Liquid cooling server and liquid cooling server cabinet

Abstract

According to the technical scheme, the liquid cooling server and the liquid cooling server cabinet are characterized in that the liquid cooling server comprises a cabinet body, and supporting plates are fixedly connected to the left side and the right side of the interior of the cabinet body; a plurality of server bodies, wherein the plurality of server bodies are movably arranged in the cabinet body in a sleeving manner; the two placing boxes are both arranged on one side of the cabinet body; the fixing part is arranged on one side of the placing box; when a worker places the two placing boxes on one side of the cabinet body, the two placing boxes can be fixed on one side of the cabinet body by using the fixing parts, and meanwhile, the placing boxes can be fixed on one sides of cabinet bodies with different sizes by using the fixing parts. Due to the fact that the two containing boxes can be fixed to the server cabinets of different sizes through the fixing parts, the heat conduction plate can directly conduct heat dissipation on a CPU in the server body after upgrading is completed, the situation that a manufacturer needs to replace the whole liquid cooling server cabinet is avoided, and therefore the server upgrading cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of servers, and in particular to a liquid-cooled server and a liquid-cooled server cabinet. Background Art

[0002] Server cabinets are usually used to integrally install panels, plugins, chassis, electronic components, devices, and mechanical parts to form an integrated installation box. In order to ensure the stable and reliable operation of electronic components, server cabinets generally use air-cooling devices for heat dissipation and use the entire cabinet for cooling.

[0003] For example, the Chinese patent with the publication number CN115190744B proposes a cabinet liquid-cooling device and a server cabinet. The component includes a rectangular frame, a vertical frame, a horizontal frame, a first liquid-cooling pipe spirally distributed on the vertical frame, a second liquid-cooling pipe fixed below the horizontal frame, and a communication module signal-connected to the cold source power output device. The first liquid-cooling pipe is in communication with the cold source power output device. The second liquid-cooling pipe is in communication with the cold source power output device, and the second liquid-cooling pipe is a coiled pipe. The communication module is connected to the temperature sensing device in the cabinet to adjust the operating state of the liquid-cooling medium in the first liquid-cooling pipe and the second liquid-cooling pipe through the device temperature of the device to be cooled. When the utilization rate of the cabinet is low, the liquid-cooling medium in the first liquid-cooling pipe and / or the second liquid-cooling pipe is circulated through the cold source power output device for cooling. While ensuring the cooling efficiency, energy consumption can also be reduced. However, in the actual application process of this solution, since most current server cabinets use air-cooling devices for heat dissipation, when the CPU and memory in the server cabinet are upgraded, the upgraded CPU will generate a large amount of heat, resulting in the inability of the air-cooling device to effectively dissipate heat from the upgraded CPU. If all are replaced with liquid-cooled server cabinets, the replacement and use cost of the server will be increased additionally. To solve the above problems, we propose a liquid-cooled server and a liquid-cooled server cabinet. Summary of the Invention

[0004] In view of the deficiencies of the prior art, the present invention provides a liquid-cooled server and a liquid-cooled server cabinet, which solve the problems mentioned in the background art.

[0005] The above technical objectives of the present invention are achieved through the following technical solutions:

[0006] A liquid-cooled server and a liquid-cooled server cabinet, comprising:

[0007] A cabinet body, wherein both the left and right sides inside the cabinet body are fixedly connected with support plates;

[0008] A plurality of server bodies, and a plurality of the server bodies are all movably sleeved inside the cabinet body;

[0009] Two placement boxes, both of the two placement boxes are arranged on one side of the cabinet body;

[0010] Two heat conduction plates, both of the two heat conduction plates are arranged inside the server body, and flow grooves are formed on the bottom surface of the heat conduction plate;

[0011] Liquid inlet hole, the liquid inlet hole is formed on the top surface of the heat conduction plate, and a liquid outlet hole is formed on the top surface of the heat conduction plate;

[0012] Heat absorption plate, the heat absorption plate is fixedly connected to the bottom surface of the heat conduction plate;

[0013] A fixing component arranged on one side of the placement box, used for fixing the two placement boxes;

[0014] A connecting component arranged on one side of the placement box, used for connecting the placement box and the heat conduction plate.

