Motormeter thermal deformation simulation analysis method and motormeter

Abstract

The invention discloses an automobile instrument thermal deformation simulation analysis method and an automobile instrument, and the method comprises the steps: obtaining the temperature change information and thermal deformation information of an automobile instrument sample in a test process, the automobile instrument sample being obtained based on an automobile instrument primary model; when the automobile instrument sample passes the test, preprocessing the automobile instrument primary model and taking the preprocessed automobile instrument primary model as a simulation model; performing thermal simulation on the simulation model to obtain a transient thermal result; applying the transient thermal result as a temperature load to the simulation model to obtain a thermal deformation result; the result verification comprises first mutual verification and second mutual verification, and the first mutual verification is that the temperature change information is compared with the transient thermal result; the second mutual verification is that the thermal deformation information is compared with the thermal deformation result. According to the invention, the number of proofing times and the number of trial and error times of the whole machine are reduced, time and sample cost are saved, and the accuracy of sample test and model simulation can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of automotive instrument thermal simulation, and more specifically, to a method for simulating and analyzing thermal deformation of an automotive instrument and an automotive instrument. Background Art

[0002] Currently, a large number of electronic devices are included in automotive instruments, such as display screens, control boards, etc. These electronic devices generate heat during operation. However, in the automotive instrument industry, there is currently a lack of relevant analysis experience regarding heat conduction, heat convection, and heat radiation of the instrument structure, which often leads to large local heat generation and poor heat dissipation capacity during the operation of products produced according to the design model, and further causes problems such as local thermal deformation of the automotive instrument. When other industries conduct heat dissipation analysis, they need to rely on physical objects. When analyzing the automotive instrument based on this heat dissipation analysis method, multiple full-scale prototypes need to be made, resulting in a large number of trial-and-error times, high time costs and sample cost, and the simulation accuracy cannot be guaranteed. Summary of the Invention

[0003] Based on the above situation, the main purpose of the present invention is to provide a method for simulating and analyzing thermal deformation of an automotive instrument to solve the problems in the related technology that multiple full-scale prototypes need to be made in the thermal simulation of automotive instruments, resulting in a large number of trial-and-error times, high time costs and sample cost, and the simulation accuracy cannot be guaranteed.

[0004] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0005] A method for simulating and analyzing thermal deformation of an automotive instrument, comprising:

[0006] Step S100, obtaining temperature change information and thermal deformation information of an automotive instrument sample during a test, where the automotive instrument sample is made based on an initial version model of the automotive instrument;

[0007] Step S200, when the automotive instrument sample passes the test, preprocessing the corresponding initial version model of the automotive instrument and using the preprocessed initial version model of the automotive instrument as a simulation model;

[0008] Step S300, performing thermal simulation on the simulation model to obtain transient thermal results of the simulation model;

[0009] Step S400, applying the transient thermal results as temperature loads to the simulation model to obtain thermal deformation results of the simulation model;

[0010] Step S500, result verification. The result verification includes first mutual verification and second mutual verification. The first mutual verification is to compare the temperature change information with the transient thermal result. When the comparison difference is less than the set value, the first mutual verification passes. The second mutual verification is to compare the thermal deformation information with the thermal deformation result. When the comparison difference is less than the set value, the second mutual verification passes.

[0011] Preferably, in step S200, preprocessing the corresponding initial version model of the vehicle instrument and using it as the simulation model includes:

[0012] Step S2001, import the initial version model of the vehicle instrument;

[0013] Step S2002, simplify the complex structural features in the initial version model of the vehicle instrument to obtain a simplified model. The simplification includes deleting complex structural features, and the complex structural features include the mounting point structural features of the protruding part models in the initial version model of the vehicle instrument, the connection features with a thermal conductivity lower than the set value, the structural features with a heat dissipation effect lower than the set value, and the pin structural features and packaging structural features of the chip;

[0014] Step S2003, identify the simplified model to obtain the simulation model.

[0015] Preferably, the connection features with a thermal conductivity lower than the set value include: the non-metallic connection structures in the initial version model of the vehicle instrument;

[0016] The structural features with a heat dissipation effect lower than the set value include: the fillets of the part models in the initial version model of the vehicle instrument and the perforations on the PCB board.

[0017] Preferably, step S2003, identify the simplified model to obtain the simulation model, includes:

[0018] Select different identification categories based on different types of part models in the simplified model;

[0019] Adjust the positions of the identified part models so that the contact relationships between the part models are the same as the contact relationships between the corresponding parts in the vehicle instrument sample;

[0020] When interference occurs between the part models, adjust the part models, and use the model composed of multiple adjusted part models as the simulation model.

[0021] Preferably, step S300, perform a thermal simulation on the simulation model to obtain the transient thermal results of each component in the simulation model, includes:

[0022] Step S3001, establish a thermal simulation module and import the simulation model into the thermal simulation module;

[0023] Step S3002, perform temperature result solution control settings;

[0024] Step S3003, perform thermal simulation solution to obtain the temperature results of the heat - generating components in the simulation model and save them;

[0025] Step S3004, establish a transient thermal module, import the simulation model into the geometric structure of the transient thermal module, and import the temperature results into the transient thermal module as the initial conditions for the transient - time temperature change of the heat - generating components;

[0026] Step S3005, perform transient thermal solution control settings;

[0027] Step S3006, perform transient thermal simulation solution to obtain the transient thermal results of the heat - generating components in the simulation model.

