Automatic resistor disc matching and feeding device and feeding method thereof

Abstract

The invention relates to the technical field of resistor disc processing, and particularly discloses an automatic resistor disc matching and feeding device and a feeding method thereof. Comprising a concave sleeve plate, the bottom of the concave sleeve plate is fixedly connected with a bottom connecting square plate, one side of the bottom connecting square plate is fixedly connected with an arc-shaped scraping piece, the outer side of the arc-shaped scraping piece is fixedly connected with an arc-shaped brush, the top of the bottom connecting square plate is fixedly connected with a frame-shaped wave plate, and the outer side of the frame-shaped wave plate is sleeved with and fixedly connected with a frame-shaped sponge. According to the automatic matching and feeding device for the resistor discs and the feeding method of the automatic matching and feeding device, friction sweeping is conducted on the bottom face of a moving code reader through an arc-shaped brush, and the situation that after the code reader is used for a long time, the bottom face is covered by dust and impurities, and the code reading effect of the code reader on the resistor discs on the positioning plate is affected is prevented; and when the code reader continues to move, the arc-shaped scraper performs scraping type cleaning on the cleaned bottom surface of the code reader, so that the condition that a part of dust impurities which are left on the bottom surface of the code reader and are cleaned by the arc-shaped brush are still attached to the bottom surface of the code reader to influence the code reading effect is prevented.

Description

Technical Field

[0001] The present invention relates to the technical field of resistor chip processing, and in particular to an automatic matching and feeding device for resistor chips and a feeding method thereof. Background Art

[0002] The matching of resistor chips is an important link in the manufacturing enterprises of lightning arresters. The matching process of lightning arresters usually first tests the resistor chips to measure the performance parameters of each resistor chip. The corresponding performance parameter information is sprayed on the surface of the resistor chips by a coding machine. Workers classify and sort the resistor chips according to the performance parameters on the surface of the resistor chips. According to the matching parameters of the lightning arresters to be assembled, workers find the resistor chips with corresponding parameters among many resistor chips and perform the matching manually. In the manufacturing process of lightning arresters, the original matching of resistor chips is realized by manually stacking the resistor chips together and then testing the parameters; during the stacking process of the resistor chips, workers need to wear cotton gloves and handle the resistor chips gently. At the same time, due to the different reference voltages, leakage currents, and residual voltages of single resistor chips, workers need to continuously adjust the resistor chips to assemble a core group that meets the requirements of lightning arrester products. The parameters of the resistor chips are recognized by a code reader and transmitted to a computer to complete the recognition and matching of the resistor chips. The degree of automation is high, and the matching efficiency is improved. However, after the code reader is used for a long time, the bottom surface is easily covered with dust and impurities, resulting in poor scanning effect of the code reader. Therefore, we propose an automatic matching and feeding device for resistor chips and a feeding method thereof. Summary of the Invention

[0003] To solve the above technical problems, the present invention provides an automatic matching and feeding device for resistor chips and a feeding method thereof, including a vertical slide rail. The top of the vertical slide rail is fixedly connected with a linear slide rail. A code reader is sleeved and slidably connected to the outside of the linear slide rail. A cleaning mechanism is sleeved and fixedly connected to the outside of the linear slide rail. A positioning lifting cylinder is slidably connected to one side of the vertical slide rail. The top of the positioning lifting cylinder is fixedly connected with an electric slide rail. A positioning plate is slidably connected to one side of the electric slide rail. A discharging mechanism is slidably connected to one side of the positioning lifting cylinder. The cleaning mechanism includes a concave sleeve plate. The bottom of the concave sleeve plate is fixedly connected with a bottom connecting square plate. An arc-shaped scraping blade is fixedly connected to one side of the bottom connecting square plate. When the code reader continues to move, the arc-shaped scraping blade performs scraping cleaning on the bottom surface of the code reader that has been cleaned, preventing a part of the dust and impurities swept away by the arc-shaped brush from remaining on the bottom surface of the code reader and still adhering to the bottom surface of the code reader, which affects the reading effect. An arc-shaped brush is fixedly connected to the outside of the arc-shaped scraping blade. The arc-shaped brush performs friction cleaning on the bottom surface of the moving code reader, preventing the bottom surface of the code reader from being covered by dust and impurities after long-term use, which affects the reading effect of the code reader on the resistor chips on the positioning plate. The concave-shaped sleeve plate is sleeved on the linear slide rail and fixedly connected to the linear slide rail. A plurality of arc-shaped brushes are provided, and the plurality of arc-shaped brushes are distributed outside the arc-shaped scraping piece; A frame-shaped wave plate is fixedly connected to the top of the bottom connecting square plate. By arranging the frame-shaped wave plate at the bottom of the code reader, the bottom surface of the code reader is surrounded and covered for protection, preventing dust particles and impurities from gradually accumulating on the bottom surface of the code reader under the influence of the working environment when the code reader stays in the working area for a long time, which affects the code reading effect of the code reader. A frame-shaped sponge is sleeved and fixedly connected to the outside of the frame-shaped wave plate. By sleeving the frame-shaped sponge on the outside of the frame-shaped wave plate, the elastic shape of the frame-shaped wave plate is stabilized and restored, preventing the frame-shaped wave plate from being bent and deformed after being repeatedly pushed and squeezed by the code reader and being unable to surround and cover the bottom surface of the code reader again. The bottom of the frame-shaped sponge is fixedly connected to the top of the bottom connecting square plate.

