Processing method and processing device for chamfer of groove plate of quartz process groove

Abstract

The invention provides a quartz process groove plate chamfer machining method and device. The machining method comprises the steps that the groove bottom of an overflow groove needing to be machined in a quartz plate and the inclination angle formed by the groove bottom and the plate face of the quartz plate are obtained, and a leaning block and a pressing block are prepared according to the inclination angle; an included angle formed by the two side faces of an overflow groove needing to be machined in the quartz plate is obtained, and a tool is prepared according to the included angle; a plurality of quartz plates are obliquely stacked between the leaning block and the pressing block and are clamped through the leaning block and the pressing block, the tops of the quartz plates are aligned, and the quartz plates are mutually adhered and fixed; wherein the leaning block is provided with an inclined supporting surface, the pressing block is provided with an inclined abutting surface, and the quartz plate is located between the supporting surface and the abutting surface; and the cutter is fixed, the precision of the cutter is detected, and inclined overflow grooves are machined in the multiple quartz plates at the same time. The invention solves the problems of complicated processing steps, non-uniform inclined surface and low processing efficiency of manual grinding of the overflow groove of the quartz plate.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and more particularly, to a processing method and a processing device for chamfering a groove plate of a quartz process tank. Background Art

[0002] The quartz process tank is a key component in the cleaning process during the processing of semiconductor wafers. With the rapid development of domestic cleaning equipment, the demand for wet equipment components including quartz tanks has increased sharply. An overflow tank is usually provided on the groove plate of the quartz process tank to achieve the overflow effect of the cleaning liquid, thereby ensuring the cleanliness of the cleaning liquid and ultimately ensuring the cleaning quality of the wafers.

[0003] However, there are many problems with the current processing methods for overflow tanks. The traditional processing method usually consists of two steps: first, a V-shaped groove is machined by equipment, and then the inclined surface of the V-shaped groove is machined by manual grinding. This method has the following defects: the processing steps are complex, the processing time is long, and the efficiency is extremely low. Manual machining of the inclined surface results in uneven control of the inclined surface dimensions, affecting the overflow effect. The processing quality is unstable, which may affect the cleaning quality of the wafers. It is difficult to meet the requirements of mass production and cannot adapt to the rapidly developing market demand. The processing accuracy is limited by manual operation, making it difficult to ensure the consistency and reliability of the products. Contamination may be introduced during the manual grinding process, affecting the cleanliness of the final product. These problems seriously restrict the production efficiency and product quality of the quartz process tank and cannot meet the requirements of the semiconductor industry for high-precision and high-efficiency processing. Summary of the Invention

[0004] The problem solved by the present invention is that the processing steps of the overflow tank of the quartz plate by manual grinding are complex, the inclined surfaces are uneven, and the processing efficiency is low.

[0005] To solve the above problems, the present invention provides a processing method for chamfering a groove plate of a quartz process tank, the processing method comprising: obtaining the inclination angle formed between the bottom of the overflow tank to be processed on the quartz plate and the plate surface of the quartz plate, and preparing a support block and a pressing block according to the inclination angle; obtaining the included angle formed between the two side surfaces of the overflow tank to be processed on the quartz plate, and preparing a tool according to the included angle; stacking a plurality of the quartz plates obliquely between the support block and the pressing block, clamping them by the support block and the pressing block, aligning the tops of the quartz plates, and adhesively fixing the quartz plates to each other; wherein, the support block has an inclined support surface, the pressing block has an inclined abutting surface, and the quartz plate is located between the support surface and the abutting surface; fixing the tool, inspecting the accuracy of the tool, and simultaneously processing the inclined overflow tanks on the plurality of quartz plates.