[0028] Preferably, in step S400, taking the transient thermal results as a temperature load and applying it to the simulation model to obtain the thermal deformation results of the simulation model, includes:

[0029] Step S4001, establish a static structure module, import the geometric structure, model, and engineering data in the transient thermal module into the static structure module, and import the transient thermal results into the static structure module as temperature loads;

[0030] Step S4002, perform thermal deformation solution control settings;

[0031] Step S4003, take the transient thermal results as temperature loads and apply them to the simulation model, perform thermal deformation simulation solution to obtain the thermal deformation results.

[0032] Preferably, step S4002, performing thermal deformation solution control settings, includes:

[0033] Set constraint conditions for the static structure, and the constraint conditions include adding fixed supports to constrain all degrees of freedom of the installation points in the simulation model.

[0034] Preferably, the automotive instrument thermal deformation simulation analysis method further includes:

[0035] S600, perform simulation analysis on the uniformity of the optical components in the automotive instrument sample before and after deformation to obtain the light uniformity of the optical components before and after deformation.

[0036] Preferably, the temperature change information includes a first temperature change curve, which is obtained based on the change relationship between the temperatures of the various parts of the automotive instrument sample and time during the test;

[0037] The transient thermal result includes a second temperature change curve, which is obtained based on the change relationship between the temperatures of the various part models in the simulation model and time.

[0038] According to another aspect of the present invention, there is provided an automotive instrument obtained by performing simulation optimization using the above-mentioned thermal deformation simulation analysis method for automotive instruments.

[0039] Beneficial effects:

[0040] According to the thermal deformation simulation analysis method for automotive instruments disclosed in the embodiments of the present invention, the method includes obtaining temperature change information and thermal deformation information of an automotive instrument sample during the test, and the automotive instrument sample is made based on the initial version model of the automotive instrument; when the automotive instrument sample passes the test, the corresponding initial version model of the automotive instrument is preprocessed and the preprocessed initial version model of the automotive instrument is used as the simulation model; performing a thermal simulation on the simulation model to obtain the transient thermal result of the simulation model; applying the transient thermal result as a temperature load to the simulation model to obtain the thermal deformation result of the simulation model; result verification, and the result verification includes a first mutual verification and a second mutual verification. The first mutual verification is to compare the temperature change information with the transient thermal result, and when the comparison difference is less than the set value, the first mutual verification passes; the second mutual verification is to compare the thermal deformation information with the thermal deformation result, and when the comparison difference is less than the set value, the second mutual verification passes. Through the above method, on the one hand, the initial version model of the automotive instrument corresponding to the automotive instrument sample that can pass the test is used as the object of thermal simulation analysis, ensuring that the object of thermal simulation analysis can operate normally, thereby reducing the number of full machine proofing times and trial and error times, and saving time and sample cost;

[0041] On the other hand, after performing a thermal simulation analysis on the automotive instrument, it is possible to simulate the internal thermal distribution and transfer process of the object and structure, evaluate its thermal performance, optimize the design and solve potential thermal problems, which has a great auxiliary effect on the thermal design of the automotive instrument;

[0042] On yet another hand, it is possible to mutually verify the temperature change information of the automotive instrument sample obtained during the test with the transient thermal result obtained from the thermal simulation analysis, and mutually verify the thermal deformation information of the automotive instrument sample obtained during the test with the thermal deformation result obtained from the thermal simulation analysis, which not only improves the accuracy of the thermal simulation analysis but also improves the accuracy of the test process.

[0043] Other beneficial effects of the present invention will be described in the specific implementation manners by introducing specific technical features and technical solutions. Those skilled in the art should be able to understand the beneficial technical effects brought by the technical features and technical solutions through these introductions. Brief Description of the Drawings

[0044] The present invention will be described below with reference to the drawings. In the figures:

[0045] Figure 1 is a schematic flow chart of the simulation analysis method according to the present invention;

[0046] Figure 2 is a schematic flow chart of preprocessing the initial version model of the vehicle instrument according to the present invention;

[0047] Figure 3 is a schematic flow chart of solving the transient heat result according to the present invention;

[0048] Figure 4 is a schematic flow chart of solving the thermal deformation result according to the present invention;

[0049] Figure 5 is a schematic diagram of the initial version model of the vehicle instrument according to the present invention;

[0050] Figure 6 is a schematic diagram of simplifying the installation point structural features of the protruding part model according to the present invention;

[0051] Figure 7 is a schematic diagram of simplifying the connection part features with a thermal conductivity lower than the set value according to the present invention;

[0052] Figure 8 is a schematic diagram of simplifying the pin structural features of the chip according to the present invention;

[0053] Figure 9 is a schematic diagram of simplifying the package structural features of the chip according to the present invention;

[0054] Figure 10 is a schematic diagram of simplifying the PCB board according to the present invention;

[0055] Figure 11 is a schematic diagram of simplifying the structural features with a heat dissipation influence lower than the set value according to the present invention;

[0056] Figure 12 is a contour map of the temperature result of the heating component according to the present invention. Detailed Description of the Invention

[0057] The present invention will be described based on embodiments, but the present invention is not limited to these embodiments. In the following detailed description of the present invention, some specific details are described in detail. In order to avoid obscuring the essence of the present invention, well-known methods, processes, procedures, and components are not described in detail.

