Resin molding apparatus and method for manufacturing resin molded article

Abstract

The resin molding apparatus includes: a molding die including a first die including a cartridge block and a second die disposed opposite to the first die; the mold closing mechanism is used for closing the forming mold; a position adjustment mechanism (20) that adjusts the position of the edge (Fa) of the release film (F) supplied to the first mold; and a control unit that controls the operation of the position adjustment mechanism (20). The position adjustment mechanism (20) comprises: columnar rollers (21, 22) for conveying the release film (F); and a sensor (23) that detects the position of the edge (Fa) of the mold release film (F), and the control unit is capable of executing control that tilts the columnar rollers (21, 22) about the conveyance direction (V) of the mold release film (F) on the basis of the detection result of the sensor (23) on the position of the edge (Fa) of the mold release film (F).

Description

Technical Field

[0001] The present disclosure relates to a resin molding apparatus and a method for manufacturing a resin molded product. Background Art

[0002] A substrate or the like on which a semiconductor chip is fixed is generally used as an electronic component by performing resin encapsulation. Conventionally, as a resin molding apparatus for resin-encapsulating a substrate or the like, a resin molding apparatus including a transfer molding die is known (for example, refer to Patent Document 1).

[0003] Patent Document 1 discloses a resin molding apparatus for transfer molding. In this resin molding apparatus, release films are respectively disposed on the molding surfaces of the upper die and the lower die. After the release films are disposed, a workpiece is clamped between the upper die and the lower die by closing the die. In this state, a molding material accommodated in a receiving cylinder to form a hole portion is supplied to the cavities of the upper die and the lower die in a molten state after being heated. Since the release films are disposed on the molding surfaces of the upper die and the lower die, the molten molding material does not directly contact the molding surfaces of the upper die and the lower die.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2022-129893 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] In Patent Document 1, the release films for the upper die and the lower die are respectively supplied by an upper die film supply mechanism and a lower die film supply mechanism. The upper die and lower die film supply mechanisms each have a film supply portion and a film winding portion, and the roll-shaped release film mounted on the film supply portion is conveyed to the film winding portion to supply the release film to the upper die and the lower die. However, when replacing the roll-shaped release film, changing the tension of the release film, etc., the position of the release film relative to the molding surface of the die may shift.

[0009] Therefore, there is a need for a resin molding apparatus and a method for manufacturing a resin molded product that can adjust the position of the release film supplied to the molding die.

[0010] Solutions to the Problems

[0011] One embodiment of the resin molding apparatus of the present disclosure includes: a molding die having a first die including a barrel block and a second die disposed opposite to the first die; a mold clamping mechanism for clamping the molding die; a position adjusting mechanism for adjusting the position of the edge of the release film supplied to the first die; and a control unit for controlling the operation of the position adjusting mechanism. The position adjusting mechanism includes: a columnar roller for conveying the release film; and a sensor for detecting the position of the edge of the release film. The control unit can perform control to tilt the columnar roller about the conveying direction of the release film based on the detection result of the position of the edge of the release film by the sensor.

[0012] One embodiment of the method for manufacturing a resin molded product of the present disclosure is a method for manufacturing a resin molded product using the resin molding apparatus described above, including: a film supply step of supplying the release film between the first die and the second die; a mold clamping step of clamping the molding die by the mold clamping mechanism; and a molding step of supplying a molding object and a resin material to the molding die to perform resin molding.

[0013] Advantages of the Invention

[0014] According to the embodiments of the present disclosure, a resin molding apparatus and a method for manufacturing a resin molded product capable of adjusting the position of the release film supplied to the molding die can be provided. Description of the Drawings

[0015] Figure 1 It is a schematic view showing a resin molding unit including the resin molding apparatus of the present embodiment.

[0016] Figure 2 It is a schematic view showing the configuration of the resin molding apparatus.

[0017] Figure 3 It is Figure 2 A sectional view taken along the line III-III of

[0018] Figure 4 It is a perspective view showing the position adjusting mechanism.

[0019] Figure 5 It is a front view showing the position adjusting mechanism.

[0020] Figure 6 It is a graph showing the relationship between the position of the edge of the release film and the output of the transmissive sensor.

[0021] Figure 7 It is a schematic view showing the configuration for adjusting the position of the release film. Detailed Description of the Embodiments

[0022] Hereinafter, embodiments of the resin molding apparatus and the method for manufacturing a resin molded product of the present disclosure will be described based on the drawings. However, the present disclosure is not limited to the following embodiments, and various modifications can be made without departing from the gist thereof.

[0023] A substrate (object to be molded), such as a semiconductor chip, is fixed and used as an electronic component by resin encapsulation. As a technique for resin encapsulating the object to be molded, a transfer method or the like can be cited. As one of the transfer methods, the following method can be cited: The object to be molded is placed on a release film adsorbed to the lower mold of the molding die, and a resin sheet (resin material) formed by solidifying powdery resin is supplied to the barrel of the molding die, heated and melted, and the molten resin is supplied to the cavity to perform resin molding on the object to be molded.

[0024] The resin sheet is formed of a solid resin obtained by compacting powdery resin and is melted by heating to become a liquid molten resin. The resin sheet can be a thermoplastic resin or a thermosetting resin. The viscosity of the thermosetting resin decreases when heated and polymerizes and cures when further heated to become a cured resin. As will be described below, in the case of resin molding and encapsulating a pre-molding substrate on which a semiconductor chip is fixed, it is desirable to use a thermosetting resin.

[0025] 〔Configuration of Resin Molding Unit〕

[0026] Hereinafter, the resin molding apparatus 30 of the transfer method will be described as an example. Figure 1 FIG. shows a plan view of a resin molding unit D including the resin molding apparatus 30 in the present embodiment. The resin molding unit D includes a molding module 3, a supply module 4, a control unit 6, and a conveying mechanism. The control unit 6 includes a processor such as a CPU (Central Processing Unit) and a storage device such as a RAM (Random Access Memory). The control unit 6 controls the operation of the resin molding unit D by the processor executing a control program stored in the storage device.

[0027] Unless otherwise specified, the operation of the resin molding unit D including the resin molding apparatus 30 described below is based on the operation instruction of the control unit 6. In the following description, the description of the operation instruction of the control unit 6 will be omitted in principle, and the operation instruction of the control unit 6 will be described as needed.

[0028] The molding module 3 has a resin molding device 30 for resin-encapsulating a pre-molding substrate Sa (an example of a molding object) fixed with a semiconductor chip, etc. The resin molding device 30 performs resin encapsulation while holding the pre-molding substrate Sa using a molding die C to mold a post-molding substrate Sb (an example of a resin molded product). In the resin molding unit D, a plurality of molding modules 3 are provided (two in the present embodiment), and each molding module 3 can be independently attached or detached. The detailed structure of the resin molding device 30 will be described below. It should be noted that in the resin molding unit D, the molding module 3 can be one or more than three.

