Variable resistor and method for manufacturing variable resistor

Abstract

A variable resistor (1A) is provided with: a base material (11); a plurality of comb tooth patterns (45a-45j) which are supported by the base material (11) and extend with intervals therebetween; and a first resist layer (20) disposed on the base material (11) so as to fill the space between the comb tooth patterns (45a-45j), the comb tooth patterns (45a-45j) having an upper surface (46) on the opposite side from the base material (11), and the upper surface (46) being exposed from the first resist layer (20).

Description

Technical Field

[0001] The present invention relates to a variable resistor and a method for manufacturing the variable resistor.

[0002] For designated countries that allow incorporation by reference, the contents described in Japanese Patent Application No. 2022-211822 filed in Japan on December 28, 2022 are incorporated herein by reference as part of the description of this specification. Background Art

[0003] The variable resistor disclosed in Patent Document 1 includes: a resistor body disposed on the upper surface of a lower diaphragm substrate; a plurality of comb patterns connected to the resistor body and arranged at intervals; and a connection body disposed on the lower surface of an upper diaphragm substrate. By pushing the upper diaphragm substrate and the connection body downward by a slider, the connection body comes into contact with the comb patterns (for example, refer to Patent Document 1 (refer to paragraph

[0090] , Figures 8 to 12 )). Further, by sliding the slider while pushing the upper diaphragm substrate, the comb patterns electrically connected to the connection body change sequentially, and the resistance length (resistance value) of the resistor body changes (for example, refer to Patent Document 1 (paragraph

[0092] , Figure 9 ).

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: WO 2021 / 205899 Summary of the Invention

[0007] (I) Technical Problem to be Solved

[0008] In the above prior art, since there is a space between the comb patterns, when the slider slides while pushing the upper diaphragm substrate, the connection body entering the space comes into contact with the comb pattern from the side of the comb pattern. Therefore, if the above sliding is repeated, the comb pattern may be cut off because the connection body repeatedly comes into contact with the comb pattern from the side, or the comb pattern may fall due to the force from the side and peel off from the lower diaphragm substrate. In such a case, there is a problem that the comb pattern deteriorates due to repeated sliding.

[0009] The technical problem to be solved by the present invention is to provide a variable resistor and a method for manufacturing the variable resistor that can suppress the deterioration of the comb pattern.

[0010] (II) Technical Solution

[0011] [1] Mode 1 of the present invention is a variable resistor, which includes: a first substrate; a plurality of comb patterns, which are supported on the first substrate and extend with intervals from each other; and an insulator, which is disposed on the first substrate in a manner that fills the space between the comb patterns. The comb pattern has a front end surface on the side opposite to the first substrate, and the front end surface is exposed from the insulator.

[0012] [2] Mode 2 of the present invention may be the following variable resistor: in the variable resistor of Mode 1, the insulator has a first main surface on the side opposite to the first substrate, and the height of the front end surface from the first substrate is substantially the same as the height of the first main surface from the first substrate.

[0013] [3] Mode 3 of the present invention may be the following variable resistor: in the variable resistor of Mode 1 or Mode 2, the insulator has a first main surface on the side opposite to the first substrate, and the first main surface extends substantially parallel to the first substrate.

[0014] [4] Mode 4 of the present invention may be the following variable resistor: in the variable resistor of any one of Modes 1 to 3, the insulator includes: a first clamping portion located between the comb patterns; and a second clamping portion located between the first substrate and the comb patterns.

[0015] [5] Mode 5 of the present invention may be the following variable resistor: in the variable resistor of any one of Modes 1 to 4, the insulator has a first main surface on the side opposite to the first substrate, the variable resistor includes a resistor body, the plurality of comb patterns include a plurality of first comb patterns connected to the resistor body, the first comb pattern includes: a first portion, which is the portion where the front end surface is exposed from the insulator; and a second portion, which is integrally formed with the first portion and connected to the resistor body. In a first direction perpendicular to the first main surface, the thickness of the second portion is thinner than the thickness of the first portion.

[0016] [6] Mode 6 of the present invention may be a variable resistor as follows: Among the variable resistors of any one of Modes 1 to 5, the variable resistor includes: a resistor body disposed on the first substrate; a first wiring pattern disposed on the first substrate and connected to the resistor body; a spacer having an opening; a second substrate laminated on the first substrate via the spacer; a connector disposed on the second substrate so as to be located within the opening and electrically connected to the resistor body by being pressed by a slider from the outside of the second substrate; and a second wiring pattern disposed on the second substrate and connected to the connector, or disposed on the first substrate and electrically connected to the connector by being pressed by the slider. In a top view, the connector has a non-overlapping region that does not overlap with the resistor body, and a sliding region where the slider can slide is included in the non-overlapping region. The front end face is the face facing the connector in the comb pattern, and the resistance value between the first wiring pattern and the second wiring pattern varies according to the position of the slider.

[0017] [7] Mode 7 of the present invention may be a variable resistor as follows: In the variable resistor of Mode 6, the second wiring pattern is disposed on the second substrate and connected to the connector. The plurality of comb patterns include a plurality of first comb patterns connected to the resistor body. In a top view, the first comb pattern overlaps with the sliding region, and the connector contacts the first comb pattern by being pressed by the slider from the outside of the second substrate.

[0018] [8] Mode 8 of the present invention may be a variable resistor as follows: In the variable resistor of Mode 6, the second wiring pattern is disposed on the first substrate. The plurality of comb patterns include a plurality of first comb patterns connected to the resistor body. In a top view, the first comb pattern and the second wiring pattern overlap with the sliding region, and the connector contacts the first comb pattern and the second wiring pattern by being pressed by the slider from the outside of the second substrate.

[0019] [9] Mode 9 of the present invention may be a variable resistor as follows: In the variable resistor of Mode 6, the second wiring pattern is disposed on the first substrate. The plurality of comb patterns include: a plurality of first comb patterns connected to the resistor body; and a plurality of second comb patterns connected to the second wiring pattern. In a top view, the first comb pattern and the second comb pattern overlap with the sliding region, and the first comb pattern and the second comb pattern are alternately arranged along the extending direction of the connector in the sliding region. The connector contacts the first comb pattern and the second comb pattern by being pressed by the slider from the first substrate.

[0020]

[10] The mode 10 of the present invention may be a variable resistor as follows: among the variable resistors of any one of modes 6 to 9, the variable resistor further includes a third wiring pattern, which is disposed on the first substrate and connected to the resistor body. The plurality of comb patterns include: a third comb pattern connected to the first wiring pattern; and a fourth comb pattern connected to the third wiring pattern. In a top view, the third comb pattern and the fourth comb pattern overlap with the sliding region.

[0021]

[11] The mode 11 of the present invention is a method for manufacturing a variable resistor. Among the methods for manufacturing a variable resistor of any one of modes 1 to 10, it includes: a first step of preparing a support body having a demolding treatment surface; a second step of forming the comb pattern on the demolding treatment surface of the support body; a third step of forming the insulator on the demolding treatment surface so as to fill the space between the comb patterns; and a fourth step of transferring the comb pattern and the insulator from the support body to the first substrate.

[0022] (III) Beneficial effects

[0023] In the present invention, by filling the space between the comb patterns with an insulator, the front end surface of the comb pattern on the side opposite to the first substrate is exposed from the insulator, thereby enabling suppression of deterioration of the comb pattern. Description of the drawings

[0024] Figure 1 It is a top view showing a variable resistor in the first embodiment of the present invention.

[0025] Figure 2 It is along Figure 1 Cross-sectional view taken along line II-II.

[0026] Figure 3 It is along Figure 1 Cross-sectional view taken along line III-III.

[0027] Figure 4 It is along Figure 1 Cross-sectional view taken along line IV-IV.

[0028] Figure 5 It is along Figure 1 Cross-sectional view taken along line V-V.

[0029] Figure 6 It is a top view showing the lower diaphragm substrate of the variable resistor in the first embodiment of the present invention.

[0030] Figure 7It is a bottom view of the spacer and the upper diaphragm substrate of the variable resistor in the first embodiment of the present invention.

[0031] Figure 8 (A) to Figure 8 (D) is a cross-sectional view showing an example of the manufacturing method of the variable resistor in the first embodiment of the present invention.

[0032] Figure 9 (A) to Figure 9 (D) is a cross-sectional view showing an example of the manufacturing method of the variable resistor in the first embodiment of the present invention.

[0033] Figure 10 It is a top view of the variable resistor in the second embodiment of the present invention.

[0034] Figure 11 It is along Figure 10 Cross-sectional view taken along line XI-XI.

[0035] Figure 12 It is a top view of the lower diaphragm substrate of the variable resistor in the second embodiment of the present invention.

[0036] Figure 13 It is a bottom view of the spacer and the upper diaphragm substrate of the variable resistor in the second embodiment of the present invention.

[0037] Figure 14 It is a top view of the variable resistor in the third embodiment of the present invention.

