Gallium nitride chip high-temperature test automatic feeding and discharging mechanism and method

Abstract

The invention discloses an automatic feeding and discharging mechanism and method for high-temperature testing of gallium nitride chips, and relates to the technical field of feeding and discharging for high-temperature testing of chips. An automatic feeding and discharging mechanism for high-temperature testing of gallium nitride chips comprises a testing table and further comprises a conveying disc rotationally arranged in the testing table, the conveying disc and the testing table slide and are sealed, a containing groove is formed in the conveying disc, a first motor is fixedly installed at the bottom of the testing table, and a second motor is fixedly installed at the bottom of the testing table. An output shaft of the first motor is fixedly connected with the conveying disc. According to the invention, the transportation disc and the test bench slide and are sealed, so that the stability of the internal temperature in the test process is ensured, the heat loss is reduced, the heating energy consumption is reduced, the heating part accurately heats the gallium nitride chip to the test temperature through the electric heater, and the test assembly performs high-temperature test through the contact between the probe and the terminal of the chip, so that the test efficiency is improved. And meanwhile, compressed air in the piston cylinder is used for realizing a high-pressure resistance test, so that the comprehensiveness and accuracy of the test are ensured.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip high-temperature test loading and unloading, and specifically relates to an automatic loading and unloading mechanism for gallium nitride chip high-temperature test. Background Art

[0002] Through high-temperature testing, the changes of gallium nitride chips under high-temperature stress can be investigated. For example, whether impurities on the chip surface and internal structures will undergo accelerated reactions, and these reactions may expose potential defects inside the chip, such as the incompleteness of PN junctions, potential defects of wafers, and the degree of ion contamination.

[0003] Currently, when gallium nitride chips are tested, they need to be heated inside a heating box or pipeline. When the gallium nitride chips enter and exit the heating box, both ends of the front and rear of the heating box are in an open state. Therefore, the heat inside the heating box is in a state of rapid loss, thus increasing the energy consumption of the test. In view of the above problems, an automatic loading and unloading mechanism for gallium nitride chip high-temperature test is proposed here. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide an automatic loading and unloading mechanism for gallium nitride chip high-temperature test that can overcome the above problems or at least partially solve the above problems.

[0005] To solve the above technical problem, the basic concept of the technical solution adopted by the present invention is: An automatic loading and unloading mechanism for gallium nitride chip high-temperature test includes a test bench, and further includes: a transport tray rotatably arranged inside the test bench, and the transport tray is slidably and sealed with the test bench. Placement grooves are provided on the transport tray. A first motor is fixedly installed at the bottom of the test bench, and the output shaft of the first motor is fixedly connected to the transport tray; a heating part is arranged above the test bench; a lifting part is arranged on the test bench, and a test component and a transfer component are arranged on the lifting part; a transmission part is arranged below the lifting part, and a positioning part is arranged on the transmission part; a dust removal part is arranged on the transmission part.

[0006] As a preferred embodiment of the present invention: Feed holes, test holes, and discharge holes are provided on the test bench. The rotating transport tray drives the gallium nitride chips at the feed holes to sequentially pass under the heating part, through the test holes, and the discharge holes.

[0007] As a preferred embodiment of the present invention: The heating part includes a sealed heat-insulating cover fixedly installed on the top of the test bench, and an electric heater is fixedly installed on the inner wall of the top of the sealed heat-insulating cover.

[0008] As a preferred embodiment of the present invention: the lifting part includes a limit column fixedly installed on the top of the test bench, a first mounting plate is slidably installed on the limit column, a lifting cylinder is fixedly installed on the top of the test bench, and the output end of the lifting cylinder is fixedly connected to the first mounting plate.