[0029] The supply module 4 is used to supply the pre-molding substrate Sa and the resin tablet T (an example of resin material) to the molding module 3, and to accommodate the post-molding substrate Sb from the molding module 3. The supply module 4 includes a substrate supply mechanism 43, a substrate arrangement mechanism 44, a resin supply mechanism 45, and a substrate accommodation portion 46. The loader 41 and the unloader 42 included in the conveying mechanism are on standby in the supply module 4. The substrate supply mechanism 43 delivers the stored pre-molding substrate Sa to the substrate arrangement mechanism 44. A plurality of semiconductor chips are fixed to the pre-molding substrate Sa in a state of being arranged longitudinally and / or transversely. The substrate arrangement mechanism 44 makes the pre-molding substrate Sa delivered from the substrate supply mechanism 43 suitable for conveying. The resin supply mechanism 45 stores the resin tablet T and configures the resin tablet T to be suitable for conveying. It should be noted that the pre-molding substrate Sa can also be fixed with a semiconductor chip.

[0030] The conveying mechanism includes: a loader 41 for conveying a pre-molding substrate Sa and a resin tablet T fixed with semiconductor chips and the like before resin encapsulation; and an unloader 42 for conveying a post-molding substrate Sb after resin encapsulation. The loader 41 can receive the pre-molding substrate Sa from the substrate arrangement mechanism 44, and can also receive the resin tablet T from the resin supply mechanism 45, and move from the supply module 4 to each molding module 3 on the track, thereby handing over the pre-molding substrate Sa and the resin tablet T to the molding mold C (lower mold LM) of each molding module 3. The unloader 42 can take out the post-molding substrate Sb from the molding module 3, and move from each molding module 3 to the substrate receiving section 46 on the track, thereby receiving the post-molding substrate Sb in the substrate receiving section 46. In the post-molding substrate Sb, semiconductor chips and the like are encapsulated with a solidified resin obtained by solidifying a molten resin Ta (hereinafter referred to as "molten resin") (an example of a resin material) melted by heating the resin tablet T. It should be noted that the substrate storage section 46 may be arranged on the opposite side of the supply module 4 across the molding module 3 , and the arrangement of the mechanisms constituting the supply module 4 is not particularly limited.

[0031] [Configuration of resin molding device]

[0032] Figure 2 Figure 30 in this embodiment shows a resin molding apparatus 30. The resin molding apparatus 30 includes: a fixed frame 3A, which is placed on a horizontal plane and fixed in a stationary state by gravity; a molding die C, which is supported by the fixed frame 3A; a movable platen 34, which is supported by the fixed frame 3A; a mold clamping mechanism 35, which moves the movable platen 34 to clamp the molding die C; and a release film supply mechanism 1, which supplies a release film F to the molding die C. It should be noted that "being supported by the fixed frame 3A" means being directly or indirectly supported by the fixed frame 3A in a state where it can move relative to the fixed frame 3A. The same applies hereinafter.

[0033] The fixed frame 3A has a lower fixed disk 31 and an upper fixed disk 33 that are rectangular in a top view. The frame body connected by a plurality of tie-bars (not shown) or plate-like members (not shown) is covered by a cover 32. A movable platen 34 that is rectangular in a top view is provided between the lower fixed disk 31 and the upper fixed disk 33. The molding die C has an upper die UM (an example of a second die) and a lower die LM (an example of a first die). The upper die UM and the lower die LM are composed of molds arranged opposite to each other. Heaters (not shown) are built into the upper die UM and the lower die LM, and the pre-molding substrate Sa and the resin sheet T supplied to the molding die C can be heated by the heaters.

[0034] The movable platen 34 can move up and down along the tie-bars or plate-like members of the fixed frame 3A, so that the lower die LM moves up and down, causing a displacement in the relative position between the lower die LM and the upper die UM. A mold clamping mechanism 35 for moving the movable platen 34 up and down is provided on the lower fixed disk 31. The mold clamping mechanism 35 is composed of, for example, a combination of a servo motor and a ball screw, a combination of a hydraulic cylinder and a link mechanism, etc. The mold clamping mechanism 35 can clamp the molding die C by moving the movable platen 34 upward, and open the molding die C by moving the movable platen 34 downward. The operation of the mold clamping mechanism 35 is controlled by a control unit 6.

[0035] 〔Configuration of the molding die〕

[0036] Figure 3 Figure 30 shows the configuration of the molding die C used in the resin molding apparatus 30. The molding die C has: an upper die UM, which includes an upper mold cavity block 80 (an example of a mold cavity block) in which an upper mold cavity MCa for injecting molten resin Ta is formed; and a lower die LM, which is arranged opposite to the upper die UM and is provided with a resin injection mechanism 7 for injecting molten resin Ta into the upper mold cavity MCa. The lower die LM in this embodiment has a lower mold cavity block 70 (an example of a mold cavity block). A lower mold cavity MCb for injecting molten resin Ta from the upper mold cavity MCa through a resin flow hole (not shown) provided in the pre-molding substrate Sa is formed in the lower mold cavity block 70.

[0037] The upper mold UM is fixed to the upper fixing plate 33. The upper mold UM includes an upper mold cavity block 80, an upper mold retainer 81, an upper mold base plate 82, ejector pins 83, an ejector plate 84, an upper mold elastic member 85, and return pins 86. The upper mold retainer 81 is mounted on the upper fixing plate 33. The ejector plate 84 is mounted on the upper fixing plate 33 via the upper mold elastic member 85 passing through the upper mold retainer 81, etc., and has a plurality of ejector pins 83 and return pins 86. The plurality of ejector pins 83 are used to demold the formed substrate Sb from the upper mold UM. The plurality of ejector pins 83 penetrate through the required parts of the upper mold base plate 82 and the upper mold cavity block 80, and can be arranged to lift and lower integrally with the ejector plate 84 relative to the upper mold base plate 82 and the upper mold cavity block 80. The upper mold base plate 82 is disposed between the upper mold cavity block 80 and the ejector plate 84, contacts the upper mold cavity block 80, and is separated from the ejector plate 84. The upper mold cavity block 80 is assembled to the upper mold retainer 81 via the upper mold base plate 82. The upper mold cavity block 80 has an upper mold cavity MCa that accommodates the chip 13 of the substrate Sa before molding and into which the molten resin Ta is injected.

