Display panel, manufacturing method thereof and display device

Abstract

The invention provides a display panel, a manufacturing method thereof and a display device. The display panel comprises a display substrate, an ultrasonic transducer and an acoustic matching layer. The display substrate comprises a supporting layer and a display layer located on the supporting layer. The ultrasonic transducer is located on the side, away from the display layer, of the supporting layer. The ultrasonic transducer comprises a vibration cavity and a vibration part. The vibration part is located between the vibration cavity and the supporting layer. The acoustic matching layer is located between the vibration portion and the support layer. The display panel provided by the invention is beneficial to improving the ultrasonic transmission efficiency of the CMUT.

Description

Display panel and manufacturing method thereof, and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Fingerprint recognition technology is widely used in mobile devices such as mobile phones and tablets, as well as in security systems such as access control systems and safes. Currently, fingerprint acquisition is primarily accomplished through optical, capacitive, and ultrasonic imaging methods. Ultrasonic fingerprint recognition technology, in particular, features 3D fingerprint acquisition and eliminates the need for the user's finger to touch the fingerprint acquisition device, improving recognition security and user experience.

[0003] Existing ultrasonic fingerprint recognition technology typically utilizes bulk piezoelectric ultrasonic transducers. Traditional bulk piezoelectric materials utilize piezoelectric ceramics, which are complex to process, require high temperatures, and are difficult to fabricate into precise arrays. Therefore, achieving micron-level fingerprint recognition requires the use of thin-film piezoelectric materials. However, these materials significantly reduce piezoelectric performance, which in turn limits the transceiver's transceiver performance.

[0004] Compared to bulk piezoelectric ultrasonic transducers, micromachined ultrasonic transducers (MUTs) are becoming a development trend due to their simpler manufacturing process and excellent transceiver performance. Micromachined ultrasonic transducers include piezoelectric micromachined ultrasonic transducers (PMUTs) and capacitive micromachined ultrasonic transducers (CMUTs). CMUTs do not require the use of piezoelectric materials and can be manufactured using conventional semiconductor manufacturing processes and materials, which helps control production costs.

[0005] Currently, CMUT applications are primarily based on low-acoustic-impedance working media such as air, water, or the human body. Because CMUTs have excellent impedance matching with these working media, they offer high ultrasonic transmission efficiency. However, there are few examples of CMUTs being used in display panels.

[0006] Summary of the Invention

[0007] The present disclosure provides a display panel, a manufacturing method thereof, and a display device, for improving the ultrasonic transmission efficiency of a CMUT in the display panel.

[0008] According to a first aspect of the present disclosure, a display panel is provided, comprising:

[0009] Display substrate; the display substrate includes a support layer and a display layer located on the support layer;

[0010] The ultrasonic transducer is located on the side of the support layer away from the display layer; the ultrasonic transducer includes a vibration cavity and a vibration part; the vibration part is located between the vibration cavity and the support layer;

[0011] The acoustic matching layer is located between the vibration part and the supporting layer.

[0012] The display panel provided by the present disclosure further includes a bonding layer located on at least one side of the acoustic matching layer.

[0013] In the display panel provided by the present disclosure, the bonding layer is located between the acoustic matching layer and the supporting layer; and the acoustic matching layer is in direct contact with the vibration part.

[0014] In the display panel provided by the present disclosure, the bonding layer includes a first bonding layer and a second bonding layer; the first bonding layer is located between the acoustic matching layer and the support layer; and the second bonding layer is located between the acoustic matching layer and the vibration part.

[0015] In the display panel provided by the present disclosure, the acoustic matching layer is in direct contact with the supporting layer, and the acoustic matching layer is in direct contact with the vibration part.

[0016] In the display panel provided by the present disclosure, the material of the acoustic matching layer is a viscous material.

[0017] The display panel provided by the present disclosure further includes a connecting layer located between the supporting layer and the ultrasonic transducer;

[0018] The connecting layer includes an edge connecting structure arranged around the edge area of ​​the ultrasonic transducer; one side of the edge connecting structure is bonded to the supporting layer, and the other side is bonded to the ultrasonic transducer to form a closed space; the orthographic projection of the vibration cavity on the display substrate is located within the orthographic projection of the closed space on the display substrate; and the acoustic matching layer fills the closed space.

[0019] The display panel provided by the present disclosure also includes: at least one support column, located between the support layer and the ultrasonic transducer; the support column is located in the area surrounded by the edge connection structure, and is spaced apart from the edge connection structure; the orthographic projection of the support column on the display substrate is located in the area outside the orthographic projection of the vibration cavity on the display substrate.

[0020] In the display panel provided by the present disclosure, a connection layer is provided as a whole layer; the connection layer also includes an internal connection structure, which is located in the area surrounded by the edge connection structure; the internal connection structure is provided with a first opening that passes through the connection layer in a direction perpendicular to the display substrate; one of the first openings corresponds to a vibration cavity, and the orthographic projection of the vibration cavity on the display substrate is located within the orthographic projection of the first opening on the display substrate; and the acoustic matching layer is located in the first opening.

[0021] In the display panel provided by the present disclosure, the acoustic impedance of the acoustic matching layer is between the acoustic impedance of the vibration part and the acoustic impedance of the support layer.

[0022] In the display panel provided in the present disclosure, the acoustic matching layer is a single-layer structure, and the acoustic impedance of the acoustic matching layer satisfies:

[0023] Here, Z represents the acoustic impedance of the acoustic matching layer; Z1 represents the acoustic impedance of the vibration part; and Z2 represents the acoustic impedance of the support layer.

[0024] In the display panel provided in the present disclosure, the shape of the vibration cavity is circular; the acoustic impedance Z1 of the vibration part satisfies:

[0025] in, p represents the average effective sound pressure on the surface of the vibration part; Represents the body velocity of the vibration part; ω represents the vibration angular frequency of the vibration part; ρ2 represents the density of the vibration part; h represents the thickness of the vibration part; a represents the radius of the circular vibration cavity; J0(x) represents the first-order zero-order Bessel function, x is the independent variable of the function; J1(x) represents the first-order first-order Bessel function, x is the independent variable of the function; I0(x) represents the first-order zero-order modified Bessel function, x is the independent variable of the function; I1(x) represents the first-order first-order modified Bessel function, x is the independent variable of the function; c2 represents the sound velocity of the ultrasonic wave propagating in the vibration part; E1 represents the Young's modulus of the vibration part; T represents the internal stress of the vibration part; σ represents the Poisson's ratio of the vibration part.

[0026] In the display panel provided by the present disclosure, the thickness of the acoustic matching layer is an odd multiple of a quarter wavelength of the ultrasonic wave emitted by the ultrasonic transducer.

