A motherboard, a motherboard interface, and a wind power converter controller having the motherboard.

Abstract

This invention relates to the field of wind power converter technology, and in particular to a motherboard, a motherboard interface, and a wind power converter controller having the motherboard. The motherboard includes a base plate connected to a power source; a core board including a microcontroller fixed to one side of the base plate and electrically connected to it; and a terminal connection assembly including an upper connection portion and a lower connection portion respectively disposed on both ends of the base plate. The upper connection portion is electrically connected to the core board via a main wire and includes at least one main connection point for transmitting power and signals to the main part of the device. The lower connection portion is electrically connected to the core board via a branch wire and includes at least one branch connection point for distributing power and signals to other branch circuits or devices. This invention, through the cooperative arrangement of the base plate, core board, and terminal connection assembly, can provide multiple types of external terminals while maintaining a reliable and stable connection.

Description

Technical Field

[0001] This invention relates to the field of wind power converter technology, and in particular to a motherboard, a motherboard interface, and a wind power converter controller having the motherboard. Background Technology

[0002] The wind power converter controller is a key component of a wind power generation system, used to convert the electrical energy generated by a doubly-fed induction generator (DFIG) into electrical energy that meets grid requirements. Through functions such as power conversion, voltage regulation, frequency control, maximum power point tracking, and system protection, it ensures the efficient and stable operation of the wind turbine at different wind speeds and smoothly integrates the electrical energy into the grid. The mainboard, as the core electronic component of the wind power converter controller, directly affects the control system's performance parameters. The mainboard connects to various devices in the wind power control system through interfaces, thereby realizing functions such as power conversion.

[0003] Currently, the core technology of wind power converter controllers is mostly based on foreign technology, but its cost is too high. The existing domestic wind power converter controller motherboards and interfaces still have the following problems: (1) Interface uniformity problem: The existing motherboards have a single interface type, which is not convenient to set up multiple interfaces in the limited motherboard space and cannot meet the needs of diverse application scenarios; (2) Signal transmission stability problem: The existing motherboards have insufficient signal sampling and transmission accuracy in high voltage, high current and complex electrical environments; (3) Interface scalability problem: The existing motherboards have limited interface expansion capabilities and cannot flexibly adapt to different equipment and system requirements; (4) Interface compatibility problem: The existing motherboard interfaces cannot be compatible with multiple types of equipment (such as switch boards, wind turbine main control systems, etc.). As a result, the existing wind power converter controllers have insufficient flexibility in the controller interface scheme and cannot adapt to different application scenarios. Summary of the Invention

[0004] In this section, as well as in the abstract and title of this application, some simplifications or omissions may be made to avoid obscuring the purpose of this section, the abstract, and the title of this application, and such simplifications or omissions shall not be used to limit the scope of the invention.

[0005] To address the shortcomings of existing technologies, one objective of this invention is to provide a motherboard.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a motherboard, comprising,

[0007] The base plate, which is connected to the power supply, provides mechanical support and electrical connection;

[0008] The core board includes a microcontroller, which is fixed to one side of the base plate and electrically connected to the base plate; and,

[0009] The terminal connection assembly includes an upper connection part and a lower connection part respectively disposed on the end face of the base plate, for connecting various external terminals;

[0010] The upper connection part is electrically connected to the core board via a main wire and includes at least one main connection point for transmitting power and signals to the main part of the device.

[0011] The lower connection section is electrically connected to the core board via branch wires, and includes at least one branch connection point for distributing power and signals to other branch circuits or devices.

[0012] As a preferred embodiment of the motherboard of the present invention, the upper connecting part and the lower connecting part both include conductive terminals, and each conductive terminal is adapted to a connection point.

[0013] The conductive terminal is detachably connected to the base plate.

[0014] In a preferred embodiment of the motherboard described in this invention, the upper connecting portion and the lower connecting portion are separated by an insulating material.

[0015] The beneficial effects of a motherboard according to the present invention are as follows: By setting up a base plate, a core plate, and a terminal connection assembly to cooperate with each other and optimizing the terminal arrangement, the present invention can provide external terminals with multiple types of interfaces within a limited volume space while maintaining a reliable and stable connection.

[0016] To address the shortcomings of existing technologies, another objective of this invention is to provide a motherboard interface.

[0017] To achieve the above objectives, the present invention adopts the following technical solution: a motherboard interface, applied to the motherboard, including a communication interface, a code disk input interface, a sampling interface, and an expansion interface adapted to the external terminals of the motherboard;

[0018] The communication interface is used for communication between the motherboard and the device;

[0019] The encoder input interface is used to measure the position and speed of the fan's rotational motion;

[0020] The sampling interface is used to control data transmission in the wind power system, and it includes a nine-channel Hall sampling interface and a thirty-two-channel AD sampling interface.

[0021] The extended interface includes an FT3 interface for interface expansion;

[0022] The communication interface includes two CAN communication interfaces adapted to the communication terminals. One CAN communication interface communicates with the switch board, and the other CAN communication interface communicates with the wind turbine main control system.

[0023] As a preferred embodiment of the motherboard interface described in this invention, the CAN communication interface includes,

[0024] The CAN controller interconnects with the microcontroller on the core board via SPI or parallel bus to enable data transmission.

[0025] The first transceiver chip, electrically connected to the core board, is used to convert signals from the CAN controller into differential signals; and,

[0026] The logic control circuit parses and repackages the input CAN data to adapt to the CAN communication requirements of the output.

[0027] As a preferred embodiment of the motherboard interface of the present invention, the logic control circuit includes a first power supply module, a CAN controller module, and a CAN bus interface module that are electrically connected to each other.

[0028] The first power module includes a DC-DC converter, with a sixth filter capacitor connected in parallel at the input terminal of the DC-DC converter, and a seventh and an eighth filter capacitor connected in parallel at the output terminal of the DC-DC converter.

[0029] The CAN controller module includes a first voltage conversion chip that provides operating voltage to the first transceiver chip. The first voltage conversion chip has CAN_RX3_3V3 and CAN_TX3_3V3 signal lines. A first pull-up resistor and a second pull-up resistor are respectively connected to the CAN_RX3_3V3 and CAN_TX3_3V3 signal lines to pull up the signal line voltage value to the power supply voltage value.

[0030] The CAN bus interface module includes a low-pass filter composed of a first filter capacitor, a second filter capacitor, and an inductor, used to filter out high-frequency interference signals on the CAN bus.

[0031] As a preferred embodiment of the motherboard interface described in this invention, the communication interface further includes an RS485 communication interface, which includes a first signal conversion circuit connected to the core board via an RS485 transceiver chip, used to convert the digital signal of the core board into a differential signal for transmission, and to convert the received differential signal into a digital signal.

[0032] As a preferred embodiment of the motherboard interface described in this invention, the first signal conversion circuit includes a second power supply module and an RS485 communication module that are electrically connected to each other.

[0033] The second power module includes a second voltage conversion chip for converting the operating voltage. A first decoupling capacitor is connected between the second voltage conversion chip and the power supply pin, and a second decoupling capacitor is connected between the second voltage conversion chip and ground.

[0034] The RS485 communication module includes a second transceiver chip, which has a receive output pin for sending received RS485 bus signals to the microcontroller, a receive enable pin for controlling the enable or disable of the receive function, a drive enable pin for controlling the enable or disable of the transmit function, a transmit input pin for receiving transmit data signals from the microcontroller, a differential signal pin, and a power supply pin.

[0035] As a preferred embodiment of the motherboard interface described in this invention, the communication interface further includes an RS232 communication interface, which includes a second signal conversion circuit connected to the core board via an RS232 level conversion chip, used to convert the digital logic level of the motherboard into positive and negative voltage levels of the RS232 standard.

[0036] As a preferred embodiment of the motherboard interface described in this invention, the second signal conversion circuit includes a third power supply module and an RS232 communication module that are electrically connected to each other;

[0037] The third power module includes a third voltage conversion chip for converting the operating voltage. A third decoupling capacitor is connected between the third voltage conversion chip and the power supply pin, and a fourth decoupling capacitor is connected between the third voltage conversion chip and ground.

[0038] The RS232 communication module includes a third transceiver chip and a fourth transceiver chip. A third filter capacitor is connected between the power supply pin of the third transceiver chip and ground, and a fourth filter capacitor is connected between the power supply pin of the fourth transceiver chip and ground.

[0039] As a preferred embodiment of the motherboard interface described in this invention, the code disk input interface is adapted to the code disk signal terminal, and each code disk input interface is connected to the input terminal of an optocoupler isolation circuit, and the input signal is stabilized by filtering and shaping circuits.