[0006] Technical effects achieved after adopting this technical solution: By obtaining the inclination angle formed between the bottom and the plate surface of the overflow groove to be processed on the quartz plate and the included angle formed between the two side surfaces, corresponding supporting blocks, pressing blocks and cutting tools are prepared. The inclined surfaces of the supporting blocks and the pressing blocks can help the quartz plates to be stacked and fixed stably in an inclined manner, thus ensuring that the quartz plates will not move during processing. After the quartz plates are inclined, a V-shaped groove and the inclined surface of the V-shaped groove can be processed at one time, and through the stacking of the products to be processed, multiple products can be processed simultaneously, greatly improving the processing efficiency. Only by adjusting the structure of the forming cutting tool and the angle of the fixture can the processing of overflow grooves of various specifications be satisfied, and through one-time processing with the forming cutting tool, the overflow grooves on each quartz plate are uniform and consistent, with high dimensional accuracy, ensuring the overflow effect, and thus guaranteeing the cleaning quality of the silicon wafers.

[0007] Further, the quartz plates are adhesively fixed to each other, specifically including: wax is applied between adjacent quartz plates for fixation.

[0008] Technical effects achieved after adopting this technical solution: Wax fixation can ensure that the quartz plates remain stable during processing, avoid movement, thereby improving the processing accuracy and efficiency. When multiple quartz plates are fixed, the wax fixation method is simpler and more efficient, and can also cope with quartz plates of different shapes and sizes; moreover, compared with the method of fixing by a manipulator, wax fixation can avoid risks such as scratches and cracks caused by uneven pressure on the quartz plates themselves.

[0009] Further, the supporting block includes a supporting block body and a base connected integrally, and the pressing block and the supporting block body are located on opposite sides of the base; wherein, multiple quartz plates are stacked and inclined between the supporting block and the pressing block and clamped by the supporting block and the pressing block, specifically including: multiple quartz plates are stacked and inclined on the supporting block body, the pressing block is pressed on the side of the quartz plate away from the supporting block body, and the pressing block is connected to the base.

[0010] Technical effects achieved after adopting this technical solution: The pressing block and the supporting block can stably fix multiple quartz plates, making them maintain a consistent inclination angle during processing, thereby improving the processing efficiency and processing accuracy; the base supports multiple quartz plates, facilitating the top alignment of the quartz plates in the case of inclination; the base and the supporting block are integrated, reducing the installation steps, facilitating the installation of the pressing block, and facilitating the adjustment of the inclination of the abutting surface of the pressing block.

[0011] Further, wax is applied between the pressing block and the base for fixation.

[0012] Technical effects achieved after adopting this technical solution: Applying wax between the pressing block and the base can increase the adhesion between the two, thereby ensuring that the pressing block can be firmly fixed on the base during processing. Moreover, it also facilitates the adjustment of the pressing block to ensure the stability of the quartz plates and the processing accuracy.

[0013] Further, the inspection of the accuracy of the tool specifically includes: using a dial indicator to check whether the circular runout of the tool is below 0.03 mm; if so, the tool meets the requirements; if not, adjust the tool and reinspect.

[0014] The technical effects achieved by adopting this technical solution: Ensure the accuracy of the tool, thereby guaranteeing the accuracy and consistency of the machined overflow groove, avoiding the position deviation of the overflow groove or tilting along the axial direction of the tool, and thus improving the processing quality and efficiency of the overflow groove.

[0015] Further, the inspection of the accuracy of the tool specifically includes: using a dial indicator to check whether the perpendicularity deviation between the mating surface of the abutting block and the end face of the tool is below 0.1 mm; if so, the tool meets the requirements; if not, adjust the tool and reinspect.

[0016] The technical effects achieved by adopting this technical solution: By accurately measuring and adjusting the perpendicularity between the tool and the abutting block, errors caused by perpendicularity deviation during the machining process can be effectively avoided, ensuring that the tool can cut vertically downward, avoiding asymmetry of the two inclined surfaces of the overflow groove, and thus improving the machining accuracy and product quality of the overflow groove.

[0017] Further, the tool is a grinding wheel, and the edge of the grinding wheel is a V-shaped structure; wherein, preparing the tool according to the included angle specifically includes: selecting the grinding wheel with an angle matching the V-shaped structure according to the included angle.

[0018] The technical effects achieved by adopting this technical solution: The edge of the grinding wheel is a V-shaped structure, and this design can effectively machine a V-shaped overflow groove that meets the requirements. Selecting a V-shaped grinding wheel with an angle matching the included angle ensures that the machined overflow groove has accurate angles and dimensions.

