Headphone and adjusting method thereof

Abstract

The present invention describes a headphone and an adjusting method thereof, the headphone comprising: a bracket provided with a first heat dissipation channel communicating with the outside; the two earmuff assemblies are connected to the two ends of the support respectively, the two earmuff assemblies are provided with second heat dissipation channels, the first heat dissipation channels are communicated with the second heat dissipation channels, and each earmuff assembly comprises a wearing side used for being close to the ear of the human body; one side of the semiconductor refrigeration part is a refrigeration side, and the refrigeration side is connected to the side, away from the wearing side, of the earmuff assembly. Therefore, through the first heat dissipation channel and the second heat dissipation channel, heat in the support and heat in the earmuff assembly can be discharged, and a user feels more comfortable when wearing the earmuff. In addition, the semiconductor refrigeration piece can further directly reduce the temperature of the earmuff assembly, and the semiconductor refrigeration piece is free of noise and vibration during refrigeration and does not affect the tone quality effect of the headphone.

Description

Technical Field

[0001] The present invention relates to the technical field of earphones, and in particular to a headset and an adjustment method thereof. Background Art

[0002] When traditional headphones are worn for a long time, components such as the speakers inside the earmuffs will generate heat when they continue to work, causing the overall temperature of the headphones to gradually rise. In this way, the area where the user's skin contacts the earmuffs is prone to heat accumulation, and the user often feels stuffy and uncomfortable. In addition, the increase in the temperature inside the headphones will also have a negative impact on the performance stability of the headphones, thereby shortening the service life of the headphones. Therefore, in order to improve the user's wearing comfort and ensure the long-term stability of the headphones, the headphones also need to fully consider the heat dissipation problem. At present, although some headphones have tried to enhance heat dissipation by optimizing the earmuff material, this method has not significantly improved the cooling effect, and it is still difficult to effectively solve the heat dissipation problem of the headphones. Summary of the invention

[0003] In view of the above existing situation, the present invention provides a headset and an adjustment method thereof, which can improve the problem of poor heat dissipation effect of the existing headset.

[0004] In a first aspect, the present invention provides a headset, comprising: a bracket, provided with a first heat dissipation channel, the first heat dissipation channel is connected to the outside; two earmuff assemblies, the two earmuff assemblies are respectively connected to the two ends of the bracket, the two earmuff assemblies are provided with a second heat dissipation channel, and the first heat dissipation channel is connected to the second heat dissipation channel, the earmuff assembly includes a wearing side for approaching a human ear; a semiconductor refrigeration element, one side of the semiconductor refrigeration element is a cooling side, and the cooling side is connected to a side of the earmuff assembly away from the wearing side.

[0005] Optionally, the bracket is provided with a heat dissipation window, which is connected to the outside; the headset also includes a first air duct, which runs through the bracket and is connected to the heat dissipation window, and the first air duct forms the first heat dissipation channel.

[0006] Optionally, the heat dissipation window is provided with heat dissipation fins.

[0007] Optionally, the headset further includes a second air duct, the second air duct runs through the earmuff assembly, and the first air duct is connected to the second air duct; the first air duct and / or the second air duct are made of flexible material.

[0008] Optionally, the headset further includes a speaker; an installation cavity is provided in the earcup assembly, the speaker is installed in the installation cavity, and the second air duct is communicated with the installation cavity.

[0009] Optionally, the earcup assembly is provided with a ventilation opening, and the ventilation opening is communicated with the second air duct and / or the installation cavity.

[0010] Optionally, it includes a fan assembly, the fan assembly is installed on the bracket, and the fan assembly is communicated with the first heat dissipation channel.

[0011] Optionally, the earcup assembly includes an earcup and a heat conduction ring connected to each other, the wearing side is located on one side of the earcup, and the heat conduction ring is at least partially located between the semiconductor refrigeration element and the earcup; the bracket is further provided with a heat conduction belt, and at least part of the heat conduction belt is used to face the human head.

[0012] Optionally, a temperature sensor and a humidity sensor are provided in the earcup assembly.

