Display device

Abstract

A display device having a first side and a second side may include a first substrate having an end portion, a first etch stop layer having an end portion, a circuit layer, a light emitting layer, a second substrate, and a second etch stop layer. A first etch stop layer may be disposed on the first substrate, and a light emitting layer may be disposed on the first etch stop layer. A second substrate may be disposed on the light emitting layer, and a second etch stop layer may be disposed between the second substrate and the light emitting layer. An end portion of the first etch stop layer protrudes farther than an end portion of the first substrate in a direction of a first side of the display device.

Description

Technical Field

[0001] The present disclosure relates to a display device. Background Art

[0002] According to the material of the light-emitting layer, an electroluminescent display device can be classified into an inorganic light-emitting display device and an organic light-emitting display device. An active-matrix organic light-emitting diode display device includes an organic light-emitting diode (hereinafter referred to as an OLED), which emits light by itself and has advantages of a fast response time, high luminous efficiency, high brightness, and a wide viewing angle. The OLED display device includes an OLED formed in each pixel. Since the OLED display device has a fast response time, high luminous efficiency, high brightness, and a wide viewing angle, and can represent black gradation with perfect black, the OLED display device has excellent contrast and a high color gamut.

[0003] Cover glass that is generally applied to an OLED display device can be used to protect a thin-film encapsulation (TFE) structure to prevent moisture from penetrating from the outside. The cover glass has high strength, but its manufacturing cost is high, so it is not always suitable for unified application to all products. For example, since the strength of the cover glass required in a mobile device is higher than that required in a notebook device, it may be uneconomical to apply the cover glass applied to the mobile device to the notebook device. Therefore, for each model of the display device (e.g., a mobile product, a wearable device, a TV, or a laptop), it is advantageous to distinguish the component in which the structure for protecting the TFE is formed. Summary of the Invention

[0004] Accordingly, embodiments of the present disclosure relate to a display device that substantially eliminates one or more problems caused by limitations and disadvantages of the related art.

[0005] Additional features and aspects will be set forth in the description below, and in part will be apparent from the description, or may be learned by practice of the inventive concepts provided herein. Other features and aspects of the inventive concepts may be realized and obtained by means of the structures particularly pointed out in the written description or claims therefrom as well as the drawings.

[0006] To achieve these and other aspects of the inventive concepts, as specifically implemented and widely described, the display device includes a first side surface and a second side surface facing each other. The display device may include a first substrate having an end, a first etch stop layer having an end disposed on the first substrate, a circuit layer and a light-emitting element layer disposed on the first etch stop layer, a second substrate having an end disposed on the light-emitting element layer, and a second etch stop layer disposed between the second substrate and the light-emitting element layer. In a direction toward the first side surface, the end of the first etch stop layer may protrude further than the end of the first substrate.

[0007] In some embodiments, the display device may further include a coating provided on an end portion of at least one of the first substrate and the second substrate.

[0008] In some embodiments, the second substrate may be located above the second etch stop layer in the vertical direction.

[0009] In some embodiments, an end portion of at least one of the first substrate and the second substrate may be tapered, and an end portion of the coating may be tapered such that the end portion of the coating corresponds to the end portion of at least one of the first substrate and the second substrate.

[0010] In some embodiments, the display device may further include a third side surface and a fourth side surface facing each other. The first substrate may include a fifth side portion and a sixth side portion respectively provided on the first side surface and the second side surface and facing each other, and a seventh side portion and an eighth side portion respectively provided on the third side surface and the fourth side surface and facing each other. The second substrate may include a ninth side portion and a tenth side portion respectively provided on the first side surface and the second side surface and facing each other, and an eleventh side portion and a twelfth side portion respectively provided on the third side surface and the fourth side surface and facing each other.

[0011] In some embodiments, the first etch stop layer may include a thirteenth side portion and a fourteenth side portion respectively provided on the first side surface and the second side surface and facing each other, and a fifteenth side portion and a sixteenth side portion respectively provided on the third side surface and the fourth side surface and facing each other.

[0012] In some embodiments, the second etch stop layer may include a seventeenth side portion and an eighteenth side portion respectively provided on the first side surface and the second side surface and facing each other, and a nineteenth side portion and a twentieth side portion respectively provided on the third side surface and the fourth side surface and facing each other.

[0013] In some embodiments, the fifth side portion and the thirteenth side portion may be arranged to overlap each other in the thickness direction. The sixth side portion and the fourteenth side portion may be arranged to overlap each other in the thickness direction. The seventh side portion and the fifteenth side portion may be arranged to overlap each other in the thickness direction. The eighth side portion and the sixteenth side portion may be arranged to overlap each other in the thickness direction.

[0014] In some embodiments, the ninth side portion and the seventeenth side portion may be arranged to overlap each other in the thickness direction. The tenth side portion and the eighteenth side portion may be arranged to overlap each other in the thickness direction. The eleventh side portion and the nineteenth side portion may be arranged to overlap each other in the thickness direction. The twelfth side portion and the twentieth side portion may be arranged to overlap each other in the thickness direction.

[0015] In some embodiments, the 13th side portion and the 17th side portion may be positioned such that they are not aligned in the thickness direction. The 14th side portion and the 18th side portion may be arranged to overlap each other in the thickness direction. The 15th side portion and the 19th side portion may be arranged to overlap each other in the thickness direction. The 16th side portion and the 20th side portion may be arranged to overlap each other in the thickness direction.

[0016] In some embodiments, the first etch stop layer may have a ring structure and may be arranged to overlap with a region disposed outside the first substrate. The second etch stop layer may have a ring structure and is arranged to overlap with a region disposed outside the second substrate.

[0017] In some embodiments, the first etch stop layer may have a planar structure and may be arranged to overlap with a region disposed inside the first substrate.

[0018] In some exemplary embodiments, the first substrate includes a first region and a second region. The second substrate and the second etch stop layer may be disposed on the first region, and the first etch stop layer may be disposed on the first region and the second region.

[0019] In some embodiments, the 13th side portion may be disposed on the second region, and the 17th side portion may be disposed on the first region.

[0020] In some embodiments, the display device may further include a bonding layer disposed between the second substrate and the first substrate.

[0021] In some embodiments, the bonding layer includes a 21st side portion disposed between the 18th side portion and the 14th side portion.

[0022] In some embodiments, the bonding layer further includes a first bonding layer arranged to overlap with the light-emitting element layer, and the thickness of the 21st side portion is greater than the thickness of the first bonding layer.

[0023] In some embodiments, the display device further includes a back surface coating formed on the back surface of the first substrate.

[0024] In some embodiments, the display device further includes a first side surface coating disposed on the first side surface and on the 5th side portion to overlap with the 13th side portion, a second side surface coating disposed on the second side surface and on the 6th side portion to overlap with the 14th side portion, a third side surface coating disposed on the third side surface and on the 7th side portion to overlap with the 15th side portion, and a fourth side surface coating disposed on the fourth side surface and on the 8th side portion to overlap with the 16th side portion.

[0025] In some embodiments, the 13th side portion includes a protrusion protruding toward the first side surface. The 14th side portion may include a protrusion protruding toward the second side surface. The 15th side portion may include a protrusion protruding toward the third side surface. The 16th side portion may include a protrusion protruding toward the fourth side surface.

[0026] In some embodiments, the 17th side portion may include a protrusion protruding toward the first side surface. The 18th side portion may include a protrusion protruding toward the second side surface. The 19th side portion may include a protrusion protruding toward the third side surface. The 20th side portion may include a protrusion protruding toward the fourth side surface.

[0027] In some embodiments, the size of the second substrate is larger than the size of the first substrate.

[0028] In some embodiments, the 9th side portion may include a protrusion protruding more toward the first side surface than the 5th side portion.