[0038] The return pins 86 are arranged to contact the outside of the placement area of the substrate Sa before molding in the lower mold cavity block 70. The return pins 86 contact the lower mold cavity block 70 when the molding die C is closed, and rise together with the ejector plate 84 relative to the upper mold cavity block 80. Thus, at the time of closing the mold, the ejector pins 83 are in a state of retracting into the surface of the upper mold cavity MCa. On the other hand, at the time of opening the mold, as the lower mold LM descends, the ejector plate 84 descends relative to the upper mold cavity block 80 by the elastic force of the upper mold elastic member 85, and the ejector pins 83 demold the formed substrate Sb from the upper mold UM.

[0039] A concave space 87 and a gate 88 are formed in the upper mold cavity block 80 of the upper mold UM. The concave space 87 and the gate 88 connect to form the knockout part 71b, the runner 71c, and the gate 71d of the cartridge block 71 of the resin injection mechanism 7 adjacent to the lower mold cavity block 70 and the upper mold cavity MCa. That is, between the upper mold cavity block 80 and the cartridge block 71, there are formed the knockout part 71b, the runner 71c, the gate 71d, the concave space 87, and the gate 88 as a resin flow path for the molten resin Ta to flow from the cartridge 71a toward the upper mold cavity MCa. The configuration of the resin injection mechanism 7 will be described below.

[0040] The lower mold LM is held by the lower mold holder 75, and the lower mold holder 75 is fixed to the movable platen 34 that is lifted and lowered by the mold clamping mechanism 35. In addition, the lower mold cavity block 70 of the lower mold LM is assembled to the lower mold holder 75 via the lower mold base plate 76. The mold clamping mechanism 35 in the present embodiment can be, for example, a mechanism that combines a servo motor and a ball screw mechanism, a mechanism that combines a cylinder, a hydraulic cylinder, and a rod, etc. In addition, a plurality of suction holes 77 for sucking air through a vacuum pump or the like are provided in the lower mold cavity block 70 to adsorb the release film F and the pre-formed substrate Sa to the mold surface. The film holes 78 for adsorbing the pre-formed substrate Sa to the mold surface by the air suction from the suction holes 77 are formed in the release film F. Hereinafter, the suction hole 77a (an example of a suction hole) in the suction holes 77 for adsorbing the pre-formed substrate Sa will be referred to as the substrate suction hole 77a. The substrate suction hole 77a communicates with the film hole 78 of the release film F. The inner diameter of the film hole 78 is larger than the inner diameter of the substrate suction hole 77a (refer to Figure 3 for the enlarged view).

[0041] 〔Configuration of resin injection mechanism〕

[0042] The resin injection mechanism 7 of the present embodiment is of the edge gate type and includes: a barrel block 71 in which a barrel 71a for accommodating the resin sheet T is formed; and a transfer mechanism 72 having a plunger 72a provided in the barrel 71a. It should be noted that the barrel 71a is formed by, for example, a cylindrical member 73. The cylindrical member 73 is fitted into a through hole formed in the barrel block 71.

[0043] The barrel block 71 is elastically supported by an elastic member 74 so as to be able to move up and down relative to the lower mold LM. That is, the barrel block 71 is configured to be able to move up and down relative to the lower mold LM through the elastic member 74. The elastic member 74 is provided on the lower side of the barrel block 71 and presses the barrel block 71 in a direction away from the lower mold LM.

[0044] In addition, a protruding portion 71A that protrudes upward from the upper surface of the barrel block 71, that is, toward the mold surface, is formed at the upper end portion of the barrel block 71. The protruding portion 71A protrudes in a state where it can press the barrel side end portion of the opposing pre-formed substrate Sa. Moreover, a knockout portion 71b, a runner 71c, and a gate 71d, which are resin flow paths for guiding the molten resin Ta injected from the barrel 71a to the upper mold cavity MCa of the upper mold cavity block 80, are formed on the upper surface of the barrel block 71. In a state where the upper mold UM and the lower mold LM are clamped, the upper surface of the protruding portion 71A contacts the concave space 87 of the upper mold cavity block 80, and the pre-formed substrate Sa is sandwiched between the lower surface of the protruding portion 71A and the mold surface of the lower mold cavity block 70.

[0045] The transfer mechanism 72 moves the plunger 72a in the state where the upper mold UM and the lower mold LM are clamped together to inject the molten resin Ta from the barrel 71a into the upper mold cavity MCa. The transfer mechanism 72 includes: a plunger 72a disposed inside the barrel 71a for pressing the molten resin Ta; a fixing block 72b that fixes the plunger 72a; and a plunger driving mechanism 72c that moves the plunger 72a via the fixing block 72b. The operation of the plunger driving mechanism 72c is controlled by the control unit 6.

[0046] The fixing block 72b has a substantially rectangular parallelepiped shape, and a plurality of plungers 72a are linearly fixed in a row on the rectangular surface (upper surface) of the fixing block 72b. It should be noted that the plurality of plungers 72a are fixed to the fixing block 72b by fixing screws or the like, for example. In addition, an equal-pressure mechanism using an elastic member or the like for making the pressure of injecting the molten resin Ta by each plunger 72a uniform may be provided in the fixing block 72b.

[0047] The plunger driving mechanism 72c moves the fixing block 72b up and down relative to the lower mold LM to move the plurality of plungers 72a up and down relative to the plurality of barrels 71a with the same moving amount uniformly. The plunger driving mechanism 72c of the present embodiment is disposed on the lower side of the fixing block 72b. As the plunger driving mechanism 72c, for example, a mechanism combining a servo motor and a ball screw mechanism, a mechanism combining a cylinder, a hydraulic cylinder and a rod, or the like can be used.

[0048] When the upper mold UM and the lower mold LM are clamped by the clamping mechanism 35, the resin flow path composed of the rejection portion 71b, the runner 71c, the gate 71d, the concave space 87, and the gate 88 connects the plurality of barrels 71a and the upper mold cavity MCa, and the upper mold cavity MCa is connected to the lower mold cavity MCb via an unillustrated resin flow hole provided in the pre-molding substrate Sa. In addition, when the upper mold UM and the lower mold LM are clamped, the barrel-side end portion of the pre-molding substrate Sa is sandwiched between the lower surface of the protruding portion 71A of the barrel block 71 and the mold surface of the lower mold LM. When the plunger 72a is raised by the plunger driving mechanism 72c in this state to inject the molten resin Ta into the upper mold cavity MCa and the lower mold cavity MCb, the chip 13 or the like on the pre-molding substrate Sa is encapsulated with resin.

[0049] 〔Configuration of the release film supply mechanism〕

[0050] The release film supply mechanism 1 supplies the release film F between the upper mold UM and the lower mold LM. As the material of the release film F, a resin material having characteristics such as heat resistance, releasability, softness, and stretchability can be used. For example, PTFE (polytetrafluoroethylene), ETFE (ethylene / tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene / hexafluoropropylene copolymer), polypropylene, polystyrene, polyvinylidene chloride, or the like can be used.

