Rectifying circuit lead frame, rectifying circuit and device

By optimizing the base island layout and diode connection method of the rectifier circuit lead frame, multiple diodes work simultaneously in half a cycle, the heating and volume problems of bridge rectifier under high voltage and high current are solved, and efficient current conversion and cost reduction effects are achieved.

CN120262925APending Publication Date: 2025-07-04TIANSHUI 749 ELECTRONICS
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Patent Information

Application Number
CN202510396225.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-31
Publication Date
2025-07-04

AI Technical Summary

Technical Problem

Existing bridge rectifiers have power loss and heating problems under high voltage and high current conditions, resulting in a decline in device performance and an increase in device volume and heat dissipation requirements, affecting circuit conversion efficiency.

Method used

A rectifier circuit lead frame is designed, using a specific base island arrangement and chip connection method, and the conversion of AC to DC is achieved through two interconnected rectifier bridge modules, and multiple diodes are used to work simultaneously in half a cycle to reduce heat generation and device volume.

Benefits of technology

It realizes the reduction of on-voltage drop, reduces heating, improves circuit conversion efficiency, reduces costs, and does not increase device volume, improves product reliability and yield.

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Abstract

The invention relates to the technical field of rectification circuits, in particular to a rectification circuit lead frame, a rectification circuit and a device.The frame comprises a lead frame body, a plurality of lead frame monomers are arranged on the lead frame body in an array mode, and each lead frame monomer comprises a first lead frame unit and a second lead frame unit which are arranged side by side; a PIN1 end is led out from the first base island, a PIN2 end is led out from the second base island, a PIN3 end is led out from the third base island, a PIN4 end is led out from the fourth base island, a PIN5 end is led out from the fifth base island, a PIN6 end is led out from the sixth base island, a PIN7 end is led out from the seventh base island, and a PIN8 end is led out from the eighth base island. A new solution is provided for use in various electronic power devices and circuits.
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Description

Technical Field

[0001] The present invention relates to the technical field of rectifier circuits, and specifically to a rectifier circuit lead frame, a rectifier circuit and a device. Background Art

[0002] Bridge rectifiers are mainly used to convert alternating current into direct current. After passing through a filtering circuit and a voltage stabilizing circuit, the pulsating current is converted into a direct current with a constant magnitude, and is used in various electronic power equipment and circuits, and has many daily uses. Air conditioners, audio systems, and electronic ignition devices are all powered by batteries, and play a crucial role in fields such as LED lighting. As the power of electronic devices increases, the requirements for the current and heat dissipation of bridge rectifiers are getting higher and higher. There are energy losses in the process, especially in the case of high voltage and large current, the on-state voltage drop of the device will cause power loss and increased heat generation. Due to power loss, the device temperature rises. If the heat dissipation design is not good, it may lead to a decrease in device performance or even damage. Currently, it is required that the volume of electronic devices be as small as possible, the power density requirements are getting higher and higher, and at the same time, the unit volume of the device is becoming more and more limited. The current existing technology process needs to increase the current supply of the bridge rectifier, and solves the device volume requirements by increasing the device volume and enlarging the heat sink.

[0003] A diode usually has a chip disposed between a positive electrode lead and a negative electrode lead, and then is realized through processes such as welding, encapsulation, and trimming and forming. The existing positive electrode lead and negative electrode lead are usually respectively disposed on two lead frames, and are completed by welding the two lead frames. When in use, the ambient temperature, large vibration, and harsh working conditions should be considered. During the actual encapsulation process, the diode is in an on-state during normal operation, and there is also a blocking state. Under normal blocking working conditions, the diode has a reverse leakage current situation. The leakage current will increase the circuit loss and also reduce the circuit conversion efficiency, especially in a working environment with a higher temperature. Therefore, in addition to hoping that the diode has a low forward voltage drop, it is also hoped that the device has a small reverse leakage current. Summary of the Invention

[0004] Aiming at the problem that the forward voltage drop and reverse leakage current of the diode in the rectifier circuit in the prior art affect the circuit conversion efficiency, the present invention provides a rectifier circuit lead frame, a rectifier circuit and a device, so as to optimize and improve the device volume from the design and packaging processes while increasing the current.

