Electronic device with antenna module

Abstract

The electronic device includes: a metal frame; the dielectric shell is formed on one side of the metal frame; the air material is contained in the interior of the dielectric shell; and an array antenna formed inside a substrate disposed in the inner region of the dielectric case. The dielectric housing includes: a first side portion attached to the metal frame; a second side surface portion corresponding to the first side surface portion; and a third side surface portion and a fourth side surface portion formed between both sides of the first side surface portion and the second side surface portion. The plurality of side surface portions of the dielectric housing include an inner side surface and an outer side surface corresponding to the inner side surface. The inner side surface is provided with a first inner side surface which is separated from a vertical surface at the tail end of the array antenna by a first gap; and the second inner side surface is separated from a vertical surface at the tail end of the array antenna by a second gap.

Description

TECHNICAL FIELD

[0001] This specification relates to an antenna module and an electronic device including the same. Specific embodiments relate to an antenna module disposed within a dielectric structure of a specific shape and an electronic device including the same. BACKGROUND ART

[0002] As the functions of electronic devices become diversified, they can be implemented as multimedia devices (Multi media players) such as those having comprehensive functions of playing music or video files, games, broadcast reception, etc., and image display devices.

[0003] An image display device is a device that plays image content, receiving and playing images from various sources. The image display device is implemented by various devices such as a PC (Personal Computer), a smart phone, a tablet PC, a laptop computer, a TV (television), etc. In an image display device such as a smart TV, an application program such as a web browser for providing network content can be provided.

[0004] In order for such an electronic device such as an image display device to perform communication with surrounding electronic devices, it may have a communication module including an antenna. On the other hand, recently, as the display area of the image display device has expanded, the configuration space of the communication module including the antenna has decreased. Accordingly, there is an increasing need to dispose an antenna inside a multi-layer circuit board for implementing the communication module.

[0005] On the other hand, as an interface for communication services between electronic devices, a WiFi wireless interface can be considered. In the case of using such a WiFi wireless interface, in order to perform high-speed data transmission between electronic devices, a millimeter wave band (mmWave) can be used. In particular, a wireless interface such as 802.11ay can be used to achieve high-speed data transmission between electronic devices.

[0006] Regarding this, an array antenna capable of operating in the millimeter wave (mmWave) band can be installed in an antenna module. However, such an antenna disposed in the antenna module and electronic components such as a transceiver circuit are configured to be electrically connected. For this reason, the transceiver circuit is operably coupled to the antenna module, and the antenna module may be composed of a multi-layer substrate.

[0007] A plurality of antenna elements of the antenna module in the form of a multilayer substrate can radiate wireless signals in the direction of one side surface of the antenna module. However, when such an antenna module is disposed in an electronic device implemented by a metal frame in a side region, there is a problem that the antenna performance is significantly degraded. In particular, due to a large metal frame such as a display in the upper region, the radio waves of the antenna cannot be radiated well to the side region and are reflected, resulting in a problem that the radio waves of the antenna are formed in the lower region. As a result, it is difficult for the electronic device to perform high-speed wireless communication with other electronic devices in the side region. Summary of the Invention

[0008] Problems to be Solved by the Invention

[0009] The object of the present specification is to solve the foregoing problems and other problems. Further, another object is to provide an electronic device having an antenna module operating in a millimeter wave band and formed with a metal frame.

[0010] Another object of the present specification is to solve the problem that an antenna that radiates radio waves to the side cannot radiate radio waves to the side normally due to a metal frame.

[0011] Another object of the present specification is to optimize the shape of a dielectric housing disposed below a metal frame, so as to improve radiation performance in the side direction.

[0012] Another object of the present specification is to dispose the antenna module at different positions in the lower part of the electronic device, so as to be able to perform wireless communication with various surrounding electronic devices in each direction.

[0013] Technical Solutions for Solving the Problems

[0014] To achieve the above or other objects, there is provided an electronic device having an antenna module according to an embodiment. The electronic device includes: a metal frame forming a side region of the electronic device; a dielectric housing formed on one side of the metal frame; an air material contained inside the dielectric housing; and an array antenna formed inside a substrate disposed in an inner region of the dielectric housing. The dielectric housing includes a first side surface attached to the metal frame, a second side surface corresponding to the first side surface, and a third side surface and a fourth side surface formed between the two sides of the first side surface and the second side surface. The plurality of side surfaces of the dielectric housing include an inner side surface and an outer side surface corresponding to the inner side surface. The inner side surface includes: a first inner side surface spaced apart from a vertical surface of the array antenna terminal by a first gap; and a second inner side surface spaced apart from a vertical surface of the array antenna terminal by a second gap.

[0015] According to an embodiment, the inner side surface includes: the first inner side surface, which is formed to face each other in a state of being separated from any one of the vertical surface at the end of the array antenna and the third side surface portion and the fourth side surface portion of the dielectric housing by a first gap; and the second inner side surface, which is formed to face each other in a state of being separated from the vertical surface at the end of the array antenna and the any one surface by a second gap.

[0016] According to an embodiment, the region of the second inner side surface may be formed between the first inner side surface and the metal frame. The second gap may be formed wider than the first gap. The first thickness between the first inner side surface and the outer side surface may be formed wider than the second thickness between the second inner side surface and the outer side surface. The array antenna may be configured to radiate a radio signal through the inner side surface and the outer side surface of the dielectric housing.

[0017] According to an embodiment, the array antenna and the second inner side surface of the dielectric housing may be in a state of being separated by a third gap. The array antenna and the first inner side surface of the dielectric housing may be in a state of being separated by a fourth gap. The third gap may be formed wider than the fourth gap.

[0018] According to an embodiment, the array antenna may be formed to be close to the region of the first inner side surface.

[0019] According to an embodiment, a connection portion electrically connected to the metal frame may be additionally formed in the ground region formed inside the substrate.

[0020] According to an embodiment, the substrate on which the array antenna is formed may be composed of a multi-layer substrate. A plurality of antenna elements of the array antenna may be disposed on a specific layer of the multi-layer substrate. The plurality of antenna elements may be configured to radiate a beamformed radio signal through one side surface of the multi-layer substrate, the first inner side surface of the dielectric housing, and the outer side surface.

[0021] According to an embodiment, the plurality of antenna elements may be configured as a 1xN array antenna spaced apart at a predetermined interval in one axial direction on the specific layer of the multi-layer substrate. The plurality of antenna elements may be formed as end-fire radiators that radiate radio signals through one side surface of the multi-layer substrate.

[0022] According to an embodiment, the 1xN array antenna may form a first radiation pattern having a first beam width in the one axial direction. A second radiation pattern having a second beam width within a predetermined angle range may be formed in the lower direction of the metal housing. The second beam width may be formed wider than the first beam width.

[0023] An electronic device with an antenna module according to this specification includes: a metal frame that forms a side region of the electronic device; a dielectric housing formed on one side of the metal frame; an air material contained inside the dielectric housing; and an array antenna formed inside a substrate disposed in an inner region of the dielectric housing. The dielectric housing includes a first side surface attached to the metal frame, a second side surface corresponding to the first side surface, and third and fourth side surfaces formed between both sides of the first side surface and the second side surface. The plurality of side surfaces of the dielectric housing include an inner side surface and an outer side surface corresponding to the inner side surface. The outer side surface may be formed to be inclined with respect to a vertical axis.

[0024] According to an embodiment, the inner side surface may include: a first inner side surface formed to face each other in a state of being separated from a vertical surface at an end of the array antenna and any one of the third and fourth side surfaces of the dielectric housing by a first gap; and a second inner side surface formed to face each other in a state of being separated from the vertical surface at the end of the array antenna and the any one surface by a plurality of gaps. A region of the second inner side surface may be formed between the first inner side surface and the metal frame. The plurality of gaps may be formed wider than the first gap. The first inner side surface and the outer side surface may form a plurality of thicknesses. The second inner side surface and the outer side surface may be formed to have a uniform thickness. The array antenna may be configured to radiate a wireless signal through the inner side surface of the dielectric housing and the inclined outer side surface.

[0025] According to an embodiment, the array antenna and the second inner side surface of the dielectric housing may be in a state of being separated by a third gap. The array antenna and the first inner side surface of the dielectric housing may be in a state of being separated by a fourth gap. The third gap may be formed wider than the fourth gap.

[0026] According to an embodiment, the array antenna may be formed to be close to a region of the first inner side surface.

[0027] According to an embodiment, a connection part electrically connected to the metal frame may be additionally formed in a ground region formed inside the substrate.

[0028] According to an embodiment, a length of the first side surface may be formed longer than a length of the second side surface.

[0029] According to an embodiment, the outer side surface of the dielectric housing may be inclined at an angle of 15 degrees to 45 degrees with respect to a vertical axis.

[0030] According to an embodiment, the outer side surface of the dielectric housing may be inclined at an angle of less than 60 degrees with respect to the vertical axis.

[0031] According to an embodiment, the substrate on which the array antenna is formed may be composed of a multi-layer substrate. A plurality of antenna elements of the array antenna may be disposed on a specific layer of the multi-layer substrate. The plurality of antenna elements may be configured to radiate a beamformed wireless signal through one side surface of the multi-layer substrate, the first inner side surface, and the outer side surface of the dielectric housing.

[0032] According to an embodiment, the plurality of antenna elements may be configured as a 1xN array antenna spaced apart at a predetermined interval in one axial direction on the specific layer of the multi-layer substrate. The plurality of antenna elements may be formed as end-fire radiators that radiate wireless signals through one side surface of the multi-layer substrate.

[0033] According to an embodiment, the 1xN array antenna may form a first radiation pattern having a first beam width in the one axial direction. A second radiation pattern having a second beam width within a predetermined angular range may be formed in the lower direction of the metal housing. The second beam width may be formed wider than the first beam width.

[0034] According to an embodiment, the multi-layer substrate may be disposed at a distance from the second inner side surface in the lower region of the dielectric housing. The array antenna may be configured to radiate a wireless signal in a frequency band between 57 GHz and 70 GHz. The height from the specific layer of the multi-layer substrate on which the plurality of antenna elements are disposed to the upper end of the second inner side surface may be formed in the range of 0.08λ0 to 0.9λ0.

[0035] According to an embodiment, the second height formed by the air material from the upper end of the second inner side surface to the upper end of the first inner side surface of the dielectric housing may be formed to have a value of 0.04λ0 or more. The distance between the second inner side surface of the dielectric housing and the multi-layer substrate may be formed to have a value of 0.6λ0 or less.

[0036] According to an embodiment, the connection portion may be implemented by a metal housing disposed at the upper end of the multi-layer substrate. A plurality of antenna elements may be disposed in a first region corresponding to the radiator region of the multi-layer substrate. The metal housing may be disposed in a second region corresponding to the ground region of the multi-layer substrate. The distance gc from the position where the plurality of antenna elements of the array antenna are disposed to one end of the metal housing may be formed such that (n + 0.1)*λ0 < gc < (n + 0.7)*λ0.

[0037] Advantages of the Invention

[0038] The technical effects of the antenna module disposed inside the dielectric housing of this specification and the electronic device including the same are as follows.

[0039] According to an embodiment, the antenna module can be disposed inside the dielectric housing in the lower region of the metal frame of the electronic device, so that radio waves can be radiated to the side region in the millimeter wave band.

[0040] According to an embodiment, the antenna module that radiates radio waves to the side can be disposed inside the dielectric housing having an inclined outer surface, so that even in a structure with a metal frame formed, radio waves can be radiated to the side region.

[0041] According to an embodiment, the outer shape of the dielectric housing disposed below the metal frame can be optimized to an inclined structure, and an air layer can be formed while forming a dielectric structure in a protruding structure inside the dielectric body, thereby improving the radiation performance in the side direction.

[0042] According to an embodiment, the antenna radiation performance can be improved by the local dielectric technology of forming an air layer inside the dielectric housing, the inclined dielectric structure with an inclined outer surface, and the metal fixing device.

[0043] According to an embodiment, the antenna module can be disposed at different positions in the lower part of the electronic device, so that wireless communication can be performed with various surrounding electronic devices in all directions.

[0044] Through the following detailed description, the additional scope to which this specification can be applied will be further clarified. However, since those of ordinary skill in the art can clearly understand various changes and modifications within the idea and scope of this specification, it should be understood that the specific embodiments such as the detailed description and the preferred embodiments of this specification are only examples. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 FIG. is a diagram schematically showing an example of the entire wireless AV system including an image display device according to an embodiment of this specification.

[0046] Figure 2 Shows the detailed configuration of a plurality of electronic devices supporting the wireless interface of this specification.

[0047] Figure 3a Shows the RTS (Request to Send) frame and CTS (Clear to Send) frame of this specification.

[0048] Figure 3b A block diagram of a communication system 400 illustrating an example of this specification is shown.

[0049] Figure 4An electronic device configured with a plurality of antenna modules and a plurality of transceiver circuit modules according to an embodiment is shown.

[0050] Figure 5a A configuration in which a multilayer circuit board configured with an array antenna module according to this specification is connected to an RFIC is shown.

[0051] Figure 5b It is a conceptual diagram showing antenna structures having different radiation directions from each other.

[0052] Figure 5c A combined structure of a multilayer substrate and a main substrate according to an embodiment is shown.

[0053] Figure 6 It is a conceptual diagram of a plurality of communication modules arranged at the lower part of an image display device, and the configuration of the communication modules communicates with another communication module in the front direction.

[0054] Figure 7a A structure of an antenna module arranged in a dielectric housing arranged in a lower region of a metal frame of an electronic device is shown.

[0055] Figure 7b It is an enlarged view of the antenna module arranged in Figure 7a the dielectric housing.

[0056] Figure 8a and Figure 8b A structure in which an antenna module is arranged in a dielectric housing having different thicknesses formed on the inner side and a vertical outer side is shown.

[0057] Figure 8c and Figure 8d A structure in which an antenna module is arranged in a dielectric housing having different thicknesses formed on the inner side and an inclined outer side is shown.

[0058] Figure 9 It is shown in Figures 8a to 8d the antenna module, an array antenna structure formed by a plurality of antenna elements.

[0059] Figure 10 A structure in which an antenna module is arranged inside a vertically formed dielectric housing according to an embodiment is shown.

[0060] Figure 11 It is a diagram obtained by comparing radiation patterns in the horizontal direction among a structure in which only an antenna module is arranged without a metal frame, a structure in which an antenna module is arranged in a lower region of a metal frame, and a structure in which an antenna module is arranged inside a dielectric housing.

[0061] Figure 12 It is a comparison of Figure 8c the inclined dielectric housing and Figure 10A diagram obtained from the radiation patterns of the antenna module inside the vertical dielectric housing on the horizontal and vertical axes.

[0062] Figure 13a Shows the radiation pattern of the x - y plane as the horizontal plane according to the change in the tilt angle of the dielectric housing.

[0063] Figure 13b Shows the antenna gain at each frequency according to the change in height from a specific layer of the multilayer substrate to the upper end of the first dielectric structure.

[0064] Figure 14a Shows the antenna gain at each frequency according to the change in height of the air layer inside the dielectric housing.

