Light-emitting device, preparation method of light-emitting device and display device

Abstract

The invention discloses a light-emitting device, a preparation method of the light-emitting device and a display device. The light emitting device includes: a mounting substrate including an electrical connection structure; the light-emitting unit is fixed on one side of the mounting substrate and comprises a packaging tube shell and a laser chip arranged in the packaging tube shell, and a conductive structure is arranged on one side, facing the mounting substrate, of the packaging tube shell; the light-emitting unit is electrically connected with the electric connection structure through the conductive structure; the packaging tube shell comprises a containing structure, a sealing cover plate and a plurality of discrete first airtight connection structures arranged between the containing structure and the sealing cover plate, and the adjacent first airtight connection structures make contact with each other based on the change of the forms of objects of the first airtight connection structures so as to seal the containing structure and the sealing cover plate. Based on the scheme, the overflow of the first airtight connection structure can be effectively reduced, so that the sealing holes are avoided or reduced, and the influence on the laser chip is avoided or reduced.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and particularly to a light-emitting device, a method for manufacturing the light-emitting device, and a display device. Background Art

[0002] With the rapid development of current laser technology, laser display technology has become the next-generation new display technology, and lasers have become an extremely important core display device. Currently, the development trend of lasers towards miniaturization is obvious, and the size of products is continuously decreasing. The accompanying problem is that the difficulty of sealing the lasers increases.

[0003] In related solutions, a preformed solder sheet is generally used for sealing. The problems with this are that when the solder sheet melts and pressure is applied, it is easy to overflow from the sealing area, resulting in insufficient solder in the welding area and forming welding voids; on the other hand, the overflow of the solder will also cause internal overflow and affect the internal light-emitting units.

[0004] Therefore, it is necessary to propose a new sealing method to improve the welding airtightness and prevent the solder from overflowing. Summary of the Invention

[0005] In a first aspect, the present application provides a light-emitting device, including:

[0006] A mounting substrate, including an electrical connection structure;

[0007] A light-emitting unit, fixed on one side of the mounting substrate, including a package housing and a laser chip disposed within the package housing. A conductive structure is disposed on the side of the package housing facing the mounting substrate; the light-emitting unit is electrically connected to the electrical connection structure through the conductive structure.

[0008] The package housing includes a receiving structure, a sealing cover plate, and a plurality of discrete first airtight connection structures disposed between the receiving structure and the sealing cover plate. Adjacent first airtight connection structures contact each other based on the change in their own physical forms to enclose the receiving structure and the sealing cover plate.

[0009] In a second aspect, the present application further provides a method for manufacturing a light-emitting device, which is used to manufacture the light-emitting device as described in the first aspect; the method includes:

[0010] Providing the laser chip, the receiving structure, the sealing cover plate, and the first airtight connection structures;

[0011] Disposing the laser chip within the receiving structure;

[0012] Connect the accommodating structure and the sealing cover plate based on a plurality of discrete first airtight connection structures, such that adjacent first airtight connection structures are in contact with each other to enclose the accommodating structure and the sealing cover plate, thereby forming the light-emitting unit;

[0013] Electrically connect the light-emitting unit to the mounting substrate.

[0014] In a third aspect, the present application further provides a display device, which includes the light-emitting device according to any one of the first aspect.

[0015] In the above solution, the light-emitting device provided by the present application seals the accommodating structure and the sealing cover plate through a plurality of discrete first airtight connection structures, thereby achieving the purpose of sealing the laser chip in the sealed package housing, such that the laser chip is isolated from the outside. The solution provided by the present application for enclosing the accommodating structure and the sealing cover plate through the first airtight connection structure can effectively reduce the overflow of the first airtight connection structure, thereby avoiding or reducing sealing holes, and avoiding or reducing the influence on the laser chip. Description of the Drawings

[0016] Figure 1 Schematic diagram of a laser structure in a related solution;

[0017] Figure 2 Another schematic diagram of a laser structure in a related solution;

[0018] Figure 3 Schematic diagram of a light-emitting device structure provided by one or more embodiments of the present application;

[0019] Figure 4 Another schematic diagram of a light-emitting device structure provided by one or more embodiments of the present application;

[0020] Figure 5 Another schematic diagram of a light-emitting device structure provided by one or more embodiments of the present application;

[0021] Figure 6 Schematic diagram of a sealing cover plate structure provided by one or more embodiments of the present application;

[0022] Figure 7 Another schematic diagram of a sealing cover plate structure provided by one or more embodiments of the present application;

[0023] Figure 8 Another schematic diagram of a sealing cover plate structure provided by one or more embodiments of the present application;

[0024] Figure 9 Schematic diagram of a process flow for a method of manufacturing a light-emitting device provided by one or more embodiments of the present application;

[0025] Figure 10 In the Figure 9 method shown, a schematic diagram of the detailed process of S903;

[0026] Figure 11 A schematic diagram of the process for manufacturing another display device provided by one or more embodiments of the present application;

[0027] Figure 12 A schematic diagram of another sealing cover structure provided by one or more embodiments of the present application;

[0028] Figure 13 A schematic diagram of another sealing cover structure provided by one or more embodiments of the present application;

