Temperature-controlled and automatically unfolded shape memory alloy flexible microstrip antenna and operating method

Abstract

The present disclosure provides a temperature-controlled, automatically deployable shape memory alloy flexible microstrip antenna and a working method, relating to the technical field of communication equipment. The antenna comprises a plurality of microstrip antenna units, a flexible dielectric substrate, a ground layer, and a metal via structure. Each microstrip antenna unit comprises a radiating patch, and the radiating patch comprises a patch matching layer and a patch radiating layer. The flexible dielectric substrate is arranged between the radiating patch and the ground layer, and the radiating patch of each microstrip antenna unit is arranged on the flexible dielectric substrate at equal intervals. The ground layer is located at the bottom layer and is composed of a shape memory alloy material. The metal via structure comprises a plurality of metal vias arranged between the microstrip antenna units, and an external coaxial cable passes through the metal vias to connect the flexible dielectric substrate and the ground layer. The shape memory alloy material of the ground layer can be stored at a set first temperature and can automatically deploy and restore its original shape at a set second temperature.

Description

Technical Field

[0001] The present disclosure relates to the technical field of communication equipment technology, and in particular to a temperature-controlled and automatically unfolded shape memory alloy flexible microstrip antenna and a working method thereof. Background Art

[0002] The statements in this section merely provide background information related to the present disclosure and do not necessarily constitute prior art.

[0003] With the rapid development of aerospace technology and unmanned systems, antennas, as key components for communications, navigation, telemetry, electronic countermeasures, and other missions, are becoming increasingly important for their lightweight, miniaturized, and intelligent deployment capabilities. When deploying antennas into outer space, the ocean, or other specific environments, the vehicles used (such as drones, launch vehicles, or microsatellites) often have limited space, compact structures, and payload limitations, making it difficult to accommodate the bulky and rigid structures of traditional antennas. Therefore, compressibility, foldability, and efficient deployment of antennas are key requirements.

[0004] Flexible antennas have a certain degree of adaptability in space-constrained scenarios due to their ability to bend and curl, and can be temporarily compressed and stored. However, existing antenna deployment methods mostly use electronically controlled drives to drive specific metal structural units to achieve antenna deployment and storage, or use a torsion spring-rope combination drive method to achieve temporary compression, storage, and deployment of the antenna. The above methods are mostly passive deployment and lack precise control over the deployment process and final geometric shape. After multiple deformations or long-term storage, problems such as deformation lag and radiation performance degradation are prone to occur. Especially in applications with high structural precision requirements such as high-frequency communications, phased arrays, or directional transmission, traditional flexible antennas are difficult to meet the stringent requirements for repeatability and stability of the deployed shape, limiting their practical application in high-reliability deployment scenarios. Summary of the Invention

[0005] In order to solve the above problems, the present disclosure proposes a temperature-controlled automatically deployable shape memory alloy flexible microstrip antenna and a working method, designs a temperature-controlled automatically deployable shape memory alloy flexible microstrip antenna, and utilizes a smart material - shape memory alloy - that realizes shape recovery at a specific temperature. After heating, the stored strain energy can be released to drive the flexible microstrip antenna to automatically restore its original shape. The shape memory alloy is combined with the flexible microstrip antenna to achieve compact compression storage while realizing high-precision and high-consistency self-recovery deployment through temperature triggering.

[0006] According to some embodiments, the present disclosure adopts the following technical solutions:

[0007] A temperature-controlled, automatically deployable shape memory alloy flexible microstrip antenna comprising multiple microstrip antenna units, a flexible dielectric substrate, a ground layer, and a metal via structure;

[0008] Each microstrip antenna unit includes a radiating patch, which includes a patch matching layer and a patch radiating layer; the flexible dielectric substrate is arranged between the radiating patch and the ground layer, and the radiating patch of each microstrip antenna unit is arranged on the flexible dielectric substrate at equal intervals. The ground layer is located at the bottom layer and is made of a shape memory alloy material; the metal via structure includes a plurality of metal vias arranged between the microstrip antenna units, and an external coaxial cable passes through the metal vias to connect the flexible dielectric substrate and the ground layer;

[0009] The shape memory alloy material of the ground layer can be stored at a set first temperature and can automatically expand and restore to its original shape at a set second temperature.

