Display panel, display device and preparation method of display panel

Abstract

The embodiment of the invention provides a display panel, a display device and a preparation method of the display panel. The display panel includes: a substrate; the conductive layer is arranged on one side of the substrate, and the conductive layer comprises a connecting part and a shielding part; the isolation structure is arranged on the side, away from the substrate, of the conducting layer, an isolation opening and a light-transmitting opening are defined by the isolation structure, and at least part of the shielding part is exposed in the light-transmitting opening; and the first electrode layer comprises a first electrode which is at least partially arranged in the isolation opening, and the first electrode is electrically connected with the connecting part. According to the display panel provided by the embodiment of the invention, the display panel has relatively good light transmission performance and working stability.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, aiming to improve the light transmittance and working stability of the display panel.

[0005] An embodiment of the first aspect of the present application provides a display panel, comprising: a substrate; a conductive layer, arranged on one side of the substrate, the conductive layer comprising a connecting portion and a shielding portion; an isolation structure, arranged on a side of the conductive layer away from the substrate, the isolation structure encloses an isolation opening and a light-transmitting opening, at least part of the shielding portion is exposed in the light-transmitting opening; a first electrode layer, comprising a first electrode at least partly arranged in the isolation opening, the first electrode being electrically connected to the connecting portion.

[0006] According to an implementation of the first aspect of the present application, the connecting portion is provided with a connecting opening, the connecting opening is communicated with the isolation opening, and at least a portion of the first electrode is disposed in the connecting opening.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the conductive layer includes a transparent conductive material.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the conductive layer includes at least one of indium zinc oxide and indium tin oxide zinc oxide.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the connecting portion and the shielding portion are an integrated structure.

[0010] According to any of the aforementioned implementations of the first aspect of the present application, the isolation structure is disposed on a side of the connecting portion facing away from the substrate.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes an isolation body and an eaves portion located on a side of the isolation body facing away from the substrate, and the eaves portion is arranged to protrude from the isolation body toward the isolation opening.

[0012] According to any of the aforementioned implementations of the first aspect of the present application, the connecting portion extends into the isolation opening.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the insulator on the substrate is located within the orthographic projection of the connecting portion on the substrate.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the surface of the eaves portion facing the light-transmitting opening on the substrate is located within the orthographic projection of the surface of the isolating body facing away from the substrate on the substrate.

[0015] According to any of the aforementioned implementations of the first aspect of the present application, the cross-sectional area of ​​the light-transmitting opening increases in a direction away from the substrate.

[0016] According to any of the aforementioned implementations of the first aspect of the present application, an orthographic projection of the shielding portion on the substrate and an orthographic projection of the light-transmitting opening on the substrate are at least partially overlapped.

[0017] According to any of the aforementioned implementations of the first aspect of the present application, the orthographic projection of the shielding portion on the substrate is located within the orthographic projection of the light-transmitting opening on the substrate.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, there are multiple light-transmitting openings, and the multiple light-transmitting openings are arranged along the circumference of the isolation opening.

[0019] According to any of the aforementioned implementations of the first aspect of the present application, the orthographic projection of the light-transmitting opening on the substrate is rectangular, square, circular or irregular polygonal.

[0020] According to any of the aforementioned implementations of the first aspect of the present application, the orthographic projection of the light-transmitting opening on the substrate is ring-shaped, and the light-transmitting opening is arranged around at least a portion of the isolation opening.

[0021] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes a light-emitting layer, and the light-emitting layer includes a light-emitting unit located on a side of the first electrode facing the substrate.

[0022] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes a second electrode layer, and the second electrode layer includes a second electrode located on a side of the light-emitting unit facing the substrate.

[0023] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes a pixel defining portion disposed between the second electrode and the connecting portion.

[0024] According to any of the foregoing embodiments of the first aspect of the present application, the conductive layer is disposed on a side of the pixel defining portion away from the substrate, or the pixel defining portion is provided with a receiving groove, and at least a part of the conductive layer and the isolation structure are located in the receiving groove.

[0025] According to any of the foregoing embodiments of the first aspect of the present application, the display panel further includes a touch electrode on a side of the isolation structure away from the substrate, and a positive projection of the touch electrode on the substrate does not overlap with a positive projection of the light transmissive opening on the substrate.

[0026] According to any of the foregoing embodiments of the first aspect of the present application, a positive projection of the touch electrode on the substrate and a positive projection of the isolation structure on the substrate are at least partially overlapped.

[0027] According to any of the foregoing embodiments of the first aspect of the present application, a positive projection of the touch electrode on the substrate is located within a positive projection of the isolation structure on the substrate.

[0028] According to any of the foregoing embodiments of the first aspect of the present application, the display panel has a display area and a non-display area. The display area includes a first area and a second area. The isolation opening is located in the first area and the second area, and the light transmissive opening is located in the second area.

[0029] According to any of the foregoing embodiments of the first aspect of the present application, the light transmittance of the second area is greater than the light transmittance of the first area.

[0030] An embodiment of the first aspect of the present application further provides a display panel. The display panel has a display area and a non-display area. The display panel includes: a substrate; a conductive layer disposed on one side of the substrate. The conductive layer includes a connection portion and a shielding portion, and at least a part of the shielding portion is located in the non-display area; an isolation structure located in the display area and disposed on a side of the conductive layer away from the substrate. The isolation structure encloses an isolation opening; a first electrode layer including a first electrode disposed at least partially in the isolation opening, and the first electrode is electrically connected to the connection portion.

[0031] According to the embodiment of the first aspect of the present application, the connection portion and the shielding portion are an integral structure.

[0032] According to any of the foregoing embodiments of the first aspect of the present application, the isolation structure is disposed on a side of the connection portion away from the substrate.

[0033] According to any of the foregoing embodiments of the first aspect of the present application, the isolation structure further encloses a light transmissive opening, and a part of the shielding portion is exposed in the light transmissive opening.

[0034] According to any of the foregoing embodiments of the first aspect of the present application, the material of the conductive layer includes a transparent conductive material.

[0035] According to any of the foregoing embodiments of the first aspect of the present application, the conductive layer includes at least one of indium zinc oxide, indium tin oxide, or zinc oxide.

[0036] An embodiment of the second aspect of the present application provides a display device, which includes the display panel of any of the above embodiments.

[0037] An embodiment of the third aspect of the present application provides a method for manufacturing a display panel, including:

[0038] Sequentially forming a stacked conductive material layer and an isolation material layer on a substrate;

[0039] Performing a patterning process on the conductive material layer and the isolation material layer to form a conductive layer and an isolation structure. The conductive layer includes a connecting portion and a shielding portion that are connected to each other. The isolation structure is disposed on a side of the conductive layer away from the substrate. The isolation structure encloses an isolation opening and a light-transmitting opening, and at least a part of the shielding portion is exposed in the light-transmitting opening;

[0040] Preparing a first electrode layer, where the first electrode layer includes a first electrode disposed at least partially within the isolation opening, and the first electrode overlaps with the connecting portion.

[0041] According to the embodiment of the third aspect of the present application, in the step of performing a patterning process on the conductive material layer and the isolation material layer to form a conductive layer and an isolation structure, it includes:

[0042] Performing a patterning process on the isolation material layer to form a first preliminary structure, where the first preliminary structure is provided with an isolation preliminary opening and a light-transmitting opening, and at least a part of the conductive material layer is exposed from the isolation preliminary opening and the light-transmitting opening;

[0043] Performing a patterning process on the inner wall enclosing the isolation preliminary opening and the part of the conductive material layer exposed from the isolation preliminary opening to form an isolation structure and a conductive layer.

[0044] According to any of the foregoing embodiments of the third aspect of the present application, the isolation structure includes an isolation body and an eaves portion located on a side of the isolation body away from the substrate, and the eaves portion protrudes from the isolation body toward the isolation opening.

[0045] According to any of the foregoing embodiments of the third aspect of the present application, in the step of performing a patterning process on the isolation material layer to form a first preliminary structure, it includes:

[0046] Performing a dry etching process on the isolation material layer to form a first preliminary structure.

[0047] According to any of the foregoing embodiments of the third aspect of the present application, in the step of performing a patterning process on the inner wall of the first preliminary structure enclosing the isolation preliminary opening and the part of the conductive material layer exposed from the isolation preliminary opening, it includes:

[0048] The inner wall of the first preliminary structure enclosing the isolation preliminary opening and the part of the conductive material layer exposed from the isolation preliminary opening are wet-etched.

[0049] According to any of the aforementioned implementations of the third aspect of the present application, the step of patterning the conductive material layer and the isolation material layer to form the conductive layer and the isolation structure includes:

[0050] The isolation material layer and the conductive material layer are patterned to form a second preliminary structure and a conductive layer, wherein the second preliminary structure is provided with an isolation opening, and the second preliminary structure comprises a first preliminary isolation portion and a second preliminary isolation portion located on a side of the first preliminary isolation portion away from the substrate, and the second preliminary isolation portion is arranged to protrude from the first preliminary isolation portion toward the isolation opening;

[0051] The second preliminary structure is patterned to form an isolation structure, which includes an isolation body and an eaves portion located on a side of the isolation body away from the substrate, and the eaves portion is protruded from the isolation body toward the isolation opening.

[0052] According to any of the aforementioned implementations of the third aspect of the present application, the step of patterning the isolation material layer and the conductive material layer to form the second preliminary structure and the conductive layer includes:

[0053] Performing dry etching on the isolation material layer to form an isolation initial opening;

[0054] The inner wall enclosing the isolation primary opening and the part of the conductive material layer exposed from the isolation primary opening are wet-etched to form a second primary structure and a conductive layer.

[0055] According to any of the aforementioned implementations of the third aspect of the present application, the step of patterning the second preliminary structure to form an isolation structure includes:

[0056] The second preliminary structure is dry-etched to form an isolation structure.

[0057] According to any of the aforementioned embodiments of the third aspect of the present application, before the step of patterning the isolation material layer and the conductive material layer to form the second preliminary structure and the conductive layer, the step includes:

[0058] Forming a photoresist layer on the isolation material layer, the photoresist layer comprising a first thickness region, a second thickness region and a first hollow region, a portion of the isolation material layer is exposed from the first hollow region, and the thickness of the photoresist layer in the first thickness region is greater than the thickness of the photoresist layer in the second thickness region;

[0059] The step of patterning the isolation material layer and the conductive material layer to form a second preliminary structure and a conductive layer also includes:

[0060] Patterning the isolation material layer and the conductive material layer corresponding to the first hollow region to form a second preliminary structure and a conductive layer;

[0061] After the step of patterning the isolation material layer and the conductive material layer to form a second preliminary structure and a conductive layer, the following steps are further included:

[0062] Using an ashing process to remove the photoresist layer within the second thickness region to form a second hollow region;

[0063] In the step of patterning the second preliminary structure to form an isolation structure, the following steps are further included:

[0064] Patterning the second preliminary structure corresponding to the second hollow region to form an isolation structure.

[0065] According to any of the foregoing embodiments of the third aspect of the present application, in the step of forming a photoresist layer on the isolation material layer, the following steps are included:

[0066] Using a halftone mask to form a photoresist layer on the isolation material layer.

[0067] According to any of the foregoing embodiments of the third aspect of the present application, before the step of sequentially forming a stacked conductive material layer and an isolation material layer on the substrate, the following steps are further included:

[0068] Preparing a second electrode layer on the substrate, the second electrode layer including a plurality of second electrodes disposed at intervals;

[0069] Forming a pixel definition material layer on the second electrode layer;

[0070] In the step of sequentially forming a stacked conductive material layer and an isolation material layer on the substrate, the following steps are included: sequentially forming a stacked conductive material layer and an isolation material layer on the pixel definition material layer;

[0071] After the step of patterning the conductive material layer and the isolation material layer to form a conductive layer and an isolation structure, the following steps are further included:

[0072] Patterning the pixel definition material layer to form a pixel defining portion, the pixel defining portion being disposed between the second electrode and the connecting portion.

[0073] According to any of the foregoing embodiments of the third aspect of the present application, the display panel has a display area and a non-display area, and a partial shielding portion is located in the non-display area.