[0029] According to certain embodiments, a display device includes opposite first and second sides, the display device includes a first substrate having an end, a first etch stop layer having an end disposed on the first substrate, a circuit layer and a light-emitting element layer disposed on the first etch stop layer, a second substrate having an end disposed on the light-emitting element layer, a second etch stop layer disposed between the second substrate and the light-emitting element layer, and a coating disposed on the ends of the first substrate and the second substrate. In the direction of the first side, the end of the first etch stop layer may protrude further than the end of the first substrate.

[0030] It should be understood that the foregoing summary and the following detailed description are both exemplary and explanatory and are intended to provide further explanation of the inventive concept claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which are incorporated in and constitute a part of this application, provide a further understanding of the present disclosure and illustrate embodiments of the present disclosure and, together with the description, serve to explain various principles. In the drawings:

[0032] Figure 1 is a plan view showing a display device according to an embodiment of the present disclosure.

[0033] Figure 2 is an exploded perspective view showing a display device according to an embodiment of the present disclosure.

[0034] Figure 3 is along Figure 1 the line I-I' in, showing a display device according to a first embodiment of the present disclosure.

[0035] Figure 4is a cross-sectional view along Figure 1 the line I-I' in, showing a display device according to a second embodiment of the present disclosure.

[0036] Figure 5 is a cross-sectional view along Figure 1 the line I-I' in, showing a display device according to a third embodiment of the present disclosure.

[0037] Figure 6 is a cross-sectional view along Figure 1 the line II-II' in, showing a display device according to a first embodiment of the present disclosure.

[0038] Figure 7 is a cross-sectional view along Figure 1 the line II-II' in, showing a display device according to a third embodiment of the present disclosure.

[0039] Figure 8 is a cross-sectional view along Figure 1 the line I-I' in, showing a display device according to a fourth embodiment of the present disclosure.

[0040] Figure 9 is a cross-sectional view along Figure 1 the line I-I' in, showing a display device according to a fifth embodiment of the present disclosure.

[0041] Figure 10 is a cross-sectional view along Figure 1 the line I-I' in, showing a display device according to a sixth embodiment of the present disclosure.

[0042] Figure 11 is a cross-sectional view of a substrate of a display device according to an embodiment of the present disclosure.

[0043] Figure 12 is a plan view of a mother substrate according to an embodiment of the present disclosure.

[0044] Figure 13 is a view for describing an etching process in a method of manufacturing a display device according to an embodiment of the present disclosure.

[0045] Figure 14 is a view for describing an etching process in a method of manufacturing a display device according to another embodiment of the present disclosure.

[0046] Figures 15 to 26 is a view for describing a method of manufacturing a display device according to an embodiment of the present disclosure. Detailed Description

[0047] Advantages and features of the present disclosure, and methods for realizing these advantages and features, will be clear by referring to the exemplary embodiments described in detail below and the accompanying drawings. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided only as examples so that those skilled in the art can fully understand the content disclosed by the present disclosure and the scope of the present disclosure.

[0048] The shapes, sizes, ratios, angles, quantities, etc. shown in the drawings for describing the exemplary embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto. Throughout the specification, the same reference numerals generally denote the same elements. In addition, in the following description of the present disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "comprising", "having", and "consisting of" used herein generally intend to allow the addition of other components, unless these terms are used together with the term "only". Any reference to the singular may include the plural unless otherwise specifically stated.

[0049] When describing the present disclosure, throughout the specification, the same reference numerals represent the same components.

[0050] When using the terms "comprising", "including", "having", and "consisting of" described in the present disclosure, other parts may be added unless the term "only" is used. When a component is expressed in the singular, it may be interpreted as multiple components unless otherwise specifically stated.

[0051] When describing the positional relationship and interconnection relationship between two components, such as "on", "above", "below", "next to", "connected or coupled", "crossed or intersected", etc., one or more other components may be inserted between the components unless the terms "immediately" or "directly" are described.

[0052] When using terms such as "after", "subsequently", "then", "before", etc. to describe the time relationship, non - consecutive cases may be included unless the terms "immediately" or "directly" are used. Although terms such as "first", "second", etc. are used to describe various components, these components are not limited to these terms. These terms are only used to distinguish one component from other components. Therefore, the first component to be mentioned below may be the second component in the technical concept of the present disclosure.

[0053] The following embodiments can be partially or fully coupled or combined, and various technical intercommunications and drivings are possible. The embodiments can be implemented independently of each other and can be implemented together in an associated relationship.

[0054] In addition, terms (including technical and scientific terms) used in the embodiments of the present disclosure may be interpreted as meanings commonly understood by those skilled in the art to which this application pertains, unless specifically defined and described explicitly, and the meanings of common terms (such as terms defined in a dictionary) may be interpreted in consideration of the background meanings of the related technology.

[0055] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0056] As Figure 1 shown, the display device 100 may include a first side surface 100A and a second side surface 100B facing each other, and a third side surface 100C and a fourth side surface 100D facing each other. The display device 100 may include a first region 101 and a second region 102. The first region 101 may be a display region. The second region 102 may be an IC region in which a driver integrated circuit (IC) for driving the first region 101 is provided. However, the present disclosure is not limited thereto, and the second region 102 may be a sub-display region.

[0057] A bending portion (not shown) may be formed between the first region 101 and the second region 102. In a plan view, the bending portion may be formed with a bending line extending in one direction. The first region 101 and the second region 102 may be bent at a predetermined angle with respect to the bending line.

[0058] As Figure 2 shown, the display device 100 may be manufactured to include substrates 10 and 11. The display device 100 may include a lower substrate 10 (or a first substrate), pads 23 provided on the lower substrate 10, a lower organic film 12 (or a first etch stop layer) provided on the lower substrate 10, a bonding layer 19 provided on the lower organic film 12, an upper organic film 13 (or a second etch stop layer) provided on the bonding layer 19, and an upper substrate 11 (or a second substrate) provided on the upper organic film 13.

[0059] The display device 100 may have, for example, a width in the X-axis direction, a length in the Y-axis direction, and a constant thickness in the Z-axis direction. Since a circuit layer and a light-emitting element layer may be provided on the lower substrate 10, the thickness of the display device 100 may be greater than the thicknesses of the substrates 10 and 11. The width and length of the display device 100 may be set to various design values according to the application field of the display device 100. The display device 100 may be manufactured in a substantially rectangular and quadrilateral plate shape, but is not limited thereto. For example, the display device 100 may be formed of a panel having a different shape with a bending portion.

[0060] When a bent portion is formed between the first region 101 and the second region 102 of the display device 100, an organic film including an organic material may be formed on at least a part of the bent portion so that the display device 100 can be easily bent at the bent portion. The organic material may include a highly elastic resin material or a mixture of two or more highly elastic resin materials. For example, polyimide, polyurethane, acrylic, and silicone synthetic rubber may be applied. For example, in some embodiments, the silicone synthetic rubber may include polydimethylsiloxane (PDMS).

[0061] One or more of the first region 101 and the second region 102 may include a display region capable of reproducing an input image. The sizes of the first region 101 and the second region 102 may be respectively set such that the first region 101 and the second region 102 have different sizes. For example, in some embodiments, the first region 101 may include a pixel array for displaying an image, and the second region 102 may include an IC mounting region in which a driving IC for driving the pixels is mounted. The pad 23 may be provided in the IC mounting region. The pad 23 may be connected to an external circuit (not shown).

[0062] In some embodiments, the first region 101 may include a pixel array for displaying an image, and at least a part of the second region 102 may include a pixel array for displaying an image or preset additional information.

[0063] As described above, the display device 100 may include a first side surface 100A and a second side surface 100B facing each other, and a third side surface 100C and a fourth side surface 100D facing each other. The components included in the display device 100 may be understood as components respectively provided on the first to fourth side surfaces 100A, 100B, 100C, and 100D.

[0064] The lower substrate 10 may include a first side lower substrate 10A (also referred to as the "fifth side portion") provided on the first side surface 100A of the display device 100, a second side lower substrate 10B (also referred to as the "sixth side portion") provided on the second side surface 100B, a third side lower substrate 10C (also referred to as the "seventh side portion") provided on the third side surface 100C, and a fourth side lower substrate 10D (also referred to as the "eighth side portion") provided on the fourth side surface 100D. The second display region may be located in the first side lower substrate 10A, but is not limited thereto.

