Ceramic-based circuit board etching device

Abstract

The invention relates to the technical field of ceramic-based circuit board processing, in particular to a ceramic-based circuit board etching device which comprises a box body and an electric conveying roller installed between the two sides of the box body, partition plates are fixedly connected to the inner side of the box body at equal intervals, an electric liquid spraying head is installed on the inner side of the box body, and a gas spraying head is installed on the inner side of the box body. A collecting frame located below the electric liquid spraying head is fixedly connected to the inner side of the box body. Etching liquid is sprayed on the ceramic-based circuit board through the electric liquid spraying head for etching, the etched ceramic-based circuit board is driven by the electric conveying roller to the position between the push plate and the water absorption belt, the electric pressing plate is started, the air bag pushes the water absorption belt to move downwards to make contact with the ceramic-based circuit board, and the attached etching liquid is absorbed and removed. The ceramic-based circuit board with the etching liquid removed is moved to the position below the air spraying head to be dried, and due to the fact that the etching liquid attached to the ceramic-based circuit board is absorbed and removed, the ceramic-based circuit board is more convenient to dry, and therefore the overall working efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of ceramic-based circuit board processing, and particularly relates to an etching device for ceramic-based circuit boards. Background Art

[0002] In the manufacturing process of ceramic-based circuit boards, etching is a crucial process. It uses chemical reactions or physical impacts to remove the unwanted copper layers or other metal materials on the circuit board, thereby forming precise circuit patterns. Then, the etching solution remaining on the etched ceramic-based circuit board is removed to complete the overall etching process.

[0003] Chinese Patent with publication number CN118540858A discloses an etching device for ceramic-based circuit boards with a predetermined depth of etching, which relates to the field of circuit board processing. It includes a production line guide rail and an etching solution tank. The etching solution tank is arranged below the production line guide rail. A suspension frame is slidably connected to the bottom of the production line guide rail. A suspension plate is fixedly connected to the bottom of the suspension frame. A connecting frame is arranged at the bottom of the suspension plate. A mesh box is fixedly connected to the bottom of the connecting frame. The mesh box is vertically penetrated. Along the length direction of the inner side surface of the mesh box, a plurality of bearing shafts are rotatably connected at equal intervals at the bottom. Circuit boards are placed on the bearing shafts. Although the above patent can etch ceramic-based circuit boards, after the ceramic-based circuit boards are etched, a large amount of etching solution will adhere to the ceramic-based circuit boards. If directly dried subsequently, it will be difficult to quickly dry due to the large amount of etching solution adhering to the ceramic-based circuit boards. Prolonged drying is likely to cause cracking or deformation of the ceramic-based circuit boards, affecting the overall working efficiency.

[0004] The present invention aims to solve the problems existing in the above patent. Therefore, an etching device for ceramic-based circuit boards is proposed, which can absorb and remove the adhering etching solution after the ceramic-based circuit boards are etched, so as to facilitate subsequent drying and improve the overall working efficiency. Summary of the Invention

[0005] In order to overcome the drawback that after the ceramic-based circuit boards are etched, a large amount of etching solution will adhere to the ceramic-based circuit boards. If directly dried subsequently, it will be difficult to quickly dry due to the large amount of etching solution adhering to the ceramic-based circuit boards. Prolonged drying is likely to cause cracking or deformation of the ceramic-based circuit boards, affecting the overall working efficiency, the present invention provides an etching device for ceramic-based circuit boards, which can absorb and remove the adhering etching solution after the ceramic-based circuit boards are etched, so as to facilitate subsequent drying and improve the overall working efficiency.

[0006] The present invention is achieved through the following technical solutions: A ceramic-based circuit board etching device includes a box body and electric conveying rollers installed between both sides of the box body. Partition plates are fixedly connected to the inner side of the box body at equal intervals. An electric liquid spraying head is installed on the inner side of the box body, and an air jet head is installed on the inner side of the box body. A collecting frame is fixedly connected to the inner side of the box body and located below the electric liquid spraying head. Shells are fixedly connected to both outer sides of the box body. It further includes belt rollers symmetrically and rotatably connected to the inner side of the shells. An absorbent belt that slidably penetrates the box body is wound between the belt rollers. The electric conveying rollers pass through the inner side of the absorbent belt. A driving motor is installed on the box body, and the end of the output shaft of the driving motor is fixedly connected to the end of one of the belt rollers. A fixing plate is fixedly connected between both inner sides of the box body. A movable rod is slidably inserted through the fixing plate. A tensioning roller that contacts the absorbent belt is rotatably inserted between the movable rods. A connecting spring is connected between the movable rod and the fixing plate. A pressing component is arranged between the box body and the movable rod. The pressing component is used to push the absorbent belt into contact with the etching surface of the ceramic-based circuit board, so that the absorbent belt absorbs and removes the attached etching liquid on the ceramic-based circuit board. An extrusion component is arranged on the box body, which is used to extrude the etching liquid inside the absorbent belt.

