A wireless instrument speaker, intelligent sound effect adjustment method and system

Abstract

This invention discloses a wireless instrument speaker, an intelligent sound effect adjustment method, and a system. The speaker includes a speaker body, which comprises a neckband and speaker units located at both ends of the neckband. Each speaker unit contains a speaker module, a main control board, a wireless transceiver module, and a power supply module. The power supply module is electrically connected to the main control board, the speaker module, and the wireless transceiver module. The speaker module and the wireless transceiver module are electrically connected to the main control board. The main control board communicates with an external instrument via the wireless transceiver module, acquiring the audio signal from the external instrument, processing the audio signal for timbre and sound effects, and then outputting it to the speaker module to drive the speaker module to play the audio signal. This invention solves the problems of high latency and poor sound effects that exist in existing instrument performance.

Description

Technical Field

[0001] This invention relates to the field of musical instrument electronic devices, and more particularly to a wireless musical instrument speaker, an intelligent sound effect adjustment method and system. Background Technology

[0002] Traditional instrument amplifiers, such as guitar amplifiers, are bulky and inconvenient to move, requiring them to be used in a fixed location. In addition, their tone adjustment relies on physical buttons, making it impossible to switch between multiple sound effects in real time. Furthermore, existing instrument amplifiers generally use Bluetooth to connect to instruments, which suffers from high latency and significant sound quality loss, making them unsuitable for professional performance scenarios and resulting in a poor user experience. Summary of the Invention

[0003] In order to overcome the shortcomings of the prior art, one of the objectives of this invention is to provide a wireless instrument speaker to solve the problems of high latency and significant sound quality loss in existing instrument speakers, which result in a poor user experience.

[0004] The second objective of this invention is to provide an intelligent sound effect adjustment method for a wireless instrument speaker, in order to solve the problems of poor performance experience caused by high latency and significant sound quality loss in existing instrument speakers.

[0005] The third objective of this invention is to provide an intelligent sound effect adjustment system for a wireless instrument speaker, in order to solve the problems of high latency and significant sound quality loss in existing instrument speakers, resulting in a poor playing experience.

[0006] One of the objectives of this invention is achieved through the following technical solution:

[0007] A wireless instrument speaker, the wireless instrument speaker includes a speaker body, the speaker body includes a neck part and speaker parts disposed at both ends of the neck part;

[0008] The audio section includes a speaker module, a main control board, a wireless transceiver module, and a power supply module; the power supply module is electrically connected to the main control board, the speaker module, and the wireless transceiver module, and the speaker module and the wireless transceiver module are respectively electrically connected to the main control board;

[0009] The main control board communicates with an external musical instrument via the wireless transceiver module. It acquires the audio signal from the external musical instrument, processes the audio signal for sound effects, and then outputs the audio signal to the speaker module to drive the speaker module to play the audio signal.

[0010] Furthermore, the audio unit includes a housing; the housing includes a base and a cover plate mounted on the base, and a cavity is formed between the base and the cover plate; the speaker module includes a first speaker module and a second speaker module; the cavity of one audio unit contains the first speaker module, a main control board, and a wireless transceiver module, and the cavity of the other audio unit contains the second speaker module and a power supply module; the main control board is electrically connected to the first speaker module and the wireless transceiver module;

[0011] The neckband is equipped with corresponding wires; by installing two speaker units at both ends of the neckband, the power supply module is electrically connected to the main control board and the wireless transceiver module through corresponding wires; the main control board is electrically connected to the second speaker module through corresponding wires.

[0012] Furthermore, the base of one speaker unit is provided with a power supply mounting slot and a first speaker module mounting slot, the power supply module being installed in the power supply mounting slot and the second speaker module being installed in the second speaker module mounting slot; the base of the other speaker unit is provided with a main control board mounting slot and a second speaker module mounting slot, the main control board being installed in the main control board mounting slot and the second speaker module being installed in the second speaker module mounting slot; the wireless transceiver module is located above the main control board; the speaker unit is provided with a sound outlet, and the sound outlet corresponds to the speaker module in the cavity;

[0013] Both the first speaker module and the second speaker module include a full-range speaker and a passive diaphragm speaker; both the first speaker module mounting slot and the second speaker module mounting slot include a full-range speaker mounting slot and a passive diaphragm speaker mounting slot, wherein the full-range speaker of the first speaker module is disposed in the corresponding full-range speaker mounting slot and the passive diaphragm speaker is disposed in the corresponding passive diaphragm speaker mounting slot, and the full-range speaker of the second speaker module is disposed in the corresponding full-range speaker mounting slot and the passive diaphragm speaker is disposed in the corresponding passive diaphragm speaker mounting slot;

[0014] The housing of the speaker unit, which has a main control board, is also equipped with a touch panel and physical buttons, which are electrically connected to the main control board.

[0015] Furthermore, the two speaker units are detachably connected to both ends of the neck hanger. The neck hanger has a first connection port on both ends and a second connection port on the end face where the speaker units are connected to the neck hanger. When the two speaker units are installed and in contact with both ends of the neck hanger, the first connection port and the second connection port are electrically connected.

[0016] The neck hanger and the speaker units at both ends of the neck hanger form a U-shaped structure, and the shell of the neck hanger is a shape memory alloy skeleton with a silicone coating layer on the outside; the shell of the speaker unit is made of carbon fiber composite material, aluminum alloy, ABS and PC materials.

