Circuit board identification method and device and storage medium

Abstract

The invention discloses a circuit board recognition method and device and a storage medium, and relates to the technical field of image recognition, and the method comprises the steps: collecting a plate image of a recognition region, and the plate image comprises at least one circuit board; identifying the plate image, and determining scanning information of each component in the plate image; determining boundary information of each component and basic information of each component according to the scanning information; combining a component layout corresponding to the plate image based on the boundary information; and generating assembly information of the circuit board according to the basic information and the component layout. According to the invention, the problem of low recognition efficiency of the circuit board image caused by incapability of quickly and accurately recognizing components in the circuit board image due to dependence on manual operation in related technologies is solved, and the recognition efficiency of the circuit board image is improved.

Description

Technical Field

[0001] The present application relates to the technical field of image recognition, and particularly to a method, device, and storage medium for identifying a circuit board. Background Art

[0002] A PCBA (Printed Circuit Board Assembly) is formed by mounting and soldering various electronic components, such as chips, resistors, capacitors, inductors, etc., on a PCB (Printed Circuit Board) to form a complete functional electronic component. To ensure the high-quality production of circuit boards, operations such as classifying, determining, and sorting circuit boards through the recognition of circuit boards can greatly improve the production efficiency and quality of circuit boards.

[0003] For the recognition of circuit boards, the related art of circuit board recognition requires multiple operation steps such as manual component recognition, positioning and marking, querying component information, and generating reports to complete.

[0004] Therefore, the related art relies on manual operations and cannot quickly and accurately identify components in circuit board images, resulting in low recognition efficiency of circuit board images.

[0005] The above content is only used to assist in understanding the technical solution of the present application and does not represent an admission that the above content is prior art. Summary of the Invention

[0006] The main purpose of the present application is to provide a method, device, and storage medium for identifying a circuit board, aiming to solve the technical problem that the related art relies on manual operations and cannot quickly and accurately identify components in circuit board images, resulting in low recognition efficiency of circuit board images.

[0007] To achieve the above purpose, the present application proposes a method for identifying a circuit board, the method comprising:

[0008] Collect a board image of the recognition area, where the board image contains at least one circuit board;

[0009] Identify the board image to determine the scanning information of each component in the board image;

[0010] Determine the boundary information of each component and the basic information of each component according to the scanning information;

[0011] Based on the boundary information, combine the component layout corresponding to the board image;

[0012] Generate the assembly information of the circuit board according to each of the basic information and the component layout.

[0013] In one embodiment, before the step of identifying the sheet material image and determining the scanning information of each component in the sheet material image, the method further includes:

[0014] Determine the positioning frames of the components according to the initial positioning of the components on the sheet material image;

[0015] Determine the coordinate positions of the components according to the positioning frames;

[0016] Combine the positioning frames and the coordinate positions to determine a rough diagram.

[0017] In one embodiment, the step of determining the boundary information of each component and the basic information of each component according to the scanning information includes:

[0018] Extract the target features of each component in the scanning information;

[0019] Determine the boundary information of each component based on the edge features in the target features;

[0020] Compare the target features with a component feature library to determine the names of the components and the classification information of the components;

[0021] Determine the basic information of each component according to the names and the classification information of the components.

[0022] In one embodiment, after the step of generating the assembly information of the circuit board according to each of the basic information and the component layout, the method further includes:

[0023] Determine the material information and the quantity information of each component according to the basic information and in combination with a component database;

[0024] Generate a bill of materials corresponding to each component based on the material information and the quantity information;

[0025] Generate and output a bill of materials file according to the bill of materials.

[0026] In one embodiment, after the step of generating and outputting the bill of materials file according to the bill of materials, the method further includes:

[0027] Determine a target real-time price according to the real-time price in the component database and in combination with the material information on the bill of materials;

[0028] Based on a preset quotation rule, combine the target real-time price and additional costs to obtain a quotation breakdown, where the additional costs include assembly costs and testing costs;

[0029] Generate and output a quotation report according to the quotation breakdown.

[0030] In one embodiment, after the step of generating a bill of materials corresponding to each of the components based on the material information and the quantity information, the method further includes:

[0031] If the information of each of the components fails to match the component information in the component database, determine the missing component information in the database;

[0032] Generate a list of missing components according to the missing component information;

[0033] Based on the component information of the same type as the missing components, perform a preliminary quotation;

[0034] Generate and output a report on missing components according to the list of missing components and the preliminary quotation.

[0035] In one embodiment, before the step of obtaining a quotation breakdown based on a preset quotation rule, combining the target real-time price and additional costs, where the additional costs include assembly costs and testing costs, the method further includes:

[0036] Based on the assembly information and the scanning information, determine the circuit layout of the circuit board;

[0037] Generate an assembly plan and a test plan according to the circuit layout and the component layout;

[0038] Based on each of the assembly plans and each of the test plans, determine the assembly costs and the testing costs;

[0039] Combine the assembly costs and the testing costs to generate the additional costs.

