Electronic device

Abstract

The invention discloses an electronic device. The electronic device includes a first field type, a second field type adjacent to the first field type, and a third field type disposed between the first field type and the second field type. The electronic device further comprises a first feed-in element and a second feed-in element. The first feed element is spaced apart from the first field pattern and the third field pattern, and is configured to electrically couple the first field pattern and the third field pattern to form a first antenna. The second feed element is configured to electrically couple the second field pattern and the third field pattern to form a second antenna.

Description

Technical Field

[0001] The present disclosure generally relates to an electronic device. Background Art

[0002] Existing antenna-in-package (AiP) antennas, such as patch antennas, have a certain antenna gain, which can be further enhanced in an array design to support millimeter (mm) wave and / or sub-terahertz (sub-THz) communication systems. However, the bandwidth of the patch antenna is limited. Using a patch antenna for multi-band communication requires an increase in package size and related costs, which may limit its applicability for miniaturization. Summary of the Invention

[0003] In some arrangements, an electronic device includes a first field type, a second field type adjacent to the first field type, and a third field type disposed between the first field type and the second field type. The electronic device further includes a first feeding element and a second feeding element. The first feeding element is spaced apart from the first field type and the third field type and is configured to electrically couple the first field type and the third field type to form a first antenna. The second feeding element is configured to electrically couple the second field type and the third field type to form a second antenna.

[0004] In some arrangements, an electronic device includes a first field type connected to a ground element, a second field type adjacent to the first field type, and a third field type adjacent to the first field type. The first field type and the second field type are configured to form a first antenna. The first field type and the third field type are configured to form a second antenna. The first antenna and the second antenna are configured to form a beamforming antenna structure.

[0005] In some arrangements, an electronic device includes a first magnetoelectric (ME) dipole antenna having a conductive field type, and a second magnetoelectric (ME) dipole antenna. The conductive field type is configured to act as part of the second ME dipole antenna. Brief Description of the Drawings

[0006] Aspects of some arrangements of the present disclosure are best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that the various structures may not be drawn to scale, and the dimensions of the various structures may be arbitrarily increased or decreased for clarity of discussion.

[0007] Figure 1A Is a perspective view of an electronic device according to an arrangement of the present disclosure.

[0008] Figure 1B Is a top view of an electronic device according to an arrangement of the present disclosure.

[0009] Figure 1C Is a cross-section of an electronic device according to an arrangement of the present disclosure.

[0010] Figure 1C 'Cross-section of an electronic device according to the arrangement of the present disclosure.

[0011] Figure 1D Cross-section of an electronic device according to the arrangement of the present disclosure.

[0012] Figure 1D 'Cross-section of an electronic device according to the arrangement of the present disclosure.

[0013] Figure 1E Cross-section of an electronic device according to the arrangement of the present disclosure.

[0014] Figure 1F Shows the current distribution of an electronic device according to the arrangement of the present disclosure.

[0015] Figure 1G Top view of an electronic device according to the arrangement of the present disclosure.

[0016] Figure 1H Top view of an electronic device according to the arrangement of the present disclosure.

[0017] Figure 1I Top view of an electronic device according to the arrangement of the present disclosure.

[0018] Figure 2A Top view of an electronic device according to the arrangement of the present disclosure.

[0019] Figure 2B Top view of an electronic device according to the arrangement of the present disclosure.

[0020] Figure 2C Top view of an electronic device according to the arrangement of the present disclosure.

[0021] Figure 2D Perspective view of an electronic device according to the arrangement of the present disclosure.

[0022] Figure 3A Top view of an electronic device according to the arrangement of the present disclosure.

[0023] Figure 3B Top view of an electronic device according to the arrangement of the present disclosure.

[0024] Figure 3C Top view of an electronic device according to the arrangement of the present disclosure.

[0025] Figure 3D Top view of an electronic device according to the arrangement of the present disclosure.

[0026] Figure 4A Simulated antenna gain field pattern of an electronic device according to the arrangement of the present disclosure.

[0027] Figure 4B An analog plot of the antenna gain (in dB) of an electronic device arranged according to the present disclosure relative to frequency. Detailed implementation

[0028] Common element symbols are used throughout the figures and the embodiments to indicate the same or similar components. The arrangement of the present disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying figures.

[0029] The following disclosure provides many different arrangements or examples for implementing the different features of the provided subject matter. Specific examples of components and arrangements are described below to explain certain aspects of the present disclosure. Of course, these components and arrangements are only examples and are not intended to be limiting. For example, in the following description, the formation of a first feature above or on a second feature may include an arrangement where the first feature and the second feature are formed or disposed in direct contact, and may also include an arrangement where additional features may be formed or disposed between the first feature and the second feature such that the first feature and the second feature are not in direct contact. Additionally, the present disclosure may repeat element symbols and / or letters in various examples. This repetition is for simplicity and clarity purposes and does not itself prescribe the relationship between the various arrangements and / or configurations discussed.

[0030] Figure 1A A perspective view of an electronic device 1a arranged according to the present disclosure. In some arrangements, the electronic device 1a may be or include, for example, an antenna device or an antenna package. In some arrangements, the electronic device 1a may be or include, for example, a wireless device, such as a user equipment (UE), a mobile station, a mobile device, a device communicating with the Internet of Things (IoT), etc. In some arrangements, the electronic device 1a may be or include a portable device.

[0031] The electronic device 1a may include a ground plane 10g, field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6, feed elements 10f1 and 10f2, and vias 10v1, 10v2, and 10v3.