[0007] Further description, the pressing component includes an electric pressing plate installed on the inner side of the box body. An air bag located directly above the absorbent belt is fixedly connected to the bottom of the electric pressing plate, which is used to push the absorbent belt downward to contact the ceramic-based circuit board. An n-shaped rod is fixedly connected between the tops of the movable rods. A push plate is fixedly connected to the n-shaped rod. The push plate passes through the electric conveying roller and is located directly below the air bag, which is used to drive the ceramic-based circuit board to move upward. A transmission component is arranged between the push plate and the electric pressing plate, which is used to drive the push plate to move.

[0008] Further description, the transmission component includes an L-shaped rack Ⅰ fixedly connected to the electric pressing plate. A spur gear meshing with the L-shaped rack Ⅰ is rotatably connected to one of the partition plates. An L-shaped rack Ⅱ meshing with the spur gear is fixedly connected to the push plate.

[0009] Further description, the extrusion component includes a liquid discharge frame fixedly inserted through the box body. The liquid discharge frame is located directly below the tensioning roller. An extrusion roller that contacts the absorbent belt is rotatably connected between both sides of the liquid discharge frame, which is used to extrude the etching liquid inside the absorbent belt.

[0010] Further description, the ceramic-based circuit board etching device further includes a deviation rectifying component. The deviation rectifying component includes a guide rod fixedly inserted through both sides of the box body. U-shaped movable plates are symmetrically and slidably sleeved on the guide rod. A U-shaped deviation rectifying plate located above the electric conveying roller is slidably sleeved on the guide rod to rectify and position the ceramic-based circuit board. A buffer spring sleeved on the guide rod is connected between the U-shaped deviation rectifying plate and the U-shaped movable plate. A bidirectional screw rod is rotatably inserted through both sides of the box body. The threads on the front and rear sides of the bidirectional screw rod are opposite. The bidirectional screw rod is threadedly connected to the U-shaped movable plate. The bidirectional screw rod slidably penetrates the front and rear U-shaped deviation rectifying plates. A stepping motor is installed on the box body, and the end of the output shaft of the stepping motor is fixedly connected to the end of the bidirectional screw rod.

[0011] Further explanation, the ceramic-based circuit board etching device also includes a cleaning component, which includes a rotating shaft symmetrically rotatably connected between the two sides of one of the shells, one of the rotating shafts is connected to the output shaft of the driving motor through a synchronous belt assembly, a brush roller in contact with the water-absorbing belt is fixedly mounted on the rotating shaft, and is used to remove impurities attached to the water-absorbing belt, a guide gear is fixedly mounted on the rotating shaft, and the guide gears on the front and rear sides are meshed, an inverted V-shaped plate is fixedly connected to the box body, and the inverted V-shaped plate is located below the rear brush roller for guiding impurities, and a collecting component is arranged on the box body for collecting fallen impurities.

[0012] To further explain, the collecting assembly includes a supporting frame fixedly connected to the box body, the supporting frame is located below one of the shells, and a material receiving frame is placed on the supporting frame for collecting impurities.

[0013] As a further explanation, the ceramic-based circuit board etching device also includes a guide roller rotatably connected to the box body, the guide roller is in contact with the inner side of the water-absorbing belt and is used to guide the water-absorbing belt.

[0014] The beneficial effects of the present invention are: 1. The etching liquid is sprayed on the ceramic-based circuit board through the electric liquid spray head for etching. The etched ceramic-based circuit board is driven by the electric conveyor roller to between the push plate and the water absorption belt. The electric pressing plate is started to push the water absorption belt downward through the air bag to contact the ceramic-based circuit board. The water absorption belt absorbs and removes the etching liquid attached to the ceramic-based circuit board. After removing the etching liquid, the ceramic-based circuit board continues to move to the left to the bottom of the spray head for drying. Since the etching liquid attached to the ceramic-based circuit board is absorbed and removed, the ceramic-based circuit board is easier to dry, thereby improving the overall work efficiency.