[0029] Figure 14 A schematic diagram of a housing structure provided by one or more embodiments of the present application;

[0030] Figure 15 A schematic diagram of another housing structure provided by one or more embodiments of the present application;

[0031] Figure 16 A schematic diagram of a light-emitting unit structure provided by one or more embodiments of the present application;

[0032] Figure 17 A schematic diagram of another light-emitting device structure provided by one or more embodiments of the present application;

[0033] Figure 18 A schematic diagram of another light-emitting unit structure provided by one or more embodiments of the present application;

[0034] Figure 19 A schematic diagram of another sealing cover structure provided by one or more embodiments of the present application;

[0035] Figure 20 A schematic diagram of another sealing cover structure provided by one or more embodiments of the present application. Detailed implementation manners

[0036] To make the objectives and implementation manners of the present application clearer, the following will clearly and completely describe the exemplary implementation manners of the present application with reference to the accompanying drawings in the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0037] It should be noted that the brief description of the terms in the present application is only for facilitating the understanding of the subsequent described implementation manners, rather than intending to limit the implementation manners of the present application. Unless otherwise specified, these terms should be understood in their ordinary and general meanings.

[0038] The terms "first", "second", "third", etc. in the specification and claims of this application and the above drawings are used to distinguish similar or similar objects or entities, and do not necessarily mean to limit a specific order or sequence, unless otherwise noted. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances.

[0039] The terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover but not exclude inclusion, for example, a product or device comprising a list of components is not necessarily limited to all the components expressly listed but may include other components not expressly listed or inherent to such product or device.

[0040] With the rapid development of laser technology, laser display technology has become the next generation of new display technology, and lasers (light-emitting devices) have become extremely important core display components. As product demand upgrades, the trend of laser miniaturization is obvious, and the size of products is continuously reduced. As a result, the difficulty of laser sealing increases. Traditional welding airtight methods are difficult to achieve high airtightness levels and there are problems such as solder overflow and glass stress.

[0041] Figure 1 Figure 1 is a schematic diagram of a laser structure in a related scheme. Figure 1 As shown, the laser generally includes two parts: a mounting substrate 100 and a light emitting unit 200. The light emitting unit 200 may include a beam collimating element 201, a package shell 202, and a laser chip ( Figure 1 Not shown), steering components ( Figure 1 The packaging tube shell 202 includes a containing structure 2021 for containing the laser chip and the steering component and a sealing cover plate 2022. The sealing cover plate 2022 and the containing structure 2021 are connected to each other to form a sealed space.

[0042] The plurality of light-emitting units 200 are generally arranged at uniform intervals in the horizontal direction, and each light-emitting unit 200 corresponds to a beam collimating element 201. The laser chip and the steering component are fixed in the package tube shell 202 by low-temperature sintering of nano-metal slurry. The thermal conductivity and mechanical reliability of the laser chip at high temperatures after sintering are greatly improved. The steering component can fold the light beam emitted by the laser chip 90° vertically, and the reflected light beam passes through the sealing cover plate 2022 of the package tube shell 202, and finally collimated by the beam collimating element 201.

[0043] The laser chip is an active device that needs to be encapsulated in a dust-free and dry space. At the same time, it requires high airtightness to prevent water vapor and oxygen from entering, so as to ensure the reliability of the long-term normal operation of the laser. Gold-tin alloy solder is a commonly used brazing material in the hermetic packaging of the package shell 202, and it has strong advantages in terms of strength and wettability.

[0044] Figure 2 It is a schematic diagram of another laser structure in the related solution. As Figure 2 shown, generally, the gold-tin alloy solder is prepared into a preformed solder sheet 205. The thickness of the solder sheet 205 can be adjusted according to requirements, and the thickness of the solder sheet 205 is uniform. Among them, 203 represents the laser chip, and 204 represents the steering component.

[0045] When using the preformed solder sheet 205 for eutectic alloy sealing, it is usually required that the welding surface needs to be gold-plated. When the welding temperature gradually rises above the melting point of the solder, the solder melts and fills into the welding gap, and finally achieves airtightness. The solder sheet 205 is generally prefabricated at the sealing cover plate 2022 and contacts and heats with the accommodating structure 2021 during the welding process to complete the welding. Since after the solder sheet 205 melts, after applying a part of pressure, the solder in the molten state is extremely easy to overflow from the sealing area 300, resulting in insufficient solder in the welding area and forming welding voids; on the other hand, the overflow of the solder will also cause internal overflow and affect the internal laser chip 203.

[0046] Based on the above technical problems, the embodiments of the present application provide a light-emitting device. Figure 3 It is a schematic diagram of the structure of a light-emitting device provided by one or more embodiments of the present application. The light-emitting device includes:

[0047] An installation substrate 100, including an electrical connection structure; a light-emitting unit, fixed on one side of the installation substrate 100, including a package shell 202 and a laser chip disposed in the package shell 202. A conductive structure is disposed on the side of the package shell 202 facing the installation substrate 100; the light-emitting unit is electrically connected through the conductive structure and the electrical connection structure; the package shell 202 includes an accommodating structure 2021, a sealing cover plate 2022, and a plurality of discrete first airtight connection structures 2023 disposed between the accommodating structure 2021 and the sealing cover plate 2022. Adjacent first airtight connection structures 2023 contact each other based on the change of their own object forms to close the accommodating structure 2021 and the sealing cover plate 2022.