[0004] Further, the unloading mechanism includes a bottom-mounted long plate. A hydraulic push rod is fixedly connected to the bottom of the bottom-mounted long plate. A discharging die shell is fixedly connected to the top of the bottom-mounted long plate. The discharging die shell is driven by the hydraulic push rod to move upward continuously to perform a top-punching type unloading of the resistor chips on the positioning plate, preventing the need for workers to remove each resistor chip from the positioning plate in turn during unloading, which affects the working efficiency of resistor chip matching. A material suction component is fixedly connected to the inner wall of the discharging die shell. An external brush is fixedly connected to the outside of the discharging die shell. When the external brush moves with the discharging die shell, it cleans the inner wall of the die holes on the positioning plate, preventing excessive dust and impurities from gradually adhering to the inner wall of the die holes on the positioning plate after long-term use, resulting in the subsequent resistor chips being unable to be properly placed on the positioning plate. A corrugated sleeve plate is sleeved and fixedly connected to the outside of the discharging die shell. By arranging the corrugated sleeve plate at a position above the external brush on the outside of the discharging die shell, the area around the external brush is wrapped and covered, preventing dust and impurities from splashing to various parts of the top surface of the positioning plate and accumulating during the cleaning of the die holes on the positioning plate by the external brush moving with the discharging die shell, which is difficult to handle. When the corrugated sleeve plate in contact with the top surface of the positioning plate moves downward with the discharging die shell, it takes away the dust and impurities near the die holes on the top surface of the positioning plate, preventing the dust and impurities cleaned by the external brush from still accumulating at the position near the die holes on the top surface of the positioning plate and affecting the placement of the resistor chips. One side of the bottom-mounted long plate is fixedly connected to one side of the positioning lifting cylinder. A plurality of discharging die shells are provided, and the plurality of discharging die shells are distributed on the top of the bottom-mounted long plate. Two hydraulic push rods are provided, and the two hydraulic push rods are distributed at the bottom of the bottom-mounted long plate. A plurality of external brushes are provided, and the plurality of external brushes are distributed on the outside of the discharging die shell.

[0005] Furthermore, the material suction component includes a fixed collar. Inside the fixed collar, a small air pump is fixedly connected. The top of the small air pump communicates with a circular ventilation shell. The small air pump sucks air into the circular ventilation shell to fixedly adsorb the resistor chip on the top of the circular ventilation shell, preventing the resistor chip being unloaded from tilting and slipping around when moving upward with the circular ventilation shell under the influence of the top impact force, which is difficult to handle. The top of the fixed collar is fixedly connected with an annular electric slide rail. An inner rotating ring plate is rotatably connected inside the annular electric slide rail. By arranging the inner rotating ring plate inside the annular electric slide rail, the area inside the annular electric slide rail is completely filled and covered, preventing dust and impurities cleaned by the built-in brush from falling into the annular chute inside the annular electric slide rail and affecting the annular driving effect of the annular electric slide rail. The top of the inner rotating ring plate is fixedly connected with an electric push rod. The electric push rod drives the top ring plate and the built-in brush inside the top ring plate to move downward together to the height of the bottom of the circular ventilation shell, preventing dust and impurities from being mixed in when the circular ventilation shell adsorbs the resistor chip, which may affect the adsorption effect and cause the resistor chip to still slip. The top of the electric push rod is fixedly connected with a top ring plate. The inside of the top ring plate is fixedly connected with a built-in brush. The built-in brush rotating with the top ring plate frictionally sweeps the top surface of the circular ventilation shell, preventing dust and impurities from accumulating on the top surface of the circular ventilation shell after long-term use and blocking the circular ventilation shell, which affects the adsorption effect on the resistor chip. One side of the fixed collar is fixedly connected with the inner wall of the unloading die shell. The outside of the annular electric slide rail is fixedly connected with the inner wall of the unloading die shell. The circular ventilation shell is a connected shell with an air inlet opened at the top and a circular cavity inside. There are multiple built-in brushes, and the multiple built-in brushes are distributed inside the top ring plate.