[0027] In the display panel provided by the present disclosure, the acoustic matching layer is a multi-layer structure

[0028] In the display panel provided by the present disclosure, the acoustic matching layer includes a first matching layer and a second matching layer stacked in sequence in a direction away from the ultrasonic transducer;

[0029] The acoustic impedance of the first matching layer satisfies:

[0030] The acoustic impedance of the second matching layer satisfies:

[0031] Among them, Z 11 represents the acoustic impedance of the first matching layer; Z 22 represents the acoustic impedance of the second matching layer; Z1 represents the acoustic impedance of the vibrating portion; and Z2 represents the acoustic impedance of the supporting layer.

[0032] In the display panel provided by the present disclosure, the thickness of each layer in the multi-layer structure of the acoustic matching layer is an odd number multiple of a quarter wavelength of the ultrasonic wave emitted by the ultrasonic transducer.

[0033] In the display panel provided by the present disclosure, the orthographic projection of the ultrasonic transducer on the display substrate covers at least a portion of the display substrate.

[0034] In the display panel provided by the present disclosure, the orthographic projection of the ultrasonic transducer on the display substrate covers a partial area of ​​the display substrate;

[0035] The display substrate also includes an ultra-clean film layer located on the side of the support layer facing the ultrasonic transducer; the ultra-clean film layer is provided with a second opening that penetrates the ultra-clean film layer in a direction perpendicular to the support layer; the orthographic projection of the ultrasonic transducer on the display substrate is located in the second opening.

[0036] According to a second aspect of the present disclosure, a display device is provided, comprising any one of the display panels described above.

[0037] A third aspect of the present disclosure provides a method for manufacturing a display panel, comprising:

[0038] forming an acoustic matching layer on a side of the vibration portion of the ultrasonic transducer facing away from the vibration cavity;

[0039] The display substrate is attached to a side of the acoustic matching layer facing away from the ultrasonic transducer.

[0040] The beneficial effects of the present disclosure are as follows:

[0041] The present disclosure provides a display panel, a manufacturing method thereof, and a display device. The display panel includes: a display substrate, an ultrasonic transducer, and an acoustic matching layer. The display substrate includes a support layer and a display layer located above the support layer. The ultrasonic transducer is located on the side of the support layer facing away from the display layer. The ultrasonic transducer includes a vibration cavity and a vibration part. The vibration part is located between the vibration cavity and the support layer. The acoustic matching layer is located between the vibration part and the support layer. The ultrasonic transducer in the display panel provided by the present disclosure is a capacitive micromachined ultrasonic transducer, which has a large bandwidth and strong penetration ability, which is beneficial to improving the quality of the signal. Furthermore, the present disclosure sets an acoustic matching layer between the ultrasonic transducer and the display substrate to minimize the reflection and loss generated when the ultrasonic wave propagates at the interface between the ultrasonic transducer and the display substrate, thereby improving the transmission efficiency of the ultrasonic wave. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments of the present disclosure. Obviously, the drawings introduced below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0043] FIG1a is a schematic diagram of a cross-sectional structure of a CMUT according to an embodiment of the present disclosure;

[0044] FIG1b is a second schematic diagram of a cross-sectional structure of a CMUT provided in an embodiment of the present disclosure;

[0045] FIG2a is a schematic diagram of a cross-sectional structure of a display panel according to an embodiment of the present disclosure;

[0046] FIG2 b is a second schematic diagram of the cross-sectional structure of a display panel provided in an embodiment of the present disclosure;

[0047] FIG3 is a third schematic diagram of the cross-sectional structure of a display panel provided in an embodiment of the present disclosure;

[0048] FIG4 is a fourth schematic diagram of the cross-sectional structure of a display panel provided in an embodiment of the present disclosure;

[0049] FIG5 is a fifth schematic diagram of the cross-sectional structure of a display panel provided in an embodiment of the present disclosure;

[0050] FIG6 a is a sixth schematic diagram of the cross-sectional structure of a display panel provided in an embodiment of the present disclosure;

[0051] FIG6 b is a schematic diagram of a top view of a display panel according to an embodiment of the present disclosure;

[0052] FIG7 a is a seventh schematic diagram of the cross-sectional structure of a display panel provided in an embodiment of the present disclosure;

[0053] FIG7 b is a second schematic diagram of a top view of the display panel provided in an embodiment of the present disclosure;

[0054] FIG8 is an eighth schematic diagram of the cross-sectional structure of a display panel provided in an embodiment of the present disclosure;

[0055] FIG9 is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0056] In order to make the above-mentioned purposes, features and advantages of the present disclosure more obvious and easy to understand, the present disclosure will be further described below with reference to the accompanying drawings and examples. However, the example embodiments can be implemented in various forms and should not be understood as being limited to the embodiments set forth herein; on the contrary, these embodiments are provided to make the present disclosure more comprehensive and complete, and to fully convey the concepts of the example embodiments to those skilled in the art. The same figure marks in the figures represent the same or similar structures, and their repeated descriptions will be omitted. The words expressing position and direction described in the present disclosure are all explained using the accompanying drawings as examples, but changes can be made as needed, and all changes are included in the scope of protection of the present disclosure. The drawings of the present disclosure are only used to illustrate relative position relationships and do not represent true proportions.

[0057] Fingerprint recognition technology is widely used in mobile devices such as mobile phones and tablets, as well as in security systems such as access control systems and safes. Currently, fingerprint acquisition is primarily accomplished through optical, capacitive, and ultrasonic imaging methods. Ultrasonic fingerprint recognition technology, in particular, features 3D fingerprint acquisition and eliminates the need for the user's finger to touch the fingerprint acquisition device, improving recognition security and user experience.

[0058] Existing ultrasonic fingerprint recognition technology typically utilizes bulk piezoelectric ultrasonic transducers. Traditional bulk piezoelectric materials utilize piezoelectric ceramics, which are complex to process, require high temperatures, and are difficult to fabricate into precise arrays. Therefore, achieving micron-level fingerprint recognition requires the use of thin-film piezoelectric materials. However, these materials significantly reduce piezoelectric performance, which in turn limits the transceiver's transceiver performance.

[0059] Compared to bulk piezoelectric ultrasonic transducers, micromachined ultrasonic transducers (MUTs) are becoming a development trend due to their simpler manufacturing process and excellent transceiver performance. Micromachined ultrasonic transducers include piezoelectric micromachined ultrasonic transducers (PMUTs) and capacitive micromachined ultrasonic transducers (CMUTs). CMUTs do not require the use of piezoelectric materials and can be manufactured using conventional semiconductor manufacturing processes and materials, which helps control production costs.

[0060] FIG1a is a schematic diagram of a cross-sectional structure of a CMUT according to an embodiment of the present disclosure; FIG1b is a schematic diagram of a cross-sectional structure of a CMUT according to an embodiment of the present disclosure.

