 30A fused ring group (cyclo group) of an aliphatic ring and an aromatic ring; C1-C 20 An alkyl group (Alkyl group); C2-C 20 An alkenyl group (alkenyl group); C2-C 20 An alkynyl group (alkinyl group); C1-C 20 An alkoxy group (alkoxy group); C6-C 30 An aryloxy group (aryloxygroup); A fluorenylene group; A carbonyl group; An ether group; Or C1-C 20 An alkoxy carbonyl group,

[0223] 8) The R', R", X2, L1-L3, R1-R8 and R 10 -R 13 May be further substituted respectively with one or more substituents selected from the group consisting of: Deuterium; A halogen; A substituted or unsubstituted C1-C 30 An alkyl group (Alkylgroup) or C6-C 30 A silane group of an aryl group; A siloxane group (Siloxanegroup); A boron group; A germanium group; A cyano group (cyano group); An amino group; A nitro group; C1-C 30 An alkylthio group; C1-C 30 An alkoxy group (alkoxy group); C6-C 30 An aryl alkoxy group; C1-C 30 An alkyl group (Alkyl group); C2-C 30 An alkenyl group (alkenyl group); C2-C 30 An alkynyl group (alkinyl group); C6-C 30 An aryl group; A C6-C substituted with deuterium 30 An aryl group; A fluorenyl group; C2-C 30a heterocyclyl group containing at least one hetero atom selected from the group consisting of O, N, S, Si, and P; an aliphatic cyclic group having 3 to C 30 an aliphatic cyclic group having 7 to C 30 an arylalkyl group having 8 to C 30 an arylalkenyl group having 8 to C

[0224] When the R', R", X2, L1 to L3, R1 to R8, and R 10 to R 13 is an aryl group, preferably, it may be an aryl group having 6 to C 30 an aryl group, more preferably, it may be an aryl group having 6 to C 18 an aryl group, for example, it may be phenyl, biphenyl, naphthyl, terphenyl, etc.

[0225] When the R', R", X2, L1 to L3, R1 to R8, and R 10 to R 13 is a heterocyclyl group, preferably, it may be a heterocyclyl group having 2 to C 30 a heterocyclyl group, more preferably, it may be a heterocyclyl group having 2 to C 18 a heterocyclyl group, for example, it may be dibenzofuran, dibenzothiophene, naphthobenzothiophene, naphthobenzofuran, etc.

[0226] When the R', R", R1 to R8, and R 10 to R 13 is a fluorenyl group, preferably, it may be 9,9-dimethyl-9H-fluorene, 9,9-diphenyl-9H-fluorenyl group, 9,9'-spirobifluorene, etc.

[0227] When L1 to L3 are arylene groups, preferably, they can be arylene groups having 6 to C 30 arylene groups, and more preferably, they can be arylene groups having 6 to C 18 arylene groups. For example, they can be phenyl, biphenyl, naphthyl, terphenyl, etc.

[0228] When R', R", X2, R1 to R8 and R 10 ~R 13 are alkyl groups, preferably, they can be alkyl groups having 1 to C 10 alkyl groups, for example, they can be methyl, t-butyl, etc.

[0229] When R', R", X2, R1 to R8 and R 10 ~R 13 are alkoxy groups, preferably, they can be alkoxy groups having 1 to C 20 alkoxy groups, and more preferably, they can be alkoxy groups having 1 to C 10 alkoxy groups, for example, they can be methoxy, t-butoxy, etc.

[0230] The ring formed by bonding adjacent groups of R', R", X2, L1 to L3, R1 to R8 and R 10 ~R 13 can be an aromatic ring group having 6 to C 60 ; a fluorenyl group; a heterocyclyl group having 2 to C 60 containing at least one hetero atom selected from O, N, S, Si and P; or an aliphatic ring group having 3 to C 60 . For example, when adjacent groups bond to each other to form an aromatic ring, preferably, an aromatic ring having 6 to C 20 can be formed, and more preferably, an aromatic ring having 6 to C 14 can be formed. For example, benzene, naphthalene, phenanthrene, etc. can be formed.

