Display device

Abstract

According to an aspect of the present disclosure, a display device includes: a substrate including a display area and a non-display area; an organic light emitting diode disposed on the substrate; an encapsulation layer disposed on the organic light emitting diode; a touch sensing unit disposed on the encapsulation layer within the display area; a plurality of touch pads disposed within the non-display area; a plurality of touch link lines disposed within the non-display area, each touch link line electrically connecting the touch sensing unit and at least one touch pad of the plurality of touch pads; and an electrostatic discharge circuit disposed within the non-display area and connected to the plurality of touch link lines. In this case, since the electrostatic discharge circuit is connected to the plurality of touch link lines, static electricity accumulated in the touch sensing unit is easily discharged to the outside, thereby suppressing electrostatic defects.

Description

[0001] This application is a divisional application of a patent application for an invention named "Display Device" with the application number 202211271005.9, the application date of October 17, 2022.

[0002] Cross-reference to related applications

[0003] This application claims priority to Korean Patent Application No. 10-2021-0153946, filed with the Korean Intellectual Property Office on November 10, 2021, the disclosure of which is incorporated herein by reference. Technical field

[0004] The present disclosure relates to a display device, and more particularly, to a display device capable of suppressing electrostatic defects. Background art

[0005] A display device that displays various information on a screen is a key technology in the information and communication era and has been developed in the direction of being thinner, lighter, more portable, and higher performance. Therefore, an organic light-emitting display device that displays an image by controlling the amount of light emitted from an organic light-emitting diode or a similar technology has received attention.

[0006] An organic light-emitting diode is a self-luminous element that uses a thin light-emitting layer located between two electrodes and has the advantage of being thinner than a backlight display. A general organic light-emitting display device has a structure in which a pixel driving circuit and an organic light-emitting diode are formed on a substrate, and an image is displayed when light emitted from the organic light-emitting diode passes through the substrate or a barrier layer.

[0007] A display device can receive user instructions through various input devices. Among them, a touch input device through which a user can intuitively and conveniently input instructions by touching the display device has been widely used. A touch input device may also be referred to as a touch sensor or a touch sensing unit because it senses the coordinates of the position where a touch input is made. For example, when a user makes a touch, static electricity may flow into the touch sensing unit together with the user's touch, and the static electricity tends to flow along a touch electrode or a link line of the touch sensing unit. The static electricity flowing along the touch electrode or the link line due to the user's touch may damage the display device due to overvoltage or overcurrent. Summary of the invention

[0008] One object to be achieved by the present disclosure is to provide a display device capable of suppressing electrostatic defects by discharging static electricity to the outside.

[0009] Another object to be achieved by the present disclosure is to provide a display device capable of improving touch sensitivity by protecting internal components and touch link lines from the influence of static electricity.

[0010] The object of the present disclosure is not limited to the above object, and those skilled in the art can clearly understand other objects not mentioned above according to the following description.

[0011] According to an aspect of the present disclosure, a display device includes: a substrate including a display area and a non-display area; an organic light-emitting diode disposed on the substrate; a package layer disposed on the organic light-emitting diode; a touch sensing unit disposed on the package layer within the display area; a plurality of touch pads disposed within the non-display area; a plurality of touch link lines disposed within the non-display area, and each touch link line electrically connects the touch sensing unit and at least one of the plurality of touch pads; and an electrostatic discharge circuit disposed within the non-display area and connected to the plurality of touch link lines. In this case, since the electrostatic discharge circuit is connected to the plurality of touch link lines, the static electricity accumulated in the touch sensing unit is easily discharged to the outside, thereby suppressing static electricity defects.

[0012] Details of other aspects are included in the detailed description section and the drawings.

[0013] According to another aspect of the present disclosure, a display device includes: a substrate including a display area and a non-display area; a touch sensing unit including a touch electrode and a connection electrode; a touch link line disposed within the non-display area and electrically connected to the touch sensing unit; a touch pad disposed within the non-display area; and an electrostatic discharge circuit disposed within the non-display area, wherein the touch link line is electrically connected to the touch pad through the electrostatic discharge circuit.

[0014] According to the present disclosure, an electrostatic discharge circuit dedicated to a touch sensing unit is implemented in a display device to remove static electricity that may be generated during the manufacturing process and the touch input process, thereby suppressing damage caused by static electricity.

[0015] The present disclosure prevents loss of touch sensitivity of a display device and improves reliability by discharging static electricity that may be generated in the touch electrode and the touch link line.

[0016] The effects according to the present disclosure are not limited to the above-exemplified contents, and the present specification also includes more various effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and other aspects, features, and other advantages of the present disclosure can be more clearly understood from the following detailed description in conjunction with the drawings, wherein:

[0018] Figure 1 is a plan view schematically depicting a display device according to an aspect of the present disclosure;

[0019] Figure 2It is a diagram for schematically showing a touch sensing unit of a display device according to an aspect of the present disclosure;

[0020] Figure 3 It is a circuit diagram showing the configuration of an electrostatic discharge circuit of a display device according to an aspect of the present disclosure;

[0021] Figure 4 It is according to an aspect of the present disclosure Figure 2 an enlarged view of region A of; and

[0022] Figure 5 It is according to Figure 4 a schematic partial cross-sectional view of a display device taken along line V-V' of and a display area of a display device according to an aspect of the present disclosure. Detailed Description

[0023] Advantages and features of the present disclosure and methods for achieving these advantages and features will become clear by referring to multiple aspects of the following detailed description and in conjunction with the accompanying drawings. However, the present disclosure is not limited to the multiple aspects disclosed herein, but will be implemented in various forms. The provided multiple aspects are only examples to enable those skilled in the art to fully understand the disclosure content of the present disclosure and the scope of the present disclosure. Therefore, the present disclosure will be defined only by the scope of the appended claims.

