Welding device for LED display screen chip production

Abstract

The invention discloses a welding device for LED display screen chip production, and relates to the technical field of chip production, the welding device comprises a bottom plate, a chip pickup assembly, a cooling assembly, a chip positioning and fixing assembly and a welding assembly; a chip picking assembly, a cooling assembly, a chip positioning and fixing assembly and a welding assembly are mounted at the upper end of the bottom plate; the chip positioning and fixing assembly comprises a welding table, a mounting groove, an electromagnetic device, a first hydraulic machine, a circular rubber sliding block, a chip positioning concave plate and a magnet, and the welding table is fixedly connected to the middle of the upper end of the bottom plate. According to the automatic chip pick-up device, the whole and local temperature of the welded chip can be quickly reduced, the chip can be quickly and automatically picked up, and the processed chip can be quickly picked up, so that the processing smoothness is improved, and the time required for replacing the chip during processing is shortened.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production, and specifically to a welding device for LED display chip production. Background Art

[0002] An LED display is a flat panel display composed of small LED module panels, which is a device used to display various information such as text, images, and videos. The LED electronic display integrates microelectronics technology, computer technology, and information processing, and has the advantages of bright colors, wide dynamic range, high brightness, long lifespan, and stable and reliable operation. LED displays are widely used in commercial media, cultural performance markets, stadiums, information dissemination, news release, securities trading, etc., and can meet the needs of different environments; Among the existing technologies, a welding device for LED display chip production proposed in the authorized announcement number CN212761886U includes a base. A groove is opened at the top of the base. A worm is rotatably installed in the groove. One end of the worm extends outside the base and is fixedly installed with a knob. Two worm wheels are rotatably installed in the groove. Both worm wheels are engaged with the worm. Circular shafts are fixedly welded to the tops of both worm wheels. Sliding frames are movably sleeved on the outer sides of both circular shafts; In the existing technology, it is difficult to quickly and compatibly fix chips of different sizes. At the same time, it is impossible to quickly cool the entire chip and the welding points after chip welding. When processing chips, manual movement and placement are required, which greatly reduces the processing fluency and increases the processing time. Therefore, we propose a welding device for LED display chip production. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to overcome the existing defects and provide a welding device for LED display chip production, which can compatibly fix chips of various sizes, can quickly cool the whole and local parts of the welded chips through directional cooling and overall cooling, can quickly and automatically pick up chips, and quickly pick up the processed chips, thereby increasing the processing fluency and reducing the time required for chip replacement during processing, and can effectively solve the problems in the background art.

[0004] To achieve the above object, the present invention provides the following technical solution: A welding device for LED display chip production, comprising a bottom plate, a chip picking component, a cooling component, a chip positioning and fixing component, and a welding component; The bottom plate: The chip picking component, the cooling component, the chip positioning and fixing component, and the welding component are installed on the upper end; Chip positioning and fixing component: It includes a soldering table, an installation groove, an electromagnetic device, a hydraulic press I, a circular rubber sliding block, a chip positioning concave plate, and a magnet. The middle of the upper end of the bottom plate is fixedly connected with a soldering table. An installation groove is opened in the middle of the inner side of the soldering table. Four electromagnetic devices are inlaid on the four sides of the inner side of the installation groove. Magnets are inlaid on the four sides of the chip positioning concave plate. The outer side of the chip positioning concave plate is slidably connected with the inner side of the installation groove. The middle of the upper end of the bottom plate is fixedly connected with a hydraulic press I. The upper end of the hydraulic press I is fixedly connected with a circular rubber sliding block. The outer side of the circular rubber sliding block is slidably connected with the inner sides of the installation groove and the chip positioning concave plate.

[0005] The bottom plate serves as an installation platform to carry the chip pickup component, the cooling component, the chip positioning and fixing component, and the soldering component. Among them, the chip positioning and fixing component accommodates the chip positioning concave plate through the installation groove of the soldering table, uses the magnetic attraction between the electromagnetic device and the magnet to fix the position of the concave plate, replaces the chip positioning concave plate to adapt to different sizes of chips. The hydraulic press I drives the circular rubber sliding block to slide inside the installation groove and the chip positioning concave plate, realizes the lifting of the chip support, facilitates the removal of the processed chip, the electromagnetic adsorption ensures the stable fixation of the chip positioning concave plate, and the hydraulic lifting combined with the rubber sliding block provides buffer protection. The modular design simplifies the chip placement process.

[0006] Further, the chip positioning and fixing component further includes a gear ring, an arc groove, a sliding rod, a sliding connection block, a sliding positioning rubber plate, a motor II, and a gear. Four sliding connection blocks are slidably connected to the four sides of the soldering table. A sliding positioning rubber plate is fixedly connected to the inner side of the sliding connection block. A sliding rod is fixedly connected to the lower end of the outer side of the sliding connection block. The gear ring is rotatably connected to the middle of the upper end of the bottom plate. Four arc grooves are opened at the upper end of the gear ring. The sliding rod is slidably connected to the inner side of the arc groove. The motor II is fixedly connected to the upper end of the bottom plate. The output shaft of the motor II is fixedly connected with a gear. The gear is meshed with the gear ring.