[0010] Furthermore, the patch matching layer and the patch radiation layer are metal films for radiating electromagnetic waves, and the flexible dielectric substrate is made of a flexible dielectric material to achieve mechanical support and act as a dielectric layer to regulate the electrical performance of the antenna.

[0011] Furthermore, the grounding layer is made of nickel-titanium-based shape memory alloy material, and copper, chromium, iron, manganese or other elements can be mixed into the nickel-titanium-based shape memory alloy to regulate its phase change temperature and mechanical properties.

[0012] Furthermore, when the antenna is in a compressed state, the first temperature is an ambient temperature lower than the austenite transformation starting temperature of the shape memory alloy of the ground layer, and the ground layer is in a martensite phase.

[0013] Furthermore, during the antenna deployment process, the second temperature is when the antenna temperature rises to above the end temperature of the austenite phase transformation. At this time, the shape memory alloy of the ground layer transforms from the martensite phase to the austenite phase, releasing the stored strain energy and driving the antenna to automatically return to its original flat and deployed shape.

[0014] Furthermore, the shape memory alloy material of the ground layer is an integral flat plate structure, or a hollow structure with a polygonal or horseshoe-shaped grid to enhance its flexibility and automatic deployment performance; the flexible dielectric material used in the flexible dielectric substrate includes but is not limited to polyimide, polyethylene terephthalate, polylactic acid-glycolic acid copolymer, polydimethylsiloxane, and polyurethane flexible polymer materials.

[0015] Furthermore, the thickness of the flexible dielectric substrate is 1 mm to 3 mm, and the thickness of the shape memory alloy material of the ground layer is 0.1 mm to 2 mm.

[0016] Furthermore, the flexible microstrip antenna is in the form of an antenna array, and the multiple microstrip antenna units, flexible dielectric substrate, ground layer and metal via structure constitute the antenna array. The antenna array adopts a centralized feeding method, and the injection of radio frequency signals is realized through multiple metal vias arranged between the microstrip antenna units. The metal vias pass through the flexible dielectric substrate layer and the ground layer and are connected to the external coaxial cable. The inner conductor of one end of the coaxial cable is welded to the radiation patch, the outer conductor is connected to the ground layer, and the other end is connected to the external functional module through a connector.

[0017] Furthermore, after the energy of the RF signal is injected through the metal via, it stimulates multiple microstrip antenna unit radiation patches in sequence through the spatial coupling between the microstrip antenna unit radiation patches or the pre-arranged microstrip feeder network, thereby realizing the synchronous operation of the entire antenna array.

[0018] According to some embodiments, the present disclosure adopts the following technical solutions:

[0019] The working method of a temperature-controlled automatically unfolding shape memory alloy flexible microstrip antenna includes: the antenna array form of the flexible microstrip antenna has good compressibility and foldability, and when the ground layer is in the martensite phase, it can be bent and curled to a large extent. In the retracted and compressed state, the antenna array is in a low-temperature environment. At this time, the antenna temperature is lower than the starting temperature of the austenite phase transformation, and the shape memory alloy material of the ground layer is in the martensite phase. When the temperature-controlled high-temperature thermal excitation causes the ground layer temperature to rise to above the end temperature of the austenite phase transformation, the shape memory alloy of the ground layer releases strain energy, driving the flexible microstrip antenna array to automatically unfold and return to the original preset flat state, and the relative positions between the radiating patches are accurately reconstructed to ensure the stability and consistency of the array performance.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The disclosed temperature-controlled, automatically deployable shape-memory alloy flexible microstrip antenna features a ground layer at the bottom layer. This layer is constructed from a shape-memory alloy material with a shape-memory effect. Shape-memory alloy is an intelligent material that can recover its shape at a specific temperature. It is highly plastic at low temperatures and easily compressed for storage. Upon warming, it releases stored strain energy, driving the structure to automatically return to its original shape. By combining the shape-memory alloy with a flexible microstrip antenna, the disclosed system achieves a compact, controllable, precise, and stable self-deployable antenna system, meeting the requirements for highly reliable and repeatable deployment in complex environments.