[0038] Figure 15 It is along Figure 14 Cross-sectional view taken along line XV-XV.

[0039] Figure 16 It is a top view of the lower diaphragm substrate of the variable resistor in the third embodiment of the present invention. Detailed Embodiments

[0040] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0041] <<First Embodiment>>

[0042] Figure 1 It is a top view of the variable resistor 1A in the first embodiment, Figure 2 It is along Figure 1 Cross-sectional view taken along line II-II, Figure 3 It is along Figure 1 Cross-sectional view taken along line III-III, Figure 4 It is along Figure 1 Cross-sectional view taken along line IV-IV,Figure 5 is a cross-sectional view along the V-V line of Figure 1 . In addition, Figure 6 is a top view showing the lower diaphragm substrate 10A of the variable resistor 1A in the first embodiment, Figure 7 is a bottom view showing the spacer 90 and the upper diaphragm substrate 60A of the variable resistor 1A in the first embodiment.

[0043] As Figures 1 to 7 shown, the variable resistor 1A in the present embodiment includes: a lower diaphragm substrate 10A (refer to Figures 2 to 6 ), an upper diaphragm substrate 60A (refer to Figures 2 to 5 , Figure 7 ), a spacer 90, and a slider 100.

[0044] The lower diaphragm substrate 10A has: a resistor body 40; a plurality (10 in this example) of comb patterns 45a to 45j; and wiring patterns 31, 35. In addition, in the present embodiment, the plurality of comb patterns 45a to 45j are sometimes collectively referred to as "comb pattern 45".

[0045] On the other hand, the upper diaphragm substrate 60A has a connector 80 that electrically connects the resistor body 40 and the wiring pattern 70. These diaphragm substrates 10A, 60A are stacked via the spacer 90, and the spacer 90 ensures a gap between the diaphragm substrates 10A, 60A. The slider 100 is configured to slide while pressing above the upper diaphragm substrate 60A in the sliding region SA (refer to Figure 1 ). By the pressing of the slider 100, the resistor body 40 and the wiring pattern 70 are electrically connected via the connector 80 and the comb pattern 45.

[0046] In this variable resistor 1A, the slider 100 slides while pressing the upper diaphragm substrate 60A, whereby the comb pattern 45 contacted by the connector 80 changes sequentially. Thereby, the electrical connection position between the connector 80 and the resistor body 40 can be changed, and the resistance length (resistance value) of the resistor body 40 can be changed. As applications of such a variable resistor 1A, for example, variable resistance elements, position sensors, switches, encoders, etc. can be exemplified. In addition, the application of the variable resistor 1A of the present embodiment is not particularly limited to the above cases.

[0047] Next, the structure of the variable resistor 1A of the present embodiment will be described in detail.

[0048] As Figure 6As shown, the lower diaphragm substrate 10A is a wiring board including a base material 11, a first resist layer 20, wiring patterns 31 and 35, a resistor body 40, a comb pattern 45, and a second resist layer 50. In addition, the base material 11 in the present embodiment corresponds to an example of the "first base material" in the present invention, the first resist layer 20 in the present embodiment corresponds to an example of the "insulator" in the present invention, the comb patterns 45a to 45j in the present embodiment correspond to an example of the "comb pattern", the comb pattern 45a in the present embodiment corresponds to an example of the "third comb pattern" in the present invention, the comb patterns 45b to 45i in the present embodiment correspond to an example of the "first comb pattern", and the comb pattern 45j in the present embodiment corresponds to an example of the "fourth comb pattern" in the present invention. In addition, the wiring pattern 31 in the present embodiment corresponds to an example of the "first wiring pattern" in the present invention, and the wiring pattern 35 in the present embodiment corresponds to an example of the "third wiring pattern" in the present invention.

[0049] The base material 11 is a film-like member made of a material having flexibility and electrical insulation. As the material constituting the base material 11, for example, a resin material or the like can be exemplified. More specifically, polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) can be exemplified. More specifically, an adhesive tape having an adhesive layer on one main surface of a PET film or the like can be used as the base material 11. Alternatively, a hot melt adhesive or the like can be used instead of the adhesive layer. In addition, the base material 11 may not have flexibility.

[0050] The first resist layer 20 is provided on the upper surface 12 of the base material 11. The first resist layer 20 is formed by hardening (curing) a resist material having electrical insulation. As a specific example of the resist material, for example, resin materials such as epoxy resin, polyurethane resin, polyester resin, and acrylic resin can be exemplified.

[0051] As Figure 2 and Figure 6 shown, the first resist layer 20 has a thin wall portion 21 and a protruding portion 22. As Figure 6 shown, the thin wall portion 21 surrounds the protruding portion 22 and is relatively thinner than the protruding portion 22.

[0052] The thin wall portion 21 overlaps with the second resist layer 50 in a plan view (when observing the variable resistor 1A from above or below (the normal direction of the variable resistor 1A with respect to the main surface (the Z direction in the figure))), and does not protrude from the second resist layer 50. In addition, as Figure 3 shown, the thin wall portion 21 is not directly covered by the second resist layer 50, and has a portion indirectly covered by the second resist layer 50 via the wiring patterns 31 and 35, the resistor body 40, and the comb pattern 45.

[0053] On the other hand, as Figure 2 and Figure 6 shown, the protruding portion 22 in the present embodiment is surrounded by the thin wall portion 21. The protruding portion 22 does not overlap with the second resist layer 50 in a plan view and is exposed from the second resist layer 50. As Figure 2 shown, the thickness of the protruding portion 22 is relatively thicker than the thickness of the thin wall portion 21, and the upper surface 22a of the protruding portion 22 protrudes upward (in the +Z direction in the figure) with respect to the upper surface 21a of the thin wall portion 21. Thus, the protruding portion 22 fills the opening 51 of the second resist layer 50. In addition, the upper surface 22a of the protruding portion 22 in the present embodiment is an example of the "first main surface" in the present invention.

[0054] The upper surface 22a of the protruding portion 22 is substantially parallel to the upper surface 12 of the base material 11. In addition, the height H1 of the upper surface 22a from the base material 11 is substantially the same as the height H2 of the upper surface 50a of the second resist layer 50 from the base material 11 (H1 = H2), and the upper surfaces 22a and 50a are substantially flush.

[0055] In addition, as Figure 2 , Figure 3 and Figure 6 shown, a comb pattern 45 is buried across the protruding portion 22 from the thin wall portion 21 of the first resist layer 20. The first resist layer 20 also has a plurality (nine in this example) of first clamping portions 23, a plurality (ten in this example) of second clamping portions 24, and a plurality (two in this example) of third clamping portions 25 around the comb pattern 45. As Figure 2 shown, in the first resist layer 20 in the present embodiment, between the third clamping portions 25, 25, the plurality of first clamping portions 23 and the plurality of second clamping portions 24 are alternately arranged along the X direction. In addition, the number of the first clamping portions 23 and the second clamping portions 24 is not particularly limited and varies according to the number of the comb patterns 45.

[0056] As Figure 6 shown, the first clamping portion 23 is located between the comb patterns 45 so as to fill the space between the comb patterns 45. The first clamping portion 23 extends along the extending direction (Y direction in the figure) of the comb pattern 45 across the protruding portion 22 from the thin wall portion 21 of the first resist layer 20.

[0057] As Figure 5 shown, the first clamping portion 23 includes a first exposed portion 23a, a first non-exposed portion 23b, and a second non-exposed portion 23c. The first exposed portion 23a is integrally formed with the first non-exposed portion 23b and the second non-exposed portion 23c.

[0058] The first exposed portion 23a forms a part of the protruding portion 22 and is exposed from the second resist layer 50. The upper surface 22a of the protruding portion 22 in the first exposed portion 23a is substantially flush with the upper surface 50a of the second resist layer 50. In addition, the surface roughness Ra of the upper surface 22a of the protruding portion 22 in the first exposed portion 23a can be set to, for example, 0.01 μm to 0.1 μm.

[0059] The first non-exposed portion 23b and the second non-exposed portion 23c form a part of the thin wall portion 21. The first non-exposed portion 23b is located between the first exposed portion 23a and the resistor body 40. The upper surface 21a of the thin wall portion 21 in the first non-exposed portion 23b is covered by the second resist layer 50. Therefore, the first non-exposed portion 23b is interposed between the second resist layer 50 and the base material 11.

[0060] The second non-exposed portion 23c is connected to the first non-exposed portion 23b. The upper surface 21a of the thin wall portion 21 in the second non-exposed portion 23c is covered by the resistor body 40. Therefore, the second non-exposed portion 23c is interposed between the resistor body 40 and the base material 11.

