Pre-laminating mechanism and method

Abstract

The invention relates to a pre-laminating mechanism and method.The pre-laminating mechanism comprises a center positioning device used for centering a first material and a second material; the laminating base station is used for fixing the second material; the automatic feeding device is used for conveying the first material and the second material between the central positioning device and the laminating base station; and finally, the attaching face of the first material is attached to the attaching face of the second material on the attaching base station. The pre-lamination mechanism can complete automatic processing of pre-lamination of the first material and the second material, so that the processing efficiency is improved, the lamination precision is high, the lamination environment is good, the lamination surface is not easy to pollute, and the yield of subsequent bonding and the qualified rate of products are improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and particularly to a pre-bonding mechanism and method. Background Art

[0002] In the production process of some light-emitting chips, it is necessary to transfer the epitaxial layer on the epitaxial wafer to a carrier substrate. For example, in a red light LED chip, an epitaxial layer is grown on a gallium arsenide substrate. After the growth of the epitaxial layer is completed, it is necessary to remove the light-absorbing gallium arsenide substrate and transfer the epitaxial layer to other light-transmitting substrates for subsequent production. During the transfer of the epitaxial layer, it is necessary to pre-bond the epitaxial wafer and the carrier substrate. Currently, the pre-bonding of the epitaxial wafer and the carrier substrate is all manual bonding. Manual bonding not only has low efficiency, but also poor bonding accuracy, and is prone to contamination during the bonding process, reducing the product qualification rate.

[0003] Therefore, how to pre-bond the epitaxial wafer and the carrier substrate to improve the product qualification rate is an urgent problem to be solved. Summary of the Invention

[0004] In view of the deficiencies of the above-mentioned related technologies, the purpose of the present application is to provide a pre-bonding mechanism and method, aiming to solve the problem of low product qualification rate caused by manual bonding.

[0005] A pre-bonding mechanism includes:

[0006] A center positioning device for centering the first material and the second material;

[0007] A bonding base for fixing the second material;

[0008] An automatic feeding device for conveying the first material and the second material between the center positioning device and the bonding base; finally, the bonding surface of the first material is bonded to the bonding surface of the second material on the bonding base.

[0009] The above pre-bonding mechanism includes a center positioning device, a bonding base, and an automatic feeding device. Among them, after the first material and the second material to be bonded are centered by the center positioning device, the first material and the second material during bonding can have good alignment, improving the bonding accuracy. Through the conveyance of the automatic feeding device, the bonding surface of the first material can be disposed opposite to the bonding surface of the second material for bonding. The pre-bonding mechanism can complete the automated processing of pre-bonding the first material and the second material, improving the processing efficiency. Not only is the bonding accuracy high, but the bonding environment is also good, and it is not easy to contaminate the bonding surface, improving the yield of subsequent bonding and the product qualification rate.

[0010] Optionally, the bonding base includes a second carrier for fixing the second material. The bonding base further includes a magnetically conductive sheet that can be removed and is disposed on the side of the second carrier away from the fixing of the second material. The automatic feeding device includes an electromagnetic chuck configured to generate a magnetic force after being energized to adsorb the magnetically conductive sheet, and fix the first material and the second material between the magnetically conductive sheet and the electromagnetic chuck for transfer. During the process of the automatic feeding device transferring the first material and the second material away from the bonding base, the first material and the second material can be stably clamped through the magnetically conductive sheet and the electromagnetic chuck, avoiding the situation of material dropping off. Until the first material and the second material are sent to the subsequent bonding fixture, the electromagnetic chuck can be de-energized to release the magnetically conductive sheet for recycling.

[0011] Based on the same inventive concept, the present application also provides a pre-bonding method, including:

[0012] Providing the pre-bonding mechanism as described above;

[0013] Respectively transporting the first material and the second material to the center positioning device through the automatic feeding device, and the center positioning device respectively centers the first material and the second material;

[0014] Transporting the second material to the bonding base through the automatic feeding device, and the bonding base fixes the second material;

[0015] Transporting the first material to the bonding base through the automatic feeding device, and making the bonding surface of the first material fit with the bonding surface of the second material on the bonding base.