[0032] The field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6 can also be referred to as conductive elements, antenna elements, or radiation elements. The field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6 can be configured to radiate and / or receive electromagnetic (EM) waves / signals, such as radio waves, microwaves, infrared waves, X-rays, gamma rays, etc. The field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6 can be configured to operate at any desired frequency (frequency band and / or bandwidth) to support fifth-generation (5G) communication, ultra-5G communication, and / or 6G communication. For example, the field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6 can be configured to operate in a microwave frequency band, a sub-6 GHz frequency band, a 5 GHz frequency band, a terahertz (THz) frequency band, etc.

[0033] The field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6 can each be electrically coupled to a ground plane 10g via vias 10v1. The vias 10v1 can intersect the field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6 perpendicularly. As used herein, the term "coupled" is used to describe two circuits that are close enough to permit mutual influence, inductive coupling, energy coupling, etc.

[0034] Although eight vias 10v1 are connected to each of the field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6, the number of vias 10v1 is not limited thereto. In some arrangements, any number of vias 10v1 can be present, depending on the design requirements.

[0035] By electrically coupling the field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6 to the ground plane 10g (which can be referred to as a grounding element), interference between the feeding elements 10f1 and 10f2 can be reduced, which can help improve the antenna performance of the electronic device 1a. Additionally, the ground plane 10g can reflect the EM waves emitted by the field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6, which helps improve the radiation efficiency and directivity of the electronic device 1a. In some arrangements, the ground plane 10g can help improve impedance matching by providing a ground potential or a reference point for radiation and reducing mismatch losses.

[0036] The field patterns 10p1, 10p2, 10p4, and 10p5, as well as the feeding elements 10f1, can be part of the antenna 14. The field patterns 10p1, 10p2, 10p4, and 10p5, as well as the feeding elements 10f1, can be jointly configured to form or constitute the antenna 14. The antenna 14 can include a magneto-electric (ME) dipole antenna.

[0037] For example, the field patterns 10p1, 10p2, 10p4, and 10p5 can be the electric dipoles of the antenna 14. The via hole 10v1 connecting the field patterns 10p1, 10p2, 10p4, and 10p5 can be the magnetic dipole of the antenna 14. The electric dipole and the magnetic dipole of the ME dipole antenna work together to radiate EM waves and facilitate communication. This configuration makes the ME dipole antenna suitable for a wide range of applications, including wireless communication, radar, and sensing systems.

[0038] The field patterns 10p1, 10p2, 10p4, and 10p5 can include or be arranged in a 2×2 array. The feeding element 10f1 can be disposed at the center of the field patterns 10p1, 10p2, 10p4, and 10p5. The field patterns 10p1, 10p2, 10p4, and 10p5 can be symmetrically arranged around the feeding element 10f1. The field patterns 10p1, 10p2, 10p4, and 10p5 can be evenly spaced from the feeding element 10f1. The feeding element 10f1 can be disposed between the field patterns 10p1 and 10p2 and between the field patterns 10p4 and 10p5.

[0039] The feeding element 10f1 can be electrically coupled to an electronic component (such as Figure 1C the electronic component 12) via the via hole 10v2. The via hole 10v2 can intersect the feeding element 10f1 perpendicularly, and the midpoint of the intersection is the feeding point. The via hole 10v2 can be disposed in the opening 10gh of the ground plane 10g. The via hole 10v2 can be spaced from the ground plane 10g. The field patterns 10p1, 10p2, 10p4, and 10p5 may be capable of being excited by the feeding element 10f1.

[0040] The field patterns 10p2, 10p3, 10p5, and 10p6 and the feeding element 10f2 can be part of the antenna 15. The field patterns 10p2, 10p3, 10p5, and 10p6 and the feeding element 10f2 can be jointly configured to form or constitute the antenna 15. The antenna 15 can include an ME dipole antenna.

[0041] For example, the field patterns 10p2, 10p3, 10p5, and 10p6 can be the electric dipoles of the antenna 15. The via hole 10v1 connecting the field patterns 10p2, 10p3, 10p5, and 10p6 can be the magnetic dipole of the antenna 15.

[0042] The field patterns 10p2, 10p3, 10p5, and 10p6 can include or be arranged in a 2×2 array. The feeding element 10f2 can be disposed at the center of the field patterns 10p2, 10p3, 10p5, and 10p6. The field patterns 10p2, 10p3, 10p5, and 10p6 can be symmetrically arranged around the feeding element 10f2. 10p2, 10p3, 10p5, and 10p6 can be evenly spaced from the feeding element 10f2. The feeding element 10f2 can be disposed between the field patterns 10p2 and 10p3 and between the field patterns 10p5 and 10p6.

[0043] The feeding element 10f2 can be electrically coupled to an electronic component (such as Figure 1C the electronic component 12 in). The via 10v3 can intersect the feeding element 10f2 perpendicularly, and the midpoint of the intersection is the feeding point. The via 10v3 can be disposed in the opening 10gh of the ground plane 10g. The via 10v3 can be spaced apart from the ground plane 10g. The field patterns 10p2, 10p3, 10p5, and 10p6 may be capable of being excited by the feeding element 10f2.

[0044] The antenna 14 and the antenna 15 can include a common field pattern. The antenna 14 and the antenna 15 can share a common field pattern. For example, the field pattern 10p2 and the field pattern 10p5 can be the common field patterns of the antenna 14 and the antenna 15. For example, the field pattern 10p2 and the field pattern 10p5 can be shared by the antenna 14 and the antenna 15. For example, the field pattern 10p2 and the field pattern 10p5 can both be part of the antenna 14 and the antenna 15. For example, both the field pattern 10p2 and the field pattern 10p5 may be capable of being excited by the feeding element 10f1. For example, both the field pattern 10p2 and the field pattern 10p5 may be capable of being excited by the feeding element 10f2.