[0074] According to any of the foregoing embodiments of the third aspect of the present application, the substrate includes a power supply voltage signal line. After the step of forming a pixel definition material layer on the second electrode layer, the following steps are included:

[0075] Performing a hole-opening process on the pixel definition material layer and the substrate located in the non-display area to form a via hole, wherein at least a portion of the power supply voltage signal line is exposed from the via hole;

[0076] A stacked conductive material layer and an isolation material layer are sequentially formed on the pixel definition material layer, and at least a portion of the conductive material layer is located in the via hole and connected to the power supply voltage signal line.

[0077] The third aspect of the present application also provides a method for preparing a display panel, including:

[0078] forming a conductive material layer on a substrate;

[0079] performing patterning on the conductive material layer to form a conductive layer;

[0080] forming an isolation material layer on the conductive layer;

[0081] Patterning the isolation material layer to form a third preliminary structure, wherein the third preliminary structure is provided with an isolation preliminary opening and a light-transmitting opening, and at least a portion of the conductive layer is exposed from the light-transmitting opening;

[0082] The inner wall enclosing the isolation opening is patterned to form an isolation structure, wherein the isolation structure is provided with an isolation opening, and the isolation structure includes an isolation body and an eaves portion located on a side of the isolation body away from the substrate, wherein the eaves portion is protruded from the isolation body toward the isolation opening;

[0083] A first electrode layer is prepared, wherein the first electrode layer includes a first electrode at least partially disposed in the isolation opening, and the first electrode overlaps the isolation structure.

[0084] According to an implementation of the third aspect of the present application, the step of patterning the isolation material layer to form the third preliminary structure includes:

[0085] The isolation material layer is dry-etched to form a third preliminary structure.

[0086] According to any of the aforementioned implementations of the third aspect of the present application, the step of patterning the inner wall enclosing the initial isolation opening includes:

[0087] The inner wall of the third preliminary structure enclosing the isolation preliminary opening is wet-etched.

[0088] The third aspect of the present application also provides a method for preparing a display panel, including:

[0089] forming a conductive material layer on a substrate;

[0090] performing patterning on the conductive material layer to form a conductive layer;

[0091] forming an isolation material layer on the conductive layer;

[0092] The isolation material layer is patterned to form a fourth preliminary structure. The fourth preliminary structure is provided with an isolation opening. The fourth preliminary structure includes a third preliminary isolation portion and a fourth preliminary isolation portion located on a side of the third preliminary isolation portion away from the substrate. The fourth preliminary isolation portion protrudes from the third preliminary isolation portion toward the isolation opening;

[0093] The fourth preliminary structure is patterned to form an isolation structure. The isolation structure is provided with a light-transmitting opening, and at least part of the conductive layer is exposed from the light-transmitting opening. The isolation structure includes an isolation body and an eaves portion located on a side of the isolation body away from the substrate. The eaves portion protrudes from the isolation body toward the isolation opening;

[0094] A first electrode layer is prepared. The first electrode layer includes a first electrode disposed at least partially within the isolation opening, and the first electrode is overlapped with the isolation structure.

[0095] According to the embodiment of the third aspect of the present application, in the step of patterning the isolation material layer to form the fourth preliminary structure, it includes:

[0096] The isolation material layer is dry-etched to form an initial isolation opening;

[0097] The inner wall enclosing the initial isolation opening is wet-etched to form the fourth preliminary structure.

[0098] According to any of the foregoing embodiments of the third aspect of the present application, in the step of patterning the fourth preliminary structure to form the isolation structure, it includes:

[0099] The fourth preliminary structure is dry-etched to form the isolation structure.

[0100] According to any of the foregoing embodiments of the third aspect of the present application, before the step of patterning the isolation material layer to form the fourth preliminary structure, it includes:

[0101] A photoresist layer is formed on the isolation material layer. The photoresist layer includes a first thickness region, a second thickness region, and a first hollowed-out region. Part of the isolation material layer is exposed from the first hollowed-out region. The thickness of the photoresist layer in the first thickness region is greater than the thickness of the photoresist layer in the second thickness region;

[0102] In the step of patterning the isolation material layer to form the fourth preliminary structure, it further includes:

[0103] The isolation material layer corresponding to the first hollowed-out region is patterned to form the fourth preliminary structure;

[0104] After the step of patterning the isolation material layer to form the fourth preliminary structure, it further includes:

[0105] Using an ashing process to remove the photoresist layer in the second thickness region to form a second hollow region;

[0106] The step of patterning the fourth preliminary structure to form an isolation structure also includes:

[0107] The fourth preliminary structure corresponding to the second hollow area is patterned to form an isolation structure.

[0108] According to any of the aforementioned implementations of the third aspect of the present application, the step of forming a photoresist layer on the isolation material layer includes:

[0109] A photoresist layer is formed on the isolation material layer using a half-tone mask.

[0110] In a display panel provided in an embodiment of the present application, the display panel includes a substrate, a conductive layer, an isolation structure and a first electrode layer. The conductive layer is arranged on one side of the substrate, the conductive layer includes a connecting portion and a shielding portion, the isolation structure is arranged on the side of the conductive layer away from the substrate, the isolation structure encloses to form an isolation opening, the first electrode layer includes a first electrode at least partially arranged in the isolation opening, the isolation structure can be used to divide the sub-pixels of the display panel, and during the preparation of the display panel, the light-emitting material of the display panel can enter the connection opening through the isolation opening under the isolation effect of the isolation structure. The first electrode is electrically connected to the connecting portion, so that the first electrodes in adjacent isolation openings can be electrically connected to each other through the conductive layer to form a surface electrode, so as to facilitate the control of the first electrode in the display panel.

[0111] By opening a light-transmitting opening on the isolation structure, the display panel can have better light-transmitting ability. By exposing the shielding part of the conductive layer in the light-transmitting opening, the shielding part can better limit the signal in the substrate from passing through the light-transmitting opening and the crosstalk with the signal in the device arranged on the side of the shielding part away from the substrate. For example, the shielding part can better limit the signal in the substrate from passing through the light-transmitting opening and the crosstalk with the touch signal in the touch electrode on the side of the shielding part away from the substrate. The display panel can have better light-transmitting performance and better working stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0112] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0113] Figure 1 It is a structural schematic diagram of an isolation structure and a conductive layer provided in an embodiment of the present application;

[0114] Figure 2 It is a schematic structural diagram of an isolation structure and a conductive layer provided by another embodiment of the present application;

[0115] Figure 3 It is a partial cross-sectional view of a display panel provided by an embodiment of the present application;

[0116] Figure 4 It is a partial cross-sectional view of a display panel provided by another embodiment of the present application;

[0117] Figure 5 It is a partial cross-sectional view of a display panel provided by still another embodiment of the present application;

[0118] Figure 6 It is a schematic structural diagram of a display panel provided by an embodiment of the present application;

[0119] Figure 7 It is a partial cross-sectional view of a display panel provided by yet another embodiment of the present application;

[0120] Figure 8 It is a schematic flow diagram of a method for manufacturing a display panel provided by an embodiment of the present application;

[0121] Figures 9 to 23 It is a schematic diagram of the manufacturing process of a method for manufacturing a display panel provided by an embodiment of the present application;

[0122] Figure 24 It is a schematic flow diagram of a method for manufacturing a display panel provided by another embodiment of the present application;

[0123] Figures 25 to 33 It is a schematic diagram of the manufacturing process of a method for manufacturing a display panel provided by another embodiment of the present application;

[0124] Figure 34 It is a schematic flow diagram of a method for manufacturing a display panel provided by still another embodiment of the present application;

[0125] Figures 35 to 48 It is a schematic diagram of the manufacturing process of a method for manufacturing a display panel provided by still another embodiment of the present application.

[0126] Explanation of reference numerals:

[0127] 10. Display panel; 10a. Pixel definition material layer; 10b. Conductive material layer; 10c. Isolation material layer; 10d. First material layer; 10e. Second material layer; 10f. Initial isolation opening; 11. First initial structure; 12. Second initial structure; 12a. First initial isolation part; 12b. Second initial isolation part; 13. Third initial structure; 14. Fourth initial structure; 14a. Third initial isolation part; 14b. Fourth initial isolation part; 15. Photoresist layer; 15a. First thickness region; 15b. Second thickness region; 15c. First hollowed-out region; 15d. Second hollowed-out region;

[0128] 100. Substrate; 110. Substrate; 120. First insulating layer; 130. Second insulating layer; 140. Third insulating layer; 150. Driving circuit; 151. Transistor; 151a. Gate; 151b. Source-drain; 152. Storage capacitor; 152a. First electrode plate; 152b. Second electrode plate;

[0129] 200. Second electrode layer; 210. Second electrode;

[0130] 300. Pixel defining part; 300a. Accommodating groove;

[0131] 400. Conductive layer; 400a. Connection opening; 410. Connection part; 420. Shielding part;

[0132] 500. Isolation structure; 500a. Isolation opening; 500b. Light-transmitting opening; 510. Isolator; 520. Eave part;

[0133] 600. Light-emitting layer; 610. Light-emitting unit;

[0134] 700. First electrode layer; 710. First electrode;

[0135] 800. Encapsulation layer; 810. First encapsulation layer; 820. Second encapsulation layer; 830. Third encapsulation layer;

[0136] 900. Touch control component; 910. Touch control electrode; 920. Touch control signal line;

[0137] AA. Display area; AA1. First area; AA2. Second area;

[0138] NA. Non-display area. Detailed implementation manners

[0139] The features and exemplary embodiments of various aspects of the present application will be described in detail below. To make the objectives, technical solutions, and advantages of the present application clearer and more understandable, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only provided to provide a better understanding of the present application by showing examples of the present application.

[0140] It should be noted that in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the element.

[0141] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "above" or "over" another layer or another region, it may mean directly above the other layer or another region, or there may be other layers or regions between it and the other layer or another region. And if the component is flipped, this layer or region will be "below" or "beneath" the other layer or region.

[0142] Embodiments of the present application provide a display panel, a display device, and a manufacturing method of the display panel. The embodiments of the display panel, the display device, and the manufacturing method of the display panel will be described below with reference to the accompanying drawings.

[0143] Figure 1 It is a schematic structural diagram of an isolation structure 500 and a conductive layer 400 provided by an embodiment of the present application. Figure 2 It is a schematic structural diagram of an isolation structure 500 and a conductive layer 400 provided by another embodiment of the present application. Figure 3 It is a partial cross-sectional view of a display panel 10 provided by an embodiment of the present application.

[0144] Among them, Patent PCT / CN2023 / 134518, Patent 202310759370.2, Patent 202310740412.8, Patent 202310707209.0, and Patent 202311346196.5 record related technical solutions of the isolation structure, the content of which is incorporated herein by reference for reference and will not be elaborated in this embodiment.

[0145] As Figures 1 to 3 shown, an embodiment of the first aspect of the present application provides a display panel 10, including: a substrate 100; a conductive layer 400 disposed on one side of the substrate 100, the conductive layer 400 including a connection portion 410 and a shielding portion 420; an isolation structure 500 disposed on the side of the conductive layer 400 away from the substrate 100, the isolation structure 500 enclosing an isolation opening 500a and a light-transmitting opening 500b, and at least a part of the shielding portion 420 is exposed in the light-transmitting opening 500b; a first electrode layer 700 including at least a part of a first electrode 710 disposed in the isolation opening 500a, and the first electrode 710 is electrically connected to the connection portion 410.

[0146] In a display panel 10 provided by an embodiment of the present application, the display panel 10 includes a substrate 100, a conductive layer 400, an isolation structure 500, and a first electrode layer 700. The conductive layer 400 is disposed on one side of the substrate 100, the conductive layer 400 includes a connection portion 410 and a shielding portion 420, the isolation structure 500 is disposed on the side of the conductive layer 400 away from the substrate 100, the isolation structure 500 encloses an isolation opening 500a, the first electrode layer 700 includes at least a part of a first electrode 710 disposed in the isolation opening 500a, the isolation structure 500 can be used to divide sub-pixels of the display panel 10, and during the preparation process of the display panel 10, the light-emitting material of the display panel 10 can enter the connection opening 400a through the isolation opening 500a under the blocking effect of the isolation structure 500. The first electrode 710 is electrically connected to the connection portion 410, so that the first electrodes 710 in adjacent isolation openings 500a can be electrically connected to each other through the conductive layer 400 to form a planar electrode, facilitating the control of the first electrode 710 in the display panel 10.