[0016] In the above pre-bonding method, after the first material and the second material to be bonded are centered by the center positioning device, the first material and the second material during bonding can have good alignment, improving the bonding accuracy. Through the transportation of the automatic feeding device, the bonding surface of the first material and the bonding surface of the second material can be relatively arranged for bonding. The pre-bonding method completes the automated processing of pre-bonding the first material and the second material, improving the processing efficiency. Not only is the bonding accuracy high, but the bonding environment is also good, and it is not easy to contaminate the bonding surface, improving the yield of subsequent bonding and the qualification rate of the product. Description of the Drawings

[0017] Figure 1 It is a schematic structural diagram of a pre-bonding mechanism provided by an embodiment of the present application;

[0018] Figure 2 It is a schematic structural diagram of an automatic flipping device provided by an embodiment of the present application;

[0019] Figure 3Schematic diagram of the structure of the fitting base provided by the embodiment of the present application;

[0020] Figure 4 Schematic diagram of the structure of the fourth manipulator provided by the embodiment of the present application;

[0021] Figure 5 Schematic diagram of the structure in which the suction head of the automatic feeding device provided by the embodiment of the present application adsorbs the magnetic conductive sheet;

[0022] Figure 6 Schematic diagram of the structure of the automatic feeding device including a preprocessing device and an automatic flipping device provided by the embodiment of the present application;

[0023] Figure 7 Flow chart of a pre-fitting method provided by another optional embodiment of the present application;

[0024] Explanation of reference numerals:

[0025] 1 - Preprocessing device; 2 - Central positioning device; 3 - Fitting base; 301 - Magnetic conductive sheet; 302 - Moving sleeve; 303 - Support column; 304 - Fixed seat; 4 - Automatic flipping device; 401 - Base; 402 - Column; 403 - Motor; 404 - Turntable; 5 - Automatic feeding device; 501 - Suction head; 502 - Connector; 503 - Three-axis drive assembly; 6 - First material; 7 - Second material. Detailed implementation manners

[0026] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant accompanying drawings. The preferred embodiments of the present application are shown in the accompanying drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided so that the disclosure of the present application can be understood more thoroughly and comprehensively.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs. The terms used in the specification of the present application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0028] In the manufacturing process of red light LED chips, an epitaxial layer is grown on a gallium arsenide substrate. After the epitaxial layer growth is completed, it is necessary to remove the light-absorbing gallium arsenide substrate and transfer the epitaxial layer to other light-transmitting substrates for subsequent manufacturing. During the transfer of the epitaxial layer, it is necessary to pre-fit the epitaxial wafer and the carrier substrate. At present, the pre-fitting of the epitaxial wafer and the carrier substrate is all manual fitting. Manual fitting not only has low efficiency, but also poor fitting accuracy, and is prone to contamination during the fitting process, reducing the product qualification rate.

[0029] Based on this, the present application hopes to provide a solution that can solve the above technical problems, and its detailed content will be elaborated in the subsequent embodiments.

[0030] This embodiment provides a pre-bonding mechanism, which can be applied to the transfer of the epitaxial layer. For example, the epitaxial layer can be transferred from the growth substrate to the sapphire substrate, but it is not limited to this. The pre-bonding mechanism in this embodiment can also be applied to other processes that require pre-bonding of two materials. As Figures 1-6 shown, the pre-bonding mechanism in this embodiment includes: a central positioning device 2, a bonding base 3, and an automatic feeding device 5. It can be understood that in this embodiment, there is no specific limitation on the layout settings between the devices included in the pre-bonding mechanism, and it can be set according to the on-site needs. For example, it can be as Figure 1 shown, the automatic feeding device 5 is arranged in the middle, and the central positioning device 2 and the bonding base 3 are respectively arranged on both sides of the automatic feeding device 5.