[0006] An automatic matching and feeding method for resistor chips includes the following steps: S1: Resistor chip feeding. Place the resistor chip on the positioning plate, lift it by the positioning lifting cylinder, and let the electric slide rail drive the positioning plate to move forward to directly below the code reader. S2: Resistor chip code reading. Drive the code reader to move linearly through the linear slide rail to scan and collect the performance parameter information sprayed on the resistor chip. S3: Resistor chip matching. After code reading, find the resistor chips with corresponding parameters among many resistor chips for matching. S4: Code reader cleaning. After the code reader finishes code reading, drive it to move into the cleaning mechanism through the linear slide rail and clean and protect the bottom surface of the code reader. S5: Resistor chip unloading. After the resistor chips are matched, the resistor chips on the positioning plate are unloaded by upward adsorption through the unloading mechanism.

[0007] The present invention provides an automatic matching and feeding device for resistor chips and its feeding method. It has the following beneficial effects: 1. The automatic grouping and feeding device for resistor chips and its feeding method. The bottom surface of the moving code reader is frictionally cleaned by an arc-shaped brush to prevent the bottom surface of the code reader from being covered by dust and impurities after long-term use, which affects the code reading effect of the resistor chips on the positioning plate by the code reader. The hydraulic push rod drives the discharge die shell to continue moving upward to perform a punching discharge on the resistor chips on the positioning plate, preventing the need for workers to remove each resistor chip from the positioning plate in sequence during discharging, which affects the working efficiency of resistor chip grouping. The small air pump sucks air into the circular ventilation shell to adsorb and fix the resistor chips on the top of the circular ventilation shell, preventing the discharged resistor chips from tilting and sliding around under the influence of the punching force when moving upward with the circular ventilation shell, making it difficult to handle.

[0008] 2. The automatic grouping and feeding device for resistor chips and its feeding method are provided with a cleaning mechanism. The bottom surface of the moving code reader is frictionally cleaned by an arc-shaped brush to prevent the bottom surface of the code reader from being covered by dust and impurities after long-term use, which affects the code reading effect of the resistor chips on the positioning plate by the code reader. When the code reader continues to move, the arc-shaped scraper performs a scraping cleaning on the cleaned bottom surface of the code reader to prevent a part of the dust and impurities swept away by the arc-shaped brush from remaining on the bottom surface of the code reader and still affecting the code reading effect. By setting a frame-shaped wave plate at the bottom of the code reader to perform an encircling coverage protection on the bottom surface of the code reader, preventing the bottom surface of the code reader from gradually accumulating dust particles and impurities under the influence of the working environment when staying in the working area for a long time, which affects the code reading effect of the code reader. By sleeving a frame-shaped sponge outside the frame-shaped wave plate to stabilize and restore the elastic shape of the frame-shaped wave plate, preventing the frame-shaped wave plate from being bent and deformed after being repeatedly pushed and squeezed by the code reader and being unable to perform an encircling coverage protection on the bottom surface of the code reader again.

[0009] 3. The automatic grouping and feeding device for resistor chips and its feeding method are provided with a discharging mechanism. The hydraulic push rod drives the discharge die shell to continue moving upward to perform a punching discharge on the resistor chips on the positioning plate, preventing the need for workers to remove each resistor chip from the positioning plate in sequence during discharging, which affects the working efficiency of resistor chip grouping. The external brush cleans the inner wall of the die holes on the positioning plate when moving with the discharge die shell, preventing excessive dust and impurities from gradually adhering to the inner wall of the die holes on the positioning plate after long-term use, resulting in the subsequent resistor chips being unable to be properly placed on the positioning plate. By setting a corrugated sleeve outside the discharge die shell above the external brush to wrap and cover the area around the external brush, preventing dust and impurities from splashing to various parts of the top of the positioning plate and accumulating during the cleaning of the die holes on the positioning plate by the external brush moving with the discharge die shell, which is difficult to handle. The corrugated sleeve in extrusion contact with the top surface of the positioning plate takes away the dust and impurities near the die holes on the top of the positioning plate when the discharge die shell moves downward, preventing the dust and impurities cleaned by the external brush from still accumulating at the position near the die holes on the top surface of the positioning plate and affecting the placement of the resistor chips.

