Preparation method of high-strength nanoscale chip packaging material

Abstract

The invention discloses a preparation method of a high-strength nanoscale chip packaging material, and relates to the technical field of packaging materials. The material consists of a surface layer, a bottom layer and a middle formula layer, and is prepared from specific conductive master batch, ABS (Acrylonitrile Butadiene Styrene), PS (Poly Styrene), conductive carbon black, modified nylon and related auxiliaries through the processes of batching, feeding, stirring, extruding, rolling, slitting and rolling. The low-moisture-content polypropylene composite material is excellent in mechanical property, high in tensile strength, good in elongation, stable in glossiness and low in moisture content. The material disclosed by the invention can be widely applied to the field of chip packaging, and has excellent conductivity, mechanical stability and environment-friendly characteristics.

Description

Technical Field

[0001] The present invention relates to the technical field of encapsulation materials, and in particular to a preparation method of a high-strength nanoscale chip encapsulation material. Background Art

[0002] With the rapid development of electronic information technology, integrated circuit chips, as the core of the information industry, have an increasing demand. Chip encapsulation technology, as an important link in the chip manufacturing process, plays a crucial role in improving the performance of chips, protecting the chip structure, and realizing functional integration. Chip encapsulation materials need to simultaneously meet the requirements of high mechanical strength, good electrical conductivity, excellent heat resistance, and processability. Especially in high-frequency, high-density, and extreme environment applications, the performance requirements for encapsulation materials are further improved.

[0003] Traditional chip encapsulation materials such as epoxy resins and polyimides, although showing good performance in some aspects, have certain limitations in mechanical properties, electrical conductivity, environmental adaptability, etc. For example, epoxy resin materials have low tensile strength, are prone to stress cracking, and have poor electrical conductivity, making them unsuitable for high-end applications that require stable electrical contact. While polyimide materials have good heat resistance, they have poor processability, high dependence on equipment during the preparation process, complex processes, and high costs. In addition, traditional encapsulation materials usually cannot simultaneously optimize mechanical properties and electrical conductivity, which limits their application in high-performance chip encapsulation.

[0004] In addition, with the increase in the operating frequency of electronic devices, the demand for the electrical conductivity of chip encapsulation materials is further enhanced. The dispersion of conductive fillers in traditional materials is poor, resulting in an unstable conductive network of the materials, which in turn affects the consistency of electrical properties. At the same time, the optical properties of encapsulation materials, such as gloss and surface quality, have gradually become one of the important indicators for measuring high-end encapsulation materials. However, the existing materials have limited ability to regulate optical properties and are difficult to meet the requirements of both bright and matte application scenarios.

[0005] Therefore, there is an urgent need to develop a high-performance, easy-to-process chip encapsulation material that can balance mechanical properties, electrical conductivity, and optical properties. By reasonably designing the material formula and optimizing the preparation process, the product performance can be improved while reducing production costs, providing a better solution for the chip encapsulation industry and meeting the needs of the modern electronics industry. Summary of the Invention

[0006] In view of the above problems, developing a multifunctional encapsulation material with high mechanical strength, excellent electrical conductivity and environmental adaptability has become the key research direction. By optimizing the material formula, including the synergistic effect of acrylonitrile-butadiene-styrene copolymer (ABS), polystyrene (PS), conductive carbon black and various additives, and combining precise control of process parameters, the present invention prepares a method for preparing a high-strength nanoscale chip encapsulation material. This material has excellent mechanical and electrical properties, and the surface gloss can be controlled, meeting the application requirements of multiple scenarios, significantly improving the encapsulation reliability and service life of chips, and providing a reliable solution for high-end electronic devices.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A method for preparing a high-strength nanoscale chip encapsulation material, which includes:

