Electrical impedance dual-vision plane imaging method and system

Abstract

The invention discloses an electrical impedance dual-vision plane imaging method and system, and the method comprises the steps: enabling a plurality of electrodes to be respectively attached to a body surface in a horizontal surrounding manner and an upward-crossing surrounding manner, carrying out the grouping of the electrodes, and collecting the EIT imaging data of a to-be-imaged part of a to-be-detected body through controlling different electrode groups; obtaining electrical impedance data of a horizontal plane and a coronal plane of the to-be-imaged part of the to-be-detected body, and finally obtaining an in-vivo impedance distribution image under the dual-vision plane based on an imaging algorithm. Compared with the original two-dimensional electrical impedance imaging, the method can obtain the multi-dimensional impedance distribution information, and is convenient to identify the target. Meanwhile, compared with traditional three-dimensional electrical impedance imaging, large-scale matrix inversion based on a three-dimensional model is not needed, and an original electrical impedance imaging hardware system does not need to be changed.

Description

Technical Field

[0001] The present invention belongs to the field of medical imaging, and particularly relates to a new imaging method for bioelectrical impedance, specifically an electrical impedance dual-vision plane imaging method and system. Background Art

[0002] Electrical Impedance Tomography (EIT) places measurement electrodes on the surface of a living body, applies a safe excitation according to a certain rule, and measures the response voltage in real time. Based on the EIT imaging algorithm, the measured voltage can be converted into an internal impedance distribution image of the living body in real time, which is used to prompt important physiological and pathological information related thereto. Chinese Patent Application (Patent No.: ZL 199910015855.6) discloses an electrical impedance tomography method, which discloses the EIT imaging technical solution in detail.

[0003] In biological EIT technology, two-dimensional imaging is generally used to obtain the distribution map of biological impedance on the horizontal plane. However, when the projections of two targets overlap on the horizontal plane, two-dimensional EIT imaging is difficult to distinguish. Some literature reports three-dimensional EIT imaging, which can obtain the three-dimensional impedance distribution, but it needs to carry out imaging calculations based on a three-dimensional model, requires large-scale matrix inversion, has a high calculation cost, and the excitation and measurement rotation methods are relatively complex, and have high requirements for the performance of the EIT hardware system, so it has not been widely used. Summary of the Invention

[0004] In order to solve the problems existing in the prior art, the purpose of the present invention is to provide an electrical impedance dual-vision plane imaging method and system, which can solve the problem that two-dimensional EIT imaging is difficult to distinguish when the projections of two targets overlap on the horizontal plane.

[0005] The technical solution adopted by the present invention is as follows:

[0006] An electrical impedance dual-vision plane imaging method, comprising:

[0007] Arranging electrodes: attaching the first electrode group to the surface of the imaging part of the object to be measured in a surrounding manner, and the first electrode group is located on the horizontal plane of the imaging part of the object to be measured; attaching the second electrode group to the surface of the imaging part of the object to be measured in an over-straddling or under-straddling manner, and the second electrode group is located above or below the first electrode group, and the electrodes in the first electrode group and the second electrode group that are located on one side of the coronal plane of the imaging part of the object to be measured are denoted as the third electrode group;

[0008] Signal acquisition and processing: The EIT imaging data of the horizontal plane of the imaging part of the object to be measured is collected through the first electrode group, and the impedance distribution under the horizontal plane is obtained by using the EIT imaging data of the horizontal plane; The EIT imaging data of the coronal plane of the imaging part of the object to be measured is collected through the third electrode group, and the impedance distribution under the coronal plane is obtained by using the EIT imaging data of the coronal plane.

[0009] Preferably, when arranging the electrodes, the electrodes on the coronal plane side of the imaging part of the object to be measured in the first electrode group are selected from the electrodes on the side of the first electrode group away from the second electrode group.