[0058] In addition, those of ordinary skill in the art should understand that the drawings provided herein are for illustrative purposes only, and the drawings are not necessarily drawn to scale.

[0059] Unless the context clearly requires otherwise, the words such as "including", "comprising" and the like in the whole specification and claims should be construed in an inclusive sense rather than an exclusive or exhaustive sense; that is, the meaning of "including but not limited to".

[0060] In the description of the present invention, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0061] To solve the related technical problems, such as Figure 1 As shown, this embodiment provides a method for simulating and analyzing the thermal deformation of an automotive instrument, including:

[0062] Step S100, obtaining the temperature change information and thermal deformation information of the automotive instrument sample during the test, and the automotive instrument sample is made based on the initial version model of the automotive instrument. In the specific implementation process, the initial version model can be designed first, and the sample can be made according to the initial version model. The completed sample includes the components required for the automotive instrument, such as the housing structure, PCB structure, and lamp bead structure, etc. After the sample is made, the sample needs to be tested to check whether the sample can operate normally, and whether to adjust the sample according to the test results. If adjustment is needed, the initial version model is adjusted accordingly to keep the initial version model consistent with the sample all the time. In one implementation manner, the test conducted on the sample is a lighting test.

[0063] During the test of the automotive instrument sample, a suitable test rack needs to be selected to simulate the installation state of the automotive instrument. Before the test, the test items need to be determined. In one implementation manner, the test items include: high and low temperature storage, low temperature operation, high temperature operation, temperature gradient, specified change rate temperature cycle, salt spray test with load, low temperature load, specified transition time temperature cycle, liquid looking down, sunlight radiation, high temperature and high humidity environment, etc. In this embodiment, there is no limitation on the specific test items.

[0064] Since there are electronic components in the automotive instrument sample, the temperature of the automotive instrument sample will rise during the test, and the temperature rise of different components is not exactly the same. At the same time, some components of the sample will undergo thermal deformation when the temperature rises. Therefore, in this embodiment, it is necessary to obtain the temperature change information and thermal deformation information of each component on the automotive instrument sample during the test. For the temperature change signal, it can be collected through the corresponding temperature sensor. For the thermal deformation information, it can be obtained by scanning the automotive instrument sample. For the thermal deformation information of some key components, it can also be obtained by microscopic observation with a metallurgical microscope. In this embodiment, there is no limitation on the specific means of obtaining the temperature change information and thermal deformation information.

[0065] Step S200, when the automotive instrument sample passes the test, preprocess the corresponding initial version model of the automotive instrument and use the preprocessed initial version model of the automotive instrument as the simulation model. In the specific implementation process, the initial version model of the automotive instrument used for preprocessing is consistent with the automotive instrument sample that has passed the test. For the preprocessing of the initial version model of the automotive instrument, specific processing needs to be carried out according to the simulation model required for thermal simulation analysis. In one implementation manner, the preprocessing includes simplifying, identifying, adjusting, etc. of the initial version model of the automotive instrument.

[0066] Step S300, perform thermal simulation on the simulation model to obtain the transient thermal results of the simulation model. In the specific implementation process, the process of performing thermal simulation on the simulation model includes importing the simulation model, processing the simulation model, setting relevant simulation parameters, and setting parameters of relevant part models, etc. According to different thermal simulation software used for thermal simulation, there are different thermal simulation methods when performing thermal simulation on the simulation model. In this embodiment, it is necessary to obtain the transient thermal results of the simulation model by performing thermal simulation on the simulation model. It should be noted that the transient thermal results in this embodiment are the results of the temperature of the simulation model changing with time. During the test of the automotive instrument sample, the results of the temperature of the automotive instrument sample changing with time, that is, the temperature change information, can also be obtained.

[0067] Step S400: Apply the transient thermal result as a temperature load to the simulation model to obtain the thermal deformation result of the simulation model. In a specific implementation process, obtaining the thermal deformation result of the simulation model is a thermo-structural coupling process. That is, the transient thermal result of the simulation model obtained by solving in step S300 needs to be applied as a temperature load (thermal stress) to the simulation model, so as to simulate the thermal deformation results of each part model on the simulation model under this transient thermal result. It should be noted that the thermal deformation result in this embodiment is the thermal deformation amount generated by the simulation model under a certain temperature load. During the test of the automotive instrument sample, the thermal deformation amount of the automotive instrument sample, that is, the thermal deformation information, can also be obtained.