[0019] Further, the tip of the V-shaped structure adopts a rounded corner, and the radius of the rounded corner is from 1 mm to 3 mm.

[0020] The technical effects achieved by adopting this technical solution: The tip of the V-shaped structure with a rounded corner design can reduce stress concentration and improve the overall strength and durability of the quartz plate; adopting the tip of the V-shaped structure with a rounded corner radius from 1 mm to 3 mm can effectively solve the problem of uneven control of the inclined surface size during the machining process of the quartz plate overflow groove, thereby ensuring uniform overflow effect and improving the cleaning quality of the silicon wafer.

[0021] The present invention also provides a processing device for chamfering the groove plate of a quartz process tank, which is used to implement the processing method provided in any of the above technical solutions. The processing device includes: the tool, the stop block, and the pressing block; the stop block has an inclined support surface, and the pressing block has an inclined abutting surface. Between the support surface and the abutting surface, a plurality of inclined quartz plates are pressed tightly, facilitating the tool to process the inclined overflow grooves.

[0022] The technical effects achieved after adopting this technical solution: The design between the support surface and the abutting surface enables a plurality of inclined quartz plates to be pressed tightly, so that the tool can conveniently process inclined overflow grooves on these quartz plates, simplifying the processing steps, significantly improving the processing efficiency, ensuring the processing accuracy and consistency, and thus guaranteeing the overflow effect and the cleaning quality of the silicon wafers.

[0023] Furthermore, the stop block and the pressing block are detachably connected.

[0024] The technical effects achieved after adopting this technical solution: The detachable connection design enables the stop block and the pressing block to be adjusted and replaced more flexibly during use, facilitating maintenance and adapting to different processing requirements of different specifications.

[0025] In summary, each of the above technical solutions of the present application may have one or more of the following advantages or beneficial effects: By obtaining the inclination angle formed between the bottom of the overflow groove to be processed on the quartz plate and the plate surface and the included angle formed between the two side surfaces, preparing the corresponding stop block, pressing block, and tool, stacking and fixing a plurality of quartz plates obliquely, and then using the tool to process the inclined overflow grooves of a plurality of quartz plates simultaneously, the problems of low efficiency and unstable accuracy in the traditional processing method are solved, and it has the advantages of improving the processing efficiency, ensuring the consistency of product quality, reducing manual operation errors, and meeting the requirements of mass production. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A flowchart of a processing method for chamfering the groove plate of a quartz process tank provided by the invention; Figure 2 A structural schematic diagram of a processing device for chamfering the groove plate of a quartz process tank provided by the invention; Figure 3 For Figure 2 A structural schematic diagram of another perspective of the processing device in ; Figure 4 For Figure 2 A structural schematic diagram of yet another perspective of the processing device in ; Figure 5 A structural schematic diagram of a quartz plate; Figure 6 A structural schematic diagram of an overflow groove.

[0027] Description of the reference numerals: 100 - Processing device; 110 - Cutting tool; 120 - Support block; 130 - Pressing block; 140 - Base; 200 - Quartz plate; 210 - Overflow groove. Detailed implementation manners

[0028] The purpose of the present invention is to provide a processing method and a processing device for chamfering the groove plate of a quartz process groove, so as to achieve the effects of high processing efficiency and high slope accuracy of the overflow groove of the quartz plate.

[0029] In order to make the above - mentioned objects, features and advantages of the present invention more obvious and understandable, the following detailed description will be made on the specific embodiments of the present invention with reference to the accompanying drawings.

