Display device and method for manufacturing display device

Abstract

A display device is provided that includes a foldable display panel and a protective member disposed on the display panel. The protective member may include a protective base layer, a hard coat layer, and a protective layer stacked in this order. The protective layer may include a matrix resin including dodecafluoroheptyl acrylate (DFHA) having a degree of polymerization of about 8. The protective layer may include a first compound dispersed in the matrix resin. The display device may have excellent display quality and excellent reliability. A method for manufacturing a display device is also provided.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority and all benefits derived therefrom to Korean Patent Application No. 10 - 2024 - 0001274, filed on January 4, 2024, the content of which is incorporated herein by reference in its entirety. Technical field

[0003] The present disclosure relates to a foldable display device and a method of manufacturing a display device. Background art

[0004] Various display devices such as televisions, mobile phones, tablet computers, or game consoles are being developed. Recently, flexible display devices including slidable or foldable flexible display panels have been developed. Different from rigid display devices, flexible display devices are foldable, rollable, or bendable. Since some flexible display devices with various transformable shapes can be carried regardless of their screen sizes, the convenience of users is improved. Considering the usage environment of users, a method for maintaining the reliability of flexible display devices is needed. Summary of the invention

[0005] The present disclosure provides a display device having excellent reliability and display quality, and a method of manufacturing the display device.

[0006] Embodiments of the inventive concept provide a display device including a display panel foldable with respect to at least one folding axis, and a protection member disposed on the display panel, wherein the protection member includes a protection base layer, a hard coating disposed on the protection base layer, and a protection layer disposed on the hard coating. The protection layer includes a matrix resin and a first compound dispersed in the matrix resin, and the matrix resin includes dodecafluoroheptyl acrylate (DFHA) having a degree of polymerization of about 8. The first compound includes an azomethine compound.

[0007] In an embodiment, the weight ratio of the matrix resin to the first compound may be about 7:3 to about 9:1.

[0008] In an embodiment, the first compound may include a first sub-compound and a second sub-compound different from the first sub-compound, the first sub-compound being the azomethine compound, and the second sub-compound may include at least one of a benzotriazole-based compound, a cyanoacrylate-based compound, a benzophenone-based compound, a salicylic acid-based compound, a salicylate-based compound, a cinnamate-based compound, an oxanilide-based compound, a polystyrene-based compound, a polyferrocenylsilane-based compound, a methylene-based compound, a triazine-based compound, a p-aminobenzoic acid-based compound, a cinnamic acid-based compound, and a urocanic acid-based compound.

[0009] In an embodiment, relative to the total weight of the first weight of the first sub-compound and the second weight of the second sub-compound, the second weight may be greater than the first weight.

[0010] In an embodiment, the weight ratio of the first sub-compound to the second sub-compound may be from about 1:1.5 to about 1:3.5.

[0011] In an embodiment, the thickness of the protective layer may be from about 0.08 μm to about 0.12 μm.

[0012] In an embodiment, the reflectance of the protective layer including the specular component (SCI) may be from about 0.8 to about 1.8.

[0013] In an embodiment, the transmittance of the protective layer may be about 30% or less with respect to light having a wavelength range of about 350 nm to about 410 nm.

[0014] In an embodiment, the transmittance of the protective layer may be equal to or less than about 5% with respect to light having a wavelength of about 405 nm.

[0015] In an embodiment, the protective substrate layer may include at least one of polyethylene terephthalate, polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, and ethylene-vinyl alcohol copolymer.

[0016] In an embodiment, the thickness of the protective member may be from about 60 μm to about 80 μm.

[0017] In an embodiment, the refractive index of the matrix resin may be from about 1.2 to about 1.4.

[0018] In an embodiment of the inventive concept, a method of manufacturing a display device includes: preparing a display panel foldable with respect to at least one folding axis, and supplying a protection member including a protection base layer on the display panel, a hard coat layer provided on the protection base layer, and a protection layer provided on the hard coat layer, wherein the supplying of the protection member includes preparing a substrate including the protection base layer and the hard coat layer, and forming the protection layer on the substrate by supplying a base resin and a first compound, the base resin including dodecafluoroheptyl acrylate having a degree of polymerization of about 8, the first compound including an azomethine compound, wherein the protection layer includes the first compound dispersed in the dodecafluoroheptyl acrylate.

[0019] In an embodiment, when forming the protection layer, the base resin and the first compound may be supplied at an ion acceleration voltage of about 100V to about 500V.

[0020] In an embodiment, the forming of the protection layer may include forming an initial protection layer by dispersing the first compound in the base resin, and depositing the initial protection layer on the substrate, wherein the forming of the initial protection layer and the depositing of the initial protection layer may be performed in the same operation.

[0021] In an embodiment, the forming of the protection layer may be performed at a temperature of about -30°C to about 10°C.

[0022] In an embodiment, the weight ratio of the base resin to the first compound may be about 7:3 to about 9:1.

[0023] In an embodiment, the first compound may include a first sub-compound and a second sub-compound different from the first sub-compound, the first sub-compound being the azomethine compound, and the second sub-compound may include at least one of a benzotriazole-based compound, a cyanoacrylate-based compound, a benzophenone-based compound, a salicylic acid-based compound, a salicylate-based compound, a cinnamate-based compound, an oxanilide-based compound, a polystyrene-based compound, a polydimethylferrocenylsilane-based compound, a methylene-based compound, a triazine-based compound, a p-aminobenzoic acid-based compound, a cinnamic acid-based compound, and a urocanic acid-based compound.

[0024] In an embodiment, the weight ratio of the first sub-compound to the second sub-compound may be about 1:1.5 to about 1:3.5.

[0025] In an embodiment, the protective matrix layer may include at least one of polyethylene terephthalate, polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, and ethylene-vinyl alcohol copolymer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings are included to provide a further understanding of the inventive concept and are incorporated into and constitute a part of this specification. The drawings illustrate embodiments of the inventive concept and, together with the description, are used to explain the principles of the inventive concept. In the drawings:

[0027] Figure 1A is a perspective view illustrating a display device according to an embodiment;

[0028] Figure 1B is a perspective view illustrating a display device according to an embodiment;

[0029] Figure 1C is a plan view illustrating a display device according to an embodiment;

[0030] Figure 1D is a perspective view illustrating a display device according to an embodiment;

[0031] Figure 2A is a perspective view illustrating a display device according to an embodiment;

[0032] Figure 2B is a perspective view illustrating a display device according to an embodiment;

[0033] Figure 2C is a perspective view illustrating a display device according to an embodiment;

[0034] Figure 3 is an exploded perspective view illustrating a display device according to an embodiment;

[0035] Figure 4 is illustrating a partial cross-sectional view taken along line I-I' in Figure 3 ;

[0036] Figure 5 is illustrating Figure 4 an enlarged cross-sectional view of region XX' of

[0037] Figure 6 is a partial cross-sectional view taken along line II-II' in Figure 3 ;

[0038] Figure 7A is a flowchart illustrating a method for manufacturing a display device according to an embodiment;

[0039] Figure 7B is a flowchart illustrating a method for manufacturing a display device according to an embodiment; and

[0040] Figure 8 is a diagram schematically illustrating operations of manufacturing a display device according to an embodiment. DETAILED DESCRIPTION

[0041] Embodiments of the present disclosure support various modifications in various forms, and specific exemplary embodiments will be illustrated in the drawings and described in detail herein. However, the description is not intended to limit the inventive concept to the specific disclosed form, and the examples provided herein should be understood to include all variations, equivalents, and alternatives included within the spirit and scope of the inventive concept.

[0042] In this specification, a description that a component (or region, layer, part, etc.) is “on” another component, “connected” to another component, or “coupled” to another component means that the component is directly placed / connected / coupled on another component, or a third component may be disposed between the components.

[0043] The same reference numerals or symbols denote the same elements. In some aspects, in the drawings, for effective description of the technical content, the thickness, ratio, and dimensions of the components are enlarged.

[0044] Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are for the purpose of distinguishing one component from other components. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may be referred to as the first component. Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0045] In some aspects, terms such as “below,” “under,” “above,” and “on” are used to describe the relationship between components illustrated in the drawings. The terms are relative concepts and are described based on the directions indicated in the drawings.

[0046] As used herein, the term “about” or “approximately” includes a specified value and includes a suitable deviation range of the specified value as determined by a person of ordinary skill in the art considering relevant measurements and errors associated with the measurement of a particular quantity. For example, the term “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the specified value.

[0047] As used herein, the term "substantially" means approximately or actually. The term "substantially equal" means approximately equal or actually equal. The term "substantially the same" means approximately the same or actually the same.

[0048] The terms used herein are for the purpose of describing particular embodiments and are not intended to be limiting. As used herein, "a", "an", "the", and "at least one" do not denote a limitation of quantity and are intended to include both the singular and the plural, unless the context clearly dictates otherwise. For example, "an element" has the same meaning as "at least one element" unless the context clearly dictates otherwise. "At least one" should not be construed as limiting "a" or "an". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It should be further understood that the terms "comprises", "comprising", "includes", "including", "have", and "having", when used in this specification, specify the presence of the stated features, regions, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and / or groups thereof.

[0049] As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one or all possible combinations of the items jointly listed in the respective phrase.