[0068] In this embodiment, the process of thermo-structural coupling of the simulation model includes processing such as importing the simulation model, setting relevant simulation parameters, and setting parameters of relevant part models, etc. To improve the simulation efficiency, some of the processing and settings in the thermal simulation in step S300 can be used as part of the processing and settings required in the thermo-structural coupling.

[0069] Step S500: Result verification. The result verification includes the first mutual verification and the second mutual verification. The first mutual verification is to compare the temperature change information with the transient thermal result. When the comparison difference is less than the set value, the first mutual verification passes; the second mutual verification is to compare the thermal deformation information with the thermal deformation result. When the comparison difference is less than the set value, the second mutual verification passes. In a specific implementation process, the result verification part includes verifying the transient thermal result obtained in the thermal simulation analysis process and the temperature information of the automotive instrument sample obtained in the test process, that is, the first verification, and verifying the thermal deformation result obtained after the thermal simulation analysis and the thermal deformation information of the automotive instrument sample obtained in the test process, that is, the second verification.

[0070] In this embodiment, the verification process can be a verification between numerical values or a verification between change curves. Since there are differences in the simulation model compared to the automotive instrument sample due to preprocessing, the transient thermal result and the temperature change information will not be exactly the same. When the comparison difference between the two is within the set range, the verification passes. Similarly, the thermal deformation result and the thermal deformation information will not be exactly the same. When the comparison difference between the two is within the set range, the verification passes.

[0071] In this embodiment, there is no limitation on the specific verification sequence. In one implementation, both the first verification and the second verification are performed after obtaining the thermal deformation results of the simulation model. In another implementation, the first verification can be performed first, and the first verification is performed before step S400. Through the first verification, it is possible to preliminarily determine whether the test process of the automotive instrument sample and the transient thermal simulation process of the simulation model are accurate. If accurate, then step S400 is performed, thereby further improving the accuracy of the thermal simulation analysis and effectively shortening the simulation cycle and simulation cost.

[0072] In addition, in one implementation, the temperature change information includes a first temperature change curve, and the first temperature change curve is obtained based on the change relationship between the temperature and time of each part of the automotive instrument sample during the test process;

[0073] The transient thermal result includes a second temperature change curve, and the second temperature change curve is obtained based on the change relationship between the temperature and time of each part model in the simulation model. By directly comparing the first temperature change curve and the second temperature change curve, it is possible to more quickly mutually verify the test process and the thermal simulation process.

[0074] On the one hand, through the above method, the present invention takes the initial version model of the automotive instrument corresponding to the automotive instrument sample that can pass the test as the object of thermal simulation analysis, ensuring that the object of thermal simulation analysis can operate normally, thereby reducing the number of full-machine proofing times and trial-and-error times, and saving time and sample cost;

[0075] On the other hand, after performing thermal simulation analysis on the automotive instrument, it is possible to simulate the internal thermal distribution and transfer process of the object and structure, evaluate its thermal performance, optimize the design and solve potential thermal problems, which has a great auxiliary effect on the thermal design of the automotive instrument;

[0076] On the other hand, it is possible to mutually verify the temperature change information of the automotive instrument sample obtained during the test process with the transient thermal results obtained from the thermal simulation analysis, and mutually verify the thermal deformation information of the automotive instrument sample obtained during the test process with the thermal deformation results obtained from the thermal simulation analysis, not only improving the accuracy of the thermal simulation analysis but also improving the accuracy of the test process.

[0077] As Figure 2 shown, in one implementation, in step S200, preprocessing the corresponding initial version model of the automotive instrument and using it as a simulation model includes:

[0078] Step S2001, import the initial version model of the automotive instrument. In a specific embodiment, as Figure 5For the schematic diagram shown, the initial version model of the automotive instrument can be imported into the preprocessing function module in the model preprocessing software or thermal simulation software.

[0079] Step S2002: Simplify the complex structure features in the initial version model of the automotive instrument to obtain a simplified model. The simplification includes deleting complex structure features, and the complex structure features include the mounting point structure features of the protruding part models in the initial version model of the automotive instrument, the joint features with a thermal conductivity lower than the set value, the structural features with a heat dissipation effect lower than the set value, as well as the pin structure features and packaging structure features of the chip.

[0080] In a specific embodiment, since the initial version model of the automotive instrument is consistent with the automotive instrument sample, there are many complex structure features in the initial version model of the automotive instrument. Some of the complex structure features have a low impact on the results of thermal simulation analysis, but a large amount of data processing is required in the simulation analysis, resulting in a significant increase in the simulation cycle and calculation amount, and further increasing the simulation cost.

