Electronic paper packaging assembly, manufacturing method and electronic paper

Abstract

The invention belongs to the technical field of display equipment, and discloses an electronic paper packaging assembly, a manufacturing method and electronic paper. The plurality of micro-cup units are connected to one surface of the first base material layer along the first direction, accommodating holes are formed in the micro-cup units, the accommodating holes penetrate through the micro-cup units along the first direction, and electronic ink is arranged in the accommodating holes; the containing hole comprises a containing cavity and a feeding hole, the feeding hole is formed in the side, away from the first base material layer, of the containing cavity in the first direction, and the hole diameter of the feeding hole is smaller than that of the containing cavity; and the packaging layer is connected to the surfaces, far away from the first substrate layer in the first direction, of the plurality of microcup units, and the packaging layer covers the feeding hole. According to the electronic paper packaging assembly, the manufacturing method and the electronic paper provided by the invention, the technical problem of abnormal packaging of the electronic paper can be solved.

Description

Technical Field

[0001] This application belongs to the technical field of display devices, and particularly relates to an electronic paper encapsulation component, a manufacturing method thereof, and an electronic paper. Background Art

[0002] During the encapsulation process of electronic paper, it is necessary to first add electronic ink into the microcup structure, and then coat an encapsulation layer on the microcup structure to seal the inlet of the microcup structure. The encapsulation layer is prone to deformation before curing. Due to the relatively large weight of the encapsulation layer above the inlet of the microcup structure, the encapsulation layer is likely to fall into the electronic ink under the action of gravity, and even the film breaks, resulting in abnormal encapsulation problems. Summary of the Invention

[0003] The purpose of the embodiments of this application is to provide an electronic paper encapsulation component, a manufacturing method thereof, and an electronic paper to solve the problem of abnormal encapsulation of electronic paper existing in the prior art.

[0004] To achieve the above purpose, an embodiment of the first aspect of this application provides an electronic paper encapsulation component, including: a first substrate layer; a plurality of microcup units connected to one side of the first substrate layer along a first direction, with accommodation holes provided in the microcup units, the accommodation holes penetrating the microcup units along the first direction, and electronic ink provided in the accommodation holes; the accommodation holes include an accommodation cavity and a feed hole, the feed hole is provided on the side of the accommodation cavity away from the first substrate layer along the first direction, and the aperture of the feed hole is smaller than the aperture of the accommodation cavity; an encapsulation layer connected to the side of the plurality of microcup units away from the first substrate layer along the first direction, and the encapsulation layer covers the feed hole.

[0005] In some embodiments, the surface of the microcup unit close to the encapsulation layer along the first direction is inclined from the edge of the microcup unit to the direction close to the first substrate layer of the feed hole to guide the electronic ink into the feed hole.

[0006] In some embodiments, the inclination slope of the surface of the microcup unit close to the encapsulation layer is 5%-30%.

[0007] In some embodiments, the aperture of the same accommodation cavity is the same at different positions in the first direction; and / or, the aperture of the same feed hole is the same at different positions in the first direction.

[0008] In some embodiments, the aperture of the accommodation cavity is 50um-300um, and the ratio of the aperture of the feed hole to the aperture of the accommodation cavity is 1 / 10-1 / 2.

[0009] An embodiment of the second aspect of the present application further provides an electronic paper, which includes a second substrate layer and the electronic paper encapsulation component of any one of the embodiments of the first aspect. A first electrode layer is provided on the first substrate layer, the second substrate layer is disposed on a side of the encapsulation layer away from the first substrate layer along a first direction, a second electrode layer is provided on the second substrate layer, and the first electrode layer and the second electrode layer are used to drive the electronic ink to act.

[0010] An embodiment of the third aspect of the present application further provides a method for manufacturing an electronic paper encapsulation component, including: providing a first substrate layer, and disposing a plurality of cushioning units at intervals on a side of the first substrate layer along the first direction; providing a microcup layer on the first substrate layer, and the microcup layer covers the plurality of cushioning units; opening a feed hole at a position corresponding to the cushioning unit on the microcup layer to expose the cushioning unit, and in a projection plane perpendicular to the first direction, a positive projection area of the feed hole is smaller than a positive projection area of the cushioning unit; removing the cushioning unit so that a receiving cavity communicating with the feed hole is formed in the microcup layer; adding electronic ink into the receiving cavity from the feed hole; and providing an encapsulation layer on a side of the microcup layer away from the first substrate layer.

[0011] In some embodiments, a surface of the cushioning unit away from the first substrate layer is inclined from an edge of the cushioning unit to the middle toward a direction close to the first substrate layer; when providing the microcup layer on the first substrate layer, the microcup layer is coated on the first substrate layer and the cushioning unit, wherein the microcup layer coated on a surface of the cushioning unit away from the first substrate layer is inclined to guide the electronic ink into the feed hole.

[0012] In some embodiments, the cushioning unit includes a first photoresist, and removing the cushioning unit includes: adding a first developer into the feed hole and removing the cushioning unit by using the first developer.

[0013] In some embodiments, the first photoresist is a positive photoresist, the microcup layer includes a second photoresist, after providing the cushioning unit on the first substrate layer, the cushioning unit is exposed, and when opening the feed hole, the second photoresist at the feed hole is removed by exposure and development.

