Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, an isolation structure, a light emitting device, a first packaging layer and a filling layer. The isolation structure encloses a plurality of isolation openings, the first packaging layer is located on the sides, away from the substrate, of the isolation structure and the light-emitting device, the first packaging layer comprises a plurality of packaging units, the packaging units correspond to the isolation openings respectively so as to cover the light-emitting device limited by the corresponding isolation openings, and the adjacent packaging units are arranged at intervals; the filling layer is located on the side, away from the substrate, of the isolation structure and located between the adjacent packaging units, the edges of the packaging units extend to the side, away from the substrate, of the isolation structure and are spaced from the isolation structure to form packaging gaps, and the filling layer fills the gaps between the adjacent packaging units and at least part of the packaging gaps. In the display panel, the packaging gaps and the gaps between the adjacent packaging units are filled with the filling layers, so that the bending performance of the display panel is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and in particular, to a display panel, a method for manufacturing the same, and a display device. Background Art

[0002] An organic light-emitting diode (OLED) is an organic thin-film electroluminescent device, which has attracted great attention due to its advantages such as simple manufacturing process, low cost, low power consumption, high brightness, wide viewing angle, high contrast, and flexible display, and is widely used in electronic display products.

[0003] In the process of manufacturing a traditional display panel, the light-emitting pixel patterning is usually achieved by a fine metal mask (FMM). The FMM technology is mature and has rich mass production experience. However, the FMM technology also has problems such as limited precision, high development cost, and long development cycle. The fine metal mask-free technology eliminates the limitations of the traditional OLED process on the display screen size, resolution, and other screen body performances, and has the advantages of high performance, full-domain size, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, CN118660589A record the relevant content of the fine metal mask-free technology for reference.

[0004] However, the packaging structure of current display products affects the bending performance of the products. Summary of the Invention

[0005] In a first aspect of the present disclosure, a display panel is provided. The display panel includes a substrate, an isolation structure, a light-emitting device, a first encapsulation layer, and a filling layer. The isolation structure is located on the substrate, and the isolation structure encloses a plurality of isolation openings. The light-emitting device is located on the substrate and corresponds to the isolation openings respectively, and at least a part of the light-emitting device is located in the corresponding isolation opening. The first encapsulation layer is located on the side of the isolation structure and the light-emitting device away from the substrate. The first encapsulation layer includes a plurality of encapsulation units, and the encapsulation units correspond to the isolation openings respectively to cover the light-emitting devices limited by the corresponding isolation openings. The adjacent encapsulation units are arranged at intervals. The filling layer is located on the side of the isolation structure away from the substrate and between the adjacent encapsulation units. The edge of the encapsulation unit extends to the side of the isolation structure away from the substrate and is spaced from the isolation structure to form an encapsulation gap. The filling layer fills the gap between the adjacent encapsulation units and at least a part of the encapsulation gap.

[0006] In the above solution, the encapsulation gap between the encapsulation unit and the isolation structure and the gap between adjacent encapsulation units are filled with a filling layer, which can improve the bending performance of the display panel.

[0007] In a specific embodiment of the first aspect of the present disclosure, the distance from the surface of the filling layer away from the substrate to the substrate is greater than the distance from the surface of the edge of the encapsulation unit away from the substrate to the substrate. The orthographic projection of the edge of the filling layer on the substrate is located within the orthographic projection of the isolation structure on the substrate. The orthographic projections of the surface of the filling layer away from the substrate and the surface of the filling layer close to the substrate on the substrate respectively cover the orthographic projection of the edge of the encapsulation unit on the substrate.

[0008] In the above solution, the design of the filling layer increases the contact area between the filling layer and the encapsulation unit, thereby increasing the bonding strength between the film layers and improving the stability of the display panel.

[0009] In a specific embodiment of the first aspect of the present disclosure, the filling layer is an optical adjustment layer or a light shielding layer.

[0010] In a specific embodiment of the first aspect of the present disclosure, the encapsulation unit includes a sidewall portion, and the sidewall portion includes a covering portion, an extending portion, and a connecting portion. The covering portion covers the sidewall of the isolation structure. The extending portion extends to the side of the isolation structure away from the substrate and is spaced apart from the isolation structure. The connecting portion connects the covering portion and the extending portion. Among them, the orthographic projections of the extending portions of adjacent encapsulation units on the substrate do not overlap each other, and the gap between the extending portion and the surface of the isolation structure away from the substrate forms an encapsulation gap.

[0011] In a specific embodiment of the first aspect of the present disclosure, the encapsulation unit further includes an encapsulation portion, wherein the encapsulation portion covers the light-emitting device and is connected to the covering portion of the sidewall portion. The orthographic projection of the encapsulation portion on the substrate falls within the orthographic projection of the isolation opening on the substrate.

[0012] In a specific embodiment of the first aspect of the present disclosure, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence on the substrate, and at least part of the light-emitting functional layer of the light-emitting device is located in the corresponding isolation opening. Among them, the height of the encapsulation gap in the direction perpendicular to the substrate is less than or equal to the sum of the thicknesses of the light-emitting functional layer and the second electrode of the corresponding light-emitting device, and any one of the light-emitting functional layer and the second electrode is made of a material different from that of the filling layer.

[0013] In a specific embodiment of the first aspect of the present disclosure, at least part of the light-emitting devices include a first light-emitting device and a second light-emitting device that emit lights of different colors, and the colors of the lights emitted by adjacent light-emitting devices are different. The encapsulation unit at least includes a first encapsulation unit and a second encapsulation unit. The first encapsulation unit corresponds to the first light-emitting device, and the second encapsulation unit corresponds to the second light-emitting device. The encapsulation gaps corresponding to the first encapsulation unit and the encapsulation gaps corresponding to the second encapsulation unit have different heights perpendicular to the substrate.

[0014] In a specific embodiment of the first aspect of the present disclosure, the isolation structure includes a support portion and a crown portion. The support portion is located between the crown portion and the substrate, and the orthographic projection of the surface of the support portion away from the substrate on the substrate is located within the orthographic projection of the crown portion on the substrate.

[0015] In a specific embodiment of the first aspect of the present disclosure, the isolation structure further includes a bottom portion. The bottom portion is located between the support portion and the substrate, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the bottom portion on the substrate.

[0016] In a specific embodiment of the first aspect of the present disclosure, the display panel further includes a pixel defining layer located on the substrate. Among them, the pixel defining layer includes pixel openings corresponding one by one to the isolation openings, and at least part of the light-emitting device is located in the pixel openings.

[0017] In a specific embodiment of the first aspect of the present disclosure, the display panel further includes a second encapsulation layer and a third encapsulation layer. Among them, the second encapsulation layer is located on the side of the first encapsulation layer away from the substrate. The orthographic projection of the second encapsulation layer on the substrate covers the orthographic projections of the first encapsulation layer and the filling layer on the substrate. The third encapsulation layer is located on the side of the second encapsulation layer away from the substrate, and the orthographic projection of the third encapsulation layer on the substrate covers the orthographic projection of the second encapsulation layer on the substrate.

[0018] In a specific embodiment of the first aspect of the present disclosure, the encapsulation gap is completely filled by part of the filling layer.

[0019] The second aspect of the present disclosure provides a method for manufacturing a display panel. The manufacturing method includes: providing a substrate; forming an isolation structure on the substrate, wherein the isolation structure encloses and forms a plurality of isolation openings; forming a light-emitting device and an encapsulation unit on the substrate, wherein the light-emitting device corresponds to the isolation opening respectively, and at least part of the light-emitting device is located in the corresponding isolation opening. The encapsulation unit corresponds to the isolation opening respectively to cover the light-emitting device limited by the corresponding isolation opening. Adjacent encapsulation units are arranged at intervals. The edge of the encapsulation unit extends to the side of the isolation structure away from the substrate and is spaced from the isolation structure to form an encapsulation gap. All the encapsulation units form a first encapsulation layer; forming a filling layer based on the encapsulation unit, wherein the filling layer fills at least part of the gap between adjacent encapsulation units and the encapsulation gap formed between the corresponding encapsulation unit and the isolation structure.

[0020] In the above solution, for the display panel formed by using this manufacturing method, the encapsulation gap between the encapsulation unit and the isolation structure and the gap between the encapsulation units have been covered by the filling layer, thereby improving the bending performance of the obtained display panel.