[0051] As Figure 2 shown, the demolding film supply mechanism 1 has: a feeding mechanism 11 for feeding the demolding film F; a film conveying mechanism 8 for conveying the demolding film F; a recovery mechanism 12 for recovering the demolding film F; and a position adjusting mechanism 20 disposed between the feeding mechanism 11 and the molding die C on the conveying path of the demolding film F. The feeding mechanism 11 can feed the demolding film F before use between the upper die UM and the lower die LM, and the recovery mechanism 12 can recover the demolding film F after use for resin molding. The operation of the demolding film supply mechanism 1 is controlled by the control unit 6.

[0052] The feeding mechanism 11 can feed the demolding film F before use between the upper die UM and the lower die LM and fix it to the fixing frame 3A. The feeding mechanism 11 in the present embodiment includes: a feeding roller 11a for feeding the demolding film F wound around the reel before use; and a motor (not shown) for rotationally driving the feeding roller 11a. The feeding roller 11a is accommodated in an openable and closable housing 11b. The feeding mechanism 11 including the housing 11b is fixed to the side of the fixing frame 3A outside the fixing frame 3A. It should be noted that "fixed to the fixing frame 3A" means a state of being directly or indirectly supported by the fixing frame 3A so as not to be able to perform relative movement with respect to the fixing frame 3A. The same applies hereinafter.

[0053] The film conveying mechanism 8 includes a pinch roller for pressing and holding the demolding film F and a conveying motor (not shown). The pinch roller includes: a conveying roller 8a that rotates by the driving force of the conveying motor to adjust the conveying speed of the demolding film F; and a pressing roller 8b that presses the demolding film F toward the conveying roller 8a. The film conveying mechanism 8 is rotatably fixed to the fixing frame 3A on the side of the recovery mechanism 12 on the conveying path of the demolding film F. The control unit 6 controls the torque of the conveying motor in the film conveying mechanism 8, whereby the demolding film F is fed in the conveying direction V (the direction from the feeding mechanism 11 toward the recovery mechanism 12).

[0054] The recycling mechanism 12 can recycle the used release film F for resin molding, and the recycling mechanism 12 is fixed to the fixed frame 3A. The recycling mechanism 12 in the present embodiment includes: a recycling roller 12a that winds the used release film F around a reel for recycling; and a motor (not shown) that rotationally drives the recycling roller 12a. The recycling roller 12a is accommodated in an openable and closable housing 12b. The recycling mechanism 12 including the housing 12b is fixed to the side of the fixed frame 3A on the opposite side of the feeding mechanism 11 outside the fixed frame 3A. When feeding the release film F, the control unit 6 applies an appropriate tension to the release film F by controlling the torque of the motors in the feeding mechanism 11 and the recycling mechanism 12. It should be noted that the method of applying tension to the release film F is not limited to torque control. For example, tension can also be applied by controlling the rotation speed of the feeding roller 11a so that the difference between the conveying speed of the film conveying mechanism 8 for the release film F and the feeding speed of the feeding mechanism 11 for the release film F becomes a specified speed difference.

[0055] 〔Configuration of the Position Adjustment Mechanism〕

[0056] Next, use Figures 2 to 7 to describe the position adjustment mechanism 20. As Figure 2 , Figure 3 shown, the position adjustment mechanism 20 is a mechanism that adjusts the release film F to a specified position of the lower mold LM when the release film F is not supplied to the specified position of the lower mold LM. The specified position of the lower mold LM refers to a position where, when the molding die C is in the closed state and the molten resin Ta is supplied to the lower mold cavity MCb, the molten resin Ta does not adhere to the mold surface of the lower mold LM. Specifically, the edge Fa of the release film F on the side closer to the barrel block 71 among the two edges of the release film F supplied to the lower mold LM (the two edges in the direction perpendicular to the conveying direction V of the release film F) is located between the boundary B between the barrel block 71 and the lower mold cavity block 70 and the substrate suction hole 77a on the side closer to the barrel block 71 among the substrate suction holes 77a formed on both sides of the lower mold cavity MCb of the lower mold cavity block 70 (refer to the enlarged view in Figure 3 ). When the release film F is at the specified position of the lower mold LM, the film holes 78 of the release film F communicate with the substrate suction holes 77a. The substrate suction hole 77a on the side closer to the barrel block 71 is arranged at a position blocked by the lower surface of the protruding portion 71A of the barrel block 71 when the molding die C is in the closed state. Thus, during molding, the molten resin Ta does not flow into the substrate suction hole 77a, and the molten resin Ta does not adhere to the mold surface of the lower mold LM. It should be noted that when supplying the release film F to the lower mold LM, as long as the molten resin Ta does not adhere to the mold surface of the lower mold LM and the release film F does not contact the side surface of the barrel block 71, the case where the edge Fa of the release film F is slightly offset from the position of the lower mold LM and is supplied is also included in the "specified position".

[0057] As Figure 4 , Figure 5 shown, the position adjustment mechanism 20 includes a columnar first roller 21 (an example of a columnar roller), a columnar second roller 22 (an example of a columnar roller), a transmissive sensor 23 (an example of a sensor), a roller support portion 24, and a motor 25 (an example of a drive source). The position adjustment mechanism 20 is disposed between the feeding mechanism 11 and the molding die C (see Figure 2 ). In the present embodiment, two position adjustment mechanisms 20 are disposed relative to one molding die C. This is because the two release films F are respectively supplied to the left and right of the cartridge block 71 (see Figure 3 ). Since the two position adjustment mechanisms 20 have the same configuration and the same function, one of the position adjustment mechanisms 20 will be described below.

[0058] In the present embodiment, the transmissive sensor 23 is an ultrasonic sensor and has a shape in which an output portion 23a and an input portion 23b are disposed opposite to each other with the release film F interposed therebetween. Specifically, the transmissive sensor 23 is disposed such that when viewed in the vertical direction, the edge Fa of the release film F supplied to the side closer to the cartridge block 71 is located between the output portion 23a and the input portion 23b. Further, the transmissive sensor 23 is disposed immediately behind the second roller 22 with respect to the conveying direction V. The transmissive sensor 23 is a line sensor, and the output portion 23a and the input portion 23b are disposed in a line shape extending in a direction (hereinafter, also referred to as "horizontal direction W") perpendicular to the conveying direction V and the vertical direction of the release film F. And, since the edge Fa of the release film F is located between the output portion 23a and the input portion 23b, a part of the output portion 23a and the input portion 23b is blocked by the release film F. Therefore, for the part of the ultrasonic wave output from the output portion 23a that is opposed to the release film F, the ultrasonic wave is blocked by the release film F and not input to the input portion 23b, and only the ultrasonic wave of the non-opposed part is input to the input portion 23b.