[0045] The antenna 14 and the antenna 15 can have the same or similar structures. In some arrangements, the distance or spacing between the feeding elements 10f1 and 10f2 can be a fraction of the wavelength of the operating frequency, such as from 0.2λ to 0.3λ. In some arrangements, the distance or spacing between the feeding elements 10f1 and 10f2 can be less than half of the wavelength of the operating frequency. As stated, by electrically coupling the field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6 to the ground plane 10g, the interference between the feeding elements 10f1 and 10f2 can be reduced.

[0046] In some arrangements, the ground plane 10g, the multiple field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6, the feeding elements 10f1 and 10f2, and the vias 10v1, 10v2, and 10v3 can each include a conductive material, such as a metal or a metal alloy. Examples of the conductive material can include but are not limited to gold (Au), silver (Ag), copper (Cu), platinum (Pt), palladium (Pd), other metals or alloys, or combinations thereof.

[0047] In some arrangements, antenna 14 and antenna 15 can form a beamforming antenna structure. Antenna 14 and antenna 15 can generate focused and directional EM beams. For example, antenna 14 and antenna 15 can generate constructive interference in a desired direction by adjusting their phases and amplitudes. In some arrangements, antenna 14 and antenna 15 can generate constructive interference in the far field region. In some arrangements, antenna 14 and antenna 15 can have far-field interference. In the case of far-field interference, the EM waves have traveled a significant distance from their source, and their wavefronts become nearly flat. Therefore, the interference field pattern formed in the far field region can be relatively stable and predictable.

[0048] Figure 1B Top view of the electronic device 1a according to an arrangement of the present disclosure.

[0049] Some or all of the field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6 can have the same or similar shapes. Some or all of the field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6 can be geometrically similar. Some or all of the field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6 can be circular, rectangular, oval, semi-circular, pentagonal, hexagonal, heptagonal, octagonal, etc. The feeding element 10f1 can have a first portion adjacent to one side (or lateral side) of the field pattern 10p1, and a second portion connected to and extending from the first portion beyond the lateral side of the field pattern 10p1. The second portion can also extend beyond the lateral side of the field pattern 10p4. For example, the feeding element 10f1 can extend between the field patterns 10p1 and 10p4.

[0050] The vias 10v1 can be arranged along the lateral sides, outer surfaces, edges, or boundaries of each of the field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6. The vias 10v1 can be arranged along three sides of each of the field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6. However, in some arrangements, the vias 10v1 can be arranged along one side, two sides, or four sides of each of the field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6.

[0051] The via hole 10v2 is disposed adjacent to one side or one end of the feeding element 10f1. For example, the via hole 10v2 is adjacent to one of the side and one end of the feeding element 10f1. In some arrangements, the via hole 10v2 is disposed at the center of the feeding element 10f1. The via hole 10v3 is disposed adjacent to one side or one end of the feeding element 10f2. For example, the via hole 10v3 is adjacent to one of the side and one end of the feeding element 10f2. In some arrangements, the via hole 10v3 is disposed at the center of the feeding element 10f2. For example, the feeding element 10f1 may have a portion extending beyond the lateral side of the field pattern 10p1, and the via hole 10v2 may be connected to the portion. For example, the feeding element 10f1 may have a portion extending beyond the lateral side of the field pattern 10p4, and the via hole 10v2 may be connected to the portion.

[0052] Figure 1C is a cross-section of the electronic device 1a according to an arrangement of the present disclosure. In some arrangements, Figure 1C may be the cross-section of the line AA' passing through Figure 1B . Figure 1C ' is a cross-section of the electronic device 1a according to an arrangement of the present disclosure. In some arrangements, Figure 1C ' may be the cross-section of the line AA' passing through Figure 1B .

[0053] The electronic device 1a may further include a radiation structure 10, a circuit structure 11, an electronic component 12, and an encapsulation 13.

[0054] The radiation structure 10 may be capable of operating at multiple frequencies (frequency bands and / or bandwidths). For example, the radiation structure 10 may be configured to operate at relatively high frequencies (relatively high frequency bands and / or bandwidths) and relatively low frequencies (relatively low frequency bands and / or bandwidths). For example, the radiation structure 10 may be configured to radiate and / or receive EM waves having relatively high frequencies and EM waves having relatively low frequencies. In some arrangements, the radiation structure 10 may be capable of radiating and / or receiving EM waves having relatively high frequencies and EM waves having relatively low frequencies in parallel.

[0055] The radiation structure 10 may include a surface 101, a surface 102 opposite to the surface 101, and lateral surfaces (or side walls) 103, 104 extending between the surfaces 101 and 102. The surface 101 and / or the surface 102 of the radiation structure 10 may be parallel to the xy plane. The radiation structure 10 may include an antenna layer ( Figure 1A and Figure 1BThe field patterns 10p1, 10p2, 10p3, 10p4, 10p5 and 10p6, and the feeding elements 10f1 and 10f2 in [[ ]] are located in the antenna layer), the ground plane 10g, the dielectric layers 10d1, 10d2, and the vias 10v1, 10v2 and 10v3. In some arrangements, as Figure 1C shown in [[ ]], the dielectric layer 10d2 may comprise a multi-layer structure having a number of layers 10d21, 10d22 and 10d23.

[0056] The antenna layer may be adjacent to the surface 102 of the radiation structure 10. Although there is one antenna layer in Figure 1C , the number of antenna layers is not limited thereto. In some arrangements, depending on the design requirements, any number of antenna layers may be present.

[0057] The antenna layer may be partially or completely within (or covered by) the dielectric layer 10d1. In some arrangements, the upper surfaces (not labeled in the figure) of the field patterns 10p1, 10p2, 10p3 may be exposed by the dielectric layer 10d1 and exposed on the surface 102 of the radiation structure 10.