[0024] The shapes, sizes, ratios, angles, quantities, etc. shown in the drawings for describing multiple aspects of the present disclosure are only examples, and the present disclosure is not limited thereto. Throughout the specification, the same reference numerals generally indicate the same elements. In addition, in the following description of the present disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "comprising", "having", and "consisting of" used herein generally intend to allow the addition of other components, unless these terms are used together with the term "only". Unless otherwise clearly stated, any reference to the singular may include the plural.

[0025] Even if not clearly stated, components are interpreted to include ordinary error ranges.

[0026] When terms such as "on", "above", "below", and "adjacent" are used to describe the positional relationship between two components, unless these terms are used together with the term "immediately" or "directly", one or more components may be located between these two components.

[0027] When an element or layer is provided "on" another element or layer, other layers or other elements may be directly interposed on the other element or between them.

[0028] Although terms such as "first", "second", etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, the first component mentioned below may be the second component in the technical concept of the present disclosure.

[0029] Throughout the specification, the same reference numerals generally indicate the same elements.

[0030] The size and thickness of each component shown in the drawings are shown for convenience of description, and the present disclosure is not limited to the size and thickness of the components shown.

[0031] The features of various aspects of the present disclosure may be attached to or combined with each other in part or in whole, and may be interlocked and operated in various ways technically, and these aspects may be executed independently of each other or in association with each other.

[0032] Hereinafter, a display device according to various aspects of the present disclosure will be described in detail with reference to the drawings.

[0033] Figure 1 is a schematic plan view of a display device according to an aspect of the present disclosure. In Figure 1 For convenience of description, only the substrate 101 of various components of the display device 100 is shown.

[0034] Refer to Figure 1 , the display device 100 includes a display area AA and a non-display area NA.

[0035] The display area AA is an area where a plurality of pixels are provided to display an image. A display unit for displaying an image and a circuit unit for driving the display unit may be formed in the display area AA. For example, when the display device 100 is an organic light emitting display device, the display unit may include an organic light emitting diode. That is, the display unit may include an anode, an organic layer located on the anode, and a cathode located on the organic layer. The organic layer may include, for example, a hole transport layer, a hole injection layer, an organic light emitting layer, an electron injection layer, and an electron transport layer. However, when the display device 100 is a liquid crystal display device, the display unit may also be configured to include a liquid crystal layer. Hereinafter, for convenience of description, it is assumed that the display device 100 is an organic light emitting display device, but the present disclosure is not limited thereto. The circuit unit may include various transistors, capacitors, and lines for driving the organic light emitting diode. For example, the circuit unit may include various components such as a driving transistor, a switching transistor, a storage capacitor, a gate line, a data line, etc., but is not limited thereto.

[0036] The non-display area NA is an area where an image is not displayed, and is an area where lines, circuits, etc. for driving display units provided in the display area AA are provided. In addition, various integrated circuits (ICs), such as gate driver ICs and data driver ICs, and chip-on-film (COF) with a driving circuit provided therein, flexible printed circuit boards (FPCBs), etc. can be provided in the non-display area NA.

[0037] The non-display area NA can be defined as an area extending from the display area AA, as Figure 1 shown. However, the present disclosure is not limited thereto, and the non-display area NA can be defined as including an area surrounding the display area AA. In addition, the non-display area NA can also be defined as extending from multiple sides of the display area AA.

[0038] Referring to Figure 1 , the non-display area NA includes a first non-display area NA1, a bending area BA, a second non-display area NA2, a pad area PA, and a third non-display area NA3. The first non-display area NA1 is an area extending from the display area AA, and the bending area BA is an area extending from the first non-display area NA1 and can be bendable. The second non-display area NA2 is an area extending from the bending area BA, and the pad area PA is an area extending from the second non-display area NA2 and can be provided with a plurality of pads PD. The third non-display area NA3 is an area surrounding the display area AA together with the first non-display area NA1, and can also be provided with a driving circuit such as gate-in-panel (GIP), etc.

[0039] A plurality of data lines and touch sensing units are provided in the display area AA, and a plurality of data lines and a plurality of chain lines LL connected to the touch sensing units are provided in the non-display area NA.

[0040] The plurality of chain lines LL transmit signals from driving circuits, gate driver ICs, data driver ICs, touch driving circuits, etc., and these driving circuits can be provided in the non-display area NA, or can be provided on a separate flexible film connected to the lines provided in the display area AA. Referring to Figure 1 , the plurality of chain lines LL can include a plurality of data chain lines and a plurality of touch chain lines 135. However, the plurality of chain lines LL is not limited thereto, and can include a plurality of gate chain lines and chain lines that can be connected to various lines, such as high-potential voltage lines and low-potential voltage lines.

[0041] The plurality of data chain lines transmit signals from the pads PD and the driving IC COP to the data lines in the display area AA. That is, the plurality of data chain lines are respectively connected to the plurality of pads PD and the plurality of data lines. Therefore, the plurality of data chain lines can transmit data voltages to the plurality of data lines.

[0042] A plurality of data link routes are provided between the pad region PA and the display region AA, and may be centrally provided in a part of the non-display region NA extending from one side of the display region AA, as Figure 1 shown, but not limited thereto. The plurality of data link routes include a first line LLA provided in the first non-display region NA1, a data bending pattern BP provided in the bending region BA, and a second line LLB provided in the second non-display region NA2.