[0061] In the embodiment of the present disclosure, as shown in Figures 1a and 1b, the CMUT includes a base substrate 110, a first electrode 120, a diaphragm layer 140, a second electrode 150, an insulating protective layer 160, and a resonant cavity 130 located between the diaphragm layer 140 and the first electrode 120, which are stacked in sequence. One resonant cavity 130 corresponds to one first electrode 120 and one second electrode 150, and one resonant cavity 130 is located between the corresponding first electrode 120 and the corresponding second electrode 150, forming a transducer unit. An ultrasonic transducer may include at least one transducer unit, which is not limited here. In a specific implementation, as shown in Figures 1a and 1b, the orthographic projection of the second electrode 150 on the base substrate 110 can be set to be located within the orthographic projection of the corresponding resonant cavity 130 on the base substrate 110, and the orthographic projection of the resonant cavity 130 on the base substrate 110 can be located within the orthographic projection of the corresponding first electrode 120 on the base substrate 110, so as to improve the sensitivity of the ultrasonic transducer unit.

[0062] During the ultrasonic transmission phase, a DC signal and an AC signal are simultaneously applied to the first electrode 120 and the second electrode 150, causing the diaphragm layer 140 located between the first electrode 120 and the second electrode 150 to vibrate as the AC electric field changes. This in turn causes the second electrode 150 and the insulating protective layer 160 located on the side of the diaphragm layer 140 facing away from the resonant cavity 130 to vibrate together, thereby transmitting ultrasonic waves. During the ultrasonic reception phase, only a DC signal is applied between the first electrode 120 and the second electrode 150 to maintain equilibrium in the diaphragm layer 140. The diaphragm layer 140, the second electrode 150, and the insulating protective layer 160 vibrate and displace under the action of ultrasonic waves, thereby changing the capacitance between the first electrode 120 and the second electrode 150, thereby receiving ultrasonic waves.

[0063] When the ultrasonic transducer is in operation, it primarily utilizes the vibration of multiple membrane structures located on the side of the vibration cavity 130 facing away from the first electrode 120 and in the overlapping region with the vibration cavity 130 to transmit and absorb ultrasonic waves. In the subsequent content of this disclosure, this portion of the membrane structure is referred to as the vibration portion 10. In a specific implementation, as shown in Figures 1a and 1b, the vibration portion 10 includes a portion of the diaphragm layer 140, a second electrode 150, and a portion of the insulating protective layer 160 located on the side of the vibration cavity 130 facing away from the first electrode 120. The orthographic projection of the vibration portion 10 on the substrate 110 completely overlaps with the orthographic projection of the vibration cavity 130 on the substrate 110.

[0064] The base substrate 110 is located at the bottom of the CMUT and is used to carry and support the film structure such as the first electrode 12 located thereon. In a specific implementation, the base substrate 110 can be made of an insulating material such as glass or resin. In some embodiments, a drive circuit can also be fabricated between the base substrate 110 and the first electrode 120 to achieve ultrasonic transmission and reception control and signal acquisition. The drive circuit includes at least one thin film transistor (TFT). In a specific implementation, the drive circuit can be manufactured using a display semiconductor process, which is not limited here.

[0065] The diaphragm layer 140 may be a single-layer structure or a multi-layer structure, which is not limited here. In specific implementations, the diaphragm layer 140 may be made of at least one of low-temperature polysilicon, silicon nitride (SiN), or silicon oxide (SiO2), which is not limited here.

[0066] The insulating protective layer 160 can be a single-layer structure or a multi-layer structure, which is not limited here. In specific implementation, the material of the insulating protective layer 160 can be at least one of low-temperature polysilicon, silicon nitride (SiN) or silicon oxide (SiO2), which is not limited here. In some embodiments, the insulating protective layer 160 can be made of the same material as the diaphragm layer 140, which is not limited here. In some embodiments, as shown in Figure 1a, during the manufacturing process, a thick insulating protective layer can be formed on the side of the second electrode 150 away from the base substrate 110 by a thin film deposition process, and then the insulating protective layer can be thinned by polishing or other processes to reduce the thickness of the vibration part 10 and reduce the collapse voltage. A relatively flat surface can be formed on the side of the insulating protective layer away from the base substrate 110 by polishing or other processes to improve the transmission efficiency and directivity of the ultrasonic wave. In some embodiments, as shown in Figure 1b, during the manufacturing process, a thin insulating protective layer 160 can be directly formed on the side of the second electrode 150 away from the base substrate 110 by a thin film deposition process, thereby reducing the process steps. As shown in FIG. 1 b , the thin insulating protective layer 160 forms steps at the corners of the surface of the ultrasonic transducer.

[0067] The ultrasonic transducer provided in the embodiment of the present disclosure may also include other structures not mentioned. The structures not mentioned in the ultrasonic transducer provided in the embodiment of the present disclosure can be manufactured by referring to the relevant manufacturing methods in the prior art, and will not be described in detail here.

[0068] Currently, CMUT applications are primarily based on working media with low acoustic impedance, such as air, water, or the human body. Because CMUTs have excellent impedance matching characteristics with working media such as air, water, or the human body, they have high ultrasonic transmission efficiency. Currently, there are few cases of CMUTs being applied to display panels. The inventors of the present disclosure discovered during the process of applying the CMUT provided by the embodiments of the present disclosure to the production of display panels that, due to the significant difference between the acoustic impedance of the CMUT and the acoustic impedance of the display substrate, directly bonding the CMUT to the display substrate results in significant energy loss when ultrasonic waves propagate through the bonding interface between the CMUT and the display substrate, resulting in low ultrasonic transmission efficiency.

[0069] In view of this, the present disclosure provides a display panel that can improve the transmission efficiency of ultrasonic waves between a CMUT and a display substrate.

[0070] FIG2 a is a schematic diagram of a cross-sectional structure of a display panel according to an embodiment of the present disclosure; FIG2 b is a schematic diagram of a cross-sectional structure of a display panel according to an embodiment of the present disclosure.

[0071] In the embodiment of the present disclosure, as shown in FIG. 2 a and FIG. 2 b , the display panel includes: an ultrasonic transducer 100 , an acoustic matching layer 200 and a display substrate 300 .

[0072] The display substrate 300 is used for image display. The shape and size of the display substrate 300 are adapted to the shape and size of the display panel. Its shape can be a conventional shape such as a square or rectangle, or a special shape such as a circle, which is not limited here. As shown in Figures 2a and 2b, the display substrate 300 includes a support layer (U-film) 310 and a display layer 320 located on the support layer 310. The support layer 310 is used to support and carry the display layer 320. In a specific implementation, the display substrate 300 is bonded to the acoustic matching layer 200 through the support layer 310. The display layer 320 includes a plurality of pixel units, each of which is used to emit light for image display.

