A mold platen for circuit connection wire bonding

Abstract

The application relates to the technical field of mold pressing plates, in particular to a mold pressing plate for circuit connection wire bonding, which comprises a mold pressing plate body, the outer wall of one side of the mold pressing plate body is fixedly connected with a vacuum pump, the outer wall of one side of the mold pressing plate body is fixedly connected with a controller on one side of the vacuum pump, the output end of the vacuum pump is fixedly connected with an exhaust pipe, the input end of the vacuum pump is fixedly connected with a suction pipe, the inner wall of the mold pressing plate body is fixedly connected with a pressure sensor on one side of the suction pipe, and the inside of the suction pipe is rotationally connected with an electric valve. The electronic element is pressed to the surface of the suction pipe, so that the electronic element is fixed, movement during wire bonding is avoided, the bonding effect is influenced, correspondingly, the electronic element is fixed on the suction pipe by the atmospheric pressure, non-contact fixing is realized, the electronic element is prevented from being damaged by the use of a moving plate for fixing the electronic element, and the protectiveness of the electronic element is improved.

Description

Technical Field

[0001] This invention belongs to the field of mold plate technology, specifically relating to a mold plate for wire bonding of circuit connections. Background Technology

[0002] A die plate for wire bonding is a key tool in the semiconductor packaging and microelectronics manufacturing industry to assist the wire bonding process. Its core function is to ensure a high-quality electrical connection between the chip and the substrate or lead frame by applying uniform pressure and precise positioning.

[0003] However, traditional devices still have the following problems when in use:

[0004] Patent application publication number CN222051698U discloses a wire bonding machine pressure plate mechanism. This wire bonding machine pressure plate mechanism can press electronic components of different thicknesses. It has a simple structure and is easy to use, which improves the practicality of the device. It can also press electronic components of different lengths and press the four sides of the electronic components, thereby improving the stability of the connection of the electronic components.

[0005] In the existing technology, the above-mentioned method of fixing electronic components uses a movable plate to fix them on both sides of the electronic components. If the force is not controlled properly, it is easy to crush the four sides of the electronic components, thereby rendering the electronic components unusable.

[0006] Therefore, we need a mold plate for wire bonding of circuit connections to solve the problem that the moving plate can easily damage the electronic component plate when the force is not properly controlled, and to avoid damage to the electronic component when fixing it. Summary of the Invention

[0007] In view of the shortcomings of the existing technology, the purpose of this invention is to provide a mold plate for wire bonding of circuit connections, which has the advantage of avoiding damage to electronic components when fixing them.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a mold pressing plate body is included, a vacuum pump is fixedly connected to the outer wall of one side of the mold pressing plate body, a controller is fixedly connected to the outer wall of one side of the mold pressing plate body located on the side of the vacuum pump, an exhaust pipe is fixedly connected to the output end of the vacuum pump, an air extraction pipe is fixedly connected to the input end of the vacuum pump, a pressure sensor is fixedly connected to the inner wall of the mold pressing plate body located on the side of the air extraction pipe, an electric valve is rotatably connected inside the air extraction pipe, a cavity is formed inside the mold pressing plate body, and a heat dissipation cavity is formed at the upper part of the interior of the mold pressing plate body.

[0009] Preferably, the outer walls on both sides of the mold plate body are provided with mounting grooves, a base is fixedly connected inside the mounting groove, a rotating shaft is rotatably connected inside the base, and a gear is fixedly connected to the outer wall of the rotating shaft.

[0010] Preferably, the outer walls on both sides of the mold pressure plate body are provided with strip grooves on one side of the mounting groove. A sealing plate is slidably connected inside the strip groove. A sealing gasket is fixedly connected to the outer wall at the bottom of the sealing plate. A groove is provided on one side of the outer wall of the sealing plate. The inside of the groove is movably inserted into the outer wall of the gear. Cleaning brushes are fixedly connected to the outer walls at both ends of the top of the sealing plate. The outer wall at the top of the cleaning brush is in movable contact with the upper part of the inner wall of the strip groove.

[0011] Preferably, an air suction pipe is fixedly connected to the upper part of the inner wall of the cavity, the outer wall of the air suction pipe is fixedly connected to the interior of the heat dissipation cavity, the outer wall of the top of the mold plate body is in movable contact with ceramic fiber, the outer wall of the top of the ceramic fiber is fixedly connected with a silicone layer, and the outer wall of the bottom of the ceramic fiber is in movable contact with the outer wall of the top of the air suction pipe.