[0031] The central positioning device 2 in this embodiment is used to center the first material 6 and the second material 7. It can be understood that centering the first material 6 and the second material 7 is to position the angles and central positions of the first material 6 and the second material 7. After centering by the central positioning device 2, subsequent transfer and processing can be carried out based on the central positions of the first material 6 and the second material 7. When bonding, the first material 6 and the second material 7 can have good alignment, improving the bonding accuracy. The central positioning device 2 in this embodiment can be an edge finder, such as a CCD (Charge-coupled Device) edge finder, but it is not limited to this. The central positioning device 2 can also be other devices that can complete the centering of the first material 6 and the second material 7, and this embodiment does not make specific limitations on this either.

[0032] The bonding base 3 in this embodiment is used to fix the second material 7. It can be understood that the bonding base 3 in this embodiment can fix the second material 7 through but not limited to vacuum adsorption. In this embodiment, it can be the other side of the second material 7 opposite to the bonding surface that contacts the bonding base 3.

[0033] The automatic feeding device 5 in this embodiment is used to convey the first material 6 and the second material 7 between the central positioning device 2 and the bonding base 3; finally, the bonding surface of the first material 6 is made to be in contact with the bonding surface of the second material 7 on the bonding base 3. This enables the pre-bonding mechanism to complete the automated processing of pre-bonding the first material 6 and the second material 7, improving the processing efficiency. Not only is the bonding accuracy high, but the bonding environment is also good, not easily polluting the bonding surface, improving the yield of subsequent bonding and the qualification rate of the product. It can be understood that the automatic feeding device 5 in this embodiment can be a manipulator, and through program settings, the manipulator can complete any feeding steps required in the pre-bonding mechanism.

[0034] In some embodiments, when a pre - fitting needs to be completed between two materials to be joined through a fitting layer, the pre - fitting mechanism may further include a pre - processing device 1 and an automatic flipping device 4. The pre - processing device 1 is used to form a fitting layer on the first material 6 and the second material 7; the automatic flipping device 4 is used to flip the first material 6 after centering. When the pre - fitting mechanism includes the pre - processing device 1 and the automatic flipping device 4, the layout settings between the devices can also be set according to specific needs. For example, as Figure 6 shown, the automatic feeding device 5 can be arranged in the middle of the pre - fitting mechanism, and the other devices are arranged on both sides of the automatic feeding device 5. It is also possible to arrange the automatic feeding device 5 on one side of the pre - fitting mechanism, and the pre - processing device 1, the center positioning device 2, the automatic flipping device 4, and the fitting base 3 are arranged in sequence on the other side of the pre - fitting mechanism. In some embodiments, a fitting layer may not be additionally provided between the two materials to be joined, and the surfaces of the two materials can be directly joined through process settings. At this time, the pre - fitting of the two materials can be completed through the center positioning device 2, the fitting base 3, and the automatic feeding device 5.

[0035] It can be understood that the present embodiment does not specifically limit the material of the fitting layer formed by the pre - processing device 1 on the material. For example, it can be, but is not limited to, a glue layer or a metal layer. When the fitting layer is a glue layer, it can be completed by a glue - coating device, such as an automatic glue - spreading machine, but is not limited thereto. It can also be other devices that can form a fitting layer on the first material 6 and the second material 7. In some application scenarios, after forming a glue layer on the first material 6 and the second material 7, the first material 6 and the second material 7 can also be baked to cure the glue layer. The baking can be completed in the glue - coating device, that is, the glue - coating device in this embodiment can have a baking function. The baking can also be completed in a baking device separately set in the pre - fitting mechanism. The present embodiment does not specifically limit this. In some application scenarios, when the fitting layer is a metal layer, a vapor deposition device, among others, can be used to form a fitting metal layer on the material. It can be understood that when transferring the epitaxial layer, the first material 6 and the second material 7 in this embodiment can be an epitaxial wafer and a sapphire substrate respectively. The epitaxial wafer includes a growth substrate and an epitaxial layer located on the growth substrate. In this embodiment, before flipping, the fitting layers of both the first material 6 and the second material 7 are located on the upper surface of the material. After flipping the first material 6, the fitting layer of the first material 6 can be located on the lower surface of the material, while the fitting layer of the unflipped second material 7 remains on the upper surface of the material, facilitating subsequent fitting.

