Electronic ceramic substrate

Abstract

An electronic ceramic substrate disclosed by the present invention comprises a substrate body and an outer frame body correspondingly sleeving the periphery of the substrate body, a clamping groove matched with the thickness of the substrate body is arranged in the outer frame body, a circle of clamping groove is arranged in the outer frame body, the outer wall of the clamping groove extends outwards to form a water tank, a circle of water tank is also arranged, and the water tank is arranged in the outer frame body. And the height of the water tank is smaller than that of the clamping groove. After the edge position of the base plate body is clamped in the clamping groove, the groove opening of the water groove is correspondingly blocked, the water groove forms a circle of sealed groove body structure, after the groove body structure is filled with water, the water body can directly make contact with the side wall of the base plate body, and therefore the water body is prevented from being damaged. The heat generated when the substrate body works is directly absorbed by the water body in the water tank, so that the purpose of rapidly reducing the temperature of the substrate body is achieved, and as the water body is in direct contact with the side wall of the substrate body, the heat absorption effect is remarkable.

Description

Technical Field

[0001] The present invention relates to ceramic substrate technology equipment in the field of electronic industry technology, and specifically relates to an electronic ceramic substrate. Background Art

[0002] In the prior art, an electronic ceramic substrate is a substrate made of ceramic materials and plays a key role in the electronic industry; the application fields of electronic ceramic substrates are very wide, and they are commonly used in the fields of semiconductor devices, optoelectronic devices, radio frequency communication, and automotive electronics technology. They are commonly used as carriers for integrated circuits, providing electrical connection, heat dissipation support, and physical support for chips to ensure the stability and reliability of chips during high-performance operation.

[0003] Electronic ceramic substrates have high performance and continuously pursue higher thermal conductivity, lower dielectric loss, better mechanical strength and other properties to meet the requirements of next-generation electronic devices for heat dissipation, high frequency, high power, etc.; they have multi-functional integration, integrating multiple functions such as sensing, filtering, storage, etc. into one body to realize the miniaturization, light weight, and high integration of electronic systems, providing support for emerging fields such as the Internet of Things and wearable devices; they have green and sustainable development, developing environmentally friendly ceramic materials and preparation processes, reducing the impact on the environment, while reducing costs and improving resource utilization rate, in line with the global green development trend.

[0004] In addition, electronic ceramic substrates also have more important properties, that is, they have strong heat dissipation performance. Their main alumina material has a higher thermal conductivity than metallic aluminum and can be applied to occasions requiring high thermal conductivity. There are also various electronic ceramic substrates that can increase heat dissipation in the prior art.

[0005] For example: "An electronic ceramic substrate for heat dissipation" disclosed in Publication (Announcement) No.: CN105693223A, for example: "A preparation process of an electronic ceramic substrate for heat dissipation" disclosed in Publication (Announcement) No.: CN105777081A, for example: "A detachable structure of an electronic ceramic substrate" disclosed in Publication (Announcement) No.: CN210928388U, etc., all set heat dissipation structures inside the substrate, effectively increasing the heat dissipation function.

[0006] However, when an electronic ceramic substrate is specifically used, usually in order to protect the ceramic substrate and for corresponding installation with other devices, etc., an external frame, etc. also needs to be provided outside the electronic ceramic substrate. And heat is more likely to accumulate at the corresponding installation positions of the external frame and the ceramic substrate, and the heat is not easily dissipated, resulting in the obstruction of the heat dissipation function.

[0007] Therefore, in order to solve the above problems, it is necessary to develop an electronic ceramic substrate with a reasonable and stable structure and increased heat dissipation. Summary of the Invention

[0008] The object of the present invention is to provide an electronic ceramic substrate in view of the deficiencies existing in the prior art. The technical solution is as follows:

[0009] An electronic ceramic substrate includes a substrate body and an outer frame correspondingly sleeved around the substrate body. A card slot adapted to the thickness of the substrate body is provided inside the outer frame. The card slot is arranged in a circle inside the outer frame, and a water groove extends outward from the outer wall of the card slot. The water groove is also arranged in a circle, and the height of the water groove is less than the height of the card slot. When the edge part of the substrate body is clamped in the card slot, the side wall of the substrate body correspondingly seals the inner slot opening of the water groove, so that the water groove forms a sealed groove structure in a circle.

