Display module and display device

Abstract

The embodiment of the invention provides a display module and a display device. The display module comprises a cover plate, a display panel, sealing glue and a metal layer. The display panel is located on one side of the cover plate, the display panel comprises a first surface, and the first surface of the display panel is located on the side, away from the cover plate, of the display panel; the sealing glue and the display panel are located on the same side of the cover plate, the sealing glue covers the first surface of the display panel and surrounds the display panel, and the first edge of the sealing glue is connected with the first edge of the cover plate; the metal layer is located on the side, away from the cover plate, of the display panel and attached to the sealing compound, and attaching of the metal layer and packaging of the sealing compound are achieved in the same technology. According to the display module provided by the embodiment of the invention, the packaging effect of the display module is improved, and the cost is reduced.

Description

Technical Field

[0001] The present application relates to the field of displays, and in particular to a display module and a display device. Background Art

[0002] In the field of displays, especially in the fields of OLED and AMOLED displays, the border of the display module is increasingly tending to be narrow to increase the screen-to-body ratio of the display area. However, with the development of the narrow border of the flexible display panel, the border sealing process of the display module faces increasing challenges. For example, during the border sealing process of the display module, when using a mold for sealing, it is easy to generate indentations or glue overflow between the mold and the module, thus affecting the display performance of the display module. And after sealing, the heat sink attachment process still needs to be carried out, resulting in a cumbersome and complex process and difficulty in reducing costs. Summary of the Invention

[0003] In view of this, in order to improve the encapsulation effect of the display module and reduce costs, the present application provides a display module and a display device.

[0004] In a first aspect, an embodiment of the present application provides a display module, including: a cover plate, a display panel, a sealant, and a metal layer. The display panel is located on one side of the cover plate. The display panel includes a first surface, and the first surface of the display panel is located on the side of the display panel facing away from the cover plate. The sealant is on the same side of the cover plate as the display panel, and the sealant covers the first surface of the display panel, and the sealant surrounds the display panel, and a first edge of the sealant is connected to a first edge of the cover plate. The metal layer is located on the side of the display panel facing away from the cover plate and is attached to the sealant, and the attachment of the metal layer and the encapsulation of the sealant are achieved in the same process.

[0005] For the display module provided by the embodiment of the present application, the sealant covers the first surface of the display panel, which enables the sealant to perform a whole-surface encapsulation during encapsulation. And the connection of the first edge of the sealant to the first edge of the cover plate can effectively prevent the sealant from generating indentations and glue overflow on the display panel during the encapsulation process. The attachment of the metal layer to the sealant is conducive to reducing the overall thickness of the module. At the same time, the attachment of the metal layer and the encapsulation of the sealant are achieved in the same process, eliminating the need for a separate process for attaching the metal layer, thereby simplifying the process flow.

[0006] In a possible implementation manner of the first aspect, the metal layer is located on the side of the sealant facing away from the cover plate.

[0007] In this implementation manner, the metal layer is located on the side of the sealant facing away from the cover plate, which means that there is no sealant on the side of the metal layer facing away from the cover plate, that is, the heat dissipation of the metal layer is not restricted by the sealant, thereby improving the heat dissipation effect of the metal layer.

[0008] In a possible implementation of the first aspect, the encapsulant wraps the metal layer.

[0009] In this implementation, the encapsulant wraps the metal layer. The metal layer can support the display panel, while the encapsulant acts as a heat sink. Utilizing the encapsulant for heat dissipation can increase the heat dissipation area.

[0010] In a possible implementation of the first aspect, the thermal conductivity of the encapsulant is greater than or equal to 0.5 W / m·K.

[0011] In this implementation, the thermal conductivity of the encapsulant being greater than or equal to 0.5 W / m·K enables the encapsulant to have good heat dissipation performance.

[0012] In a possible implementation of the first aspect, the cover plate includes a first side surface. The first side surface of the cover plate is parallel to the first direction, and the first direction is the stacking direction of the cover plate and the display panel; the encapsulant includes a first side surface. Along the first direction, the first side surface of the encapsulant is aligned with the first side surface of the cover plate.

[0013] In this implementation, the first side surface of the encapsulant being aligned with the first side surface of the cover plate means that the encapsulant and the cover plate are flush encapsulated, facilitating subsequent assembly.