[0059] The transmissive sensor 23 is configured to linearly output the ratio of the input ultrasonic wave to the output ultrasonic wave by voltage and input it to the control unit 6. Specifically, when the ratio of the input ultrasonic wave to the output ultrasonic wave becomes higher, the output voltage to the control unit 6 becomes larger, and when the ratio becomes lower, the output voltage to the control unit 6 becomes smaller. That is, as Figure 6As shown, if the release film F is displaced in the horizontal direction W, the range where the output portion 23a is blocked by the release film F becomes smaller, and the output voltage from the input portion 23b to the control portion 6 becomes larger. If the range where the output portion 23a is blocked by the release film F becomes larger, the output voltage from the input portion 23b to the control portion 6 becomes smaller. That is, based on the magnitude of the output voltage from the input portion 23b to the control portion 6 of the transmissive sensor 23, the positional displacement of the edge Fa of the release film F can be detected. It should be noted that what is output from the input portion 23b to the control portion 6 is not limited to voltage. As long as the positional displacement of the edge Fa of the release film F can be detected, any physical quantity such as current can be used.

[0060] In the resin molding apparatus 30 of the present embodiment, it is configured such that the position of the edge Fa of the release film F detected by the transmissive sensor 23 corresponds to the position of the edge Fa of the release film F supplied to the lower mold LM. Therefore, by appropriately managing the position of the edge Fa of the release film F by the transmissive sensor 23, the release film F can be supplied to a specified position of the lower mold LM. In the present embodiment, as Figure 6 shown, when the edge Fa of the release film F is at the reference position, which is the center of the detection range of the transmissive sensor 23, the output from the input portion 23b at this time is used as the reference output, and at this time, it is configured such that the release film F can be supplied to a specified position of the lower mold LM. It should be noted that the reference position of the edge Fa of the release film F in the transmissive sensor 23 also includes the case where the edge Fa is displaced within the range of the above-mentioned "specified position". That is, the reference position of the edge Fa of the release film F in the transmissive sensor 23 is not uniquely determined. As described above, the "specified position" of the release film F supplied to the lower mold LM allows for deviations within the range where no obstacles are generated during molding. Therefore, as long as the release film F is supplied to the lower mold LM within the range of the specified position, the reference position of the edge Fa of the release film F in the transmissive sensor 23 also allows for deviations.

[0061] As Figure 4 、 Figure 5 shown, the rotation axes of the first roller 21 and the second roller 22 are parallel to each other, and they are arranged in parallel such that the first roller 21 is on the lower side in the vertical direction and the second roller 22 is on the upper side in the vertical direction. That is, the first roller 21 and the second roller 22 are arranged parallel to each other. The first roller 21 and the second roller 22 are rotatably supported by the roller support portion 24. Both the first roller 21 and the second roller 22 convey the release film F in the conveying direction V by rotation. It should be noted that in Figure 5 in order to facilitate understanding of the configuration of the position adjustment mechanism 20, the illustration of the release film F is omitted.

[0062] The roller support portion 24 is constituted by including a roller guide 24a and a motor guide 24b, and both the roller guide 24a and the motor guide 24b have a plate shape. The roller support portion 24 is configured such that, when viewed in the vertical direction, the entire roller guide 24a and motor guide 24b have an L-shaped configuration.

[0063] The roller guide 24a supports the first roller 21 and the second roller 22 so as to be rotatable in the horizontal direction W. The motor guide 24b is connected to the motor shaft 25a of the motor 25. The motor shaft 25a extends in the direction of the conveyance direction V of the release film F. The motor 25 can rotate the motor shaft 25a as a rotation axis in both forward and reverse directions. As the motor shaft 25a rotates, the roller support portion 24 tilts in both forward and reverse directions about the motor shaft 25a as a central axis from the horizontal direction W. Along with this, the first roller 21 and the second roller 22 also tilt in both forward and reverse directions from the horizontal direction W. Even in the tilted state, the first roller 21 and the second roller 22 maintain a parallel state with each other. In the present embodiment, as Figure 5 shown, the center of the motor shaft 25a overlaps with the periphery of the first roller 21, but it is preferably arranged so as to overlap with the rotation axis of the first roller 21. When the center of the motor shaft 25a is arranged so as to overlap with the rotation axis of the first roller 21, the deviation of the release film F in the horizontal direction W accompanying the tilt of the first roller 21 can be minimized, and the torsion of the release film F can be suppressed.

[0064] When the first roller 21 and the second roller 22 tilt, as Figure 7 shown, the position of the release film F in the horizontal direction W can be changed. The release film F is actually conveyed by being folded back 180 degrees by the first roller 21 and the second roller 22 as Figure 2 shown, but in Figure 7 for ease of understanding, a state in which the release film F is conveyed in a straight line is illustrated.

[0065] In the present embodiment, when the transmissive sensor 23 detects that the edge Fa of the release film F has deviated from the reference position, the control unit 6 rotates the motor 25, whereby the roller support portion 24 rotates and the first roller 21 and the second roller 22 can be tilted. As described above, when the first roller 21 and the second roller 22 tilt, the position of the release film F in the horizontal direction W can be changed. Therefore, the control unit 6 adjusts the position of the edge Fa of the release film F (hereinafter, also simply referred to as "position adjustment") by appropriately controlling the rotation amount of the motor 25, that is, the tilt of the first roller 21 and the second roller 22, and can return the edge Fa of the release film F in the transmissive sensor 23 to the reference position. Thereby, the release film F can always be supplied to the specified position of the lower mold LM.

[0066] In the present embodiment, as Figure 4 , Figure 5As shown, the two position adjustment mechanisms 20 are configured to have different positions (heights) in the vertical direction. This is because the two release films F approach each other as they are disposed on the left and right of the barrel block 71. Thus, by making the positions of the two position adjustment mechanisms 20 different in the vertical direction, it is possible to prevent contact between the first rollers 21 and the second rollers 22 of one position adjustment mechanism 20 when the first rollers 21 and the second rollers 22 of one position adjustment mechanism 20 are tilted, and it is possible to increase the tilt angles of the first rollers 21 and the second rollers 22 in each position adjustment mechanism 20.

[0067] 〔Method for manufacturing resin molded product〕

[0068] Next, Figures 1 to 3 is used to describe the method for manufacturing a resin molded product (post-molding substrate Sb). The method for manufacturing a resin molded product (post-molding substrate Sb) includes: a film supply step of supplying a release film F to the lower mold LM; a sheet supply step of supplying a pre-molding substrate Sa and a resin sheet T to the lower mold LM; a mold clamping step of clamping the molding die C by a mold clamping mechanism 35; and a molding step of supplying molten resin Ta to the upper mold cavity MCa and the lower mold cavity MCb to perform resin molding of the pre-molding substrate Sa. This molding step is a step of performing resin molding of the pre-molding substrate Sa by the resin molding apparatus 30 during the period from the loading of the pre-molding substrate Sa into the molding module 3 to the unloading of the post-molding substrate Sb from the molding module 3. In the molding step of the present embodiment, molten resin Ta is supplied to the upper mold cavity MCa and the lower mold cavity MCb to supply molten resin Ta to both sides of the pre-molding substrate Sa, thereby performing double-sided molding to manufacture the post-molding substrate Sb.