[0048] As Figure 3As shown, in the embodiment of the present application, the first airtight connection structure 2023 seals the accommodation structure 2021 and the sealing cover plate 2022. After forming the sealing structure, the laser chip 203 disposed in the packaging shell 202 is isolated from the outside world, which can ensure the long-term reliable operation of the light-emitting device. In the light-emitting device provided by the embodiment of the present application, the first airtight connection structure 2023 is a plurality of discrete structures, that is, the plurality of first airtight connection structures 2023 are in a relatively independent state, and each first airtight connection structure is an independent structure. Among them, the physical form of the first airtight connection structure 2023 may include solid state, liquid state, etc. After the plurality of discrete first airtight connection structures 2023 change from solid state to liquid state, the adjacent first airtight connection structures 2023 come into contact with each other based on their own shape changes, thereby achieving the purpose of sealing the accommodation structure 2021 and the sealing cover plate 2022.

[0049] Compared with the method of sealing the accommodation structure 2021 and the sealing cover plate 2022 by means of a prefabricated solder sheet 205 in the related solution, the embodiment of the present application can effectively prevent the formation of welding voids caused by the overflow of the first airtight connection structure 2023, improve airtightness, and in addition, can also prevent the laser chip from being affected because the overflow of the first airtight connection structure 2023 can be effectively prevented.

[0050] Figure 4 It is a schematic structural diagram of another light-emitting device provided by one or more embodiments of the present application. In some embodiments, the light-emitting device further includes: a second airtight connection structure 2024. In the direction perpendicular to the plane where the sealing cover plate 2022 is located, the first airtight connection structure 2023 and the second airtight connection structure 2024 at least partially overlap; the second airtight connection structure 2024 is disposed on the side of the sealing cover plate 2022 facing the packaging shell 202 and is located between the sealing cover plate 2022 and the first airtight connection structure 2023; and / or, the second airtight connection structure 2024 is disposed on the side of the packaging shell 202 facing the sealing cover plate 2022, and the second airtight connection structure 2024 is located between the first airtight connection structure 2023 and the packaging shell 202.

[0051] Figure 4 In the figure, the second airtight connection structure 2024 is exemplarily disposed on the side of the sealing cover plate 2022 facing the packaging shell 202. In some embodiments, the second airtight connection structure 2024 may be a coating structure, such as a metallization layer, etc. Specifically, it may be materials such as Ti / Pt / Au, Ni / Au, Cr\Au, etc. The first airtight connection structure 2023 may be disposed on the second airtight connection structure 2024, and the first airtight connection structure 2023 and the second airtight connection structure 2024 cooperate with each other to achieve the purpose of stably fixing the sealing cover plate 2022 and the accommodation structure 2021, and sealing the sealing cover plate 2022 and the accommodation structure 2021.

[0052] Figure 5 Another schematic structural diagram of a light-emitting device provided for one or more embodiments of the present application. In some embodiments, a sealing area 300 is respectively provided on one side of the accommodating structure 2021 facing the sealing cover plate 2022. The sealing area 300 is used to connect the first airtight connection structure 2023; in the direction perpendicular to the plane where the sealing cover plate 2022 is located, the sealing area 300 corresponding to the encapsulation housing 202 and the sealing cover plate 2022 at least partially overlaps.

[0053] As Figure 5 shown, a sealing area 300 is respectively provided on one side of the encapsulation housing 202 facing the sealing cover plate 2022. The sealing area 300 is used for fixedly connecting the first airtight connection structure 2023, that is, the first airtight connection structure 2023 completes the sealing of the sealing cover plate 2022 and the accommodating structure 2021 at the position corresponding to the sealing area 300. In some embodiments, the sealing area 300 can be insulated from the circuit structure in the light-emitting device, and at the position corresponding to the sealing area 300, the connection reliability between the first airtight connection structure 2023 and the sealing cover plate 2022 and the accommodating structure 2021 is stronger. For example, a scheme similar to that of Figure 4 the embodiment can be adopted, and specific settings can be made for the material, surface flatness, insulation, etc. at the position corresponding to the sealing area 300.

[0054] Based on the above scheme, more stable sealing of the encapsulation housing 202 and the sealing cover plate 2022 can be achieved.

[0055] Figure 6 A schematic structural diagram of a sealing cover plate provided for one or more embodiments of the present application. Figure 7 Another schematic structural diagram of a sealing cover plate provided for one or more embodiments of the present application. In some embodiments, the first airtight connection structure 2023 is prefabricated at the sealing area 300 corresponding to the sealing cover plate 2022. The prefabricated first airtight connection structure 2023 is a hemispherical structure, and there is a gap between two adjacent prefabricated hemispherical first airtight connection structures 2023.