[0005] The present invention is realized through the following technical solutions: A rectifier circuit lead frame includes a lead frame body, on which a plurality of lead frame monomers are arranged in an array. The lead frame monomer includes a first lead frame unit and a second lead frame unit arranged side by side. On the first lead frame unit, a first base island, a second base island, a third base island, and a fourth base island are arranged in the counterclockwise direction. On the second lead frame unit, a fifth base island, a sixth base island, a seventh base island, and an eighth base island are arranged. Corresponding secondary chips are arranged on the corresponding base islands, and the diode chips are connected to the corresponding base islands through bonding wires. The first base island leads out the PIN1 terminal, the second base island leads out the PIN2 terminal, the third base island leads out the PIN3 terminal, the fourth base island leads out the PIN4 terminal, the fifth base island leads out the PIN5 terminal, the sixth base island leads out the PIN6 terminal, the seventh base island leads out the PIN7 terminal, and the eighth base island leads out the PIN8 terminal.

[0006] Preferably, the first base island and the second base island are on the same side, and the third base island and the fourth base island are on the same side; the first base island and the fourth base island are arranged oppositely; the first base island and the fourth base island are in an L shape, and the area of the fourth base island is smaller than that of the first base island. The second base island and the third base island are in a T shape, and the area of the second base island is smaller than that of the third base island; the distribution, size, and shape of the base islands on the second lead frame are the same as those on the first lead frame.

[0007] Preferably, a first diode chip and a third diode chip are arranged on the first base island. The first diode chip is connected to the second base island through a bonding wire, and the third diode chip is connected to the third base island through a bonding wire; A fourth diode chip is arranged on the third base island, and the fourth diode chip is connected to the fourth base island through a bonding wire; A second diode chip is arranged on the second base island, and the second diode chip is connected to the fourth base island through a bonding wire; A fifth diode chip and a seventh diode chip are arranged on the fifth base island. The fifth diode chip is connected to the sixth base island through a bonding wire, and the seventh diode chip is connected to the seventh base island through a bonding wire; A sixth diode chip is arranged on the sixth base island, and the sixth diode chip is connected to the eighth base island through a bonding wire; An eighth diode chip is arranged on the seventh base island, and the eighth diode chip is connected to the eighth base island through a bonding wire.

[0008] Preferably, the width of the PIN1 terminal is smaller than the width of the PIN3 terminal, the width of the PIN1 terminal is equal to the width of the PIN2 terminal, and the width of the PIN3 terminal is equal to the width of the PIN4 terminal.

[0009] Preferably, the width of the PIN5 terminal is smaller than the width of the PIN8 terminal, the width of the PIN5 terminal is equal to the width of the PIN6 terminal, and the width of the PIN7 terminal is equal to the width of the PIN8 terminal.

[0010] A rectifier circuit including the rectifier circuit lead frame described above, comprising a first rectifier bridge module, a second rectifier bridge module, a first AC input terminal, a second AC input terminal, a first DC output terminal, and a second DC output terminal, which converts the alternating current input from the AC input terminal into direct current through the use of two interconnected rectifier bridge modules and outputs it from the DC output terminal.

[0011] A high-power rectifier device including the rectifier circuit described above, comprising rectifier diodes and switching switches. The rectifier diodes are divided into two groups. One group is the forward diode group forming the first rectifier bridge module, and the other group is the reverse diodes forming the second rectifier bridge module. Each rectifier diode is connected in series with a switching switch, and the on and off of the rectifier diode branch is controlled by the closing and opening of the switching switch.

[0012] Preferably, the switching switches connected in series one by one for each diode in the forward and reverse diode groups are a group of vacuum contactors controlled simultaneously.

