Thermal simulation method of automobile instrument and automobile instrument
Patent Information
- Application Number
- CN202411460872.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-18
- Publication Date
- 2025-07-22
Smart Images
Figure CN120354517A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of simulation optimization of automobiles, and particularly to a thermal simulation method for an automotive instrument and an automotive instrument. Background Art
[0002] As one of the important components of an automobile, an automotive instrument is internally provided with a display screen and various electronic components. The display screen and electronic components will generate heat by themselves during operation, thus bringing about the problem of heat dissipation. In addition, due to the special position where the automotive instrument is installed, during the actual operation of the automotive instrument, it will inevitably be exposed to more sunlight, which will also affect the heat dissipation performance of the automotive instrument. At present, most of the heat dissipation methods of the instrument adopt natural air cooling. However, the glass, light guide plate, and film material of the automotive instrument will all undergo certain deformations when heated, which will affect its light transmittance, refractive index, and imaging ability. Therefore, the heat dissipation performance of the automotive instrument will affect the quality and lifespan of the automotive instrument.
[0003] Therefore, it is necessary to perform thermal simulation on the automotive instrument to simulate its heat generation and heat deformation conditions in order to judge the heat dissipation performance of the automotive instrument. However, since the heat dissipation of the automotive instrument is affected by multiple factors such as self-heating, environment, and heat dissipation, this leads to a large difference between the simulation result and the actual result of the automotive instrument during thermal simulation. Moreover, the automotive instrument often reaches the end stage of production design. If it is found at this time that the heat dissipation performance of the automotive instrument is unqualified, modifying the structure of these automotive instruments that have already completed mold opening or even been put into production will also significantly increase the development cost and extend the development cycle.
[0004] Therefore, how to improve the accuracy of the thermal simulation result and make the simulation result more consistent with the actual result has become an urgent technical problem to be solved. Summary of the Invention
[0005] Based on the above situation, the main purpose of the present invention is to provide a thermal simulation method for an automotive instrument and an automotive instrument, which are used to improve the accuracy of the thermal simulation result and make the simulation result more consistent with the actual result.
[0006] To achieve the above purpose, the technical solution adopted by the present invention is as follows:
[0007] In a first aspect, an embodiment of the present invention discloses a thermal simulation method for an automotive instrument, and the method includes:
[0008] Step S100, obtaining an instrument model of the automotive instrument to be simulated, where the instrument model includes a PCB simplified model and a housing simplified model;
[0009] Step S200: Simplify the instrument structure features in the instrument model to obtain a simplified model. The feature simplification includes feature deletion. The instrument structure features include the non-joint features in the housing simplified model and the non-thermal conduction features in the PCB simplified model.
[0010] Step S300: Obtain a preset solar radiation model, which is preset according to the geographical location of the vehicle instrument to be simulated.
[0011] Step S400: Perform a first mesh division on the PCB simplified model to obtain a first mesh model. The first mesh division is to perform a surface mesh division on the PCB simplified model.
[0012] Step S500: Perform a thermal simulation solution on the first mesh model according to the preset thermal simulation parameters and the solar radiation model to obtain a thermal simulation solution result.
[0013] Step S600: Perform a second mesh division on the housing simplified model to obtain a second mesh model. The second mesh division is to perform a structural mesh division on the housing simplified model.
[0014] Step S700: Perform a static analysis on the second mesh model according to the preset static solution parameters and the thermal simulation result to obtain a thermal deformation result, so as to complete the thermal simulation of the vehicle instrument to be simulated.
[0015] Preferably, between step S100 and step S200, the method further includes:
[0016] Step S110: When the instrument model meets the preset conditions, execute step S200, where the preset conditions are that the instrument sample of the vehicle instrument to be simulated passes the lighting test, and the instrument sample is produced based on the instrument model.
[0017] Preferably, between step S200 and step S300, the method further includes:
[0018] Step S210: Perform model recognition on each part in the simplified model based on the part type in the simplified model to obtain a recognition model. The recognition model consists of multiple part models, and the part model is the model obtained after the recognition of each part model in the simplified model.
[0019] Step S220: When interference occurs between part models, adjust the model parameters of the interfering part models to make the recognition model meet the thermal simulation conditions. The model parameters include the contact relationship between part models.
[0020] Preferably, step S400 includes:
[0021] Step S401: Perform the first mesh division on the simplified PCB model based on the mesh division parameters to obtain the mesh cells of the simplified PCB model. The mesh division parameters include the mesh size, the maximum number of mesh layers, and the minimum number of cell layers.