[0010] Preferably, when arranging the electrodes, when the second electrode group is attached to the surface of the imaging part of the object to be measured in an upper-straddling manner, all the electrodes in the second electrode group are spaced apart and distributed on a convex curve above the horizontal plane of the imaging part of the object to be measured;

[0011] When the second electrode group is attached to the surface of the imaging part of the object to be measured in a lower-straddling manner, all the electrodes in the second electrode group are spaced apart and distributed on a concave curve below the horizontal plane of the imaging part of the object to be measured.

[0012] Preferably, all the electrodes in the second electrode group are located on the same plane, and the convex curve or the concave curve is the intersection line of the plane where all the electrodes in the second electrode group are located and the surface of the object to be measured when the plane where all the electrodes in the second electrode group are located passes through the intersection line of the coronal plane and the horizontal plane.

[0013] Preferably, when arranging the electrodes, in the first electrode group, electrodes are distributed at both points where the horizontal plane and the coronal plane of the imaging part of the object to be measured intersect, and the third electrode group includes the two electrodes in the first electrode group distributed at the intersection points of the horizontal plane and the coronal plane.

[0014] Preferably, when obtaining the impedance distribution under the horizontal plane by using the EIT imaging data of the horizontal plane and obtaining the impedance distribution under the coronal plane by using the EIT imaging data of the coronal plane, the surface of the object where the first electrode group and the second electrode group are located is subjected to finite element meshing, and the corresponding reconstruction matrix is calculated; Then, the impedance distribution under the horizontal plane is calculated according to the EIT imaging data of the horizontal plane of the imaging part of the object to be measured collected by the first electrode group, and the impedance distribution under the coronal plane is calculated according to the EIT imaging data of the coronal plane of the imaging part of the object to be measured collected by the second electrode group.

[0015] Preferably, the impedance distribution under the horizontal plane and the impedance distribution under the coronal plane are calculated by the following formula:

[0016] δρ i =B i δU i

[0017] In the formula, i represents the coronal plane or the horizontal plane, δρi = represents the impedance distribution of the coronal plane or the impedance distribution of the horizontal plane, B i δ represents the reconstruction matrix corresponding to the coronal plane or the reconstruction matrix corresponding to the horizontal plane, δU i represents the EIT imaging data of the coronal plane of the part to be imaged of the object to be measured collected by the third electrode group or the EIT imaging data of the horizontal plane of the part to be imaged of the object to be measured collected by the first electrode group.

[0018] Preferably, the reconstruction matrix corresponding to the coronal plane or the reconstruction matrix corresponding to the horizontal plane B i is calculated by the following formula:

[0019]

[0020] In the formula, i represents the coronal plane or the horizontal plane, J i represents the sensitivity coefficient matrix corresponding to the coronal plane or the sensitivity coefficient matrix corresponding to the horizontal plane, λ represents the regularization parameter, and I is the identity matrix.

[0021] Obtain the EIT imaging data of the horizontal plane of the part to be imaged of the object to be measured, and obtain the impedance distribution map under the horizontal plane by using the EIT imaging data of the horizontal plane;

[0022] Obtain the EIT imaging data of the coronal plane of the part to be imaged of the object to be measured, and obtain the impedance distribution map under the coronal plane by using the EIT imaging data of the coronal plane.

[0023] The present invention also provides an electrical impedance dual-vision plane imaging system, which is used to implement the electrical impedance dual-vision plane imaging method as described above in the present invention. The system includes a first electrode group, a second electrode group, an electrode control module, and an EIT acquisition system. The first electrode group and the second electrode group are both connected to the electrode control module, and the electrode control module is connected to the EIT acquisition system;

[0024] The electrode control module is used for: controlling the first electrode group to collect signals, switching the first electrode group and the second electrode group to the third electrode group and controlling the third electrode group to collect signals, and for transmitting the signals collected by the first electrode group and the signals collected by the third electrode group to the EIT acquisition system;

[0025] The EIT acquisition system is used for: collecting the EIT imaging data of the horizontal plane of the part to be imaged of the object to be measured through the first electrode group, and obtaining the impedance distribution under the horizontal plane by using the EIT imaging data of the horizontal plane; collecting the EIT imaging data of the coronal plane of the part to be imaged of the object to be measured through the third electrode group, and obtaining the impedance distribution under the coronal plane by using the EIT imaging data of the coronal plane.

