Multi-wire electric discharge machine, machining control device, machining condition generation device, electric discharge machining system, electric discharge machining method, and thin plate manufacturing method

Abstract

The multi-wire electric discharge machine includes: a wire cutting unit that is disposed in parallel by winding a wire electrode around a plurality of guide rollers and faces a workpiece; a drive unit that adjusts the distance between the workpiece and the cutting wire unit; a processing power supply for applying a pulse voltage between the workpiece and the cutting wire part; a machining control device (9) that controls the drive unit and the machining power source; and a processing condition generation device (30) that generates an applicable processing condition, which is a processing condition applied to the next processing, on the basis of a measurement result of the thickness for each processing position in the processing surface of the thin plate cut by processing the workpiece by the cutting line section. A machining condition generation device (30) generates an applicable machining condition by correcting a basic machining condition, which is a basic machining condition, on the basis of the difference between a target value, which is a reference value for the thickness of the thin plate at each machining position, and a measurement result, and a machining control device (9) generates a machining condition for the thin plate at the next machining position by correcting a basic machining condition, which is a basic machining condition. At least one of the drive unit and the machining power source is controlled using the applicable machining condition.

Description

Technical Field

[0001] The present invention relates to a multi-wire electrical discharge machining apparatus, a machining control device, a machining condition generation device, an electrical discharge machining system, an electrical discharge machining method, and a thin plate manufacturing method for cutting a workpiece into a plurality of thin plates through a plurality of wires. Background Art

[0002] A multi-wire electrical discharge machining apparatus is a device that cuts a plurality of thin plates from a workpiece by applying a pulsed voltage between a plurality of wires and a columnar workpiece.

[0003] In the multi-wire electrical discharge machining apparatus described in Patent Document 1, when a value indicating a machining state exceeds a threshold value, an application command for a pulsed voltage obtained under machining conditions for avoiding breakage of a wire electrode is output to a machining power supply, thereby avoiding breakage of the wire and increasing the machining speed.

[0004] Patent Document 1: Japanese Patent No. 6991414 Summary of the Invention

[0005] However, in the technique of Patent Document 1 described above, due to the influence of assembly fluctuations of components caused by components of the multi-wire electrical discharge machining apparatus or an assembly operator, there is a problem that even when the same machining conditions are applied to workpieces made of the same material, the error of the thickness of the machined thin plate from a reference value fluctuates within the machining surface for each multi-wire electrical discharge machining apparatus.

[0006] The present invention has been made in view of the above circumstances, and an object thereof is to obtain a multi-wire electrical discharge machining apparatus capable of suppressing fluctuations in the error of the thickness of a machined thin plate from a reference value within the machining surface for each multi-wire electrical discharge machining apparatus.

[0007] In order to solve the above problems and achieve the object, the multi-wire electrical discharge machine of the present invention has: a cutting wire section that arranges wire electrodes wound around a plurality of guide rollers in parallel and faces a workpiece; and a drive section that adjusts the distance between the workpiece and the cutting wire section. Further, the multi-wire electrical discharge machine of the present invention has: a machining power supply that applies a pulsed voltage between the workpiece and the cutting wire section; and a machining control device that controls the drive section and the machining power supply. Further, the multi-wire electrical discharge machine of the present invention has a machining condition generation device that generates machining conditions to be applied in the next machining, i.e., applicable machining conditions, based on the measurement results of the thickness at each machining position in the machining surface of the thin plate cut out by machining the workpiece with the cutting wire section. The machining condition generation device corrects the basic machining conditions, i.e., the basic machining conditions, based on the difference between the target value, which is the reference value of the thickness of the thin plate at each machining position, and the measurement results, thereby generating the applicable machining conditions. The machining control device controls at least one of the drive section and the machining power supply using the applicable machining conditions in the next machining.

[0008] Effects of the Invention

[0009] The multi-wire electrical discharge machine according to the present invention has the following effect, that is, it is possible to suppress the fluctuation of the error of the thickness of the machined thin plate from the reference value for each multi-wire electrical discharge machine in the machining surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a diagram showing the structure of the multi-wire electrical discharge machine according to Embodiment 1.

[0011] Figure 2 It is a diagram showing the structure of the machining condition generation device according to Embodiment 1.

[0012] Figure 3 It is a diagram for explaining the thickness of the thin plate collected by the machining result collection unit of the machining condition generation device according to Embodiment 1.

[0013] Figure 4 It is a diagram showing the structure of the machining condition generator according to Embodiment 1.

[0014] Figure 5 It is a flowchart showing the processing sequence of the processing executed by the multi-wire electrical discharge machine according to Embodiment 1.

[0015] Figure 6 It is a diagram showing another structural example of the machining control device provided in the multi-wire electrical discharge machine according to Embodiment 1.

[0016] Figure 7This is a diagram showing an example of the hardware configuration of the machining condition generation device according to Embodiment 1.

[0017] Figure 8 This is a diagram showing the configuration of the electric discharge machining system according to Embodiment 2. Detailed Embodiment

[0018] Hereinafter, a multi-wire electric discharge machining machine, a machining control device, a machining condition generation device, an electric discharge machining system, an electric discharge machining method, and a thin plate manufacturing method according to embodiments of the present invention will be described in detail with reference to the drawings.

[0019] Embodiment 1.

[0020] Figure 1 This is a diagram showing the configuration of the multi-wire electric discharge machining machine according to Embodiment 1. In the following description, the vertical direction is set as the Z-axis direction, and two axes in the horizontal plane and orthogonal to each other are set as the X-axis and the Y-axis. That is, the X-axis, the Y-axis, and the Z-axis are three mutually perpendicular axes. The direction of the arrow among the directions of each axis is set as the positive direction, and the direction opposite to the arrow is set as the negative direction. The positive Z direction is the vertically upward direction, and the negative Z direction is the vertically downward direction.

[0021] The multi-wire electric discharge machining machine 1 is a device that discharges and cuts a columnar workpiece 2 into multiple pieces (multiple thin plates). The multi-wire electric discharge machining machine 1 causes the wire electrode 6 to rotate and travel multiple times, and discharges the workpiece 2 by applying a pulsed voltage between each of the multiple cutting wire portions 6a that travel in parallel with each other in the wire electrode 6 and the workpiece 2. The multi-wire electric discharge machining machine 1 manufactures multiple thin plates by simultaneously cutting out multiple thin plates from the workpiece 2. The multi-wire electric discharge machining machine 1 controls the voltage application performed by the machining power supply 7, thereby performing electric discharge machining while preventing the cutting of the wire electrode 6 caused by the instability of the machining process or the secular change of the machine.