[0012] Preferably, an electronic component is fixedly connected to the outer wall of the top of the silicone layer, a solder ball is welded to the outer wall of the top of the electronic component, and a lead body is welded to the outer wall of the top of the two solder balls.

[0013] Preferably, a socket is fixedly connected to the lower part of the inner wall of the cavity, a housing is fixedly connected to the upper part of the inner wall of the cavity, a T-shaped push rod is slidably connected inside the housing, a mounting plate is fixedly connected to the outer wall of the bottom of the T-shaped push rod, a heating plate is fixedly connected to the inside of the mounting plate, a plug is connected to the outer wall of the bottom of the heating plate by wires, the outer wall of the bottom of the plug is movably inserted into the inside of the socket, and a power cord is connected to the outer wall of the bottom of the socket by wires.

[0014] Preferably, the inner wall of the heat dissipation cavity near the exhaust pipe has an air inlet, the outer wall of the air inlet side is fixedly connected to the outer wall of one end of the exhaust pipe, and the outer wall of the other side of the heat dissipation cavity has a heat dissipation hole.

[0015] Preferably, a sealing gasket is fixedly connected to the outer wall of the T-shaped push rod, a return spring is fixedly connected to the outer wall of the top of the T-shaped push rod, the outer wall of the top of the return spring is fixedly connected to the upper part of the inner wall of the housing, and a through hole is provided at the lower part of the inner wall of the housing.

[0016] Preferably, an elastic block is connected to the outer wall of the bottom of the T-shaped push rod, a one-way valve is fixedly connected to the upper part of the outer wall of one side of the housing, a connecting hole is opened on the top outer wall of the T-shaped push rod, and the outer surface of the bottom of the connecting hole is connected through the interior of the T-shaped push rod.

[0017] Preferably, a square groove is formed on the outer wall of one side of the T-shaped push rod, and a movable rod is slidably connected inside the square groove. A U-shaped frame is fixedly connected to the inner wall of the T-shaped push rod located on the outer wall of the square groove. The outer wall of the U-shaped frame is slidably connected to the inside of the movable rod. A second return spring is fixedly connected to the inner wall of the U-shaped frame, and the outer wall of one end of the second return spring is fixedly connected to the inside of the movable rod.

[0018] Compared with the prior art, the beneficial effects of the present invention are:

[0019] The electronic components are pressed against the surface of the suction tube, thus fixing them in place and preventing movement during wire bonding, which would affect the bonding effect. Correspondingly, the electronic components are fixed to the suction tube by atmospheric pressure, achieving non-contact fixing. This prevents damage to the electronic components that would occur if a moving plate were used to fix them, thereby increasing the protection of the electronic components. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the present invention.

[0021] Figure 2 This is a schematic diagram of the controller structure of the present invention.

[0022] Figure 3 This is a schematic diagram of the silicone layer structure of the present invention.

[0023] Figure 4 This is a schematic diagram of the internal structure of the mold platen body of the present invention.

[0024] Figure 5 This is a schematic diagram of the cavity structure of the present invention.

[0025] Figure 6 For the present invention Figure 4 Enlarged structural diagram of point A.

[0026] Figure 7 This is a schematic diagram of the suction tube structure of the present invention.

[0027] Figure 8 This is a schematic diagram of the mounting plate structure of the present invention.

[0028] Figure 9 This is a schematic diagram of the internal structure of the housing of the present invention.

[0029] Figure 10 This is a schematic diagram of the internal structure of the T-shaped push rod of the present invention.

[0030] Figure 11 For the present invention Figure 10 Enlarged structural diagram at point B.

[0031] Figure 12This is a schematic cross-sectional view of the movable rod of the present invention.

