Window manufacturing apparatus and window manufacturing method using same

The window manufacturing method and apparatus address the challenge of maintaining display quality and folding performance by using a fixture with a curved or sloped surface to control the etching process, resulting in windows with smooth thin regions and enhanced surface characteristics.

CN120309181APending Publication Date: 2025-07-15SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
CN202510057517.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-10-10
Filing Date
2025-01-14
Publication Date
2025-07-15

AI Technical Summary

Technical Problem

The prior art is difficult to effectively manufacture windows with good folding performance and do not affect display quality, and it is difficult to control the shape and surface characteristics of the windows.

Method used

A window manufacturing device is employed, which includes a fixing fixture and an etching solution supply component having a curved or inclined surface, an etching solution supply component for receiving portions of the placement surface, by bending the base glass and fixing it to the placement surface of the fixing fixture, and then exposing the base glass in the etching solution to form a thinned area.

Benefits of technology

It realizes efficient manufacturing of windows with improved surface characteristics, controllable shape of thinned areas, omitting pretreatment and post-treatment processes, and improving process efficiency and display quality.

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Abstract

The present disclosure relates to a window manufacturing apparatus and a window manufacturing method using the same, the window manufacturing apparatus including: a fixing jig having a seating surface on which a workpiece is fixed, where the seating surface includes a curved surface or an inclined surface; and an etching solution supply member disposed below the fixing jig, in which a storage member is defined in the etching solution supply member to accommodate at least a portion of the seating surface.
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Description

[0001] Cross - Reference to Related Applications

[0002] This application claims priority and all rights arising therefrom to Korean Patent Application No. 10-2024-0006149, filed on January 15, 2024, and Korean Patent Application No. 10-2024-0137281, filed on October 10, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] In the present disclosure, the present disclosure relates to a window manufacturing apparatus and a window manufacturing method, and more particularly, to a window manufacturing apparatus for manufacturing a window including a partially thinned area and a window manufacturing method using the window manufacturing apparatus. Background Art

[0004] Various types of electronic devices are being used to provide image information, and recently, electronic devices including flexible display panels capable of being folded or bent have been developed. Different from rigid electronic devices, flexible electronic devices can be folded, curled, or bent into various shapes, and thus can be carried regardless of the screen size for displaying an image. Summary of the Invention

[0005] Flexible electronic devices generally include a window to protect the display panel and not hinder folding or bending operations. Therefore, it is desirable to develop a manufacturing method and a manufacturing apparatus for manufacturing a window having good folding performance and surface characteristics that do not affect display quality.

[0006] Embodiments of the present disclosure provide a manufacturing method and a manufacturing apparatus for manufacturing a window having improved surface characteristics.

[0007] Embodiments of the present disclosure also provide a window manufacturing method and a window manufacturing apparatus having high process efficiency and being easy to control the shape of the thinned area of the window.

[0008] Embodiments of the present invention provide a window manufacturing apparatus including: a fixing jig having a placement surface on which a workpiece is fixed, wherein the placement surface includes a curved surface or an inclined surface; and an etching solution supply member disposed below the fixing jig, wherein a storage member is defined in the etching solution supply member to accommodate at least a portion of the placement surface.

[0009] In an embodiment, the placement surface may protrude toward the storage member and include the curved surface or the inclined surface without interruption.

[0010] In an embodiment, the position of the fixing jig may be adjusted such that at least a portion of the placement surface is located in the storage member.

[0011] In an embodiment, a vacuum suction inlet may be defined on the placement surface.

[0012] In an embodiment, the fixing jig may include a groove portion that is recessed toward the storage member and extends in one direction.

[0013] In an embodiment, the placement surface may define the groove portion.

[0014] In an embodiment, a vacuum suction inlet may be defined on the placement surface.

[0015] In an embodiment, the groove portion may include the curved surface or the inclined surface without interruption.

[0016] In an embodiment, the fixing jig may be completely accommodated in the storage member.

[0017] In an embodiment, the etching solution provided in the storage member may be maintained at a constant liquid level, or the liquid level of the etching solution in the storage member may be adjusted over time.

[0018] In an embodiment of the present invention, there is provided a window manufacturing method using a window manufacturing apparatus, the window manufacturing apparatus including: a fixing jig having a placement surface including a curved surface or an inclined surface; and an etching solution supply member disposed below the fixing jig, and a storage member being defined in the etching solution supply member to accommodate at least a portion of the placement surface. The window manufacturing method according to an embodiment of the present invention includes: bending a base glass to include a bent portion corresponding to the placement surface; fixing the bent base glass to the placement surface of the fixing jig; supplying an etching solution to the storage member of the etching solution supply member; and exposing the base glass fixed to correspond to the curved surface or the inclined surface to the etching solution.

[0019] In an embodiment, the exposing the base glass to the etching solution may include etching one exposed surface of the base glass to form a window, wherein a recessed portion including the curved surface or the inclined surface is defined without interruption on the surface provided with the etching solution.

[0020] In an embodiment, the exposing the base glass to the etching solution may include controlling at least one selected from the time of exposure to the etching solution and the amount of the etching solution to be provided according to the position of the base glass.

[0021] In an embodiment, when the bent portion is fixed to the placement surface, the remaining portions of the base glass that are spaced apart from each other and between which the bent portion is interposed may be located in a direction in which the remaining portions are spaced apart from the storage member.

[0022] In an embodiment, the placement surface to which the base glass is fixed may have a shape protruding toward the storage member, and exposing the base glass to the etching solution may include dipping one surface of the base glass into the etching solution of the storage member.

[0023] In an embodiment, when the base glass is exposed to the etching solution, the thickness of the base glass dipped into the etching solution may gradually decrease from the central portion of the fixing jig toward the outer edge of the fixing jig.

[0024] In an embodiment, the placement surface to which the base glass is fixed may define a groove portion recessed in a direction toward the storage member, and exposing the base glass to the etching solution may include accommodating the fixing jig to which the base glass is fixed in the storage member to supply the etching solution to a portion of the base glass.

[0025] In an embodiment, exposing the base glass to the etching solution may include controlling the liquid level of the etching solution supplied to the storage member.

[0026] In an embodiment, the window manufacturing method may further include: attaching a protective film to one surface of the base glass before bending the base glass.

[0027] In an embodiment, when the base glass is fixed to the placement surface of the fixing jig, the protective film may be attached to the placement surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present invention and, together with the description, are used to explain the principles of the present invention. In the drawings:

[0029] Figure 1A is a perspective view showing an unfolded state of an electronic device according to an embodiment of the present invention;

[0030] Figure 1B is a perspective view showing Figure 1A the inner folding process of the electronic device according to an embodiment of the present invention shown in

[0031] Figure 1C is a perspective view showing Figure 1APerspective view of the external folding process of an electronic device according to an embodiment of the present invention as shown;

[0032] Figure 2A is a perspective view showing the unfolded state of an electronic device according to an embodiment of the present invention;

[0033] Figure 2B is showing Figure 2A Perspective view of the internal folding process of an electronic device according to an embodiment of the present invention as shown;

[0034] Figure 2C is showing Figure 2A Perspective view of the external folding process of an electronic device according to an embodiment of the present invention as shown;

[0035] Figure 3A is a perspective view showing the unfolded state of an electronic device according to an embodiment of the present invention;

[0036] Figure 3B and Figure 3C each of which is Figure 3A Perspective view of the electronic device shown in the multi-folded state;

[0037] Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present invention;

[0038] Figure 5 is a cross-sectional view showing a part of an electronic device according to an embodiment of the present invention;

[0039] Figure 6A and Figure 6B each of which is a cross-sectional view of a window according to an embodiment of the present invention;

[0040] Figure 7 is a perspective view of a window manufacturing device according to an embodiment of the present invention;

[0041] Figure 8A and Figure 8B each of which is a cross-sectional view showing a fixing jig according to an embodiment of the present invention;

[0042] Figure 9 is a cross-sectional view of a part of a window manufacturing device according to an embodiment of the present invention;

[0043] Figure 10 is a perspective view of a window manufacturing device according to an embodiment of the present invention;

[0044] Figure 11A and Figure 11B each of which is a cross-sectional view of a fixing jig according to an embodiment of the present invention;

[0045] Figure 12is a cross-sectional view of a window manufacturing apparatus according to an embodiment of the present invention;

[0046] Figure 13 is a flowchart of a window manufacturing method according to an embodiment of the present invention;

[0047] Figures 14A to 14D Each of shows a process of a window manufacturing method according to an embodiment of the present invention;

[0048] Figures 15A to 15D Each of shows a process of a window manufacturing method according to an embodiment of the present invention; and

[0049] Figures 16A to 16C Each of shows a process of a window manufacturing method according to an embodiment of the present invention. Detailed Description

[0050] The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which various embodiments are shown. However, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. Like reference numerals always denote like elements.

[0051] In this specification, it will be understood that when an element (or region, layer, part, etc.) is referred to as being "on", "connected to", or "coupled to" another element, the element may be directly on, connected to, or coupled to the other element, or there may be intervening elements between the element and the other element.

[0052] Like reference numerals always refer to like elements. Further, in the drawings, the thickness, ratio, and dimensions of elements are exaggerated for effective description of the technical content.

[0053] It will be understood that although terms such as "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the present invention, a first element may be referred to as a second element. Similarly, a second element may also be referred to as a first element.

[0054] In addition, terms (such as "under", "below", "above", and "on", etc.) are used herein to describe the relationship of one element to another element (s) as shown in the drawings. The above terms are relative concepts and are described based on the directions indicated in the drawings.

[0055] The terms used in this specification are for the purpose of describing particular embodiments only and are not intended to be limiting. Unless the context clearly dictates otherwise, as used herein, "a," "one," "the," and "at least one" do not denote a limitation of quantity and are intended to include both the singular and the plural. Thus, a reference to "a" element followed by a reference to "the" element in a claim includes one element and a plurality of elements. For example, "a" element has the same meaning as "at least one" element, unless the context clearly dictates otherwise. "At least one" should not be construed as limiting "a" or "one." "Or" means "and / or." As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It will also be understood that when used in this specification, the terms "comprises" and / or "comprising," or "includes" and / or "including" specify the presence of the stated features, regions, wholes, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, regions, wholes, steps, operations, elements, components, and / or groups thereof.

[0056] In this specification, the expression "directly disposed" may mean that no layer, film, region, plate, etc. is added between a part and another part of a layer, film, region, plate, etc. For example, the expression "directly disposed" may mean disposed between two layers or two members, and no additional member such as an adhesive member is interposed between the two layers or two members.

[0057] In this specification, the expression "a region / portion corresponds to another region / portion" means that "the region / portion overlaps with the other region / portion," but the expression is not limited to having the same area and / or the same shape. Further, in this specification, the expression "a region / portion overlaps with another region / portion" includes the case where the regions / portions indicated as overlapping with each other at least partially overlap with each other when observed in a plan view.