[0050] Unless otherwise defined, all terms (including technical and scientific terms) used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the relevant art and should not be interpreted as being too idealized or overly formal unless expressly so defined in this document.

[0051] Hereinafter, a display device according to an embodiment of the inventive concept will be described with reference to the accompanying drawings. Figure 1A is a perspective view of a state in which a display device EA according to an embodiment is not folded.

[0052] The display device EA according to the embodiment can be activated in response to an electrical signal. For example, the display device EA can be a mobile phone, a tablet computer, a car navigation system, a game console, or a wearable device, but the embodiments supported by the present disclosure are not limited thereto. Figure 1A And other drawings provided herein illustrate an example in which the display device EA is a mobile phone.

[0053] The display device EA can include a first display surface FS defined by a first direction axis DR1 and a second direction axis DR2 intersecting the first direction axis DR1. The display device EA can provide an image IM to a user through the first display surface FS. The display device EA can display the image IM on the first display surface FS in a direction parallel to each of the first direction axis DR1 and the second direction axis DR2 with respect to a third direction axis DR3.

[0054] In the present disclosure, the first direction axis DR1 and the second direction axis DR2 are orthogonal to each other, and the third direction axis DR3 can be a normal direction of a plane defined by the first direction axis DR1 and the second direction axis DR2. The thickness direction of the display device EA can be parallel to the third direction axis DR3. The front surface (or upper surface) and the rear surface (or lower surface) can face each other in a direction parallel to the third direction axis DR3, and the normal direction of each of the front surface (or upper surface) and the rear surface (or lower surface) can be parallel to the third direction axis DR3. The front surface (or upper surface) means a surface adjacent to the first display surface FS, and the rear surface (or lower surface) means a surface spaced apart from the first display surface FS. In some aspects, the rear surface (or lower surface) means a surface close to a second display surface RS to be described later. The upper side means a direction closer to the first display surface FS, and the lower side means a direction farther from the first display surface FS.

[0055] A cross-section means a surface parallel to the thickness direction (e.g., the third direction axis DR3), while a plane means a surface orthogonal to the third direction axis DR3. The plane means a plane defined by the first direction axis DR1 and the second direction axis DR2.

[0056] The directions represented by the first to third direction axes DR1, DR2, and DR3 described in the present disclosure are relative concepts and can be changed to other directions. In some aspects, the directions represented by the first to third direction axes DR1, DR2, and DR3 can be described as the first to third directions, and the same reference numerals and symbols can be used.

[0057] The display device EA can sense an external input applied from the outside. The external input can include various forms of input provided from the outside. For example, the external input can include the contact of a part of the user's body (e.g., the user's hand), and an external input (e.g., hovering) applied close to or adjacent to the display device EA within a predetermined distance. In some aspects, the external input can have various forms, for example, taking force, pressure, temperature, and light as examples.

[0058] The display device EA can include a first display surface FS and a second display surface RS. The first display surface FS can include a first active area F-AA, a first peripheral area F-NAA, and an electronic module area EMA. The second display surface RS can be defined as a surface opposite to at least a part of the first display surface FS. That is, the second display surface RS can be defined as a part of the rear surface of the display device EA.

[0059] The first active area F-AA can be activated in response to an electrical signal. The first active area F-AA can be an area where an image IM can be displayed, and can sense external inputs having various forms.

[0060] The first peripheral area F-NAA can be adjacent to the first active area F-AA. The first peripheral area F-NAA can have a predetermined color. The first peripheral area F-NAA can surround the first active area F-AA. Therefore, the shape of the first active area F-AA can be substantially defined by the first peripheral area F-NAA. However, this is an example, and the first peripheral area F-NAA can be set adjacent to only one side of the first active area F-AA, and can be omitted.

[0061] Various electronic modules can be provided in the electronic module area EMA. For example, the electronic module can include at least any one of a camera, a speaker, a light sensing sensor, and a thermal sensing sensor. The electronic module area EMA can sense an external object received through the first display surface FS and the second display surface RS, or can supply a sound signal to the outside through the first display surface FS and the second display surface RS, taking voice as an example. The electronic module can include multiple configurations and is not limited to any one implementation.

[0062] The electronic module area EMA can surround the first peripheral area F-NAA. However, this is an example, and the electronic module area EMA is not limited to any one implementation. For example, the electronic module area EMA can be surrounded by the first active area F-AA and the first peripheral area F-NAA, and can be provided in the first active area F-AA.

[0063] The display device EA according to an embodiment may include at least one folding region FA, and a plurality of non-folding regions NFA1 and NFA2 extending from the folding region FA. For example, the first non-folding region NFA1, the folding region FA, and the second non-folding region NFA2 may be defined along the second direction DR2. The display device EA according to an embodiment may include a first non-folding region NFA1 and a second non-folding region NFA2 spaced apart from each other in the second direction DR2, wherein the folding region FA is between the first non-folding region NFA1 and the second non-folding region NFA2. For example, the first non-folding region NFA1 may be disposed on one side of the folding region FA along the second direction DR2, and the second non-folding region NFA2 may be disposed on the other side of the folding region FA along the second direction.

[0064] Figure 1A This and other figures herein illustrate embodiments of a display device EA including one folding region FA, but embodiments supported by the present disclosure are not limited thereto. For example, a plurality of folding regions may be defined in the display device EA. In an example, the display device EA according to an embodiment may include at least two folding regions FA, and in some cases, the display device EA may further include at least three non-folding regions, with each of the folding regions being disposed between the non-folding regions.

[0065] Figure 1B is a perspective view illustrating the folding operation of the display device EA according to an embodiment.

[0066] Figure 1C is a plan view of the state in which the display device EA according to an embodiment is folded.

[0067] Figure 1D is a perspective view illustrating the folding operation of the display device EA according to an embodiment.

[0068] Reference Figure 1B , the display device EA according to an embodiment may be folded relative to a first folding axis FX1 extending in a first direction DR1. In the state in which the display device EA is folded, the folding region FA may have a predetermined curvature and radius of curvature. The display device EA may be folded relative to the first folding axis FX1 such that the first non-folding region NFA1 and the second non-folding region NFA2 face each other, and the display device EA may be deformed into an inwardly folded state such that the first display surface FS is not exposed to the outside.

[0069] Reference Figure 1C, in a state where the display device EA according to an embodiment is folded inward, a user can view the second display surface RS. In this case, the second display surface RS may include a second active area R-AA that displays an image. The second active area R-AA may be activated in response to an electrical signal. The second active area R-AA may be an area on which an image can be displayed, and it may sense external inputs in various forms.

[0070] The second peripheral area R-NAA may be adjacent to the second active area R-AA. The second peripheral area R-NAA may have a predetermined color. The second peripheral area R-NAA may surround the second active area R-AA. In some aspects, although not illustrated, the display device EA may further include an electronic module area EMA in which electronic modules having various configurations are provided in the second display surface RS, and the display device EA is not limited to any one embodiment.

[0071] Reference Figure 1D , the display device EA according to an embodiment may be folded with respect to a second folding axis FX2 extending in a first direction DR1. The display device EA may be folded with respect to the second folding axis FX2 to be deformed into an outwardly folded state in which the first display surface FS is exposed to the outside. In an embodiment, the display device EA may be configured to repeatedly perform an inward folding operation and an outward folding operation on each other by a folding operation, but is not limited thereto.

[0072] Figures 1A to 1D Examples in which the display device EA is folded with respect to one first folding axis FX1 or second folding axis FX2 are illustrated, but the number of folding axes and the number of non-folding areas according to the number of folding axes are not limited thereto. For example, the display device EA may be folded with respect to a plurality of folding axes such that the first display surface FS and the second display surface RS may partially face each other. In some aspects, it is illustrated that the first folding axis FX1 and the second folding axis FX2 are parallel to the long side of the display device EA, but embodiments supported by the present disclosure are not limited thereto, and the first folding axis FX1 and the second folding axis FX2 may be parallel to the short side of the display device EA.

[0073] In the display device EA, a first non-folding area NFA1 and a second non-folding area NFA2 may be defined as portions having the first display surface FS and the second display surface RS that are parallel to a plane defined by a first direction axis DR1 and a second direction axis DR2 in a folded state, as illustrated in Figure 1C , and a folding area FA may be defined as an area between the first non-folding area NFA1 and the second non-folding area NFA2. The folding area FA may include a curved bent portion so as to have a predetermined curvature in a folded state.

[0074] Figures 2A to 2C is a perspective view of a display device EA-a illustrating another embodiment according to the inventive concept. Figure 2A is a perspective view illustrating a state in which the display device EA-a is not folded. Figure 2B and Figure 2C is a perspective view illustrating a folding operation of the display device EA-a. Figure 2B is illustrated in Figure 2A is a perspective view of an inward folding operation of the display device EA-a illustrated therein. Figure 2C is illustrated in Figure 2A is a perspective view of an outward folding operation of the display device EA-a illustrated therein.

[0075] The display device EA-a may be folded with respect to a third folding axis FX3 parallel to the first direction axis DR1. Refer to Figure 2A , the extending direction of the third folding axis FX3 may be parallel to the extending direction of the short side of the display device EA-a.