[0007] The motor II drives the gear to drive the gear ring to rotate. The arc groove on the gear ring pushes the sliding rod to move horizontally, so that the sliding connection block slides along the four sides of the soldering table, and the sliding positioning rubber plate fixed to its inner side clamps or loosens the edge of the chip accordingly, realizing adaptive positioning. The linkage between the gear ring and the arc groove realizes four-way synchronous adjustment. The sliding positioning rubber plate avoids scratching the chip. The motor II has high control precision and is suitable for different sizes of chips.

[0008] Further, the cooling assembly includes an air inlet box, a solenoid valve, a connecting pipe, a vortex tube, a ball hinge type micro-spray head and a movable air jet pipe. The rear end of the upper right side of the bottom plate is fixedly connected with an air inlet box. The upper end of the air inlet box is communicated with one end of two connecting pipes. A solenoid valve is arranged inside each connecting pipe. The rear end of the inner side of the welding table is fixedly connected with a ball hinge type micro-spray head. A movable air jet pipe is arranged above the ball hinge type micro-spray head. The other end of one connecting pipe is fixedly connected with the air inlet of the vortex tube. The cold air outlet of the vortex tube passes through the welding table and is communicated with the air inlet of the ball hinge type micro-spray head.

[0009] The air flow of the air inlet box is controlled by the solenoid valve arranged inside the connecting pipe for on-off, and is input into the vortex tube. The separated cold air is transported to the ball hinge type micro-spray head through the cold air outlet, and the spraying angle is adjusted by the movable air jet pipe to directly cool the welding point. The vortex tube has high-efficiency refrigeration; the ball hinge type micro-spray head allows multi-angle and precise spraying; the solenoid valve realizes intelligent start and stop of the air flow.

[0010] Further, the cooling assembly further includes a cavity, a multi-way solenoid valve, an air jet pipe, a pressure detector and a pressure relief valve. A cavity is opened at the upper end of the welding table. Four multi-way solenoid valves are installed on the four sides of the inner upper end of the welding table. The air inlets of the multi-way solenoid valves are communicated with the cavity. A plurality of air jet pipes are installed at the air outlets of the multi-way solenoid valves. The air outlet directions of the air jet pipes all face the middle of the welding table.

[0011] The cavity at the upper end of the extended surrounding cooling system welding table distributes the air flow to the multi-way solenoid valves on the four sides, and it controls a plurality of air jet pipes to centrally supply air to the middle of the welding table; the pressure detector monitors the pressure in the cavity, and the pressure relief valve automatically exhausts gas when the pressure is too high. The multi-way solenoid valves independently control each air jet pipe, and the cooling is uniform; the pressure relief valve prevents the system from being damaged due to overpressure; the integrated design of the cavity saves space.

[0012] Further, the cooling assembly further includes a pressure detector and a pressure relief valve. A pressure detector and a pressure relief valve are fixedly connected to the upper end of the welding table. The lower end of the pressure relief valve is communicated with the cavity. The probe of the pressure detector is inside the cavity.

[0013] The probe of the pressure detector is placed inside the cavity to monitor the pressure in real time. The lower end of the pressure relief valve is communicated with the cavity and automatically opens to release gas when the pressure is too high. The pressure detector and the pressure relief valve cooperate to ensure the safety of the system; directly integrated on the upper end of the welding table, with a rapid response.

[0014] Further, the welding assembly includes a second hydraulic press, a second mounting block, a third self-locking electric telescopic rod, and a sliding frame. The middle part of the rear side of the upper end of the bottom plate is fixedly connected with a second hydraulic press. The upper end of the second hydraulic press is fixedly connected with a second mounting block. The front end of the second mounting block is fixedly connected with a third self-locking electric telescopic rod. The front end of the third self-locking electric telescopic rod is fixedly connected with a sliding frame.

[0015] Define the basic structure of the welding assembly. The second hydraulic press drives the second mounting block to lift vertically. The third self-locking electric telescopic rod pushes the sliding frame to move back and forth to adjust the welding position. The second hydraulic press provides strong thrust. The third self-locking electric telescopic rod ensures the displacement stability. The sliding frame provides a basis for precise positioning.

[0016] Further, the welding assembly further includes a second threaded rod, a second sliding mounting block, a third motor, and a welding device. The inner side of the sliding frame is rotatably connected with a second threaded rod. The right end of the sliding frame is fixedly connected with a third motor. The output shaft of the third motor is fixedly connected with one end of the second threaded rod. The inner side of the sliding frame is slidably connected with a second sliding mounting block. The second sliding mounting block is threadedly connected with the second threaded rod. The lower end of the second sliding mounting block is fixedly connected with a welding device.