[0061] In addition, in the present embodiment, the thickness T1 of the first exposed portion 23a is thicker than the thickness T2 of the first non-exposed portion 23b, and the thickness T2 of the first non-exposed portion 23b is thicker than the thickness T3 of the second non-exposed portion 23c (T1 > T2 > T3). Therefore, in the first sandwiching portion 23 in the present embodiment, a step is formed between the first exposed portion 23a and the first non-exposed portion 23b, and a step is also formed between the first non-exposed portion 23b and the second non-exposed portion 23c. Therefore, the thickness of the first sandwiching portion 23 gradually thins as it approaches the end portion on the resistor body 40 side of the comb pattern 45 (as it faces the -Y direction in the figure). In addition, the thickness in the present embodiment refers to the thickness in the direction perpendicular to the upper surface 12 of the base material 11 (the Z direction in the figure), and the Z direction in the present embodiment corresponds to an example of the "first direction" in the present invention.

[0062] As Figure 2 and Figure 3 shown, the second sandwiching portion 24 is located between the lower surface 47 of the comb pattern 45 and the upper surface 12 of the base material 11. The second sandwiching portion 24 in the present embodiment is located between two first sandwiching portions 23, 23 and has a rectangular parallelepiped shape with the same width as the comb pattern 45.

[0063] In this way, by having the second sandwiching portion 24 positioned between the comb-tooth pattern 45 and the base material 11, the adhesion of the comb-tooth pattern 45 to the base material 11 can be improved, and thus the deterioration of the comb-tooth pattern 45 can be suppressed. In addition, by means of the second sandwiching portion 24, the intrusion of water vapor and the like from the base material 11 side can also be suppressed, and thus the deterioration of the comb-tooth pattern 45 can be suppressed.

[0064] As Figure 2 shown, the third sandwiching portion 25 is positioned between the second resist layer 50 and the comb-tooth patterns 45a, 45j. The third sandwiching portion 25 also forms a part of the protruding portion 22 and is exposed from the second resist layer 50. The upper surface of this third sandwiching portion 25 is included in the upper surface 22a of the protruding portion 22 and is substantially flush with the upper surface 50a of the second resist layer 50. In addition, the surface roughness Ra of the upper surface 22a of the protruding portion 22 in the third sandwiching portion 25 can be set to, for example, 0.01 μm to 0.1 μm.

[0065] As Figure 3 shown, the wiring patterns 31, 35 are provided on the thin-walled portion 21 of the first resist layer 20. The wiring patterns 31, 35 are formed by hardening (curing) a conductive paste. The conductive paste is composed of mixing conductive particles, a binder resin, water or a solvent, and various additives. The conductive paste constituting the wiring patterns 31, 35 is a low-resistance conductive paste having a small resistance value. In addition, the method for forming the wiring patterns 31, 35 is not particularly limited to the above case.

[0066] As specific examples of the conductive particles, silver, copper, nickel, tin, bismuth, zinc, indium, palladium, and their alloys, etc. can be exemplified. In addition, as specific examples of the binder resin, acrylic resin, polyester resin, epoxy resin, vinyl resin, polyurethane resin, phenolic resin, polyimide resin, silicone resin, fluororesin, etc. can be exemplified. Moreover, as the solvent contained in the conductive paste, α-terpineol, butyl carbitol acetate, butyl carbitol, 1-decanol, butyl cellosolve, diethylene glycol monoethyl ether acetate, tetradecane, etc. can be exemplified.

[0067] Although not particularly limited, in the present embodiment, as the low-resistance conductive paste, a silver paste having silver as the main component of the conductive particles or a copper paste having copper as the main component of the conductive particles is used. In addition, as the conductive particles contained in the conductive paste, metal salts can also be used. As the metal salts, the salts of the above-mentioned metals can be cited. In addition, the binder resin can be omitted from the above-mentioned conductive paste. In addition, conductive ink can be used instead of the above-mentioned conductive paste.

[0068] As Figure 6As shown, the wiring patterns 31 and 35 in the present embodiment are connected to both ends of the resistor body 40. The wiring patterns 31 and 35 in the present embodiment extend in the X direction in the drawing substantially parallel to the resistor body 40, but are not limited thereto, and may also extend in a direction other than the X direction, such as the Y direction.

[0069] As Figure 3 and Figure 6 shown, the resistor body 40 is disposed between the wiring patterns 31 and 35 and extends along the X direction in the drawing. The resistor body 40 is also formed by curing a conductive paste, similarly to the above-described wiring patterns 31 and 35.

[0070] The conductive paste forming the resistor body 40 is a high-resistance conductive paste having a higher resistance value than the above-described low-resistance conductive paste. The conductive paste forming the resistor body 40 contains the following conductive particles, which have a higher resistivity than the conductive particles of the conductive paste forming the above-described wiring patterns 31 and 35. That is, the resistor body 40 is made of a material having a higher resistivity than the resistivity of the material forming the wiring patterns 31 and 35, and the resistance value of the resistor body 40 is sufficiently higher than the resistance values of the wiring patterns 31 and 35 to the extent that the resistance values of the wiring patterns 31 and 35 can be ignored. Specifically, the resistance value of the resistor body 40 is 10 times or more, preferably 100 times or more, the resistance value of the wiring patterns 31 and 35. In addition, the resistivity of the material forming the resistor body 40 is 10 times or more, preferably 100 times or more, the resistivity of the material forming the wiring patterns 31 and 35.

[0071] As a specific example of such a high-resistance conductive paste, a carbon paste can be exemplified. As a specific example of the conductive particles contained in the conductive paste forming the resistor body 40, carbon-based materials such as graphite, carbon black (furnace black, acetylene black, Ketjen black), carbon nanotubes, and carbon nanofibers can be exemplified.

[0072] As described above, the resistor body 40 covers the end of one wiring pattern 31 and also covers the end of the other wiring pattern 35. The wiring patterns 31 and 35 are connected to each other through the resistor body 40. Although not particularly illustrated, one wiring pattern 31 is connected to a power source, and in contrast, the other wiring pattern 35 is connected to a grounding member.

[0073] Similar to the wiring patterns 31 and 35, the comb patterns 45a to 45j are formed by curing a low-resistance conductive paste. That is, each of the comb patterns 45a to 45j is made of a material having a resistivity lower than that of the material constituting the resistor body 40, and the resistance value of the resistor body 40 is sufficiently higher than the resistance values of the comb patterns 45a to 45j to the extent that the resistance values of the comb patterns 45a to 45j can be ignored. Specifically, the resistance value of the resistor body 40 is 10 times or more, preferably 100 times or more, the resistance value of the comb patterns 45a to 45j. In addition, the resistivity of the material constituting the resistor body 40 is 10 times or more, preferably 100 times or more, the resistivity of the material constituting the comb patterns 45a to 45j.

[0074] As Figure 6 shown, the comb pattern 45a at the left end in the figure branches off from the wiring pattern 31 and protrudes along the Y direction in the figure. That is, this comb pattern 45a is connected to the wiring pattern 31 and extends below the sliding region SA (see Figure 1 ). Similarly, the comb pattern 45j at the right end in the figure branches off from the wiring pattern 35 and protrudes along the Y direction in the figure. That is, this comb pattern 45j is connected to the wiring pattern 35 and extends below the sliding region SA (see Figure 1 ).

[0075] In contrast, as Figure 3 shown, eight comb patterns 45b to 45i between the comb patterns 45a and 45j at both ends are electrically connected to the resistor body 40 by burying the ends of the comb patterns 45b to 45i in the resistor body 40. Moreover, as Figure 6 shown, these comb patterns 45b to 45i protrude from the resistor body 40 in the +Y direction. That is, these comb patterns 45b to 45i are connected to the resistor body 40 and extend below the sliding region SA (see Figure 1 ). In addition, the comb patterns 45a and 45j at both ends may not branch off from the wiring patterns 31 and 35 but may be buried in the resistor body 40 in the same manner as the comb patterns 45b to 45i.

[0076] All the comb patterns 45a to 45j extend along the Y direction in the figure, and the planar shape of the comb patterns 45a to 45j is linear. These multiple comb patterns 45a to 45j are arranged substantially in parallel. In addition, these multiple comb patterns 45a to 45j are arranged substantially at equal intervals. Moreover, the number of the comb patterns 45 is not particularly limited to the above case. In addition, as will be described later, the larger the number of the comb patterns 45, the higher the resolution of the output of the variable resistor 1A can be improved. In addition, as long as an interval is ensured between the comb patterns 45a to 45j, the intervals between the comb patterns 45a to 45j are not limited to equal intervals.

[0077] As shown Figure 4 in FIG., the comb tooth patterns 45b to 45i include a second exposed portion 48a, a third non-exposed portion 48b, and a fourth non-exposed portion 48c. The second exposed portion 48a, the third non-exposed portion 48b, and the fourth non-exposed portion 48c are integrally formed with each other. The second exposed portion 48a in the present embodiment is an example of the "first part" in the present invention, and the fourth non-exposed portion 48c in the present embodiment is an example of the "second part" in the present invention.

[0078] The second exposed portion 48a is located between the first clamping portions 23. In the second exposed portion 48a, the upper surface 46 of the comb tooth patterns 45b to 45i is exposed from the first clamping portions 23 of the first resist layer 20. In addition, the upper surface 46 is not covered by the second resist layer 50. Further, the upper surface 46 in the present embodiment is an example of the "front end surface" in the present invention.

