Liquid ejecting head and liquid ejecting recording apparatus

Abstract

The invention provides a liquid ejecting head capable of improving reliability. A liquid ejecting head according to one embodiment of the present disclosure includes: an ejecting section having a plurality of nozzles that eject a liquid; a drive substrate on which one or a plurality of drive devices for outputting a drive signal for ejecting the liquid from the nozzle to the ejection unit are disposed on a first surface; a heat dissipation member that is disposed on the first surface side of the drive substrate and cools the drive device; a pressing member disposed on a second surface side of the drive substrate facing the first surface, the pressing member bringing the drive substrate into contact with the heat dissipation member; and a fixing portion that fixes a portion of the pressing member to the drive substrate. The arrangement area of the driving device extends along a first direction in the first surface, and the fixing part is arranged in an area along a second direction orthogonal to the first direction in the first surface based on the arrangement position of the driving device.

Description

Technical Field

[0001] The present disclosure relates to a liquid ejection head and a liquid ejection recording apparatus. Background Art

[0002] Liquid ejection recording apparatuses equipped with a liquid ejection head are used in various fields, and various types of liquid ejection heads have been developed as the liquid ejection head. Summary of the Invention Problems to be Solved by the Invention

[0003] In such a liquid ejection head, it is generally required to easily improve reliability.

[0004] Therefore, it is desirable to provide a flexible substrate, a liquid ejection head, and a liquid ejection recording apparatus that can easily improve reliability. Means for Solving the Problems

[0005] A liquid ejection head according to an embodiment of the present disclosure includes: an ejection unit having a plurality of nozzles that eject a liquid; a drive substrate on which one or more drive devices for outputting a drive signal for ejecting the liquid from the nozzles are arranged on a first surface; a heat dissipation member arranged on the first surface side of the drive substrate for cooling the drive devices; a pressing member arranged on the second surface side of the drive substrate opposite to the first surface for pressing the drive substrate against the heat dissipation member; and a fixing portion that fixes a part of the pressing member to the drive substrate. The arrangement region of the drive devices extends along a first direction in the first surface, and the fixing portion is arranged in a region in the first surface along a second direction orthogonal to the first direction with reference to the arrangement position of the drive devices.

[0006] A liquid ejection recording apparatus according to an embodiment of the present disclosure includes the liquid ejection head according to an embodiment of the present disclosure. Advantages of the Invention

[0007] According to the liquid ejection head and the liquid ejection recording apparatus according to an embodiment of the present disclosure, reliability can be improved. Brief Description of the Drawings

[0008] Figure 1 is a block diagram showing a schematic configuration example of a liquid ejection apparatus according to an embodiment of the present disclosure. Figure 2 schematically shows Figure 1 a perspective view of a schematic configuration example of the liquid ejection head shown. Figure 3 schematically shows Figure 2 a cross-sectional view of a configuration example of the liquid ejection head shown. Figure 4 Schematically represents Figure 2 、 Figure 3 A top view showing a detailed configuration example of the flexible substrate shown in FIG. Figure 5 Schematically represents Figure 4 A top view showing a detailed configuration example near the flexible substrate shown in FIG. Figure 6 Schematically represents Figure 5 An exploded perspective view showing a configuration example near the flexible substrate shown in FIG. Figure 7 Schematically represents Figure 6 A perspective view showing a configuration example of the arrangement of the fixing portion and the like shown in FIG. Figure 8 Schematically represents Figure 6 A top view showing a configuration example of the arrangement of the fixing portion and the like shown in FIG. Figure 9 Schematically represents Figure 6 Another top view showing a configuration example of the arrangement of the fixing portion and the like shown in FIG. Figure 10 A schematic top view for explaining a configuration example around the driving device. Figure 11 Schematically represents Figure 10 A top view showing a detailed configuration around the driving device shown in FIG. Figure 12 A top view schematically showing a configuration example near the flexible substrate related to the comparative example. Figure 13 A top view schematically showing a configuration example near the flexible substrate related to Modification Example 1. Figure 14 A top view schematically showing a configuration example near the flexible substrate related to Modification Example 2. Detailed implementation manners

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In addition, the description will be made in the following order. 1. Embodiment (Example of a liquid ejection head having fixing portions with various configurations) 2. Modification examples Modification Examples 1 and 2 (Configuration examples in the case where the number of driving devices is changed) 3. Other modification examples

[0010] <1. Embodiment> [Schematic configuration of printer 5] Figure 1This is a diagram showing a schematic configuration example of a printer 5 which is a liquid ejection recording apparatus according to an embodiment of the present disclosure in a block diagram. Figure 2 This is a diagram schematically showing in a perspective view Figure 1 a schematic configuration example of an inkjet head 1 which is the liquid ejection head shown. Figure 3 This is a diagram schematically showing in a sectional view (Y-Z sectional view) Figure 2 a configuration example of the inkjet head 1 shown.

[0011] In addition, in each of the drawings used in the description of this specification, the scale of each component is appropriately changed in order to make each component a recognizable size.

[0012] The printer 5 is an inkjet printer that records (prints) images, characters, etc. on a recording medium (for example, Figure 1 the recording paper P shown) using the ink 9 described later. As Figure 1 shown, this printer 5 includes an inkjet head 1, a printing control unit 2, and an ink tank 3.

[0013] In addition, the inkjet head 1 corresponds to a specific example of the "liquid ejection head" in the present disclosure, and the printer 5 corresponds to a specific example of the "liquid ejection recording apparatus" in the present disclosure. Further, the ink 9 corresponds to a specific example of the "liquid" in the present disclosure.

[0014] (A. Printing Control Unit 2) The printing control unit 2 supplies various information (data) to the inkjet head 1. Specifically, as Figure 1 shown, the printing control unit 2 supplies a printing control signal Sc to the inside of the inkjet head 1 (the drive device 41 etc. described later) respectively. In addition, in this printing control signal Sc, for example, image data, ejection timing signals, and a power supply voltage for operating the inkjet head 1 are included.

[0015] (B. Ink Tank 3) The ink tank 3 is a tank that houses the ink 9 inside. As Figure 1 shown, the ink 9 inside this ink tank 3 is supplied to the inside of the inkjet head 1 (the ejection unit 11 described later) via an ink supply tube 30. In addition, the ink supply tube 30 is constituted by, for example, a flexible hose having flexibility.