[0017] The third motor drives the second threaded rod to rotate, causing the second sliding mounting block to slide horizontally along the sliding frame, driving the welding device at the lower end to accurately align with the welding point. The threaded transmission between the second threaded rod and the second sliding mounting block achieves high-precision displacement. The automatic control of the third motor improves the efficiency.

[0018] Further, the chip picking-up assembly includes a support frame, a sliding limiting rod, a first threaded rod, a first motor, and a first sliding mounting block. Two support frames are fixedly connected to the left and right corresponding positions on the front side of the upper end of the bottom plate. The upper ends of the two support frames are rotatably connected with a first threaded rod. A sliding limiting rod is fixedly connected between the two support frames. The right end of the right support frame is fixedly connected with a first motor. The output shaft of the first motor is fixedly connected with the first threaded rod. The first sliding mounting block is threadedly connected with the first threaded rod. The first sliding mounting block is slidably connected with the sliding limiting rod.

[0019] The first motor drives the first threaded rod to rotate, and the first sliding mounting block slides horizontally along the sliding limiting rod. The limiting rod is fixed between the two support frames to achieve the front-back positioning of the picking-up component. The transmission of the first threaded rod is precise. The sliding limiting rod prevents deviation. The double support frame structure is stable.

[0020] Further, the chip picking-up assembly further includes a first self-locking electric telescopic rod, a first mounting block, and a second self-locking electric telescopic rod. The inner side of the first sliding mounting block is fixedly connected with a first self-locking electric telescopic rod. The rear end of the first self-locking electric telescopic rod is fixedly connected with a first mounting block. The lower end of the first mounting block is fixedly connected with a second self-locking electric telescopic rod.

[0021] The self-locking electric telescopic rod 1 pushes the mounting block 1 to move back and forth, and the self-locking electric telescopic rod 2 at its lower end controls the vertical lifting, realizing the three-dimensional positioning of the pickup head. The double self-locking telescopic rods provide precise control of multiple degrees of freedom.

[0022] Furthermore, the chip pickup assembly further includes a chip placement board and anti-slip rubber strips. The middle part of the rear side of the lower end of the chip placement board is arched. The width of the arch of the chip placement board is the same as the diameter of the circular rubber sliding block. A plurality of anti-slip rubber strips are arranged on the upper end of the chip placement board.

[0023] The arched design at the lower end of the chip placement board matches the diameter of the circular rubber sliding block to ensure a stable handover; the anti-slip rubber strips at the upper end increase the friction force to prevent the chip from shifting. The arched structure improves the positioning accuracy; the anti-slip rubber strips prevent the chip from slipping; the rubber material protects the surface of the chip.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows: The welding device for LED display chip production of the present invention has the following advantages: 1. For the welding device for LED display chip production of the present invention, the chip positioning and fixing assembly adopts a replaceable chip positioning concave plate design. The position of the concave plate is quickly fixed through the magnetic attraction between the electromagnetic device and the magnet, easily adapting to chips of different sizes. The hydraulic press 1 drives the circular rubber sliding block to lift the chip smoothly, facilitating the removal after processing. At the same time, the motor 2 drives the arc groove through the gear and the gear ring, pushing the sliding positioning rubber plate to clamp the edge of the chip synchronously in four directions, realizing adaptive positioning. The rubber material buffers and protects the surface of the chip from being scratched. The modular design simplifies the operation process, greatly reducing the changeover time and reducing the risk of chip damage.

[0025] 2. For the welding device for LED display chip production of the present invention, the cooling assembly integrates the high-efficiency refrigeration technology of the vortex tube. After the air flow is intelligently controlled by the solenoid valve, the injection angle is adjusted by the ball hinge type micro-nozzle to directly and precisely cool the welding point. At the same time, the cavity distributes the air flow to multiple solenoid valves, driving multiple jet pipes to spray around, realizing uniform heat dissipation. The pressure detector monitors the pressure in the cavity in real time, and the pressure relief valve automatically exhausts gas when the pressure is exceeded, preventing the system from being damaged by overload. This cooling system takes into account both local directional refrigeration and global heat dissipation, effectively suppressing the heat affected zone of welding, improving the welding quality, and ensuring the stable operation of the equipment under long-term high load.