[0079] In addition, in the present embodiment, the height H3 of the upper surface 46 from the base material 11 is substantially the same as the heights H1 and H2 of the upper surfaces 22a and 50a described above (H1 = H2 = H3). That is, the upper surfaces 46, 22a, and 50a are substantially flush. In addition, the surface roughness Ra of the upper surface 46 of the comb tooth patterns 45b to 45i in the second exposed portion 48a can be set to, for example, 0.01 μm to 0.1 μm.

[0080] In addition, in the present embodiment, the upper surface 46 is substantially parallel to the upper surface 12 of the base material 11. Therefore, the upper surface 46 is also substantially parallel to the upper surface 22a and the upper surface 50a.

[0081] The third non-exposed portion 48b is located between the second exposed portion 48a and the resistor body 40. The upper surface 46 in the third non-exposed portion 48b is covered by the second resist layer 50. Therefore, the third non-exposed portion 48b is interposed between the second resist layer 50 and the second clamping portion 24 of the first resist layer 20.

[0082] The fourth non-exposed portion 48c is located between the third non-exposed portion 48b and the resistor body 40. The upper surface 46 in the fourth non-exposed portion 48c is covered by the resistor body 40. Therefore, the fourth non-exposed portion 48c is interposed between the resistor body 40 and the second clamping portion 24 of the first resist layer 20.

[0083] In addition, in the present embodiment, the thickness T4 of the second exposed portion 48a is thicker than the thickness T5 of the third non-exposed portion 48b, and the thickness T5 of the third non-exposed portion 48b is thicker than the thickness T6 of the fourth non-exposed portion 48c (T4 > T5 > T6). Therefore, in the comb patterns 45b to 45i in the present embodiment, a step is formed between the second exposed portion 48a and the third non-exposed portion 48b, and a step is also formed between the third non-exposed portion 48b and the fourth non-exposed portion 48c. Thus, the thickness of the comb patterns 45b to 45i gradually thins as it faces the -Y direction in the figure.

[0084] On the other hand, the cross-sectional shapes of the comb patterns 45a and 45j located at the left and right ends of the comb pattern 45 are slightly different from the cross-sectional shapes of the comb patterns 45b to 45i. Although not particularly illustrated, since the resistor body 40 is not interposed between the comb patterns 45a and 45j and the second resistive layer 50, the fourth non-exposed portion 48c does not exist in the comb patterns 45a and 45j, and the third non-exposed portion 48b extends from the second exposed portion 48a to the wiring patterns 31 and 35.

[0085] Similar to the first resistive layer 20, the second resistive layer 50 is formed by hardening (curing) a resistive material. As such a resistive material, resin materials such as epoxy resin, polyurethane resin, polyester resin, and acrylic resin can be exemplified, for example.

[0086] As Figures 2 to 4 shown, the second resistive layer 50 covers the thin-walled portion 21 of the first resistive layer 20, the wiring patterns 31 and 35, the resistor body 40, and the third non-exposed portion 48b of the comb pattern 45. The second resistive layer 50 has an opening 51 surrounding the periphery of the protruding portion 22 of the first resistive layer 20.

[0087] As Figure 7 shown, the upper diaphragm substrate 60A is a wiring board including a substrate 61, a wiring pattern 70, and a connecting body 80. The substrate 61 in the present embodiment corresponds to an example of the "second substrate" in the present invention, and the wiring pattern 70 in the present embodiment corresponds to an example of the "second wiring pattern" in the present invention.

[0088] Similar to the above-described base material 11, the base material 61 is a film-like member made of a material having flexibility and electrical insulation properties. As the material constituting the base material 11, for example, a resin material or the like can be exemplified. More specifically, polyethylene terephthalate (PET), polyethylene naphthalate (PEN) can be exemplified. In addition, the material constituting the base material 61 is not particularly limited to the above. The base material 61 can also be formed of a plate material made of a conductive material such as a metal material. In this case, the base material 61 can also have the function of the connector 80. In addition, the base material 61 can also have the function of the wiring pattern 70. Further, even when the base material 61 is formed of a conductive plate material, the connector 80 and the wiring pattern 70 can be formed on the base material 61 separately from the base material 61.

[0089] The wiring pattern 70 is formed by printing a low-resistance conductive paste on the lower surface 62 of the base material 61 and curing it. That is, the wiring pattern 70 is made of a material having a resistivity lower than that of the material constituting the resistor 40, and the resistance value of the resistor 40 is sufficiently high compared to the resistance value of the wiring pattern 70 to the extent that the resistance value of the wiring pattern 70 can be ignored. Specifically, the resistance value of the resistor 40 is 10 times or more, preferably 100 times or more, the resistance value of the wiring pattern 70. In addition, the resistivity of the material constituting the resistor 40 is 10 times or more, preferably 100 times or more, the resistivity of the material constituting the wiring pattern 70. In addition, the method of forming the wiring pattern 70 is not particularly limited to the above.

[0090] The connector 80 is directly connected to the wiring pattern 70. The connector 80 includes a first main body portion 81 and a first protective layer 82. In addition, the connector 80 may not include the first protective layer 82.

[0091] The first main body portion 81 is provided on the lower surface 62 of the base material 61. Similar to the above-described wiring patterns 31 and 35, the first main body portion 81 is formed by printing a low-resistance conductive paste and curing it. That is, the first main body portion 81 is made of a material having a resistivity lower than that of the material constituting the resistor 40, and the resistance value of the resistor 40 is sufficiently high compared to the resistance value of the first main body portion 81 to the extent that the resistance value of the first main body portion 81 can be ignored. Specifically, the resistance value of the resistor 40 is 10 times or more, preferably 100 times or more, the resistance value of the first main body portion 81. In addition, the resistivity of the material constituting the resistor 40 is 10 times or more, preferably 100 times or more, the resistivity of the material constituting the first main body portion 81.

[0092] On the other hand, the first protective layer 82 is a layer that protects the first main body portion 81 and is formed by printing a highly resistive conductive paste and curing it. The first protective layer 82 is provided on the lower surface 62 of the base material 61 so as to cover the entire first main body portion 81.

[0093] As Figure 1 shown, the connecting body 80 is provided on the lower surface 62 of the base material 61 so as to partially overlap with the comb tooth pattern 45 of the lower diaphragm substrate 10A in a plan view.

[0094] Similar to the above-described base materials 11 and 61, the spacer 90 is a film-like member made of a material having flexibility and electrical insulation. As the material constituting the spacer 90, for example, a resin material or the like can be exemplified. More specifically, polyethylene terephthalate (PET), polyethylene naphthalate (PEN) can be exemplified.

[0095] As Figures 1 to 5 and Figure 7 shown, the spacer 90 has an opening 91, and the opening 91 has a rectangular planar shape. The opening 91 has a size larger than that of the connecting body 80 and can contain the connecting body 80. In the present embodiment, the opening 91 has a size that can contain not only the connecting body 80 but also the comb tooth pattern 45. The opening 91 is formed on the spacer 90 so as to contain the connecting body 80 and the comb tooth pattern 45 when the diaphragm substrates 10A and 60A are laminated via the spacer 90. In addition, as long as at least a part of the connecting body 80 is located within the opening 91 of the spacer 90, a part of the connecting body 80 may extend to the outside of the opening 91 and be interposed between the spacer 90 and the base material 61.

[0096] As described above, the diaphragm substrates 10A and 60A are laminated via the spacer 90. At this time, as Figures 2 to 5 shown, the diaphragm substrates 10A and 60A are laminated such that the lower surface 62 of the base material 61 of the upper diaphragm substrate 60A faces the upper surface 12 of the base material 11 of the lower diaphragm substrate 10A. In addition, the base material 11 of the lower diaphragm substrate 10A and the spacer 90 are adhered to each other via an adhesive layer (not shown), and the spacer 90 and the base material 61 of the upper diaphragm substrate 60A are also adhered to each other via an adhesive layer (not shown).

[0097] Moreover, as Figure 1 shown, in a plan view, the connecting body 80 and the comb tooth pattern 45 are contained within the opening 91. In addition, as Figure 4 shown, in a cross-sectional view, the connecting body 80 faces the comb tooth pattern 45. In the present embodiment, as Figure 1 shown, in a plan view, the connecting body 80 has a non-overlapping region NA that does not overlap with the resistor body 40.

[0098] AsFigure 2 , Figure 4 and Figure 5 As shown, through the spacer 90, a gap is ensured between the connecting body 80 and the comb tooth pattern 45. As described later, by the pressing of the slider 100, the base material 11 of the upper diaphragm substrate 60A deforms, and through this deformation, the connecting body 80 comes into contact with the comb tooth pattern 45 and is electrically connected.

[0099] In addition, in the present embodiment, the thickness of the spacer 90 is set such that the connecting body 80 does not contact the comb tooth pattern 45 when not pressed, but is not particularly limited thereto. The thickness of the spacer 90 may also be set such that the connecting body 80 and the comb tooth pattern 45 are always in contact.