[0021] In a specific embodiment of the second aspect of the present disclosure, forming a light-emitting device and an encapsulation unit on a substrate includes: before forming the isolation structure on the substrate, forming a plurality of first electrodes spaced apart from each other on the substrate; depositing a light-emitting material film and a conductive material film, the light-emitting material film and the conductive material film covering the isolation structure and the isolation opening, wherein the portions of the light-emitting material film and the conductive material film located in the isolation opening respectively form a light-emitting functional layer and a second electrode; depositing an encapsulation material film layer to cover the light-emitting device; forming a first photoresist layer on the encapsulation material film layer, and performing a patterning process on the first photoresist layer to form a first photoresist pattern, the first photoresist pattern covering a part of the isolation opening; etching the encapsulation material film layer, the light-emitting material film and the conductive material film based on the first photoresist pattern, wherein the remaining portion of the encapsulation material film layer is formed into an initial encapsulation unit, and the light-emitting functional layer and the second electrode not covered by the initial encapsulation unit are etched; repeating the above process to form a light-emitting device and an initial encapsulation unit at the isolation opening where no light-emitting device is formed, and adjacent initial encapsulation units partially overlap on the surface of the same isolation structure away from the substrate; at least removing the overlapping portions of the adjacent initial encapsulation units to obtain encapsulation units, the adjacent encapsulation units are spaced apart, and all the encapsulation units constitute a first encapsulation layer.

[0022] In the above solution, in the steps of manufacturing the light-emitting device and the encapsulation unit, the initial encapsulation units corresponding to the adjacent encapsulation units overlap each other on the isolation structure, so that the subsequently formed initial encapsulation unit protects the previously formed initial encapsulation unit, avoiding the edge of the previously formed initial encapsulation unit from being affected by the etching process during the formation of the light-emitting device corresponding to the subsequently formed initial encapsulation unit, and improving the encapsulation effect of the display panel.

[0023] In a specific implementation of the second aspect of the present disclosure, etching the encapsulation material film layer, the light-emitting material thin film, and the conductive material thin film based on the first photoresist pattern includes: based on the first photoresist pattern, dry-etching the encapsulation material film layer outside the first photoresist pattern, and the remaining encapsulation material film layer covering a part of the light-emitting device forms an encapsulation part, and the remaining encapsulation material film layer covering the side wall of the isolation opening forms a covering part, and the covering part is connected to the encapsulation part, and the remaining encapsulation material film layer extending on the side of the isolation structure away from the substrate and spaced from the isolation structure forms an initial extension part, and the part of the encapsulation material film layer connecting the initial extension part and the covering part forms a connecting part, and the encapsulation part, the covering part, the connecting part, and the initial extension part form an initial encapsulation unit; based on the initial encapsulation unit, wet-etching the light-emitting material thin film and the conductive material thin film outside the initial encapsulation unit, and at least a part of the light-emitting material thin film and the conductive material thin film between the initial extension part and the isolation structure to form an initial encapsulation gap between the initial extension part and the isolation structure.

[0024] In the above solution, after all the light-emitting devices are formed, the overlapping parts between the initial encapsulation units are removed, so as to avoid the problem that the bending performance of the display panel is affected due to the encapsulation unit increasing the thickness of the isolation structure.

[0025] In a specific implementation of the second aspect of the present disclosure, at least removing the overlapping parts of adjacent initial encapsulation units to obtain an encapsulation unit includes: removing at least the overlapping parts of the initial extension parts of adjacent encapsulation units to form an extension part of the encapsulation unit, and the gap between the extension part and the isolation structure forms an encapsulation gap, and the extension length of the positive projection of the encapsulation gap on the substrate in the first direction is less than the extension length of the positive projection of the initial encapsulation gap on the substrate in the first direction, and the first direction is the direction from the edge of the isolation structure to the center of the isolation structure.

[0026] In a specific implementation of the second aspect of the present disclosure, forming a filling layer based on the encapsulation unit includes: under preset conditions, coating a flowable filling material on the substrate formed with the encapsulation unit to form a filling layer film layer, wherein the filling layer film layer fills at least a part of the encapsulation gap and the gap between adjacent encapsulation units, and the filling layer film layer covers the surface of the first encapsulation layer away from the substrate; forming a second photoresist layer on the filling layer film layer, and performing a patterning process on the second photoresist layer to form a second photoresist pattern, and the second photoresist pattern covers the gap between adjacent encapsulation units and the part of the extension part of the corresponding encapsulation unit close to the gap between the encapsulation units; etching the filling layer film layer based on the second photoresist pattern, wherein the remaining part of the filling layer film layer forms a filling layer.

[0027] In the above solution, a filling layer is formed in the gap between the encapsulation units and the encapsulation gap between the encapsulation unit and the isolation structure, which can improve the bending performance of the display panel. At the same time, the filling layer can be used for stress buffering, reducing the risk of crack peeling at the edge of the encapsulation unit and improving the performance of the display panel.

[0028] In a specific embodiment of the second aspect of the present disclosure, the preset conditions include a protective gas environment, a preset pressure of 3000 ppm to 6000 ppm, and ultraviolet light with a wavelength in the range of 315 nm to 400 nm.

[0029] In a specific embodiment of the second aspect of the present disclosure, the preset conditions further include: irradiating with ultraviolet light having a wavelength in the range of 230 nm to 250 nm for a preset time, and the preset time is 0.01 s to 60 s. In this way, by controlling the preset conditions during the preparation process of the filling layer, the formation of the filling layer can be controlled, so that while the filling layer fills the gap between the encapsulation units, it completely fills the corresponding encapsulation gap between the encapsulation unit and the isolation structure or partially fills the encapsulation gap, improving the applicability of the preparation method.

[0030] The third aspect of the present disclosure provides a display device, which includes the display panel of any one of the above first aspects or the display panel obtained by the preparation method of any one of the above second aspects. Description of the Drawings

[0031] Figure 1 It is a schematic plan view of a display panel provided by an embodiment of the present disclosure.

[0032] Figure 2 It is Figure 1 An enlarged view of region S1 of the shown display panel under a certain design.

[0033] Figure 3 It is Figure 2 A cross-sectional view of the shown display panel along M1-N1 under a certain design.

[0034] Figure 4 It is Figure 3 An enlarged view of portion A of the shown display panel.

[0035] Figure 5 It is Figure 2 A cross-sectional view of the shown display panel along M1-N1 under another design.

[0036] Figure 6 It is at Figure 2 A cross-sectional view of the shown display panel along M1-N1 under another design.

[0037] Figure 7Flow chart of a method for manufacturing a display panel provided by an embodiment of the present disclosure.

[0038] Figure 8 Partial flow chart of a method for manufacturing a display panel provided by an embodiment of the present disclosure.

[0039] Figure 9 Intermediate product of a display panel obtained by partial steps of a method for manufacturing a display panel provided by an embodiment of the present disclosure.

[0040] Figure 10 Intermediate product of a display panel obtained by partial steps of a method for manufacturing a display panel provided by an embodiment of the present disclosure.

[0041] Figure 11 Partial flow chart of a method for manufacturing a display panel provided by an embodiment of the present disclosure.

[0042] Figure 12 Partial flow chart of a method for manufacturing a display panel provided by an embodiment of the present disclosure.

[0043] Description of reference numerals: 10 - Display panel; 11 - Display area; 12 - Non - display area; 100 - Substrate; 200 - Light - emitting device; 210 - First electrode; 220 - Light - emitting functional layer; 221 - First functional layer; 222 - Light - emitting layer; 223 - Second functional layer; 230 - Second electrode; P1 - First light - emitting device; P2 - Second light - emitting device; P3 - Third light - emitting device; 300 - Isolation structure; 301 - Isolation opening; 310 - Support part; 320 - Crown part; 330 - Bottom part; 400 - Encapsulation structure; 400a - Encapsulation gap; 410 - First encapsulation layer; 411 - Encapsulation unit; 411a - First encapsulation unit; 411b - Second encapsulation unit; 411c - Third encapsulation unit; 412 - Edge - wrapping part; 412a - Covering part; 412b - Extending part; 412c - Connecting part; 413 - Encapsulation part; 414 - Initial encapsulation unit; 414a - Initial extending part; 420 - Second encapsulation layer; 430 - Third encapsulation layer; 500 - Filling layer; 600 - Pixel definition layer; 601 - Pixel opening. Detailed implementation manners

[0044] Next, the technical solutions in the embodiments of this specification will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this specification. Obviously, the described embodiments are only a part of the embodiments of this specification, rather than all the embodiments. Based on the embodiments in this specification, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this specification.

[0045] In the present disclosure, an isolation structure is provided at the gap between the light-emitting devices to separate the functional film layers of adjacent light-emitting devices. Thus, in the evaporation process of the functional film layer, it is only necessary to perform whole-surface evaporation on the display panel without the need to prepare the functional film layer of each light-emitting device separately with the aid of a mask plate. This process does not need to consider the problem of positioning accuracy during evaporation, so that the gap between the light-emitting devices can be designed to be smaller in size to increase the PPI.