[0081] Therefore, it is necessary to simplify the initial version model of the automotive instrument. In this embodiment, taking ANSYS as an example, the initial version model of the automotive instrument can be simplified in ANSYS. The simplification includes deleting complex structure features, and the complex structure features include but are not limited to the mounting point structure features of the protruding part models in the initial version model of the automotive instrument, the joint features with a thermal conductivity lower than the set value, the structural features with a heat dissipation effect lower than the set value, as well as the pin structure features and packaging structure features of the chip (as Figure 8 and Figure 9 shown in the schematic diagram). Among them, as Figure 6 shown in the schematic diagram, the mounting point structure features of the protruding part models include the mounting point structure inside the part model of the protruding housing, which is used for the fixed connection between the housing and another housing. After deleting this type of mounting point structure, the overall shape and contour of the housing are retained. As Figure 7 shown in the schematic diagram, the joint features with a thermal conductivity lower than the set value include the connection structures between some shells, such as snaps. Bolts, gaskets, etc. used for connection. After deleting the joint features, the overall shape and contour of the shell are still retained. As Figure 10 and Figure 11 shown in the schematic diagram, the structural features with a heat dissipation effect lower than the set value include the rounded corners of the natural air-cooling heat dissipation structure in the initial version model of the automotive instrument, such as the rounded corners of heat dissipation fins, the rounded corners of heat dissipation holes, etc.

[0082] Step S2003: Identify the simplified model to obtain the simulation model. In a specific embodiment, after manually simplifying the initial version model of the automotive instrument, it is necessary to identify the simplified model in the software, including identifying each part model in the simplified model, so as to facilitate subsequent thermal simulation analysis. Different identification categories can be selected according to the different part models during identification, and no limitation is made thereto in this embodiment.

[0083] In a specific implementation manner, the joint features with a thermal conductivity lower than the set value include: the non-metallic connection structures in the initial version model of the automotive instrument, such as the snaps with the same material and connection.

[0084] The structural features with a heat dissipation effect lower than the set value include: the rounded corners of the part models in the initial version model of the automotive instrument and the perforations on the PCB board. The rounded corners in this embodiment include the rounded corners in the natural air-cooled heat dissipation structure and the rounded corners on complex parts such as the front frame, rear shell, and light guide plate to reduce the number of subsequent mesh divisions. The perforations on the PCB board include component pin perforations and TFT cable perforations, etc. After deleting the perforations, the overall contour and size of the PCB board remain unchanged.

[0085] Thus, in this embodiment, the principle based on the simplification process of the initial version model of the automotive instrument is: delete the complex structural features in the initial version model of the automotive instrument that will increase the number of subsequent mesh divisions on the premise of having little influence on the thermal simulation analysis results. It can be understood that in addition to the above structural features, those skilled in the art can also simplify other structural features based on this simplification principle.

[0086] In a specific implementation manner, step S2003: Identify the simplified model to obtain the simulation model, including:

[0087] Select different identification categories based on different types of part models in the simplified model;

[0088] Adjust the positions of the identified part models so that the contact relationships between the part models are consistent with the contact relationships between the corresponding parts in the automotive instrument sample;

[0089] When interference occurs between the part models, adjust the part models, and use the model composed of multiple adjusted part models as the simulation model.

[0090] Specifically, in this embodiment, in ANSYS, first perform conventional model recognition on all non-electronic components and non-PCB boards in the simplified model. Select the recognition category as "3" and select the maximum facet quality to ensure that the recognition of the external structure is not distorted. For components such as capacitors and resistors in the simplified model that hardly generate heat, select the recognition category as "1". During the recognition process, if it is confirmed that certain components do not participate in heat generation and do not affect heat dissipation, they can be directly removed. For the chips in the simplified model, after removing the pins, rounded corners, and depressions, select the recognition category as "1". For the lamp beads in the simplified model, select the recognition type as "1". In this embodiment, category "3" and category "1" are classifications of preset recognition categories.

[0091] Since some part models in the simplified model are separated from each other after simplification and recognition. For example, after the chip is simplified by removing the metal pins and all package markings, the chip and the PCB board are separated in the simplified model, resulting in distortion in the subsequent thermal simulation. Therefore, after recognition, the position of the chip needs to be adjusted to make it fit on the PCB board. That is, after the recognition is completed, the positions of some part models need to be adjusted so that the contact relationship between the part models is consistent with the contact relationship between the corresponding parts in the automotive instrument sample.

[0092] Since the external shapes of the part models are adjusted during the simplification and recognition process, interference may occur between the part models after recognition. Therefore, after recognition, the part models need to be checked. When interference occurs between the part models, the part models are adjusted.

[0093] As Figure 3 shown, in step S300, perform a thermal simulation on the simulation model to obtain the transient thermal results of each component in the simulation model, including:

[0094] Step S3001, establish a thermal simulation module and import the simulation model into the thermal simulation module. In a specific embodiment, an independent thermal simulation module can be established for thermal simulation analysis, such as the ICEPAK module. The ICEPAK module is more convenient for adding parameters such as component thermal resistance and power relative to transient heat. Therefore, solve the temperature results of the heat-generating components in the ICEPAK module and output the results to transient heat as the initial conditions for the transient time-temperature change of the heat-generating components.