[0013] A rectifier device, including the rectifier circuit described above, further comprising a PIN1 pin, a PIN2 pin, a PIN3 pin, and a PIN4 pin; wherein, the PIN1 pin is connected to the first AC input terminal, the PIN2 pin is connected to the second AC input terminal, the PIN3 pin is connected to the first DC output terminal, and the PIN4 pin is connected to the second DC output terminal.

[0014] Preferably, it further includes a plurality of circuit boards, a plurality of rectifier diodes, and a heat sink structure. The rectifier diodes are respectively soldered on the positive and negative heat sinks and fixed on the circuit boards by means of a plastic encapsulation process to transfer and dissipate the heat generated by the heat sink function as a rectifier.

[0015] Compared with the prior art, the present invention has the following beneficial effects: A rectifier circuit lead frame of the present invention can convert alternating current into direct current. During the design process, the rectifier structure components, namely the diode base, the chip, and the lead, are completed. By shaping the base island and arranging the chips, the current can be reduced and the size can be thinned. It has novel and unique structure, simple and reasonable appearance, and has the advantages of low cost, energy conservation and emission reduction, etc. The production process helps to improve the yield of the product, ensure the quality, and improve the reliability of the product.

[0016] A rectifier circuit of the present invention converts alternating current input from an AC input terminal into direct current and outputs it from a DC output terminal by using two interconnected rectifier bridge modules, enabling more diodes to work simultaneously in a single half-cycle, thereby achieving the purpose of current expansion. At the same time, it can also reduce the body heat and avoid excessive increase in the device volume. The basic working principle during operation is as follows: Two rectifier bridges are composed of eight diodes, and the bridge circuit can provide rectification throughout the AC input cycle. In the positive half-cycle of the AC signal, some diodes conduct, and the current flows from one end of the AC power supply through the conducting diodes to the load and then back to the other end of the AC power supply from the load; in the negative half-cycle, another part of the diodes conduct, and the current flows in the opposite direction. In this way, both half-cycles of the AC input signal can be effectively rectified, and then a stable DC current is output. After passing through the filter circuit and voltage regulator circuit, the pulsating electricity is converted into direct current with a constant magnitude, providing a new solution for use in various electronic power equipment and circuits. Brief Description of the Drawings

[0017] Figure 1 It is a schematic diagram of the package of the lead frame of a rectifier circuit of the present invention; Figure 2 It is a schematic diagram of the structure of a single lead frame in the present invention; Figure 3 It is a schematic diagram of the layout of the single lead frame and the diode chip in the present invention; Figure 4 It is a schematic diagram of a rectifier circuit of the present invention; Figure 5 It is a schematic diagram of the rectifier circuit in Comparative Example 1; Figure 6 It is a schematic diagram of the full-wave rectifier circuit in Comparative Example 2; Figure 7 It is the specific working principle diagram of the full-wave rectifier circuit in Comparative Example 2.

[0018] In the figure, 1. Lead frame body; 2. First lead frame unit; 3. Second lead frame unit; 4. Fourth base island; 5. Third base island; 6. First base island; 7. Second base island; 8. Eighth base island; 9. Seventh base island; 10. Fifth base island; 11. Sixth base island; D1. First diode chip; D2. Second diode chip; D3. Third diode chip; D4. Fourth diode chip; D5. Fifth diode chip; D6. Sixth diode chip; D7. Seventh diode chip; D8. Eighth diode chip. Detailed Description of the Specific Embodiment

[0019] The following further elaborates on the present invention in detail in combination with specific embodiments, which is an explanation rather than a limitation of the present invention.

[0020] In this text, various directions, actions, steps, or components, etc. are mainly described. These directions, actions, steps, or components are not restricted by these terms in the text. These terms are only used to distinguish the first direction, action, step, or component from another direction, action, step, or component. For example, without departing from the scope of the embodiments of the present invention, the first connection end can be called the second connection end, and similarly, the second connection end can be called the first connection end. At the same time, both the first connection end and the second connection end are connection ends, but they are not the same connection end.