[0069] As Figure 1 shown, the loader 41 is pre-heated in a state where the accommodation space for the resin sheet T is heat-insulated, and the molding die body M is also pre-heated. Then, the pre-molding substrate Sa taken out from the substrate supply mechanism 43 is placed on the loader 41. In addition, the resin sheets T arranged by the resin supply mechanism 45 are accommodated in the accommodation space for the resin sheets T of the loader 41. Then, the loader 41 transports the pre-molding substrate Sa and the resin sheets T to the molding module 3.

[0070] The release film supply mechanism 1 supplies the pre-use release film F between the upper mold UM and the lower mold LM (film supply step). At this time, when the transmissive sensor 23 detects that the edge Fa of the release film F has deviated from the reference position, the control unit 6 tilts the first roller 21 and the second roller 22 of the position adjustment mechanism 20 to perform position adjustment, and controls the edge Fa of the release film F to return to the reference position. Thereby, the edge Fa of the release film F is supplied to a specified position of the lower mold LM. Detection and position adjustment of the edge Fa of the release film F are always performed during the operation of the resin molding apparatus 30.

[0071] After that, the resin sheet T is accommodated in the cartridge 71a of the lower mold LM (sheet supply process). By accommodating the resin sheet T in the cartridge 71a, the heater built in the lower mold LM heats the resin sheet T to make it into molten resin Ta.

[0072] Next, the clamping mechanism 35 whose driving force is controlled by the control unit 6 moves the lower mold LM in the direction of the upper mold UM, causing the release film F before use to closely adhere to the lower mold LM. Then, the release film F is adsorbed to the mold surface of the lower mold LM by air suction from the suction holes 77. In this state, the substrate Sa before molding is supplied onto the release film F.

[0073] Next, the clamping mechanism 35 whose driving force is controlled by the control unit 6 moves the upper mold UM and the lower mold LM closer to each other to clamp the upper mold UM and the lower mold LM. At this time, through the clamping mechanism 35, the lower mold LM and the cartridge block 71 rise. When the upper surface of the cartridge block 71 contacts the upper mold UM, the rise of the cartridge block 71 stops. Then, through the clamping mechanism 35, the lower mold LM rises further, whereby the elastic member 74 is compressed, the cartridge block 71 approaches the lower mold LM, and the lower surface of the protruding portion 71A contacts the cartridge-side end of the substrate Sa before molding. In addition, the lower surface of the upper mold UM contacts the end of the substrate Sa before molding where it does not contact the cartridge-side end (clamping process).

[0074] Next, the molten resin Ta obtained by melting the resin sheet T accommodated in the lower mold LM is injected into the upper mold cavity MCa and the lower mold cavity MCb through the transfer mechanism 72 whose driving force is controlled by the control unit 6. Thereby, the substrate Sa before molding is double-sided molded (molding process. Refer to Figure 2 ). After the resin molding, the lower mold LM is moved downward to open the molding die C. In this opening operation, an operation of separating the unnecessary resin such as the knockout portion 71b, the runner 71c, and the gate 71d formed in the cartridge block 71 from the substrate Sa before molding that has been double-sided molded (gate disconnection operation) is performed to separate the substrate Sb after molding and the unnecessary resin. Then, the substrate Sb after molding is demolded from the lower mold LM and the upper mold UM, and the substrate Sb after molding is accommodated in the substrate accommodation portion 46 by the unloader 42 (refer to Figure 1 ). After manufacturing the packaged substrate (substrate Sb after molding) by this resin molding device 30, the packaged substrate is cut (singulation) by the cutting device in such a way as to remove the unnecessary portion including the hole H, and the formed cut product is used as an electronic component after passing quality inspection.

[0075] Thus, since the resin molding apparatus 30 of the present embodiment includes the position adjustment mechanism 20 and the transmissive sensor 23 always detects the edge Fa of the demolding film F, even when the delivery roller 11a of the demolding film F is replaced or the tension of the demolding film F is changed, resulting in a positional deviation of the demolding film F with respect to the surface of the lower mold LM, the control unit 6 causes the first roller 21 and the second roller 22 of the position adjustment mechanism 20 to tilt for position adjustment, and controls the edge Fa of the demolding film F to return to the reference position. Thus, by adjusting the position of the demolding film F, the demolding film F can always be supplied to the specified position of the lower mold LM.

[0076] 〔Other Embodiments〕

[0077] Hereinafter, other embodiments of the above-described embodiment will be described. It should be noted that, for components that are the same as those in the above-described embodiment, the same terms and reference numerals are used for easy understanding.

[0078] <1> In the above-described embodiment, the demolding film F is adsorbed to the lower mold LM, but the demolding film F may be adsorbed to the upper mold UM, or the demolding film F may be adsorbed to both the upper mold UM and the lower mold LM. When the demolding film F is adsorbed to the upper mold UM, the ejector pin 83 of the above-described embodiment is not required. In addition, it is preferable to separately provide a position adjustment mechanism 20 for the demolding film F supplied to the upper mold UM.

[0079] <2> In the above-described embodiment, the lower mold cavity MCb is formed in the lower mold cavity block 70 of the lower mold LM, but when it is not necessary to resin-encapsulate the lower surface of the pre-molded substrate Sa, the lower mold cavity MCb may be absent. In this case, resin molding is performed only on the single surface (the upper surface of the pre-molded substrate Sa) facing the upper mold UM, but in order to prevent contamination of the lower mold LM, it is preferable to supply the demolding film F to the lower mold LM, and in this case, it is preferable to provide the position adjustment mechanism 20.

[0080] <3> In the above-described embodiment, an example of supplying the pre-molded substrate Sa to the lower mold LM is shown, but the pre-molded substrate Sa may be supplied to the upper mold UM. In this case, it is preferable to form a barrel block 71 on the upper mold UM side, and sandwich the pre-molded substrate Sa between the upper surface of the protruding portion 71A of the barrel block 71 and the surface of the upper mold UM. In this case, the upper mold UM is an example of the first mold, and the lower mold LM is an example of the second mold.

[0081] <4> In the above-described embodiment, the resin injection mechanism 7 is an edge gate type, but it may also be a side gate type.