[0010] 4. The automatic matching and feeding device for resistor chips and its feeding method are provided with a material suction component. The small air pump sucks air into the circular ventilation shell to adsorb and fix the resistor chips on the top of the circular ventilation shell, preventing the resistor chips to be unloaded from tilting and slipping around when moving up with the circular ventilation shell under the influence of the top impact force, which is difficult to handle. The built-in brush that rotates with the top ring plate frictionally cleans the top surface of the circular ventilation shell, preventing dust and impurities from accumulating on the top surface of the circular ventilation shell after long-term use and blocking the circular ventilation shell, which affects the adsorption effect on the resistor chips. By setting an inner rotating ring plate inside the annular electric slide rail to completely fill and cover the inner area of the annular electric slide rail, it prevents the dust and impurities cleaned by the built-in brush from falling into the annular chute inside the annular electric slide rail and affecting the annular driving effect of the annular electric slide rail. The electric push rod drives the top ring plate and the built-in brush inside the top ring plate to move down together to the height of the bottom of the circular ventilation shell, preventing the built-in brush from being mixed in the middle when the circular ventilation shell adsorbs the resistor chips, which affects the adsorption effect and may still cause the resistor chips to slip. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 Schematic structural diagram of the automatic matching and feeding device for resistor chips of the present invention; Figure 2 Schematic side view structural diagram of the automatic matching and feeding device for resistor chips of the present invention; Figure 3 Schematic bottom view structural diagram of the cleaning mechanism of the present invention; Figure 4 Schematic structural diagram of the cleaning mechanism of the present invention; Figure 5 Schematic structural diagram of the unloading mechanism of the present invention; Figure 6 Schematic bottom view structural diagram of the unloading mechanism of the present invention; Figure 7 Schematic structural diagram of the material suction component of the present invention; Figure 8 Schematic bottom view structural diagram of the material suction component of the present invention; Figure 9 Schematic diagram of the automatic matching and feeding method for resistor chips of the present invention.

[0012] In the figure: 1. Vertical slide rail; 2. Linear slide rail; 3. Code reader; 4. Cleaning mechanism; 5. Positioning lifting cylinder; 6. Electric slide rail; 7. Positioning plate; 8. Unloading mechanism; 401. Concave sleeve plate; 402. Bottom connecting square plate; 403. Arc-shaped scraping blade; 404. Arc-shaped brush; 405. Frame-shaped wave plate; 406. Frame-shaped sponge; 801. Bottom long plate; 802. Hydraulic push rod; 803. Unloading die shell; 804. Material suction assembly; 805. External brush; 806. Wave-shaped sleeve plate; 8041. Fixed collar; 8042. Small air pump; 8043. Circular ventilation shell; 8044. Ring-shaped electric slide rail; 8045. Inner rotating ring plate; 8046. Electric push rod; 8047. Top ring plate; 8048. Inner brush. Detailed implementation manner