[0022] The disclosed temperature-controlled, automatically deployable shape-memory alloy flexible microstrip antenna features a stowed, compressed state. When the antenna is in its stowed, compressed state, the ambient temperature is below the austenite transition start temperature of the shape-memory alloy in the ground layer, leaving the ground layer in the martensite phase. During deployment, when the antenna temperature rises above the austenite transition end temperature, the shape-memory alloy in the ground layer transforms from martensite to austenite, releasing stored strain energy and driving the antenna to automatically return to its original, deployed shape. Exposure to sunlight or other heat sources raises the antenna's temperature, causing the shape-memory alloy to undergo a phase transition. This addresses the challenges of traditional rigid antennas being difficult to fold and store in space-constrained transportation vehicles (such as drones, launch vehicles, and microsatellites), as well as the uncontrollable deployment process and poor structural repeatability of traditional flexible antennas. The antenna meets the application requirements of high-reliability automatic deployment and stable communication performance. The disclosed temperature-controlled, automatically deployable shape-memory alloy flexible microstrip antenna achieves compact, compressed storage while also enabling high-precision, consistent, self-recovery deployment triggered by temperature.

[0023] The temperature-controlled, automatically deployable shape memory alloy flexible microstrip antenna disclosed herein can be folded and stored, and occupies a small space, meeting the layout requirements of space-constrained transportation vehicles. It is thermally driven and automatically deployed without the need for a mechanical structure, simplifying system complexity and improving deployment reliability. The deployed shape is stable and the deployment repeatability is high, ensuring the consistency and predictability of communication performance. It has a lightweight structure and an adjustable phase change temperature, making it suitable for different aerospace or special communication application scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings, which constitute a part of the present disclosure, are used to provide a further understanding of the present disclosure. The exemplary embodiments of the present disclosure and their descriptions are used to explain the present disclosure and do not constitute an improper limitation to the present disclosure.

[0025] Figure 1 Schematic diagram of the structure of the microstrip antenna array disclosed in the unfolded working state;

[0026] Figure 2 This is a schematic structural diagram of the microstrip antenna array disclosed herein in a stowed state;

[0027] Figure 3 A schematic diagram of the process state of unfolding or stowing the microstrip antenna array disclosed in the present invention;

[0028] Figure 4 Schematic diagram of the cyclic process of the microstrip antenna array disclosed in the present invention from deployment to storage and then recovery to the deployment state.

[0029] Figure 5 This is a schematic structural diagram of the multi-band microstrip antenna assembly disclosed herein in an expanded working state;

[0030] Figure 6A schematic diagram of the process of deploying or stowing the multi-band microstrip antenna combination disclosed herein;

[0031] Figure 7 This is a structural diagram of the multi-band microstrip antenna assembly of the present invention in a stored state;

[0032] Figure 8 A voltage standing wave ratio curve calculated when the microstrip antenna array of the present invention is deployed and in operation;

[0033] Figure 9 Directional patterns calculated when the disclosed microstrip antenna array is in an unfolded working state;

[0034] Figure 10 The directional pattern calculated when the multi-band microstrip antenna combination of the present invention is in the deployed working state.

[0035] Among them, 1. Microstrip antenna unit; 2. Radiation patch; 3. Ground layer; 4. Flexible dielectric substrate; 5. Metal via structure. DETAILED DESCRIPTION

[0036] The present disclosure will be further described below with reference to the accompanying drawings and embodiments.

[0037] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of the present disclosure. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs.

[0038] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular form is intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0039] Explanation of terms

[0040] Shape memory refers to the ability of certain materials to "remember" their original shape under specific external stimuli (such as temperature, light, electricity, or chemicals), and then return to their initial form upon a triggering condition after deformation. The term is widely used in academic research and industrial applications, with shape memory alloys (SMAs) and shape memory polymers (SMPs) being the most prominent examples.

[0041] Example 1

[0042] In one embodiment of the present disclosure, a temperature-controlled and automatically unfolded shape memory alloy flexible microstrip antenna is provided, which is in the form of an array. Figure 1As shown, the antenna array comprises multiple microstrip antenna units 1, a flexible dielectric substrate 4, a ground layer 3, and a metal via structure 5. Each microstrip antenna unit 1 includes a radiating patch 2, which comprises a patch matching layer and a patch radiating layer. The flexible dielectric substrate 4 is disposed between the radiating patch 2 and the ground layer 3, and the radiating patches 2 of each microstrip antenna unit 1 are arranged on the flexible dielectric substrate 4 at equal intervals. The radiating patches in the antenna array are spaced 116 mm apart, which prevents the formation of coral petals. Too large a spacing can easily cause coral petals, while too small a spacing can cause overlapping feed lines when stowed, hindering the deployment and stowage states.