[0022] The multi-wire electric discharge machining machine 1 includes: a wire spool 4 that supplies the wire electrode 6; and a wire spool drive unit 17 that rotationally drives the wire spool 4. In addition, the multi-wire electric discharge machining machine 1 includes: a wire discharge roller 5 that discharges the wire electrode 6 to the outside of the multi-wire electric discharge machining machine 1; guide rollers 3a to 3d that are used to properly advance the wire electrode 6; and a guide roller drive unit 18 that drives the guide roller 3a.

[0023] Each of the guide rollers 3a to 3d is cylindrical. The guide rollers 3a to 3d guide the travel of the wire electrode 6 between the wire spool 4 and the wire discharge roller 5.

[0024] The guide rollers 3a to 3d wind the wire electrode 6 while maintaining a gap therebetween a plurality of times. That is, the central axes of the four cylindrical guide rollers 3a to 3d are parallel to each other and are arranged parallel to each other in the axial direction and separated from each other. In Figure 1 , the central axes of the respective guide rollers 3a to 3d are parallel to the Y axis. That is, in Figure 1 , a situation where the guide rollers 3a to 3d are arranged to extend in the Y-axis direction is shown.

[0025] In addition, the four guide rollers 3a to 3d are arranged in a plane orthogonal to the axial direction (in the XZ plane in Figure 1 ) such that the positions of the central axes of the respective guide rollers 3a to 3d become the vertices of a quadrilateral. That is, the planes perpendicular to the respective central axes of the four guide rollers 3a to 3d are the XZ planes. Specifically, among the four guide rollers 3a to 3d, the guide rollers 3a and 3b are provided at the highest positions in the Z-axis direction, the guide roller 3c is provided at a position below the guide roller 3b, and the guide roller 3d is provided side by side with the guide roller 3c below the guide roller 3a. That is, the line connecting the guide rollers 3a and 3b and the line connecting the guide rollers 3c and 3d are parallel to the X-axis direction, and the line connecting the guide rollers 3b and 3c and the line connecting the guide rollers 3d and 3a are parallel to the Z-axis direction.

[0026] In addition, on the outer peripheries (sides) of the four guide rollers 3a to 3d, a plurality of guide grooves for guiding the travel of the wire electrode 6 are formed at specific intervals in their respective axial directions. That is, in each of the guide rollers 3a to 3d, the plurality of guide grooves are formed at regular intervals in the direction of the central axis. The wire electrode 6 drawn out from the wire spool 4 is wound around each of the guide rollers 3a to 3d along the guide grooves. That is, in the illustrated example, when viewed from the negative Y direction, the wire electrode 6 is guided by the guide grooves respectively provided in the guide rollers 3a to 3d that rotate clockwise (to the right).

[0027] After the wire electrode 6 has wound around the guide rollers 3a to 3d a plurality of times, it is discharged by the wire discharge roller 5. That is, after the wire electrode 6 has wound around the four guide rollers 3a to 3d a plurality of times with a specific interval between the guide grooves being maintained therebetween, it is discharged to the outside of the multi-wire electrical discharge machining machine 1 by the wire discharge roller 5.

[0028] Here, the portions of the wire electrode 6 that are stretched in parallel between the guide rollers 3c and 3d respectively become the cutting wire portions 6a. That is, the cutting wire portions 6a are multiple cutting wires that are disposed opposite to the workpiece 2 and arranged in parallel by winding one wire electrode 6 around a plurality of guide rollers 3a to 3d. That is, each of the multiple cutting wire portions 6a is the portion of the wire electrode 6 that is stretched between the guide roller 3c and the guide roller 3d which serve as guide rollers. A plurality of cutting wire portions 6a that are parallel to each other are provided between the guide rollers 3c and 3d. The multiple cutting wire portions 6a are the portions of the wire electrode 6 that are parallel to each other between the guide rollers 3c and 3d. In Embodiment 1, the traveling direction of the wire electrode 6 in the multiple cutting wire portions 6a, that is, the second direction, is the X-axis direction. The cutting wire portions 6a of the wire electrode 6 cut the workpiece 2. The workpiece 2 is columnar and is arranged such that its axial direction is the Y-axis direction.

[0029] In addition, the multi-wire electrical discharge machining machine 1 includes: a power supply member 12 that contacts the wire electrode 6 and supplies a machining voltage to the wire electrode 6; and a drive unit 14 that drives a machining table (not shown) on which the workpiece 2 can be placed in the positive Z direction. The multi-wire electrical discharge machining machine 1 moves the machining table on which the workpiece 2 is placed in the positive Z direction, thereby machining the workpiece 2. That is, the drive unit 14 as a drive portion moves the machining table in the Z-axis direction as the first direction. The first direction is the direction in which the workpiece 2 moves relative to the multiple cutting wire portions 6a and is the traveling direction of electrical discharge machining in the workpiece 2.

[0030] In addition, the multi-wire electrical discharge machining machine 1 includes via the power supply member 12: each cutting wire portion 6a included in the wire electrode 6; and a machining power supply 7 that applies a machining pulse voltage (hereinafter referred to as a machining pulse voltage) between the wire electrode 6 and the workpiece 2. The machining power supply 7 applies a machining pulse voltage between each of the multiple cutting wire portions 6a and the workpiece 2. In addition, the multi-wire electrical discharge machining machine 1 has a cable 11 that connects the machining power supply 7 and the workpiece 2. Each machining power supply 7 has a plurality of machining power supply units 8 that correspond one-to-one with the cutting wire portions 6a.

[0031] In addition, the multi-wire electrical discharge machining machine 1 includes: a machining control device 9 that controls electrical discharge machining; a machining state detection device 15 that detects the machining state in each cutting wire portion 6a; and a machining condition generation device 30 that outputs machining conditions to the machining control device 9.

[0032] In Figure 1In the example shown, the guide roller drive unit 18 rotates the guide roller 3a. Further, the spool drive unit 17 rotates the spool 4 so that the tension of the wire electrode 6 becomes constant. The multi-wire electrical discharge machining machine 1 controls the rotation of the spool 4 achieved by the spool drive unit 17 and the rotation of the guide roller 3a achieved by the guide roller drive unit 18 so that the traveling speed of the wire electrode 6 becomes a desired speed.

[0033] The machining state detection device 15 detects the machining state in each cut wire portion 6a. The machining state detection device 15 is arranged on the wiring connecting the power supply member 12 and the machining power source 7. The machining state detection device 15 monitors the inter-electrode voltage, current, number of discharges per unit time, number of short circuits per unit time, and the output voltage of the machining power source 7, i.e., the machining pulse voltage, via the power supply member 12, thereby detecting the machining state in each cut wire portion 6a. The inter-electrode voltage is the voltage applied between the electrodes, i.e., between the workpiece 2 and each cut wire portion 6a. The machining state detection device 15 each has a plurality of machining state detection units 16 corresponding one-to-one with the cut wire portions 6a. The machining state detection device 15 detects the machining state for each cut wire portion 6a through each machining state detection unit 16.