[0009] As a preferred embodiment of the present invention: the transfer component includes a rotating shaft rotatably mounted on a first mounting plate, a second mounting plate is fixedly mounted on the bottom of the rotating shaft, mounting rods are fixedly mounted on both ends of the second mounting plate, and a grabbing head is fixedly mounted on the bottom of the mounting rod; the grabbing heads are provided in two groups, and each group of the grabbing heads is provided with two, one group of grabbing heads grabs the gallium nitride chips at the feed end of the transmission part and transports them to the feed hole, and the other group of grabbing heads grabs the gallium nitride chips at the discharge hole and transports them to the discharge end of the transmission part; a second motor is fixedly mounted on the first mounting plate, and the output shaft of the second motor is connected to the two groups of rotating shafts through a pulley group.

[0010] As a preferred embodiment of the present invention: the test assembly includes a piston cylinder fixedly mounted on the test bench, the piston cylinder is coaxial with the test hole, a connecting rod is fixedly mounted on the first mounting plate, the connecting rod extends into the piston cylinder where a tester is fixedly mounted, a probe is fixedly mounted on the bottom of the tester, a piston plate is slidably mounted on the piston cylinder, and the piston plate is fixedly connected to the probe.

[0011] As a preferred embodiment of the present invention: the transmission part includes a mounting platform, on which a first mounting frame and a second mounting frame are fixedly mounted, transmission rollers are rotatably mounted on the first mounting frame and the second mounting frame, and a transmission belt is rotatably mounted on the transmission rollers, and a third motor is fixedly mounted on the first mounting frame and the second mounting frame, and the output ends of the two groups of the third motors are respectively fixedly connected to the two groups of transmission rollers.

[0012] As a preferred embodiment of the present invention: the alignment part includes a limit plate fixedly mounted on the first mounting frame, alignment cylinders are fixedly mounted on both sides of the first mounting frame, and an alignment plate is fixedly mounted on the output end of the alignment cylinder.

[0013] As a preferred embodiment of the present invention: the dust removal part includes a first wind hood fixedly mounted on a first mounting frame and a second wind hood fixedly mounted on a second mounting frame, ventilation pipes are fixedly mounted on the first wind hood and the second wind hood, a filter is fixedly mounted in the ventilation pipe, a mounting shaft is rotatably mounted on the ventilation pipe, a fan blade is fixedly mounted on the mounting shaft, a fourth motor is fixedly mounted on the first wind hood, an output end of the fourth motor is fixedly connected to the mounting shaft, and a ventilation hole is arranged on the transmission belt located on the second mounting frame.

[0014] A transmission method for high-temperature testing of gallium nitride chips, comprising the following steps: Step 1: Arrange the gallium nitride chips on the transmission part. During the transmission process, the alignment part is used to calibrate the angles and positions of the gallium nitride chips; Step 2: The transfer component transfers the gallium nitride chips on the transmission part to the placement groove at the test hole, and at the same time, the transfer component transfers the gallium nitride chips in the placement groove at the discharge hole to the discharge end of the transmission part; Step 3: When the transfer component rotates while carrying the gallium nitride chips, the transport tray transports the gallium nitride chips to the heating part for heating; Step 4: While the transfer component descends, the test component descends to contact and test the gallium nitride chips in the placement groove at the test hole.

[0015] After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art: By making the transport tray slide and seal with the test bench, the present invention ensures the stability of the internal temperature during the test, reduces heat loss, lowers the heating energy consumption. At the same time, the heating part precisely heats the gallium nitride chips to the test temperature through an electric heater, and the test component conducts high-temperature testing by contacting the terminals of the chips with probes. Meanwhile, the compressed air in the piston cylinder is used to achieve high-pressure resistance testing, ensuring the comprehensiveness and accuracy of the test.

[0016] The following further describes in detail the specific implementation manners of the present invention with reference to the accompanying drawings. Description of the Drawings