[0056] As Figure 6 and Figure 7 shown, the first airtight connection structure 2023 can be a hemispherical metal solder ball, and the first airtight connection structure 2023 can be a gold-tin alloy material. There is a gap between adjacent metal solder balls prefabricated on the sealing cover plate 2022. The metal solder balls can change their own shapes under the action of pressure, extend in the direction between two adjacent metal solder balls and contact each other to achieve the purpose of sealing the sealing cover plate 2022 and the accommodating structure 2021. After being acted upon by pressure, the metal solder balls can present a disc shape.

[0057] In the above solution, different from the existing solution of welding through the solder tab 205, the metal solder balls are in contact with each other through extension to seal the accommodation structure 2021 and the sealing cover plate 2022, which can effectively prevent the solder balls from overflowing, thereby preventing the generation of welding voids and affecting the internal laser chip 203.

[0058] Figure 8 This is a schematic diagram of another sealing cover plate structure provided by one or more embodiments of the present application. In some embodiments, the sealing area 300 is an annular structure; the surface area of the annular sealing area 300 is S, the distance between the package housing 202 and the sealing cover plate 2022 is H, the number of hemispherical first airtight connection structures 2023 is m, and the radius of the hemispherical first airtight connection structure 2023 is r, satisfying:

[0059] As Figure 8 shown, in the embodiment of the present application, the hemispherical first airtight connection structure 2023 is used for eutectic welding to expand the unfilled area of the first airtight connection structure 2023. The first airtight connection structure 2023 can fill the welding area in the high-temperature molten state, so the airtight effect can be effectively guaranteed.

[0060] In the embodiment of the present application, the radius of the first airtight connection structure 2023, the distance between adjacent first airtight connection structures 2023, the pressure, and the thickness of the first airtight connection structure 2023 spread after welding are strongly correlated. Continuing to refer to Figure 8 , the outer side lengths of the theoretical sealing area 300 are L1 and L3 respectively, the inner side lengths are L2 and L4 respectively, and the distance between the package housing 202 and the sealing cover plate 2022 is H, that is, the thickness of the first airtight connection structure 2023 is ∪1. If the first airtight connection structure 2023 just fills the space corresponding to the sealing area 300 between the accommodation structure 2021 and the sealing cover plate 2022, the total volume V1 = S×H = (L1×L3 - L2×L4)×H. In an ideal situation, the total volume of the first airtight connection structure 2023 in the embodiment of the present application is equal to V1. Considering the insufficient accuracy of the total volume of the first airtight connection structure 2023, the total volume of the first airtight connection structure 2023 can be exemplarily set to be slightly larger than V1, for example, it can exceed V1 by within 10%. The radius of the first airtight connection structure 2023 is r, then the volume of a single spherical first airtight connection structure 2023 The volume of the hemispherical first airtight connection structure 2023 is Therefore, it can be set

[0061] Continuing to refer to Figure 8, in some embodiments, the sealing area 300 is an annular structure; the perimeter of the annular sealing area 300 is L, the number of hemispherical first airtight connection structures 2023 is m, the spacing between two adjacent hemispherical first airtight connection structures 2023 is a, and the radius of the hemispherical first airtight connection structure 2023 is r, satisfying: a×m = L.

[0062] As Figure 8 shown, the perimeter of the sealing area 300 is approximately L = L1 + L2 + L3 + L4, and the spacing between the centers of the adjacent first airtight connection structures 2023 on the side close to the sealing cover plate 2022 is m. In order to make the first airtight connection structures 2023 fill the sealing area 300, a×m = L.

[0063] From Equation and Equation a×m = L, it can be clearly seen that when confirming the spacing between the accommodating structure 2021 and the sealing cover plate 2022 (i.e., the thickness of the first airtight connection structure 2023 after closing the accommodating structure 2021 and the sealing cover plate 2022, hereinafter referred to as the sealing thickness) and the sealing area 300, the relationship between the number and radius parameters of the first airtight connection structures 2023 can be obtained. In the actual preparation process of the first airtight connection structures 2023, the radius value range of the first airtight connection structures 2023 is 5μm < r < 300μm.

[0064] The radius size of the first airtight connection structures 2023 mainly corresponds to different sealing thickness requirements. During the sealing process of the small-volume package shell 202, the required solder thickness is greater than or equal to 20μm and can also be less than or equal to 50μm. Correspondingly, the radius of the hemispherical first airtight connection structures 2023 can be greater than or equal to 40μm and can also be less than or equal to 100μm.

[0065] For the large-volume package shell 202, in order to increase the sealing strength and the contact area between the first airtight connection structures 2023 and the sealing cover plate 2022 and the accommodating structure 2021, the solder thickness can be greater than or equal to 50μm and can also be less than or equal to 100μm. In this case, the radius of the first airtight connection structures 2023 can be greater than or equal to 120μm and can also be less than or equal to 180μm. By adjusting the pressure parameter on the sealing cover plate 2022 and the spacing between the adjacent first airtight connection structures 2023, the ideal sealing thickness can be obtained. Among the radius parameters of the hemispherical first airtight connection structures 2023 that are greater than or equal to 40μm, less than or equal to 100μm, greater than or equal to 120μm, and less than or equal to 180μm, the pressure during the sealing process is at an appropriate level, and the ideal welding effect can be achieved. When sealing the first airtight connection structures 2023 made of gold-tin alloy material under these parameters, as the temperature increases, the diffusion of the first airtight connection structures 2023 will be more uniform and dense.