[0058] Taking into account the measurements under discussion and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), as used herein, "about" or "approximate" includes the stated value and means within the acceptable deviation for a particular value as determined by a person of ordinary skill in the art. For example, the term "about" may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0059] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will also be understood that terms, such as those defined in a general dictionary, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0060] Embodiments are described herein with reference to cross-sectional views, which are schematic views of idealized embodiments. As such, variations in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are to be expected. Accordingly, the embodiments described herein should not be construed as limited to the particular shapes of the regions shown herein but include shape deviations that result, for example, from manufacturing. For example, regions illustrated or described as flat may typically have rough and / or non-linear features. Additionally, sharp angles shown in the figures may be rounded. Thus, the regions shown in the figures are schematic in nature and their shapes are not intended to illustrate the exact shape of the regions and are also not intended to limit the scope of the claims.

[0061] Hereinafter, an electronic device according to an embodiment of the present invention, a window manufacturing device according to an embodiment of the present invention, and a window manufacturing method according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0062] Figures 1A to 5 An electronic device according to an embodiment of the present invention is shown, and Figures 1A to 5 the electronic device according to an embodiment of the present invention shown therein includes a window manufactured by a window manufacturing device according to an embodiment of the present invention and a window manufacturing method according to an embodiment of the present invention, which will be described later.

[0063] Figure 1A is a perspective view showing an unfolded state of an electronic device ED according to an embodiment of the present invention. Figure 1B is a view showing Figure 1A a perspective view of an inner folding process of the electronic device ED according to an embodiment of the present invention shown therein. Figure 1C is a view showing Figure 1A a perspective view of an outer folding process of the electronic device ED according to an embodiment of the present invention shown therein.

[0064] The electronic device ED according to an embodiment of the present invention can be activated according to an electrical signal. In an embodiment, for example, the electronic device ED may be a mobile phone, a tablet computer, a car navigation system, a gaming machine, or a wearable device, but the embodiments of the present invention are not limited thereto. In an embodiment, as Figure 1A shown therein, the electronic device ED may be a mobile phone, but is not limited thereto.

[0065] Referring to Figures 1A to 1C, an electronic device ED according to an embodiment of the present invention may include a first display surface FS in a plane defined by a first direction axis (or first direction) DR1 and a second direction axis (or second direction) DR2 intersecting the first direction axis DR1. The electronic device ED may provide an image IM to a user through the first display surface FS. The electronic device ED according to an embodiment of the present invention may display the image IM in the first display surface FS parallel to each of the first direction axis DR1 and the second direction axis DR2 toward a third direction axis (or third direction) DR3. In the present disclosure, the front (or upper) surface and the rear (or lower) surface of each component are defined based on the direction in which the image IM is displayed. The front surface and the rear surface may be opposite to each other on the third direction axis DR3, and the normal direction of each of the front surface and the rear surface may be parallel to the third direction axis DR3. Here, the third direction axis DR3 may correspond to the thickness direction of the electronic device ED.

[0066] An electronic device ED according to an embodiment of the present invention may include a first display surface FS and a second display surface RS. The first display surface FS may include an electronic module area EMA. The second display surface RS may be defined as a surface opposite to at least a part of the first display surface FS. In other words, the second display surface RS may be defined as a part of the rear surface of the electronic device ED.

[0067] An electronic device ED according to an embodiment of the present invention may sense an external input applied from the outside. The external input may include various types of inputs provided from the outside of the electronic device ED. In an embodiment, for example, the external input may not only include a touch by a part of the body (such as a user's hand), but may also include an external input (such as hovering) applied at a position close to the electronic device ED or at a predetermined short distance from the electronic device ED. In addition, the external input may have various forms, such as force (e.g., pressure), temperature, and light.

[0068] In Figure 1A and the following drawings, the first direction axis DR1 to the third direction axis DR3 are shown, and the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 described in this specification are relative concepts and may be converted to other directions. In addition, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 may be described as the first direction to the third direction, and the same reference numerals may be used for the first direction to the third direction.

[0069] The first display surface FS of the electronic device ED may include an active area activated according to an electrical signal. The electronic device ED according to an embodiment of the present invention may display an image IM through the first display surface FS. In addition, the first display surface FS may sense various types of external inputs.

[0070] The electronic device ED may include a folding area FA1 and non-folding areas NFA1 and NFA2. In an embodiment of the present invention, the non-folding areas NFA1 and NFA2 may be provided adjacent to the folding area FA1, and the folding area FA1 may be interposed between the non-folding areas NFA1 and NFA2. The electronic device ED according to an embodiment of the present invention may include a first non-folding area NFA1 and a second non-folding area NFA2 that are spaced apart from each other on a first direction axis DR1, and the folding area FA1 may be interposed between the first non-folding area NFA1 and the second non-folding area NFA2. In an embodiment, for example, the first non-folding area NFA1 may be provided on one side of the folding area FA1 along the first direction DR1, and the second non-folding area NFA2 may be provided on the other side of the folding area FA1 along the first direction DR1.

[0071] Although Figures 1A to 1C an embodiment of the electronic device ED including one folding area FA1 is shown, embodiments of the present invention are not limited thereto, and multiple folding areas may be defined in the electronic device ED. For example, the electronic device ED according to an embodiment of the present invention may include two or more folding areas, and may also include three or more non-folding areas, and each of the multiple folding areas may be interposed between the non-folding areas.

[0072] Referring to Figure 1B , the electronic device ED according to an embodiment of the present invention may be folded based on a first folding axis FX1. The first folding axis FX1 is a virtual axis extending on a second direction axis DR2, and the first folding axis FX1 may be parallel to the long side direction of the electronic device ED. The first folding axis FX1 may extend along the second direction axis DR2 on a first display surface FS.

[0073] The electronic device ED may be folded based on the first folding axis FX1, and may be converted into an inner folding state in which an area of the first display surface FS overlapping the first non-folding area NFA1 and another area of the first display surface FS overlapping the second non-folding area NFA2 face each other.

[0074] A second display surface RS of the electronic device ED according to an embodiment of the present invention may be visually recognized by a user in the inner folding state. The second display surface RS may also include an electronic module area in which an electronic module including various components is provided, and the present invention is not limited to any one embodiment.

[0075] Referring to Figure 1C, according to an embodiment of the present invention, the electronic device ED can be folded based on the first folding axis FX1 and can be converted into an outer folding state in which one region of the second display surface RS overlapping the first non-folding region NFA1 and another region of the second display surface RS overlapping the second non-folding region NFA2 face each other.

[0076] However, the embodiments of the present invention are not limited thereto, and the electronic device ED can be folded based on multiple folding axes such that a part of the first display surface FS and a part of the second display surface RS face each other, and the number of folding axes and the number of non-folding regions according to the present invention are not particularly limited.

[0077] Various electronic modules can be provided in the electronic module area EMA. In an embodiment, for example, the electronic module may include at least one selected from a camera, a speaker, a light sensor, and a thermal sensor. The electronic module area EMA can sense an external object received through the first display surface FS or the second display surface RS, or provide a sound signal such as voice to the outside through the first display surface FS or the second display surface RS. The electronic module may include multiple components and is not limited to any one embodiment.

[0078] Figure 2A is a perspective view showing an unfolded state of the electronic device ED-a according to an embodiment of the present invention. Figure 2B is a view showing Figure 2A a perspective view of the inner folding process of the electronic device ED-a shown in according to an embodiment of the present invention. Figure 2C is a view showing Figure 2A a perspective view of the outer folding process of the electronic device ED-a shown in according to an embodiment of the present invention.

[0079] According to an embodiment of the present invention, the electronic device ED-a can be folded based on the second folding axis FX2 parallel to the second direction axis DR2. Figure 2B shows a case where the extending direction of the second folding axis FX2 is parallel to the extending direction of the short side of the electronic device ED-a. However, the embodiments of the present invention are not limited thereto.

[0080] According to an embodiment of the present invention, the electronic device ED-a may include at least one folding region FA2 and non-folding regions NFA3 and NFA4 adjacent to the folding region FA2. The non-folding regions NFA3 and NFA4 may be provided to be spaced apart from each other, and the folding region FA2 is interposed between the non-folding regions NFA3 and NFA4.

[0081] The folding region FA2 has a predetermined curvature and a predetermined radius of curvature. In an embodiment of the present invention, the first non-folding region NFA3 and the second non-folding region NFA4 may face each other, and the electronic device ED-a may be folded inward so that the first display surface FS is not exposed to the outside. In addition, referring to Figure 2C , in an embodiment of the present invention, the electronic device ED-a may be folded outward so that the first display surface FS is exposed to the outside.

[0082] The electronic device ED-a according to an embodiment of the present invention may include a second display surface RS, and the second display surface RS may be defined as a surface opposite to at least a part of the first display surface FS. The second display surface RS may include an electronic module area EMA in which an electronic module including various components is provided. In addition, an image or video may be displayed on at least a part of the second display surface RS.

[0083] In an embodiment of the present invention, the first display surface FS of the electronic device ED-a may be visible to the user in the unfolded state, and its second display surface RS may be visible to the user in the inward-folded state.

[0084] Figure 3A is a perspective view showing the unfolded state of the electronic device ED-b according to an embodiment of the present invention. Figure 3B and Figure 3C each of which is Figure 3A a perspective view of the electronic device ED-b shown in

[0085] Referring to Figures 3A to 3C , the electronic device ED-b according to an embodiment of the present invention may be a multi-foldable device including a plurality of folding regions. The electronic device ED-b may include a plurality of folding regions FAa-1 and FAa-2 and a plurality of non-folding regions NFAa-1, NFAa-2, and NFAa-3. The electronic device ED-b according to an embodiment of the present invention may include a first folding region FAa-1, a second folding region FAa-2, a first non-folding region NFAa-1, a second non-folding region NFAa-2, and a third non-folding region NFAa-3. In the first direction DR1, the first folding region FAa-1 is disposed between the first non-folding region NFAa-1 and the second non-folding region NFAa-2, and the second folding region FAa-2 is disposed between the second non-folding region NFAa-2 and the third non-folding region NFAa-3. Figures 3A to 3C An embodiment including two folding regions FAa-1 and FAa-2 and three non-folding regions NFAa-1, NFAa-2, and NFAa-3 is shown as an example, but the number of folding regions and non-folding regions is not limited thereto and may be further increased.

[0086] Reference Figure 3A and Figure 3B , the first folding region FAa-1 can be folded based on a third folding axis FX3 parallel to the second direction DR2. The first folding region FAa-1 can be folded outward such that the rear surface of the second non-folding region NFAa-2 faces the rear surface of the first non-folding region NFAa-1, and the display surface of the first non-folding region NFAa-1 faces the outside. The second folding region FAa-2 can be folded based on a fourth folding axis FX4 parallel to the second direction DR2. The second folding region FAa-2 can be folded inward such that the display surfaces of the second non-folding region NFAa-2 and the third non-folding region NFAa-3 face each other.

