Jet cooling device

Abstract

The invention relates to a jet cooling device which comprises a chip fixing base, a microstructure cold plate, a splitter plate, a collector plate, a cover plate and a pipeline connector. The upper surface of the micro-structure cold plate is provided with a micro-structure rib column covering the capillary structure and a rib column bottom surface, and the micro-structure cold plate is in sealed connection with the splitter plate; the splitter plate is provided with a splitter groove and a jet flow groove, the jet flow groove is matched with the micro-structure cold plate to form a jet flow cavity, the micro-structure rib columns are located in the jet flow cavity, and the splitter groove is internally provided with splitter hole channels and collecting pipelines which are arranged in a staggered mode; the bottom surface of the collector plate and the periphery of the upper part of the splitter plate form a splitter cavity, the collector plate is provided with a collector groove, the center of the collector groove is provided with a splitter pipeline, and the bottom surface of the collector plate is provided with a collector hole channel; the bottom face of the cover plate and the periphery of the upper portion of the collector plate form a collector cavity, and an inlet hole channel is formed in the center of the top face of the cover plate to communicate with the flow dividing pipeline. Compared with the prior art, the device has the advantages of efficient temperature uniformity, heat dissipation performance, compactness, integration, wide applicability and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic devices, and in particular to a jet cooling device. Background Art

[0002] With the continuous improvement of performance requirements, electronic devices have become increasingly miniaturized and integrated. An electronic device with a size of 1 cm 2 may generate thousands of watts of heat, which causes the operating temperature of electronic components to possibly exceed the preset temperature level, greatly reducing the performance and lifespan of the device. Therefore, the efficient heat dissipation of electronic devices is of great significance for controlling the temperature of high-power electronic devices to avoid serious damage to the device.

[0003] Due to the vertical scouring of the jet in jet impingement cooling technology, the velocity changes sharply in the jet stagnation zone, and the boundary layer is very thin, resulting in an extremely high heat transfer coefficient in the jet stagnation zone, effectively improving the heat transfer efficiency, and it is particularly suitable for the heat dissipation of high-power density electronic components. Although a microjet impingement heat sink can obtain a relatively high heat transfer coefficient and a relatively low pressure drop, the distribution of the heat transfer coefficient on the heat transfer surface is not uniform. In addition, for a traditional smooth plate jet impingement cooling device, due to insufficient cooling area, the ability of the high-speed jet cannot be fully utilized. How to improve the temperature uniformity of the microjet cooling device and effectively utilize the heat dissipation performance of the high-speed jet is a common concern of those skilled in the art in this heat dissipation field. Summary of the Invention

[0004] The purpose of the present invention is to overcome the defects existing in the above-mentioned prior art and provide a jet cooling device with high efficiency in temperature uniformity, heat dissipation performance, compactness, integration, and wide applicability.

[0005] The present invention provides a jet cooling device, including: a chip fixing base, a microstructured cold plate, a flow splitter plate, a manifold plate, a cover plate, and a pipeline joint;

[0006] A base cavity is provided in the middle of the chip fixing base to nest the flow splitter plate;

[0007] The bottom surface of the microstructured cold plate is attached to the chip to absorb the heat of the chip. The upper surface of the microstructured cold plate is provided with microstructured rib columns and the bottom surface of the rib columns that cover the capillary structure. The microstructured cold plate is hermetically connected to the flow splitter plate by welding or screwing;

[0008] The upper part of the flow splitter plate is provided with a flow splitting groove, and the lower part of the flow splitter plate is provided with a jet groove. The jet groove and the microstructured cold plate cooperate to form a jet cavity. The microstructured rib columns are located in the jet cavity. The flow splitting groove is provided with staggered flow splitting channels and manifold pipes for realizing the jet and reflux of the cooling working medium in the jet cavity respectively;

[0009] The bottom surface of the current collector plate and the upper periphery of the flow splitter plate form a flow splitting cavity through integral molding, welding connection or screw connection. A current collection groove is provided on the upper part of the current collector plate, and a flow splitting pipe is provided at the center of the current collection groove to communicate with the flow splitting cavity to supply the cooling working medium. A current collection hole passage is provided on the bottom surface of the current collector plate to communicate with the current collection pipe to realize the return of the cooling working medium;

[0010] The bottom surface of the cover plate and the upper periphery of the current collector plate form a current collection cavity through integral molding, welding connection or screw connection. An inlet hole passage is provided at the center of the top surface of the cover plate to communicate with the flow splitting pipe, and an outlet hole passage is provided on one side or both sides of the inlet hole passage to communicate with the current collection cavity;

[0011] The pipeline joint is installed in the inlet hole passage and the outlet hole passage of the cover plate by welding or threading to realize the connection between the jet cooling device and the external circulation pipeline.