[0014] The beneficial effects of the electronic paper encapsulation component, electronic paper, and method for manufacturing an electronic paper encapsulation component provided in this application are as follows: The first substrate layer and the encapsulation layer are provided to seal both ends of the accommodation holes in the microcup unit, preventing the electronic ink from flowing out of the accommodation holes. The aperture of the feed hole is smaller than that of the accommodation cavity, which can reduce the weight of the encapsulation layer not supported by the microcup unit directly above the feed hole. The encapsulation layer directly above the feed hole is more likely to remain stable under the frictional force of the surrounding encapsulation layer; when the encapsulation layer comes into contact with the electronic ink in the feed hole, the pressure of the encapsulation layer directly above the feed hole on the liquid surface of the electronic ink is smaller, and the liquid surface of the electronic ink can support the encapsulation layer under the action of surface tension, preventing the encapsulation layer from falling into the electronic ink and keeping the uncured encapsulation layer intact. Encapsulating the relatively small feed hole with the encapsulation layer can improve the sealing effect and prevent the leakage of electronic ink. This application can solve the technical problem of abnormal encapsulation of electronic paper. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0016] Figure 1 Schematic structural diagram of an electronic paper encapsulation component provided by some embodiments of this application;

[0017] Figure 2 Schematic structural diagram of the connection between a microcup unit and a first substrate layer provided by some embodiments of this application;

[0018] Figure 3 For Figure 2 Top view of the microcup unit in

[0019] Figure 4 Schematic structural diagram of an electronic paper provided by some embodiments of this application;

[0020] Figure 5 Flowchart of a method for manufacturing an electronic paper encapsulation component provided by some embodiments of this application;

[0021] Figure 6 Schematic structural diagram of the connection between a cushion unit and a first substrate layer provided by some embodiments of this application;

[0022] Figure 7 For Figure 6 Top view of the cushion unit in

[0023] Figure 8 Schematic structural diagram of a microcup layer covering a cushion unit provided by some embodiments of this application;

[0024] Figure 9 is Figure 8 The top view of the micro-cup layer and the cushion unit;

[0025] Figure 10 is the schematic structural view of opening a feed hole on the micro-cup layer provided by some embodiments of the present application;

[0026] Figure 11 is Figure 10 The top view of the micro-cup layer and the cushion unit;

[0027] Figure 12 is the schematic structural view of adding electronic ink into the accommodating cavity provided by some embodiments of the present application;

[0028] Figure 13 is Figure 12 The top view of the micro-cup unit and the electronic ink;

[0029] Figure 14 is the schematic structural view of encapsulating the micro-cup unit with the encapsulation layer provided by some embodiments of the present application;

[0030] Figure 15 is Figure 14 The top view of the encapsulation layer and the micro-cup unit.

[0031] Among them, each reference numeral in the figure:

[0032] 1000, electronic paper;

[0033] 100, electronic paper encapsulation component;

[0034] 10, the first substrate layer;

[0035] 20, micro-cup unit; 21, accommodating hole; 211, accommodating cavity; 212, feed hole; 22, cover plate part; 221, first surface; 23, side wall part;

[0036] 30, encapsulation layer;

[0037] 40, electronic ink;

[0038] 200, the second substrate layer;

[0039] 2000, cushion unit; 2001, second surface. Detailed implementation manners

[0040] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0041] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0042] It should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0043] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined.

[0044] Electronic paper is a display technology that utilizes natural light reflection and does not require light emission and power consumption when maintaining static images. It has the characteristics of low carbon, recyclability, and digitization and is a new medium for text. Electronic paper can not only protect the eyes and eliminate flicker but also has a viewing angle of nearly 180°, making it suitable for long-term reading. Electronic paper can also replace traditional devices such as liquid crystal tablets and computers to achieve functions such as online teaching, examinations, and office work, and has broad market prospects. In the manufacturing process of electronic paper, the encapsulation process of electronic ink is very crucial. The encapsulation effect of electronic ink directly affects the display performance of electronic paper, and poor encapsulation can cause electronic paper to be unable to display. There are still various problems in the current electronic ink encapsulation process, and the encapsulation process restricts the development of electronic paper.

[0045] To address the above problems, an embodiment of the first aspect of the present application provides an electronic paper encapsulation component that can encapsulate electronic ink in different types of electronic paper such as electrophoretic slurry electronic paper, electrophoretic fluid ink electronic paper, and microcapsule ink electronic paper.

[0046] Please refer to Figures 1 to 3, the electronic paper encapsulation component 100 of the embodiment of the present application includes a first substrate layer 10, a plurality of microcup units 20, and an encapsulation layer 30 arranged in sequence along the first direction Z. The plurality of microcup units 20 are connected to one side of the first substrate layer 10 along the first direction Z. A receiving hole 21 is provided in the microcup unit 20. The receiving hole 21 penetrates the microcup unit 20 along the first direction Z, and electronic ink 40 is provided in the receiving hole 21; the receiving hole 21 includes a receiving cavity 211 and a feeding hole 212. The feeding hole 212 is provided on the side of the receiving cavity 211 away from the first substrate layer 10 along the first direction Z, and the aperture of the feeding hole 212 is smaller than the aperture of the receiving cavity 211. The encapsulation layer 30 is connected to one side of the plurality of microcup units 20 away from the first substrate layer 10 along the first direction Z, and the encapsulation layer 30 covers the feeding hole 212.