[0058] The ground plane 10g may be adjacent to the surface 101 of the radiation structure 10. The ground plane 10g may be disposed below the antenna layer ( Figure 1A and Figure 1B the field patterns 10p1, 10p2, 10p3, 10p4, 10p5 and 10p6, and the feeding elements 10f1 and 10f2 in [[ ]] are located in the antenna layer). Although there is one ground plane in Figure 1C , the number of ground planes is not limited thereto. In some arrangements, depending on the design requirements, any number of ground planes may be present. The ground plane 10g may be partially or completely within (or covered by) the dielectric layer 10d2.

[0059] The ground plane 10g and the antenna layer may at least partially overlap each other in a direction generally perpendicular to the surface 101 and / or surface 102 of the radiation structure 10. For example, the vertical projection of the field pattern 10p1 may be within the boundary of the ground plane 10g. For example, the vertical projection of the field pattern 10p2 may be within the boundary of the ground plane 10g. For example, the vertical projection of the field pattern 10p3 may be within the boundary of the ground plane 10g.

[0060] The vias 10v1, 10v2 and 10v3 may be electrically coupled between the antenna layer and the ground plane 10g. Although there are three vias stacked above the ground plane 10g in Figure 1C , the number of stacked vias is not limited thereto. In some arrangements, depending on the design requirements, any number of stacked vias may be present.

[0061] The feeding elements 10f1 and 10f2 can be at the same horizontal level as the field patterns 10p1, 10p2, and 10p3. For example, the feeding elements 10f1 and 10f2 can be at the same height as the field patterns 10p1, 10p2, and 10p3 relative to the surface 111 of the circuit structure 11. For example, the feeding elements 10f1 and 10f2 can be at the same height as the field patterns 10p1, 10p2, and 10p3 relative to the ground plane 10g. The feeding element 10f1 may not overlap perpendicularly with the field patterns 10p1 and 10p2. The feeding element 10f1 may not overlap with the field patterns 10p1 and 10p2 in a direction generally perpendicular to the surface 111 of the circuit structure 11. The feeding element 10f2 may not overlap perpendicularly with the field patterns 10p2 and 10p3. The feeding element 10f2 may not overlap with the field patterns 10p2 and 10p3 in a direction generally perpendicular to the surface 111 of the circuit structure 11.

[0062] The vias 10v1, 10v2, and 10v3 can be covered, encapsulated, or surrounded by the dielectric layer 10d2. In some arrangements, the dielectric layers 10d1 and 10d2 can include pre-impregnated composite fibers (e.g., prepregs), ceramic-filled polytetrafluoroethylene (PTFE) composites, borophosphosilicate glass (BPSG), silicon oxide, silicon nitride, silicon oxynitride, undoped silicate glass (USG), any combination thereof, or the like. Examples of prepregs can include, but are not limited to, multilayer structures formed by stacking or laminating multiple pre-impregnated materials / sheets. In some arrangements, the dielectric layers 10d1 and 10d2 can include the same material as the encapsulant 13.

[0063] The circuit structure 11 can be disposed adjacent to the surface 101 of the radiation structure 10. The circuit structure 11 can be disposed above or on the surface 101 of the radiation structure 10. The circuit structure 11 can be disposed below the radiation structure 10. The circuit structure 11 can contact (e.g., directly contact) the ground plane 10g of the radiation structure 10. The ground plane 10g can be disposed between the circuit structure 11 and the antenna layer (in which the field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6 as well as the feeding elements 10f1 and 10f2 are located). The ground plane 10g can be configured to mitigate electromagnetic interference (EMI) on the circuit structure 11.

[0064] In some arrangements, the circuit structure 11 may be or include, for example, a substrate. In some arrangements, the circuit structure 11 may include, for example, a printed circuit board (PCB), such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated fiberglass-based copper foil laminate. In some arrangements, the circuit structure 11 may include a dielectric layer 11d, which may include the dielectric materials described above with respect to dielectric layers 10d1 and 10d2. In some arrangements, as Figure 1C shown in ', the dielectric layer 11d may include a multilayer structure having a number of layers 11d1, 11d2, and 11d3.

[0065] In some arrangements, the circuit structure 11 may include conductive pads, traces, vias, layers, other conductive elements, or other interconnects. For example, the circuit structure 11 may include one or more transmit lines or communication cables. For example, the circuit structure 11 may include one or more conductive pads 11p that are close to, adjacent to, or embedded in the surface 111 of the circuit structure 11 and are exposed by the surface.

[0066] For example, the circuit structure 11 may include one or more vias 11v. In some arrangements, the vias 11v may be disposed above or on the surface 111 and electrically couple the conductive pads 11p on the surface 111. The vias 11v may be covered by the dielectric material of the circuit structure 11. Some of the vias 11v may be electrically coupled to the feed elements 10f1 and 10f2. Some of the vias 11v may be electrically coupled to the ground plane 10g. In some arrangements, the vias 11v may provide a feed signal to the ME dipole antennas of the radiating structure 10 (such as Figure 1A the antennas 14 and 15 in ).

[0067] The electronic component 12 may be disposed above or on the surface 111 of the circuit structure 11. The electronic component 12 may be electrically connected to one or more other electrical components (if any) and electrically connected to the circuit structure 11 (e.g., electrically connected to the interconnect), and the electrical connection may be achieved by flip chip, wire bonding technology, metal-to-metal bonding (such as Cu-to-CU bonding), or hybrid bonding. In some arrangements, the electronic component 12 may be electrically connected to the circuit structure 11 via one or more conductive elements (or electrical contacts) 12e. In some arrangements, the conductive element 12e may include controlled collapse chip connection (C4) bumps, ball grid arrays (BGA), or land grid arrays (LGA).