[0026] 3. The welding device for the production of LED display chips. The hydraulic press II and the self-locking electric telescopic rod III drive the vertical lifting and forward and backward movement of the welding device. The motor III precisely controls the lateral displacement through the threaded rod II to ensure the alignment accuracy of the welding points. The chip picking end uses the motor I to drive the threaded rod I to achieve front and rear positioning. The self-locking electric telescopic rod I and the self-locking electric telescopic rod II provide multi-degree-of-freedom adjustment. The chip placement plate is designed with an arched structure and anti-slip rubber strips to ensure smooth handover with the circular rubber sliding block and prevent chip slippage. The overall structure combines rigid transmission and flexible buffering to optimize the operation efficiency while improving the welding accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic structural diagram of the present invention; Figure 2 is a schematic right-side structural diagram of the present invention; Figure 3 is the present invention Figure 2 the enlarged schematic structural diagram of the internal structure at A in; Figure 4 is the enlarged upper-side schematic structural diagram of a part of the main body of the present invention; Figure 5 is the enlarged left-side schematic structural diagram of a part of the main body of the present invention; Figure 6 is the enlarged lower-side schematic structural diagram of a part of the main body of the present invention.

[0028] In the figure: 1 base plate, 3 chip picking assembly, 31 support frame, 32 sliding limit rod, 33 threaded rod I, 34 motor I, 35 sliding mounting block I, 36 self-locking electric telescopic rod I, 37 mounting block I, 38 self-locking electric telescopic rod II, 39 chip placement plate, 310 anti-slip rubber strip, 4 cooling assembly, 41 air inlet box, 42 solenoid valve, 43 connecting pipe, 44 vortex tube, 45 ball hinge type micro nozzle, 46 movable air injection pipe, 47 cavity, 48 multi-way solenoid valve, 49 air injection pipe, 410 pressure detector, 411 pressure relief valve, 5 chip positioning and fixing assembly, 51 welding table, 52 mounting groove, 53 electromagnetic device, 54 hydraulic press I, 55 circular rubber sliding block, 56 chip positioning concave plate, 57 magnet, 58 gear ring, 59 arc groove, 510 sliding rod, 511 sliding connection block, 512 sliding positioning rubber plate, 513 motor II, 514 gear, 6 welding assembly, 61 hydraulic press II, 62 mounting block II, 63 self-locking electric telescopic rod III, 64 sliding frame, 65 threaded rod II, 66 sliding mounting block II, 67 motor III, 68 welding device. DETAILED DESCRIPTION OF THE INVENTION

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0030] Please refer to Figures 1-6 , this embodiment provides a technical solution: a welding device for producing LED display chips, including a bottom plate 1, a chip picking component 3, a cooling component 4, a chip positioning and fixing component 5, and a welding component 6; Bottom plate 1: The chip picking component 3, the cooling component 4, the chip positioning and fixing component 5, and the welding component 6 are installed on the upper end; Chip positioning and fixing component 5: It includes a welding table 51, an installation groove 52, an electromagnetic device 53, a hydraulic press 54, a circular rubber sliding block 55, a chip positioning concave plate 56, and a magnet 57. The middle part of the upper end of the bottom plate 1 is fixedly connected with a welding table 51. The middle part of the inner side of the welding table 51 is provided with an installation groove 52. Four electromagnetic devices 53 are embedded on the four sides of the inner side of the installation groove 52. Magnets 57 are embedded on the four sides of the chip positioning concave plate 56. The outer side of the chip positioning concave plate 56 is slidably connected with the inner side of the installation groove 52. The middle part of the upper end of the bottom plate 1 is fixedly connected with a hydraulic press 54. The upper end of the hydraulic press 54 is fixedly connected with a circular rubber sliding block 55. The outer side of the circular rubber sliding block 55 is slidably connected with the inner sides of the installation groove 52 and the chip positioning concave plate 56.

[0031] The bottom plate 1 serves as an installation platform to carry the chip picking component 3, the cooling component 4, the chip positioning and fixing component 5, and the welding component 6; among them, the chip positioning and fixing component 5 accommodates the chip positioning concave plate 56 through the installation groove 52 of the welding table 51, and uses the magnetic attraction between the electromagnetic device 53 and the magnet 57 to fix the position of the concave plate. Replace the chip positioning concave plate 56 to adapt to chips of different sizes. The hydraulic press 54 drives the circular rubber sliding block 55 to slide inside the installation groove 52 and the chip positioning concave plate 56, realizing the lifting of the chip for support, facilitating the removal of the processed chip. The electromagnetic adsorption ensures the stable fixation of the chip positioning concave plate 56. The hydraulic lifting combined with the rubber sliding block 55 provides buffer protection; the modular design simplifies the chip placement process.

[0032] The chip positioning and fixing assembly 5 further includes a gear ring 58, an arc-shaped groove 59, a sliding rod 510, a sliding connection block 511, a sliding positioning rubber plate 512, a second motor 513 and a gear 514. Four sliding connection blocks 511 are slidably connected to the four sides of the welding table 51. The inner side of the sliding connection block 511 is fixedly connected with a sliding positioning rubber plate 512. The lower end of the outer side of the sliding connection block 511 is fixedly connected with a sliding rod 510. The middle part of the upper end of the bottom plate 1 is rotatably connected with a gear ring 58. Four arc-shaped grooves 59 are formed in the upper end of the gear ring 58. The sliding rod 510 is slidably connected to the inner side of the arc-shaped groove 59. The second motor 513 is fixedly connected to the upper end of the bottom plate 1. The output shaft of the second motor 513 is fixedly connected with a gear 514. The gear 514 meshes with the gear ring 58.