[0017] Furthermore, the main control board includes an audio processing unit; the audio processing unit includes a DSP module, an FPGA module, and a radio frequency modulation module;

[0018] One end of the radio frequency modulation module is communicatively connected to the wireless transceiver of the external musical instrument through the wireless transceiver module, and the other end is electrically connected to the FPGA module. It is used to acquire the radio frequency signal of the wireless transceiver through the wireless transceiver module, decode the radio frequency signal and convert it from analog to digital into a digital audio signal, and send the digital audio signal to the FPGA module for buffering.

[0019] The FPGA module is also electrically connected to the DSP module, and is used to send the buffered digital audio signals to the DSP module in sequence according to the receiving timing.

[0020] The DSP module is electrically connected to the speaker module and is used to match and obtain the IR header file from the system according to the type of external musical instrument and preset sound effect configuration parameters, and to load the corresponding IR header file onto the audio signal using a convolutional neural network model to simulate the timbre of the corresponding digital audio signal. It also performs spatial sound effect processing on the corresponding digital audio signal according to the HRTF algorithm, and sends the processed corresponding digital audio signal to the speaker module for playback. The spatial sound effect processing of the audio signal includes simulating stereo sound or surround sound.

[0021] Furthermore, the main control board also includes a Bluetooth communication module; the audio processing unit also communicates with an external terminal APP through the Bluetooth communication module, and is used to obtain the sound effect configuration parameters sent by the external terminal APP through the Bluetooth communication module, and then update the preset sound effect configuration parameters according to the sound effect configuration parameters; and to synchronously upload the generated audio signal to the external terminal APP for display through the Bluetooth communication module;

[0022] The main control board also includes a zero-crossing detection module, which is located between the radio frequency modulation module and the FPGA module and is used to filter the corresponding digital audio signals.

[0023] The speaker unit also includes sensors, including a six-axis IMU sensor, a pressure sensor, and a distance sensor. The main control board also includes an MCU module, which is electrically connected to the six-axis IMU sensor, the pressure sensor, and the distance sensor. The MCU module is used to obtain the user's head movement data based on the monitoring data from the six-axis IMU sensor, to obtain the fit level between the device and the user's neck based on the monitoring data from the pressure sensor, and to obtain the distance between the device and the user's ear based on the monitoring data from the distance sensor. The MCU module is electrically connected to the DSP module and is used to provide the DSP module with the user's head movement data, the fit level between the device and the user's neck, and the distance between the device and the user's head. This allows the DSP module to adjust the parameters of the HRTF algorithm based on the user's head movement data to adjust the spatial sound effect rendering, adjust the EQ compensation parameters based on the fit level between the device and the user's neck, and adjust the audio output mode based on the distance between the device and the user's ear.

[0024] Furthermore, the DSP module is also used to dynamically divide the corresponding digital audio signal to obtain multiple frequency division signals, and to use a convolutional neural network model to load the corresponding IR header file for each frequency division signal to simulate the timbre of each frequency division signal. In addition, after performing spatial sound effect processing on each frequency division signal according to the HRTF algorithm, the multiple frequency division signals are merged and sent to the speaker module.

[0025] The second objective of this invention is achieved by the following technical solution:

[0026] A method for intelligent sound effect adjustment of a wireless musical instrument speaker, applied to a wireless musical instrument speaker as described in one of the objectives of this invention, the method comprising:

[0027] Audio acquisition steps: Acquire the audio signal played by an external musical instrument, decode and convert the audio signal from analog to digital to obtain a digital audio signal, and buffer the digital audio signal according to the receiving timing.

[0028] Audio processing steps: First, based on the instrument type and preset sound effect configuration parameters of the external instrument, the IR header file is obtained from the system. Then, according to the convolutional neural network model, the IR header file is loaded onto each digital audio signal in turn to simulate the timbre of the corresponding digital audio signal. Next, the spatial sound effect is simulated on the timbre-simulated digital audio signal according to the HRTF algorithm.

[0029] Playback steps: The digital audio signal obtained after spatial sound effect simulation is sent to the speaker module of the wireless instrument speaker for synchronous playback.

[0030] Furthermore, it also includes:

[0031] Parameter configuration steps: Obtain the timbre configuration parameters sent by the external terminal APP, and then update the preset sound effect configuration parameters according to the timbre configuration parameters;

[0032] Data synchronization steps: Upload the digital audio signal after spatial sound effect simulation to the external terminal APP;

[0033] The audio processing steps specifically include: first, obtaining the IR amp file from the system based on the instrument type and preset sound effect configuration parameters of the external instrument, and dynamically dividing the corresponding digital audio signal to obtain multiple frequency-divided signals; then, loading the IR amp file onto each frequency-divided signal according to the convolutional neural network model to simulate the timbre of each frequency-divided signal; and finally, simulating spatial sound effects for each frequency-divided signal after timbre simulation according to the HRTF algorithm.

[0034] The third objective of this invention is achieved by the following technical solution:

[0035] A smart sound effect adjustment system for a wireless instrument speaker, the smart sound effect adjustment system comprising a wireless instrument speaker, a wireless transceiver, and an external terminal APP as described in one of the objectives of this invention; wherein, the wireless transceiver module of the wireless instrument speaker is communicatively connected to the wireless transceiver, the wireless transceiver is electrically connected to an external instrument; and the wireless instrument speaker and the external terminal APP are communicatively connected via Bluetooth.

[0036] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0037] This invention features a neckband-style wireless instrument speaker, making it convenient to wear and carry. It also utilizes wireless signals for data communication between the speaker and the instrument, reducing signal transmission latency, resulting in superior sound quality suitable for professional performances. Furthermore, it intelligently adjusts the acquired audio signals to create a more immersive and surround sound experience, providing users with a more engaging performance experience and enhancing the overall user experience. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of the overall structure of a wireless musical instrument speaker provided by the present invention;

[0039] Figure 2 for Figure 1 A side view of the speaker for a wireless musical instrument.

