Display panel, display device and preparation method of display panel

Abstract

According to the display panel, the display device and the preparation method of the display panel, the display panel comprises a substrate, metal lap joint layers, a side edge wiring layer and an adhesion layer, the substrate comprises a first surface, a second surface and a side face, the first surface and the second surface are oppositely arranged, the side face is connected with the first surface and the second surface, and the metal lap joint layers are arranged on the first surface and the second surface. The side wiring layer comprises terminal parts arranged on the first surface and the second surface and a connecting part arranged on the side surface, and the terminal parts are connected with the connecting part, so that the metal lap joint layer located on the first surface and the metal lap joint layer located on the second surface can be communicated through the side wiring layer; the adhesive layer is arranged on at least one of the metal lap joint layer of the first surface and the metal lap joint layer of the second surface and located between the terminal part and the metal lap joint layer, so that the metal lap joint layer and the terminal part can be bonded through the adhesive layer, the risk that the terminal part is torn off along with the protective film layer is reduced, and the service life of the protective film layer is prolonged. And the possibility that the side wiring layer falls off is reduced.

Description

Technical Field

[0001] This application belongs to the field of display technology, and particularly relates to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] With the increasing demand for narrow bezels and glass splicing technology, more and more research has been conducted on the side metal wiring process in double-sided manufacturing.

[0003] Currently, before depositing the side wiring material, a protective film layer can be provided on a part of the substrate corresponding to the display area to protect the display area. Subsequently, the side wiring material is deposited on the substrate, so that the side wiring material covers the metal overlap layer located in the edge area of the substrate and at least part of the protective film layer, and after the deposition is completed, the protective film layer and the side wiring material covering the protective film layer are torn off to form a side wiring layer.

[0004] However, during the above-mentioned film tearing process, the side wiring material covering the protective film layer may drive the side wiring material covering the metal overlap layer, causing the side wiring material covering the metal overlap layer to be torn off together, resulting in the detachment of the side wiring layer. Summary of the Invention

[0005] Embodiments of this application provide a display panel, a display device, and a method for manufacturing a display panel, which can reduce the possibility of detachment of the side wiring layer.

[0006] In a first aspect, embodiments of this application provide a display panel, including a substrate, a metal overlap layer, an adhesion layer, and a side wiring layer. The substrate includes a first surface, a second surface disposed opposite to each other, and a side surface connecting the first surface and the second surface; the metal overlap layer is disposed on the first surface and the second surface; the adhesion layer is disposed on at least one of the metal overlap layer on the first surface and the metal overlap layer on the second surface; the side wiring layer includes terminal portions disposed on the first surface and the second surface and a connecting portion disposed on the side surface, the terminal portions are connected to the connecting portion, and the adhesion layer is located between the terminal portion and the metal overlap layer.

[0007] In some embodiments, the adhesion layer includes an alloy material, and at least part of the adhesion layer is located in the metal overlap layer and / or the terminal portion;

[0008] Preferably, the adhesion layer includes at least two of tin, nickel, zinc, aluminum, titanium, lithium, copper, iron, gold, and silver.

[0009] In some embodiments, the adhesion layer is spaced apart from the substrate in a direction perpendicular to the substrate, and part of the metal overlap layer is located between the adhesion layer and the substrate;

[0010] Preferably, the thickness H1 of the metal overlap layer in a direction perpendicular to the substrate satisfies: H1 > 1um;

[0011] Preferably, the thickness H2 of the adhesion layer in the direction perpendicular to the substrate satisfies: 1 um < H2 ≤ 2.5 um.

[0012] In some embodiments, the area of the orthographic projection of the adhesion layer on the substrate is smaller than the area of the orthographic projection of the metal overlapping layer on the substrate;

[0013] Preferably, the area S of the orthographic projection of the adhesion layer on the substrate satisfies: 800 um 3 ≤ S ≤ 3000 um 3 ;

[0014] Preferably, the length L1 of the orthographic projection of the adhesion layer on the substrate satisfies: 40 um ≤ L1 ≤ 60 um, and the width L2 of the orthographic projection of the adhesion layer on the substrate satisfies: 20 um ≤ L2 ≤ 50 um.

[0015] In some embodiments, the display panel further includes a defining layer that covers the side of the metal overlapping layer facing away from the substrate and has an opening exposing a part of the metal overlapping layer, and the adhesion layer is located in the opening;

[0016] Preferably, the adhesion layer protrudes relative to the defining layer in the direction perpendicular to the substrate, and the thickness of the adhesion layer in the direction perpendicular to the substrate is greater than the depth of the opening in the direction perpendicular to the substrate;

[0017] Preferably, the defining layer is a photoresist layer.