[0231] For example, the cardo resin can be prepared by mixing two or more of the following components: fluorene-containing compounds such as 9,9-bis(4-glycidyloxyphenyl)fluorene; anhydride compounds such as pyromellitic dianhydride, naphthalene tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride, benzophenone tetracarboxylic dianhydride, pyromellitic dianhydride, cyclobutane tetracarboxylic dianhydride, perylene tetracarboxylic dianhydride, tetrahydrofuran tetracarboxylic dianhydride, and tetrahydrophthalic anhydride; glycol compounds such as ethylene glycol, propylene glycol, and polyethylene glycol; ethanol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; solvent compounds such as propylene glycol monomethyl ether acetate and N-methylpyrrolidone; phosphorus compounds such as triphenylphosphine; and ammonium or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylammonium, triethylammonium, tributylammonium, and benzyltriethylammonium chloride.

[0232] The weight-average molecular weight of the cardo resin is 1,000 to 100,000 g / mol. Preferably, it can be 1,000 to 50,000 g / mol. More preferably, it can be 1,000 to 30,000 g / mol. When the weight-average molecular weight of the resin is within the above range, no residue is generated during the preparation of the light-shielding layer, the pattern formation effect is good, and there is no film thickness loss during development, and a good pattern can be obtained. In the total amount of the photosensitive resin composition, the content of the resin is 1 to 30% by weight. More preferably, the content can be 3 to 20% by weight. When the content of the resin is within the above range, excellent sensitivity, developability, and adhesiveness (tight adhesion) can be obtained.

[0233] (3) Reactive unsaturated compound

[0234] The reactive unsaturated compound is an essential component for negative patterns and has an ethylenic unsaturated double bond. Therefore, during the exposure in the pattern formation process, sufficient polymerization can be initiated to form a pattern with excellent heat resistance, light resistance, and chemical resistance.

[0235] Specific examples of the reactive unsaturated compound include: ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, trimethylolpropane triacrylate, tripentaerythritol octaacrylate, etc.

[0236] Examples of commercially available products of the reactive unsaturated compound are as follows.

[0237] For example, the difunctional esters of (meth)acrylic acid include: aronyx M-210, M-240, M-6200, etc. of Toagosei Co., Ltd.; KAYARAD HDDA, HX-220, R-604, etc. of Nippon Kayaku Co., Ltd.; V-260, V-312, V-335HP, etc. of Osaka Organic Chemical Industry Co., Ltd.

[0238] For example, the trifunctional esters of (meth)acrylic acid include: aronyx M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060, etc. of Toagosei Co., Ltd.; KAYARAD TMPTA, DPCA-20, DPCA-60, DPCA-120, etc. of Nippon Kayaku Co., Ltd.; V-295, V-300, V-360, etc. of Osaka Organic Chemical Industry Co., Ltd.

[0239] The above products can be used alone or in combination of two or more.

[0240] In order to have more excellent developability, the reactive unsaturated compound can be used after being treated with an acid anhydride. In the total amount of the photosensitive resin composition, the content of the reactive unsaturated compound can be 1 to 40% by weight, for example, it can be 1 to 20% by weight. When the content of the reactive unsaturated compound is included within the above range, sufficient curing is initiated during exposure in the pattern formation process, and thus, the reliability is excellent, and the heat resistance, light resistance, and chemical resistance of the pattern are excellent, and the clarity and adhesion are also excellent.

[0241] (4) Photoinitiator

[0242] In order to present a negative pattern through a lithography machine, a photo radical initiator needs to be used. The molar absorption coefficient of the photoinitiator in the region of 330 to 380 nm is 10,000 (L / mol·cm) or more, and the temperature at which the photoinitiator undergoes a 5% weight loss is 270 °C or lower. Among them, the molar absorption coefficient can be calculated by the beer-Lambert Law. And, using TGA, the temperature was raised to 300 °C at a rate of 5 °C per minute in a nitrogen atmosphere, and the weight loss was detected.

[0243] The photopolymerization initiator is usually used in the photosensitive resin composition. For example, an acetophenone-based compound, a benzophenone-based compound, a thioxanthone-based compound, a benzoin-based compound, a triazine-based compound, an oxime-based compound, or a mixture thereof, etc. can be adopted.

[0244] For example, the acetophenone compounds include: 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyltrichloroacetophenone, p-t-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one, etc.

[0245] For example, the benzophenone compounds include: benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

[0246] For example, the thioxanthone compounds include: thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, etc.

[0247] For example, the benzoin compounds include: benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, etc.

[0248] For example, the triazine compounds include: 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-4-trichloromethyl(piperonyl)-6-triazine, 2-4-trichloromethyl(4'-methoxystyryl)-6-triazine, etc.