[0073] In the embodiment of the present disclosure, the display substrate 300 may be an organic light emitting diode (OLED) display substrate. The support layer 310 may be a substrate of the OLED display substrate, and the support layer 310 may be made of a flexible material to form a flexible OLED display substrate, or the support layer 310 may be made of a rigid material to form a rigid OLED display substrate. In a specific implementation, the support layer 310 may be made of glass, resin or other materials, which are not limited here. The display layer 320 may include a driving circuit layer and a light emitting functional layer located on the driving circuit layer. The driving circuit layer includes a plurality of pixel circuits, the light emitting functional layer includes a plurality of OLEDs, a pixel circuit is electrically connected to an OLED to form a pixel unit, and the pixel circuit is used to drive the OLED connected thereto to emit light. In a specific implementation, the pixel circuit may include at least one thin film transistor, and the OLED includes a film layer structure such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer and an electron injection layer, which are not limited here. The side of the display layer 320 facing the support layer 310 can be bonded to the support layer 310 through a first adhesive layer, and the side of the display layer 320 facing away from the support layer 310 can be connected to the polarizer through a second adhesive layer. The first adhesive layer and the second adhesive layer can both use pressure-sensitive adhesive (PSA), which is not limited here. The polarizer can be a circular polarizer, which is used to absorb ambient light incident from the outside to the inside of the OLED display substrate, and prevent the metal electrodes and signal lines in the OLED display substrate from reflecting ambient light and affecting the display effect. The side of the polarizer facing away from the display layer 320 can be bonded to the cover glass (CG) through a third adhesive layer, and the cover glass can be used to protect the OLED display substrate. The third adhesive layer can use optically clear adhesive (OCA), which is not limited here.

[0074] In some embodiments, the display substrate 300 may also be other types of display substrates, such as a liquid crystal display (LCD) substrate, a micro light emitting diode (Micro LED) display substrate, etc., without limitation herein. For example, when the display substrate 300 is a liquid crystal display substrate, the support layer 310 may be an array substrate of the liquid crystal display substrate, without limitation herein.

[0075] The ultrasonic transducer 100 is located on the side of the support layer 310 facing away from the display layer 320. In a specific implementation, the ultrasonic transducer 100 may be a capacitive micromachined ultrasonic transducer (CMUT). The ultrasonic transducer 100 includes a resonant cavity 130 and a vibrating portion 10. The vibrating portion 10 is located between the resonant cavity 130 and the support layer 310. The specific structure of the ultrasonic transducer 100 can be seen in the description of Figures 1a and 1b and is not detailed here.

[0076] The acoustic matching layer 200 is located between the vibration part 10 and the support layer 310. The acoustic matching layer 200 can minimize reflection and loss of ultrasonic waves during transmission between the ultrasonic transducer 100 and the support layer 310, thereby improving the transmission efficiency of ultrasonic waves.

[0077] In the disclosed embodiments, CMUTs are used in the manufacture of display panels to implement functions such as fingerprint recognition, gesture recognition, and touch control. CMUTs have a wide bandwidth and strong penetration capability, which helps improve signal quality. Furthermore, in the disclosed embodiments, an acoustic matching layer 200 is provided between the ultrasonic transducer 100 and the display substrate 300 to minimize reflections and losses caused by ultrasonic waves propagating between the ultrasonic transducer 100 and the display substrate 300, thereby improving the transmission efficiency of ultrasonic waves.

[0078] In some embodiments, as shown in FIG. 2 a , the surface of the ultrasonic transducer 100 facing away from the base substrate 110 is a relatively flat surface.

[0079] In some embodiments, as shown in FIG2b , a plurality of grooves 11 are provided on the surface of the ultrasonic transducer 100 facing away from the substrate 110, and a portion of the acoustic matching layer 200 is filled in the grooves 11. One of the grooves 11 corresponds to a vibration cavity 130, and the orthographic projection of the vibration cavity 130 on the substrate 110 is located within the orthographic projection of the corresponding groove 11 on the substrate 110. By providing the grooves 11 on the surface of the ultrasonic transducer 100 facing away from the substrate 110, the thickness of the vibration part 10 can be reduced, thereby improving the vibration performance of the vibration part 10, and thinning the thickness of the vibration part 10 is conducive to reducing the driving voltage. In a specific implementation, after the insulating protective layer 160 of the CMUT is manufactured, the insulating protective layer 160 can be patterned and etched to form the grooves 11, which is not limited here.

[0080] In the embodiment of the present disclosure, the acoustic impedance of the acoustic matching layer 200 is between the acoustic impedance of the vibration part 10 and the acoustic impedance of the support layer 310. In specific implementations, the acoustic matching layer 200 can adopt a single-layer structure or a multi-layer structure, which is not limited here.

[0081] In some embodiments, the acoustic matching layer 200 may be a single-layer structure. The acoustic impedance of the acoustic matching layer 200 satisfies the following conditions:

[0082] Here, Z represents the acoustic impedance of the acoustic matching layer 200 ; Z1 represents the acoustic impedance of the vibration part 10 ; and Z2 represents the acoustic impedance of the support layer 310 .

[0083] In a specific implementation, the display substrate 300 contacts the acoustic matching layer 200 via the support layer 310. The support layer 310 can be considered as a single-layer structure located at the bottom of the display substrate 300 and in contact with the acoustic matching layer 200. Its acoustic impedance Z2 can be calculated using the following formula:

[0084] Z2=ρ1c1;

[0085] Wherein, ρ1 represents the density of the support layer 310 , and c1 represents the speed of sound propagating in the support layer 310 .

[0086] The vibrating portion 10 is a laminated structure formed by stacking multiple membrane layers, mounted on the vibrating cavity 130. Because the vibrating portion 10 transmits or receives ultrasonic waves by vibrating these multiple membrane layers together, its acoustic impedance cannot be simply calculated based on the parameters of a single membrane layer. Taking a circular vibrating cavity as an example, the acoustic impedance Z1 of the vibrating portion 10 can be calculated using the following formula:

[0087] in, p represents the average effective sound pressure on the surface of the vibration part 10; represents the body velocity of the vibration part 10; ω represents the vibration angular frequency of the vibration part; ρ2 represents the density of the vibration part 10, specifically represents the average density of the multiple film layers constituting the vibration part 10; h represents the thickness of the vibration part 10. When the thickness of the vibration part 10 is uneven, h represents the average thickness of the vibration part 10; a represents the radius of the circular vibration cavity; J0(x) represents the first-order zero-order Bessel function, x is the independent variable of the function; J1(x) represents the first-order first-order Bessel function, x is the independent variable of the function; I0(x) represents the first-order zero-order modified Bessel function, x is the independent variable of the function; I1(x) represents the first-order modified Bessel function, x is the independent variable of the function; c2 represents the sound velocity of the ultrasonic wave propagating in the vibration part 10; E1 represents the Young's modulus of the vibration part 10; T represents the internal stress of the vibration part 10; σ represents the Poisson's ratio of the vibration part 10.