[0087] Reference Figure 3A and 3C , the second folding region FAa-2 can be folded based on a fourth folding axis FX4 parallel to the second direction DR2. The electronic device ED-b can be folded inward such that the display surface of the second non-folding region NFAa-2 is disposed inside, and the display surfaces of the third non-folding region NFAa-3 and the second non-folding region NFAa-2 face each other. The first folding region FAa-1 can be folded based on a third folding axis FX3 parallel to the second direction DR2. The electronic device ED-b can be folded inward such that the rear surface of the third non-folding region NFAa-3 and the display surface of the first non-folding region NFAa-1 face each other.

[0088] It should be understood that the multi-fold state is not limited to Figure 3B and Figure 3C the forms shown in, and the electronic device ED-b according to an embodiment of the present invention can have various folding forms.

[0089] In an embodiment of the present invention, an outward folding operation and an inward folding operation can occur simultaneously, and only one of the outward folding operation and the inward folding operation can occur.

[0090] In an embodiment of the present invention, the electronic device ED, ED-a or ED-b can be configured such that an inward folding operation or an outward folding operation is alternately repeated from an unfolding operation, but the embodiments of the present invention are not limited thereto. In an embodiment of the present invention, the electronic device ED, ED-a or ED-b can be configured to perform an unfolding operation, an inward folding operation or an outward folding operation. In an embodiment in which a plurality of folding regions are provided, the folding direction of at least one of the plurality of folding regions can be different from the folding directions of the remaining folding regions. In an embodiment, for example, when two folding regions are provided, one folding region between two non-folding regions can be folded by an inward folding operation, and the remaining one folding region between two non-folding regions can be folded by an outward folding operation.

[0091] Figure 4 is an exploded perspective view of an electronic device ED according to an embodiment of the present invention. Figure 5 is a cross-sectional view showing a part of the electronic device ED according to an embodiment of the present invention. Figure 5 is a view showing corresponding to Figure 1A a cross-sectional view of a part of line I-I'.

[0092] Figure 4 and Figure 5 etc. show embodiments in which Figure 1A the first folding axis FX1 of the electronic device ED shown in etc. is parallel to the long side of the electronic device ED, but the embodiments of the present invention are not limited thereto, and the content described below with reference to the drawings can be applied to cases where Figure 2A the second folding axis FX2 shown in etc. is parallel to the short side of the electronic device ED-a, or can also be applied to a multi-folded electronic device ED-b shown in Figure 3A etc.

[0093] The electronic device ED according to an embodiment of the present invention may include a display module DM, a window module WM, and a housing HAU that houses the display module DM and the window module WM.

[0094] The display module DM may include a display panel DP and a lower module LM disposed below the display panel DP. The lower module LM may include a support plate MP. In addition, in an embodiment of the present invention, in addition to the support plate MP, the lower module LM of the display module DM may further include at least one selected from a protective layer PF, a support member SP, adhesive layers AP1, AP2, AP3, and AP4, and a digitizer module DTM.

[0095] The display panel DP may display an image based on an electrical signal and transmit / receive information about an external input. The display panel DP may include a display area DP-DA and a non-display area DP-NDA. The display area DP-DA may be defined as an area that emits an image provided by the display panel DP.

[0096] The non-display area DP-NDA is adjacent to the display area DP-DA. In an embodiment, for example, the non-display area DP-NDA may surround the display area DP-DA. However, this is shown only as an example, and the non-display area DP-NDA may be defined in various shapes and is not limited to any one embodiment. In addition, the display panel DP may include a non-display bending portion NDA-BP provided on at least one side of the non-display area DP-NDA. The non-display bending portion NDA-BP may be bent toward the lower side of the display module DM and arranged to overlap at least a part of the display panel DP. A circuit layer, a connection line, a circuit board, etc. for displaying an image or transmitting / receiving information may be mounted on or attached to the non-display bending portion NDA-BP.

[0097] In an embodiment of the present invention, the display panel DP includes a display layer EDL. The display layer EDL may be a component that basically generates an image. The image generated by the display layer EDL may be viewed by an external user through a first display surface FS (see Figure 1A ). The display layer EDL may be a light-emitting display layer. In an embodiment, for example, the display layer EDL may be an organic light-emitting display layer or an inorganic light-emitting display layer. The organic light-emitting display layer may include a light-emitting element including an organic light-emitting material in a light-emitting layer. The inorganic light-emitting display layer may include a light-emitting element containing an inorganic material. And the display layer EDL may include quantum dots and quantum rods in the light-emitting layer.

[0098] The display panel DP may further include a sensor layer ISL. The sensor layer ISL may be directly provided on the display layer EDL. The sensor layer ISL may include a plurality of sensing electrodes. The sensor layer ISL may sense an external input by a self-capacitance method or a mutual-capacitance method. The sensor layer ISL may sense an input through an active input device.

[0099] In an embodiment, for example, when manufacturing the display layer EDL, the sensor layer ISL may be directly formed on the display layer EDL through a continuous process. However, the embodiments of the present invention are not limited thereto, and the sensor layer ISL may be manufactured as a panel separate from the display layer EDL, and then may be attached to the display layer EDL through an adhesive layer (not shown).

[0100] In addition, the display panel DP may further include an optical layer ROL. The optical layer ROL may have a function of reducing the reflection of external light. In an embodiment, for example, the optical layer ROL may include a polarization layer or a color filter layer. However, the embodiments of the present invention are not limited thereto, and the optical layer ROL may include optical members for improving the display quality of the display module DM.

[0101] In an embodiment of the present invention, the optical layer ROL may be directly disposed on the sensor layer ISL. Additionally, when the sensor layer ISL is omitted from the display panel DP, the optical layer ROL may be directly disposed on the display layer EDL. However, embodiments of the present invention are not limited thereto, and the optical layer ROL may be disposed on the display layer EDL or the sensor layer ISL using a separate adhesive member.

[0102] The display panel DP may include a foldable display portion FP-D and non-foldable display portions NFP1-D and NFP2-D. The foldable display portion FP-D may correspond to the folding region FA1 (see Figure 1A ), and the non-foldable display portions NFP1-D and NFP2-D may correspond to the non-folding regions NFA1 and NFA2 (see Figure 1A ). The foldable display portion FP-D and the non-foldable display portions NFP1-D and NFP2-D of the display panel DP may be referred to as the foldable display portion and the non-foldable display portions of the display module DM, respectively.

[0103] The foldable display portion FP-D may correspond to the portion that is folded or bent based on the first folding axis FX1 (see Figure 1B ). The display panel DP may include a first non-foldable display portion NFP1-D and a second non-foldable display portion NFP2-D, and the first non-foldable display portion NFP1-D and the second non-foldable display portion NFP2-D may be spaced apart from each other in the first direction DR1, and the foldable display portion FP-D may be interposed between the first non-foldable display portion NFP1-D and the second non-foldable display portion NFP2-D. The foldable display portion FP-D may correspond to the folding region FA1 of the electronic device ED, and the first non-foldable display portion NFP1-D and the second non-foldable display portion NFP2-D may correspond to the first non-folding region NFA1 and the second non-folding region NFA2 of the electronic device ED, respectively.

[0104] In an embodiment of the present invention, the support plate MP may be disposed under the display panel DP. The support plate MP may include a foldable support portion FP-MP and non-foldable support portions NFP1-MP and NFP2-MP. The first non-foldable support portion NFP1-MP and the second non-foldable support portion NFP2-MP of the support plate MP may be spaced apart from each other in the first direction DR1, and the foldable support portion FP-MP may be interposed between the first non-foldable support portion NFP1-MP and the second non-foldable support portion NFP2-MP. The foldable support portion FP-MP may correspond to the folding region FA1 (see Figure 1A ), and the non-foldable support portions NFP1-MP and NFP2-MP may correspond to the non-folding regions NFA1 and NFA2 (see Figure 1A)。The support plate MP may include a pattern portion PTA in which a plurality of openings OH are defined. The pattern portion PTA may be included in the folding support portion FP-MP. Since the pattern portion PTA is provided to correspond to the folding region FA1, the folding or bending characteristics of the electronic device ED can be improved.

[0105] In the display module DM according to an embodiment of the present invention, the protective layer PF of the lower module LM may be provided between the display panel DP and the support plate MP. The protective layer PF may be provided under the display panel DP to protect the rear surface of the display panel DP. The protective layer PF may completely overlap the display panel DP. The protective layer PF may include a polymer material. In an embodiment, for example, the protective layer PF may be a polyimide film or a polyethylene terephthalate film. However, this is only an example, and the material of the protective layer PF is not limited thereto.

[0106] In an embodiment of the present invention, the lower module LM may include a support member SP. The support member SP may include support layers SP1 and SP2. The support layers SP1 and SP2 may include a first support layer SP1 and a second support layer SP2 that are spaced apart from each other in the direction of the first direction axis DR1. The first support layer SP1 and the second support layer SP2 may be spaced apart from each other in a portion corresponding to the first folding axis FX1 (see Figure 1B ). In such an embodiment where the support layers SP1 and SP2 are provided to be spaced apart from each other in a portion overlapping the folding region FA1, the folding or bending characteristics of the electronic device ED can be improved. In an embodiment, although not shown, the support layers SP1 and SP2 may further include a buffer layer (not shown) and a lower support plate (not shown) stacked in the thickness direction.

[0107] The electronic device ED according to an embodiment of the present invention may further include a digitizer module DTM provided under the support plate MP. The digitizer module DTM according to an embodiment of the present invention may include a digitizer layer and a shielding layer, etc. The digitizer module DTM may be included in the configuration of the lower module LM.

[0108] The digitizer module DTM may include a first digitizer module DTM1 and a second digitizer module DTM2 that are spaced apart from each other in a portion overlapping the folding region FA1. The first digitizer module DTM1 may be provided to correspond to the first non-folding region NFA1, and the second digitizer module DTM2 may be provided to correspond to the second non-folding region NFA2.

[0109] That is, in an embodiment of the present invention, the first digitizer module DTM1 and the second digitizer module DTM2 may be spaced apart from each other in a region overlapping with the foldable display portion FP-D. The first digitizer module DTM1 may overlap with the first non-foldable display portion NFP1-D, and the second digitizer module DTM2 may overlap with the second non-foldable display portion NFP2-D.

[0110] In addition, the electronic device ED according to an embodiment of the present invention may include at least one selected from the adhesive layers AP1, AP2, AP3, and AP4. In an embodiment, for example, the first adhesive layer AP1 may be disposed between the display panel DP and the protective layer PF, and the second adhesive layer AP2 may be disposed between the protective layer PF and the support plate MP. The third adhesive layer AP3 and the fourth adhesive layer AP4 may be disposed between the support plate MP and the support member SP. At least one selected from the adhesive layers AP1, AP2, AP3, and AP4 may be an optically clear adhesive film or an optically clear adhesive resin layer. However, embodiments of the present invention are not limited thereto, and at least one of the adhesive layers AP1, AP2, AP3, and AP4 may have a low transmittance of 80% or less.