[0018] In some embodiments, the adhesion layer includes at least one of conductive plastic, conductive rubber, and conductive adhesive;

[0019] Preferably, a groove is formed on the side of the metal overlapping layer facing away from the substrate, the adhesion layer is disposed in the groove, and the thickness of the adhesion layer in the direction perpendicular to the substrate is greater than or equal to the depth of the groove in the direction perpendicular to the substrate.

[0020] In a second aspect, an embodiment of the present application further provides a display device, including the display panel of any one of the above.

[0021] In a third aspect, an embodiment of the present application further provides a method for manufacturing a display panel, the manufacturing method including:

[0022] Providing a substrate, and forming a metal overlapping layer on the first surface and the second surface of the substrate;

[0023] Evaporating an adhesion material on at least one of the metal overlapping layer on the first surface and the metal overlapping layer on the second surface;

[0024] Forming a protective film layer on the first surface and the second surface;

[0025] Depositing a side wiring material, wherein the side wiring material covers the metal overlap layer, the adhesive material, the side surface of the substrate and at least a portion of the protective film layer;

[0026] At least the adhesive material is processed to form an adhesive layer;

[0027] The protective film layer and the side routing material covering the protective film layer are removed to form a side routing layer, wherein the side routing layer includes terminal portions arranged on the first surface and the second surface and a connecting portion arranged on the side, wherein the terminal portions are connected to the connecting portions, and the terminal portions are located on the side of the metal overlapping layer facing away from the substrate.

[0028] In some embodiments, at least the step of processing the adhesive material to form an adhesive layer comprises:

[0029] The display panel is heat treated, and the adhesive material is alloyed with the metal overlap layer and the side wiring material to form an adhesive layer.

[0030] In some embodiments, the step of depositing an adhesion material on at least one of the metal bonding layer on the first surface and the metal bonding layer on the second surface comprises:

[0031] Forming a limiting layer on at least one of the metal bonding layer on the first surface and the metal bonding layer on the second surface, and openings are formed on the limiting layer to expose a portion of the metal bonding layer;

[0032] Vapor-depositing an adhesive material on the limiting layer, wherein the adhesive material covers a side of the limiting layer facing away from the substrate and fills the opening;

[0033] The adhesive material covering the side of the defining layer facing away from the substrate is removed.

[0034] In the display panel, display device and display panel preparation method provided by the embodiments of the present application, the display panel includes a substrate, a metal overlap layer, a side wiring layer and an adhesive layer, the substrate includes a first surface, a second surface and a side connecting the first surface and the second surface which are arranged opposite to each other, the metal overlap layer is arranged on the first surface and the second surface, the side wiring layer includes a terminal portion arranged on the first surface and the second surface and a connecting portion arranged on the side, the terminal portion is connected to the connecting portion, so that the metal overlap layer located on the first surface and the metal overlap layer located on the second surface can be connected through the side wiring layer, and the adhesive layer is arranged on at least one of the metal overlap layer on the first surface and the metal overlap layer on the second surface, and is located between the terminal portion and the metal overlap layer, therefore, the metal overlap layer and the terminal portion can be bonded through the adhesive layer, thereby reducing the risk of the terminal portion being torn off together with the protective film layer, and reducing the possibility of the side wiring layer falling off. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0036] Figure 1 is a schematic structural diagram of a display panel provided by some embodiments of the present application;

[0037] Figure 2 is another schematic structural diagram of a display panel provided by some embodiments of the present application;

[0038] Figure 3 is a flowchart of a method for manufacturing a display panel provided by some embodiments of the present application;

[0039] Figure 4 is a schematic structural diagram corresponding to step S1 in the method for manufacturing a display panel provided by some embodiments of the present application;

[0040] Figure 5 is a schematic structural diagram corresponding to step S2 in the method for manufacturing a display panel provided by some embodiments of the present application;

[0041] Figure 6 is a schematic structural diagram corresponding to step S3 in the method for manufacturing a display panel provided by some embodiments of the present application;

[0042] Figure 7 is a schematic structural diagram corresponding to step S4 in the method for manufacturing a display panel provided by some embodiments of the present application;

[0043] Figure 8 is a schematic structural diagram corresponding to step S5 in the method for manufacturing a display panel provided by some embodiments of the present application;

[0044] Figure 9 is another schematic structural diagram corresponding to step S2 in the method for manufacturing a display panel provided by some embodiments of the present application. Detailed Embodiments

[0045] The following will describe in detail the features and exemplary embodiments of various aspects of the present application. To make the objectives, technical solutions, and advantages of the present application clearer and more understandable, the following further describes the present application in detail in combination with the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

[0046] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0047] In the process of depositing side-walking wiring material on the substrate to form a side-walking wiring layer, in order to prevent the side-walking wiring material from being deposited on the display area and affecting the display effect of the display area, a protective film layer can be pre-set on the display area to cover the entire display area and part of the edge area, and after the deposition of the side-walking wiring material is completed, the protective film layer and the side-walking wiring material deposited on the protective film layer are torn off to form the side-walking wiring layer.

