High-speed test bench and method for radio frequency LTCC filter production

Abstract

The invention discloses a high-speed test seat and method for radio frequency LTCC filter production, the high-speed test seat comprises a test clamp, a test PCB and a test seat main body, the test clamp comprises a to-be-tested piece fixing assembly and a clamping plate, the to-be-tested piece fixing assembly is detachably connected with the clamping plate, the test PCB is fixed between the clamping plate and the test seat main body, and the to-be-tested piece fixing assembly is detachably connected with the clamping plate. A through hole is formed in the to-be-tested piece fixing assembly, a mounting hole is formed in the position, corresponding to the through hole, of the clamping plate, the through hole and the mounting hole penetrate through each other, and a conductive piece used for communicating the to-be-tested piece with the test PCB is arranged. According to the invention, the test is carried out by using other conductive parts such as probes and adopting a radio frequency probe mode, so that the accuracy and the stability of radio frequency index test are improved, the service life of the test fixture is prolonged, and the test efficiency is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of radio frequency component production and testing, and particularly relates to a high-speed test socket and method for radio frequency LTCC filter production. Background Art

[0002] LTCC, namely low-temperature co-fired ceramics, is a technology that enables three major passive devices such as resistors, capacitors, and inductors, as well as various passive devices such as filters and transformers, to be encapsulated in a multi-layer wiring substrate. LTCC technology has been widely applied to various products such as mobile phones, Bluetooth, GPS modules, WLAN modules, and WIFI modules. Due to its excellent product reliability, its applications in the fields of automotive electronics, communications, aerospace and military, micro-electromechanical systems, and sensor technology are also increasing continuously. With the advent of the 5G era, the advantages of LTCC technology have become even more prominent. It has the advantages of high conductivity, low-Q dielectric, and low processing temperature, and also performs well in high-frequency characteristics, sealing performance, and heat dissipation performance.

[0003] LTCC radio frequency filters are mainly applied to the fields of consumer electronics and network communication (such as smart phones, base stations, etc.). When producing LTCC radio frequency filters, the electrical performance test of LTCC filters is the most time-consuming link in the entire production process and is also the bottleneck restricting production capacity. Currently, the commonly used test scheme for LTCC filters in the production process is the conductive adhesive test scheme. The test speed (UPH: Units Per Hour) of this test scheme is generally 18 - 20k, and there are the following problems in the test process: 1) In the initial stage, the electrical performance test indicators are acceptable. As the number of tests increases, the electrical performance test indicators drop sharply. According to empirical statistics, assuming the UPH is 20k, generally after 2 hours (i.e., testing 40k tested parts), the test indicators will significantly decrease, and it is necessary to replace the conductive cloth and debug it to ensure the test effect; 2) The time for replacing the conductive cloth and the debugging time after replacement are relatively long, generally about 1 hour; 3) The price of high-quality conductive cloth is relatively high. Calculated according to the consumables, the test cost of LTCC filters will increase; and the S parameters of the conductive cloth cannot be extracted, so the test error cannot be eliminated through calibration technology. Summary of the Invention

[0004] The purpose of the present invention is to provide a high-speed test socket and method for radio frequency LTCC filter production. By using other conductive parts such as probes and adopting the method of radio frequency probes for testing, while improving the accuracy and stability of radio frequency index testing, the service life of the test fixture is also extended, thereby improving the test efficiency.

[0005] In order to achieve the above objectives, the present application provides the following solutions: On the one hand, the present invention provides a high-speed test socket for the production of radio frequency LTCC filters, which includes a test fixture, a test PCB board, and a test socket body. The test fixture includes a component for fixing the component under test and a clamping plate. Among them, the component for fixing the component under test is detachably connected to the clamping plate. The test PCB board is fixed between the clamping plate and the test socket body. A through hole is provided on the component for fixing the component under test. The clamping plate is provided with a mounting hole at a position corresponding to the through hole. The through hole and the mounting hole penetrate through, and a conductive component is provided for connecting the component under test and the test PCB board.