[0111] In Figure 4 and Figure 5 etc., an embodiment in which the lower module LM includes all of the protective layer PF, the support plate MP, the support member SP, the adhesive layers AP1, AP2, AP3, and AP4, and the digitizer module DTM is shown as an example, but embodiments of the present invention are not limited to the illustrated embodiments, and considering the desired mechanical properties, shape, operating characteristics, etc. of the electronic device ED, in the configuration of the lower module LM, only some of the listed components may be selected, or components may be added in addition to the components presented in the lower module.

[0112] The electronic device ED according to an embodiment of the present invention includes a window module WM disposed on the display module DM. In an embodiment, the electronic device ED may further include a window adhesive layer AP-W disposed between the display module DM and the window module WM, but is not limited thereto. The window module WM may include a foldable portion FP-W and non-foldable portions NFP1-W and NFP2-W. The first non-foldable portion NFP1-W and the second non-foldable portion NFP2-W of the window module WM may be spaced apart from each other in a first direction DR1, and the foldable portion FP-W is interposed between the first non-foldable portion NFP1-W and the second non-foldable portion NFP2-W. The foldable portion FP-W may correspond to the folding region FA1 of the electronic device ED (see Figure 1A), and the non-folded portions NFP1-W and NFP2-W may correspond to the non-folded regions NFA1 and NFA2. In addition, the folded portion FP-W may correspond to the folded display portion FP-D, and the non-folded portions NFP1-W and NFP2-W may correspond to the non-folded display portions NFP1-D and NFP2-D.

[0113] In an embodiment, the window module WM may completely cover the upper surface of the display module DM. In an embodiment of the present invention, the window module WM may be used as a cover window of the electronic device ED. In an embodiment of the present invention, the window module WM may correspond to the uppermost member of the electronic device ED.

[0114] In an embodiment of the present invention, the window module WM may include a window WP and a resin layer RL. The resin layer RL may be disposed on the upper surface or the lower surface of the window WP. In the drawings of the present disclosure, an embodiment in which the resin layer RL is disposed on the lower surface of the window WP is shown, but the embodiments of the present invention are not limited thereto, and the resin layer RL may be disposed on the upper surface of the window WP, or the resin layer RL may be disposed to cover the upper surface and the side surface of the window WP.

[0115] In an embodiment of the present invention, the resin layer RL may include or be formed of an organic resin. In addition, differently, the resin layer RL may be formed of a composite resin including an organic material and an inorganic material.

[0116] In an embodiment of the present invention, the window WP may be a tempered glass substrate. The window WP may be an ultra-thin tempered glass substrate. The window WP may be flexible enough to easily change its state by folding or bending.

[0117] In an embodiment of the present invention, the window WP may include a thinned region having an average thickness smaller than the average thickness of other portions, and the thinned region may be disposed to correspond to the folding region FA1 of the electronic device ED. Figure 5 An electronic device ED including a single folding region FA1 is shown as an example, but is not limited thereto. In another embodiment including a plurality of folding regions, the window WP may include thinned regions corresponding to the folding regions, respectively. Since the thinned regions are included in the window WP, the electronic device ED may exhibit excellent folding or bending operation characteristics.

[0118] Figure 6A and Figure 6B Each of and is a cross-sectional view of the window WP or WP-a according to an embodiment of the present invention. Figure 6A and Figure 6B The window WPs shown in and are substantially the same as each other, except for the shapes of the recessed portions CCP and CCP-a formed in the thinned region SLA.

[0119] A window WP or WP-a according to an embodiment of the present invention may include a folding portion FP or FP-a, and a first non-folding portion NFP1 and a second non-folding portion NFP2 spaced apart from each other in a first direction DR1, and the folding portion FP or FP-a is interposed between the first non-folding portion NFP1 and the second non-folding portion NFP2.

[0120] The recessed portion CCP or CCP-a may be a portion formed by recessing from at least one of the upper surface and the lower surface of the window WP or WP-a. The recessed portion CCP or CCP-a may be defined in the folding portion FP or FP-a. In an embodiment, as shown in Figure 6A and Figure 6B , the recessed portion CCP or CCP-a of the window WP or WP-a may be defined or formed in a direction away from the upper surface of the display panel DP, but embodiments of the present invention are not limited thereto, and in another embodiment of the present invention, the window WP or WP-a may be configured such that the recessed portion CCP or CCP-a is recessed in a direction away from the lower surface of the display panel DP.

[0121] The thinning region SLA where the recessed portion CCP or CCP-a is formed corresponds to a portion that is relatively thinner than the first non-folding portion NFP1 and the second non-folding portion NFP2 of the window WP or WP-a. The recessed portion CCP or CCP-a may be formed in a shape extending in a second direction DR2. The extending direction of the recessed portion CCP or CCP-a may correspond to the extending direction of the folding axis FX1 (see Figure 4 ).

[0122] The edge portion EDP, which is the boundary of the thinning region SLA of the recessed portion CCP or CCP-a, may be a portion corresponding to the boundary region to which the etching solution is supplied in the window manufacturing method according to an embodiment of the present invention, which will be described later. In the window WP or WP-a according to an embodiment of the present invention, the width and position of the thinning region SLA may be changed according to the desired folding or bending characteristics in the electronic device. The width and position of the thinning region SLA may be controlled according to the position of the nozzle portion configured to supply the etching solution, the supply form of the etching solution, etc. in the window manufacturing apparatus and the window manufacturing method according to an embodiment of the present invention, which will be described later.

[0123] Referring to Figure 6A, the recessed portion CCP of the window WP according to an embodiment of the present invention may include a curved surface having a predetermined radius of curvature (i.e., the radius of curvature). The recessed portion CCP may be a portion having a recessed shape that is recessed with respect to the flat surface of the upper surfaces of the first non-folded portion NFP1 and the second non-folded portion NFP2. The recessed portion CCP may be defined as a continuous curved surface shape extending in a second direction DR2 between the first non-folded portion NFP1 and the second non-folded portion NFP2 that are spaced apart from each other in a first direction DR1. The upper surface of the exposed recessed portion CCP in the window WP manufactured by the window manufacturing apparatus according to an embodiment of the present invention and the window manufacturing method according to an embodiment of the present invention, which will be described later, may include a smooth curved surface without discontinuities or step differences.

[0124] Referring to Figure 6B , the recessed portion CCP-a of the window WP-a according to an embodiment of the present invention may include inclined surfaces SS1 and SS2. The recessed portion CCP-a may be a portion having a recessed shape that is recessed with respect to the flat surface of the upper surfaces of the first non-folded portion NFP1 and the second non-folded portion NFP2. The recessed portion CCP-a may include a recessed portion flat surface SFP and a first inclined surface SS1 and a second inclined surface SS2 that are spaced apart from each other in a first direction DR1, and the recessed portion flat surface SFP is interposed between the first inclined surface SS1 and the second inclined surface SS2. The recessed portion flat surface SFP and the inclined surfaces SS1 and SS2 may be defined as a continuous flat and inclined surface shape extending in a second direction DR2. The first inclined surface SS1, the recessed portion flat surface SFP, and the second inclined surface SS2 may be continuous surfaces without discontinuities. The first inclined surface SS1, the recessed portion flat surface SFP, and the second inclined surface SS2 may be adjacent to each other and connected to each other. The boundary portion between the first inclined surface SS1 and the recessed portion flat surface SFP and the boundary portion between the recessed portion flat surface SFP and the second inclined surface SS2 may be smoothly connected to each other without discontinuities or step differences, so that the upper surface of the recessed portion CCP-a may have a continuous surface.

[0125] Figure 6A and Figure 6B The shapes of the recessed portions CCP and CCP-a of the windows WP and WP-a shown in and are merely examples, and the shapes of the recessed portions CCP and CCP-a may be changed according to the desired folding or bending characteristics in an electronic device or the like. In an embodiment, for example, according to the desired folding or bending characteristics in an electronic device, the radius of curvature or the like in the recessed portion CCP having a bent shape may be changed, and the inclination angle or length of the inclined surfaces SS1 and SS2 in the recessed portion CCP-a and the width of the recessed portion flat surface SFP between the inclined surfaces SS1 and SS2 may be changed.

[0126] Figure 7 is a perspective view of a window manufacturing apparatus PM according to an embodiment of the present invention.

[0127] The window manufacturing apparatus PM according to an embodiment of the present invention may include a fixing jig JG and an etching solution supply member TK disposed below the fixing jig JG. A storage member FZ for storing an etching solution may be defined in the etching solution supply member TK. The etching solution supply member TK may serve as a container in which the etching solution supplied during the etching process is stored.

[0128] Among Figure 7 the X-axis, Y-axis, and Z-axis shown in the following drawings, the Z-axis direction is defined as the upward direction. In addition, the X-axis and Y-axis are orthogonal to each other, and the Z-axis may be the normal direction of the plane defined by the X-axis and Y-axis.

[0129] In the present disclosure, the X-axis may correspond to the first direction DR1 shown in the above drawings, the Y-axis may correspond to the second direction DR2 shown in the above drawings, and the Z-axis may correspond to the third direction DR3 shown in the above drawings.

[0130] The fixing jig JG may include a placement surface SS on which a workpiece is fixed. In the fixing jig JG, the placement surface SS on which the workpiece is fixed may include a curved surface or an inclined surface. Specifically, the workpiece may be processed by the window manufacturing apparatus PM in a state where the workpiece is fixed to the curved surface or the inclined surface of the placement surface SS. The curved surface or the inclined surface of the placement surface SS may extend in one direction. Referring to Figure 7 , the curved surface of the placement surface SS may continuously extend in the Y-axis direction.

[0131] In the present disclosure, the workpiece processed in the window manufacturing apparatus PM according to an embodiment of the present invention may include a substrate glass. After being processed in the window manufacturing apparatus PM, the substrate glass may be flexible and may be used as a cover window of an electronic device ED (see Figure 1A ).

[0132] In an embodiment of the present invention, the fixing jig JG may be connected to a vacuum line VL. The fixing jig JG may be connected to a vacuum pump (not shown) etc. through the vacuum line VL, and the workpiece may be fixed using the state provided through the vacuum line VL.

[0133] In a window manufacturing apparatus PM according to an embodiment of the present invention, at least a part of a placement surface SS on which a workpiece is fixed of a fixing jig JG may be accommodated in a storage part FZ of an etching solution supply part TK. In an embodiment according to the present invention, the size (e.g., planar area) of the storage part FZ of the etching solution supply part TK may be larger than a size sufficient to accommodate at least a part of the placement surface SS of the fixing jig JG. In a window manufacturing apparatus PM according to an embodiment of the present invention, the position of at least one of the fixing jig JG and the etching solution supply part TK may be relatively adjusted such that at least a part of the placement surface SS of the fixing jig JG is located in the storage part FZ.