[0034] The machining control device 9 controls at least one of the drive unit 14 and the machining power source 7 based on the machining result (thickness for each machining position) of the workpiece 2. Further, the machining control device 9 generates a feed control command value as a position command based on the machining state detected by the machining state detection device 15. The machining control device 9 outputs a position command to the drive unit 14. The drive unit 14 moves the machining table in the Z-axis direction according to the position command. Thus, the drive unit 14 changes the relative position between the workpiece 2 and each cut wire portion 6a. As described above, the multi-wire electrical discharge machining machine 1 adjusts the distance between the workpiece 2 and each cut wire portion 6a through the drive unit 14.

[0035] Further, the machining control device 9 outputs a voltage application command to each machining power source unit 8 based on the machining state detected by the machining state detection device 15. Each machining power source unit 8 applies a machining pulse voltage between the cut wire portion 6a and the workpiece 2. The voltage application command includes each command value such as the amplitude of the voltage, the frequency of the machining pulse voltage, and the on-pulse time of the machining pulse voltage.

[0036] The machining control device 9 controls the distance between the workpiece 2 and each cut wire portion 6a by outputting a position command, and causes a discharge to occur between each cut wire portion 6a and the workpiece 2 by outputting a voltage application command. Thus, the multi-wire electrical discharge machining machine 1 cuts out a plurality of thin plates from the workpiece 2.

[0037] The machining condition generation device 30 has a machining condition generator 32 described later. The machining condition generator 32, which serves as a machining condition generation unit, is connected to the machining control device 9. The machining condition generator 32 compares the thickness of the thin plate with respect to the position within the plane of the thin plate (within the machining plane) and the machining results obtained by the machining result collection unit 31 described later, and generates machining conditions (target voltage, average machining current, etc.) suitable for each machining position. The machining condition generation device 30 commands the generated machining conditions to the machining control device 9.

[0038] The workpiece 2 is an ingot (such as a semiconductor ingot) that is cut into a plurality of thin plates. The raw material of the workpiece 2 is, for example, a metal such as tungsten or molybdenum that becomes a sputtering target, or a ceramic such as polycrystalline silicon carbide used as components of various structures. The workpiece 2 can be single-crystalline silicon that is a material for semiconductor wafers, or can be a semiconductor raw material such as single-crystalline silicon carbide, single-crystalline gallium nitride, single-crystalline gallium oxide, or single-crystalline diamond. In addition, the workpiece 2 can be a solar cell raw material such as single-crystalline silicon or polycrystalline silicon that is a material for solar cell wafers. An example of the multi-wire electrical discharge machining machine 1 is a device that manufactures a plurality of semiconductor wafers by cutting out a plurality of semiconductor wafers from an ingot. In addition, the shape of the workpiece 2 is not limited to a square column shape, and can also be a cylindrical shape.

[0039] Among the materials cited as examples of the workpiece 2, the resistivity of the metal is sufficiently low and does not hinder the application of electrical discharge machining. On the other hand, the raw materials among the semiconductor raw materials and solar cell raw materials that can be subjected to electrical discharge machining are raw materials with a resistivity that is sufficiently low, generally less than or equal to 100 Ω·cm, and preferably less than or equal to 10 Ω·cm.

[0040] Therefore, metals are suitable as the workpiece 2. Among raw materials such as semiconductor raw materials or solar cell raw materials, raw materials with a resistivity in the range from the same resistivity as that of metals to 100 Ω·cm are suitable as the workpiece 2. Among raw materials such as semiconductor raw materials or solar cell raw materials, raw materials with a resistivity in the range from the same resistivity as that of metals to 10 Ω·cm are more suitable as the workpiece 2.

[0041] The multi-wire electrical discharge machining machine 1 supplies a machining fluid between the workpiece 2 and each cutting wire portion 6a, that is, between the electrodes. Similar to the case of a so-called single-type wire electrical discharge machining machine, the multi-wire electrical discharge machining machine 1 supplies the machining fluid to the inter-electrode space by spraying the machining fluid or by immersing the workpiece 2 in the machining fluid. The illustration of the structure for supplying the machining fluid is omitted.

[0042] The machining power supply 7 includes a plurality of machining power supply units 8 that respectively correspond one-to-one to the cutting wire portions 6a. The machining power supply 7 generates a machining pulse voltage to be applied between the electrodes according to a voltage application instruction from the machining control device 9. The machining power supply 7 generates the machining pulse voltage, for example, by a switching power supply method. The machining power supply 7 individually applies the machining pulse voltage to the plurality of cutting wire portions 6a through the plurality of machining power supply units 8. The machining power supply 7 has a ground electrode 10 provided across the plurality of machining power supply units 8. The ground wires of the respective machining power supply units 8 are connected to the ground electrode 10. The ground electrode 10 is connected to a workpiece fixture (not shown) through a cable 11. The workpiece 2 is connected to the ground electrode 10 through the workpiece fixture and the cable 11. In addition, the machining power supply 7 can appropriately reverse the polarity of the machining pulse voltage to be generated as needed.

[0043] The power supply member 12 is composed of a plurality of power supply member units 13 insulated from each other. The plurality of power supply member units 13 respectively correspond one-to-one to the power supply wire portions 6b. In Figure 1 the example shown, the parallel portion (the portion stretched in parallel) between the guide rollers 3b and 3c among the wire electrodes 6 is the plurality of power supply wire portions 6b. The power supply wire portions 6b can be slidably connected to the respective power supply member units 13. Each power supply member unit 13 supplies the power supplied from the machining power supply unit 8 to the power supply wire portions 6b. The power supply member 12 supplies the power to the plurality of power supply wire portions 6b individually through the plurality of power supply member units 13. Thus, the machining pulse voltage is individually applied to each cutting wire portion 6a through each machining power supply unit 8.

[0044] Figure 2 FIG. is a diagram showing the structure of the machining condition generation device according to Embodiment 1. The machining condition generation device 30 includes a machining result collection unit 31, a machining condition generator 32, and a subtractor 33. In the machining condition generation device 30, the machining result collection unit 31 is connected to the subtractor 33, and the subtractor 33 is connected to the machining condition generator 32. In addition, the machining condition generator 32 is connected to the machining control device 9.

[0045] The machining result collection unit 31 collects the thickness (sheet thickness) of the sheet processed by the cutting wire portion 6a for each machining position and outputs it to the subtractor 33. The thickness of the sheet for each machining position is the thickness in the machining direction (Z-axis direction) for each machining position.

[0046] Figure 3 FIG. is a diagram for explaining the sheet thickness collected by the machining result collection unit of the machining condition generation device according to Embodiment 1. In Figure 3 it, in order to show the relationship between the position where the thickness of the sheet 2X is measured and the arrangement positions of the guide rollers 3c and 3d, the guide rollers 3c and 3d are shown. In Figure 3In this case, the thin plate 2X and the guide rollers 3c and 3d are shown when viewed from the Y-axis direction. Here, the case where the workpiece 2 is cylindrical and the thin plate 2X is circular plate-shaped will be described.