[0040] As a preferred embodiment of the motherboard interface described in this invention, the filtering and shaping circuit includes a fourth power supply module, a code disk signal input module, a signal processing module, and a signal output module that are electrically connected in sequence.

[0041] The fourth power module provides power to the entire circuit;

[0042] The encoder signal input module includes three differential signals, several sets of pull-up resistors located between the encoder signal line and the fourth power module, and several sets of fifth filter capacitors connected between the fourth power module and ground.

[0043] The signal processing module includes an optical coupler and several sets of pull-down resistors connected between the output side of the optical coupler and ground;

[0044] The signal output module includes a connector for outputting the processed encoder signal to the core board.

[0045] As a preferred embodiment of the motherboard interface described in this invention, more than one interface of the same type are respectively disposed on the upper connection part and the lower connection part; or / and,

[0046] Multiple external terminals of the same type of interface are staggered and distributed on the upper and lower connection parts.

[0047] The beneficial effects of the motherboard interface of the present invention are as follows: The present invention solves the problems of poor expandability and insufficient flexibility of existing motherboard interfaces by setting up communication interfaces, input interfaces, sampling interfaces and expansion interfaces to cooperate with each other; each main interface maintains the stability of signal transmission by setting up optimization circuits.

[0048] To address the shortcomings of existing technologies, another objective of this invention is to provide a wind power converter controller.

[0049] To achieve the above objectives, the present invention adopts the following technical solution: a wind power converter controller, including the aforementioned mainboard, and further comprising,

[0050] The switch board is connected to the CAN communication interface of the motherboard and is used to collect the status of external switches and control external devices.

[0051] The analog input board, connected to the Hall effect sampling interface and AD sampling interface of the main board, is used to acquire and process analog signals; and,

[0052] The communication expansion board connects to the motherboard's expansion interface, providing additional communication capabilities.

[0053] As a preferred embodiment of the wind power converter controller of the present invention, the communication expansion board includes at least one of the following types of communication interfaces:

[0054] The CAN communication interface is used to enable data exchange between devices.

[0055] The Profibus communication interface is used for connecting and communicating with various devices; and...

[0056] RS485 communication interface for multi-point communication;

[0057] The RS485 communication interface is provided with at least two channels, which are electrically isolated from each other and configured with different communication parameters.

[0058] The beneficial effects of the wind power converter controller of the present invention are as follows: The present invention, through the cooperation between the main board, the switch board, the analog board and the communication expansion board, and the use of a domestically produced low-cost MCU, simplifies the hardware design and reduces the cost of the controller. It solves the problems of existing wind power converter controllers, which usually have high cost, insufficient flexibility and cannot adapt to different application scenarios. Attached Figure Description

[0059] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0060] Figure 1 This is a three-dimensional structural diagram of the motherboard of the present invention.

[0061] Figure 2 This is a side view of the motherboard structure of the present invention.

[0062] Figure 3 This is a schematic diagram of the composition structure of the wind power converter controller of the present invention.

[0063] Figure 4 This is a schematic diagram of the external terminal distribution structure of the motherboard of the present invention.

[0064] Figure 5 This is a schematic diagram of the circuit connection at the DC-DC converter in the first power module of the motherboard interface of the present invention.

[0065] Figure 6 This is a schematic diagram of the circuit connection at the first voltage conversion chip in the CAN controller module of the motherboard interface of the present invention.

[0066] Figure 7 This is a schematic diagram of the circuit connection at the first transceiver chip in the CAN controller module of the motherboard interface of the present invention.

[0067] Figure 8 This is a circuit connection diagram of the CAN bus interface module of the motherboard interface of the present invention.

[0068] Figure 9 This is a schematic diagram of the circuit connection of the first signal conversion circuit of the motherboard interface of the present invention.

[0069] Figure 10This is a schematic diagram of the circuit connection at the filter capacitor in the second signal conversion circuit of the motherboard interface of the present invention.

[0070] Figure 11 This is a schematic diagram of the circuit connection at the third voltage conversion chip in the second signal conversion circuit of the motherboard interface of the present invention.

[0071] Figure 12 This is a schematic diagram of the circuit connection at HU1 in the second signal conversion circuit of the motherboard interface of the present invention.

[0072] Figure 13 This is a schematic diagram of the circuit connection at the third and fourth transceiver chips in the second signal conversion circuit of the motherboard interface of the present invention.

[0073] Figure 14 This is a schematic diagram of the circuit connection at the optocoupler U9 in the filtering and shaping circuit of the motherboard interface of the present invention.

[0074] Figure 15 This is a schematic diagram of the circuit connection at the optocoupler U10 in the filtering and shaping circuit of the motherboard interface of the present invention.

[0075] Figure 16 This is a schematic diagram of the circuit connection at connector M16 in the filtering and shaping circuit of the motherboard interface of the present invention.

[0076] Figure 17 This is a schematic diagram of signal transmission between the various components of the wind power converter controller of the present invention.

[0077] In the diagram: 100, Mainboard; 101, Baseboard; 102, Core Board; 103, Terminal Connection Assembly; 103a, Upper Connection Part; 103b, Lower Connection Part; 200, Mainboard Interface; 201, Communication Interface; 202, Encoder Input Interface; 203, Sampling Interface; 204, Expansion Interface; 300, Switching Input Board; 400, Analog Input Board; 500, Communication Expansion Board; P16, Communication Terminal; PSD1, Encoder Signal Terminal; U5, First Transceiver Chip; U59, Second Transceiver Chip; U68, Third Transceiver Chip; U69, Fourth Transceiver Chip; U2, DC-DC converter; U4, first voltage conversion chip; U60, second voltage conversion chip; U62, third voltage conversion chip; C8, first filter capacitor; C10, second filter capacitor; HC8, third filter capacitor; HC7, fourth filter capacitor; C5, sixth filter capacitor; C1, seventh filter capacitor; C2, eighth filter capacitor; RCH6, first pull-up resistor; RCH7, second pull-up resistor; L1, inductor; C235, first decoupling capacitor; C236, second decoupling capacitor; C239, third decoupling capacitor; C240, fourth decoupling capacitor. Detailed Implementation

[0078] To make the objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0079] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0080] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0081] Example 1

[0082] Reference Figures 1-4 This is the first embodiment of the present invention. This embodiment provides a motherboard 100 that can maintain a reliable and stable connection while providing external terminals with multiple types of interfaces. It includes: a base plate 101, a core board 102, and a terminal connection assembly 103. The base plate 101 provides mechanical support and electrical connection. The core board 102 includes a microcontroller. The base plate 101 is also provided with a number of terminals connected to external interfaces, which are used to realize various functions. The terminal connection assembly 103 is used to connect each terminal to the base plate 101.

[0083] Specifically, the base plate 101 is connected to the power supply via power terminals. The core plate 102 is fixed to one side of the base plate 101 and electrically connected to each terminal via wires passing through the base plate 101. The terminal connection assembly 103 includes an upper connection portion 103a and a lower connection portion 103b respectively located on both ends of the base plate 101. The upper connection portion 103a and the lower connection portion 103b are electrically isolated to prevent signal interference and electrical short circuits. They are connected via jumpers to achieve different connection configurations, ensuring signal integrity and system stability. Furthermore, the upper connection portion 103a and the lower connection portion 103b can be connected to different power supplies or signals respectively, achieving multifunctional electrical connections.

[0084] Furthermore, the upper connection part 103a is electrically connected to the core board 102 via a main wire, including at least one main connection point, for transmitting power and signals to the main parts of the device, which refer to the main circuits of core components such as the switch board 300 and the analog board 400; the lower connection part 103b is electrically connected to the core board 102 via a branch wire, including at least one branch connection point, for distributing power or signals to other branch circuits and devices. This staggered upper and lower layer structure effectively reduces the number of wires and the size of connectors, allowing simultaneous connection of main and branch wires, providing greater connection flexibility. By providing multiple connection points, the stability and reliability of the connection can be improved, reducing the risk of system failure due to single-point failure.