[0249] For example, the oxime compounds include: 2-(o-benzoyl oxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(o-acetyl oxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanol, (E)-1(((3-cyclopentyl-1-(9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl)propane)amino)oxy)ethan-1-one (PBG-304, Trony Corporation), etc.

[0250] In addition to the compounds, the photoinitiator can also be a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a non-imidazole compound, etc.

[0251] As a free radical polymerization initiator, the photoinitiator can be a peroxide compound, an azo-bis compound, etc.

[0252] For example, the peroxide compounds include: peroxide ketones such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methyl cyclohexanone peroxide, acetylacetone peroxide, etc.; diacyl peroxides such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, bis-3,5,5-trimethylhexanoyl peroxide, etc.; hydroperoxides such as 2,4,4,-trimethylpentan-2-yl hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide, t-butyl hydroperoxide, etc.; dialkyl peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, 1,3-bis(t-butoxyisopropyl)benzene, t-butyl peroxy-n-butyl pivalate, etc.; alkyl succinate peroxides such as 2,4,4-trimethylpentyl peroxyphenoxyacetate, α-cumyl peroxyneodecanoate, t-butyl peroxybenzoate, di-t-butyl peroxytrihexanedioic acid, etc.; percarbonates such as bis-3-methoxybutyl peroxydicarbonate, bis-2-ethylhexyl peroxydicarbonate, bis-4-t-cyclohexylbutyl peroxydicarbonate, diisopropyl peroxydicarbonate, acetyl cyclohexylsulfonyl peroxide, t-aryl peroxycarbonate butyl, etc.

[0253] For example, the azo-bis compounds include: 1,1'-azobis(cyclohexane-1-carbonitrile), 2,2'-azobis(2,4-dimethylpentanenitrile), 2,2,-azobis(isobutyl methyl ester), 2,2'-azobis(4-methoxy-2,4-dimethylpentanenitrile), α,α'-azobis(isobutyronitrile), 4,4'-azobis(4-cyanopentanoic acid), etc.

[0254] After the photoinitiator absorbs light and undergoes a transition to the excited state, it transfers its energy and is thus used together with a photosensitizer that undergoes a chemical reaction. For example, the photosensitizers include: triethylene glycol bis-3-mercaptopropionate, pentaerythritol tetra-3-mercaptopropionate, dipentaerythritol tetra-3-mercaptopropionate, etc.

[0255] In the total amount of the photosensitive composition, the content of the photoinitiator may be 0.01 to 10% by weight, for example, it may be 0.1 to 5% by weight. When the content of the photoinitiator is within the above range, sufficient curing is initiated during exposure in the pattern formation process. Therefore, the reliability is excellent, and the pattern has excellent heat resistance, light resistance, and chemical resistance, as well as excellent clarity and adhesion. In addition, a decrease in transmittance caused by unreacted initiator can be prevented.

[0256] (5) Colorant

[0257] Organic pigments, inorganic pigments, and dyes can all be used as the colorant.

[0258] The colorant can be a red pigment, a green pigment, a blue pigment, a yellow pigment, a black pigment, etc.

[0259] For example, the red pigments include: C.I. Pigment Red 254, C.I. Pigment Red 255, C.I. Pigment Red 264, C.I. Pigment Red 270, C.I. Pigment Red 272, C.I. Pigment Red 177, C.I. Pigment Red 89, etc.

[0260] For example, the green pigments include: copper phthalocyanine pigments substituted with halogen, such as C.I. Pigment Green 36, C.I. Pigment Green 7, etc.

[0261] For example, the blue pigments include: copper phthalocyanine pigments such as C.I. Pigment Blue 15:6, C.I. Pigment Blue 15, C.I. Pigment Blue 15:1, C.I. Pigment Blue 15:2, C.I. Pigment Blue 15:3, C.I. Pigment Blue 15:4, C.I. Pigment Blue 15:5, C.I. Pigment Blue 16, etc.

[0262] For example, the yellow pigments include: isoindoline-based pigments such as C.I. Pigment Yellow 139, quinophthalone-based pigments such as C.I. Pigment Yellow 138, nickel complex pigments such as C.I. Pigment Yellow 150, etc.

[0263] For example, the black pigments include: lactam black, aniline black, perylene black, titanium black, carbon black, etc.

[0264] Also, according to the implementation example, the colorant in the photosensitive resin composition may include a pigment, a dye, or a combination thereof. For example, the dye may include a phthalocyanine compound.

[0265] The above components can be used alone or in combination of two or more as the pigment and the dye, and there is no limitation here.