[0147] By providing a light-transmitting opening 500b in the isolation structure 500, the display panel 10 can have better light-transmitting ability. By exposing the shielding portion 420 of the conductive layer 400 in the light-transmitting opening 500b, the shielding portion 420 can preferably limit the signal in the substrate 100 from generating crosstalk with the signal in the device disposed on the side of the shielding portion 420 away from the substrate 100 through the light-transmitting opening 500b. For example, the shielding portion 420 can preferably limit the signal in the substrate 100 from generating crosstalk with the touch signal in the touch electrode 910 on the side of the shielding portion 420 away from the substrate 100 through the light-transmitting opening 500b. While enabling the display panel 10 to have better light-transmitting performance, the display panel 10 can also have better working stability.

[0148] In some embodiments of the present application, the display panel 10 further includes a light-emitting layer 600, and the light-emitting layer 600 may include a light-emitting unit 610 located on the side of the first electrode 710 facing the substrate 100.

[0149] Optionally, the light-emitting unit 610 may include a hole injection layer (Hole Inject Layer, HIL), a hole transport layer (Hole Transport Layer, HTL), a light-emitting structure, an electron injection layer (Electron Inject Layer, EIL), and an electron transport layer (Electron Transport Layer, ETL).

[0150] Optionally, the display panel 10 further includes a second electrode layer 200, and the second electrode layer 200 includes a second electrode 210 located on the side of the light-emitting unit 610 facing the substrate 100.

[0151] In these optional embodiments, the first electrode layer 700 and the second electrode layer 200 can serve as the pixel electrode layer of the display panel 10. One of the first electrode 710 and the second electrode 210 can serve as the anode, and the other can serve as the cathode to drive the light-emitting unit 610 to emit light. In the embodiments of the present application, the first electrode 710 is taken as the cathode of the display panel 10, and the second electrode 210 is taken as the anode of the display panel 10 for illustration.

[0152] Optionally, the connecting portion 410 is provided with a connecting opening 400a, and the connecting opening 400a can communicate with the isolation opening 500a. At least a part of the first electrode 710 can be disposed in the connecting opening 400a to facilitate the lap joint between the first electrode 710 and the connecting portion 410 to achieve electrical connection.

[0153] Optionally, the connecting portion 410 and the shielding portion 420 are of an integral structure. When the first electrode 710 is electrically connected to the connecting portion 410, part of the current in the first electrode 710 can also be transmitted through the shielding portion 420, so as to reduce the resistance of the mutual electrical connection between adjacent first electrodes 710 through the conductive layer 400.

[0154] Optionally, the isolation structure 500 can be disposed on a side of the connecting portion 410 away from the substrate 100.

[0155] In some embodiments of the present application, the isolation structure 500 and the conductive layer 400 can be in a mesh shape. The hollowed-out areas in the mesh-shaped isolation structure 500 can form isolation openings 500a and light-transmitting openings 500b, and the hollowed-out areas in the mesh-shaped conductive layer 400 can form connection openings 400a.

[0156] Optionally, the number of the isolation openings 500a, the connection openings 400a, the first electrodes 710, the light-emitting units 610, and the second electrodes 210 can be multiple, and the isolation openings 500a, the connection openings 400a, the first electrodes 710, the light-emitting units 610, and the second electrodes 210 can be correspondingly arranged. For example, the orthographic projection of a single isolation opening 500a on the substrate 100 can at least partially overlap with the orthographic projection of a single connection opening 400a on the substrate 100, and the orthographic projections of the first electrodes 710, the light-emitting units 610, and the second electrodes 210 on the substrate 100 are not within the orthographic projection of the isolation opening 500a on the substrate 100, so that the sub-pixels in the display panel 10 can be divided corresponding to the isolation openings 500a and the connection openings 400a. Wherein, the orthographic projection of the isolation opening 500a on the substrate 100 can refer to the orthographic projection of the inner wall enclosing the isolation opening 500a on the substrate 100, and the orthographic projection of the connection opening 400a on the substrate 100 can refer to the orthographic projection of the inner wall enclosing the connection opening 400a on the substrate 100.

[0157] In some embodiments of the present application, there are various ways to set the shape of the light-transmitting opening 500b. In some optional embodiments, as Figure 1 shown, the number of the light-transmitting openings 500b is multiple, and the multiple light-transmitting openings 500b can be arranged along the circumferential side of the isolation opening 500a.

[0158] Optionally, the orthographic projection shape of the light-transmitting opening 500b on the substrate 100 can be at least one of a rectangle, a square, a circle, an ellipse, a polygon, and an irregular shape.

[0159] In these optional embodiments, by setting the number of the light-transmitting openings 500b to be multiple and spaced apart from each other, the light-transmitting openings 500b can have a smaller size, so as to facilitate the arrangement of the light-transmitting openings 500b on the isolation structure 500.

[0160] In some other optional embodiments, such as Figure 2 As shown, the orthographic projection of the light-transmitting opening 500b on the substrate 100 is annular, and the light-transmitting opening 500b is arranged around at least a portion of the isolation opening 500a. By arranging the light-transmitting opening 500b around at least a portion of the isolation opening 500a, the space around the isolation opening 500a can be more fully utilized to arrange the light-transmitting opening 500b, so that the light-transmitting opening 500b can have a more sufficient size, so as to further improve the light transmission performance of the display panel 10.

[0161] In some embodiments of the present application, the isolation structure 500 may be used to isolate materials of adjacent light-emitting units 610 and materials of adjacent first electrodes 710 during the manufacturing process of the display panel 10 .

[0162] In some optional embodiments, such as Figure 3 As shown, the isolation structure 500 may include an isolation body 510 and an eaves portion 520 located on a side of the isolation body 510 facing away from the substrate 100 , and the eaves portion 520 may be disposed to protrude from the isolation body 510 toward the isolation opening 500 a .

[0163] By arranging the eaves 520 of the isolation structure 500 to protrude from the isolation body 510 toward the isolation opening 500a, when the light-emitting layer 600 and the first electrode layer 700 of the display panel 10 are evaporated, the eaves 520 can block at least a portion of the material used to prepare the light-emitting layer 600 and the first electrode layer 700, so as to isolate the material of the light-emitting layer 600 and the first electrode layer 700 entering different isolation openings 500a, thereby facilitating the formation of a plurality of spaced-apart light-emitting units 610 and the first electrode 710, so that there is no need to set a mask with high precision when the light-emitting layer 600 and the first electrode layer 700 of the display panel 10 are evaporated, for example, there is no need to set a high-precision metal mask (Fine Metal Mask, FMM) when the light-emitting layer 600 and the first electrode layer 700 are evaporated, thereby reducing the production cost of the display panel 10.

[0164] In some optional embodiments, the first electrodes 710 in adjacent connection openings 400a can be electrically connected through the conductive layer 400, that is, the first electrodes 710 between adjacent sub-pixels can be electrically connected through the conductive layer 400, wherein each first electrode 710 can also be connected to the negative power supply voltage signal line in the display panel 10 through the conductive layer 400, so that the first electrode 710 can receive the negative power supply voltage signal (ELVSS) through the conductive layer 400 to realize the luminous display of the display panel 10, and can facilitate the control of the first electrode 710 in the display panel 10.

[0165] Optionally, the orthographic projection of the isolation body 510 on the substrate 100 is located within the orthographic projection of the connection portion 410 on the substrate 100. Optionally, the connection portion 410 can extend into the isolation opening 500a. For example, the connection portion 410 of the conductive layer 400 can protrude from the isolation body 510 toward the connection opening 400a, so as to facilitate the overlap between the connection portion 410 and the first electrode 710, and can increase the overlap area between the connection portion 410 and the first electrode 710, thereby being able to preferably reduce the overlap resistance between the connection portion 410 and the first electrode 710 and improve the operating stability of the display panel 10.

[0166] In these optional embodiments, the conductive layer 400 is connected to the negative power supply voltage signal line, which also enables the negative power supply voltage signal line to provide a relatively stable voltage to the conductive layer 400, thereby being able to preferably improve the shielding effect of the shielding portion 420 on the signals in the substrate 100 and the signals in the devices disposed on the side of the shielding portion 420 away from the substrate 100, so that the signals in the substrate 100 are not easily crosstalked with the signals in the devices disposed on the side of the shielding portion 420 away from the substrate 100.

[0167] In some embodiments of the present application, the shielding portion 420 can be used to shield any signal in the substrate 100 that is likely to crosstalk outward through the light-transmitting opening 500b. For example, the shielding portion 420 can be used to limit signals such as the light-emitting driving signal and the light-emitting control signal in the substrate 100 from crosstalking outward through the light-transmitting opening 500b.

[0168] Optionally, there are various ways to arrange the substrate 100. For example, the substrate 100 can include a substrate 110 and a driving circuit 150 disposed on the substrate 110. Optionally, the signals in the substrate 100 can refer to the signals in the driving circuit 150. Optionally, the substrate 100 can further include a first insulating layer 120, a second insulating layer 130, and a third insulating layer 140 stacked. Exemplarily, the driving circuit 150 can include transistors 151, storage capacitors 152, and driving signal lines for connecting various devices. The transistor 151 can include a semiconductor, a gate 151a, and source / drain electrodes 151b. The storage capacitor 152 can include a first electrode plate 152a and a second electrode plate 152b. As an example, the gate 151a and the first electrode plate 152a can be located on the side of the first insulating layer 120 facing the substrate 110, the second electrode plate 152b can be located between the first insulating layer 120 and the second insulating layer 130, and the source / drain electrodes 151b can be located between the second insulating layer 130 and the third insulating layer 140.

[0169] Figure 4 It is a partial cross-sectional view of a display panel 10 provided by another embodiment of the present application.

[0170] As Figure 4As shown, in some alternative embodiments, the display panel 10 further includes a touch control component 900 on the side of the isolation structure 500 away from the substrate 100. The touch control component 900 may include touch control electrodes 910, and the touch control electrodes 910 can be used to participate in implementing the touch control operation of the display panel 10. Among them, the shielding portion 420 disposed at the light-transmitting opening 500b can be used to limit the crosstalk between the signals in the substrate 100 and the signals in the touch control electrodes 910.

[0171] Optionally, the display panel 10 may further include a packaging layer 800 for packaging the light-emitting unit 610. For example, the packaging layer 800 may include a first packaging layer 810, a second packaging layer 820, and a third packaging layer 830. The touch control electrodes 910 may be located on the side of the third packaging layer 830 away from the substrate 100. The first packaging layer 810 may be located within the isolation opening 500a and cover the surface of the first electrode 710 and a part of the isolation structure 500. The second packaging layer 820 may be located on the side of the first packaging layer 810 away from the substrate 100. The third packaging layer 830 may be located on the side of the second packaging layer 820 away from the substrate 100. Among them, the material of the first packaging layer 810 may include an inorganic material to provide better packaging for the light-emitting unit 610. The material of the second packaging layer 820 may include an organic material, so that the second packaging layer 820 may have better fluidity to improve the packaging effect of the packaging layer 800 on the light-emitting unit 610. The material of the third packaging layer 830 may include an inorganic material.

[0172] Optionally, the orthographic projection of the touch control electrodes 910 on the substrate 100 does not overlap with the orthographic projection of the light-transmitting opening 500b on the substrate 100. For example, the orthographic projection of the touch control electrodes 910 on the substrate 100 and the orthographic projection of the isolation structure 500 on the substrate 100 are at least partially overlapped, so as to further prevent the signals in the substrate 100 from easily generating crosstalk with the signals in the touch control electrodes 910 through the light-transmitting opening 500b.

[0173] Optionally, the orthographic projection of the touch control electrodes 910 on the substrate 100 is located within the orthographic projection of the isolation structure 500 on the substrate 100, so as to further prevent the signals in the substrate 100 from easily generating crosstalk with the signals in the touch control electrodes 910 through the light-transmitting opening 500b.

