Substrate processing apparatus

Abstract

Provided is a substrate processing apparatus capable of suppressing adhesion of generated particles to a substrate even if the particles are generated in a support part. A substrate processing apparatus according to an embodiment includes: a chamber having an outer wall portion; a transport unit provided inside the chamber and transporting the substrate in the first direction; a duct which is provided inside the chamber, faces the conveyance unit, extends in a second direction intersecting the first direction, and supplies the processing liquid; a plurality of nozzles which are provided inside the chamber and are arranged at predetermined intervals in a portion of the duct facing the conveyance unit; a bracket which extends in the second direction, holds the pipe inside the chamber, and has both ends provided outside the chamber; the supporting parts are arranged outside the cavity and are used for supporting the end parts of the two sides of the bracket respectively; and a drive unit that reciprocates the holder supported by the support unit in the second direction.

Description

Technical Field

[0001] Embodiments of the present invention relate to a substrate processing apparatus. Background Art

[0002] There is an apparatus for surface-supplying a processing liquid to a substrate used for a liquid crystal display or the like to process the substrate. For example, there is proposed an apparatus that blows a processing liquid onto the surface of a substrate conveyed by a conveying device from a plurality of nozzles to process the substrate. In such an apparatus, in order to uniformly supply the processing liquid to the surface of the substrate, while reciprocating a member provided with a plurality of nozzles in a direction intersecting the conveying direction of the substrate, the processing liquid is blown onto the surface of the substrate from the plurality of nozzles. At this time, a support portion that supports the member provided with the plurality of nozzles is provided inside a chamber in which the substrate is conveyed (for example, refer to Patent Document 1).

[0003] Here, when the member provided with the plurality of nozzles reciprocates, friction sometimes occurs between the member and the support portion, generating fine particles. In recent years, the size of substrates has been increasing, the size of the member provided with the plurality of nozzles has been increasing, and moreover, the weight of the member is increasing. When the weight of the member increases, fine particles are more likely to be generated.

[0004] As described above, the support portion that supports the member provided with the plurality of nozzles is provided inside the chamber in which the substrate is conveyed. Therefore, if fine particles are generated in the support portion, the generated fine particles may adhere to the substrate conveyed inside the same chamber. If fine particles adhere to the substrate, the processing quality may deteriorate.

[0005] Therefore, it is desired to develop a substrate processing apparatus that can suppress the generated fine particles from adhering to the substrate even if fine particles are generated in the support portion.

[0006] [Prior Art Documents]

[0007] [Patent Documents]

[0008] Patent Document 1: Japanese Utility Model Publication No. 5-22081 Summary of the Invention

[0009] [Problems to be Solved by the Invention]

[0010] The problem to be solved by the present invention is to provide a substrate processing apparatus that can suppress the generated fine particles from adhering to the substrate even if fine particles are generated in the support portion.

[0011] [Means for Solving the Problems]

[0012] The substrate processing apparatus according to the embodiment includes: a chamber having an outer wall portion; a transfer unit provided inside the chamber for transferring a substrate in a first direction; a pipe provided inside the chamber, facing the transfer unit, extending in a second direction intersecting the first direction for supplying a processing liquid; a plurality of nozzles provided inside the chamber, arranged at a predetermined interval in a portion of the pipe facing the transfer unit; a support extending in the second direction for holding the pipe inside the chamber with both end portions provided outside the chamber; a support portion provided outside the chamber for respectively supporting both end portions of the support; and a drive unit for reciprocating the support supported by the support portion in the second direction.

[0013] [Effects of the Invention]

[0014] According to an embodiment of the present invention, there is provided a substrate processing apparatus capable of suppressing the adhesion of generated fine particles to a substrate even when fine particles are generated in the support portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic plan view for illustrating the substrate processing apparatus according to the present embodiment.

[0016] Figure 2 is from Figure 1 The plan view is drawn by omitting the processing liquid supply unit and the moving unit from the drawing of the substrate processing apparatus shown.

[0017] Figure 3 is from Figure 1 The plan view is drawn by omitting the transfer unit from the drawing of the substrate processing apparatus shown.

[0018] Figure 4 is Figure 1 The sectional view taken along line A-A of the substrate processing apparatus in

[0019] Figure 5 is Figure 1 The sectional view taken along line B-B of the substrate processing apparatus in

[0020] Figure 6 is a schematic sectional view for illustrating the bottom of another embodiment.

[0021] Figure 7 is a schematic sectional view for illustrating the moving unit.

[0022] Figure 8 is a schematic view for illustrating a case where one bracket is provided with respect to a pair of beams.

[0023] Figure 9 is a schematic view for illustrating the operation of the drive unit on the support portion.