[0012] Further, when the micro-structured cold plate and the flow splitter plate are hermetically connected by welding, solder is filled between the fitting surfaces of the micro-structured cold plate and the flow splitter plate to achieve sealing and connection;

[0013] When the micro-structured cold plate and the flow splitter plate are hermetically connected by screws, a jet cavity sealing groove is provided on the outer edge of the micro-structured rib column of the micro-structured cold plate to install a first sealing gasket for sealing. Uniformly distributed cold plate connection holes are provided on the outer edge of the jet cavity sealing groove, and corresponding first flow splitter plate connection holes are provided on the lower periphery of the flow splitter plate to achieve connection. Second screw groups are provided in the cold plate connection holes and the first flow splitter plate connection holes.

[0014] Further, base connection holes and base mounting holes are provided on the periphery of the chip fixing base, and the jet cooling device is threadedly connected or clamped to the chip substrate through the base mounting holes to achieve fitting with the chip surface;

[0015] The flow splitter plate is provided with an outer flow splitter plate mounting edge. The bottom surface of the outer flow splitter plate mounting edge is attached to the top surface of the chip fixing base, and is screwed to the base connection hole through a flow splitter plate mounting hole. First screw groups are provided in the flow splitter plate mounting hole and the base connection hole.

[0016] Further, the flow splitting channels and the current collection pipes are arranged in a staggered manner, and the flow splitting channels and the current collection channels are distributed in a grid shape that is centrosymmetric with the center of the flow splitting groove as the reference.

[0017] Further, a nozzle structure corresponding to the flow splitting channel is provided in the jet groove to shorten the distance between the cooling working medium and the bottom surface of the rib column during the jet process; the inner diameter of the nozzle structure is the same as the diameter of the flow splitting channel; the height ratio of the nozzle structure to the jet cavity is 20%-80%;

[0018] The microstructural rib columns are arranged around the nozzle structure, and there is one or more microstructural rib columns corresponding to the spacing range of the nozzle structure.

[0019] Furthermore, the shape of the microstructural rib column is selected from one of a column with a rectangular cross-section, a cone with a rectangular cross-section, a frustum with a rectangular cross-section, a trapezoidal column, a trapezoidal cone, a trapezoidal frustum, a parallelogram column, a parallelogram cone, a parallelogram frustum, a triangular column, a triangular cone, a triangular frustum, a circular column, a circular cone, a circular frustum, an elliptical column, an elliptical cone, an elliptical frustum, a hemispherical shape or an umbrella shape. When the shape feature of the microstructural rib column is an umbrella shape, the umbrella structure is divided into two parts: a head structure and a root structure, where the head structure and the root structure can be the same or different, and are each selected from one of a column with a rectangular cross-section, a cone or a frustum, a trapezoidal column, a parallelogram column, a triangular column, a circular column, an elliptical column, a hemispherical shape, an umbrella shape.

[0020] The circumcenter of the horizontal projection profile of the root structure and the head structure of the umbrella structure can be coincident or offset according to design requirements; define R1 as the radius of the circumcircle of the horizontal projection profile of the root structure, and R2 as the radius of the circumcircle of the horizontal projection profile of the head structure. When the root and the head are offset, the offset distance is less than or equal to the sum of R1 and R2; the ratio of the circumcircle radius size R1 of the root structure to the circumcircle radius size R2 of the head structure is 0.1 to 10, and the height ratio of the root structure to the head structure can be adjusted to any value according to design requirements.

[0021] When the shape of the microstructural rib column is an umbrella shape, the periphery of the root of the microstructural rib column is covered with an interstitial capillary structure.

[0022] The microstructural rib column is a solid rib column covered with a rib column capillary structure, and the percentage of the thickness of the rib column capillary structure in the total thickness of the microstructural rib column is 0% to 100%; the bottom surface of the rib column is covered with a bottom surface capillary structure. When the thickness of the bottom surface capillary structure is 0, the bottom surface of the rib column is a smooth metal surface. Preferably, the percentage of the thickness of the rib column capillary structure in the total thickness of the microstructural rib column is 5% - 25%.

[0023] The height ratio of the microstructural rib column to the jet cavity is 0 to 1.

[0024] The rib column capillary structure, the interstitial capillary structure and the bottom surface capillary structure are all porous capillary structures; the composition method of the porous capillary structure is selected from one of a metal powder sintering method, a metal wire sintering method or a mixed sintering method of metal powder and metal wire.