[0065] The lower organic film 12 may include a first lower organic film 12A (also referred to as the "13th side portion") disposed on the first side surface 100A of the display device 100, a second lower organic film 12B (also referred to as the "14th side portion") disposed on the second side surface 100B, a third lower organic film 12C (also referred to as the "15th side portion") disposed on the third side surface 100C, and a fourth lower organic film 12D (also referred to as the "16th side portion") disposed on the fourth side surface 100D. When viewed from a plan view (e.g., the XY direction) of the display device 100, the first lower organic film 12A may overlap with the first lower substrate 10A. When viewed from a plan view of the display device 100, the second lower organic film 12B may overlap with the second lower substrate 10B. When viewed from a plan view of the display device 100, the third lower organic film 12C may overlap with the third lower substrate 10C. When viewed from a plan view of the display device 100, the fourth lower organic film 12D may overlap with the fourth lower substrate 10D.

[0066] The lower organic film 12 may be formed in a ring structure such that the lower organic film 12 extends around the outer periphery of the lower substrate 10. However, the lower organic film 12 is not limited thereto and may be formed in any suitable structure, such as a planar structure. In addition, the bonding layer 19 may include a first bonding layer 19A formed in a planar structure and disposed to overlap with the inside of the lower substrate 10. As will be described in further detail below, the lower organic film 12 may be configured to stop etching. The lower organic film 12 may be formed to overlap with the inside of the lower substrate 10 within the range of performing its function. The lower organic film 12 is also capable of distinguishing the display device 100 during the etching and cutting processes of the mother substrate. Thus, the lower organic film 12 may be formed in a ring structure. Accordingly, the cost of forming the lower organic film 12 may be reduced, thereby reducing the manufacturing cost of the display device 100.

[0067] The bonding layer 19 may further include a second-side bonding layer 19B (also referred to as the "second 21 side") disposed on the second side surface 100B of the display device 100. However, the bonding layer 19 is not limited thereto, and in some embodiments, it may further include a third-side bonding layer disposed on the third side surface 100C of the display device 100 and a fourth-side bonding layer disposed on the fourth side surface 100D of the display device 100. Although not shown in the figures, a circuit layer and a light-emitting element layer may be formed on the first region 101 of the lower substrate 10. The circuit layer and the light-emitting element layer may be formed in the inner region (e.g., the first region 101) of the lower substrate 10 and may be positioned such that they do not overlap with the outer region (e.g., the second region 102) of the lower substrate 10. The bonding layer 19 may be an adhesive for bonding the upper substrate 11 and the lower substrate 10. In some embodiments, the bonding layer 19 may be formed to have a constant thickness (e.g., in the Z direction) in the inner region where the light-emitting element layer and the circuit layer are formed. In some embodiments, the thickness of the bonding layer 19 formed in the outer region may be greater than the thickness of the bonding layer 19 formed in the inner region. In some embodiments, when the light-emitting element layer or the like is not formed in the outer region, the bonding layer 19 may be formed to have a relatively larger thickness in the inner region to ensure the stability of the display device 100 by bonding the upper substrate 11 and the lower substrate 10.

[0068] In some embodiments, as Figures 3 to 8 shown, the second-side bonding layer 19B may include a thickness that is relatively greater than the thickness of the first bonding layer 19A and may be disposed on the second side surface 100B of the display device 100. However, in other embodiments, the second-side bonding layer 19B having a relatively larger thickness is not limited thereto and may be formed on any side surface that allows for a firm lamination of the upper substrate 11 and the lower substrate 10. When viewed from a top view of the display device 100, the second-side bonding layer 19B may overlap with the second-side lower organic film 12B and the second-side lower substrate 10B. In some embodiments, the second-side bonding layer 19B may overlap with at least a portion of the second-side lower organic film 12B. In other embodiments, the second bonding layer 19B may be disposed to completely overlap with the second-side lower organic film 12B. In some embodiments, the length of the second-side lower organic film 12B in the second direction (e.g., the Y direction) may be greater than the length of the second-side bonding layer 19B in the second direction.

[0069] As described above, in some embodiments, the first bonding layer 19A may be formed in a ring structure. In other embodiments, the first bonding layer 19A may be formed in a planar structure that completely surrounds the interior within the scope of performing its function.

[0070] In some embodiments, when viewed from a top view, the first bonding layer 19A may overlap with the first region 101 and may not overlap with the second region 102, thereby allowing the upper portion of the pad 23 to remain open for connection to an external circuit. The third side of the first bonding layer 19A may overlap with the third-side underlying organic film 12C, and in a first direction (e.g., the X direction), the length of the third-side underlying organic film 12C may be greater than the length of the first bonding layer 19A. For example, when the first region 101 is considered as a display region, the outside of the display region may overlap with the underlying organic film 12, and the first bonding layer 19A may overlap with the inside of the display region 101 of the displayed image.

[0071] The upper organic film 13 may include a first-side upper organic film 13A (also referred to as the "17th side portion") provided on the first side surface 100A of the display device 100, a second-side upper organic film 13B (also referred to as the "18th side portion") provided on the second side surface 100B, a third-side upper organic film 13C (also referred to as the "19th side portion") provided on the third side surface 100C, and a fourth-side upper organic film 13D (also referred to as the "20th side portion") provided on the fourth side surface 100D. The upper organic film 13 may have a symmetric relationship with the underlying organic film 12 and may be formed in a ring structure similar to that of the underlying organic film 12. However, the upper organic film 13 is not limited thereto and may also be formed in a planar structure to overlap with the internal region. The overall structure of the organic film may be selected based on the requirements and expectations of the developer.

[0072] When viewed from a top view of the display device 100, the upper organic film 13 may be formed to overlap with the outer periphery of the first region 101. The upper organic film 13 may be configured to distinguish the display device 100 in the etching and cutting processes of the mother substrate. Therefore, in some embodiments, the upper organic film 13 may be formed in a ring structure. Thus, the manufacturing cost of the display device 100 can be reduced.

[0073] The upper substrate 11 may include a first-side upper substrate 11A (also referred to as the "9th side portion") provided on the first side surface 100A of the display device 100, a second-side upper substrate 11B (also referred to as the "10th side portion") provided on the second side surface 100B, a third-side upper substrate 11C (also referred to as the "11th side portion") provided on the third side surface 100C, and a fourth-side upper substrate 11D (also referred to as the "12th side portion") provided on the fourth side surface 100D. In some embodiments, when the first region 101 is considered as a display region, the upper substrate 11 may overlap with the display region. In the top view of the display device 100, the second-side upper substrate 11B may overlap with the second-side lower substrate 10B, the second-side bonding layer 19B, and the second-side upper organic film 13B.

[0074] As Figures 3 to 7As shown, the display device 100 may include a lower substrate 10 (also referred to as the first substrate), a lower organic film 12 (also referred to as the first etch stop layer) disposed on the lower substrate 10, a circuit layer 14 and a light-emitting element layer 16 stacked in sequence on the lower organic film 12, a package layer 18 covering the light-emitting element layer 16, a bonding layer 19 disposed on the package layer 18 to be in close contact with the upper substrate 11, an upper organic film 13 (also referred to as the second etch stop layer) disposed between the bonding layer 19 and the upper substrate 11, and an upper substrate 11 (also referred to as the second substrate) laminated on the bonding layer 19. The display device 100 may further include a touch sensor layer 21 and a color filter layer 22 disposed on the package layer 18.

[0075] Each of the lower substrate 10 and the upper substrate 11 may be formed of alkaline glass, plate-like alkali-free glass, alkali-free glass, tempered glass, etc. The lower substrate 10 and the upper substrate 11 may be manufactured based on a flexible glass film substrate. The glass film substrate may be a glass film having a thickness of 0.2 mm or less. In some embodiments, the glass film may be formed of a commercially available tempered glass film.