[0015] Preferably, the fixing component includes:

[0016] Fixing plate, the fixing plate is fixedly connected to one side of the placement box, a connecting block is fixedly connected to one side of the placement box, a rotating hole is formed on one side of the fixing plate, a connecting rod is rotatably installed inside the rotating hole, a threaded hole is formed on one side of the connecting block, the connecting rod is threadedly connected with the threaded hole, a plurality of mounting plates are fixedly connected to one side of the placement box, and an anti-slip pad is fixedly connected to one side of the mounting plate.

[0017] Preferably, the connecting component includes:

[0018] Liquid inlet pipe, the liquid inlet pipe is fixedly connected inside the liquid inlet hole, two fixing holes are formed on the top surface of the server body, a first flow control valve is fixedly connected inside the fixing hole, a first connecting pipe is fixedly connected to the top end of the first flow control valve, a plurality of mounting holes are formed on one side of the placement box, a first valve is fixedly connected inside the mounting hole, and one end of the first connecting pipe is fixedly connected with one end of the first valve;

[0019] A cooling component arranged on one side of the placement box, used for cooling the liquid.

[0020] Preferably, the cooling component includes:

[0021] A number of heat dissipation blocks, a number of the heat dissipation blocks are fixedly connected to one side of the placement box, a heat conduction hole is opened on one side of the heat dissipation block, a temperature conduction pipe is fixedly connected inside the heat conduction hole, a number of recovery holes are opened on one side of the placement box, a second valve is fixedly connected inside the recovery hole, one end of the temperature conduction pipe is fixedly sleeved with the second valve, a liquid outlet pipe is fixedly connected inside the liquid outlet hole, two collection holes are opened on the top surface of the server body, a second flow control valve is fixedly connected inside the collection hole, the liquid outlet pipe is fixedly sleeved with the second flow control valve, one end of the second flow control valve is fixedly connected with a second connecting pipe, and one end of the second connecting pipe is fixedly connected with one end of the temperature conduction pipe.

[0022] Preferably, a number of through holes are opened on one side inside the placement box, and a water pump is fixedly connected inside the through holes.

[0023] Preferably, two flow holes are opened on the bottom surface of the placement box, and an electromagnetic valve is fixedly connected inside the flow holes.

[0024] Preferably, placement holes are opened at the four corner positions on the bottom surface of the temperature conduction plate, screws are threadedly connected inside the placement holes, positioning grooves are opened at the four corner positions on the top surface of the temperature conduction plate, positioning blocks are movably sleeved inside the positioning grooves, two connecting plates are arranged on the top surface of the temperature conduction plate, the bottom surface of the connecting plate is fixedly connected with the top surfaces of the two positioning blocks, positioning holes are opened on the top surfaces of the connecting plate and the positioning blocks, and the screws are threadedly connected with the positioning holes.

[0025] Preferably, a number of heat absorption sheets are arranged on the bottom surface of the connecting plate, two limiting blocks are fixedly connected to the top surface of the heat absorption sheet, two limiting grooves are opened on one side of the connecting plate, the limiting blocks are movably sleeved with the limiting grooves, a threaded groove is opened on the top surface of the heat absorption sheet, a bolt is threadedly connected inside the threaded groove, a limiting hole is opened on the top surface of the connecting plate, and the bolt is movably sleeved with the limiting hole.

[0026] In summary, the present invention mainly has the following beneficial effects:

[0027] By setting up the cabinet body, after the staff place two placement boxes on one side of the cabinet body, the fixing components can be used to fix the two placement boxes on one side of the cabinet body at this time. At the same time, the placement boxes can be fixed on one side of cabinets of different sizes by using the fixing components. By setting up the heat conduction plate, after the staff fix the heat conduction plate inside the server body, the heat absorption plate can be attached to the CPU fixed inside the server body. The placement box and the heat conduction plate can be connected by using the connecting components, and then the placement box is connected to the water inlet and outlet of the cooler through pipelines respectively. At this time, the cooler can circulate and refrigerate the cooling water inside the placement box, so that the cooling water inside the placement box can absorb the heat of the heat absorption plate when flowing through the heat conduction plate, thus facilitating the heat absorption plate to cool the CPU later, thereby improving the heat dissipation efficiency of the server body. At the same time, if the manufacturer needs to upgrade the CPU inside the server body, since the two placement boxes can be fixed on server cabinets of different sizes through the fixing components, the heat conduction plate can directly dissipate heat from the CPU inside the server body after the upgrade, avoiding the manufacturer having to replace the entire liquid-cooled server cabinet, thus reducing the server upgrade cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a three-dimensional structural schematic diagram of the present invention;

[0029] Figure 2 is a structural schematic diagram of the heat dissipation block of the present invention;

[0030] Figure 3 is a structural schematic diagram of the heat conduction plate of the present invention;

[0031] Figure 4 is a structural schematic diagram of the fixing plate of the present invention;

[0032] Figure 5 is a structural schematic diagram of the connecting block of the present invention;

[0033] Figure 6 is a structural schematic diagram of the heat conduction pipe of the present invention;

[0034] Figure 7 is a structural schematic diagram of the placement box of the present invention;

[0035] Figure 8 is a structural schematic diagram of the heat absorption fin of the present invention.