[0085] Preferably, the terminal connection assembly 103 further includes an identification section and a fixing section. The identification section can use colors, symbols, arrows, etc., as identifiers. The identification section is used to identify the function and connection direction of each connection point. Standardized identification ensures quick identification and operation in complex wiring environments, facilitating installation and maintenance. For example, "arc-shaped grooves" and "right-angle grooves" are used to indicate the connection direction of the connection point at the terminal connection. The fixing section includes fixing elements such as screws or clips, which can be installed in pre-drilled holes and slots on the base plate 101 to ensure the stability of the connection under vibration and impact environments. It is used to fix the terminal connection assembly 103 to the installation position on the base plate 101. Both the upper connection section 103a and the lower connection section 103b include conductive terminals, each conductive terminal being adapted to one connection point. The conductive terminals are detachably connected to the base plate 101, facilitating connection and disconnection operations as needed. The detachable design makes the terminal connection structure more convenient for maintenance and upgrades, reducing installation and disassembly time and costs. The conductive terminals are made of metal materials to ensure good conductivity and durability. The terminal surface is plated with gold or silver to improve its oxidation resistance and conductivity.

[0086] Preferably, the upper connecting part 103a and the lower connecting part 103b are separated by an insulating material. The insulating material can be a high-temperature resistant and corrosion-resistant material, such as PEEK material or ceramic material. While being resistant to high temperatures, it also has excellent mechanical properties, flame retardancy, low smoke emission, and chemical corrosion resistance, ensuring insulation performance in various environments and improving safety and reliability.

[0087] Referring to Table 1-2 below, several external terminals adapted to the motherboard interface 200 are shown, which adopt a double-layer arrangement structure.

[0088] Table 1

[0089]

[0090] Table 1 above shows the structure of the CAN and serial communication terminal P16. In this embodiment, the identification part is marked by a triangle on pin 1, with the tip of the triangle pointing in the direction of wiring.

[0091] The CAN communication terminal consists of two pins: CAN_H and CAN_L. These pins connect to the CAN controller and the transceiver chip, enabling data communication between devices. It is used for high-speed, reliable data exchange with devices such as the 300 digital input / output board and the fan control system. During operation, the CAN controller converts the data into the CAN protocol format, and the CAN transceiver chip converts the data into physical layer signals (CAN_H and CAN_L) for transmission. The receiving end's CAN transceiver converts the physical layer signals back into data for processing by the CAN controller.

[0092] The RS485 communication terminal consists of two pins, A and B. These pins connect to the RS485 transceiver chip. It is used for long-distance, multi-point communication scenarios, connecting multiple slave devices to achieve high-speed, stable data transmission. During operation, the motherboard's 100 microcontroller sends data to the RS485 transceiver, which converts the digital signal into a differential signal for transmission. The receiving end's RS485 transceiver converts the differential signal back into a digital signal for processing by the microcontroller.

[0093] The RS232 communication terminal consists of two pins: T232 (transmit) and R232 (receive). These pins connect to an RS232 level conversion chip. It is used for short-range, point-to-point communication with computers, terminal devices, etc., and also for device debugging and data downloading. During operation, the motherboard 100 microcontroller sends data to the RS232 level conversion chip, which converts the digital logic level to the positive and negative voltage levels of the RS232 standard. The receiving end's RS232 level conversion chip converts the positive and negative voltage levels back to digital logic levels for processing by the microcontroller.

[0094] Table 2

[0095]

[0096] Table 2 above shows the structure of the three-channel current sampling signal terminal P4. To meet the requirements, this embodiment also provides a terminal P5 with the same structure and function as P4. Signal terminals typically consist of multiple pins used to connect different signals (such as current, voltage, etc.). These pins are connected to the signal conditioning circuit and the AD converter to acquire and process various signals, such as current and voltage, and convert them into digital signals for microcontroller processing. During operation, the signal is input to the signal conditioning circuit through the terminal. The conditioning circuit amplifies and filters the signal, and the processed signal is input to the AD converter to be converted into a digital signal. The digital signal is then used by the microcontroller for further processing and analysis.

[0097] Example 2

[0098] Reference Figures 1-8 This is the second embodiment of the present invention. Unlike the previous embodiment, this embodiment provides a motherboard interface 200 for use on a motherboard 100, including a communication interface 201 adapted to the external terminals of the motherboard 100, an input interface, a sampling interface 203, and an expansion interface 204, thereby improving the interface types and expansion capabilities. For example... Figure 3 This is a schematic diagram of the composition structure of the wind power converter controller of the present invention. For ease of understanding, the main board interface 200 is indicated by a dashed box. The switch board 300, analog board 400 and communication expansion board 500 are respectively connected to the main board 100 through the main board interface 200. The arrows connecting to the main board interface 200 in the dashed box indicate the specific interfaces.

[0099] Specifically, the communication interface 201 is used for communication between the motherboard 100 and the device; the encoder input interface 202 is used to measure the position and speed of the wind turbine's rotational motion; the sampling interface 203 is used to control high-precision data transmission in the wind power system; and the expansion interface 204 is used for interface expansion.

[0100] Furthermore, the CAN communication interface includes a CAN controller, a first transceiver chip U5, and logic control circuitry. The CAN controller interconnects with the microcontroller on the core board 102 via SPI or a parallel bus for data transmission. The first transceiver chip U5 is electrically connected to the core board 102 and converts the CAN controller's signals into signals suitable for long-distance transmission, ensuring accurate transmission, reception, and processing of CAN signals. The internal logic control circuitry of the CAN communication interface includes a first power supply module, a CAN controller module, and a CAN bus interface module, which can parse and repackage the input CAN data to adapt to the CAN communication requirements of the output. Of the two CAN communication interfaces, one communicates with the switch board 300, and the other communicates with the wind turbine main control system, enabling high-speed and reliable data exchange between devices.

[0101] like Figure 5As shown, in the first power supply module, the DC-DC converter U2 converts the input DC voltage (+Vin, -Vin) into a stable 5V DC output (+Vout, -Vout). This stable 5V power supply provides the operating voltage for some components in the subsequent CAN communication circuit, such as powering the VDD pin of the first transceiver chip U5. In the diagram, numbers 1 and 2, and 5 and 7, represent the input lines (+Vin, -Vin) and the output lines (+Vout, -Vout), respectively.

[0102] In this embodiment, the seventh filter capacitor C1 and the eighth filter capacitor C2 are both 10uF / 50V, and the sixth filter capacitor C5 is 10uF / 16V. Their function is to filter out ripple and noise in the power supply. When the power supply is output from the DC-DC converter U2, ripple may interfere with the normal transmission of the CAN communication signal. The seventh filter capacitor C1 and the sixth filter capacitor C5 are connected to the output terminal of the DC-DC converter U2, forming a low-impedance path between the positive and negative terminals of the power supply. This allows high-frequency noise to return to ground through the capacitor, thereby reducing high-frequency interference components in the power supply and providing a cleaner power supply for the CAN communication circuit.

[0103] C3 is also a filter capacitor. It is connected in parallel with PL1 to form part of a π-type filter network, which can effectively filter out high-frequency noise and ripple in the power supply output, making the output VDD_C voltage more stable and pure, providing a more stable power supply for the CAN communication circuit, and ensuring the quality and reliability of the communication signal.

[0104] As an inductor, PL1 serves as both an energy storage and filter in the circuit. When current flows through PL1, it stores energy; when the current in the circuit changes, PL1 can release or absorb energy, thereby stabilizing the output current. Simultaneously, together with C1, C2, and C3, it forms a multi-stage filter network, further reducing ripple and noise in the power output, improving power quality, and minimizing interference with CAN bus communication.

[0105] VDD_C, as the output terminal of DC-DC converter U2, provides the required power voltage for the subsequent CAN communication interface circuit, ensuring that chips such as the CAN communication controller and transceiver can work normally, and is the energy guarantee for the normal operation of the entire CAN communication system.

[0106] GND serves as the common reference ground for the entire DC-DC conversion circuit, providing a stable potential reference point for each component in the circuit, ensuring normal operation of the circuit and accurate signal transmission. Simultaneously, through its connection with GND_CAN, it establishes a potential correlation between the power ground and the CAN communication ground, ensuring the continuity and consistency of the entire system ground.

[0107] GND_CAN serves as the ground terminal of the CAN communication network, providing a reference ground potential for signals on the CAN bus. This ensures stable transmission of differential signals on the CAN bus and prevents communication errors and interference caused by ground potential differences. Furthermore, by connecting to GND, GND_CAN connects the ground of the entire CAN communication system to the power supply ground, achieving system grounding balance and improving the system's anti-interference capability and reliability.

