Improved IGBT chip with high stability and heat dissipation performance and manufacturing method thereof

Abstract

The invention discloses an improved IGBT chip with high stability and heat dissipation performance and a manufacturing method thereof, and relates to the technical field of power electronics, the improved IGBT chip comprises a heat dissipation base, a limiting groove, a limiting mechanism and an adjusting mechanism, a fixing frame is fixedly connected in the heat dissipation base, the fixing frame is fixedly connected with a mounting plate, and the mounting plate is fixedly connected with the limiting groove. Limiting grooves are symmetrically formed in the surface of the heat dissipation base with the mounting plate as the center, limiting mechanisms are arranged on the two sides of each limiting groove, an adjusting groove is formed in the position, below the fixing frame, of the heat dissipation base, and a threaded transmission adjusting mechanism is detachably arranged in the adjusting groove. By rotating the knob, the threaded rod is in threaded fit with the positioning hole to drive the mounting frame to move, then the limiting pressing plate is embedded into the clamping groove, the IGBT chip is limited, the limiting piece is pushed by the threaded rod to fix the chip with the help of the gasket, the mounting stability is improved, the cooling fins below the mounting plate are matched with the cooling fan and the ventilation groove, good air circulation is formed, and the service life of the IGBT chip is prolonged. The working temperature of the chip is effectively reduced, stable operation is ensured, and performance and service life are improved.

Description

Technical Field

[0001] The present invention relates to the field of power electronics technology, and in particular to an improved IGBT chip with high stability and heat dissipation and a manufacturing method thereof. Background Art

[0002] Insulated Gate Bipolar Transistor (IGBT) chips, as the core components in the field of power electronics, are widely used in many fields such as industrial control and new energy. However, there are some problems that need to be solved urgently in the actual use of IGBT chips on the market currently; In terms of stability, the installation method of traditional IGBT chips often cannot effectively resist the interference of external vibrations and other factors, which easily causes the chip to displace during operation, thereby affecting its electrical performance and working reliability. The fixation between the chip and the mounting plate is not firm enough, and loosening may occur after long-term use, increasing the risk of equipment failure; The heat dissipation performance is also an important factor restricting the performance of IGBT chips. With the continuous increase of the chip power density, the heat generated during its operation is also increasing day by day. If the heat cannot be dissipated in time and effectively, the chip temperature will continue to rise, resulting in performance degradation and even possible chip damage. Therefore, those skilled in the art provide an improved IGBT chip with high stability and heat dissipation and a manufacturing method thereof to solve the problems raised in the above background art. Summary of the Invention

[0003] The purpose of the present invention is to provide an improved IGBT chip with high stability and heat dissipation and a manufacturing method thereof to solve the problems raised in the above background art.

[0004] To achieve the above purpose, the present invention provides the following technical solutions: An improved IGBT chip with high stability and heat dissipation and a manufacturing method thereof, including a heat dissipation base, a limiting groove, a limiting mechanism and an adjusting mechanism. A fixing frame is fixedly connected inside the heat dissipation base. The fixing frame has a convex structure. An installation plate is fixedly connected to the fixing frame. Limiting grooves are symmetrically opened on the surface of the heat dissipation base with the installation plate as the center. Limiting mechanisms are arranged on both sides of the limiting groove. And an installation pin groove is opened on the upper surface of the installation plate. An IGBT chip is detachably installed on the installation pin groove. An adjusting groove is opened below the fixing frame in the heat dissipation base. An adjusting mechanism with threaded transmission is detachably installed in the adjusting groove.

[0005] As a further solution of the present invention: The limiting mechanism includes a rotating frame, a transmission member, a limiting pressure plate, a fixed block and a card slot. Rotating frames are symmetrically arranged in the limiting grooves on both sides. A transmission member is movably connected to the rotating frame. The transmission member has an L-shaped structure. Limiting pressure plates are arranged on one side of the fixed frame close to the rotating frame. The limiting pressure plates are inclined. Fixed blocks are symmetrically arranged on the side of the limiting pressure plate away from the fixed frame. One side of the transmission member is movably connected to the fixed block. Card slots are opened on both sides of the mounting plate close to the limiting pressure plate, and the card slots cooperate with the limiting pressure plates.