[0076] In some embodiments, the lower substrate 10 may be larger than the upper substrate 11. The lower substrate 10 may include a first region 101 and a second region 102, and the upper substrate 11 may be formed in the first region 101 of the lower substrate 10. The pads 23 may be disposed in a region of the lower substrate 10 that does not overlap with the upper substrate 11. For example, the pads 23 may be disposed in the second region 102. The lower substrate 10 may include a protrusion 10P of the lower substrate 10 that extends in a direction toward the first side surface 100A of the display device 100. The protrusion 10P may protrude farther toward the first side surface 100A than the upper substrate 11.

[0077] In some embodiments, the thickness of each of the lower substrate 10 and the upper substrate 11 may be 500 μm or less. In other embodiments, the thickness of each of the lower substrate 10 and the upper substrate 11 may be 300 μm or less. In still other embodiments, the thickness of each of the lower substrate 10 and the upper substrate 11 may be 200 μm or less. The thickness may be adjusted by an etching process as described below.

[0078] Each of the lower substrate 10 and the upper substrate 11 may include tapered surfaces 10A, 10B, 10C, 10D, 11A, 11B, 11C, and 11D provided on the first to fourth sides of each of the lower substrate 10 and the upper substrate 11. The tapered surfaces may be inclined surfaces. In some embodiments, the tapered surfaces may be linear inclined surfaces, but may include any cross-section that can be formed by an etching fluid in an etching process as will be described below. For example, in some embodiments, the tapered surfaces may include a wedge shape. However, based on the requirements and expectations of the developer, the tapered surfaces may include any suitable shape.

[0079] The lower tapered surfaces may include a first-side lower tapered surface 10A formed on the first-side lower substrate 10A, a second-side lower tapered surface 10B formed on the second-side lower substrate 10B, a third-side lower tapered surface 10C formed on the third-side lower substrate 10C, and a fourth-side lower tapered surface 10D formed on the fourth-side lower substrate 10D.

[0080] The upper tapered surfaces may include a first-side upper tapered surface 11A formed on the first-side upper substrate 11A, a second-side upper tapered surface 11B formed on the second-side upper substrate 11B, a third-side upper tapered surface 11C formed on the third-side upper substrate 11C, and a fourth-side upper tapered surface 11D formed on the fourth-side upper substrate 11D.

[0081] The first-side lower tapered surface 10A formed on the first-side lower substrate 10A may overlap with the first-side lower organic film 12A. The second-side lower tapered surface 10B formed on the second-side lower substrate 10B may overlap with the second-side lower organic film 12B. The third-side lower tapered surface 10C formed on the third-side lower substrate 10C may overlap with the third-side lower organic film 12C. The fourth-side lower tapered surface 10D formed on the fourth-side lower substrate 10D may overlap with the fourth-side lower organic film 12D. The resulting shape surrounded by each of the lower tapered surfaces 10A, 10B, 10C, and 10D and each of the lower organic films 12A, 12B, 12C, and 12D may be shaped such that it includes a tapered shape.

[0082] The first-side tapered surface 11A formed on the first-side substrate 11A may overlap with the first-side organic film 13A. The second-side tapered surface 11B formed on the second-side substrate 11B may overlap with the second-side organic film 13B. The third-side tapered surface 11C formed on the third-side substrate 11C may overlap with the third-side organic film 13C. The fourth-side tapered surface 11D formed on the fourth-side substrate 11D may overlap with the fourth-side organic film 13D. The resulting shape of the display device 100 formed by the perimeter extending along and around each of the upper tapered surfaces 11A, 11B, 11C, and 11D and each of the upper organic films 13A, 13B, 13C, and 13D may include a tapered shape that is an inverted tapered shape compared to the tapered shape of the lower tapered surface.

[0083] On the first-side surface 100A, the first-side lower organic film 12A may extend toward the first-side surface 100A and form a part of the first-side surface 100A. The edge of the first-side lower organic film 12A may protrude further toward the first-side surface 100A than the edge of the first-side lower tapered surface 10A. On the second-side surface 100B, the second-side lower organic film 12B may extend toward the second-side surface 100B and form a part of the second-side surface 100B. The edge of the second-side lower organic film 12B may protrude further toward the second-side surface 100B than the edge of the second-side lower tapered surface 10B. On the third-side surface 100C, the third-side lower organic film 12C may include a protrusion extending toward the third-side surface 100C. The protrusion may extend further toward the third-side surface 100C than the third-side lower tapered surface 10C. On the fourth-side surface 100D, the fourth-side lower organic film 12D may include a protrusion extending toward the fourth-side surface 100D. The protrusion may extend further toward the fourth-side surface 100D than the fourth-side lower tapered surface 10D.

[0084] On the first side surface 100A, the organic film 13A on the first side may include protrusions extending toward the first side surface 100A. The protrusions may extend further toward the first side surface 100A compared to the tapered surface 11A on the first side. On the second side surface 100B, the organic film 13B on the second side may include protrusions extending toward the second side surface 100B. The protrusions may extend further toward the second side surface 100B compared to the tapered surface 11B on the second side. On the third side surface 100C, the organic film 13C on the third side may include protrusions extending toward the third side surface 100C. The protrusions may extend further toward the third side surface 100C compared to the tapered surface 11C on the third side. On the fourth side surface 100D, the organic film 13D on the fourth side may include protrusions extending toward the fourth side surface 100D. The protrusions may extend further toward the fourth side surface 100D compared to the tapered surface 11D on the fourth side.

[0085] In some embodiments, on the first side surface 100A, when viewed in cross-section, the organic film 12A under the first side and the organic film 13A on the first side may be formed to be misaligned such that they do not overlap each other in the thickness direction of the display device 100.

[0086] In some embodiments, on the second side surface 100B, when viewed in cross-section, the organic film 12B under the second side and the organic film 13B on the second side may be formed to overlap each other. On the third side surface 100C, when viewed in cross-section, the organic film 12C under the third side and the organic film 13C on the third side may be formed to overlap each other. On the fourth side surface 100D, when viewed in cross-section, the organic film 12D under the fourth side and the organic film 13D on the fourth side may be formed to overlap each other.

[0087] As Figure 5 and Figure 7As shown, the display device 100 may include a plurality of side surface coatings 25, 26 respectively disposed on the first to fourth side surfaces 100A, 100B, 100C, and 100D. The plurality of side surface coatings may include a first lower side surface coating 25A disposed on the first side lower substrate 10A, a second lower side surface coating 25B disposed on the second side lower substrate 10B, a third lower side surface coating 25C disposed on the third side lower substrate 10C, and a fourth lower side surface coating 25D disposed on the fourth side lower substrate 10D. The display device 100 may further include a first upper side surface coating 26A disposed on the first side upper substrate 11A, a second upper side surface coating 26B disposed on the second side upper substrate 11B, a third upper side surface coating 26C disposed on the third side upper substrate 11C, and a fourth upper side surface coating 26D disposed on the fourth side upper substrate 11D. The side surface coatings 25 and 26 may be formed to make the upper substrate 11 or the lower substrate 10 flat. Accordingly, the rigidity of the side surfaces of the display device may be enhanced.

[0088] The first side surface of the first lower side surface coating 25A and the first upper side surface coating 26A may be a surface that is actually sawed or cut, and may have a flat cross-section. The second side surface of the second lower side surface coating 25B and the second upper side surface coating 26B may be a surface that is actually sawed or cut, and may have a flat cross-section. The third side surface of the third lower side surface coating 25C and the third upper side surface coating 26C may be a surface that is actually sawed or cut, and may have a flat cross-section. The fourth side surface of the fourth lower side surface coating 25D and the fourth upper side surface coating 26D may be a surface that is actually sawed or cut, and may have a flat cross-section.

[0089] The lower side surface coating 25 may be disposed adjacent to the end of the lower substrate 10. The end of the lower substrate 10 may be formed at an angle such that the end is tapered. The lower side surface coating 25 may be formed to have a tapered portion complementary to the end of the lower substrate. The upper surface of the lower side surface coating 25 may be disposed close to the lower surface of the first etch stop layer 12. In some embodiments, the upper surface of the lower side surface coating 25 may directly contact the lower surface of the first etch stop layer 12.