[0022] Step S402: Eliminate the meshes of the mesh cells according to the mesh elimination parameters to obtain the first mesh model. The mesh elimination parameters include the mesh distortion coefficient.
[0023] Preferably, step S200 includes:
[0024] Step S201: Delete the features at non-connection parts in the simplified housing model, and retain the features at connection parts and the shape features in the simplified housing model. The shape features include the outer shape and the thickness.
[0025] Step S202: Delete the non-thermal conduction features in the simplified PCB model. The non-thermal conduction features include the chip pins and the fillets of the wire arrangement holes.
[0026] Preferably, the features at non-connection parts include the structural features protruding from the instrument surface of the automotive instrument to be simulated and / or the fillets in the automotive instrument to be simulated with a size smaller than the preset value.
[0027] Preferably, step S500 includes:
[0028] Step S501: Obtain the part parameters under different part types based on the part types in the simplified PCB model. The part types include heating elements and lamp beads.
[0029] Step S502: Adjust the gravity coefficient of the simplified PCB model based on the earth's gravity.
[0030] Step S503: Perform thermal simulation iterative solution on the first mesh model according to the part parameters, the gravity coefficient, the preset thermal simulation parameters, and the sunlight radiation model. When the solution result converges, obtain the surface temperatures of the parts on the simplified PCB model.
[0031] Preferably, step S600 includes:
[0032] Step S601: Perform model mesh division on the simplified housing model using the mesh division parameters to obtain the divided model.
[0033] Step S602: Obtain the sheet-like structures in the simplified housing model, and locally refine the meshes corresponding to the sheet-like structures in the divided model to obtain the second mesh model.
[0034] Preferably, before step S600, it further includes:
[0035] Step S510: Obtain the test temperature of the automotive instrument to be simulated. The test temperature is obtained by testing the instrument sample of the automotive instrument to be simulated, and the instrument sample is produced based on the instrument model.
[0036] Step S520: Mutually verify the test temperature and the thermal simulation solution result, and adjust the thermal simulation parameters when the error between the thermal simulation solution result and the test temperature is greater than the preset value.
[0037] In a second aspect, an embodiment of the present invention discloses an automotive instrument obtained by performing simulation optimization using the thermal simulation method of the automotive instrument according to any one of the above first aspects.
[0038] Beneficial effects:
[0039] According to a thermal simulation method and an automotive instrument disclosed in an embodiment of the present invention, the method includes obtaining an instrument model, simplifying the instrument structure features in the instrument model to obtain a simplified model, the simplified model including a PCB simplified model and a housing simplified model, obtaining a preset solar radiation model, performing a first mesh division on the PCB simplified model to obtain a first mesh model, then performing a thermal simulation solution on the first mesh model according to the preset thermal simulation parameters and the solar radiation model to obtain a thermal simulation result, then performing a second mesh division on the housing simplified model to obtain a second mesh model, and performing a static analysis on the second mesh model based on the preset static solution parameters and the thermal simulation result to obtain a thermal deformation result, thus completing the thermal simulation of the automotive instrument to be simulated. Through the above solution, first, the instrument model is simplified. On the one hand, it can obtain better-quality first and second mesh models during mesh division, thereby improving the accuracy of the thermal simulation solution and the static analysis result. On the other hand, it also reduces the data volume and can improve the efficiency of the thermal simulation solution and the static analysis result. Setting the solar radiation model to participate in the thermal simulation solution together, and combining the thermal simulation solution result and the static analysis for thermo-solid coupling solution, considering the thermal radiation received by the automotive instrument during actual operation, makes the simulation result closer to the actual heat generation and deformation conditions, and further improves the accuracy of the finally obtained simulation result.
[0040] Other beneficial effects of the present invention will be elaborated in the specific implementation manner through the introduction of specific technical features and technical solutions. Those skilled in the art should be able to understand the beneficial technical effects brought by the said technical features and technical solutions through these introductions. BRIEF DESCRIPTION OF THE DRAWINGS
[0041] The following will describe the preferred embodiments of a thermal simulation method and an automotive instrument of the present invention with reference to the drawings. In the figures:
[0042] Figure 1Schematic diagram of the process of a thermal simulation method for an automotive instrument disclosed in this embodiment;
[0043] Figure 2 Schematic diagram of the process of meshing the simplified PCB model in this embodiment;
[0044] Figure 3 Schematic diagram of the process of solving the thermal simulation of the first mesh model in this embodiment;
[0045] Figure 4 Schematic diagram of the process of meshing the simplified housing model in this embodiment. Detailed implementation manners
[0046] The present invention will be described below based on embodiments, but the present invention is not limited to these embodiments. In the following detailed description of the present invention, some specific details are described in detail. In order to avoid obscuring the essence of the present invention, well-known methods, processes, procedures, and components are not described in detail.