[0006] In some optional embodiments, the component for fixing the component under test includes a fixture cover. Clamping components are symmetrically provided on two opposite sides of the fixture cover. One end of the clamping component extends above the fixture cover, and the other end of the clamping component extends below the fixture cover and is clamped with the clamping plate, so that the component under test is fixed between the fixture cover and the clamping plate.

[0007] In some optional embodiments, the fixture cover is provided with a groove for placing the clamping component. The clamping component includes an abutting block, an elastic component, and a clamping claw. The abutting block is fixed inside the groove. One end of the elastic component is fixed on the abutting block, and the other end is fixed on the upper end of the clamping claw. The lower end of the clamping claw is clamped with the clamping plate. Through the elastic action of the elastic component, the clamping claw can move in the groove to realize the fixing and disassembly of the lower end of the clamping claw and the clamping plate.

[0008] In some optional embodiments, a holding part integrally formed with the clamping claw is provided at the upper end of the clamping claw. An anti-slip convex is provided on a surface of the holding part facing away from the abutting block.

[0009] In some optional embodiments, the conductive component includes a plurality of radio frequency probes arranged in parallel. One end of each radio frequency probe passes through the mounting hole of the clamping plate and is conducted with the microstrip line on the PCB board, and the other end is conducted with the component under test placed between the clamping plate and the fixture cover. The component under test and the microstrip line of the PCB board are conducted through the radio frequency probes.

[0010] In some optional embodiments, the radio frequency probe uses a minimum radio frequency probe with a claw-shaped probe head and a diameter of 0.08 mm, and a hard gold coating is used on the probe head.

[0011] In some optional embodiments, the mounting hole of the clamping plate includes a rectangular mounting hole. A limiting block for respectively limiting the three radio frequency probes is further provided in the rectangular mounting hole. The limiting block is integrally in a T shape. A probe limiting hole is provided at the center of the T-shaped limiting block. The T-shaped limiting block is clamped in the rectangular mounting hole. The gap between the T-shaped limiting block and the inner wall of the rectangular mounting hole forms two limiting holes, and the three radio frequency probes are respectively placed in the three limiting holes.

[0012] In some alternative embodiments, the clamping plate includes a first clamping plate and a second clamping plate. An installation groove for clamping the second clamping plate is provided on the lower end surface of the first clamping plate. The first clamping plate is clamped with the component to be measured fixing assembly. Through installation holes are provided on both the first clamping plate and the second clamping plate.

[0013] In a second aspect, the present application provides a high-speed testing method for the production of radio frequency LTCC filters. The component to be measured is fixed on the testing machine table by using the high-speed testing seat of the first aspect. The testing process is as follows: S1. Calibrate to the end face of the testing cable, and save the calibrated file as the first calibration file; S2. Call the first calibration file, calibrate to the end face of the testing PCB, and save the calibrated file as the second calibration file; S3. Call the second calibration file, calibrate to the tip of the radio frequency probe, and save the calibrated file as the third calibration file; S4. Place the device under test into the high-speed testing seat described in the first aspect, connect the testing instrument and the testing PCB board by using the testing cable, and perform pre-testing on the device under test; S5. If the pre-test passes, perform various parameter tests on the device under test until all tests are completed to obtain the test result of the component to be measured.

[0014] In some alternative embodiments, the specific process of calibrating to the tip of the radio frequency probe in step S3 is as follows: S31. Connect the radio frequency probe to the vector network analyzer through the probe fixture, obtain the S parameters of the radio frequency probe, and store the S parameters of the radio frequency probe as the probe SNP file; S32. Import the probe SNP file into the vector network analyzer; S33. Call the second calibration file, and use the port extension method to extend the testing end face to the tip of the probe to obtain the third calibration file.