[0108] like Figure 6-7 As shown, in the CAN controller module (taking CAN3 as an example), the first voltage conversion chip U4 converts the power supply voltage to 3.3V. Since the first transceiver chip U5 requires a 3.3V power supply to operate normally, this chip provides a suitable operating voltage for U5, enabling it to correctly receive and transmit signals. In this embodiment, both the first pull-up resistor RCH6 and the second pull-up resistor RCH7 are 4.7kΩ, connected to the CAN_RX3_3V3, CAN_TX3_3V3, and other signal lines in the circuit. When the signal line is in a high-impedance state, the pull-up resistors pull the signal line voltage up to a level close to the power supply voltage, ensuring the signal line is not in an uncertain state and facilitating stable digital signal transmission.

[0109] CAN_RX3_3V3 and CAN_TX3_3V3 are low-level signals used for communication with devices operating at 3.3V logic level. They are connected to a 3.3V power supply and grounded through a first pull-up resistor RCH6 and a second pull-up resistor RCH7, respectively. CAN_RX3_3V3 is the receive signal, used to receive data from the CAN bus, with a signal level of 3.3V. When data is transmitted from the CAN bus to this module, it is converted to 3.3V by the first voltage conversion chip U4 and provided to subsequent 3.3V logic level circuits (such as microcontrollers) for processing. CAN_TX3_3V3 is the transmit signal, used to send 3.3V data to the CAN bus. It converts data from 3.3V logic level devices (such as microcontrollers) through the first voltage conversion chip U4 and sends it to the CAN bus, thus realizing the data transmission function between 3.3V level devices and the CAN bus.

[0110] CAN_RX3_5V and CAN_TX3_5V are high-level signals used for communication with devices operating at 5V logic level. They are connected to VDD_C (5V power supply). CAN_RX3_5V is the receive signal, used to receive data from the CAN bus and provide it to subsequent 5V logic level circuits for processing. It converts the data from the CAN bus to 5V using the first voltage conversion chip U4, facilitating data exchange with 5V devices. CAN_TX3_5V is the transmit signal, used to send 5V data to the CAN bus. It converts data from 5V logic level devices to 5V using the first voltage conversion chip U4, enabling data transmission between 5V level devices and the CAN bus.

[0111] In this circuit, the first voltage conversion chip U4 plays a key role in level conversion, enabling devices with different voltage levels (3.3V and 5V) to communicate via the CAN bus.

[0112] Furthermore, Figure 6 Numbers 1 to 8 represent different lines, which are connected to the following port pins: VDD1 is a power input port that provides power to a part of the voltage conversion chip's circuitry; VDD2 is also a power input port, similar to VDD1, but may differ in voltage value or power supply range, and is mainly used to power the high-voltage circuitry inside the chip; VOA is an output port used to output a signal voltage after voltage conversion; VIA is an input port that receives analog or digital signals from external circuits; VIB is also an input port, similar to VIA, and receives signals used to implement functions such as differential input; VOB is the output port corresponding to VIB, used to output the processed signal; GND1 and GND2 both serve as reference grounds in the circuit, providing a low-impedance return path for current, with GND2 primarily providing a ground reference for the high-voltage circuitry.

[0113] C9 is a decoupling capacitor, 0.1uF in this embodiment, connected between the power supply pin (VDD) and ground (GND_C) of the first transceiver chip U5. Its function is to provide instantaneous current to the first transceiver chip U5, reducing the impact of high-frequency noise on the power line. When the internal circuitry of the first transceiver chip U5 is operating, if a momentary current change occurs, C9 can quickly release its stored charge, maintaining the stability of the chip's power supply pin voltage and ensuring the chip's normal operation.

[0114] The first transceiver chip U5 has multiple functional pins. TXD (transmit data pin) receives data signals from the microcontroller; RXD (receive data pin) sends received CAN bus data to the microcontroller; VDD and VSS are power supply pins; VREF is a reference voltage pin; and CANH and CANL are differential signal pins for the CAN bus. When the microcontroller needs to send data, the data enters the first transceiver chip U5 through the TXD pin. The first transceiver chip U5 converts and modulates the signal before sending it to the CAN bus through the CANH and CANL pins. Conversely, when there is data on the CAN bus, the first transceiver chip U5 receives the signal through the CANH and CANL pins, demodulates and converts it, and then sends the data to the microcontroller through the RXD pin.

[0115] C6 and C7 are also decoupling capacitors, both of which are 0.1uF in this embodiment. They are connected between the power supply pin (VDD_C) and ground (GND_CAN) of the first transceiver chip U5, respectively, and play a similar role to C9, further stabilizing the power supply voltage of the first transceiver chip U5.

[0116] Resistors R3 and R4 are terminating resistors. In CAN bus communication, to prevent signal reflection and standing wave phenomena, matching is required at both ends of the bus. They are connected to the CANH and CANL signal lines to provide appropriate impedance matching, enabling the CAN bus signal to be effectively absorbed during transmission, reducing signal reflection, and ensuring signal integrity.

[0117] like Figure 8 As shown, in the CAN bus interface module (taking CAN3 as an example), the second filter capacitor C10 (1000pF in this embodiment), the inductor L1 (11uH in this embodiment), and the first filter capacitor C8 (1000pF in this embodiment) form an LC filter network, i.e., a low-pass filter, which can filter out high-frequency interference signals on the CAN bus. Electromagnetic interference (EMI) may couple to the CAN bus signal. This LC filter network can filter out interference signals above a certain frequency (determined by the inductor L1 and capacitor values), thereby ensuring the quality of the CAN communication signal.

[0118] GND_CAN and GND_C are two different grounds. GND_CAN is the reference ground of the CAN bus, providing a stable reference potential for the CAN bus signals. GND_C is the analog or digital ground of the CAN controller circuit, used to isolate different parts of the circuit and reduce signal interference caused by potential differences between different grounds. Through proper ground division and connection, signal interference caused by ground impedance can be avoided, ensuring the reliability of CAN communication.

[0119] The rest of the structure is the same as in Example 2.

[0120] Signal transmission process of CAN communication interface (taking CAN3 as an example):

[0121] When the microcontroller needs to send data, the data is first sent to the TXD pin of the first transceiver chip U5. The first transceiver chip U5 modulates this data, converting it into a differential signal suitable for transmission on the CAN bus. The modulated signal is output through the CANH and CANL pins of the first transceiver chip U5. The output signal passes through R3 and R4 (terminating matching resistors) to ensure good signal transmission characteristics on the CAN bus and reduce reflections. Then the signal enters the LC filter network to filter out any high-frequency interference signals. The filtered signal is output from the CAN3_H_P and CAN3_L_P pins and connected to the external CAN bus. When receiving signals, the external CAN bus signal enters from the CAN3_H_P and CAN3_L_P pins. After interference is filtered out by the LC filter network, the signal reaches the CANH and CANL pins of the first transceiver chip U5. The first transceiver chip U5 demodulates the received signal, converting the differential signal into a logic level signal suitable for the microcontroller to receive, and then sends the data to the microcontroller through the RXD pin. Throughout the process, the power module provides a stable power supply to each chip, while various filter capacitors and resistors play an auxiliary role in ensuring signal integrity and reliability.

[0122] The circuit principle of CAN2 is similar to that of CAN3, so the circuit diagrams and descriptions are omitted in this invention.

[0123] The data transmission processing procedure of the first transceiver chip U5 in CAN:

[0124] First, data input and level conversion (TXD pin) are performed. The TXD pin of the first transceiver chip U5 in the CAN system receives data transmitted from the microcontroller. This data is typically in the form of logic level signals, such as at a 3.3V or 5V logic level standard. Assuming the microcontroller uses a 3.3V logic level, when the TXD pin of the first transceiver chip U5 receives a high level (corresponding to logic "1") or a low level (corresponding to logic "0"), this is the raw data signal to be sent to the CAN bus. The first transceiver chip U5 internally performs preliminary processing on these logic level signals. It converts the signals into a level suitable for subsequent transmission circuitry based on the chip's internal level conversion circuitry. For example, the signal may be buffered and amplified to ensure that the signal has sufficient driving capability to drive the subsequent transmission circuitry.

[0125] Next, signal modulation (transmit driver) is performed. The signal after level conversion enters the transmit driver inside the first transceiver chip U5. The main function of the transmit driver is to convert the logic level signal into a differential signal suitable for transmission on the CAN bus. In CAN bus communication, differential signals are usually used to improve anti-interference capability. The differential signal of the CAN bus is generated between the CANH and CANL pins. When transmitting logic "0", the transmit driver will raise the voltage of the CANH pin to a higher level (such as 3.3V or 5V, depending on the chip design and power supply voltage), while lowering the voltage of the CANL pin to a lower level (such as close to 0V). This creates a relatively high voltage difference between CANH and CANL, usually around 2V, with the specific value varying depending on the chip and bus standard. When transmitting logic "1", the transmit driver will bring the voltages of the CANH and CANL pins to a balanced state, that is, their voltage difference is very small, close to 0V. This differential signal encoding method can effectively distinguish logic "0" and logic "1" and has a strong ability to suppress common-mode interference.

