Endoscope, imaging module, three-dimensional wiring board, and method for manufacturing endoscope

Abstract

The invention provides an endoscope, an imaging module, a three-dimensional wiring board, and a method for manufacturing the endoscope. An endoscope in which an imaging module is fixed to a tip frame of an insertion part, the imaging module comprising a camera unit and a three-dimensional wiring board having a first surface, a second surface closer to the tip side than the first surface, and a third surface closer to the base end side than the first surface, the camera unit is attached to the first surface inclined at a first angle with respect to the longitudinal axis direction of the front end portion, and the front end frame has a fourth surface in contact with the second surface and a fifth surface in contact with the third surface.

Description

Technical Field

[0001] The present invention relates to an endoscope having a camera module disposed at a distal end portion of an insertion portion, a camera module disposed at a distal end portion of the insertion portion of the endoscope, a three-dimensional wiring board of the camera module, and a method of manufacturing an endoscope having a camera module disposed at a distal end portion of the insertion portion. Background Art

[0002] In a side-view endoscope, the direction in which an imaging element performs imaging (observation direction) is inclined at a predetermined angle with respect to the longitudinal axis direction of the distal end portion of the insertion portion. When a predetermined direction cannot be observed, for example, the side-view endoscope cannot grasp the position of a treatment instrument protruding from the side surface of the distal end portion and performing treatment.

[0003] WO 2019 / 138606 discloses a side-view endoscope having a camera module, in which the imaging element of the camera module is mounted on an inclined surface of a stacked substrate. The imaging element is bonded and fixed to the lens unit via a glass cover. The lens holder of the lens unit is inserted into a through hole of the front end frame and fixed. The optical axis direction of the lens unit, that is, the observation direction of the imaging element, is fixed to the direction of the central axis of the through hole. The central axis of the through hole is inclined at a predetermined angle with respect to the front end axis of the endoscope. Summary of the Invention

[0004] The endoscope according to an embodiment of the present invention has a front end frame at a distal end portion of an insertion portion, and a camera module is fixed to the front end frame. The camera module includes a camera unit and a three-dimensional wiring board. The three-dimensional wiring board has a first surface, a second surface closer to the distal end side than the first surface, and a third surface closer to the proximal end side than the first surface. The camera unit is mounted on the first surface inclined at a first angle with respect to the longitudinal axis direction of the distal end portion. The front end frame has a fourth surface in contact with the second surface and a fifth surface in contact with the third surface.

[0005] The camera module according to an embodiment of the present invention includes: a camera unit; and a three-dimensional wiring board. The three-dimensional wiring board has a first surface on which the camera unit is mounted, a second surface located on one end side in the longitudinal axis direction of the three-dimensional wiring board with respect to the first surface, and a third surface located on the side opposite to the second surface with the first surface interposed therebetween. The second surface and the third surface are respectively configured to be in contact with two surfaces of the front end frame of the endoscope. When the second surface and the third surface are respectively in contact with the two surfaces of the front end frame, the first surface is inclined at a first angle with respect to the longitudinal axis direction.

[0006] Method for manufacturing an endoscope according to an embodiment of the present invention. In this method for manufacturing an endoscope, a three-dimensional wiring board is produced. The three-dimensional wiring board has a first surface, a second surface closer to the front end side than the first surface, and a third surface closer to the proximal end side than the first surface. The camera unit is mounted on the first surface of the three-dimensional wiring board to produce an imaging module. A front end frame is produced. The front end frame has a fourth surface and a fifth surface. The second surface of the three-dimensional wiring board is brought into contact with the fourth surface of the front end frame, and the third surface of the three-dimensional wiring board is brought into contact with the fifth surface of the front end frame. When the second surface is in contact with the fourth surface and the third surface is in contact with the fifth surface, the first surface is inclined at a first angle with respect to the longitudinal axis direction of the front end portion of the endoscope. An adhesive is injected into the gap between the three-dimensional wiring board and the front end frame, and the adhesive is cured to fix the imaging module to the front end portion of the insertion portion of the endoscope.