[0024] Figure 10 is Figure 7 a schematic enlarged view of part D in

[0025] Figure 11 is Figure 10 a schematic enlarged view of part E in

[0026] [Description of Symbols]

[0027] 1: Substrate processing apparatus

[0028] 2: Chamber

[0029] 3: Transfer section

[0030] 4: Processing liquid supply section

[0031] 5: Moving section

[0032] 21: Inner wall section

[0033] 22: Outer wall section

[0034] 22a: Pedestal

[0035] 22b, 54a2, 54c1, 54c2, 54c2a, 54d1a: Holes

[0036] 23, 123: Bottom

[0037] 23a: Drain outlet

[0038] 23b, 23c: Parts

[0039] 24: Top plate section

[0040] 31: Shaft

[0041] 32, 53c: Rollers

[0042] 33: Driving section

[0043] 41: Pipe

[0044] 42: Nozzle

[0045] 43: Storage tank

[0046] 43a: Top plate

[0047] 43a1: Inflow section

[0048] 43b: Bottom surface

[0049] 43b1: Discharge section

[0050] 43c, 43d: Sides

[0051] 43c1: Outflow section

[0052] 43c2, 43d3: Pipes

[0053] 43d1: Outlet

[0054] 43d2: Inlet

[0055] 44: Temperature control unit

[0056] 44a: Heating unit

[0057] 44b, 46: Pumps

[0058] 45: Detection unit

[0059] 47: Control valve

[0060] 48: Drain valve

[0061] 51: Bracket

[0062] 51a: Beam

[0063] 51b: Pipe holding part

[0064] 51c, 53b: Arms

[0065] 52: Support part

[0066] 52a: Linear movement part

[0067] 52b: Bracket

[0068] 52c: Frame

[0069] 53: Driving part

[0070] 53a: Guide

[0071] 53a1: Groove

[0072] 53d: Motor

[0073] 54: Sealing part

[0074] 54a: Container

[0075] 54a1: End plate

[0076] 54a3: Discharge hole

[0077] 54b: Catch plate

[0078] 54c: Pressurizing part

[0079] 54d: Storage part

[0080] 54d1: Body part

[0081] 54d2: Flange part

[0082] 100: Substrate

[0083] 101: Processing liquid

[0084] 123a, 123b, 123c: Regions

[0085] G: Sealing gas

[0086] X, Y, Z: Directions Detailed implementation manner

[0087] Hereinafter, the implementation manner will be illustrated while referring to the drawings. In addition, in each drawing, the same reference numerals are assigned to the same components and the detailed description is appropriately omitted.

[0088] In addition, the arrows X, arrow Y, and arrow Z in each drawing represent three mutually orthogonal directions. For example, the X direction (corresponding to an example of the first direction) can be set as the conveyance direction of the substrate.

[0089] Figure 1 is a schematic plan view for illustrating the substrate processing apparatus 1 of the present implementation manner.

[0090] Figure 2 is from Figure 1 The plan view of the substrate processing apparatus 1 shown is drawn by omitting the processing liquid supply unit 4 and the moving unit 5.

[0091] Figure 3 is from Figure 1 The plan view of the substrate processing apparatus 1 shown is drawn by omitting the conveyance unit 3.

[0092] In addition, Figure 2 and Figure 3 are reference drawings for facilitating the understanding of the structure of the substrate processing apparatus 1.

[0093] Figure 4 is Figure 1 The sectional view taken along the line A - A of the substrate processing apparatus 1 in

[0094] Figure 5 is Figure 1 The sectional view taken along the line B - B of the substrate processing apparatus 1 in

[0095] As Figures 1 to 5 shown, the substrate processing apparatus 1 includes, for example, a chamber 2, a conveyance unit 3, a processing liquid supply unit 4, and a moving unit 5.

[0096] As Figure 1 and Figure 5 shown, the chamber 2 includes, for example, an inner wall portion 21, an outer wall portion 22, a bottom portion 23, and a top plate portion 24.

[0097] The inner wall portion 21 is in a flat plate shape and extends in the X direction. A pair of inner wall portions 21 are arranged at a prescribed interval in the Y direction.

[0098] The outer wall portion 22 is in a flat plate shape and extends in the X direction. In the Y direction, the outer wall portion 22 is provided on the outer side of each of the pair of inner wall portions 21. The outer wall portion 22 and the inner wall portion 21 are arranged at a prescribed interval in the Y direction.

[0099] As Figure 5 shown, the bottom portion 23 is provided between the inner wall portions 21 and below the transfer portion 3. That is, the bottom portion 23 is provided inside the chamber 2 and on the side opposite to the pipe 41 side in the processing liquid supply portion 4 of the transfer portion 3. The bottom portion 23 is provided so as to cover the lower region of the transfer portion 3. The bottom portion 23 blocks the processing liquid 101 that is supplied to the upper surface of the substrate 100 from the plurality of nozzles 42 of the processing liquid supply portion 4 and discharged from the upper surface of the substrate 100.

[0100] The central portion of the bottom portion 23 in the Y direction is located farther from the transfer portion 3 than the peripheral portion of the bottom portion 23. The bottom portion 23 is inclined in a direction away from the transfer portion 3 as it approaches the central portion in the Y direction. A discharge port 23a is provided in the central portion of the bottom portion 23. If so, the processing liquid 101 discharged from the upper surface of the substrate 100 and blocked by the bottom portion 23 can be collected in the central portion of the bottom portion 23 and discharged from the discharge port 23a. Therefore, the recovery efficiency of the processing liquid 101 can be improved.

[0101] Here, in recent years, the substrate 100 to be processed has been increasing in size. Therefore, the size of the bottom portion 23 in the Y direction has a tendency to increase. If the size of the bottom portion 23 in the Y direction increases, it becomes difficult to install the bottom portion 23 in the space between the inner wall portions 21 or to disassemble the bottom portion 23 from the space between the inner wall portions 21.