[0174] In some alternative embodiments, the material of the conductive layer 400 may include a transparent conductive material. For example, the material of the conductive layer 400 may include at least one of indium zinc oxide (IZO), indium tin oxide (ITO), and zinc oxide, such that the conductive layer 400 may have good light transmittance, such that the shielding portion 420 disposed at the light-transmitting opening 500b is not likely to affect the light transmittance of the display panel 10, such that the photosensor can receive or emit light better through the shielding portion 420 and the light-transmitting opening 500b.

[0175] In some alternative embodiments, the orthographic projection of the surface of the eaves portion 520 facing the light-transmitting opening 500b on the substrate 100 is located within the orthographic projection of the surface of the spacer 510 facing away from the substrate 100 on the substrate 100.

[0176] Optionally, in the direction away from the substrate 100, the cross-sectional area of the light-transmitting opening 500b increases.

[0177] Optionally, the orthographic projection of the shielding portion 420 on the substrate 100 and the orthographic projection of the light-transmitting opening 500b on the substrate 100 are at least partially overlapped, for example, the orthographic projection of the shielding portion 420 on the substrate 100 is located within the orthographic projection of the light-transmitting opening 500b on the substrate 100.

[0178] In these alternative embodiments, by setting the orthographic projection of the surface of the eaves portion 520 facing the light-transmitting opening 500b on the substrate 100 to be located within the orthographic projection of the surface of the spacer 510 facing away from the substrate 100 on the substrate 100, that is, by reasonably setting the shape of the inner wall enclosing the light-transmitting opening 500b. For example, in the direction away from the substrate 100, the cross-sectional area of the light-transmitting opening 500b increases, such that the light-transmitting opening 500b can be formed by a dry etching process. When preparing the light-transmitting opening 500b, compared with using a wet etching process to prepare the light-transmitting opening 500b, using a dry etching process is not likely to cause excessive damage to the shielding portion 420 of the conductive layer 400 located below the light-transmitting opening 500b. For example, using a dry etching process is not likely to cause excessive damage to the shielding portion 420 including indium tin oxide material located below the light-transmitting opening 500b, such that the shielding portion 420 can have good structural stability, thereby enabling the shielding portion 420 to have good shielding stability for signals.

[0179] In some alternative embodiments, the display panel 10 may further include a pixel defining portion 300 disposed between the second electrode 210 and the connecting portion 410.

[0180] Optionally, the pixel defining portion 300 may cover the edge portion of the second electrode 210 facing the connecting portion 410.

[0181] In these alternative embodiments, by providing a pixel defining portion 300 between the second electrode 210 and the connection portion 410, insulation can be achieved between the second electrode 210 and the connection portion 410 through the pixel defining portion 300. As a result, it is less likely for a short circuit connection to occur between the second electrode 210 and the first electrode 710 through the conductive layer 400, and the light-emitting display reliability of the display panel 10 can be improved preferably.

[0182] In some embodiments of the present application, there are various ways to set the relative positions between the conductive layer 400 and the pixel defining portion 300.

[0183] In some alternative embodiments, as Figure 3 shown in Figure 4 , the conductive layer 400 can be disposed on the side of the pixel defining portion 300 away from the substrate 100, that is, the isolation structure 500 can also be disposed on the side of the pixel defining portion 300 away from the substrate 100.

[0184] Figure 5 FIG. 15 is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0185] In some other alternative embodiments, as Figure 5 shown in

[0186] Figure 6 , the pixel defining portion 300 is provided with a receiving groove 300a, and at least a part of the conductive layer 400 and the isolation structure 500 can be located in the receiving groove 300a, so that the isolation structure 500 is less likely to have an excessive height compared to the substrate 100, and thus the thickness of the display panel 10 can be reduced preferably.

[0187] As Figure 6 shown in

[0188] , in some embodiments of the present application, the display panel 10 has a display area AA and a non-display area NA. The connection opening 400a, the isolation opening 500a, and the light-transmitting opening 500b can be provided in the display area AA, and the light-emitting unit 610 corresponding to the connection opening 400a and the isolation opening 500a located in the display area AA can be used for light-emitting display.

[0189] Optionally, the first area AA1 and the second area AA2 may be provided with a connecting opening 400a, an isolating opening 500a and a light-emitting unit 610, so that the display panels 10 located in the first area AA1 and the second area AA2 may participate in realizing the light-emitting display work.

[0190] Optionally, the light-transmitting opening 500b may be only arranged in the second area AA2. The light-transmitting opening 500b located in the second area AA2 can better allow light to pass through, so that the second area AA2 can have better light transmittance, so that when the display panel 10 is applied to a display device, the photosensor in the display device can receive or emit light through the light-transmitting opening 500b.

[0191] Figure 7 It is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0192] Please combine Figures 1 to 6 Also see Figure 7 As shown, an embodiment of the first aspect of the present application further provides a display panel 10, the display panel 10 having a display area AA and a non-display area NA, the display panel comprising: a substrate 100; a conductive layer 400, arranged on one side of the substrate 100, the conductive layer 400 comprising a connecting portion 410 and a shielding portion 420, at least part of the shielding portion 420 being located in the non-display area NA; an isolation structure 500, arranged on a side of the conductive layer 400 away from the substrate 100, the isolation structure 500 encloses an isolation opening 500a; a first electrode layer 700, comprising a first electrode 710 at least partially arranged in the isolation opening 500a, the first electrode 710 being electrically connected to the connecting portion 410.

[0193] In a display panel 10 provided in an embodiment of the present application, the display panel 10 includes a substrate 100, a conductive layer 400, an isolation structure 500, and a first electrode layer 700. The conductive layer 400 is disposed on one side of the substrate 100, and the conductive layer 400 includes a connecting portion 410 and a shielding portion 420. The isolation structure 500 is disposed on a side of the conductive layer 400 away from the substrate 100. The isolation structure 500 encloses an isolation opening 500a. The first electrode layer 700 includes a first electrode 710 at least partially disposed in the isolation opening 500a. The isolation structure 500 can be used to divide the sub-pixels of the display panel 10. During the preparation of the display panel 10, the light-emitting material of the display panel 10 can enter the connection opening 400a through the isolation opening 500a under the isolation effect of the isolation structure 500. The first electrode 710 is electrically connected to the connecting portion 410 , so that the first electrodes 710 in adjacent isolation openings 500 a can be electrically connected to each other through the conductive layer 400 to form a surface electrode, so as to facilitate the control of the first electrode 710 in the display panel 10 .

[0194] By arranging at least a part of the shielding portion 420 in the non-display area NA, the shielding portion 420 can preferably limit the crosstalk between the signals in the substrate 100 and the signals in the device provided on the side of the shielding portion 420 away from the substrate 100. For example, the shielding portion 420 can preferably limit the crosstalk between the signals in the substrate 100 within the non-display area NA and the touch signals in the touch component 900 on the side of the shielding portion 420 away from the substrate 100.

[0195] Optionally, in a display panel 10 further provided in the embodiments of the first aspect of the present application, the structures of the substrate 100, the isolation structure 500, and the first electrode layer 700 can be the same as or similar to the structures of the substrate 100, the isolation structure 500, and the first electrode layer 700 in any of the foregoing embodiments respectively. For example, the first electrode 710 of the first electrode layer 700 can be used as the cathode of the display panel 10, and the isolation structure 500 can include an isolator 510 and an eaves portion 520 to preferably block and isolate the materials of the light-emitting layer 600 and the first electrode layer 700.

[0196] Optionally, the connecting portion 410 and the shielding portion 420 are of an integral structure, so that when the first electrode 710 is electrically connected to the connecting portion 410, the current in part of the first electrode 710 can also be transmitted through the shielding portion 420 to reduce the resistance of the adjacent first electrodes 710 being electrically connected to each other through the conductive layer 400. Moreover, when the conductive layer 400 is connected to the first electrode 710, the first electrode 710 can provide a relatively stable voltage to the conductive layer 400, thereby preferably enhancing the shielding and blocking effect of the shielding portion 420 on the signals between the signals in the substrate 100 and the signals in the device provided on the side of the shielding portion 420 away from the substrate 100, such that the signals in the substrate 100 are not easily crosstalked with the signals in the device provided on the side of the shielding portion 420 away from the substrate 100.

[0197] Optionally, the isolation structure 500 can be arranged on the side of the connecting portion 410 away from the substrate 100 to facilitate the overlap of the connecting portion 410 and the first electrode 710, thereby facilitating the electrical connection between the connecting portion 410 and the first electrode 710.

[0198] Optionally, in a display panel 10 further provided in the embodiments of the first aspect of the present application, the structure of the display panel 10 within the display area AA can refer to the structure of the display panel 10 in any of the foregoing embodiments, that is, the structure of the display panel 10 provided in yet another embodiment of the present application can be a structure in which part of the shielding portion 420 is extended to the non-display area NA on the basis of the display panel 10 in any of the foregoing embodiments.

[0199] For example, the isolation structure 500 can enclose to form a light-transmitting opening 500b, and a part of the shielding portion 420 can be exposed in the light-transmitting opening 500b, so that the shielding portion 420 can preferably limit the signal in the substrate 100 from generating crosstalk with the signal in the device disposed on the side of the shielding portion 420 away from the substrate 100 through the light-transmitting opening 500b.

[0200] Optionally, the material of the conductive layer 400 can include a transparent conductive material. For example, the material of the conductive layer 400 can include at least one of indium zinc oxide (IZO), indium tin oxide (ITO), and zinc oxide, so that the conductive layer 400 can have better light-transmitting performance, making it difficult for the shielding portion 420 disposed at the light-transmitting opening 500b to affect the light transmittance of the display panel 10, and enabling the photosensor to preferably receive or emit light through the shielding portion 420 and the light-transmitting opening 500b.

[0201] Optionally, the display panel 10 further includes a touch control component 900. The touch control component 900 can include touch control signal lines 920. At least a part of the touch control signal lines 920 can be located on the side of the shielding portion 420 away from the substrate 100 in the non-display area NA. The shielding portion 420 can preferably limit the signal in the substrate 100 from generating crosstalk with the signal of the touch control signal lines 920 disposed on the side of the shielding portion 420 away from the substrate 100 in the non-display area NA.

[0202] Optionally, the touch control component 900 can further include touch control electrodes 910. The touch control electrodes 910 can be located on the side of the isolation structure 500 away from the substrate 100. Among them, the shielding portion 420 disposed at the light-transmitting opening 500b can be used to limit the crosstalk between the signal in the substrate 100 and the signal in the touch control electrodes 910.

[0203] An embodiment of the second aspect of the present application provides a display device. The display device includes the display panel 10 in any of the above embodiments. Since the display device provided by the embodiment of the second aspect of the present application includes the display panel 10 in any of the above embodiments of the first aspect, the display device provided by the embodiment of the second aspect of the present application has the beneficial effects of the display panel 10 in any of the above embodiments of the first aspect, which will not be elaborated here.

[0204] The display device in the embodiments of the present application includes, but is not limited to, devices with a display function such as mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline telephones, and consoles.

[0205] Optionally, the display device may include a photosensitive sensor for sensing light. The photosensitive sensor may be disposed corresponding to the light-transmitting opening 500b. For example, at least a part of the orthographic projection of the photosensitive sensor on the substrate 100 is within the orthographic projection of the inner wall of the isolation structure 500 enclosing the light-transmitting opening 500b on the substrate 100, so that light can be better sensed by the photosensitive sensor through the light-transmitting opening 500b.

[0206] Optionally, there are various ways to set the type of the photosensitive sensor. For example, the photosensitive sensor may include components capable of sensing light, such as a distance sensor, a camera, an in-screen fingerprint recognition module, etc.

[0207] An embodiment of the third aspect of the present application provides a method for manufacturing a display panel 10. As Figures 1 to 6 shown, the display panel 10 may be the display panel 10 provided in any of the above first aspect embodiments. Please refer to Figures 9 to 22 and refer to Figure 8 shown. The manufacturing method includes:

[0208] Step S01: As Figures 9 to 11 shown, a stacked conductive material layer 10b and an isolation material layer 10c are sequentially formed on the substrate 100.

[0209] In some optional embodiments, before step S01, it may further include:

[0210] As Figure 9 shown, a second electrode layer 200 is prepared on the substrate 100. The second electrode layer 200 includes a plurality of second electrodes 210 arranged at intervals;

[0211] As Figure 10 shown, a pixel defining material layer 10a is formed on the second electrode layer 200.