[0014] In a possible implementation of the first aspect, the cover plate includes a first side surface. The first side surface of the cover plate is parallel to the first direction, and the first direction is the stacking direction of the cover plate and the display panel; the encapsulant includes a first side surface, and the first side surface of the encapsulant includes a first edge of the encapsulant; the included angle between the first side surface of the encapsulant and the first side surface of the cover plate is an obtuse angle.

[0015] In this implementation, the included angle between the first side surface of the encapsulant and the first side surface of the cover plate is an obtuse angle, so that a chamfer is formed between the first side surface of the encapsulant and the first side surface of the cover plate, which is conducive to the demolding of the encapsulant mold and reduces the demolding difficulty.

[0016] In a possible implementation of the first aspect, the display panel includes a first hole, and the encapsulant covers the side wall of the first hole of the display panel.

[0017] In this implementation, the encapsulant covering the side wall of the first hole means that the first hole is side-sealed, so that the first hole is protected by the encapsulant, preventing the side wall of the first hole from directly contacting the air, thereby improving the waterproof and oil-proof properties of the first hole and facilitating the improvement of the stability of other devices (such as a camera module or a fingerprint recognition module, etc.) inside the first hole.

[0018] In a possible implementation of the first aspect, the display panel includes a first hole, and the orthographic projection of the first hole on the cover plate does not overlap with the orthographic projection of the sealant on the cover plate.

[0019] In this implementation, the fact that the orthographic projection of the first hole on the cover plate does not overlap with the orthographic projection of the sealant on the cover plate means that there is no side-sealing for the first hole, that is, no side-sealing is required in the encapsulation process of the sealant, which is conducive to reducing the encapsulation difficulty and thus conducive to cost reduction.

[0020] In a possible implementation of the first aspect, the display module further includes a first connector, and the orthographic projection of the first connector on the cover plate does not overlap with the orthographic projection of the sealant on the cover plate.

[0021] In this implementation, the fact that the orthographic projection of the first connector on the cover plate does not overlap with the orthographic projection of the sealant on the cover plate means that the encapsulation process of the sealant avoids the first connector, which is convenient for the first connector to be electrically connected to other pins.

[0022] In a possible implementation of the first aspect, the display module includes a first region and a second region; the display panel includes a bonding region, the bonding region of the display panel is located within the first region and outside the second region; along the stacking direction of the cover plate and the display panel, the maximum distance between the sealant in the first region and the cover plate is a first height, and the maximum distance between the sealant in the second region and the cover plate is a second height, and the first height is greater than the second height.

[0023] In this implementation, the bonding region is used to bond chips. Therefore, along the stacking direction of the cover plate and the display panel, the height of the display panel in the bonding region is greater than the height of the display panel in other regions. Therefore, in order to ensure the uniformity of the sealant thickness, the first height is greater than the second height.

[0024] In a possible implementation of the first aspect, the resistivity of the sealant is less than or equal to 10 11 Ω m.

[0025] In this implementation, the resistivity of the sealant is less than or equal to 10 11 Ω m belongs to the category of low resistivity. Low resistivity can effectively reduce the probability of generating static electricity, thereby effectively improving the ESD performance.

[0026] In the second aspect, an embodiment of the present application provides a display device, including the display module provided in the first aspect.

[0027] In the display panel provided by the embodiment of the present application, the sealant and the display panel are located on the same side of the cover plate, and the sealant covers the first surface of the display panel and surrounds the display panel, so that the sealant forms a three-sided surrounding structure for the display panel, which is beneficial to the encapsulation of the display panel and avoids problems such as glue overflow or mold indentation during the encapsulation process. At the same time, the first edge of the sealant is connected to the first edge of the cover plate, so that the side of the cover plate facing the sealant is suspended, thereby avoiding problems such as the separation of the display panel from the cover plate or the breakage of the cover plate caused by uneven stress below. Brief Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0029] Figure 1 Schematic diagram of a display module provided by an embodiment of the present application; Figure 2 Schematic diagram of a display module provided by an embodiment of the present application; Figure 3 Schematic diagram of a display module and a mold provided by an embodiment of the present application; Figure 4 Schematic diagram of a display module provided by an embodiment of the present application; Figure 5 Schematic diagram of a display module and a mold provided by an embodiment of the present application; Figure 6 Provided by an embodiment of the present application Figure 1 Enlarged schematic diagram of area A; Figure 7 Schematic diagram of a display module provided by an embodiment of the present application; Figure 8 Schematic diagram of a display module provided by an embodiment of the present application; Figure 9 Schematic diagram of a display device provided by an embodiment of the present application.

