Thermal management system, control method of thermal management system and vehicle
By using two compressors or double-head compressor modules in the thermal management system to share the load, the problem of low efficiency of compressors under extremely low temperatures and extremely high temperatures and high loads is solved, and the system performance is improved.
Patent Information
- Application Number
- CN202510477034.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2025-02-18
- Filing Date
- 2025-04-16
- Publication Date
- 2025-07-04
AI Technical Summary
The existing thermal management system has low operating efficiency under extremely low temperature and extremely high temperature and high load requirements, and the cooling capacity and heating capacity are difficult to meet the requirements, which affects the system performance.
Using a compressor module including two compressors or a double-head compressor, the refrigerant circuit and water circuit design share the load, so that each compressor can operate within a comfortable pressure ratio range, and improve the compressor efficiency.
Under high pressure ratio load conditions, the operating efficiency of the compressor is improved and the overall performance of the system is improved.
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Figure CN120245669A_ABST
Abstract
Description
Technical Field
[0001] Embodiments of the present invention relate to thermal management technologies, and in particular, to a thermal management system, a control method for the thermal management system, and a vehicle. Background Art
[0002] The thermal management system cools or heats the vehicle. According to the actual needs of the vehicle, the thermal management system needs to adjust its working state to meet the actual requirements.
[0003] Currently, in the existing thermal management system, in the scenarios of extremely low temperature and extremely high temperature with large load requirements, the refrigerant circuit will exhibit the characteristic of large pressure ratio. The compressor often operates at the limit state under this working condition, resulting in high discharge temperature of the compressor, low operating efficiency, and the cooling capacity and heating capacity being difficult to meet the requirements, which affects the system performance. Summary of the Invention
[0004] Embodiments of the present invention provide a thermal management system, a control method for the thermal management system, and a vehicle to improve the system performance.
[0005] In a first aspect, embodiments of the present invention provide a thermal management system, including: a refrigerant circuit and a water circuit; the refrigerant circuit includes a compressor module, a condenser, a liquid storage tank, a first electronic expansion valve, and a cooler, and the compressor module includes two compressors or a double-headed compressor;
[0006] Wherein, the outlet of the compressor module is communicated with the refrigerant side inlet of the condenser, the refrigerant side outlet of the condenser is communicated with the inlet of the liquid storage tank, the outlet of the liquid storage tank is communicated with the refrigerant side inlet of the cooler through the first electronic expansion valve, the refrigerant side outlet of the cooler is communicated with the inlet of the compressor module, and the water side of the condenser and the water side of the cooler are communicated with the water circuit.
[0007] Optionally, the compressor module includes a first compressor and a second compressor, the suction port of the first compressor serves as the inlet of the compressor module, the discharge port of the second compressor serves as the outlet of the compressor module, and the discharge port of the first compressor is communicated with the suction port of the second compressor.
[0008] Optionally, the compressor module further includes an intercooler, and the discharge port of the first compressor is communicated with the suction port of the second compressor through the intercooler.
[0009] Optionally, the refrigerant circuit further includes an evaporator and a second electronic expansion valve, the outlet of the liquid storage tank is communicated with the inlet of the evaporator through the second electronic expansion valve, and the outlet of the evaporator is communicated with the inlet of the compressor module.
[0010] Optionally, the compressor module, the condenser, the liquid storage tank, the first electronic expansion valve, and the cooler are located in the same enclosed box.
[0011] Optionally, the water circuit includes a heater core, a battery pack assembly, a motor assembly, a radiator, a heater, an electronic water pump, and a multi-way valve. The outlet of the heater core is communicated with the water-side inlet of the condenser. The inlet of the heater core is communicated with the water-side outlet of the condenser through the multi-way valve. The outlet of the battery pack assembly is communicated with the inlet of the heater through the multi-way valve. The outlet of the heater is communicated with the water-side inlet of the cooler. The water-side outlet of the cooler is communicated with the inlet of the battery pack assembly through the multi-way valve. The outlet of the motor assembly is communicated with the water-side inlet of the condenser through the electronic water pump and the multi-way valve. The outlet of the radiator is communicated with the inlet of the motor assembly. The water-side outlet of the condenser is communicated with the inlet of the radiator through the multi-way valve.