[0065] Figure 14b Shows the antenna peak gain at each frequency according to the change in the gap spacing between the multilayer substrate and the first dielectric structure.

[0066] Figure 15 Shows the structure in which a metal housing is arranged on the multilayer substrate of the antenna module disposed inside the dielectric housing in this specification.

[0067] Figure 16 Shows the change in the radiation pattern according to the distance between the metal housing and the antenna element.

[0068] Figure 17a Shows the electric field distribution in which the electric field formed in the antenna module is deformed due to the metal frame.

[0069] Figure 17b Shows that in the case of a dielectric housing having an outer side surface with a Figure 10 vertical structure formed in the lower region of the metal frame.

[0070] Figure 18a Shows the electric field distribution in the structure formed by the first dielectric structure and the air layer inside the dielectric housing.

[0071] Figure 18b Shows the electric field distribution in the structure in which the inside of the dielectric housing is formed by the first dielectric structure and the air layer and the outer side surface of the dielectric housing is inclined.

[0072] Figure 19 Shows an electronic device having antenna modules arranged in different regions of the dielectric housing in this specification.

[0073] Figure 20a Shows the structure in which an antenna module in which a first - type antenna and a second - type antenna are formed as an array antenna is arranged in an electronic device.

[0074] Figure 20b Is an enlarged Figure 20aDiagram of a plurality of array antenna modules.

[0075] Figure 21 Illustrates antenna modules coupled in different coupling structures to specific positions of an electronic device in an embodiment. Detailed Description

[0076] Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the accompanying drawings. Here, the same or similar components are given the same reference numerals regardless of the figure numbers, and redundant descriptions thereof will be omitted. In the following description, the suffixes "module" and "unit" for components are given or used interchangeably only for the convenience of writing the specification, and do not have any meaning or function of mutual distinction. Also, in the process of describing the embodiments disclosed in the present specification, if it is determined that a detailed description of related well-known technologies will cause confusion in the gist of the embodiments disclosed in the present specification, the detailed description thereof will be omitted. Also, the accompanying drawings are only for easy understanding of the embodiments disclosed in the present specification, and the technical idea disclosed in the present specification is not limited by the accompanying drawings, and should be understood to cover all changes, equivalents, and alternatives included in the idea and technical scope of the present specification.

[0077] Ordinal terms such as first, second, etc. may be used to describe various components, but the components are not limited by the terms. The terms are only used for the purpose of distinguishing one component from other components.

[0078] If it is mentioned that a certain component is "connected" or "coupled" to another component, it should be understood that it may be directly connected or coupled to another component, but there may also be other components in between. Conversely, if it is mentioned that a certain component is "directly connected" or "directly coupled" to another component, it should be understood that there are no other components between them.

[0079] Unless otherwise clearly indicated in the context, singular expressions include plural expressions.

[0080] In this application, terms such as "comprising" or "having" are only used to specify the existence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and are not intended to preclude the existence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof in advance.

[0081] The electronic devices described in this specification may include mobile phones, smart phones, laptop computers, digital broadcast terminals, personal digital assistants (PDAs), portable multimedia players (PMPs), navigation devices, slate PCs, tablet PCs, ultrabooks, wearable devices (e.g., smart watches, smart glasses, head-mounted displays (HMDs)), and the like.

[0082] However, those skilled in the art can easily understand that the configurations of the embodiments described in this specification can be applied not only to mobile terminals but also to fixed terminals such as digital TVs, desktop computers, and digital signage, in addition to the cases where they are only applicable to mobile terminals.

[0083] Figure 1 FIG. is a diagram schematically showing an example of an entire wireless AV system including an image display device according to an embodiment of this specification.

[0084] As Figure 1 shown, the image display device 100 of another embodiment of the present invention is connected to a wireless AV system (or broadcast network) and an Internet network. For example, the image display device 100 is a network TV, a smart TV, an HBBTV, or the like.

[0085] On the other hand, the image display device 100 can be wirelessly connected to the wireless AV system (or broadcast network) through a wireless interface, or can be wirelessly or wiredly connected to the Internet network through an Internet interface. In this regard, the image display device 100 can be configured to be connected to a server or other electronic devices through a wireless communication system. As an example, it is necessary for the image display device 100 to provide 802.111ay communication services operating in the millimeter wave (mmWave) band to transmit and receive large-capacity high-speed data.

[0086] The mmWave band can be any band from 10 GHz to 300 GHz. In this application, the mmWave band may include the 802.11ay band in the 60 GHz band. Additionally, the mmWave band may include the 5G band in the 28 GHz band or the 802.11ay band in the 60 GHz band. The 5G band can be set to a band of approximately 24 - 43 GHz, and the 802.11ay band can be set to a band of 57 - 70 GHz or 57 - 63 GHz, but is not limited thereto.

[0087] On the other hand, the image display device 100 can wirelessly transmit and receive data with electronic devices around the image display device 100, such as a set-top box or other electronic devices, through a wireless interface. As an example, the image display device 100 can transmit and receive wireless AV data with a set-top box or other electronic devices such as a mobile terminal configured on the front or lower part of the image display device.

[0088] The image display device 100 includes, for example, a wireless interface 101b, a section filter 102b, an AIT (application information table) filter 103b, an application data processing unit 104b, a data processing unit 111b, a media player 106b, an Internet protocol processing unit 107b, an Internet interface 108b, and a runtime module 109b.

[0089] Receive AIT (Application Information Table) data, live broadcast content, application data, and streaming events through the broadcast interface 101b. On the other hand, the live broadcast content can also be named linear AV content (Linear A / V Content).

[0090] The section filter 102b performs section filtering on the four types of data received through the wireless interface 101b, and transmits the AIT data to the AIT filter 103b, the linear AV content to the data processing unit 111b, and the streaming events and application data to the application data processing unit 104b.

[0091] On the other hand, receive non-linear AV content (Non-Linear A / V Content) and application data through the Internet interface 108b. The non-linear AV content can also be, for example, a COD (Content On Demand) application. The non-linear AV content is transmitted to the media player 106b, and the application data is transmitted to the runtime module 109b.

[0092] Furthermore, as Figure 1 shown, for example, the runtime module 109b includes an application manager and a browser. For example, the application manager uses the AIT data to control the life cycle of the interactive application. For example, the browser executes the function of displaying and processing the interactive application.

[0093] Hereinafter, a communication module having an antenna for providing a wireless interface in the above-described electronic devices such as an image display device will be described in detail. In this regard, the wireless interface for communication between electronic devices may be a WiFi wireless interface, but is not limited thereto. As an example, a wireless interface supporting the 802.11ay standard may be provided for high-speed data transfer between electronic devices.

[0094] The 802.11ay standard is a subsequent standard for increasing the throughput of the 802.11ad standard to 20 Gbps or more. An electronic device supporting the 802.11ay wireless interface may be configured to use a frequency band of approximately 57 to 64 GHz. The 802.11ay wireless interface may be configured to provide backward compatibility with the 802.11ad wireless interface. On the other hand, an electronic device providing the 802.11ay wireless interface may be configured to provide coexistence with legacy devices using the same frequency band.

[0095] Regarding the wireless environment of the 802.11ay standard, in an indoor environment, a coverage range of 10 meters or more can be provided, and in an outdoor environment under LOS (Line of Sight) channel conditions, a coverage range of 100 meters or more can be provided.

[0096] An electronic device supporting the 802.11ay wireless interface may be configured to provide VR headset connection, support server backup, and support cloud applications that require low-latency speeds.

[0097] The short-range communication scenario, i.e., the Ultra Short Range (USR) communication scenario, as a use case of 802.11ay is a model for fast and large-capacity data exchange between two terminals. The USR communication scenario may be configured to have a fast link setup within 100 msec, a transaction time within 1 second, provide a data rate of 10 Gbps at an ultra-short distance of less than 10 cm, and require low power consumption of less than 400 mW.

[0098] As a use case of 802.11ay, 8K UHD wireless transfer in the smart home usage model (8K UHD Wireless Transfer at Smart Home Usage Model) can be considered. For the smart home usage model to stream 8K UHD content in the home, a wireless interface between the source device and the destination device can be considered. In this regard, the source device can be one of a set-top box, a Blu-ray player, a tablet, or a smartphone, and the destination device can be one of a smart TV or a display device, but is not limited thereto. In this regard, the wireless interface can be configured to transmit an uncompressed 8K UHD stream (60 fps, 24 bits per pixel, minimum 4:2:2) within a coverage range where the distance between the source device and the destination device is less than 5 m. To this end, the wireless interface can be configured such that data is transferred between electronic devices at a speed of at least 28 Gbps.

[0099] To provide such a wireless interface, with reference to the accompanying drawings, embodiments related to an array antenna operating in the mmWave band and an electronic device having the same will be described. Those skilled in the art will appreciate that the present specification can be embodied in other specific forms without departing from the spirit and essential characteristics of the present specification.

[0100] Figure 2 Shows the detailed configuration of a plurality of electronic devices supporting the wireless interface of the present specification. Figure 2 Illustrates a block diagram of an access point 110 (generally, a first wireless node) and an access terminal 120 (generally, a second wireless node) in a wireless communication system. The access point 110 is a transmission entity for the downlink and a reception entity for the uplink. The access terminal 120 is a transmission entity for the uplink and a reception entity for the downlink. As described in the present application, a "transmission entity" is an independently operating device or equipment capable of transmitting data through a wireless channel, and a "reception entity" is an independently operating device or equipment capable of receiving data through a wireless channel.

[0101] With reference to Figure 1 and Figure 2 , Figure 1 the set-top box (STB) of Figure 1 the electronic device 100 of

[0102] To transmit data, the access point 110 includes a transmit data processor 220, a frame builder 222, a transmit processor 224, a plurality of transceivers 226-1 to 226-N, and a plurality of antennas 230-1 to 230-N. In addition, the access point 110 further includes a controller 234 for controlling the operation of the access point 110.

[0103] To send data, the access point 110 includes a transmit data processor 220, a frame builder 222, a transmit processor 224, a plurality of transceivers 226-1 to 226-N, and a plurality of antennas 230-1 to 230-N. Additionally, the access point 110 further includes a controller 234 for controlling the operation of the access point 110.

[0104] In operation, the transmit data processor 220 receives data (e.g., a plurality of data bits) from a data source 215 and processes the data for transmission. For example, the transmit data processor 220 may encode the data (e.g., a plurality of data bits) into encoded data and may modulate the encoded data into a plurality of data symbols. The transmit data processor 220 may support different pluralities of MCSs (modulation and coding schemes). For example, the transmit data processor 220 may encode the data at any one of a plurality of different coding rates (e.g., using LDPC (low-density parity check) coding). Additionally, the transmit data processor 220 may modulate the encoded data using any one of a plurality of different modulation methods, the plurality of modulation methods including BPSK, QPSK, 16QAM, 64QAM, 64APSK, 128APSK, 256QAM, and 256APSK, but not limited thereto.

[0105] The controller 234 may transmit an instruction (e.g., based on a plurality of downlink channel conditions) determining which MCS (modulation and coding scheme) to use to the transmit data processor 220. The transmit data processor 220 may encode and modulate the data from the data source 215 according to the determined MCS. It should be appreciated that the transmit data processor 220 is capable of performing additional processing on the data, such as data scrambling and / or other processing. The transmit data processor 220 outputs a plurality of data symbols to the frame builder 222.

[0106] The frame builder 222 constructs a frame (also referred to as a packet) and inserts a plurality of data symbols into the data payload of the frame. The frame may include a preamble, a header, and a data payload. To assist the access terminal 120 in receiving the frame, the preamble may include an STF (short training field) sequence and a CE (channel estimation) sequence. The header may include information related to the data in the payload, such as the length of the data and the MCS used for encoding and modulating the data. This information allows the access terminal 120 to demodulate and decode the data. The data in the payload may be segmented between a plurality of blocks, each block including a portion of the data and a GI (guard interval), thereby assisting the receiver in phase tracking. The frame builder 222 outputs the frame to the transmit processor 224.

[0107] For transmission on the downlink, the transmit processor 224 processes the frame. For example, the transmit processor 224 may support different transmission modes, such as an OFDM (orthogonal frequency-division multiplexing) transmission mode and an SC (single-carrier) transmission mode. In this example, the controller 234 may convey an instruction for determining which transmission mode to use to the transmit processor 224, and the transmit processor 224 may process the frame for transmission based on the determined transmission mode. The transmit processor 224 may apply a spectral mask to the frame so that the frequency composition of the downlink signal meets specific spectral requirements.

[0108] The transmit processor 224 may support MIMO (multiple-input-multiple-output) transmission. In this form, the access point 110 may include a plurality of antennas 230-1 to 230-N and a plurality of transceivers 226-1 to 226-N (e.g., one transceiver for each antenna). The transmit processor 224 may perform spatial processing on the plurality of received frames, and a plurality of transmit frame streams may be provided to the plurality of antennas. The plurality of transceivers 226-1 to 226-N receive and process (e.g., convert to analog, amplify, filter, and up-convert) each transmit frame stream, thereby generating transmit signals for transmission through the plurality of antennas 230-1 to 230-N, respectively.

[0109] To send data, access terminal 120 includes a transmit data processor 260, a frame builder 262, a transmit processor 264, a plurality of transceivers 266-1 to 266-M, and a plurality of antennas 270-1 to 270-M (e.g., one antenna for each transceiver). Access terminal 120 can send data to access point 110 on the uplink and / or can send data to other access terminals (e.g., for peer-to-peer communication). Additionally, access terminal 120 includes a controller 274 for controlling the operation of access terminal 120.

[0110] To transmit through the plurality of antennas 270-1 to 270-M, the plurality of transceivers 266-1 to 266-M receive and process (e.g., convert to analog, amplify, filter, and up-convert) the output of transmit processor 264. For example, transceiver 266 can up-convert the output of transmit processor 264 into a transmit signal having a frequency in the 60 GHz band. Thus, the antenna module of this specification can be configured to perform beamforming operations in the 60 GHz band, e.g., in a frequency band of about 57 to 63 GHz. Additionally, the antenna module can be configured to perform beamforming operations in the 60 GHz band and support MIMO transmission.

[0111] Regarding this, the plurality of antennas 270-1 to 270-M and the plurality of transceivers 266-1 to 266-M can be implemented in an integrated form on a multi-layer circuit board. For this purpose, the antennas operating in vertical polarization among the plurality of antennas 270-1 to 270-M can be vertically arranged inside the multi-layer circuit board.

[0112] To receive data, access point 110 includes a receive processor 242 and a receive data processor 244. In operation, the plurality of transceivers 226-1 to 226-N (e.g., from access terminal 120) receive signals and perform spatial processing (e.g., down-convert, amplify, filter, and convert to digital) on the received signals.

[0113] Receive processor 242 receives the outputs of the plurality of transceivers 226-1 to 226-N, processes the plurality of outputs, and recovers a plurality of data symbols. For example, access point 110 can receive data (e.g., from access terminal 120) in a frame. In this example, receive processor 242 can use the STF sequence in the preamble of the frame to detect the start of the frame. Additionally, receiver processor 242 can use the STF for adjusting AGC (automatic gain control). Additionally, receive processor 242 can perform channel estimation (e.g., using the CE sequence in the preamble of the frame) and can perform channel equalization on the received signals based on the channel estimation.