[0100] In addition, "electrically connected" between the connecting body and the resistor body in the present invention means a state in which the resistance value between the connecting body and the comb tooth pattern is below a specified threshold value, and does not include the state in which the connecting body and the comb tooth pattern only contact when not pressed as described above.

[0101] The slider 100 is a member having a push portion 110 with a semi-cylindrical shape at the front end, and is made of, for example, a metal material. In addition, the structure of the slider 100 is not particularly limited to the above as long as it can slide while pressing the upper surface 63 of the base material 61 of the upper diaphragm substrate 60A. In the present embodiment, since the object pressed by the slider 100 is the upper surface 63 of the base material 61 of the upper diaphragm substrate 60A, the slider 100 can also be made of an electrically insulating material such as a resin material. In addition, as described later, the finger of an operator can also be used instead of the slider 100.

[0102] The slider 100 is movably held in a frame (not shown) that houses the variable resistor 1A, etc. Moreover, in a state where the push portion 110 abuts against the upper surface 63 of the base material 61 of the upper diaphragm substrate 60A with a specified pressing force, the slider 100 can reciprocally move along the X direction (the extending direction (long side direction) of the connecting body 80) in the drawing while maintaining this pressing force as constant. In the present embodiment, as Figure 1 shown, the sliding region SA in which the slider 100 can slide is included in the non-overlapping region NA of the above-mentioned connecting body 80 in a top view and does not overlap with the resistor body 40. Moreover, the entire area of the connecting body 80 is the non-overlapping region NA. The slider 100 can reciprocally move along the X direction in this sliding region SA. The sliding region SA in the present embodiment corresponds to an example of the "sliding region" in the present invention.

[0103] As Figure 2As shown, by the pressing of the slider 100, the base material 61 of the upper diaphragm substrate 60A flexes downward, and the connecting body 80 comes into contact with the comb pattern 45. Thereby, the resistor 40 and the wiring pattern 70 are electrically connected via the connecting body 80. Specifically, in Figure 2 the state shown, the comb pattern 45f among the comb patterns 45a to 45j is electrically connected to the connecting body 80.

[0104] In addition, the number of the comb patterns 45a to 45j that are simultaneously connected to the connecting body 80 by the pressing of the slider 100 can be multiple.

[0105] Moreover, in the present embodiment, the slider 100 slides while pressing the upper diaphragm substrate 60A, whereby the comb patterns 45 connected by the connecting body 80 change in sequence, and the resistance length (resistance value) of the resistor 40 is variable.

[0106] For example, in Figure 2 the state shown, as described above, the comb pattern 45f is connected via the connecting body 80. As the slider 100 slides from this state in the +X direction in the figure, the comb patterns 45 connected via the connecting body 80 change as follows: comb pattern 45f → comb pattern 45g → comb pattern 45h → comb pattern 45i → comb pattern 45j.

[0107] Accordingly, the wiring pattern 70 connected to the connecting body 80 detects the voltage (detection voltage) corresponding to the comb pattern 45 connected via the connecting body 80. That is, the resistance value between the wiring patterns 31 and 70 changes according to the pressing position of the slider 100. When the slider 100 slides in the +X direction in the figure, the resistance value between the wiring patterns 31 and 70 gradually increases as the slider 100 slides. A multimeter or the like is connected to the wiring patterns 31 and 70 of the variable resistor 1A, and the multimeter or the like outputs the potential difference between the power supply voltage and the detection voltage of the wiring pattern 70.

[0108] On the other hand, in Figure 2 the state shown, when the slider 100 slides in the -X direction in the figure, as the slider 100 slides, the combination of the comb patterns connected via the connecting body 80 changes as follows: comb pattern 45f → comb pattern 45e → comb pattern 45d → comb pattern 45c → comb pattern 45b → comb pattern 45a. In this case, the resistance value between the wiring patterns 31 and 70 gradually decreases as the slider 100 slides.

[0109] For example, in Figure 2When the comb tooth pattern 45a at the left end in [[]] is electrically connected to the wiring pattern 70 via the connector 80, a voltage having a potential approximately the same as the power supply voltage is detected at the wiring pattern 70, and a multimeter or the like outputs the potential difference between the power supply voltage and the detected voltage of the wiring pattern 70 (for example, 0 [V]).

[0110] In contrast, when the comb tooth pattern 45f approximately in the middle is electrically connected to the wiring pattern 70 via the connector 80, the wiring pattern 70 detects a voltage having a potential approximately half of the power supply voltage, and a multimeter or the like outputs the potential difference between the power supply voltage and the detected voltage of the wiring pattern 70 (for example, 2.5 [V]).

[0111] In addition, when Figure 2 the comb tooth pattern 45j at the right end in [[]] is electrically connected to the wiring pattern 70 via the connector 80, the wiring pattern 70 detects a voltage having a potential approximately the same as the ground part, and a multimeter or the like outputs the potential difference between the power supply voltage and the detected voltage of the wiring pattern 70 (for example, 5 [V]).

[0112] Thus, in the present embodiment, since the resistance value between the wiring patterns 31 and 70 varies according to the comb tooth pattern 45 connected via the connector 80, the output of the variable resistor 1A is stepped. Therefore, the more the number of the comb tooth patterns 45, and the narrower the pitch of the comb tooth pattern 45, the higher the resolution of the output of the variable resistor 1A can be improved.

[0113] As described above, in the present embodiment, since the first sandwiching part 23 of the first resist layer 20 fills the space between the comb tooth patterns 45a to 45j, the contact of the connector 80 with the sides of the comb tooth patterns 45a to 45j can be reduced. Thus, it is possible to suppress the comb tooth patterns 45a to 45j from being shaved off or the comb tooth patterns 45a to 45j from being peeled off from the lower diaphragm substrate due to the lateral force causing them to fall, and it is possible to realize the suppression of the deterioration of the comb tooth patterns 45a to 45j.

[0114] In addition, the comb tooth patterns 45a and 45j located at the left and right ends of the comb tooth pattern 45 can be protected not only by the first sandwiching part 23 but also by the third sandwiching part 25, so that it is possible to realize the suppression of the deterioration of the comb tooth patterns 45a and 45j.

[0115] In addition, in the above prior art, there is a difference between the amount of deflection of the upper diaphragm substrate and the connector when the connector contacts the upper surface of the comb pattern and the amount of deflection of the upper diaphragm substrate and the connector when the connector enters the space between the comb patterns. Therefore, the slider not only moves in the sliding direction but also moves in the vertical direction, and the conductive contact between the connector and the comb pattern may sometimes be unstable. In such a case, there is also a problem that the detection accuracy of the variable resistor (for example, the linear accuracy of the output value of the variable resistor with respect to the position of the slider) deteriorates.

[0116] In contrast, in the present embodiment, since the downward movement (the -Z direction in the figure) of the connector 80 in the space between the comb patterns 45 can be reduced by the first clamping portion 23 and the third clamping portion 25 when the slider 100 moves to a position corresponding to the space between the comb patterns 45, the downward movement of the slider 100 can be suppressed, and deterioration of the detection accuracy of the variable resistor can be suppressed.

[0117] In addition, in the present embodiment, since the height H3 of the upper surface 46 of the comb pattern 45 is substantially the same as the height H2 of the upper surface 22a in the first clamping portion 23 and the third clamping portion 25, the slider 100 can slide with almost no movement in the vertical direction, and deterioration of the detection accuracy of the variable resistor can be suppressed.

[0118] Moreover, in the present embodiment, since the upper surface 46 of the comb pattern 45 is substantially parallel to the upper surface 22a in the first clamping portion 23 and the third clamping portion 25, the slider 100 can slide with almost no movement in the vertical direction, and deterioration of the detection accuracy of the variable resistor can be suppressed.

[0119] Next, a method for manufacturing the variable resistor 1A in the first embodiment will be described with reference to the drawings. Figure 8 of (A)~ Figure 9 of (D) are cross-sectional views showing an example of a method for manufacturing the variable resistor 1A in the first embodiment. Figure 8 of (A)~ Figure 8 of (D) the upper figure is a cross-sectional view corresponding to the cross-section along the Figure 1 II-II line, Figure 8 of (A)~ Figure 8 of (D) the lower figure is a cross-sectional view corresponding to the cross-section along the Figure 1 III-III line. Similarly, Figure 9 of (A)~ Figure 9 of (D) the upper figure is a cross-sectional view corresponding to the cross-section along the Figure 1 II-II line, Figure 9 of (A)~Figure 9 The following figure (D) is a cross-sectional view corresponding to the cross-section taken along line III-III of Figure 1 .

