Electrodeposition system with temperature early warning function and temperature early warning method

Abstract

The invention provides a temperature early warning electrodeposition system and a temperature early warning method.The electrodeposition system comprises at least two electrolytic baths, each electrolytic bath is internally and independently provided with at least one polar plate set which extends into electrolyte in the electrolytic bath and is arranged side by side, and each polar plate set comprises a cathode plate and an anode plate which are arranged side by side; each cathode plate is independently connected with a copper rod; the electro-deposition system further comprises a temperature measuring device and an early warning device, and the temperature measuring device is used for measuring the temperature of all the copper rods and transmitting the temperature data corresponding to each copper rod to the early warning device. When electro-deposition is carried out in the electro-deposition system, the temperature measuring device can monitor the temperature of all the copper bars, when the temperature of the copper bars is abnormal, it can be judged that electro-deposition of the cathode plates corresponding to the copper bars is abnormal, and therefore the early warning device gives an alarm and indicates the positions of the copper bars with the abnormal temperature, measures can be taken in time, and the work efficiency is improved. And the risk that the quality of a deposition product becomes poor is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of electrodeposition, and relates to an electrodeposition system with temperature warning, and particularly to an electrodeposition system with temperature warning and a temperature warning method. Background Art

[0002] With the rapid development of society, the demand for electrodeposited nickel products at home and abroad has gradually increased. At the same time, the price of nickel sulfate, the raw material for producing electrodeposited nickel, has skyrocketed several times. As a result, the quality requirements for the produced nickel plates will become higher and higher.

[0003] In the actual production process of electrodeposited nickel, due to reasons such as too high local current density, poor electrolyte circulation, deposits on the electrode surface, anode corrosion or short circuit, etc., the quality of the prepared nickel plates will be deteriorated; if one of these problems is not discovered in time, it will have an irreparable impact on the quality of the nickel plates.

[0004] CN106637367A discloses an electroplating bath for ceramic nickel plating of new energy vehicles, including: a bath body and a partition plate. A plurality of the partition plates divide the bath body into a plurality of electroplating baths. A nickel plate chamber is arranged in the electroplating bath, and the distance between the nickel plate chamber and the partition plate is 25 mm; the thickness of the partition plate is 15 mm. A reinforcing rib is arranged at each of the upper and lower ends of the partition plate (2), the width of the reinforcing rib is 35 mm, and the thickness of the reinforcing rib is 20 mm. However, this electroplating bath for ceramic nickel plating of new energy vehicles is difficult to timely detect abnormal situations during electroplating, and the risk of having a nickel layer with poor quality is relatively high.

[0005] CN118704058A discloses a low-temperature preparation method for a corrosion-resistant coating on the surface of a manganese copper damping alloy. Step S1: Pretreat the surface of the manganese copper damping alloy substrate; S2: Suspend the pretreated manganese copper damping alloy substrate with a copper rod and put it into the electroless nickel plating solution. The components of the solution include nickel sulfate, nickel chloride, boric acid and ammonia water; the electroless nickel plating temperature is 40 - 58 °C. After nickel plating for 10 minutes, change the hanging point, continue nickel plating for 10 minutes, and then take out the manganese copper damping alloy substrate, wash it with deionized water and immediately perform electroplating; S3: Electroplate a nickel-tungsten coating on the nickel-plated manganese copper damping alloy. The electroplating adopts a hanging plating process. The components of the electroplating solution include nickel sulfate, sodium tungstate, citric acid and ammonia water. The electroplating temperature is 40 - 58 °C, and the pH value is between 5 and 7; S4: Perform a sealing treatment on the electroplated manganese copper damping alloy. However, this low-temperature preparation method for a corrosion-resistant coating on the surface of a manganese copper damping alloy cannot timely detect abnormalities during the preparation process, and the risk of having a surface corrosion-resistant coating with poor quality is relatively high.