[0015] The beneficial effects of the present invention are as follows: The present application provides a testing seat applicable to an automatic testing machine table. The testing is performed by using the radio frequency probe method. While improving the accuracy and stability of the radio frequency index testing, the service life of the testing fixture is also extended, thereby improving the testing efficiency. And the smallest radio frequency probe with a diameter of 0.08 mm is selected, covering a frequency of 25 GHz, which is 4 times higher than the highest testing frequency, ensuring that the testing frequency used is in the middle section of the probe frequency index and meeting future testing requirements; In addition, in order to optimize the testing process, an operation of calibrating the probe is added before the pre-test. Combining the de-embedding calibration technology, the testing end face is further moved forward from the microstrip line of the PCB board to the end face of the device under test, improving the testing accuracy. Description of the Drawings

[0016] Figure 1 An exploded view of a high-speed test socket for the production of radio frequency LTCC filters provided by an embodiment of the present invention; Figure 2 A schematic diagram showing the state when the component to be tested fixing assembly and the clamping plate of the present invention are clamped; Figure 3 A schematic diagram of the limiting block structure provided by an embodiment of the present invention; Figure 4 A schematic diagram of the test PCB board provided by an embodiment of the present invention; Figure 5 A flowchart of a high-speed test method for the production of radio frequency LTCC filters provided by an embodiment of the present invention; Figure 6 S-parameter test results when using conductive cloth; Figure 7 S-parameter test results when using the test socket of the present application.

[0017] Reference numerals: 1 - Component to be tested fixing assembly, 11 - Clamp cover, 12 - Groove, 13 - Contact block, 14 - Elastic member, 15 - Claw, 16 - Anti-slip convex, 17 - Through hole, 2 - Clamping plate, 21 - First clamping plate, 22 - Second clamping plate, 23 - Mounting hole, 3 - Test PCB board, 31 - Microstrip line, 4 - Test socket body, 5 - Radio frequency probe, 6 - Limiting block, 61 - Limiting hole. Detailed implementation manners

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and in no way limits the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0019] Unless otherwise specifically stated, the relative arrangements, numerical expressions and values of the components and steps set forth in these embodiments do not limit the scope of the present invention.

[0020] At the same time, it should be understood that for the convenience of description, the sizes of the various parts shown in the drawings are not drawn in actual proportional relationships.

[0021] In addition, for the sake of clarity and conciseness, the descriptions of well-known structures, functions and configurations may be omitted. Those of ordinary skill in the art will recognize that various changes and modifications can be made to the examples described herein without departing from the spirit and scope of the present disclosure.

[0022] Techniques, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be regarded as part of the authorized specification.

[0023] In all the examples shown and discussed here, any specific values should be construed as merely exemplary, not as limitations. Thus, other examples of the exemplary embodiments may have different values.

[0024] Embodiment 1 As Figure 1 shown, this embodiment provides a high-speed test socket for the production of radio frequency LTCC filters, including a test fixture, a test PCB board 3, and a test socket body 4. The test fixture includes a DUT fixing component 1 and a clamping plate 2. Among them, the DUT fixing component 1 is detachably connected to the clamping plate 2. The test PCB board 3 is fixed between the clamping plate 2 and the test socket body 4. A through hole 17 is provided on the DUT fixing component 1, and a mounting hole 23 is provided on the clamping plate 2 at a position corresponding to the through hole 17. The through hole 17 and the mounting hole 23 penetrate through, and a conductive component is provided for connecting the DUT and the test PCB board 3.