[0017] In the drawings: Figure 1 is a three-dimensional structural schematic diagram of an automatic loading and unloading mechanism for high-temperature testing of gallium nitride chips proposed by the present invention; Figure 2 is a bottom view of an automatic loading and unloading mechanism for high-temperature testing of gallium nitride chips proposed by the present invention; Figure 3 is a cross-sectional view of a test component of an automatic loading and unloading mechanism for high-temperature testing of gallium nitride chips proposed by the present invention; Figure 4 is a structural schematic diagram of a transmission part of an automatic loading and unloading mechanism for high-temperature testing of gallium nitride chips proposed by the present invention; Figure 5 is a cross-sectional view of a dust removal part of an automatic loading and unloading mechanism for high-temperature testing of gallium nitride chips proposed by the present invention; Figure 6 is a structural schematic diagram of a test bench of an automatic loading and unloading mechanism for high-temperature testing of gallium nitride chips proposed by the present invention; Figure 7 is a structural schematic diagram of a heating part of an automatic loading and unloading mechanism for high-temperature testing of gallium nitride chips proposed by the present invention; Figure 8 Schematic structural diagram of the transport tray of an automatic loading and unloading mechanism for high-temperature testing of gallium nitride chips proposed by the present invention; Figure 9 Schematic structural diagram of the transfer component of an automatic loading and unloading mechanism for high-temperature testing of gallium nitride chips proposed by the present invention; In the figure: 1, test bench; 11, feed hole; 12, test hole; 13, discharge hole; 2, transport tray; 21, placement groove; 22, first motor; 3, heating part; 31, sealed heat insulation cover; 32, electric heater; 4, lifting part; 41, limit post; 42, first mounting plate; 43, lifting cylinder; 5, transfer component; 51, rotating shaft; 52, second mounting plate; 53, mounting rod; 54, grasping head; 55, second motor; 56, pulley group; 6, transmission part; 61, mounting table; 62, first mounting frame; 63, second mounting frame; 64, transmission roller; 65, third motor; 66, transmission belt; 67, ventilation hole; 7, dust removal part; 71, first air hood; 72, second air hood; 73, ventilation pipe; 74, filter screen; 75, mounting shaft; 76, fan blade; 77, fourth motor; 8, alignment part; 81, limit plate; 82, alignment cylinder; 83, alignment plate; 9, test component; 91, piston cylinder; 92, connecting rod; 93, tester; 94, probe; 95, piston plate. Specific embodiments

[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. The following embodiments are used to illustrate the present invention but are not used to limit the scope of the present invention.

[0019] Embodiment: Refer to Figures 1 - 9 , an automatic loading and unloading mechanism for high-temperature testing of gallium nitride chips, including a test bench 1, and further including: a transport tray 2 rotatably arranged in the test bench 1, and the transport tray 2 is slidably and sealed with the test bench 1. A placement groove 21 is arranged on the transport tray 2, and a first motor 22 is fixedly installed at the bottom of the test bench 1. The output shaft of the first motor 22 is fixedly connected to the transport tray 2; a heating part 3, arranged above the test bench 1; a lifting part 4, arranged on the test bench 1, and a test component 9 and a transfer component 5 are arranged on the lifting part 4; a transmission part 6, arranged below the lifting part 4, and an alignment part 8 is arranged on the transmission part 6; a dust removal part 7, arranged on the transmission part 6. Feed holes 11, test holes 12, and discharge holes 13 are arranged on the test bench 1. The rotating transport tray 2 drives the gallium nitride chips at the feed hole 11 to sequentially pass under the heating part 3, through the test hole 12, and the discharge hole 13.

[0020] In this embodiment, the gallium nitride chips are arranged on the transfer part 6. During the transfer process, the dust removal part 7 is used to remove dust from the gallium nitride chips. After dust removal, the angle and position of the gallium nitride chips are calibrated by the alignment part 8. After calibration, the transfer assembly 5 transfers the gallium nitride chips on the transfer part 6 to the placement groove 21 at the test hole 12. Then, the first motor 22 is started to drive the transport disk 2 to rotate intermittently. The gallium nitride chips start to move from the feed hole 11, pass through the heating part 3 in sequence, and the heating part 3 is used to heat the gallium nitride chips to the test temperature. When the gallium nitride chips move to the test hole 12 after heating, the test component 9 tests the gallium nitride chips. After the test is completed, they move to the discharge hole 13 and are then transported by the transfer assembly 5 to the discharge end of the transfer part 6.