[0040] Figure 3 for Figure 1 A schematic diagram of the internal structure of a wireless instrument speaker enclosure.

[0041] Figure 4This invention provides a module diagram of an intelligent sound effect adjustment system for a wireless musical instrument speaker.

[0042] In the diagram: 1. Neckband; 2. First speaker section; 3. Second speaker section; 4. Sound outlet; 51. Full-range speaker; 52. Passive diaphragm speaker; 511. Full-range speaker mounting slot; 521. Passive diaphragm speaker mounting slot; 6. Power supply module; 61. Power supply module mounting slot; 7. Physical buttons; 71. Button mounting slot; 8. Main control board; 81. Main control board mounting slot. Detailed Implementation

[0043] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0044] Example 1

[0045] Addressing the shortcomings of existing speakers used for musical instrument performance, this invention provides a wireless musical instrument speaker. This speaker combines wireless audio transmission technology with digital sound processing technology and adopts a neckband design, providing users with a more portable musical instrument performance experience and a better user experience. Furthermore, it integrates wireless control via a smart terminal APP to achieve diverse tone adjustments and meet the diverse needs of users.

[0046] Specifically, such as Figures 1-3 As shown, the present invention provides a preferred embodiment of a wireless musical instrument speaker, comprising a speaker body. The speaker body includes a neck section 1 and speaker units disposed at both ends of the neck section 1.

[0047] More specifically, the neckband 1 and the two speaker sections form a U-shaped structure, facilitating neckband use. This invention employs a neckband design for ease of wearing. Simultaneously, the speaker enclosure features a lightweight design, providing a more comfortable wearing experience. Specifically, the neckband 1 has a shape memory alloy frame with an external silicone coating; the speaker section housing is made of carbon fiber composite material, aluminum alloy, and ABS+PC materials, featuring an ergonomic design for comfortable wear.

[0048] Furthermore, the audio section includes a speaker module, a main control board 8, a wireless transceiver module, and a power supply module 6. The power supply module 6 is electrically connected to the main control board 8, the wireless transceiver module, and the speaker module, providing power to them. In this invention, the power supply module 6 provides power to the entire wireless musical instrument speaker enclosure. Specifically, the power supply module 6 includes a battery pack, which is a lithium polymer battery pack. The power supply module 6 can simultaneously support fast charging and reverse power supply; for example, when the wireless transceiver needs charging, it can be electrically connected to the wireless transceiver to charge it.

[0049] In addition, the power supply module 6 includes not only a battery pack but also a power management chip. The power management chip controls the charging and discharging of the battery pack to optimize power consumption and extend its battery life. Specifically, this invention can support 8 hours of continuous use, meeting the battery life requirements for playing musical instruments in most scenarios.

[0050] More preferably, the housing of the speaker unit is also provided with a charging and discharging input / output port for charging the battery pack in the power supply module 6 and discharging the battery pack.

[0051] Furthermore, the speaker module and the wireless transceiver module are electrically connected to the main control board 8. Specifically, the main control board 8 communicates with the external musical instrument via the wireless transceiver module. It acquires the audio signal from the external instrument, processes the audio signal for sound effects, and then outputs the audio signal to the speaker module to drive the speaker module to play the audio signal. In actual use, the wireless transceiver module is connected to the external musical instrument, thus enabling the main control board 8 to connect with the external musical instrument and acquire its audio signal. More specifically, the wireless transceiver in this embodiment uses a 6.5mm interface wireless transmission scheme based on a proprietary 2.4GHz protocol to achieve ultra-low latency audio transmission. By employing a customized radio frequency protocol, low-latency audio transmission is provided, ensuring stable sound quality from the external musical instrument.

[0052] More preferably, the audio unit includes a housing, which includes a base and a cover plate mounted on the base, forming a cavity between the base and the cover plate to accommodate the various modules within the audio unit. Specifically, the speaker module includes a first speaker module and a second speaker module, which are respectively disposed in two audio units.

[0053] More specifically, in this embodiment, the two speaker components are respectively designated as the first speaker component 2 and the second speaker component 3, and are respectively located at the left and right ends of the neckband 1, forming a U-shaped structure with the neckband 1. Figure 2As shown, the first speaker unit 2 contains a first speaker module, a main control board 8, and a wireless transceiver module. The second speaker unit 3 contains a second speaker module and a power supply module 6 within its cavity. By evenly distributing the modules within the two speaker units, the weight of the two speaker units can be evenly distributed, resulting in a more comfortable wearing experience.

[0054] More preferably, the main control board 8 located in the first audio unit 2 is electrically connected to the first speaker module and the wireless transceiver module. Meanwhile, the neckband 1 has internal wiring to allow the main control board 8 located in the first audio unit 2 to be electrically connected to the second speaker module and the power supply module 6 located in the second audio unit 3. Simultaneously, the power supply module 6 located in the second audio unit 3 is also electrically connected to the second speaker module.

[0055] More preferably, in this embodiment, the neckband 1 and the speaker unit are connected in a detachable manner to further facilitate user wearing, such as by magnetic attachment or plug-in connection. When the neckband 1 and the speaker unit are detachable, a matching connection port is provided on the end face of the neckband 1 that contacts the speaker unit. Specifically, a first connection port is provided on each of the two end faces of the neckband 1, and a second connection port is provided on the end face of the speaker unit that connects to the neckband 1. When the two speaker units are installed and in contact with the two ends of the neckband 1 respectively, the first connection port and the second connection port are electrically connected to realize the electrical connection between the various modules within the speaker unit.