[0043] The ground layer 3, located at the bottom layer, is composed of a shape-memory alloy material exhibiting a shape-memory effect. The metal via structure 5 comprises multiple metal vias disposed between the microstrip antenna elements. An external coaxial cable passes through the metal vias, connecting the flexible dielectric substrate and the ground layer. The inner conductor of the coaxial cable is soldered to the radiating patch 2, while the outer conductor is connected to the ground layer 3. The shape-memory alloy material of the ground layer can be stored at a set first temperature and automatically unfolded and restored to its original shape at a set second temperature. This antenna is suitable for use in scenarios requiring high space utilization and automated deployment, such as drones and aerospace vehicles. It can be folded and stored within limited space and, when in use, automatically unfolds and returns to its operating state in response to rising temperatures.

[0044] As an embodiment, the radiation patch 2 includes a patch matching layer and a patch radiation layer, wherein the patch matching layer is located above the patch radiation layer, and the patch matching layer and the patch radiation layer are metal films prepared by electron beam evaporation, magnetron sputtering or electroplating methods, and are used for radiating electromagnetic waves.

[0045] The flexible dielectric substrate 4 is disposed between the radiating patch 2 and the ground layer 3 and is made of a flexible dielectric material. It provides mechanical support and acts as a dielectric layer to control the antenna's electrical performance. Examples of such flexible dielectric materials include, but are not limited to, flexible polymer materials such as polyimide (PI), polyethylene terephthalate (PET), polylactic-co-glycolic acid (PLGA), polydimethylsiloxane (PDMS), and polyurethane (PU).

[0046] As an embodiment, the thickness of the flexible dielectric substrate 4 is 1 mm to 3 mm.

[0047] As an embodiment, the grounding layer 3 is located at the bottom layer and is composed of a shape memory alloy material with a shape memory effect. Specifically, the grounding layer 3 is composed of a nickel-titanium-based shape memory alloy material. The nickel-titanium-based shape memory alloy is a binary intermetallic compound composed of nickel (Ni) and titanium (Ti), and can also be further mixed with copper, chromium, iron, manganese or other elements. The alloying element addition method of the nickel-titanium-based shape memory alloy includes both the original material composition design and the introduction of elements in subsequent processing, depending on the application requirements and preparation process, in order to regulate its phase change temperature and mechanical properties.

[0048] For example, the process of adding other elements to a nickel-titanium-based shape memory alloy includes the following: The martensite / austenite phase transition temperature of NiTi shape memory alloys is extremely sensitive to the alloy composition. By adding a third element to the NiTi matrix, the lattice size, electron concentration, and local stress field can be modified, thereby changing the thermodynamic stability between the martensite and austenite phases. For example, alloying elements that replace Ni or Ti positions adjust the energy difference between the B2 (austenite) phase and the B19 / B19′ (martensite) phase, causing the phase transition temperature to increase or decrease.

[0049] As an embodiment, the metal via structure 5 includes multiple metal vias disposed between the microstrip antenna units. An external coaxial cable passes through the metal vias to connect the flexible dielectric substrate and the ground layer. The inner conductor of the coaxial cable is soldered to the radiating patch 2, while the outer conductor is connected to the ground layer 3. The metal via structure 5 is used to implement coaxial line feeding. The metal via passes through the dielectric substrate layer and the ground layer and is connected to an external 50Ω coaxial cable: the inner conductor is soldered to the radiating patch layer, the outer conductor is connected to the ground layer, and the other end is connected to the test system or communication module via an SMA connector. Since the feeding point does not directly belong to any patch unit, its position can be optimized based on wiring symmetry, electromagnetic field distribution, or structural feasibility to ensure energy transmission efficiency and field uniformity.