[0047] In addition, those of ordinary skill in the art should understand that the drawings provided herein are for illustrative purposes only, and the drawings are not necessarily drawn to scale.
[0048] Unless the context clearly requires otherwise, the words "including", "comprising", and the like throughout the specification and claims should be construed in an inclusive sense rather than an exclusive or exhaustive sense; that is, the meaning of "including but not limited to".
[0049] In the description of the present invention, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.
[0050] In order to improve the accuracy of the thermal simulation results and make the simulation results more consistent with the actual results, this embodiment discloses a thermal simulation method for an automotive instrument and an automotive instrument. Please refer to Figure 1 , Figure 1 Schematic diagram of the process of a thermal simulation method for an automotive instrument disclosed in this embodiment. The thermal simulation method for the automotive instrument includes: step S100 to step S700, where:
[0051] Step S100: Obtain the instrument model of the vehicle instrument to be simulated. The instrument model includes a PCB model and a housing model. In this embodiment, the format of the instrument model of the vehicle instrument to be simulated can be the STP format. The instrument model is the original model of the vehicle instrument to be simulated, that is, the design model including the overall view and detailed design of the vehicle instrument to be simulated. The instrument model includes a PCB model and a housing model. The PCB model includes a PCB board, on which electronic components, lamp beads, chips, and circuits are arranged; the housing model includes the overall housing of the vehicle instrument to be simulated.
[0052] Step S200: Simplify the instrument structure features in the instrument model to obtain a simplified model. The feature simplification includes feature deletion. The instrument structure features include non-joint features in the housing model and non-thermal-conduction features in the PCB model. In this embodiment, the non-joint features in the housing model are, for example, bolts and gaskets for connection, rounded corners in the air-cooled heat dissipation structure with a size smaller than a preset value, which can be 0.5 mm for example, and rounded corners on complex parts such as the front frame, rear shell, and light guide plate with a size smaller than a preset value, which can be 1 mm for example. The non-thermal-conduction features in the PCB model include features that do not participate in heat generation, basically do not participate in heat conduction, and have a relatively low impact on the heat dissipation and conduction situation of the overall structure, such as chip metal pins and package markings, structures on the circuit board with weak heat conduction ability and extremely difficult mesh division, such as connectors, and rounded corners of component pins and TFT cable perforations on the circuit board. It can be understood that during the model simplification process, only some instrument structure features in the instrument model are simplified, such as rounded corners and pins. The geometric shape and part thickness of the vehicle instrument in the instrument model need to be retained. And when there are metal-type components in the instrument model, the connection structure of the metal parts should be avoided from being modified as much as possible to retain the metal heat conduction contact area to the greatest extent.
[0053] In order to simplify the calculation amount of the simulation while ensuring the simulation accuracy, in an alternative embodiment, step S200 includes:
[0054] Step S201: Delete the non-joint features in the housing model, and retain the joint features and shape features in the housing model. The shape features include the outer shape and thickness. In this embodiment, the joint features in the housing model include the features at the connection points between the instrument housing and external devices or between the instrument housing and the internal parts of the housing, such as connection holes, connection stud posts, etc. In an optional embodiment, the non-joint features include the structural features protruding from the instrument surface of the vehicle instrument to be simulated and / or the rounded corners in the vehicle instrument to be simulated with a size smaller than a preset value. For example, deleting the structural features protruding from the instrument surface of the vehicle instrument to be simulated can be to delete some integrated mounting points, and clean the parts of these integrated mounting points protruding from the instrument body surface; it can also be to directly remove the integrated mounting points of the same material and their buckles; it can also be to delete the bolts and gaskets for connection. The rounded corners in the vehicle instrument to be simulated with a size smaller than a preset value can include the rounded corners in the air-cooled heat dissipation structure with a size smaller than a preset value, the preset value can be, for example, 0.5 mm, and the rounded corners in complex parts such as the front frame, rear shell, and light guide plate with a size smaller than a preset value, the preset value can be, for example, 1 mm. And, since both the thickness and the outer shape of the model will affect the heat dissipation effect, in order to ensure the simulation accuracy, during the process of model simplification, it is necessary to retain the geometric shape and part thickness of the vehicle instrument in the instrument model.