[0013] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0014] Please refer to Figures 1 - 4 , the present invention provides an automatic resistor sheet grouping and feeding device and its feeding method, including a vertical slide rail 1. The top of the vertical slide rail 1 is fixedly connected with a linear slide rail 2. The outside of the linear slide rail 2 is sleeved and slidably connected with a code reader 3. The outside of the linear slide rail 2 is sleeved and fixedly connected with a cleaning mechanism 4. One side of the vertical slide rail 1 is slidably connected with a positioning lifting cylinder 5. The top of the positioning lifting cylinder 5 is fixedly connected with an electric slide rail 6. One side of the electric slide rail 6 is slidably connected with a positioning plate 7. One side of the positioning lifting cylinder 5 is slidably connected with an unloading mechanism 8; The cleaning mechanism 4 includes a concave sleeve plate 401. The bottom of the concave sleeve plate 401 is fixedly connected with a bottom connecting square plate 402. One side of the bottom connecting square plate 402 is fixedly connected with an arc-shaped scraping blade 403. The outside of the arc-shaped scraping blade 403 is fixedly connected with an arc-shaped brush 404; The concave sleeve plate 401 is sleeved on the linear slide rail 2 and fixedly connected with the linear slide rail 2. There are multiple arc-shaped brushes 404, and the multiple arc-shaped brushes 404 are distributed outside the arc-shaped scraping blade 403; A frame-shaped wave plate 405 is fixedly connected to the top of the bottom-connected square plate 402. A frame-shaped sponge 406 is sleeved and fixedly connected to the outside of the frame-shaped wave plate 405. The bottom of the frame-shaped sponge 406 is fixedly connected to the top of the bottom-connected square plate 402. During use, the resistance chip is placed on the positioning plate 7, lifted by the positioning lifting cylinder 5, and the electric slide rail 6 drives the positioning plate 7 to move forward to directly below the code reader 3. Then, the code reader 3 is driven by the linear slide rail 2 to perform a linear motion to scan and collect the performance parameter information sprayed on the resistance chip. After the code reading is completed, the resistance chip with the corresponding parameters is found among the numerous resistance chips for grouping. At the same time, after the code reader 3 finishes reading the code, it can be driven by the linear slide rail 2 to move into the cleaning mechanism 4 to clean and protect the bottom surface of the code reader 3. After the resistance chips are grouped, the unloading mechanism 8 performs upward suction unloading on the resistance chips on the positioning plate 7. When the linear slide rail 2 drives the code reader 3 to move back, it gradually approaches the concave sleeve rod. When the code reader 3 moves towards the concave sleeve rod, it first contacts the arc-shaped brush 404 and the arc-shaped scraper 403 and pushes the arc-shaped scraper 403 to bend, and then slides in contact with the arc-shaped scraper 403. The arc-shaped brush 404 frictionally sweeps the bottom surface of the moving code reader 3. When the code reader 3 continues to move, the arc-shaped scraper 403 performs scraping cleaning on the bottom surface of the code reader 3 that has been swept. The code reader 3 passing through the arc-shaped scraper 403 contacts the frame-shaped sponge 406 and pushes the frame-shaped sponge 406 to undergo a slight bending deformation until the code reader 3 moves to a position where the bottom surface is surrounded by the frame-shaped wave plate 405 inside the frame-shaped sponge 406 and then stops. By arranging the frame-shaped wave plate 405 at the bottom of the code reader 3, the bottom surface of the code reader 3 is surrounded and covered for protection. By sleeving the frame-shaped sponge 406 outside the frame-shaped wave plate 405, the elastic shape of the frame-shaped wave plate 405 is stabilized and restored.