[0026] Preferably, the electrode control module includes a micro - control unit, a constant - current source excitation circuit, an EIT electrode interface, an EIT acquisition system interface, a computer control interface, and a computer. The constant - current source excitation circuit, the EIT electrode interface, the EIT acquisition system interface, and the computer control interface are all connected to the micro - control unit. The first electrode group and the second electrode group are both connected to the EIT electrode interface. The EIT electrode interface is connected to the EIT acquisition system, and the computer is connected to the computer control interface. The computer is used to send instructions for EIT imaging data acquisition to the micro - control unit, and the micro - control unit can switch the first electrode group and the second electrode group to a third electrode group.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] Without changing the EIT hardware system, the present invention can achieve dual - vision plane EIT imaging only by reforming the arrangement form of EIT electrodes (i.e., adopting the electrode arrangement form of the third electrode group) and the imaging mode (i.e., adding the imaging of EIT imaging data detected by the third electrode group). The present invention solves the problem that the projections of multiple targets overlap on the horizontal plane and are difficult to distinguish by two - dimensional EIT. And compared with three - dimensional EIT, the method proposed by the present invention does not require large - scale matrix inversion, has low computational cost, and low requirements for the performance of the hardware system. Description of the Drawings

[0029] Figure 1 It is a schematic diagram of the "fork - type" EIT electrode used in the embodiment of the present invention.

[0030] Figure 2(a1) is a top - view schematic diagram (head) of the ring - type over - straddle EIT electrode configuration for the human head proposed in the embodiment of the present invention; Figure 2(a2) is a rear - view schematic diagram (head) of the ring - type over - straddle EIT electrode configuration for the human head proposed in the embodiment of the present invention; Figure 2(b1) is a front - view schematic diagram of the ring - type over - straddle EIT electrode configuration for the human lungs proposed in the embodiment of the present invention; Figure 2(b2) is a rear - view schematic diagram of the ring - type over - straddle EIT electrode configuration for the human lungs proposed in the embodiment of the present invention.

[0031] Figure 3 It is a schematic diagram of the design principle of the electrode control module in the embodiment of the present invention.

[0032] Figure 4 It is a flow chart of the dual - vision electrical impedance tomography imaging algorithm in the embodiment of the present invention.

[0033] Figure 5(a1) is a horizontal plane view of the skull, Figure 5(a2) is a coronal plane view of the skull shown in Figure 5(a1), Figure 5(b1) is an imaging result diagram of the traditional two-dimensional EIT for the skull shown in Figure 5(a1) and Figure 5(a2), Figure 5(c1) is a horizontal plane imaging result diagram of the electrical impedance dual-vision plane imaging method of the present invention for the skull shown in Figure 5(a1) and Figure 5(a2), Figure 5(c2) is a coronal plane imaging result diagram of the electrical impedance dual-vision plane imaging method of the present invention for the skull shown in Figure 5(a1) and Figure 5(a2), Figure 5(d1) is a horizontal plane view of the chest cavity, Figure 5(d2) is a coronal plane view of the chest cavity shown in Figure 5(d1), Figure 5(e1) is an imaging result diagram of the traditional two-dimensional EIT for the chest cavity shown in Figure 5(d1) and Figure 5(d2), Figure 5(f1) is a horizontal plane imaging result diagram of the electrical impedance dual-vision plane imaging method of the present invention for the chest cavity shown in Figure 5(d1) and Figure 5(d2), and Figure 5(f2) is a coronal plane imaging result diagram of the electrical impedance dual-vision plane imaging method of the present invention for the chest cavity shown in Figure 5(d1) and Figure 5(d2).