[0095] Step S3002, perform control settings for solving temperature results. In a specific embodiment, the content of the solution control settings includes:

[0096] Set the model solution domain: In CABINET, set the SHAPE type to PRISM and the LOCAL COORD SYSTEM type to the default setting. Set the parameter variable SPECITY type to the intercepted time range START / END. Set the node displacement XS = -135 mm, node displacement XE = 370, node displacement YS = -50, node displacement YE = 157, node displacement ZS = -53, and node displacement ZE = 51. In PROPERTIES, set the minimum dimension in the X direction to OPENING, i.e., MAXX = OPENING, the maximum dimension in the Y direction to OPENING, i.e., MAXY = OPENING, the maximum dimension in the Z direction to OPENING, i.e., MAXZ = OPENING, the minimum dimension in the X direction to OPENING, i.e., MINX = OPENING, the minimum dimension in the Y direction to OPENING, i.e., MINY = OPENING, and the minimum dimension in the Z direction to OPENING, i.e., MINZ = OPENING. Select the default setting for each boundary type, and by default, solve the problem when the content in the solution domain is air. Select the default setting for the boundary conditions in the open case, and by default, the opening flow rate is the system-recommended value.

[0097] SOLID model information input: Select PROPERTIES, add materials in SOLID MATERIAl, select the SOLID model, and add material properties in Material, Density, Specific heat, and Conductivity respectively. Their units are: kg / m 3 , J / kg·K, W / m·k.

[0098] Set the material information required for thermal simulation: including the materials, specific heat, thermal conductivity, density, Young's modulus, Poisson's ratio, yield strength, and ultimate tensile strength of the parts in the heating components.

[0099] Heating element model setting: Use the Network model and select the double thermal resistance model input. Input Rjb, Rjc, and Junction power according to the collection form provided by the hardware of the automotive instrument sample. If there is no need to input in the remaining collection form, it can be left blank.

[0100] Set the hardware input information: Set it based on the hardware parameters of the automotive instrument sample.

[0101] Input the detailed information of the lamp beads: including selecting the lamp bead model, inputting the working current and heating efficiency, and the relationship curve between the voltage corresponding to the automotive instrument sample and the ambient temperature.

[0102] Import of the PCBA board diagram: Select ODB++ Design and import the.tgz file. The ECAD model of ODB should be used for the PCBA board diagram import to ensure the accuracy of the simulation results.

[0103] Set the solution information settings: Check FLOW and TEMPERATUIR in GENERAL. Set ON in RADIATION to enable the radiation model settings. Check the DISCERTE ORDINATES RADIATION MODEL model. Click OPTIONS on the right side of this radiation model to enter the advanced radiation model settings. Set the flow iterations per radiation iteration, for example, FLOW ITERATIONS PER RADIATION ITERATION = 1 can be set. Set the number of annular divisions for annular or sector elements in polar coordinates, for example, THETA DIVISIONS = 2 can be set. Set the parameter for controlling the phase field mesh division density when dividing the mesh, for example, PHIDIVISIONS = 2 can be set for the parameter controlling the phase field mesh division density. Set the number of pixels of the volume detector object in the [θ direction, for example, THETA PIXELS = 1 can be set for the number of pixels. Set the pixel phase, for example, PHIPIXELS = 1 can be set for the pixel phase. Use the zero-equation turbulence model in FLOWRAGIME, for example, TURBULENT = ZEROEQUATION can be set for the zero-equation turbulence model. Gravity is an important part of natural cooling when there is no forced heat dissipation for the automotive instrument. Generally, some ventilation openings are opened on the rear shell of the automotive instrument. Therefore, the gravity coefficient of the automotive instrument in the Y direction can be set to 9.80665, for example, the gravity setting can be enabled by checking GRAVITY VECTOR in NATURAL CONWECTION. Set the solution domain settings in DEFAULTS, TEMPERATURE = 25°C, RADIATION TEMP = 25°C. Here, the ambient temperature and the radiation temperature can be kept the same. Set the material of the solution domain to AIR.

[0104] In setting the solution information settings, fully considering the thermal radiation mode of the complex heat-generating structure and selecting the corresponding thermal radiation model can further improve the accuracy of the thermal simulation analysis.

[0105] Step S3003, perform a thermal simulation solution, obtain the temperature results of the heat-generating components in the simulation model and save them (as shown in the schematic diagram Figure 12 ).

[0106] Step S3004: Establish a transient thermal module, import the simulation model into the geometric structure of the transient thermal module, and import the temperature results into the transient thermal module as the initial conditions for the transient time-temperature change of the heating components.

[0107] Step S3005: Perform transient thermal solution control settings.

[0108] In a specific embodiment, the transient thermal solution control settings are as follows:

[0109] View the imported simulation model and modify the names of the individual part models in the simulation model;

[0110] Add a material library and assign it to the simulation model. The material information is the same as the material information added in Step S3002.