[0126] Finally, the signal is output (CANH and CANL pins). The modulated differential signal is output to the external CAN bus through the CANH and CANL pins of the first transceiver chip U5. During the output process, the signal is also affected by some external components (such as terminating resistors, filter capacitors, and inductors). Terminating resistors ensure good signal transmission characteristics on the bus and reduce reflections; filter capacitors and inductors filter out high-frequency interference components in the signal, ensuring the quality of the transmitted signal.

[0127] The data processing procedure of the first transceiver chip U5 in CAN:

[0128] First, signal input is performed (CANH and CANL pins). The differential signal from the external CAN bus enters the first transceiver chip U5 through the CANH and CANL pins. These signals may be affected by various interference factors, such as electromagnetic interference and bus reflections, so the chip internally performs preliminary processing on the input signal. The receiving circuit inside the first transceiver chip U5 filters and amplifies the input differential signal. The filtering circuit removes some high-frequency noise components from the signal, while the amplification circuit amplifies the signal to an appropriate amplitude so that the subsequent signal processing circuit can accurately identify the signal.

[0129] Next, signal demodulation is performed, and the amplified differential signal enters the receiver comparator inside the first transceiver chip U5. The function of the receiver comparator is to convert the differential signal into a logic level signal. It compares the voltage difference between the CANH and CANL pins. If the voltage difference exceeds a certain threshold (for example, greater than 0.5V, this threshold varies depending on the chip and bus standard), it is considered that the received signal is a logic "0"; if the voltage difference is lower than this threshold, it is considered that the received signal is a logic "1".

[0130] For example, when the CANH pin voltage is 3.3V and the CANL pin voltage is 0.3V, the voltage difference between the two is 3V, which is much greater than the threshold voltage. At this time, the comparator outputs logic "0". However, when the CANH and CANL pin voltages are close to equal (e.g., both around 1.5V), and the voltage difference is less than the threshold voltage, the comparator outputs logic "1".

[0131] Then, data output and level conversion (RXD pin) are performed. The logic level signal demodulated by the receiver comparator is further processed. The first transceiver chip U5 internally performs level conversion on the signal according to the chip's output level standard (such as 3.3V or 5V logic level) to ensure that the output signal can match the logic level standard of the microcontroller.

[0132] Finally, the processed received data is output through the RXD pin of the first transceiver chip U5 and sent to the microcontroller, completing the data reception process.

[0133] Example 3

[0134] Reference Figures 1-13 This is the third embodiment of the present invention. Unlike the previous embodiment, this embodiment provides an RS485 communication interface and an RS232 communication interface.

[0135] Specifically, the communication interface 201 also includes an RS485 communication interface, which includes a first signal conversion circuit connected to the core board 102 via an RS485 transceiver chip. This circuit converts the digital signals from the core board 102 into differential signals for transmission and converts the received differential signals back into digital signals. The signal conversion and transmission are achieved through a dedicated RS485 transceiver chip. The RS485 transceiver chip converts the digital signals output by the microcontroller on the motherboard 100 into differential signals conforming to the RS485 standard for transmission, and simultaneously converts the received RS485 differential signals into digital signals for processing by the microcontroller. This is commonly used in long-distance, multi-point communication scenarios, allowing connection of multiple devices to achieve high-speed, stable data transmission. In wind power converter controller systems, it is used to connect meters.

[0136] Furthermore, the communication interface 201 also includes an RS232 communication interface, which includes a second signal conversion circuit connected to the core board 102 via an RS232 level conversion chip, used to convert the digital logic levels of the motherboard 100 into positive and negative voltage levels of the RS232 standard. This is used for short-range, point-to-point communication with computers, terminal devices, etc., for equipment debugging, data downloading, etc.

[0137] Among them, such as Figure 9-13 As shown, the first signal conversion circuit and the second signal conversion circuit are respectively equipped with a second power supply module and a third power supply module. In the second power supply module and the third power supply module, the function of the second voltage conversion chip U60 and the third voltage conversion chip U62 is to convert the power supply voltage to 3.3V, so as to provide the working voltage for some components in the subsequent RS485 and RS232 communication circuits. For example, providing suitable operating voltages for the second transceiver chip U59 (i.e., RS485 transceiver chip), the third transceiver chip U68, and the fourth transceiver chip U69 (RS232 transceiver chip) enables these chips to correctly receive and transmit signals; the first decoupling capacitor C235, the second decoupling capacitor C236, the third decoupling capacitor C239, and the fourth decoupling capacitor C240 ​​are connected between the chip's power supply pin and ground (GND_CAN). Their function is to provide instantaneous current for the chip and reduce the impact of high-frequency noise on the chip from the power supply line. When the chip's internal circuit is working, if there is an instantaneous current change, the capacitor can quickly release the stored charge to maintain the stability of the chip's power supply pin voltage and ensure the normal operation of the chip; C237 and C238 (both are 10uF in this embodiment) are the ninth filter capacitors, which are usually connected between the positive and negative terminals of the power supply. Their function is to filter out ripple and noise in the power supply, providing a cleaner power supply for RS485 and RS232 communication circuits, and preventing interference components in the power supply from affecting the signal transmission quality.

[0138] In the RS485 communication module, the second transceiver chip U59 has multiple functional pins: RO (receive output pin) is used to send the received RS485 bus signal to the microcontroller; RE (receive enable pin) is used to control the enable or disable of the receive function; DE (drive enable pin) is used to control the enable or disable of the transmit function; DI (transmit input pin) is used to receive the transmit data signal from the microcontroller; A and B are differential signal pins of the RS485 bus; VCC and GND are power supply pins.

[0139] When the microcontroller needs to send data, the data enters the second transceiver chip U59 through the DI pin, and at the same time, the DE pin is pulled high (assuming a high level to enable transmission). The second transceiver chip U59 converts and modulates the signal, and then sends it to the RS485 bus through pins A and B. For example, when transmitting logic "0", the voltage of pin A will be lower than the voltage of pin B; when transmitting logic "1", the voltage of pin A will be higher than the voltage of pin B.

[0140] When there is data on the RS485 bus, the data enters the second transceiver chip U59 through pins A and B. At the same time, the RE pin is pulled low. The second transceiver chip U59 converts the received differential signal into a single-ended signal and sends it to the microcontroller from the RO pin.

[0141] R243 (220Ω in this embodiment) is the terminating matching resistor. In RS485 bus communication, to prevent signal reflection and standing wave phenomena, matching is required at both ends of the bus. It is connected to the A and B signal lines of the RS485 bus to provide appropriate impedance matching, so that when the RS485 bus signal is transmitted on the bus, the energy can be effectively absorbed, reducing signal reflection and ensuring signal integrity.

[0142] R242 and R244 (both 4.7kΩ in this embodiment) are the third pull-up resistors. They are connected to signal lines such as RS485_TX_EN (transmit enable signal line). When the signal line is in a high-impedance state, the third pull-up resistor will pull the signal line voltage up to a level close to the power supply voltage, ensuring that the signal line is not in an uncertain state, which is very important for the stable transmission of digital signals.

[0143] In the RS232 communication module, the third transceiver chip U68 and the fourth transceiver chip U69 are used to convert the microcontroller's TTL level signals into RS232 level signals (transmit direction) and the RS232 level signals into TTL level signals (receive direction). For example, during transmission, the low level output by the microcontroller (e.g., 0V) is converted into a negative voltage (e.g., around -12V) according to the RS232 standard, and the high level (e.g., 3.3V or 5V) is converted into a positive voltage (e.g., around +12V) according to the RS232 standard; during reception, the positive voltage of RS232 is converted into a high level of TTL level, and the negative voltage is converted into a low level of TTL level.

[0144] HC9, HC6, and HC10 are the tenth filter capacitors. In this embodiment, the tenth filter capacitor, the third filter capacitor HC8, and the fourth filter capacitor HC7 are all 10uF. They are all connected between the power supply pins of the third transceiver chip U68 and the fourth transceiver chip U69 and ground (GND_CAN). Their function is to filter out ripple and noise in the power supply, provide a stable power supply for the RS232 transceiver chip, and ensure the accuracy of signal conversion.