[0048] However, since the side-walking wiring material is continuous, when the protective film layer and the side-walking wiring material on the protective film layer are torn off, the side-walking wiring material on the protective film layer may drive the side-walking wiring material on the metal overlap layer, causing at least part of the side-walking wiring material on the metal overlap layer to be torn off together, resulting in the detachment of the side-walking wiring layer.

[0049] To solve the above problems, embodiments of the present application provide a display panel, a display device and a method for manufacturing a display panel. The following describes the embodiments of the display panel, the display device and the method for manufacturing a display panel with reference to the accompanying drawings.

[0050] As Figure 1 shown, in a first aspect, embodiments of the present application provide a display panel 10, including a substrate 11, a metal overlap layer 12, an adhesion layer 13 and a side-walking wiring layer 14. The substrate 11 includes a first surface 15, a second surface 16 disposed opposite to each other, and a side surface 17 connecting the first surface 15 and the second surface 16; the metal overlap layer 12 is disposed on the first surface 15 and the second surface 16; the adhesion layer 13 is disposed on at least one of the metal overlap layer 12 on the first surface 15 and the metal overlap layer 12 on the second surface 16; the side-walking wiring layer 14 includes terminal portions 141 disposed on the first surface 15 and the second surface 16 and a connecting portion 142 disposed on the side surface 17. The terminal portions 141 are connected to the connecting portion 142, and the adhesion layer 13 is located between the terminal portions 141 and the metal overlap layer 12.

[0051] The display panel 10 includes a display area and a peripheral area. The display area refers to the area where an image can be displayed, and is provided with a plurality of light-emitting devices. The color light emitted by each light-emitting device includes a first color, a second color, or a third color, and the first color, the second color, and the third color can be the three primary colors (for example, red, green, and blue). The peripheral area is located at the edge of the display area and is used for routing and cannot display an image. The peripheral area can be provided on any one side or multiple sides of the display area, and the metal bonding layer 12 and the side routing layer 14 can be located in the peripheral area.

[0052] The substrate 11 can be a rigid substrate or a flexible substrate. When the substrate 11 is a rigid substrate, the substrate 11 can be a quartz substrate or a glass substrate. When the substrate 11 is a flexible substrate, the substrate 11 can be a polyimide film. This embodiment does not make specific limitations thereon.

[0053] Metal bonding layers 12 are provided on both the first surface 15 and the second surface 16 of the substrate 11. The adhesive layer 13 can be provided on the metal bonding layer 12 on the first surface 15, or the adhesive layer 13 can be provided on the metal bonding layer 12 on the second surface 16, or the adhesive layer 13 can also be provided on the metal bonding layers 12 on both the first surface 15 and the second surface 16 at the same time.

[0054] The side routing layer 14 includes terminal portions 141 provided on the first surface 15 and the second surface 16 and a connection portion 142 provided on the side surface 17. The terminal portion 141 located on the first surface 15 is provided on the side of the metal bonding layer 12 on the first surface 15 away from the substrate 11, and the terminal portion 141 located on the second surface 16 is provided on the side of the metal bonding layer 12 on the second surface 16 away from the substrate 11. And when the adhesive layer 13 is provided on the metal bonding layer 12 on the first surface 15 and / or the second surface 16, the adhesive layer 13 is located between the corresponding metal bonding layer 12 and the terminal portion 141. The terminal portion 141 is connected to the connection portion 142. Therefore, the metal bonding layer 12 on the first surface 15 and the metal bonding layer 12 on the second surface 16 can be connected through the side routing layer 14, so as to realize the electrical connection between the display panel 10 and an external circuit. This external circuit can be a driving circuit board, and the driving signal provided by the driving circuit board is transmitted to the display panel 10 through the side routing layer 14 to control the display area of the display panel 10 to display.