[0034] In the figure, 1 - electrode buckle, 2 - electrode wire, 3 - restraint sleeve. Detailed implementation mode

[0035] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0036] Refer to Figure 4 , the electrical impedance dual-vision plane imaging method of the present invention includes the following steps:

[0037] Step 1, adopt a "forked" electrode for the bioelectrical impedance electrode, as Figure 1 shown, the "forked" electrode includes an electrode wire 2, an electrode buckle 1 and a restraint sleeve 3. The electrode buckle 1 at the front end of the electrode wire 2 is tightly connected to the Ag / AgCl electrode sheet, the end of the electrode wire 2 is connected to the electrode control module, and the restraint sleeve 3 bundles different electrodes together.

[0038] Step 2: Attach the electrodes in Step 1 to the body surface in a horizontal circular and overlying manner to form a circular overlying electrode configuration. Among them, the horizontally circular electrode group is one group, denoted as the first electrode group, and the horizontally circular electrode group is attached to the surface of the part to be imaged of the object to be measured (the horizontal plane of the head as shown in Figures 2(a1) and 2(a2), the horizontal plane of the lungs as shown in Figures 2(b1) and 2(b2)) in a circular manner; the electrodes arranged in an overlying manner are one group, denoted as the second electrode group, and the second electrode group is located above or below the first electrode group (the coronal plane of the head as shown in Figures 2(a1) and 2(a2) and located above the horizontal plane, the upper side of the horizontal plane of the lungs as shown in Figures 2(b1) and 2(b2)). For human body parts with exposed coronal planes such as the head, the second electrode group can be directly set on the coronal plane of this part. For parts such as the lungs where the coronal plane is not exposed and the second electrode group cannot be directly arranged on the coronal plane, the electrode group can be set above or below the first electrode group. In subsequent data processing, the EIT imaging data used is the projection signal of the EIT imaging data collected by the second electrode group on the coronal plane.

[0039] Step 3: Refer to Figure 2(a1)-Figure 2(b2) , number and group the electrodes in Step 2: Taking the example of setting 16 electrodes in the first electrode group and 7 electrodes in the second electrode group, the electrode numbers on the horizontal plane are 1 - 16 respectively. The numbers of the 7 electrodes attached to the body surface in an overlying manner are 2’ - 8’ respectively. The electrodes numbered 1, 2’, … 8’, 9 … 16 are divided into the third electrode group, and the third electrode group can obtain the impedance data of the internal coronal plane of the object;

[0040] Step 4: Control the first electrode group and the scattered electrode group to measure respectively through the electrode measurement control module, and obtain the EIT imaging data δU 水平 and δU 冠状 corresponding to the horizontal plane and the coronal plane respectively;

[0041] Step 5: Process the EIT imaging data δU 水平 and δU 冠状 corresponding to the horizontal plane and the coronal plane, and finally obtain the impedance distribution maps δρ 水平 and δρ 冠状 under the double vision planes (i.e., the horizontal plane and the coronal plane).

[0042] The specific process of Step 5 includes: performing finite element meshing on the object plane where the first electrode group and the third electrode group are located, and calculating the corresponding reconstruction matrix i = horizontal, coronal. Where J i represents the sensitivity coefficient matrix, λ represents the regularization parameter, and I is the identity matrix. Then, according to the measurement data of the first electrode group and the second electrode group, calculate the impedance distribution under the horizontal and coronal two vision planes, that is, δρ i = Bi δU i i = horizontal, coronal. In the above formula, when i is horizontal, it means that the corresponding parameter is the corresponding parameter under the horizontal plane, and when i is coronal, it means that the corresponding parameter is the corresponding parameter under the coronal plane.