[0006] The electroplating systems for temperature warning disclosed in the prior art all have certain defects, and it is difficult to timely detect abnormalities during the preparation process, resulting in a risk of deterioration in the quality of the deposited products. Therefore, it is crucial to develop and design a new electroplating system for temperature warning and a temperature warning method. Summary of the Invention

[0007] Aiming at the deficiencies of the prior art, the purpose of the present invention is to provide an electroplating system for temperature warning and a temperature warning method. In this application, an electroplating system for temperature warning is provided. When electroplating is carried out in the electroplating system, the temperature measuring device can monitor the temperatures of all copper rods. When the temperature of a copper rod is abnormal, it can be determined that the electroplating of the cathode plate corresponding to this copper rod is abnormal. Then, an alarm is issued by the warning device, and the position of the copper rod with abnormal temperature is indicated. Thus, measures can be taken in a timely manner. The electroplating system can timely detect abnormalities during the electroplating process and give a warning, so that measures can be taken in a timely manner, reducing the risk of deterioration in the quality of the deposited products.

[0008] To achieve this purpose, the present invention adopts the following technical solutions:

[0009] In the first aspect, the present invention provides an electroplating system for temperature warning. The electroplating system includes at least two electrolytic cells. In each electrolytic cell, at least one set of electrode plate groups arranged side by side and extending into the electrolyte in the electrolytic cell is independently provided. The electrode plate group includes a cathode plate and an anode plate arranged side by side. Each cathode plate is independently connected to a copper rod.

[0010] The electroplating system further includes a temperature measuring device and a warning device. The temperature measuring device is used to measure the temperatures of all the copper rods and transmit the temperature data corresponding to each copper rod to the warning device.

[0011] During the actual production process of electroplating nickel, too high local current density, poor electrolyte circulation, deposits on the electrode surface, and anode corrosion or short circuit will all cause the temperature of the copper rod connected to the cathode plate in the electrolytic cell to rise.

[0012] Therefore, in this application, an electroplating system for temperature warning is provided. When electroplating is carried out in the electroplating system, the temperature measuring device can monitor the temperatures of all copper rods. When the temperature of a copper rod is abnormal, it can be determined that the electroplating of the cathode plate corresponding to this copper rod is abnormal. Then, an alarm is issued by the warning device, and the position of the copper rod with abnormal temperature is indicated. Thus, measures can be taken in a timely manner. The electroplating system can timely detect abnormalities during the electroplating process and give a warning, so that measures can be taken in a timely manner, reducing the risk of deterioration in the quality of the deposited products.

[0013] Preferably, the temperature measuring device includes a central temperature controller separately arranged from all electrolytic cells and copper bars. The central temperature controller measures the temperatures of all the copper bars through infrared measurement and transmits the temperature data corresponding to each copper bar to the warning device.

[0014] Preferably, the temperature measuring device includes temperature measuring chips separately and independently arranged inside each of the copper bars. Each temperature measuring chip converts the measured temperature data into a wireless signal and then transmits it to the warning device.

[0015] Preferably, the warning device includes a temperature receiver and an alarm electrically connected to the temperature receiver.

[0016] Preferably, each of the copper bars is separately and independently arranged at the opening of the corresponding electrolytic cell, and both ends of each copper bar are separately and independently placed on the tops of two opposite side walls of the corresponding electrolytic cell.

[0017] Preferably, the electroplating system includes at least two rows of electrolytic cell columns. Each electrolytic cell column includes at least two electrolytic cells arranged side by side. Parallelly arranged copper buses are separately and independently arranged on two opposite sides of each electrolytic cell column. Both ends of all the copper bars corresponding to the cathode plates in the electrolytic cells within each electrolytic cell column are respectively placed on two copper buses.

[0018] Preferably, adjacent sides of adjacent electrolytic cell columns share a copper bus.

[0019] Preferably, each cathode plate is separately and independently connected to the corresponding copper bar through two nickel ear tabs.

[0020] Preferably, the cathode plate includes a titanium plate with a nickel layer covering its surface.

[0021] Preferably, each cathode plate is separately and independently equipped with a diaphragm bag, and each cathode plate is separately and independently arranged inside the corresponding diaphragm bag.