[0036] In some embodiments, such as Figure 2As shown in the figure, in this embodiment, the automatic flipping device 4 includes a base 401 and a first carrier. The first carrier is used to fix the material to be bonded. The first carrier is fixed on the base 401 through a column 402. The base 401 is driven to rotate by a motor 403, driving the material fixed on the first carrier to flip. When flipping the first material 6, the first material 6 is fixed on the first carrier, and then the motor 403 drives the base 401 to rotate 180 degrees. During the rotation process, the base 401 will drive the first carrier and the first material 6 to rotate 180 degrees together, realizing the flipping of the first material 6. In this embodiment, the first carrier is supported on the base 401 through the column 402, so that there is a certain space between the first carrier and the base 401. This space allows the manipulator to reach in and place the material on the first carrier or take out the material on the first carrier. It can be understood that, in order to facilitate the placement and removal of the material, the width or diameter of the first carrier can be significantly smaller than the width or diameter of the material, so that there is a suspended part of the material for the manipulator to pick up. The motor 403 in this embodiment can drive the base 401 to rotate forward or drive the base 401 to rotate in the reverse direction to return to the original position. A transmission mechanism, such as a belt transmission mechanism, can be provided between the motor 403 and the base 401 in this embodiment. During operation, the motor 403 drives the belt transmission mechanism to rotate, and the belt transmission mechanism drives the base 401 to rotate. Vacuum adsorption holes can be provided on the column 402 and the first carrier in this embodiment, and the material is adsorbed and fixed through the vacuum effect.

[0037] In some embodiments, the automatic flipping device 4 may further include a turntable 404. A protruding central shaft is provided on one side of the turntable 404. The other side of the turntable 404 is fixedly connected to the base 401. The base 401 and the turntable 404 are arranged perpendicular to each other. When rotating, the base 401, the first carrier, and the material all rotate around the center of the turntable 404. The protruding central shaft on the turntable 404 is the power input end of the turntable 404, which can be directly driven by the motor 403 or driven by the driven wheel of the belt transmission mechanism.

[0038] When the pre - fitting mechanism in this embodiment further includes a pre - processing device 1 and an automatic flipping device 4, the automatic feeding device 5 is used to convey the first material 6 and the second material 7 between the pre - processing device 1, the center positioning device 2, the automatic flipping device 4, and the fitting base 3; finally, the fitting layer of the first material 6 is made to fit with the fitting layer of the second material 7 on the fitting base 3. In this embodiment, the fitting surface of the first material 6 is the surface of the fitting layer of the first material 6, and the fitting surface of the second material 7 is the surface of the fitting layer of the second material 7. In this embodiment, the feeding between each device can be completed by one manipulator or by different manipulators. When completed by different manipulators, the processing efficiency of pre - fitting can be improved. In some embodiments, the automatic feeding device 5 may include a first manipulator, a second manipulator, a third manipulator, and a fourth manipulator. The first manipulator is used to convey the first material 6 and the second material 7 from the pre - processing device 1 to the center positioning device 2 respectively; the second manipulator is used to convey the first material 6 and the second material 7 from the center positioning device 2 to the automatic flipping device 4 respectively; the third manipulator is used to convey the unflipped second material 7 from the automatic flipping device 4 to the fitting base 3; the fourth manipulator is used to convey the flipped first material 6 from the automatic flipping device 4 above the fitting base 3 and drive the first material 6 to move towards the second material 7, and finally make the fitting layer of the first material 6 fit with the fitting layer of the second material 7 on the fitting base 3. The first manipulator, the second manipulator, the third manipulator, and the fourth manipulator can work simultaneously, improving the processing efficiency.