[0015] Please refer to Figures 1 - 9 As shown in the figure, the present invention provides an automatic grouping and feeding device for resistance chips and its feeding method: The unloading mechanism 8 includes a bottom-mounted long plate 801. A hydraulic push rod 802 is fixedly connected to the bottom of the bottom-mounted long plate 801. A discharge die shell 803 is fixedly connected to the top of the bottom-mounted long plate 801. A material suction component 804 is fixedly connected to the inner wall of the discharge die shell 803. An external brush 805 is fixedly connected to the outside of the discharge die shell 803. A waveform sleeve piece 806 is sleeved and fixedly connected to the outside of the discharge die shell 803. One side of the bottom-mounted long plate 801 is fixedly connected to one side of the positioning lifting cylinder 5. There are multiple discharge die shells 803, and the multiple discharge die shells 803 are distributed on the top of the bottom-mounted long plate 801. There are two hydraulic push rods 802, and the two hydraulic push rods 802 are distributed at the bottom of the bottom-mounted long plate 801. There are multiple external brushes 805, and the multiple external brushes 805 are distributed on the outside of the discharge die shell 803; The material suction component 804 includes a fixed collar 8041. A small air pump 8042 is fixedly connected to the inner side of the fixed collar 8041. The top of the small air pump 8042 communicates with a circular ventilation shell 8043. A circular electric slide rail 8044 is fixedly connected to the top of the fixed collar 8041. An inner rotating ring plate 8045 is rotatably connected to the inner side of the circular electric slide rail 8044. An electric push rod 8046 is fixedly connected to the top of the inner rotating ring plate 8045. A top ring plate 8047 is fixedly connected to the top of the electric push rod 8046. An internal brush 8048 is fixedly connected to the inner side of the top ring plate 8047. One side of the fixed collar 8041 is fixedly connected to the inner wall of the discharge die shell 803. The outer side of the circular electric slide rail 8044 is fixedly connected to the inner wall of the discharge die shell 803. The circular ventilation shell 8043 is a communicating shell with an air inlet opened at the top and a circular cavity inside. There are multiple internal brushes 8048, and the multiple internal brushes 8048 are distributed on the inner side of the top ring plate 8047. During use, after the resistor chip grouping is completed, the hydraulic push rod 802 is used to push the bottom long plate 801 upward. When the bottom long plate 801 moves upward, it drives the discharge die shell 803 at the top to move. When the discharge die shell 803 moves upward, it drives the material suction component 804 on the inner wall and the external brush 805 and the corrugated sleeve 806 on the outer side to move upward together. When the discharge die shell 803 moves upward to contact the bottom of the resistor chip at the top, the resistor chip is adsorbed and fixed by the material suction component 804. The discharge die shell 803 is driven by the hydraulic push rod 802 to continue moving upward to perform a top punching discharge on the resistor chip on the positioning plate 7. When the discharge die shell 803 continues to move upward, it drives the corrugated sleeve 806 and the external brush 805 on the outer side to move upward until they pass through the positioning plate 7 and stop at the top of the positioning plate 7. At this time, the hydraulic push rod 802 is used to drive the bottom long plate 801 to drive the discharge die shell 803 to move downward. When the discharge die shell 803 moves downward, it drives the external brush 805 and the corrugated sleeve 806 on the outer side to move downward together. When the external brush 805 moves with the discharge die shell 803, it cleans the inner wall of the die hole on the positioning plate 7. By arranging the corrugated sleeve 806 at a position above the external brush 805 on the outer side of the discharge die shell 803, the surrounding area of the external brush 805 is wrapped and covered. When the corrugated sleeve 806 located at the top of the positioning plate 7 moves downward to contact the top surface of the positioning plate 7 along with the discharge die shell 803, it is deformed by extrusion and gradually passes through the die hole of the positioning plate 7 as the discharge die shell 803 moves downward. The corrugated sleeve 806 in extrusion contact with the top surface of the positioning plate 7 takes away the dust and impurities near the die hole around the top of the positioning plate 7 as the discharge die shell 803 moves downward. When the discharge die shell 803 moves upward to drive the entire material suction component 804 upward until the top of the circular ventilation shell 8043 contacts the bottom of the resistor chip, the small air pump 8042 sucks air into the circular ventilation shell 8043 to adsorb and fix the resistor chip on the top of the circular ventilation shell 8043. When the resistor chip on the top of the circular ventilation shell 8043 is removed,The top-mounted ring plate 8047 is pushed by the electric push rod 8046 to drive the built-in brush 8048 inside to move upward to a position in contact with the top surface of the circular ventilation shell 8043. At this time, the inner rotating ring plate 8045 is driven to rotate by the annular electric slide rail 8044, so that the electric push rod 8046, the top-mounted ring plate 8047 and the built-in brush 8048 at the top rotate together. As the built-in brush 8048 rotating with the top-mounted ring plate 8047 rubs and cleans the top surface of the circular ventilation shell 8043. By arranging the inner rotating ring plate 8045 inside the annular electric slide rail 8044, the inner area of the annular electric slide rail 8044 is completely filled and covered. When it is necessary to adsorb and fix the resistance chip, the electric push rod 8046 drives the top-mounted ring plate 8047 and the built-in brush 8048 inside the top-mounted ring plate 8047 to move downward together to the height of the bottom of the circular ventilation shell 8043.

