Anti-disassembly traceability LED light source module and traceability management method

Abstract

The invention discloses an anti-disassembly traceability LED light source module and a traceability management method. The module comprises a substrate, an LED chip, an RFID chip and fluorescent glue. The LED chip and the RFID chip are arranged on a chip island platform on the front surface of the substrate in parallel and are jointly covered by fluorescent glue; the two power leads are connected with the first electrode and the second electrode of the substrate respectively and serve as radiating antennas of the RFID chip at the same time. According to the traceability method, the TID or EPC code of the RFID chip is bound with the identity information of the light source to form a non-tampering evidence; and during detection, RFID signals radiated by the power supply lead are wirelessly read, and identity tracing is realized by matching evidence information. The module adopts a fluorescent glue integrated packaging structure, the communication function of the RFID chip is destroyed if the module is forcibly dismantled, and the physical anti-dismantling effectiveness is ensured. The system is compact in structure, realizes low-cost and high-reliability product identity tracing through double binding of hardware and data, and is suitable for anti-counterfeiting and supply chain management of lighting equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of LED light sources, and particularly to an anti-disassembly and traceability LED light source module and a traceability management method. Background Art

[0002] At present, there are many problems such as cross-region sales, product counterfeiting, and after-sales warranty confusion among different channels in the production, transportation, and sales processes of many LED lighting fixture brands. The RFID tag solution can perfectly solve the above problems. However, most of the existing RFID tag solutions on the market currently cannot achieve good anti-disassembly ability and the ability to read and write against metal. Summary of the Invention

[0003] The present invention aims to provide an anti-disassembly and traceability LED light source module and a traceability management method to solve the problems of cross-region sales and counterfeiting of LED lighting fixtures. The technical solutions are as follows:

[0004] In a first aspect: An anti-disassembly and traceability LED light source module includes a substrate, an LED chip, a first electrode, a second electrode, and a fluorescent glue; the first electrode and the second electrode are formed on the front surface of the substrate, the LED chip is installed on a chip island in the middle of the front surface of the substrate, and its pins are electrically connected to the first electrode and the second electrode; the fluorescent glue covers the LED chip;

[0005] It further includes an RFID chip, a ring-shaped feeding antenna, and two power leads;

[0006] The RFID chip is installed on a chip island in the middle of the substrate and is covered by the fluorescent glue together with the LED chip;

[0007] The ring-shaped feeding antenna is formed in the edge area of the front surface of the substrate, arranged around the outside of the first electrode and the second electrode, and its feeding end is electrically connected to the RFID chip through gold wire bonding;

[0008] The two power leads are respectively electrically connected to the first electrode and the second electrode, and at the same time serve as the radiation unit of the RFID chip, and the power leads extend outward from the edge of the substrate to form an antenna radiation structure.

[0009] Further, there are multiple LED chips, which are connected in parallel or in series or in a series-parallel combination and then electrically connected to the first electrode and the second electrode.

[0010] Further, it further includes a dam glue, which is coated on the substrate and forms an annular closed structure around the chip island, and the fluorescent glue is filled in the area defined by the dam glue.

[0011] Furthermore, the line width of the circular feed antenna is 0.1–0.5 mm, and it maintains a spacing of 0.2–1 mm from the first electrode and the second electrode.

[0012] Furthermore, the power supply lead forms an L-shaped bending structure in the epitaxial part of the substrate, with a bending angle of 90 - 135 degrees, a bending length greater than 2 mm, and a lead length greater than 30 mm.

[0013] Furthermore, the pins of the LED chip are electrically connected to the first electrode and the second electrode through gold wire bonding, or are electrically connected by soldering using a flip chip.

[0014] Furthermore, the substrate is a three-layer composite structure, including an insulating and heat-conducting layer, a metal substrate layer, and a surface treatment layer.

[0015] Furthermore, the first electrode, the second electrode, and the circular feed antenna are formed on the substrate through printing or etching processes.

[0016] Furthermore, the RFID chip operates in the ultra-high frequency band.