[0134] In Figure 7 the window manufacturing apparatus PM according to an embodiment of the present invention shown in, the width of the etching solution supply part TK in the X-axis direction may be greater than or equal to the width of at least a part of a curved surface or an inclined surface of the placement surface SS that can accommodate the fixing jig JG, and the width of the etching solution supply part TK in the Y-axis direction may be greater than or equal to the width of the fixing jig JG in the Y-axis direction.

[0135] The window manufacturing apparatus PM according to an embodiment of the present invention may further include a plurality of control units for controlling the operations and positions of the fixing jig JG and the etching solution supply part TK. The plurality of control units included in the window manufacturing apparatus PM may be simultaneously controlled by a central control unit, or may also be controlled by respective control systems. It should be understood that the configuration of the control units shown and described in Figure 7 etc. is an example, and in the window manufacturing apparatus PM according to an embodiment of the present invention, at least one of the control units to be described later may be omitted, or more control units may be included in addition to Figure 7 the control units shown in.

[0136] A jig control unit JCU may control the position and operation of the fixing jig JG. A motion control unit MVG may be connected to the fixing jig JG, and an operation signal provided by the jig control unit JCU may be transmitted to the motion control unit MVG, and the fixing position and vertical and horizontal movements of the fixing jig JG may be adjusted according to the operation of the motion control unit MVG. The window manufacturing apparatus PM according to an embodiment of the present invention may further include a height adjustment unit JHC that additionally adjusts the vertical position of the fixing jig JG. The height adjustment unit JHC may be adjusted by the motion control unit MVG or controlled by a separate control unit. The vertical or horizontal movement of the fixing jig JG may be controlled by the motion control unit MVG and the height adjustment unit JHC, and thus the relative positions of the fixing jig JG, the level of the etching solution stored in the etching solution supply part TK, and the workpiece may be finely adjusted.

[0137] Reference Figure 7 etc., the vertical direction can correspond to a direction parallel to the Z-axis, and the horizontal direction can correspond to a direction parallel to the plane defined by the X-axis and the Y-axis.

[0138] The window manufacturing apparatus PM according to an embodiment of the present invention may further include a position control unit TMC and a supply control unit ESU for controlling an etching solution supply member TK. The supply control unit ESU can adjust the supply of the etching solution to the storage member FZ of the etching solution supply member TK. Although not shown, the supply control unit ESU may be connected to an external etching solution storage device, an etching solution supply pipeline, etc. The supply control unit ESU can serve as a valve for supplying the etching solution into the storage member FZ. In addition, the supply control unit ESU can have a liquid level control function of sensing and adjusting the liquid level of the etching solution supplied to the storage member FZ. The position control unit TMC can control the movement of the etching solution supply member TK in the vertical direction or the horizontal direction.

[0139] In the window manufacturing apparatus PM according to an embodiment of the present invention, the etching solution provided in the storage member FZ can be provided or stored during the manufacturing process to be maintained at a certain liquid level, or the liquid level of the etching solution can be adjusted over time.

[0140] The window manufacturing apparatus PM according to an embodiment of the present invention may further include a stage STG on which the etching solution supply member TK is disposed. The etching solution supply member TK can be fixedly disposed on the stage STG. In an embodiment of the present invention, the placement position of the etching solution supply member TK can be controlled by moving in the vertical direction and the horizontal direction according to the movement of the stage STG. A gap adjustment unit THP can also be provided between the etching solution supply member TK and the stage STG. The gap adjustment unit THP can be adjusted by the position control unit TMC or controlled by a separate control unit. For example, in an embodiment of the present invention, the vertical position of the etching solution supply member TK can be finely adjusted by the gap adjustment unit THP.

[0141] In Figure 7 the window manufacturing apparatus PM according to an embodiment of the present invention shown, the placement surface SS of the fixed jig JG including a curved surface or an inclined surface can be a surface facing the etching solution supply member TK. The window manufacturing apparatus PM according to an embodiment of the present invention can be configured such that the placement surface SS of the fixed jig JG has a shape protruding in the direction toward the etching solution supply member TK. That is, in the window manufacturing apparatus PM according to an embodiment of the present invention, the workpiece can be fixed to the placement surface SS having a shape protruding convexly in the direction toward the etching solution supply member TK.

[0142] Figure 8A and Figure 8B Each of them is a cross-sectional view showing the fixing jig JG or JG-a according to an embodiment of the present invention. Figure 8A and Figure 8B Each of them may be a cross-sectional view of the fixing jig JG or JG-a according to an embodiment of the present invention at a portion corresponding to the line II-II' of Figure 7 The placement surface SS of the fixing jig JG of the embodiment of the present invention shown in

[0143] Figure 8A corresponds to a shape having a continuous curved surface. The workpiece can be fixed in a deformed form corresponding to the shape of the placement surface SS of the fixing jig JG. That is, the workpiece can be processed by etching its exposed surface while being fixed in a curved shape. As Figure 6A shown in Figure 8A In the window WP of the embodiment of the present invention manufactured by fixing to the fixing jig JG of the embodiment of the present invention shown in

[0144] Figure 8B The fixing jig JG-a of the embodiment of the present invention shown in may have a placement surface SS-a including an inclined surface IS-G. The placement surface SS-a may include a flat surface FP-G and an inclined surface IS-G having a predetermined inclination angle θ with respect to the flat surface FP-G. The inclined surfaces IS-G provided on both sides with the flat surface FP-G therebetween may have shapes symmetric to each other with respect to the flat surface FP-G. The inclination angle θ of the inclined surface IS-G may be about 0.1 degree or more. The inclination angle of the inclined surface in the manufactured window can be determined according to the inclination angle θ of the inclined surface IS-G.

[0145] When the workpiece is set on the fixing jig JG-a according to an embodiment of the present invention, the workpiece can be fixed in a deformed form corresponding to the shape of the placement surface SS-a defined by the inclined surface IS-G and the flat surface FP-G. That is, the workpiece can be processed by etching its exposed surface while being fixed in a shape including the inclined surface IS-G. As Figure 6B shown in Figure 8B In the window WP-a of the embodiment of the present invention manufactured by fixing to the fixing jig JG-a of the embodiment of the present invention shown in Figure 8BThe inclined surfaces SS1 and SS2 of the window WP-a manufactured according to the fixed jig JG-a of the embodiment of the present invention shown in the figure can be formed to have an inclination angle of about 0.1 degree or more with respect to the flat surface SFP of the recessed portion CCP-a.

[0146] Referring to Figure 8A and Figure 8B , the vacuum suction inlet VH can be defined on at least a part (or portion) of the placement surface SS or SS-a on which the workpiece is placed. The vacuum suction inlet VH can be connected to a vacuum pipeline VL provided inside the fixed jig JG, and can be a part defined on the placement surface SS or SS-a. The workpiece can be adsorbed and fixed to the fixed jig JG by using the suction state provided by the vacuum suction inlet VH connected to the vacuum pipeline VL.

[0147] When manufacturing a window using the fixed jig JG or JG-a of the embodiment of the present invention shown in Figure 8A or Figure 8B , the window manufacturing apparatus PM according to the embodiment of the present invention (see Figure 7 ) can be configured to allow replacement of the fixed jig having a shape of the placement surface SS or SS-a that reflects the shape of the finally desired recessed portion in the window.

[0148] Figure 9 is a cross-sectional view showing a part of the window manufacturing apparatus PM according to the embodiment of the present invention. Figure 9 can be a cross-sectional view of a part of the window manufacturing apparatus PM, which corresponds to Figure 7 along the line II-II'. Figure 9 can be a cross-sectional view showing the operating state of the window manufacturing apparatus PM according to the embodiment of the present invention. Figure 9 shows the window manufacturing apparatus PM including the fixed jig JG shown in Figure 8A , and when using the fixed jig JG-a shown in Figure 8B , only the fixed jig JG-a can be changed and provided in the window manufacturing apparatus PM shown in Figure 9 .

[0149] In the window manufacturing apparatus PM according to the embodiment of the present invention, the etching solution ETS can be provided to be accommodated in the storage part FZ of the etching solution supply part TK. The fixed jig JG can be positioned in such a way that the protruding placement surface SS of the fixed jig JG faces the etching solution ETS. Considering the thinning area of the workpiece fixed to the placement surface SS of the fixed jig JG, the movement of the fixed jig JG can be controlled in the operation direction MVD.

[0150] Since the placement surface SS has a convexly curved surface facing the etching solution ETS, the portions of the workpiece fixed to the placement surface SS that are exposed to the etching solution ETS can also exhibit differences based on the shape of the placement surface SS. That is, in an embodiment of the present invention, the etching amount of the workpiece fixed to the central portion CTP of the placement surface SS is relatively greater than the etching amount of the workpiece fixed to the outer portion OTP of the placement surface SS.

[0151] In an embodiment, in a state fixed to the placement surface SS, considering the portion to be etched, the workpiece can be immersed in the etching solution ETS such that the workpiece is continuously exposed to the etching solution ETS according to the shape of the placement surface SS. Therefore, the window processed by the window manufacturing apparatus PM according to an embodiment of the present invention can have a thinning region having a recessed portion defined therein and having a smooth curved surface or inclined surface.

[0152] Figure 10 is a perspective view of a window manufacturing apparatus PM-1 according to an embodiment of the present invention. Figure 11A and Figure 11B each of is a cross-sectional view of a fixing jig JG-1 or JG-1a according to an embodiment of the present invention. Figure 12 is a cross-sectional view of a window manufacturing apparatus PM-1 according to an embodiment of the present invention. Figures 11A to 12 each of can be a cross-sectional view of a portion corresponding to Figure 10 the line III-III' of.

[0153] The window manufacturing apparatus PM-1 according to an embodiment of the present invention may include a fixing jig JG-1 including a placement surface SS-1 and an etching solution supply member TK provided below the fixing jig JG-1. The window manufacturing apparatus PM-1 according to an embodiment of the present invention may include a motion control unit MVG configured to control the operation and position of the fixing jig JG-1 and a supply control unit ESU configured to supply an etching solution to the etching solution supply member TK and control the liquid level of the etching solution.

[0154] In an embodiment of the present invention, the placement surface SS-1 of the fixing jig JG-1 may be spaced apart from the bottom of the storage member FZ of the etching solution supply member TK. The fixing jig JG-1 may include a groove portion HP recessedly defined in the direction toward the storage member FZ. In an embodiment, as Figure 11A and Figure 11B shown, a part of the groove portion HP of the fixing jig JG-1 may be defined as the placement surface SS-1 or SS-1a. The workpiece may be set and fixed corresponding to the placement surface SS-1 or SS-1a of the fixing jig JG-1 or JG-1a.