[0025] As Figure 2 shown, the DUT fixing component 1 includes a fixture cover 11 for placing the DUT. Clamping components are symmetrically provided on two opposite sides of the fixture cover 11. One end of the clamping component extends above the fixture cover 11. The DUT is placed above the through hole 17, and the other end of the clamping component extends below the fixture cover 11 and is clamped with the clamping plate 2. It can be seen that the fixture cover 11 is provided with a groove 12 for placing the clamping component. The clamping component includes an abutting block 13, an elastic member 14, and a clamping jaw 15. The abutting block 13 is fixed inside the groove 12. One end of the elastic member 14 is fixed to the abutting block 13, and the other end is fixed to the upper end of the clamping jaw 15. The lower end of the clamping jaw 15 is clamped with the clamping plate 2. Through the elastic action of the elastic member 14, the clamping jaw 15 can move in the groove 12 to realize the fixing and disassembly of the lower end of the clamping jaw 15 and the clamping plate 2. The elastic member 14 can use devices such as springs.

[0026] When it is necessary to fix the fixture cover 11 and the clamping plate 2, by applying a squeezing force to the holding part, the clamping jaw 15 compresses the spring, so that the clamping jaw 15 can be tilted up, and then the tilted part is clamped in the clamping groove inside the clamping plate 2, so that the fixture cover 11 and the clamping plate 2 are fixed (the state at this time is as Figure 2 shown). When disassembling, similarly, press the spring so that the clamping jaw 15 disengages from the clamping groove, and then move the fixture cover 11 upward to separate the fixture cover 11 and the clamping plate 2. In order to increase the friction of the holding part, a holding part integrally formed with the clamping jaw 15 is provided at the upper end of the clamping jaw 15, and an anti-slip protrusion 16 is provided on the surface of the holding part facing away from the abutting block 13.

[0027] Specifically, as Figure 4 shown, the conductive member includes a plurality of parallel radio frequency probes 5. One end of each radio frequency probe 5 passes through the mounting hole 23 of the clamping plate 2 and is electrically connected to the microstrip line 31 on the PCB board, and the other end passes through the through hole 17 of the fixture cover 11 and is electrically connected to the device under test. Thus, the device under test and the microstrip line 31 of the PCB board are electrically connected.

[0028] Moreover, the radio frequency probe uses a minimum radio frequency probe with three claw-shaped probe heads and a diameter of 0.08 mm, and a hard gold coating is adopted on the probe head. By increasing the grounding positions and the number of probes, the high-frequency parasitic parameters are reduced, and the test results are closer to the true values. In this embodiment, the probes are specially customized. The size of the specially customized probes is: radio frequency probes with a diameter of 0.08 mm. Other characteristics of the customized probes are: Mechanical characteristics Spring force: 19 grams @0.40 mm It means that when the compression stroke of the probe is 0.40 mm, the contact pressure generated by the spring is 19 grams-force; Total length: 0.50 mm It means the maximum movable distance of the probe from the free state to the fully compressed state; Recommended stroke: 0.40 mm The recommended optimal compression stroke to ensure long-term stability and mechanical life; Mechanical life: 200,000 cycles The number of compression-rebound times that the probe can withstand under the recommended working stroke; Operating temperature: -40 °C ~ 125 °C Material characteristics Probe - head: Palladium alloy Probe - bottom: Beryllium copper gold-plated (nickel underlayer) Outer sleeve: Phosphor bronze - inner wall gold-plated (nickel underlayer) Spring: Music wire gold-plated (nickel underlayer) Electrical characteristics Bandwidth: 25 GHz @ -0.3 dB Supports high-frequency signal testing and is suitable for radio frequency circuit detection; Current capacity: 1.2 A continuous The maximum sustainable load current value Self-inductance: 0.51 nH, Mutual inductance: 0.24 nH Low-inductance design to reduce signal delay and crosstalk; Capacitance: 0.35 pF Minute parasitic capacitance to avoid high-frequency signal distortion; DC resistance: <80 mΩ (average value) Low contact resistance to ensure signal integrity; The performance of the customized RF probe is tested. Its coverage frequency is 25 GHz, which is 4 times higher than the highest test frequency. This ensures that the test frequency used is in the middle of the probe frequency index and meets future test requirements. The selected probe has an echo loss 6 dB higher than the requirement of the DUT, ensuring the test margin and thus reducing the test uncertainty. The probe selected in this application has good conductivity and is hardened, combining the advantages of brass and steel: it ensures stable contact and good durability of the contacts without scratching the DUT. And the probe coating is made of hard gold, ensuring good chemical resistance of the probe and providing good protection against dirt and corrosion in the production site.