[0017] Second aspect: A traceability management method for an anti-tampering and traceable LED light source module, which is applied to the anti-tampering and traceable LED light source module as described above; it includes:

[0018] During production, the TID or EPC code of the RFID chip is bound to the light source identity information to form an immutable certificate.

[0019] During detection, the RFID signal radiated by the power supply lead is wirelessly read, and the identity traceability is achieved by matching the certificate information.

[0020] Compared with the prior art, the remarkable features of the present invention are:

[0021] The structure of the present invention is compact, and through the dual binding of hardware and data, low-cost and highly reliable product identity traceability is achieved, which is suitable for lighting equipment anti-counterfeiting and supply chain management. Description of the Drawings

[0022] Figure 1 is the structural expansion of the anti-tampering and traceable LED light source module of the present invention Figure I ;

[0023] Figure 2 is the structural expansion of the anti-tampering and traceable LED light source module of the present invention Figure II ;

[0024] Figure 3 is the overall view of the anti-tampering and traceable LED light source module of the present invention. Detailed Embodiments

[0025] To further illustrate each embodiment, the present invention provides accompanying drawings. These drawings are part of the disclosure of the present invention, mainly used to illustrate the embodiments, and can be used in conjunction with the relevant descriptions in the specification to explain the operating principle of the embodiments. With reference to these contents, those of ordinary skill in the art should be able to understand other possible implementation manners and the advantages of the present invention. The components in the drawings are not drawn to scale, and similar component symbols are usually used to represent similar components.

[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific implementation manners.

[0027] As Figures 1 to 3 shown, the present invention provides an anti-disassembly and traceability LED light source module, which includes a substrate 8, an LED chip 5, a first electrode 3, a second electrode 4, a fluorescent glue 1, a dam glue 2, an RFID chip 6, a circular feeding antenna 7, and two power leads 9 and 10. The first electrode 3 and the second electrode 4 are formed on the front surface of the substrate. The LED chip 5 is installed on the chip island in the middle of the front surface of the substrate 8, and its pins are electrically connected to the first electrode 3 and the second electrode 4. The fluorescent glue 1 covers the LED chip 5. The RFID chip 6 is installed on the chip island in the middle of the substrate 8 and is covered by the fluorescent glue 1 together with the LED chip 5. The circular feeding antenna 7 is formed in the edge area of the front surface of the substrate 8, arranged around the outside of the first electrode 3 and the second electrode 4, and its feeding end is electrically connected to the RFID chip 6 through gold wire bonding. The two power leads 9 and 10 are respectively electrically connected to the first electrode 3 and the second electrode 4, and at the same time serve as the radiation units of the RFID chip 6 (formed by electromagnetic coupling with the circular feeding antenna 7). The power leads 9 and 10 extend outward from the edge of the substrate 8 to form an antenna radiation structure. The module adopts an integrated fluorescent glue packaging structure. If it is forcibly disassembled, the communication function of the RFID chip will be damaged, ensuring the effectiveness of physical anti-disassembly.

[0028] The number of LED chips 5 is multiple, and they are connected in parallel or in series or in series-parallel and then electrically connected to the first electrode and the second electrode to support high-current and / or high-voltage applications.

[0029] The dam glue 2 is a preferred setting. The dam glue 2 is coated on the substrate 8 and forms an annular closed structure around the chip island, and the fluorescent glue 1 is filled in the area defined by the dam glue 2.

[0030] The double-layer packaging structure composed of the dam glue 2 and the fluorescent glue 1 produces the following technical effects to realize the optimization of anti-disassembly and optical performance.

[0031] (1) Physical structure stability: The dam glue forms an annular closed structure on the substrate (width 0.3–0.8 mm, height 0.5–1.2 mm), precisely defining the filling boundary of the fluorescent glue and preventing the liquid fluorescent glue from overflowing to the electrode area before curing. The combination of the two forms a "hard frame and soft core" composite encapsulation structure, controlling the thickness deviation of the fluorescent glue layer within ±5%, and avoiding the color temperature difference of the light spot caused by uneven colloid distribution (ΔCCT≤100K).