[0046] However, in the display panel, each light-emitting device is packaged at the sub-pixel level, which means that the packaging units of the first packaging layer corresponding to each type of light-emitting device of the light-emitting color need to be etched and formed separately at an extremely small scale. In such a delicate operation, process control is difficult, and slight external interference or fluctuations in process parameters may affect the film quality. In the preparation process of the display panel, the packaging units of the light-emitting devices of the first type of light-emitting color that are first formed are prone to damage during the molding process, and in subsequent process steps, such as the formation of the light-emitting devices of the second type of light-emitting color, the packaging units corresponding to the light-emitting devices of the first type of light-emitting color are exposed to various environments, which are easily affected by factors such as physical impact and chemical pollution, which in turn causes the boundaries of the packaging units corresponding to the light-emitting devices of the first type of light-emitting color to peel off.

[0047] Therefore, in order to avoid damage to the packaging units of the light-emitting devices of the first light-emitting color, the packaging units corresponding to the light-emitting devices of different light-emitting colors are overlapped with each other, so that two layers of packaging units are superimposed at the position of the same isolation structure. Because the packaging units corresponding to the light-emitting devices of the second light-emitting color at least cover the edges of the packaging units corresponding to the light-emitting devices of the first light-emitting color, the packaging units corresponding to the light-emitting devices of the first light-emitting color are protected, thereby improving the problem of peeling at the boundaries of the packaging units corresponding to the light-emitting devices of the first light-emitting color. This will inevitably increase the film thickness at the isolation structure position, and the overlap between different packaging units requires a certain coverage area to ensure effective protection of the packaging units corresponding to the light-emitting devices of the first light-emitting color, which makes the space between adjacent packaging units that could have been used to maintain an appropriate gap occupied, and the gap between adjacent packaging units naturally narrows.

[0048] The film thickness at the isolation structure position is thickened, and during the bending process, it is difficult to deform evenly like a film layer of normal thickness. The thickened film layer will bear greater stress, and it is easy to crack or even break at the bend, thus affecting the bending performance of the entire product. At the same time, the gap between adjacent packaging units becomes narrower, which limits the mutual movement and deformation space of the film layers during bending. When bending, the film layers cannot adjust their positions freely, which will generate greater internal stress, resulting in peeling and misalignment between the film layers, further reducing the bending performance of the entire product, i.e. the display panel.

[0049] In view of this, at least one embodiment of the present disclosure provides a display panel, a method for manufacturing the same, and a display device to at least solve the above technical problems. The display panel includes a substrate, an isolation structure, a light-emitting device, a first encapsulation layer, and a filling layer. The isolation structure is located on the substrate, and the isolation structure encloses a plurality of isolation openings. The light-emitting device is located on the substrate and corresponds to the isolation openings respectively. At least a part of the light-emitting device is located in the corresponding isolation opening. The first encapsulation layer is located on the side of the isolation structure and the light-emitting device away from the substrate. The first encapsulation layer includes a plurality of encapsulation units, and the encapsulation units correspond to the isolation openings respectively to cover the light-emitting devices limited by the corresponding isolation openings. Adjacent encapsulation units are arranged at intervals. The filling layer is located on the side of the isolation structure away from the substrate and between adjacent encapsulation units. The edge of the encapsulation unit extends to the side of the isolation structure away from the substrate and is spaced from the isolation structure to form an encapsulation gap. The filling layer fills the gap between adjacent encapsulation units and at least a part of the encapsulation gap.

[0050] In this way, the filling layer formed in the display panel fills part or all of the encapsulation gap between the encapsulation unit and the isolation structure and the gap between the encapsulation units, thereby improving the bending performance of the display panel and reducing the risk of stress concentration at the encapsulation gap between the encapsulation unit and the isolation structure when the display panel is bent, and the problems of film layer cracks or peeling affecting the encapsulation effect, and further improving the product quality of the display panel.

[0051] Next, the structure of the display panel according to at least one embodiment of the present disclosure will be described in detail with reference to the accompanying drawings. In addition, in these drawings, a spatial rectangular coordinate system is established with the substrate as the reference to more intuitively present the positional relationship of the relevant structures in the display panel. In this spatial rectangular coordinate system, the X-axis and the Y-axis are parallel to the plane of the substrate, and the Z-axis is perpendicular to the plane of the substrate.

[0052] As Figure 1 、 Figure 2 、 Figure 3 shown, the planar region of the display panel 10 can be divided into a display area 11 and a non-display area 12 located on at least one side of the display area 11. Sub-pixels (which can be referred to as sub-pixels, etc.) can be arranged in the display area 11, such as P1, P2, and P3 sub-pixels. The physical structure of the sub-pixel can be the light-emitting device 200 in the following embodiments. Adjacent sub-pixels with different emitted light colors form a pixel (which can be referred to as a pixel unit, a large pixel, etc.). The arrangement density of the pixels in the display area 11 represents the pixel density PPI.

[0053] The physical structure of the display panel 10 includes a substrate 100, light-emitting devices 200, an isolation structure 300, a first encapsulation layer 410, and a filling layer 500. The isolation structure 300 is located on the substrate 100, and at least part of the isolation structure 300 is located in the display area 11. The isolation structure 300 encloses a plurality of isolation openings 301 located in the display area 11. The light-emitting devices 200 are located on the substrate 100 and correspond to the isolation openings 301 respectively. At least part of the light-emitting devices 200 is located in the corresponding isolation openings 301. The first encapsulation layer 410 is located on the side of the isolation structure 300 and the light-emitting devices 200 away from the substrate 100. The first encapsulation layer 410 includes a plurality of encapsulation units 411. The encapsulation units 411 correspond to the isolation openings 301 respectively to cover the light-emitting devices 200 limited by the corresponding isolation openings 301. Adjacent encapsulation units 411 are arranged at intervals. The filling layer 500 is located on the side of the isolation structure 300 away from the substrate 100 and between adjacent encapsulation units 411. The edge of the encapsulation unit 411 extends to the side of the isolation structure 300 away from the substrate 100 and is spaced from the isolation structure 300 to form an encapsulation gap 400a. The filling layer 500 fills the gap between adjacent encapsulation units 411 and at least part of the encapsulation gap 400a, such as the entire encapsulation gap 400a.

[0054] In the display panel 10, the filling layer 500 fills the encapsulation gap 400a between the encapsulation unit 411 and the corresponding isolation structure 300 and the gap between adjacent encapsulation units 411, so as to improve the problem that the bending performance of the display panel 10 is affected by the encapsulation gap 400a and the gap between the encapsulation units 411. For example, in the case where the light-emitting devices 200 are of multiple types emitting different-color light, the light-emitting devices 200 emitting different light are independently manufactured. However, the film layers (such as the evaporation film layer, for example, the light-emitting functional layer 220, etc.) in each light-emitting device 200 are evaporated over the entire surface of the display panel 10 during evaporation.

[0055] For example, the light-emitting devices 200 are classified into the first light-emitting device P1, the second light-emitting device P2, and the third light-emitting device P3 that emit different-color light. During the manufacturing process, the light-emitting devices 200 are manufactured in sequence. When manufacturing the first light-emitting device P1, the first light-emitting device P1 is formed in each isolation opening 301, and the first encapsulation layer 410 is formed to cover all the isolation openings 301. Then, the second electrode 230 and the light-emitting functional layer 220 of the first light-emitting device P1 in some of the isolation openings 301 (the isolation openings 301 for forming the second light-emitting device P2 and the third light-emitting device P3 in the final product) are removed to form an encapsulation structure 400 with an independent structure, that is, the encapsulation unit 411. The encapsulation unit 411 corresponds to the first light-emitting device P1. Based on this method, the second light-emitting device P2 and the third light-emitting device P3 are manufactured in sequence, and finally, as Figure 3The first encapsulation layer 410 formed by the encapsulation units 411 corresponding to all the light-emitting devices 200 shown.