[0006] As a further solution of the present invention: The side of the transmission member away from the limiting pressure plate cooperates with the limiting block.

[0007] As a further solution of the present invention: The adjusting mechanism includes a mounting frame, a knob, a threaded rod, a ventilation groove, a limiting block and a guiding groove. Guiding grooves are symmetrically opened on both sides of the fixed frame. The fixed frame is movably connected to the mounting frame through the limiting groove. Limiting blocks are fixedly connected to both sides of the mounting frame. Fixing plates are fixedly connected to both sides of the mounting frame. A threaded rod is movably connected to the fixing plate. A knob is arranged at one end of the threaded rod passing through the fixing plate.

[0008] As a further solution of the present invention: Positioning grooves are opened on both sides of the mounting plate on the fixed frame. Positioning holes are opened in the positioning grooves. The positioning holes have a threaded structure, and the positioning holes cooperate with the threaded rod.

[0009] As a further solution of the present invention: A limiting member is arranged on the fixed frame. Both sides of the limiting member have a threaded structure. The limiting member cooperates with the threaded rod, and a gasket is arranged on the surface of the limiting member. The limiting member cooperates with the surface of the IGBT chip through the gasket.

[0010] As a further solution of the present invention: A heat sink is arranged below the mounting plate, and a cooling fan is installed on one side of the mounting frame close to the heat sink. The cooling fan cooperates with the heat sink, and a ventilation groove is opened on the side of the mounting frame away from the heat sink.

[0011] An improved IGBT chip with high stability and heat dissipation and its manufacturing method include the following steps: S1: Symmetrically install the rotating frames in the limiting grooves, connect the transmission members, and then install the limiting pressure plates to connect the transmission members with the fixed blocks to complete the assembly of the limiting mechanism. Let the threaded rod pass through the fixing plate and be threadedly engaged with the positioning holes to initially install the adjusting mechanism; S2: Integrate the limiting mechanism and the adjusting mechanism into the heat dissipation base, install the limiting member on the fixed frame to cooperate with the threaded rod, and closely attach the heat sink to the lower side of the mounting plate; S3: Rotate the knob to check whether the adjustment mechanism runs smoothly, whether the mounting bracket moves smoothly, and at the same time check whether the limiting mechanism operates normally and whether the limiting pressure plate can be accurately inserted into the card slot; S4: Turn on the power of the cooling fan, check the operation and air volume, simulate the chip heating, monitor the temperatures at the heat sink and the chip mounting location, and evaluate the heat dissipation performance; S5: After passing the debugging and inspection, install the IGBT chip on the mounting plate through the mounting pin slots. Rotate the knob to let the limiting part press the chip tightly through the gasket to complete the manufacturing and installation.