[0009] The surface layer and the bottom layer: are made of conductive masterbatch, and the conductive masterbatch is selected from one or a combination of carbon black conductive masterbatch and graphite conductive masterbatch; the middle layer: consists of 50-70 parts by weight of acrylonitrile-butadiene-styrene copolymer, 20-40 parts by weight of polystyrene, 5-15 parts by weight of conductive carbon black, 3-8 parts by weight of modified nylon, 0.5-2 parts of reinforcing agent, 0.1-0.5 parts of antioxidant, 0.1-0.5 parts of lubricant and 0.3-1 part of toughening agent;

[0010] The three layers are compounded to form an integral structure, wherein the thickness of the surface layer and the bottom layer is 0.02-0.05 mm, and the thickness of the middle layer is 0.1-0.5 mm.

[0011] The preparation method of the reinforcing agent includes the following steps:

[0012] By mass, 0.05-0.5 parts of methallyl nickel dichloride dimer (CAS No.: 12145-60-7), 10-20 parts of zirconium aminophthalate MOF (CAS No.: 1260119-00-3), 200-300 parts of DMF and 2-5 parts of trimethylamine are stirred and reacted at 70-80 °C for 100 to 150 minutes; then 0.2-0.5 parts of allyl phenyl selenide (CAS No.: 14370-82-2) are added, and the stirring reaction is continued at 70-80 °C for 50 to 120 minutes; DMF is removed by distillation to obtain the reinforcing agent.

[0013] The antioxidant is selected from antioxidant type 1010 or antioxidant type 168.

[0014] The lubricant is selected from at least one of calcium stearate, zinc stearate or polyethylene wax.

[0015] The toughening agent is selected from at least one of maleic anhydride grafted polypropylene or hydrogenated styrene-butadiene-styrene copolymer.

[0016] For the chip packaging material described above, its preparation method includes the following steps:

[0017] (1) Ingredients preparation: Weigh each component according to the following proportions: 50-70 parts by weight of acrylonitrile-butadiene-styrene copolymer, 20-40 parts by weight of polystyrene, 5-15 parts by weight of conductive carbon black, 3-8 parts by weight of modified nylon, 0.5-2 parts of reinforcing agent, 0.1-0.5 parts of antioxidant, 0.1-0.5 parts of lubricant, and 0.3-1 part of toughening agent;

[0018] (2) Feeding: Add the weighed acrylonitrile-butadiene-styrene copolymer, polystyrene, conductive carbon black, modified nylon, reinforcing agent, antioxidant, lubricant, and toughening agent into a high-speed mixer in sequence;

[0019] (3) Stirring: Mix evenly at a stirring speed of 300-500 rpm for 10-15 minutes to ensure the uniformity of the mixture;

[0020] (4) Extrusion: Extrude the mixture through a twin-screw extruder, control the extrusion temperature at 180-200 °C, and the screw speed at 80-120 rpm;

[0021] (5) Press roll: Shape the extruded material through a press roll device, adjust the thickness within the range of 0.3-0.8 mm, and control the surface glossiness, with a matte surface having a glossiness of 19-21 and a shiny surface having a glossiness of 71-83;

[0022] (6) Slitting: Trim and cut into the target size through a slitting device;

[0023] (7) Rewinding: Roll the final product into a coil and store it in a dry environment.

[0024] Mechanism and technical effects:

[0025] The allyl-amino addition reaction between methallyl nickel dichloride dimer and zirconium aminoterephthalate MOF, as well as the similar reaction between allyl phenyl selenide and zirconium aminoterephthalate MOF, are the key steps in the preparation of high-end chip packaging materials.

[0026] 1. Function of methallyl nickel dichloride dimer: As part of the reaction, the allyl group in the structure of methallyl nickel dichloride dimer can undergo an addition reaction with the amino group in zirconium aminoterephthalate MOF to form a new chemical bond. This reaction helps to enhance the mechanical properties of the material because the newly formed chemical bond can increase the crosslinking density and rigidity of the material.

