Silica gel simulation method and device, electronic equipment and storage medium

Abstract

The invention discloses a silica gel simulation method and device, electronic equipment and a storage medium. The method comprises the following steps: determining a glass stress point and a mold stress point based on a product model; applying an acting force to the stress point of the mold, determining a stress curve of the stress point of the mold, and determining a stress curve of the stress point of the glass based on the stress curve of the stress point of the mold; determining a target moving distance according to the stress curve of the glass stress point and a preset target acting force; determining parameter values of silica gel; silica gel is injected into a product model based on the target moving distance, and the deformation quantity of the silica gel is determined; if the deformation quantity meets a preset deformation quantity condition, taking the silica gel as target silica gel; according to the technical scheme, the silica gel mold testing frequency is reduced through simulation, and manpower, material resources and time cost are saved.

Description

Technical Field

[0001] The present invention relates to the field of simulation technology, and particularly to a silicone simulation method, device, electronic device and storage medium. Background Art

[0002] In today's mobile phone market, the narrow bezel design has become one of the focuses of competition among major brands. It not only improves the overall aesthetics of the mobile phone, but also significantly increases the visible area of the screen, bringing a more immersive visual experience to users. When using the screen encapsulation technology to form the bezel in the narrow bezel design of the mobile phone, silicone is injected into the mold. As a super-elastic material, silicone has unique physical properties. The super-elasticity of the silicone material makes it difficult to accurately control its deformation during the molding process. This deformation problem brings many challenges to the product quality and performance. For the deformation problem of the silicone material, traditional testing methods require a large amount of manpower, material resources and time costs. Summary of the Invention

[0003] The present invention provides a silicone simulation method, device, electronic device and storage medium, which reduce the number of silicone trial molds through simulation, saving manpower, material resources and time costs.

[0004] According to one aspect of the present invention, a silicone simulation method is provided. The product model is composed of silicone, glass and a mold. The method includes:

[0005] Determining the glass stress points and the mold stress points based on the product model;

[0006] Applying a force to the mold stress points, determining the force curve of the mold stress points, and based on the force curve of the mold stress points, determining the force curve of the glass stress points; wherein, the force curve is composed of the moving distance and the force of the stress point;

[0007] Determining the target moving distance according to the force curve of the glass stress points and the preset target force; wherein, the preset target force refers to the maximum force value that the product composed of silicone and glass can withstand;

[0008] Determining the parameter values of the silicone;

[0009] Injecting the silicone into the product model based on the target moving distance and determining the deformation amount of the silicone;

[0010] If the deformation amount meets the preset deformation amount condition, then the silicone is used as the target silicone; wherein, the preset deformation amount condition is used to constrain the size of the deformation amount; the target silicone is the silicone category used for actual production operations.

[0011] According to another aspect of the present invention, a silicone simulation device is provided. The product model consists of silicone, glass, and a mold. The device includes:

[0012] A force application point determination module for determining the glass force application point and the mold force application point based on the product model;

[0013] A force curve determination module for applying a force to the mold force application point, determining the force curve of the mold force application point, and based on the force curve of the mold force application point, determining the force curve of the glass force application point; wherein, the force curve is composed of the moving distance of the force application point and the applied force;

[0014] A target moving distance determination module for determining the target moving distance according to the force curve of the glass force application point and a preset target applied force; wherein, the preset target applied force refers to the maximum force value that the product composed of silicone and glass can withstand;

[0015] A parameter value determination module for determining the parameter value of the silicone;

[0016] A deformation amount determination module for injecting the silicone into the product model based on the target moving distance and determining the deformation amount of the silicone;

[0017] A target silicone determination module for, if the deformation amount meets the preset deformation amount condition, taking the silicone as the target silicone; wherein, the preset deformation amount condition is used to constrain the size of the deformation amount; the target silicone is the silicone category used for actual production operations.

[0018] According to another aspect of the present invention, an electronic device is provided. The electronic device includes:

[0019] At least one processor; and a memory communicatively connected to the at least one processor; wherein, the memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute a silicone simulation method according to any embodiment of the present invention.