[0033] The second motor 513 drives the gear 514 to drive the gear ring 58 to rotate. The arc-shaped groove 59 on the gear ring 58 pushes the sliding rod 510 to move horizontally, so that the sliding connection block 511 slides along the four sides of the welding table 51. The sliding positioning rubber plate 512 fixed to its inner side clamps or loosens the edge of the chip accordingly, realizing adaptive positioning. The linkage between the gear ring 58 and the arc-shaped groove 59 realizes four-way synchronous adjustment; the sliding positioning rubber plate 512 prevents the chip from being scratched; the second motor 513 has high control precision and is suitable for chips of different sizes.

[0034] The cooling assembly 4 includes an air inlet box 41, a solenoid valve 42, a connecting pipe 43, a vortex tube 44, a ball hinge type micro-spray head 45 and a movable air spray pipe 46. The air inlet box 41 is fixedly connected to the rear end of the upper right side of the bottom plate 1. The upper end of the air inlet box 41 is communicated with one end of two connecting pipes 43. A solenoid valve 42 is arranged inside each connecting pipe 43. The ball hinge type micro-spray head 45 is fixedly connected to the rear end of the inner side of the welding table 51. The movable air spray pipe 46 is arranged at the upper end of the ball hinge type micro-spray head 45. The other end of one connecting pipe 43 is fixedly connected to the air inlet of the vortex tube 44. The cold air outlet of the vortex tube 44 passes through the welding table 51 and is communicated with the air inlet of the ball hinge type micro-spray head 45.

[0035] The air flow of the air inlet box 41 is controlled by the solenoid valve 42 arranged inside the connecting pipe 43 to control the on-off, and is input into the vortex tube 44. The separated cold air is transported to the ball hinge type micro-spray head 45 through the cold air outlet. The spraying angle is adjusted by the movable air spray pipe 46 to directly cool the welding point. The vortex tube 44 has high cooling efficiency; the ball hinge type micro-spray head 45 allows for multi-angle and precise spraying; the solenoid valve 42 realizes intelligent start and stop of the air flow.

[0036] The cooling assembly 4 further includes a cavity 47, a multi-way solenoid valve 48, a spray pipe 49, a pressure detector 410, and a pressure relief valve 411. A cavity 47 is formed at the upper end of the welding table 51. Four multi-way solenoid valves 48 are installed on the inner upper sides of the four sides of the welding table 51. The air inlet of the multi-way solenoid valve 48 communicates with the cavity 47. A plurality of spray pipes 49 are installed at the air outlet of the multi-way solenoid valve 48, and the air outlet directions of the spray pipes 49 all face the middle of the welding table 51.

[0037] The cavity 47 at the upper end of the welding table 51 of the extended circumferential cooling system distributes the air flow to the multi-way solenoid valves 48 on the four sides, which control a plurality of spray pipes 49 to concentrate the air supply towards the middle of the welding table; the pressure detector 410 monitors the pressure in the cavity 47, and the pressure relief valve 411 automatically exhausts the gas when the pressure is too high. The multi-way solenoid valves 48 independently control each spray pipe 49, and the cooling is uniform; the pressure relief valve 411 prevents the system from being damaged due to overpressure; the integrated design of the cavity 47 saves space.

[0038] The cooling assembly 4 further includes a pressure detector 410 and a pressure relief valve 411. A pressure detector 410 and a pressure relief valve 411 are fixedly connected to the upper end of the welding table 51. The lower end of the pressure relief valve 411 communicates with the cavity 47, and the probe of the pressure detector 410 is inside the cavity 47.

[0039] The probe of the pressure detector 410 is placed inside the cavity 47 to monitor the pressure in real time. The lower end of the pressure relief valve 411 communicates with the cavity 47 and automatically opens to release the gas when the pressure is too high. The pressure detector 410 and the pressure relief valve 411 cooperate to ensure the safety of the system; directly integrated on the upper end of the welding table 51, with a rapid response.

[0040] The welding assembly 6 includes a second hydraulic press 61, a second mounting block 62, a self-locking electric telescopic rod three 63, and a sliding frame 64. The second hydraulic press 61 is fixedly connected to the middle of the rear side of the upper end of the bottom plate 1. The second mounting block 62 is fixedly connected to the upper end of the second hydraulic press 61. The self-locking electric telescopic rod three 63 is fixedly connected to the front end of the second mounting block 62. The self-locking electric telescopic rod three 63 is fixedly connected to the front end of the sliding frame 64.