[0016] An automatic matching and feeding method for resistance chips includes the following steps: S1: Resistance chip feeding. The resistance chip is placed on the positioning plate 7 and lifted by the positioning lifting cylinder 5, and the electric slide rail 6 drives the positioning plate 7 to move forward to directly below the code reader 3. S2: Resistance chip code reading. The code reader 3 is driven by the linear slide rail 2 to perform a linear motion to scan and collect the performance parameter information sprayed on the resistance chip. S3: Resistance chip matching. After the code reading is completed, the resistance chips with corresponding parameters are found among many resistance chips for matching. S4: Code reader 3 cleaning. After the code reader 3 finishes code reading, it is driven by the linear slide rail 2 to move into the cleaning mechanism 4 and the bottom surface of the code reader 3 is cleaned and protected. S5: Resistance chip unloading. After the resistance chips are matched, the unloading mechanism 8 performs upward adsorption unloading on the resistance chips on the positioning plate 7.

[0017] When the present invention is in operation, the resistance chip is placed on the positioning plate 7 and lifted by the positioning lifting cylinder 5, and the electric slide rail 6 drives the positioning plate 7 to move forward to directly below the code reader 3. Then, the code reader 3 is driven by the linear slide rail 2 to perform a linear motion to scan and collect the performance parameter information sprayed on the resistance chip. After the code reading is completed, the resistance chip with the corresponding parameters is found from among the numerous resistance chips for grouping. At the same time, after the code reader 3 finishes reading the code, it can be driven by the linear slide rail 2 to move into the cleaning mechanism 4 to clean and protect the bottom surface of the code reader 3. After the resistance chips are grouped, the resistance chips on the positioning plate 7 are unloaded by upward suction by the unloading mechanism 8. When the linear slide rail 2 drives the code reader 3 to move back, it gradually approaches the concave sleeve rod. When the code reader 3 moves towards the concave sleeve rod, it first contacts the arc-shaped brush 404 and the arc-shaped scraper 403 and pushes the arc-shaped scraper 403 to bend, and then slides in contact with the arc-shaped scraper 403. The arc-shaped brush 404 frictionally sweeps the bottom surface of the moving code reader 3. When the code reader 3 continues to move, the arc-shaped scraper 403 performs a scraping cleaning on the bottom surface of the code reader 3 that has been swept. The code reader 3 passing through the arc-shaped scraper 403 contacts the frame-shaped sponge 406 and pushes the frame-shaped sponge 406 to undergo a slight bending deformation until the code reader 3 moves to a position where the bottom surface is surrounded by the frame-shaped wave plate 405 inside the frame-shaped sponge 406 and stops. The bottom surface of the code reader 3 is surrounded and covered for protection by arranging the frame-shaped wave plate 405 at the bottom of the code reader 3. The frame-shaped sponge 406 is sleeved outside the frame-shaped wave plate 405 to stabilize and restore the elastic shape of the frame-shaped wave plate 405. After the resistance chips are grouped, the hydraulic push rod 802 is used to push the bottom-mounted long plate 801 upward. When the bottom-mounted long plate 801 moves upward, it drives the top unloading die shell 803 to move. When the unloading die shell 803 moves upward, it drives the inner wall suction component 804 and the outer side external brush 805 and the waveform sleeve piece 806 to move upward together. When the unloading die shell 803 moves upward to the top and contacts the bottom of the resistance chip, the resistance chip is fixedly adsorbed by the suction component 804. The hydraulic push rod 802 is used to drive the unloading die shell 803 to continue moving upward to perform a top punching unloading on the resistance chips on the positioning plate 7. When the unloading die shell 803 continues to move upward, it drives the outer side waveform sleeve piece 806 and the external brush 805 to move upward until they pass through the positioning plate 7 and stop at the top of the positioning plate 7. At this time, the hydraulic push rod 802 is used to drive the bottom-mounted long plate 801 to drive the unloading die shell 803 to move downward. When the unloading die shell 803 moves downward, it drives the outer side external brush 805 and the waveform sleeve piece 806 to move downward together. When the external brush 805 moves with the unloading die shell 803, it cleans the inner wall of the die hole on the positioning plate 7. The waveform sleeve piece 806 is arranged at a position above the external brush 805 on the outer side of the unloading die shell 803 to wrap and cover the area around the external brush 805. When the waveform sleeve piece 806 located at the top of the positioning plate 7 moves downward to contact the top surface of the positioning plate 7 as the unloading die shell 803 moves downward, it is deformed by extrusion and gradually passes through the die hole of the positioning plate 7 as the unloading die shell 803 moves downward.When the corrugated sleeve piece 806 in extrusion contact with the top surface of the positioning plate 7 moves downward with the unloading die shell 803, it takes away the dust and impurities around the die hole at the top of the positioning plate 7. When the unloading die shell 803 moves upward and drives the whole suction component 804 to move upward until the top of the circular ventilation shell 8043 contacts the bottom of the resistance piece, the circular ventilation shell 8043 is sucked by the small air pump 8042 to adsorb and fix the resistance piece at the top of the circular ventilation shell 8043. When the resistance piece at the top of the circular ventilation shell 8043 is removed, the electric push rod 8046 pushes the top-mounted ring plate 8047 to drive the built-in brush 8048 inside to move upward to a position in contact with the top surface of the circular ventilation shell 8043. At this time, the inner rotating ring plate 8045 is driven to rotate by the annular electric slide rail 8044 so that the electric push rod 8046, the top-mounted ring plate 8047 and the built-in brush 8048 at the top rotate together. The built-in brush 8048 rotating with the top-mounted ring plate 8047 frictionally sweeps the top surface of the circular ventilation shell 8043. By arranging the inner rotating ring plate 8045 inside the annular electric slide rail 8044, the inner area of the annular electric slide rail 8044 is completely filled and covered. When it is necessary to adsorb and fix the resistance piece, the electric push rod 8046 drives the top-mounted ring plate 8047 and the built-in brush 8048 inside the top-mounted ring plate 8047 to move downward together to the height of the bottom of the circular ventilation shell 8043.,

[0018] Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art and related fields without creative efforts shall fall within the protection scope of the present invention. The structures, devices and operation methods not specifically described and explained in the present invention, unless otherwise specified and limited, are implemented according to the conventional means in the art.