[0025] Further, when the flow dividing plate, the flow collecting plate and the cover plate are integrally formed, an additive manufacturing technique is used to integrally process and manufacture the flow dividing plate, the flow collecting plate and the cover plate; when the flow dividing plate, the flow collecting plate and the cover plate are connected by welding, a welding technique is used to seal and connect the flow dividing plate, the flow collecting plate and the cover plate;

[0026] The outer wall of the flow dividing groove, the flow collecting pipe and the bottom surface of the flow collecting plate form a flow dividing cavity; the outer wall of the flow collecting groove, the flow dividing pipe and the bottom surface of the cover plate form a flow collecting cavity;

[0027] The flow dividing pipe is combined and communicated with the inlet orifice; the flow collecting orifice is combined and communicated with the flow collecting pipe;

[0028] The upstream of the flow dividing cavity is communicated with the pipeline joint through the flow dividing pipe and the inlet orifice, and the downstream is communicated with the jet cavity through the flow dividing orifice and the nozzle structure; the upstream of the flow collecting cavity is communicated with the jet cavity through the flow collecting orifice and the flow collecting pipe, and the downstream is communicated with the pipeline joint through the outlet orifice.

[0029] Further, when the flow dividing plate, the flow collecting plate and the cover plate are connected by screws, the sealing and connection between the flow dividing plate, the flow collecting plate and the cover plate are realized through screws and a sealing unit;

[0030] A flow dividing cavity sealing groove is provided at the periphery of the flow dividing groove of the flow dividing plate for installing a second sealing washer; a gasket positioning groove is provided at the bottom surface of the flow collecting plate for installing a sealing gasket;

[0031] A flow collecting cavity sealing groove is provided at the periphery of the flow collecting groove of the flow collecting plate for installing a third sealing washer; a first sealing step is provided at the upper end surface of the flow dividing pipe of the flow collecting plate for installing a fourth sealing washer, and the inlet orifice is a stepped orifice, and a second sealing step is provided at the lower end surface of the inlet orifice for cooperating with the first sealing step to compress the fourth sealing washer;

[0032] The sealing gasket and the second sealing washer jointly realize the sealing of the flow dividing cavity; the third sealing washer and the fourth sealing washer jointly realize the sealing of the flow collecting cavity;

[0033] The flow dividing cavity sealing groove is provided with uniformly distributed second flow dividing plate connection holes, and corresponding flow collecting plate connection holes and cover plate connection holes are provided at the peripheries of the flow collecting plate and the cover plate to realize connection; third screw groups are provided in the second flow dividing plate connection holes, the flow collecting plate connection holes and the cover plate connection holes;

[0034] The sealing gasket is provided with a first gasket avoidance hole and a second gasket avoidance hole; the first gasket avoidance hole is used for avoiding the communication between the flow dividing pipe and the flow dividing cavity; the second gasket avoidance hole is used for avoiding the communication between the flow collecting pipe and the flow collecting orifice.

[0035] Furthermore, when the pipe joint is welded to the cover plate, the pipe joint is processed by a customized process, the inlet and outlet holes are smooth holes, and solder is filled between the bottom surface of the pipe joint and the fitting surface of the cover plate to achieve sealing and connection;

[0036] When the pipe joint is installed with the cover plate by threading, the inlet channel and the outlet channel are both threaded holes, and the pipe joint is selected from one of the quick water-stop joints, pagoda joints, ferrule joints and quick-tighten joints with standard threads.

[0037] Furthermore, the material of the chip fixing base, microstructure cold plate, diverter plate, collecting plate, cover plate and pipe joint is selected from one of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic, ceramic or glass; the material of the first sealing gasket, the second sealing gasket, the sealing gasket, the third sealing gasket and the fourth sealing gasket is selected from one of rubber, silicone, fluororubber or plastic.

[0038] Furthermore, the cooling medium of the jet cooling device is selected from one or more mixtures of water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oils, transformer oils or fluorinated liquids.

[0039] The application principle of the present invention is as follows: a low-temperature cooling medium flows in through an inlet pipe joint connected to an external circulation pipeline, and is filled in a diversion cavity from the center to the surrounding through a connected inlet channel and a diversion pipe; the cooling medium in the diversion cavity, under the action of a fluid driving force, performs a jet impact on the microstructure rib column gap in the jet cavity through the diversion hole and the nozzle structure, quickly takes away the heat conducted from the chip to the microstructure cold plate, and then converges to the manifold cavity through the connected collecting pipe and collecting channel, and then is discharged to the external circulation pipeline through an outlet channel and an outlet pipe joint.