[0068] The electronic component 12 can be a chip or die, including a semiconductor substrate, one or more integrated circuit (IC) devices, and one or more overlying interconnect structures therein. The IC devices can include active devices such as transistors and / or passive devices such as resistors, capacitors, inductors, or combinations thereof. For example, the electronic component 12 can include a system-on-chip (SoC). For example, the electronic component 12 can include a radio frequency integrated circuit (RFIC), an application specific IC (ASIC), a central processing unit (CPU), a microprocessor unit (MPU), a graphics processing unit (GPU), a microcontroller unit (MCU), a field programmable gate array (FPGA), or another type of IC.

[0069] In some arrangements, the electronic component 12 can be an RF signal generator or transmitter. In some arrangements, the electronic component 12 can be configured to generate EM waves that are fed into the ME dipole antenna in the radiation structure 10, which in turn radiates the signal into the surrounding space. The electronic component 12 can be configured to adjust the frequency, amplitude, and other parameters of the fed signal to optimize the performance of the ME dipole antenna. Although there is one electronic component in Figure 1C , the number of electronic components is not limited thereto. In some arrangements, depending on the design requirements, any number of electronic components can be present.

[0070] The encapsulant 13 can be disposed above or on the surface 111 of the circuit structure 11 to cover the electronic component 12. The encapsulant 13 can include an insulating or dielectric material. In some arrangements, the encapsulant 13 can include an epoxy resin with fillers, a packaging material (e.g., an epoxy resin packaging material or another packaging material), polyimide, a phenolic compound or material, a material in which polysiloxane is dispersed, or combinations thereof. In some arrangements, the dielectric layer 10d2 can include an epoxy resin with fillers, a packaging material (e.g., an epoxy resin packaging material or another packaging material), polyimide, a phenolic compound or material, a material in which polysiloxane is dispersed, or combinations thereof. In some arrangements, the dielectric constant (Dk value) of the dielectric layer 10d2 can be different from the Dk value of the encapsulant 13. For example, the Dk value of the dielectric layer 10d2 can be greater than the Dk value of the encapsulant 13. For example, the Dk value of the dielectric layer 10d2 can be less than the Dk value of the encapsulant 13.

[0071] Figure 1D is a cross-section of the electronic device 1d according to an arrangement of the present disclosure. Figure 1D ' is a cross-section of the electronic device 1d according to an arrangement of the present disclosure. The electronic device 1d is similar to Figure 1C the electronic device 1a in

[0072] The feeding elements 10f1 and 10f2 can be located at different horizontal levels relative to the field patterns 10p1, 10p2, and 10p3. For example, the feeding elements 10f1 and 10f2 can be located at a height lower than the field patterns 10p1, 10p2, and 10p3 relative to the surface 111 of the circuit structure 11. For example, the feeding elements 10f1 and 10f2 can be located at a height lower than the field patterns 10p1, 10p2, and 10p3 relative to the ground plane 10g. For example, the feeding elements 10f1 and 10f2 can be vertically separated from the field patterns 10p1, 10p2, and 10p3.

[0073] By vertically separating the feeding elements 10f1 and 10f2 from the field patterns 10p1, 10p2, and 10p3, a more compact design is provided, which can help reduce the overall size of the electronic device 1d. Additionally, vertically separating the feeding elements 10f1 and 10f2 from the field patterns 10p1, 10p2, and 10p3 can also help reduce the mutual coupling between elements and improve the isolation between elements, which can result in preferred overall antenna performance. In some arrangements, the feeding elements 10f1 and 10f2 can be disposed at different heights relative to the surface 111 (or the ground plane 10g) of the circuit structure 11. For example, the feeding element 10f1 can be located at a height lower than the feeding element 10f2 relative to the surface 111 (or the ground plane 10g) of the circuit structure 11.

[0074] Figure 1E Is a cross-section of an electronic device 1e for an arrangement according to the present disclosure. The electronic device 1e is similar to Figure 1C the electronic device 1a therein, and has the following differences therebetween.

[0075] The vias 10v1, 10v2, and 10v3 can be replaced by conductive wires 10w1, 10w2, and 10w3. In some arrangements, the vias 10v1, 10v2, and 10v3 can be replaced by other conductive elements. The conductive elements can include, for example, conductive posts, conductive pastes, conductive fillers, solder materials, or other suitable elements. The conductive elements can be selected based on factors of the EM wave, which can include resonant frequency, impedance, admittance (the reciprocal of impedance), phase, wavelength, etc. The conductive wires 10w1, 10w2, and 10w3 can include vertical bonding wires or vertical conductive wires. In some arrangements, the dielectric layer 10d2 can include an epoxy resin with fillers, a packaging material (e.g., an epoxy resin packaging material or another packaging material), polyimide, phenolic compounds or materials, a material in which polysiloxane is dispersed, or a combination thereof.

[0076] Figure 1F Shows the current distribution of the electronic device 1a for an arrangement according to the present disclosure.

[0077] The all-black vector t1 represents a magnetic field between 240A / m (amperes / meter) and 300A / m, the striped vector t2 represents a magnetic field between 120A / m and 210A / m, and the all-white vector t3 represents a magnetic field between 0A / m and 90A / m. In order to reduce interference between the feeding elements 10f1 and 10f2, the field patterns 10p1, 10p2, 10p3, 10p4, 10p5 and 10p6 are electrically coupled to the ground plane 10g. It is shown that the current on the feeding elements 10f1 and 10f2 generally flows up and down, so that the current intensity is larger upward and downward, and the lateral interference (left and right directions, i.e., between the feeding elements 10f1 and 10f2) is reduced. In some arrangements, the interference between the field patterns 10p1 and 10p3 can be reduced. In some arrangements, the interference between the field patterns 10p4 and 10p6 can be reduced. In some arrangements, interference between antennas 14 and 15 may be reduced. This results in a more efficient and more effective radiation pattern of the antenna (eg, ME dipole antenna) of the electronic device 1a, because the electric and magnetic fields work together to propagate electromagnetic waves.