[0102] Therefore, as Figure 5 shown, in the Y direction, the bottom portion 23 can be divided into a portion 23b and a portion 23c. For example, the end portion of the portion 23c in the Y direction on the portion 23b side can be bent toward the transfer portion 3 side so that the end portion near the portion 23b side of the portion 23b rests on the bent end portion of the portion 23c. If the bottom portion 23 is divided in the Y direction, even if the size of the bottom portion 23 increases, the installation and disassembly of the bottom portion 23 become easy.

[0103] Figure 6 is a schematic cross-sectional view for exemplifying the bottom portion 123 of another embodiment.

[0104] As Figure 6As shown, the bottom 123 has a region 123a, a region 123b, and a region 123c. Additionally, the number of regions is not limited to three. The number of regions can be set to two or more. In the Y direction, the regions 123a, 123b, and 123c are arranged.

[0105] In the regions 123a, 123b, and 123c, discharge ports 23a are respectively provided. In the region 123a, the discharge port 23a is provided on the central side of the region 123a in the Y direction. Similar to the case of the aforementioned bottom 23, the central side of the region 123a in the Y direction is located farther from the conveying unit 3 than the peripheral portion of the region 123a. The region 123a is inclined in a direction away from the conveying unit 3 as it faces the central side in the Y direction.

[0106] In the region 123b, the discharge port 23a is provided on the central side of the region 123b in the Y direction. The central side of the region 123b in the Y direction is located farther from the conveying unit 3 than the peripheral portion of the region 123b. The region 123b is inclined in a direction away from the conveying unit 3 as it faces the central side in the Y direction.

[0107] In the region 123c, the discharge port 23a is provided on the central side of the region 123c in the Y direction. The central side of the region 123c in the Y direction is located farther from the conveying unit 3 than the peripheral portion of the region 123c. The region 123c is inclined in a direction away from the conveying unit 3 as it faces the central side in the Y direction.

[0108] Therefore, the processing liquid 101 blocked by the regions 123a, 123b, and 123c respectively converges to their respective central sides and is discharged from the discharge ports 23a provided on their respective central sides.

[0109] At this time, as Figure 6 shown, in the Y direction, the sizes of the regions 123a, 123b, and 123c are each smaller than the size of the aforementioned bottom 23. Therefore, the inclination angle in each of the regions 123a, 123b, and 123c can be larger than the inclination angle of the bottom 23. If the inclination angle becomes larger, in each of the regions 123a, 123b, and 123c, the blocked processing liquid 101 can be efficiently collected and discharged from the discharge port 23a. Therefore, the recovery efficiency of the processing liquid 101 can be further improved.

[0110] Moreover, if the inclination angles in the regions 123a, 123b, and 123c are set to be the same as the inclination angle of the aforementioned bottom 23, the sizes of the regions 123a, 123b, and 123c in the Z direction can be made smaller than the size of the bottom 23. That is, the thinning of the bottom 123 can be achieved.

[0111] On the other hand, if the dimensions of regions 123a, 123b, and 123c in the Z direction are each set to be the same as the dimension of the aforementioned bottom 23, the inclination angles of regions 123a, 123b, and 123c can be made greater than the inclination angle of the bottom 23. That is, the efficiency of the discharge of the processing liquid can be achieved.

[0112] As Figure 5 shown, the top plate portion 24 is plate-shaped and covers the end portion of the chamber 2 on the side opposite to the bottom 23 side.

[0113] As Figure 1 , Figure 2 , Figure 4 and Figure 5 shown, the transfer unit 3 is provided inside the chamber 2 and transfers the substrate 100 in the X direction. The transfer unit 3 is provided between the nozzle 42 of the processing liquid supply unit 4 and the bottom 23 of the chamber 2.

[0114] The transfer unit 3 has, for example, a shaft 31, rollers 32, and a drive unit 33.

[0115] The shaft 31 is columnar and extends in one direction. The shaft 31 extends, for example, in the Y direction. The axial dimension of the shaft 31 can be appropriately changed according to the dimension of the substrate 100 in the Y direction, for example. A plurality of shafts 31 are provided. The plurality of shafts 31 can be arranged at a predetermined interval in the X direction. The number and interval of the plurality of shafts 31 can be appropriately changed according to the dimension of the substrate 100 in the X direction. The shaft 31 can be, for example, a shaft in which the surface of a core material containing metal or carbon, etc. is coated with a resin (such as Polyvinyl Chloride (PVC), Polyfluoroalkoxy (PFA), Polyvinylidene Fluoride (PVDF)).

[0116] The rollers 32 are cylindrical, and a plurality of rollers 32 can be provided relative to one shaft 31. The plurality of rollers 32 are arranged at a predetermined interval in the Y direction. The number and interval of the plurality of rollers 32 can be appropriately changed according to the dimension of the substrate 100 in the Y direction.

[0117] The drive unit 33 can be provided, for example, in the space between the inner wall portion 21 and the outer wall portion 22 of the chamber 2. The drive unit 33 extends, for example, in the X direction. One end side of each of the plurality of shafts 31 in the Y direction is connected to the drive unit 33. The drive unit 33 rotates the plurality of shafts 31 in the same direction. By rotating the plurality of shafts 31 in the same direction, the plurality of rollers 32 rotate in the same direction, and furthermore, the substrate 100 placed on the plurality of rollers 32 is conveyed in the X direction. The drive unit 33 can also start the conveyance of the substrate 100, stop the conveyance, change the conveyance direction, change the conveyance speed, etc. The drive unit 33 can include, for example, a motor and an inverter, or include a control motor such as a servo motor.