[0020] According to another aspect of the present invention, a computer-readable storage medium is provided. The computer-readable storage medium stores computer instructions, and the computer instructions are used to implement a silicone simulation method according to any embodiment of the present invention when executed by a processor.

[0021] The technical solution of the embodiment of the present invention reduces the number of silicone mold trials through silicone simulation operations, saving labor, material, and time costs.

[0022] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it used to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0024] Figure 1 is a flowchart of a silicone simulation method provided in Embodiment 1 of the present invention;

[0025] Figure 2 is a schematic diagram of a product model provided in Embodiment 1 of the present application;

[0026] Figure 3 is another schematic diagram of a product model provided in Embodiment 1 of the present application;

[0027] Figure 4 is a schematic diagram of a stress curve provided in Embodiment 1 of the present application;

[0028] Figure 5 is a schematic diagram of a simulation result provided in Embodiment 1 of the present application;

[0029] Figure 6 is a schematic diagram of a silicone simulation process provided in Embodiment 2 of the present invention;

[0030] Figure 7 is a flowchart of a silicone simulation process provided in Embodiment 2 of the present application;

[0031] Figure 8 is a schematic diagram of the structure of a silicone simulation device provided in Embodiment 3 of the present invention;

[0032] Figure 9 is a schematic diagram of the structure of an electronic device for implementing the silicone simulation method of the embodiments of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] In order to enable those skilled in the art to better understand the solutions of the present invention, the following clearly and completely describes the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0034] It should be noted that the term "target" and the like in the description, claims and above-mentioned drawings of the present invention are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0035] Embodiment 1

[0036] Figure 1 is a flowchart of a silicone simulation method provided according to Embodiment 1 of the present invention. This embodiment is applicable to the situation of simulating silicone in a product model. This method can be executed by a silicone simulation device, which can be implemented in the form of hardware and / or software, and the silicone simulation device can be configured in a device. For example, the device can be a device with communication and computing capabilities such as a background server. As Figure 1 shown, the method includes:

[0037] S110. Determine the glass stress point and the mold stress point based on the product model.

[0038] In this solution, Figure 2 is a schematic diagram of the product model provided in Embodiment 1 of the present application. As Figure 2 shown, the product model is composed of silicone, display (glass) and a mold. Among them, the silicone contains liquid silicone rubber (LSR). The glass can refer to the glass in a mobile phone product.

[0039] In this embodiment, Figure 3 is another schematic diagram of the product model provided in Embodiment 1 of the present application. As Figure 3 shown, by extracting the key stressed parts in the product model, the product model is simplified. Since the shapes of the display and the mold are simple, in order to accelerate the calculation, it is assumed that the display and the mold are both analytical rigid bodies, and the glass stress point and the mold stress point are RP-display and RP-mold respectively.

[0040] S120. Apply a force to the force application point of the mold, determine the force curve of the force application point of the mold, and based on the force curve of the force application point of the mold, determine the force curve of the force application point of the glass; wherein, the force curve is composed of the moving distance and the applied force of the force application point.

[0041] In this embodiment, the force curve of the force application point of the mold is composed of the moving distance and the applied force of the force application point of the mold; the force curve of the force application point of the glass is composed of the moving distance and the applied force of the force application point of the glass.

[0042] In this solution, by applying a force to the force application point of the mold, the force curve of the force application point of the mold and the force curve of the force application point of the glass are obtained. Figure 4 The following is a schematic diagram of the force curve provided in the first embodiment of this application. As Figure 4 shown, the moving distance of the force application point and the applied force are linearly related.

[0043] S130. Determine the target moving distance according to the force curve of the force application point of the glass and the preset target applied force; wherein, the preset target applied force refers to the maximum force value that the product composed of silica gel and glass can withstand.

[0044] Among them, the product corresponding to the force application point of the glass is composed of silica gel and glass, and the target applied force is set based on the maximum force value that the product composed of silica gel and glass can withstand.