[0013] In a second aspect, the present invention provides an adjustment method for a headset, which is applied to the headset as described above. The adjustment method includes: obtaining a first temperature in the earcup assembly, and if the first temperature is higher than a preset temperature, controlling the semiconductor refrigeration element to start and / or controlling the fan assembly to start; obtaining a first humidity in the earcup assembly, and if the first humidity is higher than a preset humidity, controlling the fan assembly to start.

[0014] The headset involved in the present invention includes a bracket, two earmuff assemblies and a semiconductor cooling element, wherein the bracket is provided with a first heat dissipation channel, and the first heat dissipation channel is connected to the outside; the two earmuff assemblies are respectively connected to the two ends of the bracket, and the two earmuff assemblies are provided with a second heat dissipation channel, and the first heat dissipation channel is connected to the second heat dissipation channel, and the earmuff assembly includes a wearing side for being close to the human ear; one side of the semiconductor cooling element is a cooling side, and the cooling side is connected to the side of the earmuff assembly away from the wearing side. Therefore, when the headset is worn, the bracket and the earmuff assembly are close to the head and ears of the human body, and heat is relatively accumulated. The present application sets a first heat dissipation channel and a second heat dissipation channel, and the first heat dissipation channel is connected to the second heat dissipation channel, and the second heat dissipation channel is connected to the outside, so that the heat inside the bracket and the earmuff assembly can be discharged, making the user more comfortable when wearing. In addition, since the speaker that is prone to heat is also set in the earmuff assembly, the earmuff assembly heats up more obviously. In this application, a semiconductor refrigeration component is also set, and the cooling side of the semiconductor refrigerant can be connected to the earmuff assembly, so that the temperature of the earmuff assembly can be more directly reduced, further improving the heat dissipation capacity of the headset, and also ensuring the performance stability of the headset during long-term use, extending the service life. In addition, the semiconductor refrigeration component is noiseless and vibration-free during cooling, and will not affect the sound quality of the headset. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0016] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0017] Figure 1 Schematic diagram showing the overall structure of the headset involved in the present application.

[0018] Figure 2 It is a schematic diagram showing the partial structure of the headset involved in the present application.

[0019] Figure 3 2 is another partial structural schematic diagram of the headset involved in the present application.

[0020] Figure 4 2 is a schematic diagram showing the structure of the headphone bracket involved in the present application.

[0021] Figure 5 It shows what the present application relates to Figure 4 The enlarged structural schematic diagram of part A in

[0022] Reference numerals: 1, bracket; 11, heat dissipation window; 2, earcup assembly; 21, vent; 22, earcup; 23, heat conduction ring; 3, semiconductor refrigeration component; 4, first air duct; 5, heat dissipation fins; 6, second air duct; 7, fan assembly; 71, silent motor; 8, heat conduction belt. Detailed implementation manners

[0023] Hereinafter, with reference to the drawings, the preferred implementation manners of the present application will be described in detail. In the following description, the same reference numerals are given to the same components, and repeated descriptions are omitted. In addition, the drawings are only schematic diagrams, and the proportional relationship of the sizes between components or the shapes of components may be different from the actual ones. It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0024] It should also be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time.

[0025] Referring to Figure 1 , the present application provides a pair of headphones, which includes a bracket 1, two earcup assemblies 2 and a semiconductor refrigeration component 3. Among them, the bracket 1 is provided with a first heat dissipation channel, and the first heat dissipation channel communicates with the outside; the two earcup assemblies 2 are respectively connected to both ends of the bracket 1, the two earcup assemblies 2 are provided with a second heat dissipation channel, and the first heat dissipation channel communicates with the second heat dissipation channel. The earcup assembly 2 includes a wearing side for approaching the human ear; one side of the semiconductor refrigeration component 3 is a refrigeration side, and the refrigeration side is connected to the side of the earcup assembly 2 facing away from the wearing side.