[0082] <5>In the above-described embodiment, an ultrasonic type is used as the transmissive sensor 23. However, in the case where the release film is made of a material that does not transmit light, for example, a transmissive photoelectric sensor may also be used as the transmissive sensor. Further, in the above-described embodiment, a transmissive sensor is used, but it may also be configured to use a reflective sensor to detect the edge Fa of the release film F. As long as the edge Fa of the release film F can be appropriately detected, the type of the sensor and the detection method are not limited.

[0083] <6>In the above-described embodiment, the transmissive sensor 23 is disposed immediately behind the second roller 22 with respect to the conveying direction V, but is not limited thereto. The transmissive sensor 23 may be disposed immediately in front of the molding die C with respect to the conveying direction V, may be disposed immediately behind the molding die C, or may be disposed between the feeding mechanism 11 and the roller support portion 24. As long as the position of the release film F can be adjusted by the position adjusting mechanism 20 to supply the release film F to a specified position of the lower die LM, the transmissive sensor 23 can be disposed at any position.

[0084] <7>In the above-described embodiment, two columnar rollers, i.e., the first roller 21 and the second roller 22, are disposed in the position adjusting mechanism 20. However, as long as the position of the edge Fa of the release film F can be adjusted, the columnar rollers may also be configured to include only either the first roller 21 or the second roller 22.

[0085] <8>The pre-molding substrate Sa resin-molded by the resin molding apparatus 30 in the above-described embodiment is, for example, a semiconductor substrate (such as a silicon wafer), a metal substrate (such as a lead frame), a glass substrate, a ceramic substrate, a resin substrate, or a wiring substrate.

[0086] 〔Summary of the above-described embodiment〕

[0087] Hereinafter, a summary of the resin molding apparatus 30 and the method for manufacturing a resin molded product (post-molding substrate Sb) described in the above-described embodiment will be described.

[0088] (1) The resin molding apparatus 30 is characterized in the following aspects, namely, the resin molding apparatus 30 includes: a molding die C having a first die (one of the lower die LM and the upper die UM) including a barrel block 71 and a second die (the other of the lower die LM and the upper die UM) disposed opposite to the first die (one of the lower die LM and the upper die UM); a mold clamping mechanism 35 for clamping the molding die C; a position adjusting mechanism 20 for adjusting the position of the edge Fa of the release film F supplied to the first die (one of the lower die LM and the upper die UM); and a control unit 6 for controlling the operation of the position adjusting mechanism 20. The position adjusting mechanism 20 includes: columnar rollers (the first roller 21 and / or the second roller 22) for conveying the release film F; and a sensor (transmission sensor 23) for detecting the position of the edge Fa of the release film F. The control unit 6 can perform control to tilt the columnar rollers (the first roller 21 and / or the second roller 22) about the conveying direction V of the release film F based on the detection result of the position of the edge Fa of the release film F by the sensor (transmission sensor 23).

[0089] The resin molding apparatus 30 having this characteristic configuration includes a control unit 6 and a position adjusting mechanism 20. The position adjusting mechanism 20 includes a sensor (transmission sensor 23) for detecting the position of the edge Fa of the release film F. The control unit 6 can perform control to tilt the columnar rollers (the first roller 21 and / or the second roller 22) about the conveying direction V of the release film F based on the detection result of the position of the edge Fa of the release film F by the sensor (transmission sensor 23). Therefore, the position of the edge Fa of the release film F can be adjusted.

[0090] (2) In the resin molding apparatus 30 described in the above (1), it is also possible that the position adjusting mechanism 20 has a plurality of columnar rollers (the first roller 21, the second roller 22), and the sensor (transmission sensor 23) is disposed immediately behind the plurality of columnar rollers (the first roller 21, the second roller 22) in the conveying direction V of the release film F.

[0091] According to this configuration, the sensor (transmission sensor 23) is disposed immediately behind the plurality of columnar rollers (the first roller 21, the second roller 22) in the conveying direction V of the release film F. Therefore, the result of the control of tilting the plurality of columnar rollers (the first roller 21, the second roller 22) about the conveying direction V of the release film F can be immediately detected by the sensor (transmission sensor 23), and the control unit 6 can perform fine control.

[0092] (3) In the resin molding apparatus 30 described in the above (2), it is also possible that the plurality of columnar rollers (the first roller 21, the second roller 22) are supported by a roller support portion 24, the roller support portion 24 is connected to a drive source (motor 25), and the control unit 6 tilts the plurality of columnar rollers (the first roller 21, the second roller 22) by tilting the roller support portion 24 by driving the drive source (motor 25).

[0093] According to this configuration, by simply tilting the roller support portion 24, the plurality of columnar rollers (the first roller 21 and the second roller 22) can be tilted. Therefore, there is no need to provide a mechanism for tilting the plurality of columnar rollers (the first roller 21 and the second roller 22) separately. In addition, since the plurality of columnar rollers (the first roller 21 and the second roller 22) are supported by the roller support portion 24, the operations of the plurality of columnar rollers (the first roller 21 and the second roller 22) can always be linked.

[0094] (4) In the resin molding apparatus 30 according to any one of (1) to (3) above, the control unit 6 may tilt the columnar roller (the first roller 21 and / or the second roller 22) such that the edge Fa of the release film F supplied to the first mold (the lower mold LM) formed by the lower mold LM is located below the protruding portion 71A of the cartridge block 71.

[0095] According to this configuration, by tilting the columnar roller (the first roller 21 and / or the second roller 22) such that the edge Fa of the release film F supplied to the first mold (the lower mold LM) is located below the protruding portion 71A of the cartridge block 71, the molten resin Ta is only supplied onto the release film F on the mold surface of the lower mold LM. Therefore, the molten resin Ta does not adhere to the mold surface of the lower mold LM during molding.

[0096] (5) In the resin molding apparatus 30 according to any one of (1) to (4) above, the first mold (one of the lower mold LM and the upper mold UM) may further include a cavity block (the lower mold cavity block 70 or the upper mold cavity block 80) adjacent to the cartridge block 71. The cavity block (the lower mold cavity block 70 or the upper mold cavity block 80) has a suction hole (the substrate suction hole 77a) for holding the object to be molded (the substrate Sa before molding). The control unit 6 tilts the columnar roller (the first roller 21 and / or the second roller 22) such that the edge Fa of the release film F supplied to the first mold (one of the lower mold LM and the upper mold UM) is located between the boundary B between the cartridge block 71 and the cavity block (the lower mold cavity block 70 or the upper mold cavity block 80) and the suction hole (the substrate suction hole 77a).

[0097] According to this configuration, the control unit 6 performs control to tilt the columnar roller (the first roller 21 and / or the second roller 22) such that the edge Fa of the release film F supplied to the first mold (the lower mold LM or the upper mold UM) is located between the boundary B between the cartridge block 71 and the cavity block (the lower mold cavity block 70 or the upper mold cavity block 80) and the suction hole (the substrate suction hole 77a). Therefore, the molten resin Ta does not flow into the suction hole (the substrate suction hole 77a) during molding.