[0043] The first line LLA of the data link route may extend from the data line of the display region AA and be provided in the first non-display region NA1. The first line LLA may be connected to the data bending pattern BP and may transmit a signal transmitted to the data bending pattern BP to the data line of the display region AA.

[0044] The data bending pattern BP of the data link route is provided in the bending region BA. As described above, the bending region BA is a region extending from the first non-display region NA1 and is a region bent in the bending direction on the final product. Therefore, the data bending pattern BP may be formed in a pattern having a specific shape to minimize stress and cracks (e.g., electrical interruption) that may occur in the data link route in the bending region BA. For example, the data bending pattern BP may be a pattern in which at least one of a square shape, a diamond shape, a zigzag shape, and a circular shape is repeatedly provided. However, the present disclosure is not limited thereto, and the shape of the data bending pattern BP may be various shapes to minimize stress and cracks on the data link route.

[0045] In Figure 1 it is shown that the data bending pattern BP is only provided in the bending region BA, but the present disclosure is not limited thereto. The data bending pattern BP may even be provided in partial regions on the first non-display region NA1 and the second non-display region NA2 other than the bending region BA. For example, the data bending pattern BP may also be provided on a part of the first non-display region NA1 and a part of the second non-display region NA2 adjacent to the bending region BA.

[0046] The second line LLB of the data link route may extend from the data bending pattern BP in the bending region BA and be provided in the second non-display region NA2. The second line LLB may be provided between the data bending pattern BP and the pad PD to transmit a signal. In addition, referring to Figure 1 since the driving IC COP is provided in the second non-display region NA2, the driving IC COP may be connected to the second line LLB. A data signal may be provided to the data line through the driving IC COP, and the second line LLB is used to transmit the signal.

[0047] The data link lines can be formed of a conductive material, and can be formed of a conductive material having excellent ductility to minimize cracks that occur when the flexible substrate 101 is bent. For example, the first data link line LLA and the second data link line LLB can be formed of one of various materials used to manufacture the organic light-emitting diodes in the display area AA and the gate electrodes, source electrodes, and drain electrodes of the transistors, and can be configured as a single layer or multiple layers. Specifically, the first data link line LLA and the second data link line LLB can be formed of an alloy of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), silver (Ag), and magnesium (Mg), etc.

[0048] A plurality of touch link lines 135 transmit signals from the pads PD to the touch sensing unit in the display area AA. That is, the plurality of touch link lines 135 connect each of the plurality of touch pads to each of the touch electrodes of the touch sensing unit. Therefore, the plurality of touch link lines 135 can transmit touch voltages to the plurality of touch electrodes.

[0049] The plurality of touch link lines 135 are also arranged between the pad area PA and the display area AA like the plurality of data link lines. Referring Figure 1 , the plurality of touch link lines 135 can be divided into two groups and arranged adjacent to both sides of the plurality of data link lines, but the present disclosure is not limited thereto. The plurality of touch link lines 135 can include a first touch link line 135-1 disposed in the first non-display area NA1, a touch bending pattern BP' disposed in the bending area BA, and a second touch link line 135-2 disposed in the second non-display area NA2.

[0050] The first touch link line 135-1 of the touch link line 135 can extend from the touch sensing unit in the display area AA and is disposed in the first non-display area NA1. The first touch link line 135-1 can be connected to the touch bending pattern BP' and can transmit the signal transmitted to the touch bending pattern BP' to the touch electrodes in the display area AA.

[0051] The touch bending pattern BP' of the touch link line 135 is disposed in the bending area BA. Similar to the data bending pattern BP of the data link line, the touch bending pattern BP' can be formed in a pattern having a specific shape to minimize stress and cracks in the touch link lines 135 in the bending area BA. For example, the touch bending pattern BP' can be a pattern in which at least one of a square shape, a diamond shape, a zigzag shape, and a circular shape is repeatedly provided. However, the present disclosure is not limited thereto, and the shape of the touch bending pattern BP' can be various shapes to minimize stress and cracks in the touch link lines 135.

[0052] Figure 1It is shown that the touch bending pattern BP' is only set within the bending area BA, but the present disclosure is not limited thereto. Similar to the data bending pattern BP of the data link route, the touch bending pattern BP' can also be set in partial areas of the first non-display area NA1 and partial areas of the second non-display area NA2.

[0053] The second touch link route 135-2 of the touch link route 135 can extend from the touch bending pattern BP' in the bending area BA and be set within the second non-display area NA2. The second touch link route 135-2 can be set between the touch bending pattern BP' and the touch pad to transmit signals. In addition, referring to Figure 1 , since the electrostatic discharge circuit ESD is set within the second non-display area NA2, the electrostatic discharge circuit ESD can be connected to the second touch link route 135-2. By discharging the static electricity that may be generated in the touch sensing unit via the electrostatic discharge circuit ESD, damage caused by static electricity can be suppressed.

[0054] The touch link route 135 can be made of the same material as the touch electrode, or can be made of a conductive material different from the touch electrode. For example, the touch link route 135 can be formed of a metal with low resistance. Example materials of the touch link route include molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), silver (Ag), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys. In addition, if the touch link route 135 is made of the same material as the touch electrode, the touch link route 135 can be made of a transparent conductive material, such as indium tin oxide (ITO) or indium zinc oxide (IZO), but is not limited thereto.

[0055] In addition to the multiple link routes LL, multiple pads PD can be set in the non-display area NA as described above. The multiple pads PD are set in the pad area PA, and the pad area PA is an area extending from the second non-display area NA2. The multiple pads PD can include data pads, touch pads, and so on. In addition, the multiple pads PD can be connected to the multiple link routes LL.