[0212] In step S01, it may include: As Figure 11 shown, a stacked conductive material layer 10b and an isolation material layer 10c are sequentially formed on the pixel defining material layer 10a.

[0213] Optionally, the display panel 10 may have a display area AA and a non-display area NA. The substrate 100 includes power supply voltage signal lines. After the step of forming the pixel defining material layer 10a on the second electrode layer 200, it may include:

[0214] Performing an opening process on the pixel defining material layer 10a located in the non-display area NA and the substrate 100 to form a via hole, and at least a part of the power supply voltage signal lines are exposed from the via hole;

[0215] A conductive material layer 10b and an isolation material layer 10c are sequentially formed on the pixel defining material layer 10a in a stacked manner, and at least a part of the conductive material layer 10b is located in the via hole and connected to the power supply voltage signal line.

[0216] By setting at least a part of the conductive material layer 10b to be located in the via hole and connected to the power supply voltage signal line, after the preparation of the conductive layer 400 and the first electrode layer 700 is completed, the first electrode 710 of the first electrode layer 700 can be electrically connected to the power supply voltage signal line at the non-display area NA through the conductive layer 400, so that the first electrode 710 can receive a negative power supply voltage signal through the conductive layer 400, thereby realizing the light-emitting display of the display panel 10.

[0217] Step S02: As Figures 12 to 18 shown, the conductive material layer 10b and the isolation material layer 10c are patterned to form a conductive layer 400 and an isolation structure 500. The conductive layer 400 includes a connecting portion 410 and a shielding portion 420 that are connected to each other. The isolation structure 500 is disposed on a side of the conductive layer 400 facing away from the substrate 100. The isolation structure 500 encloses an isolation opening 500a and a light-transmitting opening 500b, and at least a part of the shielding portion 420 is exposed in the light-transmitting opening 500b.

[0218] Optionally, after step S02, it may further include: As Figure 14 and Figure 18 shown, the pixel defining material layer 10a is patterned to form a pixel defining portion 300. The pixel defining portion 300 is disposed between the second electrode 210 and the connecting portion 410.

[0219] By setting the pixel defining material layer 10a to be patterned only after step S02, that is, by setting the pixel defining material layer 10a to be patterned only after the etching preparation of the conductive layer 400 and the isolation structure 500 is completed, when the conductive layer 400 and the isolation structure 500 are etched and prepared, the pixel defining material layer 10a can better cover the surface of the second electrode 210, so that the etching material is not likely to cause etching damage to the second electrode 210, thereby being able to better improve the structural stability of the second electrode 210.

[0220] Step S03: As Figure 19 shown, the first electrode layer 700 is prepared. The first electrode layer 700 includes a first electrode 710 disposed at least partially in the isolation opening 500a. The first electrode 710 overlaps with the connecting portion 410.

[0221] Optionally, one of the first electrode 710 and the second electrode 210 can be used as the anode, and the other can be used as the cathode to drive the light-emitting unit 610 to emit light. In the embodiments of the present application, an example is given in which the first electrode 710 is the cathode of the display panel 10 and the second electrode 210 is the anode of the display panel 10.

[0222] In the manufacturing method provided by the embodiments of the present application, by setting the first electrode 710 to be electrically connected to the connection portion 410, adjacent first electrodes 710 can be electrically connected to each other through the conductive layer 400 to form a planar electrode, which is convenient for controlling the first electrode 710 in the display panel 10. By providing a light-transmitting opening 500b in the isolation structure 500, the display panel 10 can have better light-transmitting ability. By exposing the shielding portion 420 of the conductive layer 400 from the light-transmitting opening 500b, the shielding portion 420 can preferably limit the signal in the substrate 100 from generating crosstalk with the signal in the device disposed on the side of the shielding portion 420 away from the substrate 100 through the light-transmitting opening 500b. For example, the shielding portion 420 can preferably limit the signal in the substrate 100 from generating crosstalk with the touch signal in the touch electrode 910 disposed on the side of the shielding portion 420 away from the substrate 100 through the light-transmitting opening 500b, so that while the display panel 10 can have better light-transmitting performance, the display panel 10 can also have better working stability.

[0223] Optionally, a part of the shielding portion 420 can be located in the non-display area NA, so that the shielding portion 420 can preferably limit the signal in the substrate 100 from generating crosstalk with the signal in the device disposed on the side of the shielding portion 420 away from the substrate 100 in the non-display area NA. For example, the shielding portion 420 can preferably limit the signal in the substrate 100 located in the non-display area NA from generating crosstalk with the touch signal in the touch component 900 disposed on the side of the shielding portion 420 away from the substrate 100.

[0224] Optionally, in step S03, it may further include: preparing a light-emitting layer 600, and the light-emitting layer 600 includes a light-emitting unit 610 located on the side of the first electrode 710 facing the substrate 100.

[0225] Optionally, the material of the conductive material layer 10b may include a transparent conductive material. For example, the material of the conductive material layer 10b may include at least one of indium zinc oxide, indium tin oxide, and zinc oxide, so that the conductive layer 400 can have better light-transmitting performance, the shielding portion 420 disposed at the light-transmitting opening 500b is not likely to affect the light transmittance of the display panel 10, and the photosensor can preferably transmit or receive light through the shielding portion 420 and the light-transmitting opening 500b.

[0226] In some optional embodiments, the isolation structure 500 may include an isolation body 510 and an eaves 520 located on the side of the isolation body 510 facing away from the substrate 100, and the eaves 520 may be arranged to protrude from the isolation body 510 toward the isolation opening 500a. By arranging the eaves 520 of the isolation structure 500 to protrude from the isolation body 510 toward the isolation opening 500a, when the light-emitting layer 600 and the first electrode layer 700 of the display panel 10 are evaporated, the eaves 520 can shield at least part of the material used to prepare the light-emitting layer 600 and the first electrode layer 700, so as to form a plurality of light-emitting units 610 and the first electrode 710 arranged at intervals, so that when the light-emitting layer 600 and the first electrode layer 700 of the display panel 10 are prepared by evaporation, it is not necessary to set a mask with high precision, thereby being able to reduce the production cost of the display panel 10.

[0227] Optionally, the materials of the isolating body 510 and the eaves 520 may be different, so as to form a shape in which the eaves 520 protrudes from the isolating body 510 toward the isolating opening 500a. Exemplarily, in the direction away from the substrate 100, the isolating material layer 10c may include a first material layer 10d and a second material layer 10e stacked in sequence and made of different materials, wherein in step S02, when the isolating material layer 10c is patterned, the first material layer 10d may be used to form the isolating body 510, and the second material layer 10e may be used to form the eaves 520.

[0228] In some embodiments of the present application, there are multiple methods for forming the conductive layer 400 and the isolation structure 500 , that is, there are multiple configuration methods for step S02 .

[0229] In some optional embodiments, step S02 may include:

[0230] Step S021: Figure 12 As shown, the isolation material layer 10c is patterned to form a first preliminary structure 11. The first preliminary structure 11 is provided with an isolation preliminary opening 10f and a light-transmitting opening 500b. At least a portion of the conductive material layer 10b is exposed from the isolation preliminary opening 10f and the light-transmitting opening 500b.

[0231] Optionally, step S021 may include: performing a dry etching process on the isolation material layer 10c to form a first preliminary structure 11. The isolation material layer 10c is patterned by using a dry etching process to form a light-transmitting opening 500b. That is, compared with using a wet etching process to prepare the light-transmitting opening 500b, forming the light-transmitting opening 500b by using a dry etching process can reduce the etching damage effect of the etching material on the conductive material layer 10b below the isolation material layer 10c when etching the isolation material layer 10c. For example, when the isolation material layer 10c is patterned by using a dry etching process, the etching material in the dry etching process is not likely to cause excessive damage to the conductive material layer 10b including indium tin oxide material located below the light-transmitting opening 500b, so as to facilitate the formation of a shielding portion 420 of the conductive layer 400 exposed from the light-transmitting opening 500b with better structural stability, thereby enabling the shielding portion 420 to have better shielding stability for signals.

[0232] Step S022: As Figure 13 and Figure 14 shown, pattern the inner wall of the enclosure forming the isolation preliminary opening 10f and the part of the conductive material layer 10b exposed from the isolation preliminary opening 10f to form an isolation structure 500 and a conductive layer 400.

[0233] Optionally, step S022 may include: performing a wet etching process on the inner wall of the first preliminary structure 11 enclosing the isolation preliminary opening 10f and the part of the conductive material layer 10b exposed from the isolation preliminary opening 10f. In this step, the etching material in the wet etching process may be an etching solution, and the etching solution can etch the part of the conductive material layer 10b exposed from the isolation preliminary opening 10f. For example, the etching solution can etch the conductive material layer 10b including indium tin oxide material exposed in the opening well to etch and form a connection opening 400a. Moreover, the etching solution can also etch the inner wall enclosing the isolation preliminary opening 10f to form an isolation body 510, an eaves portion 520 protruding from the isolation body 510 toward the isolation opening 500a, and an isolation opening 500a formed by enclosing the isolation body 510 and the eaves portion 520.

[0234] Wherein, when the isolation material layer 10c includes a first material layer 10d and a second material layer 10e with different materials, the etching solution can etch a part of the first material layer 10d and the second material layer 10e that enclose to form the initial isolation opening 10f. Since the materials of the first material layer 10d and the second material layer 10e are different, the etching rate of the etching solution on the first material layer 10d is different from the etching rate of the etching solution on the second material layer 10e. That is, by reasonably setting the materials of the first material layer 10d and the second material layer 10e, for example, the material of the first material layer 10d may include aluminum, and the material of the second material layer 10e may include titanium, so that in one etching, the etching rate of the etching solution on the first material layer 10d can be greater than the etching rate of the etching solution on the second material layer 10e, so as to form a shape in which the eaves 520 protrude from the isolation body 510 toward the isolation opening 500a.

[0235] In some other alternative embodiments, step S02 may include:

[0236] Step S021: As Figure 15 and Figure 16 shown, pattern the isolation material layer 10c and the conductive material layer 10b to form a second initial structure 12 and a conductive layer 400. The second initial structure 12 is provided with an isolation opening 500a. The second initial structure 12 includes a first initial isolation portion 12a and a second initial isolation portion 12b located on the side of the first initial isolation portion 12a away from the substrate 100. The second initial isolation portion 12b protrudes from the first initial isolation portion 12a toward the isolation opening 500a.

[0237] Optionally, step S021 may include:

[0238] As Figure 15 shown, perform dry etching on the isolation material layer 10c to form an initial isolation opening 10f;

[0239] As Figure 16 shown, perform wet etching on the inner wall enclosing the initial isolation opening 10f and the part of the conductive material layer 10b exposed from the initial isolation opening 10f to form a second initial structure 12 and a conductive layer 400.

[0240] In this optional embodiment, by first patterning the isolation material layer 10c using a dry etching process to form the isolation primary opening 10f, it is possible to facilitate the subsequent use of a wet etching process to etch the inner wall surrounding the isolation primary opening 10f, so as to form a shape in which the second primary isolation portion 12b protrudes from the first primary isolation portion 12a toward the isolation opening 500a. In addition, it is also convenient to etch the portion of the conductive material layer 10b exposed from the isolation primary opening 10f using a wet etching process. For example, the etching solution can perform good etching on the conductive material layer 10b including the indium tin oxide material exposed in the opening.

[0241] Among them, when the isolation material layer 10c includes a first material layer 10d and a second material layer 10e of different materials, the first material layer 10d can be used to participate in forming the first initial isolation portion 12a, and the second material layer 10e can be used to participate in forming the second initial isolation portion 12b. When the second initial structure 12 is etched using a wet etching process, for example, when the etching liquid is used to etch the first material layer 10d and the second material layer 10e that enclose the initial isolation opening 10f, the specific etching principle of the wet etching process can be similar to the etching principle of the wet etching process in any of the aforementioned embodiments, that is, the etching rate of the etching liquid for different materials is different, and the shape of the second initial isolation portion 12b protruding from the first initial isolation portion 12a toward the isolation opening 500a can be prepared. For the convenience of description, the wet etching process mentioned in the following embodiments can also use the same etching principle to etch a specific shape, and this application will not go into too much detail about it.