[0098] (6) In the resin molding apparatus 30 according to any one of (1) to (5) above, it may also be provided with a feeding mechanism 11 including a feeding roller 11a that feeds the release film F toward one of the first molds (either the lower mold LM or the upper mold UM), and the position adjustment mechanism 20 is disposed between the feeding mechanism 11 and one of the first molds (either the lower mold LM or the upper mold UM).

[0099] According to this configuration, since the position adjustment mechanism 20 is disposed between the feeding mechanism 11 and the first mold (either the lower mold LM or the upper mold UM), the release film F can be supplied to the first mold (either the lower mold LM or the upper mold UM) after the position of the release film F is adjusted.

[0100] (7) In the resin molding apparatus 30 according to any one of (1) to (6) above, it may also be provided with two position adjustment mechanisms 20, and the two position adjustment mechanisms 20 are disposed at different heights in the vertical direction.

[0101] When the two release films F are close to each other, the two position adjustment mechanisms 20 are also close to each other. Even if only the columnar rollers (the first roller 21 and / or the second roller 22) of one of the position adjustment mechanisms 20 are slightly inclined about the conveying direction V of the release film F, it may contact the other position adjustment mechanism 20, and the columnar rollers (the first roller 21 and / or the second roller 22) cannot be inclined significantly. However, according to this configuration, since the two position adjustment mechanisms 20 are disposed at different heights in the vertical direction, it is possible to prevent the columnar rollers (the first roller 21 and / or the second roller 22) of one of the position adjustment mechanisms 20 from contacting the columnar rollers (the first roller 21 and / or the second roller 22) of the other position adjustment mechanism 20 when the columnar rollers are inclined, and the columnar rollers (the first roller 21 and / or the second roller 22) can be inclined significantly.

[0102] (8) A method for manufacturing a resin molded product (the molded substrate Sb) using the resin molding apparatus 30 according to any one of (1) to (7) above is characterized in the following points, that is, it includes: a film supply step of supplying a release film F between one of the first molds (either the lower mold LM or the upper mold UM) and the second mold (the other of the lower mold LM and the upper mold UM); a mold closing step of closing the molding die C by a mold closing mechanism 35; and a molding step of supplying a molding object (the pre-molded substrate Sa) and a resin material (the molten resin Ta) to the molding die C to perform resin molding.

[0103] In the method for manufacturing a resin molded product (molded substrate Sb) having this feature, after supplying a release film F between a first mold (one of a lower mold LM and an upper mold UM) and a second mold (the other of the lower mold LM and the upper mold UM) in a film supply process, the molding die C is closed by a die closing mechanism 35 in a die closing process. Then, resin molding is performed by supplying a molding object (pre-molded substrate Sa) and a resin material (molten resin Ta) to the molding die C in a molding process, and a resin molded product (molded substrate Sb) can be manufactured using the molding die C.

[0104] Industrial availability

[0105] The present invention can be used for a resin molding apparatus and a method for manufacturing a resin molded product.

[0106] Explanation of reference numerals:

[0107] 6: Control unit;

[0108] 11: Feeding mechanism;

[0109] 11a: Feeding roller;

[0110] 20: Position adjusting mechanism;

[0111] 21: First roller (columnar roller);

[0112] 22: Second roller (columnar roller);

[0113] 23: Transmission type sensor (sensor);

[0114] 24: Roller support portion;

[0115] 25: Motor (driving source);

[0116] 30: Resin molding apparatus;

[0117] 35: Die closing mechanism;

[0118] 70: Lower mold cavity block (cavity block);

[0119] 71: Cylinder block;

[0120] 71A: Protruding portion;

[0121] 77: Suction hole;

[0122] 77a: Substrate suction hole (suction hole);

[0123] 80: Upper mold cavity block (cavity block);

[0124] B: Boundary;

[0125] C: Molding die;

[0126] F: Demolding film;

[0127] Fa: Edge;

[0128] LM: Lower mold (first mold, second mold);

[0129] M: Molding die body;

[0130] MC: Cavity;

[0131] Sa: Substrate before molding (object to be molded);

[0132] Sb: Substrate after molding (resin molded product);

[0133] T: Resin sheet (resin material);

[0134] Ta: Molten resin (resin material);

[0135] UM: Upper mold (second mold, first mold);

[0136] V: Conveying direction.

Claims

1. A resin molding device, comprising: A molding die, having a first die including a barrel block and a second die disposed opposite to the first die; A mold clamping mechanism for clamping the molding die; A position adjusting mechanism for adjusting the position of the edge of the demolding film supplied to the first mold; And A control unit for controlling the operation of the position adjustment mechanism, The position adjustment mechanism includes: A columnar roller for conveying the release film; And a sensor for detecting the position of the edge of the release film, The control unit can execute control to tilt the columnar roller about the conveying direction of the release film based on the detection result of the position of the edge of the release film by the sensor.

2. The resin molding device according to claim 1, wherein The position adjustment mechanism has a plurality of the columnar rollers, The sensor is disposed immediately behind the plurality of columnar rollers in the conveying direction of the release film.

3. The resin molding device according to claim 2, wherein The plurality of columnar rollers are supported by a roller support portion, The roller support portion is connected to a drive source, The control unit tilts the plurality of columnar rollers by tilting the roller support portion by driving the drive source.

4. The resin molding device according to any one of claims 1 to 3, wherein The control unit tilts the columnar roller such that the edge of the release film supplied to the first die formed by the lower die is located below the protruding portion of the barrel block.

5. The resin molding device according to any one of claims 1 to 4, wherein The first die further includes a cavity block adjacent to the barrel block, The cavity block has suction holes for holding a molding object, The control unit tilts the columnar roller such that the edge of the release film supplied to the first die is located between the boundary of the barrel block and the cavity block and the suction holes.

6. The resin molding device according to any one of claims 1 to 5, wherein It further includes a feeding mechanism, and the feeding mechanism includes a feeding roller for feeding the release film toward the first die, The position adjustment mechanism is disposed between the feeding mechanism and the first die.

7. The resin molding device according to any one of claims 1 to 6, wherein There are two of the position adjustment mechanisms, The two position adjustment mechanisms are disposed at different heights in the vertical direction.

8. A method for manufacturing a resin molded product, which is a method for manufacturing a resin molded product using the resin molding device according to any one of claims 1 to 7, including: A film supply step of supplying the release film between the first die and the second die; A mold clamping step of clamping the molding die by the mold clamping mechanism; And A molding step of supplying a molding object and a resin material to the molding die to perform resin molding.

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