[0120] First, as shown in Figure 8 figure (A), a release film 200 is prepared. The release film 200 in this embodiment includes a film 201 and a release layer 202 provided on one main surface of the film 201. The film 201 is made of a resin material. As such a resin material, for example, PET etc. can be exemplified. The release layer 202 is formed by coating a release agent on the film 201. As such a release agent, for example, a silicone-based release agent, a fluorine-based release agent etc. can be exemplified. The release film 200 in this embodiment corresponds to an example of the "support body" in the present invention, and the release layer 202 in this embodiment corresponds to an example of the "release treatment surface" in the present invention.

[0121] By printing a resist material on the release layer 202 of the release film 200 and hardening (curing) it, a second resist layer 50 is formed. At this time, as shown in the upper figure of Figure 8 figure (A), the resist material is not coated in the region where the opening 51 is formed. Thereby, a second resist layer 50 having an opening 51 can be formed.

[0122] In addition, as a method for printing the resist material, either a contact coating method or a non-contact coating method can be used. As a specific example of the contact coating method, screen printing, intaglio printing, offset printing, intaglio offset printing, flexographic printing etc. can be exemplified. On the other hand, as a specific example of the non-contact coating method, inkjet printing, spraying method, dispensing coating method, jet dispensing method etc. can be exemplified. Further, as a heat source for curing the resist material, there is no particular limitation, but an electric heating oven, an infrared oven, a far-infrared furnace (IR), a near-infrared furnace (NIR), a laser irradiation device etc. can be exemplified, and it can also be a heat treatment obtained by combining them.

[0123] Next, as shown in Figure 8 the lower figure of figure (B), by printing a high-resistance conductive paste on the second resist layer 50 and hardening (curing) it, a resistor body 40 is formed. As the high-resistance conductive paste, the above-mentioned conductive paste can be used. As a method for printing the high-resistance conductive paste and a method for hardening it, there is no particular limitation, but a method similar to the printing method and the hardening method of the second resist layer 50 described above can be exemplified.

[0124] Next, as shown in Figure 8As shown in (C) thereof, a comb-tooth pattern 45 is formed by printing a low-resistance conductive paste from the inside of the opening 51 across the resistor body 40 and hardening (curing) it. As the low-resistance conductive paste, the above-described conductive paste can be used. The printing method and the hardening method of the low-resistance conductive paste are not particularly limited, but methods similar to the printing method and the hardening method of the above-described second resist layer 50 can be exemplified.

[0125] Next, as Figure 8 shown in (D) thereof, wiring patterns 31 and 35 are formed by printing a low-resistance conductive paste at both ends of the resistor body 40. As the low-resistance conductive paste, the above-described conductive paste can be used. The printing method and the hardening method of the low-resistance conductive paste are not particularly limited, but methods similar to the printing method and the hardening method of the above-described second resist layer 50 can be exemplified.

[0126] In addition, Figure 8 the formation process of the comb-tooth pattern 45 in (C) thereof and Figure 8 the formation process of the wiring patterns 31 and 35 in (D) thereof can also be in the reverse order. Alternatively, the two processes can be regarded as the same process.

[0127] Next, as Figure 9 shown in (A) thereof, a first resist layer 20 is formed by printing a resist material on the release film 200 so as to cover the wiring patterns 31 and 35, the resistor body 40, the comb-tooth pattern 45, and the second resist layer 50 and hardening (curing) it. As the resist material, a material similar to the resist material constituting the above-described second resist layer 50 can be exemplified. The printing method and the hardening method of the resist material are not particularly limited, but methods similar to the printing method and the hardening method of the above-described second resist layer 50 can be exemplified.

[0128] At this time, by hardening in a state where the resist material fills the space between the comb-tooth patterns 45 and the space between the second resist layer 50 and the comb-tooth pattern 45, a first sandwiching portion 23 that fills the space between the comb-tooth patterns 45 and a third sandwiching portion 25 that fills the space between the second resist layer 50 and the comb-tooth pattern 45 are formed. In addition, by printing and hardening the resist material so as to cover the comb-tooth pattern 45, the above-described second sandwiching portion 24 is formed.

[0129] Next, as Figure 9 shown in (B) thereof, the base material 11 is adhered to the first resist layer 20. As described above, as the base material 11, for example, an adhesive tape having an adhesive layer (not shown) can be used, and the base material 11 is adhered to the first resist layer 20 via the adhesive layer.

[0130] Next, asFigure 9 As shown in (C) of FIG. [Reference numeral not provided], the release film 200 is peeled off. In this way, the lower diaphragm substrate 10A described above is completed. That is, in the manufacturing method of the variable resistor 1A in the present embodiment, after forming the first resist layer 20, the second resist layer 50, the wiring patterns 31 and 35, the resistor body 40, and the comb pattern 45 on the release film 200 and transferring them to the base material 11, the lower diaphragm substrate 10A is manufactured.

[0131] For the lower diaphragm substrate 10A manufactured in this way, since the comb pattern 45 and the first resist layer 20 are directly formed on the release film 200 and transferred, it is possible to easily expose the upper surface 46 of the comb pattern 45 from the protruding portion 22 of the first resist layer 20 in which the comb pattern 45 is embedded. For example, if it is desired to form the first resist layer after forming the comb pattern on the base material, there is a high possibility that the resist material adheres to the upper surface of the comb pattern, so it is difficult to expose the upper surface of the comb pattern.

[0132] In addition, since the upper surface 46 of the comb pattern 45, the upper surface 22a of the protruding portion 22 of the first resist layer 20 in which the comb pattern 45 is embedded, and the upper surface 50a of the second resist layer 50 are formed on the same main surface of the release film 200, it is possible to easily make the upper surfaces 46, 22a, and 50a flush.

[0133] In addition, since the surface shape of the release film 200 with high smoothness can be transferred to the upper surfaces 46, 22a, and 50a, the upper surfaces 46, 22a, and 50a can be formed smoothly. For example, the surface roughness Ra of the upper surfaces 46, 22a, and 50a can be set to 0.01 μm to 0.1 μm.

[0134] Next, as Figure 9 shown in (D) of FIG. [Reference numeral not provided], the upper diaphragm substrate 60A is adhered to the lower diaphragm substrate 10A via the spacer 90. In addition, the wiring pattern 70 and the connector 80 of the lower diaphragm substrate 10A are formed on the lower surface 62 of the base material 61 by printing as described above. As described above, the variable resistor 1A is manufactured.

[0135] In addition, in the present embodiment, the first resist layer 20, the wiring patterns 31 and 35, the resistor body 40, the comb pattern 45, and the second resist layer 50 of the lower diaphragm substrate 10A are formed on the release film 200 and transferred, but it is not limited thereto. At least after forming the first resist layer 20 and the comb pattern 45 on the release film 200 and transferring them to the base material 11, the wiring patterns 31 and 35, the resistor body 40, and the second resist layer 50 can be formed on the base material 11.

[0136] <<Second Embodiment>>

[0137] Figure 10 is a top view showing the variable resistor 1B in the second embodiment, Figure 11 and is a cross-sectional view taken along the XI-XI line of Figure 10 . Figure 12 is a top view showing the lower diaphragm substrate 10B of the variable resistor 1B in the second embodiment. Figure 13 is a bottom view showing the spacer 90 and the upper diaphragm substrate 60B of the variable resistor 1B in the second embodiment.

[0138] As Figures 10 to 13 shown, compared with the variable resistor 1A in the first embodiment, the variable resistor 1B in this embodiment is different from the variable resistor 1A in the first embodiment in that the wiring pattern 70 is formed on the lower diaphragm substrate 10B instead of the upper diaphragm substrate 60B. However, the structure other than this is the same as that in the first embodiment. Hereinafter, for the variable resistor 1B in the second embodiment, only the differences from the first embodiment will be described, and the same reference numerals will be given to the structures that are the same as those in the first embodiment and the description thereof will be omitted.

[0139] As Figure 11 shown, the wiring pattern 70 in this embodiment is formed on the base material 11 via the first resist layer 20. This wiring pattern 70 includes a second main body portion 71 and a second protective layer 72.

[0140] Similar to the above-described wiring patterns 31 and 35, the second main body portion 71 is formed by printing a low-resistance conductive paste and hardening (curing) it. More specifically, the second main body portion 71 can be formed by printing a low-resistance conductive paste on the second protective layer 72 inside the opening 51 formed in the second resist layer 50 and curing it in the process shown in (C) of Figure 8 .

[0141] The second main body portion 71 is made of a material having a resistivity lower than that of the material constituting the resistor body 40, and the resistance value of the resistor body 40 is sufficiently higher than the resistance value of the second main body portion 71 to the extent that the resistance value of the second main body portion 71 can be ignored. Specifically, the resistance value of the resistor body 40 is 10 times or more, preferably 100 times or more, the resistance value of the second main body portion 71. In addition, the resistivity of the material constituting the resistor body 40 is 10 times or more, preferably 100 times or more, the resistivity of the material constituting the second main body portion 71.

[0142] As Figure 12 shown, the second main body portion 71 extends along the X direction in the figure. The second main body portion 71 has a parallel portion 711 extending substantially parallel to the resistor body 40 at its end. In addition, the planar shape of the second main body portion 71 is not particularly limited to the above.