[0078] According to some arrangements of the present disclosure, the utilization of a common antenna panel design allows an increase in antenna gain while maintaining a smaller antenna array size than a conventional ME dipole antenna array. This meets the demand for miniaturization. Figure 4B The simulation data in shows that the common antenna panel design (with a 1×4 array, such as Figure 2A ) achieves a 3.8 dB gain increase compared to a single ME dipole. Figure 4A The simulated antenna gain pattern shows that the common antenna panel design (with a 1×4 array, such as Figure 2A helps increase the antenna's directivity and coverage area.

[0079] Furthermore, connecting the common antenna board to the ground plane reduces interference between the feed lines. This results in improved signal quality and reliability without requiring an increase in package size.

[0080] In addition, the common board design provides the flexibility to adjust the impedance according to different frequency and bandwidth requirements. This enhances design flexibility without increasing the overall area.

[0081] Figure 1G , Figure 1H and Figure 1I FIG. 2 shows a top view of another exemplary arrangement of the guide holes 10v1 according to the present disclosure. Figure 1G In FIG. 1 , the vias 10v1 of the field patterns 10p1, 10p3, 10p4, and 10p6 are positioned along the sides of the corners of the field patterns 10p1, 10p3, 10p4, and 10p6.

[0082] exist Figure 1HIn , the vias 10v1 of field patterns 10p1, 10p3, 10p4, and 10p6 are positioned in a T shape, where a vertical line intersects a horizontal line. In Figure 1H In , the vias 10v1 of field patterns 10p2 and 10p5 are positioned in an H configuration, where two vertical lines intersect a horizontal line. In some arrangements, the H configuration may reduce interference between field patterns 10p1 and 10p3.

[0083] In Figure 1I In , the vias 10v1 of field patterns 10p1, 10p2, 10p3, 10p4, 10p5, and 10p6 are positioned in an H configuration, where two vertical lines intersect a horizontal line.

[0084] Figure 2A is a top view of an electronic device 2a according to an arrangement of the present disclosure. The electronic device 2a is similar to Figure 1B the electronic device 1a in , and has the following differences therebetween.

[0085] The electronic device 2a further includes field patterns 10p7, 10p8, 10p9, 10p10, feeding elements 10f3, 10f4, and vias 10v4, 10v5.

[0086] Field patterns 10p3, 10p7, 10p6, and 10p9 and feeding element 10f3 may be part of an antenna 16. Field patterns 10p3, 10p7, 10p6, and 10p9 and feeding element 10f3 may be configured together to form an antenna 16. The antenna 16 may include a ME dipole antenna.

[0087] Field patterns 10p7, 10p8, 10p9, and 10p10 and feeding element 10f4 may be part of an antenna 17. Field patterns 10p7, 10p8, 10p9, and 10p10 and feeding element 10f4 may be configured together to form an antenna 17. The antenna 17 may include a ME dipole antenna. In some arrangements, antennas 14, 15, 16, and 17 may form a beamforming antenna structure.

[0088] Antennas 14, 15, 16, and 17 can be arranged along the x-axis. Feeding elements 10f1, 10f2, 10f3, and 10f4 can be arranged along the y-axis, and the y-axis can be generally perpendicular to the x-axis. For example, feeding elements 10f1, 10f2, 10f3, and 10f4 can each have a longer side and a shorter side, with the longer side arranged along the y-axis. For example, feeding elements 10f1, 10f2, 10f3, and 10f4 can each have a longer side and a shorter side, with the shorter side arranged along the x-axis. Field patterns 10p1, 10p2, 10p3, 10p7, and 10p8 are arranged along the x-axis. Field patterns 10p4, 10p5, 10p6, 10p9, and 10p10 are arranged along the x-axis. Feeding elements 10f1, 10f2, 10f3, and 10f4 can each overlap with field patterns 10p1 to 10p10 along the x-axis.

[0089] Antennas 15 and 16 can include a common field pattern. Antennas 15 and 16 can share a common field pattern. For example, field patterns 10p3 and 10p6 can be the common field patterns of antennas 15 and 16. For example, field patterns 10p3 and 10p6 can be shared by antennas 15 and 16. For example, both field patterns 10p3 and 10p6 can be part of antenna 15 and part of antenna 16. For example, both field patterns 10p3 and 10p6 may be able to be excited by feeding element 10f2. For example, both field patterns 10p3 and 10p6 may be able to be excited by feeding element 10f3.

[0090] Antennas 16 and 17 can include a common field pattern. Antennas 16 and 17 can share a common field pattern. For example, field patterns 10p7 and 10p9 can be the common field patterns of antennas 16 and 17. For example, field patterns 10p7 and 10p9 can be shared by antennas 16 and 17. For example, both field patterns 10p7 and 10p9 can be part of antenna 16 and part of antenna 17. For example, both field patterns 10p7 and 10p9 may be able to be excited by feeding element 10f3. For example, both field patterns 10p7 and 10p9 may be able to be excited by feeding element 10f4.

[0091] Figure 2B It is a top view of an electronic device 2b of the arrangement according to the present disclosure. The electronic device 2b is similar to Figure 2A the electronic device 2a therein, except that feeding elements 10f5, 10f6, 10f7, and 10f8 can be arranged along the x-axis.