[0088] After determining the acoustic impedance Z2 of the support layer 310 and the acoustic impedance Z1 of the vibration part, the following formula can be used: The acoustic impedance Z of the acoustic matching layer 200 is calculated, and a material with a corresponding acoustic impedance is selected to make the acoustic matching layer 200. Since the acoustic matching layer 200 is a single-layer structure, its acoustic impedance Z satisfies: Z = ρc, where ρ represents the density of the acoustic matching layer 200. E represents the Young's modulus of the acoustic matching layer 200, and θ represents the Poisson's ratio of the acoustic matching layer 200. Based on the above relationship, the ranges of the Young's modulus E, density ρ, and Poisson's ratio θ of the acoustic matching layer 200 can be determined, and a suitable material can be selected to manufacture the acoustic matching layer 200. When the support layer 310 is made of conventional materials used in semiconductor manufacturing (such as polyethylene terephthalate (PET)), the Young's modulus E of the acoustic matching layer 200 is in the range of 5E 6 Pa~100E 6 Pa, density ρ range is 1000kg / m 3 ~3000kg / m 3 , the Poisson's ratio θ ranges from 0.25 to 0.47, which can obtain better ultrasonic transmission efficiency.

[0089] The above content uses the circular cavity 130 as an example to illustrate the process of determining the acoustic impedance of the acoustic matching layer 200. In specific implementation, the cavity 130 can also be of other shapes. It is only necessary to determine the acoustic impedance of the support layer 310 and the acoustic impedance of the vibration part 10, and then the equation By determining the acoustic impedance of the acoustic matching layer 200 , parameters such as Young's modulus, density, and Poisson's ratio of the acoustic matching layer 200 can be determined, which will not be described in detail here.

[0090] In a specific implementation, when the thickness of the acoustic matching layer 200 is an odd multiple of a quarter wavelength of the ultrasonic wave emitted by the ultrasonic transducer 100, the reflection and absorption of the ultrasonic wave by the acoustic matching layer 200 can be effectively reduced, thereby improving the transmittance of the ultrasonic wave in the acoustic matching layer 200. In a specific implementation, the thickness h1 of the acoustic matching layer 200 satisfies the following conditions: h1 = (2n + 1)h′,

[0091] Here, λ represents the wavelength of the ultrasonic wave emitted by the ultrasonic transducer 100 as it propagates through the acoustic matching layer 200; f represents the vibration frequency of the ultrasonic wave emitted by the ultrasonic transducer 100 as it propagates through the acoustic matching layer 200. The thickness of the acoustic matching layer 200 can be calculated based on the above formula and parameters such as the Young's modulus E and density ρ of the acoustic matching layer 200. The value of n can be determined based on actual needs. To reduce propagation loss and improve machining accuracy, n can be set to 0 or 1 to achieve maximum ultrasonic transmission efficiency.

[0092] FIG3 is a third schematic diagram of the cross-sectional structure of the display panel provided in an embodiment of the present disclosure.

[0093] In some embodiments, the acoustic matching layer 200 can be a multi-layer structure. This multi-layered structure can further improve the transmission efficiency of ultrasonic waves. Furthermore, when manufacturing a multi-layered acoustic matching layer 200, the stacking effect of the multiple layers can reduce the performance requirements for individual membrane layers, broaden the range of materials available for each membrane layer, and reduce the difficulty of material selection. In specific implementations, the multiple membrane layers of the acoustic matching layer 200 can be bonded together using adhesives, or they can be directly laminated using a coating process, thereby reducing the use of adhesives, reducing the number of transmission interfaces, and further improving transmission efficiency.

[0094] For example, as shown in FIG3 , the acoustic matching layer 200 may include a first matching layer 210 and a second matching layer 220 stacked in sequence in a direction away from the ultrasonic transducer 100 . The acoustic impedance of the first matching layer 210 satisfies the following conditions:

[0095] The acoustic impedance of the second matching layer 220 satisfies:

[0096] Among them, Z 11 represents the acoustic impedance of the first matching layer 210; Z 22 represents the acoustic impedance of the second matching layer 220; Z1 represents the acoustic impedance of the vibrating portion 10; and Z2 represents the acoustic impedance of the supporting layer 310. The ultrasonic wave transmittance of the double-layered acoustic matching layer 200 is approximately 2.75 times that of a single-layered acoustic matching layer, significantly improving ultrasonic wave transmission efficiency.

[0097] When the acoustic matching layer 200 has a multi-layer structure, the thickness of each layer in the multi-layer structure of the acoustic matching layer 200 can be set to an odd integer multiple of one-quarter wavelength of the ultrasonic wave emitted by the ultrasonic transducer 100 to improve ultrasonic wave transmittance. In specific implementations, the thickness of each film layer of the acoustic matching layer 200 can be determined by referring to the thickness determination process for a single-layer acoustic matching layer described above, and is not further described here.

[0098] FIG4 is a fourth schematic diagram of the cross-sectional structure of a display panel provided in an embodiment of the present disclosure; FIG5 is a fifth schematic diagram of the cross-sectional structure of a display panel provided in an embodiment of the present disclosure.

[0099] In some embodiments, as shown in Figures 4 and 5, the display panel further includes a bonding layer 400. The bonding layer 400 is located on at least one side of the acoustic matching layer 200, and is used to bond and fix the acoustic matching layer 200 to the support layer 310 and / or the vibration part 10. The bonding layer 400 can be made of a pressure-sensitive adhesive, an optical adhesive or other adhesive material. In a specific implementation, the thickness of the bonding layer 400 can be set to 3μm to 10μm, and the thickness of the bonding layer 400 can be reduced as much as possible to avoid affecting the transmission efficiency of ultrasonic waves. The acoustic matching layer 200 is bonded and fixed to the support layer 310 and / or the vibration part 10 through the bonding layer 400, so that the acoustic matching layer 200 can be made of a non-adhesive resin material such as polydimethylsiloxane (PDMS), which is not limited here.

[0100] In some embodiments, as shown in FIG4 , the bonding layer 400 includes a first bonding layer 410 and a second bonding layer 420. The second bonding layer 420 is located between the acoustic matching layer 200 and the support layer 310, and is used to bond the acoustic matching layer 200 to the support layer 310. The first bonding layer 410 is located between the acoustic matching layer 200 and the vibration part 10, and is used to bond the acoustic matching layer 200 to the ultrasonic transducer 100. The acoustic matching layer 200 does not need to be made of an adhesive material or a material that can be directly coated, thereby expanding the range of options for the acoustic matching layer 200.

[0101] In some embodiments, as shown in FIG5 , the bonding layer 400 is located between the acoustic matching layer 200 and the support layer 310. The acoustic matching layer 200 is in direct contact with the vibration part 10. In a specific implementation, the acoustic matching layer 200 can be formed directly on the surface of the ultrasonic transducer 100 using a coating process, such as chemical vapor deposition, coating, etc., thereby avoiding the need for a bonding layer 400 between the acoustic matching layer 200 and the vibration part 10, reducing the interface for ultrasonic wave propagation, and improving transmission efficiency. On the side of the acoustic matching layer 200 facing away from the ultrasonic transducer 100, the bonding between the acoustic matching layer 200 and the support layer 310 can be performed through the bonding layer 400, which is beneficial to increasing the range of materials available for the acoustic matching layer 200.