[0015] 2. Under the action of the U-shaped correcting plate, whenever the ceramic-based circuit board moves to the left between the front and rear U-shaped correcting plates, the front and rear U-shaped correcting plates move towards each other to correct the ceramic-based circuit board, which can prevent the ceramic-based circuit board from being in a skewed state and affecting the removal of the etching liquid, thereby ensuring that the etching liquid can be fully removed from the ceramic-based circuit board.

[0016] 3. Under the action of the brush roller, whenever the water-absorbing belt rotates forward, the brush roller can rotate to remove the impurities attached to the water-absorbing belt, which can prevent a large amount of impurities from being attached to the water-absorbing belt and affecting the subsequent absorption of the etching liquid, thereby further improving the effect of the subsequent use of the water-absorbing belt. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0018] Figure 2 This is a three-dimensional structural schematic diagram of the electric liquid spraying head and the air jet head of the present invention.

[0019] Figure 3 This is a three-dimensional structural schematic diagram of the belt roller and the water absorption belt of the present invention.

[0020] Figure 4 This is a three-dimensional structural schematic diagram of the pressing component of the present invention.

[0021] Figure 5 This is a three-dimensional structural schematic diagram of the push plate of the present invention.

[0022] Figure 6 This is a three-dimensional structural schematic diagram of the liquid discharge frame and the extrusion roller of the present invention.

[0023] Figure 7 This is a three-dimensional structural schematic diagram of the deviation rectifying component of the present invention.

[0024] Figure 8 This is a three-dimensional structural schematic diagram of the cleaning component of the present invention.

[0025] Figure 9 This is a three-dimensional structural schematic diagram of the inverted V-shaped plate of the present invention.

[0026] Figure 10 This is a three-dimensional structural schematic diagram of the collection component of the present invention.

[0027] Figure 11 This is a three-dimensional structural schematic diagram of the guide roller of the present invention.

[0028] The labels in the figure are: 1 - box body, 2 - electric conveying roller, 3 - collection box, 4 - partition board, 5 - electric liquid spraying head, 6 - air jet head, 7 - housing, 8 - belt roller, 81 - driving motor, 9 - water absorption belt, 10 - fixing plate, 11 - movable rod, 12 - tensioning roller, 13 - connecting spring, 14 - electric pressing plate, 141 - air bag, 1411 - n-shaped rod, 142 - push plate, 143 - L-shaped rack I, 144 - spur gear, 145 - L-shaped rack II, 15 - liquid discharge frame, 151 - extrusion roller, 16 - guide rod, 161 - U-shaped movable plate, 162 - U-shaped deviation rectifying plate, 163 - buffer spring, 164 - bidirectional screw rod, 165 - stepping motor, 17 - rotating shaft, 171 - brush roller, 172 - guide gear, 173 - inverted V-shaped plate, 18 - support frame, 19 - material receiving box, 20 - guide roller. Detailed implementation manners

[0029] Embodiment: A ceramic-based circuit board etching device, please refer to Figures 1 - 6As shown in the figure, it includes a box body 1 and an electric conveying roller 2 installed between the front and rear sides of the box body 1. The electric conveying roller 2 can drive the ceramic-based circuit board to move leftward for conveying. Three partition plates 4 are fixedly connected to the upper part inside the box body 1 at equal intervals. The three partition plates 4 divide the upper part of the box body 1 into four cavities. An electric liquid spray head 5 is installed on the right side of the inner top of the box body 1. The electric liquid spray head 5 is located in the second cavity from the right. An air jet head 6 is installed on the left side of the inner top of the box body 1. The air jet head 6 is located in the first cavity from the left. A collection box 3 is fixedly connected to the right side of the inner bottom of the box body 1. The collection box 3 is located below the electric liquid spray head 5. The collection box 3 can collect the etching solution. Shells 7 are fixedly connected to the left sides of the front and rear outer sides of the box body 1. It also includes a belt roller 8, a driving motor 81, a water-absorbing belt 9, a fixing plate 10, a movable rod 11, a tensioning roller 12, a connecting spring 13, a pressing component and an extrusion component. Belt rollers 8 are symmetrically rotatably connected up and down on the inner sides of the front and rear shells 7. A water-absorbing belt 9 is wound around the four belt rollers 8. The water-absorbing belt 9 slidably penetrates through the front and rear sides of the box body 1. The electric conveying roller 2 passes through the inner side of the water-absorbing belt 9. A driving motor 81 is installed at the lower part of the front outer side of the box body 1. The end of the output shaft of the driving motor 81 is fixedly connected to the right end of the lower belt roller 8 at the front side. Two fixing plates 10 are fixedly connected between the lower parts of the front and rear sides inside the box body 1. Movable rods 11 are slidably inserted through the middle parts of the left and right fixing plates 10. A tensioning roller 12 is rotatably inserted between the lower parts of the left and right movable rods 11. The tensioning roller 12 contacts the water-absorbing belt 9. Connecting springs 13 are connected between the lower parts of the left and right movable rods 11 and the bottoms of the left and right fixing plates 10 respectively. A pressing component is arranged between the box body 1 and the movable rod 11. The pressing component is used to push the water-absorbing belt 9 into contact with the etched surface of the ceramic-based circuit board, so that the water-absorbing belt 9 absorbs and removes the attached etching solution on the ceramic-based circuit board. An extrusion component is arranged at the bottom of the box body 1. When the extrusion component operates, the extrusion component can extrude the etching solution inside the water-absorbing belt 9.