[0007] A three-dimensional wiring board for an endoscope imaging module according to an embodiment of the present invention includes: a camera unit mounting surface on which a camera unit is mounted; a front end frame contact surface that contacts the front end frame of the endoscope before and after with the camera unit mounting surface interposed therebetween in the longitudinal axis direction of the three-dimensional wiring board. Since the front end frame contact surface contacts the front end frame of the endoscope before and after, compared with the case where the angle with the front end frame is defined by one surface, the angle of the camera unit mounting surface with respect to the longitudinal axis direction of the three-dimensional wiring board (i.e., the angle of the optical axis of the camera unit with respect to a line perpendicular to the longitudinal axis direction) can be ensured with higher precision. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a diagram showing the structure of an endoscope system including an endoscope according to an embodiment of the present invention.

[0009] Figure 2 It is a perspective view of the front end portion of an endoscope according to an embodiment of the present invention.

[0010] Figure 3 It is a perspective cross-sectional view of the front end portion of an endoscope according to an embodiment of the present invention.

[0011] Figure 4 It is a perspective view of a three-dimensional wiring board of an endoscope according to an embodiment of the present invention.

[0012] Figure 5 It is an exploded cross-sectional view of the front end portion of an endoscope according to an embodiment of the present invention.

[0013] Figure 6 It is a flowchart of a method for manufacturing an endoscope according to an embodiment of the present invention.

[0014] Figure 7 It is a perspective cross-sectional view of a camera unit of an endoscope according to an embodiment of the present invention.

[0015] Figure 8 It is a three-dimensional cross-sectional view of the three-dimensional wiring board of the endoscope according to the embodiment of the present invention.

[0016] Figure 9 It is a cross-sectional view for explaining the manufacturing method of the endoscope according to the embodiment of the present invention.

[0017] Figure 10 It is a cross-sectional view for explaining the manufacturing method of the endoscope according to the embodiment of the present invention.

[0018] Figure 11 It is a cross-sectional view of the front end portion of the endoscope according to Modification 1 of the embodiment of the present invention.

[0019] Figure 12 It is a cross-sectional view of the front end portion of the endoscope according to Modification 2 of the embodiment of the present invention.

[0020] Figure 13 It is a cross-sectional view of the front end portion of the endoscope according to Modification 3 of the embodiment of the present invention. Detailed Embodiment

[0021] <Embodiment>

[0022] As Figure 1 shown, the endoscope system 2 including the endoscope 10 of the embodiment has an endoscope 10, a processor 17, a light source device 18, and a monitor 19.

[0023] In the following description, the drawings based on each embodiment are schematic diagrams. The relationship between the thickness and width of each part, the ratio of the thickness of each part, and the relative angle are different from the actual situation. There are also parts with different dimensional relationships and ratios between the drawings. The illustration of some structural elements and the labeling of reference numerals are omitted.

[0024] The endoscope 10 is an oblique-view endoscope that inserts the insertion portion 11 into the body of the subject to capture an in-vivo image and output a captured image signal. An operation portion 12 is provided at the proximal end portion of the insertion portion 11 of the endoscope 10, and various button-like members for operating the endoscope 10 are provided on the operation portion 12. The insertion portion 11 is composed of the following parts: a front end portion 11A provided with a camera module 30, a bendable bending portion 11B connected to the proximal end portion of the front end portion 11A, and a flexible portion 11C connected to the proximal end portion of the bending portion 11B. The bending portion 11B bends by the operation of the operation portion 12.

[0025] The general cable 13 extending from the operation portion 12 is connected to the processor 17 and the light source device 18 through a connector 14. As described later, a treatment instrument is inserted through the treatment instrument insertion port 12A of the operation portion 12.

[0026] The processor 17 controls the overall endoscope system 2, processes the imaging signal output from the imaging module 30, and outputs it as an image signal. The monitor 19 displays the image signal output from the processor 17.

[0027] The light source device 18 has, for example, white LEDs. The illumination light emitted from the light source device 18 is guided to the distal end portion 11A through the general cable 13 and the light guide 40 inserted into the insertion portion 11 (see Figure 3 ), and illuminates the subject via the illumination lens 41 (see Figure 3 ).

[0028] In addition, the endoscope 10 is a medical flexible endoscope, but the endoscope of other embodiments may be a rigid endoscope or an industrial endoscope.

[0029] <Structure of the distal end portion>

[0030] As Figure 2 and Figure 3 shown, the distal end frame 20, which is a main component of the distal end portion 11A of the endoscope 10, is a rigid component made of a metal such as stainless steel. A bending portion 11B is connected in series to the proximal end side of the distal end frame 20 disposed at the distal end of the insertion portion 11.