[0021] The present invention discloses a lead frame for a rectifier circuit. Referring to Figure 1 、 2 、3, it includes a lead frame body. A plurality of lead frame monomers are arranged in an array on the lead frame body. The frame is designed as SOP8L (length x height x thickness) 238mm x 70mm x 0.203mm, the pin pitch is 1.27mm, and it is arranged in a matrix of 8 rows x 32 columns, with a total of 256 lead frame units. The lead frame unit serves as a carrier for the chip, can provide physical support for the chip, and ensure the stability of the chip during the packaging process. The lead frame unit also connects the internal circuit lead-out ends of the chip and the external leads through bonding wires to form an electrical loop, improving electrical performance and mechanical stability, and ensuring the normal operation of the rectifier circuit. The design of the frame base island matches the chip size, achieving short bonding wires, small plastic encapsulation wire arcs and punching wires, alleviating the hidden danger of product delamination, and improving product reliability. The lead frame unit also undertakes the task of heat dissipation. When the rectifier circuit is working, the chip generates heat, and the lead frame can effectively conduct this heat away to prevent the chip from being damaged due to overheating.

[0022] The lead frame monomer includes a first lead frame unit and a second lead frame unit arranged side by side. Along the counterclockwise direction on the first lead frame unit, a first base island, a second base island, a third base island, and a fourth base island are arranged. On the second lead frame unit, a fifth base island, a sixth base island, a seventh base island, and an eighth base island are arranged.

[0023] In a certain embodiment, the first base island and the second base island are on the same side, and the third base island and the fourth base island are on the same side; the first base island and the fourth base island are arranged opposite to each other; the first base island and the fourth base island are in an L shape, and the area of the fourth base island is smaller than that of the first base island. The second base island and the third base island are in a T shape, and the area of the second base island is smaller than that of the third base island; the distribution, size, and shape of the base islands on the second lead frame are the same as those on the first lead frame. Specifically, the shape of the pin is designed with a long side in an L shape and a short side in a T shape. The frame edge includes circular and oval positioning holes, and some are designed with bumps (to enhance contact stability). By limiting its shape, the current path between chips is shortened, and the parasitic inductance is reduced.

[0024] In one embodiment, corresponding secondary chips are provided on corresponding base islands, and the diode chips are connected to the corresponding base islands through bonding wires. Specifically, a first diode chip and a third diode chip are provided on the first base island. The first diode chip is connected to the second base island through a bonding wire, and the third diode chip is connected to the third base island through a bonding wire; A fourth diode chip is provided on the third base island, and the fourth diode chip is connected to the fourth base island through a bonding wire; A second diode chip is provided on the second base island, and the second diode chip is connected to the fourth base island through a bonding wire; A fifth diode chip and a seventh diode chip are provided on the fifth base island. The fifth diode chip is connected to the sixth base island through a bonding wire, and the seventh diode chip is connected to the seventh base island through a bonding wire; A sixth diode chip is provided on the sixth base island, and the sixth diode chip is connected to the eighth base island through a bonding wire; An eighth diode chip is provided on the seventh base island, and the eighth diode chip is connected to the eighth base island through a bonding wire.

[0025] In one embodiment, the first base island leads out the PIN1 terminal, the second base island leads out the PIN2 terminal, the third base island leads out the PIN3 terminal, the fourth base island leads out the PIN4 terminal, the fifth base island leads out the PIN5 terminal, the sixth base island leads out the PIN6 terminal, the seventh base island leads out the PIN7 terminal, and the eighth base island leads out the PIN8 terminal.

[0026] In one embodiment, the width of the PIN1 terminal is less than the width of the PIN3 terminal, the width of the PIN1 terminal is equal to the width of the PIN2 terminal, and the width of the PIN3 terminal is equal to the width of the PIN4 terminal; the width of the PIN5 terminal is less than the width of the PIN8 terminal, the width of the PIN5 terminal is equal to the width of the PIN6 terminal, and the width of the PIN7 terminal is equal to the width of the PIN8 terminal.