[0055] In the above solution, by providing the adhesion layer 13 on at least one of the metal bonding layers 12 on the first surface 15 and the metal bonding layers 12 on the second surface 16, and by positioning the adhesion layer 13 between the corresponding metal bonding layer 12 and the terminal portion 141, the adhesion layer 13 can bond the corresponding metal bonding layer 12 and the terminal portion 141, reducing the risk that the terminal portion 141 on the metal bonding layer 12 is torn off together with the protective film layer and decreasing the likelihood of detachment of the side-wiring layer 14.

[0056] Optionally, the metal bonding layer 12 may include a first bonding sub-layer and a second bonding sub-layer stacked in sequence in a direction perpendicular to the substrate 11. The first bonding sub-layer is located between the second bonding sub-layer and the substrate 11, and the first bonding sub-layer and the second bonding sub-layer may be connected to different devices respectively. For example, when the first surface 15 is on the light-emitting side of the display panel 10, the first bonding sub-layer and the second bonding sub-layer may be electrically connected to different components in the display area respectively to reduce signal crosstalk.

[0057] Please continue to refer to Figure 1 , in some embodiments, the adhesion layer 13 includes an alloy material, and at least a part of the adhesion layer 13 is located in the metal bonding layer 12 and / or the terminal portion 141.

[0058] At least a part of the adhesion layer 13 is located in the metal bonding layer 12 and / or the terminal portion 141. That is, the metal particles in the adhesion material of the adhesion layer 13 can penetrate into the metal bonding layer 12 and / or the terminal portion 141 during the alloying process and mix with the metal particles in the metal bonding layer 12 and / or the terminal portion 141 to form an alloy material. In other words, the alloy material can be formed by at least one of the metal bonding layer 12 and the terminal portion 141 and the adhesion material through the alloying process, and the alloy material may include at least one of the metal particles in the metal bonding layer 12 and the metal particles in the terminal portion 141 and the metal particles in the adhesion material.

[0059] In the above solution, by providing at least a part of the adhesion layer 13 in the metal bonding layer 12 and / or the terminal portion 141, the contact area between the adhesion layer 13 and the metal bonding layer 12 and the terminal portion 141 can be increased, the bonding effect of the adhesion layer 13 on the metal bonding layer 12 and the terminal portion 141 can be improved, and the risk that the terminal portion 141 on the metal bonding layer 12 is torn off together with the protective film layer can be further reduced.

[0060] Moreover, by setting the adhesion layer 13 to include an alloy material, and at least part of the adhesion layer 13 is located in the metal overlap layer 12 and / or the terminal portion 141, it is also possible to avoid the oxidation of the metal overlap layer 12 and the influence of the colloid remaining on the metal overlap layer 12 on the resistance conduction rate between the metal overlap layer 12 and the terminal portion 141 before forming the terminal portion 141 on the metal overlap layer 12, and improve the resistance conduction rate between the metal overlap layer 12 and the terminal portion 141.

[0061] It should be clear that the adhesion material refers to the material 21 located between the metal overlap layer 12 and the terminal portion 141 and before alloying with the metal overlap layer 12 and the terminal portion 141. The adhesion material can be any metal material 21 that can alloy with the metal overlap layer 12 and / or the terminal portion 141. The metal particles in the adhesion material are different from the metal particles in the metal overlap layer 12, and the metal particles in the adhesion material are also different from the metal particles in the terminal portion 141. Of course, the metal particles in the metal overlap layer 12 and the metal particles in the terminal portion 141 can be the same metal particles or different metal particles, which is not limited in this embodiment.

[0062] For example, when the alloy material of the adhesion layer 13 includes two metal particles, one of the two metal particles is the metal particle in the adhesion material, and the other is the metal particle in the metal overlap layer 12 and the terminal portion 141. At this time, the metal particles in the metal overlap layer 12 and the metal particles in the terminal portion 141 are the same metal particles; when the alloy material of the adhesion layer 13 includes three metal particles, the three metal particles can be the metal particle in the adhesion material, the metal particle in the metal overlap layer 12, and the metal particle in the terminal portion 141 respectively, or two of the three metal particles can be the metal particles in the adhesion material, and the remaining one is the metal particle in the metal overlap layer 12 and the terminal portion 141. At this time, the metal particles in the metal overlap layer 12 and the metal particles in the terminal portion 141 are the same metal particles.

[0063] Optionally, the adhesion material, the metal overlap layer 12, and the terminal portion 141 can each include at least one metal particle. That is to say, the metal particles in the adhesion material, the metal overlap layer 12, and the terminal portion 141 can be one or multiple, which is not limited in this embodiment.