[0114] The receiving data processor 244 receives a complex number of data symbols from the receiving processor 242 and a corresponding MSC mode indication from the controller 234. The receiving data processor 244 demodulates and decodes the complex number of data symbols, restores the data according to the indicated MSC mode, and stores the restored data (e.g., a complex number of data bits) and / or outputs it to the data sink 246 for additional processing.

[0115] The access terminal 120 can use an OFDM transmission mode or an SC transmission mode to transmit data. In this case, the receiving processor 242 can process the received signal according to the selected transmission mode. Additionally, as described above, the transmitting processor 264 can support MIMO (multiple-input-multiple-output) transmission. In this case, the access point 110 includes a complex number of antennas 230-1 to 230-N and a complex number of transceivers 226-1 to 226-N (e.g., one transceiver per antenna). Therefore, the antenna module in this specification can be configured to perform beamforming operations in a frequency band of about 57 to 63 GHz as an example in the 60 GHz band. Additionally, the antenna module can be configured to perform beamforming operations in the 60 GHz band and support MIMO transmission.

[0116] Regarding this, the complex number of antennas 230-1 to 230-M and the complex number of transceivers 226-1 to 226-M can be implemented in an integrated form on a multi-layer circuit board. For this purpose, the antennas among the complex number of antennas 230-1 to 230-M that operate in vertical polarization can be vertically arranged inside the multi-layer circuit board.

[0117] On the other hand, each transceiver receives and processes (e.g., down-converts, amplifies, filters, and converts to digital) signals from each antenna. The receiving processor 242 can perform spatial processing on the outputs of the complex number of transceivers 226-1 to 226-N to restore a complex number of data symbols.

[0118] The access point 110 further includes a memory 236 coupled to the controller 234. The memory 236 can store commands that cause the controller 234 to perform one or more of the complex number of operations described in this application when executed by the controller 234. Similarly, the access terminal 120 further includes a memory 276 coupled to the controller 274. The memory 276 can store commands that cause the controller 274 to perform one or more of the complex number of operations described in this application when executed by the controller 274.

[0119] On the other hand, an electronic device supporting the 802.11ay wireless interface of this specification determines whether the communication medium can be utilized to communicate with other electronic devices. To this end, the electronic device transmits an RTS-TRN frame including an RTS (Request to Send) part and a first beam training sequence. Regarding this, Figure 3a FIG. shows the RTS (Request to Send) frame and the CTS (Clear to Send) frame of this specification. Regarding this, a transmitting device can use an RTA frame to determine whether the communication medium can be utilized to transmit one or more data frames to a destination device. As a response to receiving the RTS frame, if the communication medium can be utilized, the destination device transmits a CTS (Clear to Send) frame to the transmitting device again. As a response to receiving the CTS frame, the transmitting device transmits one or more data frames to the destination device. As a response to successfully receiving one or more data frames, the destination device transmits one or more acknowledgment response ("ACK") frames to the transmitting device.

[0120] Referring to Figure 3a In (a) of, frame 300 includes an RTS part, and the RTS part includes a frame control field 310, a duration field 312, a receiver address field 314, a transmitter address field 316, and a frame check sequence field 318. For the purpose of improving communication and reducing interference, frame 300 further includes a beam training sequence field 320, and the beam training sequence field 320 is used to configure the respective antennas of the destination device and one or more neighboring devices.

[0121] Referring to Figure 3a In (b) of, CTS frame 350 includes a CTS part, and the CTS part includes a frame control field 360, a duration field 362, a receiver address field 364, and a frame check sequence field 366. For the purpose of improving communication and reducing interference, frame 350 further includes a beam training sequence field 368, and the beam training sequence field 368 is used to configure the respective antennas of the transmitting device and one or more neighboring devices.

[0122] The beam training sequence fields 320 and 368 may follow a training (TRN) sequence based on IEEE 802.11ad or 802.11ay. The transmitting device can use the beam training sequence field 368 to configure its own antenna to transmit directionally to the destination device. On the other hand, in order to reduce the transmission interference at the destination device, the transmitting device can use the beam training sequence field to configure its respective antennas. In this case, the beam training sequence field can be used to configure its respective antennas to generate an antenna radiation pattern with a plurality of nulls for the destination device.

[0123] Therefore, a plurality of electronic devices supporting an 802.11ay wireless interface can form an initial beam using a beamforming pattern determined according to a beam training sequence to have a lower interference level among each other. Regarding this, Figure 3b The block diagram of a communication system 400 illustrating an example of this specification is shown. As Figure 3b shown, the first device 410 and the second device 420 can improve communication performance by aligning the directions of the main beams. On the other hand, in order to reduce interference with the third device 430, the first device 410 and the second device 420 can form a signal-null with a weak signal intensity in a specific direction.

[0124] Regarding the formation of such main beams and signal nulls, a plurality of electronic devices in this specification can be configured to perform beamforming through an array antenna. Referring to Figure 3b this, some of the plurality of electronic devices can also be configured to communicate with the array antenna of other electronic devices through a single antenna. Regarding this, when communicating through a single antenna, the beam pattern is formed into an omnidirectional pattern.

[0125] Referring to Figure 3b this, it is shown that the first device 410 to the third device 430 perform beamforming, and the fourth device 440 does not perform beamforming, but is not limited thereto. Therefore, it can be configured that three of the first device 410 to the fourth device perform beamforming, and the other device does not perform beamforming.

[0126] As another example, it can be configured that only one of the first device 410 to the fourth device performs beamforming, and the remaining three devices do not perform beamforming. As yet another example, it can be configured that two of the first device 410 to the fourth device perform beamforming, and the other two devices do not perform beamforming. As yet another example, it can be configured that all of the first device 410 to the fourth device perform beamforming.

[0127] Referring to Figure 3a and Figure 3bThe first device 410 determines that it is the intended receiving device of the CTS-TRN frame 350 based on the address indicated in the receiver address field 364 of the CTS-TRN frame 350. In response to determining that it is the intended receiving device of the CTS-TRN frame 350, for the purpose of substantially directional transmission to the second device 420, the first device 410 may selectively use the beam training sequence in the beam training sequence field 368 of the received CTS-TRN 350 to configure its own antenna. That is, the antenna of the first device 410 is configured to generate an antenna radiation pattern having a main lobe (e.g., the highest gain lobe) substantially aimed at the second device 420 and non-main lobes aimed at other directions.

[0128] Since the second device 420 already knows the direction of the first device 410 based on the beam training sequence in the beam training sequence field 320 of the RTS-TRN frame 300 it previously received, the second device 420 can configure its own antenna for selectively directional reception (e.g., the main antenna radiation lobe) aimed at the first device 410. Therefore, during the period when the antenna of the first device 410 is configured for directional transmission to the second device 420 and the antenna of the second device 420 is configured for directional reception from the first device 410, the first device 410 sends one or more data frames to the second device 420. Thus, the first device 410 and the second device 420 perform directional transmission / reception (DIR-TX / RX) of one or more data frames through the main lobe (main beam).

[0129] On the other hand, the first device 410 and the second device 420 can partially modify the beam pattern of the third device 430 in order to reduce interference with the third device 430 caused by the antenna radiation pattern having non-main lobes.

[0130] Regarding this, the third device 430 determines that it is not the intended receiving device of the CTS-TRN frame 350 based on the address indicated by the receiver address field 364 of the CTS-TRN frame 350. In response to determining that it is not the intended receiving device of the CTS-TRN frame 350, the third device 430 uses the beam training sequence of the beam training sequence field 368 of the received CTS-TRN 350 and the sequence of the beam training sequence field 320 of the previously received RTS-TRN frame 300 to configure its own antenna to generate an antenna radiation pattern having a plurality of nulls substantially aimed at the second device 420 and the first device 410, respectively. The plurality of nulls can be based on the estimated angles of arrival of the previously received RTS-TRN frame 300 and CTS-TRN frame 350. Generally, the third device 430 generates an antenna radiation pattern having desired signal power, loss, or gain aimed at the first device 410 and the second device 420 (e.g., in order to achieve a desired BER, SNR, SINR, and / or one or more other communication attributes, and in order to make the estimated interference in such devices 410 and 420 below a defined threshold).

[0131] The third device 430 estimates the antenna gain in the directions towards the first device 410 and the second device 420, estimates the antenna reciprocity difference (e.g., transmit antenna gain - receive antenna gain) between the third device 430 and the first device 410 and the second device 420, and in order to determine the corresponding estimated interference in the first device 410 and the second device 420, it can configure its own antenna transmit radiation pattern by calculating the above-mentioned content in one or more sectors respectively.

[0132] The third device 430 transmits an RTS-TRN frame 300 intended for the fourth device 440, and the RTS-TRN frame 300 is received by the fourth device 440. As long as the first device 410 and the second device 420 communicate based on the durations indicated by the duration fields 312 and 362 of the RTS-TRN frame 300 and the CTS-TRN frame 350 respectively, the third device 430 maintains the antenna configuration having a plurality of nulls aimed at such devices. Since the antenna of the third device 430 is configured to generate a plurality of nulls aimed at the first device 410 and the second device 420, the third device 430 can generate reduced interference in the first device 410 and the second device 420 respectively when transmitting the RTS-TRN frame 300.

[0133] Therefore, a plurality of electronic devices supporting the 802.11ay wireless interface disclosed in this specification can use array antennas to align the main beam directions between each other and form a signal null direction in a specific direction to reduce interference. To this end, a plurality of electronic devices can form an initial beam direction through a beam training sequence and change the beam direction through a periodically updated beam training sequence.

[0134] As described above, for high-speed data communication between electronic devices, the beam directions must be aligned between each other. In addition, for high-speed data communication, it is necessary to minimize the loss of wireless signals transmitted to the antenna elements. To this end, it is necessary to configure the array antenna inside the multi-layer substrate on which the RFIC is configured. In addition, for radiation efficiency, it is necessary to configure the array antenna adjacent to the side region inside the multi-layer substrate.

[0135] In addition, to adapt to changes in the wireless environment, it is necessary to update the beam training sequence between a plurality of electronic devices. To update the beam training sequence, the RFIC must periodically transmit and receive signals with a processor such as a modem. Therefore, in order to minimize the update delay time, it is necessary to implement the transmission and reception control signals between the RFIC and the modem in a short time. To this end, it is necessary to reduce the physical length of the connection path between the RFIC and the modem. To this end, the modem can be configured on the multi-layer substrate on which the array antenna and the RFIC are configured. Alternatively, in a structure in which the array antenna and the RFIC are configured on the multi-layer substrate and the modem is configured on the main substrate, the connection length between the RFIC and the modem can be minimized. Regarding this, the detailed structure is described in Figure 5c is described.

[0136] Next, an electronic device having an array antenna that can operate in the millimeter wave band of this specification will be described. Regarding this, Figure 4 shows an electronic device configured with a plurality of antenna modules and a plurality of transceiver circuit modules of an embodiment. Referring to Figure 4 , the home appliance device configured with a plurality of antenna modules and a plurality of transceiver circuit modules can be a television, but is not limited thereto. Therefore, in this specification, the home appliance device configured with a plurality of antenna modules and a plurality of transceiver circuit modules can include any home appliance device or display device that supports communication services in the millimeter wave band.

[0137] Referring to Figure 4, the electronic device 1000 includes a plurality of antenna modules ANT1 to ANT4 and a plurality of transceiver circuit modules 1210a to 1210d. In this regard, the plurality of transceiver circuit modules 1210a to 1210d may correspond to the aforementioned transceiver circuit 1250. Alternatively, the plurality of transceiver circuit modules 1210a to 1210d may be part of the transceiver circuit 1250 or part of a front-end module disposed between the antenna module and the transceiver circuit 1250.

[0138] The plurality of antenna modules ANT1 to ANT4 may be formed of an array antenna configured with a plurality of antenna elements. The number of elements of the antenna modules ANT1 to ANT4 is not limited to 2, 3, 4, etc. as shown in the figure. For example, the number of elements of the antenna modules ANT1 to ANT4 may be increased to 2, 4, 8, 16, etc. In addition, the elements of the antenna modules ANT1 to ANT4 may be selected to have the same or different numbers. The plurality of antenna modules ANT1 to ANT4 may be disposed in different regions of the display or at the lower or side portions of the electronic device. The plurality of antenna modules ANT1 to ANT4 may be disposed at the upper, left, lower, and right sides of the display, but is not limited to such a configuration. As another example, the plurality of antenna modules ANT1 to ANT4 may also be disposed at the upper left, upper right, lower left, and lower right sides of the display.

[0139] The antenna modules ANT1 to ANT4 may be configured to transmit and receive signals in a specific direction in any frequency band. For example, the antenna modules ANT1 to ANT4 may operate in any one of the 28 GHz band, 39 GHz band, and 64 GHz band.

[0140] The electronic device may maintain a connection state with different entities or perform data transmission or reception operations therefor through two or more of the antenna modules ANT1 to ANT4. In this regard, the electronic device corresponding to the display device may transmit and receive data with the first entity through the first antenna module ANT1. In addition, the electronic device may transmit and receive data with the second entity through the second antenna module ANT2. As an example, the electronic device may transmit and receive data with a mobile terminal (UE) through the first antenna module ANT1. The electronic device may transmit and receive data with a control device such as a set-top box or an AP (access point) through the second antenna module ANT2.

[0141] Data can be transmitted and received with other entities through other antenna modules, such as the third antenna module ANT3 and the fourth antenna module ANT4. As another example, dual connectivity or multiple-input multiple-output (MIMO) can be performed by at least one of the first entity and the second entity previously connected via the third antenna module ANT3 and the fourth antenna module ANT4.

[0142] The mobile terminals UE1 and UE2 are configured in the front area of the electronic device, and the mobile terminals UE1 and UE2 can be configured to communicate with the first antenna module ANT1. On the other hand, the set-top box (STB) or the AP is configured in the lower area of the electronic device, and the set-top box (STB) or the AP can be configured to communicate with the second antenna module ANT2, but it is not limited thereto. As another example, the second antenna module ANT2 may have a first antenna that radiates downward and a second antenna that radiates toward the front area. Therefore, the second antenna module ANT2 can communicate with the set-top box (STB) or the AP through the first antenna and can communicate with one of the mobile terminals UE1 and UE2 through the second antenna.

[0143] On the other hand, one of the mobile terminals UE1 and UE2 can be configured to perform multiple-input multiple-output (MIMO) with the electronic device. As an example, UE1 can be configured to perform MIMO while performing beamforming with the electronic device. As described above, the electronic device equivalent to an image display device can perform high-speed communication with other electronic devices or a set-top box through a WiFi wireless interface. As an example, the electronic device can perform high-speed communication with other electronic devices or a set-top box in the 60 GHz band through an 802.11ay wireless interface.

[0144] On the other hand, the transceiver circuit modules 1210a to 1210d can operate to process transmission signals and reception signals in the RF band. Here, the RF band can be any band in the millimeter wave band such as the 28 GHz band, the 39 GHz band, and the 64 GHz band as described above. On the other hand, the transceiver circuit modules 1210a to 1210d can be referred to as RF sub-modules (SUB-MODULE) 1210a to 1210d. At this time, the number of RF sub-modules 1210a to 1210d is not limited to four and can be changed to any number of two or more according to the application.