[0145] HU1 is an isolation transformer or signal isolator. Its function is to provide signal isolation, isolating the RS232 signal from other circuits on the motherboard and preventing damage to the motherboard circuitry caused by issues such as ground potential differences in RS232 communication. For example, when the RS232 communication line is connected to other devices, there may be different ground potentials. HU1 can prevent current surges to the motherboard circuitry caused by ground potential differences.

[0146] The rest of the structure is the same as in Example 2.

[0147] RS485 communication interface signal transmission process:

[0148] When the microcontroller needs to send data, the data is first sent to the DI pin of the second transceiver chip U59. Simultaneously, the microcontroller enables the transmit function of the second transceiver chip U59 by using the RS485_TX_EN signal through relevant circuitry (such as R242, R244, etc.) (DE pin pulled high). Internally, the second transceiver chip U59 modulates the signal, converting it into a differential signal suitable for transmission on the RS485 bus. The modulated signal is output through pins A and B, and after passing through resistor R243 (terminating resistor), it is connected to the external RS485 bus. When receiving signals, the external RS485 bus signal enters the second transceiver chip U59 through pins A and B. The microcontroller enables the receive function by controlling the RE pin (RE pin pulled low). The second transceiver chip U59 demodulates the received signal, converting the differential signal into a logic level signal suitable for the microcontroller to receive, and then sends the data to the microcontroller through the RO pin.

[0149] RS232 communication interface signal transmission process:

[0150] When the microcontroller needs to send data, the data is sent to the transmit input pin of the third transceiver chip U68 or the fourth transceiver chip U69 via the UARTDBG / TX pin. The third transceiver chip U68 or the fourth transceiver chip U69 converts the TTL level signal to an RS232 level signal, and then sends it to the external RS232 communication line via the RS232_TXD1 pin. During this process, the third filter capacitors HC8 and HC9 act as filters, providing a stable power supply to the chip. When an external device sends data to the motherboard via the RS232 communication line, the signal enters the third transceiver chip U68 or the fourth transceiver chip U69 via the RS232_RXD1 pin. The third transceiver chip U68 or the fourth transceiver chip U69 converts the RS232 level signal to a TTL level signal and sends it to the microcontroller via the UARTDBG / RX pin. Simultaneously, HU1 acts as an isolation element throughout the entire RS232 communication process, preventing the ground potential of the external device from interfering with or damaging the motherboard circuitry.

[0151] Example 4

[0152] Reference Figures 1-16 This is the fourth embodiment of the present invention. Unlike the previous embodiment, this embodiment provides a code disk input interface 202 and an expansion interface 204. Specifically, the code disk input interface 202 is adapted to the code disk signal terminal PSD1, and each code disk input interface 202 is connected to the input terminal of an optocoupler isolation circuit. The input signal is stabilized through filtering and shaping circuits. The optocoupler provides electrical isolation, converting the external 24V code disk signal into a digital signal suitable for processing by the motherboard 100.

[0153] Meanwhile, the input signal is processed through filtering and shaping circuits to improve signal quality and stability. The encoder input interface is used in wind power converter controller systems to measure information such as the position and speed of rotational motion, for motor control, position detection, and other applications.

[0154] Preferably, the expansion interface 204 includes two FT3 interfaces for interface expansion. These two FT3 interfaces are implemented using a specific protocol chip and interface circuitry. The protocol chip handles the encoding and decoding of the FT3 protocol, while the interface circuitry ensures signal transmission quality and compatibility. In the wind power converter controller system, the FT3 interfaces are used for data transmission within the control system at a speed of 20 Mbps, enabling high-precision measurement and control data exchange. Furthermore, these two FT3 interfaces are scalable, allowing connection of more external devices or modules as needed to meet system function upgrades and expansions.

[0155] The filtering and shaping circuit includes a fourth power supply module, a code disk signal input module, a signal processing module, and a signal output module. The fourth power supply module uses a 3.3V power supply to provide operating power for the entire filtering and shaping circuit. The signal output from the code disk requires a suitable power supply to ensure its level stability; the 3.3V power supply is used to power components such as optocouplers (U9, U10) to ensure their normal operation.

[0156] like Figure 14-15 As shown, in the encoder signal input module, SPEEDA+, SPEEDA-, SPEEDB+, SPEEDB-, SPEEDZ+, and SPEEDZ- are all signal output terminals of the encoder. The encoder typically outputs differential signals; for example, SPEEDA+ and SPEEDA- are one differential signal, SPEEDB+ and SPEEDB- are another, and SPEEDZ+ and SPEEDZ- are a third. Differential signals can improve the signal's anti-interference capability and are suitable for applications with complex electromagnetic environments, such as wind power converter controllers.

[0157] R115, R118, R120, R124, R125, and R128 (all 2.4K in this embodiment) are also pull-up resistors. They are connected between the encoder signal line and the 3.3V power supply. When the encoder signal is in a high-impedance state, these pull-up resistors will pull the signal line voltage up to a level close to 3.3V, ensuring that the signal line is not in an uncertain state and guaranteeing signal integrity.

[0158] C31, C35 (both 0.1uF in this embodiment), C32, C36 (both 1uF in this embodiment), C33, C34, and C37 (both 101±10% in this embodiment) are all the fifth filter capacitors. They are connected between the power supply and ground to filter out ripple and noise in the power supply, providing a stable power environment for the transmission of the encoder signal. They can also filter out high-frequency interference signals on the signal lines, ensuring the quality of the encoder signal.

[0159] In the signal processing module, D1, D2, D3, D4, D5, and D6 are all diodes, but some can be replaced with resistors (such as D5). When operating normally as diodes, they can be used for signal clamping protection, preventing the signal voltage output from the encoder from being too high or too low and damaging subsequent circuits. When replaced with resistors (such as replacing D5 with a resistor), they can serve to limit current and match impedance, adjusting the signal amplitude and transmission characteristics.

[0160] U9 and U10 are optocouplers, used for signal isolation and level conversion. The input side of the optocoupler receives the signal from the code disk, while the output side is connected to the subsequent control circuitry. When the code disk outputs a signal, the signal is transmitted to the output side by the optocoupler's LEDs (ANODE1 and CATHODE1, ANODE2 and CATHODE2), which turn on the internal phototransistors (VO1 and VO2). This isolation method effectively prevents interference signals from the code disk from entering the subsequent control circuitry and also converts the code disk's signal level to a level suitable for processing by the subsequent circuitry.

[0161] R123, R116, and R126 (all taken as 20K±0.5% in this embodiment) are pull-down resistors. They are connected between the output side of the optocoupler and ground. When the pull-down resistors work in conjunction with the phototransistor of the optocoupler, they can ensure that the low level of the optocoupler output signal is in a stable low level state, thus improving signal stability.

[0162] like Figure 16 As shown, in the signal output module, M16 is a connector used to output the processed encoder signal to subsequent control circuits (such as a microcontroller). The encoder signals (SPEED_A, SPEED_B, SPEED_C) after being isolated and processed by the optocoupler are connected to other parts of the motherboard through M16 so that the microcontroller can further process and analyze the encoder signal.

[0163] The rest of the structure is the same as in Example 3.

[0164] Signal transmission process of encoder input interface 202:

[0165] The encoder outputs differential signals (SPEEDA+, SPEEDA-, SPEEDB+, SPEEDB-, SPEEDZ+, SPEEDZ-). These signals are initially processed by pull-up resistors (R115, etc.) and filter capacitors (C31, etc.) before entering the input side of the optocoupler (U9, U10). Inside the optocoupler, when the LED on the input side receives the encoder signal, it illuminates, turning on the phototransistor on the output side. For example, when the SPEEDA+ signal is high, the corresponding LED and phototransistor are turned on, and the SPEED_A- signal on the output side is low; when the SPEEDA+ signal is low, the LED and phototransistor are turned off, and the SPEED_A- signal is high under the action of the pull-down resistor (R123, etc.). The signals (SPEED_A-, SPEED_B-, SPEED_C-) after being processed by the optocoupler are output to the subsequent control circuit, such as a microcontroller, through connector M16. The microcontroller uses these signals to calculate information such as the position and speed of the encoder. Meanwhile, during signal transmission, diodes (or resistors) clamp or limit the signal to ensure signal integrity and circuit safety.