[0045] Further, after determining the target applied force, according to the force curve of the force application point of the glass, determine the target moving distance corresponding to the target applied force.

[0046] S140. Determine the parameter values of the silica gel.

[0047] In this embodiment, the parameters of the silica gel may include hardness, tensile strength, elongation at break, density, etc. The parameter values of the silica gel can be set based on general finite element analysis software (abaqus).

[0048] S150. Inject the silica gel into the product model based on the target moving distance and determine the deformation amount of the silica gel.

[0049] In this embodiment, the target moving distance is used to represent the optimal preloading amount that will not cause deformation of the glass in the product model.

[0050] Specifically, the silica gel can be injected into the product model according to the target moving distance obtained by simulation, and a measuring instrument can be used to measure the deformation amount of the silica gel.

[0051] Optionally, injecting the silica gel into the product model based on the target moving distance and determining the deformation amount of the silica gel includes:

[0052] Inject silicone into the cavity of the product model based on the target moving distance; wherein, the cavity is a spatial structure for carrying silicone.

[0053] After the silicone injection is completed, use a preset curing device to cure the silicone in the cavity; wherein, the preset curing device provides environmental parameters that meet the silicone curing conditions.

[0054] When the silicone curing is completed, use a preset pressure testing device to measure the pressure in the cavity and determine the pressure value.

[0055] When the pressure value meets the preset pressure condition, take out the cured silicone from the cavity and use a measuring instrument to measure the taken-out silicone to determine the deformation amount of the silicone.

[0056] Wherein, the preset pressure condition is used to restrict the magnitude of the pressure value. When the pressure value meets the preset pressure condition, this pressure value is the optimal cavity pressure that will not cause the silicone to deform.

[0057] In this solution, when the pressure value in the cavity is too large, it will have a certain impact on the deformation amount of the silicone. Therefore, it is necessary to use a preset pressure testing device to measure the pressure in the cavity to determine the pressure value. When the pressure value meets the preset pressure condition, take out the cured silicone from the cavity at this time and use a measuring instrument to measure the taken-out silicone to improve the accuracy of the measurement of the deformation amount of the silicone.

[0058] S160. If the deformation amount meets the preset deformation amount condition, then use the silicone as the target silicone; wherein, the preset deformation amount condition is used to restrict the magnitude of the deformation amount; the target silicone is the silicone category for actual production operations.

[0059] Wherein, the preset deformation amount condition is used to restrict the magnitude of the deformation amount, and the deformation amount condition can be set according to production requirements.

[0060] In this solution, when the deformation amount meets the preset deformation amount condition, it indicates that the silicone meets the production operation requirements. At this time, use the silicone as the target silicone.

[0061] In this solution, Figure 5 is a schematic diagram of the simulation result provided in the first embodiment of this application. As Figure 5 shown, perform a batch gluing operation on the target silicone obtained by simulation.

[0062] Optionally, the method further includes:

[0063] If the deformation amount does not meet the preset deformation amount condition, adjust the parameter value of the silica gel, inject the silica gel with adjusted parameters into the product model based on the target moving distance, and determine the new deformation amount of the silica gel until the new deformation amount meets the preset deformation amount condition, and take the silica gel as the target silica gel.

[0064] In this solution, when the deformation amount does not meet the preset deformation amount condition, it indicates that the silica gel does not meet the production operation requirements. At this time, adjust the parameter value of the silica gel to ensure that the deformation amount of the silica gel meets the preset deformation amount condition.

[0065] Specifically, adjust the parameter value of the silica gel, and inject the silica gel into the cavity of the product model based on the target moving distance; after the silica gel injection is completed, use a preset curing device to cure the silica gel in the cavity; when the silica gel curing is completed, use a preset pressure testing device to measure the pressure in the cavity to determine the pressure value; under the condition that the pressure value meets the preset pressure condition, take out the cured silica gel from the cavity, and use a measuring instrument to measure the taken-out silica gel to determine the new deformation amount of the silica gel until the new deformation amount meets the preset deformation amount condition, and take the silica gel as the target silica gel.