[0155] The groove portion HP of the fixing jig JG-1 can be formed to extend in one direction. Refer to Figure 10 and Figure 11A , in the window manufacturing apparatus PM-1 according to an embodiment of the present invention, the groove portion HP can be defined in a form that is recessed in a direction toward the storage member FZ and extends in the Y-axis direction. The portion of the base glass provided as a workpiece to be processed into a thinning region can be disposed in the groove portion HP of the fixing jig JG-1.

[0156] Refer to Figure 11A and Figure 11B , the fixing jig JG-1 or JG-1a can be divided into a processing portion JCP including the groove portion HP and a first support portion JFP1 and a second support portion JFP2 that are spaced apart from each other in the X-axis direction (i.e., one direction), and the processing portion JCP is interposed between the first support portion JFP1 and the second support portion JFP2. The upper surface of the fixing jig JG-1 or JG-1a can include a flat surface and a curved surface or an inclined surface.

[0157] The upper surface of the processing portion JCP includes a curved surface or an inclined surface, and the upper surfaces of the first support portion JFP1 and the second support portion JFP2 can be flat surfaces. The groove portion HP of the fixing jig JG-1 or JG-1a can include a curved surface having a curvature or an inclined surface formed to have an inclination angle based on the flat surface of the upper surface of the first support portion JFP1 or the second support portion JFP2. The workpiece can be provided to the groove portion HP of the fixing jig JG-1 or JG-1a in a deformed shape having a curvature or a predetermined angle, and fixed to have a shape corresponding to the shape of the placement surface SS-1 or SS-1a that defines the groove portion HP of the fixing jig JG-1 or JG-1a.

[0158] Figure 11A The placement surface SS-1 of the fixing jig JG-1 according to an embodiment of the present invention shown in has a shape of a continuous curved surface. The workpiece can be fixed in a deformed shape according to the shape of the placement surface SS-1 that defines one surface of the groove portion HP. That is, the workpiece can be processed by etching the exposed surface while being fixed in a state of having a curved surface shape. As shown in Figure 6A shown in, by being fixed to the fixing jig JG-1 according to an embodiment of the present invention shown in Figure 11A , the recessed portion CCP of the thinning region SLA of the window WP according to an embodiment of the present invention can have a continuous curved surface.

[0159] As shown in Figure 11BThe placement surface SS-1a of the fixing jig JG-1a according to an embodiment of the present invention shown in [reference] may include an inclined surface IS-H. The placement surface SS-1a may include a flat surface FP-H and an inclined surface IS-H having a predetermined inclination angle θ with respect to the flat surface FP-H. The inclined surfaces IS-H provided on both sides with the flat surface FP-H therebetween may have shapes symmetric to each other with respect to the flat surface FP-H. The inclination angle θ of the inclined surface IS-H may be about 0.1 degrees or more. The inclination angle of the inclined surface in the manufactured window may be determined according to the inclination angle θ of the inclined surface IS-H.

[0160] When a workpiece is placed on the fixing jig JG-1a according to an embodiment of the present invention, the workpiece may be fixed in a deformed shape corresponding to the shape of the placement surface SS-1a, which is the upper surface of the groove portion HP defined as the inclined surface IS-H and the flat surface FP-H. That is, the workpiece may be processed by etching the exposed surface while being fixed in a state having a shape including the inclined surface IS-H. As Figure 6B shown in [reference], in the window WP-a according to an embodiment of the present invention manufactured by being fixed to Figure 11B the fixing jig JG-1a according to an embodiment of the present invention shown in [reference], the recessed portion CCP-a of the thinning region SLA may have continuous surfaces such as an inclined surface SS1, a flat surface SFP, and an inclined surface SS2 connected to each other. The inclined surfaces SS1 and SS2 provided on the window WP-a manufactured by being fixed to the fixing jig JG-1a may be formed to have an inclination angle of about 0.1 degrees or more with respect to the flat surface SFP of the recessed portion CCP-a.

[0161] Referring to Figure 11A and Figure 11B , a vacuum suction inlet VH may be defined on (or at) the placement surface SS-1 or SS-1a, which is one surface of the groove portion HP on which the workpiece is placed. The vacuum suction inlet VH may be connected to a vacuum pipeline VL provided in the fixing jig JG-1 or JG-1a and may be defined on (or at) the placement surface SS-1 or SS-1a. Although not shown, the vacuum pipeline VL may be connected to a vacuum pump or the like to suck and fix the workpiece placed on the fixing jigs JG-1 and JG-1a.

[0162] Figure 11A and Figure 11B The fixing jigs JG-1 and JG-1a shown in [reference] and [reference] may have a groove portion HP with a fixed shape. When manufacturing a window using Figure 11A and Figure 11B the fixing jig JG-1 or JG-1a according to an embodiment of the present invention shown in [reference], in Figure 10In the window manufacturing apparatus PM-1 according to an embodiment of the present invention, a fixing jig having a groove portion reflecting the shape of a recessed portion in the window can be replaced as desired.

[0163] Figure 12 It may be a cross-sectional view showing an operating state of the window manufacturing apparatus PM-1 according to an embodiment of the present invention. In the window manufacturing apparatus PM-1 according to an embodiment of the present invention, the fixing jig JG-1 may be inserted and positioned in the storage part FZ of the etching solution supply part TK. That is, the area (e.g., planar area) of the storage part FZ defined by the X-axis and the Y-axis may be larger than the area capable of accommodating the entire fixing jig JG-1.

[0164] In an operating state of the window manufacturing apparatus PM-1 according to an embodiment of the present invention, the fixing jig JG-1 may be inserted and fixedly positioned in the storage part FZ, and the liquid level of the etching solution ETS supplied to the storage part FZ may be adjusted. According to the adjustment of the liquid level of the etching solution ETS, the range of the thinning area corresponding to the portion to be etched of the workpiece and the etching amount within the thinning area can be adjusted.

[0165] In the window manufacturing apparatus PM-1, the fixing jig JG-1a may be included instead of the fixing jig JG-1. In an embodiment of the window manufacturing apparatus PM-1, the fixing jig JG-1a may be positioned in the storage part FZ such that at least a part of the flat surface FP-H and the inclined surface IS-H of the placement surface SS-1a adjacent to the flat surface FP-H is immersed in the etching solution ETS supplied to the storage part FZ. When the placement surface SS-1 is immersed in the etching solution ETS, a difference occurs in even a part of the workpiece fixed to the placement surface SS-1 that is exposed to the etching solution ETS according to the shape of the placement surface SS-1.

[0166] In an embodiment of the present invention, the fixing jig JG-1 may be positioned such that at least a part of the placement surface SS-1 of the groove part HP (see Figure 11A ) of the fixing jig JG-1 is immersed in the etching solution ETS, and the liquid level of the etching solution ETS provided in the storage part FZ may be adjusted in consideration of the thinning area of the workpiece fixed to the placement surface SS-1 of the fixing jig JG-1. By adjusting the liquid level of the etching solution ETS over time, the etching amount varies according to the placement position of the workpiece provided on the placement surface SS-1.

[0167] In an embodiment of the present invention, according to the adjustment of the liquid level of the etching solution ETS over time, the etching amount of the workpiece fixed to the central portion CTP of the placement surface SS-1 (the central portion CTP defines a groove portion HP recessed toward the bottom surface of the storage member FZ) is relatively greater than the etching amount of the workpiece fixed to the outer portion OTP of the placement surface SS-1. In addition, by considering the etching degree and ensuring that the entire portion to be etched is immersed in the etching solution ETS in a state where the workpiece is fixed to the placement surface SS-1, the workpiece can be exposed to the etching solution ETS without any interruption according to the shape of the placement surface SS-1. Therefore, the window processed in the window manufacturing apparatus PM-1 according to an embodiment of the present invention can have a thinning region having a recessed portion defined therein and having a smooth curved surface or an inclined surface.

[0168] When using the window manufacturing apparatus PM / PM-1 according to an embodiment of the present invention described with reference to Figures 7 to 11B to process the substrate glass using the etching solution, a separate pretreatment masking process for distinguishing the portion to which the etching solution is supplied and a separate post-processing process such as surface polishing after etching can be omitted. In addition, when using the window manufacturing apparatus according to an embodiment of the present invention, step differences or interruptions that may occur at the boundary between the portion to which the etching solution is supplied and the portion to which the etching solution is not supplied or at the boundary between the portion to which a large amount of etching is supplied and the portion to which a small amount of etching is supplied do not occur, so that the window manufactured using the window manufacturing apparatus according to an embodiment of the present invention can exhibit improved surface quality characteristics without interruption.

[0169] When manufacturing a window using the window manufacturing apparatus according to an embodiment of the present invention, the flexibility of the ultra-thin tempered glass used as the substrate glass can be utilized before etching to bend or transform the substrate glass into a curved state corresponding to the shape of the fixing jig, thereby increasing the overall thickness of the window and easily reducing the thickness of the folded portion of the window to the thickness of the desired shape. Therefore, the window manufactured using the window manufacturing apparatus according to an embodiment of the present invention can exhibit high durability while having improved surface quality characteristics.

[0170] Figure 13 is a flowchart of a window manufacturing method 100 according to an embodiment of the present invention. Figures 14A to 16C Each of those in Figures 13 to 16C illustrates one process of the window manufacturing method according to an embodiment of the present invention. Hereinafter, in the description of the window manufacturing method 100 according to an embodiment of the present invention described with reference to

[0171] The window manufacturing method 100 according to an embodiment of the present invention may include bending a base glass (S10), fixing the base glass to a placement surface of a fixing jig (fixing the base glass on the placement surface of the fixing jig) (S30), and exposing the base glass to an etching solution (S50). In addition, the window manufacturing method 100 according to an embodiment of the present invention may further include supplying the etching solution to a storage part of an etching solution supply part (S40).

[0172] The supply of the etching solution (S40) may be performed before a part of the base glass is exposed to the etching solution (S50). The supply of the etching solution (S40) may be sequentially performed after the base glass is fixed to the placement surface of the fixing jig (S30), or the supply of the etching solution (S40) may be performed as a process separate from the bending of the base glass (S10) and / or fixing the base glass to the placement surface of the fixing jig (S30), and the supply of the etching solution (S40) may be performed independently of other processes. The supply of the etching solution (S40) may include filling a predetermined amount of the etching solution into the storage part of the etching solution supply part. In an embodiment, the supply of the etching solution (S40) may be performed after the base glass fixed to the fixing jig is disposed near the storage part, or after the fixing jig on which the base glass is placed is fixed in the storage part. In another embodiment, the etching solution may be first supplied and filled into the storage part, and then the position of the fixing jig or the etching solution supply part may be adjusted so that the fixing jig is disposed near the etching solution or the fixing jig is immersed in the etching solution.