[0032] (2) Dual moisture and dust protection barriers: The dam glue uses high-viscosity epoxy resin, and its dense cross-linked network blocks the water vapor penetration path, making the module airtightness reach the IP67 standard; the fluorescent glue is added with hydrophobic nano-silica particles (particle size 50-100 nm). After acting together with the dam glue, the insulation resistance degradation rate is <10% after 1000 hours of damp heat aging test (85℃ / 85%RH).

[0033] (3) Light efficiency improvement and thermal management: The white reflective property of the dam glue (reflectivity ≥85%) reflects the lateral light leakage back to the fluorescent glue layer, increasing the luminous flux by 8% - 12%; the fluorescent glue is doped with aluminum nitride thermal conductive filler (content 15-25wt%), forming a thermal conductivity gradient with the dam glue, reducing the LED junction temperature by 6-8℃, and ensuring that the light decay is <3% after 3000 hours.

[0034] (4) Anti-disassembly linkage mechanism: When the dam glue structure is damaged by external force (deformation amount >0.2 mm), the mechanical stress generated by its fracture is conducted to the RFID chip through the fluorescent glue, which will damage the communication function of the RFID chip. The system cannot read the traceability information, resulting in the module losing the warranty right.

[0035] (5) Process compatibility optimization: The curing temperature of the dam glue (80-100℃) and the curing conditions of the fluorescent glue (120-140℃) form a step curing process, avoiding the interface delamination problem. The shear strength of the bonding surface is ≥8 MPa, significantly higher than that of the traditional single-layer encapsulation structure (about 5 MPa).

[0036] The line width of the annular feeding antenna 7 is 0.1–0.5 mm, and it maintains a distance of 0.2–1 mm from the first electrode 3 and the second electrode 4. It meets the requirements of feeding and electromagnetic coupling.

[0037] The power leads 9, 10 form an L-shaped bending structure in the extended part of the substrate, with a bending angle of 90-135 degrees, a bending length greater than 3 mm, and a lead length greater than 30 mm. The leads under this structure can provide good electromagnetic radiation performance, and at the same time make the RFID tag composed of the RFID chip 6, the annular feeding antenna 7 and the power leads 9, 10 have strong anti-metal ability.

[0038] The overall thickness of the substrate 8 is 1.2–3.0 mm (preferably 1.6 mm), and it adopts a three-layer composite structure:

[0039] Insulating and heat-conducting layer (upper layer): with a thickness of 0.2–0.4 mm, made of alumina ceramic substrate (thermal conductivity ≥ 25 W / m·K), achieving the dual functions of electrical isolation and heat conduction;

[0040] Metal substrate layer (middle layer): with a thickness of 0.8–2.0 mm, made of 6063 aluminum alloy (tensile strength ≥ 180 MPa), serving as the main heat dissipation channel and mechanical support;

[0041] Surface treatment layer (lower layer): with a thickness of 0.05–0.1 mm, made of anodic oxidation film (hardness ≥ 400 HV), enhancing corrosion resistance and surface adhesion.

[0042] The first electrode 3, the second electrode 4, and the annular feeding antenna 7 are formed on the insulating and heat-conducting layer of the substrate 8 through printing or etching processes, with a thickness of 18–105 μm.

[0043] Compared with the traditional aluminum substrate, the above three-layer composite structure can enhance heat dissipation: for a 1.6 mm thick substrate, the LED junction temperature can be stabilized below 85 °C under natural convection (ambient temperature 25 °C), the light decay within 3000 hours is controlled < 2%, and it can carry a power of 100 W level.

[0044] In this application, the RFID chip 6 uses ultra-high frequency RFID, with the operating frequency band in the UHF band. The global general range is 860–960 MHz, and the specific applicable range is determined according to the standards of the country where it is located. This RFID tag is a high-performance passive tag. In an ideal environment (obstacle-free and interference-free), the reading and writing distance can reach 3–12 meters; in a complex environment (near metal / liquid), the reading and writing distance can reach 0.5–5 meters; with a high-gain antenna reader, the maximum reading distance can reach 15–20 meters. It can meet the requirements of long-distance reading and writing such as retail inventory management and logistics pallet tracking.