[0118] The processing liquid supply unit 4 supplies the processing liquid 101 onto the upper surface of the substrate 100, recovers the processing liquid 101 discharged from the upper surface of the substrate 100 and blocked by the bottom portion 23, and supplies the recovered processing liquid 101 again onto the upper surface of the substrate 100. That is, the processing liquid supply unit 4 circulates and reuses the processing liquid 101 supplied onto the upper surface of the substrate 100.

[0119] Here, the processing liquid 101 can be a liquid medicine for treating the surface of the substrate 100 used for liquid crystal displays, etc. The processing liquid 101 can be, for example, an aqueous solution of hydrogen fluoride (also called hydrofluoric acid, fluoric acid, etc.). The concentration of hydrogen fluoride in the aqueous solution of hydrogen fluoride is, for example, 5% or less.

[0120] Since such a processing liquid 101 is used, the components in the chamber 2, the conveyance unit 3, the processing liquid supply unit 4, and the moving unit 5 that come into contact with the processing liquid 101 and the components that may come into contact with the processing liquid 101 are formed of materials having resistance to the processing liquid 101. For example, when the processing liquid 101 is an aqueous solution of hydrogen fluoride, these components can be formed of resins such as PVC, PFA, and PVDF. Or, these components can also be formed of materials in which the surface of a metal, etc. is coated with the aforementioned resin, etc.

[0121] As Figure 1 、 Figure 3 、 Figure 4 And Figure 5 As shown, the processing liquid supply unit 4 has, for example, a pipe 41, a nozzle 42, a storage tank 43, a temperature control unit 44, a detection unit 45, a pump 46, a control valve 47, and a discharge valve 48. The pipe 41 and the nozzle 42 are provided inside the chamber 2. The storage tank 43, the temperature control unit 44, the detection unit 45, the pump 46, the control valve 47, and the discharge valve 48 can be provided, for example, outside the chamber 2.

[0122] The pipe 41 is cylindrical and faces the conveying unit 3. The pipe 41 extends in a direction intersecting the X direction (an example of the second direction). The direction intersecting the X direction is, for example, a direction orthogonal to the X direction (Y direction) or a direction inclined with respect to the X direction (a direction deviated from the Y direction). Further, in Figure 1 and Figure 3 , the case of the direction orthogonal to the X direction (Y direction) is exemplified. The axial dimension of the pipe 41 can be appropriately changed, for example, according to the dimension of the substrate 100 in the Y direction. A plurality of pipes 41 can be provided. The plurality of pipes 41 are arranged at a prescribed interval, for example, along the X direction. The number and interval of the plurality of pipes 41 can be appropriately changed, for example, according to the dimension of the substrate 100 in the X direction. For example, one end portion of the pipe 41 can be closed. In the internal space of the pipe 41, the processing liquid 101 is supplied, for example, from the other end portion side of the pipe 41.

[0123] A plurality of nozzles 42 can be provided with respect to one pipe 41. The plurality of nozzles 42 can be provided at a portion of the pipe 41 facing the conveying unit 3. The plurality of nozzles 42 are arranged at a prescribed interval along the extending direction of the pipe 41. The number and interval of the plurality of nozzles 42 can be appropriately changed according to the dimension of the substrate 100 in the Y direction. For example, the nozzles 42 spray the processing liquid 101 in a mist form toward the upper surface of the substrate 100. The nozzles 42 can be, for example, conical nozzles, fan-shaped nozzles, etc. Further, Figure 4 and Figure 5 , the nozzle 42 exemplified in

[0124] is a conical nozzle.

[0125] The discharge section 43b1 is a cylindrical pipe, which is bent at a right angle directly below the connection portion with the storage tank 43. The bending direction is, for example, the direction of the other end portion of the chamber 2 (the left direction in the figure). Further, the discharge section 43b1 is provided in such a manner that the edge on the other end portion side of the chamber 2 at the connection port of the discharge section 43b1 with the storage tank 43 coincides with the inner wall of the side surface 43d on the inflow section 43a1 side of the storage tank 43. Alternatively, the discharge section 43b1 may be provided in such a manner that the upper end side of the horizontal portion after being bent at a right angle in the portion bent at a right angle is connected to the lower end portion of the side surface 43d of the storage tank 43, and the remaining vertically oriented portion is connected to the bottom surface 43b of the storage tank 43.

[0126] On the side surface 43c of the storage tank 43 on the side opposite to the side where the discharge port 23a is provided, an outflow section 43c1 may be provided. The outflow section 43c1 is connected, for example, via a pipe 43c2 or the like to the end portion on the side opposite to the closed side of the pipe 41.

[0127] The temperature control section 44 controls the temperature of the processing liquid 101 stored inside the storage tank 43 within a specified range. The temperature control section 44 may be provided, for example, on the side surface 43d of the storage tank 43 on the side where the discharge port 23a is provided.