[0032] In the diagram: 1. Mold pressure plate body; 11. Controller; 12. Vacuum pump; 13. Exhaust pipe; 14. Cavity; 15. Suction pipe; 16. Extraction pipe; 17. Pressure sensor; 18. Electric valve; 2. Electronic components; 21. Solder ball; 22. Lead wire body; 3. Sealing plate; 31. Cleaning brush; 32. Sealing gasket II; 33. Rotating shaft; 34. Gear; 35. Groove; 4. Power cord; 41. Mounting plate; 42. Socket; 43. Plug; 44. Heating plate; 5. Silicone layer; 51. Ceramic fiber; 6. Housing; 61. Return spring I; 62. T-shaped push rod; 63. Through hole; 64. Sealing gasket I; 7. Heat dissipation cavity; 71. Heat dissipation hole; 72. Air inlet; 8. One-way valve; 81. Connection hole; 82. Elastic block; 83. Movable rod; 84. U-shaped frame; 85. Return spring II. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the present invention clear and complete, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of the present invention, and are merely illustrative of the embodiments of the present invention. They are not intended to limit the embodiments of the present invention. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Example 1, please refer to Figures 1 to 12This invention provides a mold platen technical solution for wire bonding of circuit connections: It includes a mold platen body 1, a vacuum pump 12 fixedly connected to the outer wall of one side of the mold platen body 1, a controller 11 fixedly connected to the outer wall of one side of the mold platen body 1 on the side of the vacuum pump 12, an exhaust pipe 13 fixedly connected to the output end of the vacuum pump 12, a suction pipe 16 fixedly connected to the input end of the vacuum pump 12, a pressure sensor 17 fixedly connected to the inner wall of the mold platen body 1 on the side of the suction pipe 16, an electric valve 18 rotatably connected inside the suction pipe 16, a cavity 14 formed inside the mold platen body 1, and a [missing information - likely a design feature or feature] formed at the top inside the mold platen body 1. The heat dissipation cavity 7 has mounting grooves on both sides of the outer wall of the mold pressure plate body 1. A base is fixedly connected inside the mounting groove. A rotating shaft 33 is rotatably connected inside the base. A gear 34 is fixedly connected to the outer wall of the rotating shaft 33. A strip groove is opened on one side of the outer wall of the mold pressure plate body 1 located in the mounting groove. A sealing plate 3 is slidably connected inside the strip groove. A sealing gasket 32 ​​is fixedly connected to the outer wall of the bottom of the sealing plate 3. A groove 35 is opened on one side of the outer wall of the sealing plate 3. The inside of the groove 35 is movably inserted into the outer wall of the gear 34. Cleaning brushes 31 are fixedly connected to the outer walls of both ends of the top of the sealing plate 3. The outer wall of the top of the cleaning brushes 31 is in movable contact with the upper part of the inner wall of the strip groove.

[0035] To avoid slight displacement of electronic component 2 during the initial fixation stage when using vacuum adsorption, the method limits the position of electronic component 2, preventing slight movement and increasing its stability. The sealing plate 3, with its bottom providing a sealing effect, can block the suction pipe 15 (not below electronic component 2) as it adjusts to the width of electronic component 2, preventing gas from continuously entering through the suction pipe 15 and affecting the fixation effect of electronic component 2 during vacuum adsorption. Furthermore, the sealing plate 3 has a cleaning function; as it moves, it cleans the inner wall of the mold platen body 1, preventing solder, glue, and metal debris from adhering to the mold platen body 1 during bonding. Timely cleaning reduces additive residue that could cause short circuits in electronic component 2. Finally, the tight contact between the bottom of the sealing plate 3 and the top of the silicone layer 5 ensures that the silicone layer 5 is stably pressed above the suction pipe 15.

[0036] The electronic component 2 is pressed against the surface of the suction tube 15, thereby fixing the electronic component 2 and preventing it from moving during wire bonding, which would affect the bonding effect. Correspondingly, the electronic component 2 is fixed on the suction tube 15 by atmospheric pressure, realizing non-contact fixing and preventing the electronic component 2 from being crushed by using a moving plate to fix it, thus increasing the protection of the electronic component 2.

[0037] In Example 2, based on Example 1, an air suction pipe 15 is fixedly connected to the upper part of the inner wall of cavity 14. The outer wall of the air suction pipe 15 is fixedly connected to the interior of the heat dissipation cavity 7. The outer wall of the top of the mold pressure plate body 1 is in movable contact with ceramic fiber 51. The outer wall of the top of the ceramic fiber 51 is fixedly connected with silicone layer 5. The outer wall of the bottom of the ceramic fiber 51 is in movable contact with the outer wall of the top of the air suction pipe 15. The outer wall of the top of the silicone layer 5 is fixedly connected with electronic component 2. The outer wall of the top of the electronic component 2 is welded with solder ball 21. The outer wall of the top of the two solder balls 21 is welded with lead wire body 22.