[0043] As a preferred implementation scheme of the above scheme of the present invention, when arranging electrodes, the electrodes in the first electrode group located on the coronal plane side of the part to be imaged of the subject are selected from the electrodes on the side of the first electrode group facing away from the second electrode group. Taking Figure 2 (b1) and Figure 2 (b2) as examples, since the second electrode group (electrode numbers are 2'-8' respectively) cannot be directly arranged on the coronal plane at this time, the second electrode group is arranged on the chest of the human body at this time, and the corresponding third resistor group is the second electrode group and the electrodes located on the chest and back of the first electrode group (electrode numbers are 9-16 and electrode No. 1 respectively) together constitute the third electrode group mentioned in the present invention. Among them, the electrodes located on the back of the first electrode group belong to the situation where the electrodes in the first electrode group located on the coronal plane side of the part to be imaged of the subject are selected from the electrodes on the side of the first electrode group facing away from the second electrode group.

[0044] As a preferred embodiment of the above scheme of the present invention, when the electrodes are arranged, when the second electrode group is attached to the surface of the part to be imaged of the object to be tested in an upward straddle manner, all the electrodes in the second electrode group are spaced and distributed on an upward convex curve above the horizontal plane of the part to be imaged of the object to be tested; refer to Figure 2 (a2) and Figure 2 (b2);

[0045] When the second electrode group is attached to the surface of the imaging part of the object to be tested in a downward-straddling manner, all electrodes in the second electrode group are spaced apart and distributed on a concave curve below the horizontal plane of the imaging part of the object to be tested, which is exactly the opposite of the situation in Figure 2 (b2).

[0046] As a preferred implementation scheme of the above-mentioned scheme of the present invention, all electrodes in the second electrode group are located on the same plane, and the convex curve or the concave curve is the intersection line of the plane where all electrodes in the second electrode group are located and the surface of the object to be measured when the plane where all electrodes in the second electrode group are located passes through the intersection line of the coronal plane and the horizontal plane.

[0047] As a preferred implementation scheme of the above-mentioned scheme of the present invention, when arranging the electrodes, in the first electrode group, electrodes are distributed at two points where the horizontal plane and the coronal plane of the part to be imaged of the object to be tested intersect, and the third electrode group includes two electrodes in the first electrode group distributed at the intersection point of the horizontal plane and the coronal plane.

[0048] It can be seen from the above scheme of the present invention that the present invention can simultaneously obtain the bioimpedance distribution in two visual planes, the horizontal plane and the coronal plane, provide more comprehensive impedance position information, and solve the problem that two-dimensional EIT imaging is difficult to distinguish when the projections of two targets overlap on the horizontal plane.

[0049] According to the above solution, as Figure 5(a1) to Figure 5(f2) shown, based on a three-dimensional model, the present invention simulates impedance change targets that coincide on the horizontal plane and do not coincide on the coronal plane. Figures 5(a1) and 5(a2), Figures 5(d1) and 5(d2) are the horizontal plane and coronal plane views of two preset targets. Figures 5(b1) and 5(e1) are the results of traditional two-dimensional EIT imaging. Figures 5(c1) and 5(c2), Figures 5(f1) and 5(f2) are the imaging results obtained by the electrical impedance dual-vision plane imaging system and method proposed by the present invention. The imaging results show that when the impedance targets coincide on the horizontal plane, the results of traditional two-dimensional EIT imaging cannot reflect the positions of the two targets, while the method proposed by the present invention can simultaneously obtain the imaging results of the horizontal plane and the coronal plane, effectively distinguishing different targets.

[0050] The present invention also provides an electrical impedance dual-vision plane imaging system, as Figure 3 shown, this system is used to implement the electrical impedance dual-vision plane imaging method described in any one of the above embodiments of the present invention. This system includes a first electrode group, a second electrode group, an electrode control module, and an EIT acquisition system. The first electrode group and the second electrode group are both connected to the electrode control module, and the electrode control module is connected to the EIT acquisition system;

[0051] The electrode control module is used for: controlling the first electrode group to collect signals, switching the first electrode group and the second electrode group to a third electrode group and controlling the third electrode group to collect signals, and for transmitting the signals collected by the first electrode group and the signals collected by the third electrode group to the EIT acquisition system;

[0052] The EIT acquisition system is used for: collecting EIT imaging data of the horizontal plane of the part to be imaged of the object to be measured through the first electrode group, and obtaining the impedance distribution under the horizontal plane by using the EIT imaging data of the horizontal plane; collecting EIT imaging data of the coronal plane of the part to be imaged of the object to be measured through the third electrode group, and obtaining the impedance distribution under the coronal plane by using the EIT imaging data of the coronal plane.