[0076] The display device EA-a may be divided into a folding area FA-a, a first non-folding area NFA1-a adjacent to one side of the folding area FA-a, and a second non-folding area NFA2-a adjacent to the other side of the folding area FA-a. The first non-folding area NFA1-a and the second non-folding area NFA2-a may be spaced apart from each other, and the folding area FA-a is between the first non-folding area NFA1-a and the second non-folding area NFA2-a.

[0077] The folding area FA-a may be folded with respect to the third folding axis FX3. In a state in which the display device EA-a is folded, the folding area FA may have a predetermined curvature and radius of curvature. The first non-folding area NFA1-a and the second non-folding area NFA2-a may face each other, and the display device EA-a may be folded inward so that the display surface FS-a is not exposed to the outside.

[0078] Refer to Figure 2A , in a state (i.e., unfolded state) in which the display device EA-a according to the embodiment is not folded, the display surface FS-a may be displayed to or viewed by a user. As described with reference to Figures 1A to 1D , the display surface FS-a of the display device EA-a may include an active area F-AAa and a peripheral area F-NAAa. The active area F-AAa may be an area on which an image IM is displayed, and it may sense external inputs in various forms.

[0079] Refer to Figure 2B, in a state where the display device EA-a according to the embodiment is folded inward, the rear surface RS-a can be displayed to or viewed by the user. For example, the rear surface RS-a can be used as a second display surface for displaying an image. In some aspects, an electronic module area in which various configured electronic modules are provided can also be provided in the rear surface RS-a.

[0080] Reference Figure 2C , the display device EA-a can be folded relative to the third folding axis FX3 to be deformed into an outwardly folded state, in which one area of the rear surface RS-a overlaps with the first non-folded area NFA1-a, and the other area faces the second non-folded area NFA2-a.

[0081] Figure 3 is Figure 1A The exploded perspective view of the display device EA illustrated in. The description of the display device EA can be equally applied to Figures 2A to 2C the display device EA-a illustrated in.

[0082] Figure 3 The exploded perspective view of the display device EA according to the embodiment is illustrated. Reference Figure 3 , the display device EA can include a display module DM and a protection member RM disposed on the display module DM. In some aspects, the display device EA can further include a lower module LM and a housing HAU.

[0083] The protection member RM can have a configuration in which the protection member RM is disposed on the uppermost part of the display device EA. The image IM generated by the display module DM (see Figure 1A ) can pass through the protection member RM to be supplied to the user. The protection member RM can absorb ultraviolet light of ultraviolet A (UVA) and prevent reflection of external light, and thus can prevent damage to the light-emitting element ED (see Figure 6 ) to be described later. The ultraviolet light of UVA can mean ultraviolet light having a wavelength range of about 315 nm to about 400 nm. In some aspects, the protection member RM can protect the display module DM from external impacts, and the protection member RM can exhibit a characteristic of low curvature, in which folding and unfolding can be easily repeated. Therefore, in the embodiment, the display device EA including the protection member RM can exhibit excellent display quality and reliability.

[0084] The upper adhesive layer AP-R may be disposed between the display module DM and the protection member RM. The protection member RM and the display module DM may be coupled through the upper adhesive layer AP-R. The upper adhesive layer AP-R may include a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA) film, or an optically clear resin (OCR) layer. However, this is an example, and the embodiments supported by the present disclosure are not limited thereto. In addition to or in place of the illustrated examples, the upper adhesive layer AP-R may be omitted.

[0085] The display module DM may display an image in response to an electrical signal and may transmit / receive information regarding an external input. The display module DM may be divided into a display area DP-DA and a non-display area DP-NDA. The display area DP-DA may be defined as an area from which an image supplied by the display module DM is output. The display area DP-DA of the display module DM may correspond to at least a part of the first active area F-AA (see Figure 1A ).

[0086] The non-display area DP-NDA may be adjacent to the display area DP-DA. For example, the non-display area DP-NDA may surround the display area DP-DA. However, this is an example, and the non-display area DP-NDA may be defined in various shapes and is not limited to any one embodiment.

[0087] The display module DM may include a foldable display portion FP-D and a first non-foldable display portion NFP1-D and a second non-foldable display portion NFP2-D. The foldable display portion FP-D may correspond to the folding area FA (see Figure 1A ), and the first non-foldable display portion NFP1-D and the second non-foldable display portion NFP2-D may correspond to the first non-folding area NFA1 and the second non-folding area NFA2 (see Figure 1A ).

[0088] The foldable display portion FP-D may be folded with respect to a first folding axis FX1 and a second folding axis FX2 (see Figure 1B and Figure 1D ). The first non-foldable display portion NFP1-D and the second non-foldable display portion NFP2-D may be spaced apart from each other in a second direction DR2, with the foldable display portion FP-D between the first non-foldable display portion NFP1-D and the second non-foldable display portion NFP2-D. The first non-foldable display portion NFP1-D may correspond to the first non-folding area NFA1 (see Figure 1A ). The second non-foldable display portion NFP2-D may correspond to the second non-folding area NFA2 (see Figure 1A ).

[0089] The lower module LM can be disposed below the display module DM. The housing HAU can be disposed below the lower module LM. The housing HAU can include a relatively high-rigidity material. For example, the housing HAU can include a plurality of frames and / or plates made of glass, plastic, or metal. The housing HAU can provide a predetermined accommodation space. The display module DM can be accommodated in the accommodation space so as to protect the display module DM from external impacts.

[0090] Although not illustrated, the display device EA can further include an upper film disposed between the display module DM and the protection member RM. The upper film can include a synthetic resin film. The upper film can absorb external impacts applied to the front surface of the display device EA.

[0091] Figure 4 is an example of a cross-sectional view taken along Figure 3 the line I-I' in Figure 4 is a cross-sectional view illustrating a display device EA according to an embodiment. For ease of description, Figure 4 the configuration of the display device EA in which the housing HAU is omitted is illustrated.

[0092] Referring to Figure 4 , the lower module LM can include a support plate MP and a lower support member BSM. Figure 4 The configuration of the lower module LM illustrated in

[0093] is an example, and the combination of the configurations included in the lower module LM in the display device EA according to the embodiment can be changed according to the size, shape, or operating characteristics of the display device EA. The support plate MP can be disposed below the display module DM. The support plate MP can include a metallic material or a polymeric material. For example, the support plate MP can be formed to include stainless steel, aluminum, or an alloy thereof. Alternatively, or additionally, the support plate MP can be formed of a polymeric material. A plurality of openings OP can be defined in the support plate MP. The support plate MP can include an opening pattern OP-PT in which the plurality of openings OP are defined. The opening pattern OP-PT can be formed in the folding region FA.

[0094] The lower support member BSM can include a support member SPM and a filling portion SAP. In a plane, the support member SPM can have a configuration in which the support member SPM overlaps most regions of the display module DM. The filling portion SAP can have a configuration in which the filling portion SAP is disposed outside the support member SPM and overlaps the periphery (e.g., boundary or perimeter) of the display module DM.

[0095] The support member SPM can include at least one of a support layer SP, a buffer layer CP, a shielding layer EMP, and an interlayer adhesive layer ILP. Figure 4The configuration of the support member SPM illustrated in [Example] is an example, and embodiments supported by the present disclosure are not limited thereto. For example, one or more of the support layer SP, the buffer layer CP, the shielding layer EMP, and the interlayer adhesive layer ILP may be omitted, the stacking order of the support layer SP, the buffer layer CP, the shielding layer EMP, and the interlayer adhesive layer ILP may be changed to a different order than Figure 4 another order, or additional configurations may be further included in the support member SPM and Figure 4 the configurations illustrated in [Example].

[0096] The support layer SP may include a metallic material or a polymeric material. The support layer SP may be disposed on the lower side of the support plate MP. For example, the support layer SP may be a thin film metal substrate. The support layer SP may include a first sub-support layer SP1 and a second sub-support layer SP2 spaced apart from each other in the second direction DR2. The first sub-support layer SP1 and the second sub-support layer SP2 may be spaced apart from each other in a region corresponding to the folding region FA (see Figure 1A ). Since the support layer SP is provided as the first sub-support layer SP1 and the second sub-support layer SP2 spaced apart from each other in the folding region FA, the folding characteristics of the display device EA can be improved.

[0097] The buffer layer CP may be disposed on the lower side of the support layer SP. The buffer layer CP may prevent the support plate MP from being compressed and plastically deformed due to external shock and force. The buffer layer CP may improve the shock resistance of the display device EA. The buffer layer CP may include an elastomer, such as sponge, foam, or urethane resin. In some aspects, the buffer layer CP may be formed by including at least one of an acrylic polymer, a urethane-based polymer, a silicone-based polymer, and an imide-based polymer. However, this is an example, and embodiments supported by the present disclosure are not limited thereto.

[0098] The buffer layer CP may include a first sub-buffer layer CP1 and a second sub-buffer layer CP2 spaced apart from each other in the second direction DR2. The first sub-buffer layer CP1 and the second sub-buffer layer CP2 may be spaced apart from each other in a portion corresponding to the first folding axis FX1 (see Figure 1B ). Since the buffer layer CP is provided as the first sub-buffer layer CP1 and the second sub-buffer layer CP2 spaced apart from each other in the folding region FA, the folding characteristics of the display device EA can be improved.