[0040] In one embodiment, before the step of collecting a board image of the recognition area, where the board image includes at least one circuit board, the method further includes:

[0041] Establish a connection with a data source through the component database;

[0042] Based on the component information and the target real-time price in the component database, synchronize in the data source;

[0043] According to the list of missing components, supplement the missing component information in the data source.

[0044] In addition, to achieve the above object, the present application further provides an identification device for a circuit board, the device including: a memory, a processor, and a computer program stored on the memory and executable on the processor, the computer program being configured to implement the steps of the circuit board identification method as described above.

[0045] In addition, to achieve the above object, the present application further provides a storage medium, the storage medium being a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, it implements the steps of the circuit board identification method as described above.

[0046] The present application provides a circuit board identification method, including collecting a board material image of an identification area, where the board material image includes at least one circuit board; identifying the board material image to determine the scanning information of each component in the board material image; determining the boundary information of each component and the basic information of each component according to the scanning information; combining based on the boundary information to form the component layout corresponding to the board material image; and generating the assembly information of the circuit board according to each basic information and the component layout. Generating a bill of materials and quotation based on automatic identification of circuit board photos greatly improves the efficiency of product design, production, and quotation.

[0047] In summary, the present application automatically identifies the image of the circuit board, accurately controls the component layout of the circuit board, and at the same time generates a bill of materials and a quotation report, overcoming the problem in the related art that various operations rely on manual work and it is impossible to quickly and accurately identify the components in the circuit board image, thereby resulting in low identification efficiency of the circuit board image, and improving the identification efficiency of the circuit board image. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.

[0049] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0050] Figure 1 It is a schematic flowchart provided for the first embodiment of the circuit board identification method of the present application;

[0051] Figure 2 It is a schematic flowchart provided for the second embodiment of the circuit board identification method of the present application;

[0052] Figure 3 Schematic flow chart provided for the third embodiment of the circuit board identification method of this application;

[0053] Figure 4 Schematic flow chart provided for the fourth embodiment of the circuit board identification method of this application;

[0054] Figure 5 Schematic flow chart provided for the fifth embodiment of the circuit board identification method of this application;

[0055] Figure 6 Schematic flow chart provided for the sixth embodiment of the circuit board identification method of this application;

[0056] Figure 7 Schematic flow chart provided for the seventh embodiment of the circuit board identification method of this application;

[0057] Figure 8 Schematic flow chart provided for the eighth embodiment of the circuit board identification method of this application;

[0058] Figure 9 Schematic structural diagram of the circuit board identification device of this application.

[0059] The realization of the purpose, functional features and advantages of this application will be further described with reference to the embodiments and the accompanying drawings. Specific embodiments

[0060] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of this application and are not used to limit this application.

[0061] The identification of circuit boards in related technologies requires multiple operation steps such as manual component identification, positioning and marking, querying component information, and generating reports to complete.

[0062] This application provides a solution: first, collect a board image of the identification area, which contains at least one circuit board; then identify the board image to determine the scanning information of each component in the board image; determine the boundary information of each component and the basic information of each component according to the scanning information; then combine based on the boundary information to form the component layout corresponding to the board image; finally, generate the assembly information of the circuit board according to each basic information and the component layout. It overcomes the problem that related technologies rely on manual operations and cannot quickly and accurately identify the components in the circuit board image, resulting in low identification efficiency of the circuit board image, and improves the identification efficiency of the circuit board image.

[0063] It should be noted that the execution subject of this embodiment can be a computing service device with data processing, network communication, and program running functions, such as a tablet computer, a personal computer, a mobile phone, etc., or an electronic device, a circuit board identification device, etc. that can implement the above functions. Taking the circuit board identification device as an example, this embodiment and the following embodiments will be described below.

[0064] To better understand the technical solution of this application, the following will be described in detail in conjunction with the specification drawings and specific implementation manners.

[0065] The embodiment of this application provides a method for identifying a circuit board. Refer to Figure 1 , Figure 1 which is a schematic flowchart provided for the first embodiment of the circuit board identification method of this application.

[0066] In this embodiment, the circuit board identification method includes steps S10 to S50:

[0067] Step S10, collect a board image of the identification area, where the board image contains at least one circuit board.

[0068] In this embodiment, the board image includes no less than one circuit board image, and the board image is an image obtained by a photographing device photographing the circuit board.

[0069] As an optional implementation manner for collecting the board image, use a high-definition camera or a professional scanning device to collect the board image, and preprocess the collected image, including converting the image into a format suitable for subsequent processing, and performing necessary image enhancement or correction to improve the recognition accuracy.

[0070] As an optional implementation manner for preprocessing the board image, preprocess the collected circuit board image, including image denoising, contrast enhancement, grayscale conversion, edge detection, etc., to ensure that the picture is clear and facilitate subsequent recognition and analysis.

[0071] Step S20, identify the board image and determine the scanning information of each component in the board image.

[0072] In this embodiment, the scanning information includes the circuit layout on the circuit board, the target features of the components, and the circuit board image. By scanning the board image, the scanning information of the circuit board is obtained.

[0073] Optionally, use computer vision technology, especially deep learning models, such as convolutional neural networks, to identify and classify various components in the picture.