[0056] More preferably, the base of the first speaker unit 2 is provided with a power supply module mounting slot 61 and a first speaker module mounting slot, with the power supply module 6 disposed in the power supply module mounting slot 61 and the second speaker module disposed in the first speaker module mounting slot. The base of the second speaker unit 3 is provided with a main control board mounting slot 81 and a second speaker module mounting slot, with the main control board 8 disposed in the main control board mounting slot 81 and the second speaker module disposed in the second speaker module mounting slot. The wireless transceiver module is disposed above the main control board 8.

[0057] In addition, both the first audio section 2 and the second audio section 3 are provided with sound outlets 4, and the sound outlets 4 correspond to the speaker modules in the cavity to ensure that the sound can be transmitted naturally and improve the user's listening experience.

[0058] Furthermore, both the first and second speaker modules include a full-range speaker 51 and a passive diaphragm speaker 52. Both the first and second speaker module mounting slots include a full-range speaker mounting slot 511 and a passive diaphragm speaker mounting slot 521. The full-range speaker 51 of the first speaker module is disposed within the corresponding full-range speaker mounting slot 511, and the passive diaphragm speaker 52 is disposed within the corresponding passive diaphragm speaker mounting slot 521. Similarly, the full-range speaker 51 of the second speaker module is disposed within the corresponding full-range speaker mounting slot 511, and the passive diaphragm speaker 52 is disposed within the corresponding passive diaphragm speaker mounting slot 521.

[0059] Each speaker unit contains a full-range speaker 51 and a passive radiator speaker 52. The front-to-back spacing between the full-range speaker 51 and the passive radiator speaker 52 optimizes sound propagation, resulting in richer and more three-dimensional sound quality. This staggered speaker layout optimizes the directionality, layering, and surround sound of the sound. For example, placing a full-range speaker 51 in front, towards the ears, improves clarity and enhances the expression of vocals and melodic lines; then, a passive radiator speaker 52 is placed behind the full-range speaker 51 to optimize bass response.

[0060] The speaker module generates a 3D sound field effect by setting up four small speaker horns, and can also use the VBAP (Vector-Based Amplitude Panning) method to calculate the optimal speaker gain.

[0061] Preferably, the main control board 8 includes an audio processing unit. The audio processing unit includes a DSP (Digital Signal Processing) module, an FPGA (Field Programmable Gate Array) module, and a radio frequency modulation module.

[0062] Specifically, the RF modulation module is electrically connected to the wireless transceiver module and electrically connected to the FPGA module via an IS2 interface. The RF modulation module is used to receive RF signals transmitted by an external musical instrument via a wireless transceiver, demodulate them into digital audio signals (such as PCM streams), and transmit the demodulated digital audio signals to the FPGA module via the I2S interface.

[0063] The FPGA module is used to buffer the received digital audio signals and send them frame by frame to the DSP module according to the receiving timing. The FPGA module uses double buffering technology to buffer the audio signals to ensure no data loss; at the same time, it sends the digital audio signals frame by frame to the DSP module according to the receiving timing to ensure data synchronization.

[0064] The DSP module is used to match and generate IR (impulse response) header files based on the instrument type and preset sound effect configuration parameters. It then loads the IR header files onto the corresponding digital audio signal using a convolutional neural network model to generate the corresponding impulse response. Finally, it performs spatial sound effect rendering on the corresponding digital audio signal using the HRTF (Head Related Transfer Function) algorithm before outputting it to the speaker module for playback. Spatial sound effect rendering includes stereo rendering and surround sound rendering.

[0065] The preset sound effect configuration parameters include: basic parameters (gain, EQ (Equalizer)), effects parameters (reverb, delay), and algorithm parameters (IR file, HRTF coefficients). These preset sound effect configuration parameters can be accessed through preset modes (such as "Jazz Mode") and the type of instrument played.

[0066] Additionally, IR amp simulation refers to the impulse response file of the corresponding instrument (such as "Fender cabinet").

[0067] This invention, by setting up a DSP module, can reconstruct the timbre of digital audio signals based on IR amplifier header files using a convolution algorithm. It can also change the spatial feel by adjusting the reverberation time register value to achieve EQ control, and modify the FIR filter coefficients to achieve frequency band equalization. By using the DSP module to simulate the timbre and sound effects of digital audio signals, it ensures better playback quality and provides users with an immersive performance experience.

[0068] This invention can also update the budgeted sound effect configuration parameters. Specifically, the configuration command is sent to the DSP module of the main control board 8 via Bluetooth through an external terminal APP. The DSP module writes the sound effect configuration parameters in the configuration command into the DSP register through the SPI interface, thereby realizing dynamic adjustment of the algorithm coefficients.

[0069] Furthermore, this invention stores various IR amp files within the system to match and derive the corresponding IR amp file based on the user's configured sound effect parameters, enabling appropriate sound effect processing of the audio signal. Specifically, IR amp files include classic amp files (Marshall, Fender, Mesa Boogie), studio microphone simulation amp files (SM57, U87), and spatial reverberation amp files (room, stage, reverberation hall). By pre-storing these IR amp files within the wireless instrument amplifier, the DSP module calls the corresponding stored IR amp file for reverberation convolution processing, thereby superimposing effects parameters to achieve simulated sound effect processing of the audio signal.