[0099] The shielding layer EMP may be an electromagnetic wave shielding layer or a heat dissipation layer. In some aspects, the shielding layer EMP may be used as an adhesive layer. The interlayer adhesive layer ILP may combine the configurations of the support plate MP and the support member SPM. The interlayer adhesive layer ILP may be supplied in the form of an adhesive resin layer or a bonding tape. Figure 4Illustrates a configuration in which the interlayer adhesive layer ILP is supplied as two parts spaced apart from each other in a region corresponding to the first folding axis FX1 (see Figure 1B ), but embodiments supported by the present disclosure are not limited thereto. In addition to or in place of the illustrated examples, the interlayer adhesive layer ILP may be supplied as a single layer that is not spaced apart in a region corresponding to the first folding axis FX1 (see Figure 1B ).

[0100] The filling part SAP may be provided outside the support layer SP and the buffer layer CP. The filling part SAP may be provided between the support plate MP and the housing HAU (see Figure 3 ). The filling part SAP may fill the space between the support plate MP and the housing HAU (see Figure 3 ), and may fix the support plate MP (for example, fix the support plate MP to the housing HAU or another component of the display device EA).

[0101] The display device EA may further include a lower protective film DF. The lower protective film DF may be provided between the display module DM and the support plate MP. The lower protective film DF may have a configuration in which the lower protective film DF is provided below the display module DM and protects the rear surface of the display module DM. The lower protective film DF may completely overlap the display module DM. The lower protective film DF may include a polymer material. For example, the lower protective film DF may be a polyimide film or a polyethylene terephthalate film. However, this is an example, and the lower protective film DF is not limited thereto.

[0102] The lower adhesive layer AP-D may be provided between the support plate MP and the lower protective film DF. The support plate MP and the lower protective film DF may be joined by the lower adhesive layer AP-D. Non-limiting examples of the lower adhesive layer AP-D include a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA) film, and an optically clear adhesive resin (OCR) layer. However, this is an example, and embodiments supported by the present disclosure are not limited thereto. In addition to or in place of the illustrated examples, the lower adhesive layer AP-D may be omitted.

[0103] The display module DM may include a display panel DP and an input sensing part TP provided on the display panel DP. The display panel DP may have a configuration in which the display panel DP basically generates an image.

[0104] The input sensing unit TP can sense an external input, convert the external input into a predetermined input signal, and supply the input signal to the display panel DP. For example, the input sensing unit TP can be a touch sensing part that senses a touch input at the display device EA according to an embodiment. The input sensing unit TP can recognize or sense a direct touch of a user, an indirect touch of a user, a direct touch of an object, an indirect touch of an object, etc.

[0105] The input sensing unit TP can sense at least any one of the position and intensity of a touch applied from the outside. In an embodiment, the input sensing unit TP can have various structures or be made of various materials and is not limited to any one embodiment. For example, the input sensing unit TP can sense an external input in a capacitive manner. The display panel DP can be supplied with an input signal through the input sensing unit TP and can generate an image corresponding to the input signal.

[0106] Figure 5 is an enlarged cross-sectional view Figure 4 of the region XX' in Figure 5 is a cross-sectional view specifically illustrating the configuration of the protection member RM.

[0107] Referring to Figure 5 , the protection member RM can include a protection base layer BL, a hard coating HC provided on the protection base layer BL, and a protection layer PL provided on the hard coating HC. The protection layer PL can be directly provided on the hard coating HC. The protection layer PL can be provided on the uppermost part of the display device EA.

[0108] The protection member RM can have a thickness TN of about 60 μm to about 80 μm. In a comparative example, a protection member having a thickness less than about 60 μm may not be able to protect the display module from external impacts, and a protection member having a thickness greater than about 80 μm may increase the thickness of the display device, such that the folding reliability of the display device may deteriorate during repeated processes of folding and unfolding. In contrast, in an embodiment, the protection member RM can have a thickness TN of about 60 μm to about 80 μm, such that the protection member RM can exhibit excellent impact resistance (e.g., impact resistance satisfying a threshold), and can maintain the thickness of the display device EA at a level that supports the property of being easily repeatedly folded and unfolded.

[0109] The protective substrate layer BL can be a member that supplies the substrate surface, and a hard coating HC and a protective layer PL are provided on the substrate surface. For example, the protective substrate layer BL can be a flexible polymer film. The protective substrate layer BL can include at least one of polyethylene terephthalate, polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, and ethylene-vinyl alcohol copolymer. The protective substrate layer BL can have a thickness of about 65 μm. However, this is an example, and the thickness of the protective substrate layer BL is not limited thereto.

[0110] The hard coating HC can include a resin for a hard coating, and the hard coating includes at least one of an organic composition, an inorganic composition, and an organic / inorganic composite composition. In some examples, the hard coating HC can include a hard coating agent. For example, the hard coating agent for forming the hard coating HC can be a composition for a hard coating that includes at least one of an acrylic compound, a siloxane compound, and a silsesquioxane compound.

[0111] In some aspects, the hard coating agent can further include inorganic particles. Supplying inorganic particles in the hard coating agent can improve the hardness of the hard coating HC. The inorganic particles can include at least one of SiO2, TiO2, Al2O3, ZrO2, ZnO, AlN, and Si3N4. The inorganic particles can be surface-treated with an organic material such as silane to increase the dispersibility in the composition for a hard coating. For example, the hard coating HC can have a thickness of about 5 μm. However, this is an example, and the thickness of the hard coating HC is not limited thereto.

[0112] In an embodiment, the protective layer PL can include a matrix resin that includes dodecafluoroheptyl acrylate (DFHA) having a degree of polymerization of about 8, and the protective layer PL can include a first compound dispersed in the matrix resin. For example, the first compound can be dispersed in dodecafluoroheptyl acrylate. The first compound can include an azomethine compound.

[0113] The matrix resin of the protective layer PL can be formed by supplying a fluorine-based monomer having low refractive characteristics. Dodecafluoroheptyl acrylate can be a fluorine-based monomer having low refractive characteristics. Dodecafluoroheptyl acrylate having a degree of polymerization of about 8 can be represented by Formula 1.

[0114] [Formula 1]

[0115]

[0116] In the protective layer PL, the matrix resin may have a refractive index of about 1.2 to about 1.4. The dodecafluorooctyl acrylate represented by Formula 1 may have a refractive index of about 1.342. The matrix resin may further contain a material having low refractive characteristics. For example, the material may have a refractive index of about 1.2 to about 1.4. The protective layer PL containing the matrix resin having a refractive index of about 1.2 to about 1.4 may exhibit excellent anti-refraction characteristics.

[0117] In the protective layer PL, the matrix resin and the first compound may have a weight ratio of about 7:3 to about 9:1. With respect to the total weight of the matrix resin and the first compound, the matrix resin and the first compound may have a weight ratio of about 7:3 to about 9:1. For example, with respect to the total weight of the matrix resin and the first compound, the matrix resin and the first compound may have a weight ratio of about 8:2. In a comparative example, the protective layer in which the matrix resin and the first compound have a weight ratio of less than about 7:3 with respect to the total weight of the matrix resin and the first compound contains a relatively small amount of the matrix resin, and such a protective layer may not exhibit anti-refraction characteristics, and the display quality of the display device including the protective layer deteriorates. In a comparative example, the protective layer in which the matrix resin and the first compound have a weight ratio of greater than about 9:1 with respect to the total weight of the matrix resin and the first compound includes a relatively small amount of the first compound, ultraviolet light having UVA is not absorbed, and damage to the light-emitting element may be caused by the ultraviolet light. In contrast, in an embodiment, the protective layer PL in which the matrix resin and the first compound have a weight ratio of about 7:3 to about 9:1 with respect to the total weight of the matrix resin and the first compound may exhibit excellent anti-reflection characteristics and excellent ultraviolet light absorption characteristics.

[0118] The first compound may contain an azomethine compound. The first compound may contain a first sub-compound and a second sub-compound different from the first sub-compound. The first sub-compound may be an azomethine compound. The second sub-compound may include at least one of a benzotriazole-based compound, a cyanoacrylate-based compound, a benzophenone-based compound, a salicylic acid-based compound, a salicylate-based compound, a cinnamate-based compound, an oxanilide-based compound, a polystyrene-based compound, a polydimethylferrocenylsilane-based compound, a methylene compound, a triazine-based compound, a p-aminobenzoic acid-based compound, a cinnamic acid-based compound, and a urocanic acid-based compound. In the present disclosure, the “compound based on ~~” means a compound containing a “functional group of ~~”.

[0119] The first compound may include a material that absorbs ultraviolet light having UVA. As described herein, ultraviolet light having UVA may mean ultraviolet light having a wavelength range of about 315 nm to about 400 nm. In an embodiment, the protective layer PL containing a material that absorbs ultraviolet light having UVA can prevent damage to the light-emitting element ED (see Figure 6 ) caused by ultraviolet light. For example, the light-emitting element ED (see Figure 6 ) containing an organic material is susceptible to ultraviolet light, and when ultraviolet light is introduced into the display device EA (see Figure 4 ), the reliability of the display device EA (see Figure 6 ) including the light-emitting element ED (see Figure 4 ) deteriorates. In contrast, in an embodiment, the protective layer PL including a material that absorbs ultraviolet light having UVA can prevent damage to the light-emitting element ED (see Figure 6 ) caused by ultraviolet light having UVA, and can improve the reliability of the display device EA (see Figure 4 ).