[0026] According to the above structure, when the headphone is worn, the bracket 1 and the earcup assembly 2 are close to the human head and ears, and heat accumulates. In this application, the first heat dissipation channel and the second heat dissipation channel are provided, and the first heat dissipation channel is communicated with the second heat dissipation channel, and the second heat dissipation channel is communicated with the outside, so that the heat inside the bracket 1 and the earcup assembly 2 can be discharged, making the user more comfortable when wearing. In addition, since the easily heat-generating speaker is also provided in the earcup assembly 2, the earcup assembly 2 generates heat more obviously. In this application, a semiconductor refrigeration component 3 is also provided, and the refrigeration side of the semiconductor refrigerant can be connected to the earcup assembly 2, so that the temperature of the earcup assembly 2 can be directly reduced, further improving the heat dissipation capacity of the headphone, and ensuring the performance stability of the headphone during long-term use and extending the service life. In addition, the semiconductor refrigeration component 3 has no noise and vibration during refrigeration, and will not affect the sound quality of the headphone.

[0027] It should be noted that the refrigeration side of the semiconductor refrigeration component 3 in this application can produce a cooling effect. Specifically, the semiconductor refrigeration component 3 is made of semiconductor material. After the semiconductor refrigeration component 3 is powered on and started, one side of the semiconductor refrigeration component 3 will produce a cooling effect, while the other side will release heat. In this application, the refrigeration side is connected to the earcup assembly 2, so the cooling effect of the semiconductor refrigeration component 3 can be transmitted to the earcup assembly 2, thereby reducing the temperature of the earcup assembly 2. This cooling method does not require the use of traditional refrigerants, avoiding the problem of refrigerant leakage. At the same time, the volume of the semiconductor refrigeration component is small, and it will not significantly increase the volume of the headphone, and will not affect its overall appearance and wearing comfort.

[0028] Refer to Figure 4 and Figure 5 , in some embodiments, the bracket 1 is provided with a heat dissipation window 11, and the heat dissipation window 11 is communicated with the outside; the headphone further includes a first air duct 4, the first air duct 4 penetrates through the bracket 1, and the first air duct 4 is communicated with the heat dissipation window 11, and the first air duct 4 forms the first heat dissipation channel. Thus, the setting of the heat dissipation window 11 can enable the heat inside the bracket 1 and the earcup assembly 2 to be fully dissipated, improving the heat exchange efficiency between the inside and the outside. Refer to Figure 5 , in some examples, the heat dissipation window 11 can be set to be square. In other examples, it can also be adapted to the shape of the bracket 1 and a suitable structure can be set.

[0029] Refer to Figure 5, in some embodiments, the heat dissipation window 11 is provided with heat dissipation fins 5. Thus, the provision of the heat dissipation fins 5 not only improves the heat dissipation performance of the earphone, but also enhances the durability and reliability of the headphone. On the one hand, the heat of the bracket 1 and the earcup assembly 2 is transferred to the heat dissipation fins 5 through the first heat dissipation channel and the second heat dissipation channel, and the provision of the heat dissipation fins 5 can increase the surface area in contact with the air, effectively improving the heat dissipation rate, thereby increasing the heat dissipation efficiency. On the other hand, the provision of the heat dissipation fins 5 also has a partial shielding effect, which can prevent external sundries from directly falling into the interior of the heat dissipation window 11, thereby protecting the internal components of the earphone from being damaged by external impurities. This shielding effect not only helps to maintain the cleanliness of the headphone, but also reduces the risk of a decrease in heat dissipation efficiency caused by the blockage of the heat dissipation channel by sundries, and also extends the service life of the headphone.

[0030] Referring to Figure 2 and Figure 3 , in some embodiments, the headphone further includes a second air duct 6. The second air duct 6 passes through the earcup assembly 2, and the first air duct 4 is communicated with the second air duct 6; the first air duct 4 and / or the second air duct 6 is made of a flexible material. It can be understood that the earcup assembly 2 can be set to be rotatable relative to the bracket 1. In this way, the earcup assembly 2 can be adjusted to a suitable angle, so that when the user wears the headphone, the earcup assembly 2 can better fit the human ear. In this embodiment, since the first air duct 4 and / or the second air duct 6 is made of a flexible material, it can ensure that the first air duct 4 and / or the second air duct 6 does not affect the rotation of the earcup assembly 2. Specifically, referring to Figure 2 , in some examples, the second air duct 6 can protrude outside the earcup assembly 2, and the second air duct 6 is connected to the first air duct 4. The flexible second air duct 6 can adapt to the rotation of the earcup assembly 2 and is slightly deformed when the earcup assembly 2 rotates, without affecting the normal rotation of the earcup assembly 2.