[0070] Furthermore, this invention can also provide customized sound effects for different musical instruments, such as supporting sound effect adaptation for instruments like guitars and basses. This is achieved through frequency response curves and dynamic processing parameters. For example, each instrument is associated with an independent frequency response curve (EQ parameters) and dynamic processing curve (compression / limiting parameters). For instance, the bass mode defaults to boosting the low-frequency range of 60-120Hz. Users can then customize curves or select preset modes (such as "jazz bass" or "metal guitar") via an external terminal app, and then train the IR amp model. The IR amp model training involves collecting impulse responses from different brands of instrument amps (such as Fender guitars and Ampeg basses) and generating high-fidelity tone simulation files, i.e., IR amp files, using a GAN model.

[0071] In this way, the DSP module can synchronously load the corresponding IR amp model according to the current instrument type to obtain the corresponding IR amp file, and then generate a digital audio signal based on the IR amp file for processing to obtain the frequency response curve and dynamic processing parameters, thereby achieving end-to-end customized timbre output.

[0072] More specifically, in this embodiment, when simulating the audio signal, the digital audio signal is first dynamically divided into multiple frequency-segmented signals. These frequency-segmented signals include low-frequency, mid-frequency, and high-frequency signals. The low-frequency signal has a frequency range of 0–200Hz, the mid-frequency signal has a frequency range of 200Hz–2kHz, and the high-frequency signal has a frequency range above 2kHz. In other words, the DSP module processes the timbre and spatial effects of each frequency-segmented signal separately, and then combines the multiple frequency-segmented signals before outputting them to the speaker module.

[0073] The DSP module applies the corresponding IR pulse response to each segment of the frequency division signal according to the selected IR header file using the following formula:

[0074]

[0075] In the formula: h(t) is the IR model; E i Let t be the i-th effect (such as distortion or delay, trained based on a convolutional neural network (CNN) to mimic the frequency response curve of a real audio processor); t is time; x(t) is the input audio signal; and n is the sampling point index.

[0076] The DSP module is also used to process each crossover signal after timbre processing using the HRTF algorithm for spatial sound effects. HRTF stands for Head-Related Transfer Function, which simulates each crossover signal to achieve stereo or surround sound effects. The specific formula for the HRTF algorithm is as follows:

[0077]

[0078] In the formula: H j (t) is the HRTF function; m is the number of channels, for example, stereo has 2 channels and surround sound has 5 channels.

[0079] Specifically, the DSP module processes each segment of the crossover signal individually to simulate the differences in how the ear perceives sound from different directions. Then, the processed crossover signals are superimposed to synthesize a full-frequency signal, ensuring frequency response continuity before being output to the speaker module. This process simulates the differences in how the ear perceives sound from different directions by processing audio signals in different frequency bands. For example, this applies to low-frequency signals.

[0080] In addition, the spatial sound effect modes in this embodiment include stereo mode and surround sound mode. For example, for stereo mode: based on the two-channel HRTF algorithm, the sound image positioning of the left and right speakers is optimized (e.g., guitar sound is off to the left, vocals are centered). For surround sound mode: on the basis of stereo, environmental reverberation and sound field diffusion algorithms are added to simulate multi-channel surround effect (e.g., the spatial feeling of a concert hall).

[0081] In addition, the switching of this mode is also derived from the preset sound effect configuration parameters, which can be achieved through an external terminal APP or physical button 7. The default setting is stereo mode.

[0082] More preferably, when the music is VR / AR music, the Ambisonics algorithm can be used instead of the HRTF algorithm to achieve more complex spatial sound effect simulation.

[0083] Furthermore, the main control board 8 in this embodiment also includes a Bluetooth communication module. The audio processing unit also communicates with the mobile terminal AP via the Bluetooth communication module to achieve data interaction with the user. Specifically, the user can adjust sound effect configuration parameters through the mobile terminal APP, such as mode selection, EQ adjustment, IR header file, reverb / delay, accompaniment volume, and other parameter configurations. Once the user updates the sound effect configuration parameters through the mobile terminal APP, the FPGA module will update the preset sound effect configuration parameters so that the DSP module can process the audio signal timbre according to the updated preset sound effect configuration parameters to achieve seamless timbre switching. Specifically, the mobile terminal APP transmits the user-set sound effect configuration parameters to the FPGA module via the JSON protocol so that the FPGA module can update the sound effect configuration parameters in the system in real time.

[0084] Meanwhile, the DSP module is also used to synchronize audio signals to a mobile terminal APP via Bluetooth to display the real-time spectrum of the audio signals.

[0085] In addition, the smart terminal APP can also access voice control and gesture recognition functions, so that users can adjust the sound effect configuration parameters by voice or gesture.

[0086] Preferably, the main control board 8 further includes a zero-crossing detection module. This module performs zero-crossing detection on the input digital audio signal to filter the signal and prevent signal abrupt changes. Specifically, the zero-crossing detection module is located between the RF conditioning module and the FPGA module. By filtering the signal, it eliminates transient noise caused by signal abrupt changes (such as instrument plugging / unplugging or mode switching), thereby improving the stability of the output sound quality. In this embodiment, the zero-crossing detection module can be implemented using hardware circuitry, such as a Zero-Crossing Detector circuit, or using software algorithms, such as identifying the zero-crossing moment by calculating the sign change of adjacent sampling points.