[0039] In this embodiment, the fitting step and the transfer after fitting can both be completed by the fourth manipulator, such as Figure 4As shown in the figure, the fourth robot arm in this embodiment may include a three-axis drive assembly 503 and at least two suction heads 501. The two suction heads 501 are used to pick up the flipped second material 7. The three-axis drive assembly 503 includes a connection head 502. The connection head 502 is connected to the suction head 501 through a connecting arm, driving the suction head 501 to move along the X-axis, Y-axis, and Z-axis directions. During operation, the fourth robot arm first picks up the flipped first material 6 on the automatic flipping device 4. When picking up, the center of the first material 6 can be located between the two suction heads 501. The setting of the two suction heads 501 facilitates the picking up of the material. After picking up, the three-axis drive assembly 503 drives the suction head 501 to move towards the fitting base 3 until the suction head 501 drives the first material 6 to move above the fitting base 3 and form good vertical alignment with the second material 7. Then, the three-axis drive assembly 503 drives the first material 6 to move downward, so that the fitting layer of the first material 6 is fitted with the fitting layer of the second material 7 on the fitting base 3. After the fitting is completed, the fixation of the second material 7 by the fitting base 3 can be released, and the fourth robot arm transfers the fitted first material 6 and second material 7 to the next process, for example, it can be transferred to a bonding jig. In some application scenarios, the fourth robot arm can adsorb and fix the material through, but not limited to, vacuum adsorption. The structures of other robot arms in this embodiment can be the same as or different from the structure of the fourth robot arm, as long as the transfer of the material can be achieved. This embodiment does not limit the specific structures of the first robot arm, the second robot arm, and the third robot arm.

[0040] In some embodiments, in order to avoid the situation of material detachment during the process of transferring the first material 6 and the second material 7 to the next process after fitting. As Figure 3 shown, the fitting base 3 may include a second carrier for fixing the second material 7. The fitting base 3 further includes a magnetizable sheet 301 that can be taken out. The magnetizable sheet 301 is disposed on the side of the second carrier away from the fixed second material 7. The automatic feeding device 5 includes an electromagnetic suction head 501. The electromagnetic suction head 501 is configured to generate a magnetic force to adsorb the magnetizable sheet 301 after being energized, and fix the first material 6 and the second material 7 between the magnetizable sheet 301 and the electromagnetic suction head 501 for transfer. As Figure 5 shown, during the process of the automatic feeding device 5 transferring the first material 6 and the second material 7 away from the fitting base 3, the first material 6 and the second material 7 can be stably clamped by the magnetizable sheet 301 and the electromagnetic suction head 501, avoiding the situation of material detachment. Until the first material 6 and the second material 7 are sent to the subsequent bonding jig, the electromagnetic suction head 501 can be powered off to release the magnetizable sheet 301, and the magnetizable sheet 301 can be recycled. To facilitate the recycling of the magnetizable sheet 301, the bonding jig can be flipped. After flipping, the magnetizable sheet 301 is located above, which is convenient for taking out the magnetizable sheet 301. After taking out, the magnetizable sheet 301 can be reinstalled on the fitting base 3 for reuse.

[0041] It can be understood that the magnetic conduction sheet 301 in this embodiment is removably arranged on the fitting base 3, that is, the fitting base 3 has no limit on the magnetic conduction sheet 301 in the removal direction of the magnetic conduction sheet 301. In some embodiments, the fitting base 3 further includes a moving sleeve 302, the magnetic conduction sheet 301 is placed on the moving sleeve 302, and the moving sleeve 302 is configured to drive the magnetic conduction sheet 301 carried thereon to approach the second carrier. The moving sleeve 302 can drive the magnetic conduction sheet 301 to move towards the second carrier, so that before the fitting is completed, the magnetic conduction sheet 301 does not contact the second material 7, preventing the second material 7 from being damaged due to the contact between the magnetic conduction sheet 301 and the second material 7 during the process of the automatic feeding device 5 pressing and fitting the first material 6 and the second material 7. After the fitting is completed, the moving sleeve 302 drives the magnetic conduction sheet 301 to move upward close to the second material 7. After reaching the preset position, the electromagnetic chuck 501 of the automatic feeding device 5 is energized to generate a magnetic force to adsorb the magnetic conduction sheet 301, clamping the first material 6 and the second material 7. Then the fitting base 3 releases the fixation on the second material 7, and the automatic feeding device 5 moves upward, and the magnetic conduction sheet 301 leaves the fitting base 3 together with the first material 6, the second material 7 and the electromagnetic chuck 501.