[0038] The silicone layer 5's own elasticity buffers the vacuum adsorption force, reducing local stress concentration in the electronic component 2. The deformation capability of the silicone layer 5 counteracts the minor deformation of the electronic component 2 caused by vacuum adsorption, maintaining the flatness of the electronic component 2. Furthermore, the ceramic fiber 51 is in movable contact with the suction pipe 15. The sealing plate 3 presses the ceramic fiber 51 onto the top of the suction pipe 15. When the sealing plate 3 needs to be replaced, it can be moved towards both ends of the mold plate body 1, releasing the contact between the sealing plate 3 and the silicone layer 5, thus allowing for the replacement of the silicone layer 5. This correspondingly improves the efficiency of silicone layer 5 replacement.

[0039] In Example 3, based on Example 1, a socket 42 is fixedly connected to the lower part of the inner wall of cavity 14, and a housing 6 is fixedly connected to the upper part of the inner wall of cavity 14. A T-shaped push rod 62 is slidably connected inside the housing 6. A mounting plate 41 is fixedly connected to the outer wall of the bottom of the T-shaped push rod 62. A heating plate 44 is fixedly connected to the inside of the mounting plate 41. A plug 43 is wired to the outer wall of the bottom of the heating plate 44. The outer wall of the bottom of the plug 43 is movably inserted into the inside of the socket 42. A power cord 4 is wired to the outer wall of the bottom of the socket 42. A sealing gasket 64 is fixedly connected to the outer wall of the T-shaped push rod 62. A return spring 61 is fixedly connected to the outer wall of the top of the T-shaped push rod 62. The outer wall of the top of the return spring 61 is fixedly connected to the upper part of the inner wall of the housing 6. A through hole 63 is opened at the lower part of the inner wall of the housing 6.

[0040] By supplying power to the heating plate 44, the heating plate 44 dissipates heat. When the heat is transferred to the electronic component 2 through the mold plate body 1, the electronic component 2 can be preheated. This avoids the thermal stress concentration caused by temperature differences when the solder balls 21 and lead bodies 22 are directly bonded at room temperature, which could lead to component cracking, delamination, or lead detachment. Correspondingly, by preheating the electronic component 2 through the mold plate body 1, the electronic component 2 and the solder balls 21 and lead bodies 22 reach similar temperatures before bonding, reducing the temperature gradient, thereby reducing thermal stress and improving the reliability of bonding.

[0041] In Example 4, based on Example 1, an air inlet 72 is provided on the inner wall of the heat dissipation cavity 7 near the exhaust pipe 13, the outer wall of the air inlet 72 is fixedly connected to the outer wall of one end of the exhaust pipe 13, and a heat dissipation hole 71 is provided on the outer wall of the other side of the heat dissipation cavity 7.

[0042] By connecting the exhaust pipe 13 to the air inlet 72, the gas drawn in by the vacuum pump 12 can enter the interior of the heat dissipation cavity 7 through the air inlet 72 and finally be discharged from the heat dissipation hole 71. Thus, the gas entering the interior of the heat dissipation cavity 7 can accelerate the flow of gas inside the heat dissipation cavity 7, thereby driving the ceramic fiber 51 to generate heat, thus reducing the heat received by the ceramic fiber 51 and reducing the efficiency of the ceramic fiber 51 aging due to heat.

[0043] In Example 5, based on Example 1, an elastic block 82 is connected to the outer wall of the bottom of the T-shaped push rod 62. A one-way valve 8 is fixedly connected to the upper part of the outer wall of one side of the housing 6. A connecting hole 81 is opened on the outer wall of the top of the T-shaped push rod 62. The outer surface of the bottom of the connecting hole 81 is connected through to the interior of the T-shaped push rod 62. A square groove is opened on the outer wall of one side of the T-shaped push rod 62. A movable rod 83 is slidably connected inside the square groove. A U-shaped frame 84 is fixedly connected to the inner wall of the T-shaped push rod 62 located on the outer wall of the square groove. The outer wall of the U-shaped frame 84 is slidably connected to the interior of the movable rod 83. A second return spring 85 is fixedly connected to the inner wall of the U-shaped frame 84. The outer wall of one end of the second return spring 85 is fixedly connected to the interior of the movable rod 83.