[0087] Furthermore, the first speaker unit 2 is also equipped with a touch panel and physical buttons 7 on its housing. The touch panel and physical buttons 7 are electrically connected to the main control board 8. The second speaker unit 2 is also equipped with a button mounting slot 71 for the installation of the physical buttons 7. By equipping the physical buttons 7 and touch panel, etc., it is possible to quickly switch sound effect modes, adjust volume and parameters, such as short press to switch tone presets, volume, etc. This method is suitable for use without a mobile APP, allowing users to operate the device independently. That is, the present invention connects the mobile terminal APP to the speaker via Bluetooth, enabling remote adjustment of configuration parameters through the mobile terminal APP, and also enabling adjustment of configuration parameters through buttons on the speaker, providing multiple ways to adjust configuration parameters for user convenience; for example, on the hardware side, quick switching can be achieved through the keyboard, and precise adjustment can be achieved through the APP to adapt to different user needs.

[0088] More preferably, the audio unit also includes sensors. These sensors include a six-axis IMU sensor, a pressure sensor, and a distance sensor. The main control board 8 also includes an MCU module, which is electrically connected to the six-axis IMU sensor, pressure sensor, and distance sensor. The six-axis IMU sensor is used to acquire the user's head movement data. The pressure sensor is used to acquire the pressure between the device and the user's neck, and then determine the device's fit level against the user's neck based on the pressure. The distance sensor is used to acquire the distance between the device and the user's head. In other words, the MCU module is used to derive the user's head movement data based on the monitoring data from the six-axis IMU sensor, acquire the device's fit level against the user's neck based on the monitoring data from the pressure sensor, and acquire the distance between the device and the user's head based on the monitoring data from the distance sensor.

[0089] Furthermore, the DSP module and MCU module are connected via a high-speed SPI interface. The DSP module dynamically adjusts audio processing parameters based on monitoring data from the three types of sensors provided by the MCU module, thereby improving audio output quality. Specifically, the DSP module dynamically adjusts HRTF algorithm parameters based on user head movement data provided by the MCU module; adapts and adjusts the EQ compensation curve according to the fit level between the device and the user's neck, optimizing low-frequency response; and adapts and switches audio output modes (such as near-field stereo mode / far-field surround sound mode) according to the distance between the device and the user's head, providing the user with better audio output effects.

[0090] For example, the DSP module dynamically adjusts the parameters of the HRTF algorithm based on the user's head motion data: First, the MCU module collects the user's head motion data through a six-axis IMU sensor (sampling rate 200Hz), and then uses a quaternion attitude calculation algorithm to calculate the user's head yaw angle θ (range 0-360°) and pitch angle φ (range -90° to +90°) in real time.

[0091] Meanwhile, the DSP module has a built-in HRTF parameter database, which stores HRTF coefficient sets for 72 azimuths (each interval corresponds to 5°).

[0092] Thus, when the MCU module detects the user's head rotation via the six-axis IMU sensor, it calculates the user's head yaw and pitch angles and sends them to the DSP module. The DSP module can then dynamically adjust the HRTF parameters based on these calculated angles and its built-in HRTF parameter database. Specifically, during parameter adjustment, the HRTF coefficients for the current user's head angle (θ, φ) are calculated using bilinear interpolation. Simultaneously, the HRTF update rate is dynamically adjusted based on the rotational angular velocity ω. For example, when the rotational angular velocity ω < 30° / s, the update frequency is adjusted to 10Hz; when the rotational angular velocity 30° / s < ω < 90° / s, the update frequency is adjusted to 30Hz; and when the rotational angular velocity ω > 90° / s, the update frequency is adjusted to 100Hz.

[0093] For example, the DSP module also implements EQ compensation based on the fit level between the device and the user's neck provided by the MCU module. The MCU module is configured to detect the neck contact pressure P (range 0-10N) using a pressure sensor (sampling rate 50Hz) and quantify it into 5 fit levels. The DSP module then implements EQ compensation as follows: For low-frequency compensation, a dynamic gain G = 3 × log(1 + P / P0) dB is applied to the 80Hz-200Hz frequency band, where P0 = 2N. During Q-value adjustment, the Q value of the second-order low-frequency filter changes linearly from 0.7 (level 1) to 1.2 (level 5). Simultaneously, when the fit level is <2, +6dB compensation below 100Hz is enabled.

[0094] For example, the DSP module switches modes based on the distance between the device and the user's head. When the distance sensor (accuracy ±1cm) detects the distance *d* between the device and the user's ear in real time, the following adjustment scheme can be used: When *d* < 15cm, the mode switches to near-field mode, with direct sound accounting for >80%; when *15cm* ≤ *d* ≤ 30cm, the mode switches to hybrid mode, adding a 15ms early reflection; when *d* > 30cm, the mode switches to surround mode, enabling Ambisonics 3rd order encoding. Simultaneously, a 500ms fade-in / fade-out transition is used during mode switching to avoid abrupt auditory changes.

[0095] Example 2

[0096] Based on Embodiment 1, this invention provides an intelligent sound effect adjustment method for a wireless musical instrument speaker, such as... Figure 4 Shown, including:

[0097] Step S1: Obtain the audio signal played by an external musical instrument, decode and convert the audio signal from analog to digital to obtain a digital audio signal, and buffer the digital audio signal according to the receiving timing.

[0098] Specifically, a wireless transceiver is installed on the musical instrument and matched with the wireless musical instrument speaker provided by the present invention, so as to collect the audio signal of the instrument playing through the wireless transceiver, and after the audio signal is collected, the audio signal is first decoded and converted from analog to digital to obtain a digital audio signal.