[0022] Preferably, diaphragm racks are arranged on two opposite side walls inside each electrolytic cell, and the diaphragm racks are used to fix the diaphragm bags.

[0023] Preferably, the anode plate includes an inert anode.

[0024] In a second aspect, the present invention provides a temperature warning method using the electroplating system described in the first aspect. The temperature warning method includes:

[0025] (1) During the electroplating process, the temperature measuring device measures the temperatures of the copper bars corresponding to each electrolytic cell and transmits the temperature data corresponding to each copper bar to the warning device;

[0026] (2) The warning device automatically determines whether the temperature of the copper rods is within the normal temperature range;

[0027] If the temperatures of all copper rods are within the normal temperature range, the warning device is silent;

[0028] If the temperature of at least one copper rod is not within the normal temperature range, the warning device issues a warning signal and displays the position information of the copper rod whose temperature is not within the normal temperature range.

[0029] In the present invention, after the temperature measuring device measures the temperatures of all copper rods, the warning device determines the electrolysis status in the electrolytic cell corresponding to each copper rod according to the temperature of each copper rod; if the warning device determines that the temperature of at least one copper rod is higher than the normal temperature range, it is determined that the electrolysis situation in the electrolytic cell corresponding to the copper rod is abnormal, issues a warning signal and displays the position of the copper rod with abnormal temperature; the warning method provided by the present invention realizes the warning and positioning of copper plates with abnormal temperature, thereby realizing the positioning of the position of the electrolytic cell where the abnormality occurs, and thus realizing the optimization of the electroplating process and ensuring the smooth progress of the electroplating process.

[0030] Preferably, the temperature of the normal temperature range in step (2) is ≤ 45 °C, for example, it can be 5 °C, 10 °C, 15 °C, 20 °C, 25 °C, 30 °C, 35 °C, 40 °C or 45 °C, but is not limited to the listed values, and other unlisted values within this numerical range are equally applicable, preferably ≤ 40 °C.

[0031] As a preferred technical solution of the temperature warning method of the present invention, the temperature warning method includes:

[0032] (1) During the electroplating process, after the central temperature controller measures the temperatures of all the copper rods by infrared measurement, and / or after the temperature measuring chip measures the temperatures of all the copper rods, the temperature data corresponding to each copper rod is transmitted to the warning device;

[0033] (2) After the temperature receiver of the warning device receives the temperatures of all the copper rods, it automatically determines whether the temperature of the copper rods is ≤ 40 °C;

[0034] If the temperatures of all copper rods are ≤ 40 °C, the alarm of the warning device is silent;

[0035] If the temperature of at least one copper rod > 45 °C, the alarm of the warning device issues a warning signal and displays the position information of all copper rods with temperature > 45 °C.

[0036] The numerical range described in the present invention includes not only the above-listed point values, but also any point values between the above numerical ranges that are not listed. Due to space limitations and for the sake of simplicity, the present invention does not exhaustively list the specific point values included in the range.

[0037] Compared with the prior art, the present invention has the following beneficial effects:

[0038] In the present application, an electroplating system with temperature warning is provided. When electroplating is carried out in the electroplating system, the temperature measuring device can monitor the temperatures of all copper bars. When the temperature of a copper bar is abnormal, it can be determined that the electroplating of the cathode plate corresponding to this copper bar is abnormal. Thereby, an alarm is issued by the warning device, and the position of the copper bar with abnormal temperature is indicated. Then, measures can be taken in time; the electroplating system can timely detect the abnormality in the electroplating process and give a warning, so that measures can be taken in time, reducing the risk of the quality of the deposited product deteriorating. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 is a schematic structural diagram of an electrolytic cell in a specific embodiment of the present invention.

[0040] Figure 2 is a combined view of an electrolytic cell, copper bars and cathode plates in a specific embodiment of the present invention.

[0041] Figure 3 is a physical diagram of a cathode plate in a specific embodiment of the present invention.

[0042] Figure 4 is a side view of a row of electrolytic cells in a specific embodiment of the present invention.