[0128] The temperature control section 44 includes, for example, a heating section 44a and a pump 44b. The heating section 44a and the pump 44b are provided outside the storage tank 43. The heating section 44a and the pump 44b are connected via a pipe 43d3 or the like between the outflow port 43d1 and the inflow port 43d2 provided on the side surface 43d of the storage tank 43.

[0129] The pump 44b causes the processing liquid 101 stored inside the storage tank 43 to flow from the outflow port 43d1 toward the inflow port 43d2.

[0130] The heating section 44a heats the processing liquid 101 flowing from the outflow port 43d1 toward the inflow port 43d2. For example, the heating section 44a performs heating based on a signal from an unillustrated temperature sensor provided inside the storage tank 43 so that the temperature of the processing liquid 101 stored inside the storage tank 43 is within a specified range.

[0131] The detection section 45 detects the state of the processing liquid 101 stored inside the storage tank 43. The detection section 45 detects, for example, the concentration of hydrogen fluoride contained in an aqueous solution of hydrogen fluoride or the concentration of contaminants generated by processing the upper surface of the substrate 100. The detection section 45 may be configured as a conductivity meter or the like, for example.

[0132] The detection unit 45 is provided, for example, inside the storage tank 43. The detection unit 45 can be provided, for example, on the bottom surface 43b of the storage tank 43. At this time, if the detection unit 45 is provided near the heating unit 44a, the detection value from the detection unit 45 may be affected by the noise from the heating unit 44a. Therefore, it is preferable that the distance between the detection unit 45 and the heating unit 44a is long. For example, as Figure 5 shown, the detection unit 45 can be provided on the opposite side of the temperature control unit 44 with the central portion of the storage tank 43 interposed therebetween. For example, the detection unit 45 can be provided near the side surface 43c of the storage tank 43 facing the side surface 43d where the heating unit 44a is provided.

[0133] The pump 46 is connected between the outflow portion 43c1 of the storage tank 43 and the end portion on the side opposite to the closed side of the pipe 41. The pump 46 supplies the processing liquid 101 stored inside the storage tank 43 to the internal space of the pipe 41. The processing liquid 101 supplied to the internal space of the pipe 41 is supplied from the nozzle 42 to the upper surface of the substrate 100.

[0134] The control valve 47 is connected, for example, between the outflow portion 43c1 of the storage tank 43 and the pump 46. The control valve 47 controls at least either the flow rate or the pressure of the processing liquid 101 supplied to the internal space of the pipe 41, for example, by the pump 46.

[0135] The discharge valve 48 is connected, for example, to the discharge portion 43b1 of the storage tank 43. The discharge valve 48 can be set as an on-off valve or the like, for example. For example, when the concentration of the contaminants contained in the processing liquid 101 detected by the detection unit 45 exceeds a specified value, maintenance for replacing the processing liquid 101 can be performed. For example, the discharge valve 48 can be opened to discharge the processing liquid 101 stored inside the storage tank 43. When the processing liquid 101 stored inside the storage tank 43 has been discharged, the discharge valve 48 can be closed and new processing liquid 101 can be supplied to the inside of the storage tank 43.

[0136] Here, as Figure 4 and Figure 5 shown, the amount of the processing liquid 101 supplied to the region directly below between the nozzles 42 on the upper surface of the substrate 100 is less than the amount of the processing liquid 101 supplied to the region directly below the nozzle 42 on the upper surface of the substrate 100.

[0137] At this time, as Figure 4 shown, the substrate 100 is conveyed in the X direction by the conveying unit 3. Therefore, the processing liquid 101 is supplied to the entire region of the upper surface of the substrate 100 in the X direction.

[0138] However, if the substrate 100 is only conveyed in the X direction by the conveying unit 3, there will be areas with a large amount and areas with a small amount of the processing liquid 101 on the upper surface of the substrate 100 in the Y direction. That is, on the upper surface of the substrate 100, the amount of the processing liquid 101 may be uneven, resulting in a decrease in processing quality.

[0139] Therefore, the moving unit 5 is provided in the substrate processing apparatus 1 of the present embodiment.

[0140] As Figure 5 shown, the moving unit 5 reciprocates the pipe 41 in a direction intersecting the X direction. The reciprocating distance can be set, for example, to about half of the distance between the nozzles 42 in the direction in which the pipe 41 extends.

[0141] Figure 7 is a schematic cross-sectional view for exemplifying the moving unit 5. In addition, Figure 7 is Figure 3 the cross-sectional view taken along the C-C line of the moving unit 5 in

[0142] As Figure 7 shown, the moving unit 5 has, for example, a bracket 51, a support portion 52, a drive portion 53, and a seal portion 54.

[0143] The bracket 51 extends in the direction in which the pipe 41 extends and holds the pipe 41 inside the chamber 2. The end portions on both sides of the bracket 51 are provided outside the chamber 2.

[0144] The bracket 51 has, for example, a beam 51a, a pipe holding portion 51b, and an arm 51c.

[0145] The beam 51a extends in the direction in which the pipe 41 extends. At least one beam 51a can be provided with respect to a plurality of pipes 41. For example, as Figure 3 shown, a pair of beams 51a can be provided with respect to a plurality of pipes 41.