[0010] An inlet interface corresponding to the water groove is arranged on the left side of the outer frame, and an outlet interface corresponding to the water groove is arranged on the right side of the outer frame. Plug covers are also installed at the inlet interface and the outlet interface. The water body contacts the side wall of the substrate body in the water groove to absorb the heat generated by the substrate body.

[0011] Further, a circle of flange parts is also arranged at the upper and lower ends inside the outer frame. The position of the flange parts corresponds to the position of the card slot inside the outer frame. Waterproof pads are also arranged at the upper and lower ends of the card slot. Threaded holes are arranged inside the flange parts, and threaded pressure rods are installed in the threaded holes. The threaded pressure rods are correspondingly screwed tightly in the threaded holes, and the waterproof pads are correspondingly pressed against the outer edge of the substrate body.

[0012] Further, the combination of the threaded pressure rods and the threaded holes is evenly arranged at intervals on the flange parts of the outer frame.

[0013] Further, a U-shaped heat sink is also sleeved on the outer frame. The heat sink is integrally sleeved from the outer side end of the outer frame. A heat conducting rod is also installed inside the heat sink. The heat conducting rod correspondingly passes through the side wall of the outer frame and extends into the water groove, and a water blocking piece is installed at the rod end. The water blocking piece is arranged in the water groove, and the size of the water blocking piece is smaller than the size of the water groove.

[0014] Further, the thickness of the heat sink is adapted to the height dimension of the flange part.

[0015] Further, uniformly distributed flow holes are also arranged on the water blocking piece. The heat sink is arranged in a whole section on the outer frame, and uniformly distributed water blocking pieces are installed on each section of the heat sink.

[0016] Further, the part where the heat conducting rod is inserted into the outer frame is waterproofed.

[0017] Further, the outer frame is of an integrally formed structure.

[0018] Beneficial effects: The present invention has the following beneficial effects:

[0019] 1) After the edge position of the substrate body is clamped in the card slot in the present invention, the notch of the water tank is correspondingly blocked, and the water tank forms a sealed tank structure. After the tank structure is filled with water, the water body can directly contact the side wall of the substrate body, and the heat generated when the substrate body works is directly absorbed by the water body in the water tank, so as to achieve the purpose of quickly reducing the temperature of the substrate body. Since the water body directly contacts the side wall of the substrate body, the heat absorption effect is remarkable;

[0020] 2) A flange portion is provided on the outer frame body of the present invention. A threaded hole is provided in the flange portion, and a threaded pressure rod is provided in the threaded hole. A waterproof pad is provided in the card slot. Then, the waterproof pad is pressed by the threaded pressure rod, and the waterproof pad presses the edge of the substrate body from the upper and lower positions to ensure the sealing effect of the water tank, and the structure is reasonably arranged;

[0021] 3) A heat sink is also sleeved on the outer frame body of the present invention. After the heat sink is sleeved on the outside, a heat conducting rod is provided inside. The heat conducting rod extends into the water tank and a water baffle is installed at the end of the rod. The setting of the water baffle can, on the one hand, block and delay the flow of the water body when the water body flows, increase the flow time of the water body, and increase the heat absorption effect; on the other hand, the water baffle can absorb heat and transfer the heat from the heat conducting rod to the external heat sink. The heat dissipation area of the heat sink is large, and the heat absorbed in the water body is directly dissipated from the heat sink, effectively increasing the heat dissipation efficiency. Description of the drawings

[0022] Figure 1 is the structural diagram of the present invention;

[0023] Figure 2 is Figure 1 the A-A view in

[0024] Figure 3 is Figure 2 the B-B view in

[0025] Figure 4 is the internal structural diagram of the outer frame body of the present invention;

[0026] Figure 5 is the structural diagram of the heat sink of the present invention;

[0027] Among them, substrate body 1; outer frame body 2; card slot 3; water tank 4; water inlet interface 5; water outlet interface 6; plug 7; flange portion 8; waterproof pad 9; threaded hole 10; threaded pressure rod 11; heat sink 12; heat conducting rod 13; water baffle 14; flow hole 15. Detailed implementation manners

[0028] The present invention will be further illustrated below in conjunction with the accompanying drawings and specific embodiments. These embodiments are implemented on the premise of the technical solution of the present invention, and it should be understood that these embodiments are only used to illustrate the present invention and not to limit the scope of the present invention.