[0027] In one embodiment, the width of the PIN1 terminal is 400 μm, the width of the PIN3 terminal is 300 μm, the width of the PIN5 terminal is 400 μm, and the width of the PIN7 terminal is 300 μm.

[0028] Refer to Figure 4, the present invention also discloses a rectifier circuit including the lead frame of the rectifier circuit, which includes a first rectifier bridge module, a second rectifier bridge module, a first AC input terminal, a second AC input terminal, a first DC output terminal, and a second DC output terminal. The alternating current input from the AC input terminal is converted into direct current and output from the DC output terminal by using two interconnected rectifier bridge modules. Specifically, the rectifier circuit includes the first and second rectifier bridge modules, the first and second AC input terminals, the first DC output terminal C and the second DC output terminal D, the PIN1 DC input terminal and the corresponding PIN4 DC output terminal. The first rectifier bridge module mainly includes the PIN1 terminal, the PIN3 terminal, and the PIN4 terminal. The second rectifier bridge module includes the PIN5 terminal, the PIN7 terminal, and the PIN8 terminal. The PIN1 terminal is connected to the first AC input terminal, the PIN2 terminal and the PIN5 terminal are commonly connected to the first DC output terminal C, the PIN3 terminal and the PIN6 terminal are commonly connected to the second DC output terminal D, and the PIN4 terminal is connected to the second AC input terminal.

[0029] Among them, the first rectifier bridge module includes a first diode D1, a second diode D2, a third diode D3, and a fourth diode D4. The positive electrode of the first diode D1, the negative electrode of the second diode D2, the positive electrode of the third diode D3, and the negative electrode of the fourth diode D4 are commonly connected to the first connection end a. The negative electrode of the first diode D1 and the negative electrode of the third diode D3 are commonly connected to the second connection end b.

[0030] The second rectifier bridge module includes a fifth diode D5, a sixth diode D6, a seventh diode D7, and an eighth diode D8. The positive electrode of the fifth diode D5, the negative electrode of the sixth diode D6, the positive electrode of the seventh diode D7, and the negative electrode of the diode are commonly connected to the PIN8 terminal. The negative electrode of the fifth diode D5 and the negative electrode of the D7 diode are commonly connected to the PIN7 terminal. The positive electrode of the sixth diode D6 and the positive electrode of the eighth diode D8 are commonly connected to the PIN6 terminal.

[0031] The PIN1 AC input terminal, the PIN5 AC input terminal, the PIN4 DC output terminal, and the PIN8 DC output terminal are located on the same side; the first diode D1, the third diode D3, the fifth diode D5, and the seventh diode D7 are arranged in sequence along the first direction; the second diode D2, the fourth diode D4, the sixth diode D6, and the eighth diode D8 are arranged in sequence along the second direction; the first direction is parallel to the second direction, and the first diode D1, the third diode D3, the fifth diode D5, and the seventh diode D7 are aligned with respect to the second diode D2, the fourth diode D4, the sixth diode D6, and the eighth diode D8.

[0032] The PIN1 AC input terminal and the PIN5 AC input terminal are on the same side; the PIN4 DC output terminal and the PIN8 DC output terminal are on the same side and on the opposite side of the PIN1 AC input terminal and the PIN5 AC input terminal; the first diode, the second diode, the sixth diode, and the fifth diode are arranged in sequence along the third direction; the third diode, the fourth diode, the eighth diode, and the seventh diode are arranged in sequence along the fourth direction; the third direction is parallel to the fourth direction, and the first diode, the second diode, the sixth diode, and the fifth diode are arranged in a staggered manner with respect to the third diode, the fourth diode, the eighth diode, and the seventh diode.

[0033] The PIN1 pin is connected to the first AC input terminal, the PIN2 pin is connected to the second AC input terminal, the PIN3 pin is connected to the first DC output terminal, and the fourth pin is connected to the second DC output terminal.