[0092] For example, antennas 14, 15, 16, and 17 may be arranged along the x-axis. Feeding elements 10f5, 10f6, 10f7, and 10f8 may be arranged in the same direction. For example, feeding elements 10f5, 10f6, 10f7, and 10f8 may each have a longer side and a shorter side, where the longer side is arranged along the x-axis. For example, feeding elements 10f5, 10f6, 10f7, and 10f8 may each have a longer side and a shorter side, where the shorter side is arranged along the y-axis.

[0093] The shape and orientation of the feeding element may be selected based on factors of the EM wave, which may include resonant frequency, impedance, admittance (the reciprocal of impedance), phase, wavelength, etc.

[0094] Figure 2C is a top view of the electronic device 2c according to the arrangement of the present disclosure. The electronic device 2c is Figure 2A the electronic device 2a in Figure 2B and the combination of the electronic device 2b in

[0095] Using more feeding elements may cause a more uniform distribution of the EM field, which can improve the antenna performance. In addition, the number of feeding lines can also affect the impedance matching of the ME dipole antenna. By adjusting the number of feeding elements, it is possible to optimize the impedance matching of the ME dipole antenna, which can improve its efficiency and performance.

[0096] Figure 2C The antennas 14, 15, 16, and 17 in

[0097] Figure 2D may include dual-polarized antennas. In a dual-polarized antenna, the electric field may be oriented in two perpendicular directions (such as horizontal and vertical). Antennas 14, 15, 16, and 17 may simultaneously transmit and receive EM waves in two different directions (or in two orthogonal polarizations). This allows for an increase in signal quality and efficiency in a more compact design. Figure 2CPerspective view of the electronic device 2c. The feeding elements 10f1 and 10f5 can be located at different horizontal levels relative to the ground plane 10g. The feeding elements 10f1 and 10f5 can at least partially overlap vertically. The feeding elements 10f1 and 10f5 can be substantially orthogonal to each other. The feeding elements 10f2 and 10f6 can be located at different horizontal levels relative to the ground plane 10g. The feeding elements 10f2 and 10f6 can at least partially overlap vertically. The feeding elements 10f2 and 10f6 can be substantially orthogonal to each other. The feeding elements 10f3 and 10f7 can be located at different horizontal levels relative to the ground plane 10g. The feeding elements 10f3 and 10f7 can at least partially overlap vertically. The feeding elements 10f3 and 10f7 can be substantially orthogonal to each other. The feeding elements 10f4 and 10f8 can be located at different horizontal levels relative to the ground plane 10g. The feeding elements 10f4 and 10f8 can at least partially overlap vertically. The feeding elements 10f4 and 10f8 can be substantially orthogonal to each other.

[0098] Figure 3A , Figure 3B , Figure 3C and Figure 3D show a top view of an electronic device including a field pattern arranged in a 3×3 array according to an arrangement of the present disclosure.

[0099] In Figure 3A the electronic device 3a, the feeding elements 30f1 and the four field patterns surrounding the feeding element 30f1 can be part of an antenna or can be configured together to form an antenna, such as a ME dipole antenna. The feeding elements 30f2 and the four field patterns surrounding the feeding element 30f2 can be part of an antenna or can be configured together to form an antenna, such as a ME dipole antenna. The feeding elements 30f3 and the four field patterns surrounding the feeding element 30f3 can be part of an antenna or can be configured together to form an antenna, such as a ME dipole antenna. The feeding elements 30f4 and the four field patterns surrounding the feeding element 30f4 can be part of an antenna or can be configured together to form an antenna, such as a ME dipole antenna. In some arrangements, Figure 3A the antenna can form a beamforming antenna structure.

[0100] The vias of the field patterns 30p1, 30p2, and 30p3 can be located along the four sides of the field patterns 30p1, 30p2, and 30p3. The field patterns 30p1 and 30p3 can be a common field pattern for two antennas. The field pattern 30p2 at the center can be a common field pattern for four antennas. The feeding elements 30f1, 30f2, 30f3, and 30f4 can be arranged along the y-axis.

[0101] In Figure 3B the electronic device 3b, the feeding elements 30f5, 30f6, 30f7, and 30f8 can be arranged along the x-axis.

[0102] In Figure 3C the electronic device 3c, Figure 3A the feeding elements 30f1, 30f2, 30f3, and 30f4 in Figure 3B and the feeding elements 30f5, 30f6, 30f7, and 30f8 in Figure 3C can be combined. The antenna in

[0103] In Figure 3D the electronic device 3d, Figure 3A the feeding elements 30f1 and 30f4 in Figure 3B and the feeding elements 30f6 and 30f7 in

[0104] Unless otherwise specified, spatial descriptions such as "above", "below", "upper", "left", "right", "lower", "top", "bottom", "vertical", "horizontal", "side", "higher than", "lower than", "upper part", "upper surface", "lower surface", etc. are indicated relative to the orientation shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and the embodiments of the structures described herein can be spatially arranged in any orientation or manner, provided that the advantages of the embodiments of the present disclosure are not deviated due to such arrangements.

[0105] As used herein, the terms "approximately", "substantially", "substantively", "about", and "circa" are used to describe and account for minor variations. When used in connection with an event or circumstance, these terms can refer to instances where the event or circumstance occurs precisely as well as instances where the event or circumstance occurs very nearly. For example, when used in connection with a numerical value, these terms can refer to a range of variation that is less than or equal to ±10% of the stated value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a first numerical value is within a range of variation that is less than or equal to ±10% of a second numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, then the first numerical value can be considered to be "substantially" the same as or equal to the second numerical value. For example, "substantially" vertical can refer to an angular range of variation that is less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1%, or less than or equal to ±0.05°.