[0056] For this process, reference can be made to the relevant descriptions in the following related embodiments, and details will not be elaborated here. In the above process, for example, an etching process is used during the formation of the second light-emitting device P2 and the third light-emitting device P3, which may have an adverse effect on the encapsulation unit 411 corresponding to the first light-emitting device P1 and is prone to peeling. The encapsulation unit 411 corresponding to the second light-emitting device P2 covers part of the edge of the encapsulation unit 411 corresponding to the first light-emitting device P1, providing protection and preventing the encapsulation unit 411 corresponding to the first light-emitting device P1 from being affected by the subsequent formation of the second light-emitting device P2 and the third light-emitting device P3. After all the light-emitting devices 200 are fabricated, the overlapping portions between adjacent encapsulation units 411 are removed, and the encapsulation gaps 400a between the encapsulation unit 411 and the isolation structure 300 and the gaps between the encapsulation units 411 are filled with the filling layer 500. Specifically, reference can be made to the introduction of the following preparation method, thereby protecting the encapsulation unit 411 while improving the bending performance of the display panel 10.

[0057] Based on the above embodiments, the present disclosure embodiments also introduce the specific design scheme of the filling layer 500, as follows.

[0058] In one embodiment of the present disclosure, as Figure 3 and Figure 4 shown, the distance from the surface of the filling layer 500 away from the substrate 100 to the substrate 100 is greater than the distance from the edge of the encapsulation unit 411 away from the surface of the substrate 100 to the substrate 100. The orthographic projection of the edge of the filling layer 500 on the substrate 100 is located within the orthographic projection of the isolation structure 300 on the substrate 100. The orthographic projections of the surface of the filling layer 500 away from the substrate 100 and the surface of the filling layer 500 close to the substrate 100 on the substrate 100 respectively cover the orthographic projection of the edge of the encapsulation unit 411 on the substrate 100. In this way, the structural design of the filling layer 500 not only increases the bonding strength between the filling layer 500 and the encapsulation unit 411, but also does not affect the encapsulation effect of the encapsulation unit 411. At the same time, it reduces the processing difficulty of the filling layer 500 and saves the production cost of the display panel 10.

[0059] For example, the upper edge of the filling layer 500 away from the surface of the isolation structure 300 covers at least part of the edge of the encapsulation unit 411 on the surface of the isolation structure 300, so as to increase the contact area between the filling layer 500 and the encapsulation unit 411, improve the bonding strength between the two, and improve the structural strength of the display panel 10. At the same time, the lower edge of the filling layer 500 close to the surface of the isolation structure 300 is filled in the encapsulation gap 400a between the encapsulation unit 411 and the isolation structure 300, and will not overflow onto the side wall of the isolation structure 300 and outside the edge of the encapsulation unit 411, so that the design of the filling layer 500 will not affect the encapsulation effect of the encapsulation unit 411 of the display panel 10 and improve the performance stability of the display panel 10.

[0060] In at least one embodiment of the present disclosure, the filling layer 500 is an organic filling layer 500. The organic filling layer 500 formed of an organic material generally has a certain flexibility and can adapt to the deformation of the display panel 10 during bending, folding, etc. to a certain extent. It can also serve as a buffer layer to absorb external impacts and stresses and reduce damage to the internal structure, thereby improving the reliability and durability of the display panel 10. At the same time, the process of preparing the organic filling layer 500 in the display panel 10 is relatively mature, thereby improving the production efficiency and product quality of the display panel 10.

[0061] In at least one embodiment of the present disclosure, the filling layer 500 is an optical adjustment layer. For example, the optical adjustment layer may have a microlens structure, or a scattering structure (such as particles or structures with scattering characteristics) or include a sub-film layer structure with different refractive indexes, so that while the organic filling layer 500 does not affect the propagation of the light emitted by the light-emitting layer of the display panel 10, it can play a role in filling and supporting, and at the same time improve the light-emitting efficiency and contrast of the display panel 10.

[0062] In at least one embodiment of the present disclosure, the filling layer 500 is a light-shielding layer. In this way, the light-shielding layer can effectively absorb and block the ambient light from outside the display area, reduce the reflection and scattering of the ambient light inside the panel. At the same time, when the light-emitting devices 200 corresponding to adjacent encapsulation units 411 emit light of different colors, the light-shielding layer can also accurately define the boundaries of each sub-pixel, prevent the light emitted by different color sub-pixels from interfering with each other, and avoid the occurrence of pixel color mixing phenomenon. Therefore, setting the organic filling layer 500 as a light-shielding layer can also improve the display effect of the display panel 10.

[0063] It should be noted that the display panel 10 in the embodiments of the present disclosure is not limited to the above structure. For example, the non-display area 12 can be the border of the display panel 10, but a bending area can be provided in the non-display area 12 so that at least part of the non-display area 12 is bent to the back of the display panel 10, so that the display panel 10 presents a narrow border or no border when in use. For example, the surface of the filling layer 500 away from the isolation structure 300 can be on the same horizontal plane as the surface of the encapsulation unit 411 away from the isolation structure 300. All of the above can be designed according to actual needs and will not be elaborated here.

[0064] In addition to designing the filling layer 500, the embodiments of the present disclosure also introduce the structure of the encapsulation unit 411, which is specifically as follows.

[0065] In an embodiment of the present disclosure, as Figure 4 shown, the encapsulation unit 411 includes a side-edge portion 412, and the side-edge portion 412 includes a covering portion 412a, an extending portion 412b, and a connecting portion 412c. The covering portion 412a covers the side wall of the isolation structure 300, the extending portion 412b extends to the side of the isolation structure 300 away from the substrate 100 and is spaced apart from the isolation structure 300, and the connecting portion 412c connects the covering portion 412a and the extending portion 412b. The orthographic projections of the extending portions 412b of adjacent encapsulation units 411 on the substrate 100 do not overlap each other, and the gap between the extending portion 412b and the surface of the isolation structure 300 away from the substrate 100 forms an encapsulation gap 400a, that is, the filling layer 500 fills the encapsulation gap 400a between the extending portion 412b of the encapsulation unit 411 and the isolation structure 300 and the gap between the extending portions 412b of adjacent encapsulation units 411.

[0066] In at least one embodiment of the present disclosure, the gap between the extending portions 412b of adjacent encapsulation units 411 is greater than or equal to 4 μm and less than or equal to 18 μm.

[0067] For example, the gap between the extending portions 412b of adjacent encapsulation units 411 is any one of 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, and 18 μm.

[0068] In at least one embodiment of the present disclosure, the length of the orthographic projection of the encapsulation gap 400a on the substrate 100 is greater than or equal to 1 μm and less than or equal to 2 μm, and the length of the orthographic projection of the encapsulation gap 400a on the substrate 100 refers to the length in the direction from the edge of the isolation structure 300 to the center of the isolation structure 300.

[0069] For example, the length of the orthographic projection of the encapsulation gap 400a on the substrate 100 is any one of 1 μm, 1.1 μm, 1.2 μm, 1.3 μm, 1.4 μm, 1.5 μm, 1.6 μm, 1.7 μm, 1.8 μm, 1.9 μm, and 2.0 μm.

[0070] The size of the gap between adjacent encapsulation units 411 and the encapsulation gap 400a between the encapsulation unit 411 and the corresponding isolation structure 300 in the embodiments of the present disclosure is not limited to the above examples, and varies according to the parameters of the corresponding process in the manufacturing process of the display panel 10 (specifically, refer to the following embodiments), which will not be elaborated herein.

[0071] In at least one embodiment of the present disclosure, as Figure 4 shown, the encapsulation unit 411 further includes an encapsulation portion 413, the encapsulation portion 413 covers the light-emitting device 200, and is connected to the covering portion 412a of the edge covering portion 412. The encapsulation portion 413 and the edge covering portion 412 together form the encapsulation unit 411. The orthographic projection of the encapsulation portion 413 on the substrate 100 falls within the orthographic projection of the isolation opening 301 on the substrate 100, that is, the encapsulation portion 413 completely covers the light-emitting device 200 within the isolation opening 301.

[0072] In one embodiment of the present disclosure, as Figure 3 shown, the light-emitting device 200 includes a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 stacked in sequence on the substrate 100, and at least a part of the light-emitting functional layer 220 of the light-emitting device 200 is located in the corresponding isolation opening 301. The height of the encapsulation gap 400a in the direction perpendicular to the substrate 100 is less than or equal to the sum of the thicknesses of the light-emitting functional layer 220 and the second electrode 230 of the corresponding light-emitting device 200. During the formation process of the light-emitting device 200, by controlling the etching process parameters of the corresponding light-emitting functional layer 220, the light-emitting functional layer 220 and the second electrode 230 within the encapsulation gap 400a are partially or completely removed, so as to form the height of the encapsulation gap 400a in the direction perpendicular to the substrate 100.

[0073] In at least one embodiment of the present disclosure, either the light-emitting functional layer 220 or the second electrode 230 is made of a material different from that of the filling layer 500, that is, any film layer included in either the light-emitting functional layer 220 or the second electrode 230 is not of the same layer and the same material as the filling layer 500.