[0111] Add part contacts for the transient heat. Establish connections between part models. In the original structure, there are strong connections such as welding and gluing, and contact: bonded substitution can be selected; in the original structure, there are bolt and screw connections, and beam connection substitution can be selected; in the original structure, there are snap fits, limit connections, etc. If there are connections, friction, frictionless, and no separation substitutions can be selected according to the situation. As shown, select the contact active contact surface and select the target geometric surface. Set the contact type to bonded, and check program control for behavior and trimmed contact. In the advanced contact settings, set the generalized Lagrangian method, enable the small sliding setting parameter, detect calculation convergence at the Gauss points, and set the penetration tolerance value to 0.158 mm. Start the elastic sliding tolerance factor, and set the coefficient to 0.3. Select to update the strength actively each time, and set the absolute normal stiffness to 15. Set the contact setting search radius to 1 mm.

[0112] Add contact tools and view the number of contacts, contact gaps, tolerances, and radii.

[0113] Perform mesh division. External mesh data can be imported during mesh division. That is, use other software to perform mesh division on the simulation model, and transfer the divided mesh file to the transient thermal module, or directly perform mesh division in ANSYS. Since the mesh division effect of other software is better, it is preferably to use other software for mesh division.

[0114] Set the initial ambient temperature of the transient heat. This temperature is a fixed value. If there are no other temperature loads, then the entire solution is in an infinite 25°C insulation box, and the ambient temperature will never drop.

[0115] Set the temperature load. It is known that the maximum temperature that the automotive instrument can withstand is -40°C to 150°C. Therefore, set a temperature curve so that its temperature changes with time. When the surface temperature of the automotive instrument changes, it will definitely affect its mechanical properties, and then result in deformation, stress, etc.

[0116] Set the number of steps and the current step number to 1, and set the step end time to 12000 s. Turn on time integration, and select program control for other advanced settings.

[0117] In step S3006, perform transient thermal simulation to obtain the transient thermal results of the heat-generating components in the simulation model.

[0118] As Figure 4 shown, in one embodiment, in step S400, applying the transient thermal results as a temperature load to the simulation model to obtain the thermal deformation results of the simulation model, including:

[0119] In step S4001, establish a static structure module, import the geometric structure, model, and engineering data in the transient thermal module into the static structure module, and import the transient thermal results as a temperature load into the static structure module. In a specific embodiment, establish a static structure module, transfer the transient thermal results obtained by solving step S3006 to the static structure module, and share the basic settings, engineering data, geometric model, and model in the transient thermal module and the static structure module to share the simulation model, material assignment, mesh division, and contact settings.

[0120] In step S4002, perform thermal deformation solution control settings. In a specific embodiment, the solution control settings include adding constraint conditions to the static structure. Since only the thermal deformation of the structure around the instrument is considered, to simplify the solution process, add a fixed support to constrain all degrees of freedom of the instrument installation point.

[0121] In step S4003, apply the transient thermal results as a temperature load to the simulation model, perform thermal deformation simulation to obtain the thermal deformation results.

[0122] Through the above steps, the present invention can perform simulation analysis on the performance of automotive instruments or navigation, help design engineers evaluate whether the product meets the design requirements, provide directions for optimizing the product design, and thus improve the durability and reliability of the product.

[0123] Based on the above embodiment, the method for thermal deformation simulation analysis of automotive instruments in the present invention further includes:

[0124] S600, perform simulation analysis on the uniformity before and after deformation of the optical components in the automotive instrument sample to obtain the light uniformity of the optical components before and after deformation, so as to further analyze and judge the performance of the automotive instrument.

[0125] Specifically, the optical component in this embodiment is the glass in an automotive instrument sample. The simulation analysis of the uniformity before and after the deformation of the optical component includes obtaining the transient thermal result of the optical component and the thermal deformation result of the optical component. The transient thermal result and the thermal deformation result can be obtained based on the thermal simulation analysis of the simulation model, and then the optical uniformity can be analyzed based on the transient thermal result and the thermal deformation result, so as to obtain the optical uniformity of the optical component before and after the deformation.

[0126] According to another aspect of the present invention, there is provided an automotive instrument obtained by performing simulation optimization using the above-mentioned thermal deformation simulation analysis method for automotive instruments.

[0127] Those skilled in the art can understand that, on the premise of no conflict, the above-mentioned preferred solutions can be freely combined and superimposed. Among them, the flowcharts and block diagrams in the drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code, and this module, program segment, or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order from that marked in the drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, as well as the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions. The numbers assigned to the steps in this article are only for convenience of description and reference, and do not limit the order before and after. The specific execution order is determined by the technology itself, and those skilled in the art can determine various permitted and reasonable orders according to the technology itself.

[0128] It should be noted that in the present invention, step numbers (letter or number numbers) are used to refer to certain specific method steps only for the purpose of convenient description and brevity, and by no means to limit the order of these method steps by letters or numbers. Those skilled in the art can understand that the order of the relevant method steps should be determined by the technology itself and should not be unduly restricted by the existence of step numbers. Those skilled in the art can determine various permitted and reasonable step orders according to the technology itself.

[0129] Those skilled in the art can understand that, on the premise of no conflict, the above-mentioned preferred solutions can be freely combined and superimposed.

[0130] It should be understood that the above-described embodiments are merely exemplary and not restrictive. Without departing from the basic principles of the present invention, various obvious or equivalent modifications or substitutions that those skilled in the art can make to the above details will all be included within the scope of the claims of the present invention.