[0047] The thickness of the thin plate 2X cut from the workpiece 2 is measured at various positions in the processing direction. In Embodiment 1, the thickness is measured at a plurality of positions on the processing path passing through the center of the thin plate 2X in the direction parallel to the Z-axis direction when processing the thin plate 2X.

[0048] For example, if the positions where the thickness is measured are set as Z1 to Zn (n is a natural number greater than or equal to 2), and the measurement results of the thin plate thickness are set as At1 to Atn, then the measurement results of the thin plate thickness for each processing position where the thickness is measured are represented by the measurement results (Z1, At1), (Z2, At2), ···, (Zn, Atn). The positions Z1 to Zn are in the order of decreasing coordinates in the Z-axis direction as positions Z1, Z2, ···, Zn.

[0049] The processing result collection unit 31 collects the measurement results (Z1, At1), (Z2, At2), ···, (Zn, Atn) measured by a thickness measuring device (not shown) and outputs them to the subtractor 33.

[0050] The subtractor 33 receives the measurement results (processing results) of the thin plate thickness for each processing position from the processing result collection unit 31. In addition, the subtractor 33 receives the target values (reference values) of the thin plate thickness for each processing position pre-stored in a storage device (not shown) of the multi-wire electrical discharge machining machine 1 or the like. If the target values of the thin plate thickness are set as A1 to An, then the target values of the thin plate thickness for each processing position where the thickness is measured are represented by the target values (Z1, A1), (Z2, A2), ···, (Zn, An). The subtractor 33 calculates the difference obtained by subtracting the measurement results of the thin plate thickness for each processing position from the target values of the thin plate thickness for each processing position, and sends the difference in thickness to the processing condition generator 32. In addition, the target values A1 to An of the thin plate thickness may be the same value. That is, A1 = A2 = ··· = An may be possible.

[0051] The processing condition generator 32 corrects the basic processing conditions pre-stored in a storage device or the like of the multi-wire electrical discharge machining machine 1 based on the difference in thickness. If the basic processing conditions are set as processing conditions C1 to Cn, then the processing conditions for each processing position where the thickness is measured are represented by the processing conditions (Z1, C1), (Z2, C2), ···, (Zn, Cn).

[0052] The machining condition generator 32 corrects the basic machining conditions by a correction value corresponding to the difference in thickness. That is, the machining condition generator 32 compares the target values (Z1, A1), (Z2, A2),..., (Zn, An) of the thin plate thickness for each machining position with the measurement results (Z1, At1), (Z2, At2),..., (Zn, Atn) of the thin plate thickness for each machining position, and corrects the basic machining conditions for each machining position based on the difference in thickness as the comparison result.

[0053] For example, when m is a natural number from 2 to n, the machining interval from the position Z(m - 1) to the position Zm is machined by the machining conditions at the position Z(m - 1). Therefore, the machining condition generator 32 corrects the basic machining conditions for each machining interval. In addition, the machining interval from the position Z(m - 1) to the position Zm can be machined by the intermediate value of the machining conditions at the position Z(m - 1) and the machining conditions at the position Zm. In the following description, the case where the machining condition generator 32 corrects the basic machining conditions for each machining interval will be described.

[0054] For example, for the thin plate 2X, the first machining interval up to the positions Z1 to Z2, the second machining interval up to the positions Z2 to Z3, and the (n - 1)th machining interval up to the positions Z(n - 1) to Zn are set. The machining condition generator 32 corrects the basic machining conditions for each of the set machining intervals.

[0055] The machining condition generator 32 generates applicable machining conditions by correcting the basic machining conditions so that the difference in thickness becomes smaller in the next machining. The applicable machining conditions are the machining conditions used for subsequent machining control. The machining condition generator 32 sends the corrected machining conditions, that is, the applicable machining conditions, to the machining control device 9. Thereby, the machining control device 9 uses the applicable machining conditions in the next machining.

[0056] The basic machining conditions and the applicable machining conditions include, for example, at least one of a target voltage, an average machining current, an open number, and an open voltage. The target voltage is the average value of the machining pulse voltage applied per unit time between the cutting wire portion 6a and the workpiece 2. The average machining current is the average value of the current flowing per unit time between the cutting wire portion 6a and the workpiece 2. The open number is the number of times without discharge per unit time during electrical discharge machining. The open voltage is the average value of the voltage per unit time during an open state (when there is no discharge).

[0057] As described above, in the first embodiment, the machining condition generator 32 generates applicable machining conditions corresponding to the machining positions (machining sections) and outputs them to the machining control device 9. That is, for each machining section, the machining condition generator 32 generates applicable machining conditions such as voltage application commands corresponding to the target voltage and outputs them to the machining control device 9. In addition, the machining result collection unit 31 can also obtain data of the measurement results measured by a thickness measuring device or the like via an existing information communication device or the like, or can obtain the measurement results manually input by the operator. The measurement results collected by the machining result collection unit 31 can be obtained by any method as long as they are information capable of determining the thickness of the thin plate 2X for each machining position.

[0058] Based on the applicable machining conditions, the machining control device 9 controls at least one of the drive unit 14 and the machining power supply 7. The machining control device 9 controls at least one of the drive unit 14 and the machining power supply 7 so as to achieve the target voltage, average machining current, number of discharges, or discharge voltage specified by the applicable machining conditions.

[0059] Figure 4 It is a diagram showing the structure of the machining condition generator according to the first embodiment. The machining condition generation device 30 having the machining condition generator 32 processes the measurement results (At1, At2, ···, Atn) of the thin plate thickness for each machining position as a set of data. In addition, the machining condition generation device 30 processes the target values (A1, A2, ···, An) of the thin plate thickness for each machining position as a set of data.

[0060] The subtractor 33 calculates the difference e, which is the difference between the target values (A1, A2, ···, An) of the thin plate thickness for each machining position and the measurement results (At1, At2, ···, Atn) of the thin plate thickness for each machining position, and sends it to the machining condition generator 32.

[0061] The machining condition generator 32 receives the difference e of the thickness from the subtractor 33. The machining condition generator 32 uses the difference e[i] input this time (assuming the i-th (i is a natural number) time) and the difference e[i - 1] input the previous time (the (i - 1)-th time) to generate the machining condition correction amount u[i] this time.

[0062] Specifically, the machining condition generator 32 uses the following formula (1) obtained by multiplying the difference e[i] this time and the difference e[i - 1] the previous time by coefficients K1 and K2 to generate the machining condition correction amount u[i] this time.