[0021] Among them, the outer shell of the transport disk 2 is made of high-temperature resistant rubber, such as silicone rubber and acrylate rubber, and the high-temperature resistant rubber is used to maintain the sealing between the transport disk 2 and the test bench 1.

[0022] When the above mechanism is in use, the transport disk 2 is only briefly exposed when it is in contact with the feed hole 11 / discharge hole 13, and remains closed at other times, maximizing the maintenance of the internal temperature stability, thereby reducing heat loss and lowering the heating energy consumption.

[0023] Refer to Figure 7 , the heating part 3 includes a sealed heat insulation cover 31 fixedly installed on the top of the test bench 1, and an electric heater 32 is fixedly installed on the inner wall of the top of the sealed heat insulation cover 31.

[0024] In this embodiment, the gallium nitride chips are heated by the electric heater 32, and the heating temperature can be accurately controlled.

[0025] Refer to Figure 1 and Figure 9 , the lifting part 4 includes a limit column 41 fixedly installed on the top of the test bench 1. A first mounting plate 42 is slidably installed on the limit column 41. A lifting cylinder 43 is fixedly installed on the top of the test bench 1, and the output end of the lifting cylinder 43 is fixedly connected to the first mounting plate 42.

[0026] When the lifting cylinder 43 is started, the lifting cylinder 43 drives the first mounting plate 42 to rise or fall along the limit column 41. While the first mounting plate 42 is lifting or lowering, it drives the transfer assembly 5 and the test component 9 to rise or fall.

[0027] Refer to Figure 1 and Figure 9, the transfer component 5 includes a rotating shaft 51 rotatably mounted on the first mounting plate 42. A second mounting plate 52 is fixedly installed at the bottom of the rotating shaft 51. Mounting rods 53 are fixedly installed at both ends of the second mounting plate 52. A gripping head 54 is fixedly installed at the bottom of the mounting rod 53; there are two groups of gripping heads 54, and each group of gripping heads 54 has two. One group of gripping heads 54 grabs the gallium nitride chips at the feeding end of the transfer part 6 and transports them to the feeding hole 11, and the other group of gripping heads 54 grabs the gallium nitride chips at the discharging hole 13 and transports them to the discharging end of the transfer part 6; a second motor 55 is fixedly installed on the first mounting plate 42, and the output shaft of the second motor 55 is drivingly connected to the two rotating shafts 51 through a pulley group 56.

[0028] When in use, the lifting cylinder 43 drives the first mounting plate 42 to lift or lower. The first mounting plate 42 drives the two rotating shafts 51 to rise or fall synchronously. The rotating shaft 51 drives the second mounting plate 52 to rise or fall. The second mounting plate 52 drives the mounting rod 53 and the gripping head 54 to rise and fall.

[0029] After the first mounting plate 42 rises, the second motor 55 is started. The second motor 55 drives the two rotating shafts 51 to rotate synchronously through the pulley group 56. The rotating shaft 51 drives the second mounting plate 52 to rotate 180°, so as to swap the positions of the two groups of gripping heads 54 in the same group. The gripping head 54 can be a suction cup or a pneumatic gripper.

[0030] Refer to Figure 1 and Figure 3 The testing component 9 includes a piston cylinder 91 fixedly installed on the testing bench 1. The piston cylinder 91 is coaxial with the testing hole 12. A connecting rod 92 is fixedly installed on the first mounting plate 42. The connecting rod 92 extends into the piston cylinder 91 and a tester 93 is fixedly installed. A probe 94 is fixedly installed at the bottom of the tester 93. A piston plate 95 is slidably installed on the piston cylinder 91. The piston plate 95 is fixedly connected to the probe 94.

[0031] In this embodiment, after the first mounting plate 42 rises, the probe 94 disengages from the gallium nitride chip. When the first mounting plate 42 descends, the first mounting plate 42 drives the tester 93, the piston plate 95 and the probe 94 to descend. During this process, the piston plate 95 compresses the gas in the piston cylinder 91 until the probe 94 contacts the terminals of the gallium nitride chip, so as to perform a high-temperature test on the gallium nitride chip. At the same time, the piston plate 95 descends to compress the air, thereby increasing the pressure at the placement groove 21 at the testing hole 12 and in the piston cylinder 91. Therefore, while realizing the high-temperature resistance test on the gallium nitride chip, a high-pressure resistance test is also performed on the gallium nitride chip.