[0044] By expelling the air inside the T-shaped push rod 62, the suction force of the suction pipe 15 on the electronic component 2 is prevented from increasing and causing deformation of the electronic component 2 when the pressure inside the cavity 14 is lower than the preset value. Correspondingly, when the low pressure inside the cavity 14 exceeds the preset value, gas can be injected into the cavity 14 to reduce the low pressure inside the cavity 14, thereby protecting the electronic component 2.

[0045] The working principle and usage process of this invention: During operation, when bonding the circuit connection leads, firstly, the electronic component 2 is placed on the top of the mold plate body 1. Then, the operator manually rotates the circular handle on the rotating shaft 33. When the circular handle is rotated under force, the rotating shaft 33 drives the gear 34 to rotate accordingly. Then, through the movable connection between the gear 34 and the groove 35, the rotation of the gear 34 drives the groove 35 to move, thereby causing the sealing plate 3, the sealing gasket 32, and the cleaning brush 31 to move inside the square groove. When one end of the two sealing plates 3 contacts the outer wall of the electronic component 2, the rotation of the circular handle can be stopped. At this time, the contact between the sealing plate 3 and the electronic component 2 can limit the electronic component 2, avoiding the initial stage of fixing the electronic component 2 when using vacuum adsorption to fix it. If slight displacement occurs, the electronic component 2 can be limited to prevent slight movement during fixation, thereby increasing its stability. The sealing plate 3, with its bottom providing a sealing effect, can also block the suction pipe 15 (not below the electronic component 2) as it adjusts to the width of the electronic component 2. This prevents gas from continuously entering through the suction pipe 15 during vacuum adsorption, thus ensuring the fixation of the electronic component 2. Furthermore, the sealing plate 3 has a cleaning function; as it moves, it cleans the inner wall of the mold platen body 1, preventing solder, glue, and metal debris from adhering to it during bonding. Timely cleaning reduces additive residue that could cause short circuits in the electronic component 2. Finally, the tight contact between the bottom of the sealing plate 3 and the top of the silicone layer 5 ensures the silicone layer 5 is stably pressed above the suction pipe 15.

[0046] It should be noted that without external force, the circular handle will remain stationary and will not cause the rotating shaft 33 to rotate arbitrarily.

[0047] After the electronic component 2 is positioned by the sealing plate 3, the vacuum pump 12 can be started. The movement of the vacuum pump 12 causes the air extraction pipe 16 to evacuate the air from the cavity 14. When a low-pressure environment is formed inside the cavity 14, and the pressure inside the cavity 14 is lower than the external atmospheric pressure, the external air pressure acts on the electronic component 2 through the suction pipe 15, pressing the electronic component 2 against the surface of the suction pipe 15. This completes the fixation of the electronic component 2, preventing movement during wire bonding and ensuring a better bonding effect. Correspondingly, the air pressure is drawn from the electronic component 2 by the atmospheric pressure. The pressure is fixed to the suction pipe 15 to achieve non-contact fixation, which prevents the electronic component 2 from being damaged by the pressure when using a moving plate to fix it, thereby increasing the protection of the electronic component 2. Then, through the setting of the pressure sensor 17, the air pressure inside the cavity 14 can be detected in real time. When the air pressure exceeds the preset value, the pressure sensor 17 transmits the detected information to the controller 11. When the controller 11 receives the signal, it can issue a control signal to control the electric valve 18 to close, thereby stopping the suction pipe 16 from continuing to evacuate the cavity 14.

[0048] Then, through the silicone layer 5 and ceramic fiber 51 set above the suction pipe 15, when the silicone layer 5 is attached to the electronic component 2, and when the electronic component 2 is fixed by vacuum adsorption, the silicone layer 5 and ceramic fiber 51 have the characteristics of elasticity and high temperature resistance. The elasticity of the silicone layer 5 itself buffers the vacuum adsorption force, reducing the local stress concentration of the electronic component 2. Thus, the deformation ability of the silicone layer 5 offsets the small deformation of the electronic component 2 caused by vacuum adsorption, maintaining the flatness of the electronic component 2. Furthermore, the ceramic fiber 51 is in movable contact with the suction pipe 15. The sealing plate 3 presses the ceramic fiber 51 onto the top of the suction pipe 15. When it is necessary to replace the sealing plate 3, the sealing plate 3 can be moved to both ends of the mold pressure plate body 1 to release the contact between the sealing plate 3 and the silicone layer 5, so that the silicone layer 5 can be replaced, thereby improving the efficiency of silicone layer 5 replacement.