[0030] Label Description 100, display module; 101, first area; 102, second area; 110, cover plate; 120, display panel; 121, bonding area; 130, sealant; 140, metal layer; 141, first part; 142, second part; 200, display device. Detailed Embodiments

[0031] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0032] It should be clear that the described embodiments are only a part of the embodiments of this application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this application without creative efforts shall fall within the protection scope of this application.

[0033] The terms used in the embodiments of this application are only for the purpose of describing specific embodiments, and are not intended to limit this application. The singular forms "a", "the" and "said" used in the embodiments of this application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0034] It should be understood that the term " / and" used herein is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A / and B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the front and rear associated objects.

[0035] In the related art, in order to make the display module have an extremely small border, a four-side sealing process is often used for sealing, that is, the four borders are sealed separately. During the sealing process, the mold needs to contact the cover plate and the backlight side of the display module to achieve sealing. However, during this process, if the contact force between the mold and the backlight side of the display module is too large, it will cause indentations on the backlight side of the display module, affecting the display effect and the subsequent heat sink mounting process; if the contact force between the mold and the backlight side of the display module is too small, it will cause glue overflow, also affecting the display effect and the subsequent heat sink mounting process. Therefore, this sealing process has strict requirements on the pressing accuracy of the mold, which is likely to reduce the product yield.

[0036] To improve the product yield of the packaging process of the display module, the embodiments of this application provide a display module and a display device.

[0037] Such as Figure 1As shown in the figure, a display module 100 includes: a cover plate 110, a display panel 120, a sealant 130, and a metal layer 140. Among them, the display panel 120 is located on one side of the cover plate 110. The display panel 120 includes a first surface, and the first surface of the display panel 120 is located on the side of the display panel 120 facing away from the cover plate 110. The sealant 130 is on the same side of the cover plate 110 as the display panel 120. Along the stacking direction of the display panel 120 and the cover plate 110, the sealant 130 covers the first surface of the display panel 120. And the sealant 130 surrounds the display panel 120, and the first edge of the sealant 130 is connected to the first edge of the cover plate 110. The metal layer 140 is located on the side of the display panel 120 facing away from the cover plate 110 and is in contact with the sealant 130. The attachment of the metal layer 140 and the encapsulation of the sealant 130 are realized in the same process.

[0038] Among them, the first surface of the display panel 120 is located on the side of the display panel 120 facing away from the cover plate 110. The first edge of the sealant 130 is the edge of the surface of the sealant 130 facing the cover plate 110. The first edge of the cover plate 110 is the edge of the surface of the cover plate 110 facing the display panel 120. The connection of the first edge of the sealant 130 and the first edge of the cover plate 110 means that the surface of the cover plate 110 facing the display panel 120 is in contact with the sealant 130, avoiding the suspension of the border position on the side of the cover plate 110 facing the display panel 120, thus realizing the complete fitting of the cover plate 110 and avoiding problems such as the separation of the edge of the display panel 120 from the cover plate 110.

[0039] In a possible implementation manner, the metal layer 140 is a metal sheet, such as a heat dissipation metal sheet. The attachment of the metal layer 140 and the encapsulation of the sealant 130 layer are realized in the same process, which can save the step of attaching the metal layer 140 on the premise of ensuring heat dissipation, reduce the complexity of the process steps, and lower the production cost.

[0040] In the embodiment of the present application, the sealant 130 and the display panel 120 are on the same side of the cover plate 110, and the sealant 130 covers the first surface of the display panel 120, and the sealant 130 surrounds the display panel 120, so that the sealant 130 forms a three-sided surrounding structure for the display panel 120, which is beneficial to the encapsulation of the display panel 120 and avoids problems such as glue overflow or mold 001 indentation during the encapsulation process. At the same time, the first edge of the sealant 130 is connected to the first edge of the cover plate 110, making the side of the cover plate 110 facing the sealant 130 suspended, thus avoiding problems such as the separation of the display panel 120 from the cover plate 110 or the cracking of the cover plate 110 caused by uneven stress below the cover plate 110.

[0041] Such as Figure 1As shown, in one embodiment of the present application, the metal layer 140 is located on the side of the sealing glue 130 away from the cover plate 110. For example, the metal layer 140 is located on the surface of the side of the sealing glue 130 away from the cover plate 110.