[0016] (C. Inkjet Head 1) As Figure 1 shown by the dotted arrow, the inkjet head 1 is a head that ejects (spits out) droplet-like ink 9 from a plurality of nozzle holes Hn described later onto the recording paper P to record images, characters, etc. For example, as Figure 2 , Figure 3As shown, the inkjet head 1 includes one ejection unit 11, one I / F (interface) substrate 12, four flexible substrates 13a, 13b, 13c, 13d, and two cooling units 141, 142.

[0017] Here, the flexible substrates 13a, 13b, 13c, 13d (the flexible substrate 13 to be described later) respectively correspond to a specific example of the "drive substrate" in the present disclosure. In addition, the cooling units 141, 142 (the cooling unit 14 to be described later) respectively correspond to a specific example of the "heat dissipation component" in the present disclosure.

[0018] (C-1. I / F Substrate 12) As Figure 2 、 Figure 3 shown, the I / F substrate 12 includes two connectors 10, four connectors 120a, 120b, 120c, 120d, and a circuit configuration area 121.

[0019] As Figure 2 shown, the connector 10 is a part (connector part) for inputting the aforementioned printing control signal Sc supplied from the printing control unit 2 to the inkjet head 1 (the flexible substrates 13a, 13b, 13c, 13d to be described later).

[0020] The connectors 120a, 120b, 120c, 120d are respectively parts (connector parts) for electrically connecting between the I / F substrate 12 and the flexible substrates 13a, 13b, 13c, 13d.

[0021] The circuit configuration area 121 is an area where various circuits are arranged on the I / F substrate 12. In addition, such a circuit configuration area may also be provided in other areas on the I / F substrate 12.

[0022] (C-2. Ejection Unit 11) As Figure 1 shown, the ejection unit 11 is a part that has a plurality of nozzle holes Hn and ejects ink 9 from these nozzle holes Hn. According to the drive signal Sd (drive voltage Vd) supplied from the drive device 41 to be described later on each of the flexible substrates 13a, 13b, 13c, 13d, such ejection of the ink 9 is performed (refer to Figure 1 ).

[0023] As Figure 1 shown, such an ejection unit 11 is composed of an actuator plate 111 and a nozzle plate 112.

[0024] (Nozzle Plate 112) The nozzle plate 112 is a plate made of a film material such as polyimide or a metal material. As Figure 1As shown, there are multiple nozzle holes Hn as described above. These nozzle holes Hn are formed side by side at a predetermined interval and, for example, are circular in shape. In addition, each of these nozzle holes Hn corresponds to a specific example of the "nozzle" in the present disclosure.

[0025] Specifically, in the example of the ejection unit 11 shown in Figure 2 multiple nozzle holes Hn in the nozzle plate 112 are composed of multiple nozzle rows (4 nozzle rows) arranged along the column direction (X-axis direction) respectively. In addition, these 4 nozzle rows are arranged side by side along the direction (Y-axis direction) orthogonal to the column direction.

[0026] (Actuator plate 111) The actuator plate 111 is, for example, a plate made of a piezoelectric material such as PZT (lead zirconate titanate). In this actuator plate 111, multiple channels (pressure chambers) are provided. These channels are parts for applying pressure to the ink 9 and are arranged side by side in a parallel manner at a predetermined interval. Each channel is divided by a drive wall (not shown) made of a piezoelectric body and becomes a concave groove portion when observed in cross section.

[0027] In such channels, there are ejection channels for ejecting the ink 9 and dummy channels (non-ejection channels) that do not eject the ink 9. In other words, the ink 9 is filled in the ejection channels, while the dummy channels are not filled with the ink 9. In addition, for example, the ink 9 is filled into each ejection channel via a flow path (common flow path) that communicates with such each ejection channel in common. In addition, each ejection channel communicates individually with the nozzle hole Hn in the nozzle plate 112, while each dummy channel does not communicate with the nozzle hole Hn. These ejection channels and dummy channels are arranged alternately side by side along the aforementioned column direction (X-axis direction).

[0028] In addition, drive electrodes are respectively provided on the opposing inner side surfaces of the above-described drive walls. In this drive electrode, there are a common electrode (common electrode) provided on the inner side surface facing the ejection channel and an active electrode (individual electrode) provided on the inner side surface facing the dummy channel. These drive electrodes are electrically connected to a drive device 41 described later via respective flexible substrates 13a, 13b, 13c, 13d. Thereby, the aforementioned drive voltage Vd (drive signal Sd) is applied to each drive electrode from the drive device 41 via respective flexible substrates 13a, 13b, 13c, 13d (refer to Figure 1 ).

[0029] (C-3. Flexible substrates 13a, 13b, 13c, 13d) As shown in Figure 2 , Figure 3As shown, the flexible substrates 13a, 13b, 13c, and 13d are substrates (driver substrates) that electrically connect the I / F substrate 12 and the ejection unit 11. These flexible substrates 13a, 13b, 13c, and 13d individually control the ejection operation of the ink 9 in each of the 4 nozzle rows in the aforementioned nozzle plate 112. Additionally, for example, as shown by the symbols P1a, P1b, P1c, and P1d in Figure 3 , near the connection parts of the respective flexible substrates 13a, 13b, 13c, and 13d to the ejection unit 11 (near the crimp electrodes 433), the respective flexible substrates 13a, 13b, 13c, and 13d are bent. Further, electrical connection between the crimp electrodes 433 and the ejection unit 11 is achieved, for example, by thermocompression bonding using an ACF (Anisotropic Conductive Film).

[0030] On such flexible substrates 13a, 13b, 13c, and 13d (on the surface S1), drive devices 41 are individually mounted (refer to Figure 3 ). These drive devices 41 are devices that output drive signals Sd (drive voltages Vd) for causing the ink 9 to be ejected from the nozzle holes Hn in the corresponding nozzle rows in the ejection unit 11. Therefore, such drive signals Sd are output from the respective flexible substrates 13a, 13b, 13c, and 13d to the ejection unit 11. Further, each of such drive devices 41 is constituted by, for example, an ASIC (Application Specific Integrated Circuit).

[0031] In addition, these drive devices 41 are cooled by the aforementioned cooling units 141 and 142. Specifically, as shown in Figure 3 , cooling units 141 are fixedly arranged between the drive devices 41 on the flexible substrates 13a and 13b, and the cooling units 141 are respectively abutted against these drive devices 41, whereby each drive device 41 is cooled. Similarly, cooling units 142 are fixedly arranged between the drive devices 41 on the flexible substrates 13c and 13d, and the cooling units 142 are respectively abutted against these drive devices 41, whereby each drive device 41 is cooled. Further, such cooling units 141 and 142 can be constituted by various cooling mechanisms respectively. As an example, a cooling mechanism is constituted by allowing a fluid such as ink to pass through.