[0056] The driving IC COP can be set in the non-display area NA. Referring to Figure 1 , the driving IC COP can be set in the second non-display area NA2. The driving IC COP includes a data driving IC, a gate driving IC, etc. that provide data signals to the data lines arranged on the substrate 101. That is, the driving IC COP can be connected to multiple gate link routes and multiple data link routes. Figure 1 A simplified style of the data driving IC is shown for illustrative purposes, and the present disclosure is not limited thereto. The driving IC can be installed on the substrate by the chip on plastic (COP) method. Referring to Figure 1, the driving IC COP can be disposed between the bending region BA and the pad region PA. Accordingly, when the bending region BA is bent, the driving IC COP can be bent together with connection interfaces such as the pad PD and is positioned at the rear side of the display device 100.

[0057] In addition, the electrostatic discharge circuit ESD is configured to minimize damage from static electricity and can be disposed within the non-display region NA. Refer to Figure 1 , the electrostatic discharge circuit ESD can be disposed within the second non-display region NA2. The electrostatic discharge circuit ESD can be configured to be connected to the touch link line 135. The electrostatic discharge circuit ESD is disposed between the bending region BA and the pad region PA such that a part of the non-display region NA is folded toward the rear surface of the display device 100 to minimize the non-display region such as the pad region PA, but is not limited thereto. In addition, the electrostatic discharge circuit ESD can be disposed adjacent to both sides of the driving IC COP, but is not limited thereto, and can be disposed at various positions. The electrostatic discharge circuit ESD will be described in more detail with reference to Figure 3 and Figure 5 below.

[0058] Figure 2 is a diagram schematically showing a touch sensing unit applied to a display device according to an aspect of the present disclosure. In Figure 2 , among various components of the display device 100, for the purpose of description, only the substrate 101, the touch sensing unit 130, the touch link line 135, the electrostatic discharge circuit ESD, and the plurality of pads PD are shown.

[0059] The touch sensing unit 130 is disposed within the display region AA. The touch sensing unit 130 includes a plurality of touch electrodes 134 and touch connection electrodes 132. The plurality of touch electrodes 134 may include a first touch electrode 134-1 and a second touch electrode 134-2. The outer shapes of the first touch electrode 134-1 and the second touch electrode 134-2 may correspond to a specific shape. For example, as Figure 2 shown, the outer shapes of the first touch electrode 134-1 and the second touch electrode 134-2 may have a grid pattern including a plurality of diamond shapes. The first touch electrode 134-1 and the second touch electrode 134-2 may be made of metal or may be made of a transparent conductive material such as ITO or IZO, but are not limited thereto. The first touch electrode 134-1 and the second touch electrode 134-2 may be disposed on the same layer. However, within the region where the first touch electrode 134-1 and the second touch electrode 134-2 intersect, the first touch electrode 134-1 may be separated and the first touch electrode 134-1 may be connected to each other through the touch connection electrode 132. Below will be described with reference to Figure 5A more detailed description will be given of the first touch electrode 134-1, the second touch electrode 134-2, and the touch connection electrode 132.

[0060] The non-display area NA is an area surrounding the display area AA, and is provided with a plurality of touch chain lines 135, an electrostatic discharge circuit ESD, and a plurality of pads PD.

[0061] Each of the plurality of touch chain lines 135 electrically connects each of the plurality of touch electrodes 134-1 and 134-2 disposed in the display area AA to the pad PD in the non-display area NA. In one example, the touch chain line 135 can be made of a low-resistance metal material, and when the touch chain line 135 is made of a low-resistance conductive material, the resistance can be reduced, and the corresponding resistance-capacitance (RC) delay can be reduced.

[0062] The plurality of pads PD can include touch pads and drive display pads. Only the touch pad is shown in Figure 2 , but the present disclosure is not limited thereto. One end of the touch pad is connected to the touch chain line 135, and the other end is electrically connected to an external circuit to receive a touch signal from the external circuit or transmit a touch sensing signal to the external circuit.

[0063] Meanwhile, referring to Figure 2 , the electrostatic discharge circuit ESD can be disposed in the middle of the touch chain line 135. The electrostatic discharge circuit ESD can be disposed between the touch bending pattern BP' of the touch chain line 135 and the plurality of pads PD. The electrostatic discharge circuit ESD is connected to the touch chain line 135, and when an overvoltage or overcurrent flows through the touch sensing unit 130, the overvoltage or overcurrent is discharged to the electrostatic discharge circuit ESD to suppress electrostatic-related effects and prevent damage to various components.

[0064] Next, for a more detailed description, the electrostatic discharge circuit ESD will be described with reference to Figure 3 together.

[0065] Figure 3 is a circuit diagram showing the configuration of the electrostatic discharge circuit of a display device according to an aspect of the present disclosure.

[0066] Referring to Figure 3 , the electrostatic discharge circuit ESD bypasses the static electricity flowing into the touch chain line 135. The electrostatic discharge circuit ESD includes a plurality of sub-transistors. The plurality of sub-transistors of the electrostatic discharge circuit ESD include a first sub-transistor TR1 and a second sub-transistor TR2, which are connected in series with each other. Each of the first sub-transistor TR1 and the second sub-transistor TR2 includes a gate electrode g, a source electrode s, and a drain electrode d.