[0012] Optionally, the electronic water pump includes a first electronic water pump, a second electronic water pump, and a third electronic water pump. The multi-way valve includes a first five-way valve, a second five-way valve, and a first three-way valve. The first end of the first five-way valve is communicated with the inlet of the heater. The outlet of the motor assembly is communicated with the second end of the first five-way valve through the first electronic water pump. The third end of the first five-way valve and the outlet of the heater core are both communicated with the water-side inlet of the condenser through the second electronic water pump. The water-side outlet of the condenser is communicated with the first end of the first three-way valve. The second end of the first three-way valve is communicated with the inlet of the heater core. The third end of the first three-way valve is communicated with the first end of the second five-way valve. The second end of the second five-way valve is communicated with the inlet of the battery pack assembly through the third electronic water pump. The outlet of the battery pack assembly is communicated with the fifth end of the first five-way valve. The fourth end of the first five-way valve is communicated with the second end of the second five-way valve. The third end of the second five-way valve is communicated with the water-side outlet of the cooler. The fourth end of the second five-way valve is communicated with the inlet of the motor assembly. The fifth end of the second five-way valve is communicated with the inlet of the radiator.
[0013] Optionally, the refrigerant circuit further includes a water-cooled heat exchanger. The multi-way valve further includes a second three-way valve. The outlet of the water-cooled heat exchanger is communicated with the water-side inlet of the cooler. The inlet of the water-cooled heat exchanger is communicated with the first end of the second three-way valve. The second end of the second three-way valve is communicated with the water-side inlet of the cooler. The third end of the second three-way valve is communicated with the third end of the second five-way valve.
[0014] Second aspect, an embodiment of the present invention provides a control method for a thermal management system. The control method is applied to the thermal management system as described in the first aspect, and the control method includes:
[0015] Receiving a control instruction;
[0016] According to the control instruction, controlling the working state of the compressor module and the working state of the first electronic expansion valve.
[0017] Third aspect, an embodiment of the present invention provides a vehicle, including the thermal management system as described in the first aspect.
[0018] The thermal management system, the control method for the thermal management system, and the vehicle provided by the embodiments of the present invention. The thermal management system includes: a refrigerant circuit and a water circuit; the refrigerant circuit includes a compressor module, a condenser, a liquid storage tank, a first electronic expansion valve, and a cooler. The compressor module includes two compressors or a double-headed compressor; wherein, the outlet of the compressor module is communicated with the refrigerant-side inlet of the condenser, the refrigerant-side outlet of the condenser is communicated with the inlet of the liquid storage tank, the outlet of the liquid storage tank is communicated with the refrigerant-side inlet of the cooler through the first electronic expansion valve, the refrigerant-side outlet of the cooler is communicated with the inlet of the compressor module, and the water-side of the condenser and the water-side of the cooler are communicated with the water circuit. For the thermal management system provided by the embodiments of the present invention, the compressor module includes two compressors or a double-headed compressor. Compared with the traditional single-stage compression, under the working conditions of large pressure ratio load, the two compressors share the load, reducing the load of a single compressor, enabling each compressor to operate in a comfortable pressure ratio range, thereby improving the operating efficiency of the compressor and effectively enhancing the system performance. Description of the Drawings
[0019] Figure 1 is a schematic structural diagram of a thermal management system provided by Embodiment 1 of the present invention;
[0020] Figure 2 is a schematic structural diagram of another thermal management system provided by Embodiment 1 of the present invention;
[0021] Figure 3 is a schematic structural diagram of yet another thermal management system provided by Embodiment 1 of the present invention;
[0022] Figure 4 is a schematic structural diagram of a thermal management system provided by Embodiment 2 of the present invention;
[0023] Figure 5 is a schematic structural diagram of another thermal management system provided by Embodiment 2 of the present invention;
[0024] Figure 6 is a schematic structural diagram of yet another thermal management system provided by Embodiment 2 of the present invention;
[0025] Figure 7 It is a flowchart of a control method for a thermal management system provided in Embodiment 3 of the present invention;
[0026] Figure 8 It is a structural block diagram of a control device for a thermal management system provided in Embodiment 4 of the present invention;
[0027] Figure 9 It is a schematic structural diagram of an electronic device provided in Embodiment 5 of the present invention. Detailed implementation manners
[0028] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. Additionally, it should be noted that for the sake of description, only parts related to the present invention are shown in the drawings, rather than all structures.