[0047] The first substrate layer 10 is used to support the microcup units 20.

[0048] The plurality of microcup units 20 are continuously distributed in a direction perpendicular to the first direction Z, and adjacent microcup units 20 are connected to each other. The plurality of microcup units 20 are used to separate the electronic ink 40 so that the electronic ink 40 in each microcup unit 20 does not affect each other when displaying colors. Optionally, the microcup unit 20 can be a light-transmitting material such as photoresist or polyurethane acrylate.

[0049] The receiving hole 21 penetrates the microcup unit 20 along the first direction Z, that is, one end of the receiving hole 21 close to the first substrate layer 10 is open and blocked by the first substrate layer 10 to prevent the leakage of the electronic ink 40.

[0050] The electronic ink 40 has particles of different colors, and the charges carried by the particles of different colors are different.

[0051] The feeding hole 212 and the receiving cavity 211 are two continuous parts along the first direction Z. The feeding hole 212 is used to introduce the electronic ink 40 into the receiving cavity 211, and the electronic ink 40 is added into the receiving cavity 211 from the feeding hole 212 when adding the electronic ink 40. The receiving cavity 211 is used to accommodate the electronic ink 40. Optionally, the cross-section of the receiving cavity 211 can be in the shape of a rectangle, hexagon, circle, ellipse, etc.

[0052] During the process of coating the encapsulation layer 30, the first direction Z is the vertical direction; the encapsulation layer 30 is not cured when it is just coated on the microcup unit 20. The aperture of the feeding hole 212 is smaller than the aperture of the receiving cavity 211, that is, the aperture of the entrance of the receiving hole 21 is reduced, reducing the weight of the encapsulation layer 30 not supported by the microcup unit 20 directly above the feeding hole 212; when the encapsulation layer 30 contacts the electronic ink 40 in the feeding hole 212, the liquid level of the electronic ink 40 can support the encapsulation layer 30 under the action of surface tension.

[0053] The encapsulation layer 30 covers the feed hole 212, which can prevent external moisture, oxygen, etc. from entering the electronic ink 40 and prevent the electronic ink 40 from denaturing. The encapsulation layer 30 can also resist external force impacts and friction, keeping the electronic paper encapsulation assembly 100 stable. The encapsulation layer 30 and the first substrate layer 10 are respectively used to encapsulate both ends of the accommodation hole 21 along the first direction Z to prevent the electronic ink 40 from flowing out of the accommodation hole 21.

[0054] During use, different voltages are applied to the electronic ink 40 on both sides of the microcup unit 20 along the first direction Z, which can control the moving directions of different color particles in the electronic ink 40; controlling one kind of particle to move along the first direction Z to a position close to the encapsulation layer 30 can make the electronic ink 40 display the color of the particle on the front side of the electronic paper encapsulation assembly 100. The front side of the electronic paper encapsulation assembly 100 is the side where the encapsulation layer 30 is away from the first substrate layer 10 along the first direction Z. Both the encapsulation layer 30 and the microcup unit 20 are made of light-transmitting materials, and the color of the electronic ink 40 can be seen from the front side of the electronic paper encapsulation assembly 100. For example, the electronic ink 40 has positively charged white particles and negatively charged black particles. After driving the white particles to move in the direction close to the encapsulation layer 30, the white particles block the black particles, and the electronic ink 40 shows white; after driving the black particles to move in the direction close to the encapsulation layer 30, the black particles block the white particles, and the electronic ink 40 shows black. By applying different voltages to the electronic ink 40 in different microcup units 20, different particles in different microcup units 20 can be made to approach the encapsulation layer 30, so that the electronic ink 40 in different microcup units 20 shows different colors, and the colors shown by the electronic ink 40 in multiple microcup units 20 are combined into a display interface.

[0055] The beneficial effects of the embodiments of the present application are as follows: The first substrate layer 10 and the encapsulation layer 30 are provided to seal both ends of the accommodation hole 21 in the microcup unit 20, which can prevent the electronic ink 40 from flowing out of the accommodation hole 21. The aperture of the feed hole 212 is smaller than that of the accommodation cavity 211, which can reduce the weight of the encapsulation layer 30 above the feed hole 212 that is not supported by the microcup unit 20. The encapsulation layer 30 above the feed hole 212 is more likely to remain stable under the frictional force of the surrounding encapsulation layer 30; when the encapsulation layer 30 contacts the electronic ink 40 in the feed hole 212, the pressure of the encapsulation layer 30 above the feed hole 212 on the liquid surface of the electronic ink 40 is smaller, and the liquid surface of the electronic ink 40 can support the encapsulation layer 30 under the action of surface tension, preventing the encapsulation layer 30 from falling into the electronic ink 40 and keeping the uncured encapsulation layer 30 intact. The encapsulation layer 30 covering the smaller feed hole 212 can improve the sealing effect and prevent the electronic ink 40 from leaking out. The embodiments of the present application can solve the technical problem that the uncured encapsulation layer 30 is likely to fall into the electronic ink 40. The encapsulation layer 30 is not easily broken, and the encapsulation effect is good, preventing defects such as material running, sagging, solvent drying, and charged particle aggregation caused by the breakage of the encapsulation layer 30 of the electronic ink 40.