[0066] When the radius of the hemispherical first hermetic connection structure 2023 is greater than or equal to 5 μm and less than or equal to 40 μm, generally a small sealing contact area and a thin sealing thickness are required. In this case, it is easy to cause phenomena such as virtual soldering and false soldering of the solder joints in the sealing area 300, and the reliability and environmental adaptability are poor. Generally, for the package shell 202 of single-chip packaging, the size of the package shell 202 and the area of the sealing area 300 are relatively small, and it is more suitable to use the radius of this first hermetic connection structure 2023.

[0067] When the radius of the hemispherical first hermetic connection structure 2023 is greater than or equal to 200 μm and less than or equal to 300 μm, it is easy to cause overflow of the first hermetic connection structure 2023 during the sealing process, and parameters such as pressure and temperature curves need to be strictly controlled, which increases the sealing process difficulty. And due to the large radius of the first hermetic connection structure 2023, it is difficult to control the sealing thickness after sealing during the sealing process, resulting in uneven thickness of the first hermetic connection structure 2023. Due to the increase in the volume of the first hermetic connection structure 2023, its sealing cost will also be higher. For the sealing of large-size package shells 202, the sealing area 300 is relatively large, and the first hermetic connection structure 2023 can completely fill the sealing and welding area.

[0068] Based on the above embodiments, it can be seen that when the radius of the first hermetic connection structure 2023 is fixed, at a certain size of the package shell 202, the required sealing thickness can also be achieved by adjusting the number of the first hermetic connection structures 2023. Generally speaking, when the size of the package shell 202 is fixed, the smaller the radius of the first hermetic connection structure 2023, the more the number of the first hermetic connection structures 2023 required. When the number of the first hermetic connection structures 2023 is between 100 and 300, the number of the first hermetic connection structures 2023 is relatively small, and a first hermetic connection structure 2023 with a larger radius can be used for sealing.

[0069] For some small-size package shells 202, when the radius of the first hermetic connection structure 2023 is small, the number of the first hermetic connection structures 2023 will be between 4000 and 8000. Generally, in this case, the radius of the first hermetic connection structure 2023 is very small, the welding difficulty is large and the reliability is poor, so it is used less.

[0070] Preferably, the number of the first hermetic connection structures 2023 is generally in the range of 500 to 2000. At this number, a uniform sealing thickness can be obtained by adjusting the radius of the appropriate first hermetic connection structure 2023, and finally a suitable sealing effect can be obtained.

[0071] In some embodiments, the prefabricated first airtight connection structure 2023 is not limited to the hemispherical structure described in the above embodiments, and may also be other shaped structures, such as a cube, a cuboid, a sphere, an ellipsoid, a tetrahedron, etc., which will not be elaborated one by one in the embodiments of the present application.

[0072] Continue to refer to Figure 8 , if the first airtight connection structure 2023 happens to fill the space corresponding to the sealing area 300 between the accommodating structure 2021 and the sealing cover plate 2022, the total volume V1 = S×H = (L1×L3 - L2×L4)×H. In an ideal situation, the total volume of the first airtight connection structure 2023 in the embodiments of the present application is equal to V1. Considering the insufficient accuracy of the total volume of the first airtight connection structure 2023, the total volume of the first airtight connection structure 2023 can be exemplarily set to be slightly larger than V1, for example, it can exceed V1 by within 10%. Taking the first airtight connection structure with a spherical shape threshold as an example, if the radius of the first airtight connection structure 2023 is r, the volume of a single spherical first airtight connection structure 2023 Therefore, it can be set that The same applies to the prefabricated first airtight connection structures 2023 of other shapes, which will not be elaborated here too much.

[0073] Figure 9 FIG. is a schematic flowchart of a method for manufacturing a light-emitting device provided by one or more embodiments of the present application. This method is used to manufacture the light-emitting device according to any one of the above light-emitting device embodiments; this method includes:

[0074] S901. Provide a laser chip 203, an accommodating structure 2021, a sealing cover plate 2022, and a first airtight connection structure 2023.

[0075] S902. Place the laser chip 203 inside the accommodating structure 2021.

[0076] S903. Connect the accommodating structure 2021 and the sealing cover plate 2022 based on a plurality of discrete first airtight connection structures 2023, such that adjacent first airtight connection structures 2023 are in contact with each other to enclose the accommodating structure 2021 and the sealing cover plate 2022, forming a light-emitting unit 200.

[0077] S904. Electrically connect the light-emitting unit 200 to the mounting substrate 100.

[0078] In some embodiments, this method further includes;

[0079] Providing a second airtight connection structure 2024 on the side of the sealing cover plate 2022 facing the accommodating structure 2021.

[0080] In some embodiments, a first airtight connection structure 2023 is provided, including:

[0081] Connect the first airtight connection structure 2023 to the second airtight connection structure 2024.