[0012] Compared with the prior art, the beneficial effects of the present invention are: By rotating the knob, the threaded rod rotates on the fixed plate, and the thread of the threaded rod cooperates with the positioning hole, thereby driving the mounting bracket to move along the guide groove. Since the side of the transmission part away from the limiting pressure plate cooperates with the limiting block, it will push the transmission part to rotate around the connection point with the rotating frame. When the transmission part rotates, the end of it movably connected to the fixed block will push the fixed block, and then drive the limiting pressure plate to rotate around its connection point with the fixed frame. During the rotation process, the end of it close to the mounting plate gradually approaches the card slot and finally inserts into the card slot. When the limiting pressure plate is inserted into the card slot, it plays a limiting role on the IGBT chip on the mounting plate, ensuring the stability of the IGBT chip installation; After completing the position adjustment of the IGBT chip and determining the final installation position, continue to rotate the knob. At this time, the threaded rod continues to move. Since both sides of the limiting part are threaded and cooperate with the threaded rod, the movement of the threaded rod will push the limiting part to move towards the IGBT chip. There is a gasket on the surface of the limiting part. When the limiting part touches the surface of the IGBT chip, the gasket plays a role in buffering and increasing the friction force. As the limiting part continues to approach the chip, the IGBT chip can be tightly fixed on the mounting plate, preventing the chip from shifting due to vibration or other reasons during use, and further improving the stability of the chip installation; The heat sink provided below the mounting plate is used to absorb the heat generated when the IGBT chip works. The cooling fan installed on the side of the mounting bracket close to the heat sink starts to work. The air blown by the cooling fan acts on the heat sink, accelerating the air flow around the heat sink, thereby improving the heat dissipation efficiency of the heat sink. There is a ventilation slot on the side of the mounting bracket away from the heat sink, and the ventilation slot provides a channel for the air flow, enabling the hot air passing through the heat sink to be discharged smoothly, forming a good air circulation, continuously and effectively reducing the working temperature of the IGBT chip, ensuring that the chip works stably within a suitable temperature range, and improving the performance and service life of the chip. Description of the Drawings

[0013] Figure 1 It is a three-dimensional structure schematic diagram of an improved IGBT chip with high stability and heat dissipation.

[0014] Figure 2 An exploded view of an improved IGBT chip with high stability and heat dissipation.

[0015] Figure 3 A top view of the heat dissipation base in an improved IGBT chip with high stability and heat dissipation.

[0016] Figure 4 It is Figure 3 A schematic cross-sectional structure diagram in the A-A direction of

[0017] Figure 5 A schematic structure diagram of the limiting mechanism in an improved IGBT chip with high stability and heat dissipation.

[0018] Figure 6 A schematic structure diagram of the adjusting mechanism in an improved IGBT chip with high stability and heat dissipation.

[0019] Figure 7 A schematic diagram of the cooperation between the heat sink and the cooling fan in an improved IGBT chip with high stability and heat dissipation.

[0020] In the figure: 1. Heat dissipation base; 2. Limiting groove; 3. Limiting mechanism; 301. Rotating frame; 302. Transmission part; 303. Limiting pressure plate; 304. Fixed block; 305. Card slot; 4. Limiting part; 5. Installation needle slot; 6. Adjusting mechanism; 601. Installation frame; 602. Knob; 603. Threaded rod; 604. Ventilation slot; 605. Limiting block; 606. Fixed plate; 7. Positioning groove; 8. Installation plate; 9. Positioning hole; 10. Cooling fan; 11. Heat sink; 12. Adjusting slot; 13. Fixed frame. Detailed implementation manners