[0056] In some embodiments, please refer to Figure 2 , the surface of the microcup unit 20 close to the encapsulation layer 30 along the first direction Z is inclined from the edge of the microcup unit 20 to the feed hole 212 in the direction close to the first substrate layer 10 to guide the electronic ink 40 into the feed hole 212.

[0057] The surface of the microcup unit 20 close to the encapsulation layer 30 along the first direction Z is the first surface 221. The first surface 221 is a closed loop around the first direction Z. The opening of the feed hole 212 is located in the middle of the first surface 221. The first surface 221 is inclined from the edge to the middle in the direction close to the accommodation cavity 211. During the process of adding the electronic ink 40, the electronic ink 40 is more likely to flow into the feed hole 212 on the inclined first surface 221.

[0058] The beneficial effects of the embodiments of the present application are as follows: Since the first surface 221 is inclined, the electronic ink 40 on the first surface 221 is likely to flow into the feed hole 212 under the action of gravity, reducing the residual electronic ink 40 on the first surface 221 and preventing the electronic ink 40 on the surface of the microcup unit 20 from diluting the encapsulation layer 30 and causing the encapsulation layer 30 to fall into the electronic ink 40, so as to keep the encapsulation layer 30 stable.

[0059] In some embodiments, please refer to Figure 2 , the inclination gradient of the first surface 221 is 5%-30%.

[0060] The inclination slope of the first surface 221 is the tangent value of the inclination angle A of the first surface 221, that is, the inclination angle A of the first surface 221 is 2.8624° - 16.699°. Optionally, the inclination slope of the first surface 221 can be 5%. The smaller slope of the first surface 221 can make the uncured encapsulation layer 30 more stable on the first surface 221. Optionally, the inclination slope of the first surface 221 can be 30%. The larger slope of the first surface 221 makes it easier for the electronic ink 40 to flow into the feed hole 212, reducing the electronic ink 40 remaining on the first surface 221. Optionally, the inclination slope of the first surface 221 can also be 10%.

[0061] Optionally, the first surface 221 can be in the shape of the side surface of a frustum of a cone or the side surface of a frustum of a pyramid, etc. Please refer to Figure 2 , for example, when the first surface 221 is in the shape of the side surface of a frustum of a cone, the angle between the generatrix of the first surface 221 and the plane perpendicular to the first direction Z is the inclination angle A of the first surface 221. For example, when the first surface 221 is in the shape of the side surface of a frustum of a pyramid, the first surface 221 is composed of multiple inclined trapezoidal surfaces, and the angle between the trapezoidal surface and the plane perpendicular to the first direction Z is the inclination angle A of the first surface 221.

[0062] If the slope of the first surface 221 is too small, the resistance when the electronic ink 40 flows downward on the first surface 221 is too large, and the electronic ink 40 is likely to remain on the first surface 221; if the slope of the first surface 221 is too large, the resistance when the uncured encapsulation layer 30 flows downward is too small, and the encapsulation layer 30 is likely to enter the accommodation cavity 211. Limiting the slope of the first surface 221 within the above range can prevent the uncured encapsulation layer 30 from entering the accommodation cavity 211, and the electronic ink 40 on the first surface 221 can easily flow downward, which can reduce the electronic ink 40 remaining on the first surface 221.

[0063] In some embodiments, please refer to Figure 2 , the apertures of the same accommodation cavity 211 are consistent at different positions in the first direction Z. That is to say, in the first direction Z, the cross-section of the accommodation cavity 211 at the end close to the encapsulation layer 30 is the same as the cross-sections at other positions of the accommodation cavity 211. The cavity wall of the accommodation cavity 211 extends in the first direction Z, and the charged particles in the electronic ink 40 close to the encapsulation layer 30 can completely block other charged particles far from the encapsulation layer 30, and the electronic ink 40 in the microcup unit 20 can stably display the color of the charged particles close to the encapsulation layer 30.

[0064] In some embodiments, please refer to Figure 2, the aperture diameters of the same feed hole 212 are consistent at different positions in the first direction Z. The hole wall of the feed hole 212 extends along the first direction Z. When the uncured encapsulation layer 30 moves downward in the feed hole 212, the hole walls at different positions of the feed hole 212 in the first direction can all be in contact with the encapsulation layer 30. The frictional force between the hole wall of the feed hole 212 and the encapsulation layer 30 can increase as the encapsulation layer 30 flows downward, which can prevent the encapsulation layer 30 from entering the electronic ink 40.

[0065] In some embodiments, please refer to Figure 2 , the aperture diameters of the accommodation cavity 211 are consistent at different positions in the first direction Z, and the aperture diameters of the feed hole 212 are consistent at different positions in the first direction Z. That is, the accommodation hole 21 has a stepped hole structure. The microcup unit 20 forms a side wall portion 23 and a cover plate portion 22 arranged in sequence along the first direction Z. The side wall portion 23 is an annular structure and encloses the accommodation cavity 211. The cover plate portion 22 is an annular plate-like structure with a feed hole 212 in the middle. When in use, the cover plate portion 22 can block the electronic ink 40 on one side of the electronic ink 40, can reduce the impact of electrons on the encapsulation layer 30, and make the encapsulation layer 30 more stable.