[0064] Preferably, the adhesion layer 13 includes at least two of tin, nickel, zinc, aluminum, titanium, lithium, copper, iron, gold, and silver. That is to say, the alloy material of the adhesion layer 13 includes at least two of tin, nickel, zinc, aluminum, titanium, lithium, copper, iron, gold, and silver. For example, the alloy material of the adhesion layer 13 can be a tin-copper alloy material, or the alloy material of the adhesion layer 13 can also be an aluminum-copper alloy material or an alloy material of titanium, zinc, and copper, which is not limited in this embodiment.

[0065] In the above solution, by setting the adhesion layer 13 to include at least two of tin, nickel, zinc, aluminum, titanium, lithium, copper, iron, gold, and silver, alloy materials of the adhesion layer 13 are formed by selecting metal particles with better alloying effects, so as to improve the bonding effect of the adhesion layer 13 on the metal overlapping layer 12 and the terminal portion 141, and the process difficulty of alloying the adhesion material with the metal overlapping layer 12 and the terminal portion 141 respectively can be reduced.

[0066] In some embodiments, the adhesion layer 13 is spaced from the substrate 11 in a direction perpendicular to the substrate 11, and a part of the metal overlapping layer 12 is located between the adhesion layer 13 and the substrate 11, so that the adhesion layer 13 can be prevented from directly contacting the substrate 11, and the performance of the substrate 11 is prevented from being affected by the adhesion layer 13.

[0067] Preferably, the thickness H1 of the metal overlapping layer 12 in the direction perpendicular to the substrate 11 satisfies: H1 > 1 um. That is to say, the thickness H1 of the metal overlapping layer 12 in the direction perpendicular to the substrate 11 can be any value greater than 1 um, such as 1.1 um, 1.2 um, 1.4 um, 1.6 um, 1.9 um, 2.0 um, 2.2 um, etc. Thus, by reasonably setting the thickness of the metal overlapping layer 12, on the basis of ensuring the conduction rate between the metal overlapping layer 12 and the terminal portion 141, the size of the metal overlapping layer 12 can be reduced.

[0068] Preferably, the thickness H2 of the adhesion layer 13 in the direction perpendicular to the substrate 11 satisfies: 1 um < H2 ≤ 2.5 um. Thus, by reasonably setting the thickness of the adhesion layer 13, on the basis of ensuring the bonding effect of the adhesion layer 13 on the metal overlapping layer 12 and the terminal portion 141, the volume of the adhesion layer 13 can be prevented from being too large to affect the strength of the display panel 10.

[0069] In some embodiments, the area of the orthographic projection of the adhesion layer 13 on the substrate 11 is smaller than the area of the orthographic projection of the metal overlapping layer 12 on the substrate 11. At this time, a part of the terminal portion 141 can be conducted with the metal overlapping layer 12 through the adhesion layer 13, and the rest of the terminal portion 141 can directly contact the metal overlapping layer 12, so as to ensure the resistance conduction rate between the terminal portion 141 and the metal overlapping layer 12. And by reasonably setting the area of the adhesion layer 13, the volume of the adhesion layer 13 can be prevented from being too large to affect the strength of the display panel 10.

[0070] Preferably, the area S of the orthographic projection of the adhesion layer 13 on the substrate 11 satisfies: 800 um 3 ≤ S ≤ 3000 um 3 , so that the area of the orthographic projection of the adhesion layer 13 on the substrate 11 can be reasonably set.

[0071] Preferably, the length L1 of the orthographic projection of the adhesion layer 13 on the substrate 11 satisfies: 40um ≤ L1 ≤ 60um, and the width L2 of the orthographic projection of the adhesion layer 13 on the substrate 11 satisfies: 20um ≤ L2 ≤ 50um. Thus, by reasonably setting the length and width of the orthographic projection of the adhesion layer 13 on the substrate 11, the area of the orthographic projection of the adhesion layer 13 on the substrate 11 can be reasonably set, avoiding the influence on the bonding effect of the adhesion layer 13 on the metal overlapping layer 12 and the terminal portion 141 or the strength of the display panel 10 due to the excessive length or width dimension of the orthographic projection of the adhesion layer 13 on the substrate 11.

[0072] Please refer to Figure 2 , in some embodiments, the display panel 10 further includes a defining layer 18. The defining layer 18 covers the side of the metal overlapping layer 12 facing away from the substrate 11 and is formed with an opening exposing a part of the metal overlapping layer 12. The adhesion layer 13 is located in the opening, thereby avoiding the formation of the adhesion layer 13 in other areas of the display panel 10 and preventing the adhesion layer 13 from affecting the performance of other areas of the display panel 10.