[0082] Figure 10 For Figure 9 In the method shown, a detailed flowchart of S903. In some embodiments, S903 includes:

[0083] S1001. Heat a plurality of first airtight connection structures 2023 so that the first airtight connection structures 2023 are in a molten state.

[0084] S1002: Connect the first airtight connection structure 2023 to the accommodating structure 2021 and apply pressure to the first airtight connection structure 2023 so that adjacent first airtight connection structures 2023 are in contact with each other to enclose the accommodating structure 2021 and the sealing cover plate 2022.

[0085] Figure 11 A flowchart of a preparation method for another display device provided by one or more embodiments of the present application. In some embodiments, connecting the first airtight connection structure 2023 to the second airtight connection structure 2024 includes:

[0086] S1101. Determine the number of the first airtight connection structures 2023, the spacing between the plurality of first airtight connection structures 2023, and the radius of the first airtight connection structures 2023;

[0087] S1102. Based on the number of the first airtight connection structures 2023, the spacing between the plurality of first airtight connection structures 2023, and the radius of the first airtight connection structures 2023, connect the first airtight connection structures 2023 to the second airtight connection structure 2024.

[0088] The preparation process and working principle of the light-emitting device provided by the embodiments of the present application are exemplarily described below with reference to the accompanying drawings. It should be noted that the preparation methods exemplified in the embodiments of the present application are only for exemplary illustration, and the steps of some methods may be interchanged with each other. In the preparation methods exemplified in the embodiments of the present application, the preparation processes of all possible elements of the light-emitting device may not be described in detail. For those not exemplified, it should be considered that they are not described in detail for the sake of brevity.

[0089] First, a laser chip 203, an accommodating structure 2021, a sealing cover plate 2022, a first airtight connection structure 2023, and a second airtight connection structure 2024 are respectively provided.

[0090] A second airtight connection structure 2024 is provided on the side of the sealing cover plate 2022 facing the accommodating structure 2021 and corresponding to one side of the first airtight connection structure 2023 for connection, such as preparing a metallization layer, etc. The structure after preparation is as Figure 12 shown, Figure 12 which is a schematic diagram of another sealing cover plate structure provided by one or more embodiments of the present application.

[0091] The function of the sealing cover plate 2022 is mainly to form an encapsulation shell 202 with the accommodating structure 2021 to achieve the sealing of the internal laser chip 203. The material of the cover plate can generally be high-strength sapphire, but the material can also be quartz, ordinary glass, etc. There needs to be a metallization layer around the cover plate, and the rest is a light-transmitting area. The metal layer combines with the airtight connection structure to achieve a high airtight level.

[0092] Based on the size of the encapsulation shell 202, determine the number of the first airtight connection structures 2023, the spacing between the multiple first airtight connection structures 2023, and the radius of the first airtight connection structures 2023, and connect the first airtight connection structures 2023 to the second airtight connection structure 2024 based on the number of the first airtight connection structures 2023, the spacing between the multiple first airtight connection structures 2023, and the radius of the first airtight connection structures 2023. The structure after preparation is as Figure 13 shown, Figure 13 which is a schematic diagram of another sealing cover plate structure provided by one or more embodiments of the present application.

[0093] A laser chip 203 is arranged in the accommodating structure 2021, and components (or structures) such as a steering component 204 and a heat sink (not shown in the figure) are arranged. Among them, the laser chip 203 is used to emit a light beam, the steering component 204 is used to change the direction of the light beam, such as a reflecting mirror, etc., and the heat sink is used to conduct the heat generated by the laser chip 203. The structure after preparation is as Figure 14 shown, Figure 14 which is a schematic diagram of an accommodating structure provided by one or more embodiments of the present application.

[0094] Figure 15 which is a schematic diagram of an accommodating structure provided by one or more embodiments of the present application; continue to refer to Figure 14 and Figure 15, the side wall 208 of the accommodating structure 2021 can be formed using ceramic materials or metal alloy materials; the bottom inside the accommodating structure 2021 is the patching area for the laser chip 203, the steering component 204, etc. Considering the patching accuracy and heat dissipation effect, the flatness requirement for the bottom inside the accommodating structure 2021 is relatively high. Therefore, at least the bottom inside the accommodating structure 2021 generally uses materials with good heat dissipation such as oxygen-free copper and diamond. The bottom inside the accommodating structure 2021 and the side wall 208 of the accommodating structure 2021 are sintered to form the overall structure of the accommodating structure 2021. Both sides of the side wall 208 of the accommodating structure 2021 are step structures 206, and metal films are provided on both step structures 206, thereby realizing electrical connection to the bottom inside the accommodating structure 2021 and finally realizing electrical connection with the mounting substrate 100. The round holes 207 in the middle part between the two steps on both sides of the side wall 208 of the accommodating structure 2021 can be used as identification areas, and a global coordinate system is constructed through the two round holes 207 on both sides. The middle rectangular part is the circuit isolation area, making the electrical connections on both sides independent of each other. An identification area can be added to one side of the ceramic side wall of the accommodating structure 2021 for direction identification when mounting the mounting substrate 100.