[0074] As an alternative implementation for identifying the board image, the model inputs the preprocessed circuit board image, and the model extracts features through a convolutional neural network to identify the coordinate positions of the components on the board image.

[0075] As an alternative implementation for circuit board image segmentation, when identifying the board image, if the board image contains one circuit board image, the identification operation is directly performed; if the board image contains multiple circuit board images, the board image is segmented to obtain individual circuit board images.

[0076] Step S30: Determine the boundary information of each component and the basic information of each component according to the scanning information.

[0077] In this embodiment, the boundary information of a component refers to the outer contour of each component body and the wiring position of the component. The basic information of a component includes the name of the component.

[0078] As an alternative implementation, by scanning the board image, marking the boundaries of the components, determining the boundary information and feature information of the components, and determining the basic information of the components in the component feature library according to the feature information.

[0079] Step S40: Combine the boundary information to form the component layout corresponding to the board image.

[0080] In this embodiment, the component layout refers to the position coordinates and placement directions of each component on the circuit board, which is convenient for automated production of the circuit board.

[0081] As an alternative implementation, based on the boundary information and combined with the position coordinates of the components, determine the component layouts corresponding to the board image.

[0082] Step S50: Generate the assembly information of the circuit board according to the basic information of each component and the component layout.

[0083] In this embodiment, the assembly information includes the basic information and the component layout. The assembly information refers to the name, type, position coordinates, and placement direction of the components.

[0084] As an alternative implementation, based on the basic information of each component and the component layout, generate the types to which the names of the components belong, the position coordinates corresponding to each component, and the placement directions of each component.

[0085] In the overall implementation method, first, the board image within the recognition area is collected. If there is one circuit board image in the board image, the recognition operation is directly performed; if there are multiple circuit board images in the board image, the board image is segmented to obtain individual circuit board images. By recognizing the circuit board images, the scanning information of each component in the board image is determined, and then the boundary information and basic information of each component are determined through the scanning information. Then, the boundary information of each component is combined to obtain the corresponding component layout. Finally, by integrating the basic information and the component layout, the assembly information of the circuit board is generated.

[0086] Exemplarily, first, a target detection algorithm is used to locate the recognized components to determine the position and orientation of each component on the circuit board. Then, the preprocessed circuit board image is input into the model, and the model extracts features through a convolutional neural network, recognizes and classifies the components on the board, and outputs the determined component assembly information.

[0087] Since the component assembly information on the board image is automatically and accurately obtained, it overcomes the problem in the related technology that various operations rely on manual labor and it is impossible to quickly and accurately recognize the components in the circuit board image, which leads to low recognition efficiency of the circuit board image, and improves the recognition efficiency and accuracy of the circuit board image.

[0088] Based on any of the above embodiments, in the second embodiment of the present application, with reference to Figure 2 , Figure 2 is the flowchart provided for the second embodiment of the recognition method of the circuit board of the present application. Before step S20, steps A11 to A12 are further included:

[0089] Step A11: Determine the positioning frames of the components according to the preliminary positioning of the components on the board image.

[0090] In this embodiment, the preliminary positioning refers to selecting and positioning the components on the circuit board image to determine their coordinate positions, which helps to improve the efficiency of subsequent component recognition.

[0091] As an optional implementation method, based on the preliminary positioning of the components on the board image, the target detection algorithm is used to select and frame the components to determine the positioning frames of the components.

[0092] Step A12: Determine the coordinate positions of the components according to the positioning frames.

[0093] In this embodiment, the positioning frames are used to identify the positions of the target objects in the image, and these rectangular frames help the model accurately locate the target objects, thereby realizing target detection and positioning.

[0094] As an alternative implementation, the coordinate positions of each component are determined based on the position information selected by each positioning frame.

[0095] Step A13: Determine a rough diagram in combination with the positioning frame and the coordinate positions.

[0096] In this embodiment, the rough diagram includes the image information of the positioning frame and the coordinate positions of each component. The coordinate positions of each component on the circuit board image can be determined through the rough diagram.

[0097] As an alternative implementation, a large number of component images are used to train a model. The coordinate positions of each component on the circuit board image are quickly located and identified through the model, and then the rough diagram is determined. At the same time, the circuit layout on the circuit board image is determined.

[0098] In the overall implementation method, first, each component on the board image is initially located through a target detection model, each component is selected through the initial positioning frame, then the coordinate positions of each component are determined according to the positioning frame of each component, and finally, a rough diagram is determined by combining the positioning frame and the coordinate positions.

[0099] Exemplarily, if there are 5 circuit board images on the board image, 5 circuit board schematic diagrams are obtained through image segmentation of the board image, and the YOLO or Faster R-CNN model is used to locate and identify the components on the circuit board schematic diagram to determine the position coordinates of each component.

[0100] Since the circuit board images in the board image are recognized and segmented, and then each component is located, the subsequent recognition of the components in the circuit board image is more accurate and fast, improving the recognition efficiency of the circuit board image.