[0040] Compared with the prior art, the present invention has the following advantages:

[0041] (1) High efficiency in temperature uniformity and heat dissipation performance. The layout of the diversion cavity in the present invention allows the cooling medium to flow radially from the center to the surrounding area, and then the diversion hole realizes high-pressure jet, which improves the temperature uniformity problem of the jet cooling device in the cooling effect; the lower end surface of the nozzle structure is very close to the jet surface, so that the velocity change in the jet stagnation zone is very drastic, which enhances the heat transfer performance.

[0042] (2) Compactness and integration. In the present invention, the collecting pipes and the diverting channels are staggered, and the hot working medium after the jet impact can be quickly discharged from the lower jet cavity; at the same time, the staggered distribution structure of the jet inlet and outlet channels improves the compactness of the cooling device.

[0043] (3) Wide applicability. In the present invention, the micro-structured rib column is a solid rib column covering a capillary structure, and the shape characteristics, structural composition, and arrangement mode of the micro-structured rib column can be adaptively adjusted according to actual needs to obtain a bottom plate surface structure with different heat exchange areas and disturbance degrees. The presence of the micro-structured rib column increases the cooling area of the bottom plate surface and enhances the heat convection effect, enabling the performance of jet cooling to be fully utilized. Brief Description of the Drawings

[0044] Figure 1 is an explosion schematic diagram of the jet cooling device;

[0045] Figure 2 is an overall structure schematic diagram of the jet cooling device;

[0046] Figure 3 is a cross-sectional schematic diagram of the overall structure of the jet cooling device;

[0047] Figure 4 is a structural schematic diagram of the chip fixing base;

[0048] Figure 5 is a structural schematic diagram of the micro-structured cold plate Figure 1 ;

[0049] Figure 6 is a structural schematic diagram of the micro-structured cold plate Figure 2 ;

[0050] Figure 7 is a structural schematic diagram of the flow splitter plate Figure 1 ;

[0051] Figure 8 is a structural schematic diagram of the flow splitter plate Figure 2 ;

[0052] Figure 9 is a structural schematic diagram of the flow collector plate Figure 1 ;

[0053] Figure 10 is a structural schematic diagram of the flow collector plate Figure 2 ;

[0054] Figure 11 is a structural schematic diagram of the cover plate Figure 1 ;

[0055] Figure 12 is a structural schematic diagram of the cover plate Figure 2 ;

[0056] Figure 13 is a structural schematic diagram of the shape characteristics of the micro-structured rib column;

[0057] Figure 14 is a structural schematic diagram of the umbrella-shaped rib column with the center of gravity coinciding and offset;

[0058] Figure 15 Structural schematic diagram of two rib columns covered with a porous capillary structure;

[0059] Figure 16 Schematic diagram of the flow direction during the flow splitting process;

[0060] Figure 17 Schematic diagram of the flow direction during the current collection process;

[0061] Figure 18 Structural schematic diagram of the sealing gasket;

[0062] Figure 19 Structural schematic diagram of the pipeline joint.

[0063] Reference numerals: 100 - Chip fixing base; 101 - Base cavity; 102 - Base connection hole; 103 - Base mounting hole;

[0064] 200 - Microstructure cold plate; 201 - Microstructure rib column; 202 - Bottom surface of the rib column; 203 - Jet cavity sealing groove; 204 - Cold plate connection hole; 205 - Jet cavity; 2011 - Capillary structure of the rib column; 2012 - Interstitial capillary structure; 2021 - Capillary structure of the bottom surface;

[0065] 300 - Flow splitting plate; 301 - Outer edge for mounting the flow splitting plate; 302 - Flow splitting groove; 303 - Flow splitting hole channel; 304 - Sprinkler structure; 305 - Jet groove; 306 - Current collection pipeline; 307 - Flow splitting cavity sealing groove; 308 - Flow splitting plate mounting hole; 309 - First flow splitting plate connection hole; 310 - Second flow splitting plate connection hole; 311 - Flow splitting cavity;

[0066] 400 - Current collection plate; 401 - Flow splitting pipeline; 402 - First sealing step; 403 - Current collection groove; 404 - Gasket positioning groove; 405 - Current collection hole channel; 406 - Current collection cavity sealing groove; 407 - Current collection plate connection hole; 408 - Current collection cavity;

[0067] 500 - Cover plate; 501 - Inlet hole channel; 502 - Second sealing step; 503 - Outlet hole channel; 504 - Cover plate connection hole;

[0068] 600 - Pipeline joint; 601 - Bottom surface of the joint;

[0069] 701 - First screw group; 702 - Second screw group; 703 - Third screw group;

[0070] 801 - First sealing washer; 802 - Second sealing washer; 803 - Sealing gasket; 8031 - First gasket avoidance hole; 8032 - Second gasket avoidance hole; 804 - Third sealing washer; 805 - Fourth sealing washer. Detailed implementation manner

[0071] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. Features such as component models, material names, connection structures, control methods, algorithms, etc. that are not clearly described in this technical solution are regarded as common technical features disclosed in the prior art.