[0029] As Figure 3 shown, the mounting holes are not only used to place the T-shaped limit block, but also used to place the DUT. The through hole 17 is used to place the pressing block that closely fits the DUT and the RF probe. Among them, the mounting hole 23 provided on the clamping plate 2 is a rectangular mounting hole 23. There is also a limit block 6 for respectively limiting the three RF probes 5 in the rectangular mounting hole 23. The limit block 6 is overall in a T shape. There is a probe limit hole 61 at the center of the T-shaped limit block 6. The T-shaped limit block 6 is clamped in the rectangular mounting hole 23. The gap between the T-shaped limit block 6 and the rectangular mounting hole 23 forms two limit holes 61. The three RF probes 5 are respectively placed in the three limit holes 61.

[0030] Among them, the clamping plate 2 includes a first clamping plate 21 and a second clamping plate 22. There is an installation groove for clamping the second clamping plate 22 on the lower end surface of the first clamping plate 21. The first clamping plate 21 is clamped with the DUT fixing assembly 1. Through holes 23 are provided on both the first clamping plate 21 and the second clamping plate 22. The first clamping plate and the second clamping plate cooperate with each other to play a role in stabilizing the RF probe. At the same time, there are pin holes on the two clamping plates that penetrate the test PCB board and the test base. The PCB is placed between the second clamping plate and the test base. The clamping plate, the test PCB board and the test base are connected into a complete test device through pins.

[0031] The operation process of fixing the DUT on the test machine table by using the test socket in this embodiment is as follows: In actual use, first place the RF probe 5 into the limit hole within the limit block 6, then place the limit block 6 between the test PCB board and the clamping plate 2, so that the limit block is embedded in the first clamping plate 21 and the second clamping plate 22 to form the lower half of the test fixture. Next, stack the test PCB board 3 and the assembled lower half of the test fixture on the test seat body 4 in sequence, and connect and fix the test fixture, the test PCB board, and the test seat body 4 through a dowel pin. Then, place the device under test in the mounting hole 23 on the clamping plate. Then, by simultaneously pressing the gripping parts on both sides of the fixture cover, the gripping parts compress the spring, causing the clamping jaws 15 to tilt up. The clamping jaws 15 are snapped into the clamping groove within the clamping plate 2 to fix the clamping plate 2 and the fixture cover 11. At this time, place a pressure block similar in size to the device under test in the through hole 17 at the center position of the fixture cover 11 to press the device under test, ensuring that the device under test is firmly connected to the RF probe. In this way, both ends of the RF probe 5 are in contact with the device under test and the microstrip line 31 on the PCB board respectively. After completing the relevant calibration, the device under test and the PCB board are conducted. Connect the test instrument and the RF connectors at both ends of the test PCB board through a test cable and wait for testing.