[0029] Figure 1 It is a schematic structural diagram of a thermal management system provided in Embodiment 1 of the present invention, Figure 2 It is another schematic structural diagram of a thermal management system provided in Embodiment 1 of the present invention, Figure 3 It is still another schematic structural diagram of a thermal management system provided in Embodiment 1 of the present invention. Referring to Figures 1 - 3 , the thermal management system includes: a refrigerant circuit and a water circuit; the refrigerant circuit includes a compressor module 10, a condenser WCC, a liquid storage tank RD, a first electronic expansion valve EXV1, and a cooler CH. The compressor module 10 includes two compressors C1, C2 or a double-headed compressor (two compressors C1, C2 share a controller and a motor rotating shaft, which is called a double-headed compressor); wherein, the outlet of the compressor module 10 is communicated with the refrigerant-side inlet of the condenser WCC, the refrigerant-side outlet of the condenser WCC is communicated with the inlet of the liquid storage tank RD, the outlet of the liquid storage tank RD is communicated with the refrigerant-side inlet of the cooler CH through the first electronic expansion valve EXV1, the refrigerant-side outlet of the cooler CH is communicated with the inlet of the compressor module 10, and the water-side of the condenser WCC and the water-side of the cooler CH are communicated with the water circuit.
[0030] Specifically, the inlet of the compressor module 10 sucks in low-temperature superheated gas. The low-temperature superheated gas is compressed by the compressor module 10 and discharged as high-temperature and high-pressure superheated gas. The high-temperature and high-pressure superheated gas flows into the condenser WCC. After being cooled by the condenser WCC, it enters the liquid storage tank RD. The saturated liquid refrigerant flows out of the liquid storage tank RD. After throttling through the first electronic expansion valve EXV1, it becomes a gas-liquid two-phase state and completes evaporation and heat absorption in the cooler CH. Moreover, by adjusting the opening degree of the first electronic expansion valve EXV1, the superheat degree at the outlet of the cooler CH is controlled, and thus the intake superheat degree of the compressor module 10 can be controlled, thereby completing the entire compression cycle.
[0031] The thermal management system provided in this embodiment includes: a refrigerant circuit and a water circuit; the refrigerant circuit includes a compressor module, a condenser, a liquid storage tank, a first electronic expansion valve, and a cooler. The compressor module includes two compressors or a double-headed compressor; wherein, the outlet of the compressor module is communicated with the refrigerant-side inlet of the condenser, the refrigerant-side outlet of the condenser is communicated with the inlet of the liquid storage tank, the outlet of the liquid storage tank is communicated with the refrigerant-side inlet of the cooler through the first electronic expansion valve, the refrigerant-side outlet of the cooler is communicated with the inlet of the compressor module, and the water-side of the condenser and the water-side of the cooler are communicated with the water circuit. In the thermal management system provided in this embodiment, the compressor module includes two compressors or a double-headed compressor. Compared with the traditional single-stage compression, under the working condition of a large pressure ratio load, the two compressors share the load, reducing the load on a single compressor, enabling each compressor to operate within a comfortable pressure ratio range, thereby improving the operating efficiency of the compressor and effectively enhancing the system performance.
[0032] Embodiment Two
[0033] This embodiment is based on Embodiment One. Refer to Figures 1 - 3 , optionally, the compressor module 10 includes a first compressor C1 and a second compressor C2. The suction port of the first compressor C1 serves as the inlet of the compressor module, and the discharge port of the second compressor C2 serves as the outlet of the compressor module. The discharge port of the first compressor C1 is communicated with the suction port of the second compressor C2.
[0034] Specifically, the low-temperature superheated gas sucked in at the inlet of the compressor module 10 is compressed by the first compressor C1 and discharged as medium-temperature and medium-pressure gaseous refrigerant. The medium-temperature and medium-pressure gaseous refrigerant flows into the suction port of the second compressor C2. After being compressed by the second compressor C2, it is discharged as high-temperature and high-pressure superheated gas. The high-temperature and high-pressure superheated gas flows into the condenser WCC. Compared with the traditional single-stage compression, under the working condition of a large pressure ratio load, the two compressors share the load, reducing the load on a single compressor, enabling each compressor to operate within a comfortable pressure ratio range, thereby improving the operating efficiency of the compressor and effectively enhancing the system performance.