[0102] In some embodiments, the acoustic matching layer 200 is in direct contact with the support layer 310, and the acoustic matching layer 200 is in direct contact with the vibration unit 10. Directly laminating the acoustic matching layer 200 to the support layer 310 and the vibration unit 10, respectively, without requiring a laminating layer or other film layer, can reduce the interfaces for ultrasonic wave propagation, reduce energy loss due to interfacial reflection, and improve transmission efficiency.

[0103] In some embodiments, the acoustic matching layer 200 can be made of an adhesive material, so that the acoustic matching layer 200 can be directly bonded to the ultrasonic transducer 100 and the display substrate 300. In specific implementations, the acoustic matching layer 200 can be made of adhesive materials such as pressure-sensitive adhesive, optical adhesive, etc. that meet acoustic impedance requirements, without limitation herein.

[0104] Figure 6a is the sixth schematic diagram of the cross-sectional structure of the display panel provided in the embodiment of the present disclosure; Figure 6b is one of the schematic diagrams of the top view structure of the display panel provided in the embodiment of the present disclosure; Figure 7a is the seventy-sixth schematic diagram of the cross-sectional structure of the display panel provided in the embodiment of the present disclosure; Figure 7b is the second schematic diagram of the top view structure of the display panel provided in the embodiment of the present disclosure.

[0105] In some embodiments, as shown in Figures 6a to 7b, the display panel further includes a connecting layer 500. The connecting layer 500 is located between the support layer 310 and the ultrasonic transducer 100 and is used to bond the support layer 310 to the ultrasonic transducer 100. The connecting layer 500 can be made of an adhesive material or a double-sided tape material, which is not limited herein.

[0106] In a specific implementation, as shown in Figures 6a to 7b, the connection layer 500 includes an edge connection structure 510 that is arranged around the edge area of ​​the ultrasonic transducer 100. One side of the edge connection structure 510 is bonded to the support layer 310, and the other side is bonded to the ultrasonic transducer 100, thereby forming a closed space with the display substrate 300 and the ultrasonic transducer 100. The orthographic projection of the vibration cavity 130 on the display substrate 300 (or the base substrate 110) is located within the orthographic projection of the closed space on the display substrate 300 (or the base substrate 110). The acoustic matching layer 200 is filled in the closed space. In a specific implementation, the display substrate 300 and the ultrasonic transducer 100 are bonded via the edge connection structure 510, so that the acoustic matching layer 200 does not need to be made of an adhesive material or a material that can be directly coated. Furthermore, the display substrate 300 , the ultrasonic transducer 100 , and the edge connection structure 510 form a closed space for accommodating the acoustic matching layer 200 . Thus, the material of the acoustic matching layer 200 is not limited to solid materials. Liquid materials can also be used to fill the closed space, further expanding the range of material choices for the acoustic matching layer 200 .

[0107] In some embodiments, as shown in Figures 6a and 6b, where Figure 6b is a schematic diagram of the top view of Figure 6a, the display panel further includes at least one support column 600. The support column 600 is located between the support layer 310 and the ultrasonic transducer 100 to support and maintain the distance between the support layer 310 and the ultrasonic transducer 100. The support column 600 is located within the area surrounded by the edge connection structure 510 and is spaced apart from the edge connection structure 510. In a specific implementation, the orthographic projection of the support column 600 on the display substrate 300 (or the base substrate 110) is located in an area outside the orthographic projection of the vibration cavity 130 on the display substrate 300 (or the base substrate 110). The support column 600 does not overlap with the vibration part 10, which can prevent the support column 600 from affecting the transmission efficiency of the ultrasonic wave and improve the transmission effect. The acoustic matching layer 200 can be made of a flexible solid material or a liquid material, and is manufactured by a coating process or direct injection filling, which is not limited here.

[0108] In some embodiments, as shown in Figures 7a and 7b, where Figure 7b is a top view of the structure of Figure 7a, the connecting layer 500 is provided as a single layer. The connecting layer 500 also includes an internal connecting structure 520, which is located within the area surrounded by the edge connecting structure 510. The internal connecting structure 520 can support and maintain the distance between the support layer 310 and the ultrasonic transducer 100. The internal connecting structure 520 defines a first opening 521 extending through the connecting layer 500 perpendicular to the display substrate 300 (or base substrate 110). One of the first openings 521 corresponds to a resonant cavity 130, with the orthographic projection of the resonant cavity 130 on the display substrate 300 (or base substrate 110) located within the orthographic projection of the corresponding first opening 521 on the display substrate 300 (or base substrate 110). This prevents overlap between the internal connecting structure 520 and the resonant cavity 130, which could affect the transmission efficiency of ultrasonic waves. The acoustic matching layer 200 is located within the first opening 521. In specific implementation, the entire connection layer 500 may be subjected to a hole-forming process to form the first opening 521 , and then the material of the acoustic matching layer 200 is filled into the first opening 521 to form the acoustic matching layer 200 , which is not limited here.

[0109] In some embodiments, as shown in Figures 7a and 7b, the ultrasonic transducer 100 may include multiple vibration cavities 130. The multiple vibration cavities 130 correspond to the multiple first openings 521, respectively. The acoustic matching layer 200 fills the multiple first openings 521. The portion of the acoustic matching layer 200 filling each first opening 521 is separated by an internal connecting structure 520, thereby reducing the lateral propagation of ultrasound and reducing ultrasonic crosstalk between adjacent transducer units.

[0110] In a specific implementation, when ultrasonic waves propagate through the acoustic matching layer 200, they are partially reflected when they reach the interface formed by the acoustic matching layer 200 and the internal connection structure 520. These reflections are then reflected back into the acoustic matching layer 200 and propagate there, thereby reducing interference between ultrasonic waves propagating through the acoustic matching layer 200 in adjacent first openings 521. For the interface formed by the acoustic matching layer 200 and the internal connection structure 520, the ultrasonic reflectivity r satisfies the following conditions:

[0111] Here, Z represents the acoustic impedance of the acoustic matching layer 200; Z3 represents the acoustic impedance of the internal connection structure 520. When the difference between Z and Z3 is large, the reflectivity r of ultrasonic waves at the interface formed by the acoustic matching layer 200 and the internal connection structure 520 can approach 1. Therefore, in specific implementations, it is advisable to select a material with a significantly different acoustic impedance from that of the acoustic matching layer 200 to fabricate the connection layer 500. This increases the reflectivity r of ultrasonic waves at the interface formed by the acoustic matching layer 200 and the internal connection structure 520, reduces crosstalk, and improves longitudinal transmission efficiency (perpendicular to the display substrate 300 or the base substrate 110).