[0030] See Figures 1 - 6 , the present invention provides a processing method for chamfering the groove plate of a quartz process groove, and the processing method includes: Obtain the inclination angle formed between the bottom of the overflow groove 210 to be processed on the quartz plate 200 and the plate surface of the quartz plate 200, and prepare the support block 120 and the pressing block 130 according to the inclination angle; Obtain the included angle formed between the two side surfaces of the overflow groove 210 to be processed on the quartz plate 200, and prepare the cutting tool 110 according to the included angle; Stack multiple quartz plates 200 obliquely between the support block 120 and the pressing block 130, and clamp them through the support block 120 and the pressing block 130. The tops of the quartz plates 200 are aligned, and the quartz plates 200 are adhesively fixed to each other; wherein, the support block 120 has an inclined support surface, the pressing block 130 has an inclined abutting surface, and the quartz plate 200 is located between the support surface and the abutting surface; Fix the cutting tool 110, check the accuracy of the cutting tool 110, and simultaneously process the inclined overflow groove 210 on multiple quartz plates 200.

[0031] In this embodiment, the technical solution obtains the inclination angle formed between the bottom of the overflow groove 210 to be processed on the quartz plate 200 and the plate surface, as well as the included angle formed between the two side surfaces, and prepares the corresponding support block 120, pressing block 130 and cutting tool 110. The inclined surfaces of the support block 120 and the pressing block 130 can help the quartz plates 200 to be stacked and fixed stably in an inclined manner, so as to ensure that the quartz plates 200 do not move during processing. After the quartz plates 200 are inclined, the V - shaped groove and the inclined surface of the V - shaped groove can be processed at one time, and through the stacking of the products to be processed, multiple products can be processed simultaneously, greatly improving the processing efficiency. Only by adjusting the structure of the forming cutting tool 110 and the angle of the fixture, the processing of overflow grooves 210 of various specifications can be satisfied, and through the one - time processing of the forming cutting tool 110, the overflow grooves 210 on each quartz plate 200 are uniform and consistent, with high dimensional accuracy, ensuring the overflow effect, and thus guaranteeing the cleaning quality of the silicon wafers.

[0032] In a specific embodiment, the quartz plates 200 are adhesively fixed to each other, specifically including: waxing is applied to fix between adjacent quartz plates 200.

[0033] It should be noted that waxing can ensure the stability of the quartz plates 200 during the processing, avoid movement, and thus improve the processing accuracy and efficiency. When fixing multiple quartz plates 200, the waxing method is simpler and more efficient, and can also cope with quartz plates 200 of different shapes and sizes; moreover, compared with the method of fixing by a manipulator, waxing can avoid risks such as scratches and cracks caused by uneven pressure on the quartz plates 200 themselves.

[0034] For example, after the contact surfaces of adjacent quartz plates 200 are cleaned to ensure no dust and impurities, wax is evenly coated on the contact surfaces, and the adjacent quartz plates 200 are tilted at the target angle and then bonded. Of course, waxing can also be applied to the sides of adjacent quartz plates 200, which is not limited here.

[0035] In a specific embodiment, the abutting block 120 includes an abutting block body and a base 140 connected integrally, and the pressing block 130 and the abutting block body are located on opposite sides of the base 140; wherein, multiple quartz plates 200 are stacked obliquely between the abutting block 120 and the pressing block 130 and clamped by the abutting block 120 and the pressing block 130, specifically including: multiple quartz plates 200 are stacked obliquely on the abutting block body, the pressing block 130 is pressed against the side of the quartz plates 200 away from the abutting block body, and the pressing block 130 is connected to the base 140.

[0036] It should be noted that the pressing block 130 and the abutting block 120 can stably fix multiple quartz plates 200 to keep them at a consistent tilt angle during the processing, thereby improving the processing efficiency and accuracy; the base 140 supports multiple quartz plates 200, facilitating the top alignment of the quartz plates 200 in the case of tilting; the base 140 and the abutting block 120 are integrated, reducing the installation steps, facilitating the installation of the pressing block 130, and facilitating the adjustment of the tilt of the abutting surface of the pressing block 130.

[0037] For example, after waxing between multiple quartz plates 200, before the wax solidifies, multiple quartz plates 200 are placed obliquely on the base 140, the height of the quartz plates 200 is corrected to make the tops and bottoms of all quartz plates 200 aligned and keep them tilted. Then the pressing block 130 is installed to press the quartz plates 200 to make the wax between the quartz plates 200 solidify stably.