[0063]

Formula 1

[0064] u[i] = K1 e[i] + K2(e[i] + e[i - 1])…(1)

[0065] In addition, Figure 4 the shown z -1 corresponds to the difference e[i - 1] at the (i - 1)-th time. The machining condition generator 32 generates the applicable machining conditions for this time to be output to the machining control device 9 by adding the machining condition correction amount u[i] to the basic machining conditions.

[0066] The multi-wire electrical discharge machining machine 1 repeats machining by applying the applicable machining conditions generated by the above machining condition generator 32, whereby the thickness of the thin plate 2X for each machining position approaches the thickness (target value) of the thin plate 2X serving as the reference. Thus, the multi-wire electrical discharge machining machine 1 can reduce the fluctuation of the thickness of the thin plate 2X from the reference value.

[0067] When cutting out the thin plate 2X with multiple multi-wire electrical discharge machining machines 1, each multi-wire electrical discharge machining machine 1 cuts out the thin plate 2X using common basic machining conditions. Thus, the thicknesses of the thin plates 2X cut out by each multi-wire electrical discharge machining machine 1 become the same thickness, and grinding and polishing of the thin plate 2X become easy.

[0068] The machining condition generator 32 generates new applicable machining conditions, for example, by obtaining the thickness of the processed thin plate 2X for each machining position from the machining result collection unit 31 for each machining. The thickness for each machining position can be collected for multiple thin plates 2X cut out by one machining. In this case, the machining result collection unit 31 collects the average value of the thicknesses of the multiple thin plates 2X as the thickness of the thin plate 2X for each machining position.

[0069] In addition, the machining condition generator 32 can obtain the thickness of the processed thin plate 2X for each machining position from the machining result collection unit 31 at each of multiple machinings, and generate new applicable machining conditions using the average thickness for each machining position. The number of times (generation frequency) that the machining condition generator 32 generates the applicable machining conditions for the number of machining times is not limited.

[0070] Figure 5 is a flowchart showing the processing sequence of the processing executed by the multi-wire electrical discharge machining machine according to Embodiment 1. The machining result collection unit 31 of the multi-wire electrical discharge machining machine 1 collects the measurement results of the thin plate thickness as the machining result for each machining position (step S10).

[0071] The subtracter 33 calculates the error of the sheet thickness from the reference value for each machining position (step S20). Specifically, the subtracter 33 calculates, for each machining position, the difference obtained by subtracting the machining result of the sheet thickness from the target value (reference) of the sheet thickness, and this difference is taken as the error of the sheet thickness from the reference value.

[0072] The machining condition generator 32 corrects the basic machining conditions for each machining section (step S30). Specifically, the machining condition generator 32 calculates the machining condition correction amount for each machining section using the error of the sheet thickness from the reference value. In addition, the machining condition generator 32 corrects the basic machining conditions for each machining section by the machining condition correction amount, thereby calculating the applicable machining conditions for each machining section. The machining condition generator 32 outputs the applicable machining conditions for each machining section to the machining control device 9.

[0073] The multi-wire electrical discharge machining machine 1 controls at least one of the drive unit 14 and the machining power supply 7 by the machining control device 9, and thereby machines the workpiece 2 under the applicable machining conditions for each machining section (step S40). The sheet 2X obtained by machining the workpiece 2 has its thickness measured for each machining position by a thickness measuring device or the like. This thickness is sent to the machining result collection unit 31 as the measurement result of the sheet thickness. The multi-wire electrical discharge machining machine 1 repeats the calculation process of the applicable machining conditions based on the measurement result of the sheet thickness and the machining process of the workpiece 2 using the applicable machining conditions.

[0074] In addition, in the cutting process of the workpiece 2, reducing the machining fluctuations of the sliced sheet 2X is important for reducing the loads of the subsequent grinding process and polishing process and for improving the yield. Assuming that due to the influence of the assembly fluctuations of the components of the multi-wire electrical discharge machining machine or the assembly operator, when the error of the thickness of the machined sheet 2X from the reference value fluctuates in-plane for each multi-wire electrical discharge machining machine, in order to reduce the fluctuations, a skilled operator needs to adjust the machining conditions for each multi-wire electrical discharge machining machine, which requires a lot of experience and a lot of time.

[0075] On the other hand, for the multi-wire electrical discharge machining machine 1 of Embodiment 1, since the error of the thickness of the machined sheet 2X from the reference value does not fluctuate in-plane, there is no need for the operator to adjust the machining conditions.

[0076] In addition, when the error of the thickness of the processed thin plate 2X from the reference value fluctuates within the plane, in order to absorb the processing fluctuations of the thin plate 2X, it is necessary to adjust the grinding amount and polishing amount of the thin plate 2X. Therefore, the loads in the grinding process and the polishing process increase.

[0077] On the other hand, in the multi-wire electrical discharge machining machine 1 of Embodiment 1, since the error of the thickness of the processed thin plate 2X from the reference value does not fluctuate within the plane, the loads in the grinding process and the polishing process can be suppressed to be small.

[0078] In addition, the machining condition generation device 30 may also be arranged in the machining control device 9. Figure 6 It is a diagram showing another structural example of the machining control device included in the multi-wire electrical discharge machining machine according to Embodiment 1.

[0079] The machining control device 9A includes a machining condition generation device 30 and a control unit 35. The control unit 35 has the same functions as those of the machining control device 9. When the machining condition generation device 30 is arranged in the machining control device 9, the multi-wire electrical discharge machining machine 1 also performs the same processing as when the machining condition generation device 30 is arranged outside the machining control device 9.

[0080] Here, the hardware structures of the machining condition generation device 30, the machining control devices 9 and 9A will be described. In addition, the machining condition generation device 30 and the machining control devices 9 and 9A have the same hardware structure, so the hardware structure of the machining condition generation device 30 will be described here.

[0081] Figure 7 It is a diagram showing a hardware structure example for implementing the machining condition generation device according to Embodiment 1. The machining condition generation device 30 can be realized by an input device 300, a processor 100, a memory 200 and an output device 400. Examples of the processor 100 are a CPU (also referred to as Central Processing Unit, central processing device, processing device, arithmetic device, microprocessor, microcomputer, DSP (Digital Signal Processor)) or a system LSI (Large Scale Integration). Examples of the memory 200 are a RAM (Random Access Memory) and a ROM (Read Only Memory).

[0082] The processing condition generation device 30 is realized by the processor 100 reading out and executing a computer-executable processing program stored in the memory 200 for executing the operations of the processing condition generation device 30. The program for executing the operations of the processing condition generation device 30, i.e., the processing program, can be said to cause the computer to execute the sequence or method of the processing condition generation device 30.

[0083] The processing program executed by the processing condition generation device 30 becomes a modular structure including the functions of the processing result collection unit 31, the processing condition generator 32, and the subtractor 33. The functions of the processing result collection unit 31, the processing condition generator 32, and the subtractor 33 are downloaded to the main storage device and generated on the main storage device.