[0143] The second protective layer 72 of the wiring pattern 70 covers the parallel portion 711 of the second main body portion 71. The second protective layer 72 is a layer that protects the parallel portion 711 of the second main body portion 71, and is formed by printing and curing a highly resistive conductive paste having a higher resistance value than the above-mentioned low-resistance conductive paste. For example, the second protective layer 72 can be formed by printing and curing a highly resistive conductive paste inside the opening 51 of the second resist layer 50 in the process shown in (B) of Figure 8 .

[0144] As a specific example of such a highly resistive conductive paste, there is no particular limitation, but for example, carbon paste can be exemplified. The second protective layer 72 has a length approximately the same as the length of the resistor body 40 along the X direction in the figure, and is arranged at a predetermined interval from the resistor body 40 and the comb pattern 45. That is, the second protective layer 72 of the wiring pattern 70 is arranged substantially parallel to the resistor body 40 and also substantially parallel to the arrangement direction of the comb pattern 45. In addition, the wiring pattern 70 may not have the second protective layer 72.

[0145] On the other hand, as shown in Figure 10 , Figure 11 and Figure 13 , in the connector 80 of the present embodiment, the wiring pattern 70 is not connected as in the first embodiment. In the present embodiment, the connector 80 has a rectangular planar shape, and this planar shape has a width wider than that of the connector 80 in the first embodiment. Moreover, in a plan view, the connector 80 is disposed on the lower surface 62 of the base material 61 in such a manner that one edge portion (the -Y side edge portion along the X direction in the figure) 80a of the connector 80 overlaps with the comb pattern 45, and the other edge portion (the +Y side edge portion along the X direction in the figure) 80b of the connector 80 overlaps with the wiring pattern 70.

[0146] As shown in Figure 11 , in the variable resistor 1B in the present embodiment, by the pressing of the slider 100, the base material 61 of the upper diaphragm substrate 60B deflects downward, and the connector 80 comes into contact with the comb pattern 45 and the wiring pattern 70 respectively. Thereby, the resistor body 40 is electrically connected to the wiring pattern 70 via the connector 80. Moreover, by sliding the slider 100 along the X direction while pressing the upper diaphragm substrate 60B, the connection position between the connector 80 and the resistor body 40 changes, and the resistance length (resistance value) of the resistor body 40 is variable.

[0147] Specifically, as described above, a power supply voltage (e.g., 5 [V]) is applied to one wiring pattern 31 connected to the resistor body 40, while the other wiring pattern 35 connected to the resistor body 40 is grounded. Additionally, by the pressing of the slider 100, the wiring pattern 70 is always electrically connected to the resistor body 40 via the connector 80, and the wiring pattern 70 is electrically connected to the resistor body 40 at an arbitrary position in the X direction in the figure. Therefore, this wiring pattern 70 detects a voltage (detection voltage) corresponding to the pressing position of the slider 100. That is, in the present embodiment, the resistance value between the wiring patterns 31 and 70 varies according to the pressing position of the slider 100. Moreover, a multimeter (not shown) or the like is connected to the wiring patterns 31 and 70 of this variable resistor 1B, and the potential difference between the power supply voltage and the detection voltage of the wiring pattern 70 is output.

[0148] For example, when the slider 100 is located at the Figure 10 left end in the sliding region SA, since the connection position of the connector 80 in the resistor body 40 is also at the left end, the wiring pattern 70 detects a voltage with a potential approximately the same as the power supply voltage, and the potential difference between the power supply voltage and the detection voltage of the wiring pattern 70 is output through a multimeter or the like (e.g., 0 [V]).

[0149] In contrast, as Figure 10 shown, when the slider 100 is located approximately in the center in the sliding region SA, since the connection position of the connector 80 in the resistor body 40 is also approximately in the center, the wiring pattern 70 detects a voltage with a potential approximately half of the power supply voltage, and the potential difference between the power supply voltage and the detection voltage of the wiring pattern 70 is output through a multimeter or the like (e.g., 2.5 [V]).

[0150] Additionally, when the slider 100 is located at the Figure 10 right end in the sliding region SA, since the connection position of the connector 80 in the resistor body 40 is also at the right end, the wiring pattern 70 detects a voltage with a potential approximately the same as the grounding member, and the potential difference between the power supply voltage and the detection voltage of the wiring pattern 70 is output through a multimeter or the like (e.g., 5 [V]).

[0151] In this second embodiment, since the first clamping portion 23 fills the space between the comb patterns 45, it is also possible to suppress the deterioration of the comb patterns 45 and the deterioration of the detection accuracy of the variable resistor 1B in the same manner as in the above first embodiment.

[0152] <<Third Embodiment>>

[0153] Figure 14 is a top view showing the variable resistor 1C in the third embodiment, Figure 15 is along Figure 14Cross-sectional view taken along line XV-XV. Figure 16 It is a top view showing the lower diaphragm substrate 10C of the variable resistor 1C in the third embodiment.

[0154] As Figures 14 to 16 shown, compared with the variable resistor 1B of the second embodiment, the variable resistor 1C of the present embodiment is different from the second embodiment in that: (1) the lower diaphragm substrate 10C has comb patterns 75a to 75i; and (2) the connecting body 80 does not overlap with the wiring pattern 70, but the other structures are the same as those of the second embodiment. Hereinafter, for the variable resistor 1C in the third embodiment, only the differences from the second embodiment will be described, and the same reference numerals will be given to the structures that are the same as those of the second embodiment and the description thereof will be omitted. In addition, in the present embodiment, the plurality of comb patterns 75a to 75i may be collectively referred to as the comb pattern 75.

[0155] Similar to the comb pattern 45, the comb pattern 75 is formed by printing a low-resistance conductive paste and curing it. As Figure 14 shown, the comb pattern 75 in the present embodiment is provided between the resistor body 40 and the wiring pattern 70. In addition, the comb pattern 75 in the present embodiment is an example of the "second comb pattern" in the present invention.

[0156] In addition, as Figure 16 shown, each of the comb patterns 75a to 75i has a linear planar shape, branches from the second main body portion 71 of the wiring pattern 70 and extends in the Y direction in the figure. In addition, the comb patterns 75a to 75i project from the wiring pattern 70 toward the resistor body 40. That is, the comb patterns 75a to 75i are connected to the wiring pattern 70 and extend below the sliding region SA. Moreover, the plurality of comb patterns 75a to 75i are arranged substantially at equal intervals in parallel.

[0157] As Figure 14 shown, all of the comb patterns 45a to 45j and 75a to 75i face the connecting body 80 through the openings 91 of the spacer 90 and overlap with the sliding region SA of the slider 100 in a top view. In addition, as Figures 14 to 16 shown, the comb patterns 45a to 45j and the comb patterns 75a to 75i are alternately arranged and substantially equally spaced along the X direction in the figure in a top view.

[0158] In addition, the number of teeth of the comb patterns 45 and 75 is not particularly limited to the above cases. Also, the arrangement of the comb patterns 45 and 75 is not particularly limited to the above cases. Furthermore, as will be described later, the more the number of teeth of the comb patterns 45 and 75, the more the resolution (resolution) of the output of the variable resistor 1C can be improved. Additionally, if a gap is ensured between the comb patterns 45 and 75, the gap between the comb patterns 45 and 75 is not limited to an equal gap.

[0159] The first sandwiching portion 23 of the first resistive layer 20 in the present embodiment includes portions that fill the spaces between the comb patterns 45, portions that fill the spaces between the comb patterns 75, and portions that fill the spaces between the comb patterns 45 and the comb patterns 75, and these portions are connected to each other. Therefore, the planar shape of the first sandwiching portion 23 is a meandering shape extending in the X direction.

[0160] In addition, the third sandwiching portion 25 includes, in addition to the portions that fill the spaces between the second resistive layer 50 and the comb patterns 45a and 45j, portions that fill the spaces between the second resistive layer 50 and the comb patterns 75a and 75i. Therefore, the planar shape of the third sandwiching portion 25 is an L shape.

[0161] As Figure 14 and Figure 15 shown, by the pushing of the slider 100, the base material 61 of the upper diaphragm substrate 60B flexes downward, and the connectors 80 come into contact with the mutually adjacent comb patterns 45 and 75 respectively. Thereby, the resistor body 40 and the wiring pattern 70 are electrically connected via the connectors 80. Specifically, in the state shown in Figure 15 the comb pattern 45f among the comb patterns 45a to 45j is electrically connected to the comb pattern 75e among the comb patterns 75a to 75i via the connector 80.

[0162] In addition, the number of the comb patterns 45a to 45j that are simultaneously connected to the connector 80 by the pushing of the slider 100 can also be multiple. Similarly, the number of the comb patterns 75a to 75j that are simultaneously connected to the connector 80 by the pushing of the slider 100 can also be multiple.