[0031] In some embodiments, the headphone further includes a speaker; an installation cavity is provided in the earcup assembly 2, and a speaker is installed in the installation cavity. The second air duct 6 is communicated with the installation cavity. Since the speaker generates a certain amount of heat during operation, especially when the speaker works continuously, the heat generation is obvious. In this embodiment, the second air duct 6 is communicated with the installation cavity to form an effective heat dissipation channel, so as to guide the heat generated by the speaker to the outside. With this structure, not only can the performance degradation of the speaker caused by overheating be prevented, but also the wearing comfort of the user can be improved, and the stuffy feeling caused by heat accumulation can be avoided.

[0032] Referring to Figure 3, in some embodiments, the earcup assembly 2 is provided with a ventilation opening 21, and the ventilation opening 21 communicates with the second air duct 6 and / or the installation cavity. Thus, the earcup assembly 2 can also exchange heat with the outside through the ventilation opening 21, especially effectively dissipating the heat generated by the speaker, and reducing the temperature of the headphone during long-term use.

[0033] Refer to 1 and Figure 4 , in some embodiments, it includes a fan assembly 7. The fan assembly 7 is installed on the bracket 1 and the fan assembly 7 communicates with the first heat dissipation channel. Thus, the fan assembly 7 can promote the air circulation in the first heat dissipation channel, the second heat dissipation channel and the installation cavity. Specifically, after the fan assembly 7 is turned on, the air flow path can be "ventilation opening 21 - installation cavity - second heat dissipation channel - first heat dissipation channel - heat dissipation window 11", so that the heat flow in the installation cavity of the earcup assembly 2 and the heat in the bracket 1 can be discharged in sequence, and new cold air can be continuously introduced through the ventilation opening 21, and so on in a cycle to achieve a better ventilation and heat dissipation effect.

[0034] Refer to Figure 4 , in some examples, the fan assembly 7 may include a fan and a silent motor 71. Among them, when the silent motor 71 drives the fan to operate, the generated noise is extremely small and will not interfere with the sound quality of the headphone itself. When the user uses the fan assembly 7 for ventilation and heat dissipation, they can also enjoy a clear and pure audio experience.

[0035] In some examples, the ventilation opening 21 may be provided with a one-way valve. When the fan assembly 7 is not working, the one-way valve remains closed, thus preventing external sundries such as dust and hair from entering the headphone through the ventilation opening 21, keeping the inside of the headphone clean and safe, and greatly reducing the maintenance frequency and potential damage risk caused by sundries blocking the headphone. When the fan assembly 7 is started, the air in the installation cavity, the first heat dissipation channel and the second heat dissipation channel is drawn out from the heat dissipation window 11, and the air pressure in the installation cavity, the first heat dissipation channel and the second heat dissipation channel is relatively small. Under the action of the internal and external air pressure difference, the one-way valve is pushed open, and when the fan assembly 7 continuously draws air, the wind force keeps the one-way valve in an open state, so that external cold air can be introduced into the headphone. When the fan assembly 7 is turned off, the internal and external air pressures gradually tend to balance, and the one-way valve closes the ventilation opening 21, restoring its function of blocking external sundries. In this way, this design of the ventilation opening 21 with a one-way valve not only improves the heat dissipation efficiency and cleanliness of the headphone, but also enables the headphone to maintain good performance and comfort during long-term use.