[0055] Step S202: Delete the non-thermally conductive features in the PCB model. The non-thermally conductive features include chip pins and the rounded corners of the wiring holes. In this embodiment, the thermally conductive features in the PCB model include the features that participate in heat generation, participate in heat conduction, and the overall structure will affect the heat dissipation and heat conduction conditions, such as chips, lamp beads, wiring holes, etc. Among them, the non-thermally conductive features can specifically be the chip metal pins and package imprints, the connectors on the circuit board and other structures with weak heat conduction ability and extremely difficult mesh division, the rounded corners of the component pins perforating the circuit board and the TFT wiring perforations, etc.
[0056] To reduce the workload of thermal simulation analysis, in an optional embodiment, between step S100 and step S200, the method further includes:
[0057] Step S110: When the instrument model meets the preset conditions, execute Step S200. Herein, the preset condition is that the instrument sample of the vehicle instrument to be simulated passes the lighting test, and the instrument sample is produced based on the instrument model. In this embodiment, the instrument sample can be made based on the instrument model. It should be noted that the instrument sample produced here does not need to meet the production standard, as long as it can represent the structure and connection relationship in the current instrument model. Select a suitable test fixture for the instrument sample to simulate the installation state of the instrument sample, and then conduct a lighting test on the instrument sample. When the instrument sample can pass the lighting test, it is considered that the vehicle instrument represented by this instrument model can operate normally, and Step S200 can be continued, that is, perform feature simplification and thermal simulation analysis on the instrument model. Only the instrument models that can pass the lighting test are subjected to model simplification and thermal simulation analysis. Compared with the solution of directly performing thermal simulation analysis on the instrument model without conducting a lighting test, it can reduce the workload of thermal simulation analysis on the instrument models that cannot operate normally, thereby shortening the product design and development process to a certain extent.
[0058] In order to simplify the calculation amount of the simulation while ensuring the simulation accuracy, in an alternative embodiment, between Step S200 and Step S300, the method further includes:
[0059] Step S210: Based on the part types in the simplified model, perform model recognition on each part in the simplified model to obtain a recognition model. The recognition model is composed of multiple part models, and the part model is the model obtained after recognizing each part model in the simplified model. In this embodiment, model recognition refers to further simplifying the simplified model. The simplified model includes multiple parts. Therefore, the parts in the simplified model can be recognized based on the part types of each part in the simplified model to obtain multiple part models, and the model formed by combining multiple part models is used as the recognition model. In the specific implementation process, different model recognitions can be performed for different part types. The part types include non-electronic components, non-circuit boards, chips, resistors, and lamp beads, etc. For example, for non-electronic components and non-circuit boards, the highest-level model recognition can be performed on them, but it is necessary to ensure that their external structures will not be distorted; for some small parts on the PCB simplified model, the lowest-level model recognition can be selected. For example, for electronic components such as resistors and capacitors that hardly generate heat, the lowest-level model recognition can be selected to ignore these smaller features. In addition, some electronic components that do not participate in heat generation and do not affect heat dissipation can also be directly removed; for chips, the lowest-level model recognition can be selected. After the model recognition is completed, move the bottom surface of the chip to the surface of the PCB board to make them fit; for lamp beads, the lowest-level model recognition can also be selected.
[0060] Step S220: When interference occurs between component models, adjust the model parameters of the interfering component models to make the recognition model meet the thermal simulation conditions. The model parameters include the contact relationships of the component models. In this embodiment, since each component in the simplified model is separately recognized during model recognition, interference may occur in the recognition model composed of the recognized component models after recognition. When interference occurs between component models, it is necessary to adjust the model parameters of the interfering component models, such as adjusting their positions, contact relationships, etc., to solve the interference problem and make the recognition model meet the thermal simulation conditions, that is, to make the recognition model free of interference problems, thereby ensuring the accuracy of the simulation results.
[0061] Step S300: Obtain a preset solar radiation model, which is preset according to the geographical location of the automotive instrument to be simulated. In this embodiment, since the automotive instrument is irradiated by the sun during use and sunlight backflow will affect the heating and heat dissipation performance of the automotive instrument, a solar radiation model can be preset based on the geographical location of the automotive instrument to be simulated to consider the thermal simulation results of the automotive instrument under sunlight irradiation. The geographical location of the automotive instrument to be simulated can be information such as the longitude, latitude, and altitude of the location where the automotive instrument to be simulated is used, or information such as month and time can be set in the solar radiation model to improve the accuracy of the solar radiation model. In the specific implementation process, relevant parameters of the solar radiation model can be set in the simulation software for thermal simulation analysis.