[0041] Define the basic structure of the welding assembly. The second hydraulic press 61 drives the second mounting block 62 to move vertically, and the self-locking electric telescopic rod three 63 pushes the sliding frame 64 to move back and forth to adjust the welding position. The second hydraulic press 61 provides a strong thrust; the self-locking electric telescopic rod three 63 ensures the displacement stability; the sliding frame 64 provides a basis for precise positioning.

[0042] The welding assembly 6 further includes a second threaded rod 65, a second sliding mounting block 66, a third motor 67, and a welding device 68. The second threaded rod 65 is rotatably connected to the inner side of the sliding frame 64. The right end of the sliding frame 64 is fixedly connected to the third motor 67. The output shaft of the third motor 67 is fixedly connected to one end of the second threaded rod 65. The second sliding mounting block 66 is slidably connected to the inner side of the sliding frame 64. The second sliding mounting block 66 is threadedly connected to the second threaded rod 65. The lower end of the second sliding mounting block 66 is fixedly connected to the welding device 68.

[0043] The third motor 67 drives the second threaded rod 65 to rotate, causing the second sliding mounting block 66 to slide horizontally along the sliding frame 64, driving the welding device 68 at the lower end to accurately align with the welding point. The threaded transmission between the second threaded rod 65 and the second sliding mounting block 66 achieves high-precision displacement; the automatic control of the third motor 67 improves efficiency.

[0044] The chip picking component 3 includes a support frame 31, a sliding limit rod 32, a first threaded rod 33, a first motor 34, and a first sliding mounting block 35. Two support frames 31 are fixedly connected to the front side of the upper end of the bottom plate 1 in a left-right corresponding manner. The first threaded rod 33 is rotatably connected to the upper ends of the two support frames 31. A sliding limit rod 32 is fixedly connected between the two support frames 31. The right end of the right support frame 31 is fixedly connected to the first motor 34. The output shaft of the first motor 34 is fixedly connected to the first threaded rod 33. The first sliding mounting block 35 is threadedly connected to the first threaded rod 33. The first sliding mounting block 35 is slidably connected to the sliding limit rod 32.

[0045] The first motor 34 drives the first threaded rod 33 to rotate, and the first sliding mounting block 35 slides horizontally along the sliding limit rod 32. The limit rod is fixed between the two support frames 31 to achieve the front-back positioning of the picking component. The transmission of the first threaded rod 33 is precise; the sliding limit rod 32 prevents deviation; the double support frame 31 structure is stable.

[0046] The chip picking component 3 further includes a self-locking electric telescopic rod 36, a first mounting block 37, and a self-locking electric telescopic rod 38. The self-locking electric telescopic rod 36 is fixedly connected to the inner side of the first sliding mounting block 35. The rear end of the self-locking electric telescopic rod 36 is fixedly connected to the first mounting block 37. The lower end of the first mounting block 37 is fixedly connected to the self-locking electric telescopic rod 38.

[0047] The self-locking electric telescopic rod 36 pushes the first mounting block 37 to move back and forth, and the self-locking electric telescopic rod 38 at its lower end controls the vertical lifting, realizing the three-dimensional positioning of the picking head. The double self-locking telescopic rods provide precise control with multiple degrees of freedom.

[0048] The chip picking component 3 further includes a chip placement plate 39 and anti-slip rubber strips 310. The middle part of the rear side of the lower end of the chip placement plate 39 is arched. The width of the arch of the chip placement plate 39 is the same as the diameter of the circular rubber sliding block 55. A plurality of anti-slip rubber strips 310 are arranged at the upper end of the chip placement plate 39.

[0049] The arched design at the lower end of the chip placement plate 39 matches the diameter of the circular rubber sliding block 55 to ensure a stable handover; the anti-slip rubber strips 310 at the upper end increase the friction force to prevent the chip from shifting. The arched structure improves the positioning accuracy; the anti-slip rubber strips 310 prevent the chip from slipping; the rubber material protects the surface of the chip.