[0146] A plurality of pipe holding portions 51b are provided at the end portion of the beam 51a on the side of the conveying unit 3. The plurality of pipe holding portions 51b are arranged in a row in the direction in which the beam 51a extends. In the plurality of pipe holding portions 51b, holes penetrating in the direction in which the beam 51a extends are provided, and the pipe 41 is installed inside the holes.

[0147] A pair of arms 51c can be provided with respect to one beam 51a. The pair of arms 51c are respectively provided at the end portions on both sides of the beam 51a. The arm 51c is, for example, columnar and extends in the direction in which the beam 51a extends.

[0148] The beam 51a and the pipe holding part 51b are provided inside the chamber 2 (inside the inner wall part 21). Near the end of the arm 51c on the side of the beam 51a, it is provided inside the chamber 2 (inside the inner wall part 21). Near the end of the arm 51c on the side opposite to the beam 51a side, it is provided outside the chamber 2 (outside the outer wall part 22). The central part of the arm 51c is provided inside the sealing part 54.

[0149] The support part 52 is provided outside the chamber 2 (outside the outer wall part 22). The support part 52 supports the ends (arms 51c) on both sides of the bracket 51 respectively. A pair of support parts 52 can be provided relative to at least one beam 51a.

[0150] Moreover, the support part 52 supports the pipe 41 via the bracket 51 and can change the position of the pipe 41 (nozzle 42) in the direction crossing the X direction.

[0151] The support part 52 has, for example, a linear movement part 52a, a bracket 52b, and a frame body 52c.

[0152] The linear movement part 52a can be a bearing capable of linearly advancing in the direction crossing the X direction (the orthogonal direction (Y direction) in this embodiment). The linear movement part 52a can be provided, for example, on a pedestal 22a provided on the outer wall part 22 of the chamber 2.

[0153] The bracket 52b is provided on the linear movement part 52a. As Figure 3 shown, in the case where a pair of beams 51a are provided for a plurality of pipes 41, one bracket 52b can be provided relative to the pair of beams 51a.

[0154] Figure 8 is a schematic diagram for exemplifying the case where one bracket 52b is provided relative to a pair of beams 51a.

[0155] As Figure 8 shown, in the case where one bracket 52b is provided relative to a pair of beams 51a, a pair of linear movement parts 52a are provided relative to one bracket 52b. If a pair of linear movement parts 52a are provided for one bracket 52b, when the position of the bracket 52b is moved by a drive part 53 described later, it is possible to suppress the inclination of the bracket 52b and the deterioration of the operation of the linear movement part 52a.

[0156] The frame body 52c is box-shaped and can be provided, for example, on a pedestal 22a provided on the outer wall part 22 of the chamber 2. Inside the inner space of the frame body 52c, the linear movement part 52a and the bracket 52b can be provided.

[0157] As Figure 7 shown, the drive part 53 can be provided on one of the pair of support parts 52.

[0158] The driving unit 53 causes the bracket 51 supported by the supporting unit 52 to reciprocate in a direction intersecting the X direction.

[0159] Figure 9 It is a schematic diagram for illustrating the operation of the driving unit 53 on the supporting unit 52.

[0160] As Figures 7 to 9 shown, the driving unit 53 has, for example, a guide 53a, an arm 53b, a roller 53c, and a motor 53d.

[0161] The guide 53a can be provided at the end of the bracket 52b on the side opposite to the linear movement unit 52a. At the end of the guide 53a on the side opposite to the bracket 52b, a groove 53a1 extending in a direction orthogonal to the direction in which the beam 51a extends is provided.

[0162] The arm 53b is plate-shaped and extends in one direction.

[0163] The roller 53c is provided near one end of the arm 53b and on the surface of the arm 53b on the side of the guide 53a.

[0164] The motor 53d is provided, for example, on the outer surface of the housing 52c. The shaft of the motor 53d is connected inside the housing 52c near the other end of the arm 53b.

[0165] That is, the guide 53a, the arm 53b, and the roller 53c constitute a crank mechanism. Therefore, the rotational motion in the motor 53d can be converted into a linear reciprocating motion.

[0166] If the rotational motion in the motor 53d can be converted into a linear reciprocating motion, then the bracket 52b of the supporting unit 52 can be reciprocated as Figure 9 shown. As Figure 7 shown, in the bracket 52b, a pipe 41 having a plurality of nozzles 42 is provided via the bracket 51. Therefore, by the reciprocating movement of the bracket 52b, the position of the pipe 41 and even the positions of the plurality of nozzles 42 can be reciprocated.

[0167] Therefore, by the movement of the substrate 100 in the X direction by means of the conveying unit 3 and the movement of the plurality of nozzles 42 in a direction intersecting the X direction by means of the driving unit 53, a treatment liquid 101 of the same amount can be supplied to the entire area of the upper surface of the substrate 100. Therefore, it is possible to suppress the following phenomenon, that is, on the upper surface of the substrate 100, the amount of the treatment liquid 101 is uneven, resulting in a decrease in the treatment quality.

[0168] Moreover, as Figure 7As shown, the support portion 52 is provided outside the chamber 2 (outside the outer wall portion 22). Here, when the linear movement portion 52a operates, fine particles may sometimes be generated. Even if the linear movement portion 52a is a rolling bearing, sliding cannot be eliminated, so the generation of fine particles cannot be completely eliminated. At this time, if the generated fine particles adhere to the substrate 100, the processing quality of the substrate 100 may deteriorate.