[0042] In some embodiments, the fitting base 3 further includes a fixed seat 304, the second carrier is supported on the fixed seat 304 through a support column 303, the magnetic conduction sheet 301 is provided with a central hole for the support column 303 to pass through, and the diameter of the central hole is larger than the diameter of the second carrier. The diameter of the central hole of the magnetic conduction sheet 301 being larger than the diameter of the second carrier facilitates the removal of the magnetic conduction sheet 301. The second carrier is supported on the fixed seat 304 through the support column 303, and there is also a certain space between the second carrier and the fixed seat 304, which facilitates the manipulator to place the second material 7 on the second carrier. The moving sleeve 302 in this embodiment can be sleeved on the support column 303, and the moving sleeve 302 can be driven by a motor, a cylinder or a hydraulic pressure, and this embodiment does not make specific limitations on this. In some application scenarios, the moving sleeve 302 may not be provided, and a fixed base is provided below the second carrier, and the magnetic conduction sheet 301 is placed on this base. This base needs to be arranged close to the second carrier so that the electromagnetic chuck 501 can adsorb the magnetic conduction sheet 301.

[0043] The above pre-laminating mechanism includes a pre-processing device 1, a center positioning device 2, an automatic flipping device 4, a laminating base 3, and an automatic feeding device 5. Among them, after the first material 6 and the second material 7 to be laminated are centered by the center positioning device 2, the first material 6 and the second material 7 during lamination can have good alignment, improving the lamination accuracy. After the automatic flipping device 4 flips the first material 6, the laminating layer of the first material 6 can be located on the lower surface of the first material 6, while the laminating layer of the unflipped second material 7 is located on the upper surface of the second material 7. And through the conveyance of the automatic feeding device 5, the laminating layer of the first material 6 and the laminating layer of the second material 7 can be arranged opposite to each other for lamination. The pre-laminating mechanism can complete the automated processing of pre-laminating the first material 6 and the second material 7, improving the processing efficiency. Not only is the lamination accuracy high, but the lamination environment is also good, and it is not easy to contaminate the lamination surface, improving the yield of subsequent bonding and the qualified rate of the product.

[0044] Another optional embodiment of the present application:

[0045] This embodiment provides a pre-laminating method, as Figure 7 shown, including the following steps:

[0046] S1: Provide a pre-laminating mechanism.

[0047] The pre-laminating mechanism in this embodiment is the same as that in the above embodiment and will not be elaborated here.

[0048] S2: Respectively convey the first material and the second material to the center positioning device through the automatic feeding device, and the center positioning device respectively centers the first material and the second material.

[0049] In some embodiments, the first material 6 and the second material 7 can be respectively conveyed to the center positioning device 2 by the first manipulator.

[0050] S3: Convey the second material to the laminating base through the automatic feeding device, and the laminating base fixes the second material.

[0051] In some embodiments, the unflipped second material 7 can be conveyed to the laminating base 3 by the third manipulator.

[0052] S4: Convey the first material to the laminating base through the automatic feeding device, and make the laminating surface of the first material fit with the laminating surface of the second material on the laminating base.

[0053] In some embodiments, the first material 6 can be conveyed to the laminating base 3 by the fourth manipulator, and the fitting of the laminating surface of the first material 6 and the laminating surface of the second material 7 on the laminating base can be slightly pressed by the suction head 501 of the fourth manipulator.