[0050] As an example, shape memory alloy is a type of metal material with unique thermoelastic phase transition properties, which can "memorize" and restore its original shape when the external temperature or stress changes. Its core mechanism comes from the reversible transformation between the austenite and martensite phases inside the material, and the resulting shape memory effect and superelastic properties. Shape memory alloys are usually composed of two or more metal elements and are mainly divided into the following three systems: nickel-titanium based alloys (Ni-Ti SMA), copper based alloys (Cu SMA) and iron based alloys (Fe SMA).

[0051] The present disclosure utilizes a nickel-titanium-based shape memory alloy. Nickel-titanium-based shape memory alloy is a binary intermetallic compound composed of nickel (Ni) and titanium (Ti), whose core properties stem from unique atomic ratios and crystal structure variations.

[0052] As an embodiment, a temperature-controlled automatically unfolded shape memory alloy flexible microstrip antenna is in a stored state. When the antenna is at a set first temperature, the set first temperature is a low temperature environment. The low temperature environment specifically refers to the current temperature of the antenna being lower than the austenite phase transformation starting temperature As. At this time, the shape memory alloy material of the ground layer is a martensite phase, which has excellent flexibility and compressibility, and can be folded or curled for storage without damaging the structure.

[0053] Furthermore, in the deployed state, the shape memory alloy material in the ground layer reaches a set second temperature. This second temperature is when the antenna temperature rises above the austenite transition end temperature (Af). This temperature can be raised above Af by sunlight or other heat sources. The shape memory alloy in the ground layer transforms from martensite to austenite, releasing stored strain energy and driving the antenna to automatically return to its original flat shape. This deployment process requires no external mechanical device, making it easy to operate and highly reliable.

[0054] As an example, the shape memory alloy material at the bottom ground layer has a thickness of 0.1 mm to 2 mm. Furthermore, the shape memory alloy material at the bottom ground layer can be a solid flat plate structure or a hollow structure with a polygonal or horseshoe-shaped grid to enhance its flexibility and automatic deployment performance.

[0055] As an embodiment, the temperature-controlled automatically deployable shape memory alloy flexible microstrip antenna disclosed herein may be in the form of a single antenna unit, an antenna array, or a multi-band antenna combination.

[0056] As an embodiment, the temperature-controlled automatically deployable shape memory alloy flexible microstrip antenna disclosed herein may be a single antenna unit that may be rectangular, rounded rectangular, circular, or in other structural shapes.

[0057] Example 2

[0058] The disclosed temperature-controlled and automatically unfolded shape memory alloy flexible microstrip antenna is in the form of a microstrip antenna array, such as Figure 1 The figure shows a microstrip antenna array structure with multiple radiating patches constructed from a single microstrip antenna element to achieve higher radiation gain and directional control capabilities. The radiating patches are evenly spaced on a flexible dielectric substrate to form a linear or planar array structure. The structural parameters can be flexibly designed based on the expected operating frequency, beamwidth, and radiation pattern requirements.

[0059] The voltage standing wave ratio curve calculated when the microstrip antenna array is in the expanded working state is as follows: Figure 8 The directional pattern calculated when the microstrip antenna array is in the unfolded working state is shown as Figure 9shown.

[0060] As an embodiment, the antenna array adopts a centralized feeding method, and the RF signal is injected through a single metal via set in the middle of the array structure or other specific locations. The metal via passes through the dielectric substrate layer and the ground layer and is connected to an external 50Ω coaxial cable: the inner conductor is soldered to the radiating patch layer, the outer conductor is connected to the ground layer, and the other end is connected to the test system or communication module through an SMA connector. Since the feeding point does not directly belong to any patch unit, its position can be optimized according to the wiring symmetry, electromagnetic field distribution or structural feasibility to ensure energy transmission efficiency and field uniformity.

[0061] After RF energy is injected through the metal vias, it sequentially excites multiple radiating patch elements through spatial coupling between them or a pre-arranged microstrip feeder network, achieving synchronized operation of the entire array. This feed structure relies solely on a single via, simplifying the process structure and avoiding the mechanical weaknesses introduced by multiple vias. It also maintains the integrity of the shape memory alloy ground layer, helping the system to deploy stably during multiple deformation and thermal cycles.