[0031] A lift table housing space S20 for housing the lift table 60 is formed in the distal end frame 20. Although not shown, the lift table 60 is used to operate the protruding direction of the treatment instrument, and the treatment instrument is inserted through the treatment instrument insertion port 12A and protrudes from the opening of the distal end portion 11A via the channel tube.

[0032] In the distal end frame 20, an illumination lens 41, an imaging module 30, and a cleaning nozzle 50 are sequentially arranged along the longitudinal axis direction LA of the distal end portion 11A. The illumination lens 41 emits illumination light toward the subject. The cleaning nozzle 50 sprays a fluid for removing attachments toward the illumination lens 41 and the imaging module 30.

[0033] That is, as Figure 3 shown, the distal end frame 20 has: a through hole H60 connected to the channel tube, a through hole H30 into which the imaging module 30 is inserted, a through hole H40 in which the illumination lens 41 is disposed, and a through hole H50 connected to the cleaning nozzle 50. For example, the through hole H30 has openings on the outer surface and the inner surface of the distal end frame 20. Although not shown, the distal end frame 20 has a relatively large opening on the side surface, and after a plurality of components are disposed inside, the opening is closed by a side cover.

[0034] The imaging module 30 includes a three-dimensional wiring board 31 and a camera unit 32. As will be described in detail later, the imaging module 30 is fixed to the distal end frame 20 using an adhesive 70.

[0035] AsFigure 4 As shown, the three-dimensional wiring board 31 has a complex three-dimensional structure. The three-dimensional wiring board 31 is a MID (Molded Interconnect Device) in which a conductor pattern (not shown) is disposed on the surface of an injection-molded three-dimensional molded article. By using the three-dimensional wiring board 31, unlike a planar wiring board, its shape has a function, and conductor patterns can also be formed on inclined surfaces, vertical surfaces, curved surfaces, through holes, etc.

[0036] The upper surface 31SA of the three-dimensional wiring board 31 includes a first surface 31S1, a second surface 31S2 on the front end side of the first surface 31S1, a third surface 31S3 on the base end side of the first surface 31S1, and a sixth surface 31S6 between the first surface 31S1 and the third surface 31S3. And, the three-dimensional wiring board 31 has a recess H31 surrounded by a frame-shaped wall 31F and having the first surface 31S1 as the bottom surface. Although not shown, a plurality of wirings are disposed on the lower surface 31SB of the three-dimensional wiring board 31. The elongated three-dimensional wiring board 31 is fixed to the front end frame 20 in such a manner that the length axis direction is the same as the length axis direction LA of the front end portion 11A.

[0037] The second surface 31S2 and the third surface 31S3 are located on the same plane and parallel to each other with the first surface 31S1 therebetween. In contrast, the first surface 31S1 is inclined with respect to the second surface 31S2 and the third surface 31S3 at a first angle θ1.

[0038] As Figure 5 shown in the exploded view, the camera unit 32 is inserted into the recess H31 of the three-dimensional wiring board 31 of the imaging module 30. That is, the camera unit 32 is mounted on the first surface 31S1 of the three-dimensional wiring board 31. The optical axis O32 of the camera unit 32 is perpendicular to the first surface 31S1. Therefore, the second angle θ2 formed by the optical axis O32 of the camera unit 32 and the line perpendicular to the length axis direction LA is the same as the inclination angle of the first surface 31S1, that is, the first angle θ1. The second angle θ2 is the angle of the optical axis O32 of the camera unit 32 with respect to the direction perpendicular to the length axis direction LA.

[0039] The second angle θ2 is, for example, -30 degrees to 30 degrees. In order for the camera unit 32 to observe a specified direction, it is necessary to manage the manufacturing error of the second angle θ2 within, for example, ±7 degrees.

[0040] In the conventional endoscope in which the lens holder of the lens unit is inserted and fixed into the through hole of the front end frame as described in the background art, there is a gap between the outer surface of the lens holder and the inner surface of the through hole. Therefore, the optical axis of the lens unit is inclined from the central axis of the through hole, and it is possible that the field of view in a specified direction cannot be observed.

[0041] An object of an embodiment of the present invention is to provide a side-view endoscope capable of observing a prescribed direction, an imaging module of the side-view endoscope capable of observing a prescribed direction, and a method of manufacturing the side-view endoscope capable of observing a prescribed direction.