[0038] In a specific embodiment, waxing is applied to fix between the pressing block 130 and the base 140.

[0039] It should be noted that waxing between the briquette 130 and the base 140 can increase the adhesion between the two, thereby ensuring that the briquette 130 can be firmly fixed on the base 140 during the processing. Moreover, it is also convenient for the adjustment of the briquette 130 to ensure the stability and processing accuracy of the quartz plate 200.

[0040] In a specific embodiment, inspecting the accuracy of the cutting tool 110 specifically includes: using a dial indicator to check whether the circular runout of the cutting tool 110 is below 0.03 mm; if so, the cutting tool 110 meets the requirements; if not, adjust the cutting tool 110 and reinspect.

[0041] It should be noted that ensuring the accuracy of the cutting tool 110 can guarantee the accuracy and consistency of the processed overflow groove 210, avoiding the position deviation of the overflow groove 210 or tilting along the axis of the cutting tool 110, thereby improving the processing quality and efficiency of the overflow groove 210.

[0042] Preferably, the cutting tool 110 is fixed to the spindle. If the circular runout of the cutting tool 110 does not meet the requirements, re-clamp the cutting tool 110 and re-measure the circular runout.

[0043] In a specific embodiment, inspecting the accuracy of the cutting tool 110 specifically includes: using a dial indicator to check whether the perpendicularity deviation between the mating surface of the abutting block 120 and the end face of the cutting tool 110 is below 0.1 mm; if so, the cutting tool 110 meets the requirements; if not, adjust the cutting tool 110 and reinspect.

[0044] It should be noted that by accurately measuring and adjusting the perpendicularity between the cutting tool 110 and the abutting block 120, errors caused by perpendicularity deviation during the processing can be effectively avoided, ensuring that the cutting tool 110 can cut vertically downward, avoiding asymmetry of the two inclined surfaces of the overflow groove 210, thereby improving the processing accuracy and product quality of the overflow groove 210.

[0045] In a specific embodiment, the cutting tool 110 is a grinding wheel, and the edge of the grinding wheel is a V-shaped structure; wherein, preparing the cutting tool 110 according to the angle specifically includes: selecting a grinding wheel with an angle-matched V-shaped structure according to the angle.

[0046] It should be noted that the edge of the grinding wheel is a V-shaped structure. This design can effectively process a V-shaped overflow groove 210 that meets the requirements. Selecting a V-shaped grinding wheel with a matching angle according to the angle ensures that the processed overflow groove 210 has accurate angles and dimensions.

[0047] Preferably, the central material of the cutting tool 110 is high-quality alloy steel, and the material of the V-shaped structure part is electroplated diamond abrasive.

[0048] In a specific embodiment, the tip of the V-shaped structure adopts a rounded corner, and the radius of the rounded corner is from 1 mm to 3 mm.

[0049] It should be noted that the tip of the V-shaped structure with a rounded corner design can reduce stress concentration and improve the overall strength and durability of the quartz plate 200; the tip of the V-shaped structure with a rounded corner radius of 1 mm to 3 mm can effectively solve the problem of uneven control of the inclined plane size during the processing of the overflow groove 210 of the quartz plate 200, thereby ensuring uniform overflow effect and improving the cleaning quality of the silicon wafer.

[0050] In a specific embodiment, the processing method further includes: after the current overflow groove 210 is processed, the tool 110 moves upward to retract the tool, the tool 110 feeds forward by a target distance, and then descends The present invention also provides a processing device 100 for chamfering the groove plate of a quartz process tank, which is used to implement the processing method provided by any of the above technical solutions. The processing device 100 includes: a tool 110, a support block 120, and a pressing block 130; the support block 120 has an inclined support surface, and the pressing block 130 has an inclined abutting surface. Between the support surface and the abutting surface, a plurality of inclined quartz plates 200 are pressed tightly to facilitate the tool 110 to process the inclined overflow groove 210.

[0051] It should be noted that the design between the support surface and the abutting surface enables a plurality of inclined quartz plates 200 to be pressed tightly, so that the tool 110 can conveniently process the inclined overflow groove 210 on these quartz plates 200, simplifies the processing steps, significantly improves the processing efficiency, ensures the processing accuracy and consistency, and thus guarantees the overflow effect and the cleaning quality of the silicon wafer.