[0242] Step S022: Figure 17 and Figure 18 As shown, the second preliminary structure 12 is patterned to form an isolation structure 500, the isolation structure 500 includes an isolation body 510 and an eaves portion 520 located on a side of the isolation body 510 away from the substrate 100, and the eaves portion 520 protrudes from the isolation body 510 toward the isolation opening 500a;

[0243] Optionally, step S022 may include: performing a dry etching process on the second initial structure 12 to form an isolation structure 500. By using a dry etching process to pattern the second initial structure 12 to form a light-transmitting opening 500b, that is, compared with using a wet etching process to prepare the light-transmitting opening 500b, forming the light-transmitting opening 500b by using a dry etching process can reduce the etching damage effect of the etching material on the conductive layer 400 below the second initial structure 12 when etching the second initial structure 12. For example, when using a dry etching process to pattern the second initial structure 12, the etching material in the dry etching process is not likely to cause excessive damage to the conductive layer 400 including indium tin oxide material located below the light-transmitting opening 500b, so as to facilitate the formation of a shielding portion 420 with good structural stability exposed from the light-transmitting opening 500b, thereby enabling the shielding portion 420 to have good shielding stability for signals.

[0244] In some alternative embodiments of the present application, when using a wet etching or dry etching process, a photoresist material may be coated on the surface at positions where etching is not required to play a protective role. Optionally, an ordinary mask plate may be used for coating the photoresist. For example, the coating of this photoresist material may be performed before step S021, and then after removing the original photoresist material before step S022, the coating of the photoresist material may be performed again. Alternatively, optionally, a device such as a half-tone mask (HTM) may be used for coating the photoresist to form a photoresist with a thickness variation.

[0245] Optionally, before step S021 may include: as Figure 20 shown, a photoresist layer 15 is formed on the isolation material layer 10c. The photoresist layer 15 includes a first thickness region 15a, a second thickness region 15b, and a first hollow region 15c. Part of the isolation material layer 10c is exposed from the first hollow region 15c. The thickness of the photoresist layer 15 in the first thickness region 15a is greater than the thickness of the photoresist layer 15 in the second thickness region 15b.

[0246] Optionally, the step of forming the photoresist layer 15 on the isolation material layer 10c may include: using a half-tone mask plate to form the photoresist layer 15 on the isolation material layer 10c.

[0247] In step S021, it may further include: as Figure 21 shown, patterning the isolation material layer 10c and the conductive material layer 10b corresponding to the first hollow region 15c to form the second initial structure 12 and the conductive layer 400;

[0248] After step S021, it may further include: as Figure 22As shown, the photoresist layer 15 in the second thickness region 15b is removed using an ashing process to form a second hollowed-out region 15d.

[0249] In step S022, it may further include: as Figure 23 shown, patterning the second initial structure 12 corresponding to the second hollowed-out region 15d to form an isolation structure 500.

[0250] In this alternative embodiment, the photoresist layer 15 is formed by using a halftone mask before patterning the isolation material layer 10c and the conductive layer 400, so that the photoresist layer 15 can have a first thickness region 15a, a second thickness region 15b, and a first hollowed-out region 15c with different thicknesses. In step S021, the etching material can etch the material exposed from the first hollowed-out region 15c. For example, a dry etching process can be first used to etch the isolation material layer 10c exposed from the first hollowed-out region 15c to etch out an initial isolation opening 10f, and then a wet etching method can be used to etch the inner wall enclosing the initial isolation opening 10f exposed from the first hollowed-out region 15c and a part of the conductive material layer 10b to etch out an isolation opening 500a and a connection opening 400a. After step S021, the photoresist layer 15 in the second thickness region 15b is removed using an ashing process to form a second hollowed-out region 15d, so that part of the second initial structure 12 can be exposed from the second hollowed-out region 15d, facilitating the process of patterning the part of the second initial structure 12 exposed from the second hollowed-out region 15d to form a light-transmitting opening 500b in step S022. In the foregoing steps, compared with using an ordinary mask for photoresist coating, when using a halftone mask for photoresist material coating, the coating times of the photoresist material can be reduced, and the preparation efficiency of the display panel 10 can be better improved.

[0251] An embodiment of the third aspect of the present application further provides a method for preparing a display panel 10. Please refer to Figures 25 to 33 and refer to Figure 24 as shown, the preparation method includes:

[0252] Step S01: As Figures 25 to 27 shown, a conductive material layer 10b is formed on the substrate 100.

[0253] Optionally, before step S01, it may further include:

[0254] As Figure 25 shown, a second electrode layer 200 is prepared on the substrate 100. The second electrode layer 200 includes a plurality of second electrodes 210 arranged at intervals;

[0255] As Figure 26As shown, a pixel defining material layer 10a is formed on the second electrode layer 200.

[0256] Step S01 may include: As Figure 27 shown, a conductive material layer 10b is formed on the pixel defining material layer 10a.

[0257] Step S02: As Figure 28 shown, the conductive material layer 10b is patterned to form a conductive layer 400.

[0258] Optionally, the material of the conductive material layer 10b may include a transparent conductive material. For example, the material of the conductive material layer 10b may include at least one of indium zinc oxide, indium tin oxide, and zinc oxide. That is, the material of the formed conductive layer 400 may include indium tin oxide, so that the conductive layer 400 may have better light transmittance performance, facilitating the photosensor to receive or emit light through the conductive layer 400.

[0259] Step S03: As Figure 29 shown, an isolation material layer 10c is formed on the conductive layer 400.

[0260] Step S04: As Figure 30 shown, the isolation material layer 10c is patterned to form a third primary structure 13. The third primary structure 13 is provided with an isolation primary opening 10f and a light-transmitting opening 500b, and at least part of the conductive layer 400 is exposed from the light-transmitting opening 500b.

[0261] Optionally, step S04 may include: performing a dry etching process on the isolation material layer 10c to form the third primary structure 13. By using the dry etching process to pattern the isolation material layer 10c to form the light-transmitting opening 500b, that is, compared with using the wet etching process to prepare the light-transmitting opening 500b, by using the dry etching process to form the light-transmitting opening 500b, the etching damage effect of the etching material on the conductive layer 400 below the isolation material layer 10c can be reduced when etching the isolation material layer 10c. For example, when using the dry etching process to pattern the isolation material layer 10c, the etching material in the dry etching process is not likely to cause excessive damage to the conductive layer 400 including indium tin oxide material located below the light-transmitting opening 500b, facilitating the formation of a conductive layer 400 with better structural stability exposed from the light-transmitting opening 500b, so that the conductive layer 400 has better shielding stability for signals.

[0262] Step S05: As Figure 31 and Figure 32As shown, the inner wall enclosing the isolation initial opening 10f is patterned to form an isolation structure 500. The isolation structure 500 is provided with an isolation opening 500a. The isolation structure 500 includes an isolation body 510 and a flange 520 located on the side of the isolation body 510 away from the substrate 100. The flange 520 is protruding from the isolation body 510 toward the isolation opening 500a.

[0263] By arranging the eaves 520 of the isolation structure 500 to protrude from the isolation body 510 toward the isolation opening 500a, when the light-emitting layer 600 and the first electrode layer 700 of the display panel 10 are evaporated, the eaves 520 can block at least a portion of the material used to prepare the light-emitting layer 600 and the first electrode layer 700, so as to form a plurality of spaced-apart light-emitting units 610 and the first electrode 710, so that there is no need to set a mask with high precision when the light-emitting layer 600 and the first electrode layer 700 of the display panel 10 are prepared by evaporation, thereby effectively reducing the production cost of the display panel 10.

[0264] Optionally, the materials of the isolating body 510 and the eaves 520 may be different, so as to form a shape in which the eaves 520 protrudes from the isolating body 510 toward the isolating opening 500a. Exemplarily, in the direction away from the substrate 100, the isolating material layer 10c may include a first material layer 10d and a second material layer 10e stacked in sequence and having different materials, wherein in step S05, when the isolating material layer 10c is patterned, the first material layer 10d may be used to form the isolating body 510, and the second material layer 10e may be used to form the eaves 520.

[0265] Optionally, step S05 may include: wet etching the inner wall of the third preliminary structure 13 enclosing the primary isolation opening 10f. In this step, the etching material in the wet etching process may be an etching liquid, and the etching liquid may etch the first material layer 10d and the second material layer 10e that enclose the primary isolation opening 10f. Since the materials of the first material layer 10d and the second material layer 10e are different, the etching rate of the first material layer 10d by the etching liquid is different from the etching rate of the second material layer 10e by the etching liquid, that is, by reasonably setting the materials of the first material layer 10d and the second material layer 10e, for example, the material of the first material layer 10d may include aluminum, and the material of the second material layer 10e may include titanium, so that in one etching, the etching rate of the first material layer 10d by the etching liquid can be greater than the etching rate of the second material layer 10e by the etching liquid, so as to form a shape where the eaves 520 protrudes from the isolation body 510 toward the isolation opening 500a.

[0266] Optionally, after step S05, the following steps may be further included: Figure 32As shown, the pixel defining material layer 10a is patterned to form a pixel defining portion 300, and the pixel defining portion 300 is disposed between the second electrode 210 and the isolation structure 500.

[0267] The second electrode 210 and the isolation structure 500 can be insulated through the pixel defining portion 300, so that the second electrode 210 and the first electrode 710 are not easily short-circuited through the isolation structure 500. By setting the patterning process of the pixel defining material layer 10a after step S05, that is, by setting the patterning process of the pixel defining material layer 10a after the etching preparation of the conductive layer 400 and the isolation structure 500 is completed, when etching and preparing the conductive layer 400 and the isolation structure 500, the pixel defining material layer 10a can better cover the surface of the second electrode 210, so that the etching material is not easily etched and damaged to the second electrode 210, thereby being able to better improve the structural stability of the second electrode 210.

[0268] Step S06: As Figure 33 shown, a first electrode layer 700 is prepared. The first electrode layer 700 includes a first electrode 710 disposed at least partially within the isolation opening 500a, and the first electrode 710 overlaps with the isolation structure 500.

[0269] Optionally, one of the first electrode 710 and the second electrode 210 can be used as the anode, and the other can be used as the cathode to drive the light-emitting unit 610 to emit light. In the embodiment of the present application, the first electrode 710 is used as the cathode of the display panel 10, and the second electrode 210 is used as the anode of the display panel 10 for illustration.

[0270] Optionally, step S06 may further include: preparing a light-emitting layer 600, and the light-emitting layer 600 includes a light-emitting unit 610 located on the side of the first electrode 710 facing the substrate 100.

[0271] In the manufacturing method provided by the embodiments of the present application, by arranging the first electrode 710 to overlap with the isolation structure 500, adjacent first electrodes 710 can be electrically connected to each other through the isolation structure 500 to form a planar electrode, facilitating the control of the first electrode 710 in the display panel 10. By forming a light-transmitting opening 500b in the isolation structure 500, the display panel 10 can have better light-transmitting ability. By exposing at least part of the conductive layer 400 from the light-transmitting opening 500b, the conductive layer 400 can better prevent signals in the substrate 100 from generating crosstalk with signals in the device disposed on the side of the conductive layer 400 away from the substrate 100 through the light-transmitting opening 500b. For example, the conductive layer 400 can better prevent signals in the substrate 100 from generating crosstalk with touch signals in the touch electrode 910 on the side of the shielding portion 420 away from the substrate 100 through the light-transmitting opening 500b. While enabling the display panel 10 to have better light-transmitting performance, the display panel 10 can also have better working stability.

[0272] An embodiment of the third aspect of the present application further provides a manufacturing method of a display panel 10. Please refer to Figures 35 to 48 and refer to Figure 34 as shown. The manufacturing method includes:

[0273] Step S01: As Figures 35 to 37 shown, form a conductive material layer 10b on the substrate 100.

[0274] Optionally, before step S01, it may further include:

[0275] As Figure 35 shown, prepare a second electrode layer 200 on the substrate 100. The second electrode layer 200 includes a plurality of second electrodes 210 arranged at intervals;

[0276] As Figure 36 shown, form a pixel definition material layer 10a on the second electrode layer 200.