[0266] The above-mentioned black pigment in the above components can be used to effectively implement light shielding for the light shielding layer. When using the black pigment, it can also be used together with a color correction agent such as an anthraquinone pigment, a perylene pigment, a phthalocyanine pigment, an azo pigment, etc.

[0267] In order to disperse the pigment in the photosensitive resin composition, a dispersant can be used together. Specifically, the pigment can be used after surface pretreatment with a dispersant, or a dispersant can be added together with the pigment when preparing the photosensitive resin composition and then used.

[0268] The dispersant can be a nonionic dispersant, an anionic dispersant, a cationic dispersant, etc. Specific examples of the dispersant include: polyalkylene glycol and its esters, polyoxyalkylene, polyoxyalkylene polyol ester adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonates, carboxylic acid esters, carboxylates, polyoxyalkylene alkylamide adducts, alkyl amines, etc., and these can be used alone or in combination of two or more.

[0269] Examples of the dispersant products on sale include DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc. of BYK Company; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc. of EFKA Chemical Company; Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse20000, Solsperse24000GR, Solsperse 27000, Solsperse 28000, etc. of Zeneka Company; or PB711, PB821, etc. of Ajinomoto Company.

[0270] In the total amount of the photosensitive resin composition, the content of the dispersant can be 0.1% by weight to 15% by weight. When the content of the dispersant is within this range, the dispersibility of the composition is excellent. Subsequently, when preparing the light-shielding layer, the stability, developability, and patternability are excellent.

[0271] The pigment can also be pretreated with water-soluble inorganic salts and a wetting agent before use. When the pigment is used after the pretreatment, refinement of the average particle size of the pigment can be achieved.

[0272] The pretreatment is achieved through the following steps: kneading the pigment together with the water-soluble inorganic salt and the wetting agent; then, filtering and rinsing the pigment obtained in the kneading step.

[0273] The kneading can be carried out at a temperature of 40°C to 100°C, and for the filtering and rinsing, water or the like can be used to rinse the inorganic salt and filter.

[0274] For example, the water-soluble inorganic salts include sodium chloride, potassium chloride, etc., but are not limited thereto.

[0275] The wetting agent uniformly mixes the pigment and the water-soluble inorganic salt, thereby acting as a medium to make the pigment easy to pulverize. For example, there are alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, and diethylene glycol monomethyl ether; alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, and glycerin polyethylene glycol. These can be used alone or in combination of two or more.

[0276] The pigment that has undergone the kneading step can have an average particle size of 20 nm to 110 nm. When the average particle size of the pigment is within the above range, not only the heat resistance and light resistance are excellent, but also a fine pattern can be effectively formed.

[0277] In the total amount of the photosensitive resin composition, the content of the pigment can be 1% to 40% by weight, and more specifically, the content can be 2% to 30% by weight. When the pigment is within the above range, the color reproduction rate is excellent, and the curability and adhesiveness of the pattern are also excellent.

[0278] (6) Solvent

[0279] The solvent is compatible with the cardo resin, the reactive unsaturated compound, the pigment, the cardo compound, and the initiator, and substances that do not react can be used.

[0280] For example, the solvents include: alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisopentyl ether, anisole, and tetrahydrofuran; ethylene glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; ethylene glycol ethyl ether acetates such as methoxyethyl acetate, ethoxyethyl acetate, and diethoxyethyl acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate (PGMEA) and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-dipentyl ketone, and 2-heptanone; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; lactate esters such as methyl lactate and ethyl lactate; alkyl glycollate esters such as methyl glycollate, ethyl glycollate, methyl glycollate, and butyl glycollate; alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, and ethyl ethoxyacetate; 3-oxopropionic acid alkyl esters such as methyl 3-oxopropionate and ethyl 3-oxopropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-oxopropionic acid alkyl esters such as methyl 2-oxopropionate, ethyl 2-oxopropionate, and propyl 2-oxopropionate; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate; 2-oxy-2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate; 2-alkoxy-2-methylpropionic acid alkyl esters such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl glycolate, and methyl 2-hydroxy-3-methylbutanoate; keto acid esters such as ethyl pyruvate, etc.

[0281] Moreover, high-boiling solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, hexanoic acid, octanoic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and ethylene glycol phenyl ether acetate can be used.

[0282] In view of the compatibility and reactivity of the solvent, ethylene glycol ethers such as ethylene glycol monoethyl ether; ethylene glycol alkoxyacetates such as ethoxyethyl acetate; ethers such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate can be used.