[0066] The technical solution of the embodiment of the present invention determines the glass stress point and the mold stress point based on the product model, then applies a force to the mold stress point, determines the stress curve of the mold stress point, and determines the stress curve of the glass stress point based on the stress curve of the mold stress point. According to the stress curve of the glass stress point and the preset target acting force, determine the target moving distance, set the parameter value of the silica gel, and inject the silica gel into the product model based on the target moving distance. Determine the deformation amount of the silica gel. If the deformation amount meets the preset deformation amount condition, take the silica gel as the target silica gel. By implementing this technical solution, the number of silica gel trial molds is reduced through simulation, saving manpower, material resources, and time costs.

[0067] Embodiment Two

[0068] Figure 6 As shown in the schematic diagram of a silica gel simulation process provided in Embodiment Two of the present invention, the relationship between this embodiment and the above embodiment is a detailed description of the silica gel simulation process. As Figure 6 shown, the method includes:

[0069] S610. Determine the glass stress point and the mold stress point based on the product model.

[0070] S620. Apply a force to the mold stress point, determine the moving distance of the mold stress point, and determine the stress curve of the mold stress point based on the correlation between the moving distance and the acting force of the mold stress point.

[0071] S630. Use the force curve of the force application point of the mold as the force curve of the force application point of the glass.

[0072] In this solution, due to the product structure of the product model, the force application points of the mold and the glass are simultaneously affected by the acting force. Therefore, use the force curve of the force application point of the mold as the force curve of the force application point of the glass.

[0073] S640. Determine the target movement distance based on the force curve of the force application point of the glass and the preset target acting force; where the preset target acting force refers to the maximum acting force that the product composed of silicone and glass can withstand.

[0074] S650. Obtain the parameters of the silicone and set the parameter values of the silicone; where the parameters include density, rubber material parameters, and Shore hardness.

[0075] Among them, the rubber material parameters include C10, C20, C30; the Shore hardness includes D1, D2, D3. The parameters of the silicone are shown in Table 1.

[0076] Table 1

[0077]

[0078]

[0079] Furthermore, the parameter values of the silicone can be set based on general finite element analysis software.

[0080] Optionally, setting the parameter values of the silicone includes:

[0081] Set the parameter values of the silicone based on a preset hyperelastic model; where the preset hyperelastic model is a constitutive model used to describe the mechanical behavior of nonlinear elastic materials.

[0082] Specifically, the coefficients of C10, C20, C30, D1, D2, D3 can be set based on the hyperelastic model Yeoh.

[0083] S660. Inject the silicone into the product model based on the target movement distance and determine the deformation amount of the silicone.

[0084] S670. If the deformation amount meets the preset deformation amount condition, then use the silicone as the target silicone; where the preset deformation amount condition is used to restrict the size of the deformation amount; the target silicone is the silicone category used for actual production operations.

[0085] In this solution, Figure 7 This is the flowchart of the silicone simulation process provided in the second embodiment of the present application, as Figure 7As shown, the process of testing material parameters includes obtaining the parameters of the silica gel; the process of determining the simplified model includes: determining the glass stress point and the mold stress point based on the product model; the process of setting the abaqus material parameters includes: setting the parameter values of the silica gel; the post-processing process includes: applying a force to the mold stress point, determining the moving distance of the mold stress point, and based on the correlation between the moving distance of the mold stress point and the force, determining the force curve of the mold stress point, and taking the force curve of the mold stress point as the force curve of the glass stress point. The process of processing and debugging includes: injecting the silica gel into the product model based on the target moving distance and determining the deformation of the silica gel; the process of modifying the parameters includes: if the deformation does not meet the preset deformation condition, adjusting the parameter values of the silica gel, injecting the silica gel with the adjusted parameters into the product model based on the target moving distance, and determining the new deformation of the silica gel until the new deformation meets the preset deformation condition, and taking the silica gel as the target silica gel. The mass production process includes: performing a batch gluing operation on the target silica gel.