[0074] For example, as Figure 3As shown, the light-emitting functional layer 220 may further include a first functional layer 221, a light-emitting layer 222, and a second functional layer 223. The first functional layer 221, the light-emitting layer 222, and the second functional layer 223 are sequentially stacked on the first electrode 210. The first functional layer 221 may include a hole injection layer, a hole transport layer, an electron blocking layer, etc. The second functional layer 223 may include an electron injection layer, an electron transport layer, a hole blocking layer, etc. It should be noted that since carriers (holes, electrons) mainly cross-talk between adjacent light-emitting devices 200 through the first functional layer 221, the isolation structure 300 needs to be arranged such that the first functional layers 221 of the respective light-emitting devices 200 are electrically disconnected from each other.

[0075] In at least one embodiment of the present disclosure, the second electrode 230 is electrically connected to the isolation structure 300, that is, the second electrodes 230 of the plurality of light-emitting devices 200 are connected to each other through the isolation structure 300 to act as a common electrode, thereby alleviating the voltage drop problem generated when driving the second electrode 230.

[0076] In one embodiment of the present disclosure, as Figure 5 shown, at least some of the light-emitting devices 200 include a first light-emitting device P1 and a second light-emitting device P2 that emit light of different colors, and the colors of the light emitted by adjacent light-emitting devices 200 are different. The encapsulation unit 411 includes at least a first encapsulation unit 411a and a second encapsulation unit 411b. The first encapsulation unit 411a corresponds to the first light-emitting device P1, and the second encapsulation unit 411b corresponds to the second light-emitting device P2. The encapsulation gap 400a corresponding to the first encapsulation unit 411a and the encapsulation gap 400a corresponding to the second encapsulation unit 411b have different heights perpendicular to the substrate 100.

[0077] For example, adjacent first encapsulation unit 411a and second encapsulation unit 411b are located on different sides of the same isolation structure 300. On the surface of the isolation structure 300 away from the substrate 100, the extension portions 412b of the adjacent first encapsulation unit 411a and the extension portions 412b of the second encapsulation unit 411b are arranged at intervals, and the gap between the extension portion 412b of the first encapsulation unit 411a and the isolation structure 300 forms an encapsulation gap 400a corresponding to the first encapsulation unit 411a. The height of the encapsulation gap 400a corresponding to the first encapsulation unit 411a is less than or equal to the thickness of the light-emitting functional layer 220 and the second electrode 230 of the first light-emitting device P1 corresponding to the first encapsulation unit 411a. The gap between the extension portion 412b of the second encapsulation unit 411b and the isolation structure 300 forms an encapsulation gap 400a corresponding to the second encapsulation unit 411b. The height of the encapsulation gap 400a corresponding to the second encapsulation unit 411b is less than or equal to the thickness of the light-emitting functional layer 220 and the second electrode 230 of the second light-emitting device P2 corresponding to the second encapsulation unit 411b. In the display panel 10, in order to achieve a better display effect, the light-emitting functional layers 220 corresponding to the light-emitting devices 200 with different light-emitting colors, such as the first light-emitting device P1 and the second light-emitting device P2, have different thicknesses to improve the performance of the corresponding light-emitting devices 200, such as luminous efficiency, brightness, etc. Therefore, the height of the encapsulation gap 400a corresponding to the first encapsulation unit 411a and the height of the encapsulation gap 400a corresponding to the second encapsulation unit 411b are different in the direction perpendicular to the substrate 100.

[0078] The embodiments of the present disclosure do not specifically limit the thickness of the light-emitting functional layers 220 corresponding to the first light-emitting device P1 and the second light-emitting device P2 with different light-emitting colors, which can be specifically designed according to product requirements and will not be elaborated here.

[0079] In at least one embodiment of the present disclosure, as Figure 5As shown, the light-emitting device 200 is classified into a first light-emitting device P1, a second light-emitting device P2, and a third light-emitting device P3 that emit different colors of light, and the light-emitting colors of the first light-emitting device P1, the second light-emitting device P2, and the third light-emitting device P3 are different. The first encapsulation unit 411a corresponding to the first light-emitting device P1 and the second encapsulation unit 411b corresponding to the adjacent second light-emitting device P2 are spaced apart by an isolation structure 300. The second encapsulation unit 411b corresponding to the second light-emitting device P2 and the third encapsulation unit 411c corresponding to the adjacent third light-emitting device P3 are spaced apart by another isolation structure 300. The above-mentioned one isolation structure 300 and another isolation structure 300 jointly limit an isolation opening 301. The corresponding filling layer 500 between the adjacent first encapsulation unit 411a and the second encapsulation unit 411b not only fills the gap between the first encapsulation unit 411a and the second encapsulation unit 411b, but also fills different encapsulation gaps 400a formed between the first encapsulation unit 411a and the second encapsulation unit 411b and the corresponding isolation structure 300. The corresponding filling layer 500 between the adjacent second encapsulation unit 411b and the third encapsulation unit 411c not only fills the gap between the second encapsulation unit 411b and the third encapsulation unit 411c, but also fills different encapsulation gaps 400a formed between the second encapsulation unit 411b and the third encapsulation unit 411c and the corresponding isolation structure 300. In addition, the filling layers 500 corresponding to different adjacent encapsulation units 411 are formed by the same process.

[0080] In at least one embodiment of the present disclosure, the light-emitting device 200 includes a red light-emitting device, a blue light-emitting device, and a green light-emitting device. For example, the first light-emitting device P1 is a red light-emitting device, the second light-emitting device P2 is a blue light-emitting device, and the third light-emitting device P3 is a green light-emitting device.

[0081] In one embodiment of the present disclosure, as Figure 3 and Figure 5 shown, the isolation structure 300 includes a support portion 310 and a crown portion 320. The support portion 310 is located between the crown portion 320 and the substrate 100, and the orthographic projection of the surface of the support portion 310 away from the substrate 100 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100. Thus, the width of the crown portion 320 is greater than the width of the support portion 310, thereby improving the isolation effect of the isolation structure 300.

[0082] In at least one embodiment of the present disclosure, the support portion 310 is a conductive structure, and the second electrode 230 is connected to the side surface of the support portion 310. The setting of the support portion 310 does not need to consider light transmission, so that it can have a relatively large design thickness (greater than that of the second electrode 230), that is, the sheet resistance of the support portion 310 is less than that of the second electrode 230. In this solution, the support portion 310 can be connected to the second electrode 230 of the light-emitting device 200 to share the same potential, thereby reducing the voltage drop generated on the second electrode 230.

[0083] In at least one embodiment of the present disclosure, as Figure 6 shown, the isolation structure 300 further includes a bottom portion 330, the bottom portion 330 is located between the support portion 310 and the substrate 100, and the orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the bottom portion 330 on the substrate 100.

[0084] In at least one embodiment of the present disclosure, the bottom portion 330 is a conductive structure, and the second electrode 230 is electrically connected to the portion of the surface of the bottom portion 330 away from the substrate 100 that is not covered by the support portion 310. Relative to the side wall of the support portion 310, the second electrode 230 is more likely to be deposited on the surface area of the bottom portion 330 away from the substrate 100, thereby reducing the impedance at the connection between the second electrode 230 and the isolation structure 300.

[0085] In at least one embodiment of the present disclosure, the orthographic projection of the bottom portion 330 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100.

[0086] In at least one embodiment of the present disclosure, as Figure 3 、 Figure 5 and Figure 6 shown, the display panel 10 further includes a pixel definition layer 600 located on the substrate 100. The pixel definition layer 600 includes pixel openings 601 corresponding one-to-one to the isolation openings 301, and at least a part of the light-emitting device 200 is located in the pixel openings 601.

[0087] In at least one embodiment of the present disclosure, the pixel definition layer 600 is an inorganic film layer. In the process of manufacturing the light-emitting device 200 based on the isolation structure 300, the pixel definition layer 600 does not need a relatively high thickness to accommodate the light-emitting device 200, which is beneficial to the thinning design of the display panel 10; in addition, as an inorganic film layer, the pixel definition layer 600 can have a relatively high bonding strength with the isolation structure 300 and the first electrode 210 to reduce the risk of the isolation structure 300 and the first electrode 210 falling off; in addition, the inorganic film layer has a high density and has a good barrier effect on water and gas to encapsulate and protect the first overlapping portion of the overlapping terminals.

[0088] In at least one embodiment of the present disclosure, the isolation structure 300 is located on the side of the pixel defining layer 600 away from the substrate 100.