[0035] Figure 4It is a schematic structural diagram of a thermal management system provided in Embodiment 2 of the present invention. Figure 5 It is a schematic structural diagram of another thermal management system provided in Embodiment 2 of the present invention. Figure 6 It is a schematic structural diagram of yet another thermal management system provided in Embodiment 2 of the present invention. Refer to Figures 4 - 6 Optionally, the compressor module 10 further includes an intercooler IC, and the exhaust port of the first compressor C1 is communicated with the suction port of the second compressor C2 through the intercooler IC.
[0036] Among them, the intercooler IC cools the medium-temperature and medium-pressure gaseous refrigerant compressed and discharged by the first compressor C1, and the cooled gaseous refrigerant flows into the suction port of the second compressor C2. Through the intercooler IC, direct cooling of the gaseous refrigerant between the first compressor C1 and the second compressor C2 can be realized, which can further reduce the system operating pressure ratio and further improve the system operating efficiency.
[0037] Refer to Figure 2 and Figure 5 Optionally, the refrigerant circuit further includes an evaporator EVAP and a second electronic expansion valve EXV2. The outlet of the liquid storage tank RD is communicated with the inlet of the evaporator EVAP through the second electronic expansion valve EXV2, and the outlet of the evaporator EVAP is communicated with the inlet of the compressor module 10.
[0038] Among them, the saturated liquid refrigerant flowing out of the outlet of the liquid storage tank RD is divided into two paths. One path is throttled by the first electronic expansion valve EXV1 and then completes evaporation and heat absorption in the cooler CH, and the other path is throttled by the second electronic expansion valve EXV2 and then completes evaporation and heat absorption in the evaporator EVAP. The evaporator EVAP is located in the passenger compartment. The thermal management system is combined with the evaporator EVAP in the passenger compartment and the water circuit switching to realize functions such as vehicle refrigeration, heating, dehumidification and defrosting, battery cooling / heating, motor heat dissipation and waste heat recovery, and is applicable to refrigerants such as R134A / R1234YF / R744 that can enter the passenger compartment to complete evaporation and heat absorption.
[0039] Optionally, the compressor module 10, the condenser WCC, the liquid storage tank RD, the first electronic expansion valve EXV1 and the cooler CH are located in the same sealed box.
[0040] Specifically, as shown in Figure 1 and Figure 4 The structure is compactly located in a sealed and sturdy box, which can effectively reduce the refrigerant filling amount such as R290 refrigerant and ensure that it is within the safe evaluation filling amount. The box can be equipped with an R290 concentration detection sensor and filled with inert gas. In case of R290 refrigerant leakage, relevant measures can be taken in time. In addition, even in case of combustion and explosion, the box can block the damage caused by the combustion and explosion, so as to ensure the safe use of R290 refrigerant and give full play to its advantages of natural refrigerant.
[0041] Reference Figures 2 - 6 Optionally, the water circuit includes a heater core HE, a battery pack assembly BAT, a motor assembly M, a radiator LTR, a heater PTC, an electronic water pump, and a multi-way valve. The outlet of the heater core HE is connected to the water side inlet of the condenser WCC, and the inlet of the heater core HE is connected to the water side outlet of the condenser WCC through the multi-way valve. The outlet of the battery pack assembly BAT is connected to the inlet of the heater PTC through the multi-way valve. The outlet of the heater PTC is connected to the water side inlet of the cooler CH, and the water side outlet of the cooler CH is connected to the inlet of the battery pack assembly BAT through the multi-way valve. The outlet of the motor assembly M is connected to the water side inlet of the condenser WCC through the electronic water pump and the multi-way valve. The outlet of the radiator LTR is connected to the inlet of the motor assembly M, and the water side outlet of the condenser WCC is connected to the inlet of the radiator LTR through the multi-way valve.