[0106] If the displacement amount between two surfaces is not greater than 5 μm, not greater than 2 μm, not greater than 1 μm, or not greater than 0.5 μm, then the two surfaces can be considered to be coplanar or substantially coplanar. If the displacement amount between the highest point and the lowest point of a surface does not exceed 5 μm, does not exceed 2 μm, does not exceed 1 μm, or does not exceed 0.5 μm, then the surface can be considered to be substantially flat.

[0107] As used herein, unless the context clearly indicates otherwise, the singular forms "a / an" and "the" can include plural referents.

[0108] As used herein, the terms "conductive", "electrically conductive", and "conductivity" refer to the ability to conduct an electric current. A conductive material is a material that presents little or no resistance to the flow of an electric current. One unit of measure for conductivity is Siemens per meter (S / m). Generally, a conductive material has a conductivity greater than about 10 4 S / m, such as at least 10 5 S / m or at least 10 6 S / m for a material. The conductivity of a material sometimes varies with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0109] In addition, quantities, ratios, and other numerical values are sometimes presented herein in a range format. It should be understood that such range formats are used for convenience and brevity and should be interpreted flexibly as including not only the explicitly specified values as the limits of the range, but also all individual values or sub-ranges subsumed within that range as if each value and sub-range were explicitly specified.

[0110] Although the present disclosure has been described and illustrated with reference to specific embodiments thereof, such description and illustration are not restrictive. Those skilled in the art will understand that various changes can be made and equivalents can be substituted without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The drawings may not necessarily be drawn to scale. Due to manufacturing processes and tolerances, there may be differences between the process reproductions and the actual devices in the present disclosure. There may be other embodiments not specifically described in the present disclosure. The specification and the drawings should be regarded as illustrative rather than restrictive. Modifications can be made to adapt a particular situation, material, composition of matter, method, or process to the objectives, spirit, and scope of the present disclosure. All such modifications are considered to be included within the scope of the appended claims. Although the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations can be combined, sub-divided, or re-ordered without departing from the teachings of the present disclosure to form equivalent methods. Thus, unless specifically indicated herein, the order and grouping of the operations are not limitations of the present disclosure.

Claims

1. An electronic device, comprising: A first field type; A second field type adjacent to the first field type; And A third field type disposed between the first field type and the second field type, A first feeding element spaced apart from the first field type and the third field type and configured to electrically couple the first field type and the third field type to form a first antenna; And A second feeding element configured to electrically couple the second field type and the third field type to form a second antenna.

2. The electronic device according to claim 1, wherein the first antenna and the second antenna are configured to form a beamforming antenna structure.

3. The electronic device according to claim 1, wherein the first feeding element is disposed between the first field type and the third field type.

4. The electronic device according to claim 1, wherein the first feeding element is disposed at a different height from the third field type and the first field type.

5. The electronic device according to claim 1, wherein the first feeding element does not vertically overlap with the third field type and the first field type.

6. The electronic device according to claim 1, wherein the third field type and the first field type are geometrically similar.

7. The electronic device according to claim 1, further comprising: A fourth field type; And A fifth field type adjacent to the fourth field type; Wherein the first feeding element is spaced apart from the fourth field type and the fifth field type and configured to electrically couple the fourth field type and the fifth field type to form the first antenna having the first field type and the third field type.

8. The electronic device according to claim 7, wherein the first field type and the third field type are arranged along a direction, and the first feeding element overlaps with the first field type, the third field type, the fourth field type, and the fifth field type in the direction.

9. The electronic device according to claim 1, wherein the distance between the first feeding element and the second feeding element is less than half of the wavelength of the operating frequency of the first antenna or less than half of the wavelength of the operating frequency of the second antenna.

10. The electronic device according to claim 1, further comprising: A third feeding element spaced apart from the first field type and configured to electrically couple the first field type and the third field type to form the first antenna.

11. The electronic device according to claim 10, wherein the first feeding element and the third feeding element at least partially vertically overlap.

12. The electronic device according to claim 11, wherein the first feeding element and the third feeding element are substantially orthogonal to each other.

13. The electronic device according to claim 10, wherein the first feeding element and the third feeding element are disposed at different heights from the first field type.

14. An electronic device, comprising: A first field type connected to a grounding element; A second field type adjacent to the first field type, wherein the first field type and the second field type are configured to form a first antenna; and A third field pattern, adjacent to the first field pattern, wherein the first field pattern and the third field pattern are configured to form a second antenna, wherein the first antenna and the second antenna are configured to form a beamforming antenna structure.

15. The electronic device according to claim 14, wherein the second field pattern and the third field pattern are arranged along a first direction, and the electronic device further comprises a plurality of ground elements arranged in a second direction substantially perpendicular to the first direction.

16. The electronic device according to claim 14, further comprising: A first feeding element disposed between the first field pattern and the second field pattern, wherein a part of the first feeding element extends beyond a lateral side of the first field pattern.

17. The electronic device according to claim 16, further comprising: A conductive element connected to the part and configured to feed a signal into the first feeding element.

18. The electronic device according to claim 14, further comprising: A ground plane disposed below the first field pattern and connected to the first field pattern via a conductive wire.

19. An electronic device, comprising: A first magnetoelectric (ME) dipole antenna having a conductive field pattern; and A second magnetoelectric (ME) dipole antenna, wherein the conductive field pattern is configured to act as a part of the second ME dipole antenna.

20. The electronic device according to claim 19, wherein the EM waves of the first ME dipole antenna and the EM waves of the second ME dipole antenna are configured to interact with each other in the far field region.

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