[0067] The drain electrode d of the first sub-transistor TR1 can be connected to the gate low-voltage line VGL. The source electrode s of the first sub-transistor TR1 can be connected to the first node N1 to be connected to the touch link line 135. The gate electrode g of the first sub-transistor TR1 can be connected to the first node N1 to be connected to the source electrode s of the first sub-transistor TR1 and the touch link line 135.

[0068] The source electrode s of the second sub-transistor TR2 can be connected to the second node N2 to be connected to the gate high-voltage line VGH. The drain electrode d of the second sub-transistor TR2 can be connected to the first node N1 to be connected to the source electrode s and the gate electrode g of the first sub-transistor TR1 and the touch link line 135. The gate electrode g of the second sub-transistor TR2 can be connected to the second node N2 to be connected to the source electrode s of the second sub-transistor TR2 and the gate high-voltage line VGH.

[0069] One first sub-transistor TR1 and one second sub-transistor TR2 having the above connection structure can be configured to be connected to one touch link line 135. That is, one first sub-transistor TR1 and one second sub-transistor TR2 can correspond to one touch link line 135.

[0070] Specifically, the sub-transistor of the electrostatic discharge circuit ESD can include a gate electrode, an active layer, a source electrode, and a drain electrode, which are respectively disposed on the same layer as the gate electrode, the active layer, the source electrode, and the drain electrode of the transistor in the display area AA and are respectively made of the same materials as the gate electrode, the active layer, the source electrode, and the drain electrode of the transistor in the display area AA. In addition, the electrostatic discharge circuit ESD can further include a discharge connection electrode, which is disposed on the same layer as the touch connection electrode 132 in the display area AA and is made of the same material as the touch connection electrode 132 in the display area AA, and the touch link line 135 can contact the discharge connection electrode to be electrically connected to the sub-transistor.

[0071] In the detailed operation of the electrostatic discharge circuit ESD, when a voltage greater than the maximum threshold is generated in the touch link line 135 due to static electricity or the like, the second sub-transistor TR2 simultaneously connected to the gate high-voltage line VGH and the touch link line 135 is turned on, and the current generated by the static electricity can flow to the gate high-voltage line VGH. On the contrary, when a voltage less than the minimum threshold is generated in the touch link line 135 due to static electricity or the like, the first sub-transistor TR1 simultaneously connected to the gate low-voltage line VGL and the touch link line 135 is turned on, and the current generated by the static electricity can flow to the gate low-voltage line VGL.

[0072] Figure 4 Yes Figure 2An enlarged view of region A, specifically, a view schematically showing a part of the non-display region of a display device according to an aspect of the present disclosure. Among various components of the display device 100, for the purpose of description, only the substrate 101, a plurality of touch chain lines 135, an electrostatic discharge circuit ESD, a plurality of pads PD, and a dam portion 190 are shown.

[0073] Reference Figure 4 , as described above, various lines and circuits for driving display units disposed in the display region AA are included within the non-display region NA. In some aspects, the non-display region NA may include a first non-display region NA1, a bending region BA, a second non-display region NA2, and a pad region PA.

[0074] The first non-display region NA1 is a region extending from the display region AA, and the first line LLA of the data chain line and the first touch chain line 135-1 may be disposed therein. In addition, within the first non-display region NA1, the dam portion 190 may be disposed to inhibit the organic layer of the encapsulation layer of the display region AA from spreading into the non-display region NA.

[0075] The bending region BA extends from the first non-display region NA1 and may be bendable. The touch bending pattern BP' of the touch chain line 135 may be disposed within the bending region BA.

[0076] The second non-display region NA2 is a region extending from the bending region BA, and a driving IC COP and an electrostatic discharge circuit ESD may be disposed therein. Reference Figure 4 , the electrostatic discharge circuit ESD within the second non-display region NA2 may be configured to be connected to the second touch chain line 135-2.

[0077] The pad region PA is a region extending from the second non-display region NA2, and a plurality of pads PD may be disposed therein. The touch chain line 135 is connected to a touch pad among the plurality of pads PD, and the touch chain line 135 may receive signals from the plurality of touch pads to transmit the signals to the touch sensing unit 130.

[0078] Next, with reference to Figure 5 the specific cross-sectional structure of the display device 100 will be described in detail.

[0079] Figure 5 is a schematic partial cross-sectional view of the display device and the display region of the display device taken along line V-V' according to Figure 4 .

[0080] Reference Figure 5 , the substrate 101 supports various components of the display device 100. The substrate 101 may be formed of a transparent insulating material, such as glass or plastic.

[0081] The first buffer layer 103 can be positioned on the substrate 101. The first buffer layer 103 is a layer for protecting the transistor from impurities (such as alkali ions, etc.) leaking from the substrate 101 or the underlying layer. The first buffer layer 103 can be made of silicon oxide (SiOx), silicon nitride (SiNx), or a multi-layer thereof.

[0082] The transistor is disposed on the first buffer layer 103. The transistor includes an active layer 102, a gate electrode 104, a source electrode 108-1, and a drain electrode 108-2.

[0083] The active layer 102 is disposed on the first buffer layer 103. The active layer 102 can be formed of polycrystalline silicon (p-Si), amorphous silicon (a-Si), or an oxide semiconductor, but is not limited thereto.

[0084] The gate insulating layer 105 is disposed on the first buffer layer 103 and the active layer 102. The gate insulating layer 105 can be made of silicon oxide (SiOx), silicon nitride (SiNx), or a multi-layer thereof.

[0085] The gate electrode 104 is disposed on the gate insulating layer 105. The gate electrode 104 is disposed on the gate insulating layer 105 to overlap with the active layer 102. The gate electrode 104 can be formed of various conductive materials, for example, magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), its alloy, or similar materials, but is not limited thereto.