[0062] Step S400: Perform a first mesh division on the PCB simplified model to obtain a first mesh model. The first mesh division is to perform a surface mesh division on the PCB simplified model. In this embodiment, performing a first mesh division on the PCB simplified model specifically means performing a surface mesh division on the PCB simplified model, that is, performing a mesh division on the PCB board.
[0063] To improve the accuracy of the obtained first mesh model and thus improve the accuracy of thermal simulation, please refer to Figure 2 , Figure 2 which is the flow diagram of mesh division of the PCB simplified model disclosed in this embodiment. As shown in Figure 2 , in an alternative embodiment, step S400 includes:
[0064] Step S401: Perform the first mesh division on the simplified PCB model based on the mesh division parameters to obtain the mesh cells of the simplified PCB model. The mesh division parameters include the mesh size, the maximum number of mesh layers, and the minimum number of cell layers. In this embodiment, when performing the mesh division, the maximum size and the minimum size can be set respectively in the three directions of X, Y, and Z. The mesh division parameters can also include the minimum number of mesh lines on the cell edges. Among them, the parameter values of the minimum number of mesh lines on the cell edges, the minimum number of cell layers, and the maximum number of mesh layers can be 3, 2, and 2 respectively, for example.
[0065] Step S402: Eliminate the meshes of the mesh cells according to the mesh elimination parameters to obtain the first mesh model. The mesh elimination parameters include the mesh distortion coefficient. In this embodiment, after dividing the meshes, the low-quality meshes can be eliminated. Specifically, the low-quality meshes can be eliminated according to the fitting degree and the distortion coefficient of the mesh cells. For example, the meshes with a coefficient in the range of 0 to 0.4 can be eliminated to improve the mesh quality of the obtained first mesh model. Since the surface mesh division is performed when dividing the meshes of the simplified PCB model, the deformed meshes in the first mesh model will significantly affect the accuracy of the thermal simulation results during the surface mesh division. Therefore, the meshes of the mesh cells can be eliminated to improve the mesh quality in the first mesh model, thereby improving the accuracy of the high-temperature simulation.
[0066] Step S500: Perform thermal simulation and solution on the first mesh model according to the preset thermal simulation parameters and the solar radiation model to obtain the thermal simulation solution result. In this embodiment, the preset thermal simulation parameters include component parameters, gravity coefficient, solution domain parameters, etc. After completing the mesh division, the thermal simulation and solution can be performed on the first mesh model according to the preset thermal simulation parameters and the solar radiation model. When the solution is completed, the thermal simulation solution result is obtained. Among them, the thermal simulation solution result includes a cloud map with the surface temperatures of each heating element marked. The solution domain parameters can refer to the solution domain of the model. For example, the content of the solution domain of the model can be set to air, and the ambient temperature and radiation temperature can also be set. In addition, since the selection of the instrument material will also affect the heat dissipation of the automotive instrument, the materials and properties of each component in the instrument model can also be limited. For example, materials, specific heat capacity, thermal conductivity, density, Poisson's ratio, etc. The components in the instrument model can include a light guide plate, a film material, an LED lamp, a PCBA, etc., and the materials and properties of the components in the instrument model can be limited respectively.
[0067] In an alternative embodiment, please refer to Figure 3 , Figure 3 is a schematic flow diagram of performing thermal simulation and solution on the first mesh model disclosed in this embodiment. As shown in Figure 3 , step S500 includes:
[0068] Step S501: Obtain component parameters under different component types based on the component types in the PCB simplified model. The component types include heating elements and lamp beads. In this embodiment, different component parameters can be set for different component types in the PCB simplified model. For example, for lamp beads, the component parameters of the lamp beads include the working current, heat generation efficiency, and the relationship curve between voltage and ambient temperature. For heating elements, the component parameters include thermal resistance, limiting temperature, junction power, etc. In the specific implementation process, the specific parameters included in the component parameters can also be increased or decreased according to the actual simulation situation and requirements.