[0042] As described above, in the endoscope 10 (imaging module 30), the second surface 31S2 and the third surface 31S3 of the three-dimensional wiring board 31 are located in the same plane and are parallel to each other. In this way, these surfaces can be formed with high precision by a method such as cutting. In addition, a first angle θ1 formed by the second surface 31S2 and the third surface 31S3 with respect to the first surface 31S1 is determined when designing the three-dimensional wiring board 31.

[0043] On the other hand, a fourth surface 20S4 and a fifth surface 20S5 of the inner surface 20SB of the front end frame 20 are parallel to the longitudinal axis direction LA of the front end portion 11A. Further, the three-dimensional wiring board 31 is fixed to the inner surface 20SB of the front end frame 20 using an adhesive 70 in a state where the second surface 31S2 and the third surface 31S3 of the three-dimensional wiring board 31 are in contact with the fourth surface 20S4 and the fifth surface 20S5 of the front end frame 20. At this time, a wall 31F constituting a concave portion H31 of the three-dimensional wiring board 31 is inserted into a through hole H30 of the front end frame 20.

[0044] The second surface 31S2 and the third surface 31S3 of the three-dimensional wiring board 31 are in contact with the fourth surface 20S4 and the fifth surface 20S5 of the front end frame 20. Since the fourth surface 20S4 and the fifth surface 20S5 are parallel to the longitudinal axis direction LA, the second surface 31S2 and the third surface 31S3 of the three-dimensional wiring board 31 are also naturally parallel to the longitudinal axis direction LA. Therefore, the first surface 31S1 inclined with respect to the second surface 31S2 of the three-dimensional wiring board 31 is inclined with respect to the longitudinal axis direction LA at a first angle θ1. Further, an optical axis O32 of the camera unit 32 is inclined with respect to the longitudinal axis direction LA at a second angle θ2 that is the same as the first angle θ1.

[0045] The imaging module 30 defines an angle with respect to the front end frame 20 by two surfaces (the second surface 31S2 on the front end side and the third surface 31S3 on the rear end side) disposed with the first surface 31S1 on which the camera unit 32 is mounted interposed therebetween. Therefore, compared with an endoscope in which an angle between the imaging module and the front end frame is defined by one surface, the endoscope 10 can more accurately ensure an angle of the optical axis O32 of the camera unit 32 with respect to the front end frame 20, that is, an angle of the optical axis O32 with respect to the longitudinal axis direction LA.

[0046] As described above, the imaging module 30 of the embodiment includes a camera unit 32 and a three-dimensional wiring board 31. The three-dimensional wiring board 31 has: a first surface 31S1 on which the camera unit 32 is mounted, and a second surface 31S2 and a third surface 31S3 that have a first angle θ1 with respect to the first surface 31S1. The second surface 31S2 is located on one end side in the length axis direction LA of the three-dimensional wiring board 31, and the third surface 31S3 is located on the side opposite to the second surface 31S2 with the camera unit 32 interposed therebetween. The second surface 31S2 and the third surface 31S3 are respectively configured to abut against two surfaces of the front end frame 20 of the endoscope 10.

[0047] The adhesive 70 is disposed in the gap G between the sixth surface 31S6 of the three-dimensional wiring board 31 and the front end frame 20 (see Figure 9 ). The adhesive 70 is not disposed between the second surface 31S2 and the third surface 31S3 and the inner surfaces 20SB (the fourth surface 20S4 and the fifth surface 20S5) of the front end frame 20. The gap G may also be provided at other positions between the three-dimensional wiring board 31 and the front end frame 20, and the adhesive 70 may be disposed here.

[0048] Since the adhesive is not disposed on the abutting surfaces for positioning (angle determination), the angle of the imaging module 30 with respect to the front end frame 20 will not deviate due to the deviation of the thickness of the adhesive. Therefore, the endoscope 10 has particularly small errors during manufacturing. For example, the accuracy of the tilt angle of the optical axis O32 of the camera unit 32 with respect to the length axis direction LA is within ±3 degrees.

[0049] According to the embodiment of the present invention, an endoscope capable of observing a specified direction, an imaging module of an endoscope capable of observing a specified direction, and a manufacturing method of an endoscope capable of observing a specified direction can be provided.

[0050] <Manufacturing method of endoscope>

[0051] According to Figure 6 the flowchart, the manufacturing method of the endoscope 10, particularly the manufacturing method of the front end portion 11A, will be described.