[0086] The interlayer insulating layer 106 is disposed on the gate insulating layer 105 and the gate electrode 104. The interlayer insulating layer 106 can be made of silicon oxide (SiOx), silicon nitride (SiNx), or a multi-layer thereof.

[0087] The source electrode 108-1 and the drain electrode 108-2 are disposed on the interlayer insulating layer 106. The source electrode 108-1 and the drain electrode 108-2 are electrically connected to the active layer 102 through contact holes formed in the gate insulating layer 105 and the interlayer insulating layer 106. The source electrode 108-1 and the drain electrode 108-2 can be formed of various conductive materials, for example, magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), its alloy, or similar materials, but is not limited thereto.

[0088] The transistor insulating layer 109 is configured to cover the source electrode 108-1 and the drain electrode 108-2 and form the top surface of the transistor. The first planarization layer 107-1 is disposed on the transistor insulating layer 109. The first planarization layer 107-1 protects the transistor and planarizes its upper part. The first planarization layer 107-1 can be formed of, for example, an organic insulating layer (such as benzocyclobutene (BCB) or acrylic), but is not limited thereto.

[0089] The first connection electrode 108-4 is disposed on the first planarization layer 107-1. The first connection electrode 108-4 is an electrode for connecting the drain electrode 108-2 and the first electrode 112, and is electrically connected to the drain electrode 108-2 through a contact hole formed in the first planarization layer 107-1. The first connection electrode 108-4 can be formed of various conductive materials, such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), its alloys, or similar materials, but is not limited thereto.

[0090] The second planarization layer 107-2 is disposed on the first planarization layer 107-1 and the first connection electrode 108-4. The second planarization layer 107-2 planarizes the upper portion of the first connection electrode 108-4. The second planarization layer 107-2 can be formed of, for example, an organic insulating layer (such as benzocyclobutene (BCB) or acrylic), but is not limited thereto. The organic light-emitting diode includes a first electrode 112, an organic light-emitting layer 114, and a second electrode 116.

[0091] The first electrode 112 is formed on the second planarization layer 107-2. The first electrode 112 is electrically connected to the first connection electrode 108-4 through a contact hole in the second planarization layer 107-2. Thus, the first electrode 112 can be electrically connected to the drain electrode 108-2 of the transistor through the first connection electrode 108-4. When the display device 100 is a top-emission type, the first electrode 112 can include a transparent conductive layer and a reflective layer located on the transparent conductive layer. The transparent conductive layer can be made of, for example, a transparent conductive oxide such as ITO or IZO, and the reflective layer can be made of, for example, silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), its alloys, or similar materials. The first electrode 112 can also be referred to as an anode.

[0092] The bank 110 is formed in the remaining regions except for the light-emitting region. Thus, the bank 110 can expose the first electrode 112 corresponding to the light-emitting region. The bank 110 can be made of an inorganic insulating material (such as a silicon nitride thin film (SiNx) or a silicon oxide thin film (SiOx)) or an organic insulating material (such as BCB, an acrylic resin, or an imide resin), but is not limited thereto.

[0093] The organic light-emitting layer 114 is disposed on the first electrode 112 exposed by the bank 110. The organic light-emitting layer 114 can include a light-emitting layer, an electron injection layer, an electron transport layer, a hole transport layer, a hole injection layer, etc. The organic light-emitting layer 114 can also be configured to have a structure of a single light-emitting layer that emits one kind of light, or be configured to have a structure of multiple light-emitting layers to emit white light.

[0094] The second electrode 116 is disposed on the organic light-emitting layer 114. When the display device 100 is a top-emission type, the second electrode 116 may be made of a thin metal material or may be made of ytterbium (Yb) or a similar material. The second electrode 116 may also be referred to as a cathode.

[0095] The encapsulation layer 120 is disposed on the second electrode 116. The encapsulation layer 120 may protect the organic light-emitting diode from moisture and oxygen. When the organic light-emitting diode is exposed to moisture or oxygen, a pixel shrinkage phenomenon in which the organic light-emitting diode is reduced or dark spots may appear in the light-emitting region may occur. The encapsulation layer 120 may also have a structure in which the organic layer 122 and the first inorganic layer 121-1 and the second inorganic layer 121-2 are alternately stacked. In this case, the first inorganic layer 121-1 and the second inorganic layer 121-2 are used to block the penetration of moisture or oxygen, and the organic layer 122 is used to planarize the upper portion of the first inorganic layer 121-1. However, the configuration of the encapsulation layer 120 is not limited thereto.

[0096] The dam portion 190 is disposed in the non-display area NA to prevent the flow of the organic layer 122 constituting the encapsulation layer 120. Specifically, the dam portion 190 may be disposed to surround the perimeter of the display area AA to prevent the flow of the organic layer 122 constituting the encapsulation layer 120. In addition, the dam portion 190 may be disposed in the non-display area NA to prevent the flow of the organic layer 122 so that the organic layer 122 constituting the encapsulation layer 120 does not penetrate into the pad area PA.

[0097] Various circuits and lines may be disposed in the non-display area NA. These various circuits and lines include a gate electrode 104' made of the same material as the gate electrode 104, and source and drain metals 108-3 made of the same material as the source electrode 108-1 and the drain electrode 108-2, but are not limited thereto.

[0098] Since the thickness and / or width of the display device may be increased by combining a panel-type touch sensor, research has been conducted to dispose the touch sensor inside the display device, and a method for disposing the touch sensing unit 130 on the encapsulation layer 120 has been developed. This type of built-in touch sensor may be referred to as a touch-on-encapsulation (ToE).