[0169] In the substrate processing apparatus 1 of the present embodiment, since the support portion 52 is provided outside the chamber 2 (outside the outer wall portion 22), compared with the case where the support portion 52 is provided inside the chamber 2 (inside the inner wall portion 21), the intrusion of the generated fine particles into the inside of the chamber 2 (inside the inner wall portion 21) can be suppressed. Therefore, the adhesion of the generated fine particles to the substrate 100 can be suppressed, and thus the processing quality of the substrate 100 can be improved.

[0170] Here, as described above, the processing liquid 101 is a liquid medicine such as an aqueous solution of hydrogen fluoride. Therefore, it is preferable to prevent a part of the processing liquid 101 sprayed onto the upper surface of the substrate 100 from leaking to the outside of the chamber 2 (outside the outer wall portion 22). Moreover, as described above, when the linear movement portion 52a operates, fine particles may sometimes be generated. Therefore, it is preferable to prevent the generated fine particles from entering the inside of the chamber 2 (inside the inner wall portion 21).

[0171] Therefore, a sealing portion 54 is provided in the substrate processing apparatus 1 of the present embodiment. Figure 10 is Figure 7 a schematic enlarged view of part D in.

[0172] Figure 11 is Figure 10 a schematic enlarged view of part E in.

[0173] As Figure 7 shown, the arm 51c of the reciprocating support 51 extends between the inside of the inner wall portion 21 and the outside of the outer wall portion 22 of the chamber 2. At this time, if the arm 51c comes into contact with at least one of the inner wall portion 21 and the outer wall portion 22 of the chamber 2, fine particles will be generated when the arm 51c reciprocates. Therefore, a gap is provided between the arm 51c and the inner wall portion 21 and the outer wall portion 22 of the chamber 2. However, if a gap is provided, leakage of the aforementioned processing liquid 101 or intrusion of fine particles is likely to occur.

[0174] Therefore, as Figure 7 shown, the sealing portion 54 is provided in the region of the chamber 2 through which the arm 51c of the support 51 passes. One sealing portion 54 can be provided for one arm 51c.

[0175] As Figure 7 shown, the sealing portion 54 has, for example, a container 54a, a capture plate 54b, a pressurizing portion 54c, and a storage portion 54d.

[0176] The container 54a is provided between the inner wall portion 21 and the outer wall portion 22 of the chamber 2 and is penetrated by the support 51 (arm 51c). The container 54a is cylindrical and end plates 54a1 are provided at both ends.

[0177] As Figure 10 shown, holes 54a2 penetrating in the thickness direction are provided in the end plates 54a1. A minute gap is provided between the inner wall of the hole 54a2 and the arm 51c. Therefore, it is possible to suppress the following phenomenon, that is, when the arm 51c reciprocates, the inner wall of the hole 54a2 and the arm 51c rub against each other to generate fine particles. However, if a gap is provided, the mist-like processing liquid 101 may invade the inside of the container 54a through the gap.

[0178] Therefore, as Figure 7 shown, a capture plate 54b is provided on the portion of the arm 51c located inside the container 54a. The capture plate 54b is provided inside the container 54a and is penetrated by the support 51 (arm 51c). The mist-like processing liquid 101 invading the inside of the container 54a is captured by the capture plate 54b and drips into the inside of the container 54a. The processing liquid 101 dripping into the inside of the container 54a is discharged to the inside of the chamber 2 (between the inner wall portion 21 and the outer wall portion 22) through a discharge hole 54a3 provided on the lower side surface of the container 54a.

[0179] As Figure 7 and Figure 10 shown, a pressure boosting portion 54c is provided on the outer wall portion 22 of the chamber 2. The pressure boosting portion 54c blocks a hole 22b in the outer wall portion 22 where the container 54a is provided. As Figure 10 shown, a hole 54c1 through which the arm 51c passes is provided in the pressure boosting portion 54c. A minute gap is provided between the inner wall of the hole 54c1 and the arm 51c. Therefore, it is possible to suppress the following phenomenon, that is, when the arm 51c reciprocates, the inner wall of the hole 54c1 and the arm 51c rub against each other to generate fine particles.

[0180] However, if a gap is provided, the fine particles generated during the operation of the linear movement portion 52a may invade the inside of the chamber 2 (inside the inner wall portion 21) through the gap and the internal space of the container 54a. Moreover, the mist-like processing liquid 101 located inside the container 54a may also leak to the outside through the gap.

[0181] Therefore, as Figure 10 shown, for a hole 54c2 provided above the pressure boosting portion 54c, a sealing gas G is supplied through a pipe. The sealing gas G can be set as, for example, dry air or the like.

[0182] As Figure 11As shown, the sealing gas G supplied through the hole 54c2 of the pressurizing section 54c and the hole 54d1a of the storage section 54d (to be described later) to the gap between the pressurizing section 54c and the arm 51c flows along the arm 51c toward the inside of the chamber 2 and the outside of the pressurizing section 54c. Therefore, intrusion of the processing liquid 101 from the inside of the chamber 2 or intrusion of fine particles from the outside of the pressurizing section 54c can be suppressed.

[0183] In addition, as Figure 10 shown, the sealing gas G supplied from the hole 54c2 provided on the upper side of the pressurizing section 54c is discharged from the hole 54c2a provided on the lower side of the pressurizing section 54c.