[0032] [Detailed configuration near the flexible substrates 13a, 13b, 13c, and 13d] Next, in addition to Figures 1 to 3 , with reference to Figures 4 to 11 , a detailed configuration example near the aforementioned flexible substrates 13a, 13b, 13c, and 13d in the inkjet head 1 will be described.

[0033] Figure 4 This is a diagram schematically showing Figure 2 、 Figure 3 a detailed configuration example of the flexible substrates 13a to 13d (hereinafter, collectively referred to as the flexible substrate 13 as appropriate) shown in the figure. Figure 5 This is a diagram schematically showing Figure 4 a detailed configuration example near the flexible substrate 13 shown in the figure. In addition, Figure 6 This is a diagram schematically showing in an exploded perspective view Figure 5 a configuration example near the flexible substrate 13 shown in the figure. Figure 7 This is a diagram schematically showing in a perspective view Figure 6 a configuration example of the arrangement of the fixing portion 43 (described later) and the like shown in the figure. Figure 8 、 Figure 9 These are diagrams schematically showing in a plan view (Z-X plan view) Figure 6 a configuration example of the arrangement of the fixing portion 43 and the like shown in the figure. In addition, Figure 10 、 Figure 11 These are diagrams schematically showing in a plan view (Z-X plan view) the configuration examples around the driving device 41 on the flexible substrate 13. In addition, in Figure 6 、 Figure 7 , for convenience, only one driving device 41 out of the plurality of driving devices 41 described later is shown representatively. In addition, in Figures 6 to 9 , for convenience, only one through-hole H15 out of the plurality of through-holes H11 to H15 described later is shown representatively.

[0034] First, the flexible substrate 13 is a double-sided substrate having a multi-layer structure including a front surface S1 and a back surface S2. Specifically, the flexible substrate 13 has, as a wiring layer of such a multi-layer structure (two-layer structure), a first wiring layer on the front surface S1 side and a second wiring layer on the back surface S2 side that are opposed to each other along a direction (Y-axis direction) orthogonal to the substrate surface (Z-X plane) (refer to Figures 3 to 9 ). In addition, the wiring layer in the flexible substrate 13 may also be a structure of three or more layers including the above-mentioned first wiring layer and second wiring layer.

[0035] Here, the above-mentioned front surface S1 corresponds to a specific example of the "first surface" in the present disclosure, and the above-mentioned back surface S2 corresponds to a specific example of the "second surface" in the present disclosure.

[0036] As Figures 4 to 9As shown, the flexible substrate 13 has one or more of the aforementioned drive devices 41 (in this example, five drive devices 411 to 415), a plurality of through holes H11 to H15, a terminal portion 130, and a plurality of electrical contact portions 131. In addition, near the flexible substrate 13 in the inkjet head 1, as Figures 5 to 7 shown, the aforementioned cooling units 141 and 142 (hereinafter, collectively referred to as the cooling unit 14 as appropriate), a pressing member 42, and screws F1 to F9 are respectively provided.

[0037] As described above, the drive device 41 is disposed on the substrate of the flexible substrate 13 (on the first wiring layer on the surface S1 side). Specifically, for example, as Figure 6 shown, the first region A1, which is the arrangement region of the drive device 41, extends along the X-axis direction in the surface S1 of the flexible substrate 13. In addition, in Figure 4 、 Figures 8 to 11 the example shown, on the surface S1 of the flexible substrate 13 (within the aforementioned first region A1), a plurality of drive devices 41 (in this example, five drive devices 411 to 415) are arranged side by side along the X-axis direction (the length direction of the flexible substrate 13).

[0038] The terminal portion 130 is disposed in the end region on the I / F substrate 12 side of the flexible substrate 13 (refer to Figures 4 to 9 ), and includes a plurality of terminals for electrically connecting between the flexible substrate 13 and the I / F substrate 12. In other words, the terminal portion 130 is the portion inserted into the connectors 120a to 120d on the I / F substrate 12, which is another substrate.

[0039] The through holes H11 to H15 are respectively through holes provided on the flexible substrate 13. Specifically, as Figure 4 shown, near the end on the terminal portion 130 side along the Z-axis direction, the through holes H11 and H12 are provided near both ends along the X-axis direction. Near the center along the Z-axis direction, the through holes H13 and H14 are provided near both ends along the X-axis direction. In addition, as Figure 4 、 Figure 6 shown, the through hole H15 is provided in the region along the Z-axis direction (the second region A2) in the surface S1 of the flexible substrate 13 with the arrangement position of the drive device 41 as a reference. In addition, a detailed example of the position of the through hole H15 will be described later.

[0040] As Figure 4 、 Figure 5 shown, the electrical contact portions 131 are respectively provided around the through holes H13 and H14, and are components for ensuring electrical contact between the flexible substrate 13 and the screws F3 and F4 described later. Such electrical contact portions 131 are formed of a conductive member such as copper foil. In addition, asFigure 4 As shown, such an electrical contact portion 131 (a component for ensuring electrical contact between the flexible substrate 13 and the screws F1, F2, and F5 described later) is not provided around the through holes H11, H12, and H15 respectively.

[0041] As described above, the cooling units 14 (141, 142) are arranged on the surface S1 side of the flexible substrate 13 (refer to Figures 5 to 7 ), and are components (heat dissipation components) for cooling the drive device 41. In addition, as Figure 5 shown, by inserting the screws F1 to F4 described later into the through holes H11 to H14 respectively, the flexible substrate 13 is fixed to the cooling unit 14. In addition, although the details will be described later, as Figure 5 、 Figure 6 shown, even for the through hole H15, the screw F5 is inserted through the pressing member 42 described later, so that the flexible substrate 13 and the pressing member 42 are fixed to the cooling unit 14 respectively. In addition, between such a cooling unit 14 and the drive device 41, for example, a heat conducting sheet (not shown) is arranged, and the cooling unit 14 and the drive device 41 are in thermal contact via the heat conducting sheet.