[0036] Reference numerals: 1, cabinet body; 2, support plate; 3, server body; 4, placement box; 5, temperature guide plate; 6, flow groove; 7, liquid inlet hole; 8, liquid outlet hole; 9, heat absorption plate; 10, fixing plate; 11, connecting block; 12, rotation hole; 13, connecting rod; 14, threaded hole; 15, mounting plate; 16, anti-slip pad; 17, liquid inlet pipe; 18, fixing hole; 19, first flow control valve; 20, first connecting pipe; 21, mounting hole; 22, first valve; 23, heat dissipation block; 24, heat conduction hole; 25, temperature guide pipe; 26, recovery hole; 27, second valve; 28, liquid outlet pipe; 29, collection hole; 30, second flow control valve; 31, second connecting pipe; 32, through hole; 33, water pump; 34, flow hole; 35, solenoid valve; 36, placement hole; 37, screw; 38, positioning groove; 39, connecting plate; 40, positioning hole; 41, heat absorption fin; 42, limiting block; 43, limiting groove; 44, threaded groove; 45, bolt; 46, limiting hole; 47, positioning block. Detailed implementation manners

[0037] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0038] Refer to Figures 1 - 8 , a liquid-cooled server and a liquid-cooled server cabinet, including:

[0039] The cabinet body 1, and support plates 2 are fixedly connected to both the left and right sides inside the cabinet body 1;

[0040] A plurality of server bodies 3, and a plurality of server bodies 3 are all movably sleeved inside the cabinet body 1;

[0041] Two placement boxes 4, both of the two placement boxes 4 are arranged on one side of the cabinet body 1, and a partition is fixedly connected inside the placement box 4, so that there are two cavities inside the placement box 4, namely a liquid inlet cavity and a liquid outlet cavity;

[0042] Two temperature guide plates 5, both of the two temperature guide plates 5 are arranged inside the server body 3, and a flow groove 6 is opened on the bottom surface of the temperature guide plate 5;

[0043] The liquid inlet hole 7, the liquid inlet hole 7 is opened on the top surface of the temperature guide plate 5, and the liquid outlet hole 8 is opened on the top surface of the temperature guide plate 5;

[0044] The heat absorption plate 9, the heat absorption plate 9 is fixedly connected to the bottom surface of the temperature guide plate 5, both the temperature guide plate 5 and the heat absorption plate 9 are made of copper, so that the heat absorption plate 9 and the temperature guide plate 5 have good thermal conductivity, and thermal conductive silicone grease is applied to the contact surface between the heat absorption plate 9 and the CPU;

[0045] A fixing component arranged on one side of the placement box 4 for fixing two placement boxes 4;

[0046] A connecting component arranged on one side of the placement box 4 for connecting the placement box 4 with the heat conduction plate 5;

[0047] By setting the cabinet body 1, when the staff places two placement boxes 4 on one side of the cabinet body 1, at this time, the fixing component can be used to fix the two placement boxes 4 on one side of the cabinet body 1. At the same time, by using the fixing component, the placement box 4 can be fixed on one side of the cabinet body 1 with different sizes. By setting the heat conduction plate 5, when the staff fixes the heat conduction plate 5 inside the server body 3, the heat absorption plate 9 can be attached to the CPU fixed inside the server body 3. By using the connecting component, the placement box 4 can be connected with the heat conduction plate 5, and then the placement box 4 is connected with the water inlet and outlet of the cooler through pipes respectively. At this time, the cooler can circulate and refrigerate the cooling water inside the placement box 4, so that the cooling water inside the placement box 4 can absorb the heat of the heat absorption plate 9 when flowing through the heat conduction plate 5, thus facilitating the heat absorption plate 9 to cool the CPU later, thereby improving the heat dissipation efficiency of the server body 3. At the same time, if the manufacturer needs to upgrade the CPU inside the server body 3, since the two placement boxes 4 can be fixed on server cabinets with different sizes through the fixing component, the heat conduction plate 5 can directly dissipate heat from the CPU inside the server body 3 after the upgrade, avoiding the manufacturer having to replace the entire liquid-cooled server cabinet, thereby reducing the server upgrade cost.