[0027] Modification of allylphenylselenium: Allylphenylselenium further modifies zirconium aminoterephthalate MOF through a similar addition reaction, introducing selenium element. The introduction of selenium element can endow the material with better conductivity and optical effects, because selenium is a semiconductor element that can form conductive paths in the material.

[0028] 2. Influence of particle morphology

[0029] As a metal-organic framework material, zirconium aminoterephthalate MOF has MOF particles with specific morphologies and sizes. After the addition reaction, these particles can be evenly dispersed in the matrix material, thereby improving the mechanical properties and stability of the material. At the same time, the particle morphology also affects the conductivity and optical effects of the material. Particles with specific shapes and sizes may be more conducive to the transmission of electrons and the scattering or absorption of light, thereby improving the conductivity and optical properties of the material.

[0030] 3. Technical effects

[0031] Excellent mechanical properties: The new chemical bonds introduced through the allyl-amine addition reaction and the evenly dispersed MOF particles together improve the tensile strength and rigidity of the material.

[0032] Good conductivity and optical effects: The introduction of selenium element endows the material with good conductivity, while the specific particle morphology helps to improve the optical effects of the material.

[0033] In summary, the allyl-amine addition reaction between methallyl nickel dichloride dimer and zirconium aminoterephthalate MOF, as well as the similar reaction between allylphenylselenium and zirconium aminoterephthalate MOF, have successfully prepared materials for high-end chip packaging by means of changing molecular structures, considering steric hindrance and controlling particle morphology. This material not only has excellent mechanical properties, good conductivity and optical effects, but also meets environmental protection requirements and is suitable for complex and changeable chip packaging application scenarios. Specific implementation manners

[0034] The following embodiments are provided to better further understand the present invention. They are not limited to the best implementation manner, and do not constitute a limitation on the content and protection scope of the present invention. Any product that is the same as or similar to the present invention obtained by anyone under the inspiration of the present invention or by combining the features of the present invention with other existing technologies falls within the protection scope of the present invention.

[0035] Example 1:

[0036] Ingredients:

[0037] Weigh 50 g of acrylonitrile-butadiene-styrene copolymer, 40 g of polystyrene, 5 g of conductive carbon black, 8 g of modified nylon, 0.5 g of reinforcing agent, 0.5 g of antioxidant type 1010, 0.1 g of calcium stearate lubricant, and 1 g of maleic anhydride grafted polypropylene toughening agent.

[0038] Preparation of the reinforcing agent: Stir and react 0.05 g of methallyl nickel dichloride dimer (CAS No.: 12145-60-7), 20 g of zirconium aminophthalate MOF (CAS No.: 1260119-00-3), 200 g of DMF, and 5 g of trimethylamine at 70 °C for 150 minutes; then add 0.2 g of allyl phenyl selenide (CAS No.: 14370-82-2) and continue to stir and react at 70 °C for 120 minutes; distill off DMF to obtain the reinforcing agent.

[0039] Feeding:

[0040] Sequentially add the weighed acrylonitrile-butadiene-styrene copolymer, polystyrene, conductive carbon black, modified nylon, reinforcing agent, antioxidant, lubricant, and toughening agent into a high-speed mixer.

[0041] Stirring:

[0042] Mix evenly at a stirring speed of 300 rpm for 15 minutes to ensure the uniformity of the mixture.

[0043] Extrusion:

[0044] Extrude the mixture through a twin-screw extruder, control the extrusion temperature at 180 °C, and the screw speed at 120 rpm.

[0045] Press roller:

[0046] Shape the extruded material through a press roller device, adjust the thickness to 0.3 mm, and control the surface gloss. The matte surface has a gloss of 19, and the shiny surface has a gloss of 71.

[0047] Slitting:

[0048] Trim and cut the material into the target size through a slitting device.

[0049] Rewinding:

[0050] Roll the final product into a coil and store it in a dry environment.

[0051] Among them, the surface layer and the bottom layer are made of carbon black conductive masterbatch, with a thickness of 0.02 mm; the thickness of the middle layer is 0.1 mm.