[0049] While the cavity 14 is evacuated through the evacuation pipe 16, the air inside the lower part of the housing 6 is discharged through the T-shaped push rod 62. Under the action of low air pressure, the T-shaped push rod 62 pushes the mounting plate 41 downward. During the downward movement of the mounting plate 41, the heating plate 44 and the plug 43 are also moved downward. When the plug 43 is inserted into the socket 42 connected to the power cord 4, the heating plate 44 is powered, causing it to work and dissipate heat. When the heat is transferred to the electronic component 2 through the mold pressure plate body 1, the electronic component 2 is preheated. This avoids the thermal stress concentration caused by temperature difference when the solder balls 21 and lead bodies 22 are directly bonded at room temperature, which could lead to component cracking, delamination, or lead detachment. Correspondingly, the electronic component 2 is preheated by the mold pressure plate body 1, so that the electronic component 2 and the solder balls 21 and lead bodies 22 reach similar temperatures before bonding, reducing the temperature gradient, thereby reducing thermal stress and improving the reliability of bonding.

[0050] Then, through the connection between the exhaust pipe 13 and the air inlet 72, the gas drawn in by the vacuum pump 12 can enter the interior of the heat dissipation cavity 7 through the air inlet 72 and finally be discharged from the heat dissipation hole 71. Thus, the gas entering the interior of the heat dissipation cavity 7 can accelerate the flow of gas inside the heat dissipation cavity 7, thereby driving the ceramic fiber 51 to generate heat, thus reducing the heat received by the ceramic fiber 51 and reducing the efficiency of the ceramic fiber 51 being accelerated to age by heat.

[0051] It should be noted that: when the vacuum pump 12 draws in gas through the suction pipe 16, and then discharges the gas through the compression and exhaust process, a vacuum is formed in the pump body. When the suction pipe 16 stops drawing in gas, the gas in the pump body has been compressed and stored in a closed space, so the exhaust pipe 13 can still continue to exhaust gas.

[0052] When the pressure inside cavity 14 exceeds the preset value, the increased low pressure causes the T-shaped push rod 62 to compress the elastic block 82, thereby driving the movable rod 83 downward. When the movable rod 83 moves to contact the housing 6, the compression of the movable rod 83 by the housing 6 allows it to enter the interior of the T-shaped push rod 62, thus expelling the air inside the T-shaped push rod 62. This prevents the suction force of the air intake pipe 15 from increasing and deforming the electronic component 2 when the pressure inside cavity 14 is lower than the preset value. Correspondingly, when the low pressure inside cavity 14 exceeds the preset value, gas can be injected into cavity 14 to reduce the low pressure inside cavity 14, thereby protecting the electronic component 2.

[0053] It should be noted that, by setting the one-way valve 8, only air is allowed to enter through the one-way valve 8;

[0054] After the electronic component 2 has finished working, the sealing plug set on one side of the controller 11 can be pulled out to allow air to enter the cavity 14.

[0055] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A die plate for wire bonding of circuit connections, comprising a die plate body (1), characterized in that: A vacuum pump (12) is fixedly connected to the outer wall of one side of the mold plate body (1). A controller (11) is fixedly connected to the outer wall of one side of the mold plate body (1) on the side of the vacuum pump (12). An exhaust pipe (13) is fixedly connected to the output end of the vacuum pump (12). An air extraction pipe (16) is fixedly connected to the input end of the vacuum pump (12). A pressure sensor (17) is fixedly connected to the inner wall of the mold plate body (1) on the side of the air extraction pipe (16). An electric valve (18) is rotatably connected inside the air extraction pipe (16). A cavity (14) is opened inside the mold plate body (1). A heat dissipation cavity (7) is opened at the top inside the mold plate body (1). The outer walls of both sides of the mold plate body (1) are provided with mounting grooves. A base is fixedly connected inside the mounting groove. A rotating shaft (33) is rotatably connected inside the base. A gear (34) is fixedly connected to the outer wall of the rotating shaft (33). A strip groove is provided on one side of the mounting groove on both sides of the mold plate body (1). A sealing plate (3) is slidably connected inside the strip groove. A sealing gasket (32) is fixedly connected to the outer wall at the bottom of the sealing plate (3). A groove (35) is provided on one side of the outer wall of the sealing plate (3). The inside of the groove (35) is movably inserted into the outer wall of the gear (34). A cleaning brush (31) is fixedly connected to the outer walls at both ends of the top of the sealing plate (3). The outer wall at the top of the cleaning brush (31) is in movable contact with the upper part of the inner wall of the strip groove.