[0042] In this embodiment, the metal layer 140 is located on the side of the sealing glue 130 away from the cover plate 110, which means that the side of the metal layer 140 away from the sealing glue 130 is outward, which can effectively dissipate heat and improve the heat dissipation effect.

[0043] In a possible implementation of this embodiment, the metal layer 140 may be placed inside the mold 001 of the sealant 130, and the inner wall of the mold 001 may be placed inside the mold 001 of the sealant 130, and then the mold 001 may be matched with the actual module, for example, the surface of the cover plate 110 away from the display panel 120 and the opening edge of the mold 001 may be located in the same plane, and then the glue may be poured from the glue pouring port of the mold 001 and cured, so that the metal layer 140 is located on the side of the glue away from the cover plate 110. In a possible implementation, the surface of the cover plate 110 away from the display panel 120 may be adsorbed by a suction cup and then placed in the glue pouring mold 001, and it may be ensured that the surface of the cover plate 110 away from the display panel 120 and the opening edge of the mold 001 are located in the same plane.

[0044] Compared with the prior art which requires attaching heat dissipation metal before the sealing glue 130 process, the display module 100 provided in the embodiment of the present application enables the metal layer 140 and the sealing glue 130 to be manufactured in the same process, thereby eliminating the need for attaching heat dissipation metal.

[0045] like Figure 2 As shown, in one embodiment of the present application, the sealant 130 wraps the metal layer 140. The sealant 130 wraps the metal layer 140, and the metal layer 140 can support the display panel 120, while the sealant 130 acts as a heat dissipator. Using the sealant 130 to dissipate heat can increase the heat dissipation area.

[0046] In a possible implementation of this embodiment, part of the glue can be poured into the glue pouring mold 001 first, and then the metal layer 140 is placed, and then the mold 001 is matched with the actual module, for example, the surface of the cover plate 110 facing away from the display panel 120 is located in the same plane as the opening edge of the mold 001, and then glue is poured from the glue pouring port of the mold 001 and cured, so that the sealing glue 130 wraps the metal layer 140. The metal layer 140 can be a metal plate. Since the metal plate is close to the display panel 120, it can support the display panel 120.

[0047] In a possible implementation, the thermal conductivity of the sealant 130 is greater than or equal to 0.5 W / m·K. In this implementation, the thermal conductivity of the sealant 130 being greater than or equal to 0.5 W / m·K enables the sealant 130 to have good heat dissipation performance.

[0048] As Figure 1 shown, in an embodiment of the present application, the cover plate 110 includes a first side surface, the first side surface of the cover plate 110 is parallel to the first direction, and the first direction is the stacking direction of the cover plate 110 and the display panel 120. The sealant 130 includes a first side surface. Along the first direction, the first side surface of the sealant 130 is aligned with the first side surface of the cover plate 110.

[0049] As Figure 3 shown, in this embodiment, the first side surface of the sealant 130 being aligned with the first side surface of the cover plate 110 means that the sealant 130 and the cover plate 110 are flush-mounted. During the encapsulation process of the sealant 130, the edge sealing difficulty of the mold 001 is relatively low. For example, only a rubber isolation layer needs to be provided on the inner wall side of the mold 001 to achieve sealing. At the same time, the first side surface of the sealant 130 being aligned with the first side surface of the cover plate 110 facilitates subsequent assembly.

[0050] As Figure 4 shown, in an embodiment of the present application, the cover plate 110 includes a first side surface, the first side surface of the cover plate 110 is parallel to the first direction, and the first direction is the stacking direction of the cover plate 110 and the display panel 120. The sealant 130 includes a first side surface, and the first side surface of the sealant 130 includes a first edge of the sealant 130. The included angle between the first side surface of the sealant 130 and the first side surface of the cover plate 110 is an obtuse angle.

[0051] As Figure 5 shown, in this embodiment, when the mold 001 performs sealant encapsulation, the included angle between the first side surface of the sealant 130 and the first side surface of the cover plate 110 is an obtuse angle, which means that a chamfer is provided at the edge of the mold 001. This chamfer facilitates mold release, reduces the mold release difficulty, and thus helps to reduce costs and improve the product yield.

[0052] In an embodiment of the present application, the display panel 120 includes a first hole, and the sealant 130 covers the side wall of the first hole of the display panel 120. In a possible implementation, the first hole can be a fingerprint hole or a camera hole. The sealant 130 covering the side wall of the first hole of the display panel 120 means that the sealant 130 performs side sealing on the first hole, thereby playing a protective role for the first hole. It should be noted that although the sealant 130 performs side sealing on the first hole, only the hole wall is side-sealed, and the hole is not filled, so as to facilitate the assembly of the camera module or the realization of the fingerprint function.