[0090] As described with respect to the lower substrate 10, the upper substrate 11 may include a tapered end. Similarly, the upper side surface coating 26 may be formed to have a tapered portion complementary to the tapered end of the upper substrate 11. The lower surface of the upper side surface coating 26 may be disposed close to the upper surface of the second etch stop layer 13. In some embodiments, the lower surface of the upper side surface coating 26 may directly contact the upper surface of the second etch stop layer 13.

[0091] In some embodiments, each of the lower organic film 12 and the upper organic film 13 is an etch stop layer and may include an organic material that has strong resistance to an etch solution. For example, the etch stop layer may include at least one selected from the group consisting of polyester-based polymers, silicone-based polymers, acrylic polymers, polyolefin-based polymers, and copolymers thereof. However, the etch stop layer is not necessarily limited thereto, and may include any one of various materials that have strong resistance to an etch solution. Since polyimide has acid resistance and heat resistance, in some embodiments, polyimide may be applied to high-temperature processes for forming the circuit layer 14 and the light-emitting element layer 16. The upper organic film 13 may be made of a black-based organic material to form a decorative line for marking or the like.

[0092] The circuit layer 14 may include a pixel circuit connected to a data line, a gate line, and a power line, a gate driving unit connected to the gate line, and the like. The pixel circuit and the gate driving unit may include circuit elements such as thin film transistors (TFTs) and capacitors. When a bent portion is formed in the display device 100, the circuit layer 14 may include lines such as a data line, a gate line, and a power line.

[0093] The light-emitting element layer 16 may include an organic light-emitting diode (OLED) driven by a driving element of the pixel circuit. The OLED may include an organic compound layer formed between an anode and a cathode. The organic compound layer may include, but is not limited to, a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL). When a voltage is applied to the anode and the cathode of the OLED, holes passing through the hole transport layer (HTL) and electrons passing through the electron transport layer (ETL) may move to the light-emitting layer (EML) to form excitons, and thus, visible light may be emitted from the light-emitting layer (EML). The light-emitting element layer 16 may further include a color filter array for selectively transmitting light of red, green, or blue wavelengths.

[0094] The pad 23 may include an IC driver in which a plurality of drivers required for driving the display device 100 are integrated. For example, the pad 23 may include a chip on film (COF), a printed circuit board (PCB), or the like.

[0095] The light-emitting element layer 16 and the circuit layer 14 may be covered with a protective layer (not shown in the figure). The protective layer and the encapsulation layer 18 may be formed of an inorganic film made of glass, metal, aluminum oxide (AlOx), or a silicon-based material, or may be a structure in which an organic film and an inorganic film are alternately stacked. The inorganic film may block the penetration of moisture or oxygen. The organic film may flatten the surface of the inorganic film. When the organic film and the inorganic film are stacked in multiple layers, the movement path of moisture or oxygen may become longer than that of a single layer, and thus, the penetration of moisture / oxygen that affects the light-emitting element layer 16 may be effectively blocked.

[0096] The color filter layer 22 may be disposed on the encapsulation layer 18. The color filter layer 22 may improve the outdoor visibility of the display device 100. The color filter layer 22 may reduce the light reflected from the surface of the display device 100 and block the light reflected from the metal of the circuit layer 14 to improve the brightness. The color filter layer 22 may be implemented as a polarizer or a circular polarizer in which a linear polarizer and a phase retardation film are laminated. The touch sensor layer 21 and the color filter layer 22 may be omitted by the developer.

[0097] The bonding layer 19 may be bent and extended from at least a part (e.g., the second side) of the remaining edge regions (e.g., the second side to the fourth side) except for the region where the pads 23 connected to the external circuit are formed, and may be disposed in contact with the lower organic film 12. In some embodiments, the bonding layer 19 may be disposed between the color filter layer 22 and the upper substrate 11 in the inner region of the first region 101 to fixedly bond the color filter layer 22 and the upper substrate 11. The bonding layer 19 may also be disposed between the lower organic film 12 and the upper organic film 13 on the second side of the outer region of the first region 101 to fixedly bond the lower substrate 10 on which the lower organic film 12 is formed and the upper substrate 11 on which the upper organic film 13 is formed.

[0098] Although not shown in the figure, the lower substrate 10 may be removed at the boundary between the first region 101 and the second region 102, and the boundary may become a curved portion. The lower substrate 10 may be formed to expose the organic film positioned to overlap with the curved portion to the rear surface of the display device 100.

[0099] As Figure 4 、 Figure 5 and Figure 7 shown, a rear surface coating 24 may be formed on the entire rear surface of the lower substrate 10. The rear surface coating 24 may be formed on the back surface of the lower substrate 10 so as to overlap with the first region 101. The rear surface coating 24 may be formed to make the rear surface of the lower substrate 10 flat. The rear surface coating 24 may be formed to overlap with the lower side surface coatings 25A, 25B, 25C, and 25D of the first to fourth sides, respectively.

[0100] The rear surface coating 24 may be formed of a material having excellent stretchability, which can prevent the rigidity from deteriorating when the lower substrate 10 of the display device 100 becomes thinner. The rear surface coating 24 may be formed in the form of a reinforcing film capable of preventing scratches on the lower substrate 10.

[0101] The rear surface coating 24 may be made of an organic material, which includes, for example, a polyester-based polymer or an acrylic-based polymer.

[0102] As Figures 8 to 10As shown, the upper substrate 11 may be larger than the lower substrate 10. The upper substrate 11 may include a first region 101 and a second region 102. For example, the pads 23 may be formed on the circuit layer 14 that overlaps with the second region 102. The organic film 13A on the first side and the organic film 12A under the first side may be arranged such that they are not aligned in the thickness direction of the display device. The upper substrate 11 may include a protruding portion 11P of the upper substrate 11 that protrudes further toward the first side than the lower substrate 10. For example, the pads 23 may be disposed in the second region 102. According to such a borderless display device, when viewed from the front of the display device 100, the border as a non-display region can be reduced. In addition, the product can be made smaller and lighter.

[0103] Figure 11 is a cross-sectional view of a substrate of a display device according to an embodiment of the present disclosure. Such a substrate can be applied to and / or used in any of the above embodiments.

[0104] As Figure 11 shown, the edge sidewalls of the lower substrate 10 or the upper substrate 11 may be processed into a wedge shape. The sidewalls of the corner portions where the two sides of the lower substrate 10 or the upper substrate 11 meet may also be processed into a wedge shape. The wedge shape means that when viewed from the edge cross-section of the lower substrate 10 or the upper substrate 11, the tapered surfaces 10C, 10D, 11C, and 11D of each of the upper half thickness portion or the lower half thickness portion of the lower substrate 10 or the upper substrate 11 are symmetric with respect to the thickness center REF of the lower substrate 10 or the upper substrate 11. Due to the vertically symmetric tapered surfaces 10C, 10D, 11C, and 11D, the thickness of the lower substrate 10 or the upper substrate 11 may gradually become thinner from the edge to the sidewall. The edge thickness STH of the lower substrate 10 or the upper substrate 11 may be inversely proportional to the distance L from the center.

[0105] As Figure 12 shown, the display device 100 may be formed by a process of forming thin films in a plurality of cells 1100 on a mother substrate (glass) 1000, which is a large glass substrate. As Figure 12 shown, one cell 1100 represents one display panel.

[0106] A plurality of display devices 100 may be manufactured simultaneously in a multi-panel process to reduce costs. First, a plurality of cells 1100 may be formed on the mother substrate 1000. After forming the plurality of cells 1100, a cutting line 1000c may be provided on the mother substrate 1000. The cutting line 1000c may be marked by laser patterning as will be described below. As shown, only a part of the cutting line 1000c is shown. Each cell 1100 may be separated (or cut) from the mother substrate 1000 with respect to the cutting line 1000c.