[0042] As Figure 5 shown, the pressing member 42 is arranged on the back surface S2 side of the flexible substrate 13, and is a component for pressing the flexible substrate 13 against the cooling unit 14. For example, as Figure 5 shown, the pressing member 42 is fixed by being screwed to other metal components (not shown) using the screws F6 to F9 near both ends in the X-axis direction. In addition, as Figure 4 、 Figure 5 shown, the pressing member 42 is arranged so as to cover the arrangement area of the drive device 41 ( Figure 6 shown as the first area A1). On such a pressing member 42, for example, a through hole H25 (refer to Figure 5 ) is provided in the fixing area 420 (the protruding portion along the Z-axis direction) shown. In addition, the arrangement position of the fixing area 420 (through hole H25) on the pressing member 42 is not limited to the Figure 6 shown example, and may also be other arrangement positions. Figure 5 、 Figure 6 shown.

[0043] The screws F1 to F9 are respectively components for fixing various components to each other (fixing by screwing) as described above. In particular, for example, as Figure 6As shown, through holes H15 in the flexible substrate 13 and through holes H25 in the pressing member 42 are respectively inserted with screws F5 for fixing between the flexible substrate 13 and the pressing member 42. In addition, the screw F5 is also inserted into the cooling unit 14, and the force with which the pressing member 42 presses the driving device 41 (such as the driving device 413) to the cooling unit 14 in the fixing area 420 is maintained by the screw F5.

[0044] (Fixing portion 43) Here, for example, as Figure 6 shown, in the inkjet head 1 of the present embodiment, a fixing portion 43 is constituted by including the above-mentioned through holes H15, H25 and screws F5. As described above, the fixing portion 43 is a mechanism for fixing a part (near the fixing area 420) of the pressing member 42 to the flexible substrate 13. Details will be described later, but for example, as Figure 6 shown, such a fixing portion 43 is arranged in a region (second region A2) along the Z-axis direction orthogonal to the X-axis direction within the surface S1 of the flexible substrate 13 with reference to the arrangement position of the driving device 41.

[0045] In the inkjet head 1 of the present embodiment, hereinafter, the reason for providing such a fixing portion 43 will be described with reference to a comparative example.

[0046] Figure 12 is a diagram schematically showing a configuration example near a driving substrate (flexible substrate 103) in an inkjet head according to a comparative example in a top view (Z-X top view). Near the flexible substrate 103 in this comparative example, unlike the pressing member 42 near the flexible substrate 13 in the present embodiment (for example, refer to Figure 5 , Figure 6 ), the fixing portion 43 is not provided on the pressing member 102. Therefore, in the inkjet head of this comparative example, for example, due to the following reasons, the reliability may decrease.

[0047] Specifically, in the flexible substrate 103 of this comparative example, the drive devices 41 (drive devices 411 and 415) on both ends of the fixing portion (the fixing portion using screws F6 to F9) closest to the two ends in the pressing member 102 are most strongly pressed against the cooling unit 14. On the other hand, regarding the drive device 413 near the center in the X-axis direction, the pressing member 102 flexes near the center in the X-axis direction, and thus the force pressing it against the cooling unit 14 mostly becomes insufficient. In addition, at both ends of this drive device 413, two drive devices 412 and 414 are arranged. Therefore, in addition to the heat generated when the drive device 413 itself operates, it is also affected by the heat generated by the surrounding drive devices 412 and 414. Thus, it is the most disadvantageous place in terms of heat. Due to these situations, it can be said that countermeasures as follows are required: Even near the center in the X-axis direction (near the drive device 413) in the pressing member 102, it is strongly pressed against the cooling unit 14.

[0048] Here, in addition to Figures 4 to 6 also refer to Figures 7 to 9 , and the configuration example of the above-mentioned fixing portion 43 will be described in detail.

[0049] First, for example, in the region in the Z-axis direction with reference to the arrangement position of the drive device 413 closest to the perpendicular bisector L5 of the side (long side) along the X-axis direction among the plurality of drive devices 41 arranged side by side along the X-axis direction, a fixing portion 43 (through hole H15, etc.) is arranged (refer to Figure 8 , Figure 9 ). In particular, in the example of Figure 9 , within the surface S1 of the flexible substrate 13, in the region of the drive device 41 (drive device 413) along the perpendicular bisector L5 of the side (long side) along the X-axis direction, a fixing portion 43 (through hole H15, etc.) is arranged.

[0050] In addition, for example, within the surface S1 of the flexible substrate 13, in the region (output terminal side region Aout) including the wiring of the drive signal Sd output from the drive device 41, a fixing portion 43 (through hole H15, etc.) is arranged (refer to Figure 7 ). Hereinafter, the advantages and the like of arranging the fixing portion 43 (through hole H15, etc.) in such an output terminal side region Aout will be described.

[0051] First, in Figure 10In the example, an input terminal side region Ain and an output terminal side region Aout are respectively shown around each of a plurality of drive devices 41 (drive devices 411 to 415), and an inter-device region Ag12, Ag23, Ag34, Ag45 located between the drive devices 41. Further, the inter-device region Ag12 is a region located between the drive devices 411 and 412, and the inter-device region Ag23 is a region located between the drive devices 412 and 413. Similarly, the inter-device region Ag34 is a region located between the drive devices 413 and 414, and the inter-device region Ag45 is a region located between the drive devices 414 and 415.

[0052] In addition, in Figure 11 the example, an input terminal side region Ain and an output terminal side region Aout are respectively shown around each of the drive devices 412 and 413 shown in Figure 10 , and the above-mentioned inter-device region Ag23. In this Figure 11 , a plurality of input terminals Tin and a plurality of output terminals Tout in each of the drive devices 412 and 413, and a transmission line Lt cascade-connected between these drive devices 412 and 413 are also respectively shown. In Figure 11 , various wiring patterns (patterns such as a drive signal wiring Wd output from each output terminal Tout, various power supply wirings Wp1, Wp2, and a ground wiring Wg) and vias TH for electrically connecting these wiring patterns to each other are also respectively shown.

[0053] In the example configured as such in Figure 11 , as candidates for the arrangement positions of the through holes H15 constituting the fixing portion 43, for example, the following candidates are listed. · First candidate: Input terminal side region Ain · Second candidate: Inter-device region Ag23 · Third candidate: Output terminal side region Aout

[0054] In the input terminal side region Ain as the first candidate, various signal lines or components connected to the respective input terminals Tin in the drive devices 412 and 413 are arranged. On the other hand, in the inter-device region Ag23 as the second candidate, wiring patterns such as various power supply wirings Wp1, Wp2, or a ground wiring Wg are arranged (refer to Figure 11 ).