[0086] The technical solution of the embodiment of the present invention determines the glass stress point and the mold stress point based on the product model, then applies a force to the mold stress point, determines the force curve of the mold stress point, and takes the force curve of the mold stress point as the force curve of the glass stress point. According to the force curve of the glass stress point and the preset target force, the target moving distance is determined, the parameter values of the silica gel are set, and the silica gel is injected into the product model based on the target moving distance. Determine the deformation of the silica gel. If the deformation meets the preset deformation condition, the silica gel is taken as the target silica gel. By implementing this technical solution, the number of silica gel trial molds is reduced through simulation, saving labor, material and time costs.

[0087] Embodiment III

[0088] Figure 8 It is a schematic structural diagram of a silica gel simulation device provided according to Embodiment III of the present invention.

[0089] As Figure 8 shown, the product model is composed of silica gel, glass and a mold. The device includes:

[0090] A stress point determination module 810, configured to determine a glass stress point and a mold stress point based on the product model;

[0091] A stress curve determination module 820, configured to apply a force to the mold stress point, determine the force curve of the mold stress point, and based on the force curve of the mold stress point, determine the force curve of the glass stress point; wherein, the stress curve is composed of the moving distance and the force of the stress point.

[0092] A target moving distance determination module 830 is configured to determine a target moving distance according to the force curve of the force application point on the glass and a preset target acting force, where the preset target acting force refers to the maximum force value that the product composed of the silica gel and the glass can withstand;

[0093] A parameter value determination module 840 is configured to determine the parameter value of the silica gel;

[0094] A deformation amount determination module 850 is configured to inject the silica gel into the product model based on the target moving distance and determine the deformation amount of the silica gel;

[0095] A target silica gel determination module 860 is configured to use the silica gel as the target silica gel if the deformation amount meets a preset deformation amount condition, where the preset deformation amount condition is used to constrain the magnitude of the deformation amount; the target silica gel is the type of silica gel used for actual production operations.

[0096] Optionally, the force curve determination module 820 is specifically configured to:

[0097] Apply an acting force to the force application point of the mold, determine the moving distance of the force application point of the mold, and determine the force curve of the force application point of the mold based on the correlation between the moving distance of the force application point of the mold and the acting force.

[0098] Optionally, the force curve determination module 820 is further configured to:

[0099] Use the force curve of the force application point of the mold as the force curve of the force application point of the glass.

[0100] Optionally, the parameter value determination module 840 includes

[0101] A parameter value setting unit is configured to obtain the parameters of the silica gel and set the parameter value of the silica gel, where the parameters include density, rubber material parameters, and Shore hardness.

[0102] Optionally, the parameter value setting unit is specifically configured to:

[0103] Set the parameter value of the silica gel based on a preset hyperelastic model, where the preset hyperelastic model is a constitutive model used to describe the mechanical behavior of nonlinear elastic materials.

[0104] Optionally, the deformation amount determination module 850 is further configured to:

[0105] Inject the silica gel into the cavity in the product model based on the target moving distance, where the cavity is a spatial structure for carrying the silica gel;

[0106] After the injection of the silica gel is completed, use a preset curing device to cure the silica gel in the cavity, where the preset curing device provides environmental parameters that meet the silica gel curing conditions;

[0107] After the silicone rubber is cured, the pressure in the cavity is measured using a preset pressure testing device to determine the pressure value.

[0108] When the pressure value meets the preset pressure condition, the cured silicone rubber is taken out of the cavity, and a measuring instrument is used to measure the taken-out silicone rubber to determine the deformation amount of the silicone rubber.

[0109] Optionally, the device further includes:

[0110] A parameter value adjustment module, configured to, if the deformation amount does not meet the preset deformation amount condition, adjust the parameter value of the silicone rubber, inject the silicone rubber with adjusted parameters into the product model based on the target moving distance, and determine the new deformation amount of the silicone rubber until the new deformation amount meets the preset deformation amount condition, and use the silicone rubber as the target silicone rubber.