[0054] The fitting base 3 in this embodiment includes a magnetically conductive sheet 301 that can be taken out. The automatic feeding device 5 includes an electromagnetic chuck 501. After the fitting surface of the first material 6 is made to fit with the fitting surface of the second material 7 on the fitting base 3, it includes:

[0055] The electromagnetic chuck 501 is energized to generate a magnetic force to adsorb the magnetically conductive sheet 301, fixing the first material 6 and the second material 7 between the magnetically conductive sheet 301 and the electromagnetic chuck 501; the automatic feeding device 5 controls the movement of the electromagnetic chuck 501 to transfer the first material 6, the second material 7, and the magnetically conductive sheet 301 from the fitting base 3. The first material 6 and the second material 7 can be stably clamped by the magnetically conductive sheet 301 and the electromagnetic chuck 501, avoiding the situation of material detachment.

[0056] In some embodiments, the fitting base 3 further includes a moving sleeve 302, and the magnetically conductive sheet 301 is placed on the moving sleeve 302. Before the electromagnetic chuck 501 is energized to generate a magnetic force to adsorb the magnetically conductive sheet 301, it includes:

[0057] Drive the moving sleeve 302 to move, and drive the magnetically conductive sheet 301 carried thereon to approach the second material 7 on the fitting base 3. The moving sleeve 302 can drive the magnetically conductive sheet 301 to move towards the second stage, so that the magnetically conductive sheet 301 does not contact the second material 7 before the fitting is completed, preventing damage to the second material 7 due to the contact between the magnetically conductive sheet 301 and the second material 7 during the process of the automatic feeding device 5 pressing and fitting the first material 6 and the second material 7.

[0058] When the pre-fitting mechanism in this embodiment further includes a pre-processing device 1 and an automatic flipping device 4, before the first material 6 and the second material 7 are respectively transported to the center positioning device 2 by the automatic feeding device 5, it further includes:

[0059] Form fitting layers on the first material 6 and the second material 7 respectively through the pre-processing device 1.

[0060] In some embodiments, the pre-processing device 1 can be a gluing device. First, glue is applied to the material through the gluing device, then the glue is evenly distributed, and then baking and curing can be performed. When the first material 6 in this embodiment is an epitaxial wafer, the fitting layer is arranged on the epitaxial layer of the epitaxial wafer. The first material 6 and the second material 7 in this embodiment can be taken out from the material storage area. The process of transferring the material from the material storage area to the pre-processing device 1 can also be completed by a manipulator, and can also be completed manually in some application scenarios.

[0061] And, after the first material 6 and the second material 7 are respectively transported to the center positioning device 2 by the automatic feeding device 4, it further includes:

[0062] The first material 6 and the second material 7 are respectively conveyed to the automatic turnover device 4 by the automatic feeding device 5, and the automatic turnover device 4 turns over the first material 6. In some embodiments, the first material 6 and the second material 7 can be respectively conveyed to the automatic turnover device 4 by the second manipulator. After the automatic turnover device 4 turns over the first material 6, the bonding layer of the first material 6 can be located on the lower surface of the first material 6, while the bonding layer of the unflipped second material 7 is located on the upper surface of the second material 7, facilitating subsequent bonding.

[0063] In the above pre-bonding method, after the first material 6 and the second material 7 to be bonded are centered by the center positioning device 2, the first material 6 and the second material 7 during bonding can have good alignment, improving the bonding accuracy. Through the conveyance of the automatic feeding device 5, the bonding surfaces of the first material 6 and the second material 7 can be arranged opposite to each other for bonding. The pre-bonding method completes the automated processing of pre-bonding the first material 6 and the second material 7, improving the processing efficiency. Not only is the bonding accuracy high, but the bonding environment is also good, and it is not easy to contaminate the bonding surface, improving the yield of subsequent bonding and the qualification rate of the product.

[0064] It should be understood that the application of this application is not limited to the above examples. For those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of this application.