[0034] Refer to Figure 4 , taking the first DC output terminal C as the positive pole and the second DC output terminal D as the negative pole as an example. When in the positive half-cycle of the alternating current (assuming A is positive and B is negative), the four diodes of the first diode D1, the third diode D3, the sixth diode D6, and the eighth diode D8 are forward-biased and conducting, while the four diodes of the fifth diode D5, the seventh diode D7, the second diode D2, and the fourth diode D4 are reverse-biased and cut off. Then, the forward conduction of the first diode D1 and the third diode D3 outputs the current from A to C, the current passes through the load RL to D, and the forward conduction of the sixth diode D6 and the eighth diode D8 makes the current return to B, thus forming a complete current loop to supply power to the load RL. When in the negative half-cycle of the alternating current (assuming A is negative and B is positive), the four diodes of the fifth diode D5, the seventh diode D7, the second diode D2, and the fourth diode D4 are forward-biased and conducting, while the four diodes of the first diode D1, the third diode D3, the sixth diode D6, and the eighth diode D8 are reverse-biased and cut off. Then, the forward conduction of the fifth diode D5 and the seventh diode D7 outputs the current from B to C, the current passes through the load RL to D, and the forward conduction of the second diode D2 and the fourth diode D4 makes the current return to A, thus forming a complete current loop to supply power to the load RL. At the same time, it simply realizes that four diodes work simultaneously in a single half-cycle, thereby achieving the purpose of current expansion and reducing the body heat generation.

[0035] Among them, by connecting diodes in parallel, the on-resistance of the diodes is halved. According to P = I² * R, with I remaining unchanged and R halved, it is equivalent to halving the heating power P to achieve the purpose of reducing heat generation. If P remains unchanged and R is halved, it is equivalent to increasing the output of current I. The material and characteristics of the rectifier diodes can be not limited. The first AC input terminal, the second AC input terminal, the first DC output terminal, and the second DC output terminal are located on the same side. By arranging the four terminals on the same side, it is more convenient to connect and apply this rectifier circuit.

[0036] In one embodiment, on the basis of Figure 4 the above technical solution, optionally, the first AC input terminal, the second AC input terminal, the first DC output terminal, and the second DC output terminal are located on the same side. By arranging the four terminals on the same side, it is more convenient to connect and apply this rectifier circuit.

[0037] Referring to Figure 5 , in a certain rectifier circuit, the first rectifier bridge module 200 includes a first diode D1, a second diode D2, a third diode D3, and a fourth diode D4; among them, the positive electrode of the first diode D1, the negative electrode of the second diode D2, the positive electrode of the third diode D3, and the negative electrode of the fourth diode D4 are commonly connected to the first connection terminal a, and the negative electrodes of the first diode D1 and the third diode D3 are commonly connected to the second connection terminal b.

[0038] Referring to Figure 6 , the full-wave rectifier circuit is a rectifier circuit that can make full use of electric energy obtained by slightly adjusting on the basis of the half-wave rectifier circuit. A certain full-wave rectifier circuit can be regarded as composed of two half-wave rectifier circuits. A tap is led out from the middle of the secondary coil of the transformer, and the secondary coil is divided into two upper and lower symmetric windings, so as to obtain two voltages U2a and U2b that are equal in magnitude but opposite in polarity, constituting two half-wave rectifier circuits of U2a, D1, RL and U2b, D2, RL. The specific working principle and waveform transformation process of the full-wave rectifier circuit are as Figure 7 shown.

[0039] As Figure 7 (a) shows, within 0 to π, U2a is a forward voltage for D1, and U2b is a reverse voltage for D2, then D1 conducts forward and D2 is cut off reversely, and a half-wave voltage with positive on the upper side and negative on the lower side is obtained on RL; as Figure 4 (b) within the time π to 2π, U2a is a reverse voltage for D1, and U2b is a forward voltage for D2, then D1 is cut off reversely and D2 conducts forward, and the half-wave voltage obtained on RL is still positive on the upper side and negative on the lower side. Repeating like this, since the two rectifying elements D1 and D2 conduct electricity alternately, during the positive half-cycle and negative half-cycle two operating periods, current in the same direction passes through the load resistor RL, so it is called full-wave rectification.