[0095] The laser chip 203 can be welded to the heat sink through an eutectic process. Among them, the main materials of the heat sink are ALN (aluminum nitride), SiC (silicon carbide), etc. The waveguide size of the laser chip 203 in the first direction is small, making the beam quality of the output beam close to the diffraction limit while generating a relatively large divergence angle. Therefore, this direction is defined as the fast axis. According to the different waveguide layer sizes in the fast axis direction, the beam divergence angle is between 40° and 60°; the second direction corresponding to the laser chip 203 is the slow axis, the size of the active area is generally between 100μm and 500μm, the divergence angle is between 6° and 15°, and its beam quality is poor. Among them, the first direction and the second direction are perpendicular to each other.

[0096] The steering component 204 can reflect the optical path of the beam emitted by the laser chip 203 by 90° for light output. The material of the steering component 204 can be materials such as borosilicate glass, quartz, and silicon. An antireflection film can be provided on the surface of the steering component 204 to improve the reflectivity. Since the divergence angle of the laser chip 203 in the fast axis direction is relatively large, the steering component 204 can only reflect most of the beams emitted by the laser chip 203, and the other part of the beams do not form effective light but are emitted from the side of the steering component 204 to form stray light beams.

[0097] Figure 16A schematic diagram of a light-emitting unit structure provided for one or more embodiments of the present application. Align the prepared sealing cover plate 2022 with the accommodating structure 2021, and heat the first airtight connection structure 2023. Apply pressure to the sealing cover plate 2022. Under the action of the pressure, the first airtight connection structure 2023 changes its own shape to fill the sealing area 300, completing the sealing of the sealing cover plate 2022 and the accommodating structure 2021.

[0098] Electrically connect the light-emitting unit 200 to the mounting substrate 100. The prepared light-emitting device is as Figure 17 shown. Figure 17 A schematic diagram of another light-emitting device structure provided for one or more embodiments of the present application.

[0099] On the one hand, the mounting substrate 100 can fix the light-emitting unit 200. On the other hand, a printed circuit board can be arranged inside the mounting substrate 100 to realize the circuit interconnection function with the packaging case 202, and then electrically connect the laser chip 203 inside the packaging case 202. The packaging case 202 can be fixed to the mounting substrate 100 by the reflow soldering method of tin-silver-copper alloy, but the fixing method is not limited to reflow soldering, and can also be fixed by high-temperature pressing and sintering silver paste and copper paste. The material of the mounting substrate 100 can be metal materials such as oxygen-free copper and red copper.

[0100] In addition, a beam collimating element 201 needs to be provided on the sealing cover plate 2022 in the embodiments of the present application. Figure 18 A schematic diagram of another light-emitting unit structure provided for one or more embodiments of the present application.

[0101] The beam collimating element 201 is mainly used to process the divergence angle of the beam emitted by the laser chip 203. Therefore, the beam collimating element 201 needs to be designed and optimized according to the divergence angle of the laser chip 203 and the optical path parameters of the light-emitting device. The curvature of the beam collimating element 201 can be optimized according to the different characteristics of each light-emitting device, or the beam collimating element 201 can be optimized to have the same curvature according to the processing convenience and cost. The surface type of the beam collimating element 201 can be optimized to be an aspherical surface type or a free-form surface type, or a Fresnel structure can be used to realize the function of compressing the divergence angle.

[0102] The surface profile parameter optimization of the beam collimating element 201 has a strong correlation with the overall optical path of the beam. Therefore, in the light-emitting device, the positions of the laser chip 203, the steering component 204, and the spacing between the sealing cover plate 2022 and the accommodating structure 2021 all need to be within a reasonable tolerance range. The number of beam collimating elements 201 is the same as the number of light-emitting units 200. The installation method of the beam collimating element 201 can be fixed by dispensing glue at the four corner points, and the dispensing positions need to avoid the optically effective area. After the beam emitted by the laser chip 203 is reflected by the steering component 204, its fast axis direction is the short side direction of the beam collimating element 201, and the slow axis direction is the long side direction of the beam collimating element 201 (i.e., the transverse arrangement direction of the collimating unit).

[0103] After completing the enclosure of the accommodating structure 2021 and the sealing cover plate 2022, that is, the encapsulated light-emitting unit 200 can be peeled off again. After peeling the sealing cover plate 2022 and the accommodating structure 2021 again, the first airtight connection structure 2023 is as Figure 19 shown Figure 19 which is a schematic diagram of another sealing cover plate structure provided by one or more embodiments of the present application.

[0104] By observing the peeling of the sealing area 300, it can be clearly seen that the formation of intermetallic compounds at the position of the first airtight connection structure 2023, and its distribution shape is circular. Since the thickness of the intermetallic compounds at the position of the first airtight connection structure 2023 is thicker than that of other areas, it is possible to clearly observe that the area corresponding to the first airtight connection structure 2023 and the area where the solder is not filled show different colors.

[0105] In the embodiment of the present application, the first airtight connection structure 2023 can be prefabricated on a large scale in advance on the base material corresponding to the sealing cover plate 2022. Figure 20 which is a schematic diagram of another sealing cover plate structure provided by one or more embodiments of the present application. By setting the transmissive film layer, the high transmittance of the sealing cover plate 2022 is ensured. The cover plate is metallized by sputtering to form the second airtight connection structure 2024, and the first airtight connection structure 2023 is prefabricated. After all the processes are completed, the shape cutting is carried out again.