Claims

1. A pre-laminating mechanism, characterized in that, Including: A center positioning device for centering the first material and the second material; A fitting base for fixing the second material; An automatic feeding device for conveying the first material and the second material between the center positioning device and the fitting base; finally, making the fitting surface of the first material fit with the fitting surface of the second material on the fitting base.

2. The pre-bonding mechanism according to claim 1, wherein, The pre-fitting mechanism further includes a pre-processing device for forming a fitting layer on the first material and the second material; An automatic flipping device for flipping the centered first material; The automatic feeding device is used for conveying the first material and the second material between the pre-processing device, the center positioning device, the automatic flipping device and the fitting base; finally, making the fitting layer of the first material fit with the fitting layer of the second material on the fitting base.

3. The pre-fitting mechanism according to claim 2, wherein, The automatic flipping device includes a base and a first carrier. The first carrier is used for fixing the material to be fitted. The first carrier is fixed on the base through a column, and the base is driven to rotate by a motor to drive the material fixed on the first carrier to flip.

4. The pre-bonding mechanism according to claim 2, wherein The automatic feeding device includes a first manipulator, a second manipulator, a third manipulator and a fourth manipulator; The first manipulator is used for respectively conveying the first material and the second material from the pre-processing device to the center positioning device; The second manipulator is used for respectively conveying the first material and the second material from the center positioning device to the automatic flipping device; The third manipulator is used for conveying the unflipped second material from the automatic flipping device to the fitting base; The fourth manipulator is used for conveying the flipped first material from the automatic flipping device above the fitting base and driving the first material to move towards the second material, finally making the fitting layer of the first material fit with the fitting layer of the second material on the fitting base.

5. The pre-bonding mechanism according to any one of claims 1-4, characterized in that The fitting base includes a second carrier for fixing the second material. The fitting base further includes a removable magnetic conductive sheet provided on the side of the second carrier away from fixing the second material; the automatic feeding device includes an electromagnetic suction head configured to generate a magnetic force after being energized to adsorb the magnetic conductive sheet, and fixing the first material and the second material between the magnetic conductive sheet and the electromagnetic suction head for transfer.

6. The pre-fitting mechanism according to claim 5, characterized in that, The fitting base further includes a movable sleeve. The magnetic conductive sheet is placed on the movable sleeve, and the movable sleeve is configured to drive the magnetic conductive sheet carried thereon to approach the second carrier.

7. The pre-fitting mechanism according to claim 5, characterized in that The fitting base further includes a fixed seat. The second carrier is supported on the fixed seat through a support column. The magnetic conductive sheet is provided with a central hole for the support column to pass through, and the diameter of the central hole is larger than the diameter of the second carrier.

8. A pre-lamination method, characterized in that, Including: Providing the pre-fitting mechanism according to any one of claims 1-7; Respectively conveying the first material and the second material to the center positioning device through the automatic feeding device, and the center positioning device respectively centers the first material and the second material; The second material is conveyed to the bonding base by the automatic feeding device, and the bonding base fixes the second material; The first material is conveyed to the bonding base by the automatic feeding device, and the bonding surface of the first material is bonded to the bonding surface of the second material on the bonding base.

9. The pre-lamination method according to claim 8, wherein, The bonding base includes a magnetizable sheet that can be removed, the automatic feeding device includes an electromagnetic chuck, and after the bonding surface of the first material is bonded to the bonding surface of the second material on the bonding base, it includes: The electromagnetic chuck is energized to generate a magnetic force to adsorb the magnetizable sheet, and the first material and the second material are fixed between the magnetizable sheet and the electromagnetic chuck; The automatic feeding device controls the movement of the electromagnetic chuck to transfer the first material, the second material and the magnetizable sheet from the bonding base.

10. The pre-lamination method according to claim 9, wherein, The bonding base further includes a moving sleeve, the magnetizable sheet is placed on the moving sleeve, and before the electromagnetic chuck is energized to generate a magnetic force to adsorb the magnetizable sheet, it includes: Driving the moving sleeve to move and driving the magnetizable sheet carried thereon to approach the second material on the bonding base.

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