[0120] In an embodiment, the second weight may be greater than the first weight relative to the total weight obtained by adding the first weight of the first sub-compound and the second weight of the second sub-compound. The first sub-compound and the second sub-compound may have a weight ratio of about 1:1.5 to about 1:3.5 relative to the total weight obtained by adding the first weight of the first sub-compound and the second weight of the second sub-compound. For example, the first sub-compound and the second sub-compound may have a weight ratio of about 1:2.5. In a comparative example, the protective layer containing the first sub-compound and the second sub-compound that do not satisfy the weight ratio range of about 1:1.5 to about 1:3.5 absorbs light in different wavelength regions, or reduces the degree of ultraviolet light absorption, and thus does not exhibit sufficient ultraviolet light absorption characteristics. In contrast, in an embodiment, the protective layer PL containing the first sub-compound and the second sub-compound having a weight ratio of about 1:1.5 to about 1:3.5 can exhibit excellent ultraviolet light absorption characteristics, thereby improving the reliability of the display device EA (see Figure 4 ).

[0121] In an example, the first sub-compound may be an azomethine compound, and the second sub-compound may be a benzotriazole-based compound. Alternatively, the first sub-compound may be an azomethine compound, and the second sub-compound may be a cyanoacrylate-based compound. The azomethine compound may be represented by the following formula 2. The azomethine compound represented by formula 2 exhibits the highest absorption for light having a wavelength range of about 300 nm to about 400 nm in the absorption spectrum. The azomethine compound represented by formula 2 exhibits an absorption close to 0 (zero) for light having a wavelength region greater than about 410 nm in the absorption spectrum.

[0122] [Formula 2]

[0123]

[0124] In Formula 2, R1 can be -[CH3CH2CH2] n1 (where n1 is 1), R2 can be -[CH3CH2O] n2 (where n2 is 6), and R3 can be -[CH3COO] n3 (where n3 is 2).

[0125] The benzotriazole-based compound can be represented by the following Formula 3. The first compound can include 2-(2'-hydroxy-5'-methylphenyl)benzotriazole as the benzotriazole-based compound. The cyanoacrylate-based compound can be represented by the following Formula 4.

[0126] [Formula 3]

[0127]

[0128] [Formula 4]

[0129]

[0130] The protective layer PL can have a thickness TH of about 0.08 μm to about 0.12 μm. In the comparative example, the protective layer having a thickness less than 0.08 μm does not have sufficient antireflection characteristics and ultraviolet light absorption characteristics, and thus the reliability of the display device deteriorates. In the comparative example, the protective layer having a thickness greater than about 0.12 μm increases the thickness of the display device, and the repetition of folding and unfolding is not easy. On the contrary, in the embodiment, the protective layer PL having a thickness of about 0.08 μm to about 0.12 μm exhibits excellent antireflection characteristics and excellent ultraviolet light absorption characteristics, as well as the characteristic of being easily repeatable for folding and unfolding. The display device EA including the protective layer PL satisfying the thickness TH range described herein (see Figure 4 ) can have excellent reliability.

[0131] In the embodiment, the protective layer PL can have a transmittance equal to or less than about 30% for light in the wavelength range of about 350 nm to about 410 nm. The protective layer PL can have a transmittance equal to or less than about 5% for light having a wavelength of about 405 nm. The light in the wavelength range of about 350 nm to about 410 nm can be included in ultraviolet light. In the present disclosure, visible light can be defined as light having a wavelength range greater than about 410 nm to about 800 nm.

[0132] The protective layer PL, which includes a matrix resin and a first compound dispersed in the matrix resin, may have a transmittance of equal to or less than about 30% for light in a wavelength region of about 350 nm to about 410 nm. The matrix resin includes dodecafluoroheptyl acrylate (DFHA) having a degree of polymerization of about 8. In some aspects, the protective layer PL, which includes a matrix resin and a first compound dispersed in the matrix resin, may have a transmittance of equal to or less than about 5% for light having a wavelength of about 405 nm. The matrix resin includes dodecafluoroheptyl acrylate (DFHA) having a degree of polymerization of about 8. Since the protective layer PL includes the first compound that absorbs ultraviolet light, the protective layer PL may exhibit low transmittance and high absorption characteristics for ultraviolet light. Thus, the display device EA (see Figure 4 ) including the protective layer PL according to the embodiment may have excellent reliability.

[0133] In an embodiment, the protective layer PL may have a reflectance including a specular component (SCI) of about 0.8 to about 1.8. For example, the protective layer PL may have an SCI reflectance of about 1.35 for light having a wavelength of about 550 nm.

[0134] The protective layer PL described herein, which includes a matrix resin and a first compound, may have an SCI reflectance of about 0.8 to about 1.8. By including a matrix resin formed of a material having low refractive characteristics, the protective layer PL may exhibit an SCI reflectance of about 0.8 to about 1.8. The protective layer PL having an SCI reflectance of about 0.8 to about 1.8 may exhibit excellent antireflection characteristics and may improve the display quality of the display device EA (see Figure 4 ).

[0135] Figure 6 is a cross-sectional view illustrating a portion taken along line II-II' in Figure 3 . Figure 6 is a cross-sectional view illustrating a display module DM according to an embodiment.

[0136] Referring to Figure 6 , the display panel DP may include a substrate BS, a circuit layer DP-CL disposed on the substrate BS, a display element layer DP-EL disposed on the circuit layer DP-CL, and a packaging layer TFE covering the display element layer DP-EL. The display panel DP may substantially generate an image. Figure 6 The configuration of the display panel DP illustrated in

[0137] The substrate BS can provide a substrate surface on which the circuit layer DP-CL is disposed. The substrate BS can be a flexible substrate, which is bendable, foldable, rollable, etc. The substrate BS can be a glass substrate, a metal substrate, a polymer substrate, etc. However, the embodiments supported by the present disclosure are not limited thereto, and the substrate BS can include an inorganic layer, an organic layer, or an organic-inorganic composite layer.

[0138] The substrate BS can include a single layer or multiple layers. For example, the substrate BS can include a first synthetic resin layer, a single layer or multiple inorganic layers, and a second synthetic resin layer disposed on the single layer or multiple inorganic layers. Each of the first synthetic resin layer and the second synthetic resin layer can include a polyimide-based resin. In some aspects, each of the first synthetic resin layer and the second synthetic resin layer can include at least one of an acrylic resin, a methacryloyl-based resin, a polyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyamide-based resin, and a perylene-based resin. In the present disclosure, "resin based on ~~" means a resin containing a "functional group of ~~".

[0139] The display panel DP can include a transistor TR and a light-emitting element ED. The transistor TR and the light-emitting element ED can be disposed on the substrate BS. Figure 6 One transistor TR is illustrated, but the display panel DP can basically include multiple transistors and at least one capacitor for driving the light-emitting element ED.

[0140] The circuit layer DP-CL can include an insulating layer, a semiconductor pattern, a conductive pattern, signal lines, and other components that support the features of the circuit layer DP-CL. For example, the circuit layer DP-CL can include a switching transistor and a driving transistor for driving the light-emitting element ED of the display element layer DP-EL.

[0141] The circuit layer DP-CL can include a shielding electrode BML, a transistor TR, a connection electrode CNE, and multiple insulating layers BFL and INS1 to INS6. The multiple insulating layers BFL and INS1 to INS6 can include a buffer layer BFL and a first insulating layer to a sixth insulating layer INS1 to INS6. However, Figure 6 the stacked structure of the circuit layer DP-CL illustrated is an example, and the stacked structure of the circuit layer DP-CL can be changed according to the configuration of the display panel DP, the process of the circuit layer DP-CL, etc.

[0142] The shielding electrode BML can be disposed on the substrate BS. The shielding electrode BML can overlap with the transistor TR. The shielding electrode BML can protect the transistor TR by shielding light incident from the lower part of the display panel DP to the transistor TR. The shielding electrode BML can include a conductive material. In an example where a voltage is applied to the shielding electrode BML, the threshold voltage of the transistor TR disposed on the shielding electrode BML can be maintained. However, embodiments supported by the present disclosure are not limited thereto, and the shielding electrode BML can be a floating electrode. The shielding electrode BML can be omitted.

[0143] The buffer layer BFL can be disposed on the substrate BS to cover the shielding electrode BML. The buffer layer BFL can include an inorganic material. The buffer layer BFL can improve the bonding force between the semiconductor pattern or the conductive pattern disposed on the buffer layer BFL and the substrate BS.

[0144] The transistor TR can include a source S1, a channel C1, a drain D1, and a gate G1. The source S1, the channel C1, and the drain D1 of the transistor TR can be formed of a semiconductor pattern. The semiconductor pattern of the transistor TR can include polysilicon, amorphous silicon, or a metal oxide, and the semiconductor pattern can be implemented with any suitable material having semiconductor properties or can include any suitable material having semiconductor properties, without limitation and not limited to any one.