[0145] In addition, the RF sub-modules 1210a to 1210d can have an up-conversion module and a down-conversion module that convert signals in the RF band into signals in the IF band or convert signals in the IF band into signals in the RF band. For this purpose, the up-conversion module and the down-conversion module can be provided with a local oscillator (LO: Local Oscillator) that can perform up-conversion and down-conversion.

[0146] On the other hand, among a plurality of RF sub-modules 1210a to 1210d, a signal can be transferred from any one of the plurality of transceiver circuit modules to an adjacent transceiver circuit module. Thus, it can be configured such that the transferred signal is transferred to each of the plurality of transceiver circuit modules 1210a to 1210d at least once.

[0147] For this purpose, a data transfer path of a loop structure can be added. In this regard, through the transmission path P2 of the loop structure, adjacent RF sub-modules 1210b and 1210c can transfer signals in both directions (bi-direction).

[0148] Alternatively, a data transfer path of a feedback structure can be added. In this regard, through the data transfer path of the feedback structure, at least one sub-module 1210c can transfer signals to the remaining sub-modules 1210a, 1210b, and 1210d in one direction (uni-direction).

[0149] The plurality of RF sub-modules can include a first RF sub-module 1210a to a fourth RF sub-module 1210d. In this regard, a signal from the first RF sub-module 1210a can be transferred to the adjacent RF sub-module 1210b and the fourth RF sub-module 1210d. Additionally, the second RF sub-module 1210b and the fourth RF sub-module 1210d can transfer the signal to the adjacent third RF sub-module 1210c. At this time, if the second RF sub-module 1210b and the third RF sub-module 1210c can transfer in both directions as Figure 4 shown, this structure can be referred to as a loop structure. On the contrary, if only one-way transfer is possible between the second RF sub-module 1210b and the third RF sub-module 1210c, it can be referred to as a feedback structure. On the other hand, the signal transferred to the third RF sub-module 1210c in the feedback structure can be at least two or more.

[0150] However, not limited to this structure, according to the application, the baseband module can be provided only in a specific module among the first RF sub-module 1210a to the fourth RF sub-module 1210d. Or, according to the application, the baseband module can be not provided in the first RF sub-module 1210a to the fourth RF sub-module 1210d, but constituted by an additional control unit, i.e., the baseband processor 1400. As an example, it can also be configured such that only through the additional control unit, i.e., the baseband processor 1400, the control signal transfer is performed.

[0151] On the other hand, hereinafter, in an electronic device as Figure 1 shown, having as Figure 2Describe the specific configuration and functions of the electronic device with the wireless interface shown. It is necessary to use the communication service in the millimeter wave (mmWave) band between electronic devices to send or receive data between electronic devices. Regarding this, as the mmWave wireless interface, the 802.11ay wireless interface can be used to provide wireless AV (audio-video) services and / or high-speed data transfer. In this case, not limited to the 802.11ay wireless interface, any wireless interface in the 60GHz band can be applied. Regarding this, for high-speed data transfer between electronic devices, 5G or 6G wireless interfaces using the 28GHz band or 60GHz band can also be used.

[0152] In order to transmit images with a resolution of 4K or higher, in an electronic device such as an image display device, there is a problem that there is no specific solution for the antenna and RFIC (radio frequency integrated chip) for providing a wireless interface. In particular, considering the situation where an electronic device such as an image display device is configured on the wall of a building or on a desktop, it is necessary to send or receive wireless AV data with other electronic devices. For this purpose, it is necessary to propose a specific configuration and antenna structure for which area of the image display device the antenna and RFIC are to be configured.

[0153] Regarding this, Figure 5a Illustrate a configuration in which a multilayer circuit board on which an array antenna module is configured is connected to an RFIC in relation to this specification. Specifically, in relation to this specification, an AIP (Antenna In Package) module structure and an antenna module structure implemented on a flexible substrate are shown.

[0154] Refer to Figure 5a In (a) of, for mmWave band communication, the AIP (Antenna In Package) module is configured as an RFIC-PCB-antenna integrated type. Regarding this, as shown in (a) of FIG. 5, the array antenna module 1100-1 can be integrally formed with a multilayer substrate (multi-layer PCB). Therefore, the array antenna module 1100-1 integrally formed with the multilayer substrate can be referred to as an AIP module. Specifically, the array antenna module 1100-1 can be configured in a side area of the multilayer substrate. Regarding this, using the array antenna module 1100-1 configured in the side area of the multilayer substrate, a first beam B1 can be formed toward the side area of the multilayer substrate.

[0155] On the other hand, refer to Figure 5a (b) of, the array antenna module 1100-2 can be configured on the multilayer substrate. The configuration of the array antenna module 1100-2 is not limited toFigure 5a The structure of (b) can be disposed on any layer inside the multilayer substrate. In this regard, by using the array antenna module 1100-2 disposed on any layer of the multilayer substrate, a second beam B2 can be formed toward the front area of the multilayer substrate. In this regard, in order to minimize the distance between the RFIC and the antenna, the AIP module integrally formed with the array antenna can configure the array antenna on the same PCB.

[0156] On the other hand, the antenna of the AIP module can be implemented by a multi-layer PCB manufacturing process and can radiate signals in the vertical / side direction of the PCB. In this regard, a patch antenna, a dipole / monopole antenna can be used to achieve dual polarization. Therefore, Figure 5a The first array antenna 1100-1 of (a) can be disposed in the side area of the multilayer substrate, and Figure 5a The second array antenna 1100-2 of (b) can be disposed in the side area of the multilayer substrate. Thus, the first beam B1 can be generated by the first array antenna 1100-1, and the second beam B2 can be generated by the second array antenna 1100-2.

[0157] The first array antenna 1100-1 and the second array antenna 1100-2 can be configured to have the same polarization. Or, the first array antenna 1100-1 and the second array antenna 1100-2 can be configured to have orthogonal polarizations. It can also be operated. In this regard, the first array antenna 1100-1 can be operated as a vertical polarization antenna or as a horizontal polarization antenna. As an example, the first array antenna 1100-1 can be a monopole antenna with vertical polarization, and the second array antenna can be a patch antenna with horizontal polarization.

[0158] On the other hand, Figure 5b is a conceptual diagram showing antenna structures with different radiation directions from each other.

[0159] Referring to Figure 5a of (a) and Figure 5b of (a), the radiation direction of the antenna module disposed in the side area of the multilayer substrate is equivalent to the side direction. In this regard, the antenna implemented on the flexible substrate can be composed of radiation elements such as dipole / monopole antennas. That is, the antenna implemented on the flexible substrate can be end-fire antenna elements.

[0160] Regarding this, end-fire radiation can be achieved by an antenna that radiates in a direction parallel to the substrate. Such an end-fire antenna can be implemented by a dipole / monopole antenna, a Yagi-dipole antenna, a Vivaldi antenna, a substrate integrated waveguide horn (SIW horn) antenna, etc. Regarding this, the Yagi-dipole antenna and the Vivaldi antenna have horizontal polarization characteristics. On the other hand, in the antenna module disposed in the image display device proposed in this specification, a vertical polarization antenna is required. Therefore, it is necessary to propose an antenna structure that operates as a vertical polarization antenna and can minimize the exposed portion of the antenna.

[0161] Referring to Figure 5a (b) of Figure 5b and (a) of , the radiation direction of the antenna module disposed in the front region of the multilayer substrate corresponds to the front direction. Regarding this, the antenna disposed in the AIP module can be composed of a radiation element such as a patch antenna. That is, the antenna disposed in the AIP module can be a broadside antenna element that radiates in the broadside direction.

[0162] On the other hand, the multilayer substrate disposed inside the array antenna can be configured to be integrally formed with the main substrate or combined with the main substrate into a module type by a connector. Regarding this, Figure 5c shows the combined structure of the multilayer substrate and the main substrate of the embodiment. Referring to Figure 5c (a) of , it shows a structure in which the RFIC 1250 and the modem 1400 are integrally formed on the multilayer substrate 1010. The modem 1400 can be referred to as the baseband processor 1400. Thus, the multilayer substrate 1010 is integrally formed with the main substrate. Such an integral structure can be applied to a structure in which only one array antenna module is disposed in the electronic device.

[0163] On the other hand, the multilayer substrate 1010 and the main substrate 1020 can be configured to be combined into a module type by a connector. Referring to Figure 5c (b) of , regarding this, the multilayer substrate 1010 can be configured to be interface-connected to the main substrate 1020 through a connector. In this case, the RFIC 1250 can be disposed on the multilayer substrate 1010, and the modem 1400 can be disposed on the main substrate 1020. Thus, the multilayer substrate 1010 can be formed by a substrate separate from the main substrate 1020 and configured to be combined through a connector.

[0164] Such a module type structure can be applied to a structure in which a plurality of array antenna modules are disposed in the electronic device. Referring to Figure 5cIn (b) of this, the multi-layer substrate 1010 and the second multi-layer substrate 1020 can be connected through a connector to interface with the main substrate 1020. The modem 1400 disposed on the main substrate 1020 is configured to be electrically coupled to the RFICs 1250, 1250b disposed on the multi-layer substrate 1010 and the second multi-layer substrate 1020.

[0165] On the other hand, when the AIP module is disposed at the lower part of an electronic device such as an image display device, it is necessary to perform communication with other communication modules disposed in the lower direction and the front direction. Regarding this, Figure 6 is a conceptual diagram of a plurality of communication modules disposed at the lower part of an image display device, the configuration of the communication module, and communication performed with another communication module disposed in the front direction. Refer to Figure 6 In (a) of this, different communication modules 1100-1, 1100-2 can be disposed at the lower part of the image display device 100. Refer to Figure 6 In (b) of this, the image display device 100 can perform communication with the communication module 1100b disposed at the lower part through the antenna module 1100. In addition, communication can be performed with the second communication module 1100c disposed in the front direction through the antenna module 1100 of the image display device 100. Regarding this, the communication module 1100b can be a set-top box or an AP (Access point) that transmits AV data to the image display device 100 at high speed through an 802.11ay wireless interface, but it is not limited thereto. On the other hand, the second communication module 1100c can be any electronic device that transceives data with the image display device 100 at high speed through an 802.11ay wireless interface.

[0166] On the other hand, in Figure 5a In the AIP module structure shown in (a) of this, depending on the RFIC drive circuit and the heat dissipation structure, the antenna height may increase. In addition, depending on the type of antenna used, in Figure 5a In the AIP module structure shown in (a) of this, the antenna height may increase. On the other hand, in Figure 5a In the multi-layer substrate shown in (b) of this, the antenna module structure implemented in the side region can implement the antenna in a low-profile shape.

[0167] On the other hand, for the electronic device shown in Figures 1 to 2 this and Figure 3a and Figure 3b in the configuration of this, the specific configuration of the antenna module that can be disposed inside or on the side of Figure 4 this and Figure 6 the electronic device will be described. Figures 5a to 5c the electronic device will be described.

[0168] An electronic device such as an image display device may have a communication module including an antenna in order to perform communication with surrounding electronic devices. On the other hand, recently, as the display area of the image display device has expanded, the configuration space of the communication module including the antenna has decreased. Therefore, the necessity of arranging an antenna inside a multilayer circuit board for implementing the communication module is increasing.

[0169] On the other hand, as an interface for communication services between electronic devices, a WiFi wireless interface can be considered. In the case of using such a WiFi wireless interface, in order to achieve high-speed data transfer between electronic devices, a millimeter wave band (mmWave) can be used. In particular, a wireless interface such as 802.11ay can be used to achieve high-speed data transfer between electronic devices.

[0170] Regarding this, an array antenna capable of operating in the millimeter wave (mmWave) band can be installed in an antenna module. However, electronic components such as the antenna and the transceiver circuit arranged in such an antenna module are configured to be electrically connected. For this reason, the transceiver circuit is operably combined with the antenna module, and the antenna module can be constituted by a multilayer substrate.

[0171] A plurality of antenna elements of such an antenna module in the form of a multilayer substrate can radiate a wireless signal in the direction of one side surface of the antenna module. However, when such an antenna module is arranged in an electronic device in which a side area is realized by a metal frame, there is a problem that the antenna performance is significantly degraded. In particular, due to a large metal frame such as a display in the upper area, the radio wave of the antenna cannot be radiated well to the side area and is reflected, resulting in a problem that the radio wave of the antenna is formed in the lower area. As a result, it is difficult for the electronic device to perform high-speed wireless communication with a plurality of other electronic devices in the side area.

[0172] The object of the present specification for solving the above-mentioned problems is to provide an electronic device having an antenna module operating in the millimeter wave band and formed with a metal frame. Another object of the present specification is to solve the problem that an antenna radiating radio waves to the side cannot normally radiate radio waves to the side due to the metal frame. Another object of the present specification is to improve the radiation performance in the side direction by optimizing the shape of a dielectric housing arranged below the metal frame. Another object of the present specification is to arrange the antenna module at different positions in the lower part of the electronic device, so that wireless communication can be performed with various surrounding electronic devices in all directions. Another object of the present specification is to arrange the antenna module at different positions in the lower part of the electronic device, so that wireless communication can be performed with various surrounding electronic devices in all directions.

[0173] The antenna module operating in the millimeter wave band of the present specification and an electronic device including the same will be described. Regarding this,Figure 7a Shows the structure of an antenna module disposed in a dielectric housing arranged in the lower region of the metal frame of an electronic device. On the other hand, Figure 7b Is an enlarged view of the antenna module disposed in Figure 7a The dielectric housing.

[0174] Referring to Figure 7a And Figure 7b In the lower region of the electronic device 1000, a dielectric housing 1020 may be formed. Inside the dielectric housing 1020, antenna modules 1100-1 and 1100-2 may be disposed. In the ground region 1100g of the antenna module 1100, a coupling structure may be disposed. The coupling structure may be coupled to the metal frame 1010 at the upper part of the dielectric housing 1020. An example of the coupling structure may be a metal housing 1150. The metal housing 1150 may be disposed at a predetermined interval from the antenna element disposed in the dielectric region of the antenna module 1100.

[0175] On the other hand, in the electronic device of this specification, the dielectric housing in which the antenna module is disposed may be formed by inclining a predetermined angle with respect to the vertical axis. Regarding this, Figure 8a And Figure 8b Show the structure in which an antenna module is disposed in a dielectric housing having different thicknesses formed on the inner side surface and a vertical outer side surface. Figure 8c And Figure 8d Show the structure in which an antenna module is disposed in a dielectric housing having different thicknesses formed on the inner side surface and an inclined outer side surface.

[0176] Referring to Figure 8a On one side of the dielectric housing 1020 disposed in the lower region of the metal frame 1010, an antenna module 1100-1 may be disposed. The array antenna 1100a of the antenna module 1100-1 may radiate radio signals through the inner side surfaces 1023a-1, 1023b-1 and the outer side surface 1023-1 of the dielectric housing 1020-1. Referring to Figure 8b On the other side of the dielectric housing 1020-1 disposed in the lower region of the metal frame 1010, an antenna module 1100-2 may be disposed. The array antenna 1100b of the antenna module 1100-2 may radiate radio signals through the inner side surfaces 1024a-1, 1024b-2 and the outer side surface 1024-1 of the dielectric housing 1020.