[0101] Based on any of the above embodiments, in the third embodiment of the present application, refer to Figure 3 , Figure 3 which is a schematic flowchart provided for the third embodiment of the recognition method of the circuit board of the present application. Step S30 includes steps B11 to B14:

[0102] Step B11: Extract the target features of each component in the scanned information.

[0103] In this embodiment, feature extraction refers to the recognition and extraction of the features of each component for comparison of components, so as to determine the category and name of the components. Fixed-point recognition refers to the fixed-point recognition of components based on the position coordinates of the components in the rough diagram. The target feature refers to the feature that can distinguish the basic information of the component and filter out useless features. The target feature includes the feature value or feature vector of each component and the edge feature. The component can be recognized through the feature value or feature vector, and the assembly direction and position of the component can be obtained through the edge feature.

[0104] As an alternative implementation, according to the position coordinates of each component in the rough diagram, each component is identified at a fixed point. By extracting the features of each component and filtering out the useless features, the target features and the boundary information of the components are obtained.

[0105] Step B12: Based on the edge features in the target features, determine the boundary information of each component.

[0106] In this embodiment, the edge feature is a feature that describes the boundary of a component and is used to determine the assembly direction and position of the component.

[0107] As an alternative implementation, according to the edge features in the target features, determine the assembly direction and position of the component.

[0108] Step B13: Compare the target features with the component feature library to determine the name of each component and the classification information of each component.

[0109] In this embodiment, the classification information of a component refers to the classification of components according to component types. For example, common types include resistors, capacitors, inductors, transformers, etc.

[0110] As an alternative implementation, construct the component feature library through a data source, compare the target features of each component with the component feature library, and determine the name of each component and the classification information of each component according to the similarity of the comparison.

[0111] Step B14: Determine the basic information of each component according to the name of each component and the classification information.

[0112] In this embodiment, the basic information of a component includes the name of the component, the classification information of the component, and the pin information of the component.

[0113] As an alternative implementation, determine the pin information of each component through the name of the component and the classification information of the component.

[0114] The overall implementation method is as follows: According to the position coordinates of each component in the scanned information, each component is identified at a fixed point. By extracting the features of each component and filtering out the useless features, the target features and the boundary information of the components are obtained. Then, construct the component feature library through a data source, compare the target features of each component with the component feature library, and determine the name of each component and the classification information of each component according to the similarity of the comparison. Finally, determine the basic information of each component through the name of the component and the classification information of the component.

[0115] Exemplarily, if a resistor is located at the first coordinate position in the rough diagram, by extracting the features and identifying the fixed points of this component in the scanning information, its target features and boundary information are determined. By comparing the target features with the component feature library, it is determined that this component is a resistor, and the classification information of this component is a resistor. According to the features of the resistor and the resistor, it is determined that this resistor component has two pins.

[0116] Due to the accurate determination of the boundary information and basic information of the components, the problem of easy error in the assembly and placement of components is overcome, and the efficiency of the reproduction of the circuit board is improved.

[0117] Based on any of the above embodiments, in the fourth embodiment of the present application, referring to Figure 4 , Figure 4 is the schematic flow chart provided for the fourth embodiment of the circuit board recognition method of the present application. After step S50, steps C11 to C13 are further included:

[0118] Step C11, according to the basic information, combined with the component database, determine the material information of each component and the quantity information of each component.

[0119] In this embodiment, the component database includes information such as the specifications, models, and suppliers of various components. The material information of the components includes information such as specifications, models, and suppliers. The basic information includes the quantity information of the components on the circuit board image.

[0120] As an optional implementation manner, based on the basic information of the components, determine the quantity information of each component, and then combined with the component database, determine the specifications, models, and suppliers of each component.

[0121] Step C12, based on the material information and the quantity information, generate a material list corresponding to each component.

[0122] In this embodiment, the material list contains information such as the name, model, quantity, supplier, and specifications of the components, which is convenient for the reproduction of the corresponding circuit board according to the circuit board image.

[0123] As an optional implementation manner, by customizing the BOM table template, based on the material information and quantity information, complete the filling of the corresponding position information in the BOM table template to obtain the material list.

[0124] Step C13, generate and output a material list file according to the material list.

[0125] In this embodiment, the material list file is a standard format file, and the file format includes forms such as XML, CSV, or Excel.

[0126] As an alternative implementation, based on the bill of materials, generate and output a bill of materials file in XML format for printing or transmission of the bill of materials.

[0127] For the overall implementation, first determine the quantity information of each component based on the basic information of the components, then combine the component database to determine the specifications, models, and suppliers of each component, and then through a custom BOM table template, based on the material information and quantity information, complete the filling of the corresponding position information in the BOM table template to obtain the bill of materials. Finally, based on the bill of materials, generate and output a bill of materials file in XML format for printing or transmission of the bill of materials.

[0128] Exemplarily, match the identified components with the existing component information in the database, query information such as the specifications, models, and suppliers of the components from the database, combine the identified quantity of components, automatically generate a BOM list, generate a BOM list file based on the BOM list, and purchase each component on the circuit board image through the BOM list file.