[0173] The window manufacturing method 100 according to an embodiment of the present invention may be a method of manufacturing a window using Figures 7 to 12 the window manufacturing apparatus PM / PM-1 according to an embodiment of the present invention as shown. The window manufacturing method 100 according to an embodiment of the present invention may be a method of manufacturing a window using a window manufacturing apparatus including a fixing jig having a placement surface with a curved surface or an inclined surface, and an etching solution supply part disposed below the fixing jig, and a storage part is defined in the etching solution supply part to accommodate at least a part of the placement surface.

[0174] In the window manufacturing method 100 according to an embodiment of the present invention, bending the base glass (S10) may include bending the base glass to include a bent part having a shape corresponding to the placement surface of the window manufacturing apparatus. In addition, fixing the base glass to the placement surface of the fixing jig (S30) may include fixing the bent base glass to the fixing jig such that the bent part is disposed in a shape corresponding to the shape of the placement surface of the fixing jig.

[0175] Exposing the substrate glass to the etching solution (S50) may include supplying the etching solution to an exposed surface of the substrate glass that is not attached to the placement surface of the fixing jig. An exposed surface of the substrate glass corresponding to the shape of the fixing jig may be exposed to the etching solution contained in the etching solution supply member. In such an embodiment, the gap in the vertical direction between the fixing jig and the etching solution supply member may be adjusted such that the fixing jig is not exposed to the etching solution. Alternatively, by disposing the fixing jig to which the substrate glass is fixed in the storage member of the etching solution supply member, one surface of the substrate glass may be exposed to the etching solution, and also a part of the fixing jig may be exposed to the etching solution.

[0176] Exposing the substrate glass to the etching solution (S50) may include controlling the degree of etching by the etching solution based on the position of the exposed surface of the substrate glass to form a window having a recessed portion defined therein. In addition, exposing the substrate glass to the etching solution (S50) may include controlling the time of exposure to the etching solution or the amount of the etching solution supplied based on the position of the exposed surface of the substrate glass.

[0177] Referring to Figures 14A to 14C The process of the window manufacturing method according to the embodiments of the present invention shown and described may correspond to the manufacturing method using the window manufacturing apparatus PM according to the embodiments of the present invention described with reference to Figures 7 to 9 described.

[0178] Figure 14A is a cross-sectional view of the substrate glass BS processed by the window manufacturing method according to the embodiments of the present invention. The substrate glass BS is a tempered glass substrate and may have flexibility that allows easy bending.

[0179] The substrate glass BS includes an upper surface BS-US and a lower surface BS-DS facing each other, and each of the upper surface BS-US and the lower surface BS-DS may be a flat surface. The substrate glass BS may include at least one preliminary thinning region P-SLA. The preliminary thinning region P-SLA may be a part of the thinning region SLA (see Figure 6A and Figure 6B ) to be processed into the window WP or WP-a.

[0180] Figure 14B Shows bending the substrate glass (S10).

[0181] The base glass BS can be bent to include a bent portion BP before being provided to the fixing jig, so that the base glass BS can be easily set according to the shape of the placement surface of the fixing jig. In bending the base glass (S10), an external force BFC can be applied to the base glass BS so that the base glass BS is deformed into a shape including the bent portion BP. The base glass BS can be bent so that the bent portion BP includes a preliminary thinning region P-SLA.

[0182] Figure 14C FIG. shows fixing the base glass to the placement surface of the fixing jig (S30) in the window manufacturing method according to an embodiment of the present invention. As Figure 14C shown, in fixing the base glass to the placement surface (S30), the bent portion BP of the base glass BS (see Figure 14B ) can be set to correspond to the placement surface SS of the fixing jig JG. The bent portion BP of the base glass BS can be set to a deformed shape corresponding to the shape of the placement surface SS and fixed to the fixing jig JG. In an embodiment, in fixing the base glass to the placement surface of the fixing jig (S30), the remaining portion of the base glass BS except for the preliminary thinning region P-SLA (see Figure 14B ) can be spaced apart from and not in contact with one surface of the fixing jig JG.

[0183] The base glass BS can be fixed to a shape corresponding to the shape of the placement surface SS by using a vacuum state provided by a vacuum suction inlet VH defined on the placement surface SS and connected to a vacuum pipeline VL (see Figure 7 ). Fixing the base glass to the placement surface of the fixing jig (S30) can include sucking and fixing one surface of the base glass BS through the vacuum suction inlet VH.

[0184] That is, different from the conventional manufacturing method in which the base glass BS is provided in an unfolded state and placed on a jig for an etching process, the window manufacturing method according to an embodiment of the present invention can bend the base glass BS to include a preliminary thinning region P-SLA, and fix the base glass BS to the fixing jig JG to maintain the bent shape. Therefore, compared with the conventional process in which a separate masking process is performed as a pretreatment process to distinguish the portion to be etched from other portions, the window manufacturing method according to an embodiment of the present invention can omit the pretreatment process by bending the base glass and fixing the base glass to the placement surface reflecting the shape of the thinning region desired for the finally manufactured window.

[0185] Figure 14DIn the window manufacturing method according to an embodiment of the present invention, the substrate glass is exposed to an etching solution (S50). One exposed surface of the substrate glass BS fixed to the fixing jig JG is exposed to the etching solution ETS, and the thickness of the substrate glass BS exposed to the etching solution ETS can vary continuously according to the shape of the placement surface SS. That is, the thickness of the substrate glass BS fixed to the fixing jig JG and exposed to the etching solution ETS can gradually decrease from the central portion CTP of the placement surface SS toward the outer portion OTP. The etching amount of the substrate glass BS can be the largest at the portion corresponding to the central portion CTP of the fixing jig JG, and the etching amount can gradually decrease from the central portion CTP toward the outer portion OTP.

[0186] In Figure 14D , the region ETA exposed to the etching solution can correspond to the thinning region SLA (see Figure 6A ). Expressions such as "exposed to the etching solution" can be understood as "immersed in the etching solution". In Figure 14D , the maximum thickness portion of the substrate glass BS immersed in the etching solution can correspond to the etching thickness ET. The etching thickness ET can correspond to the depth t of the recessed portion CCP CCP (see Figure 6A ). The edge portion EDP of the substrate glass BS corresponding to the liquid level of the surface ET-OS of the etching solution ETS can correspond to the edge portion EDP of the thinning region SLA (see Figure 6A ).

[0187] As Figure 6A etc. show, in the window WP manufactured in one process of the window manufacturing method according to an embodiment of the present invention as shown in Figures 14A to 14D , a recessed recessed portion CCP can be defined in the thinning region SLA, and one exposed surface of the recessed portion CCP can have a continuous curved surface shape.

[0188] When Figure 8B the fixing jig JG-a according to an embodiment of the present invention as shown in Figure 14C and Figure 14D is used for the process of the window manufacturing method according to an embodiment of the present invention as shown in Figure 6B , a window WP-a can be manufactured, in which a recessed recessed portion CCP-a is defined in the thinning region SLA, and one exposed surface of the recessed portion CCP-a includes a continuous flat surface SFP and inclined surfaces SS1 and SS2 and has a smooth ramp shape at the boundary portion.

[0189] Figures 15A to 15D Each of Figures 15A to 15DThe process of the window manufacturing method according to the embodiments of the present invention shown and described may correspond to the manufacturing method using the window manufacturing apparatus PM-1 according to the embodiments of the present invention Figures 10 to 12 described. Figures 15A to 15D shows the window manufacturing method using the Figure 11B window manufacturing apparatus including the fixing jig JG-1a shown therein, but the window manufacturing method according to the embodiments of the present invention described with reference to Figures 15A to 15D can be similarly applied to the window manufacturing method using the Figure 11A window manufacturing apparatus including the fixing jig JG-1 shown therein.

[0190] Figure 15A shows Figure 13 the bent base glass (S10) and the placement surface (S30) of the base glass onto the fixing jig shown therein. The base glass BS can be deformed by an external force BFC to correspond to the shape of the placement surface SS-1a of the fixing jig JG-1a. The base glass BS can be flexible such that its shape can be easily deformed by an external force BFC. The base glass BS can be placed on the fixing jig JG-1a in a state of being partially bent by an external force BFC and fixed by suction through the vacuum suction inlet VH.

[0191] Figure 15B and Figure 15C shows Figure 13 the exposure of the base glass to the etching solution (S50) shown therein. The fixing jig JG-1a can be accommodated in the storage member FZ in a state where the base glass BS is fixed. In the embodiments of the present invention, in a state where the base glass BS is exposed to the etching solution ETS in the storage member FZ, the liquid level of the etching solution ETS can change over time.

[0192] The liquid level of the etching solution ETS can change in the direction ETS-MV from the initial state INL-ES to the final state FNL-ES. In addition, the etching solution ETS flows in the flow direction EMV along the inclined surface of the base glass BS. Therefore, the central portion of the base glass BS is exposed to the etching solution ETS for a longer time, resulting in a larger etching amount of the central portion of the base glass BS compared to other portions exposed to the etching solution ETS. In the Figure 15C process of the manufacturing method shown therein, the edge portion EDP can be determined based on the position of the initial state INL-ES of the etching solution ETS. In Figure 15C , the edge portion EDP where the etching solution ETS is first supplied can correspond to the edge portion EDP of the thinning region SLA of the manufactured window WP-a (see Figure 6B ).

[0193] Refer to Figure 15DIn an embodiment of the present invention, after the fixing jig JG-1a is contained in the storage part FZ in a state where the base glass BS is fixed therein, the liquid level of the etching solution ETS can be changed in the direction ETS-MV gradually increasing from the initial state INL-ES1 to the final state FNL-ES1. In such an embodiment, the etching solution ETS flows in the flow direction EMV along the inclined surface of the base glass BS. Therefore, the time for which the central portion of the base glass BS is exposed to the etching solution ETS becomes longer, and the amount of the etching solution ETS supplied to the central portion also increases, resulting in a larger etching amount in the central portion of the base glass BS compared to other portions exposed to the etching solution ETS. Figure 15D In the process of the manufacturing method shown in , the edge portion EDP can be determined according to the position of the final state FNL-ES1 of the etching solution ETS. Figure 15D , the edge portion EDP to which the etching solution ETS is finally supplied may correspond to the edge portion EDP of the thinned area SLA of the manufactured window WP-a (see Figure 6B ).

[0194] like Figure 6B As shown in Figure 15C or Figure 15D In the window WP-a manufactured by exposing to an etching solution ETS according to the method shown in, the recessed recessed portion CCP-a can define a thinning area SLA, and an exposed surface of the recessed portion CCP-a may include a flat surface SFP without interruption and inclined surfaces SS1 and SS2, and has a smooth slope shape at the boundary portion.

[0195] At the same time, when Figure 15C and Figure 15D In one process of the window manufacturing method according to an embodiment of the present invention, as shown in FIG. Figure 11A When the fixing fixture JG-1 according to an embodiment of the present invention is shown in FIG. Figure 6A As shown in, in a window WP manufactured in a process of a window manufacturing method according to an embodiment of the present invention, a concave recessed portion CCP may be defined in the thinning area SLA, and an exposed surface of the recessed portion CCP may have a shape including a curved surface without discontinuity.