[0145] The semiconductor pattern can include a plurality of regions divided according to the conductivity magnitude. The regions of the semiconductor pattern doped with a dopant or reduced by a metal oxide can have a large conductivity and can substantially serve as the source electrode and the drain electrode of the transistor TR. The regions of the semiconductor pattern having a large conductivity can correspond to the source S1 and the drain D1 of the transistor TR. The regions of the semiconductor pattern that are undoped or doped at a low concentration, or not reduced by a metal oxide, can have a low conductivity and can correspond to the channel C1 (or active) of the transistor TR.

[0146] When covering the semiconductor pattern of the transistor TR, the first insulating layer INS1 can be disposed on the buffer layer BFL. The gate G1 of the transistor TR can be disposed on the first insulating layer INS1. In a plane, the gate G1 can overlap with the channel C1 of the transistor TR. During the process of doping the semiconductor pattern of the transistor TR, the gate G1 can act as a mask.

[0147] When covering the gate G1, the second insulating layer INS2 can be disposed on the first insulating layer INS1. The third insulating layer INS3 can be disposed on the second insulating layer INS2.

[0148] The connection electrode CNE may include a first connection electrode CNE1 and a second connection electrode CNE2 for electrically connecting the transistor TR and the light-emitting element ED. However, the configuration of the connection electrode CNE for electrically connecting the transistor TR and the light-emitting element ED is not limited thereto, and one of the first connection electrode and the second connection electrodes CNE1 and CNE2 may be omitted, or additional connection electrodes may be further included.

[0149] The first connection electrode CNE1 may be disposed on the third insulating layer INS3. The first connection electrode CNE1 may be connected to the drain D1 through a first contact hole CH1 that penetrates the first insulating layer INS1 to the third insulating layer INS3. The fourth insulating layer INS4 may be disposed on the third insulating layer INS3 while covering the first connection electrode CNE1. The fifth insulating layer INS5 may be disposed on the fourth insulating layer INS4.

[0150] The second connection electrode CNE2 may be disposed on the fifth insulating layer INS5. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through a second contact hole CH2 that penetrates the fourth insulating layer INS4 and the fifth insulating layer INS5. The sixth insulating layer INS6 may be disposed on the fifth insulating layer INS5 while covering the second connection electrode CNE2.

[0151] Each of the first insulating layer INS1 to the sixth insulating layer INS6 may include an inorganic layer or an organic layer. For example, the inorganic layer may include at least one of alumina, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic layer may include at least one of an acrylic resin, a methacryloyl-based resin, a polyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyamide-based resin, and a perylene-based resin.

[0152] The display element layer DP-EL may include a pixel defining film PDL and a light-emitting element ED. The light-emitting element ED may include a first electrode AE, a hole control layer HCL, a light-emitting layer EML, an electron control layer TCL, and a second electrode CE. The light-emitting element ED may include at least one organic material. At least one of the hole control layer HCL, the light-emitting layer EML, and the electron control layer TCL may include an organic material. As described herein, the protective layer PL (see Figure 5 ) according to an embodiment may exhibit excellent ultraviolet light absorption characteristics and thus may prevent (or minimize) damage to the light-emitting element ED containing an organic material caused by ultraviolet light.

[0153] The light-emitting element layer LED can emit light. For example, the light-emitting element ED can include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, quantum dots, quantum rods, micro LEDs, or nano LEDs.

[0154] The first electrode AE can be disposed on the sixth insulating layer INS6. The first electrode AE can be connected to the second connection electrode CNE2 through a third contact hole CNH3 that penetrates the sixth insulating layer INS6. The first electrode AE can be electrically connected to the drain D1 of the transistor TR through the first connection electrode CNE1 and the second connection electrode CNE2.

[0155] The first electrode AE can be formed of a metal material, a metal alloy, or a conductive compound. The first electrode AE can be an anode or a cathode. However, the embodiments supported by the present disclosure are not limited thereto. In some aspects, the first electrode AE can be a pixel electrode. The first electrode AE can be a transmissive electrode, a transflective electrode, or a reflective electrode. The first electrode AE can include at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn, a compound of at least two selected therefrom, a mixture of at least two selected therefrom, and an oxide thereof.

[0156] In an example where the first electrode AE is a transmissive electrode, the first electrode AE can include a transparent metal oxide, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. In an example where the first electrode AE is a transflective electrode or a reflective electrode, the first electrode AE can include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, W, or a compound or mixture thereof (for example, a mixture of Ag and Mg); and / or LiF / Ca (a stacked structure of LiF and Ca) or LiF / Al (a stacked structure of LiF and Al). Alternatively, the first electrode AE can have a multilayer structure that includes a reflective film or a transflective film formed of the above materials, and a transparent conductive film formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. For example, the first electrode AE can have a three-layer structure of ITO / Ag / ITO, but the embodiments supported by the present disclosure are not limited thereto. In some embodiments, the first electrode AE can include the metal materials described herein, a combination of at least two metal materials selected from the metal materials described herein, oxides of the metal materials described herein, etc.

[0157] The pixel defining layer PDL can be disposed on the sixth insulating layer INS6. A light-emitting opening PX_OP exposing a part of the first electrode AE can be defined in the pixel defining layer PDL. The part of the first electrode AE exposed by the light-emitting opening PX_OP can be defined as the light-emitting area LA.

[0158] The display area DP-DA of the display module DM can include a light-emitting area LA and a light-blocking area NLA. The area where the pixel defining layer PDL is disposed can correspond to the light-blocking area NLA. The light-blocking area NLA can surround the light-emitting area LA in the display area DP-DA.

[0159] The hole control layer HCL can be disposed on the first electrode AE and the pixel defining layer PDL. The hole control layer HCL can be provided as a common layer overlapping with the light-emitting area LA and the light-blocking area NLA. The hole control layer HCL can include at least one of a hole transport layer, a hole injection layer, and an electron blocking layer. The hole control layer HCL can include well-known hole injection materials and / or well-known hole transport materials.

[0160] The light-emitting layer EML can be disposed on the hole control layer HCL. The light-emitting layer EML can be disposed in the area corresponding to the light-emitting opening PX_OP. Alternatively, the light-emitting layer EML can be provided as a common layer. The light-emitting layer EML can contain an organic light-emitting material and / or an inorganic light-emitting material. The light-emitting layer EML can emit light of any one of red, green, and blue colors. For example, the light-emitting layer EML can emit blue light.

[0161] The electron control layer TCL can be disposed on the light-emitting layer EML. The electron control layer TCL can be provided as a common layer overlapping with the light-emitting area LA and the light-blocking area NLA. The electron control layer TCL can include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer. The electron control layer TCL can include well-known electron injection materials and / or well-known electron transport materials.

[0162] The second electrode CE can be disposed on the electron control layer TCL. The second electrode CE can be provided as a common layer overlapping with the light-emitting area LA and the light-blocking area NLA.

[0163] The second electrode CE can be a common electrode. The second electrode CE can be a cathode or an anode, but the embodiments supported by the present disclosure are not limited thereto. In an example where the first electrode AE is an anode, the second electrode CE can be a cathode, and when the first electrode AE is a cathode, the second electrode CE can be an anode.

[0164] The second electrode CE can be a transmissive electrode, a semi-transmissive reflective electrode, or a reflective electrode. In an example where the second electrode CE is a transmissive electrode, the second electrode CE can be formed of a transparent metal oxide (e.g., indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc.).

[0165] When the second electrode CE is a semi-transmissive reflective electrode or a reflective electrode, the second electrode CE can include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, Yb, W, or a compound or mixture containing the same (e.g., AgMg, AgYb, or MgYb); and / or LiF / Ca or LiF / Al. Alternatively, the second electrode CE can have a multilayer structure including a reflective film or a semi-transmissive reflective film formed of the above materials, and a transparent conductive film formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. For example, the second electrode CE can include the metal materials described herein, a combination of at least two metal materials selected from the metal materials described herein, or an oxide of the metal materials described herein.

[0166] The encapsulation layer TFE can be provided on the display element layer DP-EL. The encapsulation layer TFE can be provided on the second electrode CE to cover the light-emitting element ED. The encapsulation layer TFE can protect the display element layer DP-EL from foreign substances such as moisture, oxygen, and / or dust particles. The encapsulation layer TFE can include a plurality of thin films.

[0167] The encapsulation layer TFE can include at least one inorganic film. For example, the encapsulation layer TFE can include an inorganic film provided on the second electrode CE and an organic film provided between the inorganic films. The inorganic film can protect the light-emitting element ED from moisture / oxygen, and the organic film can protect the light-emitting element ED from foreign substances such as dust particles.

[0168] The input sensing unit TP can be provided on the display panel DP. For example, the input sensing unit TP can be directly provided on the encapsulation layer TFE of the display panel DP. Alternatively, an adhesive layer can be provided between the input sensing unit TP and the display panel DP.

[0169] In the present disclosure, "one component is directly provided / set on another component" means that no third component is provided / set between one component and another component. That is, one component being "directly provided / set" on another component means that one component is "in contact" with another component.

[0170] The input sensing unit TP may include a first sensing insulating layer IL1, a second sensing insulating layer IL2, and a third sensing insulating layer IL3. The input sensing unit TP may include at least one conductive layer disposed on the sensing insulating layer. The input sensing unit TP may include a first conductive layer CDL1 and a second conductive layer CDL2.