[0107] As Figure 13As shown, a mask MSK can be disposed on one surface of substrates 10 and 11, and organic films 12 and 13 can be disposed on the other surface of substrates 10 and 11. In some embodiments, a circuit layer and an organic light-emitting layer are disposed on organic films 12 and 13. However, for ease of description, they are omitted as shown. The mask MSK and the organic films 12 and 13 can be organic films applied to or laminated onto substrates 10 and 11. The organic films 12 and 13 can be used as an etch stop layer in an etching process. The mask MSK can include openings through which substrates 10 and 11 are exposed to a glass etch fluid GEF. The openings of the mask MSK can be formed by laser patterning. The shape, thickness, distance, etc. of the pattern to be formed on substrates 10 and 11 can be determined according to the shape and distance of the openings and the etching process time. The mask MSK can be removed after the etching process. Substrates 10 and 11 can be etched by spraying the glass etch fluid GEF onto substrates 10 and 11 laminated with the mask MSK, or by dipping substrates 10 and 11 into the glass etch fluid GEF.

[0108] The glass etch fluid GEF can be supplied onto substrates 10 and 11 through the openings of the mask MSK. Substrates 10 and 11 exposed through the openings of the mask MSK can react with the glass etch fluid GEF and start to be etched.

[0109] The glass exposed to the glass etch fluid GEF can be etched to form openings in substrates 10 and 11, and as the etching process time elapses, the depth of the openings can increase.

[0110] During the etching process, as the etching process time further increases, the glass etch fluid GEF enters between substrates 10 and 11 and the organic films 12 and 13, and between substrates 10 and 11 and the mask MSK, such that a tapered surface can be formed on the sidewall substrates overlapping the openings in the substrate thickness direction.

[0111] As the etching process time increases, tapered surfaces start to form at the edges of substrates 10 and 11 exposed to the glass etch fluid GEF, and as the process time further increases, the tapered surfaces can extend. When the lower surface of substrate 10 is exposed to the glass etch fluid GEF during the etching process, the thickness of substrate 10 can decrease, so the tapered surfaces can extend (e.g., see L in Figure 11 . When the thickness and cross-sectional wedge shape of the glass substrate reach predetermined design values, the etching process can be stopped.

[0112] As Figure 14 shown, substrates 10 and 11 exposed to a primary glass etch fluid GEF1 can be etched to form openings in substrates 10 and 11.

[0113] The etching process may be stopped after forming an opening of a predetermined size. At this time, the mask MSK may be removed. The substrates 10 and 11 may have a thickness D1 before performing the first etching process, and may have a thickness D2 in the opening after the opening is formed. In an exemplary embodiment, D1 may be in the range of 400 μm to 600 μm, and the thickness D2 of the opening may be in the range of 200 μm to 400 μm. The etched thickness (D1 - D2) of the opening may be 200 μm or greater.

[0114] After removing the mask MSK, the substrates 10 and 11 may be exposed to a secondary glass etching fluid GEF2. In the case of removing the mask, the entire substrates 10 and 11 may be etched to reduce the total thickness. After performing the second etching process, the thickness of the substrates 10 and 11 may be in the range of 100 μm to 300 μm. The thickness of the substrates 10 and 11 etched by the secondary glass etching fluid GEF2 may be at least 300 μm and may be greater than the thickness D2 of the opening. The organic films 12 and 13 may be used as an etch stop layer to prepare for the case where the number of etching occurrences exceeds the necessary number. Holes may be formed in the substrates 10 and 11 corresponding to the portion where the opening is formed, and the holes include a tapered surface formed by the second etching process. The holes may be formed to overlap with the organic films 12 and 13.

[0115] As Figure 15 shown, the lower organic film 12, the circuit layer 14, the light-emitting element layer 16, and the encapsulation layer 18 may be formed on the lower mother substrate 10. In some embodiments, the lower mother substrate 10 may further include a touch sensor layer 21 and a color filter layer 22.

[0116] As Figure 16 shown, the upper organic film 13 may be formed on the upper mother substrate 11.

[0117] As Figure 17 shown, the lower mother substrate 10 and the upper mother substrate 11 may be laminated using the bonding layer 19. The bonding layer 19 may not be applied on the portion where the pads are provided after cutting, and the bonding layer 19 may be formed to laminate the upper mother substrate 11 and the lower mother substrate 10 in the portion where the light-emitting element layer is not provided, and to laminate the color filter layer 22 and the upper mother substrate 11 in the portion where the light-emitting element layer is provided (as shown in the figure).

[0118] As Figure 18As shown, before performing the process for marking the cutting line, a process of adjusting the thickness of the upper mother substrate 11 and / or the lower mother substrate 10 may be performed. For example, in order to reduce the thickness of the lower mother substrate 10, a mask MSK may be formed on the upper mother substrate 11, and a glass etching fluid GEF may be sprayed on the lower mother substrate 10. In some embodiments, before lamination and etching, the upper mother substrate 11 and the lower mother substrate 10 may be formed to have substantially the same thickness. In this case, since the mother substrate can be used for both substrates, there may be an economic advantage of reducing the manufacturing cost of the display device. Additionally, if necessary (for example), in order to adjust the thickness later, a process of separately spraying the etching fluid on the lower mother substrate 10 may be added, so there is an advantage that the developer can appropriately adjust the thickness of the substrate later.

[0119] In some embodiments, after performing the etching process for adjusting the substrate thickness, the lower mother substrate 10 may have a thickness D1A, and the upper mother substrate 11 may have a thickness D1B.

[0120] As Figure 19 shown, the mask MSK may be formed on each of the upper mother substrate 11 and the lower mother substrate 10. The mask MSK may be disposed on the upper surface of the upper mother substrate 11. The mask MSK may be disposed on the lower surface of the lower mother substrate 10. Thereafter, openings may be formed in the mask MSK by the laser patterning process as described above. The formed openings may become the above-mentioned cutting lines.

[0121] As Figure 20 shown, a primary glass etching fluid GEF1 may be sprayed into the openings formed in the mask MSK. When the etching time is appropriately adjusted, an etching process may be performed such that the thickness of the upper mother substrate overlapping the opening is D2B, and the thickness of the lower mother substrate overlapping the opening is D2A. Holes may be formed in the portions of the mother substrates 10 and 11 overlapping the openings of the mask MSK. In some embodiments, since the thickness of the upper mother substrate and the thickness of the lower mother substrate may be formed differently as Figure 18 shown, D2A may be different from D2B.

[0122] As Figure 21 shown, the mask disposed on the upper mother substrate 11 and the mask disposed on the lower mother substrate 10 may be removed.

[0123] As Figure 22 shown, a secondary glass etching fluid GEF2 may be sprayed on each of the upper mother substrate 11 and the lower mother substrate 10. At this time, the openings that have been etched by the primary glass etching fluid GEF1 and whose thickness has been adjusted may be continuously etched to make the openings become holes. Due to the nature of etching and the like, the holes may have a tapered surface, but are not limited thereto.

[0124] In some embodiments, the thicknesses D3A and D3B formed by etching with the secondary glass etching fluid GEF2 may be greater than the thicknesses D2A and D2B of the openings whose thicknesses have been adjusted by the primary glass etching fluid GEF1. The thickness D3B of the upper mother substrate 11 remaining after performing the etching process may be 500 μm or less, preferably 300 μm or less, or 200 μm or less. The thickness D3A of the lower mother substrate 10 remaining after performing the etching process may be 500 μm or less, 300 μm or less, or preferably 200 μm or less.

[0125] In some embodiments, the thickness D3A of the lower mother substrate 10 and the thickness D3B of the upper mother substrate 11 remaining after performing the etching process may be different. The thickness D3A of the lower mother substrate 10 may be substantially the same as the thickness of the lower substrate of the display device according to an embodiment of the present disclosure after performing the cutting process. The thickness D3B of the upper mother substrate 11 may be substantially the same as the thickness of the upper substrate of the display device according to an embodiment of the present disclosure after performing the cutting process. Accordingly, the thicknesses of the upper substrate and the lower substrate of the display device according to an embodiment may be different.