[0106] The embodiment of the present application also provides a display device, which includes the light-emitting device according to any one of the above light-emitting device embodiments.

[0107] The display device provided by the embodiment of the present application can achieve the same or at least similar technical effects as the above light-emitting device, and will not be elaborated here.

[0108] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0109] For the sake of explanation, the above description has been presented in connection with specific embodiments. However, the above exemplary discussions are not intended to be exhaustive or to limit the embodiments to the specific forms disclosed above. Many modifications and variations are possible in light of the above teachings. The selection and description of the embodiments are intended to best explain the principles and practical applications, thereby enabling those skilled in the art to best utilize the embodiments and various embodiments suitable for specific use considerations with various different deformations.

Claims

1. A light-emitting device, characterized in that, Comprising: An installation substrate, including an electrical connection structure; A light-emitting unit, fixed on one side of the installation substrate, including a packaging shell and a laser chip disposed in the packaging shell, and a conductive structure is disposed on one side of the packaging shell facing the installation substrate; the light-emitting unit is electrically connected to the electrical connection structure through the conductive structure; The packaging shell includes a containing structure, a sealing cover plate, and a plurality of discrete first airtight connection structures disposed between the containing structure and the sealing cover plate, and adjacent first airtight connection structures contact each other based on the change of their own object forms to close the containing structure and the sealing cover plate.

2. The light-emitting device according to claim 1, wherein, Further comprising: A second airtight connection structure, in a direction perpendicular to the plane where the sealing cover plate is located, at least a part of the first airtight connection structure overlaps with the second airtight connection structure; The second airtight connection structure is disposed on the side of the sealing cover plate facing the packaging shell and is located between the sealing cover plate and the first airtight connection structure; And / or, the second airtight connection structure is disposed on the side of the packaging shell facing the sealing cover plate, and the second airtight connection structure is located between the first airtight connection structure and the packaging shell.

3. The light-emitting device according to claim 1, wherein Sealing areas are respectively disposed on the surfaces of the containing structure and the sealing cover plate opposite to each other, and the sealing areas are used to connect the first airtight connection structures; in a direction perpendicular to the plane where the sealing cover plate is located, at least a part of the sealing areas of the packaging shell corresponding to the sealing cover plate overlap.

4. The light-emitting device according to claim 3, characterized in that, The first airtight connection structure is prefabricated at the sealing area corresponding to the sealing cover plate, and the prefabricated first airtight connection structure is a hemispherical structure, and a gap is left between two adjacent prefabricated hemispherical first airtight connection structures.

5. The light-emitting device according to claim 4, characterized in that, In a direction perpendicular to the plane where the installation substrate is located, the distance between the sealing cover plate and the containing structure is greater than or equal to 20 μm, and / or less than or equal to 50 μm, and the radius of the hemispherical first airtight connection structure is greater than or equal to 40 μm, and / or less than or equal to 100 μm.

6. The light-emitting device according to claim 4, wherein, In a direction perpendicular to the plane where the installation substrate is located, the distance between the sealing cover plate and the containing structure is greater than or equal to 50 μm, and / or less than or equal to 100 μm, and the radius of the hemispherical first airtight connection structure is greater than or equal to 120 μm, and / or less than or equal to 180 μm.

7. A method for preparing a light-emitting device, characterized in that, The method is used for preparing the light-emitting device according to any one of claims 1-6; the method includes: Providing the laser chip, the containing structure, the sealing cover plate, and the first airtight connection structure; Disposing the laser chip in the containing structure; Connecting the containing structure and the sealing cover plate based on a plurality of discrete first airtight connection structures, so that adjacent first airtight connection structures contact each other to close the containing structure and the sealing cover plate, forming the light-emitting unit; Electrically connecting the light-emitting unit to the installation substrate.

8. The method according to claim 7, wherein Further comprising; Disposing a second airtight connection structure on the side of the sealing cover plate facing the containing structure; Providing the first airtight connection structure, comprising: Connecting the first airtight connection structure to the second airtight connection structure; Connecting the accommodating structure and the sealing cover plate based on a plurality of discrete first airtight connection structures, such that adjacent first airtight connection structures contact each other to enclose the accommodating structure and the sealing cover plate, comprising: Heating a plurality of the first airtight connection structures such that the first airtight connection structures are in a molten state; Connecting the first airtight connection structure to the accommodating structure and applying pressure to the first airtight connection structure such that adjacent first airtight connection structures contact each other to enclose the accommodating structure and the sealing cover plate.

9. The method according to claim 8, wherein The connecting the first airtight connection structure to the second airtight connection structure comprises: Determining the number of the first airtight connection structures, the spacing between a plurality of the first airtight connection structures, and the radius of the first airtight connection structures; Connecting the first airtight connection structures to the second airtight connection structure based on the number of the first airtight connection structures, the spacing between a plurality of the first airtight connection structures, and the radius of the first airtight connection structures.

10. A display device, characterized in that, The display device comprises the light-emitting device according to any one of claims 1-6.

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