[0042] Among them, there are multiple electronic water pumps and multi-way valves. The refrigerant circuit works to heat or cool the battery pack assembly BAT that is the water circuit, and to dissipate heat from the motor. The heat transfer process in the water circuit can refer to the prior art and will not be elaborated here.
[0043] Optionally, the electronic water pump includes a first electronic water pump P1, a second electronic water pump P2, and a third electronic water pump P3. The multi-way valve includes a first five-way valve V11, a second five-way valve V12, and a first three-way valve V21. The first end of the first five-way valve V11 is connected to the inlet of the heater PTC. The outlet of the motor assembly M is connected to the second end of the first five-way valve V11 through the first electronic water pump P1. The third end of the first five-way valve V11 and the outlet of the heater core HE are both connected to the water side inlet of the condenser WCC through the second electronic water pump P2. The water side outlet of the condenser WCC is connected to the first end of the first three-way valve V21. The second end of the first three-way valve V21 is connected to the inlet of the heater core HE. The third end of the first three-way valve V21 is connected to the first end of the second five-way valve V12. The second end of the second five-way valve V12 is connected to the inlet of the battery pack assembly BAT through the third electronic water pump P3. The outlet of the battery pack assembly BAT is connected to the fifth end of the first five-way valve V12. The fourth end of the first five-way valve V11 is connected to the second end of the second five-way valve V12. The third end of the second five-way valve V12 is connected to the water side outlet of the cooler CH. The fourth end of the second five-way valve V12 is connected to the inlet of the motor assembly M. The fifth end of the second five-way valve V12 is connected to the inlet of the radiator LTR.
[0044] Specifically, the outlet of the motor assembly M is communicated with the inlet of the first electric water pump P1. The outlet of the first electric water pump P1 is communicated with the inlet of the second electric water pump P2 through the second end and the third end of the first five-way valve V11. The outlet of the battery pack assembly BAT is communicated with the inlet of the heater PTC through the fifth end and the first end of the first five-way valve V11. The waterway side outlet of the cooler CH is communicated with the inlet of the battery pack assembly BAT through the third end and the second end of the second five-way valve V12. The third end of the first three-way valve V21 is communicated with the inlet of the radiator LTR through the first end and the fifth end of the second five-way valve V12. The conduction states of each five-way valve and each three-way valve can refer to the description in the existing thermal management system and will not be elaborated here.
[0045] Reference Figure 3 And Figure 6 Optionally, the refrigerant circuit further includes a water-cooled heat exchanger CO, and the multi-way valve further includes a second three-way valve V22. The outlet of the water-cooled heat exchanger CO is communicated with the waterway side inlet of the cooler CH. The inlet of the water-cooled heat exchanger CO is communicated with the first end of the second three-way valve V22. The second end of the second three-way valve V22 is communicated with the waterway side inlet of the cooler CH. The third end of the second three-way valve V22 is communicated with the third end of the second five-way valve V12.
[0046] Among them, the water-cooled heat exchanger CO is a water-cooled heat exchanger in the passenger compartment. The thermal management system in this embodiment is combined with the water-cooled heat exchanger in the passenger compartment and the waterway switching to realize the functions of refrigeration, heating, dehumidification and defrosting of the whole vehicle, cooling / heating of the battery, heat dissipation of the motor and waste heat recovery.
[0047] For the thermal management system provided in this embodiment, the compressor module includes a first compressor and a second compressor. Compared with the traditional single compressor, under the working condition of large pressure ratio load, the two compressors share the load, reduce the load of a single compressor, and enable each compressor to operate in a comfortable pressure ratio range, thereby improving the operation efficiency of the compressor and effectively enhancing the system performance.
[0048] Embodiment III
[0049] Figure 7 FIG. is a flowchart of a control method for a thermal management system provided in Embodiment III of the present invention. This embodiment is applicable to controlling aspects such as a thermal management system, such as the thermal management system of a vehicle. This method can be executed by a control device of the thermal management system. The control device can be integrated in the processor of an electronic device. The processor can be implemented in the form of software and / or hardware. The method specifically includes the following steps:
[0050] Step 110, receive a control instruction.
[0051] Among them, the control instruction can be an instruction that requires both the compressor module and the first electronic expansion valve to work, or an instruction that requires the compressor module and the first electronic expansion valve to stop working.