[0045] The present invention also provides a traceability management method, including:

[0046] During production, bind the TID or EPC code of the RFID chip with the light source identity information (the traceability code of the light source) to form an immutable evidence;

[0047] During detection, wirelessly read the RFID signal radiated by the power lead and match the evidence information to achieve identity traceability.

[0048] In summary, the structure of the present invention is compact, and through the dual binding of hardware and data, it realizes low-cost and highly reliable product identity traceability, and is applicable to anti-counterfeiting of lighting equipment and supply chain management.

[0049] Although the present invention has been specifically shown and described in conjunction with preferred embodiments, those skilled in the art should understand that various changes can be made to the present invention in form and detail without departing from the spirit and scope of the present invention as defined by the appended claims, and all such changes are within the scope of protection of the present invention.

Claims

1. An anti-disassembly and traceability LED light source module, comprising a substrate, an LED chip, a first electrode, a second electrode, and a fluorescent glue; the first electrode and the second electrode are formed on the front surface of the substrate, the LED chip is installed on a chip island in the middle of the front surface of the substrate, and its pins are electrically connected to the first electrode and the second electrode; the fluorescent glue covers the LED chip; characterized in that, it further comprises an RFID chip, a ring-shaped feeding antenna, and two power leads; the RFID chip is installed on a chip island in the middle of the substrate and is covered by the fluorescent glue together with the LED chip; the ring-shaped feeding antenna is formed in the edge area of the front surface of the substrate, arranged around the outside of the first electrode and the second electrode, and its feeding end is electrically connected to the RFID chip through gold wire bonding; the two power leads are respectively electrically connected to the first electrode and the second electrode, and at the same time serve as the radiation unit of the RFID chip, and the power leads extend outward from the edge of the substrate to form an antenna radiation structure.

2. The anti-disassembly and traceability LED light source module according to claim 1, characterized in that There are multiple LED chips, which are connected in parallel or in series and then electrically connected to the first electrode and the second electrode.

3. The anti-disassembly and traceability LED light source module according to claim 1, characterized in that, It further comprises a dam glue, which is coated on the substrate and forms an annular closed structure around the chip island, and the fluorescent glue is filled in the area defined by the dam glue.

4. The anti-disassembly and traceability LED light source module according to claim 1, characterized in that The line width of the ring-shaped feeding antenna is 0.1–0.5 mm, and it keeps a distance of 0.2–1 mm from the first electrode and the second electrode.

5. The anti-tampering and traceable LED light source module according to claim 1, characterized in that, The power leads form an L-shaped bending structure in the extended part of the substrate, the bending angle is 90-135 degrees, the bending length is greater than 2 mm, and the lead length is greater than 30 mm.

6. The anti-tampering and traceable LED light source module according to claim 1, wherein, The pins of the LED chip are electrically connected to the first electrode and the second electrode through gold wire bonding, or are electrically connected by soldering in the form of a flip chip.

7. The anti-disassembly and traceability LED light source module according to claim 1, wherein The substrate is a three-layer composite structure, including an insulating and heat-conducting layer, a metal substrate layer, and a surface treatment layer.

8. The anti-disassembly and traceability LED light source module according to claim 1, characterized in that, The first electrode, the second electrode, and the ring-shaped feeding antenna are formed on the substrate through printing or etching processes.

9. The anti-disassembly and traceability LED light source module according to claim 1, characterized in that, The RFID chip operates in the ultra-high frequency band.

10. A traceability management method for an anti-tampering traceable LED light source module, characterized in that, Applied to the anti-disassembly and traceability LED light source module according to any one of claims 1 to 9; including: During production, the TID or EPC code of the RFID chip is bound to the light source identity information to form an unforgeable evidence; During detection, the RFID signal radiated by the power leads is wirelessly read to match the evidence information to achieve identity traceability.

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