[0277] In step S01, it may include: As Figure 37 shown, form a conductive material layer 10b on the pixel definition material layer 10a.

[0278] Step S02: As Figure 38 shown, perform patterning on the conductive material layer 10b to form a conductive layer 400.

[0279] Optionally, the material of the conductive material layer 10b may include a transparent conductive material. For example, the material of the conductive material layer 10b may include at least one of indium zinc oxide, indium tin oxide, and zinc oxide. That is, the material of the formed conductive layer 400 may include indium tin oxide, enabling the conductive layer 400 to have better light-transmitting performance, facilitating the photosensor to receive or emit light through the conductive layer 400.

[0280] Step S03: As shown in Figure 39 , an isolation material layer 10c is formed on the conductive layer 400.

[0281] Step S04: As shown in Figure 40 and Figure 41 , the isolation material layer 10c is patterned to form a fourth primary structure 14. The fourth primary structure 14 is provided with an isolation opening 500a. The fourth primary structure 14 includes a third primary isolation portion 14a and a fourth primary isolation portion 14b located on a side of the third primary isolation portion 14a away from the substrate 100. The fourth primary isolation portion 14b protrudes from the third primary isolation portion 14a toward the isolation opening 500a.

[0282] Optionally, step S04 may include:

[0283] As shown in Figure 40 , the isolation material layer 10c is dry-etched to form an isolation primary opening 10f;

[0284] As shown in Figure 41 , the inner wall enclosing the isolation primary opening 10f is wet-etched to form the fourth primary structure 14.

[0285] In this optional embodiment, by first using a dry-etching process to pattern the isolation material layer 10c to form the isolation primary opening 10f, it is convenient to subsequently use a wet-etching process to etch the inner wall enclosing the isolation primary opening 10f, so as to form a shape in which the fourth primary isolation portion 14b protrudes from the third primary isolation portion 14a toward the isolation opening 500a.

[0286] The isolation material layer 10c may include a first material layer 10d and a second material layer 10e of different materials. The first material layer 10d may be used to participate in forming the third initial isolation portion 14a, and the second material layer 10e may be used to participate in forming the fourth initial isolation portion 14b. When the fourth initial structure 14 is etched using a wet etching process, for example, when an etching liquid is used to etch the first material layer 10d and the second material layer 10e that enclose the initial isolation opening 10f, since the materials of the first material layer 10d and the second material layer 10e are different, the etching liquid has a certain effect on the initial isolation portion 14b. The etching rate of the first material layer 10d is different from the etching rate of the etching solution on the second material layer 10e. That is, by reasonably setting the materials of the first material layer 10d and the second material layer 10e, for example, the material of the first material layer 10d may include aluminum, and the material of the second material layer 10e may include titanium, so that in one etching, the etching rate of the etching solution on the first material layer 10d can be greater than the etching rate of the etching solution on the second material layer 10e, so as to form a shape in which the fourth initial isolation portion 14b protrudes from the third initial isolation portion 14a toward the isolation opening 500a.

[0287] Step S05: Figure 42 and Figure 43 As shown, the fourth initial structure 14 is patterned to form an isolation structure 500, and the isolation structure 500 is provided with a light-transmitting opening 500b, and at least a portion of the conductive layer 400 is exposed from the light-transmitting opening 500b. The isolation structure 500 includes an isolation body 510 and an eaves 520 located on the side of the isolation body 510 away from the substrate 100, and the eaves 520 is protruding from the isolation body 510 toward the isolation opening 500a.

[0288] Optionally, step S05 may include: performing dry etching on the fourth preliminary structure 14 to form an isolation structure 500. The fourth preliminary structure 14 is patterned by using a dry etching process to form a light-transmitting opening 500b, that is, compared with preparing the light-transmitting opening 500b by a wet etching process, the light-transmitting opening 500b is formed by using a dry etching process, which can reduce the etching damage effect of the etching material on the conductive layer 400 below the fourth preliminary structure 14 when etching the fourth preliminary structure 14. For example, when the fourth preliminary structure 14 is patterned by using a dry etching process, the etching material in the dry etching process is not likely to cause excessive damage to the conductive layer 400 including the indium tin oxide material located below the light-transmitting opening 500b, so as to form a conductive layer 400 with good structural stability exposed from the light-transmitting opening 500b, so that the conductive layer 400 has good shielding stability to the signal.

[0289] Moreover, by disposing the eaves 520 of the isolation structure 500 to protrude from the isolation body 510 toward the isolation opening 500a, at least part of the materials for preparing the light-emitting layer 600 and the first electrode layer 700 can be blocked by the eaves 520 when vapor-depositing the light-emitting layer 600 and the first electrode layer 700 of the display panel 10, so as to facilitate the formation of a plurality of spaced-apart light-emitting units 610 and the first electrode 710, such that there is no need to provide a mask with high precision when vapor-depositing and preparing the light-emitting layer 600 and the first electrode layer 700 of the display panel 10, thereby being able to better reduce the manufacturing cost of the display panel 10.

[0290] Optionally, after step S05, it may further include: As Figure 43 shown, patterning the pixel defining material layer 10a to form a pixel defining portion 300, and the pixel defining portion 300 is disposed between the second electrode 210 and the isolation structure 500.

[0291] The second electrode 210 and the isolation structure 500 can be insulated through the pixel defining portion 300, such that the second electrode 210 and the first electrode 710 are not easily short-circuited through the isolation structure 500. By setting the patterning process of the pixel defining material layer 10a only after step S05, that is, by setting the patterning process of the pixel defining material layer 10a only after the etching preparation of the conductive layer 400 and the isolation structure 500 is completed, when etching and preparing the conductive layer 400 and the isolation structure 500, the pixel defining material layer 10a can better cover the surface of the second electrode 210, such that the etching material is not easily etched and damaged to the second electrode 210, thereby being able to better improve the structural stability of the second electrode 210.

[0292] Step S06: As Figure 44 shown, preparing the first electrode layer 700, the first electrode layer 700 includes a first electrode 710 disposed at least partially within the isolation opening 500a, and the first electrode 710 overlaps with the isolation structure 500.

[0293] Optionally, one of the first electrode 710 and the second electrode 210 can be used as the anode, and the other can be used as the cathode to drive the light-emitting unit 610 to emit light. In the embodiment of the present application, an example is given with the first electrode 710 as the cathode of the display panel 10 and the second electrode 210 as the anode of the display panel 10.

[0294] Optionally, in step S06, it may further include: preparing the light-emitting layer 600, and the light-emitting layer 600 includes a light-emitting unit 610 located on the side of the first electrode 710 facing the substrate 100.

[0295] In the manufacturing method provided by the embodiments of the present application, by arranging the first electrode 710 to overlap with the isolation structure 500, adjacent first electrodes 710 can be electrically connected to each other through the isolation structure 500 to form a planar electrode, facilitating the control of the first electrode 710 in the display panel 10. By providing a light-transmitting opening 500b in the isolation structure 500, the display panel 10 can have better light-transmitting ability. By exposing at least part of the conductive layer 400 from the light-transmitting opening 500b, the conductive layer 400 can preferably limit the signal in the substrate 100 from generating crosstalk with the signal in the device disposed on the side of the conductive layer 400 away from the substrate 100 through the light-transmitting opening 500b. For example, the conductive layer 400 can preferably limit the signal in the substrate 100 from generating crosstalk with the touch signal in the touch electrode 910 on the side of the shielding portion 420 away from the substrate 100 through the light-transmitting opening 500b, enabling the display panel 10 to have better light-transmitting performance while also having better operating stability.

[0296] In some alternative embodiments of the present application, when using wet etching or dry etching processes, a photoresist material can be coated on the surface at positions where etching is not required to provide protection. Optionally, a conventional mask can be used for coating the photoresist. For example, the coating of this photoresist material can be performed before step S04, and then after removing the original photoresist material before step S05, another coating of the photoresist material can be carried out. Alternatively, a halftone mask or a similar device can be used for coating the photoresist to form a photoresist with a thickness variation.

[0297] Optionally, before step S04, it may include: as Figure 45 shown, a photoresist layer 15 is formed on the isolation material layer 10c. The photoresist layer 15 includes a first thickness region 15a, a second thickness region 15b, and a first hollowed-out region 15c. Part of the isolation material layer 10c is exposed from the first hollowed-out region 15c. The thickness of the photoresist layer 15 in the first thickness region 15a is greater than the thickness of the photoresist layer 15 in the second thickness region 15b.

[0298] Optionally, the step of forming the photoresist layer 15 on the isolation material layer 10c may include: using a halftone mask to form the photoresist layer 15 on the isolation material layer 10c.

[0299] In step S04, it may further include: as Figure 46 shown, the isolation material layer 10c corresponding to the first hollowed-out region 15c is patterned to form a fourth initial structure 14.

[0300] After step S04, it may further include: as Figure 47As shown, an ashing process is used to remove the photoresist layer 15 within the second thickness region 15b to form a second hollowed-out region 15d.

[0301] In step S05, it may further include: as Figure 48 shown, patterning the fourth initial structure 14 corresponding to the second hollowed-out region 15d to form an isolation structure 500.

[0302] In this alternative embodiment, by using a halftone mask before patterning the isolation material layer 10c to form the photoresist layer 15, the photoresist layer 15 can have a first thickness region 15a, a second thickness region 15b, and a first hollowed-out region 15c with different thicknesses. In step S04, the etching material can etch the material exposed from the first hollowed-out region 15c. For example, a dry etching process can be first used to etch the isolation material layer 10c exposed from the first hollowed-out region 15c to etch out an initial isolation opening 10f, and then a wet etching method can be used to etch the inner wall surrounding the initial isolation opening 10f exposed from the first hollowed-out region 15c to etch out an isolation opening 500a. After step S04, the photoresist layer 15 within the second thickness region 15b is removed by using an ashing process to form a second hollowed-out region 15d, so that part of the fourth initial structure 14 can be exposed from the second hollowed-out region 15d, facilitating the process of patterning the part of the fourth initial structure 14 exposed from the second hollowed-out region 15d to form a light-transmitting opening 500b in step S05. In the foregoing steps, compared with using an ordinary mask for photoresist coating, when using a halftone mask for photoresist material coating, the number of photoresist material coating times can be reduced, and the preparation efficiency of the display panel 10 can be better improved.

[0303] According to the embodiments of the present application as described above, these embodiments do not describe all the details in detail, nor do they limit the invention to only the specific embodiments. Obviously, according to the above description, many modifications and variations can be made. These embodiments are selected and specifically described in this specification to better explain the principle and practical application of the present application, so that those skilled in the art can make good use of the present application and its modifications based on the present application. The present application is only limited by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that, include: substrate; A conductive layer, disposed on one side of the substrate, the conductive layer comprising a connecting portion and a shielding portion; An isolation structure is disposed on a side of the conductive layer away from the substrate, the isolation structure encloses an isolation opening and a light-transmitting opening, and at least a portion of the shielding portion is exposed in the light-transmitting opening; The first electrode layer includes a first electrode at least partially disposed in the isolation opening, and the first electrode is electrically connected to the connecting portion.

2. The display panel according to claim 1, wherein The connecting portion is provided with a connecting opening, the connecting opening is communicated with the isolating opening, and at least a portion of the first electrode is disposed in the connecting opening.

3. The display panel according to claim 1, characterized in that, The material of the conductive layer includes a transparent conductive material; Preferably, the conductive layer includes at least one of indium zinc oxide, indium tin oxide or zinc oxide.

4. The display panel according to claim 1, wherein The connecting portion and the shielding portion are an integrated structure; Preferably, the isolation structure is arranged on a side of the connecting portion facing away from the substrate.

5. The display panel according to claim 1, wherein The isolation structure comprises an isolation body and an eaves portion located on a side of the isolation body away from the substrate, wherein the eaves portion protrudes from the isolation body toward the isolation opening; Preferably, the connecting portion extends into the isolation opening; Preferably, the orthographic projection of the isolating body on the substrate is located within the orthographic projection of the connecting portion on the substrate; Preferably, the orthographic projection of the surface of the eave portion facing the light-transmitting opening on the substrate is located within the orthographic projection of the surface of the isolating body facing away from the substrate on the substrate; Preferably, the cross-sectional area of ​​the light-transmitting opening increases in a direction away from the substrate.