[0036] Refer to Figure 2, in some embodiments, the earcup assembly 2 includes an interconnected earcup 22 and a heat conducting ring 23. The wearing side is located on one side of the earcup 22, and the heat conducting ring 23 is at least partially located between the semiconductor refrigeration element 3 and the earcup 22. Specifically, since the wearing side of the earcup 22 closely adheres to the user's ear when wearing the headset, heat is likely to accumulate. Through the setting of the heat conducting ring 23, the heat of the earcup 22 can be gradually conducted to the heat dissipation fins 5 through the heat conducting ring 23 to discharge the heat to the outside. In addition, the refrigeration side of the semiconductor refrigeration element 3 can also cool the heat conducting ring 23. The refrigeration side absorbs the heat on the heat conducting ring 23 and cools the heat conducting ring 23 at the same time. This heat exchange process not only improves the heat dissipation efficiency of the earcup 22 but also ensures the stability of the internal temperature, enabling the headset to maintain a relatively low temperature during long-term use.

[0037] Refer to Figure 1 and Figure 4 , in some embodiments, the bracket 1 is further provided with a heat conducting belt 8, and at least part of the heat conducting belt 8 is used to face the human head. Since the bracket 1 is close to the user's head when wearing the headset, heat is likely to accumulate here. In this embodiment, through the setting of the heat conducting belt 8 and at least part of the heat conducting belt 8 facing the human head, when wearing the headset, the part of the bracket 1 in contact with the user's head can effectively conduct heat through the heat conducting belt 8. The heat of the heat conducting belt 8 can be gradually conducted to the heat dissipation fins 5 through the heat conducting ring 23 and then discharge the heat to the outside, effectively reducing the temperature of the contact area between the bracket 1 and the head and improving the user's wearing comfort.

[0038] In some embodiments, a temperature sensor and a humidity sensor are provided inside the earcup assembly 2. Specifically, the temperature sensor is responsible for real-time monitoring of the temperature change inside the earcup 22 in the headset. When it detects a temperature increase, it can trigger the start or adjust the working intensity of the fan assembly 7 and the semiconductor refrigeration element 3 to reduce the temperature of the headset. In addition, the humidity sensor is used to monitor the humidity condition of the headset. When the internal humidity exceeds the appropriate range, the humidity sensor can activate the fan assembly 7 to work to promote air circulation and reduce moisture accumulation. This not only helps prevent the internal components of the headset from being damaged due to moisture or the growth of bacteria but also provides a drier and more comfortable wearing environment for the user, enhancing the overall user experience.

[0039] The present application also provides an adjustment method for a headset, which is applied to the headset as described above. The adjustment method includes: obtaining the first temperature inside the earcup assembly 2, and if the first temperature is higher than the preset temperature, controlling the semiconductor refrigeration element 3 to start and / or controlling the fan assembly 7 to start; obtaining the first humidity inside the earcup assembly 2, and if the first humidity is higher than the preset humidity, controlling the fan assembly 7 to start.

[0040] In the adjustment method of the head-mounted earphone, the specific process of adjusting the temperature is as follows: The temperature sensor obtains the first temperature inside the earcup assembly 2, and the temperature sensor transmits the value of the first temperature to the processor of the head-mounted earphone. Then, the processor compares the obtained first temperature with the preset temperature. If the first temperature is higher than the preset temperature, the processor will determine that the temperature inside the earcup assembly 2 is too high and measures need to be taken to cool down. The processor can control the start of the semiconductor refrigeration component 3 and / or the start of the fan assembly 7 to lower the temperature. After the semiconductor refrigeration component 3 and / or the fan assembly 7 are started, the processor continuously monitors the temperature change inside the earcup assembly 2. If the first temperature is lower than or equal to the preset temperature, the processor determines that the temperature inside the earcup assembly 2 is normal, and the processor will control the semiconductor refrigeration component 3 and / or the fan assembly 7 to stop working to avoid overcooling. In this way, the processor continuously obtains temperature data, judges the first temperature, and adjusts the working states of the semiconductor refrigeration component 3 and the fan assembly 7 according to the temperature change situation to keep the temperature inside the earcup assembly 2 within a comfortable and safe range.