Claims

1. A method for simulating and analyzing the thermal deformation of an automotive instrument, characterized in that, Including: Step S100, obtaining the temperature change information and thermal deformation information of the automotive instrument sample during the test, where the automotive instrument sample is made based on the initial version model of the automotive instrument; Step S200, when the automotive instrument sample passes the test, preprocessing the corresponding initial version model of the automotive instrument and using the preprocessed initial version model of the automotive instrument as the simulation model; Step S300, performing thermal simulation on the simulation model to obtain the transient thermal results of the simulation model; Step S400, applying the transient thermal results as temperature loads to the simulation model to obtain the thermal deformation results of the simulation model; Step S500, result verification, where the result verification includes the first mutual verification and the second mutual verification. The first mutual verification is to compare the temperature change information with the transient thermal results. When the comparison difference is less than the set value, the first mutual verification passes; the second mutual verification is to compare the thermal deformation information with the thermal deformation results. When the comparison difference is less than the set value, the second mutual verification passes.

2. The method for simulating and analyzing the thermal deformation of an automotive instrument according to claim 1, characterized in that The preprocessing of the corresponding initial version model of the automotive instrument and using it as the simulation model in step S200 includes: Step S2001, importing the initial version model of the automotive instrument; Step S2002, simplifying the complex structure features in the initial version model of the automotive instrument to obtain a simplified model. The simplification includes deleting complex structure features, and the complex structure features include the mounting point structure features of the protruding part models in the initial version model of the automotive instrument, the connection features with a thermal conductivity lower than the set value, the structure features with a heat dissipation effect lower than the set value, and the pin structure features and packaging structure features of the chips; Step S2003, identifying the simplified model to obtain the simulation model.

3. The method for thermal deformation simulation analysis of an automotive instrument according to claim 2, wherein The connection features with a thermal conductivity lower than the set value include: the non-metal connection structures in the initial version model of the automotive instrument; The structure features with a heat dissipation effect lower than the set value include: the rounded corners of the part models in the initial version model of the automotive instrument, the perforations on the PCB board.

4. The method for simulating and analyzing the thermal deformation of an automotive instrument according to claim 2, wherein Step S2003, identifying the simplified model to obtain the simulation model, including: Selecting different identification categories based on different types of part models in the simplified model; Adjusting the positions of the identified part models so that the contact relationships between the part models are consistent with the contact relationships between the corresponding parts in the automotive instrument sample; When interference occurs between the part models, adjusting the part models, and using the adjusted model composed of multiple part models as the simulation model.

5. The method for simulating and analyzing the thermal deformation of an automotive instrument according to claim 1, characterized in that Step S300, performing thermal simulation on the simulation model to obtain the transient thermal results of each component in the simulation model, including: Step S3001, establishing a thermal simulation module and importing the simulation model into the thermal simulation module; Step S3002, performing temperature result solution control settings; Step S3003: Conduct thermal simulation to obtain the temperature results of the heat - generating components in the simulation model and save them. Step S3004: Establish a transient thermal module, import the simulation model into the geometric structure of the transient thermal module, and import the temperature results into the transient thermal module as the initial conditions for the transient - time temperature change of the heat - generating components. Step S3005: Conduct transient thermal solution control settings. Step S3006: Conduct transient thermal simulation to obtain the transient thermal results of the heat - generating components in the simulation model.

6. The method for thermal deformation simulation analysis of an automotive instrument according to claim 1, wherein Step S400: Apply the transient thermal results as temperature loads to the simulation model to obtain the thermal deformation results of the simulation model, including: Step S4001: Establish a static structure module, import the geometric structure, model, and engineering data in the transient thermal module into the static structure module, and import the transient thermal results as temperature loads into the static structure module. Step S4002: Conduct thermal deformation solution control settings. Step S4003: Apply the transient thermal results as temperature loads to the simulation model, conduct thermal deformation simulation to obtain the thermal deformation results.

7. The method for thermal deformation simulation analysis of an automotive instrument according to claim 8, wherein Step S4002: Conduct thermal deformation solution control settings, including: Set constraint conditions for the static structure, and the constraint conditions include adding fixed supports to constrain all degrees of freedom of the installation points in the simulation model.

8. The method for simulating and analyzing the thermal deformation of an automotive instrument according to claim 1, wherein, The method for thermal deformation simulation analysis of the automotive instrument further includes: S600: Conduct simulation analysis on the uniformity of the optical components in the automotive instrument sample before and after deformation to obtain the light uniformity of the optical components before and after deformation.

9. The method for simulating and analyzing the thermal deformation of an automotive instrument according to claim 1, wherein The temperature change information includes a first temperature change curve, which is obtained based on the change relationship between the temperature and time of each part in the automotive instrument sample during the test. The transient thermal results include a second temperature change curve, which is obtained based on the change relationship between the temperature and time of each part model in the simulation model.

10. An automotive instrument, characterized in that, Obtained after simulation optimization using the method for thermal deformation simulation analysis of an automotive instrument according to any one of claims 1 to 9.

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