[0283] In the total amount of the photosensitive resin composition, the solvent can be included as the balance. Specifically, the content can be 40 to 90% by weight. When the content of the solvent is within the above range, the photosensitive resin composition can have an appropriate viscosity, thereby achieving excellent processability when preparing the pattern layer.

[0284] II. Preparation process of the pixel defining layer

[0285] (1) Coating and coating step

[0286] The photosensitive composition is a low-viscosity liquid reagent. In order to form a coating with a certain thickness after coating on the substrate, a spin coater or a slit coater is used. The advantage of the spin coater is that the higher the rotation speed, the thinner the thickness, but the flatness deviation in the area is reduced. In order to form a coating on a large-area substrate, preferably, a slit coater is used compared with the spin coater. However, its disadvantage is that after the coating is formed, due to the residual solvent, the surface shows fluidity, resulting in a decrease in flatness. In order to overcome this disadvantage, VCD (vacuum chamber dry) is used to locally remove the solvent to reduce the fluidity of the surface.

[0287] (2) Pre-baking step

[0288] In this process, at a certain temperature and time, the substrate with the coating is heated by a hot plate or an oven to locally remove the solvent contained in the coating film. If the surface or the depth of the coating film is not dry, it will cause photomask contamination during the exposure in the next process. When irradiating ultraviolet light, the exposed part is not cured well. When it is not cured, it will cause the development process not to form and remove the pattern.

[0289] (3) Exposure step

[0290] In this process, when the pre-baking process is completed, actinic rays (ultraviolet rays) are irradiated using a photomask with a pattern to cure the formed film. The types of lamps that generate actinic rays include LED lamps or metal (mercury) lamps, and the wavelengths are g-line (436 nm), h-line (405 nm), i-line (365 nm), Deep UV (<260 nm), which can be used separately or in combination.

[0291] (4) Development step

[0292] When the exposure step irradiates actinic rays, the actinic rays are divided into an exposed portion and a non-exposed portion by a photomask. In the case of a positive type, the exposed portion is dissolved by a developer, while the non-exposed portion resists the developer and leaves a pattern. In the case of a negative type, the exposed portion is cured and resistant to the developer, while the non-exposed portion is developed. The black pixel defining layer (Black PDL) prepared using the composition containing the colorant of the present invention is of the negative type and can be divided into an exposed portion (cured) and a non-exposed portion (developed) to form a pattern.

[0293] (5) Post-exposure step

[0294] This process does not use a photomask and irradiates the developed substrate with actinic rays (ultraviolet rays) to further cure the developed film to enhance the film strength. The types of lamps that generate actinic rays include LED lamps or metal (mercury) lamps, and the wavelengths are g-line (436 nm), h-line (405 nm), i-line (365 nm), Deep UV (<260 nm), which can be used separately or in combination.

[0295] (6) Post-baking treatment step

[0296] This process heats the post-exposed substrate at a high temperature of 210 °C to 300 °C to remove residual solvents and fumes. When the solvents and fumes are not completely removed, degassing occurs during the post-baking treatment, which will affect the components, and thus will affect black spots or pixel shrinkage.

[0297] Another implementation example can use the photosensitive resin composition to achieve patterning at the pixel separation portion of the organic light-emitting element electrode.

[0298] Hereinafter, synthesis examples and examples of the present invention will be specifically described, but the synthesis examples and examples of the present invention are not limited thereto.

[0299] (Preparation of black photosensitive composition)

[0300] Synthesis Example 1: (Preparation of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene represented by Chemical Formula 8)

[0301] 20 g of 9,9'-biphenylene fluorene (Sigma Aldrich), 8.67 g of epichlorohydrin (Sigma Aldrich), 30 g of anhydrous potassium carbonate, and 100 ml of dimethylformamide were poured into a 300 ml three-necked round-bottom flask equipped with a distillation tube. The temperature was raised to 80 °C and the reaction was carried out for 4 hours. Then, the temperature was lowered to 25 °C, and the reaction solution was filtered. Then, the filtrate was stirred and dropped into 1000 ml of water, and the precipitated powder was filtered, then washed with water, and dried under reduced pressure at 40 °C to obtain 25 g of 9,9-bis[4-(glycidyloxy)phenyl]fluorene represented by the following Compound 8. The purity of the powder was analyzed by HPLC, and as a result, the purity was 98%.