[0043] Figure 5 is a on-site actual photo of electroplating using the temperature warning method in Application Example 1.

[0044] Wherein, 1 - electrolytic cell; 2 - cathode plate; 3 - copper bar; 4 - nickel ear. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0045] The technical solution of the present invention will be further described below through specific embodiments. Those skilled in the art should understand that the embodiments are only for helping to understand the present invention and should not be regarded as specific limitations on the present invention.

[0046] In a specific embodiment, the present invention provides an electroplating system with temperature warning. The electroplating system includes at least two electrolytic cells as shown in Figure 1 , and in each of the electrolytic cells, at least one set of plate groups arranged side by side and extending into the electrolyte in the electrolytic cell is independently provided. The plate group includes a cathode plate and an anode plate (not shown in the figure) arranged side by side, as shown in Figure 2 , and in each cathode plate as shown in Figure 3 , a copper bar is independently connected.

[0047] The electroplating system further includes a temperature measuring device (not shown in the figure) and a warning device (not shown in the figure). The temperature measuring device is used to measure the temperatures of all the copper bars and transmit the temperature data corresponding to each copper bar to the warning device.

[0048] During the actual production process of electroplating nickel, the increase in the temperature of the copper bars connected to the cathode plates in the electrolytic cell will occur due to too high local current density, poor electrolyte circulation, deposits on the electrode surface, anode corrosion, or short circuit.

[0049] Therefore, in this application, an electroplating system with temperature warning is provided. When electroplating is carried out in the electroplating system, the temperature measuring device can monitor the temperatures of all the copper bars. When the temperature of a copper bar is abnormal, it can be determined that the electroplating of the cathode plate corresponding to this copper bar is abnormal. Thus, the warning device issues an alarm and indicates the position of the copper bar with abnormal temperature, so that measures can be taken in time. The electroplating system can timely detect the abnormalities in the electroplating process and give warnings, so that measures can be taken in time, reducing the risk of the quality deterioration of the deposited products.

[0050] Further, the temperature measuring device includes a central temperature controller separately arranged from all the electrolytic cells and copper bars. The central temperature controller obtains the temperatures of all the copper bars through infrared measurement and transmits the temperature data corresponding to each copper bar to the warning device.

[0051] Further, the temperature measuring device includes temperature measuring chips respectively and independently arranged inside each copper bar. Each temperature measuring chip converts the measured temperature data into a wireless signal and then transmits it to the warning device.

[0052] Further, the warning device includes a temperature receiver and an alarm electrically connected to the temperature receiver.

[0053] Further, each copper bar is respectively and independently arranged at the opening of the corresponding electrolytic cell, and both ends of each copper bar are respectively and independently placed on the tops of two opposite side walls of the corresponding electrolytic cell.

[0054] Further, as Figure 4 shown, the electroplating system includes at least two rows of electrolytic cell columns. Each electrolytic cell column includes at least two electrolytic cells arranged side by side. Parallel copper buses are respectively and independently arranged on both opposite sides of each electrolytic cell column. Both ends of all the copper bars corresponding to the cathode plates in the electrolytic cells within each electrolytic cell column are respectively placed on two copper buses (not shown in the figure).

[0055] Further, one copper bus is shared by the adjacent sides of the adjacent electrolytic cell columns.

[0056] Further, each of the cathode plates is connected to the corresponding copper bar through two nickel tabs independently.

[0057] Further, the cathode plate includes a titanium plate with a nickel layer covering its surface.

[0058] Further, each of the cathode plates is independently equipped with a diaphragm bag (not shown in the figure), and each of the cathode plates is independently disposed inside the corresponding diaphragm bag.

[0059] Further, diaphragm racks are provided on two opposite side walls in each of the electrolytic cells, and the diaphragm racks are used to fix the diaphragm bags.

[0060] Further, the anode plate includes an inert anode.