[0126] As Figure 23 shown, the back surface coating 24 may be formed on the back surface of the lower mother substrate 10. Alternatively, in some embodiments, the side surface coatings 25 and 26 may be formed on the tapered surfaces formed by the secondary glass etching fluid GEF2.

[0127] Then, the upper mother substrate 11 and the lower mother substrate 10 may be cut. The primary cutting may be performed on the portion where the cutting lines of the upper mother substrate 11 and the lower mother substrate 10 overlap each other to separate the display device.

[0128] Then, as Figure 24 shown, the second cutting may be performed on the first side portion of the upper substrate 11 to open the portion where the pads are provided without the bonding layer.

[0129] As Figure 25 shown, during the manufacturing process of the display device, an automatic probe test may be performed to perform electrical tests on the entire display panel, such as line short - circuit and switching tests. The automatic probe test may be performed by a process of applying an electrical test signal after allowing a test probe to contact an automatic probe test pad (hereinafter referred to as "AP pad") formed on the display panel. The test signal may be applied to the display device through a test line connected to the AP pad. In some embodiments, the test line may be connected to a bonding pad to which a chip - on - film (COF) is attached. The AP pad may be removed by a cutting process using a laser to form a narrow border after the automatic probe test.

[0130] The third cutting can be performed on the first side portion of the lower substrate 10. The portion cut off by the third cutting may include the AP pads removed after the above-mentioned automatic probe test.

[0131] Then, as Figure 26 shown, the pad 23 can be attached to the first side portion. According to some embodiments, by implementing the lamination process and cell separation of the upper substrate (instead of the cover glass) and the mother substrate, the manufactured display device may include an upper substrate having different rigidities for various applications.

[0132] According to some embodiments, the mother substrate can be selectively etched according to process optimization to manufacture a display device from the mother substrate.

[0133] Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto, and the present disclosure can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all aspects and do not limit the present disclosure. The protection scope of the present disclosure should be interpreted based on the appended claims, and all technical concepts within the equivalent scope should be interpreted as falling within the scope of the present disclosure.

[0134] The exemplary embodiments of the present disclosure can be described as follows.

[0135] In one or more exemplary embodiments, a display device has a first side surface and a second side surface facing each other. The display device may include a first substrate having an end, a first etch stop layer having an end disposed on the first substrate, a circuit layer and a light-emitting element layer disposed on the first etch stop layer, a second substrate having an end disposed on the light-emitting element layer, and a second etch stop layer disposed between the second substrate and the light-emitting element layer. In the direction toward the first side surface, the end of the first etch stop layer may protrude further than the end of the first substrate.

[0136] In some exemplary embodiments, the display device may further include a coating disposed on the end of at least one of the first substrate and the second substrate.

[0137] In some exemplary embodiments, the second substrate may be located above the second etch stop layer in the vertical direction.

[0138] In some exemplary embodiments, the end of at least one of the first substrate and the second substrate may be tapered, and the end of the coating may be tapered such that the end of the coating corresponds to the end of at least one of the first substrate and the second substrate.

[0139] In some exemplary embodiments, the display device may further include a third side surface and a fourth side surface facing each other. The first substrate may include a fifth side portion and a sixth side portion respectively disposed on the first side surface and the second side surface and facing each other, and a seventh side portion and an eighth side portion respectively disposed on the third side surface and the fourth side surface and facing each other. The second substrate may include a ninth side portion and a tenth side portion respectively disposed on the first side surface and the second side surface and facing each other, and an eleventh side portion and a twelfth side portion respectively disposed on the third side surface and the fourth side surface and facing each other.

[0140] In some exemplary embodiments, the first etch stop layer may include a thirteenth side portion and a fourteenth side portion respectively disposed on the first side surface and the second side surface and facing each other, and a fifteenth side portion and a sixteenth side portion respectively disposed on the third side surface and the fourth side surface and facing each other.

[0141] In some exemplary embodiments, the second etch stop layer may include a seventeenth side portion and an eighteenth side portion respectively disposed on the first side surface and the second side surface and facing each other, and a nineteenth side portion and a twentieth side portion respectively disposed on the third side surface and the fourth side surface and facing each other.

[0142] In some exemplary embodiments, the fifth side portion and the thirteenth side portion may be arranged to overlap each other in the thickness direction. The sixth side portion and the fourteenth side portion may be arranged to overlap each other in the thickness direction. The seventh side portion and the fifteenth side portion may be arranged to overlap each other in the thickness direction. The eighth side portion and the sixteenth side portion may be arranged to overlap each other in the thickness direction.

[0143] In some exemplary embodiments, the ninth side portion and the seventeenth side portion may be arranged to overlap each other in the thickness direction. The tenth side portion and the eighteenth side portion may be arranged to overlap each other in the thickness direction. The eleventh side portion and the nineteenth side portion may be arranged to overlap each other in the thickness direction. The twelfth side portion and the twentieth side portion may be arranged to overlap each other in the thickness direction.

[0144] In some exemplary embodiments, the thirteenth side portion and the seventeenth side portion may be positioned such that they are not aligned in the thickness direction. The fourteenth side portion and the eighteenth side portion may be arranged to overlap each other in the thickness direction. The fifteenth side portion and the nineteenth side portion may be arranged to overlap each other in the thickness direction. The sixteenth side portion and the twentieth side portion may be arranged to overlap each other in the thickness direction.

[0145] In some example embodiments, the first etch stop layer may have a ring structure and may be arranged to overlap with a region disposed outside the first substrate. The second etch stop layer may have a ring structure and may be arranged to overlap with a region disposed outside the second substrate.

[0146] In some example embodiments, the first etch stop layer may have a planar structure and may be arranged to overlap with a region disposed inside the first substrate.

[0147] In some example embodiments, the first substrate includes a first region and a second region. The second substrate and the second etch stop layer may be disposed on the first region, and the first etch stop layer may be disposed on the first region and the second region.

[0148] In some example embodiments, the 13th side portion may be disposed on the second region, and the 17th side portion may be disposed on the first region.

[0149] In some example embodiments, the display device may further include a bonding layer disposed between the second substrate and the first substrate.

[0150] In some example embodiments, the bonding layer includes a 21st side portion disposed between the 18th side portion and the 14th side portion.

[0151] In some example embodiments, the bonding layer further includes a first bonding layer arranged to overlap with the light-emitting element layer, and the thickness of the 21st side portion is greater than the thickness of the first bonding layer.

[0152] In some example embodiments, the display device further includes a back surface coating formed on the back surface of the first substrate.

[0153] In some example embodiments, the display device further includes a first side surface coating disposed on the first side surface and disposed on the 5th side portion to overlap with the 13th side portion, a second side surface coating disposed on the second side surface and disposed on the 6th side portion to overlap with the 14th side portion, a third side surface coating disposed on the third side surface and disposed on the 7th side portion to overlap with the 15th side portion, and a fourth side surface coating disposed on the fourth side surface and disposed on the 8th side portion to overlap with the 16th side portion.

[0154] In some example embodiments, the 13th side portion includes a protruding portion protruding toward the first side surface. The 14th side portion may include a protruding portion protruding toward the second side surface. The 15th side portion may include a protruding portion protruding toward the third side surface. The 16th side portion may include a protruding portion protruding toward the fourth side surface.

[0155] In some exemplary embodiments, the 17th side portion may include a protrusion protruding toward the first side surface. The 18th side portion may include a protrusion protruding toward the second side surface. The 19th side portion may include a protrusion protruding toward the third side surface. The 20th side portion may include a protrusion protruding toward the fourth side surface.

[0156] In some exemplary embodiments, the size of the second substrate is larger than the size of the first substrate.

[0157] In some exemplary embodiments, the 9th side portion may include a protrusion protruding more toward the first side surface than the 5th side portion.