[0129] Since the component database is used to obtain the material information of the components on the circuit board image, and then the bill of materials file is automatically generated, the procurement efficiency of the components on the circuit board image is improved.

[0130] Based on any of the above embodiments, in the fifth embodiment of the present application, refer to Figure 5 , Figure 5 which is a schematic flow chart provided for the fifth embodiment of the method for identifying the circuit board of the present application. After step C13, steps D11 to D13 are further included:

[0131] Step D11, determine the target real-time price according to the real-time price in the component database and in combination with the material information on the bill of materials.

[0132] In this embodiment, the real-time price is usually not fixed, but will fluctuate in real time according to various factors such as market supply and demand, production cost, and exchange rate changes.

[0133] As an alternative implementation, obtain the bill of materials, use database query technology, retrieve the corresponding real-time price in the component database according to the component model and specifications in the bill of materials, match each component in the bill of materials with the real-time price in the database, and determine the target real-time price.

[0134] Step D12, based on a preset quotation rule, combine the target real-time price and additional costs to obtain a quotation breakdown, where the additional costs include assembly costs and testing costs.

[0135] In this embodiment, component quotation information and additional cost information are received to generate a quotation form. Based on the input price calculation formula and quotation items, a quotation strategy is generated. According to the quotation strategy and the quotation form, the quotation rules are determined. The quotation items include the current market price or the purchase price, combined with additional costs such as assembly costs and testing costs. The quotation strategy varies according to different buyers, such as discounts and price fluctuations. The quotation details include the component name, supplier, specification, selling price, and additional costs.

[0136] As an alternative implementation, in combination with the circuit layout, component layout, testing costs, and target real-time price on the circuit board image, and based on the preset quotation rules, quotation details are generated.

[0137] Step D13, generate and output a quotation report according to the quotation details.

[0138] In this embodiment, the quotation report is a file in a standard format, such as XML, CSV, or Excel.

[0139] As an alternative implementation, generate and output a standard format quotation report file according to the component name, supplier, specification, selling price, and additional costs.

[0140] The overall implementation method is as follows: First, obtain the bill of materials. Using database query technology, according to the component model and specification in the bill of materials, retrieve the corresponding real-time price in the component database. Match each component in the bill of materials with the real-time price in the database to determine the target real-time price. Then, in combination with the circuit layout, component layout, testing costs, and target real-time price on the circuit board, and based on the preset quotation rules, generate quotation details. Finally, generate and output a standard format quotation report file according to the component name, supplier, specification, selling price, and additional costs.

[0141] Exemplarily, compare the component name in the details with the relevant information in the component database to obtain the supplier, component specification, and real-time selling price information. Then, through the analysis of the circuit layout and component layout on the circuit board image, obtain the assembly costs and testing costs, and generate and output a standard format quotation report file in combination with the above information.

[0142] Due to the combination of multiple costs and quotation methods, the problems of slow manual quotation and difficult statistics are overcome, and the quotation efficiency of the circuit board is improved.

[0143] Based on any of the above embodiments, in Embodiment 6 of the present application, refer to Figure 6 , Figure 6It is a schematic flowchart provided for the sixth embodiment of the identification method of the circuit board of the present application. After step C12, steps E11 to E14 are further included:

[0144] Step E11, if the matching between each of the components and the component information in the component database fails, determine the missing component information in the database.

[0145] In this embodiment, a missing component refers to a component missing in the component database. During the process of matching the components with the components in the component database, if the matching fails, it is determined that the component is a missing component. The missing component information includes the name, layout, and quantity of the missing component.

[0146] As an alternative implementation, by determining the name of the component and performing a match based on the components in the component database, if the matching of the component fails, it is determined that the component is a missing component in the database, and the name, layout, and quantity of the missing component are determined.

[0147] Step E12, generate a list of missing components according to the missing component information.

[0148] In this embodiment, the list of missing components includes the name of the missing component, the layout of the missing component, and the quantity of the missing component.

[0149] As an alternative implementation, generate a list of missing components according to the name, layout, and quantity of the missing component.

[0150] Step E13, perform a preliminary quotation based on the component information of the same type as the missing component.

[0151] In this embodiment, the preliminary quotation is to make a quotation based on the component information of the same type as the missing component, and estimate the price range of the missing component using this component information.

[0152] As an alternative implementation, compare the missing component with the components in the component database to determine the component information of the same type, and obtain the quotation range of the missing component by making a quotation for the components of the same type.

[0153] Step E14, generate and output a report on the missing components according to the list of missing components and the preliminary quotation.

[0154] In this embodiment, the report on the missing components is a standard format file including the name, layout, quantity, and quotation range of the missing component, such as XML, CSV, or Excel.

[0155] As an alternative implementation, according to the quotation range of components of the same type and the name, layout, and quantity of the missing components, fill in the price information, name, component layout, and quantity into the missing component report correspondingly, and output the missing component report.