[0061] Example 1

[0062] This example provides an electroplating system with temperature warning. The electroplating system includes at least two rows of electrolytic cell columns, and each of the electrolytic cell columns includes at least two electrolytic cells arranged side by side;

[0063] At least one set of plate groups arranged side by side and extending into the electrolyte in the electrolytic cell are independently provided in each of the electrolytic cells. The plate groups include cathode plates and anode plates arranged side by side. Each of the cathode plates is independently connected to a copper bar through two nickel tabs;

[0064] Each of the copper bars is independently disposed at the opening of the corresponding electrolytic cell, and both ends of each of the copper bars are independently placed on the tops of two opposite side walls of the corresponding electrolytic cell;

[0065] Parallel copper buses are independently provided on two opposite sides of each of the electrolytic cell columns. Both ends of all the copper bars corresponding to the cathode plates in the electrolytic cells in each of the electrolytic cell columns are placed on the two copper buses;

[0066] The electroplating system further includes a temperature measuring device and a warning device. The temperature measuring device is used to measure the temperatures of all the copper bars and transmit the temperature data corresponding to each copper bar to the warning device;

[0067] The temperature measuring device includes a central temperature controller separately disposed from all the electrolytic cells and copper bars. The central temperature controller obtains the temperatures of all the copper bars through infrared measurement and transmits the temperature data corresponding to each copper bar to the warning device;

[0068] The warning device includes a temperature receiver and an alarm electrically connected to the temperature receiver.

[0069] Example 2

[0070] This embodiment provides an electroplating system with temperature warning. The electroplating system includes at least two rows of electrolytic cell columns, and each electrolytic cell column includes at least two electrolytic cells arranged side by side;

[0071] In each electrolytic cell, at least one set of electrode plate groups arranged side by side and extending into the electrolyte in the electrolytic cell is independently provided. The electrode plate group includes a cathode plate and an anode plate arranged side by side. On each cathode plate, a copper bar is independently connected through two nickel lugs;

[0072] Each copper bar is independently arranged at the opening of the corresponding electrolytic cell, and both ends of each copper bar are independently placed on the tops of two opposite side walls of the corresponding electrolytic cell;

[0073] On both sides of each electrolytic cell column arranged opposite to each other, copper buses arranged in parallel are independently provided. Both ends of all the copper bars corresponding to the cathode plates in the electrolytic cells within each electrolytic cell column are placed on two copper buses;

[0074] The electroplating system further includes a temperature measuring device and a warning device. The temperature measuring device is used to measure the temperatures of all the copper bars and transmit the temperature data corresponding to each copper bar to the warning device;

[0075] The temperature measuring device includes temperature measuring chips independently arranged inside each copper bar. Each temperature measuring chip converts the measured temperature data into a wireless signal and then transmits it to the warning device;

[0076] The warning device includes a temperature receiver and an alarm electrically connected to the temperature receiver.

[0077] This embodiment also provides a temperature warning method using the electroplating system. The temperature warning method includes:

[0078] (1) After the temperature measuring chips measure the temperatures of all the copper bars, the temperature data corresponding to each copper bar is transmitted to the warning device;

[0079] (2) After the temperature receiver of the warning device receives the temperatures of all the copper bars, it automatically determines whether the temperature of the copper bar is ≤ 40°C;

[0080] If the temperatures of all the copper bars are ≤ 40°C, the alarm of the warning device is silent;

[0081] If the temperature of at least one copper bar is > 40°C, the alarm of the warning device emits a warning signal and displays the position information of all the copper bars with a temperature > 45°C.

[0082] Comparative Example 1

[0083] This comparative example provides an electrodeposition system, which is the same as Example 1 except that the temperature measurement device and the warning device in the electrodeposition system are omitted.