[0040] The present invention also discloses a high-power rectifying device, which includes rectifying diodes and switching switches. The rectifying diodes are divided into two groups, one group is the forward diode group and the other group is the reverse diode group. Each rectifying diode is connected in series with a switching switch, and the on and off of the switching switch are used to control the connection and disconnection of the rectifying diode branch. The switching switches connected in series with the diodes one by one form a group of vacuum contactors that are simultaneously controlled. Half-wave rectification only utilizes half of the alternating current, resulting in problems such as low output voltage, large ripple coefficient, and low overall efficiency. Especially in high-power applications, there is obvious energy waste. Filter capacitors can smooth the waveform and reduce ripple. Switching to full-wave rectification can improve efficiency and the stability of the output voltage.

[0041] The present invention also discloses a rectifying device, which includes a plurality of circuit boards, a plurality of rectifying diodes and a heat dissipation plate structure. The rectifying diodes are respectively soldered on the positive and negative heat dissipation plates and fixed on the circuit board in a plastic encapsulation process. The function of the heat dissipation plate is to transfer and dissipate the heat generated by the rectifier. The rectifying circuit is arranged on the chip or the circuit board, and then the chip or the circuit board can be wrapped by the outer shell to isolate the interference of the external environment. The heat dissipation structure is attached to the surface of the encapsulation structure 7 to help dissipate the heat of the rectifying circuit and further protect the rectifying circuit.

[0042] The rectifying device further includes an encapsulation structure for protecting the rectifying circuit.

[0043] The rectifying device further includes a PIN1 pin, a PIN2 pin, a PIN3 pin and a PIN4 pin; wherein, the PIN1 pin is connected to the first AC input terminal, the PIN2 pin is connected to the second AC input terminal, the PIN3 pin is connected to the first DC output terminal, and the PIN4 pin is connected to the second DC output terminal.

[0044] The rectifying device converts the alternating current input from the AC input terminal into direct current and outputs it from the DC output terminal by using two interconnected rectifying bridge modules, enabling more diodes to work simultaneously in a single half-cycle, thus achieving the purpose of current expansion. At the same time, it can also reduce the heat generation of the device body and avoid excessive increase in the volume of the device.

[0045] A rectifier is an electrical device that converts alternating current into direct current, and this process is called rectification. Rectifiers have many uses, including as components of power supplies and amplitude modulation detectors for radio signals. Rectifiers are most commonly made using solid-state diodes, but other types of components can also be used when dealing with very high voltages or currents. By utilizing the property that diodes can only conduct electricity in one direction, alternating current signals are converted into unidirectional pulsating direct current signals. When using a single diode to rectify alternating current, the difference between the term diode and the term rectifier is just one of the usages. Such a signal, although not a pure direct current signal, is sufficient for some low-requirement circuits to convert alternating current into direct current using a diode.

[0046] Note that the above is only a preferred embodiment of the present invention and the technical principles applied. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein. Various obvious changes, re-adjustments, and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, it can also include more other equivalent embodiments, and the scope of the present invention is determined by the scope of the appended claims.

[0047] This is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any design concept using the rectification device and the DC pole-changing system described in the present invention belongs to the protection scope of the technical concept of the present invention. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and its concept of the present invention, makes equivalent substitutions or changes, and should be covered within the protection scope of the present invention.

Claims

1. A lead frame for a rectifier circuit, characterized in that, It includes a lead frame body, on which a plurality of lead frame monomers are arranged in an array. The lead frame monomer includes a first lead frame unit and a second lead frame unit arranged side by side. On the first lead frame unit, a first base island, a second base island, a third base island, and a fourth base island are arranged in a counterclockwise direction. On the second lead frame unit, a fifth base island, a sixth base island, a seventh base island, and an eighth base island are arranged. Corresponding secondary chips are arranged on the corresponding base islands, and the diode chips are connected to the corresponding base islands through bonding wires; the first base island leads out the PIN1 terminal, the second base island leads out the PIN2 terminal, the third base island leads out the PIN3 terminal, the fourth base island leads out the PIN4 terminal, the fifth base island leads out the PIN5 terminal, the sixth base island leads out the PIN6 terminal, the seventh base island leads out the PIN7 terminal, and the eighth base island leads out the PIN8 terminal.