[0112] In some embodiments, as shown in Figures 2a and 2b, the ultrasonic transducer 100 can be disposed entirely on the side of the support layer 310 facing away from the display layer 320, with the orthographic projection of the ultrasonic transducer 100 on the display substrate 300 covering the entire surface of the display substrate 300. The ultrasonic transducer 100 can emit ultrasonic waves across the entire surface of the display substrate 300, thereby enabling functions such as fingerprint recognition, gesture recognition, and touch control over the entire surface of the display panel.

[0113] FIG8 is an eighth schematic diagram of the cross-sectional structure of the display panel provided in an embodiment of the present disclosure.

[0114] In some embodiments, as shown in FIG8 , the ultrasonic transducer 100 is disposed on a side of the support layer 310 facing away from the display layer 320, and the orthographic projection of the ultrasonic transducer 100 on the display substrate 300 covers a portion of the display substrate 300. The ultrasonic transducer 100 can emit ultrasonic waves in a portion of the display substrate 300, thereby enabling functions such as fingerprint recognition, gesture recognition, and touch operation in a specific area of ​​the display panel.

[0115] In a specific implementation, as shown in FIG8 , the display substrate 300 further includes a super clean film layer (SCF) 330. The super clean film layer 330 is located on the side of the support layer 310 facing the ultrasonic transducer 100. The super clean film layer 330 can be a single-layer foam structure, or a multi-layer structure including multiple film layers such as a foam layer and a metal layer, and is used to play a role in heat dissipation, buffering, etc. The super clean film layer 330 is provided with a second opening that passes through the super clean film layer 330 in a direction perpendicular to the support layer 310. The second opening exposes the support layer 310, and the orthographic projection of the ultrasonic transducer 100 on the display substrate 300 is located in the second opening. The ultrasonic transducer 100 is bonded to the support layer 310 exposed by the second opening through the second opening.

[0116] The display panel provided by the embodiment of the present disclosure may also include other structures not mentioned. The structures not mentioned in the display panel provided by the embodiment of the present disclosure can refer to the structures of display panels in the prior art, and will not be described in detail here.

[0117] The present disclosure also provides a display device comprising the display panel provided by any of the aforementioned embodiments. In specific implementations, the display device can be a mobile phone, tablet computer, laptop computer, smartwatch, central control platform, etc., without limitation herein. The display device provided by the embodiments of the present disclosure, in specific implementations, has the same technical effects as the display panel provided by any of the aforementioned embodiments, and therefore is not further described here.

[0118] FIG9 is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present disclosure.

[0119] The present disclosure also provides a method for manufacturing a display panel. As shown in FIG9 , the method for manufacturing a display panel provided by the present disclosure includes the following steps:

[0120] S910: forming an acoustic matching layer on a side of the vibration portion of the ultrasonic transducer facing away from the vibration cavity;

[0121] S920: Laminating a display substrate to a side of the acoustic matching layer facing away from the ultrasonic transducer.

[0122] When manufacturing the display panel provided by the embodiments of the present disclosure, the ultrasonic transducer 100 and the display substrate 300 can be fabricated separately. Then, an acoustic matching layer 200 is formed on the side of the vibration portion 10 of the ultrasonic transducer 100 facing away from the vibration cavity 130. After the acoustic matching layer 200 is formed, the side of the acoustic matching layer 200 facing away from the ultrasonic transducer 100 is attached to the display substrate 300.

[0123] In some embodiments, before forming the acoustic matching layer, a first bonding layer 410 may be formed on the surface of the ultrasonic transducer, and the acoustic matching layer 200 and the ultrasonic transducer 100 are bonded together via the first bonding layer 410. A first bonding layer 420 is then formed on the side of the acoustic matching layer 200 facing away from the ultrasonic transducer 100, and the acoustic matching layer 200 and the display substrate 300 are bonded together via the second bonding layer 420.

[0124] In some embodiments, the acoustic matching layer 200 can be directly formed on the surface of the ultrasonic transducer 100 through a coating process such as chemical vapor deposition or coating. Then, a bonding layer 400 is formed on the side of the acoustic matching layer 200 facing away from the ultrasonic transducer 100, and the acoustic matching layer 200 and the display substrate 300 are bonded together through the bonding layer 400.

[0125] In some embodiments, an adhesive material may be used to make the acoustic matching layer 200. The acoustic matching layer 200 may be directly used for bonding the ultrasonic transducer 100 to the display substrate 300.

[0126] In some embodiments, before forming the acoustic matching layer 200 on the side of the ultrasonic transducer 100's vibration portion 10 facing away from the vibration cavity 130, a connection layer 500 may be formed on the surface of the ultrasonic transducer 100. The ultrasonic transducer 100 and the display substrate 300 may be bonded via the connection layer 500.

[0127] In some embodiments, the connection layer 500 includes an edge connection structure 510 disposed around the periphery of the ultrasonic transducer 100. In a specific implementation, the connection layer 500 can be formed entirely on the surface of the ultrasonic transducer 100 using a coating process such as thin film deposition, inkjet printing, or coating. Then, the inner region of the connection layer 500 is etched away using processes such as etching, exposure, development, and etching, leaving only the portion surrounding the periphery of the ultrasonic transducer 100 to form the edge connection structure 510. The edge connection structure 510 and the ultrasonic transducer 100 form a housing space, and the material used to form the acoustic matching layer 200 is filled into the housing space using processes such as chemical vapor deposition, coating, inkjet printing, and infusion to form the acoustic matching layer 200. Then, the display substrate 300 is attached to the side of the acoustic matching layer 200 facing away from the ultrasonic transducer 100 . The ultrasonic transducer 100 and the display substrate 300 are connected via the edge connection structure 510 to form a closed space to seal the acoustic matching layer 200 .

[0128] In some embodiments, the connection layer 500 includes an edge connection structure 510 disposed around the perimeter of the ultrasonic transducer 100, and an internal connection structure 520 located within the area formed by the edge connection structure 510. In a specific implementation, the connection layer 500 can be formed entirely on the surface of the ultrasonic transducer 100 using a coating process such as thin film deposition, inkjet printing, or coating. The connection layer 500 is then opened through processes such as etching, exposure, development, and etching to form first openings 521 that correspond to the resonant cavities 130 and extend through the connection layer 500. During the opening, the orthographic projection of the resonant cavities 130 on the display substrate 300 is positioned within the orthographic projection of the first openings 521 on the display substrate to prevent the connection layer 500 from interfering with ultrasonic transmission. The first openings 521 are then filled with the material used to form the acoustic matching layer 200 through processes such as chemical vapor deposition, coating, inkjet printing, and potting to form the acoustic matching layer 200. Then, the display substrate 300 is attached to the side of the acoustic matching layer 200 facing away from the ultrasonic transducer 100 . The ultrasonic transducer 100 and the display substrate 300 are connected via the edge connection structure 510 to form a closed space to seal the acoustic matching layer 200 .