[0089] In one embodiment of the present disclosure, as Figure 5 shown, the display panel 10 further includes a second encapsulation layer 420. The second encapsulation layer 420 is located on the side of the first encapsulation layer 410 away from the substrate 100, and the orthographic projection of the second encapsulation layer 420 on the substrate 100 covers the first encapsulation layer 410 and the organic filling layer 500.

[0090] In at least one embodiment of the present disclosure, the second encapsulation layer 420 is an organic film layer.

[0091] In one embodiment of the present disclosure, the display panel 10 further includes a third encapsulation layer 430. The third encapsulation layer 430 is located on the side of the second encapsulation layer 420 away from the substrate 100, and as Figure 5 shown, the orthographic projection of the third encapsulation layer 430 on the substrate 100 covers the orthographic projection of the second encapsulation layer 420 on the substrate 100.

[0092] In at least one embodiment of the present disclosure, the third encapsulation layer 430 is an inorganic film layer.

[0093] In one embodiment of the present disclosure, as Figure 3 shown in, such as 4, Figure 5 and Figure 6 shown, the encapsulation gap 400a is completely filled by a part of the filling layer 500.

[0094] The present disclosure does not introduce the solution in which a part of the encapsulation gap 400a is filled by the filling layer 500. According to actual production conditions and product requirements, by controlling the formation process of the filling layer 500, a part of the filling layer 500 may not completely fill the encapsulation gap 400a between the encapsulation unit 411 and the isolation structure 300, which can be designed according to actual needs and will not be elaborated here.

[0095] An embodiment of the present disclosure also provides a method for manufacturing a display panel. The manufacturing method includes: providing a substrate; forming an isolation structure on the substrate, wherein the isolation structure encloses a plurality of isolation openings; forming a light-emitting device and a packaging unit on the substrate, wherein the light-emitting device corresponds to the isolation opening respectively, and at least a part of the light-emitting device is located in the corresponding isolation opening, the packaging unit corresponds to the isolation opening respectively to cover the light-emitting device limited by the corresponding isolation opening, adjacent packaging units are arranged at intervals, the edge of the packaging unit extends to the side of the isolation structure away from the substrate and is spaced from the isolation structure to form a packaging gap, and all the packaging units form a first packaging layer; forming a filling layer based on the packaging unit, wherein the filling layer fills at least a part of the gap between adjacent packaging units and the packaging gap formed between the corresponding packaging unit and the isolation structure. Thus, in this manufacturing method, a filling layer is formed between adjacent packaging units during the manufacturing process. The filling layer not only fills the packaging gap between the packaging unit and the isolation structure, but also fills the gap between the packaging units, thereby improving the bending performance of the display panel.

[0096] At least one embodiment of the present disclosure provides a method for manufacturing the above display panel, which may include steps S100 to S400 as Figure 7 shown below. Specifically as follows.

[0097] S100, providing a substrate.

[0098] S200, forming an isolation structure on the substrate, wherein the isolation structure encloses a plurality of isolation openings.

[0099] S300, forming a light-emitting device and a packaging unit on the substrate, wherein the light-emitting device corresponds to the isolation opening respectively, and at least a part of the light-emitting device is located in the corresponding isolation opening, the packaging unit corresponds to the isolation opening respectively to cover the light-emitting device limited by the corresponding isolation opening, adjacent packaging units are arranged at intervals, the edge of the packaging unit extends to the side of the isolation structure away from the substrate and is spaced from the isolation structure to form a packaging gap, and all the packaging units form a first packaging layer.

[0100] S400, forming a filling layer based on the packaging unit, wherein the filling layer fills at least a part of the gap between adjacent packaging units and the packaging gap formed between the corresponding packaging unit and the isolation structure.

[0101] For the introduction of the substrate and the isolation structure in the display panel in the above steps S100 to S400, reference may be made to the above embodiments, and details are not described herein.

[0102] In at least one embodiment of the present disclosure, step S300 of forming a light-emitting device and a packaging unit on the substrate includes steps S310 to S370 as Figure 8 shown below. Specifically as follows.

[0103] S310, before forming the isolation structure on the substrate, form a plurality of first electrodes spaced apart from each other on the substrate.

[0104] S320, deposit a light-emitting material thin film and a conductive material thin film, the light-emitting material thin film and the conductive material thin film covering the isolation structure and the isolation opening, wherein the portions of the light-emitting material thin film and the conductive material thin film located in the isolation opening respectively form a light-emitting functional layer and a second electrode.

[0105] S330, deposit a packaging material film layer to cover the light-emitting device.

[0106] S340, form a first photoresist layer on the packaging material film layer, and perform a patterning process on the first photoresist layer to form a first photoresist pattern, the first photoresist pattern covering a part of the isolation opening.

[0107] S350, etch the packaging material film layer, the light-emitting material thin film and the conductive material thin film based on the first photoresist pattern, wherein the remaining part of the packaging material film layer is formed into an initial packaging unit, and the light-emitting functional layer and the second electrode not covered by the initial packaging unit are etched.

[0108] S360, repeat the above process to form a light-emitting device and an initial packaging unit at the isolation opening where no light-emitting device is formed, and adjacent initial packaging units partially overlap on the surface of the same isolation structure away from the substrate.

[0109] For example, as Figure 5 and Figure 9 shown, taking the display panel 10 as an example to sequentially form a first light-emitting device P1, a first packaging unit 411a corresponding to the first light-emitting device P1, a second light-emitting device P2, a second packaging unit 411b corresponding to the second light-emitting device P2, a third light-emitting device P3, and a third packaging unit 411c corresponding to the third light-emitting device P3, the structure of the intermediate product of the display panel 10 obtained according to the above steps S310 to S360 is as Figure 9As shown, the initial extension portions 414a of the corresponding initial encapsulation units 414 of the adjacent first encapsulation unit 411a and second encapsulation unit 411b partially overlap on the surface of the same isolation structure 300 away from the substrate 100 in this step, so that the initially formed initial encapsulation unit 414, such as the initial encapsulation unit 414 corresponding to the first light-emitting device P1, is protected by the initial encapsulation unit 414 corresponding to the subsequently formed second light-emitting device P2. In this way, the edge of the initial encapsulation unit 414 corresponding to the first light-emitting device P1 is covered and protected during the etching process of the second light-emitting device P2, thereby improving the encapsulation effect of the encapsulation unit 411 of the display panel 10. Similarly, the initial encapsulation unit 414 corresponding to the third light-emitting device P3 protects the initial encapsulation unit 414 corresponding to the second light-emitting device P2. Specifically, the initial extension portion 414a of the initial encapsulation unit 414 corresponding to the third light-emitting device P3 covers a part of the initial extension portion 414a of the initial encapsulation unit 414 corresponding to the second light-emitting device P2, thereby avoiding the etching process during the preparation of the third light-emitting device P3 from having an adverse effect on the edge of the initial encapsulation unit 414 corresponding to the second light-emitting device P2, that is, the edge of the initial extension portion 414a. At the same time, an encapsulation gap 400a is formed between the initial extension portion 414a corresponding to different initial encapsulation units 414 and the corresponding isolation structure 300, and the encapsulation gap 400a is formed during the etching process of forming the corresponding light-emitting device 200.

[0110] S370, at least remove the overlapping parts of the adjacent initial encapsulation units to obtain encapsulation units, and the adjacent encapsulation units are arranged at intervals, and all the encapsulation units constitute the first encapsulation layer.

[0111] For example, as Figure 10 shown, based on Figure 9 the intermediate product of the display panel 10 shown, remove the overlapping parts of the initial encapsulation unit 414 of the adjacent first light-emitting device P1 and the initial encapsulation unit 414 of the second light-emitting device P2 and the overlapping parts of the initial encapsulation unit 414 of the adjacent second light-emitting device P2 and the initial encapsulation unit 414 of the third light-emitting device P3, that is, remove the parts of the corresponding initial extension portions 414a of the initial encapsulation unit 414, so as to obtain the first encapsulation unit 411a, the second encapsulation unit 411b and the third encapsulation unit 411c. And the extension portion 412b of the first encapsulation unit 411a and the extension portion 412b of the adjacent second encapsulation unit 411b are arranged at intervals, and the extension portion 412b of the second encapsulation unit 411b and the extension portion 412b of the adjacent third encapsulation unit 411c are arranged at intervals. The above extension portion 412b is the remaining part after the initial extension portion 414a is removed, and different encapsulation gaps 400a are formed between the extension portion 412b and the corresponding isolation structure 300.