[0084] The input device 300 receives the measurement results (Z1, At1), (Z2, At2), ···, (Zn, Atn) from the thickness measuring device and sends them to the processor 100. The memory 200 stores the processing program and the like. In addition, the memory 200 is used as a temporary memory when the processor 100 executes various processes. The output device 400 outputs the applicable processing conditions to the processing control device 9.

[0085] The processing program can be provided as a computer program product by being stored in a computer-readable storage medium in an installable form or an executable form of a file. In addition, the processing program can also be provided to the processing condition generation device 30 via a network such as the Internet. Furthermore, regarding the functions of the processing condition generation device 30, a part can be realized by dedicated hardware such as a dedicated circuit, and a part can be realized by software or firmware.

[0086] As described above, in the first embodiment, the processing condition generation device 30 generates applicable processing conditions by correcting the basic processing conditions based on the difference between the target value, which is the reference value of the thickness of the thin plate 2X for each processing position, and the measurement result of the thickness. Moreover, in the next processing, the processing control device 9 controls at least one of the drive unit 14 and the processing power supply 7, which are the drive parts, using the applicable processing conditions. Thereby, the multi-wire electrical discharge machining machine 1 suppresses the situation where the error of the thickness of the processed thin plate 2X from the reference value fluctuates in the plane.

[0087] In addition, the machining condition generation device 30 calculates the applicable machining conditions for the multi-wire electrical discharge machining machine 1 based on the measurement results (Z1, At1), (Z2, At2),..., (Zn, Atn) of the thin plate 2X machined by the multi-wire electrical discharge machining machine 1. Thereby, even when there are multiple multi-wire electrical discharge machining machines 1, it is possible to suppress the case where the error of the thickness of the thin plate 2X machined by each multi-wire electrical discharge machining machine 1 fluctuates in the plane with respect to the reference value.

[0088] Embodiment 2.

[0089] Next, use Figure 8 Embodiment 2 will be described. In Embodiment 2, applicable machining conditions are generated for a plurality of multi-wire electrical discharge machining machines.

[0090] Figure 8 FIG. is a diagram showing the configuration of the electrical discharge machining system according to Embodiment 2. The electrical discharge machining system 50 includes a plurality of multi-wire electrical discharge machining machines 1X1 to 1X N (N is a natural number greater than or equal to 2) and a host controller 40.

[0091] The multi-wire electrical discharge machining machines 1X1 to 1X N each have Figure 1 among the structural elements of the multi-wire electrical discharge machining machine 1 described in, excluding the machining condition generation device 30. That is, the multi-wire electrical discharge machining machines 1X1 to 1X N each have a cutting wire part 6a, guide rollers 3a to 3d, a drive unit 14, a machining power source 7, a machining control device 9, etc.

[0092] In Embodiment 2, the multi-wire electrical discharge machining machine 1X1 is the first multi-wire electrical discharge machining machine, and the multi-wire electrical discharge machining machines 1X2 to 1X N are the second multi-wire electrical discharge machining machines. The workpiece 2 machined by the multi-wire electrical discharge machining machine 1X1 is the first workpiece, and the workpiece 2 machined by the multi-wire electrical discharge machining machines 1X2 to 1X N is the second workpiece.

[0093] The cutting wire part 6a, guide rollers 3a to 3d, drive unit 14, machining power source 7, and machining control device 9 of the multi-wire electrical discharge machining machine 1X1 are respectively the first cutting wire part, the first guide rollers, the first drive unit, the first machining power source, and the first machining control device.

[0094] The multi-wire electrical discharge machining machines 1X2 to 1X NThe cutting line part 6a, the guide rollers 3a to 3d, the drive unit 14, the machining power supply 7, and the machining control device 9 are respectively the second cutting line part, the second guide roller, the second drive unit, the second machining power supply, and the second machining control device.

[0095] For example, semiconductor wafers are sometimes produced on a scale of tens of thousands per month. However, due to the limited size of the semiconductor ingot, only dozens to hundreds of semiconductor wafers can be cut from one ingot. Therefore, in order to process the target production quantity, in the cutting process of semiconductor wafers, multiple multi-wire electrical discharge machining machines 1X1 to 1X N are used to process the semiconductor ingot, thereby ensuring the monthly production quantity. It is desired that when using multiple multi-wire electrical discharge machining machines 1X1 to 1X N the thickness fluctuation of the thin plate 2X starting from the reference value for each machining position is also reduced.

[0096] In Embodiment 2, the superior controller 40 calculates the applicable machining conditions for each of the multi-wire electrical discharge machining machines 1X1 to 1X N Thereby, when using multiple multi-wire electrical discharge machining machines 1X1 to 1X N the thickness fluctuation of the thin plate 2X starting from the reference value for each machining position is also reduced.

[0097] The superior controller 40 is connected to the multi-wire electrical discharge machining machines 1X1 to 1X N The superior controller 40 includes machining condition generation devices 302 to 30 N and a machining condition transmission unit 43.

[0098] Each of the machining condition generation devices 302 to 30 N has the same function as the machining condition generation device 30. That is, each of the machining condition generation devices 302 to 30 N respectively includes a machining result collection unit 31, a machining condition generator 32, and a subtractor 33.

[0099] The machining condition generation devices 302 to 30 N are respectively connected to the multi-wire electrical discharge machining machines 1X1 to 1X N The multi-wire electrical discharge machining machine 1X1 processes the workpiece 2 using the basic machining conditions. Therefore, the superior controller 40 does not include the machining condition generation device 301.

[0100] The machining condition generation devices 302 to 30 N collect the thin plate thickness of the thin plate 2X machined by the multi-wire electrical discharge machining machine 1X1 for each machining position, and set this thin plate thickness as the target value of the thin plate thickness.

[0101] In addition, the machining condition generation devices 302 to 30N For each of the multi-wire electrical discharge machining machines 1X2 to 1X N collect the sheet thickness at each machining position of the thin sheet 2X machined, and calculate the applicable machining conditions for each of the multi-wire electrical discharge machining machines 1X2 to 1X N That is, the machining condition generation device 30 M (where M is a natural number from 2 to N) collects the sheet thickness at each machining position of the thin sheet 2X machined by the multi-wire electrical discharge machining machine 1X M and calculates the applicable machining conditions used by the multi-wire electrical discharge machining machine 1X M The machining condition generation device 30 M uses the sheet thickness at each machining position of the thin sheet 2X machined by the multi-wire electrical discharge machining machine 1X1 as the target value of the sheet thickness, and uses the sheet thickness at each machining position of the thin sheet 2X machined by the multi-wire electrical discharge machining machine 1X M as the measurement result, and calculates the applicable machining conditions.