[0166] Example 5

[0167] Reference Figures 1-16 This is the fifth embodiment of the present invention. Unlike the previous embodiment, this embodiment provides: 2 CAN communication interfaces, 1 RS485 communication interface and 1 RS232 communication interface; 3 encoder input interfaces 202; and an expansion interface 204 for interface expansion, including 2 FT3 interfaces. The functions of each interface have been described in detail above.

[0168] In addition, the motherboard interface 200 in this embodiment also includes: at least one Ethernet interface for the monitoring system; 9 Hall sampling interfaces, including Hall power output, for acquisition; 32 AD sampling interfaces, for Hall acquisition on this board; at least one Chopper optical port, including 3 receivers and 3 transmitters, for connecting to the IGBT driver board; at least three input interfaces, which are 24V inputs; at least four output interfaces, which are 220V dry contacts; at least twelve IGBT interfaces, which are divided into 2 circuits on the machine side and 2 circuits on the network side; and a board power supply, which provides 15V voltage.

[0169] Referring to Table 3-5 below, several external terminals adapted to the motherboard interface 200 in this embodiment are shown, which adopt a staggered arrangement structure in upper and lower layers.

[0170] Table 3

[0171]

[0172] Table 4

[0173]

[0174] Table 5

[0175]

[0176] Table 3-5 above shows the PWM signal cable terminals for phases A, B, and C of the 30-core grid side of the wind power converter controller. The PWM signal terminals consist of multiple pins, with even-numbered pins located on the upper layer of the main board 100 and odd-numbered pins on the lower layer. Similarly, in this embodiment, a triangle is used as the identifier at pin 1, with the apex pointing in the direction of wiring. Multiple pins are used to output PWM signals. These pins connect to the PWM drive circuit and the output power module, and can be used to control the switching state of power devices (such as IGBTs) to achieve precise control of loads such as motors. SO_NA, SO_NB, and SO_NC represent module faults, while FOUT_NA, FOUT_NB, and FOUT_NC represent module temperatures. During operation, the microcontroller generates a PWM signal, which is amplified by the drive circuit to drive power devices such as IGBTs. The IGBTs control the power output of the load according to the duty cycle of the PWM signal. Furthermore, the PWM signal cable terminals for phases A, B, and C on both sides of the 30-pin wind power converter controller correspond to terminals P7, P8, and P9 of the mainboard 100, and terminals P14, P17, and P19 of the mainboard 100, respectively. The structure of the PWM signal cable terminals is the same as described above, and therefore will not be repeated. In addition, this embodiment also provides... Figure 4 PP1 is a signal terminal providing 3 inputs and 4 outputs, P15 is a CAN communication terminal, P6 and P10 are both 15V power supply terminals, P3 is a 40-pin analog ribbon cable terminal, and HJ1 is a network port. All of them adopt a staggered arrangement structure between upper and lower layers, which allows the motherboard 100 to provide multiple interfaces in a limited space, thereby solving the problem of interface singleness.

[0177] The remaining structure is the same as in Example 4.

[0178] Example 6

[0179] Reference Figures 1-17 This is the sixth embodiment of the present invention. Unlike the previous embodiment, this embodiment provides a wind power converter controller, including a motherboard 100 and a motherboard interface 200, as well as a digital input board 300, an analog input board 400 and a communication expansion board 500. This solves the problem that existing wind power converter controllers have insufficient flexibility in their controller interface schemes and cannot adapt to different application scenarios.

[0180] Specifically, the digital input board 300 is connected to the CAN communication interface of the main board 100 to collect external switch status and control external devices; the analog input board 400 is connected to the Hall sampling interface and AD sampling interface of the main board 100 to collect and process analog signals; and the communication expansion board 500 is connected to the expansion interface 204 of the main board 100 to provide additional communication capabilities.

[0181] Furthermore, the switch board 300 includes at least one 24V input terminal for acquiring external 24V switching signals; one 220V dry contact output terminal for outputting 220V control signals; and an optocoupler isolation circuit for achieving electrical isolation.

[0182] The analog input board 400 includes at least one 1140V AC input terminal for acquiring high-voltage AC signals; one CT input terminal for acquiring current signals; one 1100V DC voltage input terminal for acquiring high-voltage DC signals; and one Hall effect sampling input terminal for acquiring current signals. Preferably, the analog input board 400 also includes a high-voltage divider circuit for proportionally reducing the high voltage to a suitable low voltage range for processing; and an analog signal conditioning circuit, including gain adjustment, bias calibration, and filtering stages.

[0183] Furthermore, the communication expansion board 500 provides additional CAN, PROFIBUS, and RS485 communication interfaces to expand the system's communication capabilities. The CAN communication interface enables high-speed, reliable data exchange between devices; the PROFIBUS communication interface facilitates communication between various devices; and the RS485 communication interface supports long-distance, multi-point communication. The CAN interface typically connects to the motherboard via a dedicated CAN controller and transceiver chip. The CAN controller interconnects with the core board's microcontroller via SPI or a parallel bus to achieve data transmission. The CAN bus transceiver converts the controller's signals into signals suitable for long-distance transmission. The PROFIBUS interface connects to the motherboard via a dedicated PROFIBUS controller and transceiver. The controller typically connects to the core board via SPI or a parallel bus to achieve data transmission and reception. The RS485 interface connects to the motherboard via an RS485 transceiver chip. The transceiver chip converts the motherboard's digital signals into differential signals for transmission and converts the received differential signals back into digital signals.

[0184] The system includes at least two RS485 communication interfaces, which are electrically isolated and configured with different communication parameters. These two interfaces allow for the connection of more devices, meeting the diverse communication needs of complex systems. If one RS485 interface fails, the other can serve as a backup, improving system reliability and stability. The two RS485 interfaces also provide electrical isolation, preventing signal interference and enhancing the stability and security of signal transmission. Furthermore, the two RS485 interfaces can be configured with different communication parameters to adapt to different application scenarios.

[0185] Preferably, in this embodiment, the wind power converter controller further includes a power management module for providing stable power to the motherboard and its interfaces. The power management module includes an LDO regulator for converting 15V power to 3.3V. The wind power converter controller uses a low-cost MCU to simplify hardware design and reduce controller costs. The MCU supports multi-functional multiplexed pins and can be configured as SWD, USB, I2C, or serial port functions. The wind power converter controller also adopts a low-power design, directly converting 15V to 3.3V power via the LDO to improve power stability and reliability. In addition, the wind power converter controller also has multi-functional multiplexed pins that support multiple interface functions such as SWD, USB, I2C, and serial port to flexibly adapt to different application scenarios.

[0186] The input signals of the switch board 300 include 20 relay inputs 300-X1, 2 4~20mA inputs 300-X2, 5 PT100 temperature signal inputs 300-X3, and IDC level input (15V); the output signals of the switch board 300 include 16 relay outputs 300-Y1. The switch board 300 is responsible for receiving and processing digital signals (relay inputs, temperature signals, etc.) and transmitting these signals to the core board 102. Simultaneously, it receives control signals (relay outputs) from the core board 102 for controlling external devices (such as circuit breakers, contactors, etc.).

[0187] The analog signal inputs of the analog signal board 400 include four ±1100V DC voltage inputs (400-X1), three mains voltage inputs (400-X2, 1-phase 1100V), three mains current inputs (400-X3, 2-phase 1140V), three stator voltage inputs (400-X4), three stator current inputs (400-X5), three filter current inputs (400-X6), nine open-loop Hall effect inputs (400-X7, ±10V), and an IDC level input (15V). The outputs of the analog signal board 400 include two grid-side Hall effect power outputs (400-Y2, ±15V) and four ±1100V DC voltage outputs (400-Y1). The analog signal board 400 is responsible for acquiring and processing analog signals (such as voltage, current, and temperature) and transmitting these signals to the core board. It also receives analog output signals from the core board 102 for controlling external devices (such as motors and sensors).

[0188] The input signals of the motherboard 100 include signal input 100-X1 (relay input, temperature signal, etc.) from the switch board 300, signal input 100-X2 (voltage, current, temperature, etc.) from the analog board 400, signal input 100-X3 from the communication expansion board 500, and IDC level input (15V). The output signals of the motherboard 100 include signal outputs 100-Y1, 100-Y2, and 100-Y3 from the switch board 300, analog board 400, and communication expansion board 500. In addition, the input and output signals of the motherboard 100 also include 3 5M fiber optic signals Z1 from the chopper, 4 three-phase full-bridge pulse signals Z2, 3 encoder signals Z3 (24V), 2 FT3 extended serial ports Z4, 1 RS485 signal Z6, 1 RS232 signal Z7, and 2 Ethernet serial ports Z5 connected to the core board 102. The core board 102 is the control center of the entire system. It is responsible for processing signals from the digital input board 300 and the analog input board 400, and generating output signals according to the control logic. It communicates with external devices (such as host computers, sensors, actuators, etc.) through Profibus, CAN bus, and RS485 interfaces. The core board 102 is also responsible for transmitting control signals to the digital input board and the analog input board to control the external devices.