[0158] In one or more exemplary embodiments, the display device has opposite first and second sides, and the display device includes a first substrate having ends, a first etch stop layer having ends disposed on the first substrate, a circuit layer and a light-emitting element layer disposed on the first etch stop layer, a second substrate having ends disposed on the light-emitting element layer, a second etch stop layer disposed between the second substrate and the light-emitting element layer, and a coating disposed on the ends of the first substrate and the ends of the second substrate. In the direction of the first side, the end of the first etch stop layer may protrude further than the end of the first substrate.

[0159] As described above, specific exemplary embodiments of the present disclosure have been described in more detail with reference to the drawings. However, the present disclosure is not limited to the foregoing exemplary embodiments, but various modifications can be made without departing from the principles of the present disclosure. Therefore, the foregoing exemplary embodiments disclosed herein should be construed as illustrative of the principles of the present disclosure rather than limiting the principles of the present disclosure, and the scope of the present disclosure is not limited to the foregoing exemplary embodiments. Therefore, the foregoing exemplary embodiments should not be construed as exhaustive in any respect.

[0160] It will be apparent to those skilled in the art that various modifications and variations can be made in the present disclosure without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure is intended to cover such modifications and variations of the present disclosure.

Claims

1. A display device, the display device having a first side surface and a second side surface facing each other, the display device comprising: a first substrate having an end portion; a first etch stop layer disposed on the first substrate and having an end; A circuit layer and a light emitting element layer, wherein the circuit layer and the light emitting element layer are arranged on the first etching stop layer; a second substrate disposed on the light emitting element layer and having an end portion; as well as a second etching stop layer, the second etching stop layer being disposed between the second substrate and the light emitting element layer, Wherein, in a direction toward the first side surface, an end portion of the first etching stop layer protrudes further than an end portion of the first substrate. 2 . The display device according to claim 1 , further comprising a coating layer disposed on an end portion of at least one of the first substrate and the second substrate.

3. The display device according to claim 1, wherein: The second substrate is located above the second etch stop layer in a vertical direction.

4. The display device according to claim 2, wherein: An end portion of at least one of the first substrate and the second substrate is tapered, An end of the coating layer is tapered such that the end of the coating layer corresponds to an end of at least one of the first substrate and the second substrate.

5. The display device according to claim 1, further comprising a third side surface and a fourth side surface facing each other, in, The first substrate comprises: a fifth side portion and a sixth side portion, the fifth side portion and the sixth side portion being respectively disposed on the first side surface and the second side surface and facing each other; and a seventh side portion and an eighth side portion, the seventh side portion and the eighth side portion being respectively disposed on the third side surface and the fourth side surface and facing each other, The second substrate comprises: a ninth side portion and a tenth side portion, the ninth side portion and the tenth side portion being disposed on the first side surface and the second side surface, respectively, and facing each other; and An 11th side portion and a 12th side portion, the 11th side portion and the 12th side portion are respectively disposed on the third side surface and the fourth side surface and face each other.

6. The display device according to claim 5, wherein: The first etch stop layer comprises: a 13th side portion and a 14th side portion, the 13th side portion and the 14th side portion being respectively disposed on the first side surface and the second side surface and facing each other; and A 15th side portion and a 16th side portion, the 15th side portion and the 16th side portion are respectively disposed on the third side surface and the fourth side surface and face each other.

7. The display device according to claim 6, wherein: The second etch stop layer comprises: a 17th side portion and an 18th side portion, the 17th side portion and the 18th side portion being respectively disposed on the first side surface and the second side surface and facing each other; and A 19th side portion and a 20th side portion, the 19th side portion and the 20th side portion are respectively disposed on the third side surface and the fourth side surface and face each other.

8. The display device according to claim 7, wherein: The fifth side portion and the thirteenth side portion are arranged to overlap each other in the thickness direction, wherein the sixth side portion and the fourteenth side portion are arranged to overlap each other in the thickness direction, wherein the seventh side portion and the fifteenth side portion are arranged to overlap each other in the thickness direction, The eighth side portion and the sixteenth side portion are arranged to overlap each other in the thickness direction.

9. The display device according to claim 8, wherein: The ninth side portion and the seventeenth side portion are arranged to overlap each other in the thickness direction, wherein the tenth side portion and the eighteenth side portion are arranged to overlap each other in the thickness direction, wherein the 11th side portion and the 19th side portion are arranged to overlap each other in the thickness direction, The 12th side portion and the 20th side portion are arranged to overlap each other in the thickness direction.

10. The display device according to claim 7, wherein: The 13th side portion and the 17th side portion are positioned so that they are not aligned in the thickness direction, wherein the 14th side portion and the 18th side portion are arranged to overlap each other in the thickness direction, wherein the 15th side portion and the 19th side portion are arranged to overlap each other in the thickness direction, The sixteenth side portion and the twentieth side portion are arranged to overlap each other in a thickness direction.

11. The display device according to claim 7, wherein: The first etch stop layer has a ring structure and is disposed to overlap a region disposed outside the first substrate, The second etch stop layer has a ring structure, and is disposed to overlap a region disposed outside the second substrate.

12. The display device according to claim 7, wherein: The first etch stop layer has a planar structure, and is disposed to overlap a region disposed inside the first substrate.

13. The display device according to claim 7, wherein: The first substrate includes a first region and a second region, wherein the second substrate and the second etching stop layer are disposed on the first region, Wherein, the first etching stop layer is arranged on the first region and the second region.

14. The display device according to claim 13, wherein: The 13th side portion is arranged on the second area, Wherein, the 17th side portion is arranged on the first area. 15 . The display device according to claim 7 , further comprising a bonding layer disposed between the second substrate and the first substrate.

16. The display device according to claim 15, wherein: The bonding layer includes a 21st side portion disposed between the 18th side portion and the 14th side portion.

17. The display device according to claim 16, wherein: The bonding layer further includes a first bonding layer arranged to overlap with the light emitting element layer, and a thickness of the 21st side portion is greater than a thickness of the first bonding layer. 18 . The display device of claim 7 , further comprising a rear surface coating layer formed on a rear surface of the first substrate.

19. The display device according to claim 7, further comprising: a first side surface coating disposed on the first side surface and disposed on the fifth side portion so as to overlap the thirteenth side portion; a second side surface coating disposed on the second side surface and disposed on the sixth side portion so as to overlap the fourteenth side portion; a third side surface coating disposed on the third side surface and disposed on the seventh side portion so as to overlap with the fifteenth side portion; as well as A fourth side surface coating is disposed on the fourth side surface and disposed on the eighth side portion to overlap with the sixteenth side portion.

20. The display device according to claim 7, wherein: The 13th side portion includes a protrusion protruding toward the first side surface, wherein the 14th side portion includes a protrusion protruding toward the second side surface, wherein the 15th side portion includes a protrusion protruding toward the third side surface, Wherein, the 16th side portion includes a protrusion protruding toward the fourth side surface.

21. The display device according to claim 20, wherein: The 17th side portion includes a protrusion protruding toward the first side surface, wherein the 18th side portion includes a protrusion protruding toward the second side surface, wherein the 19th side portion includes a protrusion protruding toward the third side surface, Wherein, the 20th side portion includes a protrusion protruding toward the fourth side surface.

22. The display device according to claim 5, wherein: The size of the second substrate is larger than that of the first substrate.

23. The display device according to claim 22, wherein: The ninth side portion includes a protrusion that protrudes further toward the first side surface than the fifth side portion.

24. A display device having a first side and a second side opposite to each other, the display device comprising: a first substrate having an end portion; a first etch stop layer disposed on the first substrate and having an end; A circuit layer and a light emitting element layer, wherein the circuit layer and the light emitting element layer are arranged on the first etching stop layer; a second substrate disposed on the light emitting element layer and having an end portion; a second etching stop layer, the second etching stop layer being disposed between the second substrate and the light emitting element layer; as well as a coating layer disposed on an end portion of the first substrate and an end portion of the second substrate, Wherein, in the direction of the first side, an end of the first etching stop layer protrudes further than an end of the first substrate.

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