[0048] As a further solution of the present invention, the fixing component includes:

[0049] A fixing plate 10, the fixing plate 10 is fixedly connected to one side of the placement box 4. A connecting block 11 is fixedly connected to one side of the placement box 4. A rotating hole 12 is opened on one side of the fixing plate 10. A connecting rod 13 is rotatably installed inside the rotating hole 12. Threads are provided on the outer wall surface of the connecting rod 13. A threaded hole 14 is opened on one side of the connecting block 11. The connecting rod 13 is threadedly connected with the threaded hole 14. A plurality of mounting plates 15 are fixedly connected to one side of the placement box 4. An anti-slip pad 16 is fixedly connected to one side of the mounting plate 15;

[0050] By setting the placement box 4, when the staff places two placement boxes 4 on one side of the cabinet body 1 and then threadedly connects the connecting rod 13 with the threaded hole 14, it is convenient to adjust the distance between the two placement boxes 4 later, so that the placement box 4 and the mounting plate 15 can be used in cooperation to clamp the outside of the cabinet body 1 with different sizes, thus facilitating the heat dissipation and cooling of the server equipment installed inside the cabinet body 1 later.

[0051] As a further solution of the present invention, the connecting component includes:

[0052] The liquid inlet pipe 17 is fixedly connected inside the liquid inlet hole 7. Two fixing holes 18 are provided on the top surface of the server body 3. A first flow control valve 19 is fixedly connected inside the fixing hole 18. The top end of the first flow control valve 19 is fixedly connected with a first connecting pipe 20. A plurality of mounting holes 21 are provided on one side of the placement box 4. A first valve 22 is fixedly connected inside the mounting hole 21. One end of the first connecting pipe 20 is fixedly connected to one end of the first valve 22;

[0053] A cooling member provided on one side of the placement box 4 for cooling the liquid;

[0054] By providing the liquid inlet pipe 17, after the staff connects the water inlet and outlet of the cooler to the placement box 4 respectively, the cooled water inside the cooler can enter the liquid inlet cavity of the placement box 4. When positive pressure is generated in the cooling water inside the placement box 4, at this time, the cooling water inside the placement box 4 can enter the inside of the flow groove 6 through the first valve 22 and the first connecting pipe 20, so that the cooling water can absorb the heat on the surface of the heat absorption plate 9.

[0055] As a further solution of the present invention, the cooling member includes:

[0056] A plurality of heat dissipation blocks 23 are all fixedly connected to one side of the placement box 4. A heat conduction hole 24 is provided on one side of the heat dissipation block 23. A temperature conduction pipe 25 is fixedly connected inside the heat conduction hole 24. The heat dissipation block 23 and the temperature conduction pipe 25 can be made of copper or the staff can reasonably select materials according to the actual situation. A plurality of recovery holes 26 are provided on one side of the placement box 4. A second valve 27 is fixedly connected inside the recovery hole 26. One end of the temperature conduction pipe 25 is fixedly sleeved with the second valve 27. An outlet pipe 28 is fixedly connected inside the liquid outlet hole 8. Two collection holes 29 are provided on the top surface of the server body 3. A second flow control valve 30 is fixedly connected inside the collection hole 29. The outlet pipe 28 is fixedly sleeved with the second flow control valve 30. One end of the second flow control valve 30 is fixedly connected with a second connecting pipe 31. One end of the second connecting pipe 31 is fixedly connected to one end of the temperature conduction pipe 25;

[0057] By providing the outlet pipe 28, after the cooling water absorbs the heat on the surface of the heat absorption plate 9, it can flow out through the outlet pipe 28. At this time, the cooling water with heat can enter the inside of the temperature conduction pipe 25 through the second connecting pipe 31, so that the temperature conduction pipe 25 can transfer part of the heat inside the cooling water to the inside of the heat dissipation block 23, so that the cooling water can be preliminarily cooled. The preliminarily cooled cooling water can enter the liquid outlet cavity of the placement box 4 through the second valve 27. At this time, the cooler can cool the preliminarily cooled cooling water in the liquid outlet cavity, thereby improving the cooling rate of the cooler for the cooling water.