[0099] Reference Figure 5 , a touch buffer layer 131 is disposed on the encapsulation layer 120. The touch buffer layer 131 may be formed of an inorganic thin film, for example, silicon oxide (SiOx), silicon nitride (SiNx), or a multi-layer thereof. The touch buffer layer 131 may serve to inhibit damage to the encapsulation layer 120 during the manufacturing process of the touch sensing unit 130.

[0100] The touch connection electrode 132 may be disposed on the touch buffer layer 131. The touch connection electrode 132 is disposed at a point where the touch electrodes 134 are arranged in different directions and intersect to connect the touch electrodes 134 arranged in any direction. The touch connection electrode 132 may be formed of a transparent conductive layer, for example, a transparent conductive oxide such as ITO or IZO.

[0101] The touch insulating layer 133 may be disposed on the touch connection electrode 132 and the touch buffer layer 131. The touch insulating layer 133 may insulate the touch connection electrode 132 and the touch electrodes 134 from each other. The touch insulating layer 133 may be formed of an inorganic thin film, for example, silicon oxide (SiOx), silicon nitride (SiNx), or a multilayer thereof.

[0102] The touch electrodes 134 and the touch link lines 135 may be disposed on the touch insulating layer 133. As Figure 2 shown, the touch electrodes 134 may extend in two intersecting directions. The first touch electrode 134-1 may be disposed in a direction parallel to the data line, and the second touch electrode 134-2 may be disposed in a direction parallel to the gate line. In this case, the touch electrodes 134 may have a mesh structure as a network type structure, but are not limited thereto.

[0103] The touch link lines 135 are connected to the circuit for driving the touch sensing unit 130 through the pads PD. The touch link lines 135 transmit control signals and the like of the circuit for driving the touch sensing unit 130 to the touch electrodes 134, and may transmit signals sensed by the touch electrodes 134 and the like to the circuit for driving the touch sensing unit 130. In addition, as described above, the touch link lines 135 may be connected to the electrostatic discharge circuit ESD located in the second non-display area NA2.

[0104] The electrostatic discharge circuit ESD may include a plurality of sub-transistors, which include gate electrodes, active layers, source electrodes, and drain electrodes, which are respectively disposed on the same layers as the gate electrode 104, the active layer 102, the source electrode 108-1, and the drain electrode 108-2 of the transistor in the display area AA and are respectively made of the same materials as the gate electrode 104, the active layer 102, the source electrode 108-1, and the drain electrode 108-2 of the transistor in the display area AA. In addition, the electrostatic discharge circuit ESD may further include a discharge connection electrode, which is disposed on the same layer as the first connection electrode 108-4 in the display area AA and is made of the same material as the first connection electrode 108-4 in the display area AA, and the discharge connection electrode may be connected to the drain electrode of the sub-transistor. The touch link lines 135 may be connected to the corresponding discharge connection electrodes through contact holes and are electrically connected to the sub-transistors of the electrostatic discharge circuit ESD.

[0105] The touch planarization layer 140 is disposed on the touch insulation layer 133 and the touch electrode 134. The touch planarization layer 140 covers the touch insulation layer 133 and the touch electrode 134 so as not to be exposed to the outside, and protects the touch insulation layer 133 and the touch electrode 134 from moisture and foreign substances. In addition, the touch planarization layer 140 can planarize the upper portion of the touch electrode 134.

[0106] The electrostatic discharge circuit ESD of the display device 100 according to an aspect of the present disclosure may be connected to the touch link line 135 to discharge the static electricity generated by the touch sensing unit 130. Therefore, when a large charge due to static electricity is input from one end of the plurality of electrostatic discharge circuits ESD, the transistors constituting the electrostatic discharge circuit ESD absorb the static electricity, and thus suppress the static electricity from flowing into the touch link line 135 or the voltage lines (VGL and VGH) connected to the electrostatic discharge circuit ESD.

[0107] When a user's touch is input, static electricity may flow into the touch sensing unit 130 together with the user's touch. In this case, the static electricity may flow along the touch electrode 134 or the touch link line 135 of the touch sensing unit 130. The static electricity flowing based on the user's touch flows along the touch link line 135, and if the electrostatic discharge circuit ESD is provided in this path, the static electricity may be absorbed in the electrostatic discharge circuit ESD. That is, in the display device 100 according to this aspect of the present disclosure, the electrostatic discharge circuit ESD can discharge the static electricity flowing into the touch sensing unit 130 and prevent the display device 100 from being damaged due to the static electricity flowing into the touch electrode 134 and the touch link line 135.

[0108] In addition, the electrostatic discharge circuit ESD may be damaged during the process of discharging the static electricity accumulated in the touch sensing unit 130, but the electrostatic discharge circuit ESD is covered by the touch planarization layer 140 to minimize the damage that may occur during the process of discharging the static electricity. That is, it is possible to minimize the defects caused by electrolytic corrosion of the line due to abnormal voltages and currents that may occur in the electrostatic discharge circuit ESD.

[0109] Multiple aspects of the present disclosure may also be described as follows.

[0110] According to one aspect of the present disclosure, a display device is disclosed. The display device includes a substrate including a display area and a non-display area. The display device further includes an organic light-emitting diode disposed on the substrate. The display device further includes a encapsulation layer disposed on the organic light-emitting diode. The display device further includes a touch sensing unit disposed on the encapsulation layer within the display area. The display device further includes a plurality of touch pads disposed within the non-display area. The display device further includes a plurality of touch chain lines disposed within the non-display area, and each touch chain line electrically connects the touch sensing unit and at least one of the plurality of touch pads. The display device further includes an electrostatic discharge circuit disposed within the non-display area and connected to the plurality of touch chain lines.