[0053] In an embodiment of the present application, the display panel 120 includes a first hole, and the orthographic projection of the first hole on the cover plate 110 does not overlap with the orthographic projection of the sealant 130 on the cover plate 110. In a possible implementation manner, the first hole may be a fingerprint hole or a camera hole. The fact that the orthographic projection of the first hole on the cover plate 110 does not overlap with the orthographic projection of the sealant 130 on the cover plate 110 means that there is no sealant 130 on the side wall of the first hole, that is, the first hole is not side-sealed. Not side-sealing the first hole can reduce the difficulty of the sealant 130 and is conducive to reducing production costs.

[0054] In an embodiment of the present application, the display module 100 further includes a first connector, and the orthographic projection of the first connector on the cover plate 110 does not overlap with the orthographic projection of the sealant 130 on the cover plate 110. In a possible implementation manner of the embodiment, the first connector is used for electrically connecting the display driving chip. The first connector includes a plurality of pins, and the pins of the first connector are electrically connected to the pins of the driving chip correspondingly.

[0055] In this embodiment, the fact that the orthographic projection of the first connector on the cover plate 110 does not overlap with the orthographic projection of the sealant 130 on the cover plate 110 means that the sealant 130 needs to expose the first connector, so as to facilitate the electrical connection between the connector and the driving chip.

[0056] As Figure 1 shown in Figure 6 In an embodiment of the present application, the display module 100 includes a first region 101 and a second region 102. The display panel 120 includes a bonding region 121. The bonding region 121 of the display panel 120 is located within the first region 101 and outside the second region 102. Along the stacking direction of the cover plate 110 and the display panel 120, the maximum distance between the sealant 130 located in the first region 101 and the cover plate 110 is the first height, and the maximum distance between the sealant 130 located in the second region 102 and the cover plate 110 is the second height. The first height is greater than the second height.

[0057] In this embodiment, the bonding region 121 is used for bonding chips. As Figure 6 shown in

[0058] In Figure 7 the bonding region 121, there are bent bonding wires and chips, etc. Therefore, along the stacking direction of the cover plate 110 and the display panel 120, the height of the display panel 120 in the bonding region 121 is greater than the height of the display panel 120 in other regions. Therefore, in order to ensure the uniformity of the thickness of the sealant 130, the first height is greater than the second height.

[0059] As Figure 1 shown, in a possible implementation of this embodiment, part of the metal layer 140 is located in the first region 101, part of the metal layer 140 is located in the second region 102, and the metal layer 140 is a whole-surface structure, and the metal layer 140 conformally adheres to the colloid 130. That is, the metal layer 140 forms a step along with the step of the colloid 130. Therefore, the metal layer 140 forms a step at the connection between the first region 101 and the second region 102. This design can effectively increase the heat dissipation area of the metal layer 140, thereby improving the heat dissipation effect.

[0060] As Figure 8 shown, in a possible implementation of this embodiment, the metal layer 140 includes a first part 141 and a second part 142. The first part 141 is located in the first region 101, the second part 142 is located in the second region 102, and the distance between the first part 141 and the second part 142 is greater than zero.

[0061] In this implementation, the distance between the first part 141 and the second part 142 being greater than zero means that there is a gap between the first part 141 and the second part 142. Therefore, it is not necessary to design a step, which reduces the processing difficulty of the metal layer 140 and is beneficial to cost reduction.

[0062] In a possible implementation, the metal layer 140 can be made of copper (Cu) or stainless steel (Sus). For example, the metal layer 140 can be copper foil, alloy copper, alloy steel, stainless steel 304, or stainless steel 261.

[0063] In an embodiment of the present application, the resistivity of the encapsulant 130 is less than or equal to 10 11 Ω·m. The resistivity of the encapsulant 130 being less than or equal to 10 11 Ω·m belongs to the category of low resistivity. Low resistivity can effectively reduce the probability of generating static electricity, thereby effectively improving the ESD performance.