[0066] In some embodiments, the aperture diameter of the accommodation cavity 211 is 50um - 300um, and the ratio of the aperture diameter of the feed hole 212 to the aperture diameter of the accommodation cavity 211 is 1 / 10 - 1 / 2. That is, the aperture diameter of the feed hole 212 is 5um - 150um.

[0067] Optionally, the aperture diameter of the accommodation cavity 211 can be 50um, the density of the microcup unit 20 is relatively large, and the clarity is relatively high when the electronic paper encapsulation component 100 is in use. Optionally, the aperture diameter of the accommodation cavity 211 can also be 300um, and it is easy to fabricate the microcup unit 20. Optionally, the aperture diameter of the accommodation cavity 211 can also be 100um.

[0068] Optionally, the ratio of the aperture diameter of the feed hole 212 to the aperture diameter of the accommodation cavity 211 can be 1 / 10. The weight of the encapsulation layer 30 directly above the feed hole 212 is relatively small, and the uncured encapsulation layer 30 is not easily broken. Optionally, the ratio of the aperture diameter of the feed hole 212 to the aperture diameter of the accommodation cavity 211 can also be 1 / 2. The aperture diameter of the feed hole 212 is relatively large, and the electronic ink 40 can be quickly added into the accommodation cavity 211. Optionally, the ratio of the aperture diameter of the feed hole 212 to the aperture diameter of the accommodation cavity 211 can also be 1 / 6.

[0069] The aperture of the receiving cavity 211 is too small, making it difficult to fabricate the micro-cup unit 20. The micro-cup unit 20 and the internal electronic ink 40 are the smallest display units of the electronic paper encapsulation component 100. When the size of the electronic paper encapsulation component 100 is the same, if the aperture of the receiving cavity 211 is too large, the number of micro-cup units 20 will decrease, and the clarity of the electronic paper encapsulation component 100 during use will be lower. Limiting the aperture of the receiving cavity 211 to the above-mentioned size facilitates the fabrication of the micro-cup unit 20, and the electronic paper encapsulation component 100 has higher clarity when used in the electronic paper.

[0070] If the aperture of the feed hole 212 is too small, it is difficult for the electronic ink 40 to flow into the feed hole 212. If the aperture of the feed hole 212 is too large, the weight of the encapsulation layer 30 directly above the feed hole 212 will be too large, and the uncured encapsulation layer 30 is likely to fall into the feed hole 212. Limiting the aperture ratio of the feed hole 212 to the aperture of the receiving cavity 211 to the above-mentioned ratio can quickly add the electronic ink 40 into the receiving cavity 211 and prevent the uncured encapsulation layer 30 from falling into the feed hole 212.

[0071] In some embodiments, please refer to Figures 1 to 3 , the electronic paper encapsulation component 100 includes a first substrate layer 10, a plurality of micro-cup units 20, an encapsulation layer 30, and a second substrate layer 200 arranged in sequence along the first direction Z. The plurality of micro-cup units 20 are connected to one side of the first substrate layer 10 along the first direction Z. An accommodation hole 21 is provided in the micro-cup unit 20. The accommodation hole 21 penetrates the micro-cup unit 20 along the first direction Z, and electronic ink 40 is provided in the accommodation hole 21.

[0072] The accommodation hole 21 includes a receiving cavity 211 and a feed hole 212. The feed hole 212 is provided on the side of the receiving cavity 211 away from the first substrate layer 10 along the first direction Z. The aperture of the feed hole 212 is smaller than the aperture of the receiving cavity 211. The accommodation hole 21 has a stepped hole structure. The aperture of the receiving cavity 211 is consistent at different positions along the first direction Z, and the aperture of the feed hole 212 is consistent at different positions along the first direction Z. The surface of the micro-cup unit 20 close to the encapsulation layer 30 along the first direction Z is inclined from the edge of the micro-cup unit 20 towards the direction close to the first substrate layer 10 for the feed hole 212 to guide the electronic ink 40 into the feed hole 212. The encapsulation layer 30 is connected to one side of the plurality of micro-cup units 20 away from the first substrate layer 10 along the first direction Z, and the encapsulation layer 30 is used to encapsulate the feed hole 212.

[0073] An embodiment of the second aspect of the present application further provides an electronic paper 1000. Please refer to Figure 4, the electronic paper 1000 includes a second substrate layer 200 and the electronic paper encapsulation component 100 according to any one of the first aspect embodiments. A first electrode layer is provided on the first substrate layer 10. The second substrate layer 200 is disposed on a side of the encapsulation layer 30 away from the first substrate layer 10 along the first direction Z. A second electrode layer is provided on the second substrate layer 200. The first electrode layer and the second electrode layer are used to drive the electro-ink 40 to act.

[0074] Optionally, the first electrode layer may be provided on a side of the first substrate layer 10 close to the microcup unit 20 along the first direction Z. Optionally, the second electrode layer may be provided on a side of the second substrate layer 200 close to the microcup unit 20 along the first direction Z.