[0052] <Step S10> Fabrication of camera unit and three-dimensional wiring board

[0053] As Figure 7 shown, the camera unit 32 includes an imaging element 32A and an imaging optical system 32B. The imaging element 32A is a CCD, CMOS, etc. that converts the subject image converged by the imaging optical system 32B into an electrical signal. The imaging element 32A may also include a glass cover. The imaging optical system 32B is composed of a plurality of optical elements (lenses, filters, etc.). The imaging optical system 32B is fabricated by cutting a laminated wafer formed by laminating a plurality of optical wafer layers each including a plurality of optical elements.

[0054] On the back surface of the imaging element 32A, a ball grid array composed of a plurality of bonding members 32C is provided. The bonding members 32C are solder balls, gold bumps, etc.

[0055] As Figure 8 shown, a plurality of pads 31T1 are provided on the bottom surface, i.e., the first surface 31S1, of the recess H31 of the three-dimensional wiring board 31. The three-dimensional wiring board 31 has a through-wiring 31T2 that reaches the lower surface 31SB on the opposite side of the first surface 31S1 under the pad 31T1. The pad 31T1 and the through-wiring 31T2 are provided by plating, screen printing, sputtering, metal evaporation, etc. Although not shown, wirings extending from the through-wiring 31T2 are provided on the lower surface 31SB, and electronic components such as chip capacitors are mounted on the wirings, and further, a cable is joined to the end.

[0056] The first length L1 in the length axis direction LA between the first surface 31S1 and the second surface 31S2 is smaller than the second length L2 in the length axis direction LA between the first surface 31S1 and the third surface 31S3. By shortening the length from the camera unit 32 to the front end of the front frame 20, the endoscope 10 becomes small-sized and minimally invasive.

[0057] Moreover, in the direction perpendicular to the length axis direction LA, the positions of the second surface 31S2 and the third surface 31S3 are within the range of the depth H32 (the length in the optical axis direction of the camera unit 32) of the recess H31. Therefore, the length (outer diameter) of the front end portion 11A of the endoscope 10 in the direction perpendicular to the length axis direction LA is short and minimally invasive.

[0058] <Step S20> Fabricate the imaging module

[0059] The camera unit 32 is inserted into the recess H31 of the three-dimensional wiring board 31, and the bonding members 32C of the camera unit 32 are joined to the pads 31T1 on the first surface 31S1 of the three-dimensional wiring board 31. A sealing resin 32D is filled in the gap between the camera unit 32 housed in the recess H31 and the wall surface of the recess H31. Electronic components such as chip capacitors are mounted on the wirings on the lower surface 31SB of the three-dimensional wiring board 31, and further, a cable is joined to the end of the wiring.

[0060] <Step S30> Bring the imaging module into contact with the front frame

[0061] As Figure 9As shown, the three-dimensional wiring board 31 is temporarily fixed in a state of abutting against the inner surface of the front end frame 20. That is, the second surface 31S2 of the three-dimensional wiring board 31 abuts against the fourth surface 20S4 of the front end frame 20, and the third surface 31S3 of the three-dimensional wiring board 31 abuts against the fifth surface 20S5 of the front end frame 20. A gap G is formed between the sixth surface 31S6 of the three-dimensional wiring board 31 and the front end frame 20. The gap G only needs to be between the three-dimensional wiring board 31 and the front end frame 20, and can also be provided at a position different from the above.

[0062] <Step S40> Inject the adhesive

[0063] As Figure 10 shown, the adhesive 70 is injected into the gap G between the sixth surface 31S6 of the three-dimensional wiring board 31 and the front end frame 20. The adhesive 70 is, for example, an epoxy resin of ultraviolet curable type, heat curable type or ultraviolet heat dual-curable type. The adhesive 70 is also disposed in the gap between the through hole H30 and the imaging module 30.

[0064] The adhesive 70 is not disposed between the second surface 31S2 and the fourth surface 20S4 and between the third surface 31S3 and the fifth surface 20S5. However, between the two abutting surfaces, inevitable gaps may be generated due to manufacturing errors, etc., or there may be damage on the surface of the surface. Of course, a small amount of the adhesive 70 may also exist between the two surfaces.

[0065] <Step S50> Cure the adhesive

[0066] The curing process of the adhesive 70 is performed, and the imaging module 30 is fixed to the front end frame 20.