[0171] The first sensing insulating layer IL1 may be disposed on the encapsulation layer TFE. The first sensing insulating layer IL1 may include at least one inorganic insulating layer. The first sensing insulating layer IL1 may be in contact with the encapsulation layer TFE. Alternatively, the first sensing insulating layer IL1 may be omitted, and in this case, the first conductive layer CDL1 may be in contact with the encapsulation layer TFE.

[0172] The first conductive layer CDL1 may be disposed on the first sensing insulating layer IL1. The first conductive layer CDL1 may include a plurality of first conductive patterns. The plurality of first conductive patterns may be disposed on the first sensing insulating layer IL1. The second sensing insulating layer IL2 may be disposed on the first sensing insulating layer IL1 so as to at least partially cover the first conductive layer CDL1.

[0173] The second conductive layer CDL2 may be disposed on the second sensing insulating layer IL2. The second conductive layer CDL2 may include a plurality of second conductive patterns. The plurality of second conductive patterns may be disposed on the second sensing insulating layer IL2. The plurality of second conductive patterns may be respectively connected to the plurality of first conductive patterns through contact holes formed in the second sensing insulating layer IL2.

[0174] Each of the plurality of first conductive patterns of the first conductive layer CDL1 and the plurality of second conductive patterns of the second conductive layer CDL2 may be disposed to correspond to the light blocking region NLA. Each of the plurality of first conductive patterns of the first conductive layer CDL1 and the plurality of second conductive patterns of the second conductive layer CDL2 may correspond to a grid pattern.

[0175] The third sensing insulating layer IL3 may be disposed on the second sensing insulating layer IL2 and may cover the second conductive layer CDL2. Each of the second sensing insulating layer IL2 and the third sensing insulating layer IL3 may include an inorganic insulating layer and an organic insulating layer.

[0176] The first conductive layer CDL1 and the second conductive layer CDL2 may each have a single-layer structure, or may have a stacked multi-layer structure along the third direction DR3. The first conductive layer CDL1 and the second conductive layer CDL2 having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). In some aspects, the transparent conductive layer may include a conductive polymer (e.g., taking PEDOT as an example), metal nanowires, graphene, etc.

[0177] The first conductive layer CDL1 and the second conductive layer CDL2 having a multi-layer structure may include a metal layer. For example, the metal layer may have a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti). The first conductive layer CDL1 and the second conductive layer CDL2 having a multi-layer structure may have at least one metal layer and at least one transparent conductive layer.

[0178] Reference Figure 7A 、 Figure 7B and Figure 8 are used to describe exemplary aspects of the methods and processes supported by aspects of the present disclosure. In the description of the methods and processes herein, the operations may be performed in an order different from the order shown and / or described, or may be performed in a different order or at different times. Certain operations may also be omitted from the flowchart, one or more operations may be repeated, or other operations may be added. According to the exemplary aspects described herein, the description of elements such as "may be arranged", "may be formed", etc. includes methods, processes, and techniques for arranging, forming, positioning, and modifying the elements, etc.

[0179] A display device according to an embodiment may be formed in a method for manufacturing a display device according to an embodiment. Figure 7A and Figure 7B are flowcharts illustrating operations for manufacturing a display device according to an embodiment. Figure 8 is a diagram schematically illustrating operations for manufacturing a display device according to an embodiment. Hereinafter, in the description Figures 7A to 8 will not repeat the description made with reference to Figures 1A to 6 and will mainly describe the differences.

[0180] Reference Figure 7A , a method for manufacturing a display device according to an embodiment may include an operation (S100) of preparing a display panel and an operation (S200) of supplying (providing) a protection member on the display panel. The display panel DP (see Figure 4 ) may be foldable with respect to at least one first folding axis FX1 or a second folding axis FX2 (seeFigure 1B and Figure 1D ). Protective member RM (see Figure 5 ) may include a protective base layer BL (see Figure 5 ), set in the protective base layer BL (see Figure 5 ) on the hard coating HC (see Figure 5 ) and provided on the hard coating HC (see Figure 5 ) on the protective layer PL (see Figure 5 ). refer to Figure 7B , the operation of supplying the protection member ( S200 ) may include an operation of preparing a substrate including the protection base layer BL and the hard coating layer HC ( S210 ) and an operation of forming the protection layer PL by supplying a base resin and a first compound on the substrate ( S220 ).

[0181] Figure 8 is an example showing the formation of the protective member RM (see Figure 5 ) operation. Figure 8 The operation may include using a vacuum deposition polymerization device VC to form a protective member RM (see Figure 5 )combined.

[0182] The vacuum deposition polymerization device VC may include a main body 90, a vacuum tank 80, a tube 70, a source unit 60, and a support portion 100. The vacuum tank 80 is connected to the main body 90, and the tube 70 is disposed between the vacuum tank 80 and the source unit 60, so that the material can be supplied from the source unit 60 to the vacuum tank 80 through the tube 70. The support portion 100 may include a first sub-support portion 100-1 and a plurality of second sub-support portions 100-2 disposed on the first sub-support portion 100-1. The second sub-support portion 100-2 may be disposed between the vacuum tank 80 and the first sub-support portion 100-1. The support portion 100 may be configured so that the support portion 100 supports the vacuum tank 80. Figure 8 The configuration of the vacuum deposition polymerization apparatus VC illustrated in FIG. 1 is an example, and embodiments supported by the present disclosure are not limited thereto.

[0183] A first roller 10 in one direction and a second roller 20 spaced apart from the first roller 10 may be provided in the body 90. The first roller 10 may be provided at an upper portion of the body 90, and the second roller 20 may be provided at a lower portion of the body 90. The first roller 10 and the second roller 20 may rotate clockwise.

[0184] The main roller 30 may be disposed between the first roller 10 and the second roller 20. The main roller 30 may be disposed in the vacuum chamber 80. The tube 70 may be disposed adjacent to the main roller 30. The main roller 30 may rotate in a fourth direction DR4, and the fourth direction DR4 may be a counterclockwise direction. A plurality of sub-rollers 40 may be disposed between the first roller 10 and the main roller 30, and a plurality of sub-rollers 40 may be disposed between the second roller 20 and the main roller 30. The sub-rollers 40 may be tension rollers. The substrate CF may be supplied onto the first roller 10, and the vacuum deposition polymerization apparatus VC may move the substrate CF along the main roller 30 and the sub-rollers 40, which is associated with setting the substrate CF onto the second roller 20. The substrate CF disposed on the second roller 20 may be the substrate CF on which the protective layer PL (see Figure 5 ) is formed. The substrate CF may include a protective base layer BL and a hard coating HC.

[0185] The source unit 60 may provide a first source material MA1 and a second source material MA2 onto the substrate CF moving along the main roller 30. The source unit 60 may supply the first source material MA1 and the second source material MA2 such that the protective layer PL (see Figure 5 ) is formed on the substrate CF. The source unit 60 may include a first source portion 60-1, a second source portion 60-2, a first valve 60-3, a second valve 60-4, and a heater 60-5.

[0186] The first source portion 60-1 may supply the first source material MA1, and the second source portion 60-2 may supply the second source material MA2. The first valve 60-3 may be connected to the first source portion 60-1 and control the supply of the first source material MA1, and the second valve 60-4 may be connected to the second source portion 60-2 and control the supply of the second source material MA2. The heater 60-5 may be disposed on both sides of each of the first source portion 60-1 and the second source portion 60-2, and provide an environment of a target temperature such that the vacuum deposition polymerization apparatus VC may supply the first source material MA1 and the second source material MA2 according to the target temperature.

[0187] The first source material MA1 may be a material for supplying a matrix resin, and the second source material MA2 may be a material for supplying a first compound. The first source material MA1 and the second source material MA2 may be supplied in a weight ratio of about 7:3 to about 9:1 with respect to the total weight of the first source material MA1 and the second source material MA2.

[0188] The first source material MA1 may include dodecafluoroheptyl acrylate, which is a fluorine-based monomer having low refractive characteristics. The second source material MA2 may include a single material or multiple materials. The second source material MA2 may include an azomethine compound as a single material. Alternatively, the second source material MA2 may include a first sub-compound and a second sub-compound as multiple materials. The first sub-compound and the second sub-compound may be mixed at a weight ratio of about 1:1.5 to about 1:3.5 relative to the total weight of the first sub-compound and the second sub-compound, and may be supplied.

[0189] The first sub-compound may be an azomethine compound. The second sub-compound may include at least one of a benzotriazole-based compound, a cyanoacrylate-based compound, a benzophenone-based compound, a salicylic acid-based compound, a salicylate-based compound, a cinnamate-based compound, an oxanilide-based compound, a polystyrene-based compound, a polydimethylferrocenylsilane-based compound, a methylene-based compound, a triazine-based compound, a p-aminobenzoic acid-based compound, a cinnamic acid-based compound, and a urocanic acid-based compound. In some aspects, the first source material MA1 may further include a monomer having low refractive characteristics within a range in which the low refractive characteristics of the protective layer PL are not deteriorated.