[0029] As Figure 1 and Figure 2 shown, an electronic ceramic substrate includes a substrate body 1 and an outer frame 2 correspondingly sleeved around the periphery of the substrate body 1. A card slot 3 adapted to the thickness of the substrate body 1 is provided in the outer frame 2. The card slot 3 is provided in a circle within the outer frame 2, and a water tank 4 extends outward from the outer wall of the card slot 3. The water tank 4 is also provided in a circle, and the height of the water tank 4 is less than the height of the card slot 3. When the edge portion of the substrate body 1 is clamped in the card slot 3, the side wall of the substrate body 1 correspondingly seals the inner slot opening of the water tank 4, so that the water tank 4 forms a sealed tank structure in a circle;

[0030] As Figure 3 shown, an inlet interface 5 corresponding to and communicating with the water tank 4 is provided on the left side of the outer frame 2, an outlet interface 6 corresponding to and communicating with the water tank 4 is provided on the right side of the outer frame 2, and plugs 7 are installed at both the inlet interface 5 and the outlet interface 6; The water body contacts the side wall of the substrate body 1 in the water tank 4 and absorbs the heat generated by the substrate body 1.

[0031] As Figure 4 shown, a flange portion 8 is further provided on the upper and lower ends inside the outer frame 2. The position of the flange portion 8 corresponds to the position of the card slot 3 inside the outer frame 2. Waterproof pads 9 are provided at the upper and lower ends of the card slot 3, and threaded holes 10 are provided inside the flange portion 8. A threaded pressure rod 11 is installed in the threaded hole 10, and the threaded pressure rod 11 is correspondingly screwed tightly in the threaded hole 10, thereby pressing the waterproof pad 9 tightly against the outer edge of the substrate body 1.

[0032] The combination of the threaded pressure rod 11 and the threaded hole 10 is evenly arranged at intervals on the flange portion 8 of the outer frame 2.

[0033] As Figure 5 shown, a U-shaped heat sink 12 is further sleeved on the outer frame 2. The heat sink 12 is integrally sleeved from the outer side end of the outer frame 2, and a heat conducting rod 13 is installed inside the heat sink 12. The heat conducting rod 13 correspondingly passes through the side wall of the outer frame 2 and extends into the water tank 4, and a water blocking piece 14 is installed at the rod end. The water blocking piece 14 is arranged in the water tank 4, and the size of the water blocking piece 14 is smaller than the size of the water tank 4.

[0034] The thickness of the heat sink 12 is adapted to the height dimension of the flange portion 8.

[0035] The water blocking piece 14 is also provided with evenly distributed flow holes 15. The heat sink 12 is provided in a whole section on the outer frame 2, and evenly distributed water blocking pieces 14 are installed on each section of the heat sink 12.

[0036] The part where the heat conduction rod 13 is inserted into the outer housing 2 is waterproofed; the outer housing 2 is an integrally formed structure.

[0037] The specific working process and working principle of the present invention are as follows: The technical solution of the present invention is to provide a card slot for installing the substrate body and a water tank for storing and circulating water inside the outer housing. First, a card slot is directly provided on the inner wall of the outer housing, and the size of the card slot is adapted to the substrate body. Then, on the basis of the card slot, a water tank is extended outward. The technical feature is that when the edge position of the substrate body is clamped in the card slot, the notch of the water tank is correspondingly blocked, and the water tank forms a sealed tank structure. After the tank structure is filled with water, the water body can directly contact the side wall of the substrate body. The heat generated when the substrate body works is directly absorbed by the water body in the water tank, so as to quickly reduce the temperature of the substrate body. Since the water body directly contacts the side wall of the substrate body, the heat absorption effect is remarkable.

[0038] Moreover, in order to prevent water leakage, etc., a flange portion is provided on the outer housing, a threaded hole is provided inside the flange portion, a threaded pressure rod is provided inside the threaded hole, and a waterproof pad is provided inside the card slot. Then, the waterproof pad is pressed by the threaded pressure rod, and the waterproof pad presses the edge of the substrate body from the upper and lower positions to ensure the sealing effect of the water tank, and the structure is reasonably arranged.

[0039] And the technical solution of the present invention has two working modes. One is to access cold water through the water inlet interface and discharge cold water through the water outlet interface. The water body in the internal water tank is a circulating water body. After the water body absorbs heat, it can quickly take away the heat. The other is to be directly set in the form of storing water. The water inlet interface and the water outlet interface are both correspondingly blocked by plug caps, and the inside is a stored water body, which can also improve the heat absorption and heat dissipation effects. In addition, in order to improve the heat dissipation effect, a heat sink structure is also provided in the present invention.