6. The display panel according to claim 1, wherein, The orthographic projection of the shielding portion on the substrate and the orthographic projection of the light-transmitting opening on the substrate are at least partially overlapped; Preferably, the orthographic projection of the shielding portion on the substrate is located within the orthographic projection of the light-transmitting opening on the substrate.

7. The display panel according to claim 1, wherein The number of the light-transmitting openings is multiple, and the multiple light-transmitting openings are arranged along the peripheral side of the isolation opening; Preferably, the orthographic projection of the light-transmitting opening on the substrate is rectangular, square, circular or irregular polygonal.

8. The display panel according to claim 1, wherein The orthographic projection of the light-transmitting opening on the substrate is annular, and the light-transmitting opening is arranged around at least a portion of the isolation opening.

9. The display panel according to any one of claims 1 to 8, characterized in that, The display panel further comprises a light-emitting layer, wherein the light-emitting layer comprises a light-emitting unit located on a side of the first electrode facing the substrate; Preferably, the display panel further comprises a second electrode layer, wherein the second electrode layer comprises a second electrode located on a side of the light emitting unit facing the substrate; Preferably, the display panel further comprises a pixel defining portion disposed between the second electrode and the connecting portion; Preferably, the conductive layer is arranged on a side of the pixel defining portion facing away from the substrate, or the pixel defining portion is provided with a receiving groove, and at least part of the conductive layer and the isolation structure are located in the receiving groove.

10. The display panel according to any one of claims 1 to 8, characterized in that, The display panel further includes a touch component located on a side of the isolation structure away from the substrate, the touch component includes a touch electrode, and an orthographic projection of the touch electrode on the substrate does not overlap with an orthographic projection of the light-transmitting opening on the substrate; Preferably, the positive projection of the touch electrode on the substrate at least partially overlaps with the positive projection of the isolation structure on the substrate; Preferably, the positive projection of the touch electrode on the substrate is located within the positive projection of the isolation structure on the substrate.

11. The display panel according to any one of claims 1 to 8, characterized in that, The display panel has a display area and a non-display area. The display area includes a first area and a second area. The isolation opening is located in the first area and the second area, and the light-transmitting opening is located in the second area; Preferably, the light transmittance of the second area is greater than that of the first area.

12. A display panel, characterized in that, The display panel has a display area and a non-display area. The display panel includes: A substrate; A conductive layer provided on one side of the substrate. The conductive layer includes a connection portion and a shielding portion, and at least part of the shielding portion is located in the non-display area; An isolation structure located in the display area and provided on the side of the conductive layer away from the substrate. The isolation structure encloses an isolation opening; A first electrode layer including a first electrode at least partially disposed in the isolation opening. The first electrode is electrically connected to the connection portion.

13. The display panel according to claim 12, characterized in that, The connection portion and the shielding portion are an integral structure; Preferably, the isolation structure is provided on the side of the connection portion away from the substrate; Preferably, the isolation structure further encloses a light-transmitting opening, and part of the shielding portion is exposed in the light-transmitting opening; Preferably, the material of the conductive layer includes a transparent conductive material; Preferably, the conductive layer includes at least one of indium zinc oxide, indium tin oxide, or zinc oxide.

14. A display device, characterized in that, Including the display panel according to any one of claims 1 to 13.

15. A method for preparing a display panel, characterized in that, Including: Successively forming a stacked conductive material layer and an isolation material layer on the substrate; Patterning the conductive material layer and the isolation material layer to form a conductive layer and an isolation structure. The conductive layer includes a connection portion and a shielding portion that are interconnected. The isolation structure is provided on the side of the conductive layer away from the substrate. The isolation structure encloses an isolation opening and a light-transmitting opening, and at least part of the shielding portion is exposed in the light-transmitting opening; Preparing a first electrode layer. The first electrode layer includes a first electrode at least partially disposed in the isolation opening. The first electrode is overlapped with the connection portion.

16. The preparation method according to claim 15, characterized in that, In the step of patterning the conductive material layer and the isolation material layer to form a conductive layer and an isolation structure, it includes: Patterning the isolation material layer to form a first preliminary structure. The first preliminary structure is provided with an isolation preliminary opening and a light-transmitting opening, and at least part of the conductive material layer is exposed from the isolation preliminary opening and the light-transmitting opening; Patterning the inner wall enclosing the isolation preliminary opening and part of the conductive material layer exposed from the isolation preliminary opening to form the isolation structure and the conductive layer; Preferably, the isolation structure includes an isolation body and an eaves portion located on the side of the isolation body away from the substrate. The eaves portion protrudes from the isolation body toward the isolation opening; Preferably, in the step of patterning the isolation material layer to form a first preliminary structure, it includes: Performing dry etching on the isolation material layer to form a first preliminary structure; Preferably, the step of patterning the inner wall of the first preliminary structure enclosing the isolation preliminary opening and the portion of the conductive material layer exposed from the isolation preliminary opening comprises: The inner wall of the first preliminary structure enclosing the isolation preliminary opening and the portion of the conductive material layer exposed from the isolation preliminary opening are wet-etched.

17. The preparation method according to claim 15, characterized in that, The step of patterning the conductive material layer and the isolation material layer to form a conductive layer and an isolation structure includes: The isolation material layer and the conductive material layer are patterned to form a second initial structure and the conductive layer, wherein the second initial structure is provided with the isolation opening, and the second initial structure comprises a first initial isolation portion and a second initial isolation portion located on a side of the first initial isolation portion away from the substrate, and the second initial isolation portion is arranged to protrude from the first initial isolation portion toward the isolation opening; Performing patterning on the second preliminary structure to form the isolation structure, wherein the isolation structure includes an isolation body and an eaves portion located on a side of the isolation body away from the substrate, wherein the eaves portion protrudes from the isolation body toward the isolation opening; Preferably, the step of patterning the isolation material layer and the conductive material layer to form the second preliminary structure and the conductive layer includes: Performing dry etching on the isolation material layer to form an isolation initial opening; Performing wet etching on the inner wall enclosing the isolation primary opening and the portion of the conductive material layer exposed from the isolation primary opening to form a second initial structure and the conductive layer; Preferably, the step of patterning the second preliminary structure to form the isolation structure includes: Performing dry etching on the second preliminary structure to form the isolation structure; Preferably, before the step of patterning the isolation material layer and the conductive material layer to form the second preliminary structure and the conductive layer, the step includes: Forming a photoresist layer on the isolation material layer, the photoresist layer comprising a first thickness region, a second thickness region and a first hollow region, a portion of the isolation material layer is exposed from the first hollow region, and a thickness of the photoresist layer in the first thickness region is greater than a thickness of the photoresist layer in the second thickness region; The step of patterning the isolation material layer and the conductive material layer to form a second preliminary structure and the conductive layer also includes: Performing patterning on the isolation material layer and the conductive material layer corresponding to the first hollowed-out area to form the second preliminary structure and the conductive layer; After the step of patterning the isolation material layer and the conductive material layer to form a second preliminary structure and the conductive layer, the method further comprises: Using an ashing process to remove the photoresist layer in the second thickness region to form a second hollow region; The step of patterning the second preliminary structure to form the isolation structure also includes: Performing patterning on the second preliminary structure corresponding to the second hollowed-out area to form the isolation structure; Preferably, the step of forming a photoresist layer on the isolation material layer includes: A photoresist layer is formed on the isolation material layer using a half-tone mask.

18. The preparation method according to any one of claims 15 to 17, characterized in that, Before the step of sequentially forming a stacked conductive material layer and an isolation material layer on the substrate, the method further includes: Preparing a second electrode layer on the substrate, wherein the second electrode layer includes a plurality of second electrodes arranged at intervals; forming a pixel definition material layer on the second electrode layer; The step of sequentially forming a stacked conductive material layer and an isolation material layer on the substrate includes: sequentially forming the stacked conductive material layer and the isolation material layer on the pixel definition material layer; After the step of patterning the conductive material layer and the isolation material layer to form a conductive layer and an isolation structure, the method further includes: Patterning the pixel definition material layer to form a pixel defining portion, wherein the pixel defining portion is disposed between the second electrode and the connecting portion; Preferably, the display panel has a display area and a non-display area, and part of the shielding portion is located in the non-display area; Preferably, the substrate includes a power supply voltage signal line, and the step of forming a pixel definition material layer on the second electrode layer includes: Performing a hole-opening process on the pixel definition material layer and the substrate located in the non-display area to form a via hole, wherein at least a portion of the power supply voltage signal line is exposed from the via hole; The conductive material layer and the isolation material layer are stacked in sequence on the pixel definition material layer, and at least a portion of the conductive material layer is located in the via hole and connected to the power supply voltage signal line.

19. A method for preparing a display panel, characterized in that, include: forming a conductive material layer on a substrate; performing patterning on the conductive material layer to form a conductive layer; forming an isolation material layer on the conductive layer; Patterning the isolation material layer to form a third preliminary structure, wherein the third preliminary structure is provided with an isolation preliminary opening and a light-transmitting opening, and at least a portion of the conductive layer is exposed from the light-transmitting opening; The inner wall enclosing the isolation opening is patterned to form an isolation structure, wherein the isolation structure is provided with an isolation opening, and the isolation structure comprises an isolation body and an eaves portion located on a side of the isolation body away from the substrate, wherein the eaves portion protrudes from the isolation body toward the isolation opening; preparing a first electrode layer, the first electrode layer comprising a first electrode at least partially disposed in the isolation opening, the first electrode overlapping the isolation structure; Preferably, the step of patterning the isolation material layer to form the third preliminary structure includes: Performing dry etching on the isolation material layer to form a third preliminary structure; Preferably, the step of patterning the inner wall enclosing the isolation primary opening includes: The inner wall of the third preliminary structure enclosing the isolation preliminary opening is wet-etched.

20. A method for preparing a display panel, characterized in that, include: forming a conductive material layer on a substrate; performing patterning on the conductive material layer to form a conductive layer; forming an isolation material layer on the conductive layer; The isolation material layer is patterned to form a fourth primary structure. The fourth primary structure is provided with an isolation opening. The fourth primary structure includes a third primary isolation portion and a fourth primary isolation portion located on a side of the third primary isolation portion away from the substrate. The fourth primary isolation portion protrudes from the third primary isolation portion toward the isolation opening. The fourth primary structure is patterned to form an isolation structure. The isolation structure is provided with a light-transmitting opening, and at least a part of the conductive layer is exposed from the light-transmitting opening. The isolation structure includes an isolation body and an eaves portion located on a side of the isolation body away from the substrate. The eaves portion protrudes from the isolation body toward the isolation opening. A first electrode layer is prepared. The first electrode layer includes a first electrode disposed at least partially within the isolation opening, and the first electrode is overlapped with the isolation structure. Preferably, in the step of patterning the isolation material layer to form a fourth primary structure, it includes: The isolation material layer is dry-etched to form an initial isolation opening. The inner wall enclosing the initial isolation opening is wet-etched to form a fourth primary structure. Preferably, in the step of patterning the fourth primary structure to form an isolation structure, it includes: The fourth primary structure is dry-etched to form the isolation structure. Preferably, before the step of patterning the isolation material layer to form a fourth primary structure, it includes: A photoresist layer is formed on the isolation material layer. The photoresist layer includes a first thickness region, a second thickness region, and a first hollow region. A part of the isolation material layer is exposed from the first hollow region. The thickness of the photoresist layer in the first thickness region is greater than the thickness of the photoresist layer in the second thickness region. In the step of patterning the isolation material layer to form a fourth primary structure, it further includes: The isolation material layer corresponding to the first hollow region is patterned to form the fourth primary structure. After the step of patterning the isolation material layer to form a fourth primary structure, it further includes: An ashing process is used to remove the photoresist layer within the second thickness region to form a second hollow region. In the step of patterning the fourth primary structure to form an isolation structure, it further includes: The fourth primary structure corresponding to the second hollow region is patterned to form the isolation structure. Preferably, in the step of forming a photoresist layer on the isolation material layer, it includes: A halftone mask is used to form a photoresist layer on the isolation material layer.

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