[0050] The working principle of a welding device for LED display chips provided by the present invention is as follows: First, pick up the chip through the chip picking component 3: The motor 34 drives the threaded rod 33 to drive the sliding mounting block 35 to move horizontally. The self-locking electric telescopic rod 36 and the self-locking electric telescopic rod 38 cooperate to adjust the spatial position of the chip placement plate 39, and release it after transporting it above the chip positioning and fixing component 5; at this time, the hydraulic press 54 drives the circular rubber sliding block 55 to descend, and the chip falls into the chip positioning concave plate 56. The electromagnetic device 53 adsorbs and fixes the concave plate with the magnet 57; then the motor 513 drives the gear ring 58 to rotate through the gear 514, and the arc-shaped groove 59 pushes the sliding rod 510 to make the sliding positioning rubber plate 512 clamp the chip from all four sides. The welding component 6 starts to work: The hydraulic press 61 adjusts the height of the mounting block 62, the self-locking electric telescopic rod 63 pushes the sliding frame 64 to position front and back, and the motor 67 drives the threaded rod 65 to drive the welding device 68 to accurately align with the solder joint horizontally for welding. During the process, the cooling component 4 is started: The air flow in the air inlet box 41 is cooled by the vortex tube 44 and then is directionally sprayed with cold air to the welding position by the ball hinge type micro nozzle 45. At the same time, the cavity 47 distributes the air flow to the multi-way solenoid valve 48, and surrounds the welding table through the air spray pipe 49. The pressure detector 410 monitors the pressure in the cavity and automatically relieves the pressure by the pressure relief valve 411. After welding is completed, the electromagnetic device 53 is powered off to release the chip positioning concave plate 56, the hydraulic press 54 jacks up the circular rubber sliding block 55 to lift the chip, and the finished product is taken away by the picking component. The modular concave plate is replaced to adapt to different chip sizes. The electromagnetic fixation and hydraulic lifting cooperate to ensure the positioning stability, and the rubber parts prevent damage throughout the process. It should be noted that in the above embodiments, the input ends of the first motor 34, the first self-locking electric telescopic rod 36, the second self-locking electric telescopic rod 38, the air inlet box 41, the solenoid valve 42, the ball hinge type micro-sprinkler 45, the multi-way solenoid valve 48, the electromagnetic device 53, the first hydraulic press 54, the second motor 513, the second hydraulic press 61, the third self-locking electric telescopic rod 63 and the third motor 67 are electrically connected to the output end of an external power supply through an external PLC controller. The first motor 34, the second motor 513 and the third motor 67 all adopt servo motors. The external PLC controller controls the first motor 34, the first self-locking electric telescopic rod 36, the second self-locking electric telescopic rod 38, the air inlet box 41, the solenoid valve 42, the ball hinge type micro-sprinkler 45, the multi-way solenoid valve 48, the electromagnetic device 53, the first hydraulic press 54, the second motor 513, the second hydraulic press 61, the third self-locking electric telescopic rod 63 and the third motor 67 to work by using the commonly used methods in the prior art.

[0051] The above are only the embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. All equivalent structural or equivalent process transformations made by using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are equally included in the patent protection scope of the present invention.

Claims

1. A soldering device for the production of LED display chips, characterized in that: It includes a bottom plate (1), a chip picking component (3), a cooling component (4), a chip positioning and fixing component (5), and a welding component (6); Bottom plate (1): The chip picking component (3), the cooling component (4), the chip positioning and fixing component (5), and the welding component (6) are installed on the upper end; Chip positioning and fixing component (5): It includes a welding table (51), an installation groove (52), an electromagnetic device (53), a hydraulic press 1 (54), a circular rubber sliding block (55), a chip positioning concave plate (56), and a magnet (57). The middle part of the upper end of the bottom plate (1) is fixedly connected with a welding table (51). An installation groove (52) is opened in the middle of the inner side of the welding table (51). Four electromagnetic devices (53) are inlaid on the four sides of the inner side of the installation groove (52). Magnets (57) are inlaid on the four sides of the chip positioning concave plate (56). The outer side of the chip positioning concave plate (56) is slidably connected with the inner side of the installation groove (52). The middle part of the upper end of the bottom plate (1) is fixedly connected with a hydraulic press 1 (54). The upper end of the hydraulic press 1 (54) is fixedly connected with a circular rubber sliding block (55). The outer side of the circular rubber sliding block (55) is slidably connected with the inner sides of the installation groove (52) and the chip positioning concave plate (56).

2. The soldering device for producing LED display chips according to claim 1, characterized in that: The chip positioning and fixing component (5) further includes a gear ring (58), an arc groove (59), a sliding rod (510), a sliding connection block (511), a sliding positioning rubber plate (512), a motor 2 (513), and a gear (514). Four sliding connection blocks (511) are slidably connected to the four sides of the welding table (51). A sliding positioning rubber plate (512) is fixedly connected to the inner side of the sliding connection block (511). A sliding rod (510) is fixedly connected to the lower end of the outer side of the sliding connection block (511). A gear ring (58) is rotatably connected to the middle part of the upper end of the bottom plate (1). Four arc grooves (59) are opened on the upper end of the gear ring (58). The sliding rod (510) is slidably connected to the inner side of the arc groove (59). A motor 2 (513) is fixedly connected to the upper end of the bottom plate (1). A gear (514) is fixedly connected to the output shaft of the motor 2 (513). The gear (514) is meshed with the gear ring (58).