2. A die plate for wire bonding of circuit connections according to claim 1, characterized in that: An air suction pipe (15) is fixedly connected to the upper part of the inner wall of the cavity (14). The outer wall of the air suction pipe (15) is fixedly connected to the interior of the heat dissipation cavity (7). The outer wall of the top of the mold plate body (1) is in contact with ceramic fiber (51). The outer wall of the top of the ceramic fiber (51) is fixedly connected with a silicone layer (5). The outer wall of the bottom of the ceramic fiber (51) is in contact with the outer wall of the top of the air suction pipe (15).

3. A die plate for wire bonding of circuit connections according to claim 2, characterized in that: An electronic component (2) is fixedly connected to the outer wall of the top of the silicone layer (5), and a solder ball (21) is welded to the outer wall of the top of the electronic component (2). A lead body (22) is welded to the outer wall of the top of the two solder balls (21).

4. A die plate for wire bonding of circuit connections according to claim 1, characterized in that: A socket (42) is fixedly connected to the lower part of the inner wall of the cavity (14), and a housing (6) is fixedly connected to the upper part of the inner wall of the cavity (14). A T-shaped push rod (62) is slidably connected inside the housing (6). A mounting plate (41) is fixedly connected to the outer wall of the bottom of the T-shaped push rod (62). A heating plate (44) is fixedly connected inside the mounting plate (41). A plug (43) is connected to the wire on the outer wall of the bottom of the heating plate (44). The outer wall of the bottom of the plug (43) is movably inserted into the inside of the socket (42). A power cord (4) is connected to the wire on the outer wall of the bottom of the socket (42).

5. A die plate for wire bonding of circuit connections according to claim 1, characterized in that: The heat dissipation cavity (7) has an air inlet (72) on the inner wall near the exhaust pipe (13), and the outer wall on the side of the air inlet (72) is fixedly connected to the outer wall at one end of the exhaust pipe (13). The heat dissipation cavity (7) has a heat dissipation hole (71) on the outer wall on the other side.

6. A die plate for wire bonding of circuit connections according to claim 4, characterized in that: A sealing gasket (64) is fixedly connected to the outer wall of the T-shaped push rod (62), and a return spring (61) is fixedly connected to the outer wall of the top of the T-shaped push rod (62). The outer wall of the top of the return spring (61) is fixedly connected to the upper part of the inner wall of the housing (6), and a through hole (63) is provided at the bottom of the inner wall of the housing (6).

7. A die plate for wire bonding of circuit connections according to claim 6, characterized in that: An elastic block (82) is connected to the outer wall of the bottom of the T-shaped push rod (62). A one-way valve (8) is fixedly connected to the top of the outer wall of one side of the housing (6). A connection hole (81) is opened on the top outer wall of the T-shaped push rod (62). The outer surface of the bottom of the connection hole (81) is connected to the interior of the T-shaped push rod (62).

8. A die plate for wire bonding of circuit connections according to claim 7, characterized in that: A square groove is provided on the outer wall of one side of the T-shaped push rod (62). A movable rod (83) is slidably connected inside the square groove. A U-shaped frame (84) is fixedly connected to the inner wall of the T-shaped push rod (62) on the outer wall of the square groove. The outer wall of the U-shaped frame (84) is slidably connected to the inside of the movable rod (83). A second return spring (85) is fixedly connected to the inner wall of the U-shaped frame (84). The outer wall of one end of the second return spring (85) is fixedly connected to the inside of the movable rod (83).

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