[0030] Please refer to Figure 4 and Figure 5As shown in the figure, the pressing assembly includes an electric pressing plate 14, an airbag 141, an n-shaped rod 1411, a push plate 142 and a transmission assembly. The electric pressing plate 14 is installed on the left side of the inner top of the box body 1. The electric pressing plate 14 is located on the right side of the leftmost partition plate 4. The bottom of the electric pressing plate 14 is fixedly connected with the airbag 141. The airbag 141 is located directly above the water absorption belt 9. When the airbag 141 moves downward to contact the water absorption belt 9, the airbag 141 can push the water absorption belt 9 downward to contact the ceramic base circuit board. An n-shaped rod 1411 is fixedly connected between the tops of the movable rods 11 on the left and right sides. A push plate 142 is fixedly connected to the middle of the n-shaped rod 1411. The push plate 142 passes through the electric conveying roller 2 and is located directly below the airbag 141. When the push plate 142 moves upward, the push plate 142 can drive the ceramic base circuit board to move upward. A transmission assembly is arranged between the push plate 142 and the electric pressing plate 14. When the transmission assembly operates, the transmission assembly can drive the push plate 142 to move. The transmission assembly includes an L-shaped rack I 143, a spur gear 144 and an L-shaped rack II 145. The L-shaped rack I 143 is fixedly connected to the front side of the left side of the electric pressing plate 14. The spur gear 144 is rotatably connected to the front lower side of the right side of the leftmost partition plate 4. The spur gear 144 meshes with the L-shaped rack I 143. The L-shaped rack II 145 is fixedly connected to the front side of the push plate 142. The L-shaped rack II 145 meshes with the spur gear 144.

[0031] Please refer to Figure 4 and Figure 6 As shown in the figure, the extrusion assembly includes a liquid discharge frame 15 and an extrusion roller 151. The liquid discharge frame 15 is fixedly penetrated through the left side of the bottom of the box body 1. The liquid discharge frame 15 is located directly below the tension roller 12. An extrusion roller 151 is rotatably connected between the upper parts on the left and right sides of the liquid discharge frame 15. The extrusion roller 151 contacts the water absorption belt 9. When the extrusion roller 151 rotates, the extrusion roller 151 can extrude the etching solution in the water absorption belt 9.