[0041] Generally, it is more comfortable for the temperature of the head-mounted earphone to be slightly lower than or close to the human body temperature. When the temperature is too high, whether to start the semiconductor refrigeration component 3 first, the fan assembly 7 first, or both at the same time can be set by the user in the processor.

[0042] In some examples, if the first temperature is higher than the preset temperature, the semiconductor refrigeration component 3 is controlled to start and the fan assembly 7 is controlled to start at the same time. Specifically, the preset temperature can be 37 degrees. At this time, by the simultaneous operation of the semiconductor refrigeration component 3 and the fan assembly 7, the effect of rapid cooling can be achieved, avoiding the first temperature continuously exceeding 37 degrees and bringing sultry discomfort to the user.

[0043] In some examples, the preset temperature includes a first preset temperature and a second preset temperature, and the second preset temperature is higher than the first preset temperature; if the first temperature is higher than the first preset temperature, the fan assembly 7 is controlled; if the first temperature is higher than the second preset temperature, the semiconductor refrigeration component 3 is controlled to start. Specifically, the first preset temperature can be 35 degrees, and the second preset temperature can be set to 37 degrees. When the first temperature is higher than the first preset temperature, the fan assembly 7 starts to achieve the effect of ventilation and heat dissipation. However, after the head-mounted earphone continuously works, the temperature is likely to continue to rise. When the first temperature is higher than the second preset temperature, the semiconductor refrigeration component 3 starts to cool down the head-mounted earphone. At this time, by the simultaneous operation of the semiconductor refrigeration component 3 and the fan assembly 7, the effect of rapid cooling can be achieved, avoiding the first temperature continuously being higher than 37 degrees and bringing sultry discomfort to the user.

[0044] In some other examples, the preset temperature includes a first preset temperature and a second preset temperature, and the second preset temperature is higher than the first preset temperature. If the first temperature is higher than the first preset temperature, the semiconductor refrigeration component 3 is controlled to start; if the first temperature is higher than the second preset temperature, the fan assembly 7 is controlled to start. Specifically, the first preset temperature can be 35 degrees, and the second preset temperature can be set to 37 degrees. Contrary to the previous example, when the first temperature is higher than the first preset temperature, the semiconductor refrigeration component 3 starts to cool down the headset. When the first temperature is higher than the second preset temperature, the fan assembly 7 starts to achieve the effect of ventilation and heat dissipation. At this time, by the simultaneous operation of the semiconductor refrigeration component 3 and the fan assembly 7, the effect of rapid cooling can be achieved, avoiding the first temperature continuously being higher than 37 degrees and bringing sultry discomfort to the user.

[0045] In the above example, the user can set the preset temperature according to needs, and the user can set different preset temperatures for the semiconductor refrigeration component 3 and the fan assembly 7 respectively. When the temperature is not high, only one of them is started for heat dissipation, which is more energy-saving and environmentally friendly.

[0046] In the adjustment method of the headset, the specific process of adjusting humidity is as follows: the humidity sensor obtains the first humidity inside the earcup assembly 2, and the humidity sensor transmits the value of the first temperature to the processor of the headset, and then the processor compares the obtained first humidity with the preset humidity. If the detected first humidity is higher than the preset humidity, the processor will judge that the humidity environment inside the earcup 22 exceeds the comfortable range, and then control the fan assembly 7 to start, and promote the internal air circulation through the airflow generated by the fan to achieve the purpose of reducing humidity. If the first humidity is lower than or equal to the preset humidity, the processor judges that the humidity inside the earcup assembly 2 is normal, and the processor will control the fan assembly 7 to stop working.

[0047] The headset involved in this application can be connected to external devices, such as mobile phones, computers and other devices, in a wired or wireless manner, and the user can set the preset temperature and preset humidity on the mobile phone APP or computer software.