[0099] Step S2: Obtain the IR header file from the system according to the instrument type and preset sound effect configuration parameters of the external instrument, and load the IR header file onto each digital audio signal in turn according to the convolutional neural network model to simulate the timbre of the corresponding digital audio signal; then, simulate the spatial sound effects of the timbre-simulated digital audio signal according to the HRTF algorithm.

[0100] More specifically, in step S2, before processing the digital audio signal, it is necessary to dynamically divide the digital audio signal to obtain multiple frequency-divided signals. These frequency-divided signals include low-frequency, mid-frequency, and high-frequency signals. Step S2, when performing timbre simulation on the digital audio signal, specifically includes performing separate timbre simulation and spatial sound effect simulation on each frequency-divided signal. Step S2, in which spatial sound effect simulation is performed on the timbre-simulated digital audio signal according to the HRTF algorithm, specifically includes performing spatial sound effect simulation on each frequency-divided signal separately, and then merging the multiple audio signals after spatial sound effect simulation.

[0101] Step S3: Send the digital audio signal obtained after spatial sound effect simulation to the speaker module of the wireless instrument speaker for synchronous playback.

[0102] This invention combines wireless transmission technology and digital processing technology to reduce signal latency, achieve synchronous signal playback, and simulate timbre and spatial sound effects to improve the quality of sound playback and bring users an immersive performance experience.

[0103] Furthermore, the present invention also includes: uploading the audio signal after spatial sound effect simulation to an external terminal APP via Bluetooth and displaying it through the external terminal APP; and obtaining the timbre configuration parameters sent by the external terminal APP, and then updating the preset sound effect configuration parameters according to the timbre configuration parameters.

[0104] By setting up a Bluetooth communication module, the speaker can be connected to a mobile terminal APP to enable users to remotely update configuration parameters, adapting to more performance scenarios and requirements for more timbre and sound field. At the same time, the collected audio signal will be synchronized to the mobile terminal APP to display the frequency response curve of the audio signal on the mobile terminal APP, so as to perform further data analysis and feedback on the audio signal, providing data support for other analyses, and also enabling the storage of audio signals.

[0105] Example 3

[0106] Based on Embodiment 1, the present invention also provides another embodiment: an intelligent sound effect adjustment system for a wireless instrument speaker. The intelligent sound effect adjustment system includes a wireless instrument speaker, a wireless transceiver, and an external terminal device as provided in Embodiment 1. The wireless transceiver module of the wireless instrument speaker is communicatively connected to the wireless transceiver, and the wireless transceiver is electrically connected to an external instrument. The wireless instrument speaker and the external terminal device are connected via Bluetooth.

[0107] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A wireless instrument speaker, characterized in that, The wireless instrument speaker includes a speaker body, which includes a neck section and speaker units located at both ends of the neck section. The audio section includes a speaker module, a main control board, a wireless transceiver module, and a power supply module; The power supply module is electrically connected to the main control board, the speaker module, and the wireless transceiver module, and the speaker module and the wireless transceiver module are respectively electrically connected to the main control board; The main control board communicates with an external musical instrument via the wireless transceiver module, and is used to acquire the audio signal of the external musical instrument, process the audio signal for sound effects, and then output the audio signal to the speaker module to drive the speaker module to play the audio signal. The main control board includes an audio processing unit; the audio processing unit includes a DSP module, an FPGA module, and a radio frequency modulation module; One end of the radio frequency modulation module is communicatively connected to the wireless transceiver of the external musical instrument through the wireless transceiver module, and the other end is electrically connected to the FPGA module. It is used to acquire the radio frequency signal of the wireless transceiver through the wireless transceiver module, decode the radio frequency signal and convert it from analog to digital into a digital audio signal, and send the digital audio signal to the FPGA module for buffering. The FPGA module is also electrically connected to the DSP module, and is used to send the buffered digital audio signals to the DSP module in sequence according to the receiving timing. The DSP module is electrically connected to the speaker module and is used to match and obtain the IR header file from the system according to the type of external musical instrument and preset sound effect configuration parameters, and to load the corresponding IR header file onto the audio signal using a convolutional neural network model to simulate the timbre of the corresponding digital audio signal. It also performs spatial sound effect processing on the corresponding digital audio signal according to the HRTF algorithm, and sends the processed corresponding digital audio signal to the speaker module for playback. The spatial sound effect processing of the audio signal includes simulating stereo sound or surround sound.

2. The wireless instrument speaker according to claim 1, characterized in that, The audio unit includes a housing; the housing includes a base and a cover plate mounted on the base, and a cavity is formed between the base and the cover plate; the speaker module includes a first speaker module and a second speaker module; One of the speaker compartments houses a first speaker module, a main control board, and a wireless transceiver module; the other speaker compartment houses a second speaker module and a power supply module. The main control board is electrically connected to the first speaker module and the wireless transceiver module. The neckband is equipped with corresponding wires; by installing two speaker units at both ends of the neckband, the power supply module is electrically connected to the main control board and the wireless transceiver module through corresponding wires; the main control board is electrically connected to the second speaker module through corresponding wires.