[0072] Embodiment 1

[0073] This embodiment provides a jet cooling device, as shown in Figure 1 、 2 、3, including: a chip fixing base 100, a microstructured cold plate 200, a flow splitting plate 300, a flow collecting plate 400, a cover plate 500, and a pipeline joint 600;

[0074] A base cavity 101 is provided in the middle of the chip fixing base 100 to nest the flow splitting plate 300;

[0075] As shown in Figure 5 、 6 , the bottom surface of the microstructured cold plate 200 is attached to the chip to absorb the heat of the chip. The upper surface of the microstructured cold plate 200 is provided with microstructured rib columns 201 covering the capillary structure and rib column bottom surfaces 202. The microstructured cold plate 200 is hermetically connected to the flow splitting plate 300 by welding or screwing;

[0076] As shown in Figure 7 、 8 、16, 17, the upper part of the flow splitting plate 300 is provided with a flow splitting groove 302, and the lower part of the flow splitting plate 300 is provided with a jet groove 305. The jet groove 305 and the microstructured cold plate 200 cooperate to form a jet cavity 205. The microstructured rib columns 201 are located in the jet cavity 205. The flow splitting groove 302 is provided with staggered flow splitting channels 303 and flow collecting pipes 306 for realizing the jet and reflux of the cooling working fluid in the jet cavity 205 respectively;

[0077] As shown in Figure 9 、 10 , the bottom surface of the flow collecting plate 400 and the upper periphery of the flow splitting plate 300 form a flow splitting cavity 311 by integral molding, welding connection or screw connection. The upper part of the flow collecting plate 400 is provided with a flow collecting groove 403, and a flow splitting pipe 401 is provided at the center of the flow collecting groove 403 for communicating the flow splitting cavity 311 to realize the supply of the cooling working fluid. The bottom surface of the flow collecting plate 400 is provided with flow collecting channels 405 for communicating the flow collecting pipes 306 to realize the reflux of the cooling working fluid;

[0078] As shown in Figure 11 、 12As shown, the bottom surface of the cover plate 500 and the upper peripheral edge of the current collector plate 400 form a current collection cavity 408 through integral molding, welding connection or screw connection. An inlet hole 501 is provided at the center of the top surface of the cover plate 500 to communicate with the shunt pipe 401, and outlet holes 503 are provided on one or both sides of the inlet hole 501 to communicate with the current collection cavity 408;

[0079] The pipeline joint 600 is installed in the inlet hole 501 and the outlet hole 503 of the cover plate 500 by welding or threading to realize the connection between the jet cooling device and the external circulation pipeline.

[0080] In a specific embodiment, the micro-structured cold plate 200 and the shunt plate 300 are hermetically connected by screws. A jet cavity sealing groove 203 is provided on the outer edge of the micro-structured rib column 201 of the micro-structured cold plate 200 to install a first sealing gasket 801 for sealing. Uniformly distributed cold plate connection holes 204 are opened on the outer edge of the jet cavity sealing groove 203, and a first shunt plate connection hole 309 corresponding to the cold plate connection hole 204 is opened on the lower peripheral edge of the shunt plate 300 for connection. A second screw group 702 is provided in the cold plate connection hole 204 and the first shunt plate connection hole 309.

[0081] As Figure 4 shown, in a specific embodiment, base connection holes 102 and base mounting holes 103 are provided on the periphery of the chip fixing base 100. The jet cooling device is threadedly connected or connected by a buckle to the chip substrate through the base mounting holes 103 to realize the fitting with the chip surface;

[0082] The shunt plate 300 is provided with a shunt plate mounting outer edge 301. The bottom surface of the shunt plate mounting outer edge 301 is attached to the top surface of the chip fixing base 100 and is screw-connected through the shunt plate mounting holes 308 and the base connection holes 102. A first screw group 701 is provided in the shunt plate mounting holes 308 and the base connection holes 102.

[0083] In a specific embodiment, the shunt channels 303 and the current collection channels 306 are arranged in a staggered manner, and the shunt channels 303 and the current collection channels 306 are distributed in a centrally symmetric grid pattern with the center of the shunt groove 302 as the reference.

[0084] In a specific embodiment, a nozzle structure 304 corresponding to the shunt channel 303 is provided in the jet groove 305 to shorten the distance between the cooling working fluid and the bottom surface 202 of the rib column during the jet process; the inner diameter of the nozzle structure 304 is the same as the diameter of the shunt channel 303; the height ratio of the nozzle structure 304 to the jet cavity 205 is 20%-80%;

[0085] The microstructural rib columns 201 are arranged around the nozzle structure 304, and one or more microstructural rib columns 201 correspond to the spacing range of the nozzle structure 304.