[0032] Embodiment 2 As Figure 5 shown, this embodiment provides a high-speed testing method for the production of RF LTCC filters. Conduct strict RF simulation before machining the fixture to minimize the impact of the test fixture on the test results. Then, use the high-speed test seat of Embodiment 1 to fix the device under test on the test machine for testing. The specific testing process is as follows: S1. Calibrate to the end face of the test cable, and save the calibrated file as the first calibration file: S11. Connect the test instrument (here the test instrument is the network analyzer VNA5000A) and the test cable; S12. Use the VNA5000A-K03-S high-performance calibration component supporting VNA5000A to calibrate the test cable, eliminate the test error brought by the test cable, and calibrate the test to the cable end face; S13. Save the calibration file as the first calibration file CAL-1; S2. Calibrate to the PCB end face, and save the calibrated file as the second calibration file: S21. Calculate the S parameters of the PCB according to the thickness, width, and material of the microstrip line on the PCB and the PCB board characteristics, and save them as the SNP file of the PCB. Use the test cable to connect both ends of the test PCB board to the test instrument, and import the SNP file of the PCB into VNA5000A; S22. Call the first calibration file CAL-1, and on this basis, use the de-embedding calibration method to calibrate the test PCB board; S23. Save the calibration file as the second calibration file CAL-2; S3. Calibrate to the tip of the RF probe and save the third calibration file: S31. Connect the RF probe to the vector network analyzer through the probe fixture, obtain the S-parameters of the RF probe, and store the S-parameters of the RF probe as a probe SNP file; S32. Import the probe SNP file into VNA5000A; S33. Call the second calibration file CAL-2, and on this basis, use the port extension method to further extend the test end face to the tip of the probe; S34. Save the calibration file as the third calibration file CAL-3, and thus the entire calibration process is completed; S4. Pre-test: Place the golden sample of the device under test into the test socket in Example 1 for pre-test. When the pre-test result conforms to the theoretical value, the calibration is considered valid; if the test result does not conform to the theoretical value, it is necessary to go back to S1 to re-perform the calibration.

[0033] S5. Formal test: After the pre-test is completed, the formal test can be entered; Optimize the test process, calibrate to the cable end face, the microstrip line of the test PCB board, and the tip of the RF probe in sequence, and finally complete the calibration of the device connecting the device under test. Among them, an operation of calibrating the probe is added before the pre-test. Combining the de-embedding calibration technology, the test end face is further moved forward from the microstrip line of the PCB board to the end face of the device under test, improving the test accuracy.

[0034] As Figure 6 shown, the S-parameter test results when using conductive cloth are given. Among them, the light-colored curve represents the theoretical value of the return loss of the device under test, and the dark-colored curve represents the measured value of the return loss. Figure 7 As shown, the S-parameter test results when using the test socket of the present application are given. It can be seen that the measured effect using the RF probe is more consistent with the theoretical curve, and the overall test effect is better than the test result of the conductive cloth. And in actual use, after the test quantity exceeds 200k, the electrical performance index begins to deteriorate, and a new RF probe needs to be replaced. The replacement frequency is 1 / 3 of the conductive cloth solution; and the replacement time is reduced by 1 / 4. If the UPH is 2k and the daily production task is 20 hours, the original conductive cloth solution can produce about 133.4k per day, and the RF probe socket solution can produce about 400k per day, and the production capacity is increased by about 3 times; the cost of a single test socket is about 2000 yuan, the batch production cost is about 1000 yuan, and the test cost per single device under test is reduced to 1-2 cents per piece, and the test cost is reduced by 5-10 times.

[0035] The above are only the preferred embodiments of the present invention, and do not impose any form of limitation on the present invention. Based on the technical essence of the present invention, any simple modifications, equivalent replacements, and improvements made to the above embodiments within the spirit and principles of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. A high-speed test socket for the production of RF LTCC filters, characterized in that, It includes a test fixture, a test PCB board (3) and a test socket body (4). The test fixture includes a DUT fixing component (1) and a clamping plate (2). Among them, the DUT fixing component (1) is detachably connected to the clamping plate (2). The test PCB board (3) is fixed between the clamping plate (2) and the test socket body (4). A through hole (17) is provided on the DUT fixing component (1). The clamping plate (2) is provided with a mounting hole (23) at a position corresponding to the through hole (17). The through hole (17) and the mounting hole (23) penetrate through, and a conductive component is provided for connecting the DUT to the test PCB board (3).

2. The high-speed test socket for radio frequency LTCC filter production according to claim 1, characterized in that, The DUT fixing component (1) includes a fixture cover (11). Clamping components are symmetrically provided on two opposite sides of the fixture cover (11). One end of the clamping component extends above the fixture cover (11), and the other end extends below the fixture cover (11) and is clamped with the clamping plate (2) to fix the DUT between the fixture cover (11) and the clamping plate (2).