[0052] In a specific embodiment, the support block 120 and the pressing block 130 are detachably connected.

[0053] It should be noted that the design of the detachable connection enables the support block 120 and the pressing block 130 to be adjusted and replaced more flexibly during use, which is convenient for maintenance and adaptation to different processing requirements of different specifications.

[0054] Preferably, the support block 120 includes a support block body and a base 140, and the base 140 and the pressing block 130 are connected by wax coating. Of course, the base 140 and the pressing block 130 can also be connected by bolts, buckles, magnetic connections, etc., to facilitate disassembly and adjustment, which is not limited here.

[0055] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be subject to the scope defined by the claims.

Claims

1. A processing method for chamfering the groove plate of a quartz process tank, characterized in that, The processing method includes: Obtaining the inclination angle formed by the bottom of the overflow groove to be processed on the quartz plate and the plate surface of the quartz plate, and preparing a supporting block and a pressing block according to the inclination angle; Obtaining the included angle formed by the two side surfaces of the overflow groove to be processed on the quartz plate, and preparing a cutting tool according to the included angle; Stacking a plurality of the quartz plates obliquely between the supporting block and the pressing block, clamping them through the supporting block and the pressing block, aligning the tops of the quartz plates, and adhesively fixing the quartz plates to each other; wherein, the supporting block has an inclined supporting surface, the pressing block has an inclined abutting surface, and the quartz plate is located between the supporting surface and the abutting surface; Fixing the cutting tool, inspecting the accuracy of the cutting tool, and simultaneously processing the inclined overflow grooves on a plurality of the quartz plates.

2. The processing method according to claim 1, characterized in that, The mutual adhesive fixation of the quartz plates specifically includes: Fixing with wax between adjacent quartz plates.

3. The processing method according to claim 1, wherein The supporting block includes a supporting block body and a base connected integrally, and the pressing block and the supporting block body are located on opposite sides of the base; Among them, stacking a plurality of the quartz plates obliquely between the supporting block and the pressing block and clamping them through the supporting block and the pressing block specifically includes: Stacking a plurality of the quartz plates obliquely on the supporting block body, pressing the pressing block on the side of the quartz plate away from the supporting block body, and connecting the pressing block to the base.

4. The processing method according to claim 3, characterized in that, Fixing with wax between the pressing block and the base.

5. The processing method according to claim 1, characterized in that, The inspection of the accuracy of the cutting tool specifically includes: Using a dial indicator to inspect whether the circular runout of the cutting tool is below 0.03 mm; If so, the cutting tool meets the requirements; If not, adjust the cutting tool and reinspect.

6. The processing method according to claim 1, wherein The inspection of the accuracy of the cutting tool specifically includes: Using a dial indicator to inspect whether the perpendicularity deviation between the fitting surface of the supporting block and the end face of the cutting tool is below 0.1 mm; If so, the cutting tool meets the requirements; If not, adjust the cutting tool and reinspect.

7. The processing method according to claim 1, characterized in that, The cutting tool is a grinding wheel, and the edge of the grinding wheel is a V-shaped structure; Among them, preparing the cutting tool according to the included angle specifically includes: selecting the grinding wheel with an angle matching the V-shaped structure according to the included angle.

8. The processing method according to claim 7, wherein The tip of the V-shaped structure adopts a fillet, and the fillet radius is 1 mm to 3 mm.

9. A processing device for chamfering the groove plate of a quartz process tank, which is used to implement the processing method described in any one of claims 1-8, is characterized in that, The processing device includes: the cutting tool, the supporting block and the pressing block; the supporting block has an inclined supporting surface, the pressing block has an inclined abutting surface, and between the supporting surface and the abutting surface is used to clamp a plurality of inclined quartz plates, facilitating the cutting tool to process the inclined overflow grooves.

10. The processing device according to claim 9, characterized in that, The supporting block and the pressing block are detachably connected.

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