[0058] As a further solution of the present invention, a plurality of through holes 32 are formed on one side inside the placement box 4, and a water pump 33 is fixedly connected inside the through holes 32;

[0059] By arranging the water pump 33, when an accident occurs to the outdoor cooler or maintenance is required, after the water pump 33 is turned on, the coolant in the liquid outlet cavity inside the placement box 4 can directly enter the liquid inlet cavity, so that the CPU inside the server body 3 can work temporarily for a period of time under high temperature conditions, avoiding the server body 3 from being unable to be used normally after an accident occurs to the cooler. At the same time, since the heat dissipation block 23 is aligned with the air outlet of the heat dissipation fan of the power supply or solid-state drive inside the server body 3, the gas flowing out inside the server body 3 can take away part of the heat of the heat dissipation block 23, so that the heat dissipation block 23 can continuously perform preliminary cooling on the coolant after an accident occurs to the cooler, enabling the CPU to be used normally at a low frequency.

[0060] As a further solution of the present invention, two flow holes 34 are formed on the bottom surface of the placement box 4, and a solenoid valve 35 is fixedly connected inside the flow holes 34;

[0061] By arranging the solenoid valve 35, after the staff fixedly sleeved the water inlet and outlet of the outdoor cooler with the two solenoid valves 35 respectively using pipes, the cooler can circulate and cool part of the cooling water inside the placement box 4.

[0062] As a further solution of the present invention, placement holes 36 are formed at the four corner positions on the bottom surface of the heat conduction plate 5, and the four placement holes 36 respectively correspond to the installation hole positions of the server main board. Screws 37 are threadedly connected inside the placement holes 36. Positioning grooves 38 are formed at the four corner positions on the top surface of the heat conduction plate 5, and positioning blocks 47 are movably sleeved inside the positioning grooves 38. Two connecting plates 39 are arranged on the top surface of the heat conduction plate 5, the bottom surface of the connecting plates 39 is fixedly connected to the top surface of the two positioning blocks 47, positioning holes 40 are formed on the top surface of the connecting plates 39 and the top surface of the positioning blocks 47, and the screws 37 are threadedly connected to the positioning holes 40;

[0063] By arranging the screws 37, after the staff places the heat conduction plate 5 on the top surface of the CPU and then aligns the screws 37 with the installation hole positions of the server main board, it is convenient to fix the heat conduction plate 5 inside the server body 3 later.

[0064] As a further solution of the present invention, a plurality of heat absorbing fins 41 are provided on the bottom surface of the connecting plate 39. The connecting plate 39 and the heat absorbing fins 41 can be made of copper. Two limiting blocks 42 are fixedly connected to the top surface of the heat absorbing fins 41. Two limiting grooves 43 are formed on one side of the connecting plate 39. The limiting blocks 42 and the limiting grooves 43 are movably sleeved together. A threaded groove 44 is formed on the top surface of the heat absorbing fins 41. A bolt 45 is threadedly connected inside the threaded groove 44. A limiting hole 46 is formed on the top surface of the connecting plate 39. The bolt 45 and the limiting hole 46 are movably sleeved together. Heat conductive silicone sheets are pasted on the top surface of one side of the heat absorbing fins 41 and the bottom surface of the connecting plate 39;

[0065] By providing the heat absorbing fins 41, after adjusting the position of the heat absorbing fins 41, the heat absorbing fins 41 can be attached to one side of the memory module, so that the heat absorbing fins 41 can absorb the heat on the memory module and transfer it to the heat conducting plate 5 through the connecting plate 39, thereby reducing the working temperature of the memory module during operation.

[0066] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A liquid-cooled server and a liquid-cooled server cabinet, characterized in that, Including: A cabinet body (1), with support plates (2) fixedly connected to both the left and right sides inside the cabinet body (1); A number of server bodies (3), with a number of the server bodies (3) all movably sleeved inside the cabinet body (1); Two placement boxes (4), with both of the placement boxes (4) arranged on one side of the cabinet body (1); Two heat conduction plates (5), with both of the heat conduction plates (5) arranged inside the server body (3), and a flow groove (6) opened on the bottom surface of the heat conduction plate (5); A liquid inlet hole (7), with the liquid inlet hole (7) opened on the top surface of the heat conduction plate (5), and a liquid outlet hole (8) opened on the top surface of the heat conduction plate (5); A heat absorption plate (9), with the heat absorption plate (9) fixedly connected to the bottom surface of the heat conduction plate (5); A fixing component arranged on one side of the placement box (4) for fixing the two placement boxes (4); A connecting component arranged on one side of the placement box (4) for connecting the placement box (4) to the heat conduction plate (5).