[0196] In addition, in reference Figures 15A to 15DIn the case of the window manufacturing method according to an embodiment of the present invention, compared with the conventional manufacturing method in which a separate masking process must be performed as a pretreatment process to distinguish the portions to be etched from other portions, by bending the base glass and fixing it on the placement surface of the fixing jig that reflects the shape of the thinned area desired for the finally manufactured window and exposing the base glass to the etching solution to form the thinned area, the pretreatment process can be omitted. Further, by accommodating the entire fixing jig to which the base glass is fixed in the storage member and controlling the liquid level of the etching solution in consideration of the thinned area, a window having recessed portions with different etching degrees can be easily manufactured in a single process without an additional process.

[0197] Figures 16A to 16C FIG. shows the process of the window manufacturing method according to an embodiment of the present invention. Referring to Figures 16A to 16C The window manufacturing method according to an embodiment of the present invention described with reference to Figures 15A to 15D is substantially the same as the window manufacturing method according to an embodiment of the present invention described with reference to

[0198] Referring to Figure 16A , a protective film PL may be attached to one surface of the window. The protective film PL may be provided on a surface other than the surface BS-US thinned in the base glass BS. In an embodiment, the protective film PL may be provided on the entire one surface BS-DS of the base glass BS, or may be provided only on the area of the base glass BS exposed to the etching solution.

[0199] Figure 16B FIG. shows bending the base glass (S10) (see Figure 13 ). In a state where the protective film PL is attached, the base glass BS may be bent by an external force BFC. The protective film PL may have sufficient adhesive strength such that even when the base glass BS is bent and deformed by the external force BFC to form a bent portion BP, the protective film PL does not peel off from the base glass BS.

[0200] Figure 16C FIG. shows exposing the base glass to the etching solution (S50) (see Figure 13 ). Figure 16C FIG. shows, in a single drawing, the method of providing the etching solution ETS as shown and described in Figure 15C and Figure 15D . The moving direction ETS-MV of the liquid level of the etching solution ETS may be the direction in which the liquid level decreases from the initial state INL-ES to the final state FNL-ES, or the direction in which the liquid level increases from the initial state INL-ES1 to the final state FNL-ES1. As described with reference to Figure 15C and Figure 15D described, asFigure 6B As shown in Figures 16A to 16C , in the case of the window WP-a manufactured by the window manufacturing method according to an embodiment of the present invention described with reference to Figure 6A , a recessed portion CCP-a may be defined in the thinning region SLA, and one exposed surface of the recessed portion CCP-a may include a flat surface SFP without interruption and inclined surfaces SS1 and SS2, and have a smooth ramp shape at the boundary portion. Additionally, as Figure 11A shows, in the case of the window WP manufactured by changing from the fixed jig JG-1a to the fixed jig JG-1 (see

[0201] ) according to the window manufacturing method according to an embodiment of the present invention, a recessed portion CCP may be defined in the thinning region SLA, and one exposed surface of the recessed portion CCP may include a continuous curved surface. Figures 16A to 16C Further, in the case of the window manufacturing method according to an embodiment of the present invention described with reference to

[0202] , by accommodating the entire fixed jig to which the base glass is fixed in the storage portion and controlling the liquid level of the etching solution in consideration of the thinning region, a window having recessed portions with different etching degrees can be easily manufactured in a single process without an additional process. In addition, when the base glass is exposed to the etching solution, the other surface of the base glass that does not need to be thinned is protected by the protective film, thereby preventing damage to the base glass due to the etching solution. Therefore, the quality of the window manufactured by the window manufacturing method according to an embodiment of the present invention can be improved. Figures 7 to 16C In the description of the manufacturing apparatus according to an embodiment of the present invention and the manufacturing method according to an embodiment of the present invention described with reference to Figure 1A , etc., the manufacturing method of the window corresponding to the form of the electronic device shown in

[0203] In the case of a window manufacturing method according to an embodiment of the present invention, when processing a substrate glass using an etching solution, a separate pretreatment masking process for distinguishing a portion to which the etching solution is supplied and a separate post-processing process such as surface polishing after etching can be omitted. Therefore, the process efficiency can be improved by the window manufacturing method according to an embodiment of the present invention. In addition, when using the window manufacturing method according to an embodiment of the present invention, a step difference or discontinuity that may occur at the boundary between a portion to which the etching solution is supplied and a portion to which the etching solution is not supplied does not occur, so that the surface of the manufactured window can exhibit improved quality characteristics without discontinuities. Therefore, in the case of an electronic device including a window manufactured by a window manufacturing apparatus according to an embodiment of the present invention or a window manufacturing method according to an embodiment of the present invention, problems such as image distortion or stain recognition that may occur at the discontinuity can be improved, thereby exhibiting high display quality.

[0204] In addition, when manufacturing a window using the window manufacturing method according to an embodiment of the present invention, by bending the substrate glass into a bent state or a curved state by utilizing the flexibility of the ultra-thin tempered glass used as the substrate glass, fixing the substrate glass in the bent state or the curved state to match the shape of the mounting surface of the fixing jig, and then exposing the substrate glass to the etching solution, the thickness of the portion not desired to be etched can be maintained at a sufficient thickness. Therefore, when manufacturing a window using the window manufacturing method according to an embodiment of the present invention, the overall thickness of the window corresponding to the non-folded portion can be increased, and the thickness of the portion of the window corresponding to the folded portion can be easily reduced to the thickness of a desired shape. Therefore, a window manufactured using the window manufacturing method according to an embodiment of the present invention can exhibit high durability while having high surface quality characteristics.

[0205] Considering the shape of the recessed portion of the thinning region required in the window, by controlling the position where the workpiece fixed to the fixing jig having a curved surface or an inclined surface is exposed to the etching solution and the time for which the workpiece is exposed to the etching solution, a window having excellent surface quality can be manufactured using the window manufacturing apparatus according to an embodiment of the present invention.

[0206] By controlling the position where the etching solution is supplied and the time for which the workpiece is exposed to the etching solution in the process step, the window manufacturing method according to an embodiment of the present invention can provide a window having a desired recessed portion shape and improved surface quality, and there are no discontinuities on the surface of the recessed portion.

[0207] In addition, the window manufacturing apparatus and the window manufacturing method according to an embodiment of the present invention can improve process economy because pretreatment processes and post-processing processes before and after the etching process for thinning can be omitted.

[0208] The present invention should not be construed as limited to the embodiments described herein. On the contrary, these embodiments are provided so that the present disclosure will be thorough and complete, and the present disclosure will fully convey the concept of the present invention to those skilled in the art.

[0209] Although the present invention has been particularly shown and described with reference to its embodiments, those of ordinary skill in the art will understand that various changes in form and detail may be made therein without departing from the spirit or scope of the present invention as defined by the appended claims.

Claims

1. A window manufacturing device, wherein, The window manufacturing apparatus includes: a fixing jig having a placement surface on which a workpiece is fixed, wherein the placement surface includes a curved surface or an inclined surface; and an etching solution supply member provided below the fixing jig, wherein a storage member is defined in the etching solution supply member to accommodate at least a part of the placement surface.

2. The window manufacturing apparatus according to claim 1, wherein, The placement surface protrudes toward the storage member and includes the continuous curved surface or the inclined surface.

3. The window manufacturing device according to claim 2, wherein, The position of the fixing jig is adjusted such that at least a part of the placement surface is located in the storage member.

4. The window manufacturing apparatus according to claim 2, wherein, A vacuum suction inlet is defined on the placement surface.

5. The window manufacturing apparatus according to claim 1, wherein, The fixing jig includes a groove portion that is recessed toward the storage member and extends in one direction.

6. The window manufacturing apparatus according to claim 5, wherein, The placement surface defines the groove portion.

7. The window manufacturing apparatus according to claim 6, wherein, A vacuum suction inlet is defined on the placement surface.

8. The window manufacturing apparatus according to claim 6, wherein, The groove portion includes the continuous curved surface or the inclined surface.

9. The window manufacturing apparatus according to claim 6, wherein, The fixing jig is completely accommodated in the storage member.

10. The window manufacturing apparatus according to claim 1, wherein, The etching solution provided in the storage member is maintained at a constant liquid level, or the liquid level of the etching solution in the storage member is adjusted over time.

11. A window manufacturing method using a window manufacturing apparatus, wherein, The window manufacturing apparatus includes: a fixing jig having a placement surface that includes a curved surface or an inclined surface; and an etching solution supply member provided below the fixing jig, and a storage member is defined in the etching solution supply member to accommodate at least a part of the placement surface. The window manufacturing method includes: bending a base glass to include a bent portion corresponding to the placement surface; fixing the bent base glass to the placement surface of the fixing jig; supplying an etching solution to the storage member of the etching solution supply member; and exposing the base glass fixed to correspond to the curved surface or the inclined surface to the etching solution.

12. The window manufacturing method according to claim 11, wherein, The exposing the base glass to the etching solution includes etching an exposed surface of the base glass to form a window, wherein a recessed portion including the curved surface or the inclined surface is continuously defined on the surface provided with the etching solution.

13. The window manufacturing method according to claim 11, wherein, The exposing the base glass to the etching solution includes controlling at least one selected from the time of exposure to the etching solution and the amount of the etching solution to be provided according to the position of the base glass.

14. The window manufacturing method according to claim 11, wherein, when the bent portion is fixed to the placement surface, the remaining portions of the base glass that are spaced apart from each other and between which the bent portion is interposed are located in a direction in which the remaining portions are spaced apart from the storage member.

15. The window manufacturing method according to claim 11, wherein, the placement surface on which the base glass is fixed has a shape protruding toward the storage member, and the exposing the base glass to the etching solution includes immersing one surface of the base glass in the etching solution of the storage member.

16. The window manufacturing method according to claim 15, wherein, When the base glass is exposed to the etching solution, the thickness of the base glass immersed in the etching solution gradually decreases from the central portion of the fixing jig toward the outer edge of the fixing jig.

17. The window manufacturing method according to claim 11, wherein the placement surface on which the base glass is fixed defines a groove portion that is recessed in the direction toward the storage member, and exposing the base glass to the etching solution includes accommodating the fixing jig to which the base glass is fixed in the storage member to supply the etching solution to a part of the base glass.

18. The window manufacturing method according to claim 17, wherein, Exposing the base glass to the etching solution includes controlling the liquid level of the etching solution supplied to the storage member.

19. The window manufacturing method according to claim 11, wherein, The window manufacturing method further includes: before bending the base glass, attaching a protective film to one surface of the base glass.

20. The window manufacturing method according to claim 19, wherein, When fixing the base glass to the placement surface of the fixing jig, attaching the protective film to the placement surface.

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