[0302] <Chemical Formula 8>

[0303]

[0304] Synthesis Example 2: Preparation of a cardo-based binder resin

[0305] 25 g (54 mmol) of Compound 1 obtained in Synthesis Example 1, 8 g of acrylic acid (Ohi Kagaku Kogyo Co., Ltd.), 0.2 g of benzyl triethylammonium chloride (Ohi Kagaku Kogyo Co., Ltd.), 0.2 g of hydroquinone (Ohi Kagaku Kogyo Co., Ltd.), and 52 g of propylene glycol monomethyl ether acetate (Sigma Aldrich) were poured into a 300 ml three-necked round-bottom flask equipped with a distillation tube and stirred at 110 °C for 6 hours. After the reaction was completed, 8 g of biphenyltetracarboxylic dianhydride (Mitsubishi Gas Co., Ltd.) and 1.8 g of tetrahydrophthalic acid (Sigma Aldrich) were further poured in, and then stirred at 110 °C for 6 hours. After the reaction was completed, the reaction solution was recovered and analyzed. As a result, a cardo-based binder resin having a molecular weight of 4,580 and a solid powder content of 45% was obtained.

[0306] Preparation Example 1: Preparation of a black pigment dispersion

[0307] Using a paint shaker (Asada Co., Ltd.), 15 g of Irgaphor Black S100CF (black pigment / BASF), 8.5 g of Disperbyk 163 (BYK), 6.5 g of SR-3613 (SMS), 70 g of propylene glycol monomethyl ether acetate, and 100 g of zirconia beads with a diameter of 0.5 mm (Toray) were dispersed for 10 hours to obtain a dispersion.

[0308] A photosensitive composition solution was prepared using the components shown in Table 1 below.

[0309] Specifically, an initiator is dissolved in a solvent, and then stirred at room temperature. A binder resin and a polymerizable compound are added thereto and stirred at room temperature. Next, a colorant and other additives are added to the obtained reactant and stirred at room temperature. Then, the product is filtered three times to remove impurities, thereby preparing a photosensitive resin composition.

[0310]

Table 1

[0311]

[0312]

[0313] The acrylic resin used is SR-3100 (SMS Corporation, resin having an average molecular weight of 6,000 to 8,000 and including double bonds), the reactive unsaturated compound used is Miraemer M600 (Miwon Chemical Co., Ltd.), the photoinitiator used is PBG-304 (Trony Corporation), and the solvent used is propylene glycol monomethyl ether acetate.

[0314] The molecular weight of the silicone leveling agent used in Compositions 1-1 to 1-5 is 5,000 g / mol to 15,000 g / mol.

[0315] Using GPC (1260 Infinity) of Agilent Corporation, 100 mg of a sample to be detected was dissolved in 10 g of tetrahydrofuran (THF), and then the molecular weight was detected. The GPC Column was analyzed by a combination of Shodex Corporation (GPC-802, 803, 804), and detection was performed using an RI detector at a rate of 1 ml / min for 1 hour.

[0316] The intrinsic viscosity of the silicone leveling agent is 100,000 mm 2 / s to 500,000 mm 2 / s, and the viscosity of a mixture of 50 wt% of the silicone leveling agent and 50 wt% of propylene glycol monomethyl ether acetate detected at 20 °C is 10 mm 2 / s to 40 mm 2 / s.

[0317] 1 ml of the sample was placed in a sample cup, and the viscosity was detected at a temperature of 20 ± 3 °C using a viscometer (LVDVNX-CP) of Brookfield Corporation for 1 minute. During the detection, the main shaft (Z-40) was used, and during the detection, an analysis rpm in the range of 10 to 15 was applied.

[0318] The method for preparing a negative pixel definition layer (negative PDL) using the photosensitive composition is as follows.

[0319] (1) Coating and coating step

[0320] On a 10 cm * 10 cm substrate that has been cleaned and metal-evaporated, the photosensitive composition is coated with a constant thickness using a spin coater, and then, part of the solvent is removed using a vacuum drying chamber (VCD, vacuum chamber dry) to form a coating film. The thickness of the film formed after the coating of the photosensitive composition passes through the VCD is 3.5 μm to 3.3 μm.

[0321] (2) Pre-baking step

[0322] On a hot plate, it is heated at 90 °C to 120 °C for 100 seconds to 150 seconds to facilitate the removal of the solvent contained in the obtained coating film. This process removes a certain amount of solvent to reduce the mask contamination of the pixel pattern when performing the next process (exposure) step and prepares a clean pattern.