[0055] Here, the through-hole H15 penetrates all the layers in the flexible substrate 13. Therefore, as the arrangement position of the through-hole H15, areas with dense components, areas with complex wiring patterns, or areas where various power wirings are arranged are not ideal. In addition, the vicinity of the through-hole H15 is the part where the pressing force from the pressing member 42 is the greatest. Therefore, if such a force is applied near the short side of the rectangular driving device 41, the connection state between the flexible substrate 13 and the terminals of the driving device 41 may be damaged at this part.

[0056] Considering the above situation, among the above first to third candidates, it can be said that it is ideal to arrange the through-hole H15 near the center of the long side of the arrangement area of the driving device 41, that is, the output terminal side area Aout which is the third candidate.

[0057] In addition, in order to arrange the through-hole H15 on the flexible substrate 13, many driving signal wirings Wd (refer to Figure 11 ) arranged in the output terminal side area Aout need to be arranged avoiding the through-hole H15. As the amount by which these driving signal wirings Wd avoid the through-hole H15, it is easier to route each driving signal wiring Wd when it is as uniform as possible among all the driving signal wirings Wd output from one driving device 41. Therefore, as the arrangement position of the through-hole H15, it can be said that it is ideal to be near the center in the long side direction (X-axis direction) of the driving device 41.

[0058] Furthermore, as in the examples of Figure 10 and Figure 11 , when multiple driving devices 41 are arranged on the flexible substrate 13, for example, it is also possible not to provide through-holes H15 in the output terminal side areas Aout of each driving device 41 respectively. This is for the following reasons as described above. That is, first, regarding the driving device 413 located near the center along the X-axis direction, the pressing member 42 flexes near the center along the X-axis direction, so the force pushed against the cooling unit 14 becomes weaker, and thus the thermal contact with the cooling unit 14 also becomes weaker. In addition, two driving devices 412 and 414 are arranged at both ends of this driving device 413, so it is also the place that is the most disadvantageous thermally as described above. To solve these problems, it can be said that it is ideal to arrange one through-hole H15 in the output terminal side area Aout of this driving device 413 near the center of the pressing member 42 along the X-axis direction (near the driving device 413).

[0059] Here, the above-mentioned X-axis direction corresponds to a specific example of the "first direction" in the present disclosure, and the above-mentioned Z-axis direction corresponds to a specific example of the "second direction" in the present disclosure. Additionally, the above-mentioned through-hole H15 corresponds to a specific example of the "first through-hole" in the present disclosure, and the above-mentioned through-hole H25 corresponds to a specific example of the "second through-hole" in the present disclosure. Further, the above-mentioned screw F5 corresponds to a specific example of the "fixing member" in the present disclosure.

[0060] [Operation and Effect] (A. Basic Operation of Printer 5) In this printer 5, an inkjet head 1 is used to perform an ink ejection operation of ink 9 to perform an image or text recording operation (printing operation) on a recording medium (such as recording paper P). Specifically, in the inkjet head 1 of the present embodiment, the following processing is performed to perform an ink ejection operation of ink 9 using a shear mode.

[0061] First, the driving devices 41 on each flexible substrate 13 (13a, 13b, 13c, 13d) respectively apply a driving voltage Vd (driving signal Sd) to the aforementioned driving electrodes (common electrode and active electrode) in the actuator plate 111 in the ejection unit 11. Specifically, each driving device 41 applies a driving voltage Vd to each driving electrode disposed on a pair of driving walls that partition the aforementioned discharge channel. As a result, these two driving walls are deformed so as to protrude toward the pseudo-channel side adjacent to the discharge channel.

[0062] At this time, the driving wall is bent and deformed in a V-shape with the intermediate position in the depth direction of the driving wall as the center. Then, due to such bending deformation of the driving wall, the discharge channel is deformed as if it bulges. In this way, through the bending deformation using the piezoelectric thickness sliding effect at the pair of driving walls, the volume of the discharge channel increases. Then, due to the increase in the volume of the discharge channel, ink 9 is guided into the discharge channel.

[0063] Next, the ink 9 guided into the discharge channel in this way becomes a pressure wave and propagates inside the discharge channel. Then, at the moment when this pressure wave reaches the nozzle hole Hn of the nozzle plate 112 (or a moment near it), the driving voltage Vd applied to the driving electrode becomes 0 (zero) V. As a result, the driving wall returns from the above-mentioned bent and deformed state, and as a result, the temporarily increased volume of the discharge channel returns to its original state again.

[0064] In this way, during the process of the volume of the discharge channel returning to its original state, the pressure inside the discharge channel increases, and the ink 9 inside the discharge channel is pressurized. As a result, droplet-shaped ink 9 is ejected to the outside (toward the recording paper P) through the nozzle hole Hn (see Figure 1)。In this way, the ejection operation (spit operation) of the ink 9 in the inkjet head 1 is completed. As a result, a recording operation such as an image or text on the recording paper P is performed.

[0065] (B. Function / Effect in the Inkjet Head 1) Next, the functions and effects in the inkjet head 1 of the present embodiment will be described in detail.

[0066] (B-1. Regarding the Conventional Inkjet Head) First, regarding the drive substrate (the drive substrate on which drive devices are mounted) for driving the inkjet head, the number of wirings related to the input / output of the drive devices is generally very large. Therefore, in order to configure wirings for heat dissipation of the drive devices, etc., the number of substrate layers is increased and a large-area heat dissipation wiring (ground wiring or power supply wiring) is configured in this layer. However, it is easy to increase the number of layers in a rigid substrate, but it is difficult to increase the number of layers in a flexible substrate from the cost aspect.

[0067] In addition, in recent years, the number of drive nozzles of the inkjet head has increased and the ejection frequency has also become higher. Therefore, in addition to the increase in the mounting density of the drive devices, the heat generation amount of the drive devices has increased. Therefore, in the heat dissipation wiring arranged on the drive substrate, the heat dissipation of the drive devices is insufficient. Therefore, for example, a metal cooling component (heat sink, etc.) is used to dissipate the heat of the drive devices. It is known that in order to ensure the thermal contact between such a cooling component and the drive device, for example, screw fixation is performed in the area between multiple drive devices to ensure the heat dissipation path.

[0068] In the case of performing screw fixation in the area between the drive devices by such processing, the area (gap) between the drive devices needs to be larger than the screw, but considering the circuit mounting density on the substrate, it is ideal that the gap between the drive devices is narrow. Moreover, a threaded hole needs to be arranged in this narrow gap area. That is, the requirement to increase the circuit mounting density and the requirement to ensure the gap for the threaded hole are opposite. This problem is particularly significant in the case of arranging multiple rectangular drive devices side by side along the long side, and on top of that, there is also a problem that it becomes difficult to achieve thermal contact with the drive device arranged near the center when multiple drive devices are arranged side by side.