[0032] Refer to Figure 1 and Figure 4, the transmission unit 6 includes a mounting table 61, on which a first mounting bracket 62 and a second mounting bracket 63 are fixedly installed. Transmission rollers 64 are rotatably installed on both the first mounting bracket 62 and the second mounting bracket 63, and a transmission belt 66 is rotatably installed on the transmission rollers 64. Third motors 65 are fixedly installed on both the first mounting bracket 62 and the second mounting bracket 63, and the output ends of the two groups of third motors 65 are fixedly connected to the two groups of transmission rollers 64 respectively. The alignment unit 8 includes a limit plate 81 fixedly installed on the first mounting bracket 62, and alignment cylinders 82 are fixedly installed on both sides of the first mounting bracket 62. The output ends of the alignment cylinders 82 are fixedly installed with alignment plates 83.

[0033] For the convenience of description, the transmission belt 66 on the first mounting bracket 62 is the feeding belt, and the transmission belt 66 on the second mounting bracket 63 is the discharging belt. Ventilation holes 67 are provided on the discharging belt. The alignment unit 8 includes a limit plate 81 fixedly installed on the first mounting bracket 62, and alignment cylinders 82 are fixedly installed on both sides of the first mounting bracket 62. The output ends of the alignment cylinders 82 are fixedly installed with alignment plates 83.

[0034] When in use, the gallium nitride chip is placed on the feeding belt, and the feeding belt conveys the gallium nitride chip. When the gallium nitride chip abuts against the limit plate 81, the alignment cylinders 82 are activated, and the alignment cylinders 82 drive the two alignment plates 83 to move towards the gallium nitride chip simultaneously. Cooperating with the limit plate 81, the position and angle of the gallium nitride chip are calibrated.

[0035] Refer to Figure 1 、 Figure 2 and Figure 5 , the dust removal unit 7 includes a first air hood 71 fixedly installed on the first mounting bracket 62 and a second air hood 72 fixedly installed on the second mounting bracket 63. A ventilation pipe 73 is fixedly installed on the first air hood 71 and the second air hood 72. A filter screen 74 is fixedly installed in the ventilation pipe 73. A mounting shaft 75 is rotatably installed on the ventilation pipe 73, and a fan blade 76 is fixedly installed on the mounting shaft 75. A fourth motor 77 is fixedly installed on the first air hood 71, and the output end of the fourth motor 77 is fixedly connected to the mounting shaft 75. In this embodiment, when the fourth motor 77 is started, the fourth motor 77 drives the mounting shaft 75 to rotate, the mounting shaft 75 drives the fan blade 76 to rotate, and the fan blade 76 sucks the air in the second air hood 72 and blows it into the first air hood 71, so that the air flow blows towards the gallium nitride chip passing under the first air hood 71 to remove dust from the gallium nitride chip. At the same time, the air flow flowing in the second air hood 72 can accelerate the heat dissipation of the gallium nitride chip.

[0036] In summary, through the integrated design, this mechanism realizes the full automation of the gallium nitride chip from feeding, dust removal, alignment, transfer, heating, testing to discharging, greatly improving the testing efficiency and accuracy.

[0037] The transport tray 2 uses a high-temperature resistant rubber shell, which slides and seals with the test bench 1, ensuring the stability of the internal temperature during the test process, reducing heat loss, and lowering the heating energy consumption.

[0038] The heating unit 3 precisely heats the gallium nitride chip to the test temperature through the electric heater 32. The test component 9 contacts the terminals of the chip through the probes 94 for high-temperature testing. At the same time, the compressed air in the piston cylinder 91 is used to achieve high-pressure resistance testing, ensuring the comprehensiveness and accuracy of the test.

[0039] The transfer component 5 is driven by the lifting cylinder 43 motor, enabling the grasping head 54 to flexibly change positions between the transmission part 6 and the test hole 12, improving the transfer efficiency and accuracy.