[0156] In the overall implementation, first determine the name of the component and match it based on the components in the component database. If the component matching fails, determine that the component is a missing component in the database, and determine the name, layout, and quantity of the missing component. Then, generate a list of missing components according to the name, layout, and quantity of the missing component. Next, compare the missing component with the components in the component database to determine the component information of the same type. By obtaining quotes for components of the same type, get the quotation range of the missing component. Finally, according to the quotation range of components of the same type and the name, layout, and quantity of the missing component, fill in the price information, name, component layout, and quantity into the missing component report correspondingly, and output the missing component report.

[0157] Exemplarily, by matching the component with the component information in the database, if a component that does not exist in the database is matched, it is a missing component. Then, through the component information of the same type screened during the matching process, obtain the quotation details of components of the same type. According to the quotation details of multiple components of the same type, get the quotation range of the missing component. Fill in the price information, name, component layout, and quantity into the missing component report correspondingly, and output the missing component report.

[0158] Since the estimated quotation of the missing component is realized by combining the information of components of the same type, the quotation efficiency of the circuit board is improved. At the same time, by generating the missing component report, the effect of prompting the database to update the relevant component information is achieved.

[0159] Based on any of the above embodiments, in the seventh embodiment of the present application, referring to Figure 7 , Figure 7 is the schematic flow chart provided by the seventh embodiment of the circuit board identification method of the present application. Before step D12, steps F11 to F14 are further included:

[0160] Step F11, based on the assembly information and the scanning information, determine the circuit layout of the circuit board.

[0161] In this embodiment, the circuit layout needs to ensure that the size of the board frame conforms to the processing drawing, and considering the requirements of safety regulations, round the corners of the board frame. At the component placement level, it is necessary to select appropriate processing technologies according to the performance and processing efficiency of the PCB, such as single-sided mounting, double-sided chip mounting, mixed mounting of plug-in components, etc. In terms of the basic principles of layout operations, it is necessary to first place components that need to be positioned, such as mounting holes and connectors, and follow the layout principles of "from large to small" and "from difficult to easy".

[0162] As an alternative implementation, based on the placement methods of the components in the assembly information and combined with the wire routing shown in the circuit board schematic diagram, determine the circuit layout of the circuit board.

[0163] Step F12, generate an assembly plan and a test plan according to the circuit layout and the component layout.

[0164] In this embodiment, the assembly plan refers to the placement methods of the components on the circuit board and the circuit connection methods. The test plan refers to the test methods for the components and the circuit on the circuit board.

[0165] As an alternative implementation, generate the assembly plan and the test plan for the circuit board based on the circuit connection method and the placement positions of the components.

[0166] Step F13, determine the assembly cost and the test cost based on each of the assembly plans and each of the test plans.

[0167] In this embodiment, the assembly plan is not limited to one type. According to customer needs and costs, multiple circuit board assembly plans can be designed. The test plan is also not limited to one type. Different test plans are designed according to the test effects required by the customer and the costs.

[0168] As an alternative implementation, generate multiple different assembly costs and test costs for selection based on each of the assembly plans and each of the test plans.

[0169] Step F14, generate the additional cost by combining the assembly cost and the test cost.

[0170] In this embodiment, by combining different assembly costs and different test costs, multiple different additional costs will be generated, and the additional costs are selected according to customer needs.

[0171] As an alternative implementation, based on customer needs, select the target assembly cost and the target test cost to generate the target additional cost.

[0172] For the overall implementation method, first, based on the placement methods of each component in the assembly information and combined with the wire routing shown in the circuit board schematic diagram, determine the circuit layout of the circuit board. Then, based on the connection method of the circuits and the placement positions of the components, generate the assembly plan and test plan for the circuit board. Based on each assembly plan and each test plan, generate multiple different assembly costs and test costs for selection. Based on the customer requirements, select the target assembly cost and target test cost, and generate the target additional cost.

[0173] Exemplarily, according to the circuit information shown in the assembly information and the circuit board schematic diagram, obtain multiple circuit layouts of the circuit board. Then, through multiple circuit layouts and component layouts, determine multiple assembly plans and test plans. Finally, based on each different assembly plan and each different test plan, generate multiple different assembly costs and test costs for the customer to choose.

[0174] Since it combines the component assembly information and the wire routing, it enables the generation of the circuit layout of the personalized circuit board and also provides more diverse choices for the customer. Through automatic generation, the recognition efficiency of the circuit board is improved.

[0175] Based on any of the above embodiments, in the eighth embodiment of the present application, refer to Figure 8 , Figure 8 which is the flow schematic diagram provided for the eighth embodiment of the circuit board recognition method of the present application. Before step S10, it further includes steps G11 to G13:

[0176] Step G11, establish a connection with the data source through the component database.

[0177] In this embodiment, the data source updates the component information in the component database by connecting to the component database, including supplementing the missing component information, updating the original component information, and synchronizing the real-time prices of the components.

[0178] As an optional implementation method, the component database obtains the missing component information from the data source, updates the original component information, and synchronizes the real-time prices of the components.

[0179] Step G12, synchronize in the data source based on the component information and the target real-time price in the component database.

[0180] In this embodiment, every once in a while, the component database will connect to the data source to update the data.

[0181] As an optional implementation method, update the component information and the corresponding real-time price in the data source according to each component information and the corresponding real-time price.