[0067] <Step S60> Dispose the illumination lens

[0068] The illumination lens 41, the light guide 40, etc. are fixed to the front end frame 20. The illumination lens 41, etc. may also be fixed to the front end frame 20 before the imaging module 30 is fixed to the front end frame 20.

[0069] <Step S70> Fix the side cover

[0070] For example, the side opening (not shown) of the front end frame 20 is closed by fixing the side cover. The side opening may also be closed by fixing the side cover before the imaging module 30 is fixed to the front end frame 20.

[0071] According to the manufacturing method of the endoscope of the present embodiment, an endoscope that can accurately observe a specified direction can be easily manufactured. For example, an endoscope with an accuracy that the tilt angle of the optical axis O32 of the camera unit 32 with respect to the longitudinal axis direction LA is within ±3 degrees can be easily manufactured.

[0072] <Modification example>

[0073] Similar to the endoscope 10, the endoscopes 10A to 10C (imaging modules 30A to 30C) of the modified examples have the same effects as the endoscope 10. Therefore, in the following description, structural elements having the same functions as those of the endoscope 10 are denoted by the same reference numerals as those of the endoscope 10, and the description thereof is omitted.

[0074] <Modified Example 1>

[0075] In Figure 11 In the endoscope 10A of the present modified example shown, the second surface 31S2 and the third surface 31S3 of the three-dimensional wiring board 31A of the imaging module 30A are parallel, but not in the same plane. That is, the third surface 31S3 is located above the second surface 31S2 in the drawing. Also, the fourth surface 20S4 and the fifth surface 20S5 of the front end frame 20A are parallel, but not in the same plane.

[0076] However, the second surface 31S2 abuts against the fourth surface 20S4, and the third surface 31S3 abuts against the fifth surface 20S5, whereby the first surface 31S1 is inclined at a predetermined angle with respect to the longitudinal axis direction LA. Therefore, the optical axis O32 of the camera unit 32 is inclined at a predetermined angle with respect to the longitudinal axis direction LA.

[0077] <Modified Example 2>

[0078] In Figure 12 In the endoscope 10B of the present modified example shown, the second surface 31S2 and the third surface 31S3 of the three-dimensional wiring board 31B of the imaging module 30B are not parallel to each other, and are not parallel to the longitudinal axis direction LA either. Also, the fourth surface 20S4 and the fifth surface 20S5 of the front end frame 20B are not parallel to each other, and are not parallel to the longitudinal axis direction LA either.

[0079] However, the second surface 31S2 of the three-dimensional wiring board 31B is parallel to the fourth surface 20S4 of the front end frame 20B, and the third surface 31S3 is parallel to the fifth surface 20S5. The second surface 31S2 abuts against the fourth surface 20S4, and the third surface 31S3 abuts against the fifth surface 20S5, whereby the first surface 31S1 is inclined at a predetermined angle with respect to the longitudinal axis direction LA. Therefore, the optical axis O32 of the camera unit 32 is inclined at a predetermined angle with respect to the longitudinal axis direction LA.

[0080] <Modified Example 3>

[0081] In Figure 13 In the endoscope 10C of the present modified example shown, the three-dimensional wiring board 31C of the imaging module 30C does not have a recess surrounded by a wall like the three-dimensional wiring board 31. The inner diameter of the through hole H30 of the front end frame 20C is slightly larger than the outer diameter of the camera unit 32.

[0082] The endoscope 10C has no wall for forming a recess, and thus the length of the distal end portion can be shortened. Also, like the endoscope 10, the endoscope 10C can accurately observe a specified direction.

[0083] In addition, the ranges of the numerical values described above are not limited to the ranges described above, and can be appropriately increased or decreased. Also, the insertion portion 11 of the endoscope 10 may be a rigid endoscope. The present invention is not limited to the above-described embodiments, etc., and various changes, modifications, etc. can be made without changing the gist of the present invention.

Claims

1. An endoscope, wherein, The endoscope includes an insertion portion, and a front end frame is provided at the front end portion of the insertion portion. A camera module is fixed to the front end frame. The camera module includes: a camera unit including an imaging optical system and an imaging element; and a three-dimensional wiring board. The three-dimensional wiring board has a first surface, a second surface on the front end side with respect to the first surface, and a third surface on the base end side with respect to the first surface. The camera unit is mounted on the first surface inclined at a first angle with respect to the length axis direction of the front end portion. The front end frame has a fourth surface in contact with the second surface and a fifth surface in contact with the third surface.