[0040] The dust removal part 7 is designed with a fan and a ventilation pipe 73 to achieve dust removal of the gallium nitride chip. At the same time, the airflow in the second air hood 72 can accelerate the heat dissipation of the chip, improving the cleanliness of the test environment and the stability of the chip.

[0041] The alignment part 8 achieves precise calibration of the position and angle of the gallium nitride chip through the cooperation of the limit plate 81 and the alignment cylinder 82, ensuring the accuracy and consistency of the test.

[0042] A transport method for high-temperature testing of gallium nitride chips includes the following steps: Step 1: Arrange the gallium nitride chips on the transmission part 6. During the transmission process, the alignment part 8 calibrates the angle and position of the gallium nitride chips. Step 2: The transfer component 5 transfers the gallium nitride chips on the transmission part 6 to the placement groove 21 at the test hole 12. At the same time, the transfer component 5 transfers the gallium nitride chips in the placement groove 21 at the discharge hole 13 to the discharge end of the transmission part 6. Step 3: When the transfer component 5 rotates during the handling of the gallium nitride chips, the transport tray 2 transports the gallium nitride chips to the heating unit 3 for heating. Step 4: While the transfer component 5 descends, the test component 9 descends to contact and test the gallium nitride chips in the placement groove 21 at the test hole 12.

[0043] The above is only a preferred embodiment of the present invention and does not impose any form of limitation on the present invention. Although the present invention has been disclosed above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art of the present invention can make some changes or modifications to the above-mentioned technical content within the scope of the technical solution of the present invention to make equivalent embodiments with equivalent changes. However, as long as it does not depart from the content of the technical solution of the present invention, any simple modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present invention still fall within the scope of the present invention.

Claims

1. An automatic feeding and discharging mechanism for high-temperature testing of gallium nitride chips, including a test bench (1), characterized in that, Also includes: A transport plate (2) is rotatably arranged in the test bench (1), and the transport plate (2) and the test bench (1) are slidably and sealed, a placement groove (21) is arranged on the transport plate (2), a first motor (22) is fixedly mounted on the bottom of the test bench (1), and an output shaft of the first motor (22) is fixedly connected to the transport plate (2); A heating part (3) is arranged above the test bench (1); A lifting part (4) is arranged on the test bench (1), and a test component (9) and a transfer component (5) are arranged on the lifting part (4); A transmission part (6) is arranged below the lifting part (4), and a positioning part (8) is arranged on the transmission part (6); The dust removal part (7) is arranged on the transmission part (6).

2. The automatic loading and unloading mechanism for high-temperature testing of a gallium nitride chip according to claim 1, characterized in that, The test bench (1) is provided with a feed hole (11), a test hole (12) and a discharge hole (13); the rotating transport plate (2) drives the gallium nitride chip at the feed hole (11) to pass through the bottom of the heating part (3), the test hole (12) and the discharge hole (13) in sequence.

3. The automatic loading and unloading mechanism for high-temperature testing of a gallium nitride chip according to claim 2, wherein The heating part (3) comprises a sealed heat-insulating cover (31) fixedly mounted on the top of the test bench (1), and an electric heater (32) is fixedly mounted on the top inner wall of the sealed heat-insulating cover (31).

4. The automatic feeding and discharging mechanism for high-temperature testing of a gallium nitride chip according to claim 2, wherein The lifting part (4) comprises a limiting column (41) fixedly mounted on the top of the test bench (1), a first mounting plate (42) being slidably mounted on the limiting column (41), a lifting cylinder (43) being fixedly mounted on the top of the test bench (1), and an output end of the lifting cylinder (43) being fixedly connected to the first mounting plate (42).