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. Embodiment

[0022] Refer to Figures 1-5, this embodiment provides an improved IGBT chip with high stability and heat dissipation, including a heat dissipation base 1, a limiting groove 2, a limiting mechanism 3 and an adjusting mechanism 6. A fixing frame 13 is fixedly connected inside the heat dissipation base 1. The fixing frame 13 has a convex structure. An installation plate 8 is fixedly connected to the fixing frame 13. Limiting grooves 2 are symmetrically opened on the surface of the heat dissipation base 1 with the installation plate 8 as the center. Limiting mechanisms 3 are arranged on both sides of the limiting groove 2. And an installation pin groove 5 is opened on the upper surface of the installation plate 8. An IGBT chip is detachably installed on the installation pin groove 5. An adjusting groove 12 is opened below the fixing frame 13 in the heat dissipation base 1. An adjusting mechanism 6 with threaded transmission is detachably installed in the adjusting groove 12; In this embodiment, specifically, the limiting mechanism 3 includes a rotating frame 301, a transmission member 302, a limiting pressing plate 303, a fixing block 304 and a clamping groove 305. Rotating frames 301 are symmetrically arranged in the two limiting grooves 2 on both sides. A transmission member 302 is movably connected to the rotating frame 301. The transmission member 302 has an L-shaped structure. Limiting pressing plates 303 are arranged on one side of the fixing frame 13 close to the rotating frame 301. The limiting pressing plates 303 are inclined. Fixing blocks 304 are symmetrically arranged on one side of the limiting pressing plate 303 away from the fixing frame 13. One side of the transmission member 302 is movably connected to the fixing block 304. Clamping grooves 305 are opened on both sides of the installation plate 8 close to the limiting pressing plate 303. The clamping grooves 305 cooperate with the limiting pressing plates 303; The side of the transmission member 302 away from the limiting pressing plate 303 cooperates with the limiting block 605; Before the IGBT chip is installed, the limiting mechanism 3 is in an initial state. The transmission member 302 is movably connected to the rotating frame 301. One end of the L-shaped transmission member 302 is connected to the rotating frame 301, and the other end is movably connected to the fixing block 304. The fixing block 304 is installed on one side of the limiting pressing plate 303 away from the fixing frame 13. At this time, the limiting pressing plate 303 is inclined and does not cooperate with the clamping groove 305 on the installation plate 8. Place the IGBT chip on the installation pin groove 5 on the installation plate 8; By rotating the knob 602, the threaded rod 603 rotates on the fixing plate 606, and the threaded rod 603 is in threaded cooperation with the positioning hole 9, so as to drive the installation frame 601 to move along the guide groove 607. Since the side of the transmission member 302 away from the limiting pressing plate 303 cooperates with the limiting block 605, it will push the transmission member 302 to rotate around the connection point with the rotating frame 301. When the transmission member 302 rotates, the end of it movably connected to the fixing block 304 will push the fixing block 304, and then drive the limiting pressing plate 303 to rotate around its connection point with the fixing frame 13. During the rotation process, the end of it close to the installation plate 8 gradually approaches the clamping groove 305 and finally embeds into the clamping groove 305. When the limiting pressing plate 303 is embedded into the clamping groove 305, it plays a limiting role on the IGBT chip on the installation plate 8, ensuring the stability of the installation of the IGBT chip. Embodiment

[0023] Reference Figures 3-7 , this embodiment is based on the previous embodiment. The difference from the previous embodiment is that the adjusting mechanism 6 includes a mounting frame 601, a knob 602, a threaded rod 603, a ventilation slot 604, a limiting block 605 and a guiding slot 607. Guiding slots 607 are symmetrically formed on both sides of the fixed frame 13. The fixed frame 13 is movably connected to the mounting frame 601 through the limiting slot 2. Limiting blocks 605 are fixedly connected to both sides of the mounting frame 601. Fixing plates 606 are fixedly connected to both sides of the mounting frame 601. A threaded rod 603 is movably connected to the fixing plates 606. One end of the threaded rod 603 penetrates through the fixing plate 606 and is provided with a knob 602; Positioning grooves 7 are formed on both sides of the mounting plate 8 of the fixed frame 13. Positioning holes 9 are formed in the positioning grooves 7. The positioning holes 9 are in a threaded structure. The positioning holes 9 cooperate with the threaded rod 603; A limiting member 4 is provided on the fixed frame 13. Both sides of the limiting member 4 are in a threaded structure. The limiting member 4 cooperates with the threaded rod 603. And a gasket is provided on the surface of the limiting member 4. The limiting member 4 cooperates with the surface of the IGBT chip through the gasket; A heat sink 11 is provided below the mounting plate 8. And a cooling fan 10 is installed on one side of the mounting frame 601 close to the heat sink 11. The cooling fan 10 cooperates with the heat sink 11. And a ventilation slot 604 is formed on one side of the mounting frame 601 away from the heat sink 11.