[0032] Initially, the jet head 6 is externally connected to an air pump, and the electric liquid spray head 5 is externally connected to a machine filled with etching solution. First, start the intermittent reverse rotation of the electric conveying roller 2, and then place the ceramic-based circuit board on the electric conveying roller 2 from the right side. The intermittent reverse rotation of the electric conveying roller 2 drives the ceramic-based circuit board to move intermittently to the left. When the ceramic-based circuit board moves to directly below the electric liquid spray head 5, start the electric liquid spray head 5. The electric liquid spray head 5 sprays the etching solution onto the ceramic-based circuit board below, and the etching solution etches the ceramic-based circuit board. The etching solution that has etched the ceramic-based circuit board drops into the collection box 3 and is discharged through the collection box 3. When the etching of the ceramic-based circuit board is completed, the ceramic-based circuit board continues to move intermittently to the left. When the etched ceramic-based circuit board moves to between the push plate 142 and the water-absorbing belt 9, the reverse rotation of the electric conveying roller 2 stops. At this time, the next ceramic-based circuit board is directly below the electric liquid spray head 5 for etching. At the same time, start the electric pressing plate 14. The electric pressing plate 14 moves downward to drive the airbag 141 to move downward. The downward movement of the airbag 141 pushes the water-absorbing belt 9 to move downward. The downward movement of the electric pressing plate 14 also drives the L-shaped rack I 143 to move downward. The downward movement of the L-shaped rack I 143 drives the spur gear 144 to rotate forward. The forward rotation of the spur gear 144 drives the L-shaped rack II 145 to move upward. The upward movement of the L-shaped rack II 145 drives the push plate 142 to move upward. The upward movement of the push plate 142 drives the movable rod 11 to move upward through the n-shaped rod 1411. The connecting spring 13 is compressed. The upward movement of the movable rod 11 drives the tensioning roller 12 to move upward. At the same time, the upward movement of the push plate 142 also drives the ceramic-based circuit board to move upward. The upward movement of the ceramic-based circuit board contacts the water-absorbing belt 9. The downward movement of the airbag 141 presses the water-absorbing belt 9 against the ceramic-based circuit board. Due to the effect of the airbag 141, the water-absorbing belt 9 can closely adhere to the etching position of the ceramic-based circuit board. Turn off the electric pressing plate 14. At this time, the water-absorbing belt 9 can absorb and remove the etching solution attached to the ceramic-based circuit board. Subsequently, the electric pressing plate 14 drives the airbag 141 to move upward to reset. The upward movement of the airbag 141 stops pressing on the water-absorbing belt 9. The electric pressing plate 14 also drives the push plate 142 to move downward to reset through the L-shaped rack I 143, the spur gear 144, and the L-shaped rack II 145. The reset of the push plate 142 drives the ceramic-based circuit board to move downward to reset. The ceramic-based circuit board continues to be on the electric conveying roller 2. The push plate 142 also drives the movable rod 11 to move downward to reset through the n-shaped rod 1411. The reset of the movable rod 11 causes the connecting spring 13 to reset. The movable rod 11 also drives the tensioning roller 12 to move downward to reset. The reset of the tensioning roller 12 tightens the water-absorbing belt 9. At this time, start the forward rotation of the drive motor 81 to drive the lower front belt roller 8 to rotate forward. The lower front belt roller 8 drives the water-absorbing belt 9 to rotate forward through the remaining three belt rollers 8. When the unused position of the water-absorbing belt 9 rotates forward to directly below the airbag 141, turn off the drive motor 81, and the belt roller 8 stops driving the water-absorbing belt 9 to rotate forward. Subsequently, when the electric conveying roller 2 rotates in reverse again,The electric conveying roller 2 drives the ceramic-based circuit board for removing the etching solution and the etched ceramic-based circuit board to move leftward. The etched ceramic-based circuit board moves leftward to the position between the push plate 142 and the water-absorbing belt 9 for removing the etching solution. When the ceramic-based circuit board for removing the etching solution moves leftward, it is directly below the air jet head 6. Then, the external air pump is started. The air pump discharges air into the air jet head 6, and the air jet head 6 sprays out the air to dry the ceramic-based circuit board directly below, making the ceramic-based circuit board in a dry state. Since the etching solution attached to the ceramic-based circuit board is absorbed and removed, it is more convenient to dry the ceramic-based circuit board, thus improving the overall working efficiency. When the electric conveying roller 2 continues to reverse, the dried ceramic-based circuit board moves leftward out of the box body 1, and the operator can collect the ceramic-based circuit board for subsequent processing. Repeating this process, the ceramic-based circuit board can be continuously etched, the etching solution removed, and dried. When the water-absorbing belt 9 rotates forward so that the position after absorbing water rotates forward to contact the squeezing roller 151, under the action of the connecting spring 13, the squeezing roller 151 and the tensioning roller 12 can squeeze out the etching solution in the water-absorbing belt 9 to prevent a large amount of etching solution absorbed in the water-absorbing belt 9 from affecting the subsequent use effect, thereby improving the long-term use effect of the water-absorbing belt 9. The squeezed-out etching solution drops into the liquid discharge frame 15 through the squeezing roller 151, and the liquid discharge frame 15 discharges the etching solution for collection and treatment. The water-absorbing belt 9 after squeezing out the etching solution continues to absorb and remove the etching solution on the subsequent ceramic-based circuit boards. When all the ceramic-based circuit boards are etched, the external air pump is turned off, the air jet head 6 stops spraying air, and at the same time, the electric liquid spray head 5 is turned off, and the etching solution stops spraying, then the subsequent processing of the etched ceramic-based circuit board can be carried out.,