[0069] Due to these situations, it can be said that the reliability may decrease in the conventional inkjet head.

[0070] (B-2. Function / Effect) On the contrary, in the inkjet head 1 of the present embodiment, by having the following configuration, for example, the following functions and effects are obtained.

[0071] That is, first, in the inkjet head 1, on the back surface S2 side of the flexible substrate 13 (the surface side opposite to the surface S1 side where the cooling unit 14 for cooling the drive device 41 is provided), a pressing member 42 for pressing the flexible substrate 13 against the cooling unit 14 is provided. In addition, in the inkjet head 1, a fixing portion 43 for fixing a part of the pressing member 42 to the flexible substrate 13 is provided. Thus, in the present embodiment, compared with the foregoing comparative examples and the like, it is easy to ensure the pressing force of the drive device 41 on the flexible substrate 13 toward the cooling unit 14, thereby promoting the cooling of the drive device 41. As a result, the operation stability of the drive device 41 is ensured.

[0072] In addition, in the inkjet head 1, the arrangement region of the drive device 41 on the flexible substrate 13 extends along the X-axis direction within the surface S1. And, with the arrangement position of the drive device 41 as a reference, the fixing portion 43 is arranged in the region within the surface S1 of the flexible substrate 13 along the Z-axis direction orthogonal to the X-axis direction. Thus, in the present embodiment, for example, it is different from the case where the fixing portion 43 is arranged in the region along the X-axis direction with the arrangement position of the drive device 41 as a reference, as follows. That is, it avoids the defective conditions near the end portion in the X-axis direction in the drive device 41 (such as the poor connection between the terminals of the drive device 41 and the flexible substrate 13).

[0073] Due to the above situation, in the present embodiment, for example, compared with the foregoing comparative examples and the like, the reliability of the inkjet head 1 can be improved.

[0074] In addition, in the present embodiment, near the end portion of the drive device 41, a strong force formed by the screw F5 is applied to the flexible substrate 13, which also prevents the connection between the terminals near the end portion of the drive device 41 and the flexible substrate 13 from being damaged. Thus, the reliability can also be improved in this regard. Furthermore, in the case where a plurality of drive devices 41 are arranged, the above effects can be efficiently obtained by using a smaller number of through holes (one through hole H15), so that the cost can also be reduced. In addition, in the present embodiment, high-frequency ejection can also be performed, so that the productivity of the printer 5 is also improved, and it is also easy to ensure the return line of the drive signal Sd output from the drive device 41. Thus, the reliability can be ensured and the above effects can be obtained at the same time. In addition, in the present embodiment, by configuring the flexible substrate 13 in such a way, for example, appropriate through holes can be arranged corresponding to the size or number of the drive device 41, etc., so that the design freedom of the inkjet head 1 can be ensured while seeking to improve the reliability and reduce the cost.

[0075] Furthermore, in the present embodiment, within the configuration region of the drive device 41, a plurality of drive devices 41 are arranged side by side along the X-axis direction. Thus, as follows. That is, by arranging the drive devices 41 along the longitudinal direction, the path of the wiring pattern on the flexible substrate 13 becomes short and simple. Therefore, miniaturization of the flexible substrate 13 can be achieved.

[0076] In addition, in the present embodiment, in the case where the fixing portion 43 is arranged in the region along the Z-axis direction with reference to the arrangement position of the drive device 413 closest to the vertical bisector line L5 of the side along the X-axis direction within the surface S1 of the flexible substrate 13 among the plurality of drive devices 41 arranged side by side along the X-axis direction, as follows. That is, by setting the arrangement of such a fixing portion 43 (through hole H15), it is possible to arrange the through hole H15 only near the center of the flexible substrate 13 where the deviation of the thermal distribution is large, and the number of necessary components or through holes can be reduced.

[0077] Moreover, in the present embodiment, the number of the plurality of drive devices 41 on the flexible substrate 13 is odd (five). Thus, as follows. That is, when the number of drive devices 41 is odd, the number of through holes (through hole H15) added due to the setting of the fixing portion 43 can be set to one, and at the same time, the above-mentioned effects can be obtained. As a result, the design freedom of the inkjet head 1 can be ensured, and at the same time, improvement in reliability and cost reduction can be achieved.

[0078] Furthermore, in the present embodiment, in the case where the fixing portion 43 is arranged in the region within the surface S1 of the flexible substrate 13 along the vertical bisector line L5 of the side along the X-axis direction among the drive devices 41, as follows. That is, by setting the arrangement of such a fixing portion 43 (through hole H15), the cooling unit 14 can be used to cool the vicinity of the center of the drive device 41. Therefore, the deviation of the thermal distribution within the drive device 41 can be reduced. In addition, the situation where the vicinity of the end of the drive device 41 is broken due to the pressing force from the fixing portion 43 can also be prevented. As a result, the reliability of the flexible substrate 13 itself can be improved.

[0079] In addition, in the present embodiment, in the case where the fixing portion 43 is arranged in the region within the surface S1 of the flexible substrate 13 in the region (output terminal side region Aout) including the wiring of the drive signal Sd output from the drive device 41, as follows. That is, by arranging the fixing portion 43 (through hole H15) in a region that avoids the region where components around the drive device 41 or lines for the drive power supply are arranged, the wiring arrangement for avoiding the through hole H15 becomes easy. Thereby, stable operation of the drive device 41 can be ensured, and at the same time, the flexible substrate 13 provided with the through hole H15 can be manufactured. Therefore, the reliability of the inkjet head 1 can be further improved.

[0080] In addition, in the present embodiment, a fixing portion 43 is constituted by a through hole H15 provided in the flexible substrate 13, a through hole H25 provided in the pressing member 42, and a fixing member (screw F5) respectively inserted into these through holes H15 and H25 and used for fixing between the flexible substrate 13 and the pressing member 42. Thus, as follows. That is, for example, even when the driving device 41 is away from the end of the flexible substrate 13, the arrangement area of the driving device 41 can be reliably abutted against the cooling unit 14, and the pressing member 42 can be reliably fixed.

[0081] Furthermore, in the present embodiment, an electrical contact portion 131 between the flexible substrate 13 and the screw F5 is not provided around the through hole H15 constituting the fixing portion 43. Thus, as follows. That is, on the flexible substrate 13, the arrangement area of components or wirings avoiding the through hole H15 can be reduced, and the arrangement of power supply lines or components contributing to the stable operation of the inkjet head 1 can be performed.