[0129] In some embodiments, the display substrate 300 further includes an ultra-clean membrane layer 330 located on a side of the support layer 310 facing away from the display layer 320. Before laminating the display substrate 300 to the acoustic matching layer 200, a hole is formed in the ultra-clean membrane layer 330 to form a second opening that penetrates the ultra-clean membrane layer 330 and exposes the support layer 310. When laminating the display substrate 300 to the acoustic matching layer 200, the acoustic matching layer 200 is laminated to the support layer 310 exposed by the second opening.

[0130] The specific structure of the display panel provided by the embodiment of the present disclosure has been described in detail in the foregoing content. During specific implementation, the implementation details of the method for manufacturing the display panel provided by the embodiment of the present disclosure can refer to the specific structure of the display panel and will not be repeated here.

[0131] Although the preferred embodiments of the present disclosure have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present disclosure.

[0132] Obviously, those skilled in the art may make various changes and modifications to the present disclosure without departing from the spirit and scope of the present disclosure. Thus, if these modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include these modifications and variations.

Claims

1. A display panel, wherein: include: Display substrate; The display substrate comprises a support layer and a display layer located on the support layer; An ultrasonic transducer is located on a side of the support layer away from the display layer; the ultrasonic transducer comprises a vibration cavity and a vibration part; the vibration part is located between the vibration cavity and the support layer; The acoustic matching layer is located between the vibration part and the supporting layer.

2. The display panel according to claim 1, wherein: The invention also comprises a conforming layer located on at least one side of the acoustic matching layer.

3. The display panel according to claim 2, wherein: The bonding layer is located between the acoustic matching layer and the supporting layer; the acoustic matching layer is in direct contact with the vibration part.

4. The display panel according to claim 2, wherein: The bonding layer includes a first bonding layer and a second bonding layer; the first bonding layer is located between the acoustic matching layer and the supporting layer; and the second bonding layer is located between the acoustic matching layer and the vibration part.

5. The display panel according to claim 1, wherein: The acoustic matching layer is in direct contact with the supporting layer, and the acoustic matching layer is in direct contact with the vibration part.

6. The display panel according to claim 5, wherein: The acoustic matching layer is made of viscous material.

7. The display panel according to claim 5, wherein: Also includes a connecting layer, located between the supporting layer and the ultrasonic transducer; The connecting layer includes an edge connecting structure arranged around the edge area of ​​the ultrasonic transducer; one side of the edge connecting structure is bonded to the supporting layer, and the other side is bonded to the ultrasonic transducer to form a closed space; the orthographic projection of the vibration cavity on the display substrate is located within the orthographic projection of the closed space on the display substrate; the acoustic matching layer is filled in the closed space.

8. The display panel according to claim 7, wherein: Also includes: At least one support column is located between the support layer and the ultrasonic transducer; the support column is located in the area surrounded by the edge connection structure and is spaced apart from the edge connection structure; the orthographic projection of the support column on the display substrate is located in the area outside the orthographic projection of the vibration cavity on the display substrate.

9. The display panel according to claim 7, wherein: The connection layer is provided as a whole layer; the connection layer further comprises an internal connection structure located in the area surrounded by the edge connection structure; the internal connection structure comprises a first opening penetrating the connection layer in a direction perpendicular to the display substrate; One of the first openings corresponds to one of the resonant cavities, and the orthographic projection of the resonant cavity on the display substrate is located within the orthographic projection of the first opening on the display substrate; the acoustic matching layer is located in the first opening.

10. The display panel according to any one of claims 1 to 9, wherein: The acoustic impedance of the acoustic matching layer is between the acoustic impedance of the vibration part and the acoustic impedance of the support layer.

11. The display panel according to claim 10, wherein: The acoustic matching layer is a single-layer structure, and the acoustic impedance of the acoustic matching layer satisfies: Wherein, Z represents the acoustic impedance of the acoustic matching layer; Z1 represents the acoustic impedance of the vibration part; and Z2 represents the acoustic impedance of the supporting layer.

12. The display panel according to claim 11, wherein: The shape of the vibration cavity is circular; the acoustic impedance Z1 of the vibration part satisfies: in, p represents the average effective sound pressure on the surface of the vibration part; represents the body velocity of the vibration part; ω represents the vibration angular frequency of the vibration part; ρ2 represents the density of the vibration part; h represents the thickness of the vibration part; a represents the radius of the circular vibration cavity; J0(x) represents the first-order zero-order Bessel function, x is the independent variable of the function; J1(x) represents the first-order first-order Bessel function, x is the independent variable of the function; I0(x) represents the first-order zero-order modified Bessel function, x is the independent variable of the function; I1(x) represents the first-order first-order modified Bessel function, x is the independent variable of the function; c2 represents the sound velocity of the ultrasonic wave propagating in the vibration part; E1 represents the Young's modulus of the vibration part; T represents the internal stress of the vibration part; and σ represents the Poisson's ratio of the vibration part.

13. The display panel according to claim 11, wherein: The thickness of the acoustic matching layer is an odd multiple of a quarter wavelength of the ultrasonic wave emitted by the ultrasonic transducer.

14. The display panel according to claim 10, wherein: The acoustic matching layer is a multi-layer structure.

15. The display panel according to claim 14, wherein: The acoustic matching layer comprises a first matching layer and a second matching layer which are sequentially stacked in a direction away from the ultrasonic transducer; The acoustic impedance of the first matching layer satisfies: The acoustic impedance of the second matching layer satisfies: Among them, Z 11 represents the acoustic impedance of the first matching layer; Z 22 represents the acoustic impedance of the second matching layer; Z1 represents the acoustic impedance of the vibration part; and Z2 represents the acoustic impedance of the supporting layer.

16. The display panel according to claim 14, wherein: The thickness of each layer in the multi-layer structure of the acoustic matching layer is an odd-numbered multiple of a quarter wavelength of the ultrasonic wave emitted by the ultrasonic transducer.

17. The display panel according to any one of claims 1 to 16, wherein: The orthographic projection of the ultrasonic transducer on the display substrate covers at least a partial area of ​​the display substrate.

18. The display panel according to claim 17, wherein: The orthographic projection of the ultrasonic transducer on the display substrate covers a partial area of ​​the display substrate; The display substrate also includes an ultra-clean film layer, which is located on the side of the support layer facing the ultrasonic transducer; the ultra-clean film layer includes a second opening that penetrates the ultra-clean film layer in a direction perpendicular to the support layer; and the orthographic projection of the ultrasonic transducer on the display substrate is located in the second opening.

19. A display device, wherein: It comprises the display panel as claimed in any one of claims 1 to 18.

20. A method for manufacturing a display panel, wherein: include: An acoustic matching layer is formed on a side of the vibration portion of the ultrasonic transducer that is away from the vibration cavity; A display substrate is attached to a side of the acoustic matching layer facing away from the ultrasonic transducer.

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