[0323] (3) Exposure step

[0324] On the coating film obtained above, a mask with a pixel pattern is sandwiched to form the desired pattern and a certain thickness. Then, actinic rays of 190 nm to 600 nm are irradiated by an exposure machine. Preferably, a metal or LED light source with ghi-line can be irradiated to form a pattern. The exposure dose for forming the pattern is 80 to 110 mJ / cm 2 , and the formed pixel definition layer is of the negative type. The transmittance of the photomask used during exposure has three transmittance zones, namely, 0% (non-exposed part), 20 to 50% (Half-tone), and 100% (Full-tone), to form a pattern.

[0325] (4) Development step

[0326] After performing the exposure step, then, by the dipping method, a 2.38 wt% TMAH (tetramethylammonium hydroxide) developer is used to develop for a certain time (minutes) at 23 ± 2 °C, and then, it is rinsed with deionized water (DI water) to dissolve and remove the unexposed part, leaving only the exposed part to form an image pattern. When the thickness of the coating film is based on Half-tone, it is 1.30 to 1.95 μm, and when it is based on Full-tone, it is 3.20 to 3.40 μm.

[0327] (5) Post-exposure step

[0328] Following the development step, in order to prevent pattern disintegration after post-baking, instead of using a photomask, a metal or LED light source with actinic rays of 190 nm to 600 nm, preferably with ghi-line, is irradiated onto the entire area through an exposure machine to enhance the strength of the coating film. The exposure dose for enhancing the strength is 50 to 1,000 mJ / cm 2 .

[0329] (6) Post-baking step

[0330] In order to obtain the image pattern obtained through the development, post-baking is carried out at 210 °C to 300 °C, and the post-baking time is 60 minutes to 120 minutes to completely remove the solvent, cure the pattern to form a film, and then, outgassing is detected.

[0331] After implementing the post-baking step, the thickness of the half-tone is 1.00 to 1.90 μm, and preferably, the thickness of the full-tone is 2.80 to 3.20 μm.

[0332] (7) Element reliability evaluation

[0333] As Figure 2 and Figure 3 shown, for the element reliability evaluation such as pixel shrinkage and dark spot, according to the various conditions of the composition, on the glass surface, an electrode is formed with a thickness of . On the electrode, according to the steps (1) to (6) above, a pixel defining layer is formed using the photosensitive composition of the present invention to prepare a substrate for evaluation, and reliability inspection factors are confirmed.

[0334] (8) Outgassing detection

[0335] Using a photosensitive composition, a pattern was formed on a substrate through the above steps (1) to (6). Then, the degassing of an area of 10 cm x 10 cm was detected. The coating thickness was 2.90 μm to 3.10 μm after film formation by post-baking, and the weight after coating the photosensitive composition on a 10 cm x 10 cm substrate and performing post-baking was 11 g to 12 g. Using JTD-505Ⅲ of JAI Corporation, the degassing of the substrate was trapped at 250 °C respectively, and the degassing trapping time was 30 minutes. Using QP2020 GC / MS of Shimadzu Corporation, toluene black samples (5, 10, 50 ppm) were detected, and then a calibration curve was prepared, and the degassing generation amount of the trapped samples was amplified and detected. Products made by changing process conditions such as the development time and temperature in the development step, and the heating temperature and heat treatment time in the post-baking step were used as samples, and the detected degassing detection amounts were compared respectively.

[0336] (9) Method for detecting contact angle

[0337] After performing the coating and coating, exposure, development and post-baking as described above, a film of 1.45 μm to 1.55 μm was formed, deionized water (DI water) was dropped thereon, and the contact angle with the surface was detected. The contact angle detection equipment used was the DSA 25 equipment of KRUSS Corporation. A micro syringe was filled with deionized water and 2 μL was dropped, and the contact angle with the interface was detected. When detecting the contact angle, the average of the left and right values of the water droplet was detected.

[0338]

Table 2

[0339]

[0340]

[0341] Referring to the results of Comparative Example 1 and Examples 4 to 6 in Table 2 above, it can be seen that at the same post-baking temperature, among the results of the examples, the degassing amount after post-baking is lower, which is below 40 ppm. Therefore, it is considered that the silicone leveling agent of the present invention contained in the photosensitive composition has better thermal stability at high temperatures compared to the fluorine-based leveling agent.