[0052] Example 2:

[0053] Formulation:

[0054] Weigh 60 g of acrylonitrile-butadiene-styrene copolymer, 30 g of polystyrene, 10 g of conductive carbon black, 5 g of modified nylon, 1 g of reinforcing agent, 0.3 g of antioxidant of type 168, 0.3 g of zinc stearate lubricant and 0.6 g of hydrogenated styrene-butadiene-styrene copolymer toughening agent.

[0055] Preparation of the reinforcing agent: Stir and react 0.3 g of methallylnickel dichloride dimer (CAS No.: 12145-60-7), 15 g of zirconium aminophthalate MOF (CAS No.: 1260119-00-3), 250 g of DMF and 3 g of trimethylamine at 75 °C for 120 minutes; then add 0.3 g of allylphenylselenium (CAS No.: 14370-82-2), and continue to stir and react at 75 °C for 80 minutes; distill off DMF to obtain the reinforcing agent.

[0056] Feeding:

[0057] Add the weighed acrylonitrile-butadiene-styrene copolymer, polystyrene, conductive carbon black, modified nylon, reinforcing agent, antioxidant, lubricant and toughening agent into a high-speed mixer in sequence.

[0058] Stirring:

[0059] Mix evenly at a stirring speed of 400 rpm for 12 minutes to ensure the uniformity of the mixture.

[0060] Extrusion:

[0061] Extrude and process the mixture through a twin-screw extruder, control the extrusion temperature at 190 °C, and the screw speed at 100 rpm.

[0062] Press roller:

[0063] Shape the extruded material through a press roller device, adjust the thickness to 0.5 mm, and control the surface glossiness, with a matte surface having a glossiness of 20 and a shiny surface having a glossiness of 77.

[0064] Slitting:

[0065] Trim and cut the material into the target size through a slitting device.

[0066] Rewinding:

[0067] Roll the final product into a coil and store it in a dry environment.

[0068] Among them, the surface layer and the bottom layer are made of graphite conductive masterbatch, with a thickness of 0.03 mm; the thickness of the middle layer is 0.3 mm.

[0069] Example 3:

[0070] Ingredient preparation:

[0071] Weigh 70 g of acrylonitrile-butadiene-styrene copolymer, 20 g of polystyrene, 15 g of conductive carbon black, 3 g of modified nylon, 1.5 g of reinforcing agent, 0.1 g of antioxidant 1010, 0.5 g of polyethylene wax lubricant and 0.3 g of maleic anhydride grafted polypropylene toughening agent.

[0072] Preparation of the reinforcing agent: Stir and react 0.5 g of methallyl nickel dichloride dimer (CAS No.: 12145-60-7), 10 g of zirconium aminophthalate MOF (CAS No.: 1260119-00-3), 300 g of DMF and 2 g of trimethylamine at 80 °C for 100 minutes; then add 0.5 g of allyl phenyl selenide (CAS No.: 14370-82-2) and continue to stir and react at 80 °C for 50 minutes; distill off DMF to obtain the reinforcing agent.

[0073] Feeding:

[0074] Add the weighed acrylonitrile-butadiene-styrene copolymer, polystyrene, conductive carbon black, modified nylon, reinforcing agent, antioxidant, lubricant and toughening agent to a high-speed mixer in sequence.

[0075] Stirring:

[0076] Mix uniformly at a stirring speed of 500 rpm for 10 minutes to ensure the uniformity of the mixture.

[0077] Extrusion:

[0078] Extrude and process the mixture through a twin-screw extruder, with the extrusion temperature controlled at 200 °C and the screw speed at 80 rpm.

[0079] Press roller:

[0080] Shape the extruded material through a press roller device, adjust the thickness to 0.8 mm, and control the surface glossiness, with a matte surface of 21 glossiness and a shiny surface of 83 glossiness.