[0033] Please refer to Figure 7As shown, the ceramic-based circuit board etching device also includes a correction component installed on the box body 1, the correction component includes a guide rod 16, a U-shaped movable plate 161, a U-shaped correction plate 162, a buffer spring 163, a bidirectional screw 164 and a stepping motor 165, and the guide rod 16 is fixedly connected between the right sides of the front and rear sides of the box body 1. The guide rod 16 is symmetrically slidably mounted on the front and rear sides. The guide rod 16 is slidably mounted on both sides of the front and rear sides. The U-shaped correction plate 162 is located above the electric conveying roller 2. When the U-shaped correction plate 162 moves to contact the ceramic-based circuit board, the U-shaped correction plate 162 can realize the correction and positioning of the ceramic-based circuit board, so that the ceramic The ceramic-based circuit board is in a corrected position, and a buffer spring 163 is connected between the sides of the front and rear U-shaped correcting plates 162 that are away from each other and the sides of the front and rear U-shaped movable plates 161 that are close to each other. The buffer spring 163 is sleeved on the guide rod 16, and a bidirectional screw 164 is rotatably connected between the right sides of the front and rear sides of the box body 1. The threads on the front and rear sides of the bidirectional screw 164 are opposite. The bidirectional screw 164 is threadedly connected with the front and rear U-shaped movable plates 161. The bidirectional screw 164 slides through the front and rear U-shaped correcting plates 162. A stepper motor 165 is installed on the right side of the outer front side of the box body 1, and the output shaft end of the stepper motor 165 is fixedly connected to the front end of the bidirectional screw 164.

[0034] See also Figures 8 - 10 As shown, the ceramic-based circuit board etching device also includes a cleaning component, which includes a rotating shaft 17, a brush roller 171, a guide gear 172, an inverted V-shaped plate 173 and a collecting component. The rotating shaft 17 is symmetrically rotated between the lower parts of the left and right sides of the front shell 7. The right side of the front rotating shaft 17 is connected to the output shaft of the drive motor 81 through a synchronous belt component. The front and rear rotating shafts 17 are fixedly sleeved with brush rollers 171. The front and rear brush rollers 171 are in contact with the water absorption belt 9. When the brush roller 171 rotates, the brush roller 171 can remove impurities attached to the water absorption belt 9. The right sides of the front and rear rotating shafts 17 are A guide gear 172 is fixedly mounted on the front and rear sides of the guide gears 172, and the guide gears 172 on both sides are meshed. An inverted V-shaped plate 173 is fixedly mounted on the lower part of the outer front side surface of the box body 1, and the inverted V-shaped plate 173 is located below the rear brush roller 171. The inverted V-shaped plate 173 can guide impurities so that the impurities are discharged from the front shell body 7. A collecting component is arranged on the front side of the box body 1, and the collecting component can collect the fallen impurities; the collecting component includes a supporting frame 18 and a material receiving frame 19. A supporting frame 18 is fixedly mounted on the lower part of the outer front side surface of the box body 1, and the supporting frame 18 is located below the front shell body 7. A material receiving frame 19 is placed on the supporting frame 18, and the material receiving frame 19 can collect impurities.

[0035] When the ceramic-based circuit board moves to the left between the front and rear U-shaped deflection correcting plates 162, the stepper motor 165 is started, and the stepper motor 165 drives the bidirectional screw 164 to rotate forward, and the bidirectional screw 164 rotates forward to drive the front and rear U-shaped movable plates 161 to move in a direction close to each other, and the U-shaped movable plates 161 drive the front and rear U-shaped deflection correcting plates 162 to move in a direction close to each other through the buffer spring 163, and the U-shaped deflection correcting plates 162 move in a direction close to each other and contact the ceramic-based circuit board, and the front and rear U-shaped deflection correcting plates 162 correct and position the ceramic-based circuit board, so that the ceramic-based circuit board is in a swinging position. The U-shaped deflection correction plate 162 is placed in the correct position for subsequent etching, cleaning of etching liquid and drying. Due to the effect of the buffer spring 163, the U-shaped deflection correction plate 162 can be closely contacted with the ceramic-based circuit board for deflection correction and positioning. After the ceramic-based circuit board is deflected and positioned, the stepper motor 165 is started to drive the bidirectional screw 164 to reverse, and the bidirectional screw 164 reverses to drive the front and rear U-shaped movable plates 161 to move away from each other and reset. The U-shaped movable plate 161 drives the front and rear U-shaped deflection correction plates 162 to move away from each other and reset through the buffer spring 163. The U-shaped deflection correction plate 162 is reset and disengaged from the ceramic-based circuit board. In this way, the ceramic-based circuit board can be prevented from being in a skewed state to affect the removal of etching liquid, thereby ensuring that the ceramic-based circuit board can be fully cleaned of etching liquid.