[0184] Moreover, preferably, the pressure in the gap between the portion of the pressurizing section 54c through which the support 51 (arm 51c) is inserted and the support 51 (arm 51c) is slightly higher than the pressure of the environment where the substrate processing apparatus 1 is installed (e.g., atmospheric pressure).

[0185] If so, as Figure 11 shown, the flow of the sealing gas G toward the inside of the chamber 2 and the flow of the sealing gas G toward the outside of the pressurizing section 54c can be more reliably formed, and thus intrusion of the processing liquid 101 and fine particles can be more reliably suppressed. In addition, the ambient pressure is not limited to the pressure of the environment where the substrate processing apparatus 1 is installed. For example, it may be set to the pressure of the environment in the chamber 2 where the substrate 100 is processed. In short, as long as it is the ambient pressure outside the pressurizing section 54c and the pressure in the gap between the portion of the pressurizing section 54c through which the support 51 (arm 51c) is inserted and the support 51 (arm 51c) is set to be higher than this pressure.

[0186] Moreover, as Figure 10 and Figure 11 shown, a storage section 54d can be provided in the pressurizing section 54c. The storage section 54d is, for example, embedded in the inner wall of the hole 54c1 of the pressurizing section 54c.

[0187] The storage section 54d has, for example, a main body section 54d1 and a flange section 54d2.

[0188] The main body section 54d1 is cylindrical. The flange section 54d2 is annular and is provided at both end portions of the main body section 54d1 in the direction in which the arm 51c extends, respectively.

[0189] As Figure 11As shown, the gap between the inner wall of the cylindrical main body portion 54d1 and the arm 51c can be set, for example, to be the same as the gap between the inner wall of the hole 54c1 of the pressure increasing portion 54c and the arm 51c. The gap between the inner wall of the annular flange portion 54d2 and the arm 51c can be smaller than the gap between the inner wall of the cylindrical main body portion 54d1 and the arm 51c, for example. At this time, the inner wall of the flange portion 54d2 and the arm 51c are likely to come into contact. Therefore, regarding the material of the flange portion 54d2, it is preferably formed of a material with less generation of fine particles due to friction, high tolerance to the processing liquid 101, and self-lubricity. The flange portion 54d2 can be formed of, for example, a fluororesin or the like.

[0190] Moreover, in the main body portion 54d1, a plurality of holes 54d1a penetrating between the inner wall and the outer wall can be provided. The holes 54d1a communicate with the holes 54c2 of the pressure increasing portion 54c. Therefore, the sealing gas G supplied to the holes 54c2 of the pressure increasing portion 54c is supplied to the space surrounded by the main body portion 54d1, the flange portion 54d2, and the arm 51c via the holes 54d1a, and then flows toward the inside of the chamber 2 and the outside of the pressure increasing portion 54c. Therefore, the flow of the sealing gas G can be stabilized.

[0191] The embodiments have been illustrated above. However, the present invention is not limited to these descriptions.

[0192] Embodiments in which those skilled in the art have appropriately made design changes to the foregoing embodiments are also included in the scope of the present invention as long as they have the features of the present invention.

[0193] Moreover, the elements included in the foregoing embodiments can be combined as much as possible, and the content obtained by combining them is also included in the scope of the present invention as long as it has the features of the present invention.

Claims

1. A substrate processing apparatus, comprising: A chamber having an outer wall portion; A transfer unit provided inside the chamber for transferring a substrate in a first direction; A pipe provided inside the chamber, facing the transfer unit, extending in a second direction intersecting the first direction for supplying a processing liquid; A plurality of nozzles provided inside the chamber, arranged at a prescribed interval in a portion of the pipe facing the transfer unit; A bracket extending in the second direction, holding the pipe inside the chamber, and having both end portions provided outside the chamber; A support portion provided outside the chamber for respectively supporting both end portions of the bracket; and A drive unit for reciprocally moving the bracket supported by the support portion in the second direction.

2. The substrate processing apparatus according to claim 1, further comprising: A pressure boosting portion provided in the outer wall portion of the chamber and through which the bracket is inserted, The pressure boosting portion makes the pressure in a gap between a portion of the pressure boosting portion through which the bracket is inserted and the bracket higher than the ambient pressure.

3. The substrate processing apparatus according to claim 1 or 2, further comprising: A container provided between the inner wall portion and the outer wall portion of the chamber and through which the bracket is inserted; And A capture plate provided inside the container and through which the bracket is inserted, The mist-like processing liquid invading the inside of the container is captured by the capture plate and drips into the inside of the container.

4. The substrate processing apparatus according to claim 1 or 2, further comprising: A bottom provided inside the chamber on a side of the transfer unit opposite to the pipe side for blocking the processing liquid supplied from the plurality of nozzles toward the substrate; A storage tank for storing the processing liquid blocked by the bottom; And A pump for supplying the processing liquid stored in the storage tank to the pipe.

5. The substrate processing apparatus according to claim 4, further comprising: A detection portion provided inside the storage tank for detecting the state of the processing liquid stored in the storage tank; And A temperature control portion for controlling the temperature of the processing liquid stored in the storage tank, The detection portion is provided on a side opposite to the temperature control portion with the central portion of the storage tank interposed therebetween.

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