[0190] The method may include forming the protective layer PL by a dry process. Forming the protective layer PL may include supplying the first source material MA1 and the second source material MA2 at an ion acceleration voltage of about 100 V to about 500 V. The method may include supplying the matrix resin and the first compound at an ion acceleration voltage of about 100 V to about 500 V. For example, the method may include supplying the matrix resin and the first compound at an ion acceleration voltage of about 300 V. In a comparative example in which the matrix resin and the first compound are supplied at an ion acceleration voltage of less than about 100 V, it is not easy to form the protective layer, and in a comparative example in which the matrix resin and the first compound are supplied at an ion acceleration voltage of greater than about 500 V, a protective layer having low wear resistance is formed. In contrast, the method for manufacturing a display device according to an embodiment including an operation of supplying the matrix resin and the first compound at an ion acceleration voltage of about 100 V to about 500 V may exhibit excellent manufacturing reliability. The protective layer PL (see Figure 5 ) formed from the matrix resin and the first compound supplied at an ion acceleration voltage of about 100 V to about 500 V may exhibit excellent wear resistance and excellent adhesion to the substrate CF.

[0191] The method may include performing an operation of forming the protective layer PL (see Figure 5 ) at a temperature of about -30 °C to about 10 °C. For example, the method may include performing an operation of forming the protective layer PL at a temperature of about -20 °C (seeFigure 5 ) operation. In a comparative example where a protective layer is formed at a temperature lower than about -30°C, the first source material and / or the second source material may have low molecular energy, which prevents the easy formation of the protective layer. In a comparative example where a protective layer is formed at a temperature higher than about 10°C, a protective layer with low wear resistance is formed. In contrast, a method for manufacturing a display device according to an embodiment including the operation of forming the protective layer PL at a temperature of about -30°C to about 10°C can exhibit excellent manufacturing reliability.

[0192] The method may include forming a matrix resin from dodecafluoroheptyl acrylate of the first source material MA1, and the method may include dispersing a first compound of the second source material MA2 in the matrix resin to form an initial protective layer. The method may include supplying the initial protective layer on the substrate CF to form the protective layer PL (see Figure 5 ). The method may include forming and supplying the initial protective layer in the same operation. That is, the method may include simultaneously performing polymerization (which is a process of forming the protective layer PL (see Figure 5 )) and deposition of the protective layer PL (see Figure 5 ). The method may include forming the protective layer PL (see Figure 5 ) by directly dispersing the first compound in the matrix resin on the substrate CF. Therefore, a method for manufacturing a display device according to an embodiment can exhibit excellent manufacturing efficiency.

[0193] In some embodiments, a method for manufacturing a display device according to an embodiment can exhibit the following characteristics: wherein by optimizing the temperature of the region (the region on the main roller 30 or the sub-roller 40) where the substrate CF is disposed in the vacuum deposition polymerization apparatus VC, the speed of forming the protective layer PL (see Figure 5 ), the voltage for supplying the first compound (e.g., ion acceleration voltage), etc., a target protective layer PL (see Figure 5 ) can be easily formed according to the form / operation characteristics of the display device.

[0194] The vacuum deposition polymerization apparatus VC may include a microwave emitting device 50. The microwave emitting device 50 may be disposed between the second roller 20 and the main roller 30. The microwave emitting device 50 may emit microwaves (and irradiate an object with microwaves) to improve the bonding force between the protective layer PL (see Figure 5 ) and the substrate CF formed when moving along the main roller 30. The substrate CF on which the protective layer PL (see Figure 5 ) is formed, that is, the protective member RM (see Figure 5 ) manufactured by the manufacturing method according to an embodiment may be present on the second roller 20.

[0195] A display device according to an embodiment may include a protection member disposed on a display panel. The protection member may include a protection base layer, a hard coat layer, and a protection layer stacked in sequence. The protection layer may include a matrix resin and a first compound dispersed in the matrix resin. The matrix resin may include dodecafluoroheptyl acrylate having a degree of polymerization of about 8, and the first compound may include an azomethine compound. Accordingly, the protection layer may exhibit excellent antireflection characteristics and excellent ultraviolet light absorption characteristics, and the display device including the protection layer may have excellent reliability.

[0196] A display device according to an embodiment may be manufactured in a method for manufacturing a display device according to an embodiment. The method for manufacturing a display device according to an embodiment may include an operation of forming a protection layer, in which a matrix resin and a first compound may be supplied, and the first compound may be dispersed in the matrix resin, and at the same time, the protection layer may be formed on the hard coat layer. Accordingly, the method for manufacturing a display device according to an embodiment may exhibit excellent manufacturing efficiency, and a display device having excellent reliability may be manufactured by the method.

[0197] A display device according to an embodiment may include a protection layer including an ultraviolet light absorbing material, thereby exemplifying excellent reliability.

[0198] The method for manufacturing a display device according to an embodiment may include an operation of forming a protection layer by supplying an ultraviolet light absorbing material, thereby manufacturing a display device having excellent reliability.

[0199] Above, the description has been made with reference to exemplary embodiments of the inventive concept, but those skilled in the art or ordinary technicians in the relevant technical field may understand that various modifications and changes may be made to the inventive concept without departing from the spirit and technical scope of the inventive concept described in the appended claims.

[0200] Therefore, the technical scope of the inventive concept is not limited to the content described in the detailed description of the specification, but should be determined by the claims.

Claims

1. A display device, comprising: A display panel foldable with respect to at least one folding axis; And A protective member provided on the display panel; Wherein the protective member comprises: A protective substrate layer; A hard coating provided on the protective substrate layer; and A protective layer provided on the hard coating, and the protective layer comprises: A matrix resin, the matrix resin comprising dodecafluoroheptyl acrylate having a degree of polymerization of 8; and A first compound dispersed in the matrix resin, wherein the first compound comprises an azomethine compound.

2. The display device according to claim 1, wherein a weight ratio of the matrix resin to the first compound is 7:3 to 9:

1.

3. The display device according to claim 1, wherein: The first compound comprises a first sub-compound and a second sub-compound different from the first sub-compound, the first sub-compound being the azomethine compound, and The second sub-compound comprises at least one of a benzotriazole-based compound, a cyanoacrylate-based compound, a benzophenone-based compound, a salicylic acid-based compound, a salicylate-based compound, a cinnamate-based compound, an oxanilide-based compound, a polystyrene-based compound, a polydimethylferrocenylsilane-based compound, a methylene-based compound, a triazine-based compound, a p-aminobenzoic acid-based compound, a cinnamic acid-based compound, and a urocanic acid-based compound.

4. The display device according to claim 3, wherein the second weight is greater than the first weight with respect to a total weight of a first weight of the first sub-compound and a second weight of the second sub-compound.

5. The display device according to claim 3, wherein a weight ratio of the first sub-compound to the second sub-compound is 1:1.5 to 1:3.

5.

6. The display device according to claim 1, wherein a thickness of the protective layer is 0.08 μm to 0.12 μm.

7. The display device according to claim 1, wherein a reflectance of the protective layer including a specular component is 0.8 to 1.8, and Wherein a transmittance of the protective layer with respect to light having a wavelength range of 350 nm to 410 nm is 30% or less than 30%.

8. The display device according to claim 1, wherein the protective substrate layer comprises at least one of polyethylene terephthalate, polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, and ethylene-vinyl alcohol copolymer.

9. The display device according to claim 1, wherein a refractive index of the matrix resin is 1.2 to 1.

4.

10. A method for manufacturing a display device, the method comprising: Preparing a display panel foldable with respect to at least one folding axis; And Supplying a protective member on the display panel, the protective member comprising a protective substrate layer; A hard coating provided on the protective substrate layer; And a protective layer provided on the hard coating, Wherein the supplying of the protective member comprises: Prepare a substrate including the protective matrix layer and the hard coating; and Form the protective layer on the substrate by supplying the following: A matrix resin containing dodecafluoroheptyl acrylate having a degree of polymerization of 8, and A first compound including an azomethine compound, and wherein the protective layer contains the first compound dispersed in the dodecafluoroheptyl acrylate.

11. The method according to claim 10, wherein the formation of the protective layer includes supplying the matrix resin and the first compound at an ion acceleration voltage of 100V to 500V.

12. The method according to claim 10, wherein the formation of the protective layer includes: Form an initial protective layer by dispersing the first compound in the matrix resin; and Deposit the initial protective layer on the substrate, wherein the formation of the initial protective layer and the deposition of the initial protective layer are carried out in the same operation.

13. The method according to claim 10, wherein the formation of the protective layer is carried out at a temperature of -30°C to 10°C.

14. The method according to claim 10, wherein the weight ratio of the matrix resin to the first compound is 7:3 to 9:

1.

15. The method according to claim 10, wherein: The first compound includes a first sub-compound and a second sub-compound different from the first sub-compound, the first sub-compound is the azomethine compound, and The second sub-compound includes at least one of a benzotriazole-based compound, a cyanoacrylate-based compound, a benzophenone-based compound, a salicylic acid-based compound, a salicylate-based compound, a cinnamate-based compound, an oxanilide-based compound, a polystyrene-based compound, a polydimethylferrocenylsilane-based compound, a methylene-based compound, a triazine-based compound, a p-aminobenzoic acid-based compound, a cinnamic acid-based compound, and a urocanic acid-based compound, and wherein the weight ratio of the first sub-compound to the second sub-compound is 1:1.5 to 1:3.5.

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