[0075] The first electrode layer and the second electrode layer are respectively disposed on two sides of the electro-ink 40 along the first direction Z. By changing the voltages of the first electrode layer and the second electrode layer, the direction of the electric field between the first electrode layer and the second electrode layer can be changed, and further the moving direction and position of the charged particles in the electro-ink 40 can be changed, and further the color displayed by the electro-ink 40 on the front surface of the electronic paper 1000 can be changed. The front surface of the electronic paper 1000 is a side of the second substrate layer 200 away from the first substrate layer 10 along the first direction Z. The second substrate layer 200 is made of a light-transmitting material, and the color of the electro-ink 40 can be seen from the front surface of the electronic paper 1000. Optionally, the voltage of the first electrode layer can be controlled to be stable. By changing the voltage of the second electrode layer, the direction of the electric field between the first electrode layer and the second electrode layer can be changed, and by changing the voltages of the second electrode layer at different positions, the electro-ink 40 in different microcup units 20 can be controlled to display different colors.

[0076] The electronic paper 1000 can be used in devices with screens such as smart watches, e-book readers, billboards, etc.

[0077] The beneficial effects of the embodiments of the present application are as follows: The setting of the first electrode layer and the second electrode layer facilitates the control of the movement of the charged particles in the electro-ink 40, and further the color displayed by the electro-ink 40 can be controlled. The electronic paper 1000 of the embodiments of the present application includes the electronic paper encapsulation component 100 according to any one of the first direction Z embodiments, which can prevent the uncured encapsulation layer 30 from falling into the electro-ink 40, keep the uncured encapsulation layer 30 intact, and have all the effects of the electronic paper encapsulation component 100.

[0078] The embodiments of the third aspect of the present application further provide a method for manufacturing an electronic paper encapsulation component 100. Please refer to Figures 5 to 15 , the method for manufacturing the electronic paper encapsulation component 100 includes:

[0079] S1, please refer to Figure 6 and Figure 7, provide a first substrate layer 10, and a plurality of cushion units 2000 are arranged at intervals on one side of the first substrate layer 10 along the first direction Z.

[0080] The interval direction between adjacent cushion units 2000 is perpendicular to the first direction Z. The cushion unit 2000 is a columnar structure extending along the first direction Z. Optionally, the cross-section of the cushion unit 2000 perpendicular to the first direction Z can be in the shape of a rectangle, hexagon, circle, ellipse, etc. Optionally, the cushion unit 2000 can be a solid material such as methyl methacrylate resin or photosensitive epoxy resin that can be dissolved by a solution. Optionally, the cushion unit 2000 can also be a solid material such as liquid photosensitive resin that is easily liquefied after heating.

[0081] S2, please refer to Figure 8 and Figure 9 , a micro-cup layer is provided on the first substrate layer 10, and the micro-cup layer covers a plurality of cushion units 2000.

[0082] Except for the surface of the cushion unit 2000 in contact with the first substrate layer 10, other surfaces of the cushion unit 2000 are covered by the micro-cup layer. In the direction perpendicular to the first direction Z, the micro-cup layer covering the side surface of the cushion unit 2000 fills the gap between adjacent cushion units 2000 and separates adjacent cushion units 2000. The material of the micro-cup layer is different from that of the cushion unit 2000.

[0083] S3, please refer to Figure 10 and Figure 11 , a feed hole 212 is opened at a position corresponding to the cushion unit 2000 on the micro-cup layer to expose the cushion unit 2000. On the projection plane perpendicular to the first direction Z, the orthographic projection area of the feed hole 212 is smaller than the orthographic projection area of the cushion unit 2000.

[0084] The feed hole 212 is provided on the side of the cushion unit 2000 away from the first substrate layer 10 along the first direction Z, and the feed hole 212 penetrates the micro-cup layer along the first direction Z. On the projection plane perpendicular to the first direction Z, the orthographic projection area of the feed hole 212 is smaller than the orthographic projection area of the cushion unit 2000, that is to say, a part of the surface of the cushion unit 2000 away from the first substrate layer 10 along the first direction Z is exposed from the cushion unit 2000, and the other part is still covered by the micro-cup layer.

[0085] S4, please refer to Figure 2 and Figure 3 , remove the cushion unit 2000, so that a receiving cavity 211 communicating with the feed hole 212 is formed in the micro-cup layer.

[0086] After removing the cushion layer unit 2000, a receiving cavity 211 is formed at the position where the cushion layer unit 2000 originally was, and the shape of the receiving cavity 211 is substantially the same as the shape of the cushion layer unit 2000. The micro-cup layer is composed of a plurality of micro-cup units 20. The micro-cup unit 20 includes the pore wall of the feed hole 212 and the cavity wall of the receiving cavity 211, and a plurality of micro-cup units 20 are formed in the micro-cup layer. The material of the cushion layer unit 2000 is different from that of the micro-cup layer. Optionally, a solution that can react with the cushion layer unit 2000 is added to the feed hole 212 to dissolve the cushion layer unit 2000, and the solution can flow to the position blocked by the micro-cup layer to dissolve the cushion layer unit 2000. Optionally, the cushion layer unit 2000 can also be turned into a liquid state by methods such as heating up.