[0073] Preferably, the adhesion layer 13 protrudes relative to the defining layer 18 in a direction perpendicular to the substrate 11, and the thickness H1 of the adhesion layer 13 in a direction perpendicular to the substrate 11 is greater than the depth of the opening in a direction perpendicular to the substrate 11. Therefore, when the side-walking wiring layer 14 covers the adhesion layer 13, the contact area between the adhesion layer 13 and the side-walking wiring layer 14 can be increased, improving the adhesion effect.

[0074] Preferably, the defining layer 18 is a photoresist layer to simplify the process difficulty of forming the defining layer 18.

[0075] Optionally, when the display panel 10 includes an inorganic layer such as a passivation layer, this inorganic layer can be used as the defining layer 18. Thus, there is no need to separately prepare the defining layer 18 in the display panel 10, which can reduce the process steps and the thickness of the display panel 10.

[0076] In some embodiments, the adhesion layer 13 includes at least one of conductive plastic, conductive rubber, and conductive adhesive. Therefore, the adhesion layer 13 can bond the metal overlapping layer 12 and the terminal portion 141. At the same time, the adhesion layer 13 can also conduct electricity between the metal overlapping layer 12 and the terminal portion 141 to ensure the resistance conduction rate between the metal overlapping layer 12 and the terminal portion 141 to a certain extent.

[0077] Preferably, a groove is formed on the side of the metal overlapping layer 12 facing away from the substrate 11, and the adhesion layer 13 is disposed in the groove. The thickness of the adhesion layer 13 in a direction perpendicular to the substrate 11 is greater than or equal to the depth of the groove in a direction perpendicular to the substrate 11, thereby increasing the contact area between the adhesion layer 13 and the metal overlapping layer 12 and the terminal portion 141 and improving the bonding effect.

[0078] In a second aspect, an embodiment of the present application further provides a display device, including the display panel 10 according to any one of the above. The display device may include a plurality of display panels 10, and the plurality of display panels 10 are spliced to form the display device. Since the display device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated herein one by one.

[0079] As Figure 3 shown, in a third aspect, an embodiment of the present application further provides a method for manufacturing a display panel 10, and the manufacturing method includes:

[0080] Please refer to Figure 4 , S1. Provide a substrate 11, and form a metal overlapping layer 12 on the first surface 15 and the second surface 16 of the substrate 11. One of the metal overlapping layers 12 on the first surface 15 and the metal overlapping layer 12 on the second surface 16 is used to connect the driving circuit board, and the other is used to connect the display devices in the display area of the display panel 10. For example, when the first surface 15 is on the light-emitting side of the display panel 10 and the second surface 16 is on the backlight side of the display panel 10, the metal overlapping layer 12 on the first surface 15 can connect the display devices in the display area, and the metal overlapping layer 12 on the second surface 16 can connect the driving circuit board.

[0081] Please refer to Figure 5 , S2. Evaporate an adhesion material 19 on at least one of the metal overlapping layer 12 on the first surface 15 and the metal overlapping layer 12 on the second surface 16. During the evaporation process, a mask plate can be used to block other areas of the display panel 10 and expose at least part of the metal overlapping layer 12, so that the adhesion material 19 can be evaporated onto the metal overlapping layer 12, while avoiding the adhesion material 19 affecting the performance of other areas of the display panel 10.

[0082] Please refer to Figure 6 , S3. Form a protective film layer 20 on the first surface 15 and the second surface 16. The protective film layer 20 can cover the display area and at least part of the edge area. The protective film layer 20 can cover part of the metal overlapping layer 12 and expose the remaining part of the metal overlapping layer 12, and the adhesion material 19 is located on the metal overlapping layer 12 exposed by the protective film layer 20.

[0083] Please refer to Figure 7, S4, depositing the side wiring material 21, the side wiring material 21 covers the metal overlap layer 12, the adhesive material 19, the side surface 17 of the substrate 11, and at least part of the protective film layer 20. During the deposition process, the side wiring material 21 can be deposited on the first surface 15 and the second surface 16 respectively, so that the side wiring material 21 covers the adhesive material 19, at least part of the protective film layer 20, and the part of the metal overlap layer 12 that is not covered by the protective film layer 20 and the adhesive material 19, and when the side wiring material 21 is deposited on the first surface 15 and the second surface 16, the side wiring material 21 can also be deposited on the side surface 17 of the substrate 11 and cover the side surface 17.