[0084] Application Example 1

[0085] This application example provides a temperature warning method using the electrodeposition system described in Example 1. The temperature warning method includes:

[0086] (1) As shown, during the electrodeposition process, after the central temperature controller obtains the temperatures of all the copper rods through infrared measurement, it transmits the temperature data corresponding to each copper rod to the warning device; Figure 5 During the electrodeposition process, after the central temperature controller obtains the temperatures of all the copper rods through infrared measurement, it transmits the temperature data corresponding to each copper rod to the warning device;

[0087] (2) After the temperature receiver of the warning device receives the temperatures of all the copper rods, it automatically determines whether the temperature of the copper rods is ≤ 40°C;

[0088] If the temperatures of all the copper rods are ≤ 40°C, the alarm of the warning device is silent;

[0089] If the temperature of at least one copper rod > 40°C, the alarm of the warning device emits a warning signal and displays the position information of all the copper rods with a temperature > 45°C.

[0090] Application Example 2

[0091] This application example provides a temperature warning method using the electrodeposition system described in Example 1. The temperature warning method includes:

[0092] (1) During the electrodeposition process, after the temperature measurement chip measures the temperatures of all the copper rods, it transmits the temperature data corresponding to each copper rod to the warning device;

[0093] (2) After the temperature receiver of the warning device receives the temperatures of all the copper rods, it automatically determines whether the temperature of the copper rods is ≤ 40°C;

[0094] If the temperatures of all the copper rods are ≤ 40°C, the alarm of the warning device is silent;

[0095] If the temperature of at least one copper rod > 40°C, the alarm of the warning device emits a warning signal and displays the position information of all the copper rods with a temperature > 45°C.

[0096] Application Example 3

[0097] This application example provides a temperature warning method using the electrodeposition system described in Example 1. Except that after the temperature receiver of the warning device receives the temperatures of all the copper rods, it automatically determines whether the temperature of the copper rods is ≤ 45°C;

[0098] If the temperatures of all the copper rods are ≤ 45°C, the alarm of the warning device is silent;

[0099] If the temperature of at least one copper rod > 45°C, the alarm of the warning device emits a warning signal, and in addition to displaying the position information of all copper rods with a temperature > 45°C, the rest are the same as in Example 1.

[0100] Application Example 4

[0101] This application example provides a temperature warning method using the electroplating system described in Example 1. After the temperature receiver of the warning device receives the temperatures of all the copper rods, it automatically determines whether the temperature of the copper rods is ≤ 48°C;

[0102] If the temperatures of all copper rods are ≤ 48°C, the alarm of the warning device is silent;

[0103] If the temperature of at least one copper rod > 48°C, the alarm of the warning device emits a warning signal, and in addition to displaying the position information of all copper rods with a temperature > 48°C, the rest are the same as in Example 1.

[0104] Comparative Application Example 1

[0105] This comparative application example provides an electroplating method using the electroplating system described in the comparative example. During the electroplating process, no warning is given, and electroplating continues.

[0106] Using the methods in the above application examples and comparative application examples for batch electroplating of nickel, the quality of the electroplated nickel products obtained is tested, and the qualified rates of the electroplated nickel products obtained by testing are shown in Table 1.

[0107] Table 1

[0108] Qualified rate (%) Application Example 1 99 Application Example 2 98 Application Example 3 96 Application Example 4 92 Comparative Application Example 1 88

[0109] It can be seen from Table 1 that:

[0110] (1) Using the electroplating system and temperature warning method provided by the present invention for electroplating, the qualified rate of the finally obtained electroplated nickel products is relatively high;

[0111] (2) By comparing Application Example 1 with Application Examples 3 and 4, it can be seen that the range of the normal temperature range in the present invention will affect the qualified rate of the electroplated nickel products; the temperature of the normal temperature range is ≤ 45°C, preferably ≤ 40°C, and the qualified rate of the electroplated nickel products is relatively high. This is because the normal temperature of the copper rods during nickel deposition is ≤ 45°C, preferably ≤ 40°C. When the temperature of the copper rods is too high, the electroplating will be abnormal and needs to be processed;

[0112] (3) It can be seen from the comparison between Application Example 1 and the Comparative Application Example that the present application provides an electroplating system with temperature warning. When electroplating is carried out in the electroplating system, the temperature measuring device can monitor the temperatures of all copper bars. When the temperature of a copper bar is abnormal, it can be determined that the electroplating of the cathode plate corresponding to this copper bar is abnormal. Thus, an alarm is issued by the warning device, and the position of the copper bar with abnormal temperature is indicated. Then, measures can be taken in a timely manner; the electroplating system can timely detect abnormalities during the electroplating process and give warnings, so that measures can be taken in a timely manner, reducing the risk of deterioration of the quality of the deposited product.