[0163] Moreover, in the present embodiment, by sliding the slider 100 while pushing the upper diaphragm substrate 60B, the combination of the comb patterns 45 and 75 connected by the connectors 80 changes sequentially, and the resistance length (resistance value) of the resistor body 40 is variable.

[0164] For example, in Figure 15In the state shown, as described above, the comb patterns 75e and 45f are connected via the connecting body 80. As the slider 100 slides in the +X direction in the figure from this state, the combination of the comb patterns connected via the connecting body 80 changes as follows: comb patterns 75e, 45f → comb patterns 45f, 75f → comb patterns 75f, 45g → comb patterns 45g, 75g → comb patterns 75g, 45h → … → comb patterns 45i, 75i → comb patterns 75i, 45j.

[0165] Accordingly, the wiring patterns 70 connected to the comb patterns 75a to 75i detect the voltage (detected voltage) corresponding to the combination of the comb patterns 45 and 75 connected via the connecting body 80. That is, in this embodiment, the resistance value between the wiring patterns 31 and 70 also changes according to the pressing position of the slider 100. When the slider 100 slides in the +X direction in the figure, the resistance value between the wiring patterns 31 and 70 gradually increases as the slider 100 slides. A multimeter or the like is connected to the wiring patterns 31 and 70 of the variable resistor 1C, and the multimeter or the like outputs the potential difference between the power supply voltage and the detected voltage of the wiring pattern 70.

[0166] On the other hand, when the slider 100 slides in the -X direction in the figure from the Figure 15 state shown, as the slider 100 slides, the combination of the comb patterns connected via the connecting body 80 changes as follows: comb patterns 45f, 75e → comb patterns 75e, 45e → comb patterns 45e, 75d → comb patterns 75d, 45d → comb patterns 45d, 75c → … → comb patterns 45b, 75a → comb patterns 75a, 45a. In this case, the resistance value between the wiring patterns 31 and 70 gradually decreases as the slider 100 slides.

[0167] In this third embodiment, since the first clamping portion 23 fills the space between the comb patterns 45 and 75, it is possible to suppress the deterioration of the comb patterns 45 and 75 in the same manner as in the first embodiment described above, and it is also possible to suppress the deterioration of the detection accuracy of the variable resistor 1C.

[0168] In addition, the embodiments described above are described for the purpose of easily understanding the present invention, not for the purpose of limiting the present invention. Therefore, each element disclosed in the above embodiments also includes all design changes and equivalents belonging to the technical scope of the present invention.

[0169] For example, in the first to third embodiments, the comb pattern 45 is formed on the lower diaphragm substrate 10A, but it may also be formed on the upper diaphragm substrate 60A pressed by the slider 100.

[0170] In addition, in the first to third embodiments, the variable resistors 1A to 1C are operated by the slider 100 provided in the variable resistors 1A to 1C themselves, but it is not particularly limited thereto. For example, the operator can also operate the variable resistor by using a finger instead of the slider 100.

[0171] In addition, in the above-described embodiments, the detection voltage of the wiring pattern 70 is obtained by connecting the wiring pattern 31 to the power supply and connecting the wiring pattern 35 to the grounding member, thereby detecting the resistance values of the variable resistors 1A to 1C. However, the circuit structure for detecting the resistance values of the variable resistors is not particularly limited thereto.

[0172] For example, the wiring pattern 35 may not be provided, and the power supply may be connected to the wiring patterns 31 and 70. In this case, the resistance value between the wiring patterns 31 and 70 also changes according to the pressing position of the slider 100.

[0173] Description of reference numerals:

[0174] 1A to 1C: Variable resistor; 10A to 10C: Lower diaphragm substrate; 11: Substrate; 11a: Upper surface; 20: First resist layer; 21: Thin wall portion; 21a: Upper surface; 22: Protrusion; 22a: Upper surface; 23: First clamping portion; 23a: First exposed portion; 23b, 23c: First non-exposed portion and second non-exposed portion; 24: Second clamping portion; 25: Third clamping portion; 31: Wiring pattern; 35: Wiring pattern; 40: Resistor body; 45, 45a to 45j: Comb pattern; 46: Upper surface; 47: Lower surface; 48a: Second exposed portion; 48b, 48c: Third non-exposed portion and fourth non-exposed portion; 50: Second resist layer; 50a: Upper surface; 51: Opening; 60A, 60B: Upper diaphragm substrate; 61: Substrate; 62: Lower surface; 63: Upper surface; 70: Wiring pattern; 71: Second main body portion; 711: Parallel portion; 72: Second protective layer; 75, 75a to 75i: Comb pattern; 76: Second front end face; 80: Connecting body; 80a, 80b: Edge portion; 81: First main body portion; 82: First protective layer; 90: Spacer; 91: Opening; 100: Slider; 110: Pressing portion; 200: Release film; 201: Film; 202: Release layer; NA: Non-overlapping region; SA: Sliding region.

Claims

1. A variable resistor, comprising: A first substrate; A plurality of comb patterns supported on the first substrate and extending with spaces therebetween; And An insulator disposed on the first substrate so as to fill the spaces between the comb patterns, The comb pattern has a front end face on a side opposite to the first substrate, The front end face is exposed from the insulator.

2. The variable resistor according to claim 1, wherein The insulator has a first main face on a side opposite to the first substrate, The height of the front end face from the first substrate is substantially the same as the height of the first main face from the first substrate.

3. The variable resistor according to claim 1, wherein The insulator has a first main face on a side opposite to the first substrate, The first main face extends substantially parallel to the first substrate.

4. The variable resistor according to claim 1, wherein The insulator includes: A first clamping portion located between the comb patterns; and A second clamping portion located between the first substrate and the comb patterns.

5. The variable resistor according to claim 1, wherein The insulator has a first main face on a side opposite to the first substrate, The variable resistor includes a resistor body, The plurality of comb patterns include a plurality of first comb patterns connected to the resistor body, The first comb pattern includes: A first portion where the front end face is exposed from the insulator; And A second portion integrally formed with the first portion and connected to the resistor body, In a first direction perpendicular to the first main face, the thickness of the second portion is thinner than the thickness of the first portion.

6. The variable resistor according to claim 1, wherein The variable resistor includes: A resistor body disposed on the first substrate; A first wiring pattern disposed on the first substrate and connected to the resistor body, A spacer having an opening; A second substrate laminated on the first substrate via the spacer; A connector disposed on the second substrate so as to be located within the opening and electrically connected to the resistor body by being pushed by a slider from the outside of the second substrate; And A second wiring pattern disposed on the second substrate and connected to the connector, or disposed on the first substrate and electrically connected to the connector by being pushed by the slider, In a plan view, the connector has a non-overlapping region that does not overlap with the resistor body, In a plan view, the sliding region where the slider can slide is included in the non-overlapping region, The front end face is a face of the comb pattern that faces the connector, The resistance value between the first wiring pattern and the second wiring pattern changes according to the position of the slider.

7. The variable resistor according to claim 6, wherein The second wiring pattern is disposed on the second substrate and connected to the connector, The plurality of comb patterns include a plurality of first comb patterns connected to the resistor body, In a top view, the first comb tooth pattern overlaps with the sliding region. The connecting body comes into contact with the first comb tooth pattern by being pressed by the slider from the outer side of the second substrate.

8. The variable resistor according to claim 6, wherein the second wiring pattern is disposed on the first substrate, the plurality of comb tooth patterns includes a plurality of first comb tooth patterns connected to the resistor body, In a top view, the first comb tooth pattern and the second wiring pattern overlap with the sliding region, the connecting body comes into contact with the first comb tooth pattern and the second wiring pattern by being pressed by the slider from the outer side of the second substrate.

9. The variable resistor according to claim 6, wherein the second wiring pattern is disposed on the first substrate, the plurality of comb tooth patterns includes: a plurality of first comb tooth patterns connected to the resistor body; and a plurality of second comb tooth patterns connected to the second wiring pattern, In a top view, the first comb tooth pattern and the second comb tooth pattern overlap with the sliding region, the first comb tooth pattern and the second comb tooth pattern are alternately arranged in the sliding region along the extending direction of the connecting body, the connecting body comes into contact with the first comb tooth pattern and the second comb tooth pattern by being pressed by the slider from the first substrate.

10. The variable resistor according to claim 6, wherein the variable resistor further includes a third wiring pattern disposed on the first substrate and connected to the resistor body, the plurality of comb tooth patterns includes: a third comb tooth pattern connected to the first wiring pattern; and and a fourth comb tooth pattern connected to the third wiring pattern, In a top view, the third comb tooth pattern and the fourth comb tooth pattern overlap with the sliding region.

11. A method for manufacturing a variable resistor, which manufactures the variable resistor according to any one of claims 1 to 10, comprising: a first step of preparing a support body having a demolding treatment surface; a second step of forming the comb tooth pattern on the demolding treatment surface of the support body; a third step of forming the insulator on the demolding treatment surface so as to fill the spaces between the comb tooth patterns; and a fourth step of transferring the comb tooth pattern and the insulator from the support body to the first substrate.

Images