[0081] Slitting:

[0082] Trim and cut the material into the target size through a slitting device.

[0083] Rewinding:

[0084] Roll the final product into a coil and store it in a dry environment.

[0085] Among them, the surface layer and the bottom layer are made of a combination of carbon black and graphite conductive masterbatch, with a thickness of 0.05 mm; the thickness of the intermediate layer is 0.5 mm.

[0086] Example 4:

[0087] Ingredient preparation:

[0088] Weigh 55 g of acrylonitrile-butadiene-styrene copolymer, 35 g of polystyrene, 8 g of conductive carbon black, 6 g of modified nylon, 2 g of reinforcing agent, 0.4 g of antioxidant 168 type, 0.2 g of calcium stearate and zinc stearate mixed lubricant (mixed in a ratio of 1:1), and 0.8 g of hydrogenated styrene-butadiene-styrene copolymer toughening agent.

[0089] Preparation of the reinforcing agent: Stir and react 0.2 g of methallyl nickel dichloride (CAS No.: 12145-60-7), 18 g of zirconium aminophthalate MOF (CAS No.: 1260119-00-3), 220 g of DMF, and 4 g of trimethylamine at 78 °C for 130 minutes; then add 0.4 g of allyl phenyl selenide (CAS No.: 14370-82-2), and continue to stir and react at 78 °C for 100 minutes; distill off DMF to obtain the reinforcing agent.

[0090] Feeding:

[0091] Add the weighed acrylonitrile-butadiene-styrene copolymer, polystyrene, conductive carbon black, modified nylon, reinforcing agent, antioxidant, lubricant, and toughening agent to a high-speed mixer in sequence.

[0092] Stirring:

[0093] Mix evenly at a stirring speed of 350 rpm for 13 minutes to ensure the uniformity of the mixture.

[0094] Extrusion:

[0095] Extrude the mixture through a twin-screw extruder, control the extrusion temperature at 185 °C, and the screw speed at 110 rpm.

[0096] Press roller:

[0097] Shape the extruded material through a press roller device, adjust the thickness to 0.4 mm, and control the surface gloss. The matte surface has a gloss of 20, and the shiny surface has a gloss of 75.

[0098] Slitting:

[0099] Trim and cut the material into the target size through a slitting device.

[0100] Rewinding:

[0101] Roll the final product into a coil and store it in a dry environment.

[0102] Among them, the surface layer and the bottom layer are made of graphite conductive masterbatch with a thickness of 0.04 mm; the thickness of the middle layer is 0.2 mm.

[0103] Comparative Example 1:

[0104] This example is a comparative example of Example 1, and the difference from Example 1 is only that no enhancer is added.

[0105] Comparative Example 2:

[0106] This example is a comparative example of Example 1, and the difference from Example 1 is only that nickel dimethallylchloride dimer is not added during the preparation of the enhancer.

[0107] Comparative Example 3:

[0108] This example is a comparative example of Example 1, and the difference from Example 1 is only that zirconium aminophthalate is not added during the preparation of the enhancer.

[0109] Testing method:

[0110] Tensile strength test: The tensile strength of the material is tested according to the standard of GB / T 1040;

[0111] Elongation at break test: The elongation at break of the material is tested according to the standard of GB / T 1040;

[0112] Moisture content test: The moisture content of the material is measured using an infrared moisture meter;

[0113] Density test: The density of the material is measured according to the standard of GB / T 1033.

[0114] Test results:

[0115] Table 1 Test results of examples and comparative examples

[0116] Tensile strength MPa Elongation at break % Moisture content % <![CDATA[Density g / cm 3 > Example 1 32.2 81 0.18 1.05 Example 2 33.0 85 0.16 1.06 Example 3 33.5 88 0.15 1.05 Example 4 33.8 91 0.13 1.07 Comparative Example 1 28.9 70 0.24 1.03 Comparative Example 2 31.9 77 0.19 1.04 Comparative Example 3 30.5 74 0.21 1.04

[0117] Obviously, the above examples are only for clearly illustrating the examples and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. And the obvious changes or modifications derived therefrom are still within the protection scope of the present invention.