3. The high-speed test socket for radio frequency LTCC filter production according to claim 2, characterized in that, The fixture cover (11) is provided with a groove (12) for placing the clamping component. The clamping component includes an abutting block (13), an elastic component (14) and a clamping jaw (15). The abutting block (13) is fixed inside the groove (12). One end of the elastic component (14) is fixed on the abutting block (13), and the other end is fixed on the upper end of the clamping jaw (15). The lower end of the clamping jaw (15) is clamped with the clamping plate (2). Through the elastic action of the elastic component (14), the clamping jaw (15) can move in the groove (12) to realize the fixing and disassembly of the lower end of the clamping jaw (15) and the clamping plate (2).

4. The high-speed test socket for radio frequency LTCC filter production according to claim 3, wherein, A holding part integrally formed with the clamping jaw (15) is provided at the upper end of the clamping jaw (15). An anti-slip convex (16) is provided on a surface of the holding part facing away from the abutting block (13).

5. The high-speed test socket for radio frequency LTCC filter production according to claim 1, characterized in that, The conductive component includes a plurality of parallel radio frequency probes (5). One end of each radio frequency probe (5) passes through the mounting hole (23) of the clamping plate (2) and is conducted with a microstrip line (31) on the test PCB board (3), and the other end is conducted with the DUT.

6. The high-speed test socket for radio frequency LTCC filter production according to claim 5, characterized in that, The radio frequency probe (5) uses a minimum radio frequency probe with three claw-shaped probe heads and a diameter of 0.08 mm, and a hard gold coating is used on the probe head.

7. A high-speed test socket for the production of radio frequency LTCC filters according to claim 5, characterized in that, The mounting hole (23) of the clamping plate (2) includes a rectangular mounting hole (23). A limiting block (6) for respectively limiting the three radio frequency probes (5) is further provided in the rectangular mounting hole (23). The limiting block (6) is integrally in a T shape. A probe limiting hole (61) is provided at the center of the T-shaped limiting block (6). The T-shaped limiting block (6) is clamped in the rectangular mounting hole (23). The gap between the T-shaped limiting block (6) and the rectangular mounting hole (23) forms two limiting holes (61), and the three radio frequency probes (5) are respectively placed in the three limiting holes (61).

8. A high-speed test socket for radio frequency LTCC filter production according to claim 1, characterized in that, The clamping plate (2) includes a first clamping plate (21) and a second clamping plate (22). A mounting groove for clamping the second clamping plate (22) is provided on the lower end surface of the first clamping plate (21). The first clamping plate (21) is clamped with the DUT fixing component (1). Through holes (23) are provided on both the first clamping plate (21) and the second clamping plate (22).

9. A high-speed testing method for the production of RF LTCC filters, characterized in that, The test process is as follows: S1. Calibrate to the end face of the test cable, and save the calibrated file as the first calibration file; S2. Call the first calibration file, calibrate to the end face of the test PCB, and save the calibrated file as the second calibration file; S3. Call the second calibration file, calibrate to the tip of the RF probe, and save the calibrated file as the third calibration file; S4. Place the DUT into the high-speed test socket as described in Claim 1, connect the test instrument and the test PCB board using the test cable, and perform a pre-test on the DUT; S5. If the pre-test passes, perform various parameter tests on the DUT until all tests are completed to obtain the test results of the DUT.

10. A high-speed testing method for the production of radio frequency LTCC filters according to claim 9, characterized in that, The specific process of calibrating to the tip of the RF probe in step S3 is as follows: S31. Connect the RF probe to the vector network analyzer through the probe fixture, obtain the S parameters of the RF probe, and store the S parameters of the RF probe as the probe SNP file; S32. Import the probe SNP file into the vector network analyzer; S33. Call the second calibration file, and use the port extension method to extend the test end face to the tip of the probe to obtain the third calibration file.

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