[0086] As Figure 13 shown, in the specific implementation, the shape of the microstructural rib column 201 is selected from one or more of a rectangular cross-section column, a rectangular cross-section cone, a rectangular cross-section frustum, a trapezoidal column, a trapezoidal cone, a trapezoidal frustum, a parallelogram column, a parallelogram cone, a parallelogram frustum, a triangular column, a triangular cone, a triangular frustum, a circular column, a circular cone, a circular frustum, an elliptical column, an elliptical cone, an elliptical frustum, a hemispherical shape or an umbrella shape. In this embodiment, as Figure 14 shown, when the shape feature of the microstructural rib column 201 is an umbrella shape, the umbrella structure is divided into two parts: a head structure and a root structure, where the head structure and the root structure can be the same or different, and are each selected from a rectangular cross-section column, a rectangular cross-section cone, a rectangular cross-section frustum, a trapezoidal column, a trapezoidal cone, a trapezoidal frustum, a parallelogram column, a parallelogram cone, a parallelogram frustum, a triangular column, a triangular cone, a triangular frustum, a circular column, a circular cone, a circular frustum, an elliptical column, an elliptical cone, an elliptical frustum, a hemispherical shape or an umbrella shape.

[0087] The circumcenter of the horizontal projection profile of the root structure of the umbrella structure and the head structure can be coincident or misaligned according to design requirements; define R1 as the circumradius of the horizontal projection profile of the root structure, and R2 as the circumradius of the horizontal projection profile of the head structure. When the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2; the ratio of the circumradius size R1 of the root structure to the circumradius size R2 of the head structure is 0.1 - 10, and the height ratio of the root structure to the head structure can be adjusted to any value according to design requirements.

[0088] As Figure 15 shown, in the specific implementation, the microstructural rib column 201 is a solid rib column covered with a rib column capillary structure 2011;

[0089] When the shape feature of the microstructural rib column 201 is an umbrella shape, an additional layer of gap capillary structure 2012 is covered around its root structure.

[0090] The bottom surface 202 of the rib column is covered with a bottom surface capillary structure 2021; when the bottom surface capillary structure 2021 is 0, the bottom surface 202 of the rib column is a smooth surface.

[0091] The height ratio of the microstructural rib column 201 to the jet cavity is 0 - 1.

[0092] The rib capillary structure 2011, the gap capillary structure 2012, and the bottom capillary structure 2021 are all porous capillary structures; the composition method of the porous capillary structure is selected from one of the metal powder sintering method, the metal wire sintering method, or the mixed sintering method of metal powder and metal wire, and the thickness in different positions or regions is non-uniformly adjusted according to design requirements.

[0093] In a specific embodiment, the flow dividing plate 300, the current collecting plate 400, and the cover plate 500 are connected by screws, and the sealing and connection between the flow dividing plate 300, the current collecting plate 400, and the cover plate 500 are realized through screws and the sealing unit;

[0094] A flow dividing cavity sealing groove 307 is provided on the periphery of the flow dividing groove 302 of the flow dividing plate 300 to install the second sealing gasket 802; a gasket positioning groove 404 is provided on the bottom surface of the current collecting plate 400 to install the sealing gasket 803;

[0095] A current collecting cavity sealing groove 406 is provided on the periphery of the current collecting groove 403 of the current collecting plate 400 to install the third sealing gasket 804; a first sealing step 402 is provided on the upper end surface of the flow dividing pipe 401 of the current collecting plate 400 to install the fourth sealing gasket 805, the inlet hole 501 is a stepped hole, and a second sealing step 502 is provided on the lower end surface of the inlet hole 501 to cooperate with the first sealing step 402 to compress the fourth sealing gasket 805;

[0096] The sealing gasket 803 and the second sealing gasket 802 jointly realize the sealing of the flow dividing cavity 311; the third sealing gasket 804 and the fourth sealing gasket 805 jointly realize the sealing of the current collecting cavity 408;

[0097] The flow dividing cavity sealing groove 307 is provided with uniformly distributed second flow dividing plate connection holes 310, and the current collecting plate 400 and the cover plate 500 are provided with current collecting plate connection holes 407 and cover plate connection holes 504 corresponding to the second flow dividing plate connection holes 310 at the periphery for connection; the second flow dividing plate connection holes 310, the current collecting plate connection holes 407, and the cover plate connection holes 504 are provided with a third screw group 703;

[0098] As Figure 18 shown, the sealing gasket 803 is provided with a first gasket avoidance hole 8031 and a second gasket avoidance hole 8032; the first gasket avoidance hole 8031 is used to avoid the communication between the flow dividing pipe 401 and the flow dividing cavity 311; the second gasket avoidance hole 8032 is used to avoid the communication between the current collecting pipe 306 and the current collecting hole 404.