[0111] The display device further includes a transistor disposed between the substrate and the organic light-emitting diode within the display area. The electrostatic discharge circuit may include a plurality of sub-transistors having a gate electrode, an active layer, a source electrode, and a drain electrode, which are respectively disposed on the same layers as the gate electrode, the active layer, the source electrode, and the drain electrode of the transistor and made of the same materials as the gate electrode, the active layer, the source electrode, and the drain electrode of the transistor.

[0112] The plurality of sub-transistors may include a first sub-transistor and a second sub-transistor connected in series with each other.

[0113] The first sub-transistor may be connected to one of the plurality of touch chain lines and a gate low voltage line for transmitting a gate low voltage, and the second sub-transistor may be connected to the one touch chain line and a gate high voltage line for transmitting a gate high voltage.

[0114] The source electrode of the first sub-transistor, the gate electrode of the first sub-transistor, and the drain electrode of the second sub-transistor may be connected to the one touch chain line. The drain electrode of the first sub-transistor may be connected to the gate low voltage line. The source electrode and the gate electrode of the second sub-transistor may be connected to the gate high voltage line.

[0115] The display device may further include a plurality of gate chain lines and a plurality of data chain lines disposed within the non-display area. The display device may further include a driving IC disposed within the non-display area and connected to the plurality of gate chain lines and the plurality of data chain lines. The plurality of touch chain lines may be disposed adjacent to both sides of the driving IC.

[0116] The driving IC may be mounted on the substrate by a chip on plastic (COP) method.

[0117] The non-display area may include a bending area and a pad area. The electrostatic discharge circuit may be disposed between the bending area and the pad area.

[0118] The display device may further include a touch flattening layer disposed on the touch sensing unit. The touch flattening layer may cover the upper portion of the electrostatic discharge circuit.

[0119] According to another aspect of the present disclosure, a display device is provided. The display device includes a substrate including a display area and a non-display area. The display device further includes a touch sensing unit including a touch electrode and a connection electrode. The display device further includes a touch chain line disposed in the non-display area and electrically connected to the touch sensing unit. The display device further includes a touch pad disposed in the non-display area. The display device further includes an electrostatic discharge circuit disposed in the non-display area. The touch chain line is electrically connected to the touch pad through the electrostatic discharge circuit.

[0120] The electrostatic discharge circuit may include a plurality of sub-transistors connected in series. The plurality of sub-transistors may be connected to the touch chain line.

[0121] The display device may further include a data driving IC disposed in the non-display area. The electrostatic discharge circuit may be disposed adjacent to both sides of the data driving IC.

[0122] The non-display area may include a bending area and a pad area. The electrostatic discharge circuit may be disposed between the bending area and the pad area.

[0123] Although many aspects of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the many aspects of the present disclosure are for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above-described aspects are illustrative in all respects and do not limit the present disclosure. The protection scope of the present disclosure should be interpreted based on the following claims, and all technical concepts within the equivalent scope should be interpreted as falling within the scope of the present disclosure.

Claims

1. A display device, comprising: a substrate including a display area and a non-display area, the non-display area including a first non-display area, a bending area, a second non-display area, and a pad area, the bending area being disposed between the first non-display area and the second non-display area, and the second non-display area being disposed between the bending area and the pad area; a transistor disposed on the substrate and within the display area; a dam disposed on the substrate and within the first non-display area; an organic light-emitting diode disposed on the transistor and within the display area; a package layer disposed on the organic light-emitting diode and including a first inorganic layer, a second inorganic layer, and an organic layer disposed between the first inorganic layer and the second inorganic layer; a touch sensing unit disposed on the package layer and within the display area; and an electrostatic discharge circuit disposed within the second non-display area.

2. The display device according to claim 1, wherein, The touch sensing unit includes a plurality of touch electrodes and touch connection electrodes, the plurality of touch electrodes including a first touch electrode and a second touch electrode interconnected through the touch connection electrodes.

3. The display device according to claim 2, wherein, The first touch electrode and the second touch electrode have a grid pattern.

4. The display device according to claim 1, wherein, The display device further includes: a plurality of touch link lines disposed within the non-display area, and each touch link line electrically connects the touch sensing unit and a plurality of pads disposed within the pad area.

5. The display device according to claim 4, wherein, In a plan view of the display device, the plurality of touch link lines are disposed on both sides of the substrate.

6. The display device according to claim 1, wherein, The first inorganic layer and the second inorganic layer extend over the dam and terminate within the first non-display area.

7. The display device according to claim 1, wherein, The display device further includes: a touch buffer layer disposed on the package layer; and a touch insulating layer disposed on the touch buffer layer, wherein the touch buffer layer and the touch insulating layer extend beyond the first inorganic layer and the second inorganic layer within the first non-display area.

8. The display device according to claim 4, wherein The electrostatic discharge circuit is connected to the plurality of touch link lines.

9. The display device according to claim 1, wherein, The display device further includes: a touch planarization layer disposed on the touch insulating layer and extending within the first non-display area.

10. The display device according to claim 4, wherein, The plurality of touch link lines intersect the dam.

11. The display device according to claim 4, wherein, The display device further includes: a plurality of data link lines, wherein the plurality of data link lines and the plurality of touch link lines contain titanium.

12. The display device according to claim 4, wherein, The touch link line contains titanium and aluminum.

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