2. The lead frame of the rectifier circuit according to claim 1, characterized in that, The first base island and the second base island are located on the same side, and the third base island and the fourth base island are located on the same side; the first base island and the fourth base island are arranged oppositely; the first base island and the fourth base island are in an L shape, and the area of the fourth base island is smaller than that of the first base island. The second base island and the third base island are in a T shape, and the area of the second base island is smaller than that of the third base island; The distribution, size, and shape of the base islands on the second lead frame are the same as those on the first lead frame.

3. The lead frame of the rectifier circuit according to claim 1, characterized in that, A first diode chip and a third diode chip are arranged on the first base island. The first diode chip is connected to the second base island through a bonding wire, and the third diode chip is connected to the third base island through a bonding wire; A fourth diode chip is arranged on the third base island. The fourth diode chip is connected to the fourth base island through a bonding wire; A second diode chip is arranged on the second base island. The second diode chip is connected to the fourth base island through a bonding wire; A fifth diode chip and a seventh diode chip are arranged on the fifth base island. The fifth diode chip is connected to the sixth base island through a bonding wire, and the seventh diode chip is connected to the seventh base island through a bonding wire; A sixth diode chip is arranged on the sixth base island. The sixth diode chip is connected to the eighth base island through a bonding wire; An eighth diode chip is arranged on the seventh base island. The eighth diode chip is connected to the eighth base island through a bonding wire.

4. The lead frame of the rectifier circuit according to claim 1, characterized in that, The width of the PIN1 terminal is smaller than that of the PIN3 terminal. The width of the PIN1 terminal is equal to that of the PIN2 terminal, and the width of the PIN3 terminal is equal to that of the PIN4 terminal.

5. The lead frame of the rectifier circuit according to claim 1, characterized in that, The width of the PIN5 terminal is smaller than that of the PIN8 terminal. The width of the PIN5 terminal is equal to that of the PIN6 terminal, and the width of the PIN7 terminal is equal to that of the PIN8 terminal.

6. A rectifier circuit comprising the rectifier circuit lead frame according to any one of claims 1 to 5, characterized in that, It includes a first rectifier bridge module, a second rectifier bridge module, a first AC input terminal, a second AC input terminal, a first DC output terminal, and a second DC output terminal. The alternating current input from the AC input terminal is converted into direct current and output from the DC output terminal by using two interconnected rectifier bridge modules.

7. A high-power rectification device comprising the rectification circuit described in claim 6, characterized in that, It includes rectifier diodes and switching switches. The rectifier diodes are divided into two groups. One group is the forward diode group to form the first rectifier bridge module, and the other group is the reverse diodes to form the second rectifier bridge module. Each rectifier diode is connected in series with a switching switch, and the on and off of the rectifier diode branch is controlled by the on and off of this switching switch.

8. The high-power rectifying device according to claim 7, characterized in that, The switching switches connected in series one by one for each diode in each of the forward and reverse diode groups are a group of vacuum contactors controlled simultaneously.

9. A rectifying device, comprising the rectifying circuit as described in claim 6, characterized in that, It also includes a PIN1 pin, a PIN2 pin, a PIN3 pin, and a PIN4 pin; among them, the PIN1 pin is connected to the first AC input terminal, the PIN2 pin is connected to the second AC input terminal, the PIN3 pin is connected to the first DC output terminal, and the PIN4 pin is connected to the second DC output terminal.

10. The rectifying device according to claim 9, characterized in that, It also includes a plurality of circuit boards, a plurality of rectifier diodes, and a heat sink structure. The rectifier diodes are respectively soldered on the positive and negative heat sinks and fixed on the circuit boards in a plastic encapsulation process manner, and the heat dissipation function of the heat sink is converted into heat generated by the rectifier and dissipated and transmitted.