[0062] As an embodiment, the temperature control method of the microstrip antenna array disclosed herein includes:

[0063] like Figure 4 As shown in the figure, the array has good compressibility and foldability in the storage state. The ground layer is in the martensite phase and can be bent and curled to a large extent. Figure 2 During the deployment process, the ground layer temperature is raised to above the austenite transformation end temperature (Af) through temperature-controlled high-temperature thermal stimulation (such as sunlight, surface heating, etc.). The shape memory alloy releases strain energy, driving the antenna array to automatically deploy and return to its original preset flat state. The relative positions between the patches are accurately reconstructed, thereby ensuring the stability and consistency of the array performance. Figure 3 The cyclic process of the microstrip antenna array from unfolding to stowing and then back to the unfolded state is shown in Figure 4 shown.

[0064] Example 3

[0065] The disclosed temperature-controlled, automatically deployable shape-memory alloy flexible microstrip antenna is a multi-band microstrip antenna assembly. This assembly consists of four antenna arrays operating in different frequency bands, each corresponding to a specifically designed microstrip antenna array. Specifically, each microstrip antenna array comprises a radiating patch operating in a different frequency band, namely, the L1, L2, S1, and S2 bands. These multiple microstrip antenna arrays are placed on a larger flexible dielectric substrate to achieve multi-band coverage.

[0066] As an embodiment, each radiation patch of the multi-band microstrip antenna combination adopts a composite graphic design, which can achieve a larger bandwidth with the smallest possible microstrip antenna unit size. Electromagnetic isolation can be achieved between each microstrip antenna unit through high-barrier strips or gaps to reduce intermodulation interference. The microstrip antenna arrays of different frequency bands of the multi-band microstrip antenna combination can be arranged on the same flexible dielectric substrate in a non-equidistant or equidistant manner to form a multi-band microstrip antenna combination structure. The structural parameters can be flexibly designed according to the expected operating frequency, beam width and radiation pattern requirements. The voltage standing wave ratio curve calculated when the multi-band microstrip antenna combination is in the expanded working state is shown in the figure below. Figure 10 shown.

[0067] The multi-band microstrip antenna combination structure only changes the frequency bands of the radiating patches of the different microstrip antenna units. The rest of the structure is identical to the microstrip antenna array. Similarly, the ground layer is made of shape memory alloy and features automatic deployment. The structure can be a solid flat plate or a hollow grid for enhanced expandability. The dielectric layer utilizes a flexible polyimide film, achieving excellent dielectric properties and mechanical stability.

[0068] As an embodiment, the operating method of the multi-band microstrip antenna combination disclosed herein includes:

[0069] Working principle: When transporting or storing, the multi-band microstrip antenna combination is in a folded or curled state, and the shape memory alloy material of the ground layer is in the martensite phase at the set first temperature, such as Figure 7 When deployed, the shape memory alloy material of the ground layer is at a set second temperature through temperature control or under the action of an external heat source (such as sunlight). The second temperature, i.e., the temperature of the shape memory alloy material of the ground layer, rises to above the austenite phase transition temperature, realizing shape expansion and recovery, and actively driving the entire antenna structure to automatically expand to the working state, as shown. Figure 5 and Figure 6 shown.

[0070] The present disclosure is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present disclosure. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0071] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0072] Although the above describes the specific implementation methods of the present disclosure in conjunction with the accompanying drawings, it is not intended to limit the scope of protection of the present disclosure. Those skilled in the art should understand that on the basis of the technical solution of the present disclosure, various modifications or variations that can be made by those skilled in the art without creative work are still within the scope of protection of the present disclosure.