[0036] When the driving motor 81 rotates forward through the belt roller 8 to drive the water absorption belt 9 to rotate forward, the driving motor 81 also rotates forward through the synchronous belt assembly to drive the front shaft 17 to rotate forward, the front shaft 17 rotates forward to drive the front brush roller 171 to rotate forward, the front shaft 17 also drives the front guide gear 172 to rotate forward, the front guide gear 172 rotates forward to drive the rear guide gear 172 to rotate reversely, the rear guide gear 172 reverses to drive the rear shaft 17 to reverse, the rear shaft 17 reverses to drive the rear brush roller 171 to reverse, the rear brush roller 171 reverses and the front brush roller 171 reverses to remove impurities attached to the water absorption belt 9, the impurities removed by the rear brush roller 171 fall downward onto the inverted V-shaped plate 173, the inverted V-shaped plate 17 3 falls into the front shell 7, and the impurities removed by the front brush roller 171 fall directly into the front shell 7. The front shell 7 discharges the impurities into the material receiving frame 19, and the material receiving frame 19 collects and processes the impurities. When the driving motor 81 is turned off, the driving motor 81 stops driving the water absorption belt 9 to rotate forward through the belt roller 8, and the driving motor 81 also stops driving the front rotating shaft 17 to rotate forward, and the front rotating shaft 17 stops driving the front brush roller 171 to rotate forward, and the rear rotating shaft 17 also stops driving the rear brush roller 171 to reverse, and the operator can remove the material receiving frame 19 from the supporting frame 18, and pour out all the impurities in the material receiving frame 19 for processing. After all the impurities are poured out, the material receiving frame 19 is put back into the supporting frame 18. In this way, a large amount of impurities attached to the water absorption belt 9 can be prevented from affecting the subsequent absorption effect of the etching liquid, thereby further improving the effect of the subsequent use of the water absorption belt 9.

[0037] Please refer to Figure 11 As shown, the ceramic-based circuit board etching device further includes a guide roller 20. Guide rollers 20 are rotatably connected to the lower parts of the front and rear sides of the box body 1. The guide roller 20 is in contact with the inner side of the water absorption belt 9. The guide roller 20 can guide the water absorption belt 9 to prevent the water absorption belt 9 from being worn due to friction with the box body 1.

[0038] When the water absorption belt 9 rotates forward, the forward rotation of the water absorption belt 9 drives the guide roller 20 to rotate, and the guide roller 20 guides the water absorption belt 9. In this way, it can prevent the water absorption belt 9 from contacting the box body 1 and causing wear, thereby ensuring the safety of the water absorption belt 9 during use.

Claims

1. A ceramic-based circuit board etching device, comprising a box body (1) and electric conveying rollers (2) installed between both sides of the box body (1). The inner side of the box body (1) is fixedly connected with partition plates (4) at uniform intervals. An electric liquid spraying head (5) is installed on the inner side of the box body (1), and an air jet head (6) is installed on the inner side of the box body (1). A collection frame (3) located below the electric liquid spraying head (5) is fixedly connected to the inner side of the box body (1). Shells (7) are fixedly connected to both outer sides of the box body (1), and it is characterized in that, It also includes a belt roller (8) symmetrically and rotatably connected to the inner side of the housing (7). An absorbent belt (9) that slidably penetrates through the box body (1) is wound between the belt rollers (8). The electric conveying roller (2) passes through the inner side of the absorbent belt (9). A driving motor (81) is installed on the box body (1). The end of the output shaft of the driving motor (81) is fixedly connected to the end of one of the belt rollers (8). A fixed plate (10) is fixedly connected between the two sides inside the box body (1). A movable rod (11) is slidably inserted through the fixed plate (10). A tensioning roller (12) that contacts the absorbent belt (9) is rotatably inserted between the movable rods (11). A connecting spring (13) is connected between the movable rod (11) and the fixed plate (10). A pressing assembly is arranged between the box body (1) and the movable rod (11). The pressing assembly is used to push the absorbent belt (9) into contact with the etching surface of the ceramic-based circuit board, so that the absorbent belt (9) absorbs and removes the etching solution attached to the ceramic-based circuit board. An extrusion assembly is arranged on the box body (1) for extruding the etching solution inside the absorbent belt (9).