[0052] Step 120: According to the control instruction, control the working state of the compressor module and the working state of the first electronic expansion valve.
[0053] Specifically, when the control instruction includes an instruction that requires both the compressor module and the first electronic expansion valve to work, control each compressor in the compressor module to start running and control the opening degree of the first electronic expansion valve; when the control instruction includes an instruction that requires the compressor module and the first electronic expansion valve to stop working, control each compressor in the compressor module to stop running and control the first electronic expansion valve to close.
[0054] The control method of the thermal management system provided in this embodiment includes: receiving a control instruction, and according to the control instruction, controlling the working state of the compressor module and the working state of the first electronic expansion valve. When it is necessary for both the compressor module and the first electronic expansion valve to work, control each compressor in the compressor module to start running and control the opening degree of the first electronic expansion valve to achieve the control of the thermal management system.
[0055] This embodiment also provides a vehicle, including the thermal management system described in any embodiment of the present invention.
[0056] The vehicle provided in this embodiment and the thermal management system provided in any embodiment of the present invention belong to the same inventive concept and have corresponding beneficial effects. For the technical details not elaborated in this embodiment, please refer to the thermal management system provided in any embodiment of the present invention.
[0057] Embodiment Four
[0058] Figure 8 It is a structural block diagram of a control device for a thermal management system provided in Embodiment Four of the present invention. This control device can be integrated in the processor of an electronic device. Refer to Figure 8 , this control device includes: an instruction receiving module 210 and a state control module 220. Among them, the instruction receiving module 210 is used to receive control instructions; the state control module 220 is used to control the working state of the compressor module and the working state of the first electronic expansion valve according to the control instructions.
[0059] On the basis of the above implementation manner, the state control module 220 is specifically used to control each compressor in the compressor module to start running and control the opening degree of the first electronic expansion valve when the received instruction includes an instruction that requires both the compressor module and the first electronic expansion valve to work; when the received control instruction includes an instruction that requires the compressor module and the first electronic expansion valve to stop working, control each compressor in the compressor module to stop running and control the first electronic expansion valve to close.
[0060] The control device of the thermal management system provided in this embodiment and the control method of the thermal management system provided in any embodiment of the present invention belong to the same inventive concept and have corresponding beneficial effects. For the technical details not elaborated in this embodiment, refer to the control method of the thermal management system provided in any embodiment of the present invention.
[0061] Embodiment Five
[0062] Figure 9 It is a schematic structural diagram of an electronic device provided in Embodiment Five of the present invention. Figure 9 It shows a block diagram of an exemplary electronic device 412 suitable for implementing the embodiments of the present invention. Figure 9 The shown electronic device 412 is only an example and should not impose any limitation on the functions and usage scope of the embodiments of the present invention.
[0063] As Figure 9 shown, the electronic device 412 is presented in the form of a general-purpose device. The components of the electronic device 412 may include, but are not limited to: one or more processors 416, a storage device 428, and a bus 418 connecting different system components (including the storage device 428 and the processor 416).
[0064] The bus 418 represents one or more of several types of bus structures, including a storage device bus or a storage device controller, a peripheral bus, a graphics acceleration port, a processor, or a local bus using any of the various bus structures. For example, these architectures include, but are not limited to, the Industry Standard Architecture (ISA) bus, the Micro Channel Architecture (MAC) bus, the Enhanced ISA bus, the Video Electronics Standards Association (VESA) local bus, and the Peripheral Component Interconnect (PCI) bus.
[0065] The electronic device 412 typically includes a variety of computer system-readable media. These media can be any available media accessible by the electronic device 412, including volatile and non-volatile media, removable and non-removable media.
[0066] The storage device 428 may include computer system readable media in the form of volatile memory, such as random access memory (RAM) 430 and / or cache memory 432. The electronic device 412 may further include other removable / non-removable, volatile / non-volatile computer system storage media. By way of example only, the storage system 434 may be used for reading and writing on non-removable, non-volatile magnetic media ( Figure 9 not shown, commonly referred to as a "hard disk drive"). Although Figure 9 not shown in, a disk drive for reading and writing on removable non-volatile disks (such as "floppy disks") may be provided, as well as an optical disk drive for reading and writing on removable non-volatile optical disks, such as compact disc read-only memory (CD-ROM), digital video disc-read only memory (DVD-ROM) or other optical media). In these cases, each drive may be connected to the bus 418 through one or more data media interfaces. The storage device 428 may include at least one program product having a set (e.g., at least one) of program modules configured to perform the functions of the embodiments of the present invention.