[0069] Step S502: Adjust the gravity coefficient of the PCB simplified model based on the earth's gravity. In this embodiment, for automotive instrument panels, gravity is an important part of natural cooling in the absence of forced cooling. Generally, some ventilation openings are provided on the rear case of the instrument. Therefore, the gravity coefficient of the PCB simplified model can be set based on the earth's gravity. For example, the gravity coefficient in the Y direction can be set to 9.8.
[0070] Step S503: Perform thermal simulation iterative solution on the first grid model according to the component parameters, gravity coefficient, preset thermal simulation parameters, and solar radiation model. When the solution result converges, obtain the surface temperatures of each component on the PCB simplified model. In this embodiment, after completing the solution settings, that is, obtaining the component parameters, gravity coefficient, preset thermal simulation parameters, and solar radiation model, thermal simulation solution can be performed according to the solution settings. When the preset convergence conditions are met, the surface temperatures of each component on the PCB simplified model can be obtained at this time. Among them, the preset convergence conditions can be set according to actual needs. For example, the preset convergence conditions can include the number of iterations, the slope of the residual curve, etc. In the specific implementation process, the grid quality settings can also be selected to ensure that the results of low-quality grids can be iteratively calculated multiple times, reduce the error of the thermal simulation results, and improve the accuracy of the thermal simulation results.
[0071] To improve the accuracy of the thermal simulation results, in an alternative embodiment, before the step S600, it further includes:
[0072] Step S510: Obtain the test temperature of the automotive instrument panel to be simulated. The test temperature is obtained by testing the instrument sample of the automotive instrument panel to be simulated. The instrument sample is produced based on the instrument model. In this embodiment, after the instrument sample is produced based on the instrument model, a temperature test can be performed on the instrument sample to obtain the test temperature of the automotive instrument panel to be simulated. For example, multiple time nodes can be selected from 25°C to 85°C for temperature measurement to obtain the test temperature.
[0073] Step S520: cross-verify the test temperature and the thermal simulation solution results, and adjust the thermal simulation parameters when the error between the thermal simulation solution results and the test temperature is greater than a preset value. In this embodiment, after obtaining the thermal simulation solution results, the test temperature and the thermal simulation solution results can be cross-verified. When the error between the test temperature and the thermal simulation solution results is greater than the preset value, it is considered that there may be a large error between the thermal simulation results and the real results at this time. The thermal simulation parameters can be adjusted, and the thermal simulation is solved again using the adjusted thermal simulation parameters, so as to improve the accuracy of the thermal simulation results through the way of cross-verifying the test and the simulation.
[0074] It should be noted that step S510 can be performed before any one of steps S100 to S600, and the execution order of step S510 is not limited here.
[0075] Step S600: perform a second mesh generation on the simplified shell model to obtain a second mesh model. The second mesh generation is to perform a structural mesh generation on the simplified shell model. In this embodiment, the model mesh generation can be performed on the simplified shell model using preset mesh generation parameters to obtain a second mesh model. Among them, the mesh generation parameters include the maximum size of the mesh element, the resolution coefficient, and the characteristic clearance size. Among them, the maximum size of the mesh element can be, for example, 5 mm, the adaptive resolution coefficient of the mesh generation can be, for example, 7, and the minimum characteristic clearance size can be, for example, 0.1 mm. In the specific implementation process, a simulation software can be used for mesh generation. When using the simulation software for mesh generation, parameters such as the physical preference of the mesh generation, the smooth quality of the mesh connection, and the mesh quality error limit value can be set.
[0076] When performing mesh generation, in order to improve the accuracy of mesh generation and ensure the accuracy of simulation analysis, in an alternative embodiment, please refer to Figure 4 , Figure 4 is a schematic flow diagram of mesh generation for the simplified shell model disclosed in this embodiment. As shown in Figure 4 , step S600 includes steps S601 and S602, where:
[0077] Step S601: perform model mesh generation on the simplified shell model using the mesh generation parameters to obtain a partitioned model. In this embodiment, the model mesh generation is performed on the simplified shell model using the mesh generation parameters, so as to obtain a partitioned model. In the partitioned model, the meshes of the components in the simplified shell model conform to the same mesh generation rule.
[0078] Step S602: Obtain the sheet-like structures in the simplified housing model and locally encrypt the meshes of the sheet-like structures to obtain a second mesh model. In this embodiment, the sheet-like structures can be, for example, structures such as glass, TFT, circuit boards, film materials, and light guide plates. Locally encrypt the sheet-like structures to ensure the accuracy of the simulation results. That is to say, in the second mesh model, there are two mesh division rules. For the sheet-like structures, perform local encryption processing to increase the density of the divided meshes; while for the non-sheet-like structures, divide them according to the mesh division parameters.