[0099] As Figure 19As shown, in the specific embodiment, the pipeline joint 600 is installed with the cover plate 500 by means of threads. Both the inlet hole 501 and the outlet hole 503 are threaded holes. The pipeline joint 600 is selected from one of the quick water-stop joints, tower joints, ferrule joints, and quick-connect joints with standard threads.

[0100] In the specific embodiment, the materials of the chip fixing base 100, the micro-structured cold plate 200, the flow dividing plate 300, the flow collecting plate 400, the cover plate 500, and the pipeline joint 600 are selected from one of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic, ceramic, or glass; the materials of the first sealing washer 801, the second sealing washer 803, the sealing gasket 803, the third sealing washer 804, and the fourth sealing washer 805 are selected from one of rubber, silica gel, fluororubber, or plastic.

[0101] In the specific embodiment, the cooling working medium of the jet cooling device is selected from one or more mixtures of water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oils, transformer oils, or fluorinated liquids.

[0102] As Figure 16 , 17 shown, the application principle of the present invention is as follows: The low-temperature cooling working medium flows in through the inlet pipeline joint 600 connected to the external circulation pipeline, and fills from the center to the periphery in the flow dividing cavity 311 via the connected inlet hole 501 and the flow dividing pipeline 401; the cooling working medium in the flow dividing cavity 311 jets and impacts the gaps between the micro-structured rib columns 201 in the jet cavity 205 through the flow dividing holes 303 and the nozzle structure 304 under the action of the fluid driving force, quickly takes away the heat conducted from the chip to the micro-structured cold plate 200, and then converges to the flow collecting cavity 408 via the connected flow collecting pipeline 306 and the flow collecting hole 405, and then is discharged to the external circulation pipeline via the outlet hole 503 and the outlet pipeline joint 600.

[0103] The components not elaborated in this embodiment are all existing components that can be purchased from public channels.

[0104] The above description of the embodiments is for the convenience of those of ordinary skill in the art to understand and use the invention. Those skilled in the art can obviously make various modifications to these embodiments easily and apply the general principles described herein to other embodiments without creative labor. Therefore, the present invention is not limited to the above embodiments, and the improvements and modifications made by those skilled in the art without departing from the scope of the present invention according to the disclosure of the present invention should be within the protection scope of the present invention.

Claims

1. A jet cooling device, characterized in that, Including: A chip fixing base (100), a micro-structured cold plate (200), a flow dividing plate (300), a flow collecting plate (400), a cover plate (500) and a pipeline joint (600); A base cavity (101) is arranged in the middle of the chip fixing base (100) to nest the flow dividing plate (300); The bottom surface of the micro-structured cold plate (200) is attached to the chip to absorb the heat of the chip. The upper surface of the micro-structured cold plate (200) is provided with micro-structured rib columns (201) covering the capillary structure and rib column bottom surfaces (202). The micro-structured cold plate (200) is hermetically connected to the flow dividing plate (300); The upper part of the flow dividing plate (300) is provided with a flow dividing groove (302), and the lower part of the flow dividing plate (300) is provided with a jet groove (305). The jet groove (305) cooperates with the micro-structured cold plate (200) to form a jet cavity (205). The micro-structured rib columns (201) are located in the jet cavity (205). The flow dividing groove (302) is provided with staggered flow dividing channels (303) and flow collecting pipelines (306) respectively for realizing the jet and reflux of the cooling working medium in the jet cavity (205); The bottom surface of the flow collecting plate (400) is connected to the upper peripheral edge of the flow dividing plate (300) to form a flow dividing cavity (311). The upper part of the flow collecting plate (400) is provided with a flow collecting groove (403). The center of the flow collecting groove (403) is provided with a flow dividing pipeline (401) for communicating the flow dividing cavity (311) to realize the supply of the cooling working medium. The bottom surface of the flow collecting plate (400) is provided with flow collecting channels (405) for communicating the flow collecting pipelines (306) to realize the reflux of the cooling working medium; The bottom surface of the cover plate (500) is connected to the upper peripheral edge of the flow collecting plate (400) to form a flow collecting cavity (408). The center of the top surface of the cover plate (500) is provided with an inlet channel (501) for communicating the flow dividing pipeline (401). One side or both sides of the inlet channel (501) are provided with outlet channels (503) for communicating the flow collecting cavity (408); The pipeline joint (600) is installed in the inlet channel (501) and the outlet channel (503) of the cover plate (500) to realize the connection between the jet cooling device and the external circulation pipeline.