Claims

1. A method for preparing a high-strength nanoscale chip packaging material, comprising: The surface layer and the bottom layer are made of a conductive masterbatch, wherein the conductive masterbatch is selected from a carbon black conductive masterbatch, a graphite conductive masterbatch or a combination thereof; The middle layer is composed of 50-70 parts by weight of acrylonitrile-butadiene-styrene copolymer, 20-40 parts by weight of polystyrene, 5-15 parts by weight of conductive carbon black, 3-8 parts by weight of modified nylon, 0.5-2 parts of reinforcing agent, 0.1-0.5 parts of antioxidant, 0.1-0.5 parts of lubricant and 0.3-1 parts of toughening agent; The three layers are combined to form an overall structure, wherein the thickness of the surface layer and the bottom layer is 0.02-0.05mm, and the thickness of the middle layer is 0.1-0.5mm; The reinforcing agent is prepared by reacting methallyl nickel chloride dimer, aminophthalate zirconium MOF and allylphenyl selenium.

2. The preparation method of a high-strength nanoscale chip packaging material according to claim 1, wherein: The preparation method of the enhancer comprises the following steps: According to the mass fraction, 0.05-0.5 parts of methallyl nickel chloride dimer, 10-20 parts of zirconium aminophthalate MOF, 200-300 parts of DMF and 2-5 parts of trimethylamine are stirred and reacted at 70-80° C. for 100 to 150 minutes; then 0.2-0.5 parts of allylphenyl selenium are added, and the stirring reaction is continued at 70-80° C. for 50 to 120 minutes; and DMF is removed by distillation to obtain the enhancer.

3. A method for preparing a high-strength nanoscale chip packaging material according to claim 1, characterized in that: The antioxidant is selected from 1010 type antioxidant or 168 type antioxidant.

4. A method for preparing a high-strength nanoscale chip packaging material according to claim 1, characterized in that: The lubricant is selected from at least one of calcium stearate, zinc stearate or polyethylene wax.

5. A method for preparing a high-strength nanoscale chip packaging material according to claim 1, characterized in that: The toughening agent is selected from at least one of maleic anhydride grafted polypropylene or hydrogenated styrene-butadiene-styrene copolymer.

6. A method for preparing a high-strength nanoscale chip packaging material according to claim 1, characterized in that: The chip packaging material, the preparation method thereof comprises the following steps: (1) Ingredients: Weigh the following components in the following proportions: 50-70 parts by weight of acrylonitrile-butadiene-styrene copolymer, 20-40 parts by weight of polystyrene, 5-15 parts by weight of conductive carbon black, 3-8 parts by weight of modified nylon, 0.5-2 parts of reinforcing agent, 0.1-0.5 parts of antioxidant, 0.1-0.5 parts of lubricant and 0.3-1 parts of toughening agent; (2) Adding materials: weighing acrylonitrile-butadiene-styrene copolymer, polystyrene, conductive carbon black, modified nylon, reinforcing agent, antioxidant, lubricant and toughening agent into a high-speed mixer in sequence; (3) Stirring: Mix evenly at a stirring speed of 300-500 rpm for 10-15 minutes to ensure that the mixture is uniform; (4) Extrusion: The mixture is extruded through a twin-screw extruder, the extrusion temperature is controlled at 180-200° C., and the screw speed is 80-120 rpm; (5) Pressing roller: The extruded material is shaped by the pressing roller equipment, the thickness is adjusted within the range of 0.3-0.8 mm, and the surface gloss is controlled, the matte surface is 19-21 gloss, and the bright surface is 71-83 gloss; (6) Slitting: trimming and cutting into target size by slitting device; (7) Rewinding: The final product is rolled into a coil and stored in a dry environment.