[0053] Exemplarily, as Figure 3 shown, the electrode control module includes a micro-control unit, a constant current source excitation circuit, an EIT electrode interface, an EIT acquisition system interface, a computer control interface, and a computer. The constant current source excitation circuit, the EIT electrode interface, the EIT acquisition system interface, and the computer control interface are all connected to the micro-control unit. The first electrode group and the second electrode group are both connected to the EIT electrode interface, the EIT electrode interface is connected to the EIT acquisition system, and the computer is connected to the computer control interface. The computer is used to issue instructions for EIT imaging data acquisition to the micro-control unit, and the micro-control unit can switch the first electrode group and the second electrode group to the third electrode group.

[0054] It should be noted that the above embodiments are only for those skilled in the art to further understand the present invention. The present invention is not limited to these embodiments. Any equivalent substitution and addition made by those skilled in the art according to the technical solution of the invention also fall within the scope of protection of the present invention.

Claims

1. A method for impedance dual-vision planar imaging, characterized in that include: Arrange electrodes: attach the first electrode group to the surface of the part to be imaged of the object to be tested in a surrounding manner, and the first electrode group is located on the horizontal plane of the part to be imaged of the object to be tested; attach the second electrode group to the surface of the part to be imaged of the object to be tested in an upper-span or lower-span manner, and the second electrode group is located on the upper side or the lower side of the first electrode group, and the second electrode group and the electrodes in the first electrode group located on the coronal plane side of the part to be imaged of the object to be tested are recorded as the third electrode group; Signal acquisition and processing: The first electrode group is used to collect EIT imaging data of the horizontal plane of the part to be imaged of the object to be tested, and the impedance distribution below the horizontal plane is obtained using the EIT imaging data of the horizontal plane; the third electrode group is used to collect EIT imaging data of the coronal plane of the part to be imaged of the object to be tested, and the impedance distribution below the coronal plane is obtained using the EIT imaging data of the coronal plane.

2. The impedance tomography dual-vision planar imaging method according to claim 1, wherein When arranging the electrodes, the electrodes in the first electrode group located on the coronal plane side of the part to be imaged of the subject are electrodes on the side of the first electrode group facing away from the second electrode group.

3. The impedance tomography dual-vision planar imaging method according to claim 1, wherein When arranging the electrodes, when the second electrode group is attached to the surface of the portion to be imaged of the object to be tested in an upward straddle manner, all electrodes in the second electrode group are spaced and distributed on an upward convex curve above the horizontal plane of the portion to be imaged of the object to be tested; When the second electrode group is attached to the surface of the portion to be imaged of the object to be tested in a downward-straddling manner, all electrodes in the second electrode group are spaced and distributed on a concave curve below the horizontal plane of the portion to be imaged of the object to be tested.

4. The impedance tomography dual-vision planar imaging method according to claim 3, wherein, All electrodes in the second electrode group are located on the same plane, and the convex curve or concave curve is the intersection line of the plane where all electrodes in the second electrode group are located and the surface of the object to be measured when the plane where all electrodes in the second electrode group are located passes through the intersection line of the coronal plane and the horizontal plane.

5. A method for impedance dual-vision planar imaging according to any one of claims 1-4, characterized in that When arranging electrodes, in the first electrode group, electrodes are distributed at two points where the horizontal plane and the coronal plane of the imaging part of the object to be tested intersect, and the third electrode group includes two electrodes distributed at the intersection point of the horizontal plane and the coronal plane in the first electrode group.