2. The jet cooling device according to claim 1, characterized in that, The peripheral edge of the chip fixing base (100) is provided with a base connection hole (102) and a base mounting hole (103). The jet cooling device is connected to the chip substrate through the base mounting hole (103) to realize the fitting with the chip surface; The flow dividing plate (300) is provided with a flow dividing plate mounting outer edge (301). The bottom surface of the flow dividing plate mounting outer edge (301) is attached to the top surface of the chip fixing base (100) and is screwed to the base connection hole (102) through a flow dividing plate mounting hole (308). A first screw group (701) is arranged in the flow dividing plate mounting hole (308) and the base connection hole (102).

3. A jet cooling device according to claim 1, characterized in that, The flow dividing channels (303) and the flow collecting pipelines (306) are arranged in a staggered manner, and the flow dividing channels (303) and the flow collecting channels (306) are distributed in a centrosymmetric grid pattern with the center of the flow dividing groove (302) as the reference.

4. A jet cooling device according to claim 1, characterized in that, A nozzle structure (304) corresponding to the flow splitting channel (303) is arranged in the jet groove (305) to shorten the distance between the cooling working medium and the bottom surface (202) of the rib column during the jetting process; the inner diameter of the nozzle structure (304) is the same as the diameter of the flow splitting channel (303); the height ratio of the nozzle structure (304) to the jet cavity (205) is 20%-80%; The microstructured rib columns (201) are arranged around the nozzle structure (304), and one or more microstructured rib columns (201) correspond to the spacing range of the nozzle structure (304).

5. A jet cooling device according to claim 1, characterized in that, The shape of the microstructured rib columns (201) is selected from one or more of a column with a rectangular cross-section, a cone with a rectangular cross-section, a frustum with a rectangular cross-section, a column with a trapezoidal cross-section, a cone with a trapezoidal cross-section, a frustum with a trapezoidal cross-section, a column with a parallelogram cross-section, a cone with a parallelogram cross-section, a frustum with a parallelogram cross-section, a column with a triangular cross-section, a cone with a triangular cross-section, a frustum with a triangular cross-section, a column with a circular cross-section, a cone with a circular cross-section, a frustum with a circular cross-section, a column with an elliptical cross-section, a cone with an elliptical cross-section, a frustum with an elliptical cross-section, a hemisphere or an umbrella shape.

6. The jet cooling device according to claim 5, characterized in that, When the shape of the microstructured rib column (201) is an umbrella shape, it includes a root part and a head part arranged on the microstructured cold plate (200) from the inside to the outside; Among them, the root part and the head part have the same or different structures, and are each selected from one or more of the shapes of a column with a rectangular cross-section, a cone with a rectangular cross-section, a frustum with a rectangular cross-section, a column with a trapezoidal cross-section, a cone with a trapezoidal cross-section, a frustum with a trapezoidal cross-section, a column with a parallelogram cross-section, a cone with a parallelogram cross-section, a frustum with a parallelogram cross-section, a column with a triangular cross-section, a cone with a triangular cross-section, a frustum with a triangular cross-section, a column with a circular cross-section, a cone with a circular cross-section, a frustum with a circular cross-section, a column with an elliptical cross-section, a cone with an elliptical cross-section, a frustum with an elliptical cross-section, a hemisphere, etc.

7. The jet cooling device according to claim 6, characterized in that The circumscribed circle centers of the horizontal projection contours of the root part and the head part coincide or are offset. Denote the radius of the circumscribed circle of the horizontal projection contour of the root part as R1, and denote the radius of the circumscribed circle of the horizontal projection contour of the head part as R2. The ratio of R1 to R2 is 0.1-10; when the root part and the head part are offset, the offset distance is less than or equal to the sum of R1 and R2.

8. The jet cooling device according to claim 6, wherein, When the shape of the microstructured rib column (201) is an umbrella shape, a gap capillary structure (2012) covers the periphery of the root part of the microstructured rib column (201).

9. The jet cooling device according to claim 1, characterized in that, The microstructured rib column (201) is a solid rib column covered with a rib column capillary structure (2011), and the percentage of the thickness of the rib column capillary structure (2011) in the total thickness of the microstructured rib column (201) is 0%-100%; the bottom surface (202) of the rib column is covered with a bottom surface capillary structure (2021).

10. A jet cooling device according to claim 1, characterized in that, The height ratio of the microstructured rib column (201) to the jet cavity is 0-1.

Images