[0177] Referring to Figure 8c On one side of the dielectric housing 1020 disposed in the lower region of the metal frame 1010, an antenna module 1100-1 may be disposed. The array antenna 1100a of the antenna module 1100-1 may radiate radio signals through the inner side surface 1023a and the outer side surface 1023b of the dielectric housing 1020. Referring to Figure 8d, an antenna module 1100-2 may be disposed on the other side of the dielectric housing 1020 disposed in the lower region of the metal frame 1010. The array antenna 1100b of the antenna module 1100-2 may radiate wireless signals through the inner side surface 1024a and the outer side surface 1024b of the dielectric housing 1020.

[0178] Figure 9 Shown in Figures 8a to 8d the array antenna structure formed by a plurality of antenna elements in the antenna module. Refer to Figure 9 , the array antenna 1100a may include a plurality of antenna elements EL1, EL2, EL3 spaced apart at a predetermined interval along the z-axis direction as the first axis direction. Although the array antenna 1100a is shown as a 1x3 array antenna with three antenna elements, it is not limited thereto.

[0179] Refer to Figures 8a to 9 , the array antenna 1100a may be composed of a multi-layered substrate including a plurality of dielectric layers and a plurality of conductive layers. The array antenna 1100a may be implemented by an end-fire antenna that radiates wireless signals in the side direction of the multi-layered substrate. For example, the array antenna 1100a may be a 1x3 dipole antenna disposed at the end of a PCB implemented by a multi-layered substrate. The PCB implemented by the multi-layered substrate may constitute the antenna module 1100. The PCB implemented by the antenna module 1100 may include a dielectric region 1100d in which a plurality of antenna elements are disposed and a ground region 1100g adjacent to the dielectric region 1100d. The array antenna 1100a may be disposed in the dielectric region 1100d. A plurality of radiators constituting the array antenna 1100a may be disposed in the dielectric region 1100d, and electromagnetic waves may be radiated in the side direction of the antenna module 1100 by using the ground structure of the ground region 1100g of the PCB as a reflector.

[0180] Refer to Figures 7a to 9 , an electronic device 1000 having an antenna module may include a dielectric housing 1020, an array antenna 1100a, and an air material 1030. The electronic device may further include a frame 1010 and a display 151. Since the air material 1030 is formed at a predetermined height, it may also be referred to as an air-layer.

[0181] The frame 1010 may form a side region of the electronic device 1000. The frame 1010 may be formed to surround the display 151 and configured to support the display 151. The frame 1010 may be constituted by a metal frame made of a metal material, but is not limited thereto. The dielectric housing 1020 may be formed on one side of the metal frame 1010. For example, the dielectric housing 1020 may be disposed on one side surface of the metal frame 1010 forming the lower region.

[0182] The array antennas 1100a and 1100b may be disposed inside a substrate disposed in the inner region of the dielectric housing 1020. The array antenna 1100a may be disposed to face the inner side surface of the dielectric housing 1020. The air material 1030 may be disposed between the dielectric housing 1020 and the metal frame 1010. The air material 1030 may be included in the interior of the dielectric housing 1020. The air material 1030 may be the inner region of the dielectric housing 1020 disposed in the lower region of the metal frame 1010.

[0183] The dielectric housings 1020-1 and 1020 may include a plurality of side surface portions. The dielectric housing 1020-1 may include a first side surface portion 1021, a second side surface portion 1022, third side surface portions 1023-1 and 1023, and fourth side surface portions 1024-1 and 1024. The first side surface portion 1021 may be formed to be attached to the metal frame 1010. The second side surface portion 1022 may be formed to correspond to the first side surface portion 1021. The third side surface portions 1023-1 and 1023 and the fourth side surface portions 1024-1 and 1024 may be formed between both sides of the first side surface portion 1021 and the second side surface portion 1022. The first side surface portion 1021 and the second side surface portion 1022 may be respectively referred to as a front surface portion 1021 and a rear surface portion 1022. The third side surface portions 1023-1 and 1023 and the fourth side surface portions 1024-1 and 1024 may be respectively referred to as one side surface portion 1023-1 and 1023 and the other side surface portion 1024-1 and 1024.

[0184] The front portion 1021 of the dielectric housings 1020-1 and 1020 can be configured to be attached to the metal frame 1010. The back portion 1022 of the dielectric housing 1020 can be formed to correspond to the front portion 1021 of the dielectric housing 1020. The side portions 1023 and 1024 of the dielectric housing 1020 can be formed between the front portion 1021 and the back portion 1022 of the dielectric housings 1020-1 and 1020. The side portion 1023 of the dielectric housings 1020-1 and 1020 can be formed to connect one end portion of the front portion 1021 and one end portion of the back portion 1022 of the dielectric housing 1020. The side portion 1024 of the dielectric housings 1020-1 and 1020 can be formed to connect the other end portion of the front portion 1021 and the other end portion of the back portion 1022 of the dielectric housing 1020.

[0185] Refer to Figures 7a to 8b and Figure 9 , an electronic device in which the array antennas 1100a and 1100b are disposed in the dielectric housing 1020-1 having different thicknesses formed on the inner side and the outer side formed vertically will be described.

[0186] The plurality of side portions of the dielectric housing 1020-1 can include an inner side and an outer side corresponding to the inner side. The inner side can include a first inner side 1023a-1, 1024a-1 and a second inner side 1023b-1, 1024b-1. The first inner sides 1023a-1, 1024a-1 can face each other in a state of being separated from a vertical surface at the ends of the array antennas 1100a, 1100b and one surface of the third side portion 1023-1 and the fourth side portion 1024-1 of the dielectric housing 1020-1 by a first gap G1. The second inner sides 1023b-1, 1024b-1 can face each other in a state of being separated from a vertical surface at the ends of the array antennas 1100a, 1100b and one surface of the third side portion 1023-1 and the fourth side portion 1024-1 of the dielectric housing 1020-1 by a second gap G2. The regions of the second inner sides 1023b-1, 1024b-1 can be formed between the first inner sides 1023a-1, 1024a-1 and the metal frame 1010.

[0187] The second gap G2 may be formed wider than the first gap G1. The first thickness t1 between the first inner sides 1023a-1, 1024a-1 and the outer sides 1023-1, 1024-1 may be formed wider than the second thickness t2 between the second inner sides 1023b-1, 1024b-1 and the outer sides 1023-1, 1024-1. The array antennas 1100a, 1100b may be configured to radiate radio signals through the inner sides 1023a-1, 1023b-1, 1024a-1, 1024b-1 and the outer sides 1023-1, 1024-1 of the dielectric housing 1020-1.

[0188] The first inner sides 1023a-1, 1024a-1 may further include the inner side 1022b-1 of the lower region of the dielectric housing 1020-1. The second inner sides 1023b-1, 1024b-1 may further include the inner side 1021a-1 of the upper region of the dielectric housing 1020-1. The array antennas 1100a, 1100b and the second inner side 1021a-1 of the dielectric housing 1020-1 may be in a state of separating the third gap G3. The array antennas 1100a, 1100b and the first inner side 1022b-1 of the dielectric housing 1020-1 may be in a state of separating the fourth gap G4. The third gap G3 may be formed wider than the fourth gap G4.

[0189] The array antennas 1100a, 1100b may be formed closer to the regions of the first inner sides 1023a-1, 1024a-1 than to the second inner sides 1023b-1, 1024b-1 of the dielectric housing 1020-1. The array antennas 1100a, 1100b may be formed closer to the regions of the first inner side 1022b-1 than to the second inner side 1021a-1 of the dielectric housing 1020-1. Accordingly, the array antennas 1100a, 1100b may radiate radio signals mainly through one side surface, the other side surface, and the lower region.

[0190] A connection part 1150 electrically connected to the metal frame 1010 may be additionally formed in the ground region 1100g formed inside the substrate. The connection part 1150 connected to the metal frame 1010 may be a metal housing 1150 formed of a metal material, but is not limited thereto.

[0191] The substrates formed by the array antennas 1100a and 1100b can be composed of multi-layered substrates. A plurality of antenna elements of the array antennas 1100a and 1100b can be disposed on a specific layer of the multi-layered substrate. The plurality of antenna elements can be configured to radiate a beamformed wireless signal through one side surface of the multi-layered substrate, the first inner side surfaces 1023a-1 and 1024a-1 of the dielectric housing 1020-1, and the outer side surfaces 1023-1 and 1024-1.

[0192] The plurality of antenna elements can form a 1xN array antenna disposed at regular intervals along an axis direction on a specific layer of the multi-layered substrate. The plurality of antenna elements can be composed of end-fire radiators that radiate wireless signals through one side surface of the multi-layered substrate. The 1xN array antennas 1100a and 1100b can form a first radiation pattern having a first beam width in an axis direction. The 1xN array antennas 1100a and 1100b can form a second radiation pattern having a second beam width within a specified angle range in the lower direction of the metal housing 1010. The second beam width can be formed wider than the first beam width.

[0193] Refer to Figure 7a , Figure 7b , Figures 8c to 9 , an electronic device in which the array antennas 1100a and 1100b are disposed in a dielectric housing 1020 whose inner side surfaces are formed with different thicknesses from each other and whose outer side surfaces are inclined, will be described.

[0194] The dielectric housing 1020 can include a plurality of side surface portions. The dielectric housing 1020 can include a first side surface portion 1021, a second side surface portion 1022, a third side surface portion 1023, and a fourth side surface portion 1024. The first side surface portion 1021 can be formed to be attached to the metal frame 1010. The second side surface portion 1022 can be formed to correspond to the first side surface portion 1021. The third side surface portion 1023 and the fourth side surface portion 1024 can be formed between both sides of the first side surface portion 1021 and the second side surface portion 1022. The first side surface portion 1021 and the second side surface portion 1022 can be respectively referred to as a front surface portion 1021 and a back surface portion 1022. The third side surface portion 1023 and the fourth side surface portion 1024 can be respectively referred to as a side surface portion 1023 and another side surface portion 1024.

[0195] The third side face 1023 and the fourth side face 1024 may be formed to be inclined. Thus, the length of the first side face 1021 may be formed to be longer than the length of the second side face 1021. The outer side faces 1023a, 1024a of the dielectric housing 1020 may be formed to be inclined at an angle of 15 degrees to 45 degrees with respect to the vertical axis, so that the direction and magnitude of the radiated signal can be optimized. The outer side faces 1023a, 1024a of the dielectric housing 1020 may be formed to be at an angle of 60 degrees or less with respect to the vertical axis, so that the direction and magnitude of the radiated signal can be optimized.

[0196] The plurality of side faces of the dielectric housing 1020 may include inner side faces and outer side faces corresponding to the inner side faces. The outer side faces 1023a, 1024a may be formed to be inclined with respect to the vertical axis. The inner side faces may include first inner side faces 1023b, 1024b and second inner side faces 1023c, 1024c. The first inner side faces 1023b, 1024b may face each other in a state of being separated from a vertical face at the ends of the array antennas 1100a, 1100b and one face of the third and fourth side faces 1023, 1024 of the dielectric housing 1020-1 by a first gap G1. The second inner side faces 1023c, 1024c may face each other in a state of being separated from a vertical face at the ends of the array antennas 1100a, 1100b and one face of the third side face 1023-1 and the fourth side face 1024 of the dielectric housing 1020-1 by a plurality of gaps G2. The regions of the second inner side faces 1023c, 1024c may be formed between the first inner side faces 1023b, 1024b and the metal frame 1010.

[0197] The plurality of gaps G2 may be formed to be wider than the first gap G1. The plurality of thicknesses t1 between the first inner side faces 1023b, 1024b and the outer side faces 1023a, 1024a may be formed to be wider than the second thickness t2 between the second inner side faces 1023c, 1024c and the outer side faces 1023a, 1024a. The array antennas 1100a, 1100b may be configured to radiate wireless signals through the inner side faces 1023b, 1023c, 1024b, 1024c of the dielectric housing 1020-1 and the inclined outer side faces 1023a, 1024a.

[0198] The first inner sides 1023b and 1024b may further include the inner side 1022b of the lower region of the dielectric housing 1020-1. The second inner sides 1023c and 1024c may further include the inner side 1021a of the upper region of the dielectric housing 1020-1. The array antennas 1100a and 1100b and the second inner side 1021a of the dielectric housing 1020-1 may be in a state of separating the third gap G3. The array antennas 1100a and 1100b and the first inner side 1022b of the dielectric housing 1020-1 may be in a state of separating the fourth gap G4. The third gap G3 may be formed wider than the fourth gap G4.

[0199] The array antennas 1100a and 1100b may be formed to be closer to the regions of the first inner sides 1023b and 1024b than to the second inner sides 1023c and 1024c of the dielectric housing 1020. The array antennas 1100a and 1100b may be formed to be closer to the region of the first inner side 1022b than to the second inner side 1021a of the dielectric housing 1020. Thus, the array antennas 1100a and 1100b may radiate wireless signals mainly through one side surface, the other side surface, and the lower region.

[0200] A connection part 1150 electrically connected to the metal frame 1010 may be additionally formed in the grounding region 1100g formed inside the substrate. The connection part 1150 connected to the metal frame 1010 may be a metal housing 1150 formed of a metal material, but is not limited thereto.

[0201] The substrate on which the array antennas 1100a and 1100b are formed may be composed of a multi-layered substrate. A plurality of antenna elements of the array antennas 1100a and 1100b may be arranged on a specific layer of the multi-layered substrate. The plurality of antenna elements may be configured to radiate beamformed wireless signals through one side surface of the multi-layered substrate, the first inner sides 1023b and 1024b of the dielectric housing 1020, and the outer sides 1023a and 1024a.

[0202] The plurality of antenna elements may be configured as a 1xN array antenna arranged at regular intervals along one axial direction on a specific layer of the multi-layered substrate. The plurality of antenna elements may be composed of end-fire radiators that radiate wireless signals through one side surface of the multi-layered substrate. The 1xN array antennas 1100a and 1100b may form a first radiation pattern having a first beam width in one axial direction. The 1xN array antennas 1100a and 1100b may form a second radiation pattern having a second beam width within a specified angle range in the lower direction of the metal housing 1010. The second beam width may be formed wider than the first beam width.

[0203] On the other hand, according to another embodiment of the present specification, the outer side surface of the dielectric housing attached to the frame 1010 may also be formed vertically. Regarding this, Figure 10 The structure of arranging the antenna module inside the dielectric housing formed vertically in the embodiment is shown. Figure 10 (a) of shows the structure of arranging the antenna module 1100 in the lower region of the metal frame 1010 and radiating radio signals in the lateral direction. Figure 10 (b) of shows the dielectric housing 1020-1 vertically formed on the outer side surface 1023b-1 in the lower region of the metal frame 1010. Refer to Figure 10 (b) of, the antenna module 1100 radiates radio signals through the dielectric housing 1020-1 vertically formed on the outer side surface 1023b-1.