[0111] A silicone rubber simulation device provided by an embodiment of the present invention can execute a silicone rubber simulation method provided by any embodiment of the present invention, and has function modules and beneficial effects corresponding to the execution of the method.

[0112] Embodiment 4

[0113] Figure 9 FIG. shows a schematic structural diagram of an electronic device 10 that can be used to implement an embodiment of the present invention. The electronic device is intended to represent various forms of digital computers, such as, a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as, a personal digital processor, a cellular phone, a smart phone, a wearable device (such as a helmet, glasses, a watch, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are only examples and are not intended to limit the implementation of the present invention described and / or claimed herein.

[0114] Such as Figure 9As shown, the electronic device 10 includes at least one processor 11 and a memory communicatively connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc. Among them, the memory stores a computer program executable by the at least one processor. The processor 11 can execute various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 into the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other via a bus 14. The input / output (I / O) interface 15 is also connected to the bus 14.

[0115] Multiple components in the electronic device 10 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a magnetic disk, an optical disc, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0116] The processor 11 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the processor 11 include but are not limited to a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as a silicone simulation method.

[0117] In some embodiments, a silicone simulation method can be implemented as a computer program that is tangibly contained in a computer-readable storage medium, such as the storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed onto the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the silicone simulation method described above can be executed. Alternatively, in other embodiments, the processor 11 can be configured to execute a silicone simulation method in any other appropriate way (e.g., by means of firmware).

[0118] The various embodiments of the systems and techniques described above in this specification can be implemented in digital electronic circuitry, integrated circuit systems, field programmable gate arrays (FPGA), application specific integrated circuits (ASIC), application specific standard products (ASSP), systems on a chip (SOC), complex programmable logic devices (CPLD), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include: being implemented in one or more computer programs that are executable and / or interpretable on a programmable system including at least one programmable processor, which can be a special-purpose or general-purpose programmable processor that receives data and instructions from, and transmits data and instructions to, a storage system, at least one input device, and at least one output device.

[0119] The computer programs for implementing the methods of the present invention can be written in any combination of one or more programming languages. These computer programs can be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus, such that the computer programs, when executed by the processor, cause the functions / operations specified in the flowchart and / or block diagram to be implemented. The computer programs can be executed entirely on the machine, partly on the machine, as a stand-alone software package partly on the machine and partly on a remote machine or entirely on the remote machine or server.

[0120] In the context of the present invention, a computer-readable storage medium can be a tangible medium that can contain, or store a computer program for use by or in connection with an instruction execution system, apparatus, or device. The computer-readable storage medium can include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. Alternatively, the computer-readable storage medium can be a machine-readable signal medium. More specific examples of the machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0121] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device for displaying information to the user (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor); and a keyboard and a pointing device (e.g., a mouse or a trackball) through which the user can provide input to the electronic device. Other kinds of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0122] The systems and techniques described herein can be implemented in a computing system including backend components (e.g., as a data server), or a computing system including middleware components (e.g., an application server), or a computing system including frontend components (e.g., a user computer having a graphical user interface or a web browser through which the user can interact with an implementation of the systems and techniques described herein), or a computing system including any combination of such backend components, middleware components, or frontend components. The components of the system can be interconnected by digital data communication in any form or medium (e.g., a communication network). Examples of communication networks include: local area network (LAN), wide area network (WAN), blockchain network, and the Internet.

[0123] The computing system can include a client and a server. The client and the server are generally far from each other and typically interact through a communication network. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or a cloud host, which is a host product in the cloud computing service system, solving the defects of difficult management and weak business scalability existing in traditional physical hosts and VPS services.

[0124] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps recited in the present invention can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved, and this is not limited herein.