[0048] In summary, the headphone provided by the present application has a good heat dissipation and cooling effect. By providing a first heat dissipation channel and a second heat dissipation channel, and the first heat dissipation channel is communicated with the second heat dissipation channel, and the second heat dissipation channel is communicated with the outside, the heat inside the bracket 1 and the earcup assembly 2 can be discharged, making the user more comfortable when wearing. In addition, since the easily heat-generating speaker is also arranged in the earcup assembly 2 and the earcup assembly 2 generates heat more significantly, a semiconductor refrigeration component 3 is also arranged in the present application, and the refrigeration side of the semiconductor refrigerant can be connected to the earcup assembly 2, so that the temperature of the earcup assembly 2 can be more directly reduced, further improving the heat dissipation ability of the headphone, and also ensuring the performance stability of the headphone during long-term use and prolonging the service life. In addition, the semiconductor refrigeration component 3 has no noise and vibration during refrigeration and will not affect the sound quality effect of the headphone.

[0049] In the description of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0050] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For the parts not detailed in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0051] Among the embodiments, implementation manners and related technical features of the present application, they can be combined and replaced with each other without conflict.

[0052] The above are only the preferred embodiments of the present application and do not impose any form of limitation on the present application. However, as long as it does not deviate from the content of the technical solution of the present application, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present application still fall within the scope of the technical solution of the present application.

[0053] Although the present invention has been specifically described above in combination with the drawings and implementation manners, it can be understood that the above description does not limit the present invention in any form. Those skilled in the art can make deformations and changes to the present invention according to needs without departing from the essence and scope of the present invention, and these deformations and changes all fall within the scope of the present invention.

Claims

1. A head-mounted earphone, characterized in that, include: The bracket is provided with a first heat dissipation channel, wherein the first heat dissipation channel is communicated with the outside; Two earmuff assemblies, the two earmuff assemblies are respectively connected to two ends of the bracket, the two earmuff assemblies are provided with a second heat dissipation channel, and the first heat dissipation channel is communicated with the second heat dissipation channel, and the earmuff assembly includes a wearing side for being close to a human ear; A semiconductor refrigeration component, one side of which is a refrigeration side, and the refrigeration side is connected to a side of the earmuff assembly away from the wearing side.

2. The headphone according to claim 1, characterized in that, The bracket is provided with a heat dissipation window, and the heat dissipation window is connected to the outside; The headset further includes a first air duct, the first air duct runs through the bracket, and the first air duct is connected to the heat dissipation window, and the first air duct forms the first heat dissipation channel.

3. The headset according to claim 2, characterized in that, The heat dissipation window is provided with heat dissipation fins.

4. The headphone according to claim 2, wherein, The headset further includes a second air duct, the second air duct runs through the earmuff assembly, and the first air duct is in communication with the second air duct; The first air guide pipe and / or the second air guide pipe are made of flexible material.

5. The head-mounted earphone according to claim 4, wherein The headset also includes a speaker; The earmuff assembly is provided with a mounting cavity, the speaker is mounted in the mounting cavity, and the second air duct is communicated with the mounting cavity.

6. The headphone according to claim 5, characterized in that, The earmuff assembly is provided with a vent, and the vent is communicated with the second air duct and / or the installation cavity.

7. The head-mounted earphone according to any one of claims 1-6, characterized in that, The fan assembly comprises a fan component, which is mounted on the bracket and communicated with the first heat dissipation channel.

8. The head-mounted earphone according to any one of claims 1-6, characterized in that, The earmuff assembly comprises an earmuff and a heat-conducting ring connected to each other, the wearing side is located at one side of the earmuff, and the heat-conducting ring is at least partially located between the semiconductor refrigeration element and the earmuff; The support is also provided with a heat-conducting belt, and at least a part of the heat-conducting belt is used to face the human head.

9. The headset according to any one of claims 1-6, characterized in that, A temperature sensor and a humidity sensor are arranged in the earmuff assembly.

10. A method for adjusting a head-mounted earphone, applied to the head-mounted earphone according to any one of claims 1-9, characterized in that, The adjustment method comprises: Acquiring a first temperature in the earmuff assembly, and if the first temperature is higher than a preset temperature, controlling the semiconductor refrigeration element to start and / or controlling the fan assembly to start; A first humidity in the earmuff assembly is obtained, and if the first humidity is higher than a preset humidity, the fan assembly is controlled to start.

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