[0084] Please refer to Figure 8 , S5, at least the adhesive material 19 is processed to form the adhesive layer 13. The adhesive material 19 can be subjected to a heat treatment process to form the adhesive layer 13, or the adhesive material 19 can be subjected to a curing process to form the adhesive layer 13. After the deposition of the side wiring material 21 is completed, the adhesive material 19 is converted into the adhesive layer 13 by a heat treatment or a curing process, so that the metal bonding layer 12 and the corresponding side wiring material 21 are bonded by the adhesive layer 13. It should be clear that the adhesive material 19 can also be processed together with other materials to form the adhesive layer 13, which is not limited in this embodiment.

[0085] Please continue to refer to Figure 1 S6, tear off the protective film layer 20 and the side wiring material 21 covering the protective film layer 20 to form the side wiring layer 14, the side wiring layer 14 includes a terminal portion 141 disposed on the first surface 15 and the second surface 16 and a connecting portion 142 disposed on the side 17, the terminal portion 141 is connected to the connecting portion 142, and the terminal portion 141 is located on the side of the metal bonding layer 12 away from the substrate 11. After the metal bonding layer 12 and the side wiring material 21 located on the adhesive layer 13 are bonded by the adhesive layer 13, the protective film layer 20 and the side wiring material 21 located on the protective film layer 20 are torn off, at this time, the side wiring material 21 retained on the metal bonding layer 12 and the adhesive layer 13 forms the terminal portion 141 of the side wiring layer 14, and the side wiring material 21 located on the side 17 of the substrate 11 forms the connecting portion 142 of the side wiring layer 14.

[0086] Preferably, step S3 may include: forming a protective film layer 20 on the first surface 15 and the second surface 16, and the protective film layer 20 is spaced apart from the adhesive layer 13, thereby further reducing the risk of the side wiring material 21 on the protective film layer 20 being torn off together with the side wiring material 21 on the adhesive layer 13 when tearing the film.

[0087] In some embodiments, at least the step of processing the adhesive material 19 to form the adhesive layer 13 includes:

[0088] The heat-treated display panel 10, and the adhesion material 19 is alloyed with the metal bonding layer 12 and the side-walk trace material 21 respectively to form the adhesion layer 13.

[0089] In the above solution, the metal particles in the adhesion material 19 are alloyed with the metal particles in the metal bonding layer 12 and the metal particles in the side-walk trace material 21 respectively through a heat treatment process to bond the metal bonding layer 12 and the side-walk trace material 21 located on the adhesion material 19. Compared with bonding the metal bonding layer 12 and the side-walk trace material 21 through materials such as conductive glue, the bonding effect of the adhesion layer 13 formed by alloying is better.

[0090] Please refer to Figure 9 , in some embodiments, the step of vapor-depositing the adhesion material 19 on at least one of the metal bonding layer 12 on the first surface 15 and the metal bonding layer 12 on the second surface 16 includes:

[0091] A defining layer 18 is formed on at least one of the metal bonding layer 12 on the first surface 15 and the metal bonding layer 12 on the second surface 16, and an opening exposing a part of the metal bonding layer 12 is formed in the defining layer 18. The defining layer 18 may only cover the metal bonding layer 12, or the defining layer 18 may cover the entire first surface 15 and the second surface 16. An opening exposing a part of the metal bonding layer 12 may be formed in the defining layer 18, and the size of the opening corresponds to the size of the adhesion layer 13. The defining layer 18 may be a light-transmitting layer, so as to avoid affecting the light emission of the display panel 10.

[0092] The adhesion material 19 is vapor-deposited on the defining layer 18, and the adhesion material 19 covers the side of the defining layer 18 facing away from the substrate 11 and fills in the opening. The adhesion material 19 may be vapor-deposited on the side of the defining layer 18 facing away from the substrate 11 so that the adhesion material 19 covers the defining layer 18, and when the adhesion material 19 fills the opening, the vapor deposition of the adhesion material 19 is stopped.

[0093] The adhesion material 19 covering the side of the defining layer 18 facing away from the substrate 11 is removed. Laser cutting technology and edge grinding technology may be used to remove the adhesion material 19 covering the side of the defining layer 18 facing away from the substrate 11 to avoid the adhesion material 19 affecting the light emission effect of the display panel 10. It can be understood that during the process of removing the adhesion material 19, at least part of the defining layer 18 may be removed together with the adhesion material 19 to reduce the thickness of the display panel 10 and reduce the influence of the defining layer 18 on the light emission effect of the display panel 10.

[0094] As described above, this is only the specific implementation manner of the present application. Those skilled in the art can clearly understand that for the convenience and conciseness of description, the specific working processes of the systems, modules, and units described above can refer to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present application.