[0204] Refer to Figure 10 , the antenna module 1100 is horizontally arranged in the lower region of the metal frame 1010. The metal frame 1010 may be a part of the display of an electronic device such as an image display device or a structure supporting the display. The metal frame 1010 made of a metal material will obstruct the path of the electromagnetic wave radiated laterally through the antenna module 1100.

[0205] Refer to Figure 10 (b) of, the antenna module 1100 may be arranged in the inner region of the dielectric housing 1020-1 formed in the lower region of the metal frame 1010. Refer to Figures 7a to 8d And Figure 10 , the dielectric housings 1020 and 1020-1 may be formed of a dielectric material such as plastic having a predetermined dielectric constant. The dielectric constant of the dielectric housings 1020 and 1020-1 may be formed to be about 2.5, but is not limited thereto and may be changed according to the application.

[0206] As Figure 10 (a) of shows, in the structure where the metal frame 1010 is formed in the upper region of the antenna module 1100, the radiation pattern may be distorted. As Figure 10 (b) of shows, in the structure where the outer side surface 1023a of the dielectric housing 1020-1 arranged in the lower region of the metal frame 1010 is vertically formed, the radiation pattern may also be distorted.

[0207] Regarding this, Figure 11 shows the diagrams obtained by comparing the radiation patterns in the horizontal direction in the structure where only the antenna module is arranged without a metal frame, the structure where the antenna module is arranged in the lower region of the metal frame, and the structure where the antenna module is arranged inside the dielectric housing. The radiation pattern in the horizontal direction represents the two-dimensional (2D) radiation pattern on the x-y plane.

[0208] Refer toFigure 11 , (i) The first radiation pattern of the first structure equipped only with the antenna module is not distorted and is formed in a symmetric shape in the lateral direction. On the other hand, (ii) the second radiation pattern of the second structure with the antenna module disposed in the lower region of the metal frame is distorted into a left-right asymmetric shape with respect to the lateral direction. The antenna gain value of the second structure is also reduced by about 2 dB compared to the antenna gain value of the first structure. Additionally, (iii) the third radiation pattern of the third structure with the antenna module disposed inside the dielectric housing vertically formed on the outer side surface is distorted into a left-right asymmetric shape with respect to the lateral direction. The degree of distortion of the third radiation pattern is greater than that of the second radiation pattern, resulting in a decrease in the radiation pattern quality. Referring to Figure 10 and Figure 11 , it can be confirmed that even if the dielectric housing 10201-1 vertically formed on the outer side surface 1023b-1 is formed in the lower region of the metal frame 1010, the antenna gain is not increased in the lateral direction.

[0209] Therefore, referring to Figures 7a to 9 , the outer side surfaces 1023b, 1024b of the side faces 1023, 1024 of the dielectric housing 1020 can be formed to be inclined with respect to the vertical axis. The array antenna 1100a can be configured to radiate wireless signals through the inner side surface 1023a and the inclined outer side surface 1023b of the dielectric housing 1020. The array antenna 1100b can be configured to radiate wireless signals through the outer side surface 1024b inclined with respect to the inner side surface 1024a of the dielectric housing 1020.

[0210] Regarding this, Figure 12 shows a comparison Figure 8c of the radiation patterns of the antenna module inside the inclined dielectric housing and Figure 10 the vertical dielectric housing on the horizontal and vertical axes. Figure 12 (a) of Figure 8c shows a comparison Figure 10 of the radiation patterns of the antenna module inside the inclined dielectric housing and Figure 12 the vertical dielectric housing in the x-y plane as the horizontal axis. Figure 8c the vertical dielectric housing in the y-z plane as the vertical axis. Figure 10 shows a comparison

[0211] Referring to Figure 8c , Figure 9 and Figure 12, the structure of the dielectric housing 1020 having slanted outer sides 1023b, 1024b in this specification can be called a slanted dielectric structure. In the slanted dielectric structure, the outline of the mechanical structure in which the antenna module is disposed is formed not at a right angle but slanted. The front portion 1021 of the dielectric housing 1020 attached to the metal frame 1010 is formed to have a first length. On the other hand, the rear portion 1022 of the dielectric housing 1020 is formed to have a second length shorter than the first length. Thus, the outer sides 1023b, 1024b of the dielectric housing 1020 are formed at a slanted angle such that the length of the cross section of the dielectric housing 1020 gradually becomes smaller as it gets closer to the lower region. Thereby, the amount of electromagnetic waves radiated from the antenna module 1100 and directed upward to the upper metal frame 1010 can be reduced. Since it is reflected by the metal frame 1010, the amount of electromagnetic waves directed downward with respect to the side surface can be reduced.

[0212] On the other hand, the inner region of the dielectric housing 1020 in which the outer sides 1023b, 1024b are formed at a slanted angle can be formed as a partial dielectric structure. The outer sides 1023b, 1024b and the inner sides 1023a, 1024a of the dielectric housing 1020 can be formed to have a predetermined thickness t1. The dielectric housing 1020 can include a first dielectric structure 1020a vertically formed at a first height h1 at the inner end of the rear portion 1022. An air material 1030 having a second height h2 can be formed from the upper end of the first dielectric structure 1020a to the inner upper end of the dielectric housing 1020. The air material 1030 formed at the second height h2 can also be called a second dielectric structure.

[0213] The first dielectric structure 1020a and the second dielectric structure 1030 can be formed as different dielectrics from each other. The first dielectric constant of the first dielectric structure 1020a is formed to be higher than the second dielectric constant of the second dielectric structure. Thereby, while increasing the electromagnetic waves in the side direction toward the antenna module 1000, the amount of electromagnetic waves directed upward can be reduced. Therefore, the influence of the metal frame 1010 formed on the upper portion of the dielectric housing 1020 on the radiation pattern of the antenna module 1100 can be reduced. As an example, the first dielectric constant of the first dielectric structure 1020a can be formed to be about 2.5, and the second dielectric constant of the second dielectric structure 1030 as an air layer can be formed to be 1.

[0214] Refer to Figure 8c , Figure 9 and Figure 12(a), the 2D radiation pattern of the horizontal x-y plane formed by the array antenna 1100a of the antenna module 1100 disposed within the inclined dielectric housing 1020 is a shape that is symmetric about the left and right with respect to the side region. Regarding this, the outer side surface 1023b of the dielectric housing 1020 attached to the metal frame 1010 may be formed to be inclined, and the inner side surface 1023 is formed in a stepped structure. On the other hand, the radiation pattern of the antenna module inside the dielectric housing 1020-1 attached to the metal frame 1010 and having the outer side surface 1023b-1 formed vertically is distorted to be asymmetric about the left and right. The gain value Ga1 of the antenna module 1100 disposed within the inclined dielectric housing 1020 is approximately 5 dB larger than the gain value (Ga2) of the antenna module inside the dielectric housing 1020-1 formed vertically.

[0215] Refer to Figure 8c , Figure 9 and Figure 12 (b), the 2D radiation pattern of the vertical y-z plane formed by the array antenna 1100a of the antenna module 1100 disposed within the inclined dielectric housing 1020 is formed in the downward direction of the side region. As described above, the outer side surface 1023b of the dielectric housing 1020 attached to the metal frame 1010 may be formed to be inclined, and the inner side surface 1023 is formed in a stepped structure.

[0216] On the other hand, the radiation pattern of the antenna module inside the dielectric housing 1020-1 attached to the metal frame 1010 and having the outer side surface 1023b-1 formed vertically is further formed in the downward direction. The radiation pattern of the antenna module inside the dielectric housing 1020-1 formed vertically forms two main lobes within a specified coverage range, and a null is formed between the main lobes, resulting in a decrease in radiation performance. In the antenna module inside the dielectric housing 1020-1, as another main lobe is formed at approximately 40 degrees in the downward direction with respect to the side region, the radiation performance at the side region decreases.

[0217] In contrast, in the radiation pattern of the antenna module 1100 disposed within the inclined dielectric housing 1020, the sidelobe formed at approximately 40 degrees in the downward direction also decreases. This is an effect obtained due to a decrease in the amount of electromagnetic waves reflected by the metal frame 1010 at the upper end. The gain value Ga3 of the antenna module 1100 disposed within the inclined dielectric housing 1020 is greater than the gain value Ga4 of the antenna module inside the dielectric housing 1020-1 formed vertically.

[0218] Figures 7a to 9 and Figure 12In (a), the 1xN array antennas 1100a and 1100b can form a first radiation pattern with a first beam width in one axial direction of the horizontal plane. Refer to Figures 7a to 9 and Figure 12 In (b), the 1xN array antennas 1100a and 1100b can form a second radiation pattern with a second beam width within a specified angular range in the lower direction of the metal housing. Regarding this, the second beam width is wider than the first beam width. Therefore, the 1xN array antennas 1100a and 1100b can perform beamforming while forming a directional beam with a first beam width in one axial direction of the horizontal plane. The 1xN array antennas 1100a and 1100b can form a directional beam with a second beam width within a specified coverage range in the lower direction along the other axis which is the vertical axis.

[0219] As described above, as Figure 12 shown, the antenna radiation pattern and gain can be optimized by adjusting the tilt angles of the outer sides 1023b and 1024b of the dielectric housing 1020. In addition, as Figure 12 described, the antenna radiation pattern and gain can be optimized by optimizing the height h from a specific layer of the multilayer substrate to the upper end of the first dielectric structure 1020a.

[0220] Regarding this, Figure 13a shows the radiation pattern in the x - y plane which is the horizontal plane according to the change in the tilt angle of the dielectric housing. Refer to Figures 7a to 9 and Figure 13a , as the tilt angles s of the outer sides 1023b and 1024b of the dielectric housing 1020 increase to 15 degrees, 30 degrees, and 45 degrees, the antenna gain in the side direction increases. However, when the tilt angle s of the outer sides 1023b and 1024b is 60 degrees, the antenna gain in the side direction decreases. Therefore, the outer sides 1023b and 1024b of the dielectric housing 1020 can be tilted at an angle of 60 degrees or less with respect to the vertical axis. The outer sides 1023b and 1024b of the dielectric housing 1020 can be tilted at an angle of 15 degrees to 45 degrees with respect to the vertical axis with 30 degrees as a reference.

[0221] Figure 13b shows the antenna gain at each frequency according to the change in the height from a specific layer of the multilayer substrate to the upper end of the first dielectric structure. Refer to Figure 13b , shows the antenna peak gain in the side region according to the change in the height h from a specific layer of the multilayer substrate to the upper end of the first dielectric structure. Shows the antenna peak gain in the side region according to the change in height h in the frequency band from 57 GHz to 70 GHz.

[0222] Refer to Figures 7a to 9 and Figure 13b, the multilayer substrate of the antenna module 1100 can be disposed in the lower region of the dielectric housing 1020a having the first dielectric structure 1020a. The array antennas 1100a, 1100b of the antenna module 1100 can be configured to radiate wireless signals in the frequency band between 57 GHz and 70 GHz. The height h from a specific layer of the multilayer substrate having a plurality of antenna elements where the array antennas 1100a, 1100b are disposed to the upper ends of the second inner side surfaces 1023a-1, 1024a-1, 1023b, 1024b can be formed in the range of 0.08λ0 to 0.9λ0.

[0223] The dielectric housings 1020-1, 1020 having the second inner side surfaces 1023a-1, 1024a-1, 1023b, 1024b can form the first dielectric structures 1020a-1, 1020a. As an example, the height h to the upper end of the first dielectric structure 1020a can be formed as 1.4 mm. Since the wavelength λ0 corresponding to 60 GHz is 5 mm, if the height h to the upper end is 1.4 mm, it corresponds to 0.28λ0 in terms of the wavelength unit.

[0224] In the case of only having the antenna module 1100, the peak gain in the lateral direction at 60 GHz is 9 dBi. On the other hand, if the height h from the antenna element inside the dielectric housing 1020 inclined at the lower part of the metal frame 1010 to the upper end of the first dielectric structure 1020a is 0.08λ0, it has a peak gain of 8.1 dBi at 60 GHz, resulting in a gain reduction of 0.9 dB. On the other hand, if the height h to the upper end of the first dielectric structure 1020a is 0.5λ0, it has a peak gain of 12.4 dBi, resulting in a gain increase of 3.4 dB. On the other hand, if the height h is 0.9λ0, it has a peak gain of 8.6 dBi, resulting in a slightly reduced gain. Therefore, in the frequency band between 57 GHz and 70 GHz, the height from a specific layer of the multilayer substrate having a plurality of antenna elements to the upper end of the first dielectric structure 1020a can be formed in the range of 0.08λ0 to 0.9λ0. Here, λ0 refers to the electrical length of one wavelength in the air at the operating frequency.

[0225] As described above, as Figure 12 shown, it is possible to optimize the antenna radiation pattern and gain by adjusting the height of the air material 1030 inside the dielectric housing 1020. In addition, as Figure 12 shown, it is possible to optimize the antenna radiation pattern and gain by adjusting the gap interval between the multilayer substrate and the first dielectric structure 1020a.

[0226] Regarding this, Figure 14a shows the antenna gain at each frequency according to the change in the height of the air layer inside the dielectric housing. Refer toFigures 7a to 9 and Figure 14a If the second height h2 of the air material 1030 is 0.04λ0, the peak gain has a value of 10.0 dBi at 60 GHz. At frequencies below 61.5 GHz centered around 61.5 GHz, it has a lower gain value. However, if the second height h2 of the air material 1030 is formed to be 0.1λ0 and 0.2λ0 of the value above it, the peak gain at 60 GHz has values of 11.2 dBi and 11.7 dBi. Therefore, if the second height h2 of the air material 1030 increases to above 0.04λ0, the peak gain will maintain a value above a specified level. In particular, if the second height h2 of the air material 1030 increases to above 0.1λ0, the performance in the lower frequency band below 60 GHz is relatively greatly improved. Thus, the second height h2 formed by the air material 1030 from the upper ends of the second inner sides 1023a-1, 1024a-1, 1023b, 1024b to the upper ends of the first inner sides 1023b-1, 1024b-1, 1023c, 1024c of the dielectric housing 1020 can be formed to be a value above 0.04λ0. In order to increase the gain in the lower frequency band below 60 GHz, the second height h2 of the air material 1030 from the upper end of the first dielectric structure 1020a to the inner upper end of the dielectric housing 1020 can be formed to be a value above 0.1λ0.

[0227] Figure 14b Shows the antenna peak gain at each frequency according to the change in the gap interval between the multilayer substrate and the first dielectric structure. Refer to Figures 7a to 9 and Figure 14b If the distance G1 corresponding to the gap between the multilayer substrate of the antenna module 1100 and the first dielectric structure 1020a increases, the thickness t3 of the lower end of the first dielectric structure 1020a decreases. Regarding this, if the distance G1 increases to 0.2λ0, 0.4λ0, and 0.6λ0, the thickness t3 of the lower end of the first dielectric structure 1020a will decrease to 0.6λ0, 0.4λ0, and 0.2λ0.