3. A soldering device for manufacturing an LED display chip according to claim 1, wherein: The cooling assembly (4) includes an air inlet box (41), a solenoid valve (42), a connecting pipe (43), a vortex tube (44), a ball hinge type micro-spray head (45), and a movable air injection pipe (46). The rear end of the upper right side of the bottom plate (1) is fixedly connected with an air inlet box (41). The upper end of the air inlet box (41) is communicated with one end of two connecting pipes (43). A solenoid valve (42) is arranged inside each connecting pipe (43). The ball hinge type micro-spray head (45) is fixedly connected to the rear right side of the inner side of the welding table (51). The movable air injection pipe (46) is arranged above the ball hinge type micro-spray head (45). The other end of one connecting pipe (43) is fixedly connected with the air inlet of the vortex tube (44). The cold air outlet of the vortex tube (44) passes through the welding table (51) and is communicated with the air inlet of the ball hinge type micro-spray head (45).

4. The soldering device for manufacturing an LED display chip according to claim 3, wherein: The cooling assembly (4) further includes a cavity (47), a multi-way solenoid valve (48), an air injection pipe (49), a pressure detector (410), and a pressure relief valve (411). A cavity (47) is opened at the upper end of the welding table (51). Four multi-way solenoid valves (48) are installed on the four sides of the upper inner side of the welding table (51). The air inlets of the multi-way solenoid valves (48) are communicated with the cavity (47). A plurality of air injection pipes (49) are installed at the air outlets of the multi-way solenoid valves (48). The air outlet directions of the air injection pipes (49) all face the middle of the welding table (51).

5. A soldering device for manufacturing an LED display chip according to claim 1, characterized in that: The cooling assembly (4) further includes a pressure detector (410) and a pressure relief valve (411). The pressure detector (410) and the pressure relief valve (411) are fixedly connected to the upper end of the welding table (51). The lower end of the pressure relief valve (411) is communicated with the cavity (47). The probe of the pressure detector (410) is inside the cavity (47).

6. The soldering device for producing LED display chips according to claim 5, wherein: The welding assembly (6) includes a second hydraulic press (61), a second mounting block (62), a self-locking electric telescopic rod three (63), and a sliding frame (64). The second hydraulic press (61) is fixedly connected to the middle of the upper rear side of the bottom plate (1). The second mounting block (62) is fixedly connected to the upper end of the second hydraulic press (61). The self-locking electric telescopic rod three (63) is fixedly connected to the front end of the second mounting block (62). The sliding frame (64) is fixedly connected to the front end of the self-locking electric telescopic rod three (63).

7. The soldering device for manufacturing LED display chips according to claim 6, characterized in that: The welding assembly (6) further includes a second threaded rod (65), a second sliding mounting block (66), a third motor (67), and a welding device (68). The second threaded rod (65) is rotatably connected to the inside of the sliding frame (64). The third motor (67) is fixedly connected to the right end of the sliding frame (64). The output shaft of the third motor (67) is fixedly connected to one end of the second threaded rod (65). The second sliding mounting block (66) is slidably connected to the inside of the sliding frame (64). The second sliding mounting block (66) is threadedly connected to the second threaded rod (65). The welding device (68) is fixedly connected to the lower end of the second sliding mounting block (66).

8. The soldering device for producing LED display chips according to claim 1, wherein: The chip picking component (3) includes a support frame (31), a sliding limit rod (32), a first threaded rod (33), a first motor (34), and a first sliding mounting block (35). On the front side of the upper end of the bottom plate (1), two support frames (31) are fixedly connected corresponding to the left and right. The upper ends of the two support frames (31) are rotatably connected to a first threaded rod (33). A sliding limit rod (32) is fixedly connected between the two support frames (31). The right end of the right support frame (31) is fixedly connected to a first motor (34). The output shaft of the first motor (34) is fixedly connected to the first threaded rod (33). The first sliding mounting block (35) is threadedly connected to the first threaded rod (33), and the first sliding mounting block (35) is slidably connected to the sliding limit rod (32).

9. The soldering device for producing LED display chips according to claim 8, characterized in that: The chip picking component (3) further includes a self-locking electric telescopic rod one (36), a first mounting block (37), and a self-locking electric telescopic rod two (38). The inner side of the first sliding mounting block (35) is fixedly connected to a self-locking electric telescopic rod one (36). The rear end of the self-locking electric telescopic rod one (36) is fixedly connected to a first mounting block (37). The lower end of the first mounting block (37) is fixedly connected to a self-locking electric telescopic rod two (38).

10. A soldering device for manufacturing an LED display chip according to claim 9, characterized in that: The chip picking component (3) further includes a chip placement plate (39) and an anti-slip rubber strip (310). The middle part of the rear side of the lower end of the chip placement plate (39) is arched. The arched width of the chip placement plate (39) is the same as the diameter of the circular rubber sliding block (55). A plurality of anti-slip rubber strips (310) are arranged on the upper end of the chip placement plate (39).

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