[0079] Step S700: Perform a static analysis on the second mesh model according to the preset static solution parameters and the thermal simulation results to obtain a thermal deformation result, so as to complete the thermal simulation of the automotive instrument to be simulated. In this embodiment, the static analysis is to simulate the position and fixing method of the automotive instrument during actual installation and apply gravity to the automotive instrument. When performing the static analysis, it is necessary to preset the material properties of the automotive instrument at the corresponding positions of the instrument model in the instrument model, such as density, elastic modulus, etc. In addition, it is also necessary to establish the connection relationships between the various components in the instrument model to simulate the actual state of the instrument model. And use the thermal simulation results as an external load to directly act on the second mesh model, so as to obtain the result of the thermal deformation of the second mesh model after static solution, that is, the thermal deformation result.
[0080] In the specific implementation process, it is possible to check whether there are other electronic components with lower temperature limits around the electronic components with higher temperatures according to the thermal simulation results, so as to adjust the arrangement of the electronic components, improve the rationality of the electronic component arrangement design, and extend the service life of the automotive instrument; it is possible to optimize the structural design and material selection of the automotive instrument according to the thermal simulation results, thereby improving the service life and reliability of the automotive instrument.
[0081] In this embodiment, an automotive instrument is also disclosed, which is obtained after simulation optimization by using the thermal simulation method of the automotive instrument described in any of the above embodiments.
[0082] A thermal simulation method and an automotive instrument according to an embodiment of the present invention. The method includes obtaining an instrument model, simplifying the instrument structure features in the instrument model to obtain a simplified model, where the simplified model includes a PCB simplified model and a housing simplified model, obtaining a preset solar radiation model, performing a first mesh division on the PCB simplified model to obtain a first mesh model, then performing a thermal simulation solution on the first mesh model according to the preset thermal simulation parameters and the solar radiation model to obtain a thermal simulation result, then performing a second mesh division on the housing simplified model to obtain a second mesh model, and performing a static analysis on the second mesh model based on the preset static solution parameters and the thermal simulation result to obtain a thermal deformation result, thereby completing the thermal simulation of the automotive instrument to be simulated. Through the above solution, first, the instrument model is simplified. On the one hand, it can obtain a first mesh model and a second mesh model with better quality during mesh division, thereby improving the accuracy of the thermal simulation solution and the static analysis result. On the other hand, it also reduces the data volume and can improve the efficiency of the thermal simulation solution and the static analysis result. The solar radiation model is set to participate in the thermal simulation solution together, and the thermal-solid coupling solution is carried out by combining the thermal simulation solution result and the static analysis, taking into account the thermal radiation received by the automotive instrument during actual operation, making the simulation result closer to the actual heat generation and deformation conditions, and further improving the accuracy of the finally obtained simulation result.
[0083] Those skilled in the art can understand that, on the premise of no conflict, the above preferred solutions can be freely combined and superimposed. Among them, the flowcharts and block diagrams in the drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code, and the module, the program segment, or the part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order from that marked in the drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, as well as the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions. The numbers assigned to the steps in this article are only for convenience of description and reference, and are not used to limit the order before and after. The specific execution order is determined by the technology itself, and those skilled in the art can determine various allowed and reasonable orders according to the technology itself.
[0084] It should be noted that in the present invention, step numbers (letter or number numbers) are used to refer to certain specific method steps only for the purpose of convenience and brevity of description, and by no means to limit the order of these method steps by letters or numbers. Those skilled in the art can understand that the order of relevant method steps should be determined by the technology itself and should not be unduly restricted by the existence of step numbers. Those skilled in the art can determine various permitted and reasonable step orders according to the technology itself.
[0085] Those skilled in the art can understand that on the premise of no conflict, the above preferred solutions can be freely combined and superimposed.
[0086] It should be understood that the above embodiments are merely exemplary and not restrictive. Without departing from the basic principles of the present invention, various obvious or equivalent modifications or substitutions that those skilled in the art can make to the above details will be included within the scope of the claims of the present invention.