[0228] As the distance G1 corresponding to the gap between the multilayer substrate of the antenna module 1100 and the first dielectric structure 1020a increases, the peak gain of the antenna module 1100 gradually decays. Therefore, there is a maximum value of the distance G1 corresponding to the gap, and when implementing the gap, it needs to be a value below the maximum value of the distance G1.

[0229] If the distance G1 equivalent to the gap is 0.6λ0, a peak gain of 8.7 dBi can be confirmed at 60 GHz, and the performance at the lower frequency band of the operating broadband is greatly attenuated. However, if the distance G1 equivalent to the gap is 0.4λ0 and 0.2λ0, the peak gain performance at 60 GHz can be confirmed to increase to 10.1 dBi and 12.3 dBi. Therefore, the distance G1 between the inner sides of the first dielectric structures 1020a-1 and 1020a and the multilayer substrate of the antenna module 1100 can be formed to a value of 0.6λ0 or less. That is, the distances between the second inner side surfaces 1023a-1, 1024a-1, 1023b, and 1024b of the dielectric housings 1020-1 and 1020 and the multilayer substrate can be formed to values of 0.6λ0 or less. On the other hand, the thickness t3 of the lower end portion of the first dielectric structure 1020a can be formed to a value of 0.2λ0 or more.

[0230] On the other hand, the antenna radiation pattern can be optimized by disposing a metal housing on the multilayer substrate of the antenna module disposed inside the dielectric housing of the present specification. Regarding this, Figure 15 The structure in which a metal housing is disposed on the multilayer substrate of the antenna module disposed inside the dielectric housing of the present specification is shown. Figure 16 The radiation pattern change according to the distance between the metal housing and the antenna element is shown.

[0231] Referring to Figures 7a to 9 and Figure 15 , the electronic device provided with the antenna module 1100 may further include a metal housing 1150 disposed at the upper end portion of the multilayer substrate. Figure 15 The metal housing 1150 of Figure 8c and Figure 8d is not limited to being disposed inside the dielectric housing 1020 formed obliquely. Figure 15 The metal housing 1150 of Figure 8a and Figure 8b may also be disposed inside the dielectric housing 1020-1 formed vertically. Regarding this, the grounding region 1100g formed inside the multilayer substrate may be formed as a connection portion 1150 electrically connected to the metal frame 1010. The connection portion 1150 may be implemented by the metal housing 1150 disposed at the upper end portion of the multilayer substrate.

[0232] The metal housing 1150 is disposed in the grounding region 1100g of the antenna module 1100 and is configured to block electromagnetic waves toward the metal frame 1010. Accordingly, the metal housing 1150 may be referred to as a back metal structure. The metal housing 1150 is disposed on the back surface of the antenna module 1100, which is the opposite direction of the radiation direction of the antenna module 1100.

[0233] The metal housing 1150 can be a metal structure that serves as a support for fixing the PCB stably to the dielectric housing 1020 by fastening to the PCB composed of a multilayer substrate or using an adhesive. The metal housing 1150 can be a component attached to the PCB such as a shielding can.

[0234] A plurality of antenna elements of the array antennas 1100a and 1100b can be arranged in a first region 1100d corresponding to the radiator region of the multilayer substrate implemented by the antenna module 1100. The first region 1100d corresponding to the radiator region can be referred to as a dielectric region. The metal housing can be arranged in a second region 1100g corresponding to the ground region of the multilayer substrate. The second region 1100g can be referred to as a ground region.

[0235] The separation distance gc from the end-fire antenna element on a specific layer of the antenna module 1100 arranged on the multilayer substrate to the starting position of the metal housing 1150 can be formed within a specified range. For example, the separation distance gc can be formed as 1.5 mm, which can correspond to 0.3λ0 based on 60 GHz. The distance gc from the position where a plurality of antenna elements are arranged in the first region 1100d to one end of the metal housing 1150 can be formed as (n + 0.1)*λ0 < gc < (n + 0.7)*λ0. Here, n is characterized as 0 or a natural number.

[0236] Although the metal housing 1150 is arranged in the first dielectric structure 1020a, since it is formed with a specified thickness, a part of its region can be arranged in the air material 1030. Regarding this, a part of the region of the metal housing 1150 can be arranged in the air layer in the upper region of the first dielectric structure 1020a. The position of the lower end of the metal housing 1150 combined with the ground region at the upper end of the multilayer substrate can be formed to be lower than the upper end of the first dielectric structure 1020a. The position of the upper end of the metal housing 1010 can be formed to be higher than the upper end of the first dielectric structure 1020a.

[0237] The metal housing 1150 can be formed into a hexahedron structure including a front surface, a back surface, and side surfaces. The metal housing 1150 can be directly combined with the metal frame 1010, or can be combined through a separate coupling structure. The metal housing 1150 can be combined with the ground region 1100g of the multilayer substrate of the antenna module 1100.

[0238] Refer to Figure 15 and Figure 16, the side lobes in the downward direction from the vertical plane y - z plane, which is the metal housing 1150 serving as the back metal structure, can be reduced, thereby reducing the interference phenomenon with interference signals received from other directions. The side lobe characteristics change according to the separation distance (gc = g1) at the position where the metal housing 1150 is configured. As the separation distance g1 increases from 0.1λ0 to 0.5λ0, the side lobe levels of the (ii) second radiation pattern to the (iv) fourth radiation pattern decrease. However, as the separation distance g1 increases to 0.7λ0, the side lobe level of the (v) fifth radiation pattern increases. However, as the separation distance g1 increases from 0.1λ0 to 0.7λ0, the peak gain of the main lobe is higher than the peak gain of the main lobe of the (i) first radiation pattern without the metal housing. Additionally, even when the separation distance g1 increases from 0.1λ0 to 0.7λ0, almost no back - lobe appears, while the (i) first radiation pattern without the metal housing has a back - lobe. Therefore, regardless of the separation distance g1, there is an effect of being able to completely reduce the back - lobe through the metal housing 1150. Thus, the separation distance gc from the position where a plurality of antenna elements are configured in the first region 1100d to one end of the metal housing 1150 can be formed as (n + 0.1)*λ0 < gc < (n + 0.7)*λ0. Here, it is characterized in that n is 0 or a natural number.

[0239] On the other hand, the electric field distribution formed by the antenna module in this specification is deformed by the metal frame, and the electric field distribution can be improved according to the shape of the dielectric housing. Regarding this, Figure 17a shows the electric field distribution in which the electric field formed in the antenna module is deformed due to the metal frame. Figure 17b shows the case of the electric field distribution when a dielectric housing having a Figure 10 vertical structure on the outer side is formed in the lower region of the metal frame.

[0240] Referring to Figure 17a , if the metal frame 1010 is arranged above the antenna module 1100, the electric field distribution radiated from the antenna module 1100 is inclined at a specified first angle with respect to the horizontal plane. Therefore, the distribution of the propagation direction of the electric field is inclined at a specified angle with respect to the horizontal plane. Referring to the propagation directions of the electric fields in the first region R1 and the second region R2, the electromagnetic waves radiated from the antenna module 1100 are reflected by the metal frame 1010 and propagate in the downward direction rather than the side direction.

[0241] Referring to Figure 10 and Figure 17b, the electric field distribution radiated from the antenna module 1100 inside the dielectric housing 1020-1 with a rectangular structure vertically formed on the outer side 1023b-1 is also inclined at a specified second angle with respect to the horizontal plane. Due to the dielectric housing 1020-1, the second angle, which is the inclination angle of the electric field distribution, has a value smaller than the first angle in the structure with only the metal frame 1010, but the radiation pattern is still distorted due to the deformation of the electric field distribution. Referring to the propagation directions of the electric fields in the first region R1 and the second region R2, the electromagnetic waves radiated from the antenna module 1100 are reflected by the metal frame 1010 and propagate downward rather than in the lateral direction. Therefore, the deformation of the electric field distribution caused by the metal frame 1010 cannot be improved by the dielectric housing 1020-1 with a rectangular structure vertically formed on the outer side 1023b-1.

[0242] On the other hand, the deformed electric field distribution in this specification due to the metal frame can be improved by optimizing the shape of the dielectric housing. Regarding this, Figure 18a shows the electric field distribution in the structure formed by the first dielectric structure and the air layer inside the dielectric housing. Figure 18b shows the electric field distribution in the structure formed by the first dielectric structure and the air layer inside the dielectric housing and with the outer side of the dielectric housing inclined.

[0243] Referring to Figure 18a , the ends of the antenna module 1100 can be spaced apart from the inner side of the dielectric housing 1020-2 at different gap intervals, i.e., the first gap G1 and the second gap G2. The inside of the dielectric housing 1020-2 is formed by the first dielectric structure 1020a and the air material 1030, and the outer side 1023b-2 of the dielectric housing 1020-2 is vertically formed. As the inside of the dielectric housing 1020-2 is formed by the first dielectric structure 1020a and the air material 1030, the inclination angle of the electric field distribution is formed as a third angle, and the third angle is a value smaller than the Figure 17b second angle with respect to the horizontal plane. Referring to the propagation directions of the electric fields in the first region R1 and the second region R2, it can be confirmed that the component of the electromagnetic waves radiated from the antenna module 1100 being reflected by the metal frame 1010 and propagating downward is reduced. Therefore, it can be confirmed that in the dielectric housing 1020-2 including the first dielectric structure 1020a and the air material 1030, the component in the downward direction among the propagation direction components of the electric field is reduced and the component in the lateral direction is increased. However, as the outer side 1023b-2 of the dielectric housing 1020-2 is still vertically formed, the electric field distribution has the limitation that it cannot be formed completely parallel to the horizontal plane.

[0244] Referring to Figure 7a , Figure 8c , Figure 8d , Figure 15 andFigure 18b , the dielectric housing 1020 is inclined at a predetermined angle with respect to the vertical axis. Therefore, this is the electric field distribution diagram radiated from the antenna module 1100 inside the dielectric housing 1020 whose outer sides 1023 and 1024 are formed in a slanted shape. It can be confirmed that, due to the dielectric housing 1020 whose outer sides 1023 and 1024 are formed in a slanted shape, the amount of the electric field component reflected from the metal frame 1010 is significantly reduced.

[0245] Referring to the propagation directions of the electric fields in the first region R1 and the second region R2, it can be confirmed that the component of the electromagnetic wave radiated from the antenna module 1100 that is reflected by the metal frame 1010 and propagates in the downward direction is completely canceled by the dielectric housing 1020. Since the inside of the dielectric housing 1020 is formed of the first dielectric structure 1020a and the air material 1030 and the outer sides 1023b and 1024b of the dielectric housing 1020 are formed in a slanted shape, the deformation of the electric field distribution is completely improved. Thus, due to the dielectric housing 1020, the component in the downward direction of the electric field is completely canceled, and only the component in the side direction remains. Referring to the propagation directions of the electric fields in the first region R1 and the second region R2, due to the metal housing 1150 disposed on the back surface, the electromagnetic wave radiated from the antenna module 1100 cannot be formed toward the back surface. It can be confirmed that by disposing the metal housing 1150 on the back surface of the antenna module 1100, the rear radiation of the antenna module 1100 is significantly reduced.

[0246] As described above, an electronic device having an antenna module disposed in a dielectric housing according to an aspect of the present specification has been described. Hereinafter, an electronic device having antenna modules disposed in different regions of a dielectric housing according to another aspect of the present specification will be described. Regarding this, all of the above-described technical features and configurations also apply to the following description. Figure 19 An electronic device having antenna modules disposed in different regions of a dielectric housing according to the present specification is shown.

[0247] Referring to Figures 1 to 19 , the electronic device 1000 may include a metal frame 1010, a dielectric housing 1020, a first antenna module 1100-1, a second antenna module 1100-2, and an air material 1030. The metal frame 1010 may be configured to form the side region of the electronic device 1000. The metal frame 1010 may be formed to surround the display 151 and configured to support the display 151. The dielectric housing 1020 may be formed on one side of the metal frame 1010. The dielectric housing 1020 may be disposed on one side surface of the metal frame 1010 that forms the lower region.

[0248] The first antenna module 1100-1 can be disposed on one side of the inner region of the dielectric housing 1020. The first antenna module 1100-1 can be configured to face the inner side surface 1023a of the dielectric housing 1020. The second antenna module 1100-2 can be disposed on the other side of the inner region of the dielectric housing 1020. The second antenna module 1100-2 can be configured to face the inner side surface 1024a of the dielectric housing 1020. The air material 1030 can be disposed between the dielectric housing 1020 and the metal frame 1010.

[0249] The dielectric housing 1020 can be configured to include a plurality of side surface portions. The dielectric housing 1020 can be configured to include a first side surface portion 1021, a second side surface portion 1022, a third side surface portion 1023, and a fourth side surface portion 1024. The first side surface portion 1021 can be formed to be attached to the metal frame 1010. The second side surface portion 1022 can be formed to correspond to the first side surface portion 1021. The third side surface portion 1023 and the fourth side surface portion 1024 can be formed between both sides of the first side surface portion 1021 and the second side surface portion 1022. The first side surface portion 1021 and the second side surface portion 1022 can be respectively referred to as a front surface portion 1021 and a back surface portion 1022. The third side surface portion 1023 and the fourth side surface portion 1024 can be respectively referred to as one side surface portion 1023 and the other side surface portion 1024.

[0250] The third side surface portion 1023 and the fourth side surface portion 1024 can be formed to be inclined. Thus, the length of the first side surface portion 1021 can be formed to be longer than the length of the second side surface portion 1021. The outer side surfaces 1023a, 1024a of the dielectric housing 1020 can be inclined at an angle of 15 degrees to 45 degrees with respect to the vertical axis, so as to optimize the direction and magnitude of the radiated signal. The outer side surfaces 1023a, 1024a of the dielectric housing 1020 can be formed at an angle of 60 degrees or less with respect to the vertical axis, so as to optimize the direction and magnitude of the radiated signal.

[0251] The plurality of side faces of the dielectric housing 1020 may include an inner side face and an outer side face corresponding to the inner side face. The outer side faces 1023a, 1024a may be formed to be inclined with respect to the vertical axis. The inner side face may include a first inner side face 1023b, 1024b and a second inner side face 1023c, 1024c. The first inner side faces 1023b, 1024b may face each other in a state of being separated from a vertical face at the end of the array antennas 1100a, 1100b and one face among the third and fourth side faces 1023, 1024 of the dielectric housing 1020-1 by a first gap G1. The second inner side faces 1023c, 1024c may face each other in a state of being separated from a vertical face at the end of the array antennas 1100a, 1100b and one face among the third and fourth side faces 1023-1, 1024-1 of the dielectric housing 1020-1 by a plurality of gaps G2. The regions of the second inner side faces 1023c, 1024c may be formed between the first inner side faces 1023b, 1024b and the metal frame 1010.

[0252] The plurality of gaps G2 may be formed to be wider than the first gap G1. The plurality of thicknesses t1 between the first inner side faces 1023b, 1024b and the outer side faces 1023a, 1024a may be formed to be wider than the second thickness t2 between the second inner side faces 1023c, 1024c and the outer side faces 1023a, 1024a. The array antennas 1100a, 1100b may be configured to radiate radio signals through the inner side faces 1023b, 1023c, 1024b, 1024c of the dielectric housing 1020-1 and the inclined outer side faces 1023a, 1024a.