[0067] A program / utility 440 having a set (at least one) of program modules 442 may be stored, for example, in the storage device 428. Such program modules 442 include, but are not limited to, an operating system, one or more application programs, other program modules, and program data. Each or some combination of these examples may include the implementation of a network environment. The program modules 442 generally perform the functions and / or methods in the embodiments described in the present invention.
[0068] The electronic device 412 may also communicate with one or more external devices 414 (such as a keyboard, a pointing terminal, a display 424, etc.), and may also communicate with one or more terminals that enable a user to interact with the electronic device 412, and / or communicate with any terminal that enables the electronic device 412 to communicate with one or more other computing terminals (such as a network card, a modem, etc.). Such communication may be carried out through the input / output (I / O) interface 422. Moreover, the electronic device 412 may also communicate with one or more networks (such as a local area network (LAN), a wide area network (WAN) and / or a public network, such as the Internet) through the network adapter 420. As Figure 9As shown, network adapter 420 communicates with other modules of electronic device 412 via bus 418. It should be understood that, although not shown in the figure, other hardware and / or software modules may be used in conjunction with electronic device 412, including but not limited to: microcode, terminal drivers, redundant processors, external disk drive arrays, redundant arrays of independent disks (RAID) systems, tape drives, and data backup storage systems, etc.
[0069] Processor 416 performs various functional applications and data processing by running programs stored in storage device 428. For example, it implements the control method of the thermal management system provided by the embodiments of the present invention. The method includes:
[0070] Receiving a control instruction;
[0071] According to the control instruction, controlling the operating state of the compressor module and the operating state of the first electronic expansion valve.
[0072] Embodiment Six
[0073] Embodiment Six of the present invention provides a computer-readable storage medium, on which a computer program is stored. When the program is executed by a processor, it implements the control method of the thermal management system provided by the embodiments of the present invention. The method includes:
[0074] Receiving a control instruction;
[0075] According to the control instruction, controlling the operating state of the compressor module and the operating state of the first electronic expansion valve.
[0076] The computer storage medium of the embodiments of the present invention may adopt any combination of one or more computer-readable media. The computer-readable medium may be a computer-readable signal medium or a computer-readable storage medium. The computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the above. More specific examples (non-exhaustive list) of the computer-readable storage medium include: an electrical connection having one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this document, the computer-readable storage medium may be any tangible medium that contains or stores a program, which can be used by or in conjunction with an instruction execution system, apparatus, or device.
[0077] A computer-readable signal medium can include a data signal propagated in a baseband or as part of a carrier wave, which carries computer-readable program code. Such a propagated data signal can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. The computer-readable signal medium can also be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, apparatus, or device.
[0078] The program code contained on a computer-readable medium can be transmitted with any appropriate medium, including - but not limited to - wireless, wire, optical fiber cable, RF, etc., or any suitable combination of the above.
[0079] The computer program code for performing the operations of the present invention can be written in one or more programming languages or combinations thereof. The programming languages include object-oriented programming languages - such as Java, Smalltalk, C++, and also include conventional procedural programming languages - such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, executed as an independent software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or terminal. In the case of a remote computer, the remote computer can be connected to the user's computer through any type of network - including a local area network (LAN) or a wide area network (WAN) - or, it can be connected to an external computer (for example, by using an Internet service provider to connect through the Internet).
[0080] Note that the above is only the preferred embodiment of the present invention and the applied technical principles. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein. Various obvious changes, re-adjustments, combinations, and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, it can also include more other equivalent embodiments, and the scope of the present invention is determined by the scope of the appended claims.