[0102] The multi-wire electrical discharge machining machine 1X M machines the thin sheet 2X as the first thin sheet, and the multi-wire electrical discharge machining machine 1X1 machines the thin sheet 2X as the second thin sheet. In addition, the measurement result of the sheet thickness at each machining position of the thin sheet 2X machined by the multi-wire electrical discharge machining machine 1X M is the first measurement result, and the measurement result of the sheet thickness at each machining position of the thin sheet 2X machined by the multi-wire electrical discharge machining machine 1X1 is the second measurement result.

[0103] The machining condition transmission unit 43 sends the applicable machining conditions calculated by the machining condition generation device 30 M to the multi-wire electrical discharge machining machine 1X M . In addition, it is also possible that the upper controller 40 has one machining result collection unit 31, and the machining condition generation devices 302 to 30 N do not have the machining result collection unit 31. In this case, one machining result collection unit 31 collects the sheet thickness at each machining position of the thin sheet 2X machined by the multi-wire electrical discharge machining machines 1X1 to 1X N and sends it to each of the machining condition generation devices 302 to 30 N . That is, if the machining result collection unit 31 collects the sheet thickness at each machining position of the thin sheet 2X machined by the multi-wire electrical discharge machining machine 1X M , it sends the sheet thickness to the machining condition generation device 30 M corresponding to the multi-wire electrical discharge machining machine 1X MIn addition, if the processing result collection unit 31 collects the sheet thickness for each processing position of the thin sheet 2X processed by the multi-wire electrical discharge machining machine 1X1, it sends the sheet thickness as the target value of the sheet thickness to the processing condition generation device 30. M .

[0104] As described above, in the second embodiment, the target value (reference value) of the sheet thickness used by the processing condition generation devices 302 to 30 N is the sheet thickness for each processing position of the thin sheet 2X processed by the multi-wire electrical discharge machining machine 1X1. That is, when the measurement results of the sheet thickness for each processing position of the thin sheet 2X processed by the processing condition generation device 301 are the measurement results (Z1, At1), (Z2, At2), ···, (Zn, Atn), the processing condition generation devices 302 to 30 N set the measurement results (Z1, At1), (Z2, At2), ···, (Zn, Atn) as the target values (Z1, A1), (Z2, A2), ···, (Zn, An).

[0105] Accordingly, the sheet thickness for each processing position of the thin sheet 2X processed by the multi-wire electrical discharge machining machines 1X2 to 1X N is close to the sheet thickness for each processing position of the thin sheet 2X processed by the multi-wire electrical discharge machining machine 1X1. As described above, the electrical discharge machining system 50 applies the processing result of one of the multi-wire electrical discharge machining machines 1X1 to 1X N as the thickness of the reference thin sheet 2X, whereby the processing results of the multi-wire electrical discharge machining machines 1X1 to 1X N are close to the processing result of the reference multi-wire electrical discharge machining machine 1X1. That is, it is possible to reduce the thickness fluctuation of the thin sheet 2X processed by the multi-wire electrical discharge machining machines 1X1 to 1X N starting from the reference value.

[0106] In addition, similar to the multi-wire electrical discharge machining machine 1, the multi-wire electrical discharge machining machine 1X1 can calculate applicable processing conditions based on the preset target values (Z1, A1), (Z2, A2), ···, (Zn, An). In this case, the processing results of the multi-wire electrical discharge machining machines 1X1 to 1X N are close to the target values (Z1, A1), (Z2, A2), ···, (Zn, An).

[0107] For multiple multi-wire electrical discharge machining machines 1X1 to 1X N when cutting out the thin sheet 2X, it is also possible to reduce the thickness fluctuation of the thin sheet 2X processed by the multi-wire electrical discharge machining machines 1X1 to 1X NThe thickness fluctuation of the processed thin plate 2X from the reference value, so there is no need for a skilled operator to adjust the processing conditions for each multi-wire electrical discharge machining machine 1X1 to 1X N Moreover, the multi-wire electrical discharge machining machines 1X1 to 1X N The error of the thickness of the thin plate 2X processed from the reference value has no fluctuation within the plane, so the loads in the grinding process and the polishing process can be suppressed to be small.

[0108] In addition, the processing condition generation device 30 can also be arranged outside the upper-level controller 40. For example, the processing result collection unit 31 and the processing condition generator 32 can be arranged in each of the multi-wire electrical discharge machining machines 1X2 to 1X N Moreover, the processing result collection unit 31 can be arranged in the upper-level controller 40, and the processing condition generator 32 can be arranged in each of the multi-wire electrical discharge machining machines 1X2 to 1X N respectively.

[0109] As described above, according to the second embodiment, the processing result of one of the multi-wire electrical discharge machining machines 1X1 to 1X N is used as the thickness of the reference thin plate 2X. Therefore, when cutting out the thin plate 2X with multiple multi-wire electrical discharge machining machines 1X1 to 1X N it is also possible to suppress the situation where the error of the thickness of the processed thin plate 2X from the reference value fluctuates within the plane.

[0110] The structures shown in the above embodiments represent an example, and can also be combined with other known technologies, and the embodiments can also be combined with each other. Without departing from the main idea, a part of the structure can also be omitted or changed.

[0111] Explanation of reference numerals

[0112] 1, 1X1 to 1X N Multi-wire electrical discharge machining machines, 2 Workpiece, 2X Thin plate, 3a to 3d Guide rollers, 4 Spool, 5 Wire discharge roller, 6 Wire electrode, 6a Cutting wire part, 6b Power supply wire part, 7 Processing power supply, 8 Processing power supply unit, 9, 9A Processing control device, 10 Ground electrode, 11 Cable, 12 Power supply member, 13 Power supply member unit, 14 Driving unit, 15 Processing state detection device, 16 Processing state detection unit, 17 Spool driving part, 18 Guide roller driving part, 30, 301 to 30 N Processing condition generation device, 31 Processing result collection unit, 32 Processing condition generator, 33 Subtractor, 35 Control unit, 40 Upper-level controller, 43 Processing condition transmission part, 50 Electrical discharge machining system, 100 Processor, 200 Memory, 300 Input device, 400 Output device.

Claims

1. A multi-wire electrical discharge machining machine, characterized in that, comprising: a cutting line section that juxtaposes wire electrodes wound around a plurality of guide rollers and faces a workpiece; a drive section that adjusts the distance between the workpiece and the cutting line section; a machining power supply that applies a pulsed voltage between the workpiece and the cutting line section; a machining control device that controls the drive section and the machining power supply; and a machining condition generation device that generates machining conditions to be applied in the next machining, i.e., applicable machining conditions, based on measurement results of the thickness at each machining position within the machining surface of a thin plate cut out by machining the workpiece with the cutting line section; the machining condition generation device corrects basic machining conditions, i.e., basic machining conditions, based on the difference between a reference value, i.e., a target value, of the thickness at each machining position of the thin plate and the measurement results, thereby generating the applicable machining conditions; the machining control device controls at least one of the drive section and the machining power supply using the applicable machining conditions during the next machining.