[0040] In the present invention, a heat sink is also sleeved on the outer housing. After the heat sink is sleeved on the outside, a heat conduction rod is provided inside, and the heat conduction rod extends into the water tank and a water baffle is installed at the rod end. The setting of the water baffle can, on the one hand, block and delay the flow of the water body when the water body flows, increase the flow time of the water body, and increase the heat absorption effect; on the other hand, the water baffle can transfer the heat from the heat conduction rod to the external heat sink after absorbing heat. The heat dissipation area of the heat sink is large, and the heat absorbed by the water body is directly dissipated from the heat sink, effectively increasing the heat dissipation efficiency.

[0041] Moreover, flow holes are also provided on the water baffle. The flow holes can increase the contact area between the water body and the water baffle, so as to effectively conduct heat and transfer heat, and the structure is reasonably arranged.

[0042] The above specific embodiments are only a preferred embodiment of the present invention, and are not used to limit the implementation and scope of the claims of the present invention. Any equivalent changes and modifications made in accordance with the scope of the patent application for the present invention shall be included within the scope of the patent application for the present invention.

Claims

1. An electronic ceramic substrate, characterized in that: It includes a substrate body (1) and an outer frame body (2) correspondingly sleeved around the periphery of the substrate body (1). A card slot (3) adapted to the thickness of the substrate body (1) is provided in the outer frame body (2). The card slot (3) is arranged in a circle inside the outer frame body (2), and a water groove (4) extends outward from the outer wall of the card slot (3). The water groove (4) is also arranged in a circle, and the height of the water groove (4) is less than the height of the card slot (3). When the edge part of the substrate body (1) is clamped in the card slot (3), the side wall of the substrate body (1) correspondingly seals the inner notch of the water groove (4), so that the water groove (4) forms a sealed groove structure in a circle. An inlet interface (5) corresponding to and communicating with the water groove (4) is arranged on the left side of the outer frame body (2), and an outlet interface (6) corresponding to and communicating with the water groove (4) is arranged on the right side of the outer frame body (2). Plug covers (7) are installed at both the inlet interface (5) and the outlet interface (6); the water body contacts the side wall of the substrate body (1) in the water groove (4) to absorb the heat generated by the substrate body (1).

2. The electronic ceramic substrate according to claim 1, wherein: A circle of flange parts (8) is also arranged at the upper and lower ends inside the outer frame body (2). The position of the flange parts (8) corresponds to the position of the card slot (3) inside the outer frame body (2). Waterproof pads (9) are arranged at the upper and lower ends of the card slot (3). Threaded holes (10) are arranged inside the flange parts (8), and threaded pressure rods (11) are installed in the threaded holes (10). The threaded pressure rods (11) are correspondingly screwed tightly in the threaded holes (10), and the waterproof pads (9) are correspondingly pressed against the outer edge of the substrate body (1).

3. An electronic ceramic substrate according to claim 1, characterized in that: The combination of the threaded pressure rods (11) and the threaded holes (10) is evenly arranged at intervals on the flange parts (8) of the outer frame body (2).

4. An electronic ceramic substrate according to claim 2, characterized in that: A U-shaped heat sink (12) is also sleeved on the outer frame body (2). The heat sink (12) is integrally sleeved from the outer side end of the outer frame body (2). A heat conducting rod (13) is installed inside the heat sink (12). The heat conducting rod (13) correspondingly passes through the side wall of the outer frame body (2) and extends into the water groove (4), and a water blocking piece (14) is installed at the rod end. The water blocking piece (14) is arranged in the water groove (4), and the size of the water blocking piece (14) is smaller than the size of the water groove (4).

5. An electronic ceramic substrate according to claim 4, characterized in that: The thickness of the heat sink (12) is adapted to the height dimension of the flange parts (8).

6. The electronic ceramic substrate according to claim 4, wherein: Uniform flow holes (15) are also arranged on the water blocking piece (14). The heat sink (12) is arranged in a whole section on the outer frame body (2), and uniform water blocking pieces (14) are installed on each section of the heat sink (12).

7. An electronic ceramic substrate according to claim 6, characterized in that: The part where the heat conducting rod (13) is inserted into the outer frame body (2) is waterproofed.

8. An electronic ceramic substrate according to claim 1, characterized in that: The outer frame body (2) is of an integrally formed structure.

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