[0182] Step G13: Supplement the missing component information in the data source according to the missing component list.

[0183] In this embodiment, the missing component information includes name, component layout, quantity, and missing information. The missing information includes specifications, suppliers, models, etc.

[0184] As an alternative implementation, based on the missing information in the missing component list, supplement the specifications, suppliers, and model information of the missing components in the data source.

[0185] The overall implementation method is as follows: First, the component database obtains the missing component information from the data source, updates the original component information, and synchronizes the real-time prices of the components. Every once in a while, the component database will connect to the data source for data update. Then, based on the missing information in the missing component list, supplement the specifications, suppliers, and model information of the missing components in the data source.

[0186] Exemplarily, for the missing component information of a certain type of resistor, when the component database establishes a connection with the data source, while updating the information in the database, supplement the corresponding missing information of the missing component information.

[0187] Since the information in the component database is synchronized and supplemented in a timely manner, the timeliness of the database information is ensured, and the accuracy of identifying the circuit board is improved.

[0188] It should be noted that the above examples are only for understanding the present application and do not constitute a limitation on the circuit board identification method of the present application. Based on this technical concept, more forms of simple transformations are within the protection scope of the present application.

[0189] The present application provides a circuit board identification device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein, the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the circuit board identification method in the first embodiment above.

[0190] Next, refer to Figure 5, which shows a schematic structural diagram of an identification device for a circuit board suitable for implementing the embodiments of the present application. The identification device for the circuit board in the embodiments of the present application may include, but is not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, personal digital assistants (PDAs), tablet computers (PADs), portable multimedia players (PMPs), vehicle-mounted terminals (such as vehicle-mounted navigation terminals), etc., and fixed terminals such as digital TVs, desktop computers, etc. Figure 5 The shown identification device for the circuit board is merely an example and should not impose any limitation on the functions and usage scope of the embodiments of the present application.

[0191] As Figure 5 shown, the identification device for the circuit board may include a processing device 1001 (such as a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to the program stored in the read-only memory (ROM) 1002 or the program loaded from the storage device 1003 into the random access memory (RAM) 1004. In the random access memory 1004, various programs and data required for the operation of the identification device for the circuit board are also stored. The processing device 1001, the read-only memory 1002, and the random access memory 1004 are connected to each other through a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Generally, the following systems may be connected to the I / O interface 1006: an input device 1007 including, for example, a touch screen, a touchpad, a keyboard, a mouse, an image sensor, a microphone, an accelerometer, a gyroscope, etc.; an output device 1008 including, for example, a liquid crystal display (LCD), a speaker, a vibrator, etc.; a storage device 1003 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 1009. The communication device 1009 can allow the identification device for the circuit board to communicate with other devices wirelessly or wireline to exchange data. Although the figure shows an identification device for the circuit board with various systems, it should be understood that it is not required to implement or have all the shown systems. Instead, more or fewer systems may be implemented or had.

[0192] In particular, according to the embodiments disclosed in the present application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, the embodiments disclosed in the present application include a computer program product, which includes a computer program carried on a computer-readable medium. The computer program contains program codes for executing the methods shown in the flowcharts. In such an embodiment, the computer program can be downloaded and installed from a network through a communication device, or installed from a storage device 1003, or installed from a read-only memory 1002. When the computer program is executed by a processing device 1001, the above-mentioned functions defined in the methods of the embodiments disclosed in the present application are executed.

[0193] The circuit board identification device provided by the present application adopts the circuit board identification method in the above-mentioned embodiment, which can solve the technical problem that the related technology relies on manual operations and cannot quickly and accurately identify the components in the circuit board image, resulting in low identification efficiency of the circuit board image. Compared with the prior art, the beneficial effects of the circuit board identification device provided by the present application are the same as those of the circuit board identification method provided by the above-mentioned embodiment, and other technical features in the circuit board identification device are the same as those disclosed in the method of the previous embodiment, which will not be elaborated here.

[0194] It should be understood that each part disclosed in the present application can be implemented by hardware, software, firmware or a combination thereof. In the description of the above embodiments, specific features, structures, materials or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

[0195] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present application, and all of them should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

[0196] The present application provides a computer-readable storage medium, which has computer-readable program instructions (i.e., computer programs) stored thereon. The computer-readable program instructions are used to execute the circuit board identification method in the above-mentioned embodiment.

[0197] The computer-readable storage medium provided by the present application may, for example, be a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or components, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections with one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), or flash memory, optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the above. In this embodiment, the computer-readable storage medium may be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, device, or component. The program code contained on the computer-readable storage medium may be transmitted using any appropriate medium, including but not limited to: wires, optical cables, radio frequency (RF), etc., or any suitable combination of the above.

[0198] The above computer-readable storage medium may be included in the identification device of the circuit board; or it may exist separately and not be assembled into the identification device of the circuit board.

[0199] The above computer-readable storage medium carries one or more programs. When the one or more programs are executed by the identification device of the circuit board, the identification device of the circuit board is caused to: collect a board image of the identification area, where the board image contains at least one circuit board; identify the board image and determine the scanning information of each component in the board image; determine the boundary information of each component and the basic information of each component according to the scanning information; combine based on the boundary information to form the component layout corresponding to the board image; and generate the assembly information of the circuit board according to each basic information and the component layout.