[0125] The above specific embodiments do not constitute a limitation on the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A silicone rubber simulation method, characterized in that, The product model consists of silicone, glass, and a mold, and the method includes: Determining the glass stress points and the mold stress points based on the product model; Applying a force to the mold stress points, determining the stress curve of the mold stress points, and based on the stress curve of the mold stress points, determining the stress curve of the glass stress points; wherein, the stress curve is composed of the moving distance and the applied force of the stress point; Determining the target moving distance according to the stress curve of the glass stress points and a preset target applied force; wherein, the preset target applied force refers to the maximum stress value that the product composed of silicone and glass can withstand; Determining the parameter values of the silicone; Injecting the silicone into the product model based on the target moving distance and determining the deformation amount of the silicone; If the deformation amount meets the preset deformation amount condition, then taking the silicone as the target silicone; wherein, the preset deformation amount condition is used to constrain the size of the deformation amount; the target silicone is the silicone category used for actual production operations.

2. The method according to claim 1, characterized in that Applying a force to the mold stress points and determining the stress curve of the mold stress points, including: Applying a force to the mold stress points, determining the moving distance of the mold stress points, and based on the correlation between the moving distance and the applied force of the mold stress points, determining the stress curve of the mold stress points.

3. The method according to claim 1, wherein Based on the stress curve of the mold stress points, determining the stress curve of the glass stress points, including: Taking the stress curve of the mold stress points as the stress curve of the glass stress points.

4. The method according to claim 1, wherein Determining the parameter values of the silicone, including: Obtaining the parameters of the silicone and setting the parameter values of the silicone; wherein, the parameters include density, rubber material parameters, and Shore hardness.

5. The method according to claim 4, characterized in that, Setting the parameter values of the silicone, including: Setting the parameter values of the silicone based on a preset hyperelastic model; wherein, the preset hyperelastic model is a constitutive model used to describe the mechanical behavior of nonlinear elastic materials.

6. The method according to claim 1, characterized in that, Injecting the silicone into the product model based on the target moving distance and determining the deformation amount of the silicone, including: Injecting the silicone into the cavity in the product model based on the target moving distance; wherein, the cavity is a spatial structure for carrying the silicone; After the silicone injection is completed, using a preset curing device to cure the silicone in the cavity; wherein, the preset curing device provides environmental parameters that meet the silicone curing conditions; When the silicone curing is completed, using a preset pressure testing device to measure the pressure in the cavity and determining the pressure value; Under the condition that the pressure value meets the preset pressure condition, taking out the cured silicone from the cavity and using a measuring instrument to measure the taken-out silicone to determine the deformation amount of the silicone.

7. The method according to claim 1, characterized in that, The method further includes: If the deformation amount does not meet the preset deformation amount condition, then adjusting the parameter values of the silicone, injecting the silicone with adjusted parameters into the product model based on the target moving distance, and determining the new deformation amount of the silicone until the new deformation amount meets the preset deformation amount condition, and taking the silicone as the target silicone.

8. A silicone simulation device, characterized in that, The product model consists of silicone, glass, and a mold, and the device includes: A stress point determination module for determining the glass stress points and the mold stress points based on the product model; A force curve determination module, configured to apply a force to the force application points of the mold, determine the force curve of the force application points of the mold, and based on the force curve of the force application points of the mold, determine the force curve of the force application points of the glass; wherein, the force curve is composed of the moving distance and the applied force of the force application point; A target moving distance determination module, configured to determine a target moving distance according to the force curve of the force application points of the glass and a preset target force; wherein, the preset target force refers to the maximum force value that the product composed of silicone and glass can withstand; A parameter value determination module, configured to determine the parameter value of the silicone; A deformation amount determination module, configured to inject the silicone into the product model based on the target moving distance and determine the deformation amount of the silicone; A target silicone determination module, configured to use the silicone as the target silicone if the deformation amount meets the preset deformation amount condition; wherein, the preset deformation amount condition is used to restrict the magnitude of the deformation amount; the target silicone is the silicone category used for actual production operations.

9. An electronic device, characterized in that, The electronic device includes: At least one processor; and a memory communicatively connected to the at least one processor; wherein, the memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute a silicone simulation method according to any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions, and the computer instructions are used to cause the processor to implement a silicone simulation method according to any one of claims 1-7 when executed.

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