[0064] In the process of implementing the display module 100 provided by the embodiment of the present application, the whole surface can be potted, the process is simple, and the structure of the display module 100 is simplified. And since the cover plate 110 and the encapsulant 130 achieve glue modulus adaptation through the potting mold 001, the mechanical strength of the display module 100 can be improved. At the same time, since the whole surface is encapsulated with the encapsulant 130, and the mold 001 surrounds the entire cover plate 110 in the encapsulant 130 process, it can effectively avoid generating indentation and glue overflow, and the bracket design is cancelled during the encapsulant 130 process, reducing the process difficulty.

[0065] Secondly, since the display module 100 provided by the embodiment of the present application is encapsulated with the encapsulant 130 on the whole surface, the uniformity of the thickness of the display module 100 can be optimized, which is beneficial to optimizing the overall assembly and can improve the waterproof and oil-proof performance.

[0066] Furthermore, the display module 100 provided by the embodiment of the present application uses a low-resistance glue, which is beneficial to improving the ESD performance of the product; and the glue has good thermal conductivity, which can effectively improve the heat dissipation performance of the display module 100. At the same time, since the metal layer 140 and the encapsulating glue 130 are made in the same process, the encapsulating glue 130 can completely replace the heat sink attaching process, thereby facilitating process simplification and reduction of the product thickness.

[0067] As Figure 9 shown, the embodiment of the present application also provides a display device 200, which includes the display module 100 provided by any one of the foregoing embodiments.

[0068] By using the display device 200 provided by the embodiment of the present application, since its display module 100 can achieve both the encapsulation of the encapsulating glue and the attachment of the metal layer in one process during the encapsulation process, the process steps are reduced, the production cycle of the entire process is shortened, the efficiency is improved, and finally the production cost of the display device 200 is reduced. And since the display module 100 of the display device 200 adopts a full encapsulation method, the generation of indentations on the display module or the overflow of the encapsulating glue during the encapsulation process is reduced, which is beneficial to improving the product yield.

Claims

1. A display module, characterized in that, Comprising: Cover plate; A display panel located on one side of the cover plate, the display panel including a first surface, and the first surface of the display panel is located on the side of the display panel facing away from the cover plate; Sealing glue, on the same side of the cover plate as the display panel, and the sealing glue covers the first surface of the display panel, and the sealing glue surrounds the display panel, and a first edge of the sealing glue is connected to a first edge of the cover plate; A metal layer, located on the side of the display panel facing away from the cover plate and in contact with the sealing glue, and the attachment of the metal layer and the encapsulation of the sealing glue are achieved in the same process.

2. The display module according to claim 1, wherein The metal layer is located on the side of the sealing glue facing away from the cover plate.

3. The display module according to claim 1, wherein The sealing glue wraps the metal layer.

4. The display module according to claim 3, wherein The thermal conductivity of the sealing glue is greater than or equal to 0.5 W / m·K.

5. The display module according to claim 1, wherein The cover plate includes a first side surface, and the first side surface of the cover plate is parallel to a first direction, and the first direction is the stacking direction of the cover plate and the display panel; the sealing glue includes a first side surface; along the first direction, the first side surface of the sealing glue is aligned with the first side surface of the cover plate.

6. The display module according to claim 1, wherein The cover plate includes a first side surface, and the first side surface of the cover plate is parallel to a first direction, and the first direction is the stacking direction of the cover plate and the display panel; the sealing glue includes a first side surface, and the first side surface of the sealing glue includes the first edge of the sealing glue; the included angle between the first side surface of the sealing glue and the first side surface of the cover plate is an obtuse angle.

7. The display module according to claim 1, wherein The display panel includes a first hole, and the sealing glue covers the side wall of the first hole of the display panel.

8. The display module according to claim 1, wherein The display panel includes a first hole, and the orthographic projection of the first hole on the cover plate does not overlap with the orthographic projection of the sealing glue on the cover plate.

9. The display module according to claim 1, wherein The display module further includes a first connector, and the orthographic projection of the first connector on the cover plate does not overlap with the orthographic projection of the sealing glue on the cover plate.

10. The display module according to claim 1, wherein The display module includes a first region and a second region; the display panel includes a bonding region, and the bonding region of the display panel is located within the first region and outside the second region; Along the stacking direction of the cover plate and the display panel, the maximum distance between the sealing glue located in the first region and the cover plate is a first height, and the maximum distance between the sealing glue located in the second region and the cover plate is a second height, and the first height is greater than the second height.

11. The display module according to claim 1, wherein, The resistivity of the encapsulant is less than or equal to 10 11 Ωm.

12. A display device, characterized in that, Including the display module according to any one of claims 1-11.

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