[0200] Computer program code for performing the operations of this application can be written in one or more programming languages or combinations thereof. The above-mentioned programming languages include object-oriented programming languages such as Java, Smalltalk, C++, and also include conventional procedural programming languages such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, executed as an independent software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computer (for example, by connecting through the Internet using an Internet service provider).

[0201] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in the flowchart or block diagram can represent a module, a program segment, or a part of the code that contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than that marked in the accompanying drawings. For example, two consecutively represented blocks can actually be executed substantially in parallel, and they can sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, as well as the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0202] The modules described in the embodiments of this application can be implemented in software or in hardware. Among them, the name of the module does not constitute a limitation to the unit itself in some cases.

[0203] The readable storage medium provided in this application is a computer-readable storage medium. The computer-readable storage medium stores computer-readable program instructions (i.e., computer programs) for performing the above-mentioned method for identifying a circuit board, which can solve the technical problem that the related technology relies on manual operations and cannot quickly and accurately identify the components in the circuit board image, thereby resulting in low efficiency in identifying the circuit board image. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in this application are the same as those of the method for identifying a circuit board provided in the above embodiments, and will not be elaborated here.

[0204] The above are only some embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structural transformation made under the technical concept of the present application by using the content of the specification and drawings of the present application, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present application.

Claims

1. A method for identifying a circuit board, characterized in that, The method described above includes: Collecting a board image of an identification area, where the board image contains at least one circuit board; Identifying the board image and determining the scanning information of each component in the board image; Determining the boundary information of each component and the basic information of each component according to the scanning information; Combining based on the boundary information to form the component layout corresponding to the board image; Generating the assembly information of the circuit board according to the basic information of each component and the component layout.

2. The identification method of the circuit board according to claim 1, wherein, Before the step of identifying the board image and determining the scanning information of each component in the board image, it further includes: Determining the positioning frame of each component according to the initial positioning of each component on the board image; Determining the coordinate positions of each component according to the positioning frame; Combining the positioning frame and the coordinate positions to determine a rough diagram.

3. The identification method of the circuit board according to claim 1, characterized in that, The step of determining the boundary information of each component and the basic information of each component according to the scanning information includes: Extracting the target features of each component in the scanning information; Determining the boundary information of each component based on the edge features in the target features; Comparing the target features with the component feature library to determine the name of each component and the classification information of each component; Determining the basic information of each component according to the name of each component and the classification information.

4. The identification method of the circuit board according to claim 1, characterized in that After the step of generating the assembly information of the circuit board according to the basic information of each component and the component layout, it further includes: Determining the material information of each component and the quantity information of each component according to the basic information and combining with the component database; Generating a bill of materials corresponding to each component based on the material information and the quantity information; Generating and outputting a bill of materials file according to the bill of materials.

5. The identification method of the circuit board according to claim 4, characterized in that, After the step of generating and outputting a bill of materials file according to the bill of materials, it further includes: Determining the target real-time price according to the real-time price in the component database and combining with the material information on the bill of materials; Based on a preset quotation rule, combining the target real-time price and additional costs, where the additional costs include assembly costs and testing costs, to obtain a quotation breakdown; Generating and outputting a quotation report according to the quotation breakdown.

6. The method for identifying a circuit board according to claim 5, characterized in that, After the step of generating a bill of materials corresponding to each component based on the material information and the quantity information, it further includes: If the information of each component fails to match the component information in the component database, determining the missing component information in the database; Generating a list of missing components according to the missing component information; Making a preliminary estimate of the price based on the component information of the same type as the missing components; Generating and outputting a report on missing components according to the list of missing components and the preliminary estimate of the price.

7. The method for identifying a circuit board according to claim 2, characterized in that, Before the step of obtaining a quotation breakdown based on a preset quotation rule, combining the target real-time price and additional costs, where the additional costs include assembly costs and testing costs, it further includes: Determining the circuit layout of the circuit board based on the assembly information and the scanning information; Generate an assembly plan and a test plan according to the circuit layout and the component layout; Determine the assembly cost and the test cost based on each of the assembly plans and each of the test plans; Generate the additional cost by combining the assembly cost and the test cost.

8. The method for identifying a circuit board according to claim 6, wherein Before the step of collecting and recognizing the board image of the acquisition and recognition area, where the board image includes at least one circuit board, further includes: Establish a connection with the data source through the component database; Synchronize in the data source based on the component information and the target real-time price in the component database; Supplement the missing component information in the data source according to the missing component list.

9. An identification device for a circuit board, characterized in that, The device includes: a memory, a processor, and a computer program stored on the memory and executable on the processor, and the computer program is configured to implement the steps of the circuit board recognition method according to any one of claims 1 to 8.

10. A storage medium, characterized in that, The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium, and when the computer program is executed by the processor, it implements the steps of the circuit board recognition method according to any one of claims 1 to 8.

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