5. The automatic feeding and discharging mechanism for high-temperature testing of a gallium nitride chip according to claim 4, characterized in that, The transfer assembly (5) comprises a rotating shaft (51) rotatably mounted on a first mounting plate (42); a second mounting plate (52) is fixedly mounted on the bottom of the rotating shaft (51); mounting rods (53) are fixedly mounted on both ends of the second mounting plate (52); and a grabbing head (54) is fixedly mounted on the bottom of the mounting rod (53); Two groups of grabbing heads (54) are provided, and each group of grabbing heads (54) is provided with two. One group of grabbing heads (54) grabs the gallium nitride chips at the feed end of the transmission part (6) and transports them to the feed hole (11), and the other group of grabbing heads (54) grabs the gallium nitride chips at the discharge hole (13) and transports them to the discharge end of the transmission part (6); A second motor (55) is fixedly mounted on the first mounting plate (42), and an output shaft of the second motor (55) is transmission-connected to the two sets of rotating shafts (51) via a pulley set (56).

6. The automatic loading and unloading mechanism for high-temperature testing of a gallium nitride chip according to claim 4, characterized in that, The test assembly (9) comprises a piston cylinder (91) fixedly mounted on the test bench (1), the piston cylinder (91) being coaxial with the test hole (12), a connecting rod (92) fixedly mounted on the first mounting plate (42), the connecting rod (92) extending into the piston cylinder (91) where a tester (93) is fixedly mounted, a probe (94) is fixedly mounted at the bottom of the tester (93), a piston plate (95) is slidably mounted on the piston cylinder (91), and the piston plate (95) is fixedly connected to the probe (94).

7. An automatic feeding and discharging mechanism for high-temperature testing of a gallium nitride chip according to claim 1, characterized in that The transmission part (6) includes a mounting table (61), on which a first mounting frame (62) and a second mounting frame (63) are fixedly installed. Transmission rollers (64) are rotatably installed on both the first mounting frame (62) and the second mounting frame (63). A transmission belt (66) is rotatably installed on the transmission rollers (64). Third motors (65) are fixedly installed on both the first mounting frame (62) and the second mounting frame (63). The output ends of the two groups of third motors (65) are fixedly connected to the two groups of transmission rollers (64) respectively.

8. An automatic loading and unloading mechanism for high-temperature testing of gallium nitride chips according to claim 7, characterized in that, The alignment part (8) includes a limit plate (81) fixedly installed on the first mounting frame (62). Alignment cylinders (82) are fixedly installed on both sides of the first mounting frame (62). The output ends of the alignment cylinders (82) are fixedly installed with alignment plates (83).

9. The automatic loading and unloading mechanism for high-temperature testing of a gallium nitride chip according to claim 7, characterized in that, The dust removal part (7) includes a first air hood (71) fixedly installed on the first mounting frame (62) and a second air hood (72) fixedly installed on the second mounting frame (63). A ventilation pipe (73) is fixedly installed on the first air hood (71) and the second air hood (72). A filter screen (74) is fixedly installed in the ventilation pipe (73). A mounting shaft (75) is rotatably installed on the ventilation pipe (73). A fan blade (76) is fixedly installed on the mounting shaft (75). A fourth motor (77) is fixedly installed on the first air hood (71). The output end of the fourth motor (77) is fixedly connected to the mounting shaft (75). Ventilation holes (67) are provided on the transmission belt (66) located on the second mounting frame (63).

10. A transmission method for high-temperature testing of a gallium nitride chip, using an automatic loading and unloading mechanism for high-temperature testing of a gallium nitride chip described in claim 1, characterized in that, It includes the following steps: Step 1: Arrange the gallium nitride chips on the transmission part (6). During the transmission process of the transmission part (6), the alignment part (8) is used to calibrate the angles and positions of the gallium nitride chips. Step 2: The transfer component (5) transfers the gallium nitride chips on the transmission part (6) to the placement groove (21) at the test hole (12). At the same time, the transfer component (5) transfers the gallium nitride chips in the placement groove (21) at the discharge hole (13) to the discharge end of the transmission part (6). Step 3: When the transfer component (5) transports the gallium nitride chips in a rotational motion, the transport disk (2) transports the gallium nitride chips to the heating part (3) for heating. Step 4: While the transfer component (5) descends, the test component (9) descends to contact and test the gallium nitride chips in the placement groove (21) at the test hole (12).

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