6. The impedance tomography dual-vision planar imaging method according to claim 1, characterized in that When the impedance distribution in the horizontal plane is obtained by using the EIT imaging data in the horizontal plane and the impedance distribution in the coronal plane is obtained by using the EIT imaging data in the coronal plane, the surface on the object where the first electrode group and the second electrode group are located is subjected to finite element segmentation, and the corresponding reconstruction matrix is ​​calculated; then, the impedance distribution in the horizontal plane is calculated based on the EIT imaging data in the horizontal plane of the imaging part of the object to be measured collected by the first electrode group, and the impedance distribution in the coronal plane is calculated based on the EIT imaging data in the coronal plane of the imaging part of the object to be measured collected by the second electrode group.

7. A method for impedance dual-vision planar imaging according to claim 1, characterized in that The impedance distribution in the horizontal plane and the impedance distribution in the coronal plane are calculated by the following formula: δρ i = B i δU i wherein, i represents the coronal plane or the horizontal plane, and δρ i = represents the impedance distribution of the coronal plane or the impedance distribution of the horizontal plane, B i δ represents the reconstruction matrix corresponding to the coronal plane or the reconstruction matrix corresponding to the horizontal plane, δU i represents the EIT imaging data of the coronal plane of the part to be imaged of the object to be measured collected by the third electrode group or the EIT imaging data of the horizontal plane of the part to be imaged of the object to be measured collected by the first electrode group.

8. The electrical impedance dual-vision planar imaging method according to claim 1, wherein The reconstruction matrix corresponding to the coronal plane or the reconstruction matrix B corresponding to the horizontal plane i Calculated by the following formula: where i represents the coronal plane or the horizontal plane, and J i represents the sensitivity coefficient matrix corresponding to the coronal plane or the sensitivity coefficient matrix corresponding to the horizontal plane, λ represents the regularization parameter, and I is the identity matrix; Acquire EIT imaging data of the horizontal plane of the part to be imaged of the object to be tested, and obtain an impedance distribution map under the horizontal plane using the EIT imaging data of the horizontal plane; The EIT imaging data of the coronal plane of the part to be imaged of the object to be tested is obtained, and the impedance distribution map under the coronal plane is obtained by using the EIT imaging data of the coronal plane.

9. An impedance dual-vision planar imaging system, characterized in that, This system is used to implement the electrical impedance dual-vision planar imaging method described in any one of claims 1-8. The system includes a first electrode group, a second electrode group, an electrode control module, and an EIT acquisition system. The first electrode group and the second electrode group are both connected to the electrode control module, and the electrode control module is connected to the EIT acquisition system; The electrode control module is used for: controlling the first electrode group to collect signals, switching the first electrode group and the second electrode group to a third electrode group and controlling the third electrode group to collect signals, and for transmitting the signals collected by the first electrode group and the signals collected by the third electrode group to the EIT acquisition system; The EIT acquisition system is used for: collecting EIT imaging data of the horizontal plane of the part to be imaged of the object to be measured through the first electrode group, and obtaining the impedance distribution under the horizontal plane by using the EIT imaging data of the horizontal plane; collecting EIT imaging data of the coronal plane of the part to be imaged of the object to be measured through the third electrode group, and obtaining the impedance distribution under the coronal plane by using the EIT imaging data of the coronal plane.

10. A resistance impedance double-vision planar imaging system according to claim 9, characterized in that, The electrode control module includes a micro-control unit, a constant current source excitation circuit, an EIT electrode interface, an EIT acquisition system interface, a computer control interface, and a computer. The constant current source excitation circuit, the EIT electrode interface, the EIT acquisition system interface, and the computer control interface are all connected to the micro-control unit. The first electrode group and the second electrode group are both connected to the EIT electrode interface. The EIT electrode interface is connected to the EIT acquisition system. The computer is connected to the computer control interface. The computer is used to issue instructions for EIT imaging data acquisition to the micro-control unit, and the micro-control unit can switch the first electrode group and the second electrode group to a third electrode group.

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