Claims

1. Temperature-controlled and automatically unfolded shape memory alloy flexible microstrip antenna, characterized by: It includes multiple microstrip antenna units, a flexible dielectric substrate, a ground layer, and a metal via structure; Each microstrip antenna unit includes a radiating patch, which includes a patch matching layer and a patch radiating layer; the flexible dielectric substrate is arranged between the radiating patch and the ground layer, and the radiating patch of each microstrip antenna unit is arranged on the flexible dielectric substrate at equal intervals, and the ground layer is located at the bottom layer and is composed of a shape memory alloy material; the metal via structure includes a plurality of metal vias arranged between the microstrip antenna units, and an external coaxial cable passes through the metal vias to connect the flexible dielectric substrate and the ground layer, wherein the inner conductor of the coaxial cable is welded to the radiating patch, and the outer conductor is connected to the ground layer; The shape memory alloy material of the ground layer can be stored at a set first temperature and can automatically expand and restore its original shape at a set second temperature; when the antenna is in a stored and compressed state, the first temperature is the ambient temperature lower than the austenite phase transformation start temperature of the shape memory alloy of the ground layer, at which time the ground layer is in the martensite phase; during the antenna expansion process, the second temperature is when the antenna temperature rises to above the austenite phase transformation end temperature, at which time the shape memory alloy of the ground layer transforms from the martensite phase to the austenite phase, releasing the stored strain energy and driving the antenna to automatically restore to its original expanded shape; The temperature-controlled automatically unfolded shape memory alloy flexible microstrip antenna is a multi-band microstrip antenna combination, which consists of four antenna arrays with different frequency bands. The shape memory alloy material of the ground layer is a whole flat plate structure, or a hollow structure with a polygonal or horseshoe-shaped grid to improve its flexibility and automatic expansion performance; the flexible dielectric material used in the flexible dielectric substrate includes but is not limited to polyimide, polyethylene terephthalate, polylactic acid-glycolic acid copolymer, polydimethylsiloxane, and polyurethane flexible polymer materials.

2. The temperature-controlled and automatically deployable shape memory alloy flexible microstrip antenna according to claim 1, characterized in that: The patch matching layer and the patch radiation layer are metal films for radiating electromagnetic waves. The flexible dielectric substrate is made of a flexible dielectric material to provide mechanical support and act as a dielectric layer to regulate the electrical performance of the antenna.

3. The temperature-controlled and automatically deployable shape memory alloy flexible microstrip antenna according to claim 1, characterized in that: The grounding layer is made of nickel-titanium-based shape memory alloy material, and copper, chromium, iron, manganese or other elements can be further mixed into the nickel-titanium-based shape memory alloy to regulate its phase change temperature and mechanical properties.

4. The temperature-controlled and automatically deployable shape memory alloy flexible microstrip antenna according to claim 1, wherein: The thickness of the flexible dielectric substrate is 1 mm to 3 mm, and the thickness of the shape memory alloy material of the grounding layer is 0.1 mm to 2 mm.

5. The temperature-controlled and automatically deployable shape memory alloy flexible microstrip antenna according to claim 1, characterized in that: The flexible microstrip antenna can be configured in the form of an antenna array, wherein the multiple microstrip antenna units, the flexible dielectric substrate, the ground layer, and the metal via structure constitute the antenna array. The antenna array adopts a centralized feeding method, and the injection of radio frequency signals is achieved through multiple metal vias arranged between the microstrip antenna units. The metal vias penetrate the flexible dielectric substrate layer and the ground layer and are connected to an external coaxial cable. The inner conductor at one end of the coaxial cable is welded to the radiation patch, the outer conductor is connected to the ground layer, and the other end is connected to the external functional module through a connector.

6. The temperature-controlled and automatically deployable shape memory alloy flexible microstrip antenna according to claim 5, characterized in that: After the energy of the RF signal is injected through the metal via, it stimulates multiple microstrip antenna unit radiation patches in sequence through the spatial coupling between the microstrip antenna unit radiation patches or the pre-arranged microstrip feeder network, thereby realizing the synchronous operation of the entire antenna array.

7. A method for operating a temperature-controlled, automatically deployed shape memory alloy flexible microstrip antenna, characterized in that: The temperature-controlled automatically unfolded shape memory alloy flexible microstrip antenna according to any one of claims 1 to 6 includes: the antenna array form of the flexible microstrip antenna has good compressibility and foldability, and when the ground layer is in the martensite phase, it can be bent and curled to a large extent. When in the stored and compressed state, the antenna array is in a low-temperature environment. At this time, the antenna temperature is lower than the starting temperature of the austenite phase transformation, and the shape memory alloy material of the ground layer is the martensite phase. When the temperature-controlled high-temperature thermal excitation causes the ground layer temperature to rise to above the end temperature of the austenite phase transformation, the shape memory alloy of the ground layer releases strain energy, driving the flexible microstrip antenna array to automatically unfold and return to the original preset flat state, and the relative positions between the radiating patches are accurately reconstructed to ensure the stability and consistency of the array performance.

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