[0189] The communication expansion board 500 has one PROFIBUS interface, one CAN bus interface, and two RS485 interfaces for input signals; its output signals also include one PROFIBUS interface, one CAN bus interface, and two RS485 interfaces. The communication expansion board 500 is used to expand the communication capabilities of the core board 102, providing additional PROFIBUS, CAN bus, and RS485 interfaces. It can be flexibly configured according to the needs of engineering projects to meet different communication requirements.

[0190] The remaining structure is the same as in Example 5.

[0191] In summary, the digital input board 300 and analog input board 400 are responsible for acquiring and processing input signals, and then transmitting these signals to the core board 102. The core board 102 is the control center of the entire wind power converter controller, responsible for signal processing, logic control, and communication. The communication expansion board 500 is used to expand the communication capabilities of the core board 102 to meet the needs of different engineering projects. Through modular design, the entire wind power converter controller control system achieves complete functions of signal acquisition, processing, control, and communication.

[0192] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A motherboard, characterized in that: include, The base plate (101), which is connected to the power supply, is used to provide mechanical support and electrical connection; The core board (102) includes a microcontroller fixed to one side of the base plate (101) and electrically connected to the base plate (101); and, The terminal connection assembly (103) includes an upper connection part (103a) and a lower connection part (103b) respectively disposed on the end face of the base plate (101) for connecting various external terminals; The upper connection part (103a) is electrically connected to the core board (102) via a main wire, and includes at least one main connection point for transmitting power and signals to the main part of the device; The lower connection part (103b) is electrically connected to the core board (102) via branch wires, and includes at least one branch connection point for distributing power and signals to other branch circuits or devices; It also includes a motherboard interface, which includes a communication interface (201), a code disk input interface (202), a sampling interface (203), and an expansion interface (204) adapted to the external terminals of the motherboard (100). The communication interface (201) is used for communication between the motherboard (100) and the device; The encoder input interface (202) is used to measure the position and speed of the fan's rotational motion; The sampling interface (203) is used to control data transmission in the wind power system, and it includes a nine-channel Hall sampling interface and a thirty-two-channel AD sampling interface. The expansion interface (204) includes an FT3 interface for interface expansion; The communication interface (201) includes two CAN communication interfaces adapted to the communication terminal (P16), one of which communicates with the switch board (300) and the other CAN communication interface communicates with the wind turbine main control system. The communication interface (201) also includes an RS485 communication interface, which includes a first signal conversion circuit connected to the core board (102) via an RS485 transceiver chip. The first signal conversion circuit is used to convert the digital signal of the core board (102) into a differential signal for transmission, and to convert the received differential signal into a digital signal. The communication interface (201) also includes an RS232 communication interface, which includes a second signal conversion circuit connected to the core board (102) via an RS232 level conversion chip, used to convert the digital logic level of the motherboard (100) into positive and negative voltage levels of the RS232 standard; Multiple interfaces of the same type are located on the upper connection part (103a) and the lower connection part (103b); or / and, Multiple external terminals of the same type of interface are staggered on the upper connection part (103a) and the lower connection part (103b).

2. The motherboard as described in claim 1, characterized in that: Both the upper connecting part (103a) and the lower connecting part (103b) include conductive terminals, and each conductive terminal is adapted to a connection point. The conductive terminal is detachably connected to the base plate (101).

3. The motherboard as described in claim 1, characterized in that: The upper connecting part (103a) and the lower connecting part (103b) are separated by an insulating material.

4. The motherboard as described in any one of claims 1 to 3, characterized in that: The CAN communication interface includes, The CAN controller, which interconnects with the microcontroller on the core board (102) via SPI or parallel bus, is used to realize data transmission; The first transceiver chip (U5), electrically connected to the core board (102), is used to convert the signals from the CAN controller into differential signals; and, The logic control circuit parses and repackages the input CAN data to adapt to the CAN communication requirements of the output.

5. The motherboard as described in claim 4, characterized in that: The logic control circuit includes a first power supply module, a CAN controller module, and a CAN bus interface module that are electrically connected to each other. The first power module includes a DC-DC converter (U2), the input terminal of which is connected in parallel with a sixth filter capacitor (C5), and the output terminal of which is connected in parallel with a seventh filter capacitor (C1) and an eighth filter capacitor (C2). The CAN controller module includes a first voltage conversion chip (U4) that provides operating voltage to the first transceiver chip (U5). The first voltage conversion chip (U4) has CAN_RX3_3V3 and CAN_TX3_3V3 signal lines. A first pull-up resistor (RCH6) and a second pull-up resistor (RCH7) are respectively connected to the CAN_RX3_3V3 and CAN_TX3_3V3 signal lines to pull up the signal line voltage value to the power supply voltage value. The CAN bus interface module includes a low-pass filter composed of a first filter capacitor (C8), a second filter capacitor (C10), and an inductor (L1), used to filter out high-frequency interference signals on the CAN bus.

6. The motherboard as described in claim 5, characterized in that: The first signal conversion circuit includes a second power supply module and an RS485 communication module that are electrically connected to each other; The second power module includes a second voltage conversion chip (U60) for converting the operating voltage. A first decoupling capacitor (C235) is connected between the second voltage conversion chip (U60) and the power supply pin, and a second decoupling capacitor (C236) is connected between the second voltage conversion chip (U60) and ground. The RS485 communication module includes a second transceiver chip (U59), which has a receive output pin for sending received RS485 bus signals to the microcontroller, a receive enable pin for controlling the enable or disable of the receive function, a drive enable pin for controlling the enable or disable of the transmit function, a transmit input pin for receiving transmit data signals from the microcontroller, a differential signal pin, and a power supply pin.

7. The motherboard as described in claim 6, characterized in that: The second signal conversion circuit includes a third power supply module and an RS232 communication module that are electrically connected to each other; The third power supply module includes a third voltage conversion chip (U62) for converting the operating voltage. A third decoupling capacitor (C239) is connected between the third voltage conversion chip (U62) and the power supply pin, and a fourth decoupling capacitor (C240) is connected between the third voltage conversion chip (U62) and ground. The RS232 communication module includes a third transceiver chip (U68) and a fourth transceiver chip (U69). A third filter capacitor (HC8) is connected between the power supply pin of the third transceiver chip (U68) and ground, and a fourth filter capacitor (HC7) is connected between the power supply pin of the fourth transceiver chip (U69) and ground.

8. The motherboard as described in claim 7, characterized in that: The encoder input interface (202) is adapted to the encoder signal terminal (PSD1), and each encoder input interface (202) is connected to the input terminal of an optocoupler isolation circuit, and the input signal is stabilized by filtering and shaping circuits.

9. The motherboard as described in claim 8, characterized in that: The filtering and shaping circuit includes a fourth power supply module, a code disk signal input module, a signal processing module, and a signal output module that are electrically connected in sequence. The fourth power module provides power to the entire circuit; The encoder signal input module includes three differential signals, several sets of pull-up resistors located between the encoder signal line and the fourth power module, and several sets of fifth filter capacitors connected between the fourth power module and ground. The signal processing module includes an optical coupler and several sets of pull-down resistors connected between the output side of the optical coupler and ground; The signal output module includes a connector for outputting the processed encoder signal to the core board (102).

10. A wind power converter controller, comprising a mainboard as described in any one of claims 1 to 9, characterized in that: It also includes, The switch board (300) is connected to the CAN communication interface of the main board (100) and is used to collect the status of external switches and control external devices. The analog input board (400) is connected to the Hall sampling interface and AD sampling interface of the main board (100) for acquiring and processing analog signals; as well as, A communication expansion board (500) is connected to the expansion interface (204) of the motherboard (100) to provide additional communication capabilities.

11. The wind power converter controller as described in claim 10, characterized in that: The communication expansion board (500) includes at least one of the following types of communication interfaces: The CAN communication interface is used to enable data exchange between devices; The Profibus communication interface is used for connecting and communicating with various devices; and... RS485 communication interface for multi-point communication; The RS485 communication interface is provided with at least two channels, which are electrically isolated from each other and configured with different communication parameters.

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