[0087] S5, please refer to Figure 12 and Figure 13 , and add electronic ink 40 into the receiving cavity 211 from the feed hole 212.

[0088] S6, please refer to Figure 14 and Figure 15 , and a packaging layer 30 is provided on the surface of the micro-cup layer facing away from the first substrate layer 10 along the first direction Z. The packaging layer 30 covers the feed hole 212 to prevent the electronic ink 40 from leaking out.

[0089] The manufacturing method of the electronic paper packaging component 100 according to the embodiment of the present application can be used to manufacture the electronic paper packaging component 100 in the embodiment of the first aspect.

[0090] The beneficial effects of the embodiment of the present application are as follows: The cushion layer unit 2000 is coated with the micro-cup layer, and after opening the feed hole 212, the cushion layer unit 2000 is removed. Since the material of the cushion layer unit 2000 is different from that of the micro-cup layer, the cushion layer unit 2000 can be removed without affecting the micro-cup layer. Moreover, after removing the cushion layer unit 2000, a receiving cavity 211 with a larger aperture can be formed. The aperture of the receiving cavity 211 is larger than the aperture of the feed hole 212, which can prevent the uncured packaging layer 30 from falling into the electronic ink 40 and keep the uncured packaging layer 30 intact.

[0091] In some embodiments, please refer to Figures 6 to 8 , the surface of the cushion layer unit 2000 facing away from the first substrate layer 10 is inclined from the edge to the middle of the cushion layer unit 2000 towards the direction close to the first substrate layer 10. In S2, when the micro-cup layer is provided on the first substrate layer 10, the micro-cup layer is coated on the first substrate layer 10 and the cushion layer unit 2000. Among them, the micro-cup layer coated on the surface of the cushion layer unit 2000 facing away from the first substrate layer 10 is inclined to guide the electronic ink 40 into the feed hole 212.

[0092] The surface of the cushioning unit 2000 away from the first substrate layer 10 is the second surface 2001. The second surface 2001 is a closed loop around the first direction Z. In this embodiment, the edge of the cushioning unit 2000 is also the edge of the second surface 2001, and the middle is the middle of the second surface 2001. The second surface 2001 slopes towards the first substrate layer 10 from the edge to the middle. Optionally, the second surface 2001 can be in the shape of the side surface of a frustum of a cone or a frustum of a pyramid, etc.

[0093] The micro-cup layer includes a plurality of micro-cup units 20. The micro-cup layer forms a thin layer on the second surface 2001 with the same inclination angle as the second surface 2001, that is, the first surface 221 is formed. By changing the shape of the second surface 2001, the shape of the formed first surface 221 can be controlled. When coating the micro-cup layer, the second surface 2001 is the upper surface of the cushioning unit 2000. Optionally, the micro-cup layer can be coated on the first substrate layer 10 by spin coating. The fluid-state micro-cup layer is added to the first substrate layer 10 and the cushioning unit 2000, and the first substrate layer 10 and the cushioning unit 2000 are rotated. The micro-cup layer is evenly distributed on the second surface 2001 under the action of centrifugal force, forming a shape consistent with the second surface 2001.

[0094] Optionally, the micro-cup layer can also be coated on the first substrate layer 10 by doctor blade coating. While the doctor blade coating device moves above the cushioning unit 2000, it releases a thin film-like micro-cup layer, and the micro-cup layer adheres to the second surface 2001 to form a shape consistent with the second surface 2001. Multiple doctor blade coatings can increase the thickness of the micro-cup layer.

[0095] After the micro-cup layer is formed, processing the first surface 221 easily causes damage to the micro-cup layer. In the embodiment of the present application, the second surface 2001 is provided on the cushioning unit 2000. When coating the micro-cup layer on the second surface 2001, the first surface 221 can be formed without processing the formed micro-cup layer, preventing damage to the micro-cup layer. The first surface 221 can reduce the residue of the electronic ink 40 and prevent the electronic ink 40 from diluting the encapsulation layer 30.

[0096] In other embodiments, the surface of the cushioning unit 2000 facing away from the first substrate layer 10 can be a plane. In step S2, the micro-cup layer is formed by photolithography to form a plurality of micro-cup units 20 with an inclined first surface 221. The first surface 221 slopes towards the first substrate layer 10 from the edge to the middle.

[0097] In some embodiments, in S1, the cushioning unit 2000 includes a first photoresist. Removing the cushioning unit 2000 includes: adding a first developer to the feed hole 212, dissolving the first photoresist with the first developer, removing the cushioning unit 2000, and then removing the reacted first developer and the cushioning unit 2000 from the accommodation cavity 211.

[0098] The first developing solution can flow to various positions of the cushion layer unit 2000 and can fully dissolve the cushion layer unit 2000. The feed hole 212 is arranged downward, and the dissolved cushion layer unit 2000 and the first developing solution can flow out from the feed hole 212, so that the dissolved cushion layer unit 2000 and the first developing solution can be quickly removed.