[0082] In addition, in the present embodiment, the flexible substrate 13 constitutes a driving substrate for driving the inkjet head 1. Thus, as follows. That is, the design freedom or assemblability of the inkjet head 1 can be improved, and the miniaturization or yield of the inkjet head 1 can be pursued.

[0083] <2. Modified Example> Next, modified examples (modified examples 1 and 2) of the above-described embodiment will be described. In addition, the same reference numerals are given to the components identical to those in the embodiment, and the description will be appropriately omitted.

[0084] Figure 13 FIG. schematically shows a configuration example in the vicinity of a flexible substrate (flexible substrate 13A) according to Modified Example 1 in a top view (Z-X top view). In addition, Figure 14 FIG. schematically shows a configuration example in the vicinity of a flexible substrate (flexible substrate 13B) according to Modified Example 2 in a top view (Z-X top view).

[0085] In these modified examples 1 and 2, the number of driving devices 41 in the flexible substrates 13A and 13B is different (changed) from that in the flexible substrate 13 of the embodiment, and the other configurations are basically the same. Specifically, in Figure 13 the flexible substrate 13A of Modified Example 1 shown, three (an odd number) of driving devices 411 to 413 are arranged side by side along the X-axis direction. On the other hand, in Figure 14 the flexible substrate 13B of Modified Example 2 shown, four (an even number) of driving devices 411 to 414 are arranged side by side along the X-axis direction.

[0086] Here, in the flexible substrate 13A of Modification 1, similar to the case of the flexible substrate 13 in the embodiment, the through-holes H15 forming the fixing portion 43 are arranged in the following region. That is, in the region along the Z-axis (the aforementioned output terminal side region Aout) with reference to the arrangement position of the driving device 412 closest to the perpendicular bisector of the side along the X-axis direction, the through-holes H15 forming the fixing portion 43 are arranged.

[0087] Here, in the flexible substrate 13A of Modification 1, similar to the case of the flexible substrate 13 in the embodiment, the through-hole H15 forming the fixing portion 43 is arranged as follows. That is, in the region along the Z-axis (the aforementioned output terminal side region Aout) with reference to the arrangement position of one driving device 412 closest to the perpendicular bisector of the side along the X-axis direction, one through-hole H15 forming the fixing portion 43 is arranged.

[0088] On the other hand, in the flexible substrate 13B of Modification 2, slightly different from the case of the flexible substrate 13 in the embodiment, the through-holes H15 forming the fixing portion 43 are arranged as follows. That is, in the region along the Z-axis (the aforementioned output terminal side region Aout) with reference to the arrangement positions of two driving devices 412 and 413 closest to the perpendicular bisector of the side along the X-axis direction, two through-holes H151 and H152 forming the fixing portion 43 are respectively arranged. In addition, around these through-holes H151 and H152, similar to the periphery of the through-hole H15, the aforementioned electrical contact portion 131 is not provided. Further, both the through-holes H151 and 152 can be arranged, or only either one of the through-holes H151 and H152 can be arranged.

[0089] By such processing, the constitution and arrangement region of the fixing portion 43 are set corresponding to whether the number of driving devices 41 is odd or even.

[0090] In addition, the flexible substrates 13A and 13B respectively correspond to a specific example of the "driving substrate" in the present disclosure. Further, the through-holes H151 and H152 respectively correspond to a specific example of the "first through-hole" in the present disclosure.

[0091] In Modifications 1 and 2 having such a constitution, by substantially the same operation as in the embodiment, the same effects are also obtained.

[0092] <3. Other Modifications> As described above, the present disclosure has been described by listing the embodiment and modifications, but the present disclosure is not limited to these embodiments and the like, and various modifications can be made.

[0093] For example, in the above-described embodiments and the like, the configuration examples (shape, arrangement, number, etc.) of the components in the printer and the inkjet head are specifically listed and described. However, it is not limited to the configuration examples described in the above-described embodiments and the like, and other shapes, arrangements, numbers, etc. are also possible.

[0094] Specifically, for example, in the above-described embodiments and the like, the configuration examples (shape, arrangement, number, etc.) of the flexible substrate, the driving device, the fixing portion, and various wiring patterns are specifically listed and described. However, these configuration examples are not limited to the configuration examples described in the above-described embodiments and the like. For example, in the above-described embodiments and the like, an example in which a plurality of driving substrates are provided in the inkjet head is described. However, it is not limited to this example. For example, only one driving substrate may be provided in the inkjet head. In addition, in the above-described embodiments and the like, an example in which a plurality of driving devices are provided on the driving substrate is described. However, it is not limited to this example. For example, only one driving device may be provided on the driving substrate. Furthermore, in the above-described embodiments and the like, an example in which the driving substrate is a flexible substrate is described. However, it is not limited to this example. For example, the driving substrate may also be a non-flexible substrate (rigid substrate). In addition, in the above-described embodiments and the like, the shape of the driving device is set to a rectangular shape. However, it is not limited to this example. For example, it may also be a square shape. In addition, in the above-described embodiments and the like, as a specific example of the "fixing member" in the present disclosure, a screw is listed and described. However, it is not limited to this example, and other components (for example, a brooch or a tenon of a badge, etc.) may also be used to constitute the "fixing member".

[0095] In addition, as the structure of the inkjet head, various types of inkjet heads can be applied. That is, for example, it may also be a so-called side injection type inkjet head that ejects ink 9 from the central portion in the extending direction of each ejection channel in the actuator plate 111. Or, for example, it may also be a so-called edge injection type inkjet head that ejects ink 9 along the extending direction of each ejection channel. Furthermore, as the mode of the printer, it is not limited to the mode described in the above-described embodiments and the like. For example, various modes such as the MEMS (MicroElectro Mechanical Systems) mode can be applied.

[0096] Furthermore, for example, either a circulating inkjet head that circulates ink 9 between the ink tank and the inkjet head or a non-circulating inkjet head that does not circulate ink 9 can apply the present disclosure.

[0097] In addition, the series of processes described in the above-described embodiments and the like can be performed either by hardware (circuit) or by software (program). In the case of being performed by software, the software is constituted by a set of programs for causing a computer to execute respective functions. Regarding each program, for example, it can be pre-loaded into the above-described computer and used, or it can be installed into the above-described computer from a network or a recording medium and used.