2. The liquid-cooled server and the liquid-cooled server cabinet according to claim 1, characterized in that, The fixing component includes: A fixing plate (10), with the fixing plate (10) fixedly connected to one side of the placement box (4), a connecting block (11) fixedly connected to one side of the placement box (4), a rotating hole (12) opened on one side of the fixing plate (10), a connecting rod (13) rotatably installed inside the rotating hole (12), a threaded hole (14) opened on one side of the connecting block (11), the connecting rod (13) being threadedly connected to the threaded hole (14), a number of mounting plates (15) fixedly connected to one side of the placement box (4), and an anti-slip pad (16) fixedly connected to one side of the mounting plate (15).

3. The liquid-cooled server and the liquid-cooled server cabinet according to claim 1, wherein The connecting component includes: A liquid inlet pipe (17), with the liquid inlet pipe (17) fixedly connected inside the liquid inlet hole (7), two fixing holes (18) opened on the top surface of the server body (3), a first flow control valve (19) fixedly connected inside the fixing hole (18), a first connecting pipe (20) fixedly connected to the top end of the first flow control valve (19), a number of mounting holes (21) opened on one side of the placement box (4), a first valve (22) fixedly connected inside the mounting hole (21), and one end of the first connecting pipe (20) fixedly connected to one end of the first valve (22); A cooling component arranged on one side of the placement box (4) for cooling the liquid.

4. The liquid-cooled server and the liquid-cooled server cabinet according to claim 3, wherein, The cooling component includes: A plurality of heat dissipation blocks (23), and a plurality of the heat dissipation blocks (23) are fixedly connected to one side of the placement box (4). A heat conduction hole (24) is formed in one side of the heat dissipation block (23), and a heat conduction pipe (25) is fixedly connected inside the heat conduction hole (24). A plurality of recovery holes (26) are formed in one side of the placement box (4), and a second valve (27) is fixedly connected inside the recovery hole (26). One end of the heat conduction pipe (25) is fixedly sleeved with the second valve (27). An outlet pipe (28) is fixedly connected inside the liquid outlet hole (8). Two collection holes (29) are formed in the top surface of the server body (3), and a second flow control valve (30) is fixedly connected inside the collection hole (29). The outlet pipe (28) is fixedly sleeved with the second flow control valve (30). One end of the second flow control valve (30) is fixedly connected to a second connecting pipe (31), and one end of the second connecting pipe (31) is fixedly connected to one end of the heat conduction pipe (25).

5. A liquid-cooled server and a liquid-cooled server cabinet according to claim 1, wherein A plurality of through holes (32) are formed in one side inside the placement box (4), and a water pump (33) is fixedly connected inside the through holes (32).

6. The liquid-cooled server and the liquid-cooled server cabinet according to claim 1, characterized in that, Two flow holes (34) are formed in the bottom surface of the placement box (4), and an electromagnetic valve (35) is fixedly connected inside the flow holes (34).

7. A liquid-cooled server and a liquid-cooled server cabinet according to claim 1, characterized in that, Placement holes (36) are formed at the four corner positions of the bottom surface of the heat conduction plate (5), and screws (37) are threadedly connected inside the placement holes (36). Positioning grooves (38) are formed at the four corner positions of the top surface of the heat conduction plate (5), and positioning blocks (47) are movably sleeved inside the positioning grooves (38). Two connecting plates (39) are arranged on the top surface of the heat conduction plate (5), the bottom surface of the connecting plate (39) is fixedly connected to the top surfaces of the two positioning blocks (47), positioning holes (40) are formed in the top surfaces of the connecting plate (39) and the positioning blocks (47), and the screws (37) are threadedly connected to the positioning holes (40).

8. A liquid-cooled server and a liquid-cooled server cabinet according to claim 7, characterized in that, A plurality of heat absorption fins (41) are arranged on the bottom surface of the connecting plate (39), two limiting blocks (42) are fixedly connected to the top surface of the heat absorption fin (41), two limiting grooves (43) are formed in one side of the connecting plate (39), the limiting blocks (42) are movably sleeved with the limiting grooves (43), a threaded groove (44) is formed in the top surface of the heat absorption fin (41), a bolt (45) is threadedly connected inside the threaded groove (44), a limiting hole (46) is formed in the top surface of the connecting plate (39), and the bolt (45) is movably sleeved with the limiting hole (46).

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