Claims
1. A thermal management system, characterized in that, Comprising: A refrigerant circuit and a water circuit; the refrigerant circuit includes a compressor module, a condenser, a liquid storage tank, a first electronic expansion valve, and a cooler, and the compressor module includes two compressors or a double-headed compressor; Wherein, the outlet of the compressor module is communicated with the refrigerant side inlet of the condenser, the refrigerant side outlet of the condenser is communicated with the inlet of the liquid storage tank, the outlet of the liquid storage tank is communicated with the refrigerant side inlet of the cooler through the first electronic expansion valve, the refrigerant side outlet of the cooler is communicated with the inlet of the compressor module, and the water circuit sides of the condenser and the cooler are communicated with the water circuit.
2. The thermal management system according to claim 1, wherein, The compressor module includes a first compressor and a second compressor, the suction port of the first compressor is used as the inlet of the compressor module, the discharge port of the second compressor is used as the outlet of the compressor module, and the discharge port of the first compressor is communicated with the suction port of the second compressor.
3. The thermal management system according to claim 2, wherein, The compressor module further includes an intercooler, and the discharge port of the first compressor is communicated with the suction port of the second compressor through the intercooler.
4. The thermal management system according to claim 1, wherein The refrigerant circuit further includes an evaporator and a second electronic expansion valve, the outlet of the liquid storage tank is communicated with the inlet of the evaporator through the second electronic expansion valve, and the outlet of the evaporator is communicated with the inlet of the compressor module.
5. The thermal management system according to claim 1, characterized in that The compressor module, the condenser, the liquid storage tank, the first electronic expansion valve, and the cooler are located in the same sealed box body.
6. The thermal management system according to claim 1, characterized in that The water circuit includes a heater core, a battery pack assembly, a motor assembly, a radiator, a heater, an electronic water pump, and a multi-way valve. The outlet of the heater core is communicated with the water circuit side inlet of the condenser, the inlet of the heater core is communicated with the water circuit side outlet of the condenser through the multi-way valve, the outlet of the battery pack assembly is communicated with the inlet of the heater through the multi-way valve, the outlet of the heater is communicated with the water circuit side inlet of the cooler, and the water circuit side outlet of the cooler is communicated with the inlet of the battery pack assembly through the multi-way valve; the outlet of the motor assembly is communicated with the water circuit side inlet of the condenser through the electronic water pump and the multi-way valve, the outlet of the radiator is communicated with the inlet of the motor assembly, and the water circuit side outlet of the condenser is communicated with the inlet of the radiator through the multi-way valve.
7. The thermal management system according to claim 6, characterized in that, The electric water pump includes a first electric water pump, a second electric water pump and a third electric water pump. The multi-way valve includes a first five-way valve, a second five-way valve and a first three-way valve. The first end of the first five-way valve is communicated with the inlet of the heater. The outlet of the motor assembly is communicated with the second end of the first five-way valve through the first electric water pump. The third end of the first five-way valve and the outlet of the heater core are both communicated with the water-side inlet of the condenser through the second electric water pump. The water-side outlet of the condenser is communicated with the first end of the first three-way valve. The second end of the first three-way valve is communicated with the inlet of the heater core. The third end of the first three-way valve is communicated with the first end of the second five-way valve. The second end of the second five-way valve is communicated with the inlet of the battery pack assembly through the third electric water pump. The outlet of the battery pack assembly is communicated with the fifth end of the first five-way valve. The fourth end of the first five-way valve is communicated with the second end of the second five-way valve. The third end of the second five-way valve is communicated with the water-side outlet of the cooler. The fourth end of the second five-way valve is communicated with the inlet of the motor assembly. The fifth end of the second five-way valve is communicated with the inlet of the radiator tank.
8. The thermal management system according to claim 7, characterized in that The refrigerant circuit further includes a water-cooled heat exchanger. The multi-way valve further includes a second three-way valve. The outlet of the water-cooled heat exchanger is communicated with the water-side inlet of the cooler. The inlet of the water-cooled heat exchanger is communicated with the first end of the second three-way valve. The second end of the second three-way valve is communicated with the water-side inlet of the cooler. The third end of the second three-way valve is communicated with the third end of the second five-way valve.
9. A control method for a thermal management system, characterized in that, The control method is applied to the thermal management system according to any one of claims 1-8. The control method includes: Receiving a control instruction; According to the control instruction, controlling the working state of the compressor module and the working state of the first electronic expansion valve.
10. A vehicle, characterized in that, Including the thermal management system according to any one of claims 1-8.