Claims
1. A thermal simulation method for an automotive instrument, characterized in that, The method includes: Step S100, obtaining an instrument model of an automobile instrument to be simulated, where the instrument model includes a PCB model and a housing model; Step S200, performing feature simplification on the instrument structure features in the instrument model to obtain a simplified model. The feature simplification includes feature deletion. The instrument structure features include non-joint features in the housing model and non-thermal conduction features in the PCB model. The simplified model includes a PCB simplified model and a housing simplified model; Step S300, obtaining a preset solar radiation model, where the solar radiation model is preset according to the geographical location of the automobile instrument to be simulated; Step S400, performing a first mesh division on the PCB simplified model to obtain a first mesh model. The first mesh division is to perform a surface mesh division on the PCB simplified model; Step S500, performing a thermal simulation solution on the first mesh model according to preset thermal simulation parameters and the solar radiation model to obtain a thermal simulation solution result; Step S600, performing a second mesh division on the housing simplified model to obtain a second mesh model. The second mesh division is to perform a structural mesh division on the housing simplified model; Step S700, performing a static analysis on the second mesh model according to preset static solution parameters and the thermal simulation result to obtain a thermal deformation result, so as to complete the thermal simulation of the automobile instrument to be simulated.
2. The thermal simulation method of an automotive instrument according to claim 1, wherein, Between step S100 and step S200, the method further includes: Step S110, when the instrument model meets a preset condition, executing step S200, where the preset condition is that the instrument sample of the automobile instrument to be simulated passes a lighting test, and the instrument sample is produced based on the instrument model.
3. The thermal simulation method of an automotive instrument according to claim 1, characterized in that, Between step S200 and step S300, the method further includes: Step S210, performing model recognition on each part in the simplified model based on the part type in the simplified model to obtain a recognition model. The recognition model is composed of multiple part models, and the part model is the model obtained after recognizing each part model in the simplified model; Step S220, when interference occurs between the part models, adjusting the model parameters of the interfering part models so that the recognition model meets the thermal simulation conditions. The model parameters include the contact relationship of the part models.
4. The thermal simulation method of an automotive instrument according to claim 1, characterized in that, Step S400 includes: Step S401, performing a first mesh division on the PCB simplified model based on mesh division parameters to obtain the mesh cells of the PCB simplified model. The mesh division parameters include mesh size, maximum mesh layer number, and minimum unit layer number; Step S402, performing mesh elimination on the mesh cells according to mesh elimination parameters to obtain a first mesh model. The mesh elimination parameters include a mesh distortion coefficient.
5. The thermal simulation method of the vehicle instrument according to claim 1, characterized in that, Step S200 includes: Step S201, deleting the non-joint features in the housing simplified model, and retaining the joint features and shape features in the housing simplified model. The shape features include the outer shape and thickness; Step S202: Delete the non-thermal conduction features in the simplified PCB model, where the non-thermal conduction features include chip pins and fillets of wire connection holes.
6. The thermal simulation method of an automotive instrument according to claim 5, characterized in that, The non-joint features include structural features protruding from the instrument surface of the automotive instrument to be simulated and / or fillets in the automotive instrument to be simulated with dimensions smaller than a preset value.
7. The thermal simulation method of an automotive instrument according to claim 1, characterized in that, The step S500 includes: Step S501: Obtain part parameters for different part types based on the part types in the simplified PCB model, where the part types include heating elements and lamp beads; Step S502: Adjust the gravity coefficient of the simplified PCB model based on the earth's gravity; Step S503: Perform thermal simulation iterative solution on the first mesh model according to the part parameters, the gravity coefficient, preset thermal simulation parameters, and the solar radiation model. When the solution result converges, obtain the surface temperatures of the parts on the simplified PCB model.
8. The thermal simulation method of the vehicle instrument according to claim 1, characterized in that, The step S600 includes: Step S601: Use mesh division parameters to perform model mesh division on the simplified housing model to obtain a divided model; Step S602: Obtain the sheet-like structure in the simplified housing model, and locally encrypt the meshes corresponding to the sheet-like structure in the divided model to obtain a second mesh model.
9. The thermal simulation method of the vehicle instrument according to claim 1, wherein Before the step S600, it further includes: Step S510: Obtain the test temperature of the automotive instrument to be simulated, where the test temperature is obtained by testing the instrument sample of the automotive instrument to be simulated, and the instrument sample is produced based on the instrument model; Step S520: Mutually verify the test temperature and the thermal simulation solution result, and adjust the thermal simulation parameters when the error between the thermal simulation solution result and the test temperature is greater than a preset value.
10. An automotive instrument, characterized in that, Obtained after simulation optimization by using the thermal simulation method of the automotive instrument according to any one of claims 1 to 9.