3. The wireless instrument speaker according to claim 2, characterized in that, One speaker unit has a base with a power supply mounting slot and a first speaker module mounting slot, the power supply module being mounted in the power supply mounting slot and the second speaker module being mounted in the second speaker module mounting slot; another speaker unit has a base with a main control board mounting slot and a second speaker module mounting slot, the main control board being mounted in the main control board mounting slot and the second speaker module being mounted in the second speaker module mounting slot; a wireless transceiver module is located above the main control board; each speaker unit has a sound outlet, and the sound outlet corresponds to the speaker module within the cavity; Both the first speaker module and the second speaker module include a full-range speaker and a passive diaphragm speaker; both the first speaker module mounting slot and the second speaker module mounting slot include a full-range speaker mounting slot and a passive diaphragm speaker mounting slot, wherein the full-range speaker of the first speaker module is disposed in the corresponding full-range speaker mounting slot and the passive diaphragm speaker is disposed in the corresponding passive diaphragm speaker mounting slot, and the full-range speaker of the second speaker module is disposed in the corresponding full-range speaker mounting slot and the passive diaphragm speaker is disposed in the corresponding passive diaphragm speaker mounting slot; The housing of the speaker unit, which has a main control board, is also equipped with a touch panel and physical buttons, which are electrically connected to the main control board.

4. The wireless instrument speaker according to claim 1, characterized in that, Two speaker units are detachably connected to both ends of the neck hanger. The neck hanger has a first connection port on both ends and a second connection port on the end face where the speaker units are connected to the neck hanger. When the two speaker units are installed and in contact with the two ends of the neck hanger, the first connection port and the second connection port are electrically connected. The neck hanger and the speaker units at both ends of the neck hanger form a U-shaped structure, and the shell of the neck hanger is a shape memory alloy skeleton with a silicone coating layer on the outside; the shell of the speaker unit is made of carbon fiber composite material, aluminum alloy, ABS and PC materials.

5. The wireless instrument speaker according to claim 1, characterized in that, The main control board also includes a Bluetooth communication module; the audio processing unit also communicates with an external terminal APP through the Bluetooth communication module, and is used to obtain the sound effect configuration parameters sent by the external terminal APP through the Bluetooth communication module, and then update the preset sound effect configuration parameters according to the sound effect configuration parameters; The generated audio signal is also synchronously uploaded to an external terminal APP for display via the Bluetooth communication module. The main control board also includes a zero-crossing detection module, which is located between the radio frequency modulation module and the FPGA module and is used to filter the corresponding digital audio signals. The speaker unit also includes sensors, including a six-axis IMU sensor, a pressure sensor, and a distance sensor. The main control board also includes an MCU module, which is electrically connected to the six-axis IMU sensor, the pressure sensor, and the distance sensor. The MCU module is used to obtain the user's head movement data based on the monitoring data from the six-axis IMU sensor, to obtain the fit level between the device and the user's neck based on the monitoring data from the pressure sensor, and to obtain the distance between the device and the user's ear based on the monitoring data from the distance sensor. The MCU module is electrically connected to the DSP module and is used to provide the DSP module with the user's head movement data, the fit level between the device and the user's neck, and the distance between the device and the user's ear. This allows the DSP module to adjust the parameters of the HRTF algorithm based on the user's head movement data to adjust the spatial sound effect rendering, adjust the EQ compensation parameters based on the fit level between the device and the user's neck, and adjust the audio output mode based on the distance between the device and the user's ear.

6. The wireless instrument speaker according to claim 1, characterized in that, The DSP module is also used to dynamically divide the corresponding digital audio signal to obtain multiple frequency division signals, and to use a convolutional neural network model to load the corresponding IR header file for each frequency division signal to simulate the timbre of each frequency division signal. After performing spatial sound effect processing on each frequency division signal according to the HRTF algorithm, the multiple frequency division signals are merged and sent to the speaker module.

7. A method for intelligent sound effect adjustment of a wireless musical instrument speaker, applied to a wireless musical instrument speaker as described in any one of claims 1-6, characterized in that, The intelligent sound effect adjustment method includes: Audio acquisition steps: Acquire the audio signal played by an external musical instrument, decode and convert the audio signal from analog to digital to obtain a digital audio signal, and buffer the digital audio signal according to the receiving timing. Audio processing steps: First, based on the instrument type and preset sound effect configuration parameters of the external instrument, the IR header file is obtained from the system. Then, according to the convolutional neural network model, the IR header file is loaded onto each digital audio signal in turn to simulate the timbre of the corresponding digital audio signal. Next, the spatial sound effect is simulated on the timbre-simulated digital audio signal according to the HRTF algorithm. Playback steps: The digital audio signal obtained after spatial sound effect simulation is sent to the speaker module of the wireless instrument speaker for synchronous playback.

8. The intelligent sound effect adjustment method for a wireless musical instrument speaker according to claim 7, characterized in that, Also includes: Parameter configuration steps: Obtain the timbre configuration parameters sent by the external terminal APP, and then update the preset sound effect configuration parameters according to the timbre configuration parameters; Data synchronization steps: Upload the digital audio signal after spatial sound effect simulation to the external terminal APP; The audio processing steps specifically include: first, obtaining the IR amp file from the system based on the instrument type and preset sound effect configuration parameters of the external instrument, and dynamically dividing the corresponding digital audio signal to obtain multiple frequency-divided signals; then, loading the IR amp file onto each frequency-divided signal according to the convolutional neural network model to simulate the timbre of each frequency-divided signal; and finally, simulating spatial sound effects for each frequency-divided signal after timbre simulation according to the HRTF algorithm.

9. An intelligent sound effect adjustment system for a wireless musical instrument speaker, characterized in that, The intelligent sound effect adjustment system includes a wireless instrument speaker, a wireless transceiver, and an external terminal APP as described in any one of claims 1-6; wherein, the wireless transceiver module of the wireless instrument speaker is communicatively connected to the wireless transceiver, and the wireless transceiver is electrically connected to the external instrument; the wireless instrument speaker and the external terminal APP are communicatively connected via Bluetooth.

Images