Claims

1. A display panel, characterized in that, Comprising: A substrate, including a first surface, a second surface disposed opposite to each other, and a side surface connecting the first surface and the second surface; A metal overlapping layer disposed on the first surface and the second surface; An adhesion layer disposed on at least one of the metal overlapping layer on the first surface and the metal overlapping layer on the second surface; A side-walking wiring layer, including terminal portions disposed on the first surface and the second surface and a connecting portion disposed on the side surface, the terminal portions connecting the connecting portion, and the adhesion layer being located between the terminal portions and the metal overlapping layer.

2. The display panel according to claim 1, wherein The adhesion layer includes an alloy material, and at least a part of the adhesion layer is located in the metal overlapping layer and / or the terminal portions; Preferably, the adhesion layer includes at least two of tin, nickel, zinc, aluminum, titanium, lithium, copper, iron, gold, and silver.

3. The display panel according to claim 2, wherein The adhesion layer is spaced apart from the substrate in a direction perpendicular to the substrate, and a part of the metal overlapping layer is located between the adhesion layer and the substrate; Preferably, the thickness H1 of the metal overlapping layer in a direction perpendicular to the substrate satisfies: H1 > 1 μm; Preferably, the thickness H2 of the adhesion layer in a direction perpendicular to the substrate satisfies: 1 μm < H2 ≤ 2.5 μm.

4. The display panel according to claim 1, wherein The area of the positive projection of the adhesion layer on the substrate is smaller than the area of the positive projection of the metal overlapping layer on the substrate; Preferably, the area S of the orthographic projection of the adhesion layer on the substrate satisfies: 800um 3 ≤S≤3000um 3 ; Preferably, the length L1 of the positive projection of the adhesion layer on the substrate satisfies: 40 μm ≤ L1 ≤ 60 μm, and the width L2 of the positive projection of the adhesion layer on the substrate satisfies: 20 μm ≤ L2 ≤ 50 μm.

5. The display panel according to claim 1, characterized in that, The display panel further includes a defining layer, the defining layer covering a side of the metal overlapping layer facing away from the substrate and having an opening exposing a part of the metal overlapping layer, and the adhesion layer is located in the opening; Preferably, the adhesion layer protrudes relative to the defining layer in a direction perpendicular to the substrate, and the thickness of the adhesion layer in a direction perpendicular to the substrate is greater than the depth of the opening in a direction perpendicular to the substrate; Preferably, the defining layer is a photoresist layer.

6. The display panel according to claim 1, characterized in that, The adhesion layer includes at least one of conductive plastic, conductive rubber, and conductive adhesive; Preferably, a groove is formed on a side of the metal overlapping layer facing away from the substrate, the adhesion layer is disposed in the groove, and the thickness of the adhesion layer in a direction perpendicular to the substrate is greater than or equal to the depth of the groove in a direction perpendicular to the substrate.

7. A display device, characterized in that, Including the display panel according to any one of claims 1-6.

8. A method for preparing a display panel, characterized in that, The preparation method includes: Providing a substrate and forming a metal overlapping layer on the first surface and the second surface of the substrate; Evaporating an adhesion material on at least one of the metal overlapping layer on the first surface and the metal overlapping layer on the second surface; Forming a protective film layer on the first surface and the second surface; Depositing a side-walking wiring material, the side-walking wiring material covering the metal overlapping layer, the adhesion material, the side surface of the substrate, and at least a part of the protective film layer; At least the adhesion material is processed to form an adhesion layer; Tear off the protective film layer and the side-walking wiring material covering the protective film layer to form a side-walking wiring layer. The side-walking wiring layer includes terminal portions disposed on the first surface and the second surface and a connecting portion disposed on the side surface. The terminal portions are connected to the connecting portion, and the terminal portions are located on the side of the metal overlapping layer away from the substrate.

9. The preparation method according to claim 8, wherein the step of forming the adhesion layer by treating at least the adhesion material includes: heat-treating the display panel, and alloying the adhesion material with the metal overlapping layer and the side-walking wiring material respectively to form the adhesion layer.

10. The preparation method according to claim 8, characterized in that, The step of depositing the adhesion material on at least one of the metal overlapping layers on the first surface and the metal overlapping layer on the second surface includes: forming a defining layer on at least one of the metal overlapping layers on the first surface and the metal overlapping layer on the second surface, and opening an opening in the defining layer to expose a part of the metal overlapping layer; evaporating the adhesion material on the defining layer, and the adhesion material covers the side of the defining layer away from the substrate and fills in the opening; removing the adhesion material covering the side of the defining layer away from the substrate.

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