[0024] After completing the position adjustment of the IGBT chip and determining the final installation position, continue to rotate the knob 602. At this time, the threaded rod 603 continues to move. Since both sides of the limiting member 4 are in a threaded structure and cooperate with the threaded rod 603, the movement of the threaded rod 603 will push the limiting member 4 to move towards the IGBT chip. A gasket is provided on the surface of the limiting member 4. When the limiting member 4 contacts the surface of the IGBT chip, the gasket plays a role of buffering and increasing friction. As the limiting member 4 continues to approach the chip, the IGBT chip can be tightly fixed on the mounting plate 8, preventing the chip from shifting due to vibration or other reasons during use, and further improving the stability of chip installation; The heat sink 11 provided below the mounting plate 8 is used to absorb the heat generated when the IGBT chip works. The cooling fan 10 installed on one side of the mounting bracket 601 close to the heat sink 11 starts to work. The air blown by the cooling fan 10 acts on the heat sink 11, accelerating the air flow around the heat sink 11, thereby improving the heat dissipation efficiency of the heat sink 11. A ventilation slot 604 is provided on the side of the mounting bracket 601 away from the heat sink 11. The ventilation slot 604 provides a channel for the air flow, enabling the hot air passing through the heat sink 11 to be discharged smoothly, forming a good air circulation, continuously and effectively reducing the working temperature of the IGBT chip, ensuring the chip to work stably within an appropriate temperature range, and improving the performance and service life of the chip. Embodiment

[0025] An improved IGBT chip with high stability and heat dissipation and its manufacturing method include the following steps: S1: Symmetrically install the rotating frame 301 in the limiting slot 2, connect the transmission member 302, and then install the limiting pressure plate 303 to connect the transmission member 302 with the fixed block 304, completing the assembly of the limiting mechanism 3. Let the threaded rod 603 pass through the fixing plate 606 and be in threaded cooperation with the positioning hole 9, and initially install the adjusting mechanism 6; S2: Integrate the limiting mechanism 3 and the adjusting mechanism 6 onto the heat dissipation base 1. Install the limiting member 4 on the fixing frame 13 to cooperate with the threaded rod 603, and tightly attach the heat sink 11 under the mounting plate 8; S3: Rotate the knob 602 to check whether the adjusting mechanism 6 runs smoothly, whether the mounting bracket 601 moves smoothly, and at the same time check whether the limiting mechanism 3 operates normally and whether the limiting pressure plate 303 can accurately fit into the card slot 305; S4: Connect the power supply of the cooling fan 10, check the operation and air volume, simulate the chip heating, monitor the temperatures at the heat sink 11 and the chip installation location, and evaluate the heat dissipation performance; S5: After the debugging and testing are qualified, install the IGBT chip on the mounting plate 8 through the mounting pin slot 5, and rotate the knob 602 to make the limiting member 4 press the chip tightly through the gasket, completing the manufacturing and installation.

[0026] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0027] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An improved IGBT chip with high stability and heat dissipation, characterized in that, It includes a heat dissipation base (1), a limiting groove (2), a limiting mechanism (3) and an adjusting mechanism (6). A fixing frame (13) is fixedly connected inside the heat dissipation base (1). The fixing frame (13) has a convex structure. An installation plate (8) is fixedly connected to the fixing frame (13). Limiting grooves (2) are symmetrically opened on the surface of the heat dissipation base (1) with the installation plate (8) as the center. Limiting mechanisms (3) are arranged on both sides of the limiting groove (2). And an installation pin groove (5) is opened on the upper surface of the installation plate (8). An IGBT chip is detachably arranged on the installation pin groove (5). An adjusting groove (12) is opened below the fixing frame (13) in the heat dissipation base (1). An adjusting mechanism (6) with threaded transmission is detachably arranged in the adjusting groove (12).

2. An improved IGBT chip with high stability and heat dissipation according to claim 1, characterized in that, The limiting mechanism (3) includes a rotating frame (301), a transmission part (302), a limiting pressing plate (303), a fixing block (304) and a clamping groove (305). Rotating frames (301) are symmetrically arranged in the limiting grooves (2) on both sides. A transmission part (302) is movably connected to the rotating frame (301). The transmission part (302) has an L-shaped structure. Limiting pressing plates (303) are arranged on one side of the fixing frame (13) close to the rotating frame (301). The limiting pressing plates (303) are inclined. Fixing blocks (304) are symmetrically arranged on one side of the limiting pressing plate (303) away from the fixing frame (13). One side of the transmission part (302) is movably connected to the fixing block (304). Clamping grooves (305) are opened on both sides of the installation plate (8) close to the limiting pressing plate (303). The clamping grooves (305) cooperate with the limiting pressing plates (303).