[0253] The first inner side faces 1023b, 1024b may further include an inner side face 1022b in the lower region of the dielectric housing 1020-1. The second inner side faces 1023c, 1024c may further include an inner side face 1021a in the upper region of the dielectric housing 1020-1. The array antennas 1100a, 1100b and the second inner side face 1021a of the dielectric housing 1020-1 may be in a state of being separated by a third gap G3. The array antennas 1100a, 1100b and the first inner side face 1022b of the dielectric housing 1020-1 may be in a state of being separated by a fourth gap G4. The third gap G3 may be formed to be wider than the fourth gap G4.

[0254] The array antennas 1100a and 1100b can be formed closer to the regions of the second inner sides 1023c and 1024c of the dielectric housing 1020 than to the regions of the first inner sides 1023b and 1024b. The array antennas 1100a and 1100b can be formed closer to the regions of the second inner side 1021a of the dielectric housing 1020 than to the regions of the first inner side 1022b. Accordingly, the array antennas 1100a and 1100b can radiate radio signals mainly through one side surface, the other side surface, and the lower region.

[0255] Connection parts 1150-1 and 1150-2 electrically connected to the metal frame 1010 can be additionally formed in the ground regions 1100g-1 and 1100g-2 formed inside the substrate. The connection part 1150 connected to the metal frame 1010 may be a metal housing 1150 formed of a metal material, but is not limited thereto.

[0256] The electronic device 1000 may further include first metal housings 1150-1 and second metal housings 11150-2 disposed at upper ends of the first multi-layer substrate and the second multi-layer substrate of the first antenna module 1100-1 and the second antenna module 1100-2. A plurality of antenna elements of the first antenna module 1100-1 and the second antenna module 1100-2 may be disposed in first regions 1100d-1 and 1100d-2 corresponding to radiator regions of the first multi-layer substrate and the second multi-layer substrate. The first metal housings 1150-1 and the second metal housings 1150-2 may be disposed in second regions 1100g-1 and 1100g-2 corresponding to ground regions of the first multi-layer substrate and the second multi-layer substrate.

[0257] The antenna module disposed inside the dielectric housing disclosed in this specification may be configured by an array antenna in the electronic device. Regarding this, Figure 20a The structure of the electronic device in which an antenna module in which a first type antenna and a second type antenna are formed by an array antenna is shown. Figure 20b is an enlarged Figure 20a view of a plurality of array antenna modules.

[0258] Referring to Figures 1 to 20b , the array antenna may include a first antenna module 1100-1 and a second antenna module 1100-2 disposed at a predetermined interval from the first antenna module 1100-1 in a first horizontal direction. On the other hand, the number of antenna modules is not limited to two, and as shown in Figure 20b , it may also be implemented by three or more. Accordingly, the antenna module may be configured to include a first antenna module 1100-1 to a third antenna module 1100-3.

[0259] FIGS. 5 to Figure 6The processor 1400 of c can control the first beam and the second beam to be formed in the first direction and the second direction by using the first antenna module 1100-1 and the second antenna module 1100-2 respectively. That is, the first beam can be formed in the horizontal direction in the first direction by using the first antenna module 1100-1. In addition, the second beam can be formed in the horizontal direction in the second direction by using the second antenna module 1100-2. In this regard, the processor 1400 can perform multiple-input multiple-output (MIMO) by using the first beam in the first direction and the second beam in the second direction.

[0260] The processor 1400 can use the first antenna module 1100-1 and the second antenna module 1100-2 to form a third beam in the third direction. In this regard, the processor 1400 can control the transceiver circuit 1250 to synthesize the signals received through the first antenna module 1100-1 and the second antenna module 1100-2. In addition, the processor 1400 can control the signals transmitted to the first antenna module 1100-1 and the second antenna module 1100-2 through the transceiver circuit 1250 to be distributed to the respective antenna elements. The processor 1400 can perform beamforming by using the third beam having a beam width narrower than that of the first beam and the second beam.

[0261] On the other hand, the processor 1400 can perform multiple-input multiple-output (MIMO) by using the first beam in the first direction and the second beam in the second direction, and can perform beamforming by using the third beam having a beam width narrower than that of the first beam and the second beam. In this regard, if the quality of the first signal and the second signal received from other electronic devices around the electronic device is below the critical value, beamforming can be performed by using the third beam.

[0262] The number of elements of the array antenna is not limited to 2, 3, 4, etc. as shown in the figure. For example, the number of elements of the array antenna can be increased to 2, 4, 8, 16, etc. Thus, the array antenna can be composed of 1x2, 1x3, 1x4, 1x5…1x8 array antennas.

[0263] On the other hand, Figure 21 An antenna module combined in different bonding structures at specific positions of the electronic device in the embodiment is shown. Referring to Figure 21 In (a) of, the antenna module 1100 can be substantially horizontally arranged with the display 151 in the lower region of the display 151. Thus, the beam B1 can be generated in the lower direction of the electronic device by any one of the plurality of array antenna modules. On the other hand, another beam B2 can be generated in the front direction of the electronic device by another one of the plurality of array antenna modules.

[0264] Referring toFigure 21 In (b) of this, the array antenna module 1100 can be disposed substantially perpendicular to the display 151 in the lower region of the display 151. Thus, a beam B2 can be generated in the front direction of the electronic device by any one of the plurality of array antenna modules. On the other hand, another beam B1 can be generated in the lower direction of the electronic device by another one of the plurality of array antenna modules.

[0265] Referring to Figure 21 In (c) of this, the antenna module 1100 can also be disposed inside the rear housing 1001 which is equivalent to a mechanical structure. It can be disposed substantially parallel to the display 151 inside the rear housing 1001. Thus, a beam B1 can be generated in the lower direction of the electronic device by any one of the plurality of array antenna modules. On the other hand, another beam B3 can be generated in the rear direction of the electronic device by another one of the plurality of array antenna modules.

[0266] As described above, the antenna module disposed inside the dielectric housing and the electronic device including the same have been described. The technical effects of the antenna module disposed inside the dielectric housing of this specification and the electronic device including the same are as follows.

[0267] According to an embodiment, the antenna module can be disposed inside the dielectric housing in the lower region of the metal frame of the electronic device, so that radio waves can be radiated to the side region in the millimeter wave band.

[0268] According to an embodiment, the antenna module that radiates radio waves to the side can be disposed inside the dielectric housing having an inclined outer surface, so that radio waves can be radiated to the side region even in a structure having a metal frame.

[0269] According to an embodiment, the outer shape of the dielectric housing disposed at the lower part of the metal frame can be optimized to an inclined structure, and an air layer can be formed while forming a dielectric structure in a protruding structure inside the dielectric, so that the radiation performance in the side direction can be improved.

[0270] According to an embodiment, the antenna radiation performance can be improved by the local dielectric technology of forming an air layer inside the dielectric housing, the inclined dielectric structure of the inclined outer surface, and the metal fixing device.

[0271] According to an embodiment, the antenna module can be disposed at different positions in the lower part of the electronic device, so that wireless communication can be performed with various surrounding electronic devices in various directions.

[0272] The appended scope to which this specification is applicable will become further clear from the following detailed description. However, since various changes and modifications within the spirit and scope of this specification can be clearly understood by those of ordinary skill in the art, it should be understood that specific embodiments such as the detailed description and the preferred embodiments of this specification are merely examples.

[0273] The appended scope to which this specification is applicable can be made clear by the following detailed description. However, those skilled in the art can clearly understand various changes and modifications within the spirit and scope of this specification. Therefore, it should be understood that specific embodiments such as the detailed description and the preferred embodiments of this specification are merely examples. Regarding the foregoing specification, the design and driving of an antenna operating in the millimeter-wave band and an electronic device controlling the same can be implemented by computer-readable code in a medium recording a program.

[0274] Computer-readable media include all types of storage devices storing data readable by a computer system. Examples of computer-readable media are HDD (Hard Disk Drive), solid-state drive, SDD (Silicon Disk Drive), ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage devices, etc., and can also be implemented in the form of a carrier wave (e.g., Internet-based transmission). Also, the computer may include a control unit of a terminal. Therefore, the above detailed description should not be construed as restrictive in all aspects, but should be understood as exemplary. The scope of this specification should be determined by a reasonable interpretation of the appended claims, and all changes within the equivalent scope of this specification should fall within the scope of this specification.

Claims

1. An electronic device having an antenna module, wherein, Comprising: A metal frame that forms a side region of the electronic device; A dielectric housing formed on one side of the metal frame; An air material contained inside the dielectric housing; And An array antenna formed inside a substrate disposed in an inner region of the dielectric housing; The dielectric housing includes a first side face attached to the metal frame, a second side face corresponding to the first side face, and a third side face and a fourth side face formed between the two sides of the first side face and the second side face, Plural side faces of the dielectric housing include an inner side face and an outer side face corresponding to the inner side face, The inner side face includes: A first inner side face formed to face each other in a state of being separated by a first gap from a vertical face at the end of the array antenna and any one of the third side face and the fourth side face of the dielectric housing; And A second inner side face formed to face each other in a state of being separated by a second gap from the vertical face at the end of the array antenna and the any one face; A region of the second inner side face is formed between the first inner side face and the metal frame, The second gap is formed wider than the first gap, A first thickness between the first inner side face and the outer side face is formed wider than a second thickness between the second inner side face and the outer side face, The array antenna is configured to radiate wireless signals through the inner side face and the outer side face of the dielectric housing.

2. The electronic device according to claim 1, wherein The array antenna and the second inner side face of the dielectric housing are in a state of being separated by a third gap, The array antenna and the first inner side face of the dielectric housing are in a state of being separated by a fourth gap, The third gap is formed wider than the fourth gap.

3. The electronic device according to claim 1, wherein The array antenna is formed to be close to a region of the first inner side face.

4. The electronic device according to claim 1, wherein A connection portion electrically connected to the metal frame is additionally formed in a ground region formed inside the substrate.

5. The electronic device according to claim 1, wherein The substrate on which the array antenna is formed is composed of a multilayer substrate, Plural antenna elements of the array antenna are disposed on a specific layer of the multilayer substrate, The plural antenna elements are configured to radiate beamformed wireless signals through one side face of the multilayer substrate, the first inner side face of the dielectric housing, and the outer side face.

6. The electronic device according to claim 5, characterized in that The plural antenna elements are configured as a 1xN array antenna disposed at regular intervals along one axial direction on the specific layer of the multilayer substrate, The plural antenna elements are end-fire radiators that radiate wireless signals through one side face of the multilayer substrate.

7. The electronic device according to claim 6, characterized in that The 1xN array antenna forms a first radiation pattern having a first beam width in the one axial direction, The 1xN array antenna forms a second radiation pattern having a second beam width within a specified angular range in a lower direction of the metal housing, The second beam width is wider than the first beam width.

8. An electronic device having an antenna module, wherein, Comprising: A metal frame forming a side area of the electronic device; A dielectric housing formed on one side of the metal frame; An air material contained inside the dielectric housing; And An array antenna formed inside a substrate disposed in an inner area of the dielectric housing; The dielectric housing includes a first side surface attached to the metal frame, a second side surface corresponding to the first side surface, and a third side surface and a fourth side surface formed between both sides of the first side surface and the second side surface, Plural side surfaces of the dielectric housing include an inner side surface and an outer side surface corresponding to the inner side surface, The outer side surface is formed to be inclined with respect to a vertical axis, The inner side surface includes: A first inner side surface formed to face each other in a state of being separated from a vertical surface at an end of the array antenna and any one of the third side surface and the fourth side surface of the dielectric housing by a first gap; And A second inner side surface formed to face each other in a state of being separated from the vertical surface at the end of the array antenna and the any one surface by plural gaps; A region of the second inner side surface is formed between the first inner side surface and the metal frame, The plural gaps are formed to be wider than the first gap, The first inner side surface and the outer side surface form plural thicknesses, The second inner side surface and the outer side surface are formed with a uniform thickness, The array antenna is configured to radiate a wireless signal through the inner side surface of the dielectric housing and the inclined outer side surface.

9. The electronic device according to claim 8, wherein The array antenna and the second inner side surface of the dielectric housing are in a state of being separated by a third gap, The array antenna and the first inner side surface of the dielectric housing are in a state of being separated by a fourth gap, The third gap is formed to be wider than the fourth gap.

10. The electronic device according to claim 8, wherein The array antenna is formed to be close to a region of the first inner side surface.

11. The electronic device according to claim 8, wherein A connection portion electrically connected to the metal frame is additionally formed in a ground region formed inside the substrate.

12. The electronic device according to claim 8, wherein The length of the first side surface is formed to be longer than the length of the second side surface.

13. The electronic device according to claim 8, wherein The outer side surface of the dielectric housing is inclined at an angle of 15 degrees to 45 degrees with respect to a vertical axis.

14. The electronic device according to claim 8, wherein The outer side surface of the dielectric housing is inclined at an angle of 60 degrees or less with respect to a vertical axis.

15. The electronic device according to claim 8, wherein The substrate on which the array antenna is formed is composed of a multi-layer substrate, Plural antenna elements of the array antenna are disposed on a specific layer of the multi-layer substrate, The plural antenna elements are configured to radiate a beamformed wireless signal through one side surface of the multi-layer substrate, the first inner side surface of the dielectric housing, and the outer side surface.

16. The electronic device according to claim 8, characterized in that A 1xN array antenna is formed by a plurality of the antenna elements, which are arranged at a prescribed interval in a prescribed axial direction on the specific layer of the multilayer substrate. The plurality of the antenna elements are end-fire radiators that radiate radio signals through one side surface of the multilayer substrate.

17. The electronic device according to claim 16, wherein the 1xN array antenna forms a first radiation pattern having a first beam width in the one axial direction, the 1xN array antenna forms a second radiation pattern having a second beam width within a prescribed angular range in the lower direction of the metal housing, the second beam width is wider than the first beam width.

18. The electronic device according to claim 5, wherein the multilayer substrate is arranged separately from the second inner surface, which is a lower region of the dielectric housing, the array antenna is configured to radiate radio signals in a frequency band between 57 GHz and 70 GHz, the height from the specific layer of the multilayer substrate where the plurality of the antenna elements are arranged to the upper end of the second inner surface is formed in a range of 0.08λ0 to 0.9λ0.

19. The electronic device according to claim 18, wherein the second height formed by the air material from the upper end of the second inner surface to the upper end of the first inner surface of the dielectric housing is formed to be a value of 0.04λ0 or more, the distance between the second inner surface of the dielectric housing and the multilayer substrate is formed to be a value of 0.6λ0 or less.

20. The electronic device according to claim 11, wherein the connection part is realized by a metal housing arranged at the upper end of the multilayer substrate, the plurality of the antenna elements are arranged in a first region corresponding to a radiator region in the multilayer substrate, the metal housing is arranged in a second region corresponding to a ground region in the multilayer substrate, the distance gc from the position where the plurality of antenna elements of the array antenna are arranged to one end of the metal housing is formed such that (n + 0.1)*λ0 < gc < (n + 0.7)*λ0, where n is 0 or a natural number.

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