2. The endoscope according to claim 1, wherein the second surface, the third surface, the fourth surface, and the fifth surface are parallel to the length axis direction.

3. The endoscope according to claim 1, wherein the three-dimensional wiring board is a molded interconnect device.

4. The endoscope according to claim 3, wherein the three-dimensional wiring board has a recess surrounded by a wall and having the first surface as the bottom surface. The camera unit is housed in the recess. The wall constituting the recess is inserted into a through hole of the front end frame.

5. The endoscope according to claim 1, wherein a first length between the first surface and the second surface is less than a second length between the first surface and the third surface.

6. The endoscope according to claim 1, wherein the first angle is equal to a second angle formed by the optical axis of the camera unit and a line perpendicular to the length axis direction.

7. The endoscope according to claim 1, wherein the second surface and the third surface are located on one plane.

8. The endoscope according to claim 7, wherein the fourth surface and the fifth surface are located on the one plane.

9. The endoscope according to claim 7, wherein in a direction perpendicular to the length axis direction, positions of the second surface and the third surface are within a range of a length in the optical axis direction of the camera unit.

10. The endoscope according to claim 1, wherein the three-dimensional wiring board has a sixth surface between the first surface and the third surface. An adhesive is disposed in a gap between the sixth surface and the front end frame.

11. The endoscope according to claim 10, wherein the adhesive is not disposed between the second surface and the front end frame and between the third surface and the front end frame.

12. An imaging module, wherein, The camera module includes: a camera unit; and a three-dimensional wiring board having a first surface on which the camera unit is mounted, a second surface on one end side in the length axis direction of the three-dimensional wiring board with respect to the first surface, and a third surface located on the opposite side of the second surface with respect to the first surface. The second surface and the third surface are respectively configured to be in contact with two surfaces of the front end frame of the endoscope. When the second surface and the third surface are respectively in contact with the two surfaces of the front end frame, the first surface is inclined at a first angle with respect to the length axis direction.

13. The camera module according to claim 12, wherein the second surface and the third surface have the first angle with respect to the first surface.

14. The imaging module according to claim 12 or 13, wherein no adhesive is provided between the second surface and the front end frame, and between the third surface and the front end frame.

15. A method of manufacturing an endoscope, in which a three-dimensional wiring board is fabricated, the three-dimensional wiring board having a first surface, a second surface on the front end side with respect to the first surface, and a third surface on the base end side with respect to the first surface, a camera unit is mounted on the first surface of the three-dimensional wiring board to fabricate an imaging module, a front end frame is fabricated, the front end frame having a fourth surface and a fifth surface, the second surface of the three-dimensional wiring board is brought into contact with the fourth surface of the front end frame, and the third surface of the three-dimensional wiring board is brought into contact with the fifth surface of the front end frame. When the second surface is in contact with the fourth surface and the third surface is in contact with the fifth surface, the first surface is inclined at a first angle with respect to the longitudinal axis direction of the front end portion of the endoscope, an adhesive is injected into the gap between the three-dimensional wiring board and the front end frame, the adhesive is cured, and the imaging module is fixed to the front end portion of the insertion portion of the endoscope.

16. The method of manufacturing an endoscope according to claim 15, wherein the three-dimensional wiring board has a recess surrounded by walls with the first surface as the bottom surface, and the camera unit including an imaging optical system and an imaging element is housed in the recess.

17. The method of manufacturing an endoscope according to claim 15 or 16, wherein the second surface and the third surface have the first angle with respect to the first surface.

18. The method of manufacturing an endoscope according to claim 15 or 16, wherein no adhesive is provided between the second surface and the front end frame, and between the third surface and the front end frame.

19. A three-dimensional wiring board for an endoscopic camera module, wherein, The three-dimensional wiring board includes: a camera unit mounting surface on which a camera unit is mounted; a front end frame contact surface that contacts the front end frame of the endoscope before and after across the camera unit mounting surface in the longitudinal axis direction of the three-dimensional wiring board.

20. The three-dimensional wiring board for an endoscope imaging module according to claim 19, wherein when the front end frame contact surface contacts the front end frame, the camera unit mounting surface is inclined at a predetermined angle with respect to the longitudinal axis direction of the three-dimensional wiring board.

21. The three-dimensional wiring board for an endoscope imaging module according to claim 19 or 20, wherein no adhesive is provided between the front end frame contact surface and the front end frame.

Images