[0098] Furthermore, in the above-described embodiments and the like, as a specific example of the "liquid ejection recording apparatus" in the present disclosure, the printer 5 (inkjet printer) was cited and described, but it is not limited to this example, and the present disclosure can also be applied to other apparatuses other than inkjet printers. In other words, the "liquid ejection head" (inkjet head) of the present disclosure can also be applied to other apparatuses other than inkjet printers. Specifically, for example, the "liquid ejection head" of the present disclosure can be applied to apparatuses such as facsimile machines or digital presses.

[0099] In addition, the various examples described so far can be applied in any combination.

[0100] In addition, the effects described in this specification are merely examples and are not limited effects, and there may also be other effects.

[0101] In addition, the present disclosure can also adopt the following configuration. (1) A liquid ejection head, comprising: An ejection unit having a plurality of nozzles for ejecting a liquid; A drive substrate on which one or more drive devices for outputting a drive signal for causing the above-mentioned liquid to be ejected from the above-mentioned nozzles are arranged on a first surface; A heat dissipation member arranged on the first surface side of the above-mentioned drive substrate for cooling the above-mentioned drive devices; A pressing member arranged on a second surface of the above-mentioned drive substrate opposite to the first surface for pressing the above-mentioned drive substrate against the above-mentioned heat dissipation member; and A fixing portion for fixing a part of the above-mentioned pressing member to the above-mentioned drive substrate, The arrangement region of the above-mentioned drive devices extends along a first direction in the above-mentioned first surface, The above-mentioned fixing portion is arranged in a region along a second direction orthogonal to the first direction in the above-mentioned first surface with reference to the arrangement position of the above-mentioned drive devices. (2) The liquid ejection head according to (1) above, In the arrangement region of the above-mentioned drive devices, a plurality of the above-mentioned drive devices are arranged side by side along the first direction. (3) The liquid ejection head according to (2) above, In a region along the second direction with reference to the arrangement positions of one or more of the driving devices closest to the first surface of the driving substrate among the plurality of driving devices arranged side by side along the first direction, within the first surface and with respect to the perpendicular bisector of the side along the first direction, the fixing portion is arranged. (4) The liquid ejection head described in (3) above, the number of the plurality of driving devices is odd. (5) The liquid ejection head described in any one of (1) to (4) above, within the first surface, the fixing portion is arranged in a region of the driving devices along the perpendicular bisector of the side along the first direction. (6) The liquid ejection head described in (5) above, the fixing portion is arranged within a region including the wiring of the driving signal output from the driving device in the first surface. (7) The liquid ejection head described in any one of (1) to (6) above, the fixing portion is composed of the following components: a first through hole provided on the driving substrate; a second through hole provided on the pressing member; and a fixing member respectively inserted into the first through hole and the second through hole for fixing between the driving substrate and the pressing member. (8) The liquid ejection head described in (7) above, around the first through hole, no electrical contact portion is provided between the driving substrate and the fixing member. (9) The liquid ejection head described in any one of (1) to (8) above, the driving substrate is a flexible substrate. (10) A liquid ejection recording apparatus, comprising the liquid ejection head described in any one of (1) to (9) above.

Symbol Explanation

[0102] 1... Inkjet head, 10... Connector, 11... Jetting section, 111... Actuator board, 112... Nozzle board, 12... I / F substrate, 120a, 120b, 120c, 120d... Connectors, 121... Circuit configuration area, 13, 13a, 13b, 13c, 13d, 13A, 13B... Flexible substrates, 130... Connection electrode, 131... Electrical contact portion, 14, 141, 142... Cooling unit, 2... Printing control section, 3... Ink tank, 30... Ink supply tube, 41, 411 to 415... Driving devices, 42... Pressing member, 420... Fixing area, 43... Fixing portion, 433... Crimping electrode, 5... Printer, 9... Ink, P... Recording paper, Hn... Nozzle hole, Sc... Printing control signal, Sd... Driving signal, Vd... Driving voltage, S1... Surface, S2... Back surface, A1... First area, A2... Second area, Ain... Input terminal side area, Aout... Output terminal side area, Ag12, Ag23, Ag34, Ag45... Area between devices, H11 to H15, H151, H152, H25... Through holes, F1 to F9... Screws, Wd... Driving signal wiring, Wp1, Wp2... Power supply wiring, Wg... Grounding wiring, Lt... Transmission line, Tin... Input terminal, Tout... Output terminal, TH... Through hole

Claims

1. A liquid ejection head, comprising: an ejection unit having a plurality of nozzles for ejecting liquid; a drive substrate on which one or more drive devices for outputting a drive signal for ejecting the liquid from the nozzles are disposed on a first surface; a heat dissipation member disposed on the first surface side of the drive substrate for cooling the drive devices; a pressing member disposed on a second surface side of the drive substrate opposite to the first surface for pressing the drive substrate against the heat dissipation member; and a fixing portion for fixing a part of the pressing member to the drive substrate, a configuration region of the drive devices extends along a first direction in the first surface, the fixing portion is disposed in a region in the first surface along a second direction orthogonal to the first direction with reference to a configuration position of the drive devices.

2. The liquid ejection head according to claim 1, wherein a plurality of the drive devices are disposed side by side along the first direction within the configuration region of the drive devices.

3. The liquid ejection head according to claim 2, wherein in a region along the second direction with reference to a configuration position of one or more of the drive devices closest to a perpendicular bisector of a side along the first direction in the first surface among the plurality of drive devices disposed side by side along the first direction, the fixing portion is disposed.

4. The liquid ejection head according to claim 3, wherein the number of the plurality of drive devices is odd.

5. The liquid ejection head according to claim 1, wherein in the first surface, the fixing portion is disposed in a region along a perpendicular bisector of a side along the first direction among the drive devices.

6. The liquid ejection head according to claim 5, wherein the fixing portion is disposed in the first surface within a region including a wiring of the drive signal output from the drive devices.

7. The liquid ejection head according to claim 1, wherein the fixing portion is constituted by including the following components: a first through hole provided in the drive substrate; a second through hole provided in the pressing member; and a fixing member respectively inserted into the first through hole and the second through hole for fixing between the drive substrate and the pressing member.

8. The liquid ejection head according to claim 7, wherein around the first through hole, an electrical contact portion between the drive substrate and the fixing member is not provided.

9. The liquid ejection head according to claim 1, wherein the drive substrate is a flexible substrate.

10. A liquid ejection recording apparatus, wherein the liquid ejection head according to claim 1 is provided.

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