[0112] Thus, in the method for manufacturing a display panel including the above steps S310 to S370, a light-emitting device and a packaging unit are prepared according to the above steps. During the formation of the light-emitting device, the packaging unit formed later protects the initially formed packaging unit. For example, the initially formed packaging unit corresponding to the second light-emitting device covers the edge of the initially formed packaging unit corresponding to the first light-emitting device to protect the initially formed packaging unit corresponding to the first light-emitting device, and the initially formed packaging unit corresponding to the third light-emitting device covers the edge of the initially formed packaging unit corresponding to the second light-emitting device to protect the initially formed packaging unit corresponding to the second light-emitting device. This improves the effectiveness of the packaging unit and avoids its being affected by subsequent etching processes. Then, in step S370, the overlapping portions of the initially formed packaging units are removed, so that a gap is formed between adjacent packaging units and a packaging gap is formed between the packaging unit and the corresponding isolation structure. Thus, while protecting the packaging unit, especially the initially formed packaging unit, the problem that the thickness of the isolation structure is increased due to the overlap between the packaging units, affecting the bending ability, is also reduced.

[0113] In at least one embodiment of the present disclosure, step S350 etches the encapsulation material film layer, the light-emitting material thin film, and the conductive material thin film based on the first photoresist pattern, including steps S351 to S352 as shown Figure 11 below.

[0114] S351, based on the first photoresist pattern, dry-etch the encapsulation material film layer outside the first photoresist pattern. The remaining encapsulation material film layer covering the light-emitting device forms an encapsulation portion, the remaining encapsulation material film layer covering the sidewall of the isolation opening forms a covering portion, and the covering portion is connected to the encapsulation portion. The remaining encapsulation material film layer extending on the side of the isolation structure away from the substrate and spaced from the isolation structure forms an initial extension portion, and the portion of the encapsulation material film layer connecting the initial extension portion and the covering portion forms a connecting portion. The encapsulation portion, the covering portion, the connecting portion, and the initial extension portion form an initial packaging unit.

[0115] S352, based on the initial packaging unit, wet-etch the light-emitting material thin film and the conductive material thin film outside the initial packaging unit, and at least a part of the light-emitting material thin film and the conductive material thin film between the initial extension portion and the isolation structure to form an initial packaging gap between the initial extension portion and the isolation structure.

[0116] In at least one embodiment of the present disclosure, step S370 removes at least the overlapping portions of adjacent initial encapsulation units to obtain encapsulation units, including: removing at least the overlapping portions of the initial extension portions of adjacent encapsulation units to form the extension portions of the encapsulation units, where the gap between the extension portions and the isolation structure constitutes an encapsulation gap, and the extension length of the positive projection of the encapsulation gap on the substrate in the first direction is less than the extension length of the positive projection of the initial encapsulation gap on the substrate in the first direction, and the first direction is the direction from the edge of the isolation structure to the center of the isolation structure.

[0117] In at least one embodiment of the present disclosure, step S400 forms a filling layer based on the encapsulation units, including steps S410 to S430 as shown in Figure 12 and are specifically as follows.

[0118] S410, under preset conditions, apply a flowable filling material on the substrate formed with encapsulation units to form a filling layer film layer, where the filling layer film layer fills at least part of the encapsulation gap and the gap between adjacent encapsulation units, and the filling layer film layer covers the surface of the first encapsulation layer away from the substrate.

[0119] S420, form a second photoresist layer on the filling layer film layer, and perform a patterning process on the second photoresist layer to form a second photoresist pattern, where the second photoresist pattern covers the gap between adjacent encapsulation units and the part of the extension portion of the corresponding encapsulation unit close to the gap between the encapsulation units.

[0120] S430, etch the filling layer film layer based on the second photoresist pattern, where the remaining part of the filling layer film layer forms the filling layer.

[0121] For example, the specific structure of the filling layer obtained in step S430 can be referred to the above embodiments and will not be elaborated here.

[0122] In at least one embodiment of the present disclosure, the preset conditions include a protective gas environment, a preset pressure of 3000 ppm to 6000 ppm, and ultraviolet light with a wavelength in the range of 315 nm to 400 nm.

[0123] In at least one embodiment of the present disclosure, the preset conditions further include: irradiating with ultraviolet light with a wavelength in the range of 230 nm to 250 nm for a preset time.

[0124] In at least one embodiment of the present disclosure, the preset time is 0.01 s to 60 s.

[0125] For example, according to the filling condition of the filling layer, based on a protective gas environment, a preset pressure of 3000 ppm to 6000 ppm, and ultraviolet light with a wavelength in the range of 315 nm to 400 nm, ultraviolet light with a wavelength in the range of 230 nm to 250 nm is continuously irradiated for a preset time. In addition, regarding the specific selection of the ultraviolet wavelength, irradiation time, and specific pressure parameters and other conditions, they can be designed according to actual needs and will not be elaborated here.

[0126] In at least one embodiment of the present disclosure, the protective gas environment is a pure protective gas environment. For example, the protective gas environment can be a nitrogen environment, an argon environment, a carbon dioxide environment, etc.

[0127] In at least one embodiment of the present disclosure, the filling layer is an organic filling layer. In at least one embodiment of the present disclosure, the filling layer is an optical adjustment layer. In at least one embodiment of the present disclosure, the filling layer is a light-shielding layer. The introduction of the filling layer can refer to the above embodiments and will not be elaborated here.

[0128] In at least one embodiment of the present disclosure, the preparation method further includes: depositing a pixel defining material film layer before forming the isolation structure and after forming the first electrode; performing a patterning process on the pixel defining material film layer to form a pixel defining layer, wherein pixel openings are formed in the pixel defining layer, and the pixel openings correspond to the isolation openings one by one to expose at least a part of the first electrode.

[0129] In at least one embodiment of the present disclosure, the preparation method further includes: forming an organic encapsulation material on the side of the first encapsulation layer away from the substrate to form a second encapsulation layer, wherein the second encapsulation layer covers the first encapsulation layer and the filling layer. The specific structure of the display panel prepared by this method can refer to the relevant descriptions in the foregoing embodiments and will not be elaborated here.

[0130] In at least one embodiment of the present disclosure, the second encapsulation layer is an organic film layer. The specific structure of the display panel prepared by this method can refer to the relevant descriptions in the foregoing embodiments and will not be elaborated here.

[0131] In at least one embodiment of the present disclosure, the formation method of the second encapsulation layer includes inkjet printing. For example, the second encapsulation layer is an organic film layer. During the use of inkjet printing, the material levels off, enabling the second encapsulation layer to have a planarizing effect, thereby improving the quality of the subsequently formed third encapsulation layer and other structures. The specific setting manner of the second encapsulation layer prepared by this method in the display panel can refer to the relevant descriptions in the foregoing embodiments and will not be elaborated here.

[0132] At least one embodiment of the present disclosure provides a display device, which may include the display panel in the above embodiment or the display panel obtained by the manufacturing method in the above embodiment. For example, the display device may include structures such as a touch control structure, optical films (such as microlenses, polarizers), and a cover plate disposed on the light-emitting side of the display panel.

[0133] For example, the display device may be any product or component with a display function, such as a television, digital camera, mobile phone, watch, tablet computer, notebook computer, navigator, etc.

[0134] It should be understood that various forms of the processes shown above may be used, with steps reordered, added, or deleted. For example, the steps described in the present invention may be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved, and no limitations are imposed herein.

[0135] The above specific embodiments do not constitute a limitation on the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A display panel, characterized in that, Comprising: A substrate; An isolation structure located on the substrate, the isolation structure enclosing to form a plurality of isolation openings; Light-emitting devices located on the substrate and corresponding to the isolation openings respectively, at least part of the light-emitting devices being located in the corresponding isolation openings; A first encapsulation layer located on the side of the isolation structure and the light-emitting devices away from the substrate. Wherein, the first encapsulation layer includes a plurality of encapsulation units corresponding to the isolation openings respectively to cover the light-emitting devices limited by the corresponding isolation openings, and adjacent encapsulation units are arranged at intervals; and A filling layer located on the side of the isolation structure away from the substrate and between adjacent encapsulation units; Wherein, the edge of the encapsulation unit extends to the side of the isolation structure away from the substrate and is spaced from the isolation structure to form an encapsulation gap, and the filling layer fills the gap between adjacent encapsulation units and at least part of the encapsulation gap.

2. The display panel according to claim 1, wherein The distance from the surface of the filling layer away from the substrate to the substrate is greater than the distance from the surface of the edge of the encapsulation unit away from the substrate to the substrate. The orthographic projection of the edge of the filling layer on the substrate is located within the orthographic projection of the isolation structure on the substrate. The orthographic projections of the surface of the filling layer away from the substrate and the surface of the filling layer close to the substrate on the substrate respectively cover the orthographic projection of the edge of the encapsulation unit on the substrate.