[0099] In some embodiments, the first photoresist is a positive photoresist, and the microcup layer includes a second photoresist. In S1, after the cushion layer unit 2000 is arranged on the first substrate layer 10, the cushion layer unit 2000 is exposed. In S3, when the feed hole 212 is opened, the second photoresist at the position of the feed hole 212 is removed by exposure and development.

[0100] After the cushion layer unit 2000 is arranged on the first substrate layer 10, the cushion layer unit 2000 is exposed, that is, the cushion layer unit 2000 is exposed before the step of S2 is carried out.

[0101] Optionally, the second photoresist can be a negative photoresist. For example, the second photoresist can include acrylic resin; when the feed hole 212 is opened, the microcup layer outside the position of the feed hole 212 is exposed.

[0102] Optionally, the second photoresist can also be a positive photoresist, and when the feed hole 212 is opened, the microcup layer at the position of the feed hole 212 is exposed.

[0103] When removing the second photoresist, a second developing solution is used to dissolve the microcup layer at the position of the feed hole 212. Optionally, the first developing solution is a positive photoresist developing solution, and the second developing solution is a negative photoresist developing solution. Optionally, the second developing solution can also be the same as the first developing solution.

[0104] The beneficial effects of the embodiments of the present application are as follows: after the cushion layer unit 2000 is exposed, the microcup layer is then fabricated on the first substrate layer 10, which can fully expose the cushion layer unit 2000, enable the cushion layer unit 2000 to react fully with the first developing solution, and can prevent the influence on the second photoresist when the cushion layer unit 2000 is exposed, and can prevent the removal of the second photoresist outside the position of the feed hole 212.

[0105] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An electronic paper encapsulation component, characterized in that Comprising: A first substrate layer; A plurality of micro-cup units, connected to one side of the first substrate layer along a first direction. An accommodation hole is provided in the micro-cup unit, and the accommodation hole penetrates the micro-cup unit along the first direction. Electronic ink is provided in the accommodation hole; the accommodation hole includes an accommodation cavity and a feed hole. The feed hole is provided on a side of the accommodation cavity away from the first substrate layer along the first direction, and the aperture of the feed hole is smaller than the aperture of the accommodation cavity; A packaging layer, connected to one side of the plurality of micro-cup units away from the first substrate layer along the first direction, and the packaging layer covers the feed hole.

2. The electronic paper encapsulation component according to claim 1, wherein, The surface of the micro-cup unit close to the packaging layer is inclined from the edge of the micro-cup unit to the direction in which the feed hole faces closer to the first substrate layer to guide the electronic ink into the feed hole.

3. The electronic paper encapsulation component according to claim 2, wherein The inclination slope of the surface of the micro-cup unit close to the packaging layer is 5%-30%.

4. The electronic paper encapsulation component according to claim 1, characterized in that, The aperture of the same accommodation cavity is consistent at different positions in the first direction; and / or, the aperture of the same feed hole is consistent at different positions in the first direction.

5. The electronic paper encapsulation component according to claim 1, wherein The aperture of the accommodation cavity is 50um-300um, and the ratio of the aperture of the feed hole to the aperture of the accommodation cavity is 1 / 10-1 / 2.

6. An electronic paper, characterized in that, Comprising a second substrate layer and the electronic paper packaging component according to any one of claims 1-5. A first electrode layer is provided on the first substrate layer. The second substrate layer is provided on a side of the packaging layer away from the first substrate layer along the first direction. A second electrode layer is provided on the second substrate layer. The first electrode layer and the second electrode layer are used to drive the electronic ink to act.

7. A method for manufacturing an electronic paper encapsulation component, characterized in that, Comprising: Providing a first substrate layer, and arranging a plurality of cushion units at intervals on one side of the first substrate layer along a first direction; Providing a micro-cup layer on the first substrate layer, and the micro-cup layer covers the plurality of cushion units; Opening a feed hole at a position corresponding to the cushion unit on the micro-cup layer to expose the cushion unit. On a projection plane perpendicular to the first direction, the projected area of the feed hole is smaller than the projected area of the cushion unit; Removing the cushion unit so that an accommodation cavity communicating with the feed hole is formed in the micro-cup layer; Adding electronic ink into the accommodation cavity from the feed hole; Providing a packaging layer on a side of the micro-cup layer away from the first substrate layer.

8. The method for manufacturing an electronic paper encapsulation component according to claim 7, wherein The surface of the cushion unit away from the first substrate layer is inclined from the edge of the cushion unit to the middle towards the direction closer to the first substrate layer; when the micro-cup layer is provided on the first substrate layer, the micro-cup layer is coated on the first substrate layer and the cushion unit, wherein the micro-cup layer coated on the surface of the cushion unit away from the first substrate layer is inclined to guide the electronic ink into the feed hole.

9. The method for manufacturing an electronic paper encapsulation component according to claim 7, characterized in that, The cushion unit includes a first photoresist, and the removing the cushion unit includes: Adding a first developer into the feed hole, and using the first developer to remove the cushion unit.

10. The method for manufacturing an electronic paper encapsulation component according to claim 9, wherein, The first photoresist is a positive photoresist, the micro-cup layer includes a second photoresist, after the cushioning unit is disposed on the first substrate layer, the cushioning unit is exposed, and when the feed hole is opened, the second photoresist at the feed hole is removed by exposure and development.

Images