[0113] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by any person skilled in the art within the technical scope disclosed by the present invention fall within the protection scope and the disclosure scope of the present invention.

Claims

1. An electroplating system for temperature warning, characterized in that, The electroplating system includes at least two electrolytic cells, and in each of the electrolytic cells, at least one set of plate groups arranged side by side and extending into the electrolyte in the electrolytic cell is independently provided. The plate group includes a cathode plate and an anode plate arranged side by side, and a copper rod is independently connected to each of the cathode plates; The electroplating system further includes a temperature measuring device and a warning device. The temperature measuring device is used to measure the temperatures of all the copper rods and transmit the temperature data corresponding to each copper rod to the warning device.

2. The electrodeposition system according to claim 1, wherein The temperature measuring device includes a central temperature controller separately arranged from all the electrolytic cells and copper rods. The central temperature controller obtains the temperatures of all the copper rods through infrared measurement and transmits the temperature data corresponding to each copper rod to the warning device.

3. The electrodeposition system according to claim 1, characterized in that, The temperature measuring device includes temperature measuring chips independently arranged inside each of the copper rods. Each temperature measuring chip converts the measured temperature data into a wireless signal and then transmits it to the warning device.

4. The electrodeposition system according to any one of claims 1 to 3, characterized in that, The warning device includes a temperature receiver and an alarm electrically connected to the temperature receiver.

5. The electrodeposition system according to any one of claims 1 to 4, characterized in that, Each of the copper rods is independently arranged at the opening of the corresponding electrolytic cell, and both ends of each copper rod are independently placed on the tops of two opposite side walls of the corresponding electrolytic cell.

6. The electrodeposition system according to any one of claims 1 to 5, characterized in that, The electroplating system includes at least two rows of electrolytic cell columns. Each electrolytic cell column includes at least two electrolytic cells arranged side by side. Parallel copper buses are independently arranged on both opposite sides of each electrolytic cell column. Both ends of all the copper rods corresponding to the cathode plates in the electrolytic cells within each electrolytic cell column are placed on the two copper buses.

7. The electrodeposition system according to any one of claims 1 to 6, characterized in that, Each of the cathode plates is independently connected to the corresponding copper rod through two nickel ear tabs.

8. A temperature warning method using the electrodeposition system according to any one of claims 1 to 7, characterized in that, The temperature warning method includes: (1) During the electroplating process, the temperature measuring device measures the temperatures of the copper rods corresponding to each electrolytic cell and transmits the temperature data corresponding to each copper rod to the warning device; (2) The warning device automatically determines whether the temperatures of the copper rods are within the normal temperature range; If the temperatures of all the copper rods are within the normal temperature range, the warning device remains silent; If the temperature of at least one copper rod is not within the normal temperature range, the warning device issues a warning signal and displays the position information of the copper rods whose temperatures are not within the normal temperature range.

9. The temperature warning method according to claim 8, wherein The temperature of the normal temperature range in step (2) is ≤45°C, preferably ≤40°C.

10. The temperature warning method according to claim 8 or 9, characterized in that The temperature warning method includes: (1) During the electroplating process, after the central temperature controller obtains the temperatures of all the copper rods through infrared measurement and / or the temperature measuring chips measure the temperatures of all the copper rods, the temperature data corresponding to each copper rod is transmitted to the warning device; (2) After the temperature receiver of the warning device receives the temperatures of all the copper rods, it automatically determines whether the temperatures of the copper rods are ≤40°C; If the temperatures of all the copper rods are ≤40°C, the alarm of the warning device remains silent; If the temperature of at least one copper rod >40°C, the alarm of the warning device issues a warning signal and displays the position information of all the copper rods whose temperatures >45°C.

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