2. The multi-wire electrical discharge machining machine according to claim 1, wherein the target value is the measurement result of the thickness at each machining position of a thin plate machined by other multi-wire electrical discharge machining machines of the same model.

3. The multi-wire electrical discharge machining machine according to claim 1 or 2, wherein the basic machining conditions include at least one of an average value of the pulsed voltage applied per unit time between the cutting line section and the workpiece, i.e., a target voltage, an average value of the current flowing per unit time between the cutting line section and the workpiece, i.e., an average machining current, the number of times without discharge per unit time during electrical discharge machining, i.e., an open number, and an average value of the voltage per unit time during opening, i.e., an open voltage; the machining condition generation device generates the applicable machining conditions by correcting at least one of the target voltage, the average machining current, the open number, and the open voltage included in the basic machining conditions.

4. A processing control device, characterized in that, comprising: a control section that controls a drive section and a machining power supply, the drive section adjusting the distance between a cutting line section that juxtaposes wire electrodes wound around a plurality of guide rollers and faces a workpiece and the workpiece, the machining power supply applying a pulsed voltage between the workpiece and the cutting line section; and a machining condition generation device that generates machining conditions to be applied in the next machining, i.e., applicable machining conditions, based on measurement results of the thickness at each machining position within the machining surface of a thin plate cut out by machining the workpiece with the cutting line section; the machining condition generation device corrects basic machining conditions, i.e., basic machining conditions, based on the difference between a reference value, i.e., a target value, of the thickness at each machining position of the thin plate and the measurement results, thereby generating the applicable machining conditions; the control section controls at least one of the drive section and the machining power supply using the applicable machining conditions during the next machining.

5. A machining condition generation device, characterized in that, comprising: A processing result collection unit that collects measurement results of the thickness at each processing position in the processed surface of the thin plate cut out by cutting a workpiece with a cutting wire, the cutting wire being arranged in parallel by winding a wire electrode around a plurality of guide rollers and facing the workpiece; and A processing condition generator that generates, based on the measurement results, the processing conditions to be applied in the next processing, i.e., the applicable processing conditions, The processing condition generator corrects the basic processing conditions, i.e., the basic processing conditions, based on the difference between the target value, which is the reference value of the thickness at each processing position of the thin plate, and the measurement results, thereby generating the applicable processing conditions.

6. A discharge machining system, characterized in that, It has: A first multi-wire electrical discharge machining machine that machines a first workpiece; A second multi-wire electrical discharge machining machine, which is of the same model as the first multi-wire electrical discharge machining machine, and machines a second workpiece; and A processing condition generation device that generates, based on the first measurement results of the thickness at each processing position in the processed surface of the first thin plate cut out by the second multi-wire electrical discharge machining machine by machining the second workpiece, the processing conditions to be applied in the next processing by the second multi-wire electrical discharge machining machine, i.e., the applicable processing conditions, The first multi-wire electrical discharge machining machine has: A first cutting wire part that arranges a first wire electrode in parallel by winding it around a plurality of first guide rollers and faces the first workpiece; A first driving part that adjusts the distance between the first workpiece and the first cutting wire part; A first processing power supply that applies a pulsed voltage between the first workpiece and the first cutting wire part; and A first processing control device that controls the first driving part and the first processing power supply, The second multi-wire electrical discharge machining machine has: A second cutting wire part that arranges a second wire electrode in parallel by winding it around a plurality of second guide rollers and faces the second workpiece; A second driving part that adjusts the distance between the second workpiece and the second cutting wire part; A second processing power supply that applies a pulsed voltage between the second workpiece and the second cutting wire part; and A second processing control device that controls the second driving part and the second processing power supply, The processing condition generation device corrects the basic processing conditions, i.e., the basic processing conditions, based on the difference between the target value, which is the reference value of the thickness at each processing position of the first thin plate, and the first measurement results, thereby generating the applicable processing conditions, The second processing control device uses the applicable processing conditions to control at least one of the second driving part and the second processing power supply during the next processing, The target value is the second measurement results of the thickness at each processing position in the processed surface of the second thin plate cut out by the first cutting wire part by machining the first workpiece.

7. The electrical discharge machining system according to claim 6, characterized in that It further has a superior controller that is connected to the first multi-wire electrical discharge machining machine and the second multi-wire electrical discharge machining machine, The superior controller has the processing condition generation device, The machining condition generating device collects the second measurement result from the first multi-wire electrical discharge machining machine and sends the applicable machining conditions to the second multi-wire electrical discharge machining machine.

8. A discharge machining method, characterized in that, Comprising: A machining condition generating step, in which a multi-wire electrical discharge machining machine corrects the basic machining conditions, i.e., the basic machining conditions, based on the difference between the target value, which is the reference value of the thickness of the thin plate for each machining position, and the measurement result, thereby generating applicable machining conditions. The multi-wire electrical discharge machining machine has a cutting wire part in which a wire electrode is wound around a plurality of guide rollers and arranged in parallel, opposite to the workpiece, a driving part for adjusting the distance between the workpiece and the cutting wire part, a machining power supply for applying a pulsed voltage between the workpiece and the cutting wire part, a machining control device for controlling the driving part and the machining power supply, and a machining condition generating device for generating the machining conditions to be applied in the next machining, i.e., the applicable machining conditions, based on the measurement result of the thickness of the thin plate cut out by machining the workpiece through the cutting wire part for each machining position within the machining surface; And A control step, in which the multi-wire electrical discharge machining machine controls at least one of the driving part and the machining power supply using the applicable machining conditions during the next machining.

9. A method for manufacturing a thin plate, characterized in that, Comprising: A machining condition generating step, in which a multi-wire electrical discharge machining machine corrects the basic machining conditions, i.e., the basic machining conditions, based on the difference between the target value, which is the reference value of the thickness of the thin plate for each machining position, and the measurement result, thereby generating applicable machining conditions. The multi-wire electrical discharge machining machine has a cutting wire part in which a wire electrode is wound around a plurality of guide rollers and arranged in parallel, opposite to the workpiece, a driving part for adjusting the distance between the workpiece and the cutting wire part, a machining power supply for applying a pulsed voltage between the workpiece and the cutting wire part, a machining control device for controlling the driving part and the machining power supply, and a machining condition generating device for generating the machining conditions to be applied in the next machining, i.e., the applicable machining conditions, based on the measurement result of the thickness of the thin plate cut out by machining the workpiece through the cutting wire part for each machining position within the machining surface; And A control step, in which the multi-wire electrical discharge machining machine controls at least one of the driving part and the machining power supply using the applicable machining conditions during the next machining.

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