2. The ceramic substrate circuit board etching device according to claim 1, wherein The pressing assembly includes an electric pressing plate (14) installed on the inner side of the box body (1). An airbag (141) located directly above the absorbent belt (9) is fixedly connected to the bottom of the electric pressing plate (14), which is used to push the absorbent belt (9) to move downward into contact with the ceramic-based circuit board. An n-shaped rod (1411) is fixedly connected between the tops of the movable rods (11). A push plate (142) is fixedly connected to the n-shaped rod (1411). The push plate (142) passes through the electric conveying roller (2) and is located directly below the airbag (141), which is used to drive the ceramic-based circuit board to move upward. A transmission assembly is arranged between the push plate (142) and the electric pressing plate (14) for driving the movement of the push plate (142).

3. The ceramic substrate circuit board etching device according to claim 2, wherein The transmission assembly includes an L-shaped rack I (143) fixedly connected to the electric pressing plate (14). A spur gear (144) meshing with the L-shaped rack I (143) is rotatably connected to one of the partition plates (4). An L-shaped rack II (145) meshing with the spur gear (144) is fixedly connected to the push plate (142).

4. The ceramic substrate circuit board etching device according to claim 3, wherein, The extrusion assembly includes a liquid discharge frame (15) fixedly inserted through the box body (1). The liquid discharge frame (15) is located directly below the tensioning roller (12). An extrusion roller (151) that contacts the absorbent belt (9) is rotatably connected between the two sides of the liquid discharge frame (15), which is used to extrude the etching solution inside the absorbent belt (9).

5. The ceramic substrate circuit board etching device according to claim 4, wherein, The ceramic-based circuit board etching device also includes a deflection correction component, which includes a guide rod (16) fixedly connected between two sides of the box body (1), a U-shaped movable plate (161) symmetrically slidably mounted on the guide rod (16), a U-shaped deflection correction plate (162) located above the electric conveying roller (2) slidably mounted on the guide rod (16) to correct the deflection of the ceramic-based circuit board, and a U-shaped deflection correction plate (162) and a U-shaped movable plate (161) are connected between the U-shaped deflection correction plate (162) and the U-shaped movable plate (161) and are mounted on the guide rod (16). A buffer spring (163) is provided, a bidirectional screw (164) is rotatably connected between the two sides of the box body (1), the threads of the bidirectional screw (164) on the front and rear sides are opposite, the bidirectional screw (164) is threadedly connected to the U-shaped movable plate (161), the bidirectional screw (164) slides through the U-shaped deviation correcting plates (162) on the front and rear sides, a stepping motor (165) is installed on the box body (1), and the output shaft end of the stepping motor (165) is fixedly connected to the end of the bidirectional screw (164).

6. The ceramic-based circuit board etching device according to claim 5, characterized in that, The ceramic-based circuit board etching device further comprises a cleaning component, the cleaning component comprising a rotating shaft (17) symmetrically rotatably connected between two sides of one of the housings (7), one of the rotating shafts (17) being connected to the output shaft of the driving motor (81) via a synchronous belt component, a brush roller (171) in contact with the water absorption belt (9) being fixedly sleeved on the rotating shaft (17) for cleaning impurities attached to the water absorption belt (9), a guide gear (172) being fixedly sleeved on the rotating shaft (17), the guide gears (172) on the front and rear sides being meshed, an inverted V-shaped plate (173) being fixedly connected to the housing (1), the inverted V-shaped plate (173) being located below the rear brush roller (171) for guiding impurities, and a collecting component being arranged on the housing (1) for collecting fallen impurities.

7. The ceramic substrate circuit board etching device according to claim 6, wherein The collecting assembly comprises a supporting frame (18) fixedly connected to the box body (1), the supporting frame (18) being located below one of the shells (7), and a receiving frame (19) being placed on the supporting frame (18) for collecting impurities.

8. The ceramic substrate circuit board etching device according to claim 7, characterized in that, The ceramic-based circuit board etching device also includes a guide roller (20) rotatably connected to the box body (1), the guide roller (20) being in contact with the inner side of the water absorption belt (9) and being used to guide the water absorption belt (9).

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