3. An improved IGBT chip with high stability and heat dissipation according to claim 1, characterized in that, The adjusting mechanism (6) includes an installation frame (601), a knob (602), a threaded rod (603), a ventilation groove (604), a limiting block (605) and a guiding groove (607). Guiding grooves (607) are symmetrically opened on both sides of the fixing frame (13). The fixing frame (13) is movably connected to the installation frame (601) through the limiting groove (2). Limiting blocks (605) are fixedly connected to both sides of the installation frame (601). Fixing plates (606) are fixedly connected to both sides of the installation frame (601). A threaded rod (603) is movably connected to the fixing plate (606). A knob (602) is arranged at one end of the threaded rod (603) penetrating through the fixing plate (606).

4. An improved IGBT chip with high stability and heat dissipation and a manufacturing method thereof according to claim 3, characterized in that, Positioning grooves (7) are opened on both sides of the installation plate (8) in the fixing frame (13). Positioning holes (9) are opened in the positioning grooves (7). The positioning holes (9) have a threaded structure. The positioning holes (9) cooperate with the threaded rod (603).

5. An improved IGBT chip with high stability and heat dissipation according to claim 4, characterized in that, A limiting part (4) is arranged on the fixing frame (13). Both sides of the limiting part (4) have a threaded structure. The limiting part (4) cooperates with the threaded rod (603). And a gasket is arranged on the surface of the limiting part (4). The limiting part (4) cooperates with the surface of the IGBT chip through the gasket.

6. An improved IGBT chip with high stability and heat dissipation and a manufacturing method thereof according to claim 5, characterized in that, A heat sink (11) is provided below the mounting plate (8), and a cooling fan (10) is installed on one side of the mounting bracket (601) close to the heat sink (11). The cooling fan (10) cooperates with the heat sink (11), and a ventilation slot (604) is formed on the side of the mounting bracket (601) away from the heat sink (11).

7. An improved IGBT chip with high stability and heat dissipation according to claim 2, characterized in that, One side of the transmission member (302) away from the limit pressing plate (303) cooperates with the limit block (605).

8. An improved IGBT chip with high stability and heat dissipation and a manufacturing method thereof according to any one of claims 1-7, characterized in that, It includes the following steps: S1: Symmetrically install the rotating frame (301) in the limit slot (2), connect the transmission member (302), and then install the limit pressing plate (303) to connect the transmission member (302) with the fixed block (304) to complete the assembly of the limit mechanism (3). Let the threaded rod (603) pass through the fixed plate (606) and be in threaded cooperation with the positioning hole (9) to initially install the adjustment mechanism (6). S2: Integrate the limit mechanism (3) and the adjustment mechanism (6) into the heat dissipation base (1). Install the limit member (4) on the fixed frame (13) to cooperate with the threaded rod (603), and closely attach the heat sink (11) to the lower side of the mounting plate (8). S3: Rotate the knob (602) to check whether the adjustment mechanism (6) operates smoothly and whether the mounting bracket (601) moves smoothly. At the same time, check whether the limit mechanism (3) operates normally and whether the limit pressing plate (303) can accurately fit into the card slot (305). S4: Connect the power supply of the cooling fan (10), check the operation and air volume, simulate the chip heating, monitor the temperatures at the heat sink (11) and the chip installation location, and evaluate the heat dissipation performance. S5: After the debugging and testing are qualified, install the IGBT chip on the mounting plate (8) through the mounting pin slot (5), and rotate the knob (602) to make the limit member (4) press the chip tightly through the gasket to complete the manufacturing and installation.

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