[0342] And, referring to Table 2 above and Figure 2 It was confirmed that for the examples in which the post-baking temperature was adjusted to the range of 210 °C to 300 °C, compared with the results of Comparative Example 2 with a lower post-baking temperature, the degassing amount decreased, and the contact angle was included in the range of 60° to 100°. After comparing with the results of Comparative Example 3 with a higher post-baking temperature, it was confirmed that the degassing amount level was similar, but the contact angle was included in the range defined by the present invention.

[0343] And, referring to Table 2 above and Figure 3It is confirmed that in the example of preparing the pixel defining layer by post-baking treatment at a temperature in the range of 210°C to 300°C, no residue or pixel shrinkage of the pixel defining layer occurs, and the component structure ensures excellent reliability.

[0344] On the contrary, from the results of Comparative Example 2, it can be confirmed that when the post-baking treatment temperature is lower than 210°C, the outgassing amount increases after the post-baking treatment, and black spots occur in the component. From Comparative Example 3, it can be confirmed that when the post-baking treatment temperature is above 300°C, the pixel defining layer is not heat-resistant, and due to further outgassing during the driving of the component, a pixel shrinkage phenomenon will occur.

[0345] The above description only exemplifies the present invention. As long as those of ordinary skill in the technical field to which the present invention pertains can make various modifications without departing from the essential characteristics of the present invention.

[0346] Therefore, the embodiments disclosed in this specification are used to describe the present invention, rather than to limit the present invention. The idea and scope of the present invention are not limited by such embodiments. The scope of the claims of the present invention should be construed according to the appended claims, and should be construed to include all technologies within the same scope as falling within the scope of the claims of the present invention.

Claims

1. A pixel definition layer, characterized in that: The pixel definition layer comprises a photosensitive composition, the photosensitive composition comprises a leveler containing no fluorine, and the pixel definition layer comprises a half-tone layer.

2. The pixel definition layer according to claim 1, characterized in that: The leveler includes a silicon-based compound.

3. The pixel definition layer according to claim 2, characterized in that: The molecular weight of the silicon-based compound is 5,000 g / mol to 15,000 g / mol.

4. The pixel definition layer according to claim 2, characterized in that: The viscosity of the silicon compound is 100,000 mm 2 / s to 500,000mm 2 / s.

5. The pixel definition layer according to claim 2, characterized in that: The silicon-based compound comprises a substituent selected from the group consisting of: C1 to C 40 Alkyl group; C1~C 40 Alkenyl group; C1~C 40 Alkinyl group; C1~C 30 Alkoxy group; C6~C 40 aryloxy group; C1~C 40 an alkoxy carbonyl group; a carbonyl group; an ether group; an ester group; a carboxyl group or a combination thereof.

6. The pixel definition layer according to claim 1, characterized in that: The preparation thereof comprises the step of post-baking the photosensitive composition.

7. The pixel defining layer according to claim 6, characterized in that: The post-baking step is performed at a temperature of 210° C. to 300° C. for 30 minutes to 120 minutes.

8. The pixel definition layer according to claim 6, characterized in that: The preparation of the pixel definition layer further includes the steps of: coating and coating the photosensitive composition; pre-baking; exposing; developing; and post-exposure.

9. The pixel defining layer according to claim 8, characterized in that: The transmittance of the photomask is divided into three sections, namely, 0% (non-exposed portion), 20-50% (half-tone) and 100% (full-tone), and is formed by a single exposure and development process including a half-tone layer and a full-tone layer.

10. The pixel definition layer according to claim 1, characterized in that: The photosensitive composition comprises: a leveler containing no fluorine in an amount of 0.01 to 0.5 wt % based on the total amount of the leveler.

11. The pixel definition layer according to claim 1, characterized in that: The photosensitive composition comprises a resin, and the resin comprises an acrylic binder resin, a cardo binder resin or a combination thereof.

12. The pixel definition layer according to claim 1, characterized in that: The photosensitive composition includes a colorant; a reactive unsaturated compound; and a photoinitiator.

13. The pixel definition layer according to claim 1, characterized in that: At 25±3°C, the surface of the pixel definition layer is exposed to 2 to 10 μl When water is present, the contact angle with the interface is 60° to 100°.

14. The pixel definition layer according to claim 1, characterized in that: After the post-baking step, the half-tone thickness is 1.00 to 1.90 μm.

15. The pixel definition layer according to claim 1, characterized in that: After the post-baking step, the full-tone thickness is 2.80 to 3.20 μm.

Images