3. The display panel according to claim 2, wherein The filling layer is an optical adjustment layer or a light-shielding layer.

4. The display panel according to claim 1, wherein The encapsulation unit includes a side-edge portion, and the side-edge portion includes a covering portion, an extending portion and a connecting portion. The covering portion covers the side wall of the isolation structure. The extending portion extends to the side of the isolation structure away from the substrate and is spaced from the isolation structure. The connecting portion connects the covering portion and the extending portion. Wherein, the orthographic projections of the extending portions of adjacent encapsulation units on the substrate do not overlap each other, and the gap between the extending portion and the surface of the isolation structure away from the substrate forms the encapsulation gap.

5. The display panel according to claim 4, characterized in that, The encapsulation unit further includes an encapsulating portion. Wherein, the encapsulating portion covers the light-emitting device and is connected to the covering portion of the side-edge portion, and the orthographic projection of the encapsulating portion on the substrate falls within the orthographic projection of the isolation opening on the substrate.

6. The display panel according to claim 5, wherein The light-emitting device includes a first electrode, a light-emitting functional layer and a second electrode stacked in sequence on the substrate, and at least part of the light-emitting functional layer of the light-emitting device is located in the corresponding isolation opening. Wherein, the height of the encapsulation gap in the direction perpendicular to the substrate is less than or equal to the sum of the thicknesses of the light-emitting functional layer and the second electrode of the corresponding light-emitting device, and either the light-emitting functional layer or the second electrode is made of a material different from that of the filling layer.

7. The display panel according to claim 5, wherein At least part of the light-emitting devices include a first light-emitting device and a second light-emitting device that emit light of different colors, and adjacent light-emitting devices emit light of different colors. The encapsulation unit at least includes a first encapsulation unit and a second encapsulation unit. The first encapsulation unit corresponds to the first light-emitting device, and the second encapsulation unit corresponds to the second light-emitting device. The encapsulation gaps corresponding to the first encapsulation unit and the encapsulation gaps corresponding to the second encapsulation unit have different heights perpendicular to the substrate.

8. The display panel according to claim 5, wherein The isolation structure includes a support portion and a crown portion. The support portion is located between the crown portion and the substrate, and the orthographic projection of the surface of the support portion away from the substrate on the substrate is located within the orthographic projection of the crown portion on the substrate.

9. The display panel according to claim 8, wherein The isolation structure further includes a bottom portion. The bottom portion is located between the support portion and the substrate, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the bottom portion on the substrate.

10. The display panel according to claim 9, wherein, It further includes a pixel defining layer located on the substrate. Among them, the pixel defining layer includes pixel openings corresponding one by one to the isolation openings, and at least part of the light-emitting device is located in the pixel openings.

11. The display panel according to claim 10, wherein It further includes a second encapsulation layer and a third encapsulation layer. Among them, the second encapsulation layer is located on the side of the first encapsulation layer away from the substrate. The orthographic projection of the second encapsulation layer on the substrate covers the orthographic projections of the first encapsulation layer and the filling layer on the substrate. The third encapsulation layer is located on the side of the second encapsulation layer away from the substrate, and the orthographic projection of the third encapsulation layer on the substrate covers the orthographic projection of the second encapsulation layer on the substrate.

12. The display panel according to any one of claims 1 to 11, characterized in that, The encapsulation gap is completely filled by a part of the filling layer.

13. A method for manufacturing a display panel, characterized in that, Comprising: Providing a substrate; Forming an isolation structure on the substrate, wherein the isolation structure encloses and forms a plurality of isolation openings; Forming a light-emitting device and an encapsulation unit on the substrate, wherein the light-emitting device corresponds to the isolation opening respectively, and at least part of the light-emitting device is located in the corresponding isolation opening. The encapsulation unit corresponds to the isolation opening respectively to cover the light-emitting device limited by the corresponding isolation opening. Adjacent encapsulation units are arranged at intervals. The edge of the encapsulation unit extends to the side of the isolation structure away from the substrate and is spaced from the isolation structure to form an encapsulation gap. All the encapsulation units form a first encapsulation layer; Forming a filling layer based on the encapsulation unit, wherein the filling layer fills at least part of the gap between adjacent encapsulation units and the encapsulation gap formed between the corresponding encapsulation unit and the isolation structure.

14. The preparation method according to claim 13, wherein The forming the light-emitting device and the encapsulation unit on the substrate includes: Before forming the isolation structure on the substrate, forming a plurality of first electrodes spaced apart from each other on the substrate; Depositing a light-emitting material thin film and a conductive material thin film. The light-emitting material thin film and the conductive material thin film cover the isolation structure and the isolation opening. Among them, the parts of the light-emitting material thin film and the conductive material thin film located in the isolation opening respectively form a light-emitting functional layer and a second electrode; Deposit a packaging material film layer to cover the light-emitting device; Form a first photoresist layer on the packaging material film layer, and perform a patterning process on the first photoresist layer to form a first photoresist pattern, where the first photoresist pattern covers part of the isolation opening; Etch the packaging material film layer, the light-emitting material thin film, and the conductive material thin film based on the first photoresist pattern. Among them, the remaining part of the packaging material film layer forms an initial packaging unit, and the light-emitting functional layer and the second electrode that are not covered by the initial packaging unit are etched; Repeat the above process to form the light-emitting device and the initial packaging unit at the isolation opening where the light-emitting device is not formed, and adjacent initial packaging units partially overlap on the surface of the same isolation structure away from the substrate; Remove at least the overlapping parts of adjacent initial packaging units to obtain the packaging units. Adjacent packaging units are spaced apart, and all the packaging units constitute a first packaging layer.

15. The preparation method according to claim 14, characterized in that, The etching of the packaging material film layer, the light-emitting material thin film, and the conductive material thin film based on the first photoresist pattern includes: Based on the first photoresist pattern, dry-etch the packaging material film layer outside the first photoresist pattern. The part of the remaining packaging material film layer covering the light-emitting device constitutes a packaging part, the part of the remaining packaging material film layer covering the side wall of the isolation opening constitutes a covering part, and the covering part is connected to the packaging part. The part of the remaining packaging material film layer extending on the side of the isolation structure away from the substrate and spaced apart from the isolation structure constitutes an initial extension part, and the part of the packaging material film layer connecting the initial extension part and the covering part constitutes a connecting part. The packaging part, the covering part, the connecting part, and the initial extension part constitute an initial packaging unit; Based on the initial packaging unit, wet-etch the light-emitting material thin film and the conductive material thin film outside the initial packaging unit, and at least part of the light-emitting material thin film and the conductive material thin film located between the initial extension part and the isolation structure to form an initial packaging gap between the initial extension part and the isolation structure.

16. The preparation method according to claim 15, wherein, The at least removing the overlapping parts of adjacent initial packaging units to obtain the packaging units includes: Remove at least the overlapping parts of the initial extension parts of adjacent packaging units to form an extension part of the packaging unit. The gap between the extension part and the isolation structure constitutes the packaging gap. The extension length of the positive projection of the packaging gap on the substrate in the first direction is less than the extension length of the positive projection of the initial packaging gap on the substrate in the first direction. The first direction is the direction from the edge of the isolation structure to the center of the isolation structure.

17. The preparation method according to claim 16, wherein The forming of a filling layer based on the packaging unit includes: Under preset conditions, a flowable filling material is coated on the substrate on which the encapsulation unit is formed to form a filling layer film layer, wherein the filling layer film layer fills at least a part of the encapsulation gap and the gap between adjacent encapsulation units, and the filling layer film layer covers the surface of the first encapsulation layer away from the substrate; A second photoresist layer is formed on the filling layer film layer, and a patterning process is performed on the second photoresist layer to form a second photoresist pattern, and the second photoresist pattern covers the gap between adjacent encapsulation units and the part of the extension of the corresponding encapsulation unit close to the gap between the encapsulation units; The filling layer film layer is etched based on the second photoresist pattern, wherein the remaining part of the filling layer film layer is formed into the filling layer.

18. The preparation method according to claim 17, wherein The preset conditions include a protective gas environment, a preset pressure of 3000 ppm to 6000 ppm, and ultraviolet light with a wavelength in the range of 315 nm to 400 nm.

19. The preparation method according to claim 18, wherein, The preset conditions further include irradiating with ultraviolet light with a wavelength in the range of 230 nm to 250 nm for a preset time, and the preset time is 0.01 s to 60 s.

20. A display device, characterized in that, A display panel according to any one of claims 1 to 12 or a display panel obtained by the manufacturing method according to any one of claims 13 to 19.

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