Claims

1. An automatic resistor sheet grouping and feeding device, comprising a vertical slide rail (1), characterized in that: The top of the vertical slide rail (1) is fixedly connected to a linear slide rail (2). A code reader (3) is sleeved and slidably connected to the outside of the linear slide rail (2). A cleaning mechanism (4) is sleeved and fixedly connected to the outside of the linear slide rail (2). A positioning lifting cylinder (5) is slidably connected to one side of the vertical slide rail (1). The top of the positioning lifting cylinder (5) is fixedly connected to an electric slide rail (6). A positioning plate (7) is slidably connected to one side of the electric slide rail (6). A discharging mechanism (8) is slidably connected to one side of the positioning lifting cylinder (5); The cleaning mechanism (4) includes a concave sleeve plate (401). The bottom of the concave sleeve plate (401) is fixedly connected to a bottom connecting square plate (402). An arc-shaped scraping blade (403) is fixedly connected to one side of the bottom connecting square plate (402). An arc-shaped brush (404) is fixedly connected to the outside of the arc-shaped scraping blade (403); The top of the bottom connecting square plate (402) is fixedly connected to a frame-shaped wave plate (405). A frame-shaped sponge (406) is sleeved and fixedly connected to the outside of the frame-shaped wave plate (405). The bottom of the frame-shaped sponge (406) is fixedly connected to the top of the bottom connecting square plate (402); The discharging mechanism (8) includes a bottom long plate (801). A hydraulic push rod (802) is fixedly connected to the bottom of the bottom long plate (801). A discharging die shell (803) is fixedly connected to the top of the bottom long plate (801). A material suction component (804) is fixedly connected to the inner wall of the discharging die shell (803). An external brush (805) is fixedly connected to the outside of the discharging die shell (803). A waveform sleeve plate (806) is sleeved and fixedly connected to the outside of the discharging die shell (803); The material suction component (804) includes a fixed sleeve ring (8041). A small air pump (8042) is fixedly connected to the inside of the fixed sleeve ring (8041). A circular ventilation shell (8043) is communicated with the top of the small air pump (8042). A circular electric slide rail (8044) is fixedly connected to the top of the fixed sleeve ring (8041). An inner rotating ring plate (8045) is rotatably connected to the inside of the circular electric slide rail (8044). An electric push rod (8046) is fixedly connected to the top of the inner rotating ring plate (8045). A top ring plate (8047) is fixedly connected to the top of the electric push rod (8046). An internal brush (8048) is fixedly connected to the inside of the top ring plate (8047).

2. The automatic grouping and feeding device for resistor chips according to claim 1, wherein: The concave sleeve plate (401) is sleeved on the linear slide rail (2) and fixedly connected to the linear slide rail (2). There are multiple arc-shaped brushes (404), and the multiple arc-shaped brushes (404) are distributed on the outside of the arc-shaped scraping blade (403).

3. An automatic grouping and feeding device for resistor chips according to claim 1, characterized in that: One side of the bottom long plate (801) is fixedly connected to one side of the positioning lifting cylinder (5). There are multiple discharging die shells (803), and the multiple discharging die shells (803) are distributed on the top of the bottom long plate (801).

4. The automatic matching and feeding device for resistor chips according to claim 1, wherein: There are two hydraulic push rods (802), and the two hydraulic push rods (802) are distributed at the bottom of the bottom long plate (801). There are multiple external brushes (805), and the multiple external brushes (805) are distributed on the outer side of the discharge die shell (803).

5. An automatic resistor sheet grouping and feeding device according to claim 1, characterized in that: One side of the fixed collar (8041) is fixedly connected to the inner wall of the discharge die shell (803), and the outer side of the annular electric slide rail (8044) is fixedly connected to the inner wall of the discharge die shell (803).

6. The automatic matching and feeding device for resistor chips according to claim 1, characterized in that: The circular ventilation shell (8043) is a connected shell with an air inlet opened at the top and a circular cavity inside. There are multiple internal brushes (8048), and the multiple internal brushes (8048) are distributed inside the top ring plate (8047).

7. An automatic matching and feeding method for resistor chips, characterized in that, It includes the following steps: S1: Resistance chip feeding. Place the resistance chip on the positioning plate (7), lift it by the positioning lifting cylinder (5), and let the electric slide rail (6) drive the positioning plate (7) to move forward to directly below the code reader (3). S2: Resistance chip code reading. Drive the code reader (3) to move linearly through the linear slide rail (2) to scan and collect the performance parameter information sprayed on the resistance chip. S3: Resistance chip grouping. After the code reading is completed, find the resistance chips with corresponding parameters among many resistance chips for grouping. S4: Code reader (3) cleaning. After the code reader (3) finishes code reading, drive it to move into the cleaning mechanism (4) through the linear slide rail (2) and clean and protect the bottom surface of the code reader (3). S5: Resistance chip discharging. After the resistance chip grouping